An in-situ mechanical property testing device and its equipment

Abstract

The present invention relates to the technical field of material mechanical property testing equipment, and particularly relates to an in-situ mechanical property testing device and its equipment. The in-situ mechanical property testing device includes a base, a connecting rod, a testing probe, a control system, and a pressure testing system; the base is used for sealing connection with a commercial material analysis and testing equipment; the connecting rod includes a first connecting rod and a second connecting rod connected in sequence, the free end of the first connecting rod is connected to the base, and the free end of the second connecting rod is connected to the testing probe; the control system controls the movement of the connecting rod; the pressure testing system is used for controlling and measuring the applied stress of the testing probe. The in-situ mechanical property testing device provided by the present invention is matched with existing commercial material analysis and testing equipment. The matching method can be directly inserted through existing interfaces on SEM and FIB, and then vacuum sealed to achieve system integration; when not in use, it can be withdrawn without affecting the normal use of SEM and FIB.

Description

Technical Field

[0001] The present invention relates to the technical field of testing equipment for mechanical properties of materials, and particularly relates to an in-situ mechanical property testing device and equipment thereof. Background Art

[0002] Testing the micro-area mechanical properties of thin film materials or other two-dimensional materials (fibers, tubes, etc.) with nano or micron sizes is an important characterization testing method in modern manufacturing and scientific research. In the past 30 years, many corresponding testing technologies and equipment have been commercialized.

[0003] Currently, there are many reported testing methods for micro-area mechanical properties, which can be mainly divided into two categories: mechanical and non-mechanical methods. The former includes direct peeling method, laser peeling method, indentation method, scratching method, stretching method, bending unfolding method, abrasion method, tape sticking method, etc.; the latter includes thermal method, nucleation method, capacitance method, X-ray diffraction method, etc. Compared with non-mechanical methods, mechanical methods have stronger practicability. The most commonly used mechanical methods include indentation method, scratching method and stretching method, and the combination of their corresponding theories and testing methods has been widely applied in the industry.

[0004] Looking at the commercially available testing equipment on the market currently, most of them are integrated on the platforms of optical microscopes or atomic force microscopes. Its disadvantages are as follows:

[0005] 1. The resolution of optical microscopes is low, and it is impossible to perform positioning tests on thin films and materials with small sizes such as nano or sub-micron levels.

[0006] 2. It is not suitable for testing and analyzing the mechanical properties of film layers at the device level. The process layers in devices generally have complex structures (patterned) and sizes as small as the nano level. In addition, some analyses require testing the binding energy between a certain film layer or specific film layers in those tiny underlying areas. For example, the analysis of the binding force between M1 and the dielectric layer above in CMOS devices. In this case, there are no such testing technologies and equipment on the market currently.

[0007] 3. Some film layers tested in the air are prone to oxidation or are greatly affected by humidity in the air. Therefore, during the testing process, the structure or performance of the film layer may change due to environmental influence.

[0008] There are also some commercial stress testing systems based on electron microscopes on the market currently. However, they are basically discrete and need to be separately installed on the sample stages of SEM or FIB for testing. For example, the in-situ indentation testing system developed by the Swiss Federal Laboratories for Materials Science and Technology (EMPA); the PI85 SEM PicoIndenter in-situ indenter of Hysitron Inc.; both are tray-type designs, that is, installed on the SEM sample stage for testing, which will inevitably affect the normal use of SEM / FIB. Summary of the Invention

[0009] The present invention aims to solve at least one of the technical problems existing in the prior art or related technologies.

[0010] To this end, the object of the present invention is to provide an in-situ mechanical property testing device, which can be integrated into various types of commercial material analysis equipment on the current market, such as SEM (scanning electron microscope), FIB (focused ion beam) and other equipment, and can realize nano-level in-situ stress testing. The in-situ mechanical property testing device provided by the present invention can not only be used for the mechanical property testing of bulk materials, wires and multi-layer thin films, but also can realize the mechanical property testing of different process film layers in semiconductor devices, as well as the stress testing of the bonding force between process layers.

[0011] To achieve the above object, the present invention provides an in-situ mechanical property testing device, including a base, a connecting rod, a testing probe, a control system and a pressure testing system;

[0012] The base is used for sealing connection with the material analysis and testing equipment;

[0013] The connecting rod includes a first connecting rod and a second connecting rod connected in sequence. The free end of the first connecting rod is connected to the base, and the free end of the second connecting rod is connected to the testing probe;

[0014] The control system controls the movement of the connecting rod;

[0015] The pressure testing system is used to control and measure the applied stress of the testing probe.

[0016] In some possible implementation manners, the control system includes a displacement sensor, a driving motor and control software.

[0017] In some possible implementation manners, both the first connecting rod and the second connecting rod are telescopic rods. The first connecting rod and the second connecting rod are both provided with displacement sensors and driving motors. Different displacement sensors are used to monitor the movement positions of different connecting rods, and the control software controls the telescopic movements of different telescopic rods respectively.

[0018] In some possible embodiments, the base is further provided with a universal rotary connection mechanism, the universal connection rotary structure is connected to the first connecting rod, the control system also controls the movement of the universal connection mechanism, and the movement of the universal connection mechanism drives the movement of the connecting rod.

[0019] In some possible embodiments, the pressure test system includes a pressure sensor and stress measurement software.

[0020] In some possible embodiments, the pressure sensor of the pressure test system is disposed at the position where the connecting rod is connected to the test probe or at the position where the first connecting rod is connected to the second connecting rod.

[0021] In some possible embodiments, the base is sealingly connected to the external interface of the material analysis and testing equipment.

[0022] In some possible embodiments, the connection port for the sealing connection between the base and the external interface of the material analysis and testing equipment is disposed at the position between the base and the connecting rod.

[0023] In some possible embodiments, the connection port is further provided with a sealing member and a fixing member for fixing the base and the material analysis and testing equipment.

[0024] In some possible embodiments, the test probe includes a connecting portion and a testing portion, and the testing portion is connected to the connecting rod through the connecting portion;

[0025] The testing portion is selected from any one of the following shapes:

[0026] Arc, plane, cone, triangle, sharp corner, blade shape, etc.

[0027] The present invention also provides an in-situ mechanical testing device, including the above-mentioned in-situ mechanical property testing device and material analysis and testing equipment, and the in-situ mechanical property testing device is vacuum-sealingly connected to the external interface of the material analysis and testing equipment;

[0028] The material analysis and testing equipment is FIB or SEM.

[0029] The in-situ mechanical testing device provided by the present invention, by means of the existing material analysis and testing equipment, adds an in-situ mechanical property testing device. The in-situ mechanical property testing device is inserted into the existing material analysis and testing equipment such as SEM or FIB, and vacuum sealing realizes system integration, and can realize nano-level in-situ stress testing. It can not only be used for the mechanical property testing of bulk materials, wire materials and multi-layer thin films, but also can realize the mechanical property testing of different process film layers in semiconductor devices and the stress testing of the bonding force between process layers.

[0030] Advantages of the present invention compared with the prior art:

[0031] (1) The in-situ mechanical property testing device provided by the present invention is compatible with existing scanning electron microscopes and focused ion beam equipment, etc. The method can be to directly insert through the existing interfaces on the SEM and FIB, and then perform vacuum sealing to achieve system integration; it can be withdrawn when not in use, without affecting the normal use of the SEM and FIB.

[0032] (2) All tests of the in-situ mechanical property testing device provided by the present invention are carried out in a high-vacuum environment, which can avoid the deviation of the test results caused by the influence of the environment on the film layer during the test.

[0033] (3) The in-situ mechanical property testing device provided by the present invention can utilize the high-resolution imaging of the scanning electron microscope to achieve the experimental analysis purpose of in-situ testing and observation of nanomaterials and structures, observe the dynamic strain and microscopic structure changes of the material during the test and failure process, and achieve nanoscale precise positioning and observation analysis.

[0034] (4) The in-situ mechanical property testing device provided by the present invention can conduct the testing and analysis of the mechanical properties of the device-level film layer; while the conventional scratch test technology is difficult to achieve the analysis of the bonding force between process layers in the device. The present invention proposes to use the focused ion beam equipment to pattern the stripping and testing modules of the film layer (including the bottom process layer) to be analyzed in the device, so as to achieve the testing and analysis of the bonding force between the film layers in the device; in addition, it can also achieve the testing of the mechanical properties of specific film layers of semiconductor devices (such as fracture strength, elastic modulus, etc. testing, etc.).

[0035] (5) The in-situ mechanical property testing device provided by the present invention can be used for the mechanical property testing of bulk materials, wire materials and multi-layer thin films, such as the testing of film layer bonding force, nano-cutting, and the mechanical properties of nano-film layers, etc.

[0036] (6) The mechanical properties tested by the in-situ mechanical property testing device provided by the present invention include but are not limited to hardness, elastic modulus, fracture strength, film layer interface bonding force, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and / or additional aspects and advantages of the present invention will become obvious and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

[0038] Figure 1 Shows a schematic diagram of the in-situ mechanical property testing device provided by the embodiment of the present invention;

[0039] Figure 2 Shows a schematic diagram of the in-situ mechanical property testing device in another state provided by the embodiment of the present invention;

[0040] Figure 3 Shows a schematic diagram of the electron beam chamber (e-column) / ion beam chamber (I-column) and the stress test direction of a commercial FIB device involved in an embodiment of the present invention;

[0041] Figure 4 Shows a schematic diagram of the electron beam chamber (e-column) / ion beam chamber (I-column) and the stress test direction of another commercial FIB device involved in an embodiment of the present invention;

[0042] Figure 5 Shows a schematic diagram of different test probes involved in an embodiment of the present invention;

[0043] In the figure, 100 - base; 101 - connection port; 102 - universal rotary connection mechanism; 200 - connecting rod; 210 - first connecting rod; 220 - second connecting rod; 201 - pressure sensor; 300 - test probe. Detailed implementation manners

[0044] In order to more clearly understand the above - mentioned objects, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the drawings and specific implementation manners. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0045] In the following description, many specific details are set forth to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described herein. Therefore, the protection scope of the present invention is not limited to the limitations of the specific embodiments disclosed below.

[0046] Based on the above content, the in - situ mechanical property testing device according to some embodiments of the present invention will be described below with reference to the drawings.

[0047] An embodiment of the present invention provides an in - situ mechanical property testing device, as Figure 1 and Figure 2 shown, including a base 100, a connecting rod 200, a test probe 300, a control system, and a pressure testing system;

[0048] The base 100 is used for sealing connection with a material analysis and testing device;

[0049] The connecting rod 200 includes a first connecting rod 210 and a second connecting rod 220 connected in sequence. The free end of the first connecting rod 210 is connected to the base 100, and the free end of the second connecting rod 220 is connected to the test probe 300;

[0050] The control system controls the movement of the connecting rod 200;

[0051] The pressure test system is used to control and measure the applied stress of the test probe 300.

[0052] The in-situ mechanical property testing device provided by the present invention can be well integrated into existing SEM and FIB devices on the market. The integration can be achieved by directly inserting through the existing interfaces on the SEM and FIB, and then performing vacuum sealing to realize system integration. When not in use, it can be withdrawn to achieve plug-and-play, without affecting the normal use of the SEM and FIB.

[0053] In the present invention, the base 100 is vacuum-connected to the SEM / FIB cavity, and the connection between the two can be designed corresponding to the interfaces of SEM / FIB devices of different manufacturers and different models.

[0054] Furthermore, the base 100 is hermetically connected to the external interface of the material analysis and testing device.

[0055] Furthermore, the connection port 101 for hermetically connecting the base 100 to the external interface of the material analysis and testing device is arranged at the position between the base 100 and the connecting rod 200.

[0056] In the present invention, the base 100 is generally outside the external interface of the material analysis and testing device. Generally, a driving motor and its related connection lines can be placed inside the base 100. A connection port 101 for hermetically connecting to the external interface of the material analysis and testing device can be arranged at the part of the base 100 close to the connecting rod 200 or at the part between the base 100 and the connecting rod 200.

[0057] Furthermore, the connection port 101 is also provided with a sealing member and a fixing member for fixing the base 100 to the material analysis and testing device.

[0058] The sealing member is for maintaining the vacuum environment in the test chamber of the material analysis and testing device after the base 100 is inserted into the material analysis and testing device. The shape of the sealing member can be designed accordingly according to the situation of the part to be sealed. For example, the sealing member can be an O-ring, a sealing sleeve, etc. In the present invention, the sealing member has a broad meaning, which can refer to a single sealing member or multiple sealing members; it can refer to a single sealing member or a sealing assembly.

[0059] The fixing member is used to fix the base 100 to the material analysis and testing device together. Existing fixing parts can be selected as the fixing member according to the fixing requirements, such as it can be a flange. In the present invention, the fixing member has a broad meaning, which can refer to a single fixing member or multiple fixing members; it can refer to a single fixing member or a fixing assembly.

[0060] For commercial SEM and FIB devices, there are usually multiple external interfaces. The in-situ mechanical property testing device of the present invention can be inserted using these interfaces to achieve a high degree of integration with SEM / FIB.

[0061] As Figure 3 shown is the general external interface of a commercial FIB device, the relative positions of the electron beam chamber / ion beam chamber, and the stress testing direction of the present invention. As Figure 3 shown, the test probe 300 of the present invention is inserted at an oblique angle into the plane where the electron beam chamber / ion beam chamber is located, and the insertion angle is approximately 50 degrees (the insertion angles of devices from different manufacturers may vary). This oblique insertion method can simplify the design of the in-situ testing system and save space. The oblique insertion can achieve the tests of normal pressure and parallel pressure in one step.

[0062] Figure 4 Shows the test of the bonding force of some special thin film samples, the interface connection and insertion method that need to adjust the pressurizing direction (angle).

[0063] To achieve the adjustment of different pressurizing directions, the in-situ mechanical property testing device of the present invention can be inserted along the interface in the same plane of the electron beam chamber / ion beam chamber, so that the tilting of the sample stage of the SEM / FIB device can be utilized to achieve stress testing and analysis in different directions, as Figure 4 shown, which provides more test solutions for the testing device proposed by the present invention.

[0064] In the present invention, the base 100 is generally arranged outside the external interface of the material analysis and testing device. Generally, a driving motor and its related connection lines can be placed inside the base 100. The part of the base 100 close to the connecting pipe or the connection port 101 where the base 100 is hermetically connected to the external interface of the connecting rod 200 and the material analysis and testing device.

[0065] In the present invention, the connecting rod 200 has a broad meaning, which can refer to a single connecting rod 200 or a connecting rod 200 assembly. In the present invention, the connecting rod 200 can be set in multiple modes. For example, it can be a telescopic rod that can automatically expand and contract, and the movement of the telescopic rod is controlled by a control system to achieve the purpose of adjusting the position of the test probe 300; another example is that the connecting rod 200 can be a sliding connecting rod assembly, and a sliding groove is provided on the sliding assembly, and the connecting rod 200 can slide in the sliding groove; and so on.

[0066] In the present invention, the control system includes a displacement sensor, a driving motor, and control software.

[0067] In the present invention, the control system has a broad meaning, and the control system can include at least one displacement sensor, at least one driving motor, and at least one control software.

[0068] In the present invention, when the control system is used for testing, the in-situ mechanical property testing device is inserted into the SEM / FIB cavity, and the test probe is accurately moved close to the sample test area, and the interaction adjustment with the SEM / FIB sample stage is realized; after the test is completed, the test system is withdrawn from the SEM / FIB cavity, so that the operation and use of the main equipment will not be affected.

[0069] The control system can control different components. For example, the control system can control the telescopic movement of the rod body of the connecting rod 200, or control the displacement of the rod body of the connecting rod 200; it can also control the displacement of the connecting part between the connecting rod 200 and the base 100, so as to control the connecting rod 200 to turn in different directions.

[0070] Furthermore, both the first connecting rod 210 and the second connecting rod 220 are telescopic rods. Displacement sensors and driving motors are arranged on both the first connecting rod 210 and the second connecting rod 220. Different displacement sensors are used to monitor the movement positions of different connecting rods, and the control software controls the telescopic movements of different telescopic rods respectively.

[0071] The accuracy of the first connecting rod 210 and its displacement control and driving equipment does not need to be very high. The maximum driving displacement can range from millimeters to dozens of centimeters. On the one hand, it is used to insert the test probe 300 into the SEM / FIB cavity during test analysis; on the other hand, it is used to withdraw the test probe 300 after the test is completed, so that the operation and use of the main equipment will not be affected. While the displacement of the second connecting rod 220 requires very high precision, generally at the nanometer or sub-nanometer level. The goal of the displacement control and driving system is to be able to accurately move the test probe close to the sample test area, and realize the interaction adjustment with the SEM / FIB sample stage, and avoid collision with the sample stage of the FIB / SEM.

[0072] The telescopic rod of the present invention can be a pneumatic telescopic rod or a threaded telescopic rod.

[0073] The displacement sensors arranged on different connecting rods are used to monitor the movement positions of the connecting rods. Through the monitoring of the displacement sensors, the control system can better control the telescopic movements of the telescopic rods.

[0074] In some possible implementation manners, the base 100 is further provided with a universal rotary connection mechanism 102. The universal connection rotary structure is connected to the first connecting rod 210. The control system also controls the movement of the universal connection mechanism, and the movement of the universal connection mechanism drives the movement of the connecting rod 200.

[0075] In the present invention, the universal rotary connection mechanism 102 has a broad meaning, which can refer to a universal rotary joint, or a universal rotary joint and its auxiliary accessories.

[0076] In this setting, displacement sensors are respectively arranged on the telescopic rod and the universal rotary connection mechanism 102, and there can be one driving motor and control software. The driving motor drives the movement of the universal rotary connection mechanism 102 and the telescopic movement of the connecting rod 200 respectively. At the same time, when the universal rotary connection mechanism 102 moves, it can drive the movement of the connecting rod 200. This is because the universal rotary connection mechanism 102 is connected to the connecting rod 200, and when the universal rotary connection mechanism 102 moves, it drives the connecting rod 200 to move. And the connecting rod 200 can move by itself during the telescopic movement.

[0077] The software of the control system is generally digital control system software.

[0078] The driving motor provides the propulsion of the test probe 300 during stress testing. The test probe 300 can perform test analyses such as nano-scratch testing, nano-interface peeling testing, and nano-cutting testing.

[0079] Furthermore, the pressure test system includes a pressure sensor 201 and stress measurement software.

[0080] The pressure test system is used to control and monitor the applied stress during stress testing.

[0081] The speed and magnitude of the applied stress can be controlled simultaneously by the pressure test system and the above-mentioned control system; it can also be that the pressure test system and the control system supporting the pressure test system are set separately, such as including a high-precision pressure sensor 201, a high-precision displacement sensor, a high-precision driving motor, a high-precision digital control system software, and stress test software.

[0082] In the above content, the stress test software can exist independently or be embedded in the corresponding control software for use.

[0083] In different embodiments of the present invention, the pressure sensor 201 of the pressure test system is arranged at the position where the connecting rod 200 is connected to the test probe 300 or at the position where the first connecting rod 210 is connected to the second connecting rod 220.

[0084] Furthermore, the test probe 300 includes a connecting portion and a test portion, and the test portion is connected to the connecting rod 200 through the connecting portion;

[0085] The test portion is selected from any one of the following shapes:

[0086] Arc, plane, cone, triangle, sharp corner, blade shape, etc.

[0087] In the present invention, the connecting portion of the test probe 300 is detachably connected to the connecting rod 200, and the test probe 300 can be replaced with different test probes 300 according to different test purposes.

[0088] The design of the replaceable test probe is based on different test purposes.

[0089] The replaceable test probe and its connection design ensure that the test probe has sufficient rigidity during the test.

[0090] The replaceable test probe and its connection design ensure that the test probe has sufficient operability during the replacement process.

[0091] Such as Figure 5 Shown is the typical test probe 300 (also known as the test probe) proposed in the present invention. For different test film materials and test purposes, different test probes can be used.

[0092] Among them, the arc-shaped test probe (4a) is used for stress testing of the circular columnar test module for FIB patterning (as described in the subsequent in-situ nano-patterning interface peeling test scheme); the planar test probe (4b) is used for stress testing of the cubic columnar test module for FIB patterning (as described in the subsequent in-situ nano-patterning interface peeling test scheme); the conical test probe (4c) is used for nano-scratch testing of those with relatively low film hardness (as described in the subsequent in-situ nano-scratch test scheme); the sharp-cornered test probe (4d) is used for nano-scratch testing of those with relatively high film hardness (as described in the subsequent in-situ nano-scratch test scheme); the blade-shaped probe (4e) is used for nano-cutting testing; the pointed probe (4f) is used for mechanical property testing of device-level nano-film layers (equivalent to nano-indentation).

[0093] The present invention also provides an in-situ mechanical testing device, including the above-mentioned in-situ mechanical property testing device and a material analysis testing device, and the external interface of the in-situ mechanical property testing device is vacuum-sealed and connected to the material analysis testing device;

[0094] The material analysis testing device is FIB or SEM.

[0095] The in-situ mechanical testing device provided by the present invention, by means of an existing material analysis testing device, adds an in-situ mechanical property testing device. The in-situ mechanical property testing device is inserted into an existing material analysis testing device such as SEM or FIB, and vacuum sealing is used to achieve system integration, enabling nano-level in-situ mechanical testing. The mechanical properties include but are not limited to hardness, elastic modulus, fracture strength, film interface bonding force, etc. It can not only be used for mechanical property testing of bulk materials, wires and multi-layer films, but also for mechanical property testing of different process films in semiconductor devices and stress testing of the bonding force between process layers.

[0096] The in-situ mechanical property testing device proposed by the present invention can achieve the following tests:

[0097] 1. In-situ nano-scratch test (non-device level);

[0098] 2. In-situ nano-scratch test (device level);

[0099] 3. In-situ nano-peeling test (non-device level);

[0100] 4. In-situ nano-peeling test (device level);

[0101] 5. In-situ wire cutting test;

[0102] 6. In-situ test of mechanical properties of nano-film layer (non-device level);

[0103] 7. In-situ test of mechanical properties of nano-film layer (device level).

[0104] It should be noted that in the present invention, the material analysis and testing equipment is FIB (focus ion beam) or SEM (Scanning electron microscopy), which can refer to FIB with SEM function or a separate FIB, or SEM with FIB function or a separate SEM.

[0105] In the present invention, terms such as "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. Terms such as "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or a virtual connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0106] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", "left", "right", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, should not be construed as a limitation to the present invention.

[0107] In the description of this specification, the descriptions of terms such as "one embodiment", "some embodiments", "specific embodiments", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or instance. Moreover, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.

[0108] The above are only some exemplary embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An in-situ mechanical property testing device, characterized in that, It includes a base, a connecting rod, a test probe, a control system, and a pressure testing system. The control system includes a displacement sensor, a drive motor, and control software; The base is used for sealing connection with a material analysis and testing device; The connecting rod includes a first connecting rod and a second connecting rod connected in sequence. The free end of the first connecting rod is connected to the base, and the free end of the second connecting rod is connected to the test probe. Both the first connecting rod and the second connecting rod are telescopic rods. Displacement sensors and drive motors are provided on both the first connecting rod and the second connecting rod. Different displacement sensors are used to monitor the movement positions of different connecting rods, and the control software controls the telescopic movements of different telescopic rods respectively; The control system controls the movement of the connecting rod; The pressure testing system is used to control and measure the applied stress of the test probe.

2. The in-situ mechanical property testing device according to claim 1, characterized in that, The base is further provided with a universal rotary connection mechanism. The universal rotary connection mechanism is connected to the first connecting rod. The control system also controls the movement of the universal rotary connection mechanism, and the movement of the universal rotary connection mechanism drives the movement of the connecting rod.

3. The in-situ mechanical property testing device according to claim 1, characterized in that, The pressure testing system includes a pressure sensor and stress measurement software.

4. The in-situ mechanical property testing device according to claim 3, wherein The pressure sensor of the pressure testing system is arranged at the position where the connecting rod is connected to the test probe or at the position where the first connecting rod is connected to the second connecting rod.

5. The in-situ mechanical property testing device according to claim 1, characterized in that, The base is hermetically connected to the external interface of the material analysis and testing device.

6. The in-situ mechanical property testing device according to claim 5, characterized in that, The connection port for the hermetic connection between the base and the external interface of the material analysis and testing device is arranged at the position between the base and the connecting rod; Furthermore, the connection port is also provided with a sealing member and a fixing member for fixing the base and the material analysis and testing device.

7. The in-situ mechanical property testing device according to any one of claims 1-6, characterized in that The test probe includes a connecting portion and a testing portion, and the testing portion is connected to the connecting rod through the connecting portion; The testing portion is selected from any one of the following shapes: Arc-shaped, flat, conical, triangular, sharp-cornered, blade-shaped.

8. An in-situ mechanical testing device, characterized in that, It includes the in-situ mechanical property testing device according to any one of claims 1-7 and a material analysis and testing device. The in-situ mechanical property testing device is hermetically connected to the external interface of the material analysis and testing device in a vacuum; The material analysis and testing device is FIB or SEM.

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