A display panel and a display device

Abstract

Embodiments of the present application disclose a display panel and a display device. The display panel includes a substrate; a driving circuit layer disposed on one side surface of the substrate; and light-emitting units arrayed on one side surface of the driving circuit layer away from the substrate. Wherein, a groove is provided on one side of the substrate away from the driving circuit layer, and the groove is filled with a heat-conducting material. The beneficial effects of the embodiments of the present application are that a groove is formed on the substrate in the display panel and display device provided by the embodiments of the present application, and a heat-conducting adhesive and heat-conducting particles are filled in the groove to conduct the heat of the light-emitting units to the outside of the substrate, avoiding heat accumulation on the driving circuit layer and causing the driving circuit layer to age and fail. The groove is disposed directly below the light-emitting units, thereby maximizing the reduction of the heat-conducting path and improving the heat-conducting efficiency.

Description

Technical Field

[0001] The present application relates to the field of displays, and particularly to a display panel and a display device. Background Art

[0002] A light emitting diode (LED) is a semiconductor electronic component that can convert electrical energy into light energy. Due to its characteristics such as small size, long service life, rich and colorful colors, and low energy consumption, it is widely used in fields such as lighting, display screens, signal lights, backlights, and toys. Mini LED, also known as sub-millimeter light emitting diode, usually has a size of 80 micrometers to 200 micrometers. It is a new generation of LED technology that inherits the characteristics of small-pitch LEDs, such as high efficiency, high reliability, high brightness, and fast response time. Compared with small-pitch LEDs, it has lower power consumption and cost.

[0003] The development of Mini-LED is one of the hotspots of future display technologies. Compared with current LCD and OLED display devices, it has advantages such as fast response, high color gamut, and low energy consumption. However, it has many technical difficulties and is technically complex.

[0004] The LED chip emits light and heat for a long time, which easily causes heat to concentrate inside the substrate, especially the flexible substrate, and cannot be dissipated. As a result, the lower layer driving device layer operates at a high temperature for a long time, affecting the service life of the driving device and the stability of the supply current. Summary of the Invention

[0005] Embodiments of the present application provide a display panel and a display device, which can solve the technical problem in the prior art that the temperature of the display panel is too high, resulting in a reduced service life of the driving device.

[0006] Embodiments of the present application provide a display panel, including a substrate; a driving circuit layer provided on one side surface of the substrate; and light emitting units arrayed on the side surface of the driving circuit layer away from the substrate. Wherein, a groove is provided on the side of the substrate away from the driving circuit layer, and the groove is filled with a heat conducting material.

[0007] Optionally, in some embodiments of the present application, the opening of the groove faces away from the driving circuit layer, and the groove corresponds to the light emitting unit one by one.

[0008] Optionally, in some embodiments of the present application, the heat conducting material includes a heat conducting adhesive and heat conducting particles. The heat conducting adhesive is filled in the groove, and the heat conducting particles are distributed in the heat conducting adhesive.

[0009] Optionally, in some embodiments of the present application, the heat conducting particles include at least one of carbon particles, graphene particles, and metal particles.

[0010] Optionally, in some embodiments of the present application, the depth of the groove is 95% to 100% of the thickness of the substrate.

[0011] Optionally, in some embodiments of the present application, the substrate is a flexible transparent substrate.

[0012] Optionally, in some embodiments of the present application, a projection A of the groove on the substrate driving circuit layer and a projection B of the light-emitting unit on the driving circuit layer have an overlapping area.

[0013] Optionally, in some embodiments of the present application, the ratio of the area of the overlapping area to the area of the projection A is 4:5 to 1:1.

[0014] Optionally, in some embodiments of the present application, a packaging layer is disposed on a side of the driving circuit layer away from the substrate and covers the light-emitting unit.

[0015] Correspondingly, an embodiment of the present application further provides a display device, including the above-mentioned display panel.

[0016] The beneficial effect of the embodiment of the present application is that a display panel and a display device provided by the embodiment of the present application open grooves on the substrate, and fill thermal conductive glue and thermal conductive particles in the grooves to conduct the heat of the light-emitting unit to the outside of the substrate, avoiding heat accumulation on the driving circuit layer and causing the driving circuit layer to age and fail. The groove is disposed directly below the light-emitting unit, thereby maximizing the reduction of the heat conduction path and improving the heat conduction efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 is a schematic structural diagram of the display panel provided by the embodiment of the present application;

[0019] Figure 2 is a schematic structural diagram after the preparation of the packaging layer provided by the embodiment of the present application;

[0020] Figure 3 is a schematic structural diagram after the preparation of the groove provided by the embodiment of the present application.

[0021] Description of the reference numerals:

[0022] Substrate 100; Driving circuit layer 200;

[0023] Light-emitting unit 300; Encapsulation layer 400;

[0024] Thermal conductive adhesive 500; Thermal conductive particles 600;

[0025] Pixel unit 310; Groove 110. Detailed implementation manner

[0026] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application. In addition, it should be understood that the specific implementation manners described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the orientation words such as "upper" and "lower" usually refer to the upper and lower in the actual use or working state of the device, specifically the drawing direction in the accompanying drawings; and "inner" and "outer" refer to the outline of the device.

[0027] The embodiments of the present application provide a display panel and a display device. The following is a detailed description.

[0028] Embodiment

[0029] In this embodiment, the present invention provides a display panel and a display device. Among them, the main technical features and all technical effects of the display device are reflected in the display panel. Specifically, as Figure 1 shown, the display panel includes a substrate 100, a driving circuit layer 200, a light-emitting unit 300, an encapsulation layer 400, a thermal conductive adhesive 500, and thermal conductive particles 600.

[0030] The substrate 100 is a flexible substrate, usually made of polyimide material. In this embodiment, the substrate 100 is a transparent substrate, so as to increase the transmittance of the display panel.

[0031] The driving circuit layer 200 is disposed on one side surface of the substrate 100. Specifically, the driving circuit layer 200 includes a plurality of driving circuit structures and a plurality of pads. Among them, the pads are exposed on the side surface of the driving circuit layer 200 away from the substrate 100 for connecting to the light-emitting unit 300, and the driving circuit structures are used to transmit electrical signals to the pads. In another preferred embodiment of the present invention, the driving circuit structure is a thin-film transistor unit, which can actively and separately drive each light-emitting unit 300 to increase the brightness and contrast of the display panel.

[0032] The light-emitting units 300 are disposed on the surface of the driving circuit layer 200 away from the substrate 100. In this embodiment, the light-emitting units 300 are mini light-emitting diodes (Mini-LEDs), which are arranged in an array on the driving circuit layer 200, and each light-emitting unit 300 is correspondingly welded to a pad. In this embodiment, a group of light-emitting units 300 are correspondingly welded to each pad, and each group of light-emitting units 300 includes a red light-emitting unit, a green light-emitting unit, and a blue light-emitting unit. Each group of light-emitting units 300 is a pixel unit 310. There is a gap between two adjacent pixel units 310.

[0033] The encapsulation layer 400 is disposed on the side of the driving circuit layer 200 away from the substrate 100. The encapsulation layer 400 is a transparent encapsulation material for encapsulating the light-emitting units 300 to prevent external moisture from invading the interior of the light-emitting units 300, thereby causing the light-emitting units 300 to fail.

[0034] Since a large amount of heat is released when the electrical energy is converted into light energy when the light-emitting units 300 are connected to the power supply and emit light, this heat needs to be quickly dissipated to prevent heat accumulation from causing the driving circuit layer 200 below the light-emitting units 300 to age and fail rapidly in a high-temperature environment. In this embodiment, a plurality of grooves 110 are formed in the substrate 100, wherein the openings of the grooves 110 face away from the side of the driving circuit layer 200 for subsequent filling of a heat-conducting material. The thickness of the grooves 110 is less than or equal to the thickness of the substrate 100. When the thickness of the grooves 110 is equal to the thickness of the substrate 100, the grooves 110 are hole structures longitudinally penetrating the substrate 100. The gap between two adjacent grooves 110 is greater than the width of the grooves 110. Thereby, the strength of the substrate 100 is ensured, and the substrate 100 is prevented from breaking due to the formation of the grooves 110. In this embodiment, the grooves 110 are correspondingly arranged with the pixel units 310, that is, the grooves 110 are disposed directly below the pixel units 310, so that the heat-conducting path between the pixel units 310 and the grooves 110 is the shortest, increasing the heat-conducting effect. In another preferred embodiment of the present invention, the grooves 110 can also be disposed between two adjacent pixel units 310, thereby reducing the number of grooves 110 and enhancing the strength of the substrate 100. In another preferred embodiment of the present invention, the projection A of the grooves 110 on the driving circuit layer 200 and the projection B of the pixel units 310 on the driving circuit layer 200 have an overlapping area, and the ratio of the area of the overlapping area to the area of the projection A is 4:5 to 1:1.

[0035] A heat-conducting adhesive 500 and heat-conducting particles 600 are filled in the grooves 110. Among them, the heat-conducting adhesive 500 is a transparent colloid with a heat-conducting coefficient of 2 to 5 W / mK. It can well conduct the heat generated by the light-emitting units 300 to the outside of the openings of the grooves 110, preventing heat from accumulating in the driving circuit layer 200.

[0036] Specifically, in this embodiment, heat-conducting particles 600 are further injected into the heat-conducting adhesive 500. The heat-conducting particles 600 are carbon particles, graphene particles or metal particles, which is beneficial to further improve the heat-conducting ability of the substrate 100 and can improve the heat conduction efficiency.

[0037] To better explain the present invention, a method for manufacturing the above display panel is also provided in this embodiment, which specifically includes the following manufacturing steps:

[0038] S1) As Figure 2 shown, a substrate 100 is provided. The substrate 100 is a transparent flexible substrate. A driving circuit layer 200, a light-emitting unit 300 and a packaging layer 400 are sequentially manufactured on the substrate 100.

[0039] S2) As Figure 3 shown, a groove 110 is formed on the side of the substrate 100 away from the driving circuit layer 200. Among them, the groove 110 is arranged corresponding to the light-emitting unit 300, and the depth of the groove 110 is 95% - 100% of the thickness of the substrate 100.

[0040] S3) The heat-conducting adhesive 500 and the heat-conducting particles 600 are filled in the groove 110. The heat-conducting particles 600 are carbon particles, graphene particles or metal particles.

[0041] The beneficial effect of this embodiment is that a display panel and a display device provided in this embodiment form a groove on the substrate and fill the groove with a heat-conducting adhesive and heat-conducting particles to conduct the heat of the light-emitting unit to the outside of the substrate, avoiding heat accumulation on the driving circuit layer and causing the driving circuit layer to age and fail. The groove is arranged directly below the light-emitting unit, thereby maximizing the reduction of the heat conduction path and improving the heat conduction efficiency.

[0042] The above has introduced in detail a display panel and a display device provided by an embodiment of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A display panel, characterized in that, including a substrate, the substrate being a flexible transparent substrate, and the material of the substrate including polyimide; a driving circuit layer disposed on one surface of the substrate; light-emitting units arrayed on a surface of the driving circuit layer away from the substrate; wherein, a groove is provided on a side of the substrate away from the driving circuit layer, and a heat-conducting material is filled in the groove.

2. The display panel according to claim 1, wherein the opening of the groove faces away from the driving circuit layer, and the groove corresponds to the light-emitting unit one by one.

3. The display panel according to claim 1, wherein the heat-conducting material includes a heat-conducting adhesive and heat-conducting particles, the heat-conducting adhesive is filled in the groove, and the heat-conducting particles are distributed in the heat-conducting adhesive.

4. The display panel according to claim 3, wherein the heat-conducting particles include at least one of carbon particles, graphene particles, and metal particles.

5. The display panel according to claim 1, wherein the depth of the groove is 95% - 100% of the thickness of the substrate.

6. The display panel according to claim 1, wherein a projection A of the groove on the driving circuit layer of the substrate and a projection B of the light-emitting unit on the driving circuit layer have an overlapping area.

7. The display panel according to claim 6, wherein the ratio of the overlapping area to the area of the projection A is 4:5 - 1:

1.

8. The display panel according to claim 1, wherein further including a packaging layer disposed on a side of the driving circuit layer away from the substrate and covering the light-emitting units.

9. A display device, characterized in that, including the display panel according to any one of claims 1 - 8.

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