Vibration absorbing device and electronic equipment

Abstract

The present application provides a vibration absorption device and an electronic device, which relate to the field of communication technology. The electronic device includes a shell, a speaker and a vibration absorption device. The speaker is arranged in the shell, and a first cavity is formed between the speaker and the shell; the outer shell of the speaker is provided with a first opening, and the vibration absorption device is arranged at the first opening, and the first opening is connected to the first cavity through the vibration absorption device.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a vibration absorbing device and an electronic device. Background Art

[0002] The speaker module is an acoustic module used in electronic devices such as mobile phones, tablets, and notebooks. In order to improve the appearance integrity and aesthetics of electronic devices, the current speaker module is usually set on the side of the electronic device. The speaker module includes a speaker and a speaker housing, and the speaker divides the speaker housing into a front cavity and a rear cavity. The sound waves generated by the speaker are transmitted through the front cavity to the sound outlet of the housing of the electronic device, and finally transmitted to the external environment where the electronic device is located.

[0003] In order to realize miniaturized electronic devices, the spatial layout of components in the electronic devices is relatively compact, which limits the volume of the rear cavity of the speaker module, resulting in poor low-frequency performance of the speaker module. Summary of the invention

[0004] The embodiments of the present application provide a vibration absorbing device and an electronic device, which can solve the problem in the prior art that the space layout of components in the electronic device is relatively compact, which limits the volume of the back cavity of the speaker module, resulting in poor low-frequency performance of the speaker module.

[0005] In order to solve the above-mentioned technical problems, the present invention is achieved as follows:

[0006] In a first aspect, an embodiment of the present application provides an electronic device, the electronic device comprising a housing, a speaker, and a vibration absorbing device, the speaker being disposed in the housing, and a first cavity being formed between the speaker and the housing;

[0007] The housing of the speaker is provided with a first opening, the vibration absorbing device is provided at the first opening, and the first opening is communicated with the first cavity through the vibration absorbing device.

[0008] In a second aspect, an embodiment of the present application provides a vibration absorbing device, the vibration absorbing device comprising:

[0009] The receiving structure has a sound inlet and a sound outlet, wherein the sound inlet is connected to the sound outlet to form a sound transmission channel;

[0010] The perforated vibration absorbing structure is arranged in the receiving structure, and a plurality of openings are opened on the perforated vibration absorbing structure. A second cavity is formed between the perforated vibration absorbing structure and the receiving structure, and the openings connect the second cavity and the sound transmission channel.

[0011] In a third aspect, an embodiment of the present application provides an electronic device, wherein the electronic device includes the vibration absorption device described in the second aspect.

[0012] In an embodiment of the present application, the electronic device includes a housing, a speaker, and a vibration absorbing device. The speaker is disposed in the housing, and a first cavity is formed between the speaker and the housing. The housing of the speaker is provided with a first opening, and the vibration absorbing device is disposed at the first opening, and the first opening is connected to the first cavity through the vibration absorbing device. In this way, the interior of the speaker and the first cavity are connected through the first opening, and the sound emitted by the speaker can flow to the first cavity through the first opening, thereby improving the low-frequency performance of the speaker; further, the vibration absorbing device can be used to absorb vibration to reduce the probability of resonance between the housing and the sound emitted by the speaker. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0014] Figure 2 This is one of the structural schematic diagrams of a vibration absorbing device provided in an embodiment of the present application;

[0015] Figure 3 This is the second structural schematic diagram of a vibration absorbing device provided in an embodiment of the present application;

[0016] Figure 4 It is a partial structural schematic diagram of a vibration absorbing device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0018] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0019] The vibration absorption device and the electronic device provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0020] See also Figure 1, Figure 1 is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application, such as Figure 1 As shown, the electronic device includes a housing 1 , a speaker 2 and a vibration absorbing device 3 . The speaker 2 is disposed in the housing 1 , and a first cavity 11 is formed between the speaker 2 and the housing 1 .

[0021] The housing 21 of the loudspeaker 2 is provided with a first opening 211 , the vibration absorbing device 3 is provided at the first opening 211 , and the first opening 211 is communicated with the first cavity 11 through the vibration absorbing device 3 .

[0022] The vibration absorbing device 3 can be assembled separately, or can be integrally formed with the housing 21 of the speaker 2. The vibration absorbing device 3 can be an expansion tube resonance muffler, or a porous material muffler, etc. The specific structure of the vibration absorbing device 3 is not limited in this embodiment.

[0023] In one embodiment, if Figure 2 As shown, the vibration absorbing device 3 may include:

[0024] The receiving structure 31 is connected to the speaker 2 and has a sound inlet 311 connected to the first opening 211 and a sound outlet 312 connected to the first cavity 11 . The sound inlet 311 and the sound outlet 312 are connected to form a sound transmission channel 313 .

[0025] The perforated vibration absorbing structure 32 is disposed in the receiving structure 31 . A plurality of openings 321 are formed on the perforated vibration absorbing structure 32 . A second cavity 33 is formed between the perforated vibration absorbing structure 32 and the receiving structure 31 . The openings 321 connect the second cavity 33 with the sound transmission channel 313 .

[0026] In one embodiment, if Figure 3 As shown, the vibration absorbing device 3 may include:

[0027] The expansion vibration absorbing structure 35 includes a connecting tube 351 and an expansion tube 352 . The connecting tube 351 is connected to the expansion tube 352 . The connecting tube 351 is disposed at the first opening 211 . The expansion tube 352 is communicated with the first cavity 11 .

[0028] It should be noted that the rear cavity 24 of the speaker 2 and the first cavity 11 can be connected through the first opening 211. The sound emitted by the speaker 2 can flow from the rear cavity 24 of the speaker 2 to the first cavity 11 through the first opening 211, which is equivalent to increasing the volume of the rear cavity 24 of the speaker 2, thereby improving the low-frequency performance of the speaker 2.

[0029] In one embodiment, the receiving structure 31 and the perforated vibration absorbing structure 32 constitute a perforated vibration absorbing assembly, and the vibration absorbing device 3 may include a plurality of perforated vibration absorbing assemblies; and / or, the vibration absorbing device 3 may include a plurality of expanded vibration absorbing structures 35;

[0030] Wherein, when there are multiple expansion vibration absorbing structures 35, multiple expansion vibration absorbing structures 35 are connected in series;

[0031] When there are multiple perforated vibration absorbing components, the multiple perforated vibration absorbing components are connected in series;

[0032] Alternatively, when there are multiple expansion vibration absorbing structures 35 and multiple perforated vibration absorbing components, one expansion vibration absorbing structure 35 and one perforated vibration absorbing component are connected in series to form a vibration absorbing unit, and multiple vibration absorbing units are connected in series to form a vibration absorbing device 3.

[0033] In addition, taking the connection of two perforated vibration-absorbing components in series as an example, the receiving structure 31 of the first perforated vibration-absorbing component is connected to the first opening 211, the open hole vibration-absorbing structure 32 of the first perforated vibration-absorbing component is connected to the open hole vibration-absorbing structure 32 of the second perforated vibration-absorbing component, the receiving structure 31 of the first perforated vibration-absorbing component is connected to the receiving structure 31 of the second perforated vibration-absorbing component, the sound inlet 311 and the sound outlet 312 of the first perforated vibration-absorbing component, and the sound inlet 311 and the sound outlet 312 of the second perforated vibration-absorbing component form a sound transmission channel, thereby realizing the connection of two perforated vibration-absorbing components in series, and the manner of connecting multiple perforated vibration-absorbing components in series is similar.

[0034] In addition, taking the connection of two vibration absorbing units in series as an example, the connecting tube 351 of the expanded vibration absorbing structure 35 of the first vibration absorbing unit is connected to the first opening 211, the connecting tube 351 of the expanded vibration absorbing structure 35 of the second vibration absorbing unit is connected to the receiving structure 31 of the first vibration absorbing unit, and the open-hole vibration absorbing structure 32 of the second vibration absorbing unit is connected to the first cavity 11, thereby realizing the connection of two vibration absorbing units in series, and the manner of connecting multiple vibration absorbing units in series is similar.

[0035] In this way, the air vibration passes through the loss of the multi-channel sound absorbing structure including multiple expanded vibration absorbing structures 35 and / or multiple open-hole vibration absorbing structures 32, and the sound waves of the resonant frequency contained in the air vibration transmitted into the first cavity 11 will be very small, which will greatly reduce the vibration of the shell 1.

[0036] It should be noted that after the back sound waves radiated by the speaker 2 pass through the back cavity 24, they will continue to propagate in the first cavity 11 through the first opening 211, and the sound waves enter the vibration absorbing device 3 through the first opening 211, and the sound waves are attenuated by the vibration absorbing device 3. In one embodiment, the vibration absorbing frequency band of the vibration absorbing device 3 may include a target frequency, and the target frequency is the resonant frequency at which the shell 1 resonates with the sound emitted by the speaker 2. The vibration absorbing device 3 attenuates the sound waves of the target frequency that easily excite the vibration of the shell 1, while the sound waves in other frequency bands are attenuated very little or basically unaffected. When the sound waves pass through the vibration absorbing device 3 and enter the first cavity 11, the resonance intensity of the shell 1 can be greatly reduced, thereby improving the user experience.

[0037] Taking the electronic device as a mobile phone as an example, when the first opening 211 is not provided, the cavity formed by the housing 21 of the speaker 2 is almost sealed, which can be called a closed BOX. For a closed BOX, when the speaker 2 is working, an air pressure change opposite to that in the front cavity 23 will occur in the rear cavity 24. The air pressure change in the front cavity 23 will eventually propagate to the outside of the mobile phone along the direction of the arrow in the front cavity 23 to form the sound heard by the user, while the air pressure change in the rear cavity 24 will be confined in the rear cavity 24, and a very small part will propagate outward through the housing 21 of the speaker 2, which can be basically ignored. The closed BOX has a poor low-frequency performance of the speaker 2 due to the small volume of the rear cavity 24. In the embodiment of the present application, by providing the first opening 211 in the housing 21 of the speaker 2, the cavity formed by the housing 21 of the speaker 2 is no longer sealed, which can be called an open BOX. The airflow in the housing 21 of the speaker 2 can flow with the airflow in the first cavity 11, so that the volume of the rear cavity 24 is increased, thereby improving the low-frequency performance of the speaker 2 and obtaining a better mobile phone external listening experience.

[0038] In the embodiment of the present application, by setting a first opening 211 on the housing 21 of the speaker 2, and the first opening 211 is connected to the first cavity 11 through the vibration absorbing device 3, the entire internal space of the mobile phone can be fully utilized, and the problem of strong vibration of the mobile phone battery cover can be solved.

[0039] It should be noted that the speaker 2 in the embodiment of the present application is particularly suitable for electronic devices with insufficient space and compact structure, such as virtual reality (VR) devices, augmented reality (AR) devices, mobile phones, tablets and other electronic devices.

[0040] In the embodiment of the present application, the electronic device includes a housing 1, a speaker 2 and a vibration absorbing device 3. The speaker 2 is arranged in the housing 1, and a first cavity 11 is formed between the speaker 2 and the housing 1. The housing 21 of the speaker 2 is provided with a first opening 211, and the vibration absorbing device 3 is arranged at the first opening 211. The first opening 211 is connected with the first cavity 11 through the vibration absorbing device 3. In this way, the interior of the speaker 2 and the first cavity 11 are connected through the first opening 211, and the sound emitted by the speaker 2 can flow to the first cavity 11 through the first opening 211, thereby improving the low-frequency performance of the speaker 2; further, the vibration absorbing device 3 can be used to absorb vibration to reduce the probability of resonance between the housing 1 and the sound emitted by the speaker 2.

[0041] Alternatively, if Figure 2 As shown, the vibration absorbing device 3 comprises:

[0042] The receiving structure 31 is connected to the speaker 2, and has a sound inlet 311 connected to the first opening 211 and a sound outlet 312 connected to the first cavity 11, and the sound inlet 311 and the sound outlet 312 are connected to form a sound transmission channel;

[0043] The perforated vibration absorbing structure 32 is disposed in the receiving structure 31 . The perforated vibration absorbing structure 32 is provided with a plurality of openings. A second cavity 33 is formed between the perforated vibration absorbing structure 32 and the receiving structure 31 . The openings connect the second cavity 33 and the sound transmission channel.

[0044] The receiving structure 31 may be a square receiving structure 31 , or a circular receiving structure 31 , or a receiving structure 31 of other shapes. The present embodiment does not limit the shape of the receiving structure 31 .

[0045] In addition, the open-hole vibration-absorbing structure 32 can be a pipe, the two ends of which are respectively connected to the sound inlet 311 and the sound outlet 312, and the sound inlet 311 and the sound outlet 312 of the receiving structure 31, as well as the pipe are connected to form a sound transmission channel; or, a plurality of open-hole vibration-absorbing structures 32 are enclosed to form the sound transmission channel.

[0046] It should be noted that the perforated vibration absorbing structure 32 can achieve resonance sound absorption through the multiple openings. Sound waves act on the perforated vibration absorbing structure 32, pushing the perforated vibration absorbing structure 32 to vibrate back and forth, thereby absorbing the energy of the sound waves and converting the sound energy into vibration energy for consumption. Under normal circumstances, the energy of the sound waves is not enough to push the perforated vibration absorbing structure 32 to vibrate. Only when resonance occurs can the perforated vibration absorbing structure 32 be caused to vibrate. The openings on the perforated vibration absorbing structure 32 can change the resonance frequency, thereby changing the frequency of the absorbed sound waves.

[0047] In one embodiment, if Figure 4 As shown, by adjusting the opening ratio of the open hole vibration absorbing structure 32, the cavity depth D of the second cavity 33 and the side wall thickness b of the open hole vibration absorbing structure 32, the resonance frequency of the open hole vibration absorbing structure 32 can be changed, thereby changing the sound absorption frequency of the open hole vibration absorbing structure 32. The sound absorption frequency of the open hole vibration absorbing structure 32 can be a target frequency, and the target frequency is the resonance frequency at which the housing 1 resonates with the sound emitted by the speaker 2.

[0048] In this way, due to the loss of air vibration through the open hole vibration absorbing structure 32, the sound waves contained in the air vibration transmitted into the first cavity 11 will be very small, which will greatly reduce the vibration of the shell 1.

[0049] Optionally, the open-hole vibration absorbing structure 32 is a pipe, and the two ends of the open-hole vibration absorbing structure 32 are respectively connected to the sound inlet 311 and the sound outlet 312, the sound transmission channel is located inside the open-hole vibration absorbing structure 32, and a plurality of the open holes are opened on the side wall of the open-hole vibration absorbing structure 32;

[0050] and / or

[0051] The vibration absorbing device 3 includes a plurality of open-hole vibration absorbing structures 32 , and the plurality of open-hole vibration absorbing structures 32 enclose and form the sound transmission channel.

[0052] The perforated vibration absorbing structure 32 is a pipe, which may be a square pipe, a circular pipe, or a pipe of other shapes, etc., which is not limited in this embodiment. The perforated vibration absorbing structure 32 may be a pipe formed by a perforated plate.

[0053] In addition, the perforated vibration absorbing structure 32 may be a perforated plate, and a plurality of perforated plates may enclose and form the sound transmission channel.

[0054] It should be noted that the open-pored vibration-absorbing structure 32 realizes resonant sound absorption through the side walls of the open-pored vibration-absorbing structure 32 . Sound waves act on the side walls, pushing the side walls to vibrate back and forth, thereby absorbing the sound wave energy and converting the sound energy into vibration energy for consumption.

[0055] Alternatively, if Figure 2 As shown, a sound absorbing material 34 is disposed in the second cavity 33 .

[0056] The sound absorbing material 34 may be placed close to the side wall of the second cavity 33 formed by the receiving structure 31. The sound absorbing material 34 may include linen, or petroleum fiber cotton, or sponge, or aluminum silicate cotton, and the like.

[0057] In this embodiment, the open hole vibration absorbing structure 32 can not only absorb sound waves of a specific frequency through the openings on the side wall, but also can assist the openings on the side wall in absorbing the sound waves of the specific frequency through the sound absorbing material 34 arranged in the second cavity 33, thereby improving the sound absorption effect of the open hole vibration absorbing structure 32.

[0058] Optionally, the plurality of openings provided on the open-hole vibration absorbing structure 32 are spaced apart along a sound transmission direction, and the sound transmission direction is directed from the sound inlet to the sound outlet.

[0059] The perforated vibration absorbing structure 32 may be a pipe, and the sound transmission direction may be from the end of the perforated vibration absorbing structure 32 connected to the sound inlet 311 to the end of the perforated vibration absorbing structure 32 connected to the sound outlet 312. A better sound absorption effect can be obtained by the multiple openings provided on the perforated vibration absorbing structure 32 and arranged at intervals along the sound transmission direction.

[0060] Optionally, the sound absorption frequency of the open hole vibration absorption structure 32 is a target frequency, and the target frequency is a resonance frequency at which the housing 1 resonates with the sound emitted by the speaker 2;

[0061] The sound absorption frequency of the open-pored vibration absorbing structure 32 is proportional to the porosity of the open-pored vibration absorbing structure 32 , inversely proportional to the cavity depth of the second cavity 33 , and inversely proportional to the sidewall thickness of the open-pored vibration absorbing structure 32 .

[0062] In one embodiment, the sound absorption frequency f of the open hole vibration absorption structure 32 may be:

[0063]

[0064] Wherein, c is the speed of sound, p is the porosity of the open-hole vibration absorbing structure 32 , and D is the cavity depth of the second cavity 33 .

[0065] Among them, the parameter L k for:

[0066]

[0067] Wherein, b is the side wall thickness of the open hole vibration absorbing structure 32 .

[0068] Alternatively, if Figure 3 As shown, the vibration absorbing device 3 comprises:

[0069] at least one expansion vibration absorbing structure 35, the expansion vibration absorbing structure 35 comprising a connecting pipe 351 and an expansion pipe 352, the connecting pipe 351 is connected to the expansion pipe 352, and the connecting pipe 351 is disposed at the first opening 211;

[0070] The expansion tube 352 is connected to the receiving structure 31 , and the first opening 211 is connected to the first cavity 11 through the connecting tube 351 , the expansion tube 352 and the sound transmission channel in sequence.

[0071] The connecting tube 351 may be a square tube, a circular tube, or a tube of other shapes, etc., and this embodiment does not limit the tube shape of the connecting tube 351. The expansion tube 352 may form a hollow cylindrical cavity, a hollow square cavity, or a cavity of other shapes, and this embodiment does not limit the cavity shape formed by the expansion tube 352.

[0072] In one embodiment, the connecting tube 351 is a circular pipe, and the expansion tube 352 forms a hollow cylindrical cavity.

[0073] In one embodiment, the diameter of the pipe formed by the open-hole vibration-absorbing structure 32 may be the same as the diameter of the connecting pipe 351 .

[0074] In one embodiment, a second opening and a third opening are respectively formed on two opposite side walls of the expansion tube 352 , the second opening is communicated with the open-hole vibration absorbing structure 32 , and the third opening is communicated with the connecting tube 351 .

[0075] The opening cross-sectional area of ​​the second opening may be the same as the cross-sectional area of ​​the pipe formed by the open hole vibration absorbing structure 32, and the cross-sectional area of ​​the pipe is the area of ​​the cross section perpendicular to the center line of the pipe. The opening cross-sectional area of ​​the third opening may be the same as the cross-sectional area of ​​the connecting pipe 351, and the cross-sectional area of ​​the connecting pipe 351 may be the area of ​​the cross section perpendicular to the center line of the connecting pipe 351.

[0076] In one embodiment, the cross-sectional area of ​​the pipe formed by the open-pored vibration-absorbing structure 32 may be the same as the cross-sectional area of ​​the connecting pipe 351 , so as to facilitate the sound waves to flow from the pipe formed by the open-pored vibration-absorbing structure 32 to the connecting pipe 351 , thereby providing a better transmission path for the sound waves.

[0077] In this way, the air vibration passes through the loss of the two sound absorbing structures including the expansion vibration absorbing structure 35 and the open hole vibration absorbing structure 32, and the sound waves of the target frequency contained in the air vibration transmitted into the first cavity 11 will be very small, which will greatly reduce the vibration of the shell 1.

[0078] Optionally, the vibration absorbing device 3 comprises:

[0079] The expansion vibration absorbing structure 35 includes a connecting tube 351 and an expansion tube 352 , wherein the connecting tube 351 is connected to the expansion tube 352 , and the connecting tube 351 is disposed at the first opening 211 , and the first opening 211 is connected to the first cavity 11 through the connecting tube 351 and the expansion tube 352 .

[0080] The pipe length of the expansion tube 352 may be one quarter of the target frequency, and the target frequency is the resonance frequency at which the shell 1 resonates with the sound emitted by the speaker 2 .

[0081] In one embodiment, the acoustic transmission coefficient of the expanded vibration absorbing structure 35 may be:

[0082]

[0083] Among them, f is the frequency of the sound wave, c is the speed of sound, such as Figure 3 As shown, S2 is the cross-sectional area of ​​the expansion tube 352, S1 is the cross-sectional area of ​​the connecting tube 351, and T is the pipe length of the expansion tube 352. According to the formula of the sound transmission coefficient, when the pipe length T of the expansion tube 352 is 1 / 4 of the wavelength of the sound wave, the sound transmission coefficient is the smallest, the reflection coefficient is the strongest, and the sound can be better eliminated.

[0084] Optionally, the vibration absorbing device 3 includes a plurality of the expansion vibration absorbing structures 35 , wherein the expansion tube 352 of the expansion vibration absorbing structure 35 is connected to the connecting tube 351 of another adjacent expansion vibration absorbing structure 35 .

[0085] Among them, taking the connection of two expansion vibration absorbing structures 35 in series as an example, the connecting tube 351 of the first expansion vibration absorbing structure 35 is connected to the first opening 211, the connecting tube 351 of the second expansion vibration absorbing structure 35 is connected to the expansion tube 352 of the first expansion vibration absorbing structure 35, and the expansion tube 352 of the second expansion vibration absorbing structure 35 is connected to the first cavity 11, thereby realizing the connection of two expansion vibration absorbing structures 35 in series, and the manner of connecting multiple expansion vibration absorbing structures 35 in series is similar.

[0086] Alternatively, if Figure 1 As shown, the speaker 2 includes a diaphragm 22, and the diaphragm 22 separates the speaker 2 into a front cavity 23 and a rear cavity 24. The front cavity 23 is connected to the sound outlet 25 of the speaker 2. The first opening 211 is provided on the shell 21 to form a side wall of the rear cavity 24. The rear cavity 24 is connected to the first cavity 11 through the first opening 211 and the vibration absorbing device 3.

[0087] The front cavity 23 and the rear cavity 24 may be isolated from each other.

[0088] Optionally, the vibration absorbing frequency band of the vibration absorbing device 3 includes a target frequency, and the target frequency is a resonance frequency at which the shell 1 resonates with the sound emitted by the speaker 2 .

[0089] It should be noted that if the frequency of the airflow emitted by the speaker 2 leaking into the housing 1 is near the target frequency, the housing 1 itself will resonate. By providing the vibration absorbing device 3, the vibration absorbing frequency band of the vibration absorbing device 3 includes the target frequency, so that the frequency of the airflow emitted by the speaker 2 leaking into the housing 1 can be reduced to the airflow near the target frequency through the vibration absorbing device 3, thereby reducing the possibility of resonance between the housing 1 and the sound emitted by the speaker 2, and even eliminating the resonance.

[0090] In one implementation, the center frequency of the vibration absorbing frequency band of the vibration absorbing device 3 is the target frequency.

[0091] Among them, the vibration absorbing device 3 has the best absorption effect on the airflow of the center frequency of the vibration absorbing frequency band. For example, the maximum value of the vibration absorbing frequency of the vibration absorbing device 3 can be frequency a, the minimum value of the vibration absorbing frequency of the vibration absorbing device 3 can be frequency b, and the center frequency of the vibration absorbing frequency band of the vibration absorbing device 3 can be (a+b) / 2.

[0092] In this way, the vibration absorbing device 3 can better eliminate the airflow near the target frequency, further reducing the possibility of resonance between the housing 1 and the sound emitted by the speaker 2.

[0093] Optionally, the electronic device further includes a damping net 4 disposed between the vibration absorbing device 3 and the housing 1 , and the first opening 211 is connected to the first cavity 11 through the vibration absorbing device 3 and the damping net 4 .

[0094] Wherein, the vibration absorbing device 3 may include a receiving structure 31, such as Figure 3 As shown, the damping net 4 may be arranged at the sound outlet 312 of the receiving structure 31. The damping net 4 may be a mesh cloth with high acoustic resistance. By arranging the damping net 4 between the vibration absorbing device 3 and the housing 1, the air pressure change of the airflow passing through the damping net 4 can be effectively reduced, thereby achieving the effect of balancing the air pressure.

[0095] The embodiment of the present application further provides a vibration absorbing device 3, the vibration absorbing device 3 comprising:

[0096] The receiving structure 31 has a sound inlet 311 and a sound outlet 312, wherein the sound inlet 311 is connected to the sound outlet 312 to form a sound transmission channel;

[0097] The perforated vibration absorbing structure 32 is disposed in the receiving structure 31 . The perforated vibration absorbing structure 32 is provided with a plurality of openings. A second cavity 33 is formed between the perforated vibration absorbing structure 32 and the receiving structure 31 . The openings connect the second cavity 33 and the sound transmission channel.

[0098] Optionally, the open-hole vibration absorbing structure 32 is a pipe, and the two ends of the open-hole vibration absorbing structure 32 are respectively connected to the sound inlet 311 and the sound outlet 312, the sound transmission channel is located inside the open-hole vibration absorbing structure 32, and a plurality of the open holes are opened on the side wall of the open-hole vibration absorbing structure 32;

[0099] and / or

[0100] The vibration absorbing device 3 includes a plurality of open-hole vibration absorbing structures 32 , and the plurality of open-hole vibration absorbing structures 32 enclose and form the sound transmission channel.

[0101] Optionally, a sound absorbing material 34 is disposed in the second cavity 33 .

[0102] Optionally, the plurality of openings provided on the open hole vibration absorbing structure 32 are arranged at intervals along the sound transmission direction.

[0103] Optionally, the sound absorption frequency of the open-pored vibration absorbing structure 32 is proportional to the porosity of the open-pored vibration absorbing structure 32 , inversely proportional to the cavity depth of the second cavity 33 , and inversely proportional to the sidewall thickness of the open-pored vibration absorbing structure 32 .

[0104] Optionally, the vibration absorbing device 3 comprises:

[0105] At least one expansion vibration absorbing structure 35, the expansion vibration absorbing structure 35 comprising a connecting tube 351 and an expansion tube 352, the connecting tube 351 being connected to the expansion tube 352;

[0106] The expansion tube 352 is connected to the receiving structure 31 .

[0107] The embodiment of the present application further provides a vibration absorbing device 3, the vibration absorbing device 3 comprising:

[0108] The expansion vibration absorbing structure 35 includes a connecting tube 351 and an expansion tube 352 , wherein the connecting tube 351 is connected to the expansion tube 352 .

[0109] An embodiment of the present application further provides an electronic device, which includes the vibration absorption device described in the embodiment of the present application.

[0110] The electronic device in the embodiment of the present application may be a mobile electronic device or a non-mobile electronic device. For example, the mobile electronic device may be a mobile phone, a tablet computer, a laptop computer, a PDA, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook or a personal digital assistant (PDA), etc., and the non-mobile electronic device may be a personal computer (PC), a television (TV), a teller machine or a self-service machine, etc., which is not specifically limited in the embodiment of the present application.

[0111] It should be noted that, in this article, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise one..." do not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0112] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. An electronic device, characterized in that: The electronic device comprises a housing (1), a speaker (2) and a vibration absorbing device (3); the speaker (2) is arranged in the housing (1), and a first cavity (11) is formed between the speaker (2) and the housing (1); The housing (21) of the loudspeaker (2) is provided with a first opening (211), the vibration absorbing device (3) is provided at the first opening (211), and the first opening (211) is connected to the first cavity (11) through the vibration absorbing device (3); Wherein, the vibration absorbing device (3) comprises: a receiving structure (31) connected to the speaker (2), the receiving structure (31) having a sound inlet (311) communicating with the first opening (211) and a sound outlet (312) communicating with the first cavity, the sound inlet (311) and the sound outlet (312) communicating with each other to form a sound transmission channel; The open-hole vibration absorbing structure (32) is arranged in the receiving structure (31), and a plurality of openings are provided on the open-hole vibration absorbing structure (32). A second cavity (33) is formed between the open-hole vibration absorbing structure (32) and the receiving structure (31), and the openings connect the second cavity (33) and the sound transmission channel.

2. The electronic device according to claim 1, characterized in that The open-hole vibration absorbing structure (32) is a pipe, the two ends of the open-hole vibration absorbing structure (32) are respectively connected to the sound inlet (311) and the sound outlet (312), the sound transmission channel is located inside the open-hole vibration absorbing structure (32), and a plurality of open holes are provided on the side wall of the open-hole vibration absorbing structure (32); and / or The vibration absorbing device (3) comprises a plurality of open-hole vibration absorbing structures (32), and the plurality of open-hole vibration absorbing structures (32) enclose and form the sound transmission channel.

3. The electronic device according to claim 1, characterized in that: Sound absorbing material (34) is arranged in the second cavity (33).

4. The electronic device according to claim 1, characterized in that: The multiple openings provided on the open hole vibration absorption structure (32) are arranged at intervals along a sound transmission direction, and the sound transmission direction is directed from the sound inlet to the sound outlet.

5. The electronic device according to claim 1, characterized in that: The sound absorption frequency of the open hole vibration absorption structure (32) includes a target frequency, and the target frequency is a resonance frequency at which the shell (1) resonates with the sound emitted by the speaker (2); The sound absorption frequency of the open-pore vibration absorption structure (32) is proportional to the opening ratio of the open-pore vibration absorption structure (32), inversely proportional to the cavity depth of the second cavity (33), and inversely proportional to the side wall thickness of the open-pore vibration absorption structure (32).

6. The electronic device according to claim 1, characterized in that: The vibration absorbing device (3) comprises: at least one expansion vibration absorbing structure (35), the expansion vibration absorbing structure (35) comprising a connecting tube (351) and an expansion tube (352), the connecting tube (351) being connected to the expansion tube (352), the connecting tube (351) being arranged at the first opening (211); The expansion tube (352) is connected to the receiving structure (31), and the first opening (211) is connected to the first cavity (11) via the connecting tube (351), the expansion tube (352) and the sound transmission channel in sequence.

7. The electronic device according to claim 1, characterized in that: The vibration absorbing device (3) comprises: An expansion vibration absorbing structure (35), the expansion vibration absorbing structure (35) comprising a connecting tube (351) and an expansion tube (352), the connecting tube (351) being connected to the expansion tube (352), the connecting tube (351) being arranged at the first opening (211), and the first opening (211) being connected to the first cavity (11) via the connecting tube (351) and the expansion tube (352).

8. The electronic device according to claim 6, characterized in that: The vibration absorbing device (3) comprises a plurality of the expansion vibration absorbing structures (35), wherein the expansion tube (352) of the expansion vibration absorbing structure (35) is connected to a connecting tube (351) of another adjacent expansion vibration absorbing structure (35).

9. The electronic device according to claim 1, characterized in that: The loudspeaker (2) comprises a diaphragm (22), wherein the diaphragm (22) separates the loudspeaker into a front cavity (23) and a rear cavity (24), wherein the front cavity (23) is connected to a sound outlet hole (25) of the loudspeaker, and the first opening (211) is provided on the housing (21) to form a side wall of the rear cavity (24), and the rear cavity is connected to the first cavity (11) via the first opening (211) and the vibration absorbing device (3).

10. The electronic device according to claim 1, characterized in that: The vibration absorbing frequency band of the vibration absorbing device (3) includes a target frequency, and the target frequency is a resonance frequency at which the shell (1) resonates with the sound emitted by the speaker (2).

11. The electronic device according to claim 1, characterized in that: The electronic device further comprises a damping net (4) arranged between the vibration absorbing device (3) and the housing, and the first opening (211) is connected to the first cavity (11) through the vibration absorbing device (3) and the damping net (4).

12. A vibration absorbing device, characterized in that: The vibration absorbing device comprises: The receiving structure (31) has a sound inlet (311) and a sound outlet (312), wherein the sound inlet (311) is connected to the sound outlet (312) to form a sound transmission channel; The open-hole vibration absorbing structure (32) is arranged in the receiving structure (31), and a plurality of openings are provided on the open-hole vibration absorbing structure (32). A second cavity (33) is formed between the open-hole vibration absorbing structure (32) and the receiving structure (31), and the openings connect the second cavity (33) and the sound transmission channel.

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