Resin composition for sealing, electronic component device, and method for manufacturing electronic component device

Abstract

A sealing resin composition for wafer level packaging, the sealing resin composition containing an epoxy resin, a hardener, and an inorganic filler, the sealing resin composition having an elastic modulus of 18 GPa or less at a temperature of 25°C.

Description

Technical Field

[0001] This invention relates to a sealing resin composition, an electronic component device, and a method for manufacturing the electronic component device. Background Technology

[0002] For example, Patent Document 1 discloses a sealing epoxy resin molding material containing a silicone compound, and the application of the sealing epoxy resin molding material to thin packaging.

[0003] [Existing Technical Documents]

[0004] [Patent Literature]

[0005] Patent Document 1: Japanese Patent Application Publication No. 2006-241307 Summary of the Invention

[0006] [The problem the invention aims to solve]

[0007] Wafer-level packaging (WLP) is a technology that uses a sealing resin composition to seal a large area. Since there is a tendency for molding warpage to become more pronounced as the area sealed by the sealing resin composition increases, there is a need for sealing resin compositions that can suppress molding warpage.

[0008] The embodiments disclosed herein are based on the aforementioned circumstances.

[0009] The present disclosure aims to provide a sealing resin composition for wafer-level packaging that suppresses molding warpage, an electronic component device sealed using the sealing resin composition, and a method for manufacturing the electronic component device sealed using the sealing resin composition.

[0010] [Technical means to solve the problem]

[0011] Specific methods for solving the aforementioned problem include the following forms.

[0012] <1> A sealing resin composition for wafer-level packaging, the sealing resin composition comprising epoxy resin, a hardener, and an inorganic filler, wherein the hardened form of the sealing resin composition has an elastic modulus of 18 GPa or less at a temperature of 25°C.

[0013] <2> The sealing resin composition according to <1> further contains an amorphous polymer with a glass transition temperature of 70°C or less.

[0014] <3> The sealing resin composition according to <1> or <2>, wherein the content of the inorganic filler is 65% by volume or more and 80% by volume or less relative to the total sealing resin composition.

[0015] <4> The sealing resin composition according to any one of <1> to <3>, wherein the glass transition temperature of the cured product of the sealing resin composition is 100°C or higher and 160°C or lower, and the coefficient of linear expansion between the temperature 25°C of the cured product of the sealing resin composition and the glass transition temperature is 10 × 10⁻⁶. -6 / K or above.

[0016] <5> according to <1> ~ <4> The sealing resin composition according to any one of the following, wherein the hardener comprises an active ester compound.

[0017] <6> An electronic component device includes: a support member, an element disposed on the support member, and a seal for sealing the element. <1> ~ <5> The hardened form of the sealing resin composition described in any one of the above statements.

[0018] <7> A method for manufacturing an electronic component device includes: a process of mounting a plurality of components on a wafer; and utilizing a method based on... <1> ~ <5> The process of sealing the plurality of elements together with the sealing resin composition described in any one of the above statements; and the process of monolithizing the sealed individual elements.

[0019] [The effects of the invention]

[0020] According to this disclosure, a sealing resin composition for wafer-level packaging that suppresses the occurrence of forming warpage of hardened material can be provided, an electronic component device sealed using the sealing resin composition, and a method for manufacturing the electronic component device sealed using the sealing resin composition. Detailed Implementation

[0021] In this disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that achieve the purpose of the process, even if they cannot be clearly distinguished from other processes.

[0022] In this disclosure, the numerical values ​​recorded before and after “~” in the numerical range represented by “~” are respectively the minimum value and the maximum value.

[0023] In the numerical ranges described in this disclosure, the upper or lower limit of one numerical range can be replaced by the upper or lower limit of other numerical ranges described in different stages. Furthermore, the upper or lower limit of the numerical ranges described in this disclosure can also be replaced by the values ​​shown in the embodiments.

[0024] In this disclosure, each component may also comprise multiple equivalent substances. In the case where multiple substances equivalent to each component are present in the composition, unless otherwise specified, the content or percentage of each component refers to the total content or percentage of the multiple substances present in the composition.

[0025] In this disclosure, multiple particles corresponding to each component may also be included. In the case where multiple particles corresponding to each component are present in the composition, unless otherwise specified, the particle size of each component refers to a value relating to a mixture of the multiple particles present in the composition.

[0026] <Sealant Composition>

[0027] The sealing resin composition disclosed herein is a sealing resin composition for wafer-level packaging, containing epoxy resin, a hardener, and an inorganic filler, wherein the hardened form of the sealing resin composition has an elastic modulus of 18 GPa or less at a temperature of 25°C.

[0028] Wafer-level packaging (WLP) is a technology that uses a sealing resin composition to seal a large area. The sealing resin composition disclosed herein suppresses molding warpage by having a modulus of elasticity of less than 18 GPa at a temperature of 25°C.

[0029] Sealing resin compositions generally exhibit a tendency to warp more easily when the coefficient of linear expansion of the cured material is higher. According to the sealing resin composition of this disclosure, even if the coefficient of linear expansion of the cured material is high, warping can be suppressed by ensuring that the modulus of elasticity of the cured material at 25°C is below 18 GPa.

[0030] From the viewpoint of further suppressing molding warpage, the modulus of elasticity of the cured sealant resin composition of this disclosure at a temperature of 25°C is more preferably 16 GPa or less, and even more preferably 14 GPa or less. The modulus of elasticity of the cured sealant resin composition of this disclosure at a temperature of 25°C is, for example, 10 GPa or more.

[0031] One example of the sealing resin composition disclosed herein is that the glass transition temperature of the cured material is in the range of 100°C to 170°C (preferably in the range of 100°C to 160°C), and the coefficient of linear expansion between the temperature of the cured material (25°C) and the glass transition temperature is 10 × 10⁻⁶. -6 / K or higher. The coefficient of linear expansion is, for example, 20 × 10⁻⁶. -6 / K or below.

[0032] In one embodiment, the coefficient of linear expansion between the glass transition temperature of the hardened material and the temperature 175°C is, for example, 30 × 10⁻⁶. -6 / K or higher. The coefficient of linear expansion is, for example, 75 × 10⁻⁶.-6 / K or below.

[0033] In this disclosure, the glass transition temperature is also referred to as Tg, the coefficient of linear expansion between 25°C and the glass transition temperature is also referred to as "CLE1" (coefficient of linear expansion 1), and the coefficient of linear expansion between the glass transition temperature and the temperature 175°C is also referred to as "CLE2" (coefficient of linear expansion 2).

[0034] Here, the methods for determining the elastic modulus, glass transition temperature, and coefficient of linear expansion of the cured resin composition for sealing are explained.

[0035] -Elastic modulus and Tg-

[0036] Using a sealing resin composition, a sheet with a thickness of 0.8 mm was formed under the conditions of mold temperature 175°C, molding pressure 7 MPa, and curing time 90 seconds. A 4 mm × 25 mm plate was cut from the sheet and used as a test piece.

[0037] The test specimen was placed in a solid viscoelasticity measuring device (e.g., TA Instruments, model RSA-G2) and dynamic viscoelasticity was measured using a three-point bending mode. The measurement conditions were set as follows: temperature range: 10℃~40℃, heating rate: 5℃ / min, vibration frequency: 10Hz, strain: 0.2%, environment: nitrogen flow.

[0038] The storage elasticity coefficient E′ (Pa) and the loss elasticity coefficient E″ (Pa) were measured, and the loss tangent tanδ (=E″ / E′) was calculated to obtain the tanδ-temperature curve.

[0039] The storage elastic coefficient E′ at 25°C is set as the elastic coefficient (GPa) of the cured resin composition for sealing, and the temperature of the peak of the tanδ-temperature curve is set as the Tg (°C) of the cured resin composition for sealing.

[0040] -Coefficient of linear expansion-

[0041] Using a sealing resin composition, a prism with a length of 20 mm and a side length of 4 mm was formed under the conditions of mold temperature of 175°C, molding pressure of 7 MPa and curing time of 120 seconds, and used as a test piece.

[0042] The test specimen was placed in a thermomechanical analysis apparatus (e.g., Rigaku Corporation, model TMA8310L) and thermomechanical analysis was performed using compression and heating modes. The measurement conditions were set as follows: temperature range: 20℃~180℃, heating rate: 5℃ / min, load: 98mN, environment: nitrogen flow.

[0043] Measure the length L of the test piece at 20℃ 20 (mm), length L of the test piece at 25℃ 25 (mm), the length L of the test piece at Tg of the cured resin composition for sealing. Tg (mm), length L of the test piece at 175℃ 175 (mm).

[0044] Calculate the temperature difference Δt1 = Tg - 25 (K) between Tg and 25℃, and the length difference ΔL1 = L between Tg and 25℃. Tg -L 25 (mrm), and then calculate CLE1 according to the following formula 1.

[0045] The temperature difference Δt2 between 175℃ and Tg was calculated as 175 - Tg (K), and the length difference ΔL2 between 175℃ and Tg was calculated as L. 175 -L Tg (mm), and then calculate CLE2 according to the following formula 2.

[0046] (Equation 1)...CLE1( / K)=(1÷L) 20 )×(ΔL1÷Δt1)

[0047] (Equation 2)...CLE2( / K)=(1÷L) 20 )×(ΔL2÷Δt2)

[0048] There are no particular limitations on the method of controlling the elastic modulus of the hardened material at a temperature of 25°C to below 18 GPa. For example, it can be controlled by including an amorphous polymer with a Tg of 70°C or below in the sealing resin composition, or by increasing or decreasing the content of inorganic fillers in the sealing resin composition.

[0049] (Tg is for amorphous polymers below 70℃)

[0050] In this disclosure, an amorphous polymer refers to a polymer that corresponds to any one of (a) to (c) in differential scanning calorimetry (DSC).

[0051] (a) Polymers for which a distinct endothermic peak could not be identified.

[0052] (b) Polymers exhibiting a step-like change in endothermic heat.

[0053] (c) Polymers whose full width at half maximum (FWHM) of the endothermic peak, measured at a heating rate of 10 °C / min, exceeds 10 °C.

[0054] The glass transition temperature of amorphous polymers is determined from the DSC curve and is the "extrapolated glass transition onset temperature" recorded in the "Method for Determining Glass Transition Temperature" of Japanese Industrial Standard (JIS) K7121:1987 "Method for Determining the Transition Temperature of Plastics".

[0055] As amorphous polymers with a Tg below 70℃, examples include silicones, various modified silicones, polyimides, and polyamide-imides.

[0056] Amorphous polymers with a Tg of 70°C or less are more preferably those with a Tg of 50°C or less, and even more preferably those with a Tg of 30°C or less.

[0057] As an example of an embodiment of an amorphous polymer with a Tg below 70°C, polyether-modified silicone can be cited. There is no particular limitation on the type of polyether-modified silicone, as long as it is a compound having a siloxane-based backbone, i.e., a silicone, to which polyether groups have been introduced. The polyether-modified silicone can be a side-chain modified polyether-modified silicone, a terminal modified polyether-modified silicone, or a polyether-modified silicone with both side chains and terminal modifications. Among these, a side-chain modified polyether-modified silicone is preferred.

[0058] As an example of an embodiment of an amorphous polymer with a Tg below 70°C, epoxy-polyether modified silicone can be cited. Epoxy-polyether modified silicone is not particularly limited as long as it is a compound having a main molecular structure based on siloxane bonds, i.e., silicone, in which polyether groups and epoxy groups are introduced.

[0059] The epoxy-polyether modified silicone can be a side-chain modified epoxy-polyether modified silicone, a terminal modified epoxy-polyether modified silicone, or a side-chain and terminal modified epoxy-polyether modified silicone. Polydimethylsiloxane is preferably used as the main skeleton of the epoxy-polyether modified silicone. The polyether group is preferably a polyether group polymerized from one or both of ethylene oxide and propylene oxide.

[0060] Epoxy-polyether modified silicone is preferably a side-chain modified epoxy-polyether silicone in which polyether groups (preferably polyether groups formed by polymerization of one or both of ethylene oxide and propylene oxide) and epoxy groups are respectively present in the side chains of silicone (preferably polydimethylsiloxane). Commercially available epoxy-polyether modified silicones include, for example, Momentive Advanced Materials.e Performanc e Materials Corporation's "SIM768E", Dow Toray Industries' "BY16-760", "BY16-870", and "BY16-876" are examples of such products.

[0061] As an example of an embodiment of an amorphous polymer with a Tg below 70°C, polycaprolactone-modified silicone can be cited. Polycaprolactone-modified silicone is not particularly limited as long as it is a compound formed by reacting caprolactone with a polymeric compound having a main backbone based on siloxane bonds, i.e., silicone.

[0062] Polycaprolactone-modified silicone can be side-chain modified, single-terminal modified, or bi-terminal modified, with bi-terminal modified silicone being preferred. Polydimethylsiloxane is preferably used as the main skeleton of the polycaprolactone-modified silicone. Commercially available bi-terminal modified polycaprolactone-modified silicone, such as "DBL-C32" manufactured by Gelest, is an example.

[0063] There are no particular limitations on the viscosity of amorphous polymers with a Tg of 70°C or below. From the viewpoint of controlling the elastic modulus of the cured resin composition for sealing, the viscosity (at 25°C) of amorphous polymers with a Tg of 70°C or below is preferably 0.5 Pa·s to 300 Pa·s, more preferably 1 Pa·s to 100 Pa·s, and even more preferably 2 Pa·s to 50 Pa·s.

[0064] The viscosity of amorphous polymers with a Tg below 70℃ is set as the value obtained according to the method of JIS K 7233:1986.

[0065] From the viewpoint of controlling the elastic modulus of the cured resin composition for sealing, the content of amorphous polymer with a Tg of 70°C or less is preferably 10 to 100 parts by mass relative to 100 parts by mass of epoxy resin, more preferably 15 to 80 parts by mass, and even more preferably 20 to 60 parts by mass, and even more preferably 20 to 40 parts by mass.

[0066] (Epoxy resin)

[0067] There are no particular restrictions on the types of epoxy resins that have epoxy groups in their molecules.

[0068] Specific examples of epoxy resins include: phenolic varnish resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthol with aliphatic aldehyde compounds such as formaldehyde, acetaldehyde, and propionaldehyde under an acidic catalyst; and epoxidizing the phenolic varnish resin to obtain phenolic varnish-type epoxy resins (phenolic varnish-type epoxy resins, o-cresol varnish-type epoxy resins, etc.); and triphenylmethane-type phenolic resins obtained by condensing or co-condensing the phenolic compound with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst. Triphenylmethane-type epoxy resin obtained by epoxidation of phenolic resin; phenolic varnish resin obtained by co-condensation of the phenolic compound and naphthol compound with an aldehyde compound under an acidic catalyst, followed by epoxidation of the phenolic varnish resin to obtain a copolymeric epoxy resin; diphenylmethane-type epoxy resin as diglycidyl ether of bisphenol A, bisphenol F, etc.; biphenyl-type epoxy resin as diglycidyl ether of alkyl-substituted or unsubstituted biphenol; stilbene-type epoxy resin as diglycidyl ether of stilbene-based phenolic compounds; sulfur-containing epoxy resin as diglycidyl ether of bisphenol S, etc.; epoxy resin as glycidyl ether of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; epoxy resin as glycidyl ether of phthalic acid, isophthalic acid, etc. Glycidyl ester type epoxy resins of polycarboxylic acid compounds such as acids and tetrahydrophthalic acid; glycidyl amine type epoxy resins obtained by replacing the active hydrogen atom of nitrogen atoms in aniline, diaminodiphenylmethane, isocyanuric acid, etc. with glycidyl groups; dicyclopentadiene type epoxy resins obtained by epoxidizing a co-condensation resin of dicyclopentadiene and phenolic compounds; alicyclic epoxy resins such as diepoxyvinylcyclohexene, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spirocyclic (3,4-epoxy)cyclohexane-m-dioxane obtained by epoxidizing the olefin bonds within the molecule; and glycidyl ethers as p-xylene-modified phenolic resins. p-Xylene-modified epoxy resin; p-Xylene-modified epoxy resin of glycidyl ether as a m-xylene-modified phenolic resin; terpene-modified epoxy resin of glycidyl ether as a terpene-modified phenolic resin; dicyclopentadiene-modified epoxy resin of glycidyl ether as a dicyclopentadiene-modified phenolic resin; cyclopentadiene-modified epoxy resin of glycidyl ether as a cyclopentadiene-modified phenolic resin; polycyclic aromatic ring-modified epoxy resin of glycidyl ether as a polycyclic aromatic ring-modified phenolic resin; naphthalene-type epoxy resin of glycidyl ether as a naphthalene-containing phenolic resin; halogenated phenolic varnish-type epoxy resin; hydroquinone-type epoxy resin; trimethylolpropane-type epoxy resin; linear aliphatic epoxy resin obtained by oxidizing olefin bonds using peracids such as peracetic acid.Aryl alkyl epoxy resins are obtained by epoxidation of aryl alkyl phenol resins such as phenolic aryl alkyl resins and naphthol aryl alkyl resins. Furthermore, epoxides of acrylic resins can also be used as epoxy resins. These epoxy resins can be used alone or in combination of two or more.

[0069] There are no particular limitations on the epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin. From the viewpoint of balancing various properties such as formability, reflow resistance, and electrical reliability, 100 g / eq to 1000 g / eq is preferred, and 150 g / eq to 500 g / eq is more preferred.

[0070] The epoxy equivalent of the epoxy resin is set as the value obtained by determination using the method based on JIS K 7236:2009.

[0071] When the epoxy resin is solid, there are no particular limitations on its softening point or melting point. From the viewpoint of formability and reflow resistance, a temperature of 40°C to 180°C is preferred, and from the viewpoint of operability in the preparation of the sealing resin composition, a temperature of 50°C to 130°C is more preferred.

[0072] The melting point or softening point of the epoxy resin is set as a value obtained by determination using differential scanning calorimetry (DSC) or the method of JIS K 7234:1986 (ring and ball method).

[0073] In terms of strength, flowability, heat resistance, and formability, the mass percentage of epoxy resin in the total amount of the sealing resin composition is preferably 0.5% to 50% by mass, more preferably 2% to 30% by mass.

[0074] (hardener)

[0075] The sealing resin composition disclosed herein contains a curing agent. There are no particular limitations on the type of curing accelerator.

[0076] The curing agent is preferably a reactive ester compound. The reactive ester compound in this disclosure refers to a compound having one or more ester groups that react with epoxy groups in one molecule and possessing the curing effect of epoxy resin.

[0077] The transmission loss caused by the thermal conversion of radio waves transmitted for communication within a dielectric material is expressed as the product of frequency, the square root of the relative permittivity, and the dielectric tangent. That is, the transmitted signal readily converts into heat proportionally to the frequency; therefore, to suppress transmission loss, the higher the frequency band, the lower the dielectric properties required for the materials of communication components. In the field of information communication, with the increase in the number of channels and the amount of information transmitted, the frequency of radio waves is increasing. Currently, the practical application of 5G mobile communication systems is underway worldwide, and several candidate frequency bands in the range of approximately 30GHz to 70GHz can be listed. Future mainstream wireless communication will be at such high frequencies, therefore, the dielectric tangent required for the materials of communication components will be even lower.

[0078] Previously, phenolic curing agents and amine curing agents were commonly used as curing agents for epoxy resins. In the reaction of epoxy resin with phenolic or amine curing agents, secondary hydroxyl groups are generated. In contrast, in the reaction of epoxy resin with reactive ester compounds, ester groups are generated instead of secondary hydroxyl groups. Since ester groups are less polar than secondary hydroxyl groups, sealing resin compositions containing reactive ester compounds as curing agents can suppress the dielectric tangent of the cured material to a lower degree compared to sealing resin compositions containing only curing agents that generate secondary hydroxyl groups.

[0079] Furthermore, the polar groups in the hardened material increase its water absorption. By using an active ester compound as a hardener, the concentration of polar groups in the hardened material can be suppressed, thereby inhibiting its water absorption. Moreover, by suppressing the water absorption of the hardened material, i.e., suppressing the content of H2O as a polar molecule, the dielectric tangent of the hardened material can be further reduced.

[0080] There are no particular restrictions on the types of reactive ester compounds that have one or more ester groups in their molecule that react with an epoxy group. Examples of reactive ester compounds include: phenolic esters, thiophenolic esters, N-hydroxyamine esters, and esterifications of heterocyclic hydroxyl compounds.

[0081] Examples of active ester compounds include ester compounds obtained by combining at least one aliphatic carboxylic acid and an aromatic carboxylic acid with at least one aliphatic hydroxyl compound and an aromatic hydroxyl compound. Ester compounds in which an aliphatic compound is used as a condensation component tend to exhibit excellent compatibility with epoxy resins due to the presence of an aliphatic chain. Ester compounds in which an aromatic compound is used as a condensation component tend to exhibit excellent heat resistance due to the presence of an aromatic ring.

[0082] Specific examples of active ester compounds include aromatic esters obtained through the condensation reaction of aromatic carboxylic acids and phenolic hydroxyl groups. Preferably, aromatic esters are obtained by using a mixture of aromatic carboxylic acid components (such as benzene, naphthalene, biphenyl, diphenylpropane, diphenylmethane, diphenyl ether, and diphenylsulfonic acid) as raw materials, formed by substituting 2 to 4 hydrogen atoms of the aromatic ring with a carboxyl group, a monohydric phenol formed by substituting 1 hydrogen atom of the aromatic ring with a hydroxyl group, and a polyhydric phenol formed by substituting 2 to 4 hydrogen atoms of the aromatic ring with a hydroxyl group, through the condensation reaction of aromatic carboxylic acids and phenolic hydroxyl groups. That is, aromatic esters preferably have structural units derived from the aromatic carboxylic acid component, structural units derived from the monohydric phenol, and structural units derived from the polyhydric phenol.

[0083] Specific examples of active ester compounds include phenolic resins having a molecular structure formed by aliphatic cyclic hydrocarbon nodules as described in Japanese Patent Application Publication No. 2012-246367, and active ester resins having a structure obtained by reacting an aromatic dicarboxylic acid or its halide with an aromatic monohydroxy compound. Preferably, the active ester resin is a compound represented by the following structural formula (1).

[0084] [Chemistry 1]

[0085]

[0086] In structural formula (1), R 1 X is an alkyl group having 1 to 4 carbon atoms, X is a benzene ring, a naphthalene ring, a benzene ring or naphthalene ring formed by substitution with an alkyl group having 1 to 4 carbon atoms, or a biphenyl ring, Y is a benzene ring, a naphthalene ring, or a benzene ring or naphthalene ring formed by substitution with an alkyl group having 1 to 4 carbon atoms, k is 0 or 1, and n represents the average number of repetitions and is 0.25 to 1.5.

[0087] As specific examples of compounds represented by structural formula (1), the following exemplary compounds (1-1) to (1-10) can be listed. In the structural formula, t-Bu is tert-butyl.

[0088] [Chemistry 2]

[0089]

[0090] [Chemistry 3]

[0091]

[0092] Other specific examples of active ester compounds include compounds represented by the following structural formula (2) and compounds represented by the following structural formula (3) as described in Japanese Patent Application Publication No. 2014-114352.

[0093] [Chemistry 4]

[0094]

[0095] In structural formula (2), R 1 and R 2 Each of the following is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. Z is an ester-forming structural site (z1) or a hydrogen atom (z2) selected from the group consisting of benzoyl, naphthoyl, benzoyl or naphthoyl formed by substitution of an alkyl group having 1 to 4 carbon atoms, and acyl groups having 2 to 6 carbon atoms. At least one of Z is an ester-forming structural site (z1).

[0096] In structural formula (3), R 1 and R 2 Each of the following is independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or an alkoxy group having 1 to 4 carbon atoms. Z is an ester-forming structural site (z1) or a hydrogen atom (z2) selected from the group consisting of benzoyl, naphthoyl, benzoyl or naphthoyl formed by substitution of an alkyl group having 1 to 4 carbon atoms, and acyl groups having 2 to 6 carbon atoms. At least one of Z is an ester-forming structural site (z1).

[0097] As specific examples of compounds represented by structural formula (2), the following exemplary compounds (2-1) to (2-6) can be listed.

[0098] [Chemistry 5]

[0099]

[0100] As specific examples of compounds represented by structural formula (3), the following exemplary compounds (3-1) to (3-6) can be listed.

[0101] [Chemistry 6]

[0102]

[0103] Commercially available products can also be used as active ester compounds. Examples of commercially available active ester compounds containing a dicyclopentadiene-type diphenol structure include "EXB9451", "EXB9460", "EXB9460S", and "HPC-8000-65T" (manufactured by DIC Corporation); examples of active ester compounds containing an aromatic structure include "EXB9416-70BK", "EXB-8", and "EXB-9425" (manufactured by DIC Corporation); examples of active ester compounds containing acetylated phenolic varnishes include "DC808" (manufactured by Mitsubishi Chemical Corporation); and examples of active ester compounds containing benzoyl compounds of phenolic varnishes include "YLH1026" (manufactured by Mitsubishi Chemical Corporation), etc.

[0104] Active ester compounds can be used alone or in combination of two or more.

[0105] There is no particular limitation on the ester equivalent of the active ester compound. From the viewpoint of balancing various properties such as formability, reflow resistance, and electrical reliability, it is preferred to be 150 g / eq to 400 g / eq, more preferably 170 g / eq to 300 g / eq, and even more preferably 200 g / eq to 250 g / eq.

[0106] The ester equivalent of the active ester compound is set as the value obtained by determination according to the method of JIS K 0070:1992.

[0107] From the viewpoint of suppressing the dielectric tangent of the cured material to a low level, the equivalent ratio (ester group / epoxy group) of epoxy resin to reactive ester compound is preferably 0.9 or more, more preferably 0.95 or more, and even more preferably 0.97 or more.

[0108] From the viewpoint of minimizing the unreacted components of the reactive ester compound, the equivalent ratio (ester group / epoxy group) of the epoxy resin to the reactive ester compound is preferably 1.1 or less, more preferably 1.05 or less, and even more preferably 1.03 or less.

[0109] The curing agent may also contain curing agents other than active ester compounds. In this case, there are no particular limitations on the types of other curing agents, and they can be selected according to the desired properties of the sealing resin composition. Examples of other curing agents include: phenolic curing agents, amine curing agents, acid anhydride curing agents, polythiol curing agents, polyaminoamide curing agents, isocyanate curing agents, block isocyanate curing agents, etc.

[0110] Examples of phenolic curing agents include: resorcinol, catechol, bisphenol A, bisphenol F, substituted or unsubstituted biphenol, and other polyphenolic compounds; phenolic varnish-type phenolic resins obtained by condensing or co-condensing at least one phenolic compound selected from the group consisting of phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthol with aldehyde compounds such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde under an acidic catalyst; and phenolic varnish-type phenolic resins obtained by reacting the aforementioned phenolic compounds with dimethoxy-p-xylene, bis(methoxymethyl) Aryl alkyl phenolic resins such as biphenyl and naphthol aryl alkyl resins; p-xylene-modified phenolic resins and m-xylene-modified phenolic resins; melamine-modified phenolic resins; terpene-modified phenolic resins; dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerizing the aforementioned phenolic compounds with dicyclopentadiene; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; biphenyl-type phenolic resins; triphenylmethane-type phenolic resins obtained by condensing or co-condensing the aforementioned phenolic compounds with aromatic aldehydes such as benzaldehyde and salicylaldehyde under an acidic catalyst; and phenolic resins obtained by copolymerizing two or more of these. These phenolic curing agents can be used alone or in combination of two or more.

[0111] There are no particular limitations on the functional group equivalent of other hardeners (hydroxyl equivalent in the case of phenolic hardeners). From the viewpoint of balancing various properties such as formability, reflow resistance, and electrical reliability, 70 g / eq to 1000 g / eq is preferred, and 80 g / eq to 500 g / eq is more preferred.

[0112] The functional group equivalents of other curing agents (hydroxyl equivalents in the case of phenolic curing agents) are set as values ​​determined by means of JISK 0070:1992.

[0113] There are no particular limitations on the softening point or melting point of the hardener. From the viewpoint of formability and resistance to reflow soldering, 40°C to 180°C is preferred, and from the viewpoint of operability in the manufacture of the sealing resin composition, 50°C to 160°C is more preferred.

[0114] The melting point or softening point of the hardener is set to a value obtained by measuring the melting point or softening point of the epoxy resin in the same way.

[0115] The equivalent ratio of epoxy resin to all hardeners (reactive ester compounds and other hardeners), i.e., the ratio of the number of functional groups in the hardener to the number of functional groups in the epoxy resin (functional groups in the hardener / functional groups in the epoxy resin), is not particularly limited. From the viewpoint of minimizing unreacted components, a range of 0.5 to 2.0 is preferred, and a range of 0.6 to 1.3 is more preferable. From the viewpoint of formability and solderability resistance, a range of 0.8 to 1.2 is further preferred.

[0116] From the viewpoint of suppressing the dielectric tangent of the cured material to a low level, the mass percentage of the active ester compound in the total amount of the active ester compound and other curing agents is preferably 80% by mass or more, more preferably 85% by mass or more, and even more preferably 90% by mass or more.

[0117] From the viewpoint of suppressing the dielectric tangent of the cured material to a low level, the total mass percentage of epoxy resin and reactive ester compound in the total amount of epoxy resin, reactive ester compound and other curing agents is preferably 80% by mass or more, more preferably 85% by mass or more, and even more preferably 90% by mass or more.

[0118] (Curing accelerator)

[0119] The sealing resin composition disclosed herein may also contain a curing accelerator. There are no particular limitations on the type of curing accelerator; it can be selected based on the type of epoxy resin or curing agent, the desired properties of the sealing resin composition, etc.

[0120] Examples of hardening accelerators include: 1,5-diazabicyclo[4.3.0]nonene-5 (DBN), 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), and other diazabicycloolefins; cyclic amidine compounds such as 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-heptadecylimidazole; derivatives of said cyclic amidine compounds; and the cyclic amidine compounds. Phenolic aldehyde varnish salts of benzo[a]amine compounds or their derivatives; compounds with intramolecular polarization formed by adding maleic anhydride, 1,4-benzoquinone, 2,5-toluenequinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and other quinone compounds, as well as diazonyl phenylmethane and other compounds with π bonds; tetraphenylboron salts of DBU, DBN, 2-ethyl-4-methylimidazolium, N-methylmorpholine, etc. Amidonium compounds; tertiary amine compounds such as pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, and tris(dimethylaminomethyl)phenol; derivatives of said tertiary amine compounds; ammonium salts such as tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexylammonium benzoate, and tetrapropylammonium hydroxide; triphenylphosphine, diphenyl(p-toluene)phosphine, tri(alkylphenyl)phosphine, tri(alkoxyphenyl)phosphine, tri(alkyl·alkoxyphenyl)phosphine, tri(dialkylphenyl)phosphine, tri(trialkylphenyl)phosphine, tri(tetraalkylphenyl)phosphine, tri(dialkoxyphenyl)phosphine, tri... Tri-phosphine, tris(tetraalkoxyphenyl)phosphine, trialkylphosphine, dialkylarylphosphine, alkyldiarylphosphine, and other tertiary phosphines; phosphine compounds such as complexes of the tertiary phosphines with organoboron compounds; compounds with intramolecular polarization formed by adding the tertiary phosphines or the phosphine compounds to quinone compounds such as maleic anhydride, 1,4-benzoquinone, 2,5-toluenequinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and diazonylphenylmethane, etc.When the tertiary phosphine or the phosphine compound is reacted with 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodophenol, 3-iodophenol, 2-iodophenol, 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6-di-tert-butylphenol, or 4-chloro-1-naphthol... Compounds with intramolecular polarization obtained by reacting halogenated phenols such as 1-bromo-2-naphthol, 6-bromo-2-naphthol, and 4-bromo-4′-hydroxybiphenyl with hydrogen halogenation; tetrasubstituted phosphonates such as tetraphenylphosphonium, tetra-p-tolueneborate and other tetrasubstituted phosphonates and their borates that do not have phenyl groups bonded to boron atoms; salts of tetraphenylphosphonium and phenolic compounds; salts of tetraalkylphosphonium and partially hydrolyzed products of aromatic carboxylic anhydrides, etc.

[0121] When the sealing resin composition of this disclosure contains a curing accelerator, the amount of the curing accelerator is preferably 0.1 to 30 parts by mass, more preferably 1 to 15 parts by mass, relative to 100 parts by mass of the resin component (total amount of epoxy resin and curing agent). If the amount of the curing accelerator is 0.1 parts by mass or more relative to 100 parts by mass of the resin component, there is a tendency for good curing in a short time. If the amount of the curing accelerator is 30 parts by mass or less relative to 100 parts by mass of the resin component, there is a tendency to obtain a good molded article with a curing speed that is not too fast.

[0122] (Inorganic filler material)

[0123] The sealing resin composition disclosed herein includes an inorganic filler. There are no particular limitations on the type of inorganic filler. Specifically, examples include fused silica, crystalline silica, glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon nitride, aluminum nitride, boron nitride, beryllium oxide, zircon, zircon, forsterite, blocky talc, spinel, mullite, titanium dioxide, talc, clay, mica, and other inorganic materials. Inorganic fillers with flame-retardant properties may also be used. Examples of inorganic fillers with flame-retardant properties include: aluminum hydroxide, magnesium hydroxide, composite metal hydroxides such as magnesium and zinc hydroxides, zinc borate, etc.

[0124] Among inorganic fillers, silica such as fused silica is preferred from the viewpoint of reducing the coefficient of linear expansion, while alumina is preferred from the viewpoint of high thermal conductivity. Inorganic fillers can be used alone or in combination of two or more. Examples of inorganic filler forms include powders, granules formed by spheroidizing powders, and fibers.

[0125] When the inorganic filler is in particulate form, its average particle size is not particularly limited. For example, the average particle size is preferably 0.2 μm to 100 μm, more preferably 0.5 μm to 50 μm. If the average particle size is 0.2 μm or more, there is a tendency to further suppress the increase in viscosity of the sealing resin composition. If the average particle size is 100 μm or less, there is a tendency to further improve the filling performance. The average particle size of the inorganic filler is determined as the volume average particle size (D50) using a laser scattering diffraction particle size distribution measuring device.

[0126] From the viewpoint of controlling the elastic modulus of the hardened product of the sealing resin composition, the content of inorganic filler contained in the sealing resin composition of the present disclosure is preferably 60% to 82% of the total sealing resin composition, more preferably 62% to 80% of the total sealing resin composition, even more preferably 65% ​​to 80% of the total sealing resin composition, and even more preferably 65% ​​to 78% of the total sealing resin composition.

[0127] The volume ratio of inorganic fillers in a sealing resin composition can be determined by the following method.

[0128] Thin-film samples of the sealing resin composition or its cured form are imaged using a scanning electron microscope (SEM). A specific arbitrary area S is selected in the SEM image, and the total area A of the inorganic filler contained within area S is calculated. The total area A of the inorganic filler is divided by the area S and converted into a percentage (%). This value is set as the volume proportion of the inorganic filler in the sealing resin composition.

[0129] Set the area S to be sufficiently large relative to the size of the inorganic filler. For example, set the size to contain more than 100 inorganic fillers. The area S can be the sum of multiple cut surfaces.

[0130] Inorganic fillers sometimes exhibit a deviation in proportion in the direction of gravity during the curing of the sealing resin composition. In such cases, when using SEM imaging, the entire direction of gravity of the cured material is captured, and an area S specifically including the entire direction of gravity of the cured material is defined.

[0131] [Various additives]

[0132] In addition to the components described herein, the sealing resin composition may also contain various additives such as coupling agents, ion exchangers, release agents, flame retardants, and colorants, as exemplified below. Besides the additives exemplified below, the sealing resin composition may also contain various additives known in the art, as needed.

[0133] (Coupling agent)

[0134] The sealing resin composition may also contain a coupling agent. From the viewpoint of improving the adhesion between the resin component and the inorganic filler, the sealing resin composition preferably contains a coupling agent. Examples of coupling agents include: silane compounds such as epoxy silanes, mercaptosilanes, aminosilanes, alkylsilanes, acylurea silanes, vinyl silanes, and disilazanes; titanium compounds; aluminum chelate compounds; and aluminum / zirconium compounds.

[0135] When the sealing resin composition contains a coupling agent, the amount of coupling agent is preferably 0.05 to 5 parts by weight, more preferably 0.1 to 2.5 parts by weight, relative to 100 parts by weight of the inorganic filler. If the amount of coupling agent is 0.05 parts by weight or more relative to 100 parts by weight of the inorganic filler, there is a tendency to further improve the adhesion to the frame. If the amount of coupling agent is 5 parts by weight or less relative to 100 parts by weight of the inorganic filler, there is a tendency to further improve the formability of the encapsulation.

[0136] (ion exchanger)

[0137] The sealing resin composition may also contain an ion exchanger. From the viewpoint of improving the moisture resistance and high-temperature storage characteristics of electronic components including sealed elements, the sealing resin composition preferably contains an ion exchanger. There are no particular limitations on the ion exchanger; existing known ion exchangers can be used. Specifically, examples include hydrotalcite compounds and hydroxides containing at least one element selected from the group consisting of magnesium, aluminum, titanium, zirconium, and bismuth. One ion exchanger may be used alone or in combination of two or more. Hydrotalcite represented by the following general formula (A) is preferred.

[0138] Mg (1-X) Al X (OH)2(CO3) X / 2 .mH2O……(A)

[0139] (0 < X ​​≤ 0.5, m is a positive number)

[0140] When the sealing resin composition contains an ion exchanger, there is no particular limitation on the amount of the ion exchanger as long as it is sufficient to capture halogen ions, etc. For example, it is preferably 0.1 to 30 parts by mass relative to 100 parts by mass of the resin component (total amount of epoxy resin and hardener), and more preferably 1 to 10 parts by mass.

[0141] (Mold release agent)

[0142] From the viewpoint of achieving good release properties from the mold during molding, the sealing resin composition may also contain a release agent. There are no particular limitations on the release agent; existing and known release agents can be used. Specifically, examples include: palm wax, higher fatty acids such as lignite acid and stearic acid, metal salts of higher fatty acids, ester waxes such as lignite esters, polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene, etc. A single release agent may be used, or two or more may be used in combination.

[0143] When the sealing resin composition contains a release agent, the amount of release agent is preferably 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, relative to 100 parts by weight of the resin component (total amount of epoxy resin and hardener). If the amount of release agent is 0.01 parts by weight or more relative to 100 parts by weight of the resin component, there is a tendency to obtain sufficient release properties. If it is 10 parts by weight or less, there is a tendency to obtain better adhesion.

[0144] (Flame retardant)

[0145] The sealing resin composition may also contain a flame retardant. There are no particular limitations on the flame retardant; existing and known flame retardants may be used. Specifically, examples include organic or inorganic compounds containing halogen atoms, antimony atoms, nitrogen atoms, or phosphorus atoms, metal hydroxides, etc. A single flame retardant may be used, or two or more may be used in combination.

[0146] When the sealing resin composition contains a flame retardant, there is no particular limitation on the amount of flame retardant as long as it is sufficient to obtain the desired flame retardant effect. For example, it is preferably 1 to 30 parts by mass relative to 100 parts by mass of the resin component (the total amount of epoxy resin and hardener), and more preferably 2 to 20 parts by mass.

[0147] (Coloring agent)

[0148] The sealing resin composition may also contain a colorant. Examples of known colorants include carbon black, organic dyes, organic pigments, titanium dioxide, red lead, and iron oxide. The content of the colorant can be appropriately selected according to the purpose, etc. A single colorant may be used, or two or more may be used in combination.

[0149] (Preparation method of the sealing resin composition)

[0150] There are no particular limitations on the preparation method of the sealing resin composition. A general method includes: after thoroughly mixing the components in a specified amount using a mixer or similar apparatus, melting and kneading the mixture using a grinding roller, extruder, or similar means, followed by cooling and pulverizing. More specifically, a method may include: uniformly stirring and mixing the specified amounts of the components, kneading the mixture using a kneader, roller, extruder, or similar apparatus preheated to 70°C–140°C, followed by cooling and pulverizing.

[0151] The sealing resin composition is preferably a solid at room temperature and pressure (e.g., 25°C, atmospheric pressure). There are no particular limitations on the shape of the solid sealing resin composition; examples include powder, granules, and flakes. From an operational point of view, the size and weight of the flake sealing resin composition are preferably those that conform to the molding conditions for encapsulation.

[0152] <Electronic Components and Devices>

[0153] The electronic component device disclosed herein is manufactured using a wafer-level package (WLP). That is, the electronic component device disclosed herein is formed by mounting multiple components (active components such as semiconductor chips, transistors, diodes, and thyristors, and passive components such as capacitors, resistors, and coils) on a wafer, sealing these components together with a sealing resin composition, and then monolithically packaging each sealed component. The WLP can be either a fan-out wafer-level package (FOWLP) or a fan-in wafer-level package (FIWLP, also known as a wafer-level chip-size package (WLCSP)).

[0154] An example of an embodiment of the electronic component device disclosed herein includes: a support member, an element disposed on the support member, and a hardened copy of the sealing resin composition of the present disclosure for sealing the element.

[0155] <Manufacturing Methods for Electronic Components and Devices>

[0156] The method for manufacturing an electronic component device disclosed herein includes: a step of disposing of a plurality of components on a wafer; a step of sealing the plurality of components together using a sealing resin composition disclosed herein; and a step of monolithically packaging the sealed components. That is, the method for manufacturing an electronic component device disclosed herein is a manufacturing method including wafer-level packaging.

[0157] There are no particular restrictions on the methods for performing the aforementioned processes; they can be carried out using general methods. Furthermore, there are no particular restrictions on the types of wafers and components used in the manufacture of electronic components; wafers and components generally used in the manufacture of electronic components can be used.

[0158] The raw materials for wafers used in WLP (Wafer Plasma Processing) are typically crystals of semiconductor materials, generally single crystals of silicon. There are no particular limitations on the size of the wafers, for example, they can be 6 to 12 inches in diameter, preferably 10 to 12 inches.

[0159] Methods for sealing elements using the sealing resin composition disclosed herein include transfer molding, compression molding, and spray molding.

[0160] [Example]

[0161] The following examples illustrate the implementation methods in detail, but the scope of the implementation methods is not limited to these examples.

[0162] <Preparation of Sealing Resin Compositions>

[0163] The sealing resin compositions of the Examples and Comparative Examples were prepared by mixing the components shown below in the proportions (parts by mass) shown in Table 1. The sealing resin compositions are solids at room temperature and pressure.

[0164] • Epoxy Resin 1: Triphenylmethane type epoxy resin, epoxy equivalent 167 g / eq (Mitsubishi Chemical Corporation, product name "1032H60")

[0165] • Epoxy Resin 2: Biphenyl-type epoxy resin, epoxy equivalent 192g / eq (Mitsubishi Chemical Corporation, product name "YX-4000")

[0166] • Epoxy Resin 3: Biphenyl aralkyl type epoxy resin, epoxy equivalent 274g / eq (Nippon Kayaku Co., Ltd., product name "NC-3000")

[0167] • Polymer 1: Epoxy-polyether modified silicone, amorphous polymer, Tg≤25℃, liquid (Momentive Performance Materials, product name "SIM768E")

[0168] • Polymer 2: Epoxy-polyether modified silicone, amorphous polymer, Tg≤25℃, liquid (Dow Toray Industries, Inc., product name "BY16-876")

[0169] • Polymer 3: Polycaprolactone-modified dimethyl silicone, amorphous polymer, Tg 55℃ (Gelest, product name "DBL-C32")

[0170] • Polymer 4: Silicone resin, amorphous polymer, Tg of 80℃ (Dow Toray Industries, Inc., product name "AY42-119")

[0171] • Active ester compound 1: DIC Corporation, product name "EXB-8"

[0172] Phenolic hardener 1: Biphenyl aryl resin, hydroxyl equivalent 275g / eq (Mingwa Chemical Co., Ltd., product name "MEH7851SS")

[0173] • Hardening accelerator 1: Triphenylphosphine / 1,4-benzoquinone adduct

[0174] Hardening accelerator 2: 2-Ethyl-4-methylimidazole

[0175] • Inorganic filler: Fused silica (DENKA Corporation, product name "FB9454FC", volume average particle size 10μm)

[0176] Coupling agent 1: 3-Methacryloxypropyltrimethoxysilane (Shin-Etsu Chemical Industry Co., Ltd., product name "KBM-503")

[0177] • Release agent: Lignite ester wax (Clariant Japan Co., Ltd., product name "HW-E")

[0178] • Colorant: Carbon black (Mitsubishi Chemical Corporation, product name "MA600")

[0179] Test specimens of cured resin compositions were prepared using the sealing resin compositions of each embodiment or comparative example, and the elastic modulus, glass transition temperature, and coefficient of linear expansion (CLE1 and CLE2) were measured. The results are recorded in Table 1.

[0180] Performance Evaluation of Sealing Resin Compositions

[0181] (Shaping warped)

[0182] A mold and a release film are prepared for forming a laminate of a 200 μm thick resin-cured material stacked on a 12-inch diameter silicon wafer using compression molding. Using the mold, release film, 12-inch diameter silicon wafer, and a sealing resin composition, the laminate of the cured resin composition stacked on the silicon wafer is formed under conditions of a mold temperature of 175°C, a molding pressure of 7 MPa, and a curing time of 300 seconds.

[0183] Regarding the laminated body, molding warpage was measured using a Shadowmoire measuring device (manufactured by Akrometrix, TherMoire AXP). A warpage of 2.0 mm or less is considered acceptable.

[0184] (Flowability: Spiral flow)

[0185] Using a vortex flow measurement mold according to EMMI-1-66, the sealing resin composition was molded under the conditions of mold temperature 180°C, molding pressure 6.9 MPa, and curing time 90 seconds, and the flow distance (cm) was determined.

[0186] (Relative permittivity and dielectric tangent)

[0187] The sealing resin composition was loaded into a vacuum manual press and molded at a mold temperature of 175°C, a molding pressure of 6.9 MPa, and a curing time of 600 seconds. After curing at 180°C for 6 hours, a plate-shaped cured material (12.5 mm long, 25 mm wide, and 0.2 mm thick) was obtained. The plate-shaped cured material was used as a test piece, and the relative permittivity and dielectric tangent were measured at approximately 60 GHz at a temperature of 25 ± 3°C using a dielectric constant measuring device (Agilent Technologies, product name "Network Analyzer N5227A").

[0188] [Table 1]

[0189]

[0190] The sealing resin composition of the embodiment suppresses molding warping compared to the sealing resin composition of the comparative example.

[0191] All documents, patent applications and technical specifications set forth in this specification are incorporated herein by reference to the same extent as those documents, patent applications and technical specifications which are specifically described and incorporated herein by reference.

[0192] The entire contents of the disclosure of Japanese Application No. 2020-009046, filed on January 23, 2020, are incorporated herein by reference.

Claims

1. A sealing resin composition for wafer-level packaging, The sealing resin composition contains epoxy resin, a hardener, and inorganic fillers. The cured form of the sealing resin composition has an elastic modulus of less than 18 GPa at a temperature of 25°C. The glass transition temperature of the cured resin composition for sealing is above 100°C and below 160°C. The coefficient of linear expansion between the cured temperature (25°C) and the glass transition temperature of the sealing resin composition is 10 × 10⁻⁶. -6 / K or more, The hardener contains an active ester compound. The content of the active ester compound is 73.5 to 120 parts by weight relative to 100 parts by weight of the epoxy resin.

2. The sealing resin composition according to claim 1 further comprises an amorphous polymer with a glass transition temperature of 70°C or lower.

3. The sealing resin composition according to claim 1 or 2, wherein the content of the inorganic filler is 65% by volume or more and 80% by volume or less relative to the total sealing resin composition.

4. An electronic component device, comprising: Supporting components Elements disposed on the support member, and The hardened form of the sealing resin composition as described in any one of claims 1 to 3 that seals the element.

5. A method for manufacturing an electronic component device, comprising: The process of placing multiple components on a wafer; A process of sealing the plurality of elements together using the sealing resin composition as described in any one of claims 1 to 3; as well as The process of individually packaging each sealed component.

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