Bone conduction microphone

Abstract

The application provides a bone conduction microphone, which comprises a shell, a dielectric material sheet, a conductive plate, a conductive ring, an insulating ring and a circuit board, wherein the circuit board is provided with a first conductive ring; the dielectric material sheet is installed at the bottom of the shell; the insulating ring is arranged above the dielectric material sheet along the inner wall of the shell, the bottom of the insulating ring is in abutment with the dielectric material sheet, the conductive plate is arranged above the dielectric material sheet along the inner wall of the insulating ring and is in electrical connection with the positive pole of the dielectric material sheet, the conductive ring is arranged above the conductive plate along the inner wall of the insulating ring, the bottom of the conductive ring is in abutment with the conductive plate and is in electrical connection, the circuit board is arranged at the top of the insulating ring and is fixedly connected with the shell, and the first conductive ring is in abutment with the top end surface of the conductive ring. The dielectric material sheet and the circuit board of the bone conduction microphone do not need to be connected through wires, the assembly is convenient, and the conductive silica gel is further arranged inside, so that the sensitivity of the microphone can be adjusted.

Description

Technical Field

[0001] This invention relates to the field of bone conduction technology, and more particularly to a bone conduction microphone. Background Technology

[0002] In existing technologies, most microphones use gas as a conduction medium to transmit sound. However, microphones based on this principle have always been unable to solve the problem of interference from external background noise sources. They cannot filter out ambient noise in noisy environments, severely affecting their performance in such conditions. With technological advancements, a microphone using bone conduction has emerged, effectively solving the problem of external interference. However, this type of microphone still has the following shortcomings: Existing bone conduction microphones require wires to connect the dielectric material sheet and the circuit board inside. Assembling the microphone requires soldering these wires to securely connect both ends to the circuit board and the dielectric material sheet. This electrical connection, achieved through soldering, is prone to detachment, leading to microphone malfunction. Furthermore, soldering is time-consuming and labor-intensive, increasing assembly difficulty. Additionally, the sensitivity of existing bone conduction microphones cannot be adjusted. Summary of the Invention

[0003] The main objective of this invention is to provide a bone conduction microphone that can electrically connect the internal dielectric material sheet to the circuit board without the need for conductive wires, and also allows for sensitivity adjustment.

[0004] To achieve the above objectives, the present invention is implemented through the following technical solution:

[0005] This invention proposes a bone conduction microphone, which includes a shell, a dielectric material sheet, a conductive plate, a conductive ring, an insulating ring, and a circuit board, wherein a first conductive ring is provided on the circuit board;

[0006] The dielectric material sheet is installed at the bottom of the housing. The insulating ring is placed above the dielectric material sheet along the inner wall of the housing, with the bottom of the insulating ring abutting against the dielectric material sheet. The conductive plate is placed above the dielectric material sheet along the inner wall of the insulating ring and forms an electrical connection with the positive electrode of the dielectric material sheet. The conductive ring is placed above the conductive plate along the inner wall of the insulating ring, with the bottom of the conductive ring abutting against the conductive plate and forming an electrical connection. The circuit board is placed on top of the insulating ring and fixedly connected to the housing. The first conductive ring abuts against the top end face of the conductive ring.

[0007] Furthermore, the outer diameters of the insulating ring and the dielectric material sheet are equal.

[0008] Furthermore, the outer diameters of the conductive ring and the conductive plate are equal.

[0009] Furthermore, the circuit board is also provided with a second conductive ring. When the dielectric material sheet is installed at the bottom of the housing, the negative electrode of the dielectric material sheet is electrically connected to the housing. The circuit board is fixedly connected to the housing, so that the second conductive ring and the housing form an electrical connection.

[0010] Furthermore, the circuit board is also provided with wire solder joints, which are used for soldering wires.

[0011] Furthermore, the bone conduction microphone also includes one or more conductive silicone pads disposed between the conductive ring and the dielectric material sheet.

[0012] Furthermore, the number of conductive silicone pads is two, and the bone conduction microphone includes a first conductive silicone pad disposed between the dielectric material sheet and the conductive plate.

[0013] Furthermore, the diameters of the first conductive silicone and the dielectric material sheet are equal, one side of the first conductive silicone is electrically connected to the positive electrode of the dielectric material sheet, and the other side of the first conductive silicone is electrically connected to the conductive plate.

[0014] Furthermore, the bone conduction microphone also includes a second conductive silicone, which is disposed between the conductive plate and the conductive ring.

[0015] Furthermore, the second conductive silicone and the conductive plate have the same diameter.

[0016] The beneficial effects of this invention are:

[0017] The bone conduction microphone proposed in this invention features a first conductive ring on a circuit board, which abuts against the end face of a conductive ring. The conductive ring, conductive plate, and dielectric material sheet are then electrically connected, creating an electrical connection between the circuit board and the dielectric material sheet. This eliminates the need for soldering wires; assembly is simple, requiring only sequential installation, saving time and effort, and preventing microphone malfunction due to wire detachment. A first conductive silicone pad is placed between the dielectric material sheet and the metal background plate, and a second conductive silicone pad is placed between the conductive plate and the conductive ring. The elasticity of both conductive silicone pads allows for a certain range of adjustment within the microphone's internal cavity, enabling sensitivity adjustment in the bone conduction microphone. Attached Figure Description

[0018] Figure 1 This is an exploded view of Embodiment 1 of the bone conduction microphone of the present invention;

[0019] Figure 2 This is a cross-sectional view of Embodiment 1 of the bone conduction microphone of the present invention;

[0020] Figure 3 This is a schematic diagram of the circuit board structure of Embodiment 1 of the bone conduction microphone of the present invention;

[0021] Figure 4 This is an exploded view of Embodiment 2 of the bone conduction microphone of the present invention;

[0022] Figure 5 This is a cross-sectional view of Embodiment 2 of the bone conduction microphone of the present invention. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0024] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0025] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0026] Example 1

[0027] Please refer to Figure 1 , Figure 2 , Figure 3 The present invention proposes a bone conduction microphone, which includes a shell 10, a dielectric material sheet 11, a conductive plate 15, a conductive ring 16, an insulating ring 17, and a circuit board 18, wherein a first conductive ring 19 is provided on the circuit board 18.

[0028] In this embodiment, the dielectric material sheet can be a piezoelectric ceramic sheet or a PVDF sheet (polyvinylidene fluoride sheet). The dielectric material sheet 11 in this embodiment uses a piezoelectric ceramic sheet. The dielectric material sheet 11 includes a brass sheet 12, a ceramic substrate 13 attached to the brass sheet 12, and a silver plating layer 14 disposed on the ceramic substrate 13. The brass sheet 12 is the negative electrode of the dielectric material sheet 11, and the silver plating layer 14 is the positive electrode of the dielectric material sheet 11.

[0029] The dielectric material sheet 11 is installed at the bottom of the housing 10. The insulating ring 17 is placed above the dielectric material sheet 11 along the inner wall of the housing 10, and the bottom of the insulating ring 17 abuts against the brass sheet 12. The conductive plate 15 is placed above the silver plating layer 14 along the inner wall of the insulating ring 17 and forms an electrical connection with the silver plating layer 14. The conductive ring 16 is placed above the conductive plate 15 along the inner wall of the insulating ring 17, and the bottom of the conductive ring 16 abuts against the conductive plate 15 and forms an electrical connection. The circuit board 18 is placed on top of the insulating ring 17 and fixedly connected to the housing 10. The first conductive ring 19 abuts against the top end face of the conductive ring 16.

[0030] In this embodiment, the dielectric material sheet 11 is a common type found in the market. The brass sheet 12 and the silver plating layer 14 are the two electrodes of the dielectric material sheet 11. When the dielectric material sheet 11 is placed inside the housing 10, the brass sheet 12 is in close contact with the bottom of the housing 10. The housing 10 is made of stainless steel or aluminum alloy. The insulating ring 17 is made of plastic, and the bottom of the insulating ring 17 abuts against the brass sheet 12. The conductive plate 15 is placed on the silver plating layer 14 and electrically connected to the silver plating layer 14. The conductive ring 16 is then placed on the conductive plate 15. The first conductive ring 19 is the electrical connection point of the circuit board 18. The outer diameter of the first conductive ring 19 is the same as the outer diameter of the conductive ring 16. When the circuit board 18 is placed on top of the insulating ring 17 and the conductive ring 16, the first conductive ring 19 can just abut against the top end face of the conductive ring 16, thereby electrically connecting the conductive ring 16 and the first conductive ring 19. In this way, the circuit board 18 and the dielectric material sheet 11 can be electrically connected together without the need to solder wires to achieve the electrical connection.

[0031] Furthermore, the outer diameters of the insulating ring 17 and the dielectric material sheet 11 are equal. The outer diameters of the conductive ring 16 and the conductive plate 15 are equal.

[0032] In this embodiment, the outer shell 10, the dielectric material sheet 11, the conductive plate 15, the insulating ring 17, the conductive ring 16, and the circuit board 18 are all circular. The outer diameter of the insulating ring 17 and the dielectric material sheet 11 is slightly smaller than the inner diameter of the outer shell 10, allowing them to be placed inside the outer shell 10 along its inner wall. The outer diameter of the conductive ring 16 and the conductive plate 15 is slightly smaller than the inner diameter of the insulating ring 17, allowing the insulating ring 17 to be fitted around the outer periphery of the conductive ring 16 and the conductive plate 15, thus separating them from the outer shell 10.

[0033] Furthermore, the circuit board is also provided with a second conductive ring 23. When the dielectric material sheet 11 is installed at the bottom of the outer casing 10, the negative electrode of the dielectric material sheet 11 is electrically connected to the outer casing 10. The fixed connection between the circuit board 18 and the outer casing 10 is achieved by edge sealing with an edge sealing machine, which electrically connects the second conductive ring 23 and the outer casing 10. The circuit board 18 is also provided with wire solder joints 20 for soldering wires.

[0034] In this embodiment, the wire solder joint 20 is used to solder wires, and then the bone conduction microphone of the present invention is connected to the device via the wires.

[0035] Example 2

[0036] Please refer to Figure 4 and Figure 5 This embodiment adds two conductive silicone sheets to Example 1. These two conductive silicone sheets are designated as a first conductive silicone sheet 21 and a second conductive silicone sheet 22. The first conductive silicone sheet 21 is disposed between the dielectric material sheet 11 and the conductive plate 15. The diameter of the first conductive silicone sheet 21 is equal to that of the dielectric material sheet 11. One side of the first conductive silicone sheet 21 is electrically connected to the silver plating layer 14, and the other side is electrically connected to the conductive plate 15. The second conductive silicone sheet 22 is disposed between the conductive plate 15 and the conductive ring 16. One side of the second conductive silicone sheet 22 is electrically connected to the conductive ring 16, and the other side is electrically connected to the conductive plate 15. The diameter of the second conductive silicone sheet 22 is equal to that of the conductive plate 15.

[0037] In this embodiment, the first conductive silicone 21 and the second conductive silicone 22 have a certain elasticity. While ensuring that the circuit board 18 can be stably electrically connected to the dielectric material sheet 11, the amplitude of the internal air vibration can also be adjusted within a certain range. By using the first conductive silicone 21 and the second conductive silicone 22 of different thicknesses to adjust this adjustment range, the bone conduction microphone can achieve sensitivity adjustment.

[0038] It should be noted that the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are implemented by those skilled in the art. When the combination of technical solutions is contradictory or cannot be implemented, the person should consider that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0039] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A bone conduction microphone, characterized in that, The bone conduction microphone includes a shell, a dielectric material sheet, a conductive plate, a conductive ring, an insulating ring, and a circuit board, wherein a first conductive ring is provided on the circuit board; The dielectric material sheet is installed at the bottom of the housing. The insulating ring is placed above the dielectric material sheet along the inner wall of the housing, with the bottom of the insulating ring abutting against the dielectric material sheet. The conductive plate is placed above the dielectric material sheet along the inner wall of the insulating ring and forms an electrical connection with the positive electrode of the dielectric material sheet. The conductive ring is placed above the conductive plate along the inner wall of the insulating ring, with the bottom of the conductive ring abutting against the conductive plate and forming an electrical connection. The circuit board is placed on top of the insulating ring and fixedly connected to the housing. The first conductive ring abuts against the top end face of the conductive ring. The bone conduction microphone also includes one or more conductive silicone pads, wherein the conductive silicone pads are disposed between the conductive ring and the dielectric material sheet; The number of conductive silicone pads is two, and the bone conduction microphone includes a first conductive silicone pad, which is disposed between the dielectric material sheet and the conductive plate. The bone conduction microphone also includes a second conductive silicone, which is disposed between the conductive plate and the conductive ring.

2. The bone conduction microphone according to claim 1, characterized in that, The outer diameters of the insulating ring and the dielectric material sheet are equal.

3. The bone conduction microphone according to claim 1, characterized in that, The outer diameters of the conductive ring and the conductive plate are equal.

4. The bone conduction microphone according to claim 1, characterized in that, The circuit board is also provided with a second conductive ring. When the dielectric material sheet is installed at the bottom of the housing, the negative electrode of the dielectric material sheet is electrically connected to the housing. The circuit board is fixedly connected to the housing, so that the second conductive ring and the housing form an electrical connection.

5. The bone conduction microphone according to claim 1, characterized in that, The circuit board is also provided with wire solder joints, which are used to solder wires.

6. The bone conduction microphone according to claim 1, characterized in that, The first conductive silicone and the dielectric material sheet have the same diameter. One side of the first conductive silicone is electrically connected to the positive electrode of the dielectric material sheet, and the other side of the first conductive silicone is electrically connected to the conductive plate.

7. The bone conduction microphone according to claim 1, characterized in that, The second conductive silicone and the conductive plate have the same diameter.

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