LED hair removal instrument light source module

Abstract

The application discloses an LED hair removal instrument light source module, which comprises a PCB board, a heat dissipation assembly, a substrate and an LED circuit assembly. The heat dissipation assembly is arranged on the heat dissipation convex plate, and the heat dissipation assembly comprises a plurality of heat dissipation plates arranged in a mutual laminating mode, wherein the heat dissipation plate located at the bottom layer is attached to the PCB board. The substrate is attached to the heat dissipation plate located at the top layer in the heat dissipation assembly. The LED circuit assembly comprises a plurality of LED bare wafers, and all the LED bare wafers are arranged on the substrate in a series connection mode or a parallel connection mode. The energy loss can be reduced, the heat dissipation performance can be improved, and the hair removal effect and the service life are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of depilation instruments, in particular to an LED depilation instrument light source module. BACKGROUND

[0002] At present, the emission light source of the LED depilation instrument light source module is generally directly attached to the PCB board, so that the emission light source is far away from the human skin during use, resulting in poor depilation effect. Therefore, in order to improve the depilation effect, the power of the emission light source is often increased, which increases the heat dissipation. Therefore, a large-area heat sink needs to be added inside the LED depilation instrument light source module to improve the heat dissipation performance. However, this will increase the cost and complicate the process. SUMMARY

[0003] The present application provides an LED depilation instrument light source module which reduces energy loss while improving heat dissipation performance, and can improve the depilation effect without increasing the power.

[0004] In a first aspect, the present application provides an LED depilation instrument light source module, which comprises a PCB board, a heat dissipation assembly, a substrate and an LED circuit assembly; the PCB board is provided with a heat dissipation protruding plate; the heat dissipation assembly is arranged on the heat dissipation protruding plate, and the heat dissipation assembly comprises a plurality of heat dissipation plates arranged in layers; the heat dissipation plate at the bottom layer is attached to the PCB board; the substrate is attached to the heat dissipation plate at the top layer of the heat dissipation assembly; the LED circuit assembly comprises a plurality of LED bare wafers, all of which are arranged on the substrate in series or in parallel.

[0005] Further, the heat dissipation assembly comprises two heat dissipation plates, wherein the heat dissipation plate at the bottom layer is a first heat dissipation plate, and the heat dissipation plate at the top layer is a second heat dissipation plate; the first heat dissipation plate is arranged on the heat dissipation protruding plate and attached to the PCB board, and the second heat dissipation plate is arranged on the first heat dissipation plate and attached to the first heat dissipation plate; the substrate is attached to the second heat dissipation plate.

[0006] Further, the first heat dissipation plate comprises a first heat dissipation piece, a second heat dissipation piece, a third heat dissipation piece and a fourth heat dissipation piece, which are arranged on the heat dissipation protruding plate by an interval to form a heat dissipation groove on the heat dissipation protruding plate.

[0007] Further, the heat dissipation convex plate, the second heat dissipation plate, the first heat dissipation piece and the fourth heat dissipation piece are all provided with heat dissipation holes, and the heat dissipation holes on the second heat dissipation plate correspond to the heat dissipation holes of the first heat dissipation piece and the fourth heat dissipation piece respectively, and the heat dissipation holes of the first heat dissipation piece and the fourth heat dissipation piece correspond to the heat dissipation holes on the heat dissipation convex plate respectively.

[0008] Further, the LED circuit assembly comprises two groups of LED lamp groups, one group of the LED lamp groups comprises twenty one LED bare wafers, and the other group of the LED lamp groups comprises twenty four LED bare wafers.

[0009] Further, an NTC wafer is connected between the two groups of LED lamp groups.

[0010] Further, the positive and negative poles of all the LED lamp groups and two ends of the NTC wafer are connected with the first heat dissipation plate and the second heat dissipation plate.

[0011] Further, the LED circuit assembly is composed of LED bare wafers with a wavelength of 730nm±50nm and LED bare wafers with a wavelength of 830nm±50nm.

[0012] Further, a metal dam is further included, which is arranged on the substrate to fix the LED circuit assembly on the substrate.

[0013] Further, a sapphire lens is further included, which covers the metal dam.

[0014] The LED hair removal instrument light source module provided by the application shortens the distance from the LED circuit assembly to the skin through the stacked heat dissipation plates, reduces the loss in the energy transmission process, and the heat dissipation plates can also provide heat dissipation to improve the heat dissipation performance of the LED light source module, and the process is relatively simple, so that the hair removal effect is improved while the heat dissipation performance is improved and the cost is saved. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme of the application, the following will briefly introduce the drawings needed to be used in the embodiment description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0016] Figure 1 is a structural schematic diagram of the LED hair removal instrument light source module provided by the embodiment of the application.

[0017] Figure 2is a structural schematic view of a first heat sink of an LED light source module of an LED hair removal instrument provided by an embodiment of the present application;

[0018] Figure 3 is a structural schematic view of an LED circuit assembly of the LED light source module of the LED hair removal instrument provided by an embodiment of the present application;

[0019] Figure 4 is a circuit connection schematic view of an LED bare wafer group provided by another embodiment of the present application;

[0020] Figure 5 is a structural schematic view of the LED light source module of the LED hair removal instrument provided by another embodiment of the present application;

[0021] Figure 6 is a structural schematic view of the LED circuit assembly of the LED light source module of the LED hair removal instrument provided by another embodiment of the present application.

[0022] BRIEF DESCRIPTION OF DRAWINGS: 1, PCB board; 2, heat dissipation assembly; 3, first heat sink; 4, second heat sink; 5, base plate; 6, LED circuit assembly; 7, LED bare wafer; 8, NTC wafer; 9, heat dissipation protruding plate; 10, first heat dissipation piece; 11, second heat dissipation piece; 12, third heat dissipation piece; 13, fourth heat dissipation piece; 14, heat dissipation hole; 15, metal dam; 16, sapphire lens; 17, LED lamp group. DETAILED DESCRIPTION

[0023] The technical solutions in the present application will be described clearly and completely below in conjunction with the drawings in the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application.

[0024] It should be understood that the terms “include” and “contain” as used in the present specification and the appended claims indicate the presence of the described features, whole, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, whole, steps, operations, elements, components and / or sets thereof.

[0025] It should also be understood that the terms used in the present specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the present specification and the appended claims, the singular forms “a”, “an” and “the” are intended to include the plural forms, unless the context clearly indicates otherwise. It should be further understood that the term “and / or” as used in the present specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0026] Referring to Figures 1 to 6 , Figure 1 a structure diagram of an LED light source module of a hair removal device according to the present application, Figure 2 a structure diagram of a first heat dissipation plate of an LED light source module of a hair removal device according to the present application, Figure 3 a structure diagram of an LED circuit assembly of an LED light source module of a hair removal device according to the present application, Figure 4 a circuit connection diagram between different LED bare wafers 7 of an LED light source module of a hair removal device according to the present application, Figure 5 a structure diagram of an LED light source module of a hair removal device according to another embodiment of the present application; Figure 6 a structure diagram of an LED circuit assembly of an LED light source module of a hair removal device according to another embodiment of the present application. As Figure 1 shown, the LED light source module of the hair removal device comprises a PCB board 1, a heat dissipation assembly 2, a substrate 5 and an LED circuit assembly 6; the PCB board 1 is provided with a heat dissipation protruding plate 9; the heat dissipation assembly 2 is arranged in the upper part of the heat dissipation protruding plate 9, and the heat dissipation assembly 2 comprises a plurality of heat dissipation plates arranged in a stack, wherein the heat dissipation plate at the bottom layer is attached to the PCB board 1; the substrate 5 is attached to the heat dissipation plate at the top layer of the heat dissipation assembly 2; the LED circuit assembly 6 comprises a plurality of LED bare wafers 7, and all the LED bare wafers 7 are arranged on the substrate 5 in a series or parallel manner.

[0027] Specifically, the PCB board 1 is provided with a heat dissipation protruding plate 9 for arranging the heat dissipation assembly 2, and the heat dissipation assembly 2 includes a plurality of heat dissipation plates arranged in layers, wherein the number of the heat dissipation plates can be arranged according to the heat dissipation requirement and the distance requirement, the material of the heat dissipation plates can be copper plate or aluminum plate, or metal block and other materials easy to conduct heat, and the specific material is not limited here. The distance requirement refers to the distance from the LED circuit assembly 6 to the skin, which can be shortened by increasing the number of heat dissipation plates, or by increasing the thickness of a single heat dissipation plate, and the specific way is not limited here. The heat dissipation plates are used to provide heat dissipation to reduce the temperature of the LED light source module, and the heat dissipation plates arranged in layers can also shorten the distance from the LED circuit assembly 6 to the skin, so as to reduce the loss of energy in the process of transmitting from the LED circuit assembly 6 to the skin, thereby improving the hair removal effect. The substrate 5 can be a super heat-conducting ceramic substrate or a purple copper heat-electricity separation plate, and the copper disc for mounting the LED circuit assembly 6 is arranged on the substrate 5, the connecting circuit for connecting with the LED circuit assembly 6 is arranged on the copper disc, and the LED bare wafer 7 in the LED circuit assembly 6 can be arranged on the connecting circuit by gold wire or silver wire, wherein the number of the LED bare wafer 7 can be set according to the power, and the higher the power, the more the number can be increased. In addition, a high-transparency glass can be arranged on the LED circuit assembly 6 to adjust the area of the skin irradiated and achieve the purpose of lossless energy transmission, or a silica gel with fluorescent powder can be arranged to adjust the color of the light irradiated by the color of the fluorescent powder.

[0028] As shown in Figure 1 In an embodiment, the heat dissipation assembly 2 includes two heat dissipation plates, wherein the heat dissipation plate at the bottom layer is the first heat dissipation plate 3, and the heat dissipation plate at the top layer is the second heat dissipation plate 4; the first heat dissipation plate 3 is arranged on the heat dissipation protruding plate 9 and is attached to the PCB board 1, and the second heat dissipation plate 4 is arranged on the first heat dissipation plate 3 and is attached to the first heat dissipation plate 3, wherein the substrate 5 is attached to the second heat dissipation plate 4.

[0029] As shown in Figure 2 In a further embodiment, the first heat dissipation plate 3 includes a first heat dissipation piece 10, a second heat dissipation piece 11, a third heat dissipation piece 12, and a fourth heat dissipation piece 13, and the first heat dissipation piece 10, the second heat dissipation piece 11, the third heat dissipation piece 12, and the fourth heat dissipation piece 13 are arranged on the heat dissipation protruding plate 9 by spacing to form heat dissipation grooves on the heat dissipation protruding plate 9.

[0030] In a further embodiment, the heat dissipation protrusion 9, the second heat dissipation plate 4, the first heat dissipation component 10, and the fourth heat dissipation component 13 are all provided with heat dissipation holes 14, and the heat dissipation holes 14 on the second heat dissipation plate 4 correspond to the heat dissipation holes 14 on the first heat dissipation component 10 and the fourth heat dissipation component 13, respectively, and the heat dissipation holes 14 on the first heat dissipation component 10 and the fourth heat dissipation component 13 correspond to the heat dissipation holes 14 on the heat dissipation protrusion 9, respectively.

[0031] The heat dissipation component 2 may include multiple heat sinks, such as a first heat sink 3 and a second heat sink 4. The thicknesses of the first heat sink 3 and the second heat sink 4 may differ, and the first heat sink 3 may be a separate design while the second heat sink 4 may be a single-piece design. Specific thicknesses and design methods are not limited here. Taking an example where the thickness of the first heat sink 3 is greater than the thickness of the second heat sink 4, and the first heat sink 3 is a separate design while the second heat sink 4 is a single-piece design, the thickness of the first heat sink 3 can be twice the thickness of the second heat sink 4. This stacked design of the first heat sink 3 and the second heat sink 4 shortens the distance between the LED circuit component 6 and the skin. When the heat dissipation component 2 includes more than two heat sinks, all heat sinks except the second heat sink 4 can be of a separate design.

[0032] like Figure 1 As shown, the first heat sink 3 adopts a split design and may include a first heat sink 10, a second heat sink 11, a third heat sink 12, and a fourth heat sink 13. The first heat sink 10, the second heat sink 11, the third heat sink 12, and the fourth heat sink 13 are all spaced apart on the PCB board 1, thus forming heat dissipation grooves on the PCB board 1, further improving heat dissipation. To further improve heat dissipation performance, heat dissipation holes 14 can be provided on the heat dissipation protrusion 9, the second heat sink 4, the first heat sink 10, the second heat sink 11, the third heat sink 12, and the fourth heat sink 13. Alternatively, heat dissipation holes 14 penetrating the front and back surfaces and heat dissipation holes 14 penetrating the side surfaces can be provided on the first heat sink 10 and the fourth heat sink 13. The specific location of the heat dissipation holes 14 can be adjusted according to actual conditions and is not limited here. Figure 5 As shown, the first heat sink may also consist of only the first heat sink 10 and the fourth heat sink 13, with a certain distance between the first heat sink 10 and the fourth heat sink 13 to improve heat dissipation capacity.

[0033] like Figure 6 As shown, in a further embodiment, the LED circuit assembly 6 includes two sets of LED light groups 17, one set of LED light groups 17 including twenty-one LED bare wafers 7, and the other set of LED light groups 17 including twenty-four LED bare wafers 7.

[0034] The system can include two sets of LED light groups 17. One set of LED light groups 17 has twenty-one bare wafers 7, and the other set has twenty-four bare wafers 7. The bare wafers 17 within each set are connected in series, and the two sets of LED light groups 17 are also connected in series. It should be noted that the number of LED light groups 17, the number of bare wafers 7 within each set, and the connection method of the bare wafers 7 can all be set according to the power requirement and are not limited here.

[0035] like Figure 3 As shown, in a further embodiment, an NTC wafer 8 is connected between the two LED light groups 17.

[0036] An NTC wafer 8 can be connected between each group of LED lights 17. The NTC wafer 8 is used to sense the temperature of the LED hair removal device's light source module, so as to accurately understand the temperature of the LED hair removal device during operation.

[0037] like Figure 4 As shown, in a further embodiment, the positive and negative terminals of all the LED light groups 17 and both ends of the NTC wafer are connected to the first heat sink and the second heat sink.

[0038] in, Figure 4 This is a circuit diagram of an LED light assembly 17 and an NTC wafer 8. The LED light assembly 17 includes five bare wafer groups, each containing nine bare wafers 7. These groups are connected in parallel to form the LED light assembly 17. The LED light assembly 17 is connected to the PCB board to provide a light source. The positive and negative terminals of the LED light assembly 17 are also connected to the first heat sink 3 and the second heat sink 4, respectively. Directly connecting the positive and negative terminals of the LED light assembly 17 to the first and second heat sinks 3 and 4 further improves heat dissipation efficiency. Connecting the NTC wafer 8 to the first and second heat sinks 3 and 4 allows for accurate monitoring of the temperature of the LED light assembly 17. It should be noted that when the first heat sink is a split design and includes a first heat sink 10, a second heat sink 11, a third heat sink 12, and a fourth heat sink 13, the NTC wafer 8 is connected to the second heat sink 11 and the third heat sink 12, respectively.

[0039] In one embodiment, the LED circuit assembly 6 consists of an LED bare wafer 7 with a wavelength of 730nm±50nm and an LED bare wafer 7 with a wavelength of 830nm±50nm.

[0040] The LED bare wafers 7 contained in the LED circuit assembly 6 have a wavelength of 730nm±50nm or 830nm±50nm, and the LED bare wafers 7 with the above two wavelengths are arranged in series or in parallel on the substrate 5 in any combination, for example, for an LED circuit assembly 6 with five LED bare wafers 7 in series, the wavelengths can be 730nm±50nm, 730nm±50nm, 730nm±50nm, 830nm±50nm and 830nm±50nm respectively, or 730nm±50nm, 830nm±50nm, 830nm±50nm, 830nm±50nm and 730nm±50nm respectively, and the specific combination is not limited herein.

[0041] In an embodiment, a metal dam 15 is further included, which is arranged on the substrate 5 to fix the LED circuit assembly 6 on the substrate 5.

[0042] In a further embodiment, a sapphire lens 16 is further included, which covers the metal dam 15.

[0043] The metal dam 15 is used to fix the LED circuit assembly 6 on the substrate 5, and a sapphire lens 16 can be arranged to cover the metal dam 15 to adjust the irradiation area.

[0044] The present application can shorten the distance between the light source module of the LED hair removal instrument and the skin by the laminated heat dissipation plate, reduce the energy loss, and improve the heat dissipation performance by the heat dissipation plate, thereby improving the hair removal effect, improving the heat dissipation capacity and reducing the cost.

[0045] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An LED epilator light source module, characterized in that, The application relates to a PCB board, a heat dissipation assembly and an LED circuit assembly. The PCB board is provided with a heat dissipation protruding plate. The heat dissipation assembly is arranged on the heat dissipation protruding plate and comprises a plurality of heat dissipation plates arranged in a stack. The heat dissipation plate at the bottom is attached to the PCB board. A substrate is attached to the heat dissipation plate at the top. The LED circuit assembly comprises a plurality of LED bare wafers arranged in series or parallel on the substrate. The heat dissipation assembly comprises two heat dissipation plates. The heat dissipation plate at the bottom is a first heat dissipation plate and the heat dissipation plate at the top is a second heat dissipation plate. The first heat dissipation plate is arranged on the heat dissipation protruding plate and attached to the PCB board.

2. The LED epilator light source module of claim 1, wherein, The second heat dissipation plate is arranged on the first heat dissipation plate and attached to the first heat dissipation plate.

3. The LED epilator light source module of claim 1, wherein the LED array is configured to emit light having a wavelength of 600 nm to 700 nm. The first heat dissipation plate is arranged in a split mode and comprises a first heat dissipation member, a second heat dissipation member, a third heat dissipation member and a fourth heat dissipation member.

4. The LED epilator light source module of claim 3, wherein the LED array is configured to emit light having a wavelength of 400- 500 nm. The first heat dissipation member, the second heat dissipation member, the third heat dissipation member and the fourth heat dissipation member are arranged on the heat dissipation protruding plate through spacing to form a heat dissipation groove on the heat dissipation protruding plate.

5. The LED epilator light source module of claim 1, wherein the LED array is configured to emit light having a wavelength of 600 nm to 700 nm. The LED circuit assembly comprises two groups of LED lamp groups.

6. The LED epilator light source module of claim 1, wherein, The NTC wafer is connected to the first heat dissipation plate and the second heat dissipation plate.

7. The LED epilator light source module of claim 6, wherein the LED array is configured to emit light having a wavelength of 600 nm to 700 nm. The heat dissipation protruding plate, the second heat dissipation plate, the first heat dissipation member and the fourth heat dissipation member are provided with heat dissipation holes. The heat dissipation holes of the second heat dissipation plate correspond to the heat dissipation holes of the first heat dissipation member and the fourth heat dissipation member. One group of the LED lamp groups comprises twenty-one LED bare wafers and the other group of the LED lamp groups comprises twenty-four LED bare wafers. The positive and negative poles of all the LED lamp groups are connected to the first heat dissipation plate and the second heat dissipation plate. The LED circuit assembly is composed of LED bare wafers with a wavelength of 730nm+ / -50nm and LED bare wafers with a wavelength of 830nm+ / -50nm. A metal dam is arranged on the substrate to fix the LED circuit assembly on the substrate. A sapphire lens is arranged on the metal dam.

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