Display device

Abstract

A display device includes a substrate, a first conductive pattern layer, a first insulating pattern layer, a second conductive pattern layer, a second insulating pattern layer, a plurality of pixel structures and a light absorption pattern layer. The first conductive pattern layer is disposed on the substrate. The first insulating pattern layer is disposed on the first conductive pattern layer and has a first opening. The second conductive pattern layer is disposed on the first insulating pattern layer and has a plurality of light-shielding conductive patterns arranged periodically. The second insulating pattern layer is disposed on the second conductive pattern layer and has a second opening overlapping the first opening. The light absorption pattern layer at least covers a first side wall defining the first opening and a second side wall defining the second opening, and separates a plurality of light-shielding conductive patterns of the second conductive pattern layer. The light absorption pattern layer has a light-transmitting opening overlapping the first opening and the second opening.

Description

Technical Field

[0001] The present invention relates to a photoelectric device, and in particular to a display device. Background Art

[0002] The transparent display device has a certain degree of perspective, and the user can see the background information behind it through the transparent display device, and at the same time can see the display information displayed by the transparent display device. The transparent display device can be applied to a variety of occasions, such as: vending machines, car windows, store windows, etc.

[0003] In order to allow users to receive display information and background information at the same time, the transparent display device has a non-penetrating area and a penetrating area. The non-penetrating area is used to set up shading components, such as electrodes, circuit traces, etc. The penetrating area is used to allow background light to pass through so that the user can receive background information behind. The shading components set in the non-penetrating area are mostly arranged periodically. The periodically arranged shading components are prone to form a plurality of regularly arranged micro-openings. When the background light beam passes through these micro-openings, significant diffraction will occur, resulting in a reduction in the quality of the background image. Therefore, how to reduce the diffraction phenomenon in the transparent display device and make the transparent display device maintain a certain degree of perspective is a major challenge currently faced. Summary of the invention

[0004] The invention provides a display device with good perspective effect.

[0005] The display device of the present invention comprises a substrate, a first conductive pattern layer, a first insulating pattern layer, a second conductive pattern layer, a second insulating pattern layer, a plurality of pixel structures and a light absorption pattern layer. The substrate has a first area and a second area outside the first area. The first conductive pattern layer is arranged on the first area of ​​the substrate. The first insulating pattern layer is arranged on the first conductive pattern layer and has a first opening. The first insulating pattern layer has a first side wall defining the first opening. The second conductive pattern layer is arranged on the first insulating pattern layer, located in the first area of ​​the substrate, and has a plurality of light-shielding conductive patterns arranged periodically. The second insulating pattern layer is arranged on the second conductive pattern layer and has a second opening. The second opening overlaps the first opening, and the second insulating pattern layer has a second side wall defining the second opening. A plurality of pixel structures are arranged on the second insulating pattern layer. The light absorption pattern layer is arranged on the first area of ​​the substrate. The light absorption pattern layer covers at least the first side wall and the second side wall and separates the plurality of light-shielding conductive patterns of the second conductive pattern layer. The light absorption pattern layer has a light-transmitting opening overlapping the first opening and the second opening. The light-transmitting opening of the light absorption pattern layer is located in the second area of ​​the substrate.

[0006] In one embodiment of the present invention, the above-mentioned first conductive pattern layer has a plurality of light-shielding conductive patterns arranged periodically; in the top view of the display device, the plurality of light-shielding conductive patterns of the first conductive pattern layer and the plurality of light-shielding conductive patterns of the second conductive pattern layer are alternately arranged; the light-absorbing pattern layer further separates the plurality of light-shielding conductive patterns of the first conductive pattern layer.

[0007] In one embodiment of the present invention, the light absorption pattern layer includes a side wall portion, which covers the first side wall of the first insulating pattern layer and the second side wall of the second insulating pattern layer, separates a plurality of light-shielding conductive patterns of the first conductive pattern layer, and separates a plurality of light-shielding conductive patterns of the second conductive pattern layer. The side wall portion includes a first sub-side wall portion and a second sub-side wall portion. In a top view of the display device, an edge of the first sub-side wall portion is located outside an edge of a corresponding light-shielding conductive pattern of the first conductive pattern layer. In a top view of the display device, an edge of the second sub-side wall portion is located outside an edge of a corresponding light-shielding conductive pattern of the second conductive pattern layer.

[0008] In one embodiment of the present invention, the light absorption pattern layer further includes a first top portion and a second top portion. The first top portion is disposed on the top surface of the second insulating pattern layer facing away from the substrate, connected to the first sub-side wall portion, and overlaps with the corresponding light-shielding conductive pattern of the first conductive pattern layer. The second top portion is disposed on the top surface of the second insulating pattern layer facing away from the substrate, connected to the second sub-side wall portion, and overlaps with the corresponding light-shielding conductive pattern of the second conductive pattern layer.

[0009] In one embodiment of the present invention, each of the above-mentioned pixel structures includes an electrode and a light-emitting element electrically connected to the electrode, the electrode belongs to a third conductive pattern layer, the third conductive pattern layer is arranged on the second insulating pattern layer, and the multiple electrodes of the multiple pixel structures are arranged periodically. The sidewall portion also includes a third sub-sidewall portion. In a top view of the display device, an edge of the third sub-sidewall portion is located outside an edge of a corresponding electrode of the third conductive pattern layer. In one embodiment of the present invention, the above-mentioned light absorption pattern layer also includes a third top portion, which is arranged on the top surface of the second insulating pattern layer facing away from the substrate, connected to the third sub-sidewall portion, and partially overlaps the corresponding electrode of the third conductive pattern layer.

[0010] In one embodiment of the present invention, the display device further includes a light-shielding pattern layer and a third insulating pattern layer. The light-shielding pattern layer is disposed in the first area of ​​the substrate, between the first conductive pattern layer and the substrate, and shields the light-shielding conductive pattern of the first conductive pattern layer and the light-shielding conductive pattern of the second conductive pattern layer. The third insulating pattern layer is disposed on the light-shielding pattern layer and between the first conductive pattern layer and the light-shielding pattern layer. The third insulating pattern layer has a third opening overlapping the first opening and a third sidewall defining the third opening, and the light-absorbing pattern layer further covers the third sidewall.

[0011] In one embodiment of the present invention, the display device further includes an encapsulation layer covering the pixel structure and overlapping the first opening of the first insulating pattern layer, the second opening of the second insulating pattern layer and the light-transmitting opening of the light-absorbing pattern layer.

[0012] In one embodiment of the present invention, the display device further includes an encapsulation layer covering the pixel structure and filling the first opening of the first insulating pattern layer, the second opening of the second insulating pattern layer and the light-transmitting opening of the light-absorbing pattern layer.

[0013] In one embodiment of the present invention, the first insulating pattern layer includes a first main portion and a first auxiliary portion. The first main portion overlaps the light-shielding conductive pattern of the first conductive pattern layer. The first auxiliary portion is located between the light-shielding conductive patterns of the first conductive pattern layer. The first sidewall defining the first opening of the first insulating pattern layer includes a sidewall of the first main portion and a sidewall of the first auxiliary portion that are opposite to and separated from each other, and the light-absorbing pattern layer covers the sidewall of the first main portion of the first insulating pattern layer and the sidewall of the first auxiliary portion of the first insulating pattern layer.

[0014] In one embodiment of the present invention, the first auxiliary portion of the first insulating pattern layer is located in the light-transmitting opening of the light-absorbing pattern layer.

[0015] In one embodiment of the present invention, the second insulating pattern layer includes a second main portion and a second auxiliary portion. The second main portion overlaps the light-shielding conductive pattern of the first conductive pattern layer and is disposed on the first main portion of the first insulating pattern layer. The second auxiliary portion is disposed on the first auxiliary portion of the first insulating pattern layer. The second sidewall defining the second opening of the second insulating pattern layer includes a sidewall of the second main portion and a sidewall of the second auxiliary portion that are opposite to and separated from each other, and the light-absorbing pattern layer further covers the sidewall of the second main portion of the second insulating pattern layer and the sidewall of the second auxiliary portion of the second insulating pattern layer.

[0016] In one embodiment of the present invention, the second auxiliary portion of the second insulating pattern layer is located in the light-transmitting opening of the light-absorbing pattern layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figures 1A to 1F FIG. 1 is a top view of a manufacturing process of a display device 10 according to an embodiment of the present invention.

[0018] FIG. 2A to FIG. 2F FIG. 1 is a cross-sectional schematic diagram of a manufacturing process of a display device 10 according to an embodiment of the present invention.

[0019] FIG. 3A to FIG. 3F FIG. 1 is a cross-sectional schematic diagram of a manufacturing process of a display device 10 according to an embodiment of the present invention.

[0020] Figure 4 FIG. 1 is a top view of the light shielding pattern layer 120 according to an embodiment of the present invention.

[0021] Figure 5 FIG. 1 is a top view of the first conductive pattern layer 140 according to an embodiment of the present invention.

[0022] Figure 6 FIG. 1 is a top view of the second conductive pattern layer 160 according to an embodiment of the present invention.

[0023] Figure 7 FIG. 1 is a top view of the third conductive pattern layer 180 according to an embodiment of the present invention.

[0024] Figure 8 FIG. 1 shows a diffraction spot formed after a co-modulated light beam passes through a display device 10 according to an embodiment of the present invention.

[0025] Fig. 9 The diffraction spot formed after a co-modulated light beam passes through a display device of a comparative example is shown.

[0026] Fig.10 The reflection spectra of the display device 10 according to one embodiment of the present invention and the display device according to a comparative example are shown.

[0027] Fig.11 The penetration spectra of the display device 10 according to an embodiment of the present invention and the display device according to a comparative example are shown.

[0028] Fig.12 FIG. 1 is a top view of a display device 10A according to another embodiment of the present invention.

[0029] Fig.13 FIG. 1 is a cross-sectional schematic diagram of a display device 10A according to another embodiment of the present invention.

[0030] Fig.14 FIG. 1 is a cross-sectional schematic diagram of a display device 10A according to another embodiment of the present invention.

[0031] Fig.15 FIG. 1 is a top view of a display device 10B according to another embodiment of the present invention.

[0032] Fig.16 FIG. 1 is a cross-sectional schematic diagram of a display device 10B according to another embodiment of the present invention.

[0033] Fig.17 FIG. 1 is a cross-sectional schematic diagram of a display device 10B according to another embodiment of the present invention.

[0034] 18A to 18F FIG. 1 is a cross-sectional schematic diagram of a manufacturing process of a display device 10C according to another embodiment of the present invention.

[0035] Description of reference numerals:

[0036] 10, 10A, 10B, 10C: Display device

[0037] 110: Substrate

[0038] 110a: District 1

[0039] 110b: Second District

[0040] 120: Light-shielding pattern layer

[0041] 120a: Light-transmitting opening

[0042] 122: First shading strip

[0043] 124: Second shading strip

[0044] 126: Shading pattern

[0045] 130: third insulating pattern layer

[0046] 130': The third insulating material layer

[0047] 130-1: The third major section

[0048] 130-2: Third Auxiliary Department

[0049] 132: The third opening

[0050] 132s: Third side wall

[0051] 140: first conductive pattern layer

[0052] 142, 162: Light-shielding conductive pattern

[0053] 150: first insulating pattern layer

[0054] 150': First insulating material layer

[0055] 150-1: First major section

[0056] 150-2: First Auxiliary Department

[0057] 130-1s, 130-2s, 150-1s, 150-2s, 170-1s, 170-2s: Side wall

[0058] 152: First Opening

[0059] 152s: First sidewall

[0060] 160: Second conductive pattern layer

[0061] 170: Second insulation pattern layer

[0062] 170': Second insulating material layer

[0063] 170-1: Second major section

[0064] 170-2: Second Auxiliary Department

[0065] 170a, 182a: Top surface

[0066] 172: Second opening

[0067] 172s: Second side wall

[0068] 180: The third conductive pattern layer

[0069] 182: Conductive pattern

[0070] 190: Light-absorbing pattern layer

[0071] 190a: Light-transmitting opening

[0072] 190b: Auxiliary opening

[0073] 192: Side wall

[0074] 192-1: First sub-side wall portion

[0075] 192-2: Second sub-side wall

[0076] 192-3: The third sub-side wall

[0077] 142e, 162e, 182e, 190be, 192-1e, 192-2e, 192-3e: Edge

[0078] 194: Top

[0079] 194-1: First Top

[0080] 194-2: Second top

[0081] 194-3: Third top

[0082] 200: Light-emitting element

[0083] 210: Encapsulation layer

[0084] 220: Translucent protective plate

[0085] d1, d2, d3: distance

[0086] SPX: Pixel Structure

[0087] I-I', II-II', III-III', IV-IV', V-V', VI-VI': hatching line DETAILED DESCRIPTION

[0088] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, the same reference numerals are used in the drawings and the description to refer to the same or like parts.

[0089] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected to" another element, it may be directly on or connected to another element, or an intermediate element may also exist. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intermediate elements. As used herein, "connection" may refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may refer to the presence of other elements between two elements.

[0090] As used herein, "about", "approximately", or "substantially" includes the stated value and the average value within an acceptable deviation range of the particular value determined by one of ordinary skill in the art, taking into account the measurement in question and the particular amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, "about", "approximately", or "substantially" can select a more acceptable deviation range or standard deviation depending on the optical property, etching property or other property, and can apply to all properties without a single standard deviation.

[0091] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and the present invention, and will not be interpreted as an idealized or overly formal meaning unless explicitly defined as such herein.

[0092] Figures 1A to 1F FIG. 1 is a top view of a manufacturing process of a display device 10 according to an embodiment of the present invention.

[0093] FIG. 2A to FIG. 2F FIG. 1 is a cross-sectional schematic diagram of a manufacturing process of a display device 10 according to an embodiment of the present invention. FIG. 2A to FIG. 2F Corresponding to Figures 1A to 1F Section line I-I'.

[0094] FIG. 3A to FIG. 3F FIG. 1 is a cross-sectional schematic diagram of a manufacturing process of a display device 10 according to an embodiment of the present invention. FIG. 3A to FIG. 3F Corresponding to Figures 1A to 1F Section line II-II'.

[0095] Please refer to Figure 1A , Figure 2A and Figure 3A First, a substrate 110 is provided. The substrate 110 has a first area 110a and a second area 110b outside the first area 110a. The first area 110a is used to set a solid body of a light-shielding / light-absorbing component. The first area 110a may also be called a non-transmitting area. The second area 110b is used to set an opening and / or a light-transmitting component of the light-shielding / light-absorbing component. The second area 110b may also be called a transmissive area. In the present embodiment, the material of the substrate 110 is, for example, glass. However, the present invention is not limited thereto, and in other embodiments, the material of the substrate 110 may also be quartz, an organic polymer, or other light-transmitting materials.

[0096] Figure 4 FIG. 1 is a top view of the light shielding pattern layer 120 according to an embodiment of the present invention.

[0097] Please refer to Figure 1A , Figure 2A , Figure 3A and Figure 4 Then, a light shielding pattern layer 120 is formed on the substrate 110. The light shielding pattern layer 120 is disposed on the first region 110a of the substrate 110. In the present embodiment, the light shielding pattern layer 120 includes a plurality of first light shielding strips 122 arranged periodically and a plurality of second light shielding strips 124 arranged periodically, wherein the plurality of first light shielding strips 122 and the plurality of second light shielding strips 124 are arranged alternately.

[0098] In the present embodiment, the light shielding pattern layer 120 may further include a plurality of light shielding patterns 126 arranged periodically, wherein each light shielding pattern 126 is disposed beside at least one of a corresponding first light shielding strip 122 and a corresponding second light shielding strip 124. For example, in the present embodiment, each light shielding pattern 126 may be selectively disposed beside the intersection of a corresponding first light shielding strip 122 and a corresponding second light shielding strip 124, but the present invention is not limited thereto. The light shielding pattern layer 120 has a light-transmitting opening 120a (indicated at Figure 4 ). The light-transmitting opening 120a is defined by the edge of the entity of the light-shielding pattern layer 120. For example, in the present embodiment, the light-transmitting opening 120a may be defined by the edge of two adjacent first light-shielding strips 122, the edge of two adjacent second light-shielding strips 124, and the edge of two adjacent light-shielding patterns 126, but the present invention is not limited thereto. In the present embodiment, the material of the light-shielding pattern layer 120 is, for example, metal. However, the present invention is not limited thereto, and in other embodiments, the material of the light-shielding pattern layer 120 may also be other materials capable of shielding light, and the material of the light-shielding pattern layer 120 may not necessarily be a conductive material.

[0099] Please refer to Figure 1A , Figure 2A and Figure 3AThen, a third insulating material layer 130' is formed on the substrate 110. The third insulating material layer 130' is disposed on the first region 110a and the second region 110b of the substrate 110, and covers the light shielding pattern layer 120. For example, in the present embodiment, the material of the third insulating material layer 130' can be an inorganic material (e.g., silicon oxide, silicon nitride, silicon oxynitride, or a stacked layer of at least two of the above materials), an organic material, or a combination thereof.

[0100] Figure 5 FIG. 1 is a top view of the first conductive pattern layer 140 according to an embodiment of the present invention.

[0101] Please refer to Figure 1A , Figure 2A , Figure 3A and Figure 5 Then, a first conductive pattern layer 140 is formed on the third insulating material layer 130'. The first conductive pattern layer 140 is disposed on the first region 110a of the substrate 110. The first conductive pattern layer 140 has a plurality of light shielding conductive patterns 142 arranged periodically. Figure 1A , Figure 2A , Figure 4 and Figure 5 In this embodiment, the plurality of first light shielding strips 122 of the light shielding pattern layer 120 respectively shield the plurality of light shielding conductive patterns 142 of the first conductive pattern layer 140. In this embodiment, the plurality of light shielding conductive patterns 142 of the first conductive pattern layer 140 are, for example, a plurality of gate lines. However, the present invention is not limited thereto. In other embodiments, the plurality of light shielding conductive patterns 142 of the first conductive pattern layer 140 may also be a plurality of data lines or other conductive elements. In this embodiment, the material of the first conductive pattern layer 140 is, for example, metal. However, the present invention is not limited thereto. In other embodiments, the material of the first conductive pattern layer 140 may also be other conductive materials capable of shielding light.

[0102] Please refer to Figure 1A , Figure 2A and Figure 3A Then, a first insulating material layer 150' is formed on the third insulating material layer 130'. The first insulating material layer 150' is disposed on the first region 110a and the second region 110b of the substrate 110, and covers the first conductive pattern layer 140. For example, in the present embodiment, the material of the first insulating material layer 150' can be an inorganic material (e.g., silicon oxide, silicon nitride, silicon oxynitride, or a stacked layer of at least two of the above materials), an organic material, or a combination thereof.

[0103] Figure 6 FIG. 1 is a top view of the second conductive pattern layer 160 according to an embodiment of the present invention.

[0104] Please refer to Figure 1A, Figure 3A and Figure 6 Then, a second conductive pattern layer 160 is formed on the first insulating material layer 150'. The second conductive pattern layer 160 is disposed on the first region 110a of the substrate 110 and has a plurality of periodically arranged light shielding conductive patterns 162. Figure 1A , Figure 3A , Figure 4 and Figure 6 In this embodiment, the plurality of second light shielding strips 124 of the light shielding pattern layer 120 respectively shield the plurality of light shielding conductive patterns 162 of the second conductive pattern layer 160. For example, in this embodiment, the plurality of light shielding conductive patterns 162 of the second conductive pattern layer 160 are a plurality of data lines. However, the present invention is not limited thereto. In other embodiments, the plurality of light shielding conductive patterns 162 of the second conductive pattern layer 160 may also be a plurality of gate lines or other conductive elements. In this embodiment, the material of the second conductive pattern layer 160 is, for example, metal. However, the present invention is not limited thereto. In other embodiments, the material of the second conductive pattern layer 160 may also be other conductive materials capable of shielding light.

[0105] Please refer to Figure 1A , Figure 2A and Figure 3A Then, a second insulating material layer 170' is formed on the first insulating material layer 150' and the second conductive pattern layer 160. The second insulating material layer 170' is disposed on the first region 110a and the second region 110b of the substrate 110, and covers the second conductive pattern layer 160. For example, in the present embodiment, the material of the second insulating material layer 170' can be an inorganic material (e.g., silicon oxide, silicon nitride, silicon oxynitride, or a stacked layer of at least two of the above materials), an organic material, or a combination thereof.

[0106] Figure 7 FIG. 1 is a top view of the third conductive pattern layer 180 according to an embodiment of the present invention.

[0107] Please refer to Figure 1A , Figure 2A , Figure 3A and Figure 7 Then, a third conductive pattern layer 180 is formed on the second insulating material layer 170'. The third conductive pattern layer 180 is disposed on the first region 110a of the substrate 110 and has a plurality of conductive patterns 182 arranged periodically. In the present embodiment, the plurality of conductive patterns 182 of the third conductive pattern layer 180 can selectively shield light, and the plurality of light shielding patterns 126 of the light shielding pattern layer 120 can respectively shield the plurality of conductive patterns 182 of the third conductive pattern layer 180. For example, in the present embodiment, the plurality of conductive patterns 182 of the third conductive pattern layer 180 are used to communicate with the light emitting element 200 (depicted in FIG. Figure 1D , Figure 2D and Figure 3D ) are electrically connected to a plurality of electrodes. However, the present invention is not limited thereto. In other embodiments, the plurality of conductive patterns 182 of the third conductive pattern layer 180 may also be other conductive elements. In this embodiment, the material of the third conductive pattern layer 180 is, for example, metal. However, the present invention is not limited thereto. In other embodiments, the material of the third conductive pattern layer 180 may also be other conductive materials.

[0108] Please refer to Figure 1A to Figure 1B , FIG. 2A to FIG. 2B and FIG. 3A to FIG. 3B Then, the first insulating material layer 150', the second insulating material layer 170' and the third insulating material layer 130' are patterned to form the first insulating pattern layer 150, the second insulating pattern layer 170 and the third insulating pattern layer 130. In the present embodiment, the first insulating material layer 150', the second insulating material layer 170' and the third insulating material layer 130' can be selectively patterned using a laser drilling technique to form the first insulating pattern layer 150, the second insulating pattern layer 170 and the third insulating pattern layer 130 having the first opening 152, the second opening 172 and the third opening 132, respectively. However, the present invention is not limited thereto, and in other embodiments, other techniques can also be used to form the first opening 152, the second opening 172 and the third opening 132.

[0109] Please refer to Figure 1B , Figure 2B and Figure 3B, the first insulating pattern layer 150 is disposed on the first conductive pattern layer 140. The second conductive pattern layer 160 is disposed on the first insulating pattern layer 150. The second insulating pattern layer 170 is disposed on the second conductive pattern layer 160. The second opening 172 of the second insulating pattern layer 170 overlaps the first opening 152 of the first insulating pattern layer 150. The third insulating pattern layer 130 is disposed on the light shielding pattern layer 120 and is located between the first conductive pattern layer 140 and the light shielding pattern layer 120. The third insulating pattern layer 130 has a third opening 132 overlapping the first opening 152 of the first insulating pattern layer 150. The first insulating pattern layer 150 has a first sidewall 152s defining the first opening 152. The second insulating pattern layer 170 has a second sidewall 172s defining the second opening 172. The third insulating pattern layer 130 has a third sidewall 132s defining the third opening 132. In the present embodiment, the first sidewall 152s of the first insulation pattern layer 150, the second sidewall 172s of the second insulation pattern layer 170, and the third sidewall 132s of the third insulation pattern layer 130 are substantially aligned. In other words, the first opening 152 of the first insulation pattern layer 150, the second opening 172 of the second insulation pattern layer 170, and the third opening 132 of the third insulation pattern layer 130 are substantially overlapped.

[0110] Please refer to Figure 1B In the present embodiment, in the top view, the edge of the first opening 152, the edge of the second opening 172 and the edge of the third opening 132 are located within the range enclosed by the entity of the first conductive pattern layer 140, the entity of the second conductive pattern layer 160 and the entity of the third conductive pattern layer 180, and the edge of the first opening 152, the edge of the second opening 172 and the third opening 132 maintain a distance d1, d2, d3 from the entity of the first conductive pattern layer 140, the entity of the second conductive pattern layer 160 and the entity of the third conductive pattern layer 180.

[0111] Please refer to Figure 1B , Figure 2B and Figure 3BIn the present embodiment, the first insulating pattern layer 150, the second insulating pattern layer 170 and the third insulating pattern layer 130 cover the periodically arranged multiple light-shielding conductive patterns 142 of the first conductive pattern layer 140, the periodically arranged multiple light-shielding conductive patterns 162 of the second conductive pattern layer 160, and the periodically arranged multiple first light-shielding strips 122, multiple second light-shielding strips 124 and multiple light-shielding patterns 126 of the light-shielding pattern layer 120, and the first opening 152 of the first insulating pattern layer 150, the second opening 172 of the second insulating pattern layer 170 and the third opening 132 of the third insulating pattern layer 130 expose areas that do not overlap with the periodically arranged multiple light-shielding conductive patterns 142 of the first conductive pattern layer 140, the periodically arranged multiple light-shielding conductive patterns 162 of the second conductive pattern layer 160, the periodically arranged multiple first light-shielding strips 122, multiple second light-shielding strips 124 and multiple light-shielding patterns 126 of the light-shielding pattern layer 120.

[0112] Please refer to Figure 1C , Figure 2C and Figure 3C Then, in this embodiment, a light absorption pattern layer 190 is formed on at least the first side wall 152s of the first insulation pattern layer 150 defining the first opening 152, the second side wall 172s of the second insulation pattern layer 170 defining the second opening 172, and the third side wall 132s of the third insulation pattern layer 130 defining the third opening 132.

[0113] Please refer to Figure 2C and Figure 3C In the present embodiment, the light absorption pattern layer 190 is disposed on the first area 110a of the substrate 110, the light absorption pattern layer 190 covers the first side wall 152s, the second side wall 172s and the third side wall 132s, and the light absorption pattern layer 190 separates the periodically arranged multiple light-shielding conductive patterns 142 of the first conductive pattern layer 140, the periodically arranged multiple light-shielding conductive patterns 162 of the second conductive pattern layer 160, and the periodically arranged multiple conductive patterns 182 of the third conductive pattern layer 180.

[0114] In detail, in the present embodiment, the light absorption pattern layer 190 includes a sidewall portion 192, which covers the first sidewall 152s of the first insulating pattern layer 150, the second sidewall 172s of the second insulating pattern layer 170, and the third sidewall 132s of the third insulating pattern layer 130. The sidewall portion 192 of the light absorption pattern layer 190 separates the periodically arranged plurality of light shielding conductive patterns 142 of the first conductive pattern layer 140, the periodically arranged plurality of light shielding conductive patterns 162 of the second conductive pattern layer 160, and the periodically arranged plurality of conductive patterns 182 of the third conductive pattern layer 180.

[0115] Please refer to Figure 1CSpecifically, in the present embodiment, the sidewall portion 192 of the light absorption pattern layer 190 includes a first sub-sidewall portion 192-1, a second sub-sidewall portion 192-2, and a third sub-sidewall portion 192-3. In the top view, an edge 192-1e of the first sub-sidewall portion 192-1 is located outside an edge 142e of a corresponding light shielding conductive pattern 142 of the first conductive pattern layer 140; in other words, in the present embodiment, an edge 192-1e of the first sub-sidewall portion 192-1 is disposed along an edge 142e of a corresponding light shielding conductive pattern 142 of the first conductive pattern layer 140. In the top view, the edge 192-2e of the second sub-sidewall portion 192-2 is located outside the edge 162e of the corresponding light-shielding conductive pattern 162 of the second conductive pattern layer 160; in other words, in the present embodiment, the edge 192-2e of the second sub-sidewall portion 192-2 is arranged along the edge 162e of the corresponding light-shielding conductive pattern 162 of the second conductive pattern layer 160. In the top view, the edge 192-3e of the third sub-sidewall portion 192-3 is located outside the edge 182e of the corresponding conductive pattern 182 of the third conductive pattern layer 180; in other words, in the present embodiment, the edge 192-3e of the third sub-sidewall portion 192-3 is substantially parallel to the edge 182e of the corresponding conductive pattern 182 of the third conductive pattern layer 180.

[0116] Please refer to Figure 1C , Figure 2C and Figure 3C In this embodiment, the light absorption pattern layer 190 may optionally further include a top portion 194 disposed on the top surface 170a of the second insulating pattern layer 170 facing away from the substrate 110. In this embodiment, the top portion 194 of the light absorption pattern layer 190 may include a first top portion 194-1 (indicated at Figure 1C ), the second top 194-2 (marked on Figure 1C ) and the third top 194-3 (marked at Figure 1C ). The first top portion 194-1 is disposed on the top surface 170a of the second insulating pattern layer 170 facing away from the substrate 110, connected to the first sub-side wall portion 192-1, and overlaps with a corresponding light-shielding conductive pattern 142 of the first conductive pattern layer 140. The second top portion 194-2 is disposed on the top surface 170a of the second insulating pattern layer 170 facing away from the substrate 110, connected to the second sub-side wall portion 192-2, and overlaps with a corresponding light-shielding conductive pattern 162 of the second conductive pattern layer 160. The third top portion 194-3 is disposed on the top surface 170a of the second insulating pattern layer 170 facing away from the substrate 110, connected to the third sub-side wall portion 192-3, and partially overlaps with a corresponding conductive pattern 182 of the third conductive pattern layer 180.

[0117] In the present embodiment, the light absorption pattern layer 190 has a light-transmitting opening 190a, which overlaps the first opening 152 of the first insulation pattern layer 150, the second opening 172 of the second insulation pattern layer 170, and the third opening 132 of the third insulation pattern layer 130. The light-transmitting opening 190a of the light absorption pattern layer 190 is located in the second region 110b of the substrate 110. The light-transmitting opening 190a of the light absorption pattern layer 190 defines a transmission region (i.e., the second region 110b).

[0118] Please refer to Figure 1C In this embodiment, the light-transmitting opening 190a of the light-absorbing pattern layer 190 may be selectively polygonal. In other words, in this embodiment, the edge of the light-transmitting opening 190a of the light-absorbing pattern layer 190 has multiple corners. However, the present invention is not limited thereto. In other embodiments, the corners of the edge of the light-transmitting opening 190a of the light-absorbing pattern layer 190 may be rounded to reduce the diffraction effect of the background light beam when passing through the light-transmitting opening 190a. In other embodiments, the light-transmitting opening 190a may also be circular, elliptical or other shapes with arc-shaped edges.

[0119] Please refer to Figure 1D , Figure 2D and Figure 3D In this embodiment, a plurality of light emitting elements 200 are then disposed on the substrate 110, and the plurality of light emitting elements 200 are electrically connected to the plurality of conductive patterns 182 of the third conductive pattern layer 180. Specifically, in this embodiment, the light absorption pattern layer 190 has an auxiliary opening 190b, exposing at least a portion of the conductive pattern 182; the light emitting element 200 is disposed on at least a portion of the conductive pattern 182 exposed by the auxiliary opening 190b of the light absorption pattern layer 190.

[0120] In the present embodiment, the light emitting element 200 is, for example, a micro light emitting diode (μLED). However, the present invention is not limited thereto, and in other embodiments, the light emitting element 200 may also be other types of light emitting elements. For example, in another embodiment, the light emitting element 200 may also be an organic light emitting element including an organic electroluminescent layer. In addition, it should be noted that the present invention does not limit the display device 10 to include the light emitting element 200; in another embodiment, the light emitting element 200 may also be replaced by a non-self-luminous element (not shown), wherein the non-self-luminous element includes a non-self-luminous display medium layer (for example, but not limited to: a liquid crystal layer).

[0121] In the present embodiment, each pixel structure SPX includes an electrode (i.e., a conductive pattern 182) and a light-emitting element 200 electrically connected to the electrode, the electrode (i.e., the conductive pattern 182) belongs to the third conductive pattern layer 180, and the third conductive pattern layer 180 is disposed on the second insulating pattern layer 170. In the present embodiment, in a top view, an edge 190be of the auxiliary opening 190b of the light absorption pattern layer 190 overlaps with an edge 182e of the electrode (i.e., the conductive pattern 182) of a corresponding pixel structure SPX. In the present embodiment, the top 194 of the light absorption pattern layer 190 may cover the top surface 170a of the second insulating pattern layer 170, but does not cover the top surface 182a of the electrode (i.e., the conductive pattern 182), but the present invention is not limited thereto.

[0122] Please refer to Figure 1E , Figure 2E and Figure 3E Then, a packaging layer 210 is formed to cover the plurality of pixel structures SPX. The packaging layer 210 overlaps the first opening 152 of the first insulating pattern layer 150, the second opening 172 of the second insulating pattern layer 170, and the light-transmitting opening 190a of the light-absorbing pattern layer 190. In the present embodiment, the sidewall portion 192 of the light-absorbing pattern layer 190 does not completely fill the first opening 152 of the first insulating pattern layer 150, the second opening 172 of the second insulating pattern layer 170, and the third opening 132 of the third insulating pattern layer 130, and the packaging layer 210 may fill the first opening 152 of the first insulating pattern layer 150, the second opening 172 of the second insulating pattern layer 170, the third opening 132 of the third insulating pattern layer 130, and the light-transmitting opening 190a of the light-absorbing pattern layer 190. For example, in the present embodiment, the packaging layer 210 may be a thin film packaging material, a die-bonding adhesive, or other packaging materials.

[0123] Please refer to Figure 1F , Figure 2F and Figure 3F Then, in this embodiment, a light-transmitting protective plate 220 may be selectively formed on the encapsulation layer 210. In this embodiment, the light-transmitting protective plate 220 may selectively include an anti-reflection film (not shown), but the present invention is not limited thereto. Thus, the display device 10 of this embodiment is completed.

[0124] It is worth noting that the display device 10 includes a light absorption pattern layer 190 that covers at least the first side wall 152s of the first insulating pattern layer 150 and the second side wall 172s of the second insulating pattern layer 170, and the light absorption pattern layer 190 at least separates the periodically arranged multiple light shielding conductive patterns 162 of the second conductive pattern layer 160. When the background light beam (not shown) from the rear of the display device 10 passes through the periodically arranged multiple light shielding conductive patterns 162 of the second conductive pattern layer 160, it will be absorbed by the light absorption pattern layer 190, and it is not easy to generate near-field diffraction inside the display device 10 due to passing through the periodically arranged multiple light shielding conductive patterns 162. Therefore, the background image viewed through the display device 10 is clearer, and the perspective effect of the display device 10 is good.

[0125] Figure 8 FIG. 1 shows a diffraction spot formed after a co-modulated light beam passes through a display device 10 according to an embodiment of the present invention. Fig. 9 The diffraction spot formed after a co-modulated light beam passes through a display device of a comparative example is shown.

[0126] The display device of the comparative example is similar to the display device 10 of the embodiment, and the difference between the two is that the first insulating pattern layer, the second insulating pattern layer, and the third insulating pattern layer of the display device of the comparative example do not have the first opening, the second opening, and the third opening, and the display device of the comparative example does not include the light absorption pattern layer 190 of the display device 10. Please refer to Figure 8 and Fig. 9 , compare the diffraction spot (such as Figure 8 ) and the diffraction spot formed after passing through the display device of the comparative example (as shown Fig. 9 As shown in FIG. 1 , the divergence of the diffraction spot formed after passing through the display device 10 of the embodiment is significantly less. This proves that the display device 10 of the embodiment can effectively reduce the near-field diffraction effect between the film layers inside the display device 10, thereby improving the clarity of the background image.

[0127] Fig.10 The reflection spectra of the display device 10 according to one embodiment of the present invention and the display device according to the comparative example are shown. Fig.10 The display device of the comparative example is the display device of the comparative example mentioned above. The difference between the display device of the comparative example and the display device of the embodiment is described above, and will not be repeated here. Fig.10 By comparing the reflection spectra of the display device 10 of the embodiment with the display device of the comparative example, it can be seen that due to the light absorption pattern layer 190, the reflectivity of the display device 10 of the embodiment is significantly lower, and the lower reflectivity helps to improve the visual effect of the display device 10 under strong light.

[0128] Fig.11The penetration spectra of the display device 10 according to an embodiment of the present invention and the display device of the comparative example are shown. Fig.11 The display device of the comparative example is the display device of the comparative example mentioned above. The difference between the display device of the comparative example and the display device 10 of the embodiment is described above, and will not be repeated here. Fig.11 By comparing the penetration spectra of the display device 10 of the embodiment and the display device of the comparative example, it can be seen that at most wavelengths of visible light, the transmittance of the display device 10 of the embodiment is higher than that of the display device of the comparative example. In other words, the transmittance of the display device 10 of the embodiment is higher, which helps to improve the perspective effect of the display device 10. In addition, the transmittance of the display device of the comparative example is relatively low in the range of 380nm to 480nm, that is, the background light beam passing through the display device of the comparative example will lack the components of purple and blue light, and the background image seen through the display device of the comparative example will be yellowish. In contrast, the display device 10 of the embodiment has a more consistent transmittance at each wavelength, which can effectively improve the problem of the yellowish background image.

[0129] It must be noted that the following embodiments use the component numbers and some contents of the previous embodiments, wherein the same number is used to represent the same or similar components, and the description of the same technical contents is omitted. The description of the omitted parts can refer to the previous embodiments, and the following embodiments will not be repeated.

[0130] Fig.12 FIG. 1 is a top view of a display device 10A according to another embodiment of the present invention. Fig.13 FIG. 1 is a cross-sectional schematic diagram of a display device 10A according to another embodiment of the present invention. Fig.13 correspond Fig.12 Section line III-III'. Fig.14 FIG. 1 is a cross-sectional schematic diagram of a display device 10A according to another embodiment of the present invention. Fig.14 correspond Fig.12 Section line IV-IV'.

[0131] Fig.12 , Fig.13 and Fig.14 The display device 10A and Figure 1F , Figure 2F and Figure 3F The display device 10A is similar to the display device 10 , and the difference between the two is that the coverage range of the light absorption pattern layer 190 of the display device 10A is different from the coverage range of the light absorption pattern layer 190 of the display device 10 .

[0132] Please refer to Fig.12 , Fig.13 and Fig.14Specifically, in this embodiment, the light absorption pattern layer 190 further covers at least a portion of the top surface 182a of the conductive pattern 182 of the third conductive pattern layer 180. Specifically, in this embodiment, the light absorption pattern layer 190 may cover the entire area of ​​the top surface 182a of the conductive pattern 182 that is not occupied by the light emitting element 200.

[0133] Fig.15 FIG. 1 is a top view of a display device 10B according to another embodiment of the present invention. Fig.16 FIG. 1 is a cross-sectional schematic diagram of a display device 10B according to another embodiment of the present invention. Fig.16 correspond Fig.15 The section line V-V'. Fig.17 FIG. 1 is a cross-sectional schematic diagram of a display device 10B according to another embodiment of the present invention. Fig.17 correspond Fig.15 Section line VI-VI'.

[0134] Fig.15 , Fig.16 and Fig.17 The display device 10B and Figure 1F , Figure 2F and Figure 3F The display device 10B is similar to the display device 10 , and the difference between the two is that the coverage range of the light absorption pattern layer 190 of the display device 10B is different from the coverage range of the light absorption pattern layer 190 of the display device 10 .

[0135] Please refer to Fig.15 , Fig.16 and Fig.17 Specifically, in the present embodiment, the light absorption pattern layer 190 covers the first side wall 152s of the first insulating pattern layer 150, the second side wall 172s of the second insulating pattern layer 170 and the third side wall 132s of the third insulating pattern layer 130, but the light absorption pattern layer 190 does not cover the top surface 170a of the second insulating pattern layer 170 and the conductive pattern 182 of the third conductive pattern layer 180.

[0136] 18A to 18F FIG. 1 is a cross-sectional schematic diagram of a manufacturing process of a display device 10C according to another embodiment of the present invention. 18A to 18F Manufacturing process of display device 10C FIG. 2A to FIG. 2F The manufacturing process of the display device 10 is similar to that of the display device 10, and the difference between the two is that the formation range of the first opening 152, the second opening 172 and the third opening 132 of the first insulating pattern layer 150, the second insulating pattern layer 170 and the third insulating pattern layer 130 of the display device 10C is different from the formation range of the first opening 152, the second opening 172 and the third opening 132 of the first insulating pattern layer 150, the second insulating pattern layer 170 and the third insulating pattern layer 130 of the display device 10. 18A to 18F Let me illustrate this with an example.

[0137] Please refer to Fig.18A First, a light shielding pattern layer 120, a third insulating material layer 130', a first conductive pattern layer 140, a first insulating material layer 150', a second conductive pattern layer (not shown), a second insulating material layer 170' and a third conductive pattern layer 180 are sequentially formed on the substrate 110.

[0138] Please refer to Fig.18B Then, the first insulating material layer 150', the second insulating material layer 170' and the third insulating material layer 130' are patterned to form a first insulating pattern layer 150, a second insulating pattern layer 170 and a third insulating pattern layer 130 having a first opening 152, a second opening 172 and a third opening 132 respectively.

[0139] Different from the aforementioned embodiment, in the present embodiment, the first opening 152, the second opening 172 and the third opening 132 are not hollow openings, but are annular openings, and a portion of the first insulation pattern layer 150, a portion of the second insulation pattern layer 170 and a portion of the third insulation pattern layer 130 are disposed in the annular first opening 152, the second opening 172 and the third opening 132.

[0140] Please refer to Fig. 18C Then, a plurality of light emitting elements 200 are disposed on the substrate 110, and the plurality of light emitting elements 200 are electrically connected to the plurality of conductive patterns 182 of the third conductive pattern layer 180. Each pixel structure SPX includes an electrode (ie, the conductive pattern 182) and a light emitting element 200 electrically connected to the electrode.

[0141] Please refer to Fig.18D Then, a light absorption pattern layer 190 is formed on at least the first side wall 152s of the first insulation pattern layer 150 defining the first opening 152, the second side wall 172s of the second insulation pattern layer 170 defining the second opening 172, and the third side wall 132s of the third insulation pattern layer 130 defining the third opening 132.

[0142] Different from the aforementioned embodiment, in the present embodiment, the first insulating pattern layer 150 includes a first main portion 150-1 and a first auxiliary portion 150-2, the first main portion 150-1 overlaps the light-shielding conductive pattern 142 of the first conductive pattern layer 140, the first auxiliary portion 150-2 is located between the light-shielding conductive patterns 142 of the first conductive pattern layer 140, and the first side wall 152s of the first opening 152 defining the first insulating pattern layer 150 includes the side wall 150-1s of the first main portion 150-1 and the side wall 150-2s of the first auxiliary portion 150-2 that are opposite to and separated from each other, and the light absorption pattern layer 190 covers the side wall 150-1s of the first main portion 150-1 of the first insulating pattern layer 150 and the side wall 150-2s of the first auxiliary portion 150-2 of the first insulating pattern layer 150.

[0143] In the present embodiment, the second insulating pattern layer 170 includes a second main portion 170-1 and a second auxiliary portion 170-2, the second main portion 170-1 overlaps the light-shielding conductive pattern 142 of the first conductive pattern layer 140 and is disposed on the first main portion 150-1 of the first insulating pattern layer 150, the second auxiliary portion 170-2 is disposed on the first auxiliary portion 150-2 of the first insulating pattern layer 150, and the second side wall 172s of the second opening 172 of the second insulating pattern layer 170 is defined to include the side wall 170-1s of the second main portion 170-1 and the side wall 170-2s of the second auxiliary portion 170-2 that are opposite to and separated from each other, and the light absorption pattern layer 190 further covers the side wall 170-1s of the second main portion 170-1 of the second insulating pattern layer 170 and the side wall 170-2s of the second auxiliary portion 170-2 of the second insulating pattern layer 170.

[0144] In the present embodiment, the third insulating pattern layer 130 includes a third main portion 130-1 and a third auxiliary portion 130-2, the third main portion 130-1 covers the entity of the light-shielding pattern layer 120 and is arranged between the first main portion 150-1 of the first insulating pattern layer 150 and the substrate 110, the third auxiliary portion 130-2 is arranged between the first auxiliary portion 150-2 of the first insulating pattern layer 150 and the substrate 110, and the third side wall 132s of the third opening 132 of the third insulating pattern layer 130 is defined to include the side wall 130-1s of the third main portion 130-1 and the side wall 130-2s of the third auxiliary portion 130-2 that are opposite to and separated from each other, and the light absorption pattern layer 190 further covers the side wall 130-1s of the third main portion 130-1 of the third insulating pattern layer 130 and the side wall 130-2s of the third auxiliary portion 130-2 of the third insulating pattern layer 130.

[0145] In short, in the present embodiment, the light absorption pattern layer 190 can fill the first opening 152 of the first insulation pattern layer 150, the second opening 172 of the second insulation pattern layer 170, and the third opening 132 of the third insulation pattern layer 130, and the first auxiliary portion 150-2 of the first insulation pattern layer 150, the second auxiliary portion 170-2 of the second insulation pattern layer 170, and the third auxiliary portion 130-2 of the third insulation pattern layer 130 are located in the light-transmitting opening 190a of the light absorption pattern layer 190. In the present embodiment, the light absorption pattern layer 190 is formed by using an inkjet printing process instead of a photolithography process.

[0146] Please refer to Fig.18E Then, a packaging layer 210 is formed to cover the plurality of pixel structures SPX. Fig.18F Finally, a light-transmitting protection plate 220 is formed on the encapsulation layer 210. Here, the display device 10C of this embodiment is completed.

Claims

1. A display device, comprising: A substrate having a first area and a second area outside the first area; A first conductive pattern layer is disposed on the first region of the substrate; a first insulating pattern layer, disposed on the first conductive pattern layer and having a first opening, wherein the first insulating pattern layer has a first sidewall defining the first opening; a second conductive pattern layer, disposed on the first insulating pattern layer, located in the first region of the substrate, and having a plurality of periodically arranged light-shielding conductive patterns; a second insulating pattern layer, disposed on the second conductive pattern layer and having a second opening, wherein the second opening overlaps the first opening, and the second insulating pattern layer has a second sidewall defining the second opening; A plurality of pixel structures are disposed on the second insulating pattern layer; as well as a light absorption pattern layer, disposed on the first region of the substrate, wherein the light absorption pattern layer at least covers the first side wall and the second side wall and separates the light-shielding conductive patterns of the second conductive pattern layer, the light absorption pattern layer has a light-transmitting opening overlapping the first opening and the second opening, and the light-transmitting opening of the light absorption pattern layer is located in the second region of the substrate, The first insulating pattern layer comprises: a first main portion overlapping the light-shielding conductive patterns of the first conductive pattern layer; and A first auxiliary portion located between the light-shielding conductive patterns of the first conductive pattern layer; Among them, the first side wall of the first opening defining the first insulation pattern layer includes a side wall of the first main part and a side wall of the first auxiliary part which are opposite to and separated from each other, and the light absorption pattern layer covers the side wall of the first main part of the first insulation pattern layer and the side wall of the first auxiliary part of the first insulation pattern layer.

2. A display device as described in claim 1, wherein the first conductive pattern layer has a plurality of light-shielding conductive patterns arranged periodically; in a top view of the display device, the light-shielding conductive patterns of the first conductive pattern layer and the light-shielding conductive patterns of the second conductive pattern layer are alternately arranged; and the light-absorbing pattern layer further separates the light-shielding conductive patterns of the first conductive pattern layer.

3. The display device as claimed in claim 2, wherein the light absorption pattern layer comprises: A side wall portion covers the first side wall of the first insulating pattern layer and the second side wall of the second insulating pattern layer, separates the light-shielding conductive patterns of the first conductive pattern layer, and separates the light-shielding conductive patterns of the second conductive pattern layer, wherein the side wall portion includes: a first sub-side wall portion, wherein in a top view of the display device, an edge of the first sub-side wall portion is located outside an edge of a corresponding light-shielding conductive pattern of the first conductive pattern layer; and A second sub-side wall portion, wherein, in a top view of the display device, an edge of the second sub-side wall portion is located outside an edge of a corresponding light-shielding conductive pattern of the second conductive pattern layer.

4. The display device as claimed in claim 3, wherein the light absorption pattern layer further comprises: a first top portion, disposed on a top surface of the second insulating pattern layer facing away from the substrate, connected to the first sub-sidewall portion, and overlapping the corresponding light-shielding conductive pattern of the first conductive pattern layer; and A second top portion is disposed on the top surface of the second insulating pattern layer facing away from the substrate, connected to the second sub-side wall portion, and overlapped with the corresponding light-shielding conductive pattern of the second conductive pattern layer.

5. The display device as claimed in claim 3, wherein each pixel structure comprises an electrode and a light-emitting element electrically connected to the electrode, the electrode belongs to a third conductive pattern layer, the third conductive pattern layer is disposed on the second insulating pattern layer, the plurality of electrodes of the pixel structures are periodically arranged, and the sidewall portion further comprises: A third sub-side wall portion, wherein, in a top view of the display device, an edge of the third sub-side wall portion is located outside an edge of a corresponding electrode of the third conductive pattern layer.

6. The display device as claimed in claim 5, wherein the light absorption pattern layer further comprises: A third top portion is disposed on the top surface of the second insulating pattern layer facing away from the substrate, connected to the third sub-side wall portion, and partially overlapped with the corresponding electrode of the third conductive pattern layer.

7. The display device according to claim 2, further comprising: a light-shielding pattern layer, disposed in the first region of the substrate, located between the first conductive pattern layer and the substrate, and shielding the light-shielding conductive patterns of the first conductive pattern layer and the light-shielding conductive patterns of the second conductive pattern layer; and A third insulating pattern layer is disposed on the light-shielding pattern layer and located between the first conductive pattern layer and the light-shielding pattern layer, wherein the third insulating pattern layer has a third opening overlapping the first opening and a third side wall defining the third opening, and the light-absorbing pattern layer further covers the third side wall.

8. The display device according to claim 1, further comprising: A packaging layer covers the pixel structures and overlaps the first opening of the first insulating pattern layer, the second opening of the second insulating pattern layer and the light-transmitting opening of the light-absorbing pattern layer.

9. The display device according to claim 1, further comprising: A packaging layer covers the pixel structures and fills the first opening of the first insulating pattern layer, the second opening of the second insulating pattern layer and the light-transmitting opening of the light-absorbing pattern layer. 10 . The display device as claimed in claim 1 , wherein the first auxiliary portion of the first insulating pattern layer is located in the light-transmitting opening of the light-absorbing pattern layer.

11. The display device as claimed in claim 10, wherein the second insulating pattern layer comprises: a second main portion, overlapping the light-shielding conductive patterns of the first conductive pattern layer and disposed on the first main portion of the first insulating pattern layer; and a second auxiliary portion, disposed on the first auxiliary portion of the first insulating pattern layer; Among them, the second side wall of the second opening defining the second insulation pattern layer includes a side wall of the second main part and a side wall of the second auxiliary part which are opposite to and separated from each other, and the light absorption pattern layer further covers the side wall of the second main part of the second insulation pattern layer and the side wall of the second auxiliary part of the second insulation pattern layer. 12 . The display device as claimed in claim 11 , wherein the second auxiliary portion of the second insulating pattern layer is located in the light-transmitting opening of the light-absorbing pattern layer.

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