Internal circulation forced air cooling machine cabinet

Abstract

This invention relates to an internally circulating forced air-cooled chassis, comprising a chassis shell and a heat dissipation shell. The heat dissipation shell includes at least a closed inner heat exchange cavity and an open outer heat exchange cavity, with the chassis shell located within the inner heat exchange cavity. A heat exchanger, in cooperation with the chassis shell, divides the inner heat exchange cavity into upper and lower parts. The heat exchanger includes hot-end heat exchange fins located in the outer heat exchange cavity, cold-end heat exchange fins located in the inner heat exchange cavity, and a heat dissipation plate. The heat dissipation plate includes a heat insulation plate and a thermoelectric cooler. The hot end of the thermoelectric cooler transfers high temperature to the hot-end heat exchange fins, and the cold end transfers low temperature to the cold-end heat exchange fins. An internal cooling fan fixed to the bottom of the chassis shell draws air from the lower part of the inner heat exchange cavity and sends it into the chassis shell. The air inside the chassis shell is discharged through an air vent at the top of the chassis shell into the upper space of the inner heat exchange cavity. Simultaneously, the air in the upper space of the inner heat exchange cavity is cooled by the cold-end heat exchange fins before entering the lower space. This invention has a simple structure, is easy to implement, and provides good cooling performance.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation of electronic components, and specifically relates to an internally circulating forced air-cooled chassis. Background Technology

[0002] Existing internally circulating air-cooled chassis mainly consist of a chassis panel, circuit boards, fans, and air-to-water heat exchangers. Cool air circulates within the chassis via fans, blowing cool air onto the modules to remove heat. The hot air then passes through the air-to-water heat exchanger, becoming cool again, and the fans then blow the cool air onto the circuit boards, repeating the cycle. However, existing air-to-water heat exchangers are relatively complex, require an external power source (pump), and have disadvantages such as large equipment size. Summary of the Invention

[0003] To address the aforementioned problems, this invention provides a novel internally circulated forced air-cooled chassis structure that combines a traditional heat exchanger with a thermoelectric cooler to replace the existing air-water heat exchanger and achieve air-cooled heat dissipation of the chassis.

[0004] The objective of this invention and the technical problem it solves are achieved by the following technical solution. According to this invention, an internally circulating forced air-cooled chassis includes a chassis shell and a heat dissipation shell. The heat dissipation shell includes at least a closed inner heat exchange cavity and an open outer heat exchange cavity. The chassis shell is located within the inner heat exchange cavity. A heat exchanger, in cooperation with the chassis shell, divides the inner heat exchange cavity into upper and lower parts. The heat exchanger includes hot-end heat exchange fins located in the outer heat exchange cavity, cold-end heat exchange fins located in the inner heat exchange cavity, and a heat dissipation plate. The heat dissipation plate includes a heat insulation plate located between the inner and outer heat exchange cavities and several thermoelectric coolers. The hot end of the thermoelectric cooler transfers high temperature to the hot-end heat exchange fins, and the cold end transfers low temperature to the cold-end heat exchange fins. An internal cooling fan fixed to the bottom of the chassis shell draws gas from the lower part of the inner heat exchange cavity and sends it into the chassis shell, then discharges it through an air vent at the top of the chassis shell into the upper space of the inner heat exchange cavity. Simultaneously, the gas in the upper space of the inner heat exchange cavity is cooled by the cold-end heat exchange fins and enters the lower space.

[0005] The objectives of this invention and the technical problems it addresses can be further achieved by the following technical measures.

[0006] The aforementioned internally circulated forced air-cooled chassis, wherein the external heat exchange cavity is also provided with an external cooling fan for dissipating heat from the heat exchange fins at the hot end.

[0007] The aforementioned internally circulated forced air-cooled chassis, wherein the internal heat exchange chamber and the external heat exchange chamber are separated by a partition and a heat insulation plate, and the partition is made of a low thermal conductivity material.

[0008] The aforementioned internally circulated forced air-cooled chassis has an external heat exchange cavity that is a U-shaped cavity composed of a heat dissipation shell, a heat insulation plate, and a partition. This U-shaped cavity meets the requirement of heat dissipation by the heat exchange fins at the hot end contacting the external cold air.

[0009] The aforementioned internally circulated forced air-cooled chassis, wherein the walls on the opposite sides of the inner heat exchange chamber and the outer heat exchange chamber are composed of the chassis shell, a support plate supported at the bottom of the chassis shell, and a partition plate fixed between the top of the chassis shell and the heat dissipation shell.

[0010] In the aforementioned internally circulated forced air-cooled chassis, the wall on the opposite side of the heat exchange chamber and the outer heat exchange chamber cooperates with the side of the heat dissipation shell away from the outer heat exchange chamber to form a cavity.

[0011] The aforementioned internally circulated forced air-cooled chassis also has heat dissipation fins extending vertically on the outside of the circuit boards assembled inside the chassis shell.

[0012] The aforementioned internally circulated forced air-cooled chassis includes a cold plate, which comprises an outer cold plate, an inner cold plate, and a heat dissipation plate. The heat dissipation plate includes a heat insulation plate for preventing heat exchange between the inner and outer cold plates and a thermoelectric cooler for keeping the inner cold plate at a low temperature. The heat dissipation fins are located outside the outer cold plate.

[0013] The aforementioned internally circulated forced air-cooled chassis also includes a PCB board fixedly attached to the inner cold plate by a rear cover, and the inner cold plate is provided with a number of heat-conducting protrusions on the surface facing the PCB board for contacting the heat-generating components on the PCB board.

[0014] Compared with existing technologies, this invention has significant advantages and beneficial effects. Through the above technical solution, this invention achieves considerable technological advancement and practicality, and has broad industrial application value, possessing at least the following advantages:

[0015] The internal circulation forced air-cooled chassis of this invention maintains the low temperature of the heat exchanger cold end heat exchange fins through a thermoelectric cooler. It is not only simple in structure and easy to implement, but also can effectively reduce the overall size of the chassis. Furthermore, the thermoelectric cooling heat dissipation achieved by this invention has the advantages of small size and light weight; no noise and reliable operation; fast cooling speed; and easy operation by adjusting the current to change the heat dissipation power consumption. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the internal circulation forced air cooling chassis structure of the present invention;

[0017] Figure 2 This is a schematic diagram of the heat exchanger components of the present invention;

[0018] Figure 3 This is a cross-sectional view of the heat exchanger of the present invention;

[0019] Figure 4 This is a schematic diagram of the circuit board composition of the present invention;

[0020] Figure 5 This is a schematic diagram of the cold plate composition of the present invention;

[0021] Figure 6 This is a cross-sectional view of the cold plate of the present invention;

[0022] Figure 7 This is a front view of the cold plate of the present invention;

[0023] Figure 8 This is an exploded view of the circuit board of the present invention;

[0024] Figure 9 This is a schematic diagram of a circuit board according to another embodiment of the present invention.

[0025] [Explanation of Key Component Symbols]

[0026] 1: Chassis 2: Circuit Boards 6: Heat Insulation Board

[0027] 21: Back cover 22: PCB board 23: Cold plate

[0028] 231: Outer cold plate; 232: Inner cold plate; 2321: Heat-conducting boss

[0029] 233: Heat sink; 8: Thermoelectric cooler; 81: Cold end

[0030] 82: Hot end; 107: Heat dissipation fins

[0031] 108: Heat sink housing; 109: Upper plate; 110: Lower plate

[0032] 111: Left panel 112: Right panel 113: Front panel

[0033] 114: Rear panel; 115: Internal cooling fan; 116: External cooling fan

[0034] 117: External cavity cold air inlet; 118: Heat exchange cavity baffle; 119: Cold end heat exchange fins.

[0035] 120: Heat sink 121: Heat exchange fins at the hot end Detailed Implementation

[0036] To further illustrate the technical means and effects adopted by the present invention to achieve the intended purpose, the following detailed description of the specific implementation, structure, features and effects of the internal circulation forced air-cooled chassis proposed according to the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0037] Please see Figure 1-3This is a schematic diagram of the structure of various parts of the internal circulation forced air-cooled chassis in Embodiment 1 of the present invention. The air-cooled chassis includes a chassis shell 1 and a heat dissipation shell 108. An inner heat exchange cavity 129 and an outer heat exchange cavity 130 are formed in the heat dissipation shell 108. The inner heat exchange cavity 129 is a closed cavity, and the outer heat exchange cavity 130 is open on at least one side. The chassis shell 1 is fixed in the inner heat exchange cavity 129, and an inner cooling fan 115 is provided at the bottom of the chassis shell 1. The inner cooling fan 115 delivers cold air into the chassis shell 1.

[0038] A heat exchanger is also provided on one side of the chassis housing 1. The heat exchanger works with the chassis housing 1 to divide the space inside the inner heat exchange chamber 129 into upper and lower parts. The air in the upper space enters the lower space after being heated by the heat exchanger, and is then sent into the chassis housing 1 by the inner cooling fan 115, and then discharged from the upper air vent of the chassis housing 1.

[0039] In this embodiment, the gap between adjacent circuit boards 2 extends vertically, and the air supplied to the chassis housing 1 by the internal cooling fan 115 flows along the gap between adjacent circuit boards and is discharged from the top of the chassis housing. Preferably, the circuit boards 2 are arranged in a front-to-back direction or a left-to-right direction.

[0040] The heat exchanger includes a heat dissipation plate 120 and cold-end heat exchange fins 119 and hot-end heat exchange fins 121 distributed on both sides of the heat dissipation plate 120. The heat dissipation plate 120 includes a heat insulation plate 6 and a plurality of thermoelectric coolers 8 fixed on the heat insulation plate 6. The hot end 81 of the thermoelectric cooler 8 is in close contact with the hot-end heat exchange fin 121, and the cold end 82 is in close contact with the cold-end heat exchange fin 119. The cold-end heat exchange fin 119 of the heat exchanger is located in the inner heat exchange cavity 129, and the hot-end heat exchange fin 121 is located in the outer heat exchange cavity 130. One end of the hot-end heat exchange fin 121 is connected to the external space of the heat dissipation shell 108, and the other end is connected to an external cooling fan 116. The external cooling fan 116 draws in external air to dissipate heat from the hot-end heat exchange fin 121.

[0041] In this embodiment, a heat exchange chamber partition 118 is also fixed at the lower end of the heat exchanger. The heat exchange chamber partition 118 supports and fixes the heat exchanger inside the heat dissipation housing 108, ensuring sufficient space below the cold end heat exchange fins 119 and achieving isolation of heat transfer between the inner heat exchange chamber 129 and the outer heat exchange chamber 130. To increase the space of the inner heat exchange chamber 129, preferably, the outer heat exchange chamber 130 is a space partitioned off at the lower part of one side of the heat dissipation housing 108, with the heat dissipation housing 108 open at the lower part of this side. The heat dissipation housing 108, the heat exchanger, the heat exchange chamber partition 118 fixed at the bottom of the heat exchanger near the heat dissipation plate 120, and the partition 123 fixed above the heat dissipation plate 120 and between the heat dissipation housing 108 together form a U-shaped outer heat exchange chamber 130, and the outer heat exchange chamber 130 has an external cold air inlet 117 communicating with the outside.

[0042] In this embodiment, the heat dissipation housing 108 includes an upper plate 109, a lower plate 110, a left plate 111, a right plate 112, a front plate 113, and a rear plate 114. There is a gap between the lower part of the left plate 111 and the lower plate 110. The heat exchanger is located on the lower left side of the heat dissipation housing 108. The heat exchange chamber partition 118 below the heat dissipation housing 108 is fixed on the lower plate 110. A partition 123 is also fixed above the heat exchange chamber partition 118. The partition 123 is fixed on the heat dissipation plate 120 or at the position of the cold end heat exchange fin 119 near the heat dissipation plate 120. Thus, the partition 123, the left plate 111, the lower plate 110, the heat exchanger, and the heat exchange chamber partition 118 together form a U-shaped cavity. The hot end heat exchange fin 121 is located in the U-shaped cavity. The rear plate 114 is open at the position corresponding to the U-shaped cavity to form an external cavity cold air inlet 117. To avoid obstructing the external heat exchange cavity 130, an obstruction hole is provided at the lower left end of the front plate of the present invention. Preferably, both the partition plate 123 and the heat exchange cavity partition plate 118 are made of a low heat transfer material.

[0043] In this embodiment, one end of the cold-end heat exchange fin 119 contacts the heat sink 120, and the other end contacts the chassis housing, thereby dividing the space inside the inner heat exchange cavity 129 into upper and lower parts. After the upper air is cooled by the cold-end heat exchange fin 119, it enters the lower space and is then sent into the chassis housing 1 by the internal cooling fan fixed to the bottom of the chassis housing 1. Finally, it is discharged from the top of the chassis housing 1 through the gap between the boards, and takes away the heat between the boards.

[0044] In this embodiment, the bottom of the chassis housing 1 is supported and fixed to the lower plate 110 by a support plate. The support plate 130 on the side of the bottom of the chassis housing 1 away from the heat exchanger, the right shell 14 of the chassis housing 1, and the partition plate 131 fixed between the upper shell 11 and the upper plate 109 of the chassis housing 1 together form the wall on the right side of the inner heat exchange cavity 129. This prevents hot air exhausted from the upper part of the chassis housing 1 from returning to the lower space without passing through the heat exchanger, thus affecting the heat dissipation effect. The wall on the right side of the inner heat exchange cavity 129 and the part of the right side of the heat dissipation housing away from the outer heat exchange cavity cooperate to form a cavity 133.

[0045] The chassis housing 1 is equipped with several circuit boards 2. Please refer to [link / reference]. Figure 4-8This is a schematic diagram of the structure of various parts of the board 2 according to an embodiment of the present invention. The board 2 includes a cold plate 23 and a PCB board 22 fixed in a receiving groove 234 on one side of the cold plate 23 by a rear cover 21. The cold plate 23 includes a sandwich structure composed of an outer cold plate 231, an inner cold plate 232 and a heat sink. The outer cold plate 231 has a receiving groove 2311 on one side. The heat sink 233 and the inner cold plate 232 are stacked sequentially in the receiving groove 2311, and the heat sink 233 is pressed and positioned in the receiving groove 2311 of the outer cold plate 231 by the inner cold plate 232. The heat sink 233 includes a heat insulation plate 6 and a thermoelectric cooler 8 located in a positioning groove 61 on the heat insulation plate 6. There are multiple thermoelectric coolers 8, which are evenly distributed on the heat insulation plate 6 or distributed on the heat insulation plate 6 according to the arrangement of heat-generating components on the PCB board. The hot end 81 of the thermoelectric cooler 8 is in contact with the outer cold plate 231, and the cold end 82 is in contact with the inner cold plate 232, so as to reduce the temperature of the PCB board in contact with the inner cold plate 232.

[0046] In this embodiment, to prevent heat conduction between the inner and outer cold plates, the outer edge of the insulation plate 6 protrudes beyond the outer edge of the inner cold plate 232. Preferably, the outer edges of the insulation plate 6 and the inner cold plate 232 are clearance-fitted with the wall of the receiving groove 2311, and the clearance between the outer edge of the inner cold plate 232 and the wall of the receiving groove is greater than the clearance between the outer edge of the insulation plate 6 and the wall of the receiving groove. That is, due to the different cross-sectional areas of the inner cold plate, the insulation plate, and the outer cold plate, contact between the inner and outer cold plates can be avoided, and heat insulation between the inner and outer cold plates is achieved by their different areas and the insulation plate.

[0047] In this embodiment, the inner cold plate 232 is further provided with a plurality of heat-conducting protrusions 2321 on the surface facing the PCB board for contacting the heat-generating components on the PCB board. The provision of the heat-conducting protrusions 2321 can enhance the heat dissipation of the heat-generating components and accelerate the heat dissipation rate.

[0048] In this embodiment, the outer cold plate 231 and the rear cover 21 are fixed with screws, and the receiving groove 2311 of the outer cold plate 231 has an inwardly protruding positioning protrusion 2312. The positioning protrusion 2312 has screw holes, and the outer cold plate 231 and the rear cover 21 are fixed by screws passing through these screw holes. Preferably, the sidewall of the positioning protrusion 2312 within the receiving groove 2311 has an arc-shaped structure. Both the inner cold plate 232 and the heat insulation plate 6 within the receiving groove 2311 have clearance grooves 2313 to avoid the positioning protrusion 2312. These clearance grooves 2313 cooperate with the positioning protrusion 2312 to position the inner cold plate 232 and the heat insulation plate 6 within the outer cold plate 231. A gap exists between the edge of the inner cold plate 232 and the positioning protrusion 2312. Preferably, there are a total of 6 positioning protrusions 2312, including 4 distributed at the four corners of the receiving groove 2311 and 2 located in the middle of the two long sides of the receiving groove 2311, but it is not limited to this.

[0049] In other embodiments of the present invention, in order to maintain the low temperature inside the circuit board 2 and prevent the external high temperature from being transferred to the circuit board 2 through the back cover, the back cover 21 also has a heat insulation function, such as the back cover 21 being made of heat insulation material or the back cover 21 having a heat insulation plate 6 inside. Preferably, the back cover 21 is a sandwich structure, which includes an outer back cover, an inner back cover, and a heat insulation plate 21 sandwiched between the inner and outer back covers.

[0050] Please see Figure 9 This is a schematic diagram of a board structure according to another embodiment of the present invention. In this embodiment, the outer side of the outer cold plate of the board is also provided with heat dissipation fins 107 for air cooling. When the internal cooling fan delivers cold air into the chassis housing 1, the cold air passes through the heat dissipation fins 107 and carries away the high temperature heat on the outer side of the outer cold plate, thereby achieving heat dissipation.

[0051] In this embodiment of the heat exchanger, the cold end of the thermoelectric cooler is attached to the cold end heat exchange fins to maintain a low temperature, while the hot end of the thermoelectric cooler is attached to the hot end heat exchange fins. Based on the principle of thermoelectric cooling, the cold end heat exchange fins maintain a constant low temperature, and hot air becomes cold air after passing through them. The external hot end heat exchange fins are forcibly cooled by a fan. The external cooling fan 116 draws in cold air through the external cavity air inlet to remove heat from the hot end of the heat exchanger. The internal cooling fan 115 carries away heat from the circuit board 2 and achieves heat exchange at the cold end of the heat exchanger, becoming cold air after passing through the heat exchanger and re-entering the circulation.

[0052] The heat dissipation fins in this invention can be formed by machining, welding, or profile repair. The heat dissipation fins can be rectangular, cylindrical, discontinuous rectangular, or parabolic, etc.

[0053] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. An internally circulated forced air-cooled chassis, comprising a chassis shell and a heat dissipation shell, characterized in that: The heat dissipation housing includes at least a closed inner heat exchange cavity and an open outer heat exchange cavity, with the chassis housing located inside the inner heat exchange cavity. The heat exchanger cooperates with the chassis housing to divide the inner heat exchange cavity into upper and lower parts. The heat exchanger includes hot-end heat exchange fins located in the outer heat exchange cavity, cold-end heat exchange fins located in the inner heat exchange cavity, and a heat dissipation plate. The heat dissipation plate includes a heat insulation plate located between the inner and outer heat exchange cavities and several thermoelectric coolers. The hot end of the thermoelectric cooler transfers high temperature to the hot-end heat exchange fins, and the cold end transfers low temperature to the cold-end heat exchange fins. An internal cooling fan fixed to the bottom of the chassis housing draws gas from the lower part of the inner heat exchange cavity and sends it into the chassis housing. The chassis housing has an air vent at the top to discharge gas into the upper space of the inner heat exchange cavity. At the same time, the gas in the upper space of the inner heat exchange cavity is cooled by the cold-end heat exchange fins and enters the lower space.

2. The internally circulated forced air-cooled chassis according to claim 1, characterized in that: The external heat exchange cavity is also equipped with an external cooling fan for dissipating heat from the heat exchange fins at the hot end.

3. The internally circulated forced air-cooled chassis according to claim 1, characterized in that: The inner heat exchange cavity and the outer heat exchange cavity are separated by a partition and a heat insulation plate, and the partition is made of a low thermal conductivity material.

4. The internally circulated forced air-cooled chassis according to claim 3, characterized in that: The external heat exchange cavity is a U-shaped cavity composed of a heat dissipation shell, a heat insulation plate, and a partition. This U-shaped cavity meets the requirement of heat dissipation by the heat exchange fins at the hot end contacting the external cold air.

5. The internally circulating forced air-cooled chassis according to claim 4, characterized in that: The wall of the inner heat exchange cavity away from the outer heat exchange cavity is composed of a chassis shell, a support plate supported at the bottom of the chassis shell, and a partition plate fixed between the top of the chassis shell and the heat dissipation shell.

6. The internally circulating forced air-cooled chassis according to claim 5, characterized in that: The wall of the inner heat exchange cavity on the side away from the outer heat exchange cavity and the heat dissipation shell on the side away from the outer heat exchange cavity cooperate to form a cavity.

7. The internally circulated forced air-cooled chassis according to claim 1, characterized in that: The circuit boards assembled inside the chassis also have heat dissipation fins extending vertically on their outer sides.

8. The internally circulating forced air-cooled chassis according to claim 7, characterized in that: The board includes a cold plate, which includes an outer cold plate, an inner cold plate, and a heat dissipation plate. The heat dissipation plate includes a heat insulation plate for preventing heat exchange between the inner and outer cold plates and a thermoelectric cooler for keeping the inner cold plate at a low temperature. The heat dissipation fins are located outside the outer cold plate.

9. The internally circulating forced air-cooled chassis according to claim 8, characterized in that: The board also includes a PCB board that is fixedly attached to the inner cold plate by a back cover. The inner cold plate is also provided with a number of heat-conducting protrusions for contacting the heat-generating components on the PCB board.

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