Electronic accessory test processor

Abstract

The present invention relates to an electronic component test handler. Specifically, according to one embodiment of the present invention, an electronic component test handler can be provided including a first tray to place a plurality of electronic components; a plurality of pickers arranged in an x-axis direction, and the plurality of electronic components placed on the first tray can be transferred to a transfer hand of a second tray; a photographing unit to acquire image information by photographing the plurality of pickers; and a control unit to acquire a first picker x-axis coordinate as an x-axis coordinate of each of the plurality of pickers when the transfer hand is placed at a first tray position on the first tray based on the image information.

Description

Technical Field

[0001] This invention relates to an electronic component testing processor. Background Technology

[0002] A test handler is a device that supports testing electronic components such as semiconductor devices manufactured through a defined manufacturing process, and classifies the electronic components according to the test results. Such a test handler can test electronic components such as semiconductor devices by electrically connecting them to a tester.

[0003] On the other hand, electronic components, after being tested, are provided to the test processor while loaded onto the customer's pallet. Furthermore, these electronic components are conveyed to the test processor by multiple pickups to a transfer station. The spacing between the multiple pickups and the spaces where the electronic components are arranged on the customer's pallet differs from the spacing between the electronic components on the transfer station. Therefore, when multiple pickups convey electronic components loaded on the customer's pallet, it is necessary to adjust the spacing between the electronic components according to the transfer station's arrangement.

[0004] However, the positions of multiple pickups may deviate during assembly, and tolerances may arise due to incorrect assembly. Furthermore, errors may occur due to the inability to precisely control the spacing between multiple pickups. Thus, the spacing control between multiple pickups can be flawed for various reasons. In such cases, the pickups may not accurately grasp the electronic components and may not place them correctly on the transfer platform. Consequently, electronic components may detach from the transfer platform, reducing test accuracy and potentially damaging the components.

[0005] Therefore, there is a need for an electronic component testing and processing machine that can accurately hold electronic components even if there are errors in the spacing between multiple pickups, and can place the held electronic components in the correct position on the transfer platform. Summary of the Invention

[0006] An embodiment of the present invention is based on the above background, and provides an electronic component testing processor that can accurately hold components even if there is an error in the spacing between multiple pickups, and can place the held electronic components in the correct position on the first tray.

[0007] In addition, one embodiment of the present invention provides an electronic component test processor that improves the accuracy of testing by placing electronic components in the correct position and prevents damage to electronic components due to separation.

[0008] According to one aspect of the present invention, an electronic component testing processor is provided, comprising: a first tray for placing a plurality of electronic components; a transfer hand including a plurality of pickups arranged along the x-axis for transferring the plurality of electronic components placed on the first tray to a second tray; a capturing unit for acquiring image information by capturing images of the plurality of pickups; and a control unit that, based on the image information, acquires a first pickup x-coordinate as the x-axis coordinate of each of the plurality of pickups when the transfer hand is placed on the first tray position. The control unit, when the transfer hand is placed on the first tray position, calculates a first reference x-coordinate as a preset x-axis coordinate of each of the plurality of pickups and a first x-coordinate deviation value of each of the plurality of pickups corresponding to the first reference x-coordinate as the difference between the first pickup x-coordinates; and, when a first maximum x-deviation value having the maximum value among the plurality of first x-coordinate deviation values ​​is less than a preset x-critical value, controls the transfer hand to grasp the plurality of electronic components from the first tray after moving the first minimum x-deviation value having the minimum value among the plurality of first x-coordinate deviation values ​​and a first average x-deviation value being the average of the first maximum x-deviation value to one side of the x-axis.

[0009] Furthermore, an electronic component test processor can be provided in which at least a portion of the plurality of pickups are arranged along the y-axis direction; the control unit, based on the image information, when the conveyor is placed at the first tray position, acquires a first pickup y-coordinate as the y-axis coordinate of each of the plurality of pickups; when the conveyor is placed at the first tray position, calculates a first reference y-coordinate as a preset y-axis coordinate of each of the plurality of pickups and a first y-coordinate deviation value of each of the plurality of pickups corresponding to the first reference y-coordinate as the difference of the first pickup y-coordinate; when a first maximum y-deviation value having the maximum value among the plurality of first y-coordinate deviation values ​​is less than or equal to a preset y-critical value, the conveyor moves to one side in the y-axis direction by the first minimum y-deviation value having the minimum value among the plurality of first y-coordinate deviation values ​​and the first average y-deviation value as the average of the first maximum y-deviation value, and then controls the conveyor to grasp the plurality of electronic components from the second tray.

[0010] Furthermore, a control unit can be provided that, when the conveyor is placed on the second tray position on the second tray, acquires a second pickup x-coordinate as the x-axis coordinate of each of the plurality of pickups; when the conveyor is placed on the second tray position, calculates a second reference x-coordinate as a preset x-axis coordinate of each of the plurality of pickups and a second x-coordinate deviation value of each of the plurality of pickups corresponding to the second reference x-coordinate as the difference between the second pickup x-coordinate; calculates an x-correction value as the difference between the first x-coordinate deviation value and the second x-coordinate deviation value of each of the plurality of pickups, and calculates an x-correction value as the average of the maximum and minimum values ​​of the plurality of x-correction values; after the conveyor moves the first average x-deviation value to one side in the x-axis direction and moves the average x-correction value to the other side in the x-axis direction, controls the conveyor to place the plurality of electronic components on the electronic component test processor on the second tray.

[0011] Furthermore, a control unit can be provided that, when one or more of the plurality of first x-coordinate deviation values ​​exceed the x-critical value, controls the conveyor to place the plurality of pickups at a position separated from the first pickups by other average x-deviation values, and controls the conveyor to place one or more pickups exceeding the x-critical value onto one or more of the plurality of electronic components; the other average x-deviation value is the average of the maximum and minimum x-deviation values ​​of the remaining pickups other than the one or more pickups exceeding the x-critical value in the electronic component test processor.

[0012] Furthermore, a control unit can be provided that, when the conveyor is placed on the second tray position on the second tray, acquires the second pickup x-coordinate as the x-axis coordinate of each of the plurality of pickups; when the conveyor is placed on the second tray position, calculates the second reference x-coordinate of each of the plurality of pickups as a preset x-axis coordinate and the second x-coordinate deviation value of each of the plurality of pickups as the difference of the second pickup x-coordinate corresponding to the second reference x-coordinate; calculates the offset x-correction value as the difference between the first x-coordinate deviation value and the second x-coordinate deviation value of the one or more pickups; after the conveyor moves the other average x-deviation value to one side of the x-axis direction and moves the offset x-correction value to the other side of the x-axis direction, controls the conveyor to cause one or more pickups exceeding the x-critical value to place the one or more electronic components on the second tray as an electronic component test processor.

[0013] Furthermore, an electronic component testing processor control method can be provided, comprising: an image acquisition step of acquiring image information by capturing images from multiple pickups; a first pickup x-coordinate acquisition step of acquiring first pickup x-coordinates as x-axis coordinates of each of the multiple pickups when the conveyor is located at a first tray position on a first tray based on the image information; a first x-coordinate deviation value calculation step of calculating first reference x-coordinates as preset x-axis coordinates of each of the multiple pickups and first x-coordinate deviation values ​​of each of the multiple pickups corresponding to the first reference x-coordinates as differences in the first pickup x-coordinates when the conveyor is placed at the first tray position; a determination step of determining whether a first maximum x-deviation value having the maximum value among the multiple first x-coordinate deviation values ​​exceeds a preset x-critical value; and a first movement step of moving the conveyor to one side in the x-axis direction when it is determined that the first maximum x-deviation value is less than or equal to the x-critical value, moving the conveyor to the first minimum x-deviation value having the minimum value among the multiple first x-coordinate deviation values ​​and a first average x-deviation value being the average of the first minimum x-deviation value.

[0014] Furthermore, an electronic component testing processor control method can be provided, comprising: a first pickup y-coordinate acquisition step, based on the image information, when the conveyor is placed at the first tray position, acquiring a first pickup y-coordinate as the y-axis coordinate of each of the plurality of pickups; a first y-coordinate deviation value calculation step, when the conveyor is placed at the first tray position, calculating a first reference y-coordinate as the preset y-axis coordinate of each of the plurality of pickups and a first y-coordinate deviation value of each of the plurality of pickups corresponding to the first reference y-coordinate as the difference of the first pickup y-coordinate; a determination step, determining whether a first maximum y-coordinate deviation value having the maximum value among the plurality of first y-coordinate deviation values ​​exceeds a preset y-critical value; and a second movement step, when the first maximum y-coordinate deviation value is less than or equal to the y-critical value, moving the conveyor to one side in the y-axis direction by a first minimum y-coordinate deviation value having the minimum value among the plurality of first y-coordinate deviation values ​​and a first average y-coordinate deviation value being the average of the first minimum y-coordinate deviation value.

[0015] Furthermore, an electronic component testing processor control method may be provided, which includes a second pickup x-coordinate acquisition step, which acquires the second pickup x-coordinate as the x-axis coordinate of each of the plurality of pickups when the conveyor is placed on the second tray position; a second x-coordinate deviation value calculation step, which calculates the second reference x-coordinate as the preset x-axis coordinate of each of the plurality of pickups and the second x-coordinate deviation value of each of the plurality of pickups corresponding to the second reference x-coordinate as the difference of the second pickup x-coordinate; an average x-correction value calculation step, which calculates the x-correction value as the difference between the first x-coordinate deviation value and the second x-coordinate deviation value of each of the plurality of pickups, and calculates the average x-correction value as the average of the maximum and minimum values ​​of the plurality of x-correction values; and a second movement step, which moves the conveyor placed on the second tray to one side in the x-axis direction by the first average x-deviation value and to the other side in the x-axis direction by the average x-correction value.

[0016] Furthermore, an electronic component testing processor control method may be provided, which includes a step of calculating an average x-deviation value, which is the average of the maximum and minimum x-deviation values ​​of the remaining pickups other than one or more pickups that exceed the x-critical value, based on the first x-coordinate deviation value among the plurality of pickups; and a first sequential movement step, which, when one or more of the plurality of first x-coordinate deviation values ​​exceed the x-critical value, moves the plurality of pickups to a position spaced from the first pickup x-coordinate of the other average x-deviation value, and moves the conveyor to place the one or more pickups on one or more of the plurality of electronic components.

[0017] Furthermore, an electronic component testing processor control method may be provided, which includes a second pickup x-coordinate acquisition step, which acquires the second pickup x-coordinate as the x-axis coordinate of each of the plurality of pickups when the conveyor is placed on the second tray position on the second tray; a second x-coordinate deviation value calculation step, which calculates the second reference x-coordinate as the preset x-axis coordinate of each of the plurality of pickups and the second x-coordinate deviation value of each of the plurality of pickups corresponding to the second reference x-coordinate as the difference between the second reference x-coordinate and the second pickup x-coordinate; an offset x-coordinate deviation value calculation step, which calculates the offset x-correction value as the difference between the first x-coordinate deviation value and the second x-coordinate deviation value of the one or more pickups; and a second sequential movement step, which includes an average value movement step of moving the conveyor in the x-axis direction to move the other average x-coordinate value and an offset correction value movement step of moving the offset x-correction value to the other side in the x-axis direction.

[0018] Beneficial effects

[0019] One embodiment of the present invention has the effect of accurately holding electronic components or placing the held electronic components in the correct position on the first tray, even if there is an error in the spacing between multiple pickups.

[0020] In addition, one embodiment of the present invention has the effect of improving the accuracy of testing by placing the electronic components in the correct position, and preventing damage to the electronic components due to their separation. Attached Figure Description

[0021] Figure 1 A conceptual diagram illustrating an electronic component test processor according to an embodiment of the present invention;

[0022] Figure 2 To illustrate Figure 1 A diagram showing the relationship between the conveyor and electronic components;

[0023] Figure 3 To show Figure 2 A diagram showing the state when the intervals of multiple pickups are adjusted;

[0024] Figure 4 To show Figure 1 A diagram showing the status of multiple pickups set on multiple electronic components;

[0025] Figure 5 To show Figure 4 A diagram showing the state of the conveyor moving along the x-axis in the direction of the first average x-deviation value;

[0026] Figure 6 To show Figure 5 A diagram showing the state of adjusting the spacing between multiple pickups while they are holding electronic components.

[0027] Figure 7 To show Figure 6 A diagram showing the state of the transmitter moving the first average x-deviation value;

[0028] Figure 8 To show Figure 7 A graph showing the state of the moving average x-correction value of the transmitter;

[0029] Figure 9 The flowchart illustrates, in sequence, a control method for an electronic component test processor according to an embodiment of the present invention. Detailed Implementation

[0030] The specific embodiments for realizing the technical concept of the present invention will now be described in detail with reference to the accompanying drawings.

[0031] Furthermore, when describing the present invention, if it is determined that a detailed description of the relevant known structures or functions may obscure the essence of the present invention, such detailed description will be omitted.

[0032] Furthermore, when it is mentioned that a certain constituent element is "connected" or "held" by other constituent elements, although it can be directly connected to and held by other constituent elements, it should be understood that there may be other constituent elements in between.

[0033] The terminology used in this specification is for illustrative purposes only and is not intended to limit the invention. Unless the singular expression is clearly distinguishable in the context, it includes multiple expressions.

[0034] Furthermore, although terms such as first, third, etc., which include ordinal numbers, can be used to describe various constituent elements,

[0035] However, the corresponding constituent elements are not limited to these terms. These terms are only used to distinguish one constituent element from another.

[0036] The word "including" as used in the specification means to specify a particular characteristic, domain, positive number, step, action, element and / or component, without excluding the existence or addition of other specific characteristics, domains, positive numbers, steps, actions, elements, components and / or groups.

[0037] Furthermore, the descriptions of "top," "bottom," etc., in this specification are based on the illustrations shown on the drawing. If the orientation of the object changes, the difference in description will be indicated in advance. On the other hand, the x-axis and y-axis directions in this specification refer to... Figures 4 to 8 The directions in which the x-axis and y-axis extend.

[0038] See below. Figure 1 According to an embodiment of the present invention, an electronic component test processor (1) can electrically connect electronic components (2) manufactured through a prescribed manufacturing process to a tester and then classify the electronic components (2) according to the test results. For example, the electronic component (2) can be a semiconductor device. Furthermore, the electronic component test processor (1) can be manufactured in various forms to be optimized for the type of electronic component (2) to be tested. Such an electronic component test processor (1) can be combined with a tester (3) capable of testing electronic components (2), and the electronic component 2 can be electrically connected to the tester 3. Such an electronic component test processor (1) can include a frame (10), a stacker (20), a group base (30), a conveyor (40), a shooting unit (50), a first tray (60), a tester (70), a transfer (80), a control unit (90), and a mover (100).

[0039] The frame (10) can support the stacker (20), the assembly base (30), the conveyor (40), the shooting unit (50), the first tray (60), the test hand (70), the ferry (80), the control unit (90), and the movement.

[0040] The frame (100) loads a second tray (CT) and provides transfer space. Such a frame (10) may include a repeater (not shown) capable of transferring the second tray (CT) from the stacker (20) to the group base (30). In this specification, the second tray (CT) may be referred to as the customer tray (CT).

[0041] The stacker (20) can hold a second tray (CT) loaded with electronic components. Such a stacker (20) can be supported on a frame (10). Furthermore, the second tray (CT) loaded in the stacker (20) can be transferred to the group base (30) via a repeater, and the second tray (CT) can be transferred back to the stacker (20) from the group base (30). Such a stacker (20) can be positioned below the group base (30).

[0042] The assembly base (30) can support the second tray (CT) conveyed by the stacker (20). Such an assembly base (30) can be formed with an opening (not shown) for exposing the second tray (CT) loaded with electronic components (2) toward the conveyor (40). When the second tray (CT) loaded with electronic components (2) is located inside such an opening, the electronic components (2) can be conveyed from the second tray (CT) to the first tray (60) by the conveyor (40).

[0043] See Figure 2 and Figure 3 The conveyor (40) can transfer electronic components (2) loaded on the second tray (CT) to the first tray (60). For example, the conveyor (40) can be supported and moved by a conveyor track (not shown) while conveying multiple electronic components (2). In addition, the hand body (41) can move from either the first tray position or the second tray position to the other position. In this specification, the first tray position is the position when the conveyor (40) is placed on the first tray (60), and the second tray position is the position when the conveyor (40) is placed on the second tray (CT). Such a conveyor (40) may include a hand body (41), a pickup (42), and a drive motor (43).

[0044] The hand body (41) can support multiple pickups (42). Such a hand body (41) can move in one or more directions, including the x-axis and y-axis, via a drive motor (43). Furthermore, the spacing between the multiple pickups (42) can be adjusted. For example, the hand body (41) can be equipped with a cam and cam follower driven by the drive motor (43). The spacing between the multiple pickups (42) can be adjusted by such a cam and cam follower.

[0045] The pickup (42) can transfer multiple electronic components (2) from either the second tray (CT) or the first tray (60) to the other. For example, the pickup (42) can hold an electronic component (2) placed on the second tray (CT) and can place the held electronic component (2) on the first tray (60). Multiple such pickups (42) can be provided, and multiple pickups (42) can hold multiple electronic components (2) simultaneously or individually. Such multiple pickups (42) may include a first pickup (42a), a second pickup (42b), a third pickup (42c), and a fourth pickup (42d). However, this specification describes multiple pickups (42) as being provided in four, but this is only an example and any number can be provided.

[0046] On the other hand, the multiple pickups (42) can be configured to adjust the spacing between them. For example, the multiple pickups (42) can adjust the spacing between the multiple electronic accessories (2) as they transfer multiple electronic accessories (2) from one of the second tray (CT) and the first tray (60) to the other. The spacing between such multiple pickups (42) can be wider in the second tray position than in the first tray position. This is because the spacing between the pockets in the first tray (60) where the electronic accessories (2) are placed is wider than the spacing between the pockets (not shown) in the second tray (CT) where the electronic accessories (2) are placed. Therefore, the spacing between the multiple pickups (42) can narrow when the transfer hand (40) moves from the first tray position to the second tray position. On the other hand, the spacing between the multiple pickups (42) may have different spacings due to assembly and manufacturing tolerances.

[0047] The imaging unit (50) can acquire image information by photographing the conveyor (40). The image information may include images of the hand body (41) and multiple pickups (42) captured by the imaging unit (50). Furthermore, the image information acquired by the imaging unit (50) can be transmitted to the control unit (90). For example, the imaging unit (50) may be a camera and may photograph the bottom surface of the conveyor (40). Multiple such imaging units (50) may be provided. Furthermore, any one of the multiple imaging units (50) may be positioned adjacent to the first tray (60) and acquire first image information by photographing the conveyor (40) placed at the first tray position. Additionally, another of the multiple imaging units (50) may be positioned adjacent to the second tray (CT) and acquire second image information by photographing the conveyor (40) placed at the second tray position.

[0048] The first tray (60) can transfer electronic components (2) received from the conveyor (40) via a transfer (80). Multiple pockets (not shown) can be formed in this first tray (60) to hold multiple electronic components. Furthermore, the first tray (60) can move back and forth between the conveyor (40) and the test location (TP). The test location (TP) refers to the area where the electronic component (2) is electrically connected to the tester (3). This first tray (60) can be loaded with electronic components and may be referred to as a transfer table or test tray.

[0049] The tester (70) can transfer the electronic component (2) placed on the transfer station (80) to the test location (TP) and load the electronic component (2) to be tested into the test socket (3a) of the tester (3). The test socket (3a) is the part of the tester (3) that cannot hold the electronic component (2). When the tester (70) places the electronic component (2) into the test socket (3a), the test socket (3a) can be placed on the test location (TP). On the other hand, the tester (70) can remove the tested electronic component (2) from the test socket (3a) and transfer it to the transfer station (80).

[0050] The transfer (80) can transport electronic components received from the first tray (60) to the test location (TP). In addition, the transfer (80) can transport electronic components that have completed testing to the mover (100). Multiple spaces (not shown) can be formed in such a transfer (80) to accommodate multiple electronic components.

[0051] The control unit (90) can control the operation of the conveyor (40), the imaging unit (50), the first tray (60), the test hand (70), the ferry (80), and the mover (100). Such a control unit (90) can be implemented by a computing device including a microprocessor, a measuring device such as a sensor, and a memory. Its implementation is obvious to those skilled in the art, and therefore further detailed description will be omitted.

[0052] The mover (100) can receive tested electronic components from the transfer station (80). This mover (100) can simultaneously classify the tested electronic components according to the test results and transfer them to the second tray (CT). The mover (100) can move along... Figure 1 Move in the direction indicated by the arrow.

[0053] On the other hand, when the interval between the multiple pickups (42) is adjusted, the control unit (90) can adjust the position of the conveyor (40) so that the multiple pickups (42) stably hold or release the electronic accessory (2). In the following, the control for adjusting the position of the conveyor (40) when the control unit (90) causes the multiple pickups (42) to hold or release the electronic accessory (2) will be described.

[0054] See you again Figure 2 In this specification, the coordinates of each of the multiple electronic components (2) placed in the first correct position (RP1) of the first tray (60) are defined as the preset first reference x-coordinate and first reference y-coordinate. Furthermore, when multiple pickups (42) are placed on the upper side of the first correct position (RP1), the coordinates of each of the multiple pickups (42) can also be defined as the first reference x-coordinate and first reference y-coordinate. The first reference x-coordinate is the x-axis coordinate, and the first reference y-coordinate is the y-axis coordinate.

[0055] See Figure 3 In this specification, the coordinates of the multiple electronic components (2) placed in the second correct position (RP2) of the second tray (CT) are defined as preset second reference x-coordinates and second reference y-coordinates. Furthermore, when the multiple pickups (42) are respectively placed on the upper side of the second correct position (RP2), the coordinates of the multiple pickups (42) can also be defined as second reference x-coordinates and second reference y-coordinates. The second reference x-coordinate is the x-axis coordinate, and the second reference y-coordinate is the y-axis coordinate.

[0056] On the other hand, when the conveyor (40) is placed in the first tray position, the control unit (90) can obtain the coordinates of each of the multiple pickups (42) based on the first image information captured by the imaging unit (50). In this specification, the x-axis coordinate of the multiple pickups (42) obtained when the conveyor (40) is placed in the first tray position is defined as the x-coordinate of the first pickup, and the y-axis coordinate is defined as the x-coordinate of the first pickup.

[0057] Furthermore, when the conveyor (40) is placed in the second tray position, the control unit (90) can obtain the coordinates of each of the multiple pickups (42) based on the second image information captured by the imaging unit (50). In this specification, the x-axis coordinates of the multiple pickups (42) obtained when the conveyor (40) is placed in the second tray position are defined as the x-coordinates of the second pickups, and the y-axis coordinates are defined as the x-coordinates of the second pickups.

[0058] See Figure 4 The control unit (90) can calculate the first x-coordinate deviation value by the difference between the first reference x-coordinate of each of the multiple pickups (42) and the first pickup x-coordinate. For example, the first x-coordinate deviation value of the first pickup (42a) is -1, and the first x-coordinate deviation value of the second pickup (42b) is 0. Furthermore, the first x-coordinate deviation value of the third pickup (42c) is 4, and the first x-coordinate deviation value of the fourth pickup (42d) is 3. On the other hand, in Figure 4 In this case, the grid value is 2. Furthermore, the control unit (90) can calculate the first y-coordinate deviation value by the difference between the first reference y-coordinate of each of the multiple pickups (42) and the first pickup y-coordinate.

[0059] When the first maximum x-deviation value, which has the largest value among multiple first x-coordinate deviation values, is less than or equal to a preset x-critical value, the control unit (90) can calculate a first average x-deviation value. The first average x-deviation value can be the average between the first minimum x-deviation value, which has the smallest value among multiple first x-coordinate deviation values, and the first maximum x-deviation value. For example, the x-critical value can be 6. In this case, since the first maximum x-deviation value (4 of the third pickup (42c)) is less than or equal to the x-critical value, the control unit (90) calculates the first average x-deviation value 1.5 by averaging the first minimum x-deviation value -1 and the first maximum x-deviation value 4.

[0060] Furthermore, when the first maximum y-deviation value, which has the largest value among the multiple first y-coordinate deviation values, is less than or equal to a preset y-critical value, the control unit (90) can calculate a first average y-deviation value. The first average y-deviation value can be the average value between the first minimum y-deviation value and the first maximum y-deviation value, which have the smallest value among the multiple first y-coordinate deviation values.

[0061] See Figure 5 The control unit (90) can control the conveyor (40) to move the conveyor (40) to one side in the x-axis direction by a first average x-deviation value. Furthermore, the control unit (90) can control the conveyor (40) to move the conveyor (40) to one side in the y-axis direction by a first average y-deviation value. When the conveyor (40) moves by a first average x-deviation value in the x-axis direction and by a first average y-deviation value in the y-axis direction, the control unit (90) can control multiple pickups (42) to hold the electronic component (2).

[0062] See Figure 6 When the conveyor (40) holds multiple electronic components (2), the control unit (90) can move the conveyor (40) so that the conveyor (40) is placed in the second tray position. In addition, during the movement of the conveyor (40), the control unit (90) can control the conveyor (40) so that the multiple pickers (42) shorten the interval between each other while holding multiple electronic components (2).

[0063] The control unit (90) can calculate the second x-coordinate deviation value by the difference between each second reference x-coordinate of the plurality of pickups (42) and the acquired second pickup x-coordinate. For example, the second x-coordinate deviation value of the first pickup (42a) is -5, and the second x-coordinate deviation value of the second pickup (42b) is 0. Furthermore, the second x-coordinate deviation value of the third pickup (42c) is 1, and the second x-coordinate deviation value of the fourth pickup (42d) is 2. In addition, the control unit (90) can calculate the second y-coordinate deviation value by the difference between each second reference y-coordinate of the plurality of pickups (42) and the second pickup y-coordinate.

[0064] Furthermore, the control unit (90) can calculate the x-correction value by the difference between the first coordinate x-deviation value and the second coordinate x-deviation value of each of the multiple pickups (42). For example, the x-correction value of the first pickup (42a) is -4, and the x-correction value of the second pickup (42b) is 0. In addition, the x-correction value of the third pickup (42c) is -3, and the x-correction value of the fourth pickup (42d) is -1.

[0065] In this case, the control unit (90) can calculate the average x-correction value, which is the average of the maximum and minimum values ​​among multiple x-correction values. The average x-correction value can be -2. Furthermore, the control unit (90) can calculate the y-correction value, which is the difference between the first y-coordinate deviation value and the second y-coordinate deviation value corresponding to the multiple pickups (42). Such a control unit (90) can calculate the average y-correction value based on multiple y-correction values.

[0066] Then, the control unit (90) moves the conveyor (40) to one side in the x-axis direction by the first average x-deviation value (see...). Figure 7 ), causing the conveyor (40) to move the average x-correction value to the other side of the x-axis direction (see Figure 8 Furthermore, the control unit (90) can move the conveyor (40) to one side of the y-axis direction by a first average y-deviation value, and move the conveyor (40) to the other side of the y-axis direction by an average y-correction value. When the conveyor (40) moves the average x-correction value and the average y-correction value along the x-axis and y-axis respectively, the control unit (90) can place multiple electronic components (2) on the second tray (CT).

[0067] In this way, even if errors occur in the spacing between the multiple pickups (42) by adjusting the spacing between them, the control unit (90) can move the transport hand (40) by correction. Therefore, the phenomenon of multiple pickups (42) missing multiple electronic accessories (2) is minimized, and the phenomenon of multiple pickups (42) being separated from their correct positions on the first tray (60) or the second tray (CT) can be prevented.

[0068] On the other hand, when one or more of the multiple first x-coordinate deviation values ​​exceed the x-critical value, the control unit (90) can calculate other average x-deviations of the pickups (42) other than the one or more pickups (42) that exceed the x-critical value. For example, when the first x-coordinate deviation value of the fourth pickup (42d) exceeds the x-critical value, the control unit (90) calculates other average x-deviation values ​​by controlling the average of the maximum and minimum x-coordinate deviation values ​​among the first pickup (42a), the second pickup (42b), and the third pickup (42c). In this case, after the control unit (90) moves one or more pickups (42) that exceed the x-critical value to one or more electronic components (2) among the multiple electronic components (2), it controls the conveyor (40) to hold one or more electronic components (2). In addition, the control unit (90) can move the remaining pickups (42) that do not exceed the x-critical value to a position from the first pickup x-coordinate interval to other average x-deviation values, and then control the conveyor (40) to hold the electronic components (2).

[0069] Furthermore, when the conveyor (40) moves to the second tray position while holding the electronic component (2), the control unit (90) can acquire the second pickup x-coordinate of each of the multiple pickups (42) and calculate the second x-coordinate deviation value. Such a control unit (90) can calculate the offset x-correction value by subtracting the first x-coordinate deviation value and the second x-coordinate deviation value of one or more pickups (42) that exceed the threshold value. In this case, after the control unit (90) moves the conveyor (40) placed at the second tray position to one side of the x-axis direction by other average x-deviation values ​​and to the other side of the x-axis direction by offset x-correction values, it can control the conveyor (40) to place one or more electronic components (2) on the second tray (CT) by one or more pickups (42) that exceed the x-threshold value.

[0070] When one or more of the multiple first y-coordinate deviation values ​​exceed the y-critical value, the control unit (90) can calculate other average y-deviation values ​​for the remaining pickups (42) other than the one or more pickups (42) that exceed the y-critical value. For example, the control unit (90) can calculate other average y-deviation values ​​by averaging the maximum and minimum y-deviation values ​​of the one or more pickups (42) that exceed the y-critical value. In this case, after one or more pickups (42) that exceed the y-critical value move to one or more electronic components (2) among the multiple electronic components (2), the control unit (90) can control the conveyor (40) to hold one or more electronic components (2). Furthermore, the control unit (90) can control the conveyor (40) to hold one or more electronic components (2) after moving the remaining pickups (42) that do not exceed the y-critical value to a position that is spaced apart from the first pickup's y-coordinate by other average y-deviation values.

[0071] In addition, the control unit (90) can calculate the offset y correction value by subtracting the first y coordinate deviation value and the second y coordinate deviation value of one or more pickups (42) that exceed the y threshold value.

[0072] In this specification, the control unit (90) has been described for correcting the gap between electronic components during the transfer of electronic components from the first tray (60) to the second tray (CT), but the same control can also be applied to the transfer of electronic components from the second tray (CT) to the first tray (60). Furthermore, although the correction of the gap between electronic components between the first tray (60) and the second tray (CT) has been described, the correction control can also be applied to the process of correcting the gap between electronic components between the first tray (60) and the transfer (80).

[0073] Thus, even if errors occur in the intervals between the multiple pickups (42), the electronic component testing processor (1) according to an embodiment of the present invention can accurately hold multiple electronic components (2) by correcting them. In addition, it also has the effect of placing the multiple electronic components (2) to be held in the correct position on the first tray (60).

[0074] Furthermore, even though the spacing of the electronic component placement spaces formed in the first tray (60) and the second tray (CT) are different, the electronic component test processor (1) has the effect of placing the electronic component (2) in the correct position by controlling the spacing between the pickers (42).

[0075] In the following text, refer to Figure 9 An electronic component test processor control method (S10) for controlling an electronic component test processor (1) according to an embodiment of the present invention will be described.

[0076] An electronic component test processor control method (S10) supports the testing of electronic components (2) by controlling an electronic component test processor (1). Such an electronic component test processor control method (S10) may include an image acquisition step (S100), a first coordinate acquisition step (S200), a first deviation value calculation step (S300), a judgment step (S400), a first movement step (S500), a second coordinate acquisition step (S600), a second deviation value calculation step (S700), an average correction value calculation step (S800), a second movement step (S900), other average deviation value calculation steps (S1000), a first sequential movement step (S1100), an offset deviation value calculation step (S1200), and a second sequential movement step (S1300).

[0077] The image acquisition step (S100) can acquire image information by capturing multiple pickups (42) through the shooting unit (50). Such an image acquisition step (S100) can acquire first image information by capturing the conveyor (40) placed on the first tray, and acquire second image information by capturing the conveyor (40) placed on the second tray.

[0078] The first coordinate acquisition step (S200) may include a first picker x coordinate acquisition step (S210) and a first picker y coordinate acquisition step (S220).

[0079] In the first pickup x-coordinate acquisition step (S210), based on the image information, the first pickup x-coordinate of each of the multiple pickups placed on the first tray can be acquired.

[0080] In the first pickup y-coordinate acquisition step (S220), based on the image information, the first pickup y-coordinate of each of the multiple pickups placed on the first tray can be acquired.

[0081] The first deviation value calculation step (S300) may include the first x-coordinate deviation value calculation step (S310) and the first y-coordinate deviation value calculation step (S320).

[0082] In the first x-coordinate deviation value calculation step (S310), based on the first reference x-coordinate and the first pickup x-coordinate, the first x-coordinate deviation value of each of the multiple pickups (42) can be calculated. In addition, in the first x-coordinate deviation value calculation step (S310), the first average x-coordinate deviation value can be calculated by averaging the first minimum x-coordinate deviation value and the first x-coordinate deviation value.

[0083] In the first y-coordinate deviation calculation step (S320), based on the first reference y-coordinate and the first pickup y-coordinate, the first y-coordinate deviation value of each of the multiple pickups (42) can be calculated. In addition, in the first y-coordinate deviation calculation step (S320), the first average y-coordinate deviation value can be calculated by averaging the first minimum y-coordinate deviation value and the first y-coordinate deviation value.

[0084] In the judgment step (S400), it can be determined whether the first maximum x-deviation value, which has the largest value among the multiple first x-coordinate deviation values ​​calculated in the first deviation value calculation step (S300), exceeds the x-critical value. Furthermore, it can be determined whether the first maximum y-deviation value, which has the largest value among the multiple first y-coordinate deviation values, exceeds the y-critical value.

[0085] The first movement step (S500) can move the conveyor (40) placed on the first tray. This first movement step (S500) can be performed before the conveyor (40) grasps the electronic component (2). The first movement step (S500) can include a first movement step (S510) and a second movement step (S520).

[0086] In the first moving step (S510), when the first maximum x deviation value is less than or equal to the x critical value, the conveyor (40) can move the first average x deviation value in the x-axis direction.

[0087] In the second moving step (S520), when the first maximum y deviation value is equal to or less than the y critical value, the conveyor (40) can move the first average y deviation value in the y-axis direction.

[0088] The second coordinate acquisition step (S200) may include a second picker x-coordinate acquisition step (S610) and a second picker y-coordinate acquisition step (S620).

[0089] In the second pickup x-coordinate acquisition step (S610), the second pickup x-coordinate of each of the multiple pickups (42) placed on the second tray position can be obtained based on the second image information.

[0090] In the second pickup y-coordinate acquisition step (S620), the second pickup y-coordinate of each of the multiple pickups (42) placed on the second tray position can be obtained based on the second image information.

[0091] The second deviation value calculation step (S700) may include the second x-coordinate deviation value calculation step (S710) and the second y-coordinate deviation value calculation step (S720).

[0092] In the second x-coordinate deviation value calculation step (S710), the second x-coordinate deviation value of each of the multiple pickups (42) can be calculated based on the second reference x-coordinate and the second pickup x-coordinate.

[0093] In the second y-coordinate deviation value calculation step (S720), the second y-coordinate deviation value of each of the multiple pickups (42) can be calculated based on the second reference y-coordinate and the second pickup y-coordinate.

[0094] The step of calculating the average correction value (S800) may include the step of calculating the average x correction value (810) and the step of calculating the average y correction value (S820).

[0095] In the average x-correction value calculation step (S810), the x-correction value, which is the difference between the first x-coordinate deviation value and the second x-coordinate deviation value of each of the plurality of pickups (42), can be calculated. In addition, the average x-correction value, which is the average of the maximum and minimum x-correction values ​​calculated in the average x-correction value calculation step (S810), can be calculated.

[0096] In the average y-correction value calculation step (S820), the y-correction value, which is the difference between the first y-coordinate deviation value and the second y-coordinate deviation value of each of the plurality of pickups (42), can be calculated. In addition, the average y-correction value, which is the average of the maximum and minimum y-correction values ​​calculated in the average y-correction value calculation step (S820), can be calculated.

[0097] In the second moving step (S900), the conveyor (40) placed at the second tray position is moved to one side of the x-axis direction by a first average x-deviation value, and can also be moved to the other side of the x-axis direction by an average x-correction value. Furthermore, in the second moving step (S900), the conveyor (40) can move to one side of the y-axis direction by a first average y-deviation value, and can also move only the average y-correction value to the other side of the y-axis direction.

[0098] On the other hand, the other average deviation value calculation step (S1000) may include the other average x deviation value calculation step (S1010) and the other average y deviation value calculation step (S1020).

[0099] In the step of calculating other average x-deviation values ​​(S1010), when the first maximum x-deviation value exceeds the x-critical value, other average x-deviation values ​​of the remaining pickups (42) other than one or more pickups whose first x-coordinate deviation value exceeds the x-critical value can be calculated. Among them, the other average x-deviation values ​​are the average of the maximum x-deviation value and the minimum x-deviation value among the first x-coordinate deviation values ​​of the remaining pickups (42).

[0100] In the step of calculating other average y-deviation values ​​(S1020), when the first maximum y-deviation value exceeds the y-critical value, other average y-deviation values ​​of the remaining pickups (42), excluding one or more pickups whose first y-coordinate deviation values ​​exceed the y-critical value, can be calculated. These other average y-deviation values ​​are the average of the maximum and minimum y-deviation values ​​among the first y-coordinate deviation values ​​of the remaining pickups (42).

[0101] In the first sequential movement step (S1100), when one or more of the multiple first x-coordinate deviation values ​​exceed one or more x-critical values, the conveyor (40) can be moved to one side in the x-axis direction by other average x-deviation values. Similarly, when one or more of the multiple first y-coordinate deviation values ​​exceed a y-critical value, the conveyor (40) can be moved to one side in the y-axis direction by other average y-deviation values. On the other hand, in the first sequential movement step (S1100), by moving the conveyor (40), one or more pickups (42) exceeding one or more of the x-critical and y-critical values ​​are placed on a portion of the multiple electronic components (2). That is, even if the pickup (42) exceeding the critical value is moved by an average x-deviation value or an average y-deviation value, it cannot hold the electronic component (2). Therefore, the control unit (90) further controls the conveyor (40) to make the pickup (42) exceeding the critical value hold the electronic component (2).

[0102] The step of calculating the offset deviation value (S1200) may include the step of calculating the offset x deviation value (S1210) and the step of calculating the offset y deviation value (S1220).

[0103] In the step of calculating the offset x-deviation value (S1210), the offset x-correction value can be calculated by subtracting the first x-coordinate deviation value and the second x-coordinate deviation value of one or more pickers (42) whose first x-coordinate deviation value exceeds the x-critical value.

[0104] In the offset y-deviation value calculation step (S1220), the offset y-correction value can be calculated by subtracting the first y-coordinate deviation value and the second y-coordinate deviation value of one or more pickers (42) whose first y-coordinate deviation value exceeds the y-critical value.

[0105] The second sequential shift step (S1300) may include an average value shift step (S1310) and an offset correction value shift step (S1320).

[0106] In other average value shifting steps (S1310), the conveyor (40) can be moved to one side of the x-axis direction with other average x-deviation values, and the conveyor (40) can be moved to one side of the y-axis direction with other average y-deviation values.

[0107] In the offset correction value moving step (S1320), the conveyor (40) can be moved to the other side of the x-axis direction with an offset x correction value, and the conveyor (40) can be moved to the other side of the y-axis direction with an offset y correction value.

[0108] Although embodiments of the invention have been described as specific examples, these are merely illustrative and the invention is not limited thereto, and should be construed as having the broadest scope of the technical ideas disclosed herein. Those skilled in the art can implement patterns of unspecified shapes by combining / substituting the disclosed embodiments, without departing from the scope of the invention. Furthermore, those skilled in the art can readily make changes or modifications to the disclosed embodiments based on this specification, and such changes or modifications are obviously also within the scope of the invention.

Claims

1. An electronic accessory test handler, comprising: comprises: a first tray for placing a plurality of electronic components; a transfer hand including a plurality of pickers arranged in an x-axis direction, which transfers the plurality of electronic components placed on the first tray to a second tray; a photographing unit which acquires image information by photographing the plurality of pickers; and a control section which, based on the image information, acquires first picker x coordinates as x-axis coordinates of the plurality of pickers when the transfer hand is placed at a first tray position on the first tray, the control section, calculates first reference x coordinates as preset x-axis coordinates of the plurality of pickers and first x coordinate deviation values of the plurality of pickers corresponding to differences from the first reference x coordinates as the first picker x coordinates when the transfer hand is placed at the first tray position, controls the transfer hand to grip the plurality of electronic components from the first tray after moving the transfer hand to one side in the x-axis direction by a first minimum x deviation value, which is a minimum value among the first x coordinate deviation values, and a first average x deviation value, which is an average value of the first maximum x deviation value, when a first maximum x deviation value, which is a maximum value among the plurality of first x coordinate deviation values, is less than a preset x critical value. at least a part of the plurality of pickers is arranged in a y-axis direction; the control section, acquires first picker y coordinates as y-axis coordinates of the plurality of pickers when the transfer hand is placed at the first tray position based on the image information, calculates first reference y coordinates as preset y-axis coordinates of the plurality of pickers and first y coordinate deviation values of the plurality of pickers corresponding to differences from the first reference y coordinates as the first picker y coordinates when the transfer hand is placed at the first tray position, controls the transfer hand to grip the plurality of electronic components from the second tray after moving the transfer hand to one side in the y-axis direction by a first minimum y deviation value, which is a minimum value among the plurality of first y coordinate deviation values, and a first average y deviation value, which is an average value of the first maximum y deviation value, when a first maximum y deviation value, which is a maximum value among the plurality of first y coordinate deviation values, is less than or equal to a preset y critical value.

2. An electronic component test handler characterized by comprising: a first tray for placing a plurality of electronic components; a transfer hand including a plurality of pickers arranged in an x-axis direction, which transfers the plurality of electronic components placed on the first tray to a second tray; a photographing unit which acquires image information by photographing the plurality of pickers; and a control section which, based on the image information, acquires first picker x coordinates as x-axis coordinates of the plurality of pickers when the transfer hand is placed at a first tray position on the first tray, the control section, calculates first reference x coordinates as preset x-axis coordinates of the plurality of pickers and first x coordinate deviation values of the plurality of pickers corresponding to differences from the first reference x coordinates as the first picker x coordinates when the transfer hand is placed at the first tray position, ​ ​ when a first maximum x deviation value, which is a maximum value among the first x coordinate deviation values, is smaller than a preset x critical value, the transfer hand is moved to one side in the x axis direction by a first minimum x deviation value, which is a minimum value among the first x coordinate deviation values, and a first average x deviation value, which is an average value of the first maximum x deviation value, and then the transfer hand is controlled to grip the plurality of electronic components from the first tray; the control section, when the transfer hand is placed at a second tray position on the second tray, a second picker x coordinate, which is an x axis coordinate of each of the plurality of pickers, is acquired; when the transfer hand is placed at the second tray position, a second reference x coordinate, which is a preset x axis coordinate of each of the plurality of pickers, and a second x coordinate deviation value, which is a difference from the second reference x coordinate as the second picker x coordinate, of each of the plurality of pickers are calculated; an x correction value, which is a difference between the first x coordinate deviation value and the second x coordinate deviation value of each of the plurality of pickers, is calculated, and an average x correction value, which is an average value of a maximum value and a minimum value among the plurality of x correction values, is calculated; the transfer hand is moved to one side in the x axis direction by the first average x deviation value and to the other side in the x axis direction by the average x correction value, and then the transfer hand is controlled so that the plurality of electronic components are placed on the second tray.

3. An electronic component test processor characterized by comprising: a first tray for placing a plurality of electronic components; a transfer hand including a plurality of pickers arranged in an x axis direction, which transfers the plurality of electronic components placed on the first tray to a second tray; a photographing unit which acquires image information by photographing the plurality of pickers; and a control section which, based on the image information, acquires a first picker x coordinate, which is an x axis coordinate of each of the plurality of pickers, when the transfer hand is placed at a first tray position on the first tray; the control section, calculates a first reference x coordinate, which is a preset x axis coordinate of each of the plurality of pickers, and a first x coordinate deviation value, which is a difference from the first reference x coordinate as the first picker x coordinate, of each of the plurality of pickers, when the transfer hand is placed at the first tray position; when a first maximum x deviation value, which is a maximum value among the first x coordinate deviation values, is smaller than a preset x critical value, the transfer hand is moved to one side in the x axis direction by a first minimum x deviation value, which is a minimum value among the first x coordinate deviation values, and a first average x deviation value, which is an average value of the first maximum x deviation value, and then the transfer hand is controlled to grip the plurality of electronic components from the first tray; the control section, when one or more of the plurality of first x coordinate deviation values exceeds the x critical value, the transfer hand is controlled so that the plurality of pickers are placed at positions spaced by the average x deviation value from the first picker x coordinates; the transfer hand is controlled so that the one or more pickers that exceed the x critical value are placed on one or more of the plurality of electronic components; the transfer hand is controlled so that the one or more pickers that exceed the x critical value are placed on one or more of the plurality of electronic components; The other average x deviation value is an average of a maximum x deviation value and a minimum x deviation value of the remaining pickers other than the one or more pickers exceeding the x critical value.

4. The electronic component test handler of claim 3, wherein, the control section, obtaining second picker x coordinates as the x-axis coordinates of the respective pickers when the transfer hand is placed at a second tray position on the second tray; calculating second reference x coordinates of the respective pickers as the preset x-axis coordinates and second x coordinate deviation values of the respective pickers as the differences from the second reference x coordinates when the transfer hand is placed at the second tray position; calculating an offset x correction value as the difference between the first x coordinate deviation value and the second x coordinate deviation value of the one or more pickers; controlling the transfer hand to cause the one or more pickers exceeding the x critical value to place the one or more electronic components on the second tray after moving the transfer hand by the other average x deviation value to one side in the x-axis direction and by the offset x correction value to the other side in the x-axis direction.

5. An electronic accessory test handler control method, comprising: including: an image obtaining step of obtaining image information by imaging the plurality of pickers; a first picker x coordinate obtaining step of obtaining first picker x coordinates as the x-axis coordinates of the respective pickers when the transfer hand is placed at a first tray position on a first tray based on the image information; a first x coordinate deviation value calculating step of calculating first reference x coordinates of the respective pickers as the preset x-axis coordinates and first x coordinate deviation values of the respective pickers as the differences from the first picker x coordinates when the transfer hand is placed at the first tray position; a judging step of judging whether a first maximum x deviation value having a maximum value among the plurality of first x coordinate deviation values exceeds a preset x critical value; and a first moving step of moving the transfer hand by a first minimum x deviation value having a minimum value among the plurality of first x coordinate deviation values and a first average x deviation value as an average of the first minimum x deviation value to one side in the x-axis direction when it is judged that the first maximum x deviation value is less than or equal to the x critical value. including: a first picker y coordinate obtaining step of obtaining first picker y coordinates as the y-axis coordinates of the respective pickers when the transfer hand is placed at the first tray position based on the image information; a first y coordinate deviation value calculating step of calculating first reference y coordinates of the respective pickers as the preset y-axis coordinates and first y coordinate deviation values of the respective pickers as the differences from the first picker y coordinates when the transfer hand is placed at the first tray position; a judging step of judging whether a first maximum y deviation value having a maximum value among the plurality of first y coordinate deviation values exceeds a preset y critical value; and ​ A second moving step of moving the transfer hand to one side in the y-axis direction by a first minimum y deviation value having a minimum value among the plurality of first y coordinate deviation values and a first average y deviation value that is an average of the first minimum y deviation value when the first maximum y deviation value is smaller than or equal to a y critical value.

6. An electronic component test handler control method characterized by comprising: an image acquisition step of acquiring image information by photographing a plurality of pickups; a first pickup x coordinate acquisition step of acquiring first pickup x coordinates that are x-axis coordinates of the respective plurality of pickups when a transfer hand is positioned at a first tray position on a first tray based on the image information; a first x coordinate deviation value calculation step of calculating first x coordinate deviation values that are differences from preset x-axis coordinates of the respective plurality of pickups as the first pickup x coordinates corresponding to the first reference x coordinates when the transfer hand is positioned at the first tray position; a judgment step of judging whether a first maximum x deviation value having a maximum value among the plurality of first x coordinate deviation values exceeds a preset x critical value; and a first moving step of moving the transfer hand to one side in the x-axis direction by a first minimum x deviation value having a minimum value among the plurality of first x coordinate deviation values and a first average x deviation value that is an average of the first minimum x deviation value when it is judged that the first maximum x deviation value is smaller than or equal to the x critical value. Further comprising: a second pickup x coordinate acquisition step of acquiring second pickup x coordinates that are x-axis coordinates of the respective plurality of pickups when the transfer hand is positioned at a second tray position on a second tray; a second x coordinate deviation value calculation step of calculating second x coordinate deviation values that are differences from preset x-axis coordinates of the respective plurality of pickups as the second pickup x coordinates corresponding to the second reference x coordinates when the transfer hand is positioned at the second tray position; an average x correction value calculation step of calculating x correction values that are differences between the first x coordinate deviation values and the second x coordinate deviation values of the respective plurality of pickups, and calculating an average x correction value that is an average of a maximum value and a minimum value of the plurality of x correction values; and a second moving step of moving the transfer hand positioned at the second tray to one side in the x-axis direction by the first average x deviation value and to the other side in the x-axis direction by the average x correction value.

7. An electronic component test handler control method characterized by comprising: an image acquisition step of acquiring image information by photographing a plurality of pickups; a first pickup x coordinate acquisition step of acquiring first pickup x coordinates that are x-axis coordinates of the respective plurality of pickups when a transfer hand is positioned at a first tray position on a first tray based on the image information; a first x coordinate deviation value calculation step of calculating first x coordinate deviation values that are differences from preset x-axis coordinates of the respective plurality of pickups as the first pickup x coordinates corresponding to the first reference x coordinates when the transfer hand is positioned at the first tray position; a judgment step of judging whether a first maximum x deviation value having a maximum value among the plurality of first x coordinate deviation values exceeds a preset x critical value; and a first moving step of moving the transfer hand to one side in the x-axis direction by a first minimum x deviation value having a minimum value among the plurality of first x coordinate deviation values and a first average x deviation value that is an average of the first minimum x deviation value when it is judged that the first maximum x deviation value is smaller than or equal to the x critical value. a first x-coordinate deviation value calculation step of calculating, when the transfer hand is placed at the first tray position, a first reference x-coordinate that is a preset x-axis coordinate of each of the plurality of pickups and a first x-coordinate deviation value of each of the plurality of pickups that corresponds to a difference from the first reference x-coordinate as the first pickup x-coordinate; a judgment step of judging whether a first maximum x-deviation value that is a maximum value among the plurality of first x-coordinate deviation values exceeds a preset x-critical value; and a first movement step of moving the transfer hand to one side in the x-axis direction by a first minimum x-deviation value that is a minimum value among the plurality of first x-coordinate deviation values and a first average x-deviation value that is an average of the first minimum x-deviation value when it is judged that the first maximum x-deviation value is smaller than or equal to the x-critical value. Further comprising: a further average x-deviation value calculation step of calculating, among the plurality of pickups, a further average x-deviation value that is an average of a maximum x-deviation value and a minimum x-deviation value of the remaining pickups other than one or more pickups that exceed the x-critical value as a result of the first x-coordinate deviation value calculation; and a first sequential movement step of moving the plurality of pickups to positions that are spaced apart from the first pickup x-coordinates by the further average x-deviation value and moving the transfer hand so that the one or more pickups are placed on one or more electronic components among the plurality of electronic components when one or more of the plurality of first x-coordinate deviation values exceed the x-critical value.

8. An electronic component test handler control method, characterized by comprising: an image acquisition step of acquiring image information by photographing the plurality of pickups; a first pickup x-coordinate acquisition step of acquiring, based on the image information, a first pickup x-coordinate that is an x-axis coordinate of each of the plurality of pickups when a transfer hand is located at a first tray position on a first tray; a first x-coordinate deviation value calculation step of calculating, when the transfer hand is placed at the first tray position, a first reference x-coordinate that is a preset x-axis coordinate of each of the plurality of pickups and a first x-coordinate deviation value of each of the plurality of pickups that corresponds to a difference from the first reference x-coordinate as the first pickup x-coordinate; a judgment step of judging whether a first maximum x-deviation value that is a maximum value among the plurality of first x-coordinate deviation values exceeds a preset x-critical value; and a first movement step of moving the transfer hand to one side in the x-axis direction by a first minimum x-deviation value that is a minimum value among the plurality of first x-coordinate deviation values and a first average x-deviation value that is an average of the first minimum x-deviation value when it is judged that the first maximum x-deviation value is smaller than or equal to the x-critical value. Further comprising: a further average x-deviation value calculation step of calculating, among the plurality of pickups, a further average x-deviation value that is an average of a maximum x-deviation value and a minimum x-deviation value of the remaining pickups other than one or more pickups that exceed the x-critical value as a result of the first x-coordinate deviation value calculation; and a first sequential movement step of moving the plurality of pickups to positions that are spaced apart from the first pickup x-coordinates by the further average x-deviation value and moving the transfer hand so that the one or more pickups are placed on one or more electronic components among the plurality of electronic components when one or more of the plurality of first x-coordinate deviation values exceed the x-critical value. The first sequential movement step, when one or more of the plurality of first x-coordinate deviation values exceeds the x-critical value, the plurality of pickers are moved to positions spaced from the first picker x-coordinate by the other average x-deviation values, and the transfer hand is moved so that the one or more pickers are placed on one or more of the plurality of electronic components; Further comprising: A second picker x-coordinate acquisition step, when the transfer hand is placed at a second tray position on the second tray, acquiring a second picker x-coordinate as an x-axis coordinate of each of the plurality of pickers; A second x-coordinate deviation value calculation step, when the transfer hand is placed at the second tray position, calculating a second reference x-coordinate as a preset x-axis coordinate of each of the plurality of pickers, and a second x-coordinate deviation value of each of the plurality of pickers as a difference between the second reference x-coordinate and an x-coordinate of the second picker corresponding to the second reference x-coordinate; An offset x-deviation value calculation step, calculating an offset x-correction value as a difference between the first x-coordinate deviation value and the second x-coordinate deviation value of the one or more pickers; and A second sequential movement step, including an other average value movement step in which the transfer hand is moved in the x-axis direction by an other average value of the other average x-deviation values, and an offset correction value movement step in which the transfer hand is moved in the x-axis direction by the offset x-correction value to the other side.

Images