Fingerprint recognition device manufacturing method

Abstract

The present invention provides a method for manufacturing a fingerprint recognition device. After forming a corresponding component structure on a basic process of a thin film transistor (TFT) substrate, a peelable adhesive is selected to be attached to the detection active area of ​​the fingerprint recognition device, and then a packaging material is selected to be attached to the outer edge of the substrate layer of the upper and lower butted thin film transistor substrates, and two peelable adhesives are aligned and attached at the same time to form a stack structure of the fingerprint recognition device. After the stack structure is subjected to a thinning process, it is placed in an alkaline solution to dissociate the packaging material and tear off the peelable adhesive, so that the upper and lower joined thin film transistor (TFT) substrates can be completely separated without the need for a cutting process.

Description

Technical Field

[0001] The invention belongs to the technical field of process optimization, and in particular relates to a method for manufacturing a fingerprint recognition device. Background Art

[0002] Generally speaking, when the thin-film transistor (TFT) substrate is thinned for fingerprint recognition double-panel glass, in order to maintain the overall unit spacing, an acid-resistant sealant is required and then coated around the edges of the fingerprint recognition device to make it appear closed.

[0003] At the same time, in order to maintain the overall unit spacing and prevent the surface of the fingerprint recognition device within the protective surface from being scratched, the fingerprint recognition device active detection area within the protective film attachment surface is required.

[0004] That is, two thin film transistor (TFT) substrates facing each other are bonded together using an acid-resistant sealant, and a protective film is attached to the surface of the fingerprint recognition device in the middle as a supporting layer and a protective layer.

[0005] After the glass layers of the two thin film transistor (TFT) substrates have been thinned, the two substrates need to be cut and separated to obtain a plurality of smaller-sized thin film transistor substrates with fingerprint recognition.

[0006] However, since the sealant has a low modulus property, in order to separate the two overlapping thin film transistor (TFT) substrates, a scribe break (SBK) or laser cutting method is required. Cutting off part of the sealant will cause the glass layer size of the thin film transistor (TFT) substrate to become smaller after the overall separation.

[0007] In addition, when the SBK cutting method is used, the glass layer edge nodes where the sealant is applied are easily broken and the appearance quality is poor; when the laser cutting method is used, the laser cutting will produce heat effects and dust during cutting. Therefore, when using the conventional technology to perform fingerprint recognition process, there is still room for optimization or improvement and technology. Summary of the invention

[0008] One purpose of the present invention is to solve the problem of heat effect and dust generation when cutting.

[0009] Another purpose of the present invention is to maintain the appearance and size of the thin film transistor (TFT) substrate intact, without the risk of cutting the edge to cause fragmentation or breakage, and the thin film transistor (TFT) strength will not decay. In addition to improving the conventional defects, the yield of the finished product can be increased, and at the same time, the production process can be simplified.

[0010] To achieve the above-mentioned purpose, the present invention provides a stack structure of a fingerprint recognition device to facilitate a method for manufacturing a fingerprint recognition device. The stack structure includes a first thin film transistor substrate, a first peelable adhesive, a second thin film transistor substrate, a second peelable adhesive and a packaging material.

[0011] The first thin film transistor substrate includes a first substrate and a first sensing component. One side of the first sensing component is attached to the first substrate, and the other side of the first sensing component has a first detection active area.

[0012] The first removable adhesive is attached to the first detection active area, and the first removable adhesive has a first thickness.

[0013] The second thin film transistor substrate includes a second substrate and a second sensing component. One side of the second sensing component is attached to the second substrate, and the other side of the second sensing component has a second detection active area.

[0014] The second removable adhesive is attached to the second detection active area, and the second removable adhesive has a second thickness.

[0015] The packaging material is located on the first substrate and is coated around the outer edge of the first substrate. The packaging material has a width and a third thickness.

[0016] One side of the first removable adhesive and one side of the second removable adhesive are attached to each other, so that the packaging material is located on the second substrate, and the packaging material surrounds the outer edge of the second substrate.

[0017] Furthermore, the first removable adhesive is a colloid that is cured and formed after heating. The first removable adhesive is made of polyvinyl chloride (PVC) material, and the first removable adhesive needs to be resistant to alkaline liquid and not corrode the first thin film transistor substrate, so as to protect the first detection active area.

[0018] Furthermore, the second removable adhesive is a colloid that is cured and formed after heating. The second removable adhesive is made of polyvinyl chloride (PVC) material, and the second removable adhesive needs to be resistant to alkaline liquid and not corrode the second thin film transistor substrate, so as to protect the second detection active area.

[0019] Furthermore, the packaging material is an alkali dissociation type packaging material, and its material is acrylic resin or acrylate. The packaging material is a UV curing adhesive and is resistant to corrosion by hydrofluoric acid and sulfuric acid.

[0020] Furthermore, the first thickness and the second thickness are both between 40 and 50 micrometers (um).

[0021] Further, the width is between 3 and 4 millimeters (mm), and the third thickness is between 180 and 200 micrometers (um).

[0022] In addition, the present invention provides a method for manufacturing a fingerprint recognition device, comprising the following steps:

[0023] a. Provide a first thin film transistor substrate, a first peelable adhesive, a packaging material, a second thin film transistor substrate and a second peelable adhesive, the first thin film transistor substrate includes a first substrate and a first sensing component, one side of the first sensing component is attached to the first substrate, and the other side of the first sensing component has a first detection active area, the second thin film transistor substrate includes a second substrate and a second sensing component, one side of the second sensing component is attached to the second substrate, and the other side of the second sensing component has a second detection active area.

[0024] b. Apply the first removable adhesive to the first detection activity area so that one side of the first removable adhesive is against the first detection activity area, and at the same time, apply the second removable adhesive to the second detection activity area so that one side of the second removable adhesive is against the second detection activity area.

[0025] c. coating the packaging material on the first substrate, and surrounding the outer edge of the first substrate with the packaging material.

[0026] d. The second thin film transistor substrate is disposed on the first thin film transistor substrate so that the first peelable adhesive and the second peelable adhesive are in contact with each other, and the other end of the packaging material is located on the second substrate. The packaging material surrounds the outer edge of the second substrate to form a stacked structure of the fingerprint recognition device.

[0027] e. Performing a thinning process on the stack structure, etching the first substrate to a fourth thickness, and etching the second substrate to a fifth thickness.

[0028] f. placing the stacked structure after the thinning process into an alkaline solution, subjecting the packaging material to ultrasonic oscillation in the alkaline solution at 80°C and peeling off the packaging material, and then separating the first thin-film transistor substrate with the first strippable adhesive after thinning and the second thin-film transistor substrate with the second strippable adhesive after thinning manually or with an auxiliary jig, so that the first strippable adhesive and the second strippable adhesive are removed from the first thin-film transistor substrate and the second thin-film transistor substrate, respectively.

[0029] g. taking out the first thin film transistor substrate after the thinning process and the second thin film transistor substrate after the thinning process.

[0030] h. Cutting the first thin film transistor substrate after the thinning process to obtain a plurality of thin film transistor substrates with fingerprint identification.

[0031] i. Cutting the second thin film transistor substrate after the thinning process to obtain a plurality of thin film transistor substrates with fingerprint identification.

[0032] Furthermore, the first removable adhesive is a colloid that is cured and formed after heating, and the first removable adhesive needs to be resistant to alkaline liquid and not corrode the first thin film transistor substrate, and is used to protect the first detection active area. When separating, the first removable adhesive can be torn off manually or with an auxiliary tool without residual adhesive.

[0033] Furthermore, the second removable adhesive is a colloid that is cured and formed after heating, and the second removable adhesive needs to be resistant to alkaline liquid and not corrode the second thin film transistor substrate, and is used to protect the second detection active area. When separating, the second removable adhesive can be torn off manually or with an auxiliary tool without residual adhesive.

[0034] Furthermore, when the fingerprint recognition device is placed in the alkaline solution of 10% potassium hydroxide (KOH) and subjected to ultrasonic oscillation for 50 to 70 minutes (min), the packaging material can be separated.

[0035] In the above, the temperature of the alkali solution is between 70 degrees and 90 degrees.

[0036] The present invention further provides another method for manufacturing a fingerprint recognition device, comprising the following steps:

[0037] S1. Provide a first thin film transistor substrate, a peelable adhesive, a packaging material, and a second thin film transistor substrate. The first thin film transistor substrate includes a first substrate and a first sensing component. One side of the first sensing component is attached to the first substrate, and the other side of the first sensing component has a first detection active area. The second thin film transistor substrate includes a second substrate and a second sensing component. One side of the second sensing component is attached to the second substrate, and the other side of the second sensing component has a second detection active area.

[0038] S2. Apply the removable adhesive to the first detection activity area so that the removable adhesive is attached to the first detection activity area.

[0039] S3. Apply the packaging material on the first substrate, and surround the outer edge of the first substrate with the packaging material.

[0040] S4. The second thin film transistor substrate is disposed on the first thin film transistor substrate so that the removable adhesive is configured between the first photosensitive component and the second photosensitive component. At the same time, the other end of the packaging material is located on the second substrate. The packaging material surrounds the outer edge of the second substrate to form a stacking structure of the fingerprint recognition device.

[0041] S5. Perform a thinning process on the stack structure, and perform an etching operation on the first substrate to reach a fourth thickness, and perform an etching operation on the second substrate to reach a fifth thickness.

[0042] S6. Place the stacked structure after the thinning process in an alkaline solution, perform ultrasonic oscillation on the packaging material in the alkaline solution at 80°C, and after peeling, separate the strippable adhesive, the first thin film transistor substrate, and the second thin film transistor substrate, so that the strippable adhesive is removed from the first thin film transistor substrate and the second thin film transistor substrate. S7. Take out the first thin film transistor substrate after the thinning process and the second thin film transistor substrate after the thinning process;

[0043] S8. Cutting the first thin film transistor substrate after the thinning process to obtain a plurality of thin film transistor substrates with fingerprint identification;

[0044] S9. Cutting the second thin film transistor substrate after the thinning process to obtain a plurality of thin film transistor substrates with fingerprint identification.

[0045] In summary, the manufacturing method of the fingerprint recognition device of the present invention is to complete the stacking structure of the fingerprint recognition device, perform a thinning process, place the stacking structure in an alkaline solution, dissociate the packaging material, and tear off the peelable adhesive, and finally complete the complete separation of the upper and lower bonded thin film transistor (TFT) substrates without the need for a cutting process.

[0046] Therefore, from the above, it can be seen that the advantages of the manufacturing method of the fingerprint recognition device of the present invention are:

[0047] 1. The overall structure, through the packaging material and the peelable adhesive, maintains the uniformity and stability of the unit spacing.

[0048] 2. The process is simplified. The stacked thin film transistor substrates can be separated without the need for conventional cutting processes in the entire manufacturing process.

[0049] 3. Ensure the finished product has a complete appearance and size, and avoid breaking or chipping the edges of the finished product after cutting.

[0050] 4. When cutting is performed in the later process, the risk of dust or thermal effects can be avoided, and the strength of the thin film transistor will not decay, which can improve the yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is a simplified three-dimensional exploded view of the stacking structure of the present invention.

[0052] Figure 2A It is a cross-sectional schematic diagram of the stack structure of the present invention.

[0053] Figure 2B It is a cross-sectional schematic diagram of another stacking structure of the present invention

[0054] Figure 3 It is a flow chart of the steps of the manufacturing method of the fingerprint recognition device of the present invention.

[0055] Figure 4 It is a continuation Figure 3 Flow chart of the steps.

[0056] Figure 5 It is a simplified process diagram of the manufacturing method of the fingerprint recognition device of the present invention.

[0057] Figure 6 It is a line graph of ultrasonic oscillation time and bonding strength of the packaging material of the present invention.

[0058] Figure 7 It is a flow chart of the steps of another method for manufacturing a fingerprint recognition device of the present invention.

[0059] Figure 8 It is a continuation Figure 7 Flow chart of the steps.

[0060] The accompanying drawings are marked as follows:

[0061] 1: Stack structure

[0062] 2: First thin film transistor substrate

[0063] 21: First substrate

[0064] 22: First sensing component

[0065] 221: First detection activity area

[0066] 3: First peelable adhesive

[0067] 4: Second thin film transistor substrate

[0068] 41: Second substrate

[0069] 42: Second sensing component

[0070] 421: Second detection activity area

[0071] 5: Second peelable adhesive

[0072] 6: Packaging material

[0073] 7: Peelable adhesive

[0074] T1: First thickness

[0075] T2: Second thickness

[0076] T3: The third thickness

[0077] W: Width

[0078] a~i:Steps

[0079] S1~S9: Steps DETAILED DESCRIPTION

[0080] In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are described in detail with reference to the preferred embodiment of the present invention, and the features and functions thereof are as follows, so as to facilitate a complete understanding, but it should be noted that the content does not constitute a limitation of the present invention. In addition, in this specification, the numerical range represented by "~" refers to the range including the numerical values ​​recorded before and after "~" as the lower limit and the upper limit. In addition, in the numerical range recorded in stages in this specification, the upper limit or lower limit recorded in a certain numerical range can be replaced with the upper limit or lower limit of the numerical range recorded in other stages. In addition, in the numerical range recorded in this specification, the upper limit or lower limit recorded in a certain numerical range can be replaced with the value shown in the embodiment. In addition, the term "step" in this specification is not only an independent step, but also is included in this term as long as the desired purpose of the step can be achieved even if it cannot be clearly distinguished from other steps. Furthermore, although the terms "step" and / or "block" may be used herein or in the accompanying drawings to imply different elements of the methods employed, these terms should not be interpreted as implying any specific order among or between the various steps disclosed herein unless and until the order of the individual steps is explicitly stated.

[0081] See also Figure 1 as well as Figure 2A The present invention provides a stacking structure 1 of a fingerprint recognition device to facilitate a method for manufacturing a fingerprint recognition device. The stacking structure 1 includes a first thin film transistor substrate 2, a first peelable adhesive 3, a second thin film transistor substrate 4, a second peelable adhesive 5 and a packaging material 6.

[0082] The first TFT substrate 2 includes a first substrate 21 and a first sensing element 22 . One side of the first sensing element 22 is attached to the first substrate 21 , and the other side of the first sensing element 22 has a first detection active area 221 .

[0083] The first removable adhesive 3 is attached to the first detection active area 221, and the first removable adhesive 3 has a first thickness T1. In this embodiment, the first removable adhesive 3 is a colloid that is cured after heating, and the first removable adhesive 3 is made of polyvinyl chloride (PVC) material. With the first thickness T1, the first removable adhesive 3 can protect the first detection active area 221 from being damaged. In a preferred embodiment, the first thickness T1 is between 40 and 50 microns (um).

[0084] The second thin film transistor substrate 4 includes a second substrate 41 and a second sensing component 42. One side of the second sensing component 42 is attached to the second substrate 41, and the other side of the second sensing component 42 has a second detection activity area 421. It should be noted that the first detection activity area 221 or the second detection activity area 421 referred to here refers to the sensing area of ​​the first sensing component 22 or the second sensing component 42. In addition, the first sensing component 22 and the second sensing component 42 can be optical sensing components, such as photodiodes or ultrasonic sensing components, etc., and the present invention is not limited thereto.

[0085] The second removable adhesive 5 is attached to the second detection activity area 421, and the second removable adhesive 5 has a second thickness T2. In this embodiment, the second removable adhesive 5 is a colloid that is cured after heating, and the second removable adhesive 5 is made of polyvinyl chloride (PVC). With the second thickness T2, the second removable adhesive 5 can protect the second detection activity area 421 from being damaged. In a preferred embodiment, the second thickness T2 is between 40 and 50 microns (um).

[0086] The packaging material 6 is located on the first substrate 21, and the packaging material 6 is coated around the outer edge of the first substrate 21. The packaging material 6 has a width W and a third thickness T3. The width W and the third thickness T3 are used to maintain the uniformity of the overall unit spacing. In this embodiment, the packaging material 6 is an alkaline packaging material, and its material is acrylic resin or acrylate. The packaging material 6 is a UV curing glue that can resist corrosion by hydrofluoric acid and sulfuric acid. In a preferred embodiment, the width W is between 3 and 4 millimeters (mm), and the third thickness T3 is between 180 and 200 microns (um). In addition, the first thickness T1 and the second thickness T2 are respectively smaller than the third thickness T3, and are described here.

[0087] The first peelable adhesive 3 and the second peelable adhesive 5 are attached to each other, so that the packaging material 6 is located on the second substrate 41 , and the packaging material 6 surrounds the outer edge of the second substrate 41 .

[0088] Please refer to Figure 2B , Figure 2BA cross-sectional diagram of another stacking structure is given. Figure 2A The biggest difference is that Figure 2B There is only one layer of peelable adhesive 7. In this feasible embodiment, the peelable adhesive 7 is disposed between the first sensing component 22 and the second sensing component 42. In addition, in any feasible illustrative embodiment, it can also be made of a decomposable material.

[0089] Please see additional Figures 3 to 5 In addition, the present invention also provides a method for manufacturing a fingerprint recognition device, comprising the following steps:

[0090] a. Provide a first thin film transistor substrate, a first peelable adhesive, a packaging material, a second thin film transistor substrate and a second peelable adhesive, wherein the first thin film transistor substrate includes a first substrate and a first sensing component, one side of the first sensing component is attached to one side of the first substrate, and the other side of the first sensing component has a first detection active area; the second thin film transistor substrate includes a second substrate and a second sensing component, one side of the second sensing component is attached to one side of the second substrate, and the other side of the second sensing component has a second detection active area.

[0091] b. Apply the first removable adhesive to the first detection activity area so that one side of the first removable adhesive is against the first detection activity area, and at the same time, apply the second removable adhesive to the second detection activity area so that one side of the second removable adhesive is against the second detection activity area.

[0092] In this step, the first removable adhesive 3 and the second removable adhesive 5 can also be processed by screen printing to replace the protective film in the conventional technology. The removable adhesives (3, 5) are harder than the protective film and will not collapse, and can achieve uniform and stable overall unit spacing.

[0093] c. Apply the packaging material on the first substrate, and surround the outer edge of the first substrate. In this step, the packaging material 6 can prevent liquid from corroding or penetrating into the first sensing component 22.

[0094] d. The second thin film transistor substrate is disposed on the first thin film transistor substrate so that the other side of the first peelable adhesive and the other side of the second peelable adhesive are in contact with each other, and the other end of the packaging material is located on the side of the second substrate. The packaging material surrounds the outer edge of the second substrate to form a stacked structure of a fingerprint recognition device.

[0095] e. Performing a thinning process on the stack structure of the fingerprint recognition device, etching the first substrate to a fourth thickness, and etching the second substrate to a fifth thickness.

[0096] It should be noted that the fourth thickness and the fifth thickness can be the same thickness or different thicknesses, and a thinning process can be performed according to manufacturing requirements. In a preferred embodiment, the fourth thickness and the fifth thickness are 90±20 micrometers (um).

[0097] f. Place the stacked structure of the fingerprint recognition device after the thinning process in an alkaline solution, and perform ultrasonic oscillation in the alkaline solution at 80° C. After the packaging material is oscillated and peeled off, the first thin-film transistor substrate with the first strippable adhesive after thinning and the second thin-film transistor substrate with the second strippable adhesive after thinning are separated by manual or auxiliary processing tools (such as: a robot arm or a two-way vacuum suction device, etc.), so that the first strippable adhesive and the second strippable adhesive are removed from the first thin-film transistor substrate and the second thin-film transistor substrate respectively.

[0098] g. taking out the first thin film transistor substrate after the thinning process and the second thin film transistor substrate after the thinning process.

[0099] h. Cutting the first thin film transistor substrate after the thinning process to obtain a plurality of thin film transistor substrates with fingerprint identification.

[0100] i. Cutting the second thin film transistor substrate after the thinning process to obtain a plurality of thin film transistor substrates with fingerprint identification.

[0101] In addition, please refer to Figure 7 and Figure 8 It should be noted that another method for manufacturing a fingerprint recognition device can be derived from the above, comprising the following steps:

[0102] S1: providing a first thin film transistor substrate, a strippable adhesive, a packaging material, and a second thin film transistor substrate, wherein the first thin film transistor substrate comprises a first substrate and a first sensing component, one side of the first sensing component is attached to the first substrate, and the other side of the first sensing component has a first detection active area, and the second thin film transistor substrate comprises a second substrate and a second sensing component, one side of the second sensing component is attached to the second substrate, and the other side of the second sensing component has a second detection active area;

[0103] S2: applying the peelable adhesive to the first detection activity area so that the peelable adhesive is attached to the first detection activity area;

[0104] S3: coating the packaging material on the first substrate, and surrounding the outer edge of the first substrate with the packaging material;

[0105] S4: The second thin film transistor substrate is disposed on the first thin film transistor substrate, so that the strippable adhesive is disposed between the first photosensitive component and the second photosensitive component, and the other end of the packaging material is located on the second substrate, and the packaging material surrounds the outer edge of the second substrate to form a stacked structure of the fingerprint recognition device;

[0106] S5: performing a thinning process on the stack structure, etching the first substrate to a fourth thickness, and etching the second substrate to a fifth thickness;

[0107] S6: In any of the above embodiments of the present proposal, the stack structure after the thinning process is placed in an alkaline solution, and the packaging material is subjected to ultrasonic oscillation in the alkaline solution at 80°C and peeled off, and then the strippable adhesive, the first thin film transistor substrate and the second thin film transistor substrate are separated, so that the strippable adhesive is removed from the first thin film transistor substrate and the second thin film transistor substrate.

[0108] S7: taking out the first thin film transistor substrate after the thinning process and the second thin film transistor substrate after the thinning process;

[0109] S8: cutting the first thin film transistor substrate after the thinning process to obtain a plurality of thin film transistor substrates with fingerprint identification;

[0110] S9: cutting the second thin film transistor substrate after the thinning process to obtain a plurality of thin film transistor substrates with fingerprint identification.

[0111] In addition, the first thickness T1 and the second thickness T2 are respectively smaller than the third thickness T3, and the fourth thickness and the fifth thickness are both smaller than the first thickness T1 and the second thickness T2, and are described herein.

[0112] It should be further explained that the first removable adhesive 3 and the second removable adhesive 5 are both colloids that are cured and formed after heating, and the colloids need to be resistant to alkaline solutions and not corrode the substrate (the first thin film transistor substrate 2, the second thin film transistor substrate 4), and are respectively used to protect the detection active areas (221, 421), and when the colloids (3, 5) are separated, the colloids (3, 5) can be torn off manually or with an auxiliary tool without residual adhesive.

[0113] Please also refer to Figure 6By the method provided above, the stack structure 1 is placed in the alkaline solution of 10% potassium hydroxide (KOH) and oscillated with ultrasound in the alkaline solution at 80° C. It is found that the packaging material 6 located at the periphery is oscillated with ultrasound for 50 to 70 minutes in the alkaline solution of 10% potassium hydroxide (KOH). After the thinning process, the stacked first thin film transistor substrate 2 and the second thin film transistor substrate 4 can be completely separated without residual glue.

[0114] In addition, it is preferable that the adhesive strength decreases and becomes loose after oscillating for two minutes, and a one-minute separation operation is performed (the colloid (3, 5) is torn off manually or with an auxiliary tool without residual glue), and a one-minute cleaning is performed after removal, and finally the peeling can be completed within 5 minutes.

[0115] During the entire test process, the pads in the first active detection area 221 and the second active detection area 421 were confirmed to have no corrosion, indicating that the air tightness and alkali resistance between the strippable adhesive (3, 5) and the sensing component (22, 42) are sufficient.

[0116] In summary, the advantages of the fingerprint recognition device and method of the present invention are:

[0117] 1. The overall structure, through the packaging material and the peelable adhesive, maintains the uniformity and stability of the unit spacing.

[0118] 2. The process is simplified. The stacked thin film transistor substrates can be separated without the need for conventional cutting processes in the entire manufacturing process.

[0119] 3. Ensure the finished product has a complete appearance and size, and avoid breaking or chipping the edges of the finished product after cutting.

[0120] 4. When cutting is performed in the later process, the risk of dust or thermal effects is avoided, and the strength of the thin film transistor will not decay, thereby improving the yield.

[0121] Through the above detailed description, it can be fully demonstrated that the purpose and efficacy of the present invention are progressive in implementation, and have great industrial utilization value. It fully meets the requirements of invention patents, and therefore an application is filed in accordance with the law. However, the above is only a preferred embodiment of the present invention, and does not limit the implementation method and protection scope of the present invention. For those skilled in the art, it should be able to realize that all solutions obtained by equivalent substitutions and obvious changes made by using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a fingerprint recognition device, characterized in that: The following steps are involved: A first thin film transistor substrate, a first removable adhesive, a packaging material, a second thin film transistor substrate and a second removable adhesive are provided, wherein the first thin film transistor substrate includes a first substrate and a first sensing component, one side of the first sensing component is attached to the first substrate, and the other side of the first sensing component has a first detection active area, and the second thin film transistor substrate includes a second substrate and a second sensing component, one side of the second sensing component is attached to the second substrate, and the other side of the second sensing component has a second detection active area; Applying the first removable adhesive to the first detection activity area so that the first removable adhesive is attached to the first detection activity area, and applying the second removable adhesive to the second detection activity area so that the second removable adhesive is attached to the second detection activity area; Applying the packaging material on the first substrate, and surrounding the outer edge of the first substrate; The second thin film transistor substrate is arranged on the first thin film transistor substrate, so that the first peelable adhesive and the second peelable adhesive are in contact with each other, and the other end of the packaging material is located on the second substrate, and the packaging material surrounds the outer edge of the second substrate to form a stacked structure of the fingerprint recognition device; Performing a thinning process on the stack structure, etching the first substrate to a fourth thickness, and etching the second substrate to a fifth thickness; The stacked structure after the thinning process is placed in an alkaline solution, and the packaging material is subjected to ultrasonic oscillation in the alkaline solution at 80° C. and after being peeled off, the first thin film transistor substrate with the first strippable adhesive after thinning and the second thin film transistor substrate with the second strippable adhesive after thinning are separated manually or with an auxiliary jig, so that the first strippable adhesive and the second strippable adhesive are removed from the first thin film transistor substrate and the second thin film transistor substrate respectively; taking out the first thin film transistor substrate after the thinning process and the second thin film transistor substrate after the thinning process; Cutting the first thin film transistor substrate after the thinning process to obtain a plurality of thin film transistor substrates with fingerprint identification; The second thin film transistor substrate after the thinning process is cut to obtain a plurality of thin film transistor substrates with fingerprint identification.

2. The method for manufacturing a fingerprint recognition device according to claim 1, characterized in that: The first removable adhesive is a colloid that is cured and formed after heating, and the first removable adhesive is made of polyvinyl chloride. The colloid is resistant to alkaline liquid and does not corrode the first thin film transistor substrate, and is used to protect the first detection active area.

3. The method for manufacturing a fingerprint recognition device according to claim 1, wherein: The second removable adhesive is a colloid that is cured and formed after heating, and the second removable adhesive is made of polyvinyl chloride material. The colloid is resistant to alkaline liquid and does not corrode the second thin film transistor substrate, and is used to protect the second detection active area.

4. The method for manufacturing a fingerprint recognition device according to claim 1, wherein: When the stacked structure of the fingerprint identification device is placed in the alkaline solution of 10% potassium hydroxide and subjected to ultrasonic oscillation for 50 to 70 minutes, the packaging material can be separated.

5. The method for manufacturing a fingerprint recognition device as claimed in claim 4, characterized in that: The temperature of the alkali solution is between 70 degrees and 90 degrees.

6. The method for manufacturing a fingerprint recognition device according to claim 1, wherein: The packaging material is an alkali dissociation type packaging material, and its material is acrylic resin or acrylate. The packaging material is ultraviolet light curing glue and can resist corrosion by hydrofluoric acid and sulfuric acid.

7. The method for manufacturing a fingerprint recognition device according to claim 1, characterized in that: The first removable adhesive has a first thickness, and the second removable adhesive has a second thickness, and the first thickness and the second thickness are both between 40 and 50 micrometers.

8. The method for manufacturing a fingerprint recognition device according to claim 1, wherein: The packaging material has a width and a third thickness, the width is between 3 and 4 mm, and the third thickness is between 180 and 200 μm.

9. A method for manufacturing a fingerprint recognition device, characterized in that: The following steps are involved: A first thin film transistor substrate, a strippable adhesive, a packaging material, and a second thin film transistor substrate are provided. The first thin film transistor substrate includes a first substrate and a first sensing component. One side of the first sensing component is attached to the first substrate, and the other side of the first sensing component has a first detection active area. The second thin film transistor substrate includes a second substrate and a second sensing component. One side of the second sensing component is attached to the second substrate, and the other side of the second sensing component has a second detection active area. Applying the peelable adhesive to the first detection activity area so that the peelable adhesive is attached to the first detection activity area; Applying the packaging material on the first substrate, and surrounding the outer edge of the first substrate; The second thin film transistor substrate is disposed on the first thin film transistor substrate, so that the removable adhesive is disposed between the first sensing component and the second sensing component, and the other end of the packaging material is located on the second substrate, and the packaging material surrounds the outer edge of the second substrate to form a stacked structure of the fingerprint recognition device; Performing a thinning process on the stack structure, etching the first substrate to a fourth thickness, and etching the second substrate to a fifth thickness; The stacked structure after the thinning process is placed in an alkaline solution, and the packaging material is subjected to ultrasonic oscillation in the alkaline solution at 80° C. After being peeled off, the strippable adhesive, the first thin film transistor substrate and the second thin film transistor substrate are separated, so that the strippable adhesive is removed from the first thin film transistor substrate and the second thin film transistor substrate; taking out the first thin film transistor substrate after the thinning process and the second thin film transistor substrate after the thinning process; Cutting the first thin film transistor substrate after the thinning process to obtain a plurality of thin film transistor substrates with fingerprint identification; The second thin film transistor substrate after the thinning process is cut to obtain a plurality of thin film transistor substrates with fingerprint identification.

10. The method for manufacturing a fingerprint recognition device according to claim 9, characterized in that: When the stacked structure of the fingerprint identification device is placed in the alkaline solution of 10% potassium hydroxide and subjected to ultrasonic oscillation for 50 to 70 minutes, the packaging material can be separated, and the temperature of the alkaline solution is between 70 degrees and 90 degrees.

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