A 3D chip packaging heat dissipation structure

Abstract

This invention discloses a 3D chip packaging heat dissipation structure, relating to the field of 3D chip technology. It includes: a circuit board with a mounting slot on its top; stacked chips mounted within the mounting slot on the circuit board; a cooling assembly disposed on top of and inside the stacked chips; and a leakage detection assembly disposed between the cooling assembly and the stacked chips. This invention, through the leakage detection assembly, can prevent water from entering the chip in the event of a leak. Since the microchannel tube is an integrated structure, leaks are most likely to occur at the connections between the microchannel tube and the distribution tube or the collection tube. A cable-type water immersion sensor is installed at these points to immediately alert the user upon detecting a leak, ensuring that water does not enter the chip and thus extending its lifespan.

Description

Technical Field

[0001] This invention relates to the field of 3D chip technology, specifically to a 3D chip packaging heat dissipation structure. Background Technology

[0002] 3D chips employ multi-core architecture. Unlike conventional chips, multiple processors are not connected side-by-side, but rather vertically. This expands the cable distribution area to cover the entire surface of the processor, and the parallel structure effectively shortens the cable length between processors. Since the 3D chip generates heat during operation, a heat dissipation structure is required to cool it.

[0003] Currently, heat dissipation for computing chips is mainly divided into two types: external heat dissipation and internal heat dissipation. Air cooling, cold plates, and other methods are all external heat dissipation methods. For highly integrated supercomputing chips such as 3D chips, due to their three-dimensional structure, the internal heat is difficult to dissipate quickly during operation. Long-term operation will affect the lifespan of 3D chips. To address this issue, a 3D chip packaging heat dissipation structure has been invented. Summary of the Invention

[0004] The purpose of this invention is to provide a 3D chip packaging heat dissipation structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a 3D chip packaging heat dissipation structure, comprising:

[0006] A circuit board, wherein a mounting groove is provided on the top of the circuit board;

[0007] Stacked chips, wherein stacked chips are installed in the mounting slots of the circuit board;

[0008] A cooling assembly is disposed on top of and inside the stacked chips;

[0009] A leakage detection component is provided, wherein the leakage detection is disposed between the cooling component and the stacked chips.

[0010] Furthermore, the cooling assembly includes a water-cooling assembly and a microchannel heat dissipation assembly, with the water-cooling assembly disposed on top of the stacked chips and the microchannel heat dissipation assembly disposed inside the stacked chips.

[0011] The microchannel heat dissipation assembly includes a microchannel tube, one end of which penetrates one end of the stacked chip. A water collection tube is fixedly connected to one end of the microchannel tube, and a water distribution tube is fixedly connected to the other end of the microchannel tube. Heat dissipation assemblies are fixedly connected to both ends of the microchannel heat dissipation assembly. A water pump is fixedly connected to the inlet end of the water distribution tube, and a radiator is fixedly connected to the inlet end of the water pump. The inlet end of the radiator and the outlet end of the water collection tube are fixed.

[0012] The water leakage detection component uses a cable-type water immersion sensor. The water leakage detection component includes a housing, the bottom of which is fixed to the top of the circuit board, the outer wall of the stacked chip and the inside of the housing, one end of the housing is in contact with one side of the water distribution pipe, the other end of the housing is in contact with one side of the water collection pipe, a microchannel tube passes through the housing, the bottom of the cable-type water immersion sensor is fixed to the top of the circuit board, and the cable-type water immersion sensor and the circuit board are connected by wires.

[0013] Furthermore, a base is fixedly connected to the bottom of the radiator, the bottom of the base is fixed to the top of the circuit board, the bottom of the water pump is fixed to the top of the base, and the circuit board is electrically connected to the radiator and the water pump.

[0014] Furthermore, the water-cooling assembly includes a mounting bracket, the bottom end of which is fixed to the top end of the circuit board. A heat-conducting component is fixedly connected inside the mounting bracket. The bottom end of the heat-conducting component contacts the top end of the stacked chips. The water inlet end of the heat-conducting component is fixed to the water outlet end of the water pump, and the water outlet end of the heat-conducting component is fixed to the water inlet end of the radiator.

[0015] Furthermore, the cable-type water immersion sensor includes two leakage sensing wires that pass through the housing. The bottom ends of the leakage sensing wires are fixed to the bottom of the housing, which is made of thermally conductive silicone.

[0016] Furthermore, the two leakage sensing wires and the cable-type water immersion sensor form two electrical circuits, and the two leakage sensing wires do not come into contact with each other.

[0017] Furthermore, the connection between the water pump and the water distribution pipe is coated with sealant, the connection between the water distribution pipe and the microchannel pipe is coated with sealant, the connection between the microchannel pipe and the water collection pipe is coated with sealant, and the connection between the water collection pipe and the radiator is coated with sealant.

[0018] Compared with the prior art, the beneficial effects of the present invention are:

[0019] This 3D chip packaging heat dissipation structure, through the inclusion of a water leakage detection component, can prevent water from entering the chip's interior in the event of a leak. Since the microchannel tube is an integrated structure, the connection points between the microchannel tube and the water distribution tube or the microchannel tube and the water collection tube are most likely to leak. A cable-type water immersion sensor is installed at these points, and an alarm is immediately triggered to alert the user when a leak occurs, ensuring that water does not enter the chip and thus extending the chip's lifespan.

[0020] This 3D chip packaging heat dissipation structure, through the setting of microchannel tubes, penetrates through the chip and contacts the inside of the chip. It can carry away the heat generated inside the chip during operation, avoiding the situation where the chip life is reduced due to the increase in internal chip temperature. It also avoids the chip automatically reducing its frequency due to excessive chip temperature, which would reduce the chip's performance and thus reduce the user experience. Attached Figure Description

[0021] Figure 1 This is an isometric drawing of the present invention;

[0022] Figure 2 This is an isometric view of the cooling assembly of the present invention;

[0023] Figure 3 This is a front view of the cooling assembly of the present invention;

[0024] Figure 4 This is an isometric view of the leakage detection component of the present invention;

[0025] Figure 5 This is a cross-sectional view of the leak detection component of the present invention.

[0026] In the diagram: 1. Circuit board; 2. Stacked chips; 3. Cooling assembly; 301. Microchannel tube; 302. Water distribution tube; 303. Water collection tube; 304. Water pump; 305. Heat sink; 306. Thermal conductive component; 4. Leakage detection assembly; 401. Cable-type water immersion sensor; 402. Housing. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] like Figures 1-3 As shown, the present invention provides a technical solution: a 3D chip packaging heat dissipation structure, comprising:

[0029] Circuit board 1, with a mounting slot on its top;

[0030] Stacked chip 2 is installed in the mounting slot of circuit board 1;

[0031] Cooling component 3 is disposed on top of and inside the stacked chip 2;

[0032] Leakage detection component 4 and leak prevention component 4 are disposed between cooling component 3 and stacked chip 2.

[0033] like Figure 1 As shown, the cooling component 3 includes a water cooling component and a microchannel heat dissipation component. The water cooling component is disposed on the top of the stacked chip 2, and the microchannel heat dissipation component is disposed inside the stacked chip 2.

[0034] like Figures 2-3 As shown, the microchannel heat dissipation assembly includes a microchannel tube 301, one end of which penetrates one end of the stacked chip 2. A water collection tube 303 is fixedly connected to one end of the microchannel tube 301, and a water distribution tube 302 is fixedly connected to the other end of the microchannel tube 301. Heat dissipation assemblies are fixedly connected to both ends of the microchannel heat dissipation assembly. A water pump 304 is fixedly connected to the inlet end of the water distribution tube 302, and a heat sink 305 is fixedly connected to the inlet end of the water pump 304. The inlet end of the heat sink 305 and the outlet end of the water collection tube 303 are fixedly connected.

[0035] like Figures 4-5 As shown, the water leakage detection component 4 uses a cable-type water immersion sensor 401. The water leakage detection component 4 includes a housing 402. The bottom end of the housing 402 is fixed to the top end of the circuit board 1. The outer wall of the stacked chip 2 is fixed to the inside of the housing 402. One end of the housing 402 is in contact with one side of the water distribution pipe 302, and the other end of the housing 402 is in contact with one side of the water collection pipe 303. The microchannel tube 301 passes through the housing 402. The bottom end of the cable-type water immersion sensor 401 is fixed to the top end of the circuit board 1. The cable-type water immersion sensor 401 and the circuit board 1 are connected by wires.

[0036] like Figure 1 As shown, a base is fixedly connected to the bottom of the radiator 305, and the bottom of the base is fixed to the top of the circuit board 1. The bottom of the water pump 304 is fixed to the top of the base, and the circuit board 1 is electrically connected to the radiator 305 and the water pump 304.

[0037] like Figures 2-3 As shown, the water cooling assembly includes a mounting bracket, the bottom of which is fixed to the top of the circuit board 1. A heat-conducting component 306 is fixedly connected inside the mounting bracket. The bottom of the heat-conducting component 306 is in contact with the top of the stacked chip 2. The water inlet of the heat-conducting component 306 is fixed to the water outlet of the water pump 304, and the water outlet of the heat-conducting component 306 is fixed to the water inlet of the radiator 305.

[0038] like Figure 5 As shown, the cable-type water immersion sensor 401 includes two leakage sensing wires that pass through the housing 402. The bottom ends of the leakage sensing wires are fixed to the bottom ends inside the housing 402. The housing 402 is made of thermally conductive silicone. The two leakage sensing wires and the interior of the cable-type water immersion sensor 401 form two electrical circuits. The two leakage sensing wires do not contact each other.

[0039] like Figure 1As shown, sealant is applied to the connection between the water pump 304 and the water distribution pipe 302, sealant is applied to the connection between the water distribution pipe 302 and the microchannel pipe 301, sealant is applied to the connection between the microchannel pipe 301 and the water collection pipe 303, and sealant is applied to the connection between the water collection pipe 303 and the radiator 305.

[0040] Working principle: Circuit board 1 supplies power to stacked chip 2, causing stacked chip 2 to start working. Simultaneously, circuit board 1 also supplies power to water pump 304, which draws liquid from heat sink 305. This liquid flows through pump 304 to water distribution pipe 302 and heat conductor 306. The bottom of heat conductor 306 contacts the top of stacked chip 2. Some of the heat generated by stacked chip 2 is absorbed at the top of stacked chip 2, while the bottom of heat conductor 306 absorbs some of the heat. Liquid continuously flows through the interior of heat conductor 306. As the liquid passes through heat conductor 306, its own temperature is low, while the temperature of heat conductor 306, after absorbing heat, is high. Heat is transferred from heat conductor 306 to the liquid. With the continuous influx of liquid, the heat absorption process continues. The liquid, after being pumped, flows out from the outlet of the heat-conducting component 306 under pressure and into the heat sink 305. After being cooled by the heat sink 305, the liquid's temperature decreases, and it is then drawn out again by the water pump 304 to cool the stacked chip 2. The liquid flowing into the water distribution pipe 302 experiences a reduction in impact force from the water pump 304 due to the transition from narrow to wide. Since the microchannel tube 301 is in internal contact with the stacked chip 2, the impact force on the microchannel tube 301 should be minimized to avoid damage to the transistors inside the stacked chip 2. The water slowly flows into the microchannel tube 301 through the water distribution pipe 302. The outer wall of the microchannel tube 301 and the inner wall of the stacked chip 2... When the stacked chip 2 comes into contact with the microchannel tube 301, the heat inside is transferred to the microchannel tube 301. Liquid flows through the microchannel tube 301, where the higher-temperature microchannel tube 301 transfers heat to the lower-temperature liquid. The liquid flows to the collecting tube 303, where it is gathered together. The liquid then flows out from the outlet of the collecting tube 303 to the heat sink 305, where it is cooled. The liquid then participates in the circulation again. Because the microchannel tube 301 needs to penetrate the stacked chip 2, its presence must be considered during the manufacturing of the stacked chip 2 so that the stacked chip 2 can utilize the microchannel tube 301. Through the placement of the microchannel tube 301, which penetrates the stacked chip 2 and comes into contact with its interior, it can remove heat generated during operation from the chip. The heat generated is controlled to prevent the internal temperature of the stacked chip 2 from rising, which could reduce its lifespan. It also prevents the stacked chip 2 from automatically reducing its frequency due to overheating, thus reducing its performance and improving the user experience. The water leakage detection component 4 prevents water from entering the stacked chip 2 in the event of a leak. Since the microchannel tube 301 is an integrated structure, leaks are most likely to occur at the connections between the microchannel tube 301 and the water distribution tube 302, or between the microchannel tube 301 and the water collection tube 303. A cable-type water immersion sensor 401 is installed at these locations to immediately alert the user when a leak is detected, ensuring that water does not enter the chip and thus extending its lifespan.The outer casing 402 is made of thermally conductive silicone, a material that conducts heat but not electricity. Therefore, it allows for the placement of two leakage detection wires without interference between them.

[0041] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A 3D chip packaging heat dissipation structure, characterized in that, include: Circuit board (1), the top of which is provided with a mounting groove; Stacked chips (2), the stacked chips (2) are installed in the mounting slot of the circuit board (1); A cooling assembly (3) is disposed on top of and inside the stacked chips (2); A water leakage detection component (4) is disposed between the cooling component (3) and the stacked chip (2). The cooling component (3) includes a water cooling component and a microchannel heat dissipation component. The water cooling component is disposed on the top of the stacked chip (2), and the microchannel heat dissipation component is disposed inside the stacked chip (2). The microchannel heat dissipation assembly includes a microchannel tube (301), one end of which penetrates one end of the stacked chip (2). A water collection tube (303) is fixedly connected to one end of the microchannel tube (301), and a water distribution tube (302) is fixedly connected to the other end of the microchannel tube (301). Heat dissipation assemblies are fixedly connected to both ends of the microchannel heat dissipation assembly. A water pump (304) is fixedly connected to the inlet end of the water distribution tube (302), and a radiator (305) is fixedly connected to the inlet end of the water pump (304). The inlet end of the radiator (305) and the outlet end of the water collection tube (303) are fixedly connected. The water leakage detection component (4) uses a cable-type water immersion sensor (401). The water leakage detection component (4) includes a housing (402). The bottom end of the housing (402) is fixed to the top end of the circuit board (1). The outer wall of the stacked chip (2) is fixed to the inside of the housing (402). One end of the housing (402) is in contact with one side of the water distribution pipe (302). The other end of the housing (402) is in contact with one side of the water collection pipe (303). The microchannel tube (301) passes through the housing (402). The bottom end of the cable-type water immersion sensor (401) is fixed to the top end of the circuit board (1). The cable-type water immersion sensor (401) and the circuit board (1) are connected by wires.

2. The 3D chip packaging heat dissipation structure according to claim 1, characterized in that: The bottom end of the radiator (305) is fixedly connected to a base, the bottom end of the base is fixed to the top end of the circuit board (1), the bottom end of the water pump (304) is fixed to the top end of the base, and the circuit board (1) is electrically connected to the radiator (305) and the water pump (304).

3. The 3D chip packaging heat dissipation structure according to claim 1, characterized in that: The water-cooling assembly includes a mounting bracket, the bottom of which is fixed to the top of the circuit board (1). A heat-conducting component (306) is fixedly connected inside the mounting bracket. The bottom of the heat-conducting component (306) is in contact with the top of the stacked chip (2). The water inlet of the heat-conducting component (306) is fixed to the water outlet of the water pump (304). The water outlet of the heat-conducting component (306) is fixed to the water inlet of the radiator (305).

4. The 3D chip packaging heat dissipation structure according to claim 1, characterized in that: The cable-type water immersion sensor (401) includes two water leakage sensing wires, which pass through the housing (402). The bottom end of the water leakage sensing wires is fixed to the bottom end inside the housing (402), and the housing (402) is made of thermally conductive silicone.

5. The 3D chip packaging heat dissipation structure according to claim 4, characterized in that: The two leakage sensing wires and the cable-type water immersion sensor (401) form two electrical circuits, and the two leakage sensing wires do not contact each other.

6. The 3D chip packaging heat dissipation structure according to claim 1, characterized in that: The connection between the water pump (304) and the water distribution pipe (302) is coated with sealant, the connection between the water distribution pipe (302) and the microchannel pipe (301) is coated with sealant, the connection between the microchannel pipe (301) and the water collection pipe (303) is coated with sealant, and the connection between the water collection pipe (303) and the radiator (305) is coated with sealant.

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