Display panel and display device

Abstract

The present invention discloses a display panel and a display device, belonging to the field of display technology. The display panel includes a substrate and a plurality of pad groups on one side of the substrate. One pad group includes a first pad and a second pad; in the pad group corresponding to the same light-emitting device, in the direction perpendicular to the plane of the substrate, the first pad at least partially overlaps with the first metal part and the overlapping area is S1, and the second pad at least partially overlaps with the second metal part and the overlapping area is S2. Alternatively, in the pad group corresponding to the same light-emitting device, in the direction perpendicular to the plane of the substrate, the first pad does not overlap with the first metal part, and the second pad does not overlap with the second metal part. The display device includes the above display panel. The present invention can improve the bonding success rate of the light-emitting device, avoid problems such as false soldering and poor contact, improve the product yield, and enhance the display effect.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly, to a display panel and a display device. Background Art

[0002] As electronic products such as mobile phones, computers and televisions are widely used in all aspects of life. Electronic display screens such as display panels are widely used. Among them, Micro LED (micro light-emitting diode) / Mini LED (mini light-emitting diode) technology, as a new display technology, has the characteristics of self-luminous display. It has the advantages of full solid state, long life, high brightness, low power consumption, small size, ultra-high resolution, and can be applied to extreme environments such as high temperature or radiation. It has good application prospects. Micro LED / Mini LED technology is LED miniaturization and matrix technology, which refers to the technology of integrating high-density, tiny-sized LED arrays on a chip to reduce the distance between pixels from millimeters to micrometers or even nanometers. Due to the small size of the LED chip, it can be used as a pixel on a display panel.

[0003] In the process of making Micro LED / Mini LED display panel, the Micro LED / Mini LED chip prepared by epitaxial growth on the wafer substrate will be transferred to the driving backplane through the transfer substrate to form an LED array. During the transfer process, the electrodes of the Micro LED / Mini LED chip need to be bound to the pads on the driving backplane. The pins of each LED chip are connected to the pads on the driving backplane by surface spot welding, which can be controlled separately. However, when the driving backplane made in the prior art is bound, due to the huge number of LED chips and the size of the LED chips at the micron level, the spacing between the LED chips is also relatively small, so that the contact area between the pins of the LED chips and the pads is getting smaller and smaller. In the vertical direction, the push-pull force of the LED chip is getting lower and lower, and the pins of the LED chips and the pads often have the phenomenon of cold welding and poor contact, which easily causes the LED chip to fall off, seriously reducing the yield of the product, and then affecting the normal display. Therefore, it is a technical problem to be solved by those skilled in the art to provide a display panel and a display device that can improve the success rate of LED chip binding, avoid the problems of cold welding and poor contact as much as possible, so as to improve the product yield, and then improve the display effect. Summary of the invention

[0004] In view of this, the present invention provides a display panel and a display device to solve the problem that in the prior art, the pins of the LED chip and the pads often have poor soldering and poor contact, which easily causes the LED chip to fall off, seriously reducing the yield of the product and thus affecting the normal display.

[0005] The present invention discloses a display panel, comprising: a substrate; a plurality of pad groups located on one side of the substrate, one pad group including a first pad and a second pad; at least one pad group corresponding to a light-emitting device; a first metal part and a second metal part located on the side of the pad group close to the substrate; wherein, in the pad groups corresponding to the same light-emitting device, in the direction perpendicular to the plane where the substrate is located, the first pad at least partially overlaps with the first metal part, and the second pad at least partially overlaps with the second metal part, the overlapping area of the first pad and the first metal part is S1, and the overlapping area of the second pad and the second metal part is S2. Alternatively, in the pad groups corresponding to the same light-emitting device, in the direction perpendicular to the plane where the substrate is located, the first pad does not overlap with the first metal part, and the second pad does not overlap with the second metal part.

[0006] Based on the same inventive concept, the present invention also discloses a display device, which includes the above display panel.

[0007] Compared with the prior art, the display panel and the display device provided by the present invention at least achieve the following beneficial effects:

[0008] The display panel provided by the present invention includes a substrate, which can be used as a carrier substrate of the display panel, and other structures of the display panel can be fabricated on the substrate. One side of the substrate includes a plurality of pad groups, at least one pad group is correspondingly arranged with a light-emitting device, and a light-emitting device can be bound and arranged above the pad group. One pad group includes a first pad and a second pad. In the display panel, a first metal part and a second metal part are included on the side of the pad group close to the substrate. When there is a first metal part directly below the first pad and a second metal part directly below the second pad in the pad groups corresponding to the same light-emitting device, the overlapping area of the first pad and the first metal part is basically equal to the overlapping area of the second pad and the second metal part, and satisfies As a result, the first pad and the second pad can be substantially kept on the same horizontal plane, and height differences between the first pad and the second pad in the direction perpendicular to the plane of the substrate can be avoided as much as possible, which is beneficial to improving the flatness of the first pad and the second pad corresponding to the same light-emitting device. Or when no first metal part is provided directly below the first pad and no second metal part is provided directly below the second pad, no metal part is provided below the first pad and the second pad corresponding to a pad group to damage their flatness. Further, when a light-emitting device is subsequently bonded to a pad group, it can be avoided as much as possible that a metal part directly below one pad in the same pad group raises the film layer while there is no metal part under the other pad, resulting in poor flatness of the pad group before the light-emitting device is bonded, and causing problems such as poor soldering or poor contact between the light-emitting device and the pad group. Height differences between the first pad and the second pad in the direction perpendicular to the plane of the substrate can be avoided as much as possible, which is beneficial to ensuring the electrical connection stability when the light-emitting device is bonded to the first pad and the second pad in the pad group, improving the bonding yield, and further improving the product yield, which is beneficial to improving the display quality.

[0009] Of course, any product implementing the present invention does not necessarily need to achieve all the above-described technical effects simultaneously.

[0010] Other features and advantages of the present invention will become clear from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0012] Figure 1 is a schematic plan view of a display panel provided by an embodiment of the present invention;

[0013] Figure 2 is Figure 1 a schematic cross-sectional structure view taken along the line A-A' in

[0014] Figure 3 is Figure 1 another schematic cross-sectional structure view taken along the line A-A' in

[0015] Figure 4 is Figure 1 another schematic cross-sectional structure view taken along the line A-A' in

[0016] Figure 5 is Figure 1 another schematic cross-sectional structure view taken along the line A-A' in

[0017] Figure 6 is Figure 1Another schematic diagram of the sectional structure in the A-A' direction;

[0018] Figure 7 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0019] Figure 8 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0020] Fig. 9 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0021] Fig.10 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0022] Fig.11 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0023] Fig.12 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0024] Fig.13 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0025] Fig.14 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0026] Fig.15 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0027] Fig.16 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0028] Fig.17 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0029] Fig.18 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0030] Fig.19 is Figure 1 Another schematic diagram of the sectional structure in the A-A' direction;

[0031] Fig. 20 is Figure 1Another schematic cross-sectional structure diagram in the direction of A-A';

[0032] Fig.21 It is Figure 1 Another schematic cross-sectional structure diagram in the direction of A-A';

[0033] Fig. 22 It is Figure 1 Another schematic cross-sectional structure diagram in the direction of A-A';

[0034] Fig.23 It is another schematic plan structure diagram of the display panel provided by the embodiment of the present invention;

[0035] Fig.24 It is another schematic plan structure diagram of the display panel provided by the embodiment of the present invention;

[0036] Fig.25 It is Fig.23 Schematic cross-sectional structure diagram in the direction of B-B';

[0037] Fig.26 It is Fig.23 Another schematic cross-sectional structure diagram in the direction of B-B';

[0038] Fig. 27 It is Fig.23 Another schematic cross-sectional structure diagram in the direction of B-B';

[0039] Fig.28 It is Fig.23 Another schematic cross-sectional structure diagram in the direction of B-B';

[0040] Fig.29 It is Fig.23 Another schematic cross-sectional structure diagram in the direction of B-B';

[0041] Fig.30 It is another schematic plan structure diagram of the display panel provided by the embodiment of the present invention;

[0042] Fig.31 It is Fig.23 Another schematic cross-sectional structure diagram in the direction of B-B';

[0043] Fig.32 It is another schematic plan structure diagram of the display panel provided by the embodiment of the present invention;

[0044] Fig.33 It is another schematic plan structure diagram of the display panel provided by the embodiment of the present invention;

[0045] Fig.34 It is another schematic plan structure diagram of the display panel provided by the embodiment of the present invention;

[0046] Fig.35 is Fig.34 a schematic cross-sectional structure diagram in the C-C' direction in

[0047] Fig.36 Another schematic plan view of the display panel provided by an embodiment of the present invention;

[0048] Fig.37 Another schematic plan view of the display panel provided by an embodiment of the present invention;

[0049] Fig.38 is Fig.23 Another schematic cross-sectional structure diagram in the B-B' direction in

[0050] Fig.39 is Fig.23 Another schematic cross-sectional structure diagram in the B-B' direction in

[0051] Fig.40 is Fig.23 Another schematic cross-sectional structure diagram in the B-B' direction in

[0052] Fig.41 is Figure 1 Another schematic cross-sectional structure diagram in the D-D' direction in

[0053] Fig.42 A schematic plan view of the display device provided by an embodiment of the present invention. Detailed implementation manners

[0054] Now, various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.

[0055] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present invention or its application or use.

[0056] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the specification.

[0057] In all the examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0058] It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0059] Please refer to Figure 1-Figure 5 , Figure 1 which is a schematic plan view of a display panel provided by an embodiment of the present invention, Figure 2 and Figure 1 is a schematic cross-sectional view taken along the line A-A' in Figure 3 and Figure 1 is another schematic cross-sectional view taken along the line A-A' in Figure 4 and Figure 1 is another schematic cross-sectional view taken along the line A-A' in Figure 5 and Figure 1 is another schematic cross-sectional view taken along the line A-A' in Figure 1 (it can be understood that, for the sake of clearly showing the structure of this embodiment,

[0060] a transparency filling is performed). The display panel 000 provided by this embodiment includes:

[0061] a substrate 10;

[0062] a plurality of pad groups 20 located on one side of the substrate 10, and one pad group 20 includes a first pad 201 and a second pad 202; at least one pad group 20 corresponds to one light-emitting device 30;

[0063] wherein,

[0064] as shown in Figure 2 , in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 and the first metal part 401 at least partially overlap, the second pad 202 and the second metal part 402 at least partially overlap, the overlapping area of the first pad 201 and the first metal part 401 is S1, and the overlapping area of the second pad 202 and the second metal part 402 is S2, or,

[0065] as shown in Figure 3 , in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 and the first metal part 401 do not overlap, and the second pad 202 and the second metal part 402 do not overlap.

[0066] Specifically, the display panel 000 provided in this embodiment includes a substrate 10. The substrate 10 can be used as a carrier substrate of the display panel 000, and other structures of the display panel 000 can be fabricated on the substrate 10. One side of the substrate 10 includes a plurality of pad groups 20. At least one pad group 20 is correspondingly arranged with a light-emitting device 30. One pad group 20 includes a first pad 201 and a second pad 202. Optionally, the light-emitting device 30 can include mini LED (sub-millimeter light-emitting diode), micro LED (micro light-emitting diode), nano LED (nano light-emitting diode), and their combinations, etc. Among them, micro LED and mini-LED are smaller than traditional LEDs, and their size is about 1 / 5 of the size of traditional LEDs, while nano LED refers to an LED with a single size below 1 micron (nano level). The micro LED, mini LED, and nano LED display technologies are self-luminous technologies, and their advantages include low power consumption, high brightness, ultra-high resolution and color saturation, fast response speed, ultra-low power consumption, long lifespan, high efficiency, etc. The pins (such as the cathode pin and the anode pin) of the light-emitting device 30 in this embodiment can be respectively bonded to the first pad 201 and the second pad 202 of a pad group 20. For example, the anode pin of the light-emitting device 30 is bonded to the first pad 201 to achieve the electrical connection between the anode pin of the light-emitting device 30 and the first pad 201, and the cathode pin of the light-emitting device 30 is bonded to the second pad 202 to achieve the electrical connection between the cathode pin of the light-emitting device 30 and the second pad 202. The device (not shown in the figure, such as a driving transistor) in the driving circuit layer connected to the first pad 201 can provide an anode driving signal for the anode pin of the light-emitting device 30, and the cathode signal line connected to the second pad 202 can provide a cathode driving signal for the cathode pin of the light-emitting device 30 to drive the light-emitting device 30 to emit light. Optionally, in this embodiment of the Figure 1Taking an example where one light-emitting device 30 corresponds to at least one pad group 20 for illustration, in specific implementation, the number of pad groups 20 corresponding to one light-emitting device 30 includes but is not limited to this. It is also possible that one light-emitting device 30 corresponds to two pad groups 20. Optionally, one of the two pad groups 20 can be used as a spare pad group, which can be enabled when the other pad group 20 fails. Even if there may be a problem of poor soldering in one pad group 20, it can be repaired through the other spare pad group to ensure electrical connection and enable the corresponding light-emitting device 30 to emit light normally. Optionally, the light-emitting device 30 and its corresponding pad group 20 can be overlapped in the direction perpendicular to the plane where the substrate 10 is located, that is, the light-emitting device 30 can be bound and arranged above the pad group 20. In the prior art, a driving circuit layer 01 can also be provided between the substrate 10 and the pad group 20. The first metal part 401 and the second metal part 402 can be partial structures in the driving circuit layer 01. The driving circuit layer 01 generally includes multiple conductive structures (such as metal conductive structures like transistors) and multiple conductive signal lines (such as scan signal lines, data signal lines, power signal lines, etc.), and can also include multiple insulating layers for insulation, which are not shown in the figure. Only the driving circuit layer 01 is schematically shown by multiple film layer structures. Through the setting of the driving circuit layer 01, the driving signal can be transmitted to each light-emitting device 30 to achieve the normal light-emitting display effect of the light-emitting device 30. Since the driving circuit layer 01 includes a relatively large number of conductive film layers, the graphic circuit trace design is likely to cause too large a height difference between the first pad 201 and the second pad 202 in the set pad group 20, that is, the circuit trace design of the driving circuit layer 01 is likely to be unevenly distributed, resulting in too large a height difference between the first pad 201 and the second pad 202 in the same pad group 20. Furthermore, when the light-emitting device 30 is bound to the pad group 20, it is very easy to have problems such as poor soldering and poor contact between the pins of the light-emitting device 30 and the first pad 201 and the second pad 202 in the pad group 20, which seriously affects the product yield and display quality.

[0067] In order to solve the above problems, in this embodiment, the side of the display panel 000 close to the substrate 10 and located at the pad group 20 includes a first metal portion 401 and a second metal portion 402. Optionally, the first metal portion 401 and the second metal portion 402 can be understood as two metal structures in the same film layer of the driving circuit layer, or can also be understood as two metal structures in different layers of multiple film layers in the driving circuit layer. This embodiment does not limit this, and only needs to satisfy that the first metal portion 401 and the second metal portion 402 are located on the side of the pad group 20 close to the substrate 10. In this embodiment, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 at least partially overlaps with the first metal portion 401, and the second pad 202 at least partially overlaps with the second metal portion 402, that is, there is a first metal portion 401 directly below the first pad 201, and there is a second metal portion 402 directly below the second pad 202. When the overlapping area S1 between the first pad 201 and the first metal portion 401 is equal to the overlapping area S2 between the second pad 202 and the second metal portion 402, there may be process errors during the manufacturing process, and the overlapping areas S1 and S2 may not be exactly equal, but only need to satisfy it can be understood that the overlapping area S1 between the first pad 201 and the first metal portion 401 is basically equal to the overlapping area S2 between the second pad 202 and the second metal portion 402. Thus, in a pad group 20 corresponding to the same light-emitting device 30, the area of the metal portion overlapping with the first pad 201 is basically equal to the area of the metal portion overlapping with the second pad 202, that is, the first pad 201 and the second pad 202 can basically be kept on the same horizontal plane, and it is possible to avoid as much as possible the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane where the substrate 10 is located, which is beneficial to improving the flatness of the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30; or, such as Figure 3As shown, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 and the first metal portion 401 do not overlap, and the second pad 202 and the second metal portion 402 do not overlap, that is, the first metal portion 401 is not arranged directly below the first pad 201, and the second metal portion 402 is not arranged directly below the second pad 202. When the metal portion is not arranged below the first pad 201 and the second pad 202 corresponding to one pad group 20 to destroy the flatness thereof, the occurrence of unevenness can be avoided as much as possible when the light-emitting device 30 is subsequently bound to one pad group 20. In the same pad group 20, there is a metal part directly below one pad to raise the film layer, while there is no metal part under the other pad, resulting in poor flatness of the pad group 20 before the light-emitting device 30 is bound, causing problems such as cold soldering or poor contact between the light-emitting device 30 and the pad group 20. The height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane of the substrate 10 can be avoided as much as possible, which is beneficial to ensure the stability of the electrical connection when the light-emitting device 30 is bound to the first pad 201 and the second pad 202 in the pad group 20, improve the binding yield, and then improve the product yield, which is beneficial to improving the display quality.

[0068] It can be understood that in the present embodiment, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 at least partially overlaps with the first metal portion 401, and the second pad 202 at least partially overlaps with the second metal portion 402, that is, when the first pad 201 has the first metal portion 401 below, and the second pad 202 has the second metal portion 402 below, only the first pad 201 and the second metal portion 402 are overlapped. Figure 2 The diagram shows a configuration structure in which the first metal portion 401 and the second metal portion 402 are located in the same metal film layer. In a specific implementation, the configuration structure of the first metal portion 401 and the second metal portion 402 includes but is not limited to this.

[0069] Optional, such as Figure 2 As shown, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 can at least partially overlap with a first metal part 401, and the second pad 202 can at least partially overlap with a second metal part 402, that is, there is a first metal part 401 under the first pad 201, and there is a second metal part 402 under the second pad 202, and the first metal part 401 and the second metal part 402 can be arranged in the same film layer.

[0070] Optional, such as Figure 4As shown, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 can at least partially overlap with a first metal part 401, and the second pad 202 can at least partially overlap with a second metal part 402. That is, there is a first metal part 401 below the first pad 201, and there is a second metal part 402 below the second pad 202, and the first metal part 401 that at least partially overlaps with the first pad 201 and the second metal part 402 that at least partially overlaps with the second pad 202 can be arranged in different film layers.

[0071] Optionally, as Figure 5 shown, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 can at least partially overlap with two or more first metal parts 401, and the second pad 202 can at least partially overlap with two or more second metal parts 402. That is, there is a first metal part 401 below the first pad 201, and there is a second metal part 402 below the second pad 202, and the two first metal parts 401 and the two second metal parts 402 can be arranged in the same film layer. At this time, the overlapping area S1 between the first pad 201 and the first metal part 401 can be understood as the sum of the overlapping areas between the first pad 201 and the two first metal parts 401, and the overlapping area S2 between the second pad 202 and the second metal part 402 can be understood as the sum of the overlapping areas between the second pad 202 and the two second metal parts 402. That is, the sum of the overlapping areas S1 between the first pad 201 and the two first metal parts 401 ( Figure 5 where S11 + S12 = S1 in Figure 5 is) and the overlapping area S2 between the second pad 202 and the two second metal parts 402 (

[0072] Optionally, as Figure 6 shown, Figure 6 is Figure 1Another schematic cross-sectional structure view in the A-A' direction. In the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane of the substrate 10, the first pad 201 can at least partially overlap with two first metal parts 401, and the second pad 202 can at least partially overlap with two second metal parts 402. That is, there is a first metal part 401 under the first pad 201, and there is a second metal part 402 under the second pad 202, and the two first metal parts 401 and the two second metal parts 402 can be arranged in different film layers. At this time, the overlapping area S1 between the first pad 201 and the first metal part 401 can be understood as the overlapping area between the first pad 201 and one of the first metal parts 401, and the overlapping area S2 between the second pad 202 and the second metal part 402 can be understood as the overlapping area between the second pad 202 and one of the second metal parts 402, and the two are basically equal or equal.

[0073] Optionally, the first metal part 401 and the second metal part 402 can also have other structural arrangements. Only when there is a first metal part 401 under the first pad 201 and a second metal part 402 under the second pad 202, the overlapping area S1 between the first pad 201 and the first metal part 401 and the overlapping area S2 between the second pad 202 and the second metal part 402 are basically equal or exactly equal, having the relationship within the allowable error range is sufficient, and this embodiment does not make any limitations in this regard.

[0074] It can be understood that this embodiment does not specifically limit the shapes and sizes of the first pad 201 and the second pad 202. In specific implementation, the first pad 201 and the second pad 202 can both be square or rectangular, or the shapes and sizes of the first pad 201 and the second pad 202 can be the same. This embodiment does not specifically limit the shapes and sizes of the first metal part 401 that at least partially overlaps with the first pad 201 and the second metal part 402 that at least partially overlaps with the second pad 202. The first metal part 401 and the second metal part 402 can be block-shaped conductive structures, or strip-shaped or wire-shaped wire structures. This embodiment does not make specific limitations. Only when there is a first metal part 401 directly under the first pad 201 and a second metal part 402 directly under the second pad 202, the overlapping area S1 between the first pad 201 and the first metal part 401 and the overlapping area S2 between the second pad 202 and the second metal part 402 are equal or basically equal.

[0075] It should be noted that only the structure of the display panel is exemplarily drawn in the accompanying drawings of this embodiment. In specific implementation, the structure of the display panel 000 includes but is not limited to this, and may also include other structures capable of achieving a display effect. For understanding, reference can be made to the structures of display panels such as micro LED, mini LED, and nano LED in related technologies, which will not be elaborated herein in this embodiment.

[0076] It should be further noted that in this embodiment Figure 1 only takes the example of multiple light-emitting devices 30 being arranged in an array on the substrate 10 for illustrative purposes. In specific implementation, the arrangement manner of the light-emitting devices 30 on the substrate 10 includes but is not limited to this, and may also be other arrangement manners, which are not limited in this embodiment.

[0077] Optionally, as Figure 1 and Figure 7 shown, Figure 7 is Figure 1 another schematic cross-sectional structure diagram in the A-A' direction in. The encapsulation form of the light-emitting device 30 in the display panel 000 of this embodiment can be a horizontal light-emitting chip. The first pin 301 (such as the P electrode in the PN junction, the anode pin) and the second pin 302 (such as the N electrode in the PN junction, the cathode pin) of the horizontal light-emitting chip are located on the surface of the light-emitting device 30 facing the substrate 10. Therefore, when binding the light-emitting device 30 to the pad group 20, it is necessary to ensure that the first pad 201 and the second pad 202 of a pad group 20 corresponding to the same light-emitting device 30 have a high flatness to ensure the binding connection effect between the first pin 301 of the light-emitting device 30 and the first pad 201, and the binding connection effect between the second pin 302 and the second pad 202.

[0078] Optionally, as Figure 1 and Figure 8 shown, Figure 8 is Figure 1 another schematic cross-sectional structure diagram in the A-A' direction in. The pad group 20 in this embodiment includes an electrode layer 20A and a eutectic layer 20B located on the side of the electrode layer 20A away from the substrate 10. The electrode layer 20A may include a first electrode 20A1 and a second electrode 20A2 made of a metal conductive material; the eutectic layer 20B can be made of a high-melting-point eutectic material, such as a eutectic material of solder and silver or gold. The region where the eutectic layer 20B overlaps with the first electrode 20A1 of the electrode layer 20A can be understood as the region of the first pad 201 in this embodiment, and the region where the eutectic layer 20B overlaps with the second electrode 20A2 of the electrode layer 20A can be understood as the region of the second pad 202 in this embodiment (such as Figure 8The dotted box in the figure indicates the circled area). The eutectic layer 20B has the characteristics of good electrical conductivity and high heat dissipation performance. The first pin 301 of the light-emitting device 30 can be bound and electrically connected to the first electrode 20A1 through the eutectic layer 20B. The surface of the eutectic layer 20B facing away from the substrate 10 is fixedly bound to the first pin 301 of the light-emitting device 30. The surface of the eutectic layer 20B facing the substrate 10 is fixedly bound to the first electrode 20A1. The second pin 302 of the light-emitting device 30 is bound and electrically connected to the second electrode 20A2 through the eutectic layer 20B. The surface of the eutectic layer 20B facing away from the substrate 10 is fixedly bound to the second pin 302 of the light-emitting device 30. The surface of the eutectic layer 20B facing the substrate 10 is fixedly bound to the second electrode 20A2, thereby achieving the transmission effect of the driving signal.

[0079] In some optional embodiments, please continue to refer to Figure 1 , Figure 2 , Figure 5 and Fig. 9 , Fig. 9 yes Figure 1 Another schematic diagram of the cross-sectional structure along the AA' line, in this embodiment, the first metal portion 401 and the second metal portion 402 are arranged in the same layer.

[0080] This embodiment explains that the first metal portion 401 and the second metal portion 402 can be arranged in the same layer. Figure 2 , Figure 5 and Fig. 9 As shown, the first metal part 401 and the second metal part 402 can be metal structures in any film layer in the driving circuit layer 01 between the pad group 20 and the substrate 10. It is only necessary that the first metal part 401 overlaps with the first pad 201 directly below, and the second metal part 402 overlaps with the second pad 202 directly below. The first metal part 401 and the second metal part 402 can be arranged on the same layer. No matter in which film layer of the driving circuit layer 01 the first metal part 401 and the second metal part 402 are located, the overlapping area S1 of the first pad 201 and the first metal part 401 and the overlapping area S2 of the second pad 202 and the second metal part 402 are basically equal or exactly equal, so that the first pad 201 and the second pad 202 can basically be maintained on the same horizontal plane, and the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane of the substrate 10 can be avoided as much as possible, which is beneficial to improving the flatness of the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30, ensuring the electrical connection stability when the light-emitting device 30 is bound to the first pad 201 and the second pad 202 in the pad group 20, and improving the binding yield as much as possible, thereby improving the product yield.

[0081] In some optional embodiments, please refer to Figure 1 and Fig.10 , Fig.10 is Figure 1 Another schematic cross-sectional structure view in the A-A' direction in [the context]. In this embodiment, the display panel 000 includes a first metal layer 40 on the side of the pad group 20 close to the substrate 10. Both the first metal part 401 and the second metal part 402 are located in the first metal layer 40, and there is no other metal layer between the first metal layer 40 and the pad group 20.

[0082] This embodiment explains that the first metal part 401 and the second metal part 402 are arranged on the same layer. For example, for the first metal layer 40 in the driving circuit layer 01, the first metal layer 40 can be understood as the conductive film layer closest to the pad group 20 among the multiple metal film layers of the driving circuit layer 01, that is, there is no other metal layer between the first metal layer 40 and the pad group 20. When the first metal layer 40 is reused as a certain metal layer in the driving circuit layer 01, it is preferably to reuse the metal layer closest to the pad group 20. That is, during the manufacturing process of the display panel 000, after the manufacturing process of the first metal layer 40 and before the manufacturing of the pad group 20, there is no manufacturing process of other metal layers. There is no other metal structure above the first metal layer 40 that affects the flatness of the film layer below the first pad 201 and the second pad 202 in the pad group 20. After manufacturing the insulating layer 011 that insulates the first metal layer 40 and the pad group 20 above the first metal layer 40, it can provide a relatively flat film layer base for the manufacturing of the pad group 20, so that the manufactured first pad 201 and second pad 202 have better flatness and can be basically on the same horizontal plane, which can improve the bonding yield of the subsequent light-emitting devices 30, and thus is beneficial to better improving the display effect.

[0083] Optionally, such as Fig.10As shown, in this embodiment, other metal layers may be included between the first metal layer 40 and the substrate 10. The other metal layers may be part of the metal conductive film layer of the driving circuit layer 01, and may be used to make transistor structures or scanning lines or other conductive structures in the driving circuit layer 01. This embodiment does not specifically limit the arrangement of the metal structures in the other metal film layers, but only needs to satisfy that in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 at least partially overlaps with the first metal portion 401 of the first metal layer 40, and the second pad 202 at least partially overlaps with the second metal portion 402 of the first metal layer 40, that is, when there is a first metal portion 401 in the first metal layer 40 directly below the first pad 201 and the closest to it, and there is a second metal portion 402 in the first metal layer 40 directly below the second pad 202 and the closest to it, The overlapping area S1 of the first pad 201 and the first metal portion 401 is equal to or substantially equal to the overlapping area S2 of the second pad 202 and the second metal portion 402, or the first pad 201 and the first metal portion 401 in the first metal layer 40 nearest to it do not overlap, and the second pad 202 and the second metal portion 402 in the first metal layer 40 nearest to it do not overlap, that is, the first metal portion 401 is not arranged directly below the first pad 201, and the second metal portion 402 is not arranged directly below the second pad 202, so that the first pad 201 and the second pad 202 can be basically maintained on the same horizontal plane, and the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane of the substrate 10 can be avoided as much as possible, so as to improve the flatness of the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30. This embodiment will not be described in detail here.

[0084] In some optional embodiments, please refer to Figure 1 and Fig.11 , Fig.11 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction, in this embodiment, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 at least partially overlaps with the first metal portion 401, and the second pad 202 at least partially overlaps with the second metal portion 402;

[0085] In the pad group 20 corresponding to the same light-emitting device 30, the orthographic projection of the first metal part 401 overlapping with the first pad 201 on the substrate 10 covers the orthographic projection of the first pad 201 on the substrate 10, and the orthographic projection of the second metal part 402 overlapping with the second pad 202 on the substrate 10 covers the orthographic projection of the second pad 202 on the substrate 10.

[0086] In this embodiment, it is explained that in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane of the substrate 10, the first pad 201 and the first metal portion 401 of the first metal layer 40 at least partially overlap, and the second pad 202 and the second metal portion 402 of the first metal layer 40 at least partially overlap. That is, when there is a first metal portion 401 in the first metal layer 40 closest to the bottom of the first pad 201 and a second metal portion 402 in the first metal layer 40 closest to the bottom of the second pad 202, the orthographic projection of the first metal portion 401 overlapping with the first pad 201 on the substrate 10 covers the orthographic projection of the first pad 201 on the substrate 10, and the orthographic projection of the second metal portion 402 overlapping with the second pad 202 on the substrate 10 covers the orthographic projection of the second pad 202 on the substrate 10. That is, when there are metal structures under both the first pad 201 and the second pad 202 of the same pad group 20, the area of the metal structure under the pad is made as large as possible. The first metal portion 401 can cover the entire first pad 201, and the second metal portion 402 can cover the entire second pad 202. It is equivalent to that the metal cushion structure under the first pad 201 can lift the entire area where the first pad 201 is located, and the metal cushion structure under the second pad 202 can also lift the entire area where the second pad 202 is located, avoiding the first pad 201 shifting out of the area where the first metal portion 401 is located below, causing a step difference in the first pad 201 and resulting in a flatness problem, and avoiding the second pad 202 shifting out of the area where the second metal portion 402 is located below, causing a step difference in the second pad 202 and resulting in a flatness problem. It can be understood that at this time, the overlapping area S1 between the first pad 201 and the first metal portion 401 is the area of the first pad 201 itself, and the overlapping area S2 between the second pad 202 and the second metal portion 402 is the area of the second pad 202 itself. The two are basically equal or equal, so that both the first pad 201 and the second pad 202 are lifted by the metal structure as a whole. The whole of the first pad 201 and the whole of the second pad 202 can be better on the same horizontal plane, and the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane of the substrate 10 can be avoided as much as possible, which is beneficial to better ensuring the flatness of the pad group 20 corresponding to the same light-emitting device 30 and further improving the yield of bonding the light-emitting device 30.

[0087] In some alternative embodiments, please refer to Figure 1 、 Figure 3 and Figure 12-14 , Fig.12 is Figure 1 Another schematic cross-sectional structure diagram in the A-A' direction in Fig.13 is Figure 1 Another schematic cross-sectional structure diagram in the A-A' direction in Fig.14 is Figure 1 Another schematic cross-sectional structure view in the A-A' direction. In this embodiment, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, the first pad 201 does not overlap with the first metal part 401, and the second pad 202 does not overlap with the second metal part 402.

[0088] In the pad group 20 corresponding to the same light-emitting device 30, in the direction X parallel to the plane where the substrate 10 is located, the minimum distance L1 from the first metal part 401 to the first pad 201 is greater than 8.5 μm, and the minimum distance L2 from the second metal part 402 to the second pad 202 is greater than 8.5 μm.

[0089] This embodiment explains that in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, when there is no metal structure overlapping directly below the first pad 201 and the second pad 202, that is, when the first pad 201 does not overlap with the first metal part 401 and the second pad 202 does not overlap with the second metal part 402, as Figure 3 shown, in the direction X parallel to the plane where the substrate 10 is located, the first metal part 401 can be located between the first pad 201 and the second pad 202, and the second metal part 402 can be located on the side of the second pad 202 away from the first pad 201. At this time, the first metal part 401 located between the first pad 201 and the second pad 202 can also be understood as the second metal part, and its minimum distance L2 to the second pad 202 also needs to satisfy being greater than 8.5 μm. Or as Fig.12 shown, the second metal part 402 can be located between the first pad 201 and the second pad 202, and the first metal part 401 can be located on the side of the first pad 201 away from the second pad 202. At this time, the second metal part 402 located between the first pad 201 and the second pad 202 can also be understood as the first metal part, and its minimum distance L1 to the first pad 201 also needs to satisfy being greater than 8.5 μm. Or as Fig.13 shown, the first metal part 401 can be located on the side of the first pad 201 away from the second pad 202, and the second metal part 402 can be located on the side of the second pad 202 away from the first pad 201; or as Fig.14 shown, the second metal part 402 and the first metal part 401 can be the same structure, that is, the first metal part 401 is reused as the second metal part 402 and is arranged between the first pad 201 and the second pad 202; or the first metal part 401 and the second metal part 402 can also be other arrangement methods, as long as in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, there is no metal structure overlapping directly below the first pad 201 and the second pad 202.

[0090] As Figure 3 , Figure 12-14 As shown, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane where the substrate 10 is located, when there is no metal structure overlapping with the first pad 201 and the second pad 202 directly below, in the pad group 20 corresponding to the same light-emitting device 30, in the direction X parallel to the plane where the substrate 10 is located, the minimum distance L1 from the first metal portion 401 to the first pad 201 is greater than 8.5 μm, that is, the distance L1 between the edge 401A of the first metal portion 401 facing the first pad 201 and the edge 201A of the first pad 201 facing the first metal portion 401 is greater than 8.5 μm, and the minimum distance L2 from the second metal portion 402 to the second pad 202 is greater than 8.5 μm, that is, the distance L2 between the edge 402A of the second metal portion 402 facing the second pad 202 and the edge 402A of the second metal portion 402 facing the second pad 202 The distance L2 between the edge 202A of the second metal part 402 and the edge 202A on the side of the second metal part 402 is greater than 8.5μm, thereby offsetting the flatness difference caused by the difference in the stacking of the underlying metal structure directly below the pad, and avoiding that the minimum distance L1 from the first metal part 401 to the first pad 201 is too small, causing the first metal part 401 to raise the insulating film layer covering the first metal part 401, and the raised position is too close to the first pad 201 subsequently manufactured, resulting in unevenness of the first pad 201 manufactured on the insulating layer, and avoiding that the minimum distance L2 from the second metal part 402 to the second pad 202 is too small, causing the second metal part 402 to raise the insulating film layer covering the second metal part 402, and the raised position is too close to the second pad 202 subsequently manufactured, resulting in unevenness of the second pad 202 manufactured on the insulating layer. Therefore, in the present embodiment, in the pad group 20 corresponding to the same light-emitting device 30, in the direction X parallel to the plane where the substrate 10 is located, the minimum distance L1 from the first metal part 401 to the first pad 201 is relatively large, and the minimum distance L2 from the second metal part 402 to the second pad 202 is also relatively large, and both L1 and L2 are greater than 8.5μm. In the pad group 20 corresponding to the same light-emitting device 30, when there is no metal structure overlapping with the first pad 201 and the second pad 202 directly below, the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane where the substrate 10 is located can be avoided as much as possible, which is beneficial to further improve the flatness of the first pad 201 and the second pad 202 in the pad group 20 and improve the product yield.

[0091] In some optional embodiments, please refer to Figure 1 and Figure 15-17 , Fig.15 yes Figure 1 Another cross-sectional structure schematic diagram along the A-A' direction, Fig.16 yes Figure 1 Another cross-sectional structure schematic diagram along the A-A' direction, Fig.17 yes Figure 1 Another cross-sectional structural diagram along the A-A' direction, in this embodiment, the display panel 000 further includes a thin film transistor array layer 012, optionally, a driving circuit layer 01 is included between the substrate 10 and the pad group 20, the thin film transistor array layer 012 may be a partial film layer in the driving circuit layer 01, and the thin film transistor array layer 012 is located on a side of the pad group 20 close to the substrate 10; the thin film transistor array layer 012 includes a plurality of thin film transistors T;

[0092] The thin film transistor array layer 012 includes a second metal layer 50, and the source TS and / or drain TD of the thin film transistor T are located in the second metal layer 50, and the second metal layer 50 is located on the side of the first metal part 401 and / or the second metal part 402 facing the substrate 10, or the first metal part 401 and / or the second metal part 402 are located in the second metal layer 50. Optionally, the source TS / drain TD of the thin film transistor T in this embodiment is electrically connected to the first pad 201 (the figure takes the drain TD of the thin film transistor T as an example for illustration), the light emitting device 30 is located on the side of the pad group 20 away from the substrate 10, and the light emitting device 30 includes a first pin 301 and a second pin 302, the first pin 301 is an anode pin, and the second pin 302 can be a cathode pin, the first pin 301 is bound and electrically connected to the first pad 201, and the second pin 302 is bound and electrically connected to the second pad 202.

[0093] This embodiment explains that the display panel 000 may also include a thin film transistor array layer 012 located between the pad group 20 and the substrate 10, and a driving circuit layer 01 is included between the substrate 10 and the pad group 20. The thin film transistor array layer 012 may be a partial film layer in the driving circuit layer 01. The thin film transistor array layer 012 is used to set a plurality of thin film transistors T. The thin film transistor array layer 012 of this embodiment includes at least a second metal layer 50, and the second metal layer 50 may be used to make a source TS and / or a drain TD of the thin film transistor T. Optionally, the thin film transistor array layer 012 may also include a third metal layer 60 and an active layer 70, the third metal layer 60 is located on the side of the second metal layer 50 facing the substrate 10, and the active layer 70 is located on the side of the third metal layer 60 facing the substrate 10. The third metal layer 60 may be used to make a gate TG of the thin film transistor T, and the active layer 70 may be used to make an active portion TP of the thin film transistor T. As shown in FIG. Fig.15As shown, the second metal layer 50 of this embodiment is located on the side of the first metal part 401 and / or the second metal part 402 facing the substrate 10. That is, when the first metal part 401 and the second metal part 402 are arranged on the same layer, such as when both are located in the first metal layer 40, the first metal layer 40 can be located on the side of the second metal layer 50 away from the substrate 10. The first metal layer 40 where the first metal part 401 and the second metal part 402 are located is the metal film layer closest to the pad group 20. At this time, in order for the thin-film transistor T to provide a driving signal for the light-emitting device 30, it is necessary to electrically connect the drain TD of the thin-film transistor T to the first pin (anode pin) of the light-emitting device 30. Then, the drain TD of the thin-film transistor T can be electrically connected to the first metal part 401 through a first via K1 first, and then the first metal part 401 is electrically connected to the first pad 201 through a second via K2. Furthermore, after the light-emitting device 30 is bonded to the pad group 20, the electrical connection effect between the thin-film transistor T and the light-emitting device 30 is realized, and thus the transmission of the driving signal is realized.

[0094] Optionally, as Fig.15 shown, the second metal part 402 is located in the first metal layer 40. Then, in the direction perpendicular to the plane where the substrate 10 is located, at least the first metal part 401 located in the first metal layer 40 and the drain TD located in the second metal layer 50 are included directly below the first pad 201. Therefore, in order to further reduce the height difference between the first pad 201 and the second pad 202, a first metal cushion layer 501 can also be included in the second metal layer 50 of this embodiment. The first metal cushion layer 501 is located directly below the second pad 202, that is, directly below the second metal part 402. The setting of the first metal cushion layer 501 in the second metal layer 50 can further raise the position of the second pad 202, keeping the first pad 201 and the second pad 202 as much as possible on the same horizontal plane. It can be understood that the first metal cushion layer 501 can be reused as the data line in the display panel 000, that is, the original metal structure that may exist in the second metal layer 50 in the display panel can be used as the first metal cushion layer 501, avoiding the influence of separately arranging a cushion layer structure in the display panel 000 on the transmittance of the display panel.

[0095] Further optionally, as Fig.15 shown, in this embodiment, if the first metal part 401 and the second metal part 402 are symmetrical about a symmetry axis, the drain TD of the thin-film transistor T and the first metal cushion layer 501 can also be symmetrical about this symmetry axis in the second metal layer 50, which is beneficial to making the heightening effect of the drain TD of the thin-film transistor T and the first metal cushion layer 501 uniform, avoiding inconsistent heightening of the first metal part 401 and the second metal part 402 by the drain TD of the thin-film transistor T and the first metal cushion layer 501, causing a large height difference between the first pad 201 and the second pad 202, and further affecting the flatness.

[0096] As Fig.16 shown, the first metal part 401 and / or the second metal part 402 of this embodiment are / is located in the second metal layer 50. That is, when the first metal part 401 and the second metal part 402 are arranged in the same layer, they can both be located in the second metal layer 50 where the source electrode TS and / or the drain electrode TD of the thin-film transistor T are / is located. The second metal layer 50 where the first metal part 401 and the second metal part 402 are located is a metal film layer closest to the pad group 20. At this time, in order for the thin-film transistor T to provide a driving signal for the light-emitting device 30, it is necessary to electrically connect the drain electrode TD of the thin-film transistor T to the first pin (anode pin) of the light-emitting device 30. Then, the drain electrode TD of the thin-film transistor T can be connected to the first metal part 401 in the same layer, such as achieving electrical connection through direct contact (it can be understood that the drain electrode TD of the thin-film transistor T at this time can also be understood as the first metal part 401, that is, there are two directly contacting first metal parts 401 under the first pad 201, and the overall overlapping area with the first pad 201 is S1), and then electrically connected to the first pad 201 through a third via K3. Furthermore, after the light-emitting device 30 is bonded to the pad group 20, the electrical connection effect between the thin-film transistor T and the light-emitting device 30 is achieved, and thus the transmission of the driving signal is realized.

[0097] Further optionally, as Fig.16 shown, in this embodiment, if the first metal part 401 and the second metal part 402 are symmetrical about an axis of symmetry, the overall structure formed by the drain electrode TD of the thin-film transistor T and the first metal part 401 can also be symmetrical about this axis of symmetry with the second metal part 402 in the second metal layer 50, which is beneficial to making the heightening effect on the first pad 201 and the second pad 202 uniform, avoiding a large height difference between the first pad 201 and the second pad 202, and further affecting the flatness.

[0098] As Fig.17As shown, the first metal part 401 and / or the second metal part 402 of this embodiment are / is located in the second metal layer 50. That is, when the first metal part 401 and the second metal part 402 are arranged on the same layer, they can both be located in the second metal layer 50 where the source electrode TS and / or the drain electrode TD of the thin film transistor T are / is located. The second metal layer 50 where the first metal part 401 and the second metal part 402 are located is a metal film layer closest to the pad group 20. At this time, in order for the thin film transistor T to provide a driving signal for the light-emitting device 30, it is necessary to electrically connect the drain electrode TD of the thin film transistor T to the first pin (anode pin) of the light-emitting device 30. Then, the drain electrode TD of the thin film transistor T can be understood as the first metal part 401 of this embodiment, that is, the first metal part 401 is multiplexed with the drain electrode TD of the thin film transistor T. The first metal part 401 and the first pad 201 are electrically connected through a fourth via hole K4, which can be understood as realizing the electrical connection between the drain electrode TD of the thin film transistor T and the first pad 201. Furthermore, after the light-emitting device 30 is bonded to the pad group 20, the electrical connection effect between the thin film transistor T and the light-emitting device 30 is realized, and then the transmission of the driving signal is realized.

[0099] Further optionally, as Fig.17 shown, in this embodiment, if the first metal part 401 and the second metal part 402 are symmetric about a symmetry axis, then the drain electrode TD (multiplexed as the first metal part 401) of the thin film transistor T and the second metal part 402 can also be symmetric about this symmetry axis in the second metal layer 50, which is beneficial to making the heightening effect on the first pad 201 and the second pad 202 uniform and avoiding a large height difference between the first pad 201 and the second pad 202, thereby affecting the flatness.

[0100] In some optional embodiments, please continue to refer to Figure 1 、 Figure 2 、 Figure 5 and Figure 6 、 Figure 15-17 , in this embodiment, in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane of the substrate 10, the number of the first metal parts 401 that at least partially overlap with a first pad 201 is M, and the number of the second metal parts 402 that at least partially overlap with a second pad 202 is N; where M = N, and both M and N are integers greater than or equal to 0.

[0101] This embodiment explains that in the pad group 20 corresponding to the same light-emitting device 30, in the direction Z perpendicular to the plane of the substrate 10, the number M of the first metal parts 401 that at least partially overlap with a first pad 201 and the number N of the second metal parts 402 that at least partially overlap with a second pad 202 are equal, as Figure 2As shown, in the same metal film layer, the number of the first metal parts 401 at least partially overlapping with a first pad 201 is 1, and the number of the second metal parts 402 at least partially overlapping with a second pad 202 is also 1; or Figure 5 As shown, in the same metal film layer, the number of first metal parts 401 at least partially overlapping with a first pad 201 is 2, and the number of second metal parts 402 at least partially overlapping with a second pad 202 is also 2, which is beneficial for making the number M of first metal parts 401 at least partially overlapping with a first pad 201 and the number N of second metal parts 402 at least partially overlapping with a second pad 202 in the same film layer equal, so as to avoid as much as possible the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane of the substrate 10, thereby improving the flatness of the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30.

[0102] It is understandable that if Figure 2 As shown, along the direction Z perpendicular to the plane where the substrate 10 is located, the number of first metal portions 401 included in different metal film layers and at least partially overlapping with a first pad 201 is 1, and the number of second metal portions 402 included in different metal film layers and at least partially overlapping with a second pad 202 is also 1; or Figure 6 As shown, along the direction Z perpendicular to the plane of the substrate 10, the number of first metal parts 401 included in different metal film layers and at least partially overlapping with a first pad 201 is 2, and the number of second metal parts 402 included in different metal film layers and at least partially overlapping with a second pad 202 is also 2.

[0103] It is understandable that if Figure 15-17 As shown, Fig.15 The first metal portion 401 located in the first metal layer 40 can be understood as a first metal portion 401 overlapping with the first pad 201, and the drain TD of the thin film transistor T located in the second metal layer 50 can be understood as another first metal portion 401 overlapping with the first pad 201, that is, Fig.15 The number M of the first metal parts 401 at least partially overlapping the first pad 201 can be understood as 2; similarly Fig.15 The second metal portion 402 located in the first metal layer 40 can be understood as a second metal portion 402 overlapping the second pad 202, and the first metal pad layer 501 located in the second metal layer 50 can be understood as another second metal portion 402 overlapping the second pad 202, that is, Fig.15 The number N of the second metal portions 402 at least partially overlapping the second pad 202 may also be understood to be two.

[0104] Understandably, Fig.16 The first metal part 401 located in the second metal layer 50 in and the drain TD of the thin film transistor T as a whole can be understood as a first metal part 401 overlapping with the first pad 201, that is Fig.16 In , the number M of the first metal parts 401 that at least partially overlap with the first pad 201 can be understood as 1; similarly Fig.16 The second metal part 402 located in the second metal layer 50 in can be understood as a second metal part 402 overlapping with the second pad 202, that is Fig.16 In , the number N of the second metal parts 402 that at least partially overlap with the second pad 202 can also be understood as 1.

[0105] It can be understood that Fig.17 The first metal part 401 that is multiplexed as the drain TD of the thin film transistor T and is located in the second metal layer 50 in can be understood as a first metal part 401 overlapping with the first pad 201, that is Fig.17 In , the number M of the first metal parts 401 that at least partially overlap with the first pad 201 can be understood as 1; similarly Fig.17 The second metal part 402 located in the second metal layer 50 in can be understood as a second metal part 402 overlapping with the second pad 202, that is Fig.17 In , the number N of the second metal parts 402 that at least partially overlap with the second pad 202 can also be understood as 1.

[0106] In some alternative embodiments, please refer to Figure 1 、 Figure 2 and Fig.18 , Fig.18 is Figure 1 Another schematic cross-sectional structure diagram in the A-A' direction in . In this embodiment, in a pad group 20, in the direction Z perpendicular to the plane where the substrate 10 is located, the minimum distance H1 from the first pad 201 to the substrate 10 is equal to the minimum distance H2 from the second pad 202 to the substrate 10.

[0107] In this embodiment, it is explained that in order to avoid a height difference between the first pad 201 and the second pad 202 in the Z direction perpendicular to the plane of the substrate 10 and improve the flatness of the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30, it can be set that in the Z direction perpendicular to the plane of the substrate 10, the minimum distance H1 from the first pad 201 to the substrate 10 is equal to or substantially equal to the minimum distance H2 from the second pad 202 to the substrate 10. During the manufacturing process, there may be process errors, and the minimum distance H1 from the first pad 201 to the substrate 10 and the minimum distance H2 from the second pad 202 to the substrate 10 may not be exactly equal, but as long as |H1 - H2| ≤ 0.5 μm is satisfied, the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30 can be made to be on the same horizontal plane as much as possible, which is beneficial to improving the subsequent bonding yield of the light-emitting device 30.

[0108] Optionally, as Fig.18 shown, the minimum distance H1 from the first pad 201 to the substrate 10 can be understood as the minimum distance between the surface of the first pad 201 facing the substrate 10 and the surface of the substrate 10 facing the first pad 201. During specific implementation, due to the existence of process errors, the surface of the first pad 201 facing the substrate 10 is not necessarily a horizontal plane, and it may be as Fig.18 shown, an inclined plane, while the surface of the second pad 202 facing the substrate 10 may be a horizontal plane. In this case, the minimum distance H1 from the first pad 201 to the substrate 10 can be understood as the distance between the point on the surface of the first pad 201 facing the substrate 10 that is closest to the substrate 10 and the surface of the substrate 10 facing the first pad 201. Similarly, due to the existence of process errors, the surface of the second pad 202 facing the substrate 10 is not necessarily a horizontal plane, and it may be as Fig.19 shown, Fig.19 is Figure 1 another schematic cross-sectional structure diagram in the A - A' direction in Fig. 20 shown, an inclined plane, while the surface of the first pad 201 facing the substrate 10 may be a horizontal plane. In this case, the minimum distance H2 from the second pad 202 to the substrate 10 can be understood as the distance between the point on the surface of the second pad 202 facing the substrate 10 that is closest to the substrate 10 and the surface of the substrate 10 facing the second pad 202. Or as Fig. 20 shown, Figure 1Another schematic diagram of the cross-sectional structure in the A-A' direction. Due to process errors, the surface of the second pad 202 facing the substrate 10 side is not necessarily a horizontal plane, and the surface of the first pad 201 facing the substrate 10 side is not necessarily a horizontal plane either. At this time, the minimum distance H1 from the first pad 201 to the substrate 10 can be understood as the distance between the closest point to the substrate 10 on the surface of the first pad 201 facing the substrate 10 side and the surface of the substrate 10 facing the first pad 201 side. The minimum distance H2 from the second pad 202 to the substrate 10 can be understood as the distance between the closest point to the substrate 10 on the surface of the second pad 202 facing the substrate 10 side and the surface of the substrate 10 facing the second pad 202 side.

[0109] Further optionally, as Figure 18-Figure 20 shown, due to process errors in this embodiment, the surface of the first pad 201 facing the substrate 10 side is not necessarily a horizontal plane, but an inclined plane. The angle α1 between the surface of the first pad 201 facing the substrate 10 side and the horizontal plane can be set to less than 3°. Within this angle α1 range, the surface of the first pad 201 facing the substrate 10 side can be approximately regarded as a horizontal plane, avoiding the problem that the excessive inclination degree of the first pad 201 causes too little bonding area with the first pin 301 of the light-emitting device 30, thereby causing the problem of unreliable bonding. Similarly, due to process errors in this embodiment, the surface of the second pad 202 facing the substrate 10 side is not necessarily a horizontal plane, but an inclined plane. The angle α2 between the surface of the second pad 202 facing the substrate 10 side and the horizontal plane can be set to less than 3°. Within this angle α2 range, the surface of the second pad 202 facing the substrate 10 side can be approximately regarded as a horizontal plane, avoiding the problem that the excessive inclination degree of the second pad 202 causes too little bonding area with the second pin 302 of the light-emitting device 30, thereby causing the problem of unreliable bonding.

[0110] It can be understood that in this embodiment Figure 18-Figure 20Only schematically shown is that one end of the first pad 201 facing the second pad 202 is inclined away from the substrate 10, and / or one end of the second pad 202 facing the first pad 201 is inclined away from the substrate 10. In specific implementation, the inclination modes of the first pad 201 and the second pad 202 include but are not limited to this. It is also possible that one end of the first pad 201 facing the second pad 202 is inclined away from the substrate 10, and one end of the second pad 202 away from the first pad 201 is inclined away from the substrate 10, or one end of the first pad 201 away from the second pad 202 is inclined away from the substrate 10, and one end of the second pad 202 facing the first pad 201 is inclined away from the substrate 10, etc. This embodiment does not limit this, and only needs to satisfy that when the surface of the first pad 201 on the side facing the substrate 10 is an inclined surface, the included angle α1 between the surface of the first pad 201 on the side facing the substrate 10 and the horizontal plane is less than 3°. Within this included angle α1 range, the surface of the first pad 201 on the side facing the substrate 10 can be approximately regarded as a horizontal plane; when the surface of the second pad 202 on the side facing the substrate 10 is an inclined surface, the included angle α2 between the surface of the second pad 202 on the side facing the substrate 10 and the horizontal plane is less than 3°. Within this included angle α2 range, the surface of the second pad 202 on the side facing the substrate 10 can be approximately regarded as a horizontal plane, so as to ensure the flatness of the two pads and improve the bonding effect of the light-emitting device 30.

[0111] Optionally, as Fig.21 and Fig. 22 shown, Fig.21 is Figure 1 another schematic cross-sectional structure diagram in the A-A' direction in Fig. 22 is Figure 1 another schematic cross-sectional structure diagram in the A-A' direction in. The minimum distance H1 from the first pad 201 to the substrate 10 can be understood as the minimum distance between the surface of the first pad 201 on the side facing the substrate 10 and the surface of the substrate 10 on the side facing the first pad 201. The minimum distance H2 from the second pad 202 to the substrate 10 can be understood as the minimum distance between the surface of the second pad 202 on the side facing the substrate 10 and the surface of the substrate 10 on the side facing the second pad 202. In specific implementation, due to process errors, although the surface of the first pad 201 on the side facing the substrate 10 is a horizontal plane and the surface of the second pad 202 on the side facing the substrate 10 is a horizontal plane, the surfaces of the first pad 201 on the side facing the substrate 10 and the second pad 202 on the side facing the substrate 10 may not be at the same height. At this time, the minimum distance H1 from the first pad 201 to the substrate 10 and the minimum distance H2 from the second pad 202 to the substrate 10 may not be exactly equal, but as long as |H1 - H2| ≤ 0.5 μm, it can be understood that the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30 are on the same horizontal plane.

[0112] In some alternative embodiments, please refer to Fig.23 、 Fig.24 and Figure 25-Figure 29 , Fig.23 which is another schematic plan view of the display panel provided by the embodiment of the present invention. Fig.24 which is another schematic plan view of the display panel provided by the embodiment of the present invention. Fig.25 is Fig.23 the schematic cross-sectional structure view in the direction of B-B' in Fig.26 is Fig.23 another schematic cross-sectional structure view in the direction of B-B' in Fig. 27 is Fig.23 another schematic cross-sectional structure view in the direction of B-B' in Fig.28 is Fig.23 another schematic cross-sectional structure view in the direction of B-B' in Fig.29 is Fig.23 another schematic cross-sectional structure view in the direction of B-B' in (it can be understood that, for clearly showing the structure of this embodiment, Fig.23 and Fig.24 are filled with transparency). In the display panel 000 provided in this embodiment, there are also included a plurality of light-emitting regions LA and a plurality of light-transmitting regions TA. The light-emitting region LA includes at least one light-emitting device 30, and the orthographic projection of the pad group 20 on the substrate 10 is located in the light-emitting region LA;

[0113] The display panel 000 also includes at least one insulating layer 02. The insulating layer 02 is located on the side of the pad group 20 close to the substrate 10, and the insulating layer 02 includes a through hole 02K located in the light-transmitting region TA;

[0114] In one pad group 20, along the direction X parallel to the plane where the substrate 10 is located, the minimum distance from the first pad 201 to the through hole 02K is W1, and the minimum distance from the second pad 202 to the through hole 02K is W2, where |W1 - W2| ≤ 1.1 μm.

[0115] This embodiment explains that the display panel 000 can be a transparent display panel. The display area of the display panel 000 can include a transparent display area AA. The transparent display area AA can include a plurality of light-emitting regions LA and a plurality of light-transmitting regions TA. Among them, along the direction parallel to the plane where the substrate 10 is located, the light-transmitting region TA and the light-emitting region LA are arranged adjacent to each other, and the transmittance of the light-transmitting region TA is greater than that of the light-emitting region LA. Optionally, as Fig.23As shown, the multiple light-emitting regions LA in this embodiment can be arranged in an array. The multiple light-emitting regions LA are arranged along the first direction X1 to form a light-emitting region row LAH, and the multiple light-emitting regions LA are arranged along the second direction X2 to form a light-emitting region column LAL. In two adjacent light-emitting region rows LAH, two light-emitting regions LA are located in the same light-emitting region column LAL. The first direction X1 and the second direction X2 intersect in the direction X parallel to the plane where the substrate 10 is located. In the figure, an example is given where the first direction X1 and the second direction X2 are perpendicular to each other. Or as Fig.24 As shown, the multiple light-emitting regions LA in this embodiment can be arranged in an array. The multiple light-emitting regions LA are arranged along the first direction X1 to form a light-emitting region row LAH, and the multiple light-emitting regions LA are arranged along the second direction X2 to form a light-emitting region column LAL. In two adjacent light-emitting region rows LAH, two light-emitting regions LA are respectively located in two adjacent light-emitting region columns LAL, that is, two adjacent light-emitting regions LA in the first direction X1 are staggered in the second direction X2, and two adjacent light-emitting regions LA in the second direction X2 are staggered in the first direction X1. Optionally, the arrangement manner of the multiple light-emitting regions LA in this embodiment includes but is not limited to the above structure, and can also be other arrangement manners, which are not elaborated herein.

[0116] The light-emitting region LA of this embodiment includes at least one light-emitting device 30. The orthographic projection of the pad group 20 on the substrate 10 is located in the light-emitting region LA, that is, no structure that affects the light transmittance is provided in the light-transmitting region TA. The display panel 000 further includes at least one insulating layer 02. The insulating layer 02 is located on the side of the pad group 20 close to the substrate 10. Optionally, the insulating layer 02 can be an inorganic insulating layer that insulates between multiple metal film layers. The insulating layer 02 of this embodiment is provided with a through hole 02K within the range of the light-transmitting region TA. Further optionally, during the manufacturing process of the display panel 000, a highly transparent material can be filled in the through hole 02K later to further improve the light transmittance of the light-transmitting region TA of the display panel 000.

[0117] In this embodiment, in a pad group 20, along a direction X parallel to the plane where the substrate 10 is located, the minimum distance from the first pad 201 to the via hole 02K is W1, and the minimum distance from the second pad 202 to the via hole 02K is W2. The minimum distance W1 from the first pad 201 to the via hole 02K can be understood as the distance between the edge of the first pad 201 facing the via hole 02K and the edge of the via hole 02K facing the first pad 201 between the first pad 201 and the nearest via hole 02K in the direction X parallel to the plane where the substrate 10 is located. The minimum distance W2 from the second pad 202 to the via hole 02K can be understood as the distance between the edge of the second pad 202 facing the via hole 02K and the edge of the via hole 02K facing the second pad 202 between the second pad 202 and the nearest via hole 02K in the direction X parallel to the plane where the substrate 10 is located. W1 and W2 are equal or substantially equal. During the manufacturing process, there may be process errors, and W1 and W2 may not be exactly equal, but as long as |W1 - W2| ≤ 1.1 μm, it can be understood that the minimum distance W1 from the first pad 201 to the via hole 02K and the minimum distance W2 from the second pad 202 to the via hole 02K are substantially equal or approximately equal or equal. In this embodiment, the minimum distance W1 from the first pad 201 to the via hole 02K and the minimum distance W2 from the second pad 202 to the via hole 02K are approximately equal, that is, the distance from the first pad 201 to the nearest via hole 02K and the distance from the second pad 202 to the nearest via hole 02K are substantially the same. In the prior art, for the production of the light-transmitting area TA, generally, through holes penetrating to the surface of the substrate 10 are formed in the insulating layer of multiple inorganic materials on the substrate 10, and the through holes are located in the light-transmitting area TA. The via hole 02K of the insulating layer 02 in this embodiment can be understood as the via hole 02K formed in a certain insulating layer 02 when forming the through hole. After forming the through hole penetrating to the surface of the substrate 10, an insulating layer of an organic material (such as Fig.25 the insulating layer of the organic material under the first metal part 401) is used to fill the through hole. Since the depth of the through hole will not be filled up when the insulating layer of the organic material fills and covers the through hole, there will be a height difference between the position of the through hole and the positions of other areas where no through hole is formed, resulting in the subsequent insulating layer (such as Fig.25The insulating layer 02 shown in the figure can be a planarization layer. During the manufacturing process, it is easy to have problems with leveling differences, resulting in poor flatness. Moreover, if the distance from the first pad 201 to the nearest through hole 02K is not the same as the distance from the second pad 202 to the nearest through hole 02K, there will also be a problem that the inclination degrees of the first pad 201 and the second pad 202 are inconsistent due to leveling differences. Therefore, in this embodiment, the distance from the first pad 201 to the nearest through hole 02K is set to be basically the same as the distance from the second pad 202 to the nearest through hole 02K, which can ensure that even if there is a leveling problem with the film layer under the pad group 20, the inclination degrees of the two can be basically the same, and it can avoid the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane of the substrate 10, so that the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30 are as much as possible on the same horizontal plane, thereby improving the flatness of the first pad 201 and the second pad 202 of the pad group 20 and being beneficial to ensuring the product yield.

[0118] Optionally, as Figure 23-Figure 29 shown, a plurality of light-transmitting regions TA are arranged along the first direction X1, and there is a pad group 20 between two adjacent light-transmitting regions TA along the first direction X1. The first pad 201 and the second pad 202 in a pad group 20 are also arranged along the first direction X1. At this time, along the first direction X1, the through hole 02K closest to the first pad 201 and the through hole 02K closest to the second pad 201 can be two different through holes on opposite sides of the light-transmitting region TA. The minimum distance W1 from the first pad 201 to the through hole 02K and the minimum distance W2 from the second pad 202 to the through hole 02K can be as Figure 23-Figure 25 shown

[0119] Optionally, as Fig.30 shown, Fig.30 is another schematic plan view of the display panel provided by the embodiment of the present invention (it can be understood that, for clearly showing the structure of this embodiment, Fig.30 transparency filling is performed). In this embodiment, a plurality of light-transmitting regions TA are arranged along the first direction X1, and there is a pad group 20 between two adjacent light-transmitting regions TA along the first direction X1. The first pad 201 and the second pad 202 in a pad group 20 can be arranged along the second direction X2. At this time, along the first direction X1, the through hole 02K closest to the first pad 201 and the through hole 02K closest to the second pad 201 can be the same through hole on the same side of the light-transmitting region TA. The minimum distance W1 from the first pad 201 to the through hole 02K and the minimum distance W2 from the second pad 202 to the through hole 02K can be as Fig.30 shown.

[0120] It should be noted that the present embodiment does not specifically limit the arrangement manner of the first pad 201 and the second pad 202 in the pad group 20. During specific implementation, the arrangement manner of the first pad 201 and the second pad 202 in the same pad group 20 between the two light-transmitting regions TA can be selected according to actual requirements, and the present embodiment does not limit this here.

[0121] Optionally, as Figure 26-Figure 29 shown, the first metal part 401 and the second metal part 402 in the present embodiment can be arranged on the same layer, or the first metal part 401 and the second metal part 402 can be arranged on different layers. The first pad 201 in a pad group 20 can correspond to multiple first metal parts 401, and the second pad 202 can correspond to multiple second metal parts 402. For specific reference, please refer to the description in the above embodiment. The arrangements of the first metal part 401 and the second metal part 402 in the above embodiment can effectively solve the problem of film layer inclination caused by the leveling difference of the film layer under the pad group 20, which is beneficial to ensuring that the first pad 201 and the second pad 202 in a pad group 20 between the light-transmitting regions TA are as much as possible on the same horizontal plane, and further ensuring the bonding effect of the light-emitting device 30.

[0122] In some alternative embodiments, please continue to refer to Figure 23-Figure 30 , in the present embodiment, in a pad group 20, along the direction X parallel to the plane where the substrate 10 is located, the minimum distance from the first pad 201 to the through hole 02K is W1, and the minimum distance from the second pad 202 to the through hole 02K is W2, where W1 ≥ 7.5 μm and W2 ≥ 7.5 μm.

[0123] This embodiment explains that the display panel 000 is a transparent display panel, and the display panel 000 includes at least one insulating layer 02, which is located on the side of the pad group 20 close to the substrate 10. When the insulating layer 02 opens a through hole 02K within the light-transmitting area TA of the transparent display panel, in order to avoid the unevenness caused by excessive tilting of the first pad 201 and the second pad 202 due to the difference in leveling of the film layer under the pad group 20, this embodiment sets a pad group 20, along the direction X parallel to the plane where the substrate 10 is located, the minimum distance W1 from the first pad 201 to the through hole 02K and the minimum distance W2 from the second pad 202 to the through hole 02K are both greater than or equal to 7 .5μm, it can be understood that, along the direction X parallel to the plane where the substrate 10 is located, the minimum distance W1 from the first pad 201 to the through hole 02K can be understood as the distance between the first pad 201 and the nearest through hole 02K, from the edge of the first pad 201 facing the through hole 02K to the edge of the through hole 02K facing the first pad 201 is W1; along the direction X parallel to the plane where the substrate 10 is located, the minimum distance W2 from the second pad 202 to the through hole 02K can be understood as the distance between the second pad 202 and the nearest through hole 02K, from the edge of the second pad 202 facing the through hole 02K to the edge of the through hole 02K facing the second pad 202 is W2. If the minimum distance W1 from the first pad 201 to the through hole 02K and the minimum distance W2 from the second pad 202 to the through hole 02K along the direction X parallel to the plane of the substrate 10 are too small, such as less than 7.5 μm, it is very likely that the insulating layer 02 will tilt downward (toward the direction close to the substrate 10) due to the digging of the through hole 02K, thereby causing the first pad 201 and the second pad 202 to tilt as well, resulting in a height difference and unevenness between the first pad 201 and the second pad 202 in the same pad group 20. In this embodiment, when the minimum distance W1 between the first solder pad 201 and the through hole 02K and the minimum distance W2 between the second solder pad 202 and the through hole 02K are set to be greater than or equal to 7.5μm, the flatness difference caused by the leveling difference of the film layer below the solder pad group 20 can be maintained within 0.1μm, that is, the tilting problem caused by the leveling difference of the film layer caused by digging the through hole 02K can be effectively solved, and the height difference between the first solder pad 201 and the second solder pad 202 in the direction Z perpendicular to the plane of the substrate 10 can be avoided as much as possible, so that the first solder pad 201 and the second solder pad 202 corresponding to the same light-emitting device 30 are on the same horizontal plane as much as possible, thereby improving the flatness of the first solder pad 201 and the second solder pad 202 of the solder pad group 20, which is beneficial to ensuring the product yield.

[0124] In some optional embodiments, please continue to refer to Figure 23-Figure 30, in this embodiment, in a pad group 20, along the direction X parallel to the plane where the substrate 10 is located, the minimum distance from the first metal part 401 to the via hole 02K is W3, and the minimum distance from the second metal part 402 to the via hole 02K is W4, where |W1 - W2| ≤ 1.1 μm.

[0125] In this embodiment, it is explained that the display panel 000 is a transparent display panel. The display panel 000 includes at least one insulating layer 02. The insulating layer 02 is located on the side of the pad group 20 close to the substrate 10. When the insulating layer 02 opens a through hole 02K within the light-transmitting area TA of the transparent display panel, in order to avoid the uneven leveling of the film layer under the pad group 20, the first metal part 401 and the second metal part 402 are overly inclined, which may further cause the first pad 201 and the second pad 202 to be overly inclined and result in a flatness problem. In this embodiment, in a pad group 20, along the direction X parallel to the plane where the substrate 10 is located, the minimum distance from the first metal part 401 to the through hole 02K is W3, and the minimum distance from the second metal part 402 to the through hole 02K is W4. The minimum distance W3 from the first metal part 401 to the through hole 02K can be understood as the distance between the edge of the first metal part 401 facing the through hole 02K and the edge of the through hole 02K facing the first metal part 401 between the first metal part 401 and the nearest through hole 02K in the direction X parallel to the plane where the substrate 10 is located. The minimum distance W4 from the second metal part 402 to the through hole 02K can be understood as the distance between the edge of the second metal part 402 facing the through hole 02K and the edge of the through hole 02K facing the second metal part 402 between the second metal part 402 and the nearest through hole 02K in the direction X parallel to the plane where the substrate 10 is located. W3 and W4 are equal or substantially equal. There may be process errors during the manufacturing process, and W3 and W4 may not be exactly equal, but as long as |W3 - W4| ≤ 1.1 μm, it can be understood that the minimum distance W3 from the first metal part 401 to the through hole 02K and the minimum distance W4 from the second metal part 402 to the through hole 02K are substantially equal or approximately equal or equal. In this embodiment, it is set that the minimum distance W3 from the first metal part 401 to the through hole 02K and the minimum distance W4 from the second metal part 402 to the through hole 02K are approximately equal, that is, the distance from the first metal part 401 to the nearest through hole 02K and the distance from the second metal part 402 to the nearest through hole 02K are substantially the same. Even if there are differences in the leveling of the film layer under the pad group 20, the inclination degrees of the first metal part 401 and the second metal part 402 corresponding to the same pad group 20 are also substantially the same, which can avoid the height difference between the first metal part 401 and the second metal part 402 in the direction Z perpendicular to the plane where the substrate 10 is located, and further avoid the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane where the substrate 10 is located. That is, it can make the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30 be on the same horizontal plane as much as possible, thereby improving the flatness of the first pad 201 and the second pad 202 of the pad group 20 and being beneficial to ensuring the product yield.

[0126] Optionally, as Figure 23-Figure 29As shown, multiple light-transmitting regions TA are arranged along the first direction X1. There is a pad group 20 along the first direction X1 between two adjacent light-transmitting regions TA. The first pad 201 and the second pad 202 in a pad group 20 are also arranged along the first direction X1. Then the first metal part 401 and the second metal part 402 are also arranged along the first direction X1, that is, the first pad 201 corresponds to at least one first metal part 401, and the second pad 202 corresponds to at least one second metal part 402. At this time, along the first direction X1, the through hole 02K closest to the first metal part 401 and the through hole 02K closest to the second metal part 402 can be two different through holes on opposite sides of the light-transmitting region TA. The minimum distance W3 from the first metal part 401 to the through hole 02K and the minimum distance W4 from the second metal part 402 to the through hole 02K can be as Figure 23-Figure 25 shown

[0127] Optionally, as Fig.30 shown, in this embodiment, multiple light-transmitting regions TA are arranged along the first direction X1. There is a pad group 20 along the first direction X1 between two adjacent light-transmitting regions TA. The first pad 201 and the second pad 202 in a pad group 20 can be arranged along the second direction X2. Then the first metal part 401 and the second metal part 402 are also arranged along the second direction X2, that is, the first pad 201 corresponds to at least one first metal part 401, and the second pad 202 corresponds to at least one second metal part 402. At this time, along the first direction X1, the through hole 02K closest to the first metal part 401 and the through hole 02K closest to the second metal part 402 can be the same through hole on the same side of the light-transmitting region TA. The minimum distance W3 from the first metal part 401 to the through hole 02K and the minimum distance W4 from the second metal part 402 to the through hole 02K can be as Fig.30 shown.

[0128] It should be noted that this embodiment does not specifically limit the arrangement manner of the first pad 201 and the second pad 202 in the pad group 20. During actual implementation, the arrangement manner of the first pad 201 and the second pad 202 in the same pad group 20 between two light-transmitting regions TA can be selected according to actual requirements, and this embodiment does not limit it here.

[0129] Optionally, as Figure 26-Figure 29As shown, the first metal part 401 and the second metal part 402 in this embodiment can be arranged on the same layer, or they can be arranged on different layers. The first pad 201 in a pad group 20 can correspond to multiple first metal parts 401, and the second pad 202 can correspond to multiple second metal parts 402. For specific reference, please refer to the description in the above embodiment. The arrangements of the first metal part 401 and the second metal part 402 in the above embodiment can effectively solve the problem of film layer inclination caused by the leveling difference of the film layer under the pad group 20, which is beneficial to ensuring that the first pad 201 and the second pad 202 in a pad group 20 between the light-transmitting areas TA are as much as possible on the same horizontal plane, thereby ensuring the bonding effect of the light-emitting device 30.

[0130] In some alternative embodiments, please refer to Fig.23 and Fig.31 , Fig.31 is Fig.23 Another schematic cross-sectional structure diagram taken along the B-B' direction in [reference figure]. In this embodiment, the insulating layer 02 is an organic layer, and the organic layer is located on one side of the first metal part 401 and / or the second metal part 402 close to the pad group 20, and the organic layer is in direct contact with the first metal part 401 and / or the second metal part 402.

[0131] This embodiment explains that the insulating layer 02 with the through hole 02K opened can be an organic layer. This organic layer can be a planarization layer. The insulating layer 02 made of an organic material such as at least one of polyimide, acrylate, and epoxy resin can have high flatness. This organic layer is located on one side of the first metal part 401 and / or the second metal part 402 close to the pad group 20, and the organic layer is in direct contact with the first metal part 401 and / or the second metal part 402, that is, the organic layer covers the film layer where the first metal part 401 and / or the second metal part 402 are located. The characteristic of the high flatness of the organic layer made of an organic material can be utilized to make the surface of the insulating layer 02 on the side facing away from the substrate 10 after covering the first metal part 401 and / or the second metal part 402 have high flatness, and as much as possible weaken the height difference problem brought by the first metal part 401 and / or the second metal part 402. Furthermore, the first pad 201 and the second pad 202 of the pad group 20 made on the side of this organic layer facing away from the substrate 10 can be as much as possible on the same horizontal plane, which is beneficial to ensuring the bonding yield of the light-emitting device 30.

[0132] It can be understood that, as shown in Fig.31As shown, between the insulating layer 02 of the organic layer and the substrate 10 in this embodiment, other insulating layers may also be included, such as a buffer layer 03 between the substrate 10 and the active layer 70, an insulating layer between the gate TG of the thin film transistor T, the active part TP of the thin film transistor T, and the film layers where the source TS / drain TD of the thin film transistor T are located, a passivation layer 04 on the side of the film layers where the source TS / drain TD of the thin film transistor T are located away from the substrate 10, etc. In this embodiment, the setting structure of the insulating film layer between the pad group 20 and the substrate 10 is not specifically limited, and only the insulating layer 02 covering the first metal part 401 and / or the second metal part 402 and the insulating layer 02 under the pad group 20 need to be the flat organic layer to minimize the height difference problem caused by the first metal part 401 and / or the second metal part 402 as much as possible.

[0133] In some alternative embodiments, please refer to Fig.31 and Fig.32 , Fig.32 which is another schematic plan view of the display panel provided by the embodiment of the present invention (it can be understood that, for the sake of clearly showing the structure of this embodiment, Fig.32 transparency filling is performed). In this embodiment, a plurality of light-transmitting regions TA are arranged along the first direction X1, and there is a pad group 20 along the first direction XA between two adjacent light-transmitting regions TA;

[0134] The first pad 201 and the second pad 202 in a pad group 20 are arranged along the first direction X1.

[0135] This embodiment explains that the display panel 000 can be a transparent display panel. The display area of the display panel 000 may include a transparent display area AA. The transparent display area AA may include a plurality of light-emitting areas LA and a plurality of light-transmitting areas TA. Among them, in a direction parallel to the plane where the substrate 10 is located, the light-transmitting area TA is adjacent to the light-emitting area LA, and the transmittance of the light-transmitting area TA is greater than that of the light-emitting area LA. When realizing the transparent display effect of the display panel 000, a plurality of light-transmitting areas TA are arranged along the first direction X1, and there is a pad group 20 along the first direction XA between two adjacent light-transmitting areas TA. Then, the first pad 201 and the second pad 202 in a pad group 20 also extend along the first direction X1. The first metal part 401 below the first pad 201 may be a part of a metal trace J1 extending along the second direction X2 or may be an independent metal structure. The second metal part 402 below the second pad 202 may be a part of another metal trace J2 extending along the second direction X2 or may be an independent metal structure. This embodiment does not limit this. In this embodiment, the problem of the height difference between the first pad 201 and the second pad 202 can be weakened by making the distances from the first pad 201 and the second pad 202 to their nearest vias 02K substantially equal, thereby improving the bonding yield of the light-emitting device 30.

[0136] In some alternative embodiments, please refer to Fig.33 , Fig.33 is another schematic plan view of the display panel provided by the embodiment of the present invention (it can be understood that, for clearly showing the structure of this embodiment, Fig.33 transparency filling is performed). In this embodiment, a plurality of light-transmitting areas TA are arranged along the first direction X1, and there is a pad group 20 along the first direction X1 between two adjacent light-transmitting areas TA. The first pad 201 and the second pad 202 in a pad group 20 may be arranged along the second direction X2.

[0137] This embodiment explains that the display panel 000 can be a transparent display panel. The display area of the display panel 000 can include a transparent display area AA, and the transparent display area AA can include a plurality of light-emitting areas LA and a plurality of light-transmitting areas TA. Wherein, along the direction parallel to the plane where the substrate 10 is located, the light-transmitting area TA is adjacent to the light-emitting area LA, and the transmittance of the light-transmitting area TA is greater than that of the light-emitting area LA to achieve the transparent display effect of the display panel 000. The plurality of light-transmitting areas TA are arranged along the first direction X1, and there is a pad group 20 along the first direction XA between two adjacent light-transmitting areas TA. Then, the first pad 201 and the second pad 202 in a pad group 20 are arranged along the second direction X2, which is different from the arrangement direction of the light-transmitting area TA. Thus, the first pad 201 and the second pad 202 of the same pad group 20 can be as close as possible to the middle position of the lower-layer wiring stack, and it is possible to ensure that the first pad 201 and the second pad 202 of a pad group 20 are on the same horizontal plane. As Fig.33 shown, the first metal part 401 below the first pad 201 and the second metal part 402 below the second pad 202 can be partial structures of the same metal wiring J3 extending along the second direction X2, or the first metal part 401 below the first pad 201 and the second metal part 402 below the second pad 202 can also be two independent metal structures, and the metal structures are also arranged along the second direction X2. Since the first pad 201 and the second pad 202 of the same pad group 20 can be concentrated as much as possible above the same metal wiring, the height difference problem between the first pad 201 and the second pad 202 can be better weakened, and the bonding yield of the light-emitting device 30 can be improved.

[0138] In some alternative embodiments, please refer to Fig.34 and Fig.35 . Fig.34 is another schematic plan view of the display panel provided by the embodiment of the present invention. Fig.35 is Fig.34 the schematic cross-sectional structure view in the direction of C-C' in Fig.34 (it can be understood that, for clearly showing the structure of this embodiment,

[0139] transparency filling is performed). In this embodiment, the display panel 000 further includes a plurality of light-emitting areas LA and a plurality of light-transmitting areas TA. The light-emitting area LA includes at least two light-emitting devices 30, and the orthographic projection of the pad group 20 on the substrate 10 is located in the light-emitting area LA;

[0140] This embodiment explains that the display panel 000 can be a transparent display panel. The display area of the display panel 000 can include a transparent display area AA. The transparent display area AA can include a plurality of light-emitting areas LA and a plurality of light-transmitting areas TA. Among them, along the direction parallel to the plane where the substrate 10 is located, the light-transmitting area TA is adjacent to the light-emitting area LA, and the transmittance of the light-transmitting area TA is greater than that of the light-emitting area LA. When realizing the transparent display effect of the display panel 000, the light-emitting area LA can include at least two light-emitting devices 30, such as Fig.34 and Fig.35 shown. Taking the light-emitting area LA including two light-emitting devices 30 as an example for illustration, the orthographic projection of the pad group 20 on the substrate 10 is located in the light-emitting area LA. The two light-emitting devices 30 can each correspond to at least one pad group 20. Optionally, a plurality of light-transmitting areas TA are arranged along the first direction X1, and there are at least two pad groups 20 between adjacent two light-transmitting areas TA along the first direction X1. One light-emitting device 30 can correspond to at least one pad group 20. The display panel 000 further includes at least one insulating layer 02. The insulating layer 02 is located on the side of the pad group 20 close to the substrate 10. Optionally, the insulating layer 02 can be an inorganic insulating layer that insulates between a plurality of metal film layers. The insulating layer 02 of this embodiment is provided with a through hole 02K within the range of the light-transmitting area TA. Further optionally, during the manufacturing process of the display panel 000, a highly transparent material can be filled in the through hole 02K subsequently to further improve the transmittance of the light-transmitting area TA of the display panel 000.

[0141] Between the substrate 10 and the pad group 20 in this embodiment, a driving circuit layer 01 may be included. Among them, multiple thin-film transistors T may be provided in the driving circuit layer 01. The thin-film transistors T are used to realize the electrical connection between the signal traces in the display panel 000 and the light-emitting devices 30. Optionally, the source TS / drain TD of the thin-film transistor T is electrically connected to the first pad 201. The first pad 201 may be bound and electrically connected to the first pin 301 of the light-emitting device 30. The first pin 301 may be understood as the anode pin of the light-emitting device 30. Optionally, the second pad 202 in this embodiment may be bound and electrically connected to the second pin 302 of the light-emitting device 30. The second pin 302 may be understood as the cathode pin of the light-emitting device 30. Since the cathode pins may be connected to the same potential signal, the multiple second pads 202 of the multiple different pad groups 20 in this embodiment may be electrically connected together to realize supplying the cathode signal to the multiple second pads 202 in the display panel 000 together. In this embodiment, when one light-emitting area LA between two adjacent light-transmitting areas TA includes at least two light-emitting devices 30, the first pad 201 in one pad group 20 is located on the side of the second pad 202 close to the light-transmitting area TA, that is, the first pad 201 bound and electrically connected to the first pin 301 of the anode pin is closer to the through hole 02K of the light-transmitting area TA. The metal structures (such as various conductive structures of the thin-film transistor T) required under the first pin 301 of the anode pin itself can be used to fill the problem of film layer inclination caused by the film layer leveling difference under the pad group 20, thereby being beneficial to further weakening the height difference problem between the first pad 201 and the second pad 202 of the same pad group 20 and improving the bonding yield of the light-emitting device 30.

[0142] Optionally, the first metal part 401 and the second metal part 402 in this embodiment may be provided on the same layer, or the first metal part 401 and the second metal part 402 may be provided on different layers. The first pad 201 in one pad group 20 may correspond to multiple first metal parts 401, and the second pad 202 may correspond to multiple second metal parts 402. For specific reference, please refer to the description in the above embodiment. The settings of the first metal part 401 and the second metal part 402 in the above embodiment can effectively solve the problem of film layer inclination caused by the film layer leveling difference under the pad group 20, thereby being beneficial to ensuring that the first pad 201 and the second pad 202 in one pad group 20 between the light-transmitting areas TA are as much as possible on the same horizontal plane, and further ensuring the bonding effect of the light-emitting device 30.

[0143] Optionally, please refer to Fig.25 、 Fig.36 and Fig.37 as shown in Fig.36 which is another schematic plan view of the display panel provided by the embodiment of the present invention. Fig.37Another schematic diagram of the planar structure of the display panel provided by the embodiment of the present invention (it can be understood that, for the sake of clearly showing the structure of this embodiment, Fig.36 and Fig.37 are filled with transparency). In this embodiment, multiple first pads 201 of different pad groups 20 are insulated from each other, and multiple second pads 202 of different pad groups 20 are electrically connected to each other through pad connection lines JL. The pad connection lines JL can be arranged in the same film layer as the pad group 20.

[0144] The first pin 301 of the light-emitting device 30 in this embodiment can be an anode pin. The first pin 301 is bound and electrically connected to the first pad 201. The first pin 301 can be understood as the anode pin of the light-emitting device 30. Therefore, multiple first pads 201 of different pad groups 20 are insulated from each other, so that each light-emitting device 30 can be independently driven to emit light. The second pad 202 can be bound and electrically connected to the second pin 302 of the light-emitting device 30. The second pin 302 can be understood as the cathode pin of the light-emitting device 30. Since the cathode pins can be connected to the same potential signal, multiple second pads 202 of different pad groups 20 in this embodiment can be electrically connected to each other through the pad connection lines JL to realize that multiple second pads 202 in the display panel 000 jointly supply a cathode signal. Optionally, since there are fewer conductive structures in the film layer where the pad group 20 is located, the pad connection lines JL can be arranged in the same film layer as the pad group 20. This can not only avoid occupying space when the pad connection lines JL are arranged in the driving circuit layer 01, thereby saving the wiring space in the driving circuit layer 01, but also reduce the connection difficulty between the second pads 202 and the pad connection lines JL, which is beneficial to improving the manufacturing process efficiency.

[0145] Optionally, as Figure 8 shown, the pad group 20 includes an electrode layer 20A and a eutectic layer 20B located on the side of the electrode layer 20A away from the substrate 10. The electrode layer 20A can include a first electrode 20A1 and a second electrode 20A2 made of a metal conductive material; the eutectic layer 20B can be made of a high-melting-point eutectic material, such as a eutectic material of solder and silver or gold. The overlapping area of the eutectic layer 20B and the first electrode 20A1 of the electrode layer 20A can be understood as the area of the first pad 201 in this embodiment, and the overlapping area of the eutectic layer 20B and the second electrode 20A2 of the electrode layer 20A can be understood as the area of the second pad 202 in this embodiment. The pad connection lines JL in this embodiment can be arranged in the same layer as the electrode layer 20A in the film layer where the pad group 20 is located, that is, the production material of the pad connection lines JL also uses a metal conductive material.

[0146] In some alternative embodiments, please refer to Fig.23 and Fig.38 , Fig.38 is Fig.23 Another schematic cross-sectional structure diagram in the B-B' direction. In this embodiment, a third metal portion 403 is included between two adjacent light-transmitting regions TA. In the direction Z perpendicular to the plane of the substrate 10, the third metal portion 403 does not overlap with the first pad 201, and the third metal portion 403 does not overlap with the second pad 202.

[0147] In the same pad group 20, the orthographic projection of the third metal portion 403 on the substrate 10 is located between the orthographic projection of the first pad 201 on the substrate and the orthographic projection of the second pad 202 on the substrate 10.

[0148] Along the direction from the first pad 201 to the second pad 202, the distance from the third metal portion 403 to the first pad 201 is equal to the distance from the third metal portion 403 to the second pad 202.

[0149] This embodiment explains that the display panel 000 can be a transparent display panel. The display area of the display panel 000 can include a transparent display area AA. The transparent display area AA can include a plurality of light-emitting regions LA and a plurality of light-transmitting regions TA. Wherein, along the direction parallel to the plane of the substrate 10, the light-transmitting regions TA are arranged adjacent to the light-emitting regions LA, and the transmittance of the light-transmitting regions TA is greater than the transmittance of the light-emitting regions LA to achieve the transparent display effect of the display panel 000. A third metal portion 403 can be included between two adjacent light-transmitting regions TA. In the direction Z perpendicular to the plane of the substrate 10, the third metal portion 403 does not overlap with the first pad 201, the third metal portion 403 does not overlap with the second pad 202, the orthographic projection of the third metal portion 403 on the substrate 10 is located between the orthographic projection of the first pad 201 on the substrate and the orthographic projection of the second pad 202 on the substrate 10. The third metal portion 403 can be understood as Figure 3The first metal part 401 in the embodiment, that is, in the direction Z perpendicular to the plane where the substrate 10 is located, no metal structure is provided directly below the first pad 201, no metal structure is provided directly below the second pad 202, and in the same pad group 20, along the direction from the first pad 201 to the second pad 202, the distance from the third metal part 403 to the first pad 201 is equal to the distance from the third metal part 403 to the second pad 202. The distance L01 from the edge of the third metal part 403 facing the first pad 201 to the edge of the first pad 201 facing the third metal part 403 is equal to or substantially equal to the distance L02 from the edge of the third metal part 403 facing the second pad 202 to the edge of the second pad 202 facing the third metal part 403. The third metal part 403 is located at a relatively middle position between the two pads. Optionally, the third metal part 403 may be one or more metal structures of different layers, which is not specifically limited in this embodiment. Thus, the flatness difference caused by the stacking difference of the underlying metal structures directly below the pads can be offset. When there is no metal structure overlapping directly below the first pad 201 and the second pad 202 in the pad group 20 corresponding to the same light-emitting device 30, the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane where the substrate 10 is located can be avoided as much as possible, which is beneficial to further improving the flatness of the first pad 201 and the second pad 202 in the pad group 20 and improving the product yield.

[0150] In some alternative embodiments, please refer to Fig.23 and Fig.39 , Fig.39 is Fig.23 Another schematic cross-sectional structure diagram in the B-B' direction in. In this embodiment, between two adjacent light-transmitting regions TA, there is a first metal part 401 and a second metal part 402;

[0151] In the same pad group 20, the orthographic projection of a first metal part 401 on the substrate 10 overlaps at least partially with the orthographic projection of the first pad 201 on the substrate, and the orthographic projection of a second metal part 402 on the substrate 10 overlaps at least partially with the orthographic projection of the second pad 202 on the substrate 10;

[0152] The first pad 201 and the second pad 202 in the same pad group 20 are symmetric structures with respect to the first symmetry axis D1, and the first metal part 401 and the second metal part 402 are symmetric structures with respect to the first symmetry axis D1.

[0153] This embodiment explains that the display panel 000 can be a transparent display panel. The display area of the display panel 000 can include a transparent display area AA. The transparent display area AA can include a plurality of light-emitting areas LA and a plurality of light-transmitting areas TA. Wherein, in a direction parallel to the plane where the substrate 10 is located, the light-transmitting area TA is adjacent to the light-emitting area LA, and the transmittance of the light-transmitting area TA is greater than that of the light-emitting area LA. When realizing the transparent display effect of the display panel 000, between two adjacent light-transmitting areas TA, there is a first metal part 401 and a second metal part 402. In the same pad group 20, the orthographic projection of a first metal part 401 on the substrate 10 at least partially overlaps with the orthographic projection of the first pad 201 on the substrate, and the orthographic projection of a second metal part 402 on the substrate 10 at least partially overlaps with the orthographic projection of the second pad 202 on the substrate 10. That is, there is a first metal part 401 under the first pad 201, and there is a second metal part 402 under the second pad 202, and the first metal part 401 and the second metal part 402 can be arranged in the same film layer to lift the first pad 201 and the second pad 202 respectively, which is beneficial to ensuring flatness. In this embodiment, the first pad 201 and the second pad 202 in the same pad group 20 are symmetrically structured with respect to the first symmetry axis D1, then the first metal part 401 and the second metal part 402 are symmetrically structured with respect to the first symmetry axis D1. Thus, the area where the first metal part 401 lifts the first pad 201 and the area where the second metal part 402 lifts the second pad 202 can be basically the same, and it can be avoided as much as possible that there is a height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane where the substrate 10 is located, which is beneficial to improving the flatness of the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30 and improving the bonding yield.

[0154] Optionally, when the first metal part 401 and the second metal part 402 in this embodiment are symmetrically structured with respect to the first symmetry axis D1, both the first metal part 401 and the second metal part 402 tend to be as close as possible to the nearest through hole 02K, to avoid the first metal part 401 and the second metal part 402 gathering towards the center positions of two adjacent light-transmitting areas TA at the same time. By making the metal parts as close as possible to the through hole 02K to fill the problem of film layer inclination caused by the film layer leveling difference under the pad group 20, the flatness of the first pad 201 and the second pad 202 can be further improved.

[0155] Optionally, please refer to Fig.23 and Fig.40 , Fig.40 is Fig.23Another schematic cross-sectional structure diagram in the B-B' direction. In this embodiment, a plurality of fourth metal parts 404 are included between two adjacent light-transmitting regions TA. Along the direction from the first pad 201 to the second pad 202, the plurality of fourth metal parts 404 are evenly arranged, that is, the distance between two adjacent fourth metal parts 404 can be basically equal.

[0156] This embodiment explains that the display panel 000 can be a transparent display panel. The display area of the display panel 000 can include a transparent display area AA. The transparent display area AA can include a plurality of light-emitting regions LA and a plurality of light-transmitting regions TA. Among them, along the direction parallel to the plane where the substrate 10 is located, the light-transmitting region TA is adjacent to the light-emitting region LA. The transmittance of the light-transmitting region TA is greater than that of the light-emitting region LA. To achieve the transparent display effect of the display panel 000, a plurality of fourth metal parts 404 can be included between two adjacent light-transmitting regions TA. Along the direction from the first pad 201 to the second pad 202, the plurality of fourth metal parts 404 are evenly arranged, that is, the distance between two adjacent fourth metal parts 404 can be basically equal. Since the number of fourth metal parts 404 between two adjacent light-transmitting regions TA is relatively large, and the distance between two adjacent light-transmitting regions TA is fixed, the distance between two adjacent fourth metal parts 404 will be relatively reduced. At this time, the step difference fluctuation of the metal parts under the pad group 20 can be ignored, and the plurality of fourth metal parts 404 are evenly arranged, so that the plurality of fourth metal parts 404 between two adjacent light-transmitting regions TA satisfy that the distance between two adjacent fourth metal parts 404 can be basically equal, which can avoid the height difference between the first pad 201 and the second pad 202 in the pad group 20 in the direction Z perpendicular to the plane where the substrate 10 is located, improve the flatness of the first pad 201 and the second pad 202 in the pad group 20, and improve the product yield.

[0157] It should be noted that Fig.40 only takes the example that there are 5 fourth metal parts 404 between two adjacent light-transmitting regions TA for illustration. In specific implementation, the number of fourth metal parts 404 included between two adjacent light-transmitting regions TA includes but is not limited to this, and can also be 3 or 4 or other numbers, as long as it does not affect the normal light-emitting effect of the light-emitting region LA.

[0158] In some alternative embodiments, please refer to Figure 1 、 Figure 2 、 Figure 6 and Fig.41 , Fig.41 is Figure 1 Another schematic cross-sectional structure diagram in the D-D' direction in. In this embodiment, the light-emitting device 30 at least includes a first-color light-emitting device 30A and a second-color light-emitting device 30B;

[0159] The first color light emitting device 30A is a blue or green light emitting device, and the second color light emitting device 30B is a red light emitting device;

[0160] In the pad group 20 corresponding to the first color light-emitting device 30A, the number of first metal parts 401 at least partially overlapping with a first pad 201 is P, and in the pad group 20 corresponding to the second color light-emitting device 30B, the number of first metal parts 401 at least partially overlapping with a first pad 201 is Q; wherein Q>P≥0, and P and Q are integers.

[0161] This embodiment explains that in the pad group 20 corresponding to the same light-emitting device 30, the number of first metal parts 401 of a different layer at least partially overlapping with a first pad 201 and the number of second metal parts 402 of a different layer at least partially overlapping with a second pad 202 in the direction Z perpendicular to the plane where the substrate 10 is located can be equal, such as Figure 2 As shown, in different metal film layers, the number of first metal portions 401 at least partially overlapping with a first pad 201 is 1, and the number of second metal portions 402 at least partially overlapping with a second pad 202 is also 1; or Figure 6 As shown, in different metal film layers, the number of first metal parts 401 of different layers at least partially overlapping with a first pad 201 is 2, and the number of second metal parts 402 of different layers at least partially overlapping with a second pad 202 is also 2, which is beneficial for making the number of first metal parts 401 at least partially overlapping with a first pad 201 and the number of second metal parts 402 at least partially overlapping with a second pad 202 in the same film layer equal, thereby avoiding as much as possible the height difference between the first pad 201 and the second pad 202 in the direction Z perpendicular to the plane of the substrate 10, thereby improving the flatness of the first pad 201 and the second pad 202 corresponding to the same light-emitting device 30.

[0162] In this embodiment, the number of first metal parts 401 of different layers corresponding to the pad groups 20 in the light-emitting devices 20 of different colors is different. Specifically, the light-emitting device 30 includes at least a first color light-emitting device 30A and a second color light-emitting device 30B. The first color light-emitting device 30A is a blue or green light-emitting device, and the second color light-emitting device 30B is a red light-emitting device, that is, the first color light-emitting device 30A has a higher light-emitting efficiency, and the second color light-emitting device 30B has a lower light-emitting efficiency. Then, in this embodiment, the number of first metal parts 401 at least partially overlapping with a first pad 201 in the pad group 20 corresponding to the first color light-emitting device 30A with higher light-emitting efficiency is P, and the number of first metal parts 401 at least partially overlapping with a first pad 201 in the pad group 20 corresponding to the second color light-emitting device 30B with lower light-emitting efficiency is Q, and Q>P≥0, such as Fig.41 Taking P as 1 and Q as 2 schematically, a larger number of metal structures can be provided below the second-color light-emitting device 30B with a lower luminous efficiency to raise the second-color light-emitting device 30B. As a result, in the packaged display panel 000, the second-color light-emitting device 30B with a lower luminous efficiency can be closer to the light-emitting surface of the display panel 000, which is beneficial to making the light-emitting brightness of the first-color light-emitting device 30A and the second-color light-emitting device 30B on the light-emitting surface of the display panel 000 as identical as possible, thereby improving the brightness uniformity of the entire display panel 000.

[0163] In some alternative embodiments, please refer to Fig.42 , Fig.42 which is a schematic plan view of the display device provided by an embodiment of the present invention. The display device 111 provided in this embodiment includes the display panel 000 provided by the above-mentioned embodiment of the present invention. Fig.42 This embodiment only takes a mobile phone as an example to illustrate the display device 111. It can be understood that the display device 111 provided by the embodiments of the present invention can be other display devices 111 with a display function, such as a computer, a television, a vehicle-mounted display device, etc. The present invention does not make specific limitations thereto. The display device 111 provided by the embodiments of the present invention has the beneficial effects of the display panel 000 provided by the embodiments of the present invention. For the specific description of the display panel 000, reference can be made to the above embodiments, and details are not described herein again.

[0164] As can be seen from the above embodiments, the display panel and the display device provided by the present invention achieve at least the following beneficial effects:

[0165] The display panel provided by the present invention includes a substrate, which can be used as a carrier substrate of the display panel, and other structures of the display panel can be fabricated on the substrate. One side of the substrate includes a plurality of pad groups, at least one pad group is correspondingly arranged with a light-emitting device, a light-emitting device can be bound and arranged above the pad group, and one pad group includes a first pad and a second pad. In the display panel, a first metal part and a second metal part are included on the side of the pad group close to the substrate. When there is a first metal part directly below the first pad and a second metal part directly below the second pad in the pad group corresponding to the same light-emitting device, the overlapping area between the first pad and the first metal part is substantially equal to the overlapping area between the second pad and the second metal part, and it satisfies As a result, the first pad and the second pad can be substantially kept on the same horizontal plane, and height differences between the first pad and the second pad in the direction perpendicular to the plane of the substrate can be avoided as much as possible, which is beneficial to improving the flatness of the first pad and the second pad corresponding to the same light-emitting device. Or when no first metal part is provided directly below the first pad and no second metal part is provided directly below the second pad, no metal part is provided below the first pad and the second pad corresponding to a pad group to damage their flatness. Furthermore, when a light-emitting device is subsequently bonded to a pad group, it can be avoided as much as possible that a metal part directly below one pad in the same pad group raises the film layer while there is no metal part under the other pad, resulting in poor flatness of the pad group before the light-emitting device is bonded, and causing problems such as poor soldering or poor contact between the light-emitting device and the pad group. Height differences between the first pad and the second pad in the direction perpendicular to the plane of the substrate can be avoided as much as possible, which is beneficial to ensuring the electrical connection stability when the light-emitting device is bonded to the first pad and the second pad in the pad group, improving the bonding yield, and further improving the product yield, which is beneficial to improving the display quality.

[0166] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A display panel, characterized in that, it includes: a substrate; a plurality of pad groups located on one side of the substrate, one of the pad groups includes a first pad and a second pad; at least one of the pad groups corresponds to a light-emitting device; a first metal part and a second metal part located on the side of the pad group close to the substrate; wherein, In the pad group corresponding to the same light-emitting device, in a direction perpendicular to the plane where the substrate is located, the first pad and the first metal part at least partially overlap, the second pad and the second metal part at least partially overlap, the overlapping area between the first pad and the first metal part is S1, and the overlapping area between the second pad and the second metal part is S2. Or, in the pad group corresponding to the same light-emitting device, in the direction perpendicular to the plane where the substrate is located, the first pad does not overlap with the first metal part, and the second pad does not overlap with the second metal part; the display panel further includes a plurality of light-emitting areas and a plurality of light-transmitting areas, the light-emitting areas include at least one of the light-emitting devices, and the orthographic projection of the pad group on the substrate is located in the light-emitting area; the display panel further includes at least one insulating layer, the insulating layer is located on the side of the pad group close to the substrate, and the insulating layer includes through holes located in the light-transmitting area; in one of the pad groups, in the direction parallel to the plane where the substrate is located, the minimum distance from the first metal part to the through hole is W3, and the minimum distance from the second metal part to the through hole is W4, wherein, |W3 - W4| ≤ 1.1 μm.

2. The display panel according to claim 1, characterized in that, the first metal part and the second metal part are arranged on the same layer.

3. The display panel according to claim 2, characterized in that, the display panel includes a first metal layer located on the side of the pad group close to the substrate, the first metal part and the second metal part are both located in the first metal layer, and there is no other metal layer between the first metal layer and the pad group.

4. The display panel according to claim 1, characterized in that, in the pad group corresponding to the same light-emitting device, in the direction perpendicular to the plane where the substrate is located, the first pad at least partially overlaps with the first metal part, and the second pad at least partially overlaps with the second metal part; in the pad group corresponding to the same light-emitting device, the orthographic projection of the first metal part overlapping with the first pad on the substrate covers the orthographic projection of the first pad on the substrate, and the orthographic projection of the second metal part overlapping with the second pad on the substrate covers the orthographic projection of the second pad on the substrate.

5. The display panel according to claim 1, characterized in that, in the pad group corresponding to the same light-emitting device, in the direction perpendicular to the plane where the substrate is located, the first pad does not overlap with the first metal part, and the second pad does not overlap with the second metal part; in the pad group corresponding to the same light-emitting device, in the direction parallel to the plane where the substrate is located, the minimum distance from the first metal part to the first pad is greater than 8.5 μm, and the minimum distance from the second metal part to the second pad is greater than 8.5 μm.

6. The display panel according to claim 1, characterized in that, The display panel further includes a thin film transistor array layer, and the thin film transistor array layer is located on a side of the pad group close to the substrate; the thin film transistor array layer includes a plurality of thin film transistors; The thin film transistor array layer includes a second metal layer, a source electrode and / or a drain electrode of the thin film transistor are / is located on the second metal layer, the second metal layer is located on a side of the first metal portion and / or the second metal portion facing the substrate, or the first metal portion and / or the second metal portion are / is located on the second metal layer.

7. The display panel according to claim 6, wherein, in the pad group corresponding to the same light-emitting device, in a direction perpendicular to a plane where the substrate is located, the number of the first metal portions at least partially overlapping with one first pad is M, and the number of the second metal portions at least partially overlapping with one second pad is N; wherein M = N, and both M and N are integers greater than or equal to 0.

8. The display panel according to claim 1, wherein, in a pad group, in a direction perpendicular to a plane where the substrate is located, a minimum distance from the first pad to the substrate is equal to a minimum distance from the second pad to the substrate.

9. The display panel according to claim 1, wherein, in a pad group, along a direction parallel to a plane where the substrate is located, a minimum distance from the first pad to the through hole is W1, and a minimum distance from the second pad to the through hole is W2, wherein |W1 - W2| ≤ 1.1 μm.

10. The display panel according to claim 9, wherein, W1 ≥ 7.5 μm, W2 ≥ 7.5 μm.

11. The display panel according to claim 1, wherein, the insulating layer is an organic layer, the organic layer is located on a side of the first metal portion and / or the second metal portion close to the pad group, and the organic layer is in direct contact with the first metal portion and / or the second metal portion.

12. The display panel according to claim 1, wherein, a plurality of the light-transmitting regions are arranged in a first direction, and there is one pad group between two adjacent light-transmitting regions along the first direction; the first pad and the second pad in a pad group are arranged along the first direction.

13. The display panel according to claim 1, wherein, the light-emitting region includes at least two of the light-emitting devices; the display panel includes a thin film transistor, a source electrode / drain electrode of the thin film transistor is electrically connected to the first pad, and the first pad in a pad group is located on a side of the second pad close to the light-transmitting region.

14. The display panel according to claim 13, wherein, a plurality of the light-transmitting regions are arranged in a first direction, and there are at least two pad groups between two adjacent light-transmitting regions along the first direction.

15. The display panel according to claim 1, wherein, Between two adjacent ones of the light-transmitting regions, there is a third metal portion; in a direction perpendicular to the plane of the substrate, the third metal portion does not overlap with the first pad, and the third metal portion does not overlap with the second pad; In the same pad group, the orthographic projection of the third metal portion on the substrate is located between the orthographic projection of the first pad on the substrate and the orthographic projection of the second pad on the substrate; In a direction from the first pad towards the second pad, the distance from the third metal portion to the first pad is equal to the distance from the third metal portion to the second pad.

16. The display panel according to claim 1, wherein, Between two adjacent ones of the light-transmitting regions, there is a first metal portion and a second metal portion; In the same pad group, the orthographic projection of one of the first metal portions on the substrate at least partially overlaps with the orthographic projection of the first pad on the substrate, and the orthographic projection of one of the second metal portions on the substrate at least partially overlaps with the orthographic projection of the second pad on the substrate; In the same pad group, the first pad and the second pad are symmetric structures with respect to a first axis of symmetry, and the first metal portion and the second metal portion are symmetric structures with respect to the first axis of symmetry.

17. The display panel according to claim 1, wherein, The light-emitting device at least includes a first-color light-emitting device and a second-color light-emitting device; The first-color light-emitting device is a blue or green light-emitting device, and the second-color light-emitting device is a red light-emitting device; In the pad group corresponding to the first-color light-emitting device, the number of the first metal portions that at least partially overlap with one of the first pads is P, and in the pad group corresponding to the second-color light-emitting device, the number of the first metal portions that at least partially overlap with one of the first pads is Q; wherein, Q > P ≥ 0, and P and Q are integers.

18. The display panel according to claim 1, wherein, The pad group includes an electrode layer and an eutectic layer located on a side of the electrode layer away from the substrate, and a region where the eutectic layer overlaps with the electrode layer is the first pad or the second pad.

19. A display device, wherein, it includes the display panel according to any one of claims 1 - 18.

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