An integrated circuit, control method and system
By using a controllable pull-up switch resistor and control unit in the integrated circuit, the pull-up resistor is disconnected before the target chip is powered on, thus solving the error signal problem caused by the pull-up power supply, improving the reliability of the integrated circuit and simplifying the peripheral circuit.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2020-02-14
- Publication Date
- 2026-07-03
AI Technical Summary
In existing integrated circuits, the pull-up resistor of the target chip is from the same source as the power supply of the SoC before power-on, which causes error signals and affects the reliability of the chip.
A controllable pull-up switch resistor is used, which is disconnected by the control unit before the target chip is powered on to prevent error signal transmission. The pull-up switch resistor is supplied with voltage through the built-in power supply voltage, which simplifies the external circuit structure.
It improves the reliability of integrated circuits, reduces the board area and production cost of peripheral circuits, and prevents the target chip from receiving error signals before power-on.
Smart Images
Figure CN115104259B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of integrated circuit technology, and in particular to an integrated circuit, a control method, and a system. Background Technology
[0002] Currently, integrated circuits are commonly found in electronic devices. For example, a system-on-chip (SoC) is a type of integrated circuit used to achieve specific goals. An SoC can integrate most of the core components of an electronic device and can control the operating state of other chips within the device.
[0003] For example, after the SoC powers on, it can control the power-on of the target chip via power control pins. After controlling the target chip to power on, the SoC can also configure the parameters in the target chip via configuration pins. Currently, in order to adapt to the target chip, it is often necessary to set a corresponding pull-up resistor for each configuration pin in the SoC's peripheral circuitry. One end of the pull-up resistor is connected to the corresponding configuration pin, and the other end is connected to the pull-up power supply.
[0004] However, in current electronic devices, the pull-up power supply of the pull-up resistor and the power supply of the SoC are usually the same. That is, after the SoC is powered on, the pull-up power supply of the pull-up resistor will start to discharge, causing the voltage of the configuration pin to be pulled up. As a result, the target chip will receive a signal from the configuration pin of the SoC before it is powered on, causing the target chip to malfunction.
[0005] Therefore, the reliability of current SoC chips still needs further improvement. Summary of the Invention
[0006] This application provides an integrated circuit, a control method, and a system to improve the reliability of the integrated circuit.
[0007] In a first aspect, embodiments of this application provide an integrated circuit, which mainly includes a power supply pin, a configuration pin, a pull-up switch resistor, and a control unit. The integrated circuit provided in this application embodiment can provide control signals to a target chip through its configuration pin. In the integrated circuit, the first end of the pull-up switch resistor is connected to the power supply pin, the second end of the pull-up switch resistor is connected to the configuration pin, and the control end of the pull-up switch resistor is connected to the control unit; the power supply pin can receive the power supply voltage of the integrated circuit; the control unit can control the pull-up switch resistor to be in an open state before the target chip is powered on.
[0008] In the integrated circuit provided in this application embodiment, the pull-up switch resistor is a controllable switching resistor. The control unit controls the pull-up switch resistor to be in an open state before the target chip is powered on, so that the pull-up voltage (the integrated circuit's supply voltage) received by the pull-up switch resistor is not transmitted to the configuration pin, and therefore not to the target chip. Therefore, this application embodiment helps prevent the target chip from receiving error signals from the integrated circuit's configuration pin before power-on, thereby improving the reliability of the integrated circuit. Furthermore, the pull-up switch resistor is built into the integrated circuit, using the integrated circuit's own supply voltage to provide the pull-up voltage. This implementation simplifies the structure of the integrated circuit's peripheral circuitry, reducing the board area occupied by the peripheral circuitry and manufacturing costs.
[0009] For example, the control unit controls the pull-up switch resistor to be in an open state before the target chip is powered on. Specifically, the control unit controls the pull-up switch resistor to be in an open state before a target time point, wherein the target time point is no earlier than the time point when the power-on voltage of the target chip reaches the target voltage. It can be understood that during the power-on process of the target chip, the power-on voltage supplied to the target chip can gradually increase from a lower initial voltage to the target voltage. In this embodiment, the control unit controls the pull-up switch resistor to be in an open state before the target time point, that is, before the power-on voltage of the target chip reaches the target voltage. This helps prevent the target chip from receiving error signals from the configuration pins of the integrated circuit during the power-on process. Therefore, adopting this technical solution is beneficial to further improve the reliability of the integrated circuit.
[0010] In this embodiment, the integrated circuit may further include a power control pin; the control unit may also output a power-on signal through the power control pin, which can conduct a power-on path to the target chip. In this case, the integrated circuit can also calculate the target time point based on the time point of the output power-on signal and the time delay for the target chip's power-on voltage to reach the target voltage.
[0011] In this embodiment, the integrated circuit can output control signals to the target chip via configuration pins. For example, the integrated circuit may further include a pull-down switch resistor, with a first terminal connected to the configuration pin, a second terminal grounded, and a control terminal connected to a control unit. In this case, the control unit can also control the pull-up switch resistor to be in an on or off state, and control the pull-down switch resistor to be in an on or off state, after the target chip is powered on, to generate control signals; and then output control signals to the target chip via the configuration pins.
[0012] To increase the types of target chips that the integrated circuit can be used with, the integrated circuit provided in this application embodiment may include multiple pull-up switching resistors connected in parallel. When generating a control signal, the control unit can determine one or more target pull-up switching resistors among the multiple pull-up switching resistors; the control unit can then control the one or more target pull-up switching resistors to be in an on or off state. When a target pull-up switching resistor is determined, that target pull-up switching resistor can adjust the high-level voltage of the control signal. When multiple target pull-up switching resistors are determined, the parallel resistance of the multiple target pull-up switching resistors can adjust the high-level voltage of the control signal. Using this implementation, by adjusting one or more target pull-up switching resistors determined by the control unit, the integrated circuit can be made compatible with different types of target chips.
[0013] For example, in the integrated circuit provided in this application embodiment, the pull-down switch resistor may include a pull-down switch and a pull-down resistor; the pull-down switch includes a first terminal, a second terminal, and a control terminal; wherein, the first terminal of the pull-down switch is connected to a configuration pin, the second terminal of the pull-down switch is connected to one end of the pull-down resistor, the control terminal of the pull-down switch is connected to a control unit, and the other end of the pull-down resistor is grounded. The control terminal of the pull-down switch is also the control terminal of the pull-down switch resistor. The control unit can turn on the pull-down switch, thereby controlling the pull-down switch resistor to be in a conducting state. The control unit can also turn off the pull-down switch, thereby controlling the pull-down switch resistor to be in a disconnected state.
[0014] For example, in the integrated circuit provided in this application embodiment, the pull-up switch resistor may include a pull-up switch and a pull-up resistor; the pull-up switch includes a first terminal, a second terminal, and a control terminal; the first terminal of the pull-up switch is connected to a configuration pin, the second terminal of the pull-up switch is connected to one end of the pull-up resistor, the control terminal of the pull-up switch is connected to a control unit, and the other end of the pull-up resistor is connected to a power supply pin. The control terminal of the pull-up switch is also the control terminal of the pull-up switch resistor. The control unit can turn on the pull-up switch, thereby controlling the pull-up switch resistor to be in a conducting state. The control unit can also turn off the pull-up switch, thereby controlling the pull-up switch resistor to be in a disconnected state.
[0015] In this embodiment, the resistance value of the pull-up switch resistor can be adapted to the target chip. For example, the resistance value of the pull-up switch resistor can include any value from 4.7KΩ to 10KΩ.
[0016] Secondly, embodiments of this application provide a control method that can be applied to integrated circuits. The technical effects of the corresponding solutions in the second aspect can be referred to the technical effects that can be obtained by the corresponding solutions in the first aspect, and repeated details will not be elaborated. For example, the integrated circuit to which embodiments of this application are applicable may include a pull-up switch resistor, a power supply pin, and a configuration pin. The first end of the pull-up switch resistor is connected to the power supply pin, and the second end of the pull-up switch resistor is connected to the configuration pin. The integrated circuit can provide control signals to the target chip through the configuration pin. In the method provided by embodiments of this application, the integrated circuit can receive the power supply voltage through the power supply pin. Before the target chip is powered on, the integrated circuit controls the pull-up switch resistor to be in an open state.
[0017] To further improve the reliability of the integrated circuit, in one possible implementation, the integrated circuit can determine whether it is necessary to continue controlling the pull-up switch resistor to be in the open state based on a target time point. The target time point is no earlier than the time when the power-on voltage of the target chip reaches the target voltage. For example, the integrated circuit can control the pull-up switch resistor to be in the open state before the target time point.
[0018] In this embodiment of the application, the integrated circuit can also output a power-on signal through the power control pin of the integrated circuit. The power-on signal can conduct the path to power on the target chip. The integrated circuit can calculate the target time point based on the time point of outputting the power-on signal and the time delay of the target chip's power-on voltage reaching the target voltage.
[0019] In this embodiment, the integrated circuit may further include a pull-down switch resistor, with a first terminal connected to a configuration pin and a second terminal grounded. In this case, after the target chip is powered on, the integrated circuit can control the pull-up switch resistor to be in an on or off state, and control the pull-down switch resistor to be in an on or off state, to generate a control signal; the integrated circuit can then output the control signal to the target chip through the configuration pin.
[0020] To increase the types of target chips that the integrated circuit can be applied to, the integrated circuit provided in this application embodiment may include multiple pull-up switching resistors connected in parallel. In this case, when generating a control signal, the integrated circuit can determine one or more target pull-up switching resistors among the multiple pull-up switching resistors. The integrated circuit can then control the one or more target pull-up switching resistors to be in an on or off state.
[0021] In this embodiment, the resistance value of the pull-up switch resistor can be adapted to the target chip. For example, the resistance value of the pull-up switch resistor can include any value from 4.7KΩ to 10KΩ.
[0022] Thirdly, embodiments of this application provide a system, which can be an electronic device. The technical effects of the corresponding solutions in the third aspect can be referred to the technical effects obtainable by the corresponding solutions in the first aspect, and repetitions will not be detailed. For example, the system provided in embodiments of this application may include a target chip and an integrated circuit as provided in any of the first aspects above.
[0023] These or other aspects of this application will become more apparent from the description of the following embodiments. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of an electronic device structure;
[0025] Figure 2 This application provides a schematic diagram of the system structure of an electronic device.
[0026] Figure 3 This is an enlarged schematic diagram of a partial structure in an integrated circuit provided in an embodiment of this application;
[0027] Figure 4 This is an enlarged schematic diagram of a partial structure in an integrated circuit provided in an embodiment of this application;
[0028] Figure 5 This is a schematic flowchart of a control method provided in an embodiment of this application;
[0029] Figure 6 This is a schematic diagram of a specific control method provided in an embodiment of this application. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. It should be noted that in the description of the embodiments of this application, "at least one" refers to one or more, where "multiple" refers to two or more. Therefore, in the embodiments of this invention, "multiple" can also be understood as "at least two". "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / ", unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship. Furthermore, it should be understood that in the description of this application, terms such as "first" and "second" are only used for distinguishing the purpose of description and should not be construed as indicating or implying relative importance or order.
[0031] It should be noted that in the embodiments of this application, "connection" refers to electrical connection. The connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components, such as the connection between A and B. Alternatively, it can be a direct connection between A and C, a direct connection between C and B, with A and B connected through C.
[0032] An integrated circuit (IC) is a miniature electronic device or component. It can be understood as a circuit that integrates a certain number of commonly used electronic components, such as resistors, capacitors, and transistors, along with the interconnections between these components, using semiconductor technology to create a circuit with a specific function. For example, chips such as System-on-a-Chip (SoC) and Central Processing Unit (CPU) can be implemented using integrated circuits.
[0033] Taking SoC as an example, SoC can also be called a system-on-a-chip or system chip. SoC is an integrated circuit used to implement a specific purpose. Most of the core components of an electronic device can be integrated into an SoC, thus forming a micro-sized system.
[0034] It's understandable that a System-on-a-Chip (SoC) often cannot integrate the entire electronic system of an electronic device. Therefore, in addition to the SoC, electronic devices may contain other functional chips with specific functions. For example, in addition to the SoC, smart TVs also have a screen driver chip, also known as a timing control (TCON) chip. The TCON chip in a smart TV is responsible for receiving image signals and converting them into timing signals to control the LCD screen.
[0035] For example, in addition to the SoC (System-on-a-Chip), a baseband chip is also included in a smart terminal. The baseband chip is used in a smart terminal to synthesize baseband signals for external transmission or to decode received baseband signals. Depending on the type of electronic device, the type of functional chip may vary; these will not be listed individually in this application's embodiments.
[0036] As the core of electronic devices, the System-on-a-Chip (SoC) can control the operation of other functional chips. The following explanation will use the TCON chip as an example. Figure 1 An exemplary schematic diagram of an electronic device structure is shown, such as... Figure 1 As shown, the electronic device 100 mainly includes a SoC 101, a TCON chip 102, and a power module 103.
[0037] like Figure 1As shown, SoC101 may include a power pin P1, a power control pin P2, a data pin P3, a configuration pin P4, and a configuration pin P5. Power pin P1 is connected to the power module 103, power control pin P2 is connected to the power switch MOS, and data pin P3, configuration pin P4, and configuration pin P5 are respectively connected to corresponding pins in the TCON chip 102.
[0038] The power switch MOS is located on the SoC board where the SoC is located. The power switch MOS mainly includes a control terminal, a first terminal, and a second terminal. The control terminal of the power switch MOS is connected to the power control pin P2 of the SoC, the first terminal of the power switch MOS is connected to the power module 103, and the second terminal of the power switch MOS is connected to the TCON chip.
[0039] The power module 103 may include a battery, a power management unit (PMU), and a direct-current converting circuit. The power module 103 is connected to both the SoC 101 and the first terminal of the power switch MOS. The power module 103 provides a supply voltage to the SoC 101. Generally, the supply voltage provided by the power module 103 to the SoC is 3.3V. However, other voltages are also possible, such as 1.8V. The SoC 101 receives the supply voltage through its power pin P1, thus powering on.
[0040] After power-on, SoC101 completes initialization and other operations. Then, SoC101 can continue to control the power-on of the TCON chip. Specifically, SoC101 can send a power-on signal to the power switch MOS via the power control pin P2. This power-on signal turns on the power switch MOS, thereby establishing a connection between the power module 103 and the TCON chip 102. The power module 103 outputs a power-on voltage VCC to the power switch MOS, which is then transmitted to the TCON chip. The TCON chip receives the power-on voltage VCC, thus completing the power-on process.
[0041] After the TCON chip is powered on, the SoC101 can continue to send control signal 1 to the TCON chip through configuration pin P4 and control signal 2 through configuration pin P5, thereby controlling the TCON chip through control signal 1 and control signal 2.
[0042] For example, SoC 101 can configure the TCON chip via control signal 1 and control signal 2, such as configuring parameters like display partitions and bit count. Specifically, control signal 1 can be a high-level signal, corresponding to the number 1, or a low-level signal, corresponding to the number 0, and control signal 2 similarly. Therefore, the TCON chip can have four pre-set configuration types, corresponding to 00, 01, 10, and 11, respectively. SoC 101 can use control signal 1 and control signal 2 to indicate the specific configuration type of the TCON chip, which can be any of the four configuration types, allowing the TCON chip 102 to complete the configuration according to the specific configuration type indicated by SoC 101.
[0043] After the TCON chip 102 is configured, the SoC 101 can transmit a data signal Data to the TCON chip 102 through the data pin P3, so that the TCON chip 102 can control the display panel to display images according to the data signal Data.
[0044] Generally, to improve the stability of configuration pins P4 and P5, such as Figure 1 As shown, pull-up resistor R1 corresponding to configuration pin P4 and pull-up resistor R2 corresponding to configuration pin P5 can also be set in the peripheral circuit of SoC101.
[0045] Taking pull-up resistor R1 as an example, one end of pull-up resistor R1 is connected to power module 103, and the other end is connected to configuration pin P4. Pull-up resistor R1 can receive pull-up voltage from power module 103. When control signal 1 output by configuration pin P4 is a high-level signal, pull-up resistor R1 can divide the pull-up voltage it receives, thereby suppressing the voltage of control signal 1 to protect TCON chip 102.
[0046] Generally, the value of the pull-up resistor R1 is set according to the TCON chip 102, so that when the control signal 1 is a high-level signal, the voltage of the control signal 1 can be recognized by the TCON chip 102, but the TCON chip 102 will not be damaged due to excessive current.
[0047] like Figure 1As shown, the pull-up voltage of pull-up resistor R1 and the supply voltage of SoC101 are from the same source. Therefore, when SoC101 powers on, pull-up resistor R1 will also receive a pull-up voltage, which may cause pull-up resistor R1 to provide a high-level signal to TCON chip 102. However, since SoC101 usually does not immediately turn on the power switch MOS after power-on, for example, SoC101 needs to complete initialization before turning on the power switch MOS, TCON chip 102 may misinterpret the signal received from pull-up resistor R1 before it has completed power-on.
[0048] In view of this, embodiments of this application provide an integrated circuit, which can be a SoC (System-on-a-Chip), a CPU, a microcontroller unit (MCU), or other integrated circuits with control functions. Embodiments of this application do not impose further limitations on this. For ease of description, embodiments of this application will continue to use a SoC as an example for further explanation.
[0049] Figure 2 An exemplary schematic diagram of the system structure of an electronic device to which an embodiment of this application applies is shown. For example... Figure 2 As shown, the electronic device 200 includes a SoC 201 and a target chip 202. The target chip 202 can be a functional chip controlled by the SoC 201, such as a baseband chip, a TCON chip, a sensor chip, or other functional chips that are in a different power domain from the SoC 201.
[0050] In one possible implementation, the electronic device 200 may further include a power module 203, which can supply power to the SoC 201 and the target chip 202. The implementation of the power module 203 can be referenced to the power module 103 described above, and will not be repeated here.
[0051] like Figure 2 As shown, SoC201 mainly includes a power pin P1, configuration pins P4 and P5, pull-up resistors (KR1 and KR2), and a control unit 2011. It should be understood that SoC201 may include one or more configuration pins, each with a corresponding pull-up resistor. Figure 2 In the configuration pin P4, there is a pull-up switch resistor KR1, and in the configuration pin P5, there is a pull-up switch resistor KR2. The SoC201 can provide control signals to the target chip through the configuration pins P4 and P5.
[0052] like Figure 2As shown, the pull-up switch resistor KR1 includes a first terminal, a second terminal, and a control terminal. The first terminal of the pull-up switch resistor KR1 is connected to the power supply pin P1. Therefore, when the SoC201 receives the supply voltage through the power supply pin P1, the supply voltage can also be used as the pull-up voltage of the pull-up switch resistor KR1.
[0053] The second terminal of the pull-up switch resistor KR1 is connected to the configuration pin P4, and the control terminal of the pull-up switch resistor KR1 is connected to the control unit 2011. The control unit 2011 can control the pull-up switch resistor KR1 to be in the off state before the target chip 202 is powered on.
[0054] It should be understood that the number of configuration pins does not affect the specific implementation of the embodiments of this application. For example, SoC 201 may include only one configuration pin, such as only configuration pin P4, or SoC 201 may include multiple configuration pins, such as configuration pins P4 and P5. When SoC 201 includes multiple configuration pins, each configuration pin also has a corresponding pull-up switch resistor, and the connection method between each configuration pin and its corresponding pull-up switch resistor is similar to that of configuration pin P4.
[0055] For example Figure 2 In the configuration pin P5, there is a pull-up switch resistor KR2. Pull-up switch resistor KR2 includes a first terminal, a second terminal, and a control terminal. The first terminal of pull-up switch resistor KR2 is connected to the power supply pin P1; therefore, when SoC201 receives a power supply voltage through power supply pin P1, this voltage can also be used as the pull-up voltage for pull-up switch resistor KR2. The second terminal of pull-up switch resistor KR2 is connected to configuration pin P5, and the control terminal of pull-up switch resistor KR2 is connected to control unit 2011. Control unit 2011 can control pull-up switch resistor KR2 to be in the off state before the target chip 202 is powered on.
[0056] Unless otherwise specified, the following explanation will use configuration pin P4 and pull-up switch resistor KR1 as examples. Other configuration pins (such as P5) and other pull-up switch resistors (such as KR2) in the SoC201 can be implemented in a similar way, and will not be described in detail here.
[0057] In this embodiment, the pull-up switch resistor KR1 is a controllable switching resistor. The control unit 2011 keeps the pull-up switch resistor KR1 open before the target chip 202 is powered on, so that the pull-up voltage (the power supply voltage of SoC 201) received by the pull-up switch resistor KR1 is not transmitted to the configuration pin P4, and therefore not to the target chip 202. Therefore, this embodiment helps prevent the target chip 202 from receiving an error signal from the configuration pin P4 before power-on, thereby improving the reliability of SoC 201.
[0058] Furthermore, in this embodiment, the pull-up switch resistor KR1 is integrated into the SoC201, and the pull-up voltage of the pull-up switch resistor KR1 is provided by the SoC's own power supply voltage. This implementation simplifies the structure of the SoC's peripheral circuitry, reducing the board area occupied and manufacturing costs of the peripheral circuitry.
[0059] After the target chip 202 is powered on, the SoC 201 can send control signal 1 through the configuration pin P4. In this embodiment, the specific implementation of control signal 1 is mainly determined according to the type of the target chip 202. For example, control signal 1 can be a high-level signal or a low-level signal to indicate the configuration type to the target chip 202, such as the configuration of the TCON chip 102 described above. Alternatively, control signal 1 can also carry configuration information of the target chip 202, such as the values of various parameters required for the target chip 202 to be configured. The target chip 202 can then complete the configuration based on the configuration information.
[0060] For example, such as Figure 3 As shown, the SoC 201 may also include a pull-down switch resistor KR3 corresponding to the configuration pin P4. The pull-down switch resistor KR3 includes a first terminal, a second terminal, and a control terminal. The first terminal of the pull-down switch resistor KR3 is connected to the configuration pin P4, and the second terminal of the pull-down switch resistor KR3 is grounded. After the target chip 202 is powered on, the control unit 2011 can control the pull-up switch resistor KR1 to be in a conducting or de-conducting state, and control the pull-down switch resistor KR3 to be in a conducting or de-conducting state, to generate control signal 1. Then, control signal 1 is output to the target chip through the configuration pin P4.
[0061] Specifically, when the pull-up switch resistor KR1 is in the on state and the pull-down switch resistor KR3 is in the off state, control signal 1 is at a high level. When the pull-up switch resistor KR1 is in the off state and the pull-down switch resistor KR3 is in the on state, control signal 1 is at a low level. Therefore, the control unit 2011 can generate control signal 1 by controlling the pull-up switch resistor KR1 to be in the on or off state, and by controlling the pull-down switch resistor KR3 to be in the on or off state.
[0062] Next, further exemplary descriptions will be given of the pull-up switch resistor KR1, the pull-down switch resistor KR3, and the control unit 2011.
[0063] Pull-up switch resistor KR1
[0064] In this embodiment, the resistance value of the pull-up switch resistor KR1 can be adapted to the target chip. This ensures that when control signal 1 is high, control signal 1 can be recognized by the target chip 202 without damaging the target chip 202 due to excessive current. Generally, the resistance value of the pull-up switch resistor can include any value from 4.7KΩ to 10KΩ.
[0065] like Figure 3 As shown, the pull-up switch resistor KR1 includes a pull-up switch Ku and a pull-up resistor Ru. The pull-up switch Ku includes a first terminal, a second terminal, and a control terminal. The first terminal of the pull-up switch Ku is connected to the configuration pin P4, the second terminal of the pull-up switch Ku is connected to one end of the pull-up resistor Ru, the control terminal of the pull-up switch Ku is connected to the control unit 2011, and the other end of the pull-up resistor Ru is connected to the power supply pin P1.
[0066] The control terminal of the pull-up switch Ku is also the control terminal of the pull-up switch resistor KR1. The control unit 2011 can turn on the pull-up switch Ku, thereby controlling the pull-up switch resistor KR1 to be in the on state. The control unit 2011 can also turn off the pull-up switch Ku, thereby controlling the pull-up switch resistor KR1 to be in the off state.
[0067] In this case, the resistance value of the pull-up resistor Ru is the same as the resistance value of the pull-up switch resistor KR1. That is, the resistance value of the pull-up resistor Ru can be adapted to the target chip 202. Generally, the resistance value of the pull-up resistor Ru can be any value from 4.7KΩ to 10KΩ.
[0068] Pull-down switch resistor KR3
[0069] like Figure 3 As shown, the pull-down switch resistor KR3 may include a pull-down switch Kd and a pull-down resistor Rd. The pull-down switch Kd includes a first terminal, a second terminal, and a control terminal. The first terminal of the pull-down switch Kd is connected to the configuration pin P4, the second terminal of the pull-down switch Kd is connected to one end of the pull-down resistor Rd, the control terminal of the pull-down switch Kd is connected to the control unit 2011, and the other end of the pull-down resistor Rd is grounded.
[0070] The control terminal of the pull-down switch Kd is also the control terminal of the pull-down switch resistor KR3. The control unit 2011 can turn on the pull-down switch Kd, thereby controlling the pull-down switch resistor KR3 to be in the on state. The control unit 2011 can also turn off the pull-down switch Kd, thereby controlling the pull-down switch resistor KR3 to be in the off state.
[0071] Generally, the pull-down resistor Rd has a large resistance value, which can reduce the current passing through the pull-down switch resistor KR3 when the pull-down switch Kd is turned on, thus helping to protect the pull-down switch Kd.
[0072] Control Unit 2011
[0073] In this embodiment, the control unit 2011 can control the pull-up switch resistor KR1 to be in an open state before the target chip 202 is powered on. It should be understood that the pull-up switch resistor KR1 is always in an open state before the target chip is powered on.
[0074] For functional chips like the TCON chip that require a relatively high operating voltage, a certain power-on delay is needed to complete the power-on process. Specifically, the control unit 2011 can output a power-on signal through the power control pin P2. This power-on signal can establish a path to power on the target chip 202. For example... Figure 2 In the process, the power-on signal can turn on the power switch MOS, thereby opening the path between the power module 203 and the target chip 202, so that the power-on voltage output by the power module 203 can be transmitted to the target chip 202.
[0075] Since the target chip 202 operates at a relatively high voltage, in order to protect the target chip 202, the power-on voltage will be gradually increased from a lower initial voltage to the target voltage. Only after the power-on voltage stabilizes at the target voltage can the target chip 202 be considered to have completed power-on.
[0076] In view of this, in one possible implementation, the control unit 2011 can control the pull-up switch resistor KR1 to be in the off state before the target time point. The target time point is no earlier than the time when the power-on voltage of the target chip 202 reaches the target voltage, that is, the time when the target chip 202 completes power-on.
[0077] For example, the control unit 2011 can calculate the target time point based on the time point of the output power-on signal and the time delay between the power-on voltage of the target chip 202 and the target voltage. The time delay between the power-on voltage of the target chip 202 and the time point between the start of power-on and the target voltage is the power-on delay of the target chip 202, which can be preset in the SoC 201.
[0078] In another possible implementation, the control unit 2011 can also start timing after outputting the power-on signal. Before the timing duration reaches the first delay, the pull-up switch resistor KR1 is in the off state. The length of the first delay is not less than the power-on delay of the target chip 202.
[0079] Next, the structure of the control unit 2011 will be further illustrated. For example... Figure 3 As shown, the control unit 2011 may include a processor and one or more registers. The processor and registers may be integrated in the same module or set independently. This application embodiment does not impose many restrictions on this.
[0080] One or more registers in the control unit 2011 correspond one-to-one with the switching resistors controlled by the control unit 2011. For example Figure 3 In the control unit 2011, there are register 1 and register 2. Register 1 corresponds to the pull-up switch resistor KR1, that is, register 1 is connected to the control terminal of the pull-up switch resistor KR1. Register 2 corresponds to the pull-down switch resistor KR3, that is, register 2 is connected to the control terminal of the pull-down switch resistor KR3.
[0081] For example Figure 4 In this configuration, SoC 201 may include N pull-up switch resistors (KR11 to KR1N, where N is an integer greater than 1) corresponding to configuration pin P4. In this case, control unit 2011 includes registers 11 to 1N and register 2. Registers 11 to 1N correspond to pull-up switch resistors KR11 to KR1N, respectively, and register 2 corresponds to pull-down switch resistor KR3.
[0082] by Figure 3 Taking the processor and register 1 as an example, the processor can write control information for the pull-up switch resistor KR1 into register 1. Register 1 then generates a drive signal based on the control information for the pull-up switch resistor KR1, which can control the pull-up switch resistor KR1 to be turned on or off.
[0083] To illustrate with a concrete example: When it is necessary to turn on the pull-up switch resistor KR1, the processor can write data 1 to register 1. Register 1 generates a drive signal a based on the written data 1 and provides drive signal a to the pull-up switch resistor KR1, turning KR1 on. When it is necessary to turn off the pull-up switch resistor KR1, the processor can write data 0 to register 1. Register 1 generates a drive signal b based on the written data 0 and provides drive signal b to the pull-up switch resistor KR1, turning KR1 off.
[0084] The control method of the control unit 2011 for other switching resistors is similar to that of the pull-up switching resistor KR1, and will not be described in detail here.
[0085] like Figure 4 As shown, N pull-up resistors in SoC201 are connected in parallel between power pin P1 and configuration pin P4. In this case, when configuring target chip 202, control unit 2011 can determine one or more target pull-up resistors among the N pull-up resistors, control the one or more target pull-up resistors to be in the on or off state, and control pull-down resistor KR3 to be in the on or off state to generate control signal 1.
[0086] In this embodiment, the resistance values of N pull-up switch resistors can be set according to the possible types of the target chip 202. The resistance values of different pull-up switch resistors can be the same or different.
[0087] Specifically, the target pull-up switch resistor information can be set for SoC 201 based on the target chip 202. When configuring the target chip 202, the control unit 2011 can determine one or more target pull-up switch resistors from N pull-up switch resistors based on the target pull-up switch resistor information.
[0088] When a single target pull-up switch resistor is determined, that target pull-up switch resistor can adjust the high-level voltage of control signal 1. When multiple target pull-up switch resistors are determined, the parallel resistance of the multiple target pull-up switch resistors can adjust the high-level voltage of control signal 1.
[0089] It is understandable that when configuring the target chip 202, among the N pull-up switch resistors, the pull-up switch resistors other than the target pull-up switch resistor are in the open state to avoid interfering with the control signal 1.
[0090] Based on the same technical concept, embodiments of this application also provide a control method. This method can be applied to integrated circuits. Exemplarily, the integrated circuit can be an integrated circuit (SoC) as provided in any of the above embodiments, which will not be described again in this application.
[0091] Figure 5 An exemplary schematic diagram of a control method provided in an embodiment of this application is shown. Figure 5 As shown, the method mainly includes the following steps:
[0092] S501: Receives power supply voltage through the power supply pin.
[0093] S502: Before the target chip is powered on, the pull-up switch resistor is kept in the open state.
[0094] In this embodiment, the pull-up switch resistor is a controllable switching resistor. The integrated circuit keeps the pull-up switch resistor open before the target chip is powered on, so that the pull-up voltage received by the pull-up switch resistor (i.e., the power supply voltage of the integrated circuit) is not transmitted to the configuration pin, and therefore not to the target chip. Therefore, this embodiment helps prevent the target chip from receiving error signals from the configuration pin before power-on, thereby improving the reliability of the integrated circuit.
[0095] Furthermore, the pull-up switch resistor in this application is integrated into the integrated circuit, and the pull-up voltage of the pull-up switch resistor is provided by the power supply voltage of the integrated circuit itself. This implementation method simplifies the structure of the peripheral circuitry of the integrated circuit, reducing the board area occupied by the peripheral circuitry and the production cost.
[0096] To further improve the reliability of the integrated circuit, in one possible implementation, the integrated circuit can determine whether it is necessary to continue controlling the pull-up switch resistor to be in the open state based on a target time point. The target time point is no earlier than the time when the power-on voltage of the target chip reaches the target voltage. For example, the integrated circuit can control the pull-up switch resistor to be in the open state before the target time point.
[0097] In this embodiment of the application, the integrated circuit can also output a power-on signal through the power control pin of the integrated circuit. The power-on signal can conduct the path to power on the target chip. The integrated circuit can calculate the target time point based on the time point of outputting the power-on signal and the time delay of the target chip's power-on voltage reaching the target voltage.
[0098] In this embodiment, the integrated circuit may further include a pull-down switch resistor, with a first terminal connected to a configuration pin and a second terminal grounded. In this case, after the target chip is powered on, the integrated circuit can control the pull-up switch resistor to be in an on or off state, and control the pull-down switch resistor to be in an on or off state, to generate a control signal; the integrated circuit can then output the control signal to the target chip through the configuration pin.
[0099] To increase the types of target chips that the integrated circuit can be applied to, the integrated circuit provided in this application embodiment may include multiple pull-up switching resistors connected in parallel. In this case, when generating a control signal, the integrated circuit can determine one or more target pull-up switching resistors among the multiple pull-up switching resistors. The integrated circuit can then control the one or more target pull-up switching resistors to be in an on or off state.
[0100] Next, with Figure 2 Taking the SoC201 shown as an example, we will illustrate this with a specific example. Figure 6 This is a schematic flowchart of a control method provided in an embodiment of this application, such as... Figure 6 As shown, the main steps include:
[0101] S601: SoC201 powers on. Specifically, SoC201 receives the power supply voltage from power module 203 via power pin P1, thus powering on. Generally, after powering on, SoC201 can also perform initialization operations. During S601, SoC201 controls pull-up switch resistors KR1 and KR2 to be in the off state.
[0102] S602: SoC201 outputs a power-on signal. Specifically, SoC201 can output a power-on signal to the power switch MOS via the power control pin P2. The power-on signal turns on the power switch MOS, thereby establishing a connection between the power module 203 and the target chip 202, allowing the power-on voltage output by the power module 203 to be transmitted to the target chip 202. During S602, SoC201 keeps the pull-up switch resistors KR1 and KR2 in the off state.
[0103] S603: SoC201 waits for a first delay. The length of this first delay is not less than the power-on delay of the target chip 202. After SoC201 outputs a power-on signal, the target chip 202 can be considered to have started powering on. After waiting for the first delay, the target chip 202 can be considered to have completed powering on. During the execution of S603, SoC201 controls the pull-up switch resistors KR1 and KR2 to be in the off state.
[0104] S604: SoC201 outputs control signals. During this period, SoC201 can control the pull-up switch resistor KR1 to be in a conducting state or a de-conducting state to generate control signal 1. Also, SoC201 can control the pull-up switch resistor KR2 to be in a conducting state or a de-conducting state to generate control signal 2. SoC201 can thus control the target chip 202 through control signals 1 and control signals 2.
[0105] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.
[0106] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.
[0107] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.
[0108] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.
[0109] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of protection of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.
Claims
1. An integrated circuit, characterized by include: The integrated circuit includes power pins, configuration pins, pull-up switch resistors, and a control unit. The configuration pins provide control signals to the target chip. The first end of the pull-up switch resistor is connected to the power supply pin, the second end of the pull-up switch resistor is connected to the configuration pin, and the control end of the pull-up switch resistor is connected to the control unit. The power pin is used to receive the power supply voltage of the integrated circuit; The control unit is used to control the pull-up switch resistor to be in an open state before the target chip is powered on, wherein the power module supplies power to the integrated circuit and the target chip; The control unit is specifically used for: Before the target time point, the pull-up switch resistor is controlled to be in the open state, and the target time point is not earlier than the time point when the power-on voltage of the target chip reaches the target voltage.
2. The integrated circuit of claim 1, wherein, The integrated circuit also includes a power control pin; The control unit is also used for: A power-on signal is output through the power control pin, and the power-on signal is used to conduct the path to power on the target chip; The target time point is calculated based on the time point of the output power-on signal and the time delay for the power-on voltage of the target chip to reach the target voltage.
3. The integrated circuit according to claim 1, characterized in that, The integrated circuit also includes a pull-down switch resistor, the first end of which is connected to the configuration pin, the second end of which is grounded, and the control terminal of which is connected to the control unit. The control unit is also used for: After the target chip is powered on, the pull-up switch resistor is controlled to be in the on or off state, and the pull-down switch resistor is controlled to be in the on or off state, so as to generate the control signal; The control signal is output to the target chip through the configured pin.
4. The integrated circuit according to claim 3, characterized in that, The integrated circuit includes multiple pull-up switching resistors connected in parallel; The control unit is specifically used for: Determine one or more target pull-up switch resistors among the plurality of parallel pull-up switch resistors; Control the one or more target pull-up switch resistors to be in the on or off state.
5. The integrated circuit according to claim 3, characterized in that, The pull-down switch resistor includes a pull-down switch and a pull-down resistor; The pull-down switch includes a first terminal, a second terminal, and a control terminal; The first end of the pull-down switch is connected to the configuration pin, the second end of the pull-down switch is connected to one end of the pull-down resistor, the control end of the pull-down switch is connected to the control unit, and the other end of the pull-down resistor is grounded.
6. The integrated circuit according to any one of claims 1 to 5, characterized in that, The pull-up switch resistor includes a pull-up switch and a pull-up resistor; The pull-up switch includes a first terminal, a second terminal, and a control terminal; The first end of the pull-up switch is connected to the configuration pin, the second end of the pull-up switch is connected to one end of the pull-up resistor, the control end of the pull-up switch is connected to the control unit, and the other end of the pull-up resistor is connected to the power pin.
7. The integrated circuit according to any one of claims 1 to 5, characterized in that, The resistance value of the pull-up switch resistor is adapted to the target chip.
8. The integrated circuit according to any one of claims 1 to 5, characterized in that, The resistance value of the pull-up switch resistor includes any value from 4.7KΩ to 10KΩ.
9. A control method, characterized in that, This is applied to an integrated circuit, which includes a pull-up switch resistor, a power supply pin, and a configuration pin. The first end of the pull-up switch resistor is connected to the power supply pin, and the second end of the pull-up switch resistor is connected to the configuration pin. The integrated circuit can provide control signals to a target chip through the configuration pin, and a power module supplies power to the integrated circuit and the target chip. The method includes: The power supply voltage is received through the power pin; Before the target chip is powered on, the pull-up switch resistor is controlled to be in the open state; Before the target chip is powered on, controlling the pull-up switch resistor to be in an open state specifically includes: Before the target time point, the pull-up switch resistor is controlled to be in the open state, and the target time point is not earlier than the time point when the power-on voltage of the target chip reaches the target voltage.
10. The control method according to claim 9, characterized in that, After receiving the power supply voltage through the power pin, the system also includes: A power-on signal is output through the power control pin of the integrated circuit, and the power-on signal is used to conduct the path to power on the target chip; The target time point is calculated based on the time point of the output power-on signal and the time delay for the power-on voltage of the target chip to reach the target voltage.
11. The control method according to claim 9, characterized in that, The integrated circuit further includes a pull-down switch resistor, a first terminal of which is connected to the configuration pin, and a second terminal of which is grounded. The method further includes: After the target chip is powered on, the pull-up switch resistor is controlled to be in the on or off state, and the pull-down switch resistor is controlled to be in the on or off state, so as to generate a control signal; The control signal is output to the target chip through the configured pin.
12. The control method according to claim 11, characterized in that, The integrated circuit includes multiple pull-up switching resistors connected in parallel; Controlling the pull-up switch resistor to be in a conducting or open state specifically includes: Determine one or more target pull-up switch resistors among the plurality of parallel pull-up switch resistors; Control the one or more target pull-up switch resistors to be in the on or off state.
13. The control method according to any one of claims 9 to 12, characterized in that, The resistance value of the pull-up switch resistor is adapted to the target chip.
14. The control method according to any one of claims 9 to 12, characterized in that, The resistance value of the pull-up switch resistor includes any value from 4.7KΩ to 10KΩ.
15. An electronic device, characterized in that, Includes the target chip and the integrated circuit as described in any one of claims 1 to 8.