Electronic component inspection method, device and automatic quality inspection equipment

Abstract

The present application relates to the technical field of device detection, and provides an electronic component detection method, device and automatic quality inspection equipment, which first acquires an original image of a to-be-detected object, extracts a target image of an overall region for mounting a target electronic component in the to-be-detected object from the original image, then performs masking on the target image based on a mask corresponding to color information of the target electronic component determined in advance to obtain a masked image, and finally determines pixel values of each pixel point in the masked image and determines mounting information of the target electronic component in the to-be-detected object based on the pixel values of each pixel point. The method does not require manual participation when detecting the electronic component, not only avoids the influence of human factors on the detection result, improves the accuracy of the detection result, but also improves the detection efficiency. Moreover, the detection cost caused by training of detection personnel can be avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of device detection, and in particular to an electronic component detection method and device and automatic quality inspection equipment. BACKGROUND

[0002] A motherboard, also known as a mainboard, is installed in a server such as a computer and is the core of the server for realizing functions. The motherboard includes a large number of electronic components, such as card board components and jumper cap components. During the research and development, testing and production of the motherboard, quality detection of the motherboard is often required, and the core of the quality detection is to detect the electronic components to determine whether the electronic components exist on the motherboard and the installation positions of the electronic components.

[0003] In the prior art, when detecting the electronic components, a manual detection method is usually used, that is, the detection personnel are trained in advance, and after the training, the detection personnel observe the motherboard image to determine the presence or absence of the electronic components and the installation positions of the electronic components through the motherboard image. This is extremely challenging for the vision and concentration of the detection personnel, has a high failure rate, low detection efficiency, small coverage, and different quality inspection personnel may obtain different detection results for the same motherboard image due to different quality inspection standards.

[0004] Therefore, there is an urgent need to provide an electronic component detection method. SUMMARY

[0005] The present application provides an electronic component detection method, device and automatic quality inspection equipment to solve the defects in the prior art.

[0006] The present application provides an electronic component detection method, which comprises:

[0007] obtaining an original image of a to-be-detected object, and extracting a target image of an overall region for installing a target electronic component in the to-be-detected object from the original image;

[0008] masking the target image based on a mask corresponding to color information of the target electronic component determined in advance to obtain a masked image; the mask is used to cover non-target electronic component installation regions in the target image and retain target electronic component installation regions in the target image;

[0009] determining pixel values of each pixel point in the masked image, and determining installation information of the target electronic component in the to-be-detected object based on the pixel values of the each pixel point.

[0010] According to the electronic component detection method provided by the present application, the target image of the overall region for installing the target electronic component in the to-be-detected object is extracted from the original image, specifically comprising:

[0011] determine a standard image corresponding to a reference object of the to-be-detected object;

[0012] perform feature matching between the standard image and the original image to obtain a matching result;

[0013] determine the target image based on the matching result.

[0014] According to the electronic component detection method provided by the present application, the mask includes a target mask determined based on target color information of the target electronic component in a target color space;

[0015] Correspondingly, the mask based on the color information of the target electronic component is used to mask the target image to obtain a masked image, and the process specifically includes:

[0016] determine a designated image of the target image in the target color space;

[0017] mask the designated image based on the target mask to obtain the masked image.

[0018] According to the electronic component detection method provided by the present application, the determination method of the target mask includes:

[0019] determine a mask retention range of the target electronic component based on a value range of the target color information;

[0020] determine the target mask based on the mask retention range.

[0021] According to the electronic component detection method provided by the present application, the target color space specifically includes one of an RGB color space, a grayscale space, and an HSV color space.

[0022] According to the electronic component detection method provided by the present application, the to-be-detected object includes a mainboard, and the target electronic component includes a jump cap component.

[0023] The present application also provides an electronic component detection device, which includes:

[0024] an image acquisition module, configured to acquire an original image of a to-be-detected object and extract a target image of an overall region for installing a target electronic component in the to-be-detected object from the original image;

[0025] The mask module is configured to mask the target image based on a predetermined mask corresponding to color information of the target electronic component, to obtain a masked image; the mask is configured to cover a non-target electronic component mounting area in the target image and reserve a target electronic component mounting area in the target image.

[0026] The detection module is configured to determine pixel values of each pixel point in the masked image, and determine the mounting information of the target electronic component in the object to be detected based on the pixel values of the each pixel point.

[0027] The application further provides an automatic quality inspection device, comprising an image acquisition device and the electronic component detection device.

[0028] The image acquisition device is configured to acquire an original image of an object to be detected, and send the original image to the electronic component detection device.

[0029] The electronic component detection device is configured to acquire the original image, and determine the mounting information of the target electronic component in the object to be detected based on the original image.

[0030] The application further provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the electronic component detection method according to any one of the above when executing the program.

[0031] The application further provides a non-transitory computer readable storage medium, which stores a computer program executable by a processor to implement the electronic component detection method according to any one of the above.

[0032] The application further provides a computer program product, comprising a computer program executable by a processor to implement the electronic component detection method according to any one of the above.

[0033] The electronic component testing method, apparatus, and automatic quality inspection equipment provided by this invention first acquires an original image of the object to be inspected, and extracts a target image of the entire area within the object to be inspected for mounting the target electronic component from the original image. Then, based on a pre-determined mask corresponding to the color information of the target electronic component, the target image is masked to obtain a masked image. Finally, the pixel values ​​of each pixel in the masked image are determined, and based on the pixel values, the mounting information of the target electronic component in the object to be inspected is determined. This method eliminates the need for manual intervention when inspecting electronic components, not only avoiding the influence of human factors on the inspection results and improving the accuracy of the results, but also increasing inspection efficiency. Furthermore, it avoids the inspection costs associated with training inspection personnel and the re-inspection costs resulting from different quality inspectors obtaining different inspection results. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on the drawings described below without creative effort.

[0035] Figure 1 This is a flowchart illustrating the electronic component testing method provided by the present invention;

[0036] Figure 2 This is a schematic diagram of the target image in the electronic component detection method provided by the present invention;

[0037] Figure 3 This is a schematic diagram of the masking image in the electronic component detection method provided by the present invention;

[0038] Figure 4 This is a schematic diagram of the electronic component testing device provided by the present invention;

[0039] Figure 5 This is a schematic diagram of the structure of the automatic quality inspection equipment provided by the present invention;

[0040] Figure 6 This is a schematic diagram of the structure of the electronic device provided by the present invention. Detailed Implementation

[0041] In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the present application will be described clearly and completely below in conjunction with the drawings in the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work belong to the protection scope of the present application.

[0042] In the prior art, when electronic components are detected, for example, when a jump cap component on a mainboard is detected, a manual detection method is usually used, that is, the detection personnel need to be trained in advance, and after training, the detection personnel need to observe the mainboard image to determine the presence or absence of the jump cap component and its installation position through the mainboard image, which tests the vision and concentration of the detection personnel, has a high error rate, low detection efficiency, small coverage, and different quality inspection personnel will obtain different detection results due to different quality inspection standards. Therefore, the present application provides an electronic component detection method.

[0043] Figure 1 A flowchart of an electronic component detection method provided in the embodiments of the present application is shown in Figure 1 The method comprises the following steps.

[0044] S1, obtaining an original image of a to-be-detected object, and extracting a target image of an overall region for installing a target electronic component in the to-be-detected object from the original image;

[0045] S2, performing masking on the target image based on a mask corresponding to color information of the target electronic component determined in advance, to obtain a masked image; the mask is used to cover non-target electronic component installation regions in the target image, and to retain target electronic component installation regions in the target image;

[0046] S3, determining pixel values of each pixel point in the masked image, and determining installation information of the target electronic component in the to-be-detected object based on the pixel values of each pixel point.

[0047] Specifically, the electronic component detection method provided in the embodiments of the present application has an execution subject of an electronic component detection device. The device can be configured in a server, which can be a local server or a cloud server. The local server can be a computer, a tablet computer, etc., which is not limited in the embodiments of the present application.

[0048] Firstly, step S1 is performed to obtain an original image of a to-be-detected object, which can be a mainboard in a server. The original image can be collected by an image collection device fixed in a detection environment and sent to an electronic component detection device. The original image can be an RGB color image, a grayscale image, or an image in an HSV color space, which is not limited here.

[0049] After receiving the original image, the electronic component detection device can extract a target image of an overall region for installing a target electronic component in the to-be-detected object from the original image, that is, the overall region for installing the target electronic component in the to-be-detected object can be recognized from the original image first, and then the overall region is segmented from the original image to obtain the target image. The overall region in the target image refers to the union of all regions in the to-be-detected object that can be used to install the target electronic component.

[0050] The recognition method of the overall region can be realized by a conventional target recognition method, or by a neural network model, which can be trained by image samples carrying overall region labels, which is not limited here.

[0051] The target electronic component can be any electronic component that can be recognized by color information in the to-be-detected object, such as a jumper component, which is usually pure color, such as blue, green, etc., in the mainboard.

[0052] Then, step S2 is performed to mask the target image according to a mask corresponding to the color information of the target electronic component to obtain a masked image. The mask is predetermined and corresponds to the color information of the target electronic component. The color information of the target electronic component can be color information in an RGB color space, represented by R, G, and B components; or color information in a grayscale space, represented by a value of 0-255; or color information in an HSV color space, represented by hue (H), saturation (S), and lightness (V) components.

[0053] The predetermined mask can be used to cover the non-target electronic component installation region in the target image, and retain the target electronic component installation region in the target image, so as to obtain the masked image, which only contains the target electronic component installation region in the target image, and other regions are covered, for example, can be black.

[0054] Before the masking, the image of the target image in the color space corresponding to the color information of the target electronic component needs to be determined first, and then the image is masked. For example, if the target image is an RGB image and the color information of the target electronic component is the color information of the RGB color space, the mask can be directly used for masking; if the target image is an RGB image and the color information of the target electronic component is the color information of the HSV color space, the image of the target image in the HSV color space needs to be determined first, and then the mask is used for masking, so as to ensure the matching of the mask and the masking object and improve the accuracy of the masking.

[0055] The non-target electronic component mounting area in the target image refers to the area in which the target electronic component actually does not exist in the complete area, and the target electronic component mounting area in the target image refers to the area in which the target electronic component actually exists in the complete area. Therefore, the target image is masked, and the non-target electronic component mounting area is actually covered, which can be understood as making the pixel value of the non-target electronic component mounting area 0, and the target electronic component mounting area is retained, which can be understood as keeping the pixel value of the target electronic component mounting area unchanged.

[0056] The masked image is the image corresponding to the case that the pixel value of the non-target electronic component mounting area in the target image is 0 and the pixel value of the target electronic component mounting area is kept unchanged. If the target electronic component is installed in the to-be-detected object, there is a region with a pixel value not equal to 0 in the masked image, and the region with a pixel value not equal to 0 is the target electronic component mounting area, otherwise the masked image is a black image.

[0057] Finally, step S3 is performed to determine the pixel value of each pixel point in the masked image. Based on the pixel value of each pixel point, the pixel distribution in the masked image can be determined, and based on the pixel distribution, the installation information of the target electronic component in the to-be-detected object can be determined. The installation information can include whether the target electronic component is installed in the to-be-detected object and the installation position in the case of installing the target electronic component.

[0058] If the pixel distribution in the masked image is that the pixel value is 0, it indicates that the target electronic component is not installed in the to-be-detected object, and if the pixel distribution in the masked image is that there is a pixel point with a pixel value not equal to 0, it indicates that the target electronic component is installed in the to-be-detected object, and the set of all pixel points with a pixel value not equal to 0 is the target electronic component mounting area. Through the position of the target electronic component mounting area in the masked image, the installation position of the target electronic component in the to-be-detected object can be determined.

[0059] The electronic component detection method provided in the embodiment of the present application first acquires an original image of a to-be-detected object, and extracts a target image of an overall region for mounting a target electronic component in the to-be-detected object from the original image; then performs masking on the target image based on a mask corresponding to color information of the target electronic component determined in advance, to obtain a masked image; and finally determines pixel values of each pixel point in the masked image, and determines mounting information of the target electronic component in the to-be-detected object based on the pixel values of the each pixel point. The method does not need manual participation when detecting the electronic component, not only avoids the influence of human factors on the detection result, improves the accuracy of the detection result, but also improves the detection efficiency. Moreover, the detection cost caused by training of detection personnel and the re-inspection cost caused by different detection results of different detection personnel can be avoided.

[0060] To avoid the situation that the placement information of the to-be-detected object, such as the placement position and the placement angle, is not standardized when the original image is collected, the detection difficulty is increased, and the detection result is inaccurate, the feature matching algorithm is used to correct the original image in the embodiment of the present application, and then the target image is extracted.

[0061] On the basis of the above embodiment, the electronic component detection method provided in the embodiment of the present application specifically includes the following steps.

[0062] Determining a standard image of a reference object corresponding to the to-be-detected object;

[0063] Performing feature matching on the standard image and the original image to obtain a matching result;

[0064] Determining the target image based on the matching result.

[0065] Specifically, in the embodiment of the present application, when the target image is extracted from the original image, the standard image of the reference object corresponding to the to-be-detected object can be determined first. The reference object refers to an object with standard placement information, and has the same type as the to-be-detected object, that is, if the to-be-detected object is a mainboard, the reference object is also a mainboard, and the target electronic component is not mounted in the reference object, so that the complete region for mounting the target electronic component in the to-be-detected object can be successfully determined through the feature matching algorithm, and the influence of the target electronic component mounted in the reference object on the determination of the complete region is avoided.

[0066] Then the standard image is matched with the original image in features to obtain a matching result. The feature matching can be realized by using an ORB (Oriented FAST and Rotated BRIEF) algorithm, a SIFT (Scale-invariant feature transform) algorithm or a SURF (Speeded Up Robust Features) algorithm. Compared with the SIFT algorithm and the SURF algorithm, the ORB algorithm has the advantages of high processing speed, high matching accuracy and accurate matching effect. Here, the matching result can be the corresponding relationship between the pixels in the standard image and the original image.

[0067] Finally, the target image is determined according to the obtained matching result. Here, the transformation matrix is determined according to the matching result, that is, the corresponding relationship between the pixels in the standard image and the original image is represented by the transformation matrix. Thereafter, the original image can be corrected according to the transformation matrix to eliminate the image distortion and position misplacement caused by the offset and rotation, so that the corrected image can be considered as the original image of the to-be-detected object with standard placement information, and the position for installing the target electronic component in the to-be-detected object can be accurately positioned through the corrected image.

[0068] Further, the corresponding relationship between the pixels in the standard image and the original image and the position information of the complete region for installing the target electronic component in the standard image can be used to determine the complete region for installing the target electronic component in the to-be-detected object in the corrected image, and the target image can be obtained by intercepting.

[0069] In the embodiment of the application, the target image is determined by the feature matching method, which can avoid the situation that the placement information such as the placement position and the placement angle of the to-be-detected object during the original image acquisition is not standardized, which increases the detection difficulty and leads to inaccurate detection results. Therefore, the detection difficulty can be reduced and the accuracy of the detection results can be improved.

[0070] On the basis of the above-mentioned embodiment, the electronic component detection method provided in the embodiment of the application includes a target mask determined based on target color information of the target electronic component in a target color space.

[0071] Correspondingly, the target image is masked by the mask corresponding to the color information of the target electronic component determined in advance to obtain a masked image, and the masking specifically includes:

[0072] determining a specified image of the target image in the target color space;

[0073] Based on the target mask, the specified image is masked to obtain the masked image.

[0074] Specifically, in the embodiment of the present application, the mask adopted includes a target mask determined based on target color information of the target electronic component in a target color space. The target color space can include an RGB color space, a grayscale space, or an HSV color space, etc. For example, the target color space is an HSV color space, and the mask adopted includes a target mask determined based on target color information of the target electronic component in the HSV color space. The target color information of the target electronic component in the HSV color space can be obtained by color space conversion from color information of the target electronic component in the RGB color space, which is not limited here. The color information of the target electronic component in the RGB color space can be determined directly from the target electronic component image collected by the RGB image collection device.

[0075] In determining the masked image, the specified image in the target color space of the target image can be determined first. If the target image is an image in the target color space, the specified image is the same as the target image. For example, the target image is an RGB image, and the target color space is an RGB color space, so the target image can be directly used as the specified image. If the target image is not an image in the target color space, the target image can be converted from its color space to the target color space, i.e. the specified image is obtained. For example, the target image is an RGB image, and the target color space is an HSV color space, so the target image can be converted from the RGB color space to the HSV color space, i.e. the specified image is obtained.

[0076] Thereafter, the specified image can be masked according to the target mask to obtain the masked image. Since the non-target electronic component mounting area in the specified image is usually not the same as the target color information of the target electronic component in the target color space, the non-target electronic component mounting area in the specified image can be covered by using the target mask, and only the target electronic component mounting area is retained, and then the masked image is obtained.

[0077] In the embodiment of the present application, the specified image in the target color space of the target image is determined first in determining the masked image, and then the target mask is used for masking, so as to ensure the matching of the mask and the masking object and improve the accuracy of the masking.

[0078] On the basis of the above-mentioned embodiment, the electronic component detection method provided in the embodiment of the present application, the determination method of the target mask includes:

[0079] Based on the value range of the target color information, a mask retention range of the target electronic component is determined;

[0080] Determine the target mask based on the mask reservation range.

[0081] Specifically, in the embodiments of the present application, when determining the target mask, the value range of the target color information of the target electronic component can be determined first.

[0082] For example, when the target color space is HSV color space and the target electronic component is green, the target color information is obtained by representing the green color of the target electronic component in the hue, saturation and lightness components of the HSV color space. Further, the value range can be determined by the union of the values of each pixel point of the target electronic component image in the hue, saturation and lightness components in the HSV color space.

[0083] Thereafter, the value range can be directly used as the mask reservation range of the target electronic component, that is, the maximum value of a certain component in the value range is used as the maximum mask threshold of the component, and the minimum value of a certain component in the value range is used as the minimum mask threshold of the component. The range formed by the minimum mask threshold and the maximum mask threshold is the mask reservation range.

[0084] The difference between the maximum value of a certain component in the value range and the adjustment value is used as the minimum mask threshold of the component.

[0085] Finally, the target mask can be determined according to the mask reservation range. In the embodiments of the present application, the target mask can be set to retain the pixel points in the mask reservation range in the to-be-masked image, and the pixel values of the pixel points outside the mask reservation range in the to-be-masked image are set to 0. That is, the target mask is transparent to the pixel points in the mask reservation range in the to-be-masked image, and is opaque to the pixel points outside the mask reservation range in the to-be-masked image.

[0086] In the embodiments of the present application, the target mask can be preferably determined based on the target color information of the target electronic component in the HSV color space, that is, the maximum mask threshold and the minimum mask threshold of the H, S and V components corresponding to the target color information are found in the HSV color space, and then the target mask is obtained according to the maximum mask threshold and the minimum mask threshold. Further, the target mask is used to mask the target image to obtain a masked image. Compared with finding the maximum mask threshold and the minimum mask threshold corresponding to the target color information in the RGB color space and the gray space, not only the difficulty of determining the target mask is reduced, thereby reducing the detection cost, but also the influence of external factors such as light is avoided, and the accuracy of the target mask is improved.

[0087] On the basis of the above-mentioned embodiment, the electronic component detection method provided in the embodiment of the present application, the object to be detected includes a mainboard, and the target electronic component includes a jump cap component.

[0088] Specifically, in the embodiment of the present application, the object to be detected is a mainboard, and the target electronic component is a jump cap component. Since a large number of jump cap components need to be installed on the mainboard, and the jump cap component has a small size, the advantages of the electronic component detection method provided in the embodiment of the present application for determining the installation information of the jump cap component in the mainboard are more prominent.

[0089] As shown in the above-mentioned embodiment, the electronic component detection method provided in the embodiment of the present application includes the following steps. Figure 2 As shown in the above-mentioned embodiment, the electronic component detection method provided in the embodiment of the present application includes the following steps. Figure 2 In the embodiment, the object to be detected has three pins 21, 22 and 23 which can be used to install the target electronic component 24. The target electronic component 24 can be installed on the upper pin 21 and the middle pin 22, or the middle pin 22 and the lower pin 23. Figure 2 In the embodiment, only the case that the target electronic component 24 is installed on the middle pin 22 and the lower pin 23 is shown. The mask image obtained after the mask is covered is shown in the above-mentioned embodiment. Figure 3 As shown in the above-mentioned embodiment, the electronic component detection method provided in the embodiment of the present application includes the following steps.

[0090] As shown in the above-mentioned embodiment, the electronic component detection method provided in the embodiment of the present application includes the following steps. Figure 4 As shown in the above-mentioned embodiment, the electronic component detection method provided in the embodiment of the present application includes the following steps.

[0091] The image acquisition module 41 is configured to acquire an original image of the object to be detected, and extract a target image of the overall region for installing the target electronic component in the object to be detected from the original image.

[0092] The mask module 42 is configured to mask the target image based on a mask corresponding to the color information of the target electronic component determined in advance, to obtain a mask image. The mask is used to cover the non-target electronic component installation region in the target image, and retain the target electronic component installation region in the target image.

[0093] The detection module 43 is configured to determine the pixel value of each pixel point in the mask image, and determine the installation information of the target electronic component in the object to be detected based on the pixel value of each pixel point.

[0094] On the basis of the above-mentioned embodiment, the electronic component detection device provided in the embodiment of the present application, the image acquisition module is specifically configured to:

[0095] Determine the standard image of the reference object corresponding to the object to be detected.

[0096] The standard image is matched with the original image by feature matching to obtain the matching result;

[0097] Based on the matching results, the target image is determined.

[0098] Based on the above embodiments, the electronic component detection device provided in the embodiments of the present invention includes a target mask determined based on the target color information of the target electronic component in the target color space;

[0099] Accordingly, the masking module is specifically used for:

[0100] Determine the specified image of the target image in the target color space;

[0101] Based on the target mask, the specified image is masked to obtain the masked image.

[0102] Based on the above embodiments, the electronic component detection device provided in this embodiment of the invention further includes a target mask determination module, used for:

[0103] Based on the value range of the target color information, the mask retention range of the target electronic component is determined;

[0104] The target mask is determined based on the mask retention range.

[0105] Based on the above embodiments, the electronic component detection device provided in the embodiments of the present invention specifically includes one of the following: RGB color space, grayscale space and HSV color space.

[0106] Based on the above embodiments, the electronic component testing device provided in this embodiment of the invention includes a motherboard as the object to be tested and a jump cap as the target electronic component.

[0107] Specifically, the functions of each module in the electronic component testing device provided in this embodiment of the invention correspond one-to-one with the operation flow of each step in the above method-like embodiments, and the achieved effects are also the same. For details, please refer to the above embodiments, and this will not be repeated in this embodiment of the invention.

[0108] like Figure 5 As shown, based on the above embodiments, this embodiment of the invention provides an automatic quality inspection device, including an image acquisition device 51 and an electronic component testing device 52 provided in the above embodiments, wherein the image acquisition device 51 is connected to the electronic component testing device 52.

[0109] The image acquisition device 51 is configured to acquire an original image of the object to be detected and send the original image to the electronic component detection device 52.

[0110] The electronic component detection device 52 is configured to acquire the original image and determine the installation information of the target electronic component in the object to be detected based on the original image.

[0111] Specifically, the automatic quality inspection equipment provided in the embodiments of the present application can be used to automatically inspect the object to be detected and determine the installation information of the target electronic component in the object to be detected, i.e., determine whether the object to be detected is installed with the target electronic component and the installation position of the target electronic component in the case of being installed with the target electronic component.

[0112] The image acquisition device in the automatic quality inspection equipment can be a camera, such as an industrial camera, etc. The image acquisition device can be fixed by a fixing element. The image acquisition device can acquire an original image of the object to be detected placed on the object supporting surface of the automatic quality inspection equipment and send the original image to the electronic component detection device. The electronic component detection device can determine the installation information of the target electronic component in the object to be detected by executing the electronic component detection method in each of the above embodiments.

[0113] The automatic quality inspection equipment provided in the embodiments of the present application only needs to place the object to be detected on the object supporting surface of the automatic quality inspection equipment to automatically determine the installation information of the target electronic component in the object to be detected, and then automatically determine whether the object to be detected is installed with the target electronic component and the installation position of the target electronic component in the case of being installed with the target electronic component. The equipment does not need manual participation when detecting the electronic component, which not only avoids the influence of human factors on the detection result and improves the accuracy of the detection result, but also improves the detection efficiency. Moreover, the detection cost caused by training of detection personnel and the re-inspection cost caused by different detection results of different quality inspection personnel can be avoided.

[0114] Figure 6 An example of a schematic diagram of the physical structure of an electronic device is shown in FIG. 1. Figure 6As shown, the electronic device can include a processor 610, a communications interface 620, a memory 630, and a communications bus 640, wherein the processor 610, the communications interface 620, and the memory 630 complete mutual communication through the communications bus 640. The processor 610 can invoke a logical instruction in the memory 630 to execute the electronic component detection method provided in each of the above embodiments, which includes: acquiring an original image of a to-be-detected object, and extracting a target image of an overall region for installing a target electronic component in the to-be-detected object from the original image; performing masking on the target image based on a predetermined mask corresponding to color information of the target electronic component, to obtain a masked image; the mask is used to cover non-target electronic component installation regions in the target image, and retain target electronic component installation regions in the target image; determining pixel values of each pixel point in the masked image, and determining installation information of the target electronic component in the to-be-detected object based on the pixel values of each pixel point.

[0115] In addition, the logical instruction in the memory 630 described above can be implemented in the form of a software functional unit and sold or used as an independent product, which can be stored in a computer-readable storage medium. Based on such understanding, the technical solutions of the present application essentially or partly or parts of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and various other media that can store program codes.

[0116] In another aspect, the present application also provides a computer program product comprising a computer program, which can be stored on a non-transitory computer readable storage medium, and the computer program is executable by a processor to cause a computer to perform the electronic component detection method provided in any of the above embodiments, which comprises: obtaining an original image of a to-be-detected object, and extracting a target image of an overall region for mounting a target electronic component in the to-be-detected object from the original image; performing masking on the target image based on a predetermined mask corresponding to color information of the target electronic component, to obtain a masked image; the mask is used to cover non-target electronic component mounting regions in the target image, and to retain target electronic component mounting regions in the target image; determining pixel values of each pixel point in the masked image, and determining mounting information of the target electronic component in the to-be-detected object based on the pixel values of the each pixel point.

[0117] In yet another aspect, the present application also provides a non-transitory computer readable storage medium having a computer program stored thereon, which is executable by a processor to implement the electronic component detection method provided in any of the above embodiments, which comprises: obtaining an original image of a to-be-detected object, and extracting a target image of an overall region for mounting a target electronic component in the to-be-detected object from the original image; performing masking on the target image based on a predetermined mask corresponding to color information of the target electronic component, to obtain a masked image; the mask is used to cover non-target electronic component mounting regions in the target image, and to retain target electronic component mounting regions in the target image; determining pixel values of each pixel point in the masked image, and determining mounting information of the target electronic component in the to-be-detected object based on the pixel values of the each pixel point.

[0118] The device embodiments described above are merely illustrative, wherein the units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, i.e., can be located in one place, or can be distributed on multiple network units. Part or all of the modules can be selected to achieve the purpose of the present embodiment scheme according to actual needs. Those skilled in the art can understand and implement without creative labor.

[0119] Those skilled in the art can clearly understand the technical solutions of the various embodiments from the above description of the embodiments, and the various embodiments can be implemented by means of software with the necessary general hardware platforms, and of course, can also be implemented by hardware. Based on such understanding, the above technical solutions, essentially or in other words, the part of the prior art that makes a contribution, can be embodied in the form of a software product, which can be stored in a computer readable storage medium, such as a ROM / RAM, a magnetic disk, an optical disk, and the like, and includes a number of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0120] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for some technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic component inspection method characterized by comprising: The method comprises the following steps: obtaining an original image of a to-be-detected object, and extracting a target image of an overall region for mounting a target electronic component in the to-be-detected object from the original image; masking the target image based on a predetermined mask corresponding to color information of the target electronic component to obtain a masked image; the mask is used to cover non-target electronic component mounting regions in the target image and retain target electronic component mounting regions in the target image; determining pixel values of each pixel point in the masked image, and determining mounting information of the target electronic component in the to-be-detected object based on the pixel values of each pixel point; The target image is extracted from the original image, and the target image of the overall region for mounting the target electronic component in the to-be-detected object is determined, specifically comprising: determining a standard image of a reference object corresponding to the to-be-detected object; performing feature matching on the standard image and the original image to obtain a matching result; determining the target image based on the matching result; The mask comprises a target mask determined based on target color information of the target electronic component in a target color space; the target color space is an HSV color space, and the target mask is determined by the following method: finding maximum mask threshold values and minimum mask threshold values of H, S and V components corresponding to the target color information in the HSV color space, and obtaining the target mask according to the maximum mask threshold values and the minimum mask threshold values.

2. The electronic component inspection method according to claim 1, wherein The target image is masked based on the predetermined mask corresponding to the color information of the target electronic component to obtain a masked image, specifically comprising: determining a specified image of the target image in the target color space; masking the specified image based on the target mask to obtain the masked image.

3. The electronic component inspection method according to any one of claims 1-2, wherein The to-be-detected object comprises a mainboard, and the target electronic component comprises a jumper cap component.

4. An electronic component inspection apparatus characterized by comprising: The method comprises the following steps: An image acquisition module is configured to obtain an original image of a to-be-detected object, and extract a target image of an overall region for mounting a target electronic component in the to-be-detected object from the original image; A masking module is configured to mask the target image based on a predetermined mask corresponding to color information of the target electronic component to obtain a masked image; the mask is used to cover non-target electronic component mounting regions in the target image and retain target electronic component mounting regions in the target image; A detection module is configured to determine pixel values of each pixel point in the masked image, and determine mounting information of the target electronic component in the to-be-detected object based on the pixel values of each pixel point; The image acquisition module is specifically configured to: determine a standard image of a reference object corresponding to the to-be-detected object; perform feature matching on the standard image and the original image to obtain a matching result; determine the target image based on the matching result; The mask comprises a target mask determined based on target color information of the target electronic component in a target color space; the target color space is an HSV color space; Further comprising a target mask determination module configured to: Maximum mask threshold and minimum mask threshold of H, S and V components corresponding to the target color information in the HSV color space are searched, and a target mask is obtained according to the maximum mask threshold and the minimum mask threshold.

5. An automatic quality inspection apparatus characterized by comprising: The electronic component detection device comprises an image acquisition device connected with the electronic component detection device. The image acquisition device is configured to acquire an original image of the object to be detected and send the original image to the electronic component detection device. The electronic component detection device is configured to acquire the original image and determine the installation information of the target electronic component in the object to be detected based on the original image.

6. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, The processor executes the program to implement the electronic component detection method according to any one of claims 1-3.

7. A non-transitory computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the electronic component detection method according to any one of claims 1-3.

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