Passive resettable vibration condition monitoring device and monitoring method

Abstract

The application provides a passive resettable vibration state monitoring device and a monitoring method, a first switch module is connected with a first antenna, a second switch module is connected with a second antenna, a chip is connected between the first antenna and the second antenna, and is connected with the first switch module and the second switch module respectively; when a vibration sensing module detects vibration sensing in at least one direction, a corresponding switch module is triggered to have a state mutation, and the state is output in the form of wireless signal strength by the antenna through the chip, and the state of the switch module remains unchanged; a reset module is used for keeping or resetting the vibration sensing state of the first vibration sensing module and the second vibration sensing module. The application can accurately monitor the vibration anomaly of a monitored object and record under the condition that there is no power supply. When an operator checks, abnormal information is fed back to the operator in real time; the reset can be performed unlimited times under the control of specific equipment, and is used for the next monitoring.

Description

Technical Field

[0001] This invention relates to the field of radio frequency electronic tag sensors, and more specifically, to a passive resettable vibration state monitoring device and monitoring method. Background Technology

[0002] Currently, RFID (Radio Frequency Identification) technology is widely used in several industries, such as logistics, aviation, automotive, cold chain, and medical. RFID is a non-contact, wireless transmission automatic identification technology.

[0003] Sensor technology is the ability to sense the surrounding environment or specific substances and convert them into useful output signals according to certain rules. It is a cutting-edge technology in current hot fields such as artificial intelligence, the Internet of Things, and robotics.

[0004] There are many types of sensors, each based on different principles. These include temperature sensors, gravity sensors, and ultrasonic sensors; most are active products. The combination of radio frequency identification (RFID) technology and sensor technology is widely used in the Internet of Things (IoT) field. By integrating electronic tags with sensors, different sensor electronic tags can be selected for different industries and applications.

[0005] In reality, most sensors are active products, only compatible with 2.4G active electronic tags or UWB technology solutions, limiting their application scenarios. In the field of vibration monitoring, traditional mechanical vibration sensors require active operation, resulting in excessive power consumption and high cost, preventing large-scale use as monitoring terminals and falling far short of the requirements for large-scale deployment. Even some new low-power vibration sensor modules on the market require a power supply to function properly. Therefore, passive, resettable vibration sensing technology becomes particularly necessary. Those skilled in the art are dedicated to this area; however, no descriptions or reports of technologies similar to this invention have been found, nor have similar domestic or international materials been collected. Summary of the Invention

[0006] To address the aforementioned shortcomings in the prior art, this invention provides a passive resettable vibration state monitoring device and method.

[0007] This invention is achieved through the following technical solutions.

[0008] According to one aspect of the present invention, a passive resettable vibration state monitoring device is provided, comprising: a device substrate and a chip, an antenna module, a switch module, a vibration sensing module, and a reset module mounted on the device substrate; wherein:

[0009] The antenna module includes: a first antenna and a second antenna, wherein the first antenna and the second antenna are arranged in a mirror-symmetrical manner with respect to the chip as the center;

[0010] The vibration sensing module includes: a first vibration sensing module and a second vibration sensing module; the first vibration sensing module and the second vibration sensing module are respectively used to monitor the vibration sensing of the monitored object in the vertical or horizontal direction according to the relative installation direction between them and the monitored object.

[0011] The switching module includes: a first switching module and a second switching module, wherein the first switching module and the second switching module are respectively adapted to the first vibration sensing module and the second vibration sensing module;

[0012] The first switch module is connected to the first antenna, the second switch module is connected to the second antenna, and the chip is connected between the first antenna and the second antenna, and is also connected to the first switch module and the second switch module respectively. When the vibration sensing module detects vibration in at least one direction, it triggers the corresponding switch module to undergo a state change, and outputs the state through the chip via the antenna in the form of wireless signal strength, while storing it in the chip. At this time, the state of the switch module remains unchanged.

[0013] The reset module includes: a first reset module and a second reset module; the first reset module and the second reset module are respectively connected to the first vibration sensing module and the second vibration sensing module, and are used to maintain the vibration sensing state of the first vibration sensing module and the second vibration sensing module or to reset the vibration sensing state.

[0014] Optionally, when the monitoring device is placed horizontally relative to the object being monitored, the monitoring directions of the first vibration sensing module and the second vibration sensing module are vertical and horizontal, respectively; when the monitoring device is placed vertically relative to the object being monitored, the monitoring directions of the first vibration sensing module and the second vibration sensing module are horizontal and vertical, respectively.

[0015] Optionally, the antenna module includes: a first pad for a first switch module, a second pad for a first switch module, a first pad for a second switch module, a second pad for a second switch module, a first element of the antenna, and a second element of the antenna; wherein the first element of the antenna, the first pad for the first switch module, and the second pad for the first switch module constitute a first antenna, and the second element of the antenna, the first pad for the second switch module, and the second pad for the second switch module constitute a second antenna;

[0016] The chip is connected to the first pad of the first switch module and the first pad of the second switch module;

[0017] The two ends of the first switch module are respectively connected to the first pad and the second pad of the first switch module; the two ends of the second switch module are respectively connected to the first pad and the second pad of the second switch module.

[0018] Optionally, an antenna branch is formed between the chip, the first switch module and the first antenna, and between the chip, the second switch module and the second antenna. The two antenna branches and the chip form a passive electronic tag, realizing the transmission and reception of radio frequency signals.

[0019] Optionally, both the first and second switch modules include: an insulating housing and two alloy metal pieces encapsulated inside the insulating housing; when the corresponding vibration sensing module does not detect vibration, the two alloy metal pieces are tightly pressed together under the magnetic attraction of the corresponding vibration sensing module, and are in a conductive state; when the corresponding vibration sensing module detects vibration, it triggers the two alloy metal pieces to suddenly deform and separate, and are in a disconnected state.

[0020] Optionally, both the first vibration sensing module and the second vibration sensing module include: a vibration module substrate and a magnetic cylinder, a magnetic column, and a drive coil mounted on the vibration module substrate; wherein the magnetic column is disposed inside the magnetic cylinder, the drive coil is disposed on the magnetic cylinder, and the end of the drive coil is connected to the drive coil pad on the vibration module substrate.

[0021] When at least one of the first vibration sensing module and the second vibration sensing module fails to detect vibration, the magnetic column is located inside the magnetic column near one end of the corresponding switch module. The switch module is in a conducting state under the action of the magnetic column, and the corresponding antenna is in the optimal electrical length state at this time.

[0022] When at least one of the first vibration sensing module and the second vibration sensing module is subjected to external force, causing the magnetic column to detach, so that the magnetic column is located inside the magnetic column body at one end away from the corresponding switch module, the switch module is in the off state, and at this time the corresponding antenna is in the worst electrical length state.

[0023] Optionally, the magnetic cylinder includes: a cylinder body, a magnetic cylinder base, and a drive coil holder; wherein, the cylinder body is mounted on the magnetic cylinder base, the drive coil holder is fitted onto the outside of the cylinder body and mounted on the magnetic cylinder base, the cylinder body, the magnetic cylinder base, and the drive coil holder are concentrically arranged, the free end of the cylinder body and the outer wall are provided with a plurality of slots, and the outer wall of the cylinder body is also provided with a radially recessed opening groove near the free end; the free end of the cylinder body is close to its corresponding switch module.

[0024] Optionally, both the first reset module and the second reset module include: a reset module base plate and a baffle, a baffle rod, a pin, a reset module spring, a first conductive post, a second conductive post, and a reset coil mounted on the reset module base plate; wherein, the reset coil is connected to the reset module spring, the free end of the reset module spring is connected to the baffle rod and mounted on the baffle, the pin is fixedly connected to the baffle, and the two ends of the reset coil are respectively soldered to the first and second conductive posts on the reset module, and the ends of the reset enameled wires of the corresponding vibration sensing module are also respectively connected to the first conductive post and the second conductive post;

[0025] When the corresponding vibration sensing module does not detect vibration, the stop bar cannot enter the opening slot on the cylinder of the vibration sensing module due to the obstruction of the magnetic column of the vibration sensing module, and the corresponding switch module is in the conducting state.

[0026] When the corresponding vibration sensing module detects vibration, the magnetic column of the vibration sensing module moves under the action of external force. At this time, the stop bar enters the opening slot on the cylinder of the vibration sensing module under the elastic force of the spring of the reset module, so that the corresponding switch module remains in the off state.

[0027] When the corresponding reset coil and drive coil receive reset power, the reset coil is electromagnetically converted and attracts the reset module spring, causing the stop bar to leave the opening slot; after electromagnetic conversion, the drive coil pushes the magnetic column towards the end of the magnetic column cylinder near the switch module. At this time, the switch module is in the conducting state under the magnetic attraction of the magnetic column, completing the reset, and the stop bar rests against the side wall of the magnetic column again.

[0028] Optionally, the device substrate includes: a first vibration monitoring module slot, a second vibration monitoring module slot, a plurality of first vibration monitoring module pads, and a plurality of second vibration monitoring module pads; wherein, the first vibration sensing module is mounted in the first vibration monitoring module slot via the plurality of first vibration monitoring module pads, the second vibration sensing module is mounted in the second vibration monitoring module slot via the plurality of second vibration monitoring module pads, and the first switch module and the second switch module are also respectively mounted in the first vibration monitoring module slot and the second vibration monitoring module slot.

[0029] Optionally, the device operates in the 860MHz to 960MHz ultra-high frequency band.

[0030] Optionally, the energy for both receiving and transmitting signals by the monitoring device is obtained from the signals emitted by the query device (i.e., the handheld device that identifies the passive electronic tag), and then converted into operating energy for the device to complete the information query. When the query device sends an inventory signal, the signal is scattered in the air as radio waves. The monitoring device receives the radio waves through its antenna module and obtains the energy to drive the chip from them. After receiving the query signal, the chip reflects its stored information back into the air through the antenna module. The query device obtains and parses the device information to determine the device's current status. Thus, complete communication is achieved between the query device and the passive electronic tag.

[0031] According to another aspect of the present invention, a monitoring method for the passive resettable vibration state monitoring device described in any one of the above claims is provided, comprising:

[0032] The passive resettable vibration state monitoring device is placed horizontally or vertically relative to the monitored object.

[0033] The first and second vibration sensing modules of the passive resettable vibration state monitoring device detect the vibration state of the object being tested.

[0034] When any one or more of the first vibration sensing module and the second vibration sensing module detect vibration, the corresponding switch module undergoes a state change, causing the corresponding antenna to be in the worst electrical length state. The state is output by the antenna through the chip in the form of wireless signal strength. The corresponding reset module maintains the vibration sensing state of the vibration sensing module, thus completing the monitoring of the vibration state.

[0035] When the corresponding reset module and the vibration sensing module receive a reset power supply, the reset module restores the magnetic attraction of the vibration sensing module, and the corresponding switch module returns to its original state under the magnetic attraction. The reset module completes the reset of the vibration sensing state.

[0036] By adopting the above technical solution, the present invention has at least one of the following beneficial effects compared with the prior art:

[0037] The passive resettable vibration state monitoring device and method provided by this invention address the vibration anomaly monitoring needs in existing monitoring application scenarios, providing the industry with a passive resettable vibration sensing technology and a reference solution for projects with similar monitoring needs.

[0038] The passive resettable vibration state monitoring device and method provided by this invention can accurately record the vibration abnormalities of the monitored object under conditions without power supply, and provide real-time feedback of abnormal information to the operator during inventory checks.

[0039] The passive resettable vibration state monitoring device and method provided by the present invention can be reset an unlimited number of times under reset power supply control for the next monitoring.

[0040] The passive resettable vibration state monitoring device and method provided by this invention have significant advantages such as low cost, simple installation, convenient operation, and no need for subsequent maintenance.

[0041] The passive resettable vibration status monitoring device and method provided by this invention are suitable for applications where vibration requirements are relatively high, such as equipment transportation and precision instrument transfer. Before transportation or storage, the vibration status monitoring device is reset, and the device is checked to ensure it is in a "normal" state, and this is recorded. Upon acceptance, the device is checked to determine if the vibration status monitoring device is "abnormal". When determining liability for damage or packaging breakage during transportation or storage, the vibration status information before and after transportation or storage is compared to determine whether the relevant operators violated regulations. Attached Figure Description

[0042] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0043] Figure 1 This is a schematic diagram of the passive resettable vibration state monitoring device in a preferred embodiment of the present invention.

[0044] Figure 2 This is a schematic diagram of the structure of the device substrate in a preferred embodiment of the present invention.

[0045] Figure 3 This is a schematic diagram of the antenna module in a preferred embodiment of the present invention.

[0046] Figure 4 This is a schematic diagram of the switch module in a preferred embodiment of the present invention.

[0047] Figure 5 This is a schematic diagram of the vibration sensing module structure in a preferred embodiment of the present invention.

[0048] Figure 6 This is a schematic diagram of the structure of the vibration module substrate in a preferred embodiment of the present invention.

[0049] Figure 7 This is a schematic diagram of the reset module in a preferred embodiment of the present invention.

[0050] Figure 8 This is a schematic diagram of the structure of the magnetic cylinder in a preferred embodiment of the present invention.

[0051] In the diagram, 100 is the chip, 200 is the device substrate, 300 is the antenna, 400 is the switch module, 500 is the vibration sensing module, 210 is the vertical vibration sensing module slot, 220 is the horizontal vibration sensing module slot, 231 is the first pad of the vertical vibration sensing module, 232 is the second pad of the vertical vibration sensing module, and 233 is the third pad of the vertical vibration sensing module. 241 is the first pad of the horizontal vibration sensing module, 242 is the second pad of the horizontal vibration sensing module, 243 is the third pad of the horizontal vibration sensing module, 244 is the fourth pad of the horizontal vibration sensing module, 311 is the first pad of the vertical switch module, 314 is the second pad of the vertical switch module, 312 is the first pad of the horizontal switch module, 313 is the second pad of the horizontal switch module, 321 is the first element of the antenna, 322 is the second element of the antenna, 410 is the glass package of the switch module, 420 is the first spring, 430 is the second spring, 510 is the vibration module substrate, 520 is the reset module, 530 is the magnetic cylinder, 540 is the magnetic column, 550 is the drive coil, and 560 is the reset enameled wire. 511 is the pin slot, 512 is the drive coil pad, 513 is the fixing pad, 514 is the magnetic cylinder slot, 515 is the vibration module slot, 521 is the reset module base plate, 522 is the baffle, 523 is the stop bar, 524 is the pin piece, 525 is the reset module spring piece, 526 is the first conductive post, 527 is the second conductive post, 528 is the reset coil, 531 is the inner cylinder, 532 is the opening slot, 533 is the magnetic cylinder base, 534 is the drive coil holder, 535 is the bayonet, and 536 is the outer wall. Detailed Implementation

[0052] The embodiments of the present invention are described in detail below: These embodiments are implemented based on the technical solution of the present invention, and provide detailed implementation methods and specific operation processes. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention.

[0053] One embodiment of the present invention provides a passive resettable vibration state monitoring device that can operate in the 860MHz to 960MHz ultra-high frequency band.

[0054] Please also refer to Figures 1 to 8 The passive resettable vibration state monitoring device provided in this embodiment may include: a device substrate and a chip, antenna module, switch module, vibration sensing module, and reset module mounted on the device substrate; wherein:

[0055] The antenna module includes a first antenna and a second antenna, which are arranged in a mirror-symmetrical manner with respect to the chip.

[0056] The vibration sensing module includes: a first vibration sensing module and a second vibration sensing module; the first vibration sensing module and the second vibration sensing module are respectively used to monitor the vibration sensing of the monitored object in the vertical or horizontal direction according to the relative installation direction between them and the monitored object.

[0057] The switching module includes: a first switching module and a second switching module, wherein the first switching module and the second switching module are respectively adapted to the first vibration sensing module and the second vibration sensing module;

[0058] The first switch module is connected to the first antenna, the second switch module is connected to the second antenna, and the chip is connected between the first antenna and the second antenna, and is connected to the first switch module and the second switch module respectively; when the vibration sensing module detects vibration in at least one direction, it triggers the corresponding switch module to undergo a state change, and outputs the state through the chip via the antenna in the form of wireless signal strength, while storing it in the chip; at this time, the state of the switch module remains unchanged;

[0059] The reset module includes a first reset module and a second reset module; the first reset module and the second reset module are respectively connected to the first vibration sensing module and the second vibration sensing module, and are used to maintain the vibration sensing state of the first vibration sensing module and the second vibration sensing module or to reset the vibration sensing state.

[0060] In a preferred embodiment, when the monitoring device is placed horizontally relative to the object being monitored, the monitoring directions of the first vibration sensing module and the second vibration sensing module are vertical and horizontal, respectively; when the monitoring device is placed vertically relative to the object being monitored, the monitoring directions of the first vibration sensing module and the second vibration sensing module are horizontal and vertical, respectively.

[0061] In a preferred embodiment, the antenna module includes: a first pad of a first switch module, a second pad of a first switch module, a first pad of a second switch module, a second pad of a second switch module, a first antenna element, and a second antenna element; wherein the first antenna element, the first pad of the first switch module, and the second pad of the first switch module constitute a first antenna, and the second antenna element, the first pad of the second switch module, and the second pad of the second switch module constitute a second antenna;

[0062] The chip is connected to the first pad of the first switch module and the first pad of the second switch module;

[0063] The two ends of the first switch module are respectively connected to the first pad and the second pad of the first switch module; the two ends of the second switch module are respectively connected to the first pad and the second pad of the second switch module.

[0064] In a preferred embodiment, an antenna branch is formed between the chip, the first switch module and the first antenna, and between the chip, the second switch module and the second antenna. The two antenna branches and the chip form a passive electronic tag, realizing the transmission and reception of radio frequency signals.

[0065] In a preferred embodiment, both the first switch module and the second switch module include: an insulating shell and two alloy metal pieces encapsulated inside the insulating shell; when the corresponding vibration sensing module does not detect vibration, the two alloy metal pieces are tightly pressed together under the magnetic attraction of the corresponding vibration sensing module and are in a conductive state; when the corresponding vibration sensing module detects vibration, it triggers the two alloy metal pieces to suddenly deform and separate, and are in a disconnected state.

[0066] In a preferred embodiment, both the first vibration sensing module and the second vibration sensing module include: a vibration module substrate and a magnetic cylinder, a magnetic column, and a drive coil mounted on the vibration module substrate; wherein the magnetic column is disposed inside the magnetic cylinder, the drive coil is disposed on the magnetic cylinder, and the end of the drive coil is connected to the drive coil pad on the vibration module substrate.

[0067] When at least one of the first vibration sensing module and the second vibration sensing module fails to detect vibration, the magnetic column is located inside the magnetic column near one end of the corresponding switch module. The switch module is in the conducting state under the action of the magnetic column, and the corresponding antenna is in the optimal electrical length state at this time.

[0068] When at least one of the first vibration sensing module and the second vibration sensing module is subjected to external force, the magnetic column is dislodged, causing the magnetic column to be located inside the magnetic column at one end away from the corresponding switch module. The switch module is in the off state, and at this time the corresponding antenna is in the worst electrical length state.

[0069] In a preferred embodiment, the magnetic cylinder includes: a cylinder body, a magnetic cylinder base, and a drive coil holder; wherein, the cylinder body is mounted on the magnetic cylinder base, the drive coil holder is fitted onto the outside of the cylinder body and mounted on the magnetic cylinder base, the cylinder body, the magnetic cylinder base, and the drive coil holder are concentrically arranged, the free end of the cylinder body and the outer wall are provided with a plurality of slots, and the outer wall of the cylinder body near the free end is also provided with a radially recessed opening groove; the free end of the cylinder body is close to its corresponding switch module.

[0070] In a preferred embodiment, both the first reset module and the second reset module include: a reset module base plate and a baffle, a baffle rod, a pin, a reset module spring, a first conductive post, a second conductive post, and a reset coil mounted on the reset module base plate; wherein, the reset coil is connected to the reset module spring, the free end of the reset module spring is connected to the baffle rod and mounted on the baffle, the pin is fixedly connected to the baffle, and the two ends of the reset coil are respectively soldered to the first and second conductive posts on the reset module, and the ends of the reset enameled wires of the corresponding vibration sensing module are also respectively connected to the first and second conductive posts;

[0071] When the corresponding vibration sensing module does not detect vibration, the stop bar cannot enter the opening slot on the cylinder of the vibration sensing module due to the obstruction of the magnetic column of the vibration sensing module, and the corresponding switch module is in the conducting state.

[0072] When the corresponding vibration sensing module detects vibration, the magnetic column of the vibration sensing module moves under the action of external force. At this time, the stop bar enters the opening slot on the cylinder of the vibration sensing module under the elastic force of the spring of the reset module, so that the corresponding switch module remains in the off state.

[0073] When the corresponding reset coil and drive coil receive the reset power supply, the reset coil is electromagnetically converted and attracts the reset module spring, causing the stop bar to leave the opening slot; after electromagnetic conversion, the drive coil pushes the magnetic column towards the end of the magnetic column cylinder near the switch module. At this time, the switch module is in the conducting state under the magnetic attraction of the magnetic column, completing the reset, and the stop bar is back against the side wall of the magnetic column.

[0074] In a preferred embodiment, the device substrate includes: a first vibration monitoring module slot, a second vibration monitoring module slot, a plurality of first vibration monitoring module pads, and a plurality of second vibration monitoring module pads; wherein, the first vibration sensing module is mounted in the first vibration monitoring module slot via the plurality of first vibration monitoring module pads, the second vibration sensing module is mounted in the second vibration monitoring module slot via the plurality of second vibration monitoring module pads, and the first switch module and the second switch module are also respectively mounted in the first vibration monitoring module slot and the second vibration monitoring module slot.

[0075] In a preferred embodiment, the device operates in the 860MHz to 960MHz ultra-high frequency band.

[0076] In a preferred embodiment, the energy for both receiving and transmitting signals by the monitoring device is obtained from the signals emitted by the query device (i.e., the handheld device that identifies the passive electronic tag), and then converted into operating energy for the device to complete the information query. Further, when the query device sends an inventory signal, the signal is scattered in the air as radio waves. The monitoring device receives these radio waves through its antenna module and obtains the energy to drive the chip from them. After receiving the query signal, the chip reflects its stored information back into the air through the antenna module. The query device then obtains and parses the device information to determine its current status. Thus, complete communication is achieved between the query device and the passive electronic tag.

[0077] An embodiment of the present invention also provides a monitoring method for any of the passive resettable vibration state monitoring devices described in the above embodiments of the present invention, which may include the following steps:

[0078] S100, the passive resettable vibration state monitoring device is placed horizontally or vertically relative to the monitored object;

[0079] S200, the first and second vibration sensing modules of the passive resettable vibration state monitoring device detect the vibration state of the object being tested.

[0080] S300 When any one or more of the first vibration sensing module and the second vibration sensing module detect vibration, the corresponding switch module undergoes a state change, causing the corresponding antenna to be in the worst electrical length state. The state is output by the antenna through the chip in the form of wireless signal strength. The corresponding reset module maintains the vibration sensing state of the vibration sensing module, thus completing the monitoring of the vibration state.

[0081] In step S400, when the corresponding reset module and vibration sensing module receive reset power, the reset module restores the magnetic attraction of the vibration sensing module, and the corresponding switch module returns to its original state under magnetic attraction. The reset module then completes the reset of the vibration sensing state. In a specific application example, the reset power supply device can be a wireless resetter with a built-in battery. During reset, the wireless resetter is placed directly above the monitoring device, and the reset button is activated. The battery in the wireless resetter powers its internal coil, coupling the wireless capability to the drive coil and reset coil of the monitoring device, causing them to operate.

[0082] It should be noted that the steps in the method provided by the present invention can be implemented using corresponding modules and devices in the apparatus. Those skilled in the art can refer to the technical solution of the apparatus to implement the steps of the method. That is, the embodiments in the system can be understood as preferred examples of the method, and will not be elaborated here.

[0083] The technical solution provided by the above embodiments of the present invention will be further described below with reference to a specific application example and accompanying drawings.

[0084] In this specific application example:

[0085] The vibration sensing module 500 is divided into a horizontal vibration sensing module and a vertical vibration sensing module according to their relative installation direction to the object being monitored. When the device is placed horizontally relative to the object being monitored, the monitoring directions of the horizontal and vertical vibration sensing modules remain unchanged. When the device is placed vertically relative to the object being monitored, the monitoring directions of the horizontal and vertical vibration sensing modules are reversed; that is, the horizontal vibration sensing module monitors the vertical direction, and the vertical vibration sensing module monitors the horizontal direction.

[0086] When the monitored object is dropped, collided, or overturned during transportation, handling, or transfer, the horizontal or vertical vibration sensing module detects vibration variables. Specifically, if the vibration frequency in the horizontal or vertical direction exceeds 100Hz or the acceleration exceeds 2G, the switching module undergoes a sudden state change, switching from a "normally closed" state to a "normally open" state. This state cannot be reset without the operation of dedicated equipment. The "normally closed" state of this device provides a "normal" signal, while the "normally open" state provides an "abnormal" signal.

[0087] When an operator uses the query device to check status information, the device sends a signal to the monitoring unit. After receiving the signal, the antenna on the monitoring unit feeds back an "abnormal" or "normal" signal to the chip, and then radiates the signal back to the query device as radio waves. Upon receiving the signal, the query device uses its internal recognition to determine whether the tag's status is "normal" or "abnormal." Throughout the entire status information query process, the monitoring device operates in a passive environment. The energy used for receiving and transmitting signals is derived from the signals emitted by the query device, which is then converted into operating energy to complete the information query.

[0088] The installation direction of the switch module 400 is adjusted according to the vibration sensing module. The switch module is a horizontal switch module that is compatible with the horizontal monitoring module and a vertical switch module that is compatible with the vertical monitoring module.

[0089] like Figure 3As shown, antenna 300 includes a first pad 312 for a horizontal switch module, a second pad 313 for a horizontal switch module, a first pad 311 for a vertical switch module, a second pad 312 for a vertical switch module, a first antenna element 321, and a second antenna element 322. These components constitute a first antenna and a second antenna that are mirror-symmetrical about the chip.

[0090] The first antenna consists of antenna element 321, vertical switch first pad 311, and vertical switch second pad 314. The second antenna consists of antenna element 322, horizontal switch first pad 312, and horizontal switch module second pad 313.

[0091] Chip 100 is soldered to the first pad 312 of the horizontal switch module and the first pad 311 of the vertical switch module of the antenna using SMT surface mount technology.

[0092] The antenna signal strength is directly related to the electrical length of the symmetrical elements on both sides of the antenna. When the device is in the "normally closed" state, the length of the symmetrical elements on both sides is optimal. This electrical length corresponds to the antenna's best performance at 915MHz and is perfectly conjugate-matched with the chip, resulting in optimal signal radiation capability. When the device is in the "normally open" state, at least one of the horizontal and vertical switching modules is off, and the electrical length of one or both elements on one side decreases sharply. This electrical length results in the antenna having optimal performance at higher frequencies but is completely mismatched with the chip, leading to the worst signal radiation capability. Therefore, the antenna signal strength reflects the vibration state, enabling real-time monitoring of the vibration state.

[0093] In the "normally closed" state, the spring plates of the horizontal switch module and the vibration switch module are tightly attracted together by the magnetic attraction force of their respective magnetic pillars, and the spring plates are in the conducting state, thus making the element in the optimal electrical length state.

[0094] In the "normally closed" state, in either the horizontal or vertical vibration sensing module, the magnetic column 540 is located at one end (top) of the inner cylinder of the magnetic column tube 530, adsorbed onto the corresponding switch module side. Under acceleration forces not exceeding 2G or vibrations not exceeding 100Hz, the magnetic column 540 will not move, ensuring a tight connection between the two springs 420 and 430 in the switch module. At this time, the stop rod 523 of the reset module 520, under the influence of the elastic force of the reset module spring 525, passes through the opening slot 532 of the magnetic column tube 530 and adheres to the side wall of the magnetic column tube 530. Due to the obstruction of the magnetic column 540, the stop rod 523 cannot spring normally to the inside of the opening slot.

[0095] In the "normally open" state, when the spring plates of the horizontal and vertical switch modules are dislodged due to external forces caused by vibration on one or both sides of the magnetic post, the spring plates in the switch modules are in the open state, thus making the element in the worst electrical length state.

[0096] In the "normally open" state, the magnetic column, due to vibration or external force, slides down to the other end (bottom end) of the inner cylinder 531 of the magnetic column cylinder 530. At this time, because there is no obstruction from the magnetic column, and with the elastic force of the reset module's spring plate 523, the stop rod 523 of the reset module is completely inserted into the inner side of the opening slot 532 of the magnetic column cylinder, blocking the magnetic column 540 from sliding towards the top. Without the assistance of the reset device, the magnetic column 540 cannot be attracted to the side of the switch module, and the "normally open" state cannot be changed.

[0097] like Figure 5 As shown and Figure 7 As shown, the vibration sensing module includes: a vibration module substrate 510, a magnetic cylinder 530, a magnetic column 540, a drive coil 550, and a reset enameled wire 560; the reset module includes: a reset module substrate 521, a baffle 522, a baffle rod 523, a pin 524, a reset module spring 525, a first conductive post 526, a second conductive post 527, and a reset coil 528. The two ends of the drive coil 550 are soldered to the drive coil pad 512 on the vibration reset substrate 510. The reset enameled wire 560 is soldered to the first conductive post 526 and the second conductive post 527 of the reset module 520, respectively. The two ends of the reset coil 528 are also soldered to the first conductive post 526 and the second conductive post 527 of the reset module 520, respectively.

[0098] The reset module 520 enables the reset function, and can simultaneously power the reset coil 528 and the drive coil 550 via the wireless charging function of an external wireless resetter. After receiving energy, the reset coil 528 undergoes electromagnetic conversion and attracts the reset module spring 525, causing the stop lever 523 to move away from the opening slot 532 of the magnetic cylinder 530. After receiving energy, the drive coil 550 undergoes electromagnetic conversion, and due to the reverse magnetic force, pushes the magnetic column 540 towards the top of the inner cylinder of the magnetic cylinder 530. At this point, the stop lever 523 has also moved away, and the magnetic column 540 is firmly attached to one side of the switch module. After the reset is complete, the stop lever 523 springs back up and rests against the side wall of the magnetic column 540.

[0099] In this specific application example:

[0100] A passive resettable vibration monitoring device with a length of 100mm to 200mm, a width of 40mm to 80mm, and a thickness of 10mm to 50mm.

[0101] The device substrate 200 has a length of 100mm to 200mm, a width of 40mm to 80mm, and a thickness of 0.8mm to 2mm, and is made of FR4 material.

[0102] like Figure 2 As shown, the device substrate 200 has a horizontal vibration sensing module slot 220, a vertical vibration sensing module slot 210, and corresponding pads. The horizontal vibration sensing module is soldered to the device substrate 200 via four pads, and the vertical vibration sensing module is soldered to the device substrate 200 via three pads.

[0103] Antenna 300 has a J-shaped array structure, which is mirror-symmetrical with chip 100 as the center.

[0104] The antenna 300 has a length of 10mm to 20mm and a width of 40mm to 60mm. The antenna is made of copper foil and is etched onto the PCB board. The pads of the horizontal and vertical switch modules are directly connected to the short side of the antenna's J-shaped array.

[0105] Chip 100 has a length of 1.5mm to 2mm, a width of 1.5mm to 2mm, and a thickness of 0.25mm. This chip is an ultra-high frequency chip, with its two ends soldered to the first pads of the horizontal and vertical switching modules. The chip, along with the switching module and the antenna, forms an antenna loop system capable of transmitting radio frequency signals.

[0106] The length of the switch module 400 is 20mm to 50mm, and the diameter is 3mm to 10mm.

[0107] like Figure 4 As shown, the switch module 400 is composed of two alloy metal pieces 420 and 430 encapsulated by a glass encapsulation (insulating shell) 410. Under normal conditions, when affected by the magnetic attraction of the magnetic post 540, the two alloy metal pieces 420 and 430 are tightly in contact and closed with each other, forming a normally closed state; when the magnetic post 540 moves under external force, the magnetic attraction disappears, and the two alloy metal pieces 420 and 430 suddenly deform and break apart, maintaining a gap with each other, forming a normally open state.

[0108] The horizontal vibration sensing module is located 1mm to 5mm below the horizontal switch module and is placed horizontally. This distance allows for effective adjustment of the acceleration and amplitude of the vibration sensing in the horizontal direction.

[0109] The vertical vibration sensing module is located 1mm to 5mm below the vertical switch module and is placed vertically. This distance allows for effective adjustment of the acceleration and amplitude of the vibration sensing in the vertical direction.

[0110] like Figure 5As shown, the vibration sensing module consists of a vibration module base plate 510, a magnetic cylinder 530, a magnetic column 540, a drive coil 550, and a reset enameled wire 560. The length is 30mm–50mm, the width is 15mm–30mm, and the thickness is 8mm–40mm.

[0111] like Figure 6 As shown, the vibration module substrate 510 is made of FR4 substrate, with a length of 30mm to 50mm, a width of 15mm to 30mm, and a thickness of 1mm to 3mm.

[0112] The fixing pad 513 on the vibration module substrate 510 for fixing the entire monitoring device consists of four square patch pads, each 4mm long and 4mm wide.

[0113] The magnetic cylinder mounting slot 514 has an open structure. During installation, the base of the magnetic cylinder 530 is positioned in the open direction, with the cylinder opening facing inward. The four pairs of bayonets of the magnetic cylinder respectively mate with the vibration module base plate 510, and the bayonets are fixed with quick-drying adhesive.

[0114] The magnetic cylinder mounting slot 514 and the reset module mounting slot 515 are connected, and the reset module spring 525 and the stop bar 523 are located in the reset module mounting slot.

[0115] The length of the drive coil pad 512 is 1mm to 6mm, and the width is 1mm to 6mm.

[0116] like Figure 8 As shown, the magnetic cylinder 530 is injection molded from PPS material, with a diameter of 5mm-10mm and a height of 8mm-20mm. The inner cylinder has a diameter of 3mm and a height of 3mm-7mm. The magnetic cylinder base 533 has a diameter of 5mm-10mm and a height of 1mm-2mm. The drive coil holder 534 has a diameter of 4mm-8mm and a height of 1mm-2mm. The bayonet 535 consists of four rectangular blocks, with a length of 2mm-4mm, a width of 2mm-4mm, and a thickness of 1mm-2mm. The opening height is 2mm-4mm and the depth is 2mm-5mm.

[0117] The 540 magnetic column is a cylindrical neodymium magnet with a diameter of 1mm to 5mm and a height of 3mm to 10mm.

[0118] The drive coil 550 is made of enameled wire with an inner diameter of 1mm to 5mm and an outer diameter of 5mm to 20mm. The coil is wound with 0.05mm enameled copper wire, with 1000 to 5000 turns, including 2 wire ends. The coil is fixed to the drive coil base with glue, and the wire ends are soldered to the drive coil pad 512.

[0119] like Figure 7As shown, the reset module 520 comprises: a reset module base plate 521, a baffle 522, a baffle rod 523, a pin 524, a reset module spring 525, a first conductive post 526, a second conductive post 527, and a module reset coil 528.

[0120] The pin 524 is a copper sheet with a length of 1mm to 10mm and a width of 1mm to 10mm. The pin 524 passes through the pin slot 511, and then the reset module 520 and the reset module substrate 521 are fixed together with solder.

[0121] The reset module spring 525 is welded to one end of the stop lever 523. The reset module spring 525 is a metal spring with a length of 5mm to 20mm and a width of 5mm to 15mm. The metal spring is located above the reset coil 528; under normal conditions, the metal spring is in a spring-up state; when resetting, the reset coil 528 generates a magnetic force to attract the metal spring.

[0122] The reset coil 528 is made of enameled wire with an inner diameter of 3mm to 5mm and an outer diameter of 8mm to 20mm. The coil is wound with 0.05mm enameled copper wire, with 3000 to 6000 turns, and includes two wire ends. The wire ends are soldered to the first conductive post 526 and the second conductive post 527 of the reset module 520.

[0123] The stop lever 523 is made of manganese copper wire and is welded to the reset module spring piece 525. It has a diameter of 0.5mm to 1mm and a length of 5mm to 15mm.

[0124] Both the first conductive post 526 and the second conductive post 527 are copper posts with a diameter of 1mm to 2mm and a height of 10mm to 25mm.

[0125] Both the baffle plate 522 and the baffle lever 523 are made of copper and have an inverted L-shaped structure.

[0126] The reset module substrate 521 is made of PPS material, which is resistant to aging and high temperature.

[0127] The passive resettable vibration monitoring device and method provided in the above embodiments of the present invention can monitor abnormal vibration states in both the horizontal and vertical directions according to scenario requirements, and record them in a chip. During subsequent inventory checks, the vibration state information can be fed back to the operator. When the acceleration of the monitored object exceeds 2G or the vibration frequency exceeds 100Hz, the vibration sensing module of the monitoring device triggers the switching module, feeding back an "abnormal (over-limit)" signal; otherwise, a "normal" signal is received. The switching module's state is irreversible without specific reset equipment. The monitoring device transmits the "abnormal (over-limit)" and "normal" signals to an ultra-high frequency chip, which then radiates the signal to the query device via an antenna as radio waves. This monitoring device requires no power supply and can obtain energy from the signal emitted by the query device to transmit the on / off signal to the query device.

[0128] Any matters not covered in the above embodiments of the present invention are well-known in the art.

[0129] The specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various modifications or variations within the scope of the claims, which do not affect the essence of the present invention.

Claims

1. A passive, resettable vibration state monitoring device, characterized in that, include: The device substrate and the chip, antenna module, switch module, vibration sensing module, and reset module mounted on the device substrate; wherein: The antenna module includes: a first antenna and a second antenna, wherein the first antenna and the second antenna are arranged in a mirror-symmetrical manner with respect to the chip as the center; The vibration sensing module includes: a first vibration sensing module and a second vibration sensing module; the first vibration sensing module and the second vibration sensing module are respectively used to monitor the vibration sensing of the monitored object in the vertical or horizontal direction according to the relative installation direction between them and the monitored object. The switching module includes: a first switching module and a second switching module, wherein the first switching module and the second switching module are respectively adapted to the first vibration sensing module and the second vibration sensing module; The first switch module is connected to the first antenna, the second switch module is connected to the second antenna, and the chip is connected between the first antenna and the second antenna, and is also connected to the first switch module and the second switch module respectively. When the vibration sensing module detects vibration in at least one direction, it triggers the corresponding switch module to undergo a state change, and outputs the state through the chip via the antenna in the form of wireless signal strength, while storing it in the chip. The reset module includes: a first reset module and a second reset module; the first reset module and the second reset module are respectively connected to the first vibration sensing module and the second vibration sensing module, and are used to maintain the vibration sensing state of the first vibration sensing module and the second vibration sensing module or to reset the vibration sensing state. The first switch module and the second switch module both include: an insulating shell and two alloy metal pieces encapsulated inside the insulating shell; when the corresponding vibration sensing module does not detect vibration, the two alloy metal pieces are tightly pressed together under the magnetic attraction of the corresponding vibration sensing module and are in a conductive state; when the corresponding vibration sensing module detects vibration, it triggers the two alloy metal pieces to suddenly deform and separate, and are in a disconnected state. Both the first vibration sensing module and the second vibration sensing module include: a vibration module substrate and a magnetic cylinder, a magnetic column, and a drive coil mounted on the vibration module substrate; wherein, the magnetic column is disposed inside the magnetic cylinder, the drive coil is disposed on the magnetic cylinder, and the end of the drive coil is connected to the drive coil pad on the vibration module substrate; When at least one of the first vibration sensing module and the second vibration sensing module fails to detect vibration, the magnetic column is located inside the magnetic column near one end of the corresponding switch module. The switch module is in a conducting state under the action of the magnetic column, and the corresponding antenna is in the optimal electrical length state at this time. When at least one of the first vibration sensing module and the second vibration sensing module is subjected to external force, causing the magnetic column to detach, so that the magnetic column is located inside the magnetic column body at one end away from the corresponding switch module, the switch module is in the off state, and at this time the corresponding antenna is in the worst electrical length state.

2. The passive resettable vibration state monitoring device according to claim 1, characterized in that, When the monitoring device is placed horizontally relative to the object being monitored, the monitoring directions of the first vibration sensing module and the second vibration sensing module are vertical and horizontal, respectively; when the monitoring device is placed vertically relative to the object being monitored, the monitoring directions of the first vibration sensing module and the second vibration sensing module are horizontal and vertical, respectively.

3. The passive resettable vibration state monitoring device according to claim 1, characterized in that, The antenna module includes: a first pad for a first switch module, a second pad for a first switch module, a first pad for a second switch module, a second pad for a second switch module, a first element of the antenna, and a second element of the antenna; wherein the first element of the antenna, the first pad for the first switch module, and the second pad for the first switch module constitute a first antenna, and the second element of the antenna, the first pad for the second switch module, and the second pad for the second switch module constitute a second antenna; The chip is connected to the first pad of the first switch module and the first pad of the second switch module; The two ends of the first switch module are respectively connected to the first pad and the second pad of the first switch module; the two ends of the second switch module are respectively connected to the first pad and the second pad of the second switch module.

4. The passive resettable vibration state monitoring device according to claim 3, characterized in that, An antenna branch is formed between the chip, the first switch module and the first antenna, and between the chip, the second switch module and the second antenna. The two antenna branches and the chip form a passive electronic tag, realizing the transmission and reception of radio frequency signals.

5. The passive resettable vibration state monitoring device according to claim 1, characterized in that, The magnetic cylinder includes: a cylinder body, a magnetic cylinder base, and a drive coil holder; wherein, the cylinder body is mounted on the magnetic cylinder base, the drive coil holder is fitted onto the outside of the cylinder body and mounted on the magnetic cylinder base, the cylinder body, the magnetic cylinder base, and the drive coil holder are concentrically arranged, the free end of the cylinder body and the outer wall are provided with a plurality of slots, and the outer wall of the cylinder body near the free end is also provided with a radially recessed opening groove; the free end of the cylinder body is close to its corresponding switch module.

6. The passive resettable vibration state monitoring device according to claim 5, characterized in that, Both the first reset module and the second reset module include: a reset module base plate and a baffle, a baffle rod, a pin, a reset module spring, a first conductive post, a second conductive post, and a reset coil mounted on the reset module base plate; wherein, the reset coil is connected to the reset module spring, the free end of the reset module spring is connected to the baffle rod and mounted on the baffle, the pin is fixedly connected to the baffle, and the two ends of the reset coil are respectively soldered to the first and second conductive posts on the reset module, and the ends of the reset enameled wires of the corresponding vibration sensing module are also respectively connected to the first conductive post and the second conductive post; When the corresponding vibration sensing module does not detect vibration, the stop bar cannot enter the opening slot on the cylinder of the vibration sensing module due to the obstruction of the magnetic column of the vibration sensing module, and the corresponding switch module is in the conducting state. When the corresponding vibration sensing module detects vibration, the magnetic column of the vibration sensing module moves under the action of external force. At this time, the stop bar enters the opening slot on the cylinder of the vibration sensing module under the elastic force of the spring of the reset module, so that the corresponding switch module remains in the off state. When the corresponding reset coil and drive coil receive reset power, the reset coil is electromagnetically converted and attracts the reset module spring, causing the stop bar to leave the opening slot; after electromagnetic conversion, the drive coil pushes the magnetic column towards the end of the magnetic column cylinder near the switch module. At this time, the switch module is in the conducting state under the magnetic attraction of the magnetic column, completing the reset, and the stop bar rests against the side wall of the magnetic column again.

7. The passive resettable vibration state monitoring device according to claim 1, characterized in that, The device substrate includes: a first vibration monitoring module slot, a second vibration monitoring module slot, a plurality of first vibration monitoring module pads, and a plurality of second vibration monitoring module pads; wherein, the first vibration sensing module is mounted in the first vibration monitoring module slot via the plurality of first vibration monitoring module pads, the second vibration sensing module is mounted in the second vibration monitoring module slot via the plurality of second vibration monitoring module pads, and the first switch module and the second switch module are also respectively mounted in the first vibration monitoring module slot and the second vibration monitoring module slot.

8. The passive resettable vibration state monitoring device according to any one of claims 1-7, characterized in that, It also includes any one or more of the following: - The monitoring device operates in the 860MHz to 960MHz ultra-high frequency band; The energy for receiving and transmitting signals by the monitoring device is obtained from the signals transmitted by the query device, and then converted into the device's operating energy to complete the information query.

9. A monitoring method for the passive resettable vibration state monitoring device according to any one of claims 1-8, characterized in that, include: The passive resettable vibration state monitoring device is placed horizontally or vertically relative to the monitored object. The first and second vibration sensing modules of the passive resettable vibration state monitoring device detect the vibration state of the object being tested. When any one or more of the first vibration sensing module and the second vibration sensing module detect vibration, the corresponding switch module undergoes a state change, causing the corresponding antenna to be in the worst electrical length state. The state is output by the antenna through the chip in the form of wireless signal strength. The corresponding reset module maintains the vibration sensing state of the vibration sensing module, thus completing the monitoring of the vibration state. When the corresponding reset module and the vibration sensing module receive a reset power supply, the reset module restores the magnetic attraction of the vibration sensing module, and the corresponding switch module returns to its original state under the magnetic attraction. The reset module completes the reset of the vibration sensing state.

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