Display device and method for manufacturing a display device

Abstract

The present application relates to a display device and a manufacturing method of a display device. The present application provides a display device or the like in which a plurality of layers can be formed without replacing a mask, and an OLED can exhibit a desired performance. A display device (100) includes a substrate (120), an organic layer stacked on the substrate (120), and a cathode (138) stacked on the organic layer. The organic layer includes at least a first layer and a second layer stacked on the first layer. The first layer is covered by the second layer on one end side in a first direction Dx and is not covered by the second layer on the other end side. The organic layer is covered by the cathode (138) on the one end side and is not covered by the cathode (138) on the other end side.

Description

Technical Field

[0001] This disclosure relates to a display device and a method of manufacturing a display device. Background Technology

[0002] In the manufacture of display devices comprising a stacked structure of thin films, there are known methods for continuously forming multiple layers without changing the mask (e.g., Patent Document 1).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2003-317958 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] When multiple layers are formed without changing the mask, the thin film material released during the formation of the earlier layers adheres to the mask, narrowing the opening of the mask. Therefore, the deposition range of the later-formed layers is narrower than that of the earlier-formed layers, creating a step at the ends of the stacked structure. This step results in a tapered structure that gradually tapers along the stacking direction.

[0008] When attempting to form a stacked structure of multiple organic layers in the light-emitting layer of an OLED (Organic Light Emitting Diode) that functions as pixels using organic electroluminescence (EL) without changing the mask, a cone-shaped structure results in the exposed ends of each organic layer. When an electrode layer for current flow is further stacked on this light-emitting layer, the electrode layer abuts against the ends of each organic layer at the cone-shaped portion. Therefore, a current path is established between the electrode layer and the lowermost layer among the organic layers. This current path differs from the desired current path of the light-emitting layer, i.e., the current path flowing through the electrode layer and all the organic layers. Therefore, if a display device is manufactured using conventional methods without changing the mask, it is difficult to achieve the intended performance of OLED.

[0009] This disclosure was made in view of the above-mentioned issues, with the aim of providing a display device and a method for manufacturing the display device that can form multiple layers without changing the mask and can perform the performance originally intended for OLEDs.

[0010] Methods for solving problems

[0011] A display device according to one aspect of this disclosure includes a substrate, an organic layer stacked on the substrate, and an electrode layer stacked on the organic layer, wherein the organic layer includes at least a first layer and a second layer stacked on the first layer, the first layer being covered by the second layer at one end along one direction of the substrate and not covered by the second layer at the other end along the same direction, the organic layer being covered by the electrode layer at one end and not covered by the electrode layer at the other end.

[0012] According to one aspect of the present disclosure, a method for manufacturing a display device involves depositing an organic layer comprising multiple layers and an electrode layer stacked on the organic layer onto a substrate using a mask. The mask has an opening corresponding to the size and shape of the first layer formed in the organic layer. The manufacturing method includes: a step of depositing the first layer formed in the organic layer; a step of moving the mask along one side of the substrate before forming layers other than the first layer formed in the organic layer; a step of depositing the layers other than the first layer formed in the organic layer; a step of moving the mask to the first side before forming the electrode layer; and a step of depositing the electrode layer. Attached Figure Description

[0013] [ Figure 1 ] Figure 1 This is a cross-sectional view illustrating an example of the stacked structure of a display device.

[0014] [ Figure 2 ] Figure 2 This is a schematic diagram illustrating the structure of the upper side of the substrate and the state of the mask in process 1.

[0015] [ Figure 3 ] Figure 3 This is a schematic diagram illustrating the structure of the upper side of the substrate and the state of the mask in process 2.

[0016] [ Figure 4 ] Figure 4 This is a schematic diagram illustrating the structure of the upper side of the substrate and the state of the mask in process 3.

[0017] [ Figure 5 ] Figure 5 This is a schematic diagram illustrating the structure of the upper side of the substrate and the state of the mask in process 4.

[0018] [ Figure 6 ] Figure 6 This is a schematic diagram showing the structure of the upper side of the substrate after process 4 and the state of the mask.

[0019] [ Figure 7 ] Figure 7This is a top view showing the position and state of the openings of the masks from process 1 to process 4, as well as the stacked structure formed on the substrate after the processes preceding process 1 are completed.

[0020] [ Figure 8 ] Figure 8 A schematic top view illustrating an example of the transmission path of the potential provided by the cathode contact wiring.

[0021] [ Figure 9 ] Figure 9 A schematic top view illustrating another example of the transmission path of the potential provided by the cathode contact wiring.

[0022] [ Figure 10 ] Figure 10 for Figure 9 AA cross-section view.

[0023] [ Figure 11 ] Figure 11 for Figure 9 BB cross-section.

[0024] [ Figure 12 ] Figure 12 This is a schematic diagram illustrating a stacked structure formed without changing the position of the mask.

[0025] Explanation of reference numerals in the attached figures

[0026] 100 display devices

[0027] 120 substrate

[0028] 131, 131G, 131B, 131R First Organic Layer

[0029] 132, 132G, 132B, 132R, second organic layer

[0030] 133, 133G, 133B, 133R Third Organic Layer

[0031] 174 pixel electrode

[0032] 193 Dike

[0033] 195 Wiring

[0034] 299 contacts

[0035] 200 masks

[0036] 211 Opening Detailed Implementation

[0037] Hereinafter, various embodiments of this disclosure will be described with reference to the accompanying drawings. It should be noted that this disclosure is merely an example, and any content readily conceived by those skilled in the art while maintaining the spirit of the invention is naturally included within the scope of this disclosure. Furthermore, the accompanying drawings are provided to make the description clearer. Compared to the actual embodiment, the drawings sometimes schematically represent the width, thickness, shape, etc., of various parts, but are only examples and do not limit the interpretation of this disclosure. Additionally, in this specification and the various drawings, elements identical to those described in previously presented figures are labeled with the same reference numerals, and detailed descriptions are sometimes appropriately omitted.

[0038] (Implementation Method 1)

[0039] Figure 1 This is a cross-sectional view showing an example of the stacked structure of the display device 100. The display device 100 includes a substrate 120, a counter substrate 150, and a plurality of constituent units forming a stacked structure between the substrate 120 and the counter substrate 150. Hereinafter, viewed from the substrate 120, the counter substrate 150 side is designated as the upper side. In the description of the embodiment, the stacking direction of the substrate 120 and the counter substrate 150 is designated as the third direction Dz. In addition, the direction in which the first sub-pixel Gpix, the second sub-pixel Bpix, and the third sub-pix, described later, are arranged is designated as the first direction Dx. In addition, the direction orthogonal to both the third direction Dz and the first direction Dx is designated as the second direction Dy. When only sub-pixels are described, the first sub-pixel Gpix, the second sub-pixel Bpix, and the third sub-pixel Rpix are included.

[0040] On the substrate 120, these constituent units are stacked in the following order: base layer 121, semiconductor layer including semiconductor film 122, interlayer insulating layer 123, first electrode layer including gate electrode 124, interlayer insulating layer 125, second electrode layer including drain electrode 126 and source electrode 127, interlayer insulating layer 128, and planarization layer 129.

[0041] The substrate layer 121 and the interlayer insulating layers 123, 125, and 128 are, for example, insulating layers containing silicon oxide or silicon nitride. In addition, the first electrode layer and the second electrode layer are particularly required to have low resistivity and are composed of metal layers selected from molybdenum (Mo), titanium (Ti), aluminum (Al), etc., or stacks thereof.

[0042] On substrate 120, multiple pixel circuits Sw are arranged in a matrix, corresponding to each of the multiple subpixels. The portion of the pixel circuit Sw, excluding the organic EL element, is formed in the layer from substrate layer 121 to pixel electrode 174. Furthermore, semiconductor film 122, gate electrode 124, drain electrode 126, and source electrode 127 constitute a thin-film transistor (TFT) directly connected to the organic EL element. This TFT controls the light emission of the subpixel corresponding to the pixel circuit Sw containing the TFT. Viewed from above, semiconductor film 122 and gate electrode 124 overlap. The region of semiconductor film 122 overlapping with gate electrode 124 forms the channel region of the TFT, and the upper surface of the protruding portion of semiconductor film 122 contacts the drain electrode 126 and source electrode 127, which penetrate the interlayer insulating layers 123 and 125, respectively. Planarization layer 129, for example, is an acrylic resin film, provided to cover the portion of the pixel circuit Sw containing the TFT that mainly consists of the portion excluding the organic EL element.

[0043] Furthermore, on the planarization layer 129, a third electrode layer including the pixel electrode 174, a spacer 193, a first organic layer including first organic layers 131G, 131B, and 131R, a second organic layer including second organic layers 132G, 132B, and 132R, a third organic layer including third organic layers 133G, 133B, and 133R, a cathode 138, and a sealing film 139 are sequentially stacked. Hereinafter, when referred to as an organic layer, it includes the first organic layer, the second organic layer, and the third organic layer.

[0044] The third electrode layer is determined based on factors such as the work function required to make the organic layer emit light, and is composed of an oxide conductive material selected from indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), etc. Furthermore, in the case of a top-emitting type, the third electrode layer requires reflectivity, and can also be a layer of silver (Ag), aluminum (Al), etc., as a reflective layer.

[0045] A contact hole 1741 is formed above the drain electrode 126 in the interlayer insulating layer 128 and the planarization layer 129, and the drain electrode 126 contacts the pixel electrode 174 at the bottom of the contact hole 1741. It should be noted that the source electrode 127 may be connected to the pixel electrode 174 via the contact hole 1741 instead of the drain electrode 126.

[0046] An organic layer is disposed above the pixel electrode 174, and a fourth electrode layer, including a cathode 138 formed of a transparent electrode, is disposed above the organic layer. The cathode 138 is further covered by a sealing film 139. The pixel electrode 174, the organic layer, and the cathode 138 constitute an OLED with the pixel electrode 174 as the anode and the cathode 138 as the cathode. When the cathode 138 is a transparent electrode, the fourth electrode layer is made of an oxide conductive material such as ITO. In addition, the cathode 138 can be formed as a single layer of oxide conductive material, or it can be formed as multiple layers including layers of other metal materials. It should be noted that, in this embodiment, since the constituent unit contained in the fourth electrode layer is the cathode 138, the pixel electrode 174 contained in the third electrode layer sandwiching the organic layer is the anode.

[0047] The organic layer is a light-emitting layer that emits light by applying voltage to the pixel electrode 174 and the cathode 138, allowing current to flow through it. The organic layers of the first sub-pixel Gpix, the second sub-pixel Bpix, and the third sub-pixel Rpix are formed using organic materials with different wavelengths of light that reach peak emission. Specifically, the organic layer of the first sub-pixel Gpix is ​​formed using an organic material whose wavelength is visually perceived as green (G) light reaching peak emission. Similarly, the organic layer of the second sub-pixel Bpix is ​​formed using an organic material whose wavelength is visually perceived as blue (B) light reaching peak emission. Furthermore, the organic layer of the third sub-pixel Rpix is ​​formed using an organic material whose wavelength is visually perceived as red (R) light reaching peak emission. Examples of such organic materials include phosphorescent materials and fluorescent materials.

[0048] The region where the pixel electrode 174 contacts the organic layer is positioned directly above the thin-film transistor, or more precisely, above the contact hole 1741 that connects the drain electrode 126 (or source electrode 127) to the pixel electrode 174. Furthermore, the organic layer emits light in the light-emitting region corresponding to the region where the pixel electrode 174 contacts the organic layer.

[0049] like Figure 1 As shown, the cross-section of the partition 193 is a so-called trapezoid, with the width decreasing at the top. The partition 193 is formed of acrylic resin. The lower surface of the partition 193 is in contact with the planarization layer 129 and the pixel electrode 174. The pixel electrode 174 is exposed between the partitions 193, and an organic layer is formed on the pixel electrode 174.

[0050] It should be noted that the organic layer also extends to the upper side of the partition 193 stacked at both ends of the pixel electrode 174. The partition 193 is located between the plurality of pixel electrodes 174 arranged in the first direction Dx, so that the adjacent pixel electrodes 174 sandwiched by the partition 193 are insulated from each other.

[0051] Additionally, a cathode contact wiring 195 is provided on the upper side of the partition 193. The cathode contact wiring 195, like the first electrode layer and the second electrode layer, is made of a material with low resistance. The cathode contact wiring 195 is connected to the cathode 138 stacked on top of it. Specifically, for example... Figure 1 As shown, one end of the cathode 138 in the first direction Dx is connected to the cathode contact wiring 195. It should be noted that the cathode 138 is not connected to the cathode contact wiring 195 located at the other end in the first direction Dx. Furthermore, if the cathode 138 is formed of multiple layers, it is sufficient for any one layer to be connected to the cathode contact wiring 195.

[0052] Regarding the cathode 138, the organic layer beneath it is covered at one end of the first direction Dx connected to the cathode contact wiring 195. Furthermore, at one end of the first direction Dx, among the multiple layers contained in the organic layer stacked above the pixel electrode 174, the uppermost layer covers the layer directly below it. Specifically, the third organic layer formed on the first sub-pixel Gpix, the second sub-pixel Bpix, and the third sub-pix Rpix respectively covers the second organic layer beneath it at one end of the first direction Dx. Additionally, the second organic layer formed on the first sub-pixel Gpix, the second sub-pixel Bpix, and the third sub-pix Rpix respectively covers the first organic layer beneath it at one end of the first direction Dx. That is, if the lower side of two layers that abut each other among the multiple layers contained in the organic layer is designated as the first layer and the upper side as the second layer, then the second layer covers the first layer at one end along one direction of the substrate 120 (e.g., the first direction Dx).

[0053] A color filter layer 145 with a black matrix 141 is formed on the surface of the opposing substrate 150 on the substrate 120 side. The black matrix 141 is a light-shielding film used to block light leaking from the boundaries of each sub-pixel. A filler material 140 is provided between the color filter layer 145 and the sealing film 139 stacked on the substrate 120. For the substrate 120 with the aforementioned base layer 121 to the sealing film 139 stacked, and the opposing substrate 150 with the color filter layer 145 formed, the substrate 120 and the opposing substrate 150 are bonded together using the filler material 140 sandwiched between the sealing film 139 and the color filter layer 145 as an adhesive. It should be noted that the black matrix 141 and the color filter layer 145 may not be formed.

[0054] exist Figure 1In this configuration, the organic layer can also be a constituent unit that represents various colors through color filters disposed on the color filter layer 145. In this case, the organic layers of the first sub-pixel Gpix, the second sub-pixel Bpix, and the third sub-pixel Rpix are not formed separately, but are provided together as a light-emitting layer that emits a common color (e.g., white light). Furthermore, on the upper side of the organic layer having a positional relationship of being adjacent to the black matrix 141 in the first direction Dx, color filters of different colors are disposed on the color filter layer 145. The colors of the color filters are, for example, green (G), blue (B), red (R), etc., but are not limited to these and can be appropriately varied.

[0055] A pixel is formed by combining one first sub-pixel (Gpix), one second sub-pixel (Bpix), and one third sub-pixel (Rpix). Each of these sub-pixels functions as a sub-pixel. Although not illustrated, in the first direction Dx, multiple sub-pixels are periodically arranged in the order of first sub-pixel (Gpix), second sub-pixel (Bpix), and third sub-pixel (Rpix). Furthermore, as described later... Figure 8 and Figure 9 As shown, multiple sub-pixels of the same color are arranged along the second direction Dy. This arrangement of sub-pixels and pixels is just one example and not a limitation; it can be modified as appropriate.

[0056] Furthermore, the organic layer has a conical structure TP. The conical structure TP is formed by multiple layer structures contained in the organic layer. Specifically, for the first organic layer formed on each of the first sub-pixel Gpix, the second sub-pixel Bpix, and the third sub-pixel Rpix, the other end of the first direction Dx extends to the partition 193 in a state where it is not covered by the second organic layer formed on its upper side. Similarly, for the second organic layer formed on each of the first sub-pixel Gpix, the second sub-pixel Bpix, and the third sub-pixel Rpix, the other end of the first direction Dx extends to the first organic layer in a state where it is not covered by the third organic layer formed on its upper side. Thus, the conical structure TP is formed by a stacked structure of a lower layer that extends further on its other side compared to the uppermost layer, and an upper layer. That is, if the lower side of two mutually abutting layers in the organic layer is designated as the first layer and the upper side as the second layer, then the other end of the first layer along one direction (e.g., the first direction Dx) of the substrate 120 is not covered by the second layer. Furthermore, the other end of the cathode 138 along the first direction Dx is not covered by the conical structure TP. In other words, the other end of all layers in the organic layer, including the uppermost layer (e.g., the third organic layer), is not covered by the cathode 138.

[0057] It should be noted that, in the organic layer, the layer that contacts the pixel electrode 174 is the bottommost layer among the multiple layers contained in the organic layer. The layers other than the bottommost layer in the multiple layers contained in the organic layer do not contact the pixel electrode 174.

[0058] The layers in the laminated structure between the substrate 120 and the filler material 140 are formed, for example, by utilizing a mask 200 such as a metal mask (see reference). Figure 2 The process involves vapor deposition. It should be noted that the entire stacked structure does not need to be formed by vapor deposition; for example, other formation methods such as photolithography can be used for a portion of the stacked structure. In this embodiment, vapor deposition using a mask is employed in the formation of at least the organic layer and the formation of the cathode 138 within the manufacturing process of the display device 100.

[0059] The organic layer and the cathode 138 are formed using the same mask 200. See below for reference. Figures 2 to 7 The formation processes of the organic layer and the cathode 138 will be described. Hereinafter, the process of forming the first organic layer 131 will be designated as process 1. The first organic layer 131 is any one of the first organic layer 131G, the first organic layer 131B, or the first organic layer 131R. Furthermore, the process of forming the second organic layer 132 on top of the first organic layer 131 will be designated as process 2. The second organic layer 132 is any one of the second organic layer 132G, the second organic layer 132B, or the second organic layer 132R. Furthermore, the process of forming the third organic layer 133 on top of the second organic layer 132 will be designated as process 3. The third organic layer 133 is any one of the third organic layer 133G, the third organic layer 133B, or the third organic layer 133R. In addition, the process of forming a cathode 138 on the upper side of the first organic layer 131, the second organic layer 132, and the third organic layer 133 formed up to process 3 is designated as process 4.

[0060] Figure 2 This is a schematic diagram illustrating the structure of the upper side of the substrate 120 and the state of the mask 200 in process 1. It should be noted that, when referring to... Figures 2 to 6 In this description, the formation process performed before the formation process of the first organic layer 131 in the formation process of the laminated structure formed on the substrate 120 is omitted. In this description, the substrate 120 is rendered into a state by the formation process performed before the formation process of the first organic layer 131, wherein a laminated structure below the planarization layer 129 is formed, and pixel electrodes 174, spacers 193, and cathode contact wiring 195 are formed on the upper side of the planarization layer 129. Hereinafter, when referred to as "substrate 120 in which the processes preceding process 1 have been completed," this refers to the substrate 120 in this state. Furthermore, in Figures 2 to 6 In this paper, detailed illustrations of the structure below planarization layer 129 are omitted.

[0061] like Figure 2 As shown, in the formation process of the first organic layer 131, the mask 200 is positioned such that the opening 211 is located above the pixel electrode 174. Figure 2 As shown, opening 211 is an opening of a mask 200 with an opening width D1 in the first direction Dx. Width D1 is the interval between edge portions 201 and 202 of the mask 200. Edge portions 201 and 202 are positioned opposite each other in the first direction Dx, sandwiching opening 211. When the position of the mask 200 changes, the positions of edge portions 201 and 202 change, and therefore the position of opening 211 changes. Figures 2 to 7 In this context, the position of the edge portion 201 in the first direction Dx during process 1 is shown as position P11. Additionally, in... Figures 2 to 6 In the process, the position of the edge portion 202 in the first direction Dx is shown as position P21.

[0062] In step 1, the organic material constituting the first organic layer 131 is vapor-deposited using a mask 200. Figure 2 The radiation, within the indicated radiation angle range Ra, is emitted from top to bottom and adheres to the pixel electrode 174 and the spacer 193, forming the first organic layer 131. For example... Figure 2 As shown, the first organic layer 131 is formed between two cathode contact wirings 195 arranged in the first direction Dx. The formation range of the first organic layer 131 corresponds to the position and size of the width D1 of the opening 211 and the position of the substrate 120 that has been completed in the process preceding process 1.

[0063] In the description of processes 1 to 4, the position of the substrate 120, which has been completed in the previous processes, is fixed. Therefore, in processes 1 to 4, the formation range of the layer formed in each process is determined by the position of the mask 200. It should be noted that in the description of processes 1 to 4, the position change of the mask 200 between processes is performed in the first direction Dx, but not in the second direction Dy and the third direction Dz.

[0064] Figure 3 This is a schematic diagram showing the structure of the upper side of the substrate 120 and the state of the mask 200 in process 2. Before process 2, a reference is made. Figure 2In step 1, a first organic layer 231 is deposited on the mask 200. The first organic layer 231 is a layer formed of the organic material of the first organic layer 131. Most of the organic material constituting the first organic layer 231 is attached to the upper side of the mask 200, and a portion is also attached to the edge portions 201 and 202. Thus, the opening 211, which is exposed on the inside of the edge portions 201 and 202 in step 1, becomes an opening 212 in step 2 where the edge portions 201 and 202 are covered by the first organic layer 231. The opening width Dx of the opening 212 in the first direction is the width D2 between the edge portion 201 covered by the first organic layer 231 and the edge portion 202 covered by the first organic layer 231. The width D2 is smaller than the width D1.

[0065] After performing step 1 and before performing step 2, a first position change of the mask 200 is performed by moving the position of the edge portion 201 from position P11 to position P12. Through this first position change, the position of the edge portion 202 moves from position P21 to position P22. Figure 3 In the diagram, arrow V1 indicates the movement of mask 200 caused by the change in the first position. Through the vapor deposition of the mask 200 after process 1 and the change in the first position, in process 2, the organic material constituting the second organic layer 132 is deposited... Figure 3 Within the radiation angle range Rb shown, the material is emitted from the top to the bottom and adheres to the first organic layer 131 and the partition 193 to form the second organic layer 132.

[0066] Mask 200 undergoes a first position change, thus, as Figure 3 As shown, the second organic layer 132 is formed closer to one side of the two cathode contact wirings 195 arranged in the first direction Dx. Therefore, on the other side, a region is formed where the second organic layer 132 is not stacked on the upper side of the first organic layer 131, exposing the first organic layer 131.

[0067] Figure 4 This is a schematic diagram showing the structure of the upper side of the substrate 120 and the state of the mask 200 in process 3. Reference is made before process 3. Figure 3In step 2, a second organic layer 232 is further deposited on the mask 200. The second organic layer 232 is a layer formed of the organic material of the second organic layer 132. Most of the organic material constituting the second organic layer 232 is attached to the upper side of the first organic layer 231, and a portion is also attached to the edge portions 201 and 202 where the organic material constituting the first organic layer 231 is already attached. Thus, in step 3, the edge portions 201 and 202 are covered by the first organic layer 231 and the second organic layer 232. Therefore, in step 3, the opening of the mask 200 becomes the opening 213. The opening width Dx of the opening 213 in the first direction is the width D3 between the edge portion 201 covered by the first organic layer 231 and the second organic layer 232 and the edge portion 202 covered by the first organic layer 231 and the second organic layer 232. The width D3 is smaller than the width D2.

[0068] After step 2 and before step 3, the mask 200 undergoes a second position change by moving the edge portion 201 from position P12 to position P13. Through this second position change, the edge portion 202 moves from position P22 to position P23. Figure 4 In the diagram, arrow V2 indicates the movement of mask 200 caused by the change in the second position. Through the vapor deposition of the mask 200 after step 2 and the change in the second position, in step 3, the organic material constituting the third organic layer 133 is deposited... Figure 4 The radiation is emitted from the top to the bottom within the radiation angle range Rc shown, and adheres to the second organic layer 132 and the dam 193 to form the third organic layer 133.

[0069] Mask 200 undergoes a second position change, thus, as follows Figure 4 As shown, the third organic layer 133 is formed in the region closer to one side of the two cathode contact wirings 195 arranged in the first direction Dx. Therefore, on the other side, a region is formed where the third organic layer 133 is not stacked on the upper side of the second organic layer 132, exposing the second organic layer 132.

[0070] Figure 5 This is a schematic diagram illustrating the structure of the upper side of the substrate 120 and the state of the mask 200 in process 4. A reference is made before process 4. Figure 4In step 3, a third organic layer 233 is further deposited on the mask 200. The third organic layer 233 is a layer formed of the organic material of the third organic layer 133. Most of the organic material constituting the third organic layer 233 is attached to the upper side of the second organic layer 232, and a portion is also attached to the edge portions 201 and 202 where the organic materials constituting the first organic layer 231 and the second organic layer 232 are already attached. As a result, in step 4, the edge portions 201 and 202 are covered by the first organic layer 231, the second organic layer 232, and the third organic layer 233. Therefore, in step 4, the opening of the mask 200 becomes the opening 214. The opening width of the opening 214 in the first direction Dx is the width D4 between the edge portion 201 covered by the first organic layer 231, the second organic layer 232, and the third organic layer 233, and the edge portion 202 covered by the first organic layer 231, the second organic layer 232, and the third organic layer 233. The width D4 is smaller than the width D3.

[0071] After step 3 and before step 4, the third position change of the mask 200 is performed by moving the edge portion 201 from position P13 to position P14. Through this third position change, the position of the edge portion 202 moves from position P23 to position P24. Figure 5 In the diagram, arrow V3 indicates the movement of mask 200 caused by the change in the third position. Through the vapor deposition of the mask 200 after step 3 and the change in the third position, in step 4, the thin-film electrode material constituting the cathode 138 is deposited... Figure 5 The radiation is emitted from top to bottom within the indicated radiation angle range Rd, adhering to the third organic layer 133, the spacer 193, and the cathode contact wiring 195 to form a cathode 138. The thin-film electrode material is, for example, a metal such as aluminum, or an alloy or a conductive compound.

[0072] Mask 200 undergoes a third position change, thus, as Figure 5 As shown, the cathode 138 is formed in a region that overlaps with one side of one of the two cathode contact wirings 195 arranged in the first direction Dx, and is connected to the cathode contact wirings 195. Therefore, on the other side, a region is formed where the cathode 138 is not stacked on the upper side of the third organic layer 133, exposing the third organic layer 133. A conical structure TP is formed on the other side of the first organic layer 131 formed in process 1, the other end of the second organic layer 132 formed in process 2, and the other end of the third organic layer 133 formed in process 3.

[0073] It should be noted that, in Figure 1 , Figure 5 and Figure 6In the example shown, the other end of the cathode 138 in the first direction Dx is not covered by the inclined surface of the organic layer and the organic layer along the upper base of the trapezoid. The inclined surface of the organic layer and the organic layer along the upper base of the trapezoid are formed by forming the organic layer in a way that climbs up to the trapezoidal structure 193 provided on the other end. The specific shape of the cathode 138 is not limited to... Figure 1 , Figure 5 and Figure 6 The example shown. For instance, the extension length of the cathode 138 in the first direction Dx can be further increased by making the radiation angles θ1 and θ2 of the radiation angle range Rd extending from the mask 200 side to the substrate 120 side through the opening 214 larger, so that the other end of the cathode 138 is covered by the slope of the organic layer and the organic layer along the upper bottom of the trapezoid. In this case, according to the radiation angles θ1 and θ2, the position of the edge portion 201 in process 4 is set to the position between position P13 and position P14, etc., and the position of the mask 200 in the first direction Dx is adjusted, thereby making the position of one end of the cathode 138 and the edge portion 201 in process 4 more closely related to the position of the cathode 138. Figure 1 , Figure 5 and Figure 6 The example shown is similar, and on the other end, the cathode 138 covers the inclined surface of the organic layer, along the upper base of the trapezoid. More specifically, for example, the adjustment of the emission angles θ1 and θ2 can be achieved by adjusting the positional relationship between the substrate through which the vapor-deposited material is emitted to the mask 200 side and the mask 200 in the third direction Dz. Furthermore, by adjusting (lengthening) the positional relationship between the mask 200 and the substrate 120 in the third direction Dz, the range of the emission angle Rd can be further increased without changing the emission angles θ1 and θ2, thus further increasing the formation range of the cathode 138. Similarly, on the other end, the cathode 138 covers the inclined surface of the organic layer, along the upper base of the trapezoid. However, even in this case, the conical structure TP is not covered on the other end of the cathode 138 in the first direction Dx.

[0074] Figure 6 This is a schematic diagram showing the structure of the upper side of the substrate 120 after process 4 and the state of the mask 200. (Referencing...) Figure 5In step 4, an electrode layer 238 is further deposited on the mask 200. The electrode layer 238 is a layer formed from the thin-film electrode material of the cathode 138. Most of the thin-film electrode material constituting the electrode layer 238 is attached to the upper side of the third organic layer 233, and a portion is also attached to the edge portions 201 and 202 where the organic materials constituting the first organic layer 231, the second organic layer 232, and the third organic layer 233 are already attached. As a result, after step 4, the edge portions 201 and 202 are covered by the first organic layer 231, the second organic layer 232, the third organic layer 233, and the electrode layer 238. Therefore, after step 4, the opening of the mask 200 becomes an opening 215 that is smaller than the opening 214.

[0075] Figure 7 This is a top view showing the position and state of the openings in the mask 200 from process 1 to process 4, and the stacked structure formed on the substrate 120 where processes prior to process 1 have been completed. The top view is a frontal view of the plane from the first direction Dx to the second direction Dy. It should be noted that in Figure 7 The diagram illustrates the cathode contact wiring 195 connected to the cathode 138 contained in the laminated structure, showing the openings of the mask 200 in each process and the position of the laminated structure when viewed from above. Figure 7 As shown in the "Location of Mask Opening" column of "Process 1", the opening 211 is, for example, a rectangular opening.

[0076] For reference Figure 2 As explained, the opening of the mask 200 in process 1 is opening 211. The opening width of opening 211 in the second direction Dy is width T1. Through the implementation of process 1, as... Figure 7 As shown in the "Layered Structure" column of "Process 1", a first organic layer 131 is formed. When viewed from above, the width of the first organic layer 131 in the first direction Dx and the width in the second direction Dy are larger than the opening 211.

[0077] For reference Figure 3 As explained, in step 2, the opening used to form the second organic layer 132 is opening 212. The opening width of opening 212 in the second direction Dy is width T2. Width T2 is less than width T1. By implementing step 2, as... Figure 7 As shown in the "Layered Structure" section of "Process 2", a second organic layer 132 is formed. When viewed from above, the width of the second organic layer 132 in the first direction Dx and the width in the second direction Dy are larger than the opening 212. (See attached image.) Figure 3 and Figure 7 As shown in the "Location of Mask Opening" column of "Process 2", the opening 211 is located on one side of the first direction Dx. Figure 2The position of the end of the edge portion 201) moves from position P11 to position P12, so the formation position of the second organic layer 132 is closer to the cathode contact wiring 195 than that of the first organic layer 131.

[0078] For reference Figure 4 As explained, the opening used to form the third organic layer 133 in step 3 is opening 213. The opening width of opening 213 in the second direction Dy is width T3. Width T3 is smaller than width T2. By implementing step 3, as... Figure 7 As shown in the "Layered Structure" section of "Process 3", a third organic layer 133 is formed. When viewed from above, the width of the third organic layer 133 in the first direction Dx and the width in the second direction Dy are larger than the opening 213. (See attached image.) Figure 4 and Figure 7 As shown in the "Location of Mask Opening" column of "Process 3", the opening 211 is located on one side of the first direction Dx. Figure 2 The position of the end of the edge portion 201) moves from position P12 to position P13, so that the formation position of the third organic layer 133 is closer to the cathode contact wiring 195 than that of the second organic layer 132. It should be noted that, not limited to the third organic layer 133, it is desirable that none of the multiple organic layers abut against the cathode contact wiring.

[0079] For reference Figure 5 As explained, in step 4, the opening used to form the cathode 138 is opening 214. The opening width of opening 214 in the second direction Dy is width T4. Width T4 is smaller than width T3. Through the implementation of step 4, as... Figure 7 As shown in the "Layered Structure" section of "Process 4", cathode 138 is formed. When viewed from above, the width of cathode 138 in the first direction Dx and the width in the second direction Dy are larger than the opening 214. (See attached image.) Figure 5 and Figure 7 As shown in the "Location of Mask Opening" column of "Process 2", due to the first direction Dx side of the opening 211 ( Figure 2 The position of the end of the edge portion 201) moves from position P13 to position P14, so that the cathode 138 is formed to overlap with the cathode contact wiring 195.

[0080] Figure 5 and Figure 6The sub-pix shown is any one of the first sub-pixel Gpix, the second sub-pixel Bpix, or the third sub-pixel Rpix. When the first sub-pixel Gpix is ​​formed, a first organic layer 131G is formed through process 1, a second organic layer 132G is formed through process 2, a third organic layer 133G is formed through process 3, and a cathode 138 is formed through process 4. When the second sub-pixel Bpix is ​​formed, a first organic layer 131B is formed through process 1, a second organic layer 132B is formed through process 2, a third organic layer 133B is formed through process 3, and a cathode 138 is formed through process 4. When the third sub-pixel Rpix is ​​formed, a first organic layer 131R is formed through process 1, a second organic layer 132R is formed through process 2, a third organic layer 133R is formed through process 3, and a cathode 138 is formed through process 4. The formation of the first sub-pixel Gpix, the second sub-pixel Bpix, and the third sub-pixel Rpix are performed through separate processes.

[0081] Figure 8 A schematic top view illustrating an example of the potential transmission path provided by the cathode contact wiring 195. (See attached image.) Figure 1 and Figure 8 As shown, the cathode contact wiring 195 connected to each sub-pixel (first sub-pixel Gpix, second sub-pixel Bpix, and third sub-pix Rpix) is arranged on one side of the first direction Dx relative to the sub-pixel. Furthermore, as... Figure 8 As shown, the cathode contact wiring 195 is configured, for example, as wiring extending in the second direction Dy. Subpixels arranged in the second direction Dy share the cathode contact wiring 195.

[0082] Additionally, the display device 100 has a display area AA and a peripheral area FA. In the display area AA, multiple pixels are configured, each pixel comprising a first sub-pixel Gpix, a second sub-pixel Bpix, and a third sub-pixel Rpix. Image display based on the multiple pixels is performed in the display area AA. The peripheral area FA is located outside the display area AA when viewed from above. In the peripheral area FA, for example, a power supply line 199 is provided along a first direction Dx. The power supply line 199, for example, is contained within a reference... Figure 1The electrodes are arranged in a manner consistent with the laminated structure between the substrate 120 and the filler material 140. Specifically, the cathode contact wiring 195 is disposed along the sub-pixel within the display area AA and extends to the peripheral area FA at its ends. The cathode contact wiring 195 is connected to the power supply line 199 at the peripheral area FA. When the cathode contact wiring 195 and the power supply line 199 are on the same layer, they are integrally disposed. When the cathode contact wiring 195 and the power supply line 199 are on different layers, they are connected via contact holes. The potential of the cathode 138 is applied externally via the power supply line 199 and the cathode contact wiring 195.

[0083] Although not illustrated, the display device 100 includes a driving circuit that provides various potentials and electrical signals, including the potential of the cathode 138, to operate the pixels of the display device 100. The details of this driving circuit may be the same as those used in known organic EL displays, or it may be a dedicated driving circuit.

[0084] exist Figure 8 The example illustrates a display area AA with one pixel arranged in the first direction Dx and three pixels arranged in the second direction Dy; however, more pixels can be arranged in the display area AA. Additionally, the positional relationship between the sub-pixels (not shown) and the cathode contact wiring 195 is related to... Figure 8 The positional relationship between the sub-pixel and the cathode contact wiring 195 shown is the same.

[0085] It should be noted that the shape, arrangement, and number of sub-pixels per pixel when viewed from above are not limited to the following. Figure 8 The following Figure 9 The example shown can be modified as appropriate. For example, multiple pixels can be set in the display area AA as follows: a pixel consisting of 4 sub-pixels arranged in the manner of Dx in the first direction × Dy in the second direction = 2 × 2.

[0086] In addition, Figure 8In this configuration, the cathode contact wiring 195 extending near the first sub-pix Gpix, the second sub-pix Bpix, and the third sub-pix Rpix and connected to each cathode 138 is connected to a common contact hole 299, but it can also be supplied with different potentials according to each color of the sub-pix. That is, in the peripheral region FA, the cathode contact wiring 195 extending near the first sub-pix Gpix and connected to each cathode 138, the cathode contact wiring 195 extending near the second sub-pix Bpix and connected to each cathode 138, and the cathode contact wiring 195 extending near the third sub-pix Rpix and connected to each cathode 138 can be connected to different electrodes respectively. Therefore, by supplying different potentials to different electrodes, the potential of the cathode 138 can be determined individually for each color of the sub-pix.

[0087] It should be noted that the connection method between the cathode contact wiring 195 and the external environment is not limited to the reference method. Figure 8 The examples illustrate this.

[0088] Figure 9 A schematic top view illustrating another example of the potential transmission path provided by the cathode contact wiring 195. (See diagram below.) Figure 9 As shown, contact holes 299 can also be provided near each of the sub-pixels (first sub-pixel Gpix, second sub-pixel Bpix, and third sub-pixel Rpix). In this case, the cathode contact wiring 195 applies the potential of the cathode 138 from the outside via the connection path formed using the contact holes 299.

[0089] Figure 10 for Figure 9 AA cross-sectional view. Cathode contact wiring 195 as shown. Figure 1 , Figure 5 , Figure 6 and Figure 10 As shown, the cathode contact wiring 195 is connected to the cathode 138. The cathode 138 is connected via a reference... Figures 2 to 5 The process described above involves step 4 in the process of forming the stacked structure of the first organic layer 131, the second organic layer 132, the third organic layer 133, and the cathode 138. Figure 10 The first organic layer 131G, the second organic layer 132G, and the third organic layer 133G illustrated in the figure are formed by the following processes, namely, processes 1, 2, and 3 as the process of forming the first sub-pixel Gpix.

[0090] A contact hole 299 is provided on the lower side of the cathode contact wiring 195, penetrating the partition 193. The cathode contact wiring 195 is connected to the power supply line 295 provided on the lower side of the cathode contact wiring 195 via the contact hole 299. It should be noted that... Figure 10 And then Figure 11The power supply line 295 shown is located within the planarization layer 129. The power supply line 295 can be placed within the stacked structure below the planarization layer 129, and its configuration is not limited to the planarization layer 129.

[0091] Figure 11 for Figure 9 BB cross-sectional view. (See attached image.) Figure 11 As illustrated, the power supply line 295 may be an electrode or wiring extending in the second direction Dy, but the form of the power supply line 295 is not limited to this. The power supply line 295 may extend in such a way that the potential of the cathode 138 can be applied from the outside through any path via the layer connected by the contact hole 299.

[0092] It should be noted that, in Figure 10 and Figure 11 The figure illustrates an example where the cathode contact wiring 195 is connected to the power supply line 295 by embedding a contact hole 299 with the same configuration as the cathode contact wiring 195 during its formation. However, the configuration of embedding the contact hole 299 is not limited to this. For example, the formation of the cathode contact wiring 195 may be omitted. In this case, when the cathode 138 is formed, the contact hole 299 is embedded with the same configuration as the cathode 138, thereby connecting the cathode 138 to the power supply line 295.

[0093] In reference Figures 9 to 11 In this example, since the surrounding area FA is not required, the edge (e.g., a frame-like edge) surrounding the display area AA can be narrower when viewed from above. It should be noted that the location of the contact hole 299 is not limited to... Figure 9 The example shown can be appropriately modified within the range where the cathode 138 can overlap with the position of the contact hole 299 at one end.

[0094] According to reference Figures 1 to 11 In the described embodiment, a first organic layer 131, a second organic layer 132, and a third organic layer 133 are sandwiched between the cathode 138 and the pixel electrode 174. Furthermore, the cathode 138 abuts against the third organic layer 133. That is, there are no portions where the cathode 138 abuts against the first organic layer 131, or where the cathode 138 abuts against the second organic layer 132. Therefore, a stacked structure can be formed that does not form a conductive path connecting the cathode 138 to the first organic layer 131 or the second organic layer 132, thus suppressing the reduction in luminous efficiency caused by leakage current generated during the formation of such a conductive path.

[0095] Figure 12 This is a schematic diagram illustrating a stacked structure formed without repositioning the mask 200. Here, it is assumed that no reference datum is used. Figures 2 to 6The display device 300 is used when the position of the mask 200 changes, as described above. In this case, as... Figure 12 As shown, cones are generated at both ends of the first direction Dx of each sub-pixel (the first sub-pixel Gpix, the second sub-pixel Bpix, and the third sub-pixel Rpix). The reason for forming such cones is that, as shown in the reference... Figures 2 to 7 As explained, when the first organic layer 131 to the cathode 138 are formed using the same mask 200, the layer formed on the upper side is smaller in size when viewed from above than the layer formed on the lower side. Furthermore, adjacent sub-pixels in the first direction Dx are connected to each other by the cathode 138, which is formed in a cone-shaped manner covering from the top. That is, short circuits occur between the sub-pixels.

[0096] Figure 12The following illustration shows a display device 300 in which a short-circuit portion SC1 is formed between conical structures TP1 and TP2, a short-circuit portion SC2 is formed between conical structures TP3 and TP4, and a short-circuit portion SC3 is formed between conical structures TP5 and TP6. Conical structure TP1 is a cone-shaped structure in the first sub-pix Gpix, having a step difference between a first organic layer 131G, a second organic layer 132G, and a third organic layer 133G formed on one side of the first direction Dx. Conical structure TP2 is a cone-shaped structure in the second sub-pix Bpix, having a step difference between a first organic layer 131B, a second organic layer 132B, and a third organic layer 133B formed on the other side of the first direction Dx. The short-circuit portion SC1 is formed by the contact between one side of the cathode 138, which is formed to cover the conical structure TP1 from above, and the other side of the cathode 138, which is formed to cover the conical structure TP2 from above. The conical structure TP3 is a cone-shaped structure in the second sub-pix Bpix, with a step difference between the first organic layer 131B, the second organic layer 132B, and the third organic layer 133B formed on one side of the first direction Dx. The conical structure TP4 is a cone-shaped structure in the third sub-pix Rpix, with a step difference between the first organic layer 131R, the second organic layer 132R, and the third organic layer 133R formed on the other side of the first direction Dx. The short-circuit portion SC2 is formed by the contact between one side of the cathode 138, which is formed to cover the conical structure TP3 from above, and the other side of the cathode 138, which is formed to cover the conical structure TP4 from above. The conical structure TP5 is a cone-shaped structure in the third sub-pix Rpix, with a step difference of the first organic layer 131R, the second organic layer 132R, and the third organic layer 133R formed on one side of the first direction Dx. The conical structure TP6 is a cone-shaped structure in the first sub-pix Gpix, with a step difference of the first organic layer 131G, the second organic layer 132G, and the third organic layer 133G formed on the other side of the first direction Dx. The short-circuit portion SC3 is a short-circuit portion formed by the contact between one side of the cathode 138 that covers the conical structure TP5 from above and the other side of the cathode 138 that covers the conical structure TP6 from above.

[0097] For reference Figure 12 The display device 300 described herein, according to an embodiment, is as follows (refer to...) Figures 2 to 6 As explained, no short circuits occur between adjacent sub-pixels. Therefore, the process of forming an organic layer and a cathode 138 on the pixel electrode 174 can be performed using the same mask 200.

[0098] As described above, according to the embodiment, the display device 100 includes a substrate 120, an organic layer stacked on the substrate 120, and an electrode layer (cathode 138) stacked on the organic layer. The organic layer includes at least a first layer and a second layer stacked on the first layer. The first layer is covered by the second layer at one end along one direction of the substrate (e.g., a first direction Dx), but not at the other end in the same direction. The organic layer is covered by the electrode layer at one end, but not at the other end. Thus, all the electrical paths including the electrode layer and the organic layer are established. On the other hand, electrical paths including only a portion of the electrode layer and the organic layer are not established. Therefore, the OLED can perform the desired performance. Furthermore, in the manufacture of such an OLED, the organic layer including the first layer and the second layer, and the electrode layer, can be formed without changing the mask (mask 200).

[0099] Additionally, the electrode layer (cathode 138) is connected to wiring (e.g., cathode contact wiring 195) at one end along one direction (e.g., the first direction Dx) of the substrate 120. This allows a power-carrying path to the electrode layer to be formed using this wiring.

[0100] Additionally, wiring (e.g., cathode contact wiring 195) or contact holes communicating with the wiring (e.g., contact holes 299) are provided in an insulating portion (barrier 193) extending in such a way as to cover a portion of the pixel electrode 174 formed on the underside of the organic layer. One end of the organic layer and the electrode layer are stacked on the insulating portion. As a result, the insulation between the pixel electrode 174 and the wiring and the pixel electrode 174 and the electrode layer can be performed more reliably.

[0101] Furthermore, multiple pixel electrodes 174 are arranged in one direction (e.g., a first direction Dx). An insulating portion (barrier 193) extends such that one end in that direction covers a portion of one of the two adjacent pixel electrodes 174 in that direction, and the other end in that direction covers a portion of the other of the two adjacent pixel electrodes 174 in that direction. An organic layer is stacked on each of the multiple pixel electrodes 174. The other end of this organic layer is stacked on the insulating portion. Thus, when viewed from above, an organic layer can be formed over a wider area than the area of ​​the pixel electrodes 174 not covered by the insulating portion.

[0102] Furthermore, the manufacturing method of the display device 100 used in this embodiment is a method of forming an organic layer comprising multiple layers (e.g., a first organic layer 131, a second organic layer 132, and a third organic layer 133) and an electrode layer (cathode 138) stacked on the organic layer by vapor deposition on a substrate 120 using a mask 200. The mask 200 is provided with an opening (opening 211) corresponding to the size and shape of the first layer formed in the organic layer. This manufacturing method includes: a step of vapor deposition to form the first layer formed in the organic layer; a step of moving the mask 200 along one side of the substrate 120 before forming layers other than the first layer formed in the organic layer; a step of vapor deposition to form layers other than the first layer formed in the organic layer; a step of moving the mask 200 to that side before forming the electrode layer; and a step of vapor deposition to form the electrode layer. Therefore, the organic layer comprising multiple layers and the electrode layer can be formed without changing the mask 200. Furthermore, the OLED of the display device manufactured using this method can achieve the desired performance.

[0103] Furthermore, when forming the organic layer other than the first layer formed, the relative positional relationship between the substrate 120 and the mask 200 is as follows: based on the relative positional relationship between the substrate 120 and the mask 200 in the process of forming the previous layer before forming this layer, the mask 200 is located at a position offset along one side of the substrate 120 relative to the substrate 120. Therefore, even for organic layers comprising three or more layers, the organic layer and the electrode layer can be formed without changing the mask 200. Furthermore, the OLED of the display device manufactured using this method can achieve the desired performance.

[0104] It should be noted that, in reference Figures 2 to 7 The description uses the case where the mask 200 is moved while the position of the fixed substrate 120 is fixed as an example, but the method of changing the relative positional relationship between the mask 200 and the substrate 120 is not limited to this. For reference... Figures 2 to 7 Regarding the change in the relative positional relationship between the mask 200 and the substrate 120, it can be done by moving either the mask 200 or the substrate 120, or by moving both the mask 200 and the substrate 120.

[0105] Furthermore, the direction of movement of the mask 200 is not limited to the first direction Dx. The relative movement between the mask 200 and the substrate 120 can be performed such that the uppermost organic layer (e.g., the third organic layer 133) abuts against the cathode 138, while the other organic layers do not abut against the cathode 138. For example, the relative movement direction between the mask 200 and the substrate 120 can also be a direction orthogonal to the third direction Dz and intersecting the first direction Dx and the second direction, or a direction of the second direction Dy.

[0106] In addition, in reference Figures 2 to 7 In the description, the amount of change in the relative positional relationship between the mask 200 and the substrate 120 between process 1 and process 2, the amount of change in the relative positional relationship between the mask 200 and the substrate 120 between process 2 and process 3, and the amount of change in the relative positional relationship between the mask 200 and the substrate 120 between process 3 and process 4 are different, but some or all of the changes can be uniform.

[0107] In addition, the number of layers contained in the organic layer is not limited to 3, as long as it is 2 or more.

[0108] Furthermore, regarding other effects brought about by the methods described in this embodiment, effects that are clearly known from the description in this specification, or effects that can be appropriately conceived by those skilled in the art, can of course be understood as effects brought about by this disclosure.

Claims

1. A display device comprising: a substrate, an organic layer laminated to the substrate, and an electrode layer laminated to the organic layer, the organic layer including at least a first layer and a second layer laminated to the first layer, the first layer being covered by the second layer on one end side in one direction of the substrate and not covered by the second layer on the other end side in the one direction, the organic layer being covered by the electrode layer on the one end side and not covered by the electrode layer on the other end side, the organic layer being an emission layer that emits light by flowing current when a voltage is applied by an anode and a cathode, a current path including all of the electrode layer and the layers included in the organic layer being established, the electrode layer being connected to a wiring on the one end side, the wiring or a contact hole communicating with the wiring being provided to an insulating portion extending in a manner of covering a portion of a pixel electrode formed on a lower side of the organic layer, the one end side of the organic layer and the electrode layer being laminated to the insulating portion.

4. The display device according to claim 3, wherein a plurality of the pixel electrodes are arranged in the one direction, the insulating portion extending in a manner of covering a portion of one of two pixel electrodes adjacent in the one direction on one end in the one direction and covering a portion of the other of the two pixel electrodes adjacent in the one direction on the other end in the one direction, the organic layer being laminated to each of the plurality of the pixel electrodes, the other end side of the organic layer being laminated to the insulating portion.

5. A manufacturing method of a display device, the display device including an organic layer including a plurality of layers and an electrode layer laminated to the organic layer, the manufacturing method including: forming the organic layer and the electrode layer by evaporation on a substrate using a mask provided with an opening portion corresponding to a size and a shape of a layer formed first in the organic layer, the manufacturing method including: a step of forming the layer formed first in the organic layer by evaporation; a step of moving the mask to one side of the substrate in a manner such that the layer formed first in the organic layer is covered by a layer other than the layer formed first in the organic layer on one end side in one direction of the substrate and not covered by the layer other than the layer formed first in the organic layer on the other end side in the one direction before forming the layer other than the layer formed first in the organic layer; a step of forming the layer other than the layer formed first in the organic layer by evaporation; a step of moving the mask to the one side in a manner such that the organic layer is covered by the electrode layer on the one end side and not covered by the electrode layer on the other end side before forming the electrode layer; and a step of forming the electrode layer by evaporation.

6. The manufacturing method according to claim 5, wherein a relative position of the substrate and the mask when one of the layers other than the layer formed first in the organic layer is formed is a relative position relationship in which the mask is located at a position shifted to the one side with respect to the substrate, based on the relative position relationship of the substrate and the mask in the step of forming the layer formed last before the one of the layers is formed. ​ ​ ​ ​ wherein ​ 2. The display device of claim 1, wherein, ​ 3. The display device of claim 2, wherein, ​ ​ ​ ​ ​ ​ ​ 5. A method for manufacturing a display device, wherein ​ ​ ​ ​ ​ ​ 6. The method for manufacturing a display device according to claim 5, wherein ​

Images