Hybrid cooling system

Abstract

The application discloses a composite cooling system which comprises a heat exchanger and a refrigeration system. The composite cooling system comprises the heat exchanger for exchanging cold and heat energy and the refrigeration system connected with the heat exchanger for forming a main refrigeration cycle and a secondary refrigeration cycle. The refrigeration system comprises at least one expansion valve. By controlling the expansion valve, the cold energy generated by the main refrigeration cycle can be used to perform secondary heat dissipation on a high-heat-source through the heat exchanger, and the secondary refrigeration cycle can be used to dissipate heat of other heat sources. The heat exchanger has a cold end inlet, a cold end outlet, a hot end inlet and a hot end outlet. The cold end inlet and the cold end outlet are in communication. The hot end inlet and the hot end outlet are in communication and are not in communication with the cold end inlet and the cold end outlet. The refrigeration system comprises an expansion valve, a heat dissipation unit and a compressor. The expansion valve is connected with the cold end inlet. The heat dissipation unit is connected with the expansion valve. The compressor is connected with the heat dissipation unit and the cold end outlet.

Description

Technical Field

[0001] This invention relates to a cooling system, and more particularly to a composite cooling system. Background Technology

[0002] In today's era of rapid technological advancement, progress in the computer industry has become a key indicator of technological development. To improve computer performance, major computer companies worldwide are constantly developing new motherboards and chipsets (such as central processing units, display adapters, sound cards, and memory). For example, central processing units have evolved from single-core processors to dual-core processors, and then to today's multi-core processors.

[0003] Although the various electronic components on a computer motherboard are constantly being updated, it is still impossible to avoid the heat generated by the internal resistance of these components when current flows through them. Excessive heat will raise the temperature of the electronic components, which can easily reduce their operating efficiency. Even worse, when the temperature of an electronic component reaches a critical point, it may be damaged due to the high temperature, causing the computer to crash.

[0004] To mitigate the negative impact of heat on electronic components, heat sinks are installed on these components or motherboards. Two types of heat sinks are the most common: air-cooled and water-cooled. However, neither air-cooled nor water-cooled heat sinks, as a single form of cooling system, can adequately meet the high heat dissipation requirements of modern electronic components. Therefore, how to make cooling systems meet these high heat dissipation requirements is one of the problems that researchers must solve. Summary of the Invention

[0005] In view of this, the present invention provides a composite cooling system to make the heat dissipation system meet the high heat dissipation requirements of current electronic components.

[0006] This invention proposes a composite cooling system, comprising: a heat exchanger for exchanging hot and cold energy; and a refrigeration system connected to the heat exchanger for forming a main refrigeration cycle and a secondary refrigeration cycle, comprising: at least one expansion valve, by controlling the expansion valve, enabling the cold energy generated by the main refrigeration cycle to dissipate heat from high-heat-generating heat sources through the heat exchanger, and the secondary refrigeration cycle to dissipate heat from other heat sources.

[0007] Furthermore, in the aforementioned composite cooling system, the heat exchanger includes: a cold-end inlet, a cold-end outlet, a hot-end inlet, and a hot-end outlet, wherein the cold-end inlet is connected to the cold-end outlet, the hot-end inlet is connected to the hot-end outlet, and is not connected to the cold-end inlet and the cold-end outlet; and

[0008] Refrigeration system, including:

[0009] A compressor is connected to the cold end outlet and is used to compress and drive the refrigerant to form a high-pressure, high-temperature gaseous refrigerant.

[0010] A heat dissipation unit is connected to the compressor outlet and is used to condense the high-pressure, high-temperature gaseous refrigerant into a high-pressure, room-temperature liquid refrigerant.

[0011] A first expansion valve is connected to the outlet of the heat dissipation unit and the inlet of the cold end. It is used to depressurize the high-pressure room temperature liquid refrigerant into a low-pressure low temperature liquid-gas mixture refrigerant, which enters the heat exchanger through the cold end inlet to absorb heat and transform into a low-pressure low temperature gaseous refrigerant, so as to perform a second heat dissipation on the high heat source.

[0012] A second expansion valve is connected to the outlet of the heat dissipation unit and is used to depressurize the high-pressure room-temperature liquid refrigerant into a low-pressure low-temperature liquid-gas mixture refrigerant.

[0013] A gas-cooled unit, connected to the second expansion valve, is used to absorb heat from the low-pressure, low-temperature liquid-gas mixture refrigerant and convert it into a low-pressure, low-temperature gaseous refrigerant to dissipate heat from other heat sources.

[0014] Furthermore, this invention proposes a composite cooling system. The refrigeration system includes a first expansion valve, a first branch pipe, a second expansion valve, an air-cooling unit, a second branch pipe, a compressor, and a heat dissipation unit. The first expansion valve is connected to the cold end inlet. The first branch pipe has a first pipe section, a second pipe section, and a third pipe section. The first pipe section is connected to the first expansion valve. The second and third pipe sections are both connected to the first pipe section. The second expansion valve is connected to the second pipe section. The air-cooling unit is connected to the second expansion valve. The second branch pipe has a fourth pipe section, a fifth pipe section, and a sixth pipe section. The fourth and fifth pipe sections are both connected to the sixth pipe section. The fourth pipe section is connected to the air-cooling unit, and the fifth pipe section is connected to the cold end outlet. The compressor is connected to the sixth pipe section. The heat dissipation unit connects the compressor to the third pipe section of the first branch pipe.

[0015] The present invention also proposes a composite cooling system, characterized in that it comprises: a heat exchanger for exchanging hot and cold energy; and a refrigeration system connected to the heat exchanger for forming a main refrigeration cycle and a secondary refrigeration cycle, comprising: at least one expansion valve, which, by controlling the expansion valve, enables the cold energy generated by the main refrigeration cycle to perform secondary heat dissipation on a high-heat-generating heat source through the heat exchanger.

[0016] Furthermore, the aforementioned composite cooling system includes:

[0017] The heat exchanger includes: a cold end inlet, a cold end outlet, a hot end inlet, and a hot end outlet, wherein the cold end inlet is connected to the cold end outlet, the hot end inlet is connected to the hot end outlet, and is not connected to either the cold end inlet or the cold end outlet; and

[0018] A refrigeration system, comprising:

[0019] A compressor is connected to the cold end outlet and is used to compress and drive the refrigerant to form a high-pressure, high-temperature gaseous refrigerant.

[0020] A heat dissipation unit is connected to the compressor outlet and is used to condense the high-pressure, high-temperature gaseous refrigerant into a high-pressure, room-temperature liquid refrigerant.

[0021] An expansion valve is connected to the outlet of the heat dissipation unit and the inlet of the cold end. It is used to depressurize the high-pressure room-temperature liquid refrigerant into a low-pressure low-temperature liquid-gas mixture refrigerant, which enters the heat exchanger through the cold end inlet to absorb heat and transform into a low-pressure low-temperature gaseous refrigerant, so as to perform a second heat dissipation on the high-heat-generating heat source.

[0022] The advantages of this invention over existing technologies are as follows:

[0023] (1) The above-mentioned composite cooling system uses a refrigeration system to perform a second heat dissipation on the water cooling system, thereby further reducing the return water temperature of the water cooling system, so that the water cooling system can be applied to heat sources with high heat generation, such as overclocked central processing units.

[0024] (2) In addition, in some embodiments, the refrigeration system is divided into a main refrigeration cycle and a secondary refrigeration cycle. By controlling the two expansion valves, the cold energy generated by the refrigeration system can not only dissipate heat to the water cooling system through the heat exchanger, but also selectively dissipate heat to another component that needs heat dissipation, such as the casing or other heat sources, through the evaporator.

[0025] The above description of the present invention and the following description of the embodiments are intended to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention. Attached Figure Description

[0026] Figure 1 This is a three-dimensional schematic diagram of the composite cooling system according to the first embodiment of the present invention;

[0027] Figure 2 for Figure 1 A three-dimensional diagram from another perspective;

[0028] Figure 3 for Figure 1 A block diagram of a composite cooling system;

[0029] Figure 4This is a three-dimensional schematic diagram of the composite cooling system according to the second embodiment of the present invention;

[0030] Figure 5 for Figure 4 A three-dimensional diagram from another perspective;

[0031] Figure 6 for Figure 4 A block diagram of a composite cooling system;

[0032] Figure 7 This is a three-dimensional schematic diagram of the composite cooling system according to the second embodiment of the present invention;

[0033] Figure 8 for Figure 7 A block diagram of a composite cooling system.

[0034] In the attached figures, the following labels are used:

[0035] 10, 10a, 10b... Composite cooling system

[0036] 100, 100a, 100b... heat exchangers

[0037] 110, 110a, 110b... Cold end inlet

[0038] 120, 120a, 120b... Cold end outlet

[0039] 130, 130a, 130b... Hot end inlet

[0040] 140, 140a, 140b... Hot end outlet

[0041] Refrigeration systems 200, 200a, 200b...

[0042] 210, 210a, 210b... First expansion valve

[0043] 220, 220a, 220b... First branch pipe

[0044] 221, 221a, 221b... First Pipe Section

[0045] 222, 222a, 222b... Second pipe section

[0046] 223, 223a, 223b... Third Pipeline

[0047] 230, 230b... Second expansion valve

[0048] 240, 240b... air-cooled unit

[0049] 241, 241b... Evaporator

[0050] 242, 242b... Air-cooled fan

[0051] 250, 250a, 250b... Second branch pipe

[0052] 251, 251a, 251b... Fourth Pipeline

[0053] 252, 252a, 252b... Fifth Pipeline

[0054] 253, 253a, 253b... Sixth Department

[0055] 260, 260a, 260b... Liquid storage units

[0056] 270, 270a, 270b... compressors

[0057] 280, 280a, 280b... heat dissipation units

[0058] 281, 281a, 281b... Condenser

[0059] 282, 282a, 282b... Cooling Fans

[0060] 300, 300a, 300b... Water cooling system

[0061] 310, 310a, 310b... water cooling blocks

[0062] 320, 320a, 320b... water cooling radiators

[0063] 330, 330a, 330b... Water-cooled fans Detailed Implementation

[0064] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0065] The illustrative embodiments and descriptions of the present invention are used to explain the invention, but are not intended to limit the invention. Furthermore, elements / components using the same or similar reference numerals in the drawings and embodiments are used to represent the same or similar parts.

[0066] The directional terms used in this article, such as up, down, left, right, front, or back, are for reference only. Figure 2 The direction. Therefore, the use of directional terms is for illustrative purposes only and not to limit this work.

[0067] The terms “include,” “including,” “have,” “contain,” etc., used in this article are all open-ended terms, meaning that they include but are not limited to.

[0068] The term "and / or" as used herein includes any or all of the things mentioned.

[0069] The term "multiple" in this article includes "two" and "more than two"; the term "multiple groups" in this article includes "two groups" and "more than two groups".

[0070] Certain terms used to describe this application will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in describing the application.

[0071] Please see Figures 1 to 3 . Figure 1 This is a three-dimensional schematic diagram of the composite cooling system according to the first embodiment of the present invention. Figure 2 for Figure 1 A three-dimensional diagram from another perspective. Figure 3 for Figure 1 A block diagram of a composite cooling system.

[0072] The composite cooling system 10 of this embodiment includes a heat exchanger 100 and a refrigeration system 200.

[0073] A composite cooling system includes: a heat exchanger 100 for exchanging hot and cold energy; and a refrigeration system 200 connected to the heat exchanger 100 for forming a main refrigeration cycle and a secondary refrigeration cycle. The system includes at least one expansion valve, which controls the cooling energy generated by the main refrigeration cycle to dissipate heat from high-heat-generating sources through the heat exchanger 100, while the secondary refrigeration cycle dissipates heat from other heat sources. Furthermore, the composite cooling system 100 may also include a water-cooling system 300.

[0074] The heat exchanger 100 is, for example, a plate heat exchanger 100, and has a cold end inlet 110, a cold end outlet 120, a hot end inlet 130, and a hot end outlet 140. The cold end inlet 110 is connected to the cold end outlet 120. The hot end inlet 130 is connected to the hot end outlet 140, but is not connected to the cold end inlet 110 and the cold end outlet 120.

[0075] The refrigeration system 200 includes a first expansion valve 210, a first branch pipe 220, a second expansion valve 230, an air-cooling unit 240, a second branch pipe 250, a compressor 270, and a heat dissipation unit 280. Additionally, the refrigeration system 200 may also include a liquid storage unit 260.

[0076] The first expansion valve 210 is connected to the cold end inlet 110 of the heat exchanger 100. The first branch pipe 220 has a first pipe section 221, a second pipe section 222, and a third pipe section 223. The second pipe section 222 and the third pipe section 223 are both connected to the first pipe section 221. The first pipe section 221 is connected to the first expansion valve 210. The second expansion valve 230 is connected to the second pipe section 222. The air-cooling unit 240 includes, for example, an evaporator 241 and an air-cooling fan 242. The evaporator 241 is, for example, a finned evaporator and is connected to the second expansion valve 230. The air-cooling fan 242 is mounted on the evaporator 241, and the airflow generated by the air-cooling fan 242 is used, for example, to blow towards the casing to dissipate heat from the casing.

[0077] The second branch pipe 250 has a fourth pipe section 251, a fifth pipe section 252, and a sixth pipe section 253. The fourth pipe section 251 and the fifth pipe section 252 are both connected to the sixth pipe section 253. The fourth pipe section 251 is connected to the air-cooling unit 240. The fifth pipe section 252 is connected to the cold end outlet 120 of the heat exchanger 100.

[0078] The liquid storage assembly 260 is, for example, a liquid storage tank, and is connected to the sixth pipe section 253 of the second branch pipe 250. The compressor 270 is connected to the liquid storage assembly 260.

[0079] The heat dissipation unit 280 includes, for example, a condenser 281 and a cooling fan 282. The condenser 281 is connected to the compressor 270 and the third pipe section 223 of the first branch pipe 220. The cooling fan 282 is mounted on the condenser 281.

[0080] In this embodiment, an additional liquid storage component 260 is provided to prevent liquid from flowing into the compressor 270, but the provision of the liquid storage component 260 is not intended to limit the present invention. In other embodiments, the liquid storage component 260 may be omitted.

[0081] The water cooling system 300 includes a water block 310 and a water radiator 320. In addition, the water cooling system 300 may also include a water cooling fan 330.

[0082] The water-cooling head 310 and the water-cooling radiator 320 are configured in series, with the water-cooling head 310 connected to the hot end outlet 140 of the heat exchanger 100 and the water-cooling radiator 320 connected to the hot end inlet 130 of the heat exchanger 100. In other words, the water-cooling head 310, the water-cooling radiator 320, and the heat exchanger 100 are connected by pipes to form a cooling channel. In this embodiment, the water-cooling head 310 is equipped with a pump to drive the coolant to circulate in the cooling channel. A water-cooled fan 330 is installed on the water-cooling radiator 320 to dissipate heat from the water-cooling radiator 320.

[0083] In this embodiment, the water cooling system 300 dissipates heat from the coolant using a water radiator 320 and a water-cooled fan 330, but this is not intended to limit the invention. In other embodiments, the water cooling system may not have a water-cooled fan, i.e., it may rely solely on the water radiator to dissipate heat from the coolant.

[0084] In this embodiment, the water cooling head 310 has a built-in pump, but this is not a limitation. In other embodiments, the water cooling head may not have a built-in pump, but may instead use an external pump to drive the coolant for cooling circulation.

[0085] In this embodiment, the water-cooling block 310 is used to thermally couple to heat sources such as overclocked or unoverclocked CPUs and GPUs to transfer the heat generated by the heat sources to the coolant. The coolant, having absorbed heat, then flows to the water-cooling radiator 320 and then to the heat exchanger 100 for heat dissipation. Thus, the coolant, after absorbing heat, undergoes a first heat dissipation through the water-cooling radiator 320, and a second heat dissipation through the low-temperature refrigerant of the refrigeration system 200 (described later). The cooled coolant then flows back to the water-cooling block 310 to dissipate heat from the CPU, GPU, and other heat sources.

[0086] The reason for the secondary cooling of the coolant after absorbing heat is, for example, to dissipate heat from overclocked or other high-heat sources. For example, the heat generated by an overclocked CPU or GPU is much higher than that of a non-overclocked CPU. If the heat generated by the overclocked CPU is only dissipated through the radiator 320, the temperature of the coolant returning to the water block 310 may not meet the system's low-temperature requirements. Therefore, in this embodiment, the coolant, after absorbing heat, first undergoes a first cooling process through the radiator 320, and then a second cooling process through the low-temperature refrigerant in the refrigeration system 200, so that the coolant temperature can meet the system's low-temperature requirements.

[0087] Furthermore, the refrigeration system 200 in this embodiment is divided into a main refrigeration cycle and a secondary refrigeration cycle. The main refrigeration cycle uses a compressor 270 to drive the refrigerant through a refrigeration cycle, compressing the gaseous low-pressure, low-temperature refrigerant into a high-pressure, high-temperature gaseous refrigerant. The high-pressure, high-temperature gaseous refrigerant dissipates heat through a condenser 281, condensing into a high-pressure, room-temperature liquid refrigerant. The high-pressure, room-temperature liquid refrigerant is depressurized through a first expansion valve 210 into a low-pressure, low-temperature liquid-gas mixture refrigerant. The low-pressure, low-temperature liquid-gas mixture refrigerant absorbs heat through a heat exchanger 100, transforming into a low-pressure, low-temperature gaseous refrigerant to dissipate heat from the coolant in the water-cooling system. The secondary refrigeration cycle uses a compressor 270 to drive the refrigerant through a refrigeration cycle, compressing the gaseous low-pressure, low-temperature refrigerant into a high-pressure, high-temperature gaseous refrigerant. The high-pressure, high-temperature gaseous refrigerant dissipates heat through a condenser 281, condensing into a high-pressure, room-temperature liquid refrigerant. The high-pressure, room-temperature liquid refrigerant is depressurized through a second expansion valve 230 into a low-pressure, low-temperature liquid-gas mixture refrigerant. The low-pressure, low-temperature liquid-gas mixture refrigerant absorbs heat in the evaporator 241 and is converted into a low-pressure, low-temperature gaseous refrigerant to dissipate heat to another component that needs heat dissipation, such as the casing or other heat sources.

[0088] In this way, by controlling the two expansion valves 210 and 230, the cold energy generated by the refrigeration system 200 can not only dissipate heat to the water cooling system 300 through the heat exchanger 100, but can also selectively dissipate heat to another component that needs heat dissipation, such as the casing or other heat sources, through the evaporator 241.

[0089] In this embodiment, a controller (not shown), such as a programmable logic controller (PLC), can control the on / off state and airflow direction of the water-cooled fan 330 based on the coolant temperature sensed by a temperature sensor. This control could include drawing air out of the electronic device or blowing air in from outside the device. Specifically, when the coolant temperature in the water-cooling system 300 is high, the controller can control the water-cooled fan 330 to draw air out of the electronic device to lower the coolant temperature. Conversely, when the coolant temperature is low, the controller can control the water-cooled fan 330 to blow air in from outside the electronic device to lower the internal temperature. Furthermore, since the pump or compressor 270 generally delivers fluid in one direction, the coolant temperature cannot be controlled by reversing the flow. Therefore, when the coolant temperature sensed by the temperature sensor reaches a default upper limit, the controller can also stop the refrigerant system.

[0090] Please see Figures 4 to 6 . Figure 4 This is a three-dimensional schematic diagram of the composite cooling system according to the second embodiment of the present invention. Figure 5 for Figure 4 A three-dimensional diagram from another perspective. Figure 6 for Figure 4 A block diagram of a composite cooling system.

[0091] The composite cooling system 10a of this embodiment includes a heat exchanger 100a and a refrigeration system 200a. A composite cooling system includes: a heat exchanger 100 for exchanging hot and cold energy; and a refrigeration system 200 connected to the heat exchanger 100 for forming a main refrigeration cycle and a secondary refrigeration cycle, including: at least one expansion valve, which, by controlling the expansion valve, allows the cold energy generated by the main refrigeration cycle to be dissipated secondary to a high-heat-generating heat source through the heat exchanger 100. Furthermore, the composite cooling system 10a may also include a water-cooling system 300a.

[0092] The heat exchanger 100a is, for example, a plate heat exchanger 100a, and has a cold end inlet 110a, a cold end outlet 120a, a hot end inlet 130a, and a hot end outlet 140a. The cold end inlet 110a is connected to the cold end outlet 120a. The hot end inlet 130a is connected to the hot end outlet 140a, but is not connected to the cold end inlet 110a and the cold end outlet 120a.

[0093] The refrigeration system 200a includes a first expansion valve 210a, a compressor 270a, and a heat dissipation unit 280a. In addition, the refrigeration system 200a may also include a first branch pipe 220a, a second branch pipe 250a, and a liquid storage unit 260a.

[0094] The first expansion valve 210a is connected to the cold end inlet 110a of the heat exchanger 100a. The first branch pipe 220a has a first pipe section 221a, a second pipe section 222a, and a third pipe section 223a. The second pipe section 222a and the third pipe section 223a are both connected to the first pipe section 221a. The first pipe section 221a is connected to the first expansion valve 210a. The second branch pipe 250a has a fourth pipe section 251a, a fifth pipe section 252a, and a sixth pipe section 253a. The fourth pipe section 251a and the fifth pipe section 252a are both connected to the sixth pipe section 253a. The fifth pipe section 252a is connected to the cold end outlet 120a of the heat exchanger 100a.

[0095] The liquid storage assembly 260a is, for example, a liquid storage tank, and is connected to the sixth pipe section 253a of the second branch pipe 250a. The compressor 270a is connected to the liquid storage assembly 260a.

[0096] The heat dissipation unit 280a includes, for example, a condenser 281a and a cooling fan 282a. The condenser 281a is connected to the compressor 270a and the third pipe section 223 of the first branch pipe 220a. The cooling fan 282a is mounted on the condenser 281a.

[0097] In this embodiment, an additional liquid storage component 260a is provided to prevent liquid from flowing into the compressor 270a, but the provision of the liquid storage component 260a is not intended to limit the invention. In other embodiments, the liquid storage component 260a may not be required.

[0098] In this embodiment, the liquid storage assembly 260a is connected to the sixth pipe section 253a of the second branch pipe 250a, and the condenser 281 is connected to the third pipe section 223a of the first branch pipe 220a, but this is not a limitation. In other embodiments, the liquid storage assembly may also be connected to the fourth pipe section 251a of the second branch pipe 250a, and the condenser may also be connected to the second pipe section 222a of the first branch pipe 220a.

[0099] In this embodiment, a first branch pipe 220a is used to connect the condenser 281a and the heat exchanger 100a, and a second branch pipe 250a is used to connect the liquid storage assembly 260a and the heat exchanger 100a, but this is not a limitation. In other embodiments, straight pipes can also be used to connect the condenser 281a and the heat exchanger 100a, and straight pipes can also be used to connect the liquid storage assembly 260a and the heat exchanger 100a.

[0100] The water cooling system 300a includes a water block 310a and a water radiator 320a. In addition, the water cooling system 300a may also include a water cooling fan 330a.

[0101] The water-cooling head 310a and the water-cooling radiator 320a are configured in series. The water-cooling head 310a is connected to the hot end outlet 140a of the heat exchanger 100a, and the water-cooling radiator 320a is connected to the hot end inlet 130a of the heat exchanger 100a. In other words, the water-cooling head 310a, the water-cooling radiator 320a, and the heat exchanger 100a are connected by pipes to form a cooling channel. In this embodiment, the water-cooling head 310a is equipped with a pump to drive the coolant to circulate in the cooling channel. A water-cooled fan 330a is installed on the water-cooling radiator 320a to dissipate heat from the water-cooling radiator 320a.

[0102] In this embodiment, the water cooling system 300a dissipates heat from the coolant using a water radiator 320a and a water-cooled fan 330a, but this is not intended to limit the invention. In other embodiments, the water cooling system may not have a water-cooled fan, i.e., it may rely solely on the water radiator to dissipate heat from the coolant.

[0103] In this embodiment, the water cooling head 310a has a built-in pump, but this is not a limitation. In other embodiments, the water cooling head may not have a built-in pump, but may instead use an external pump to drive the coolant for cooling circulation.

[0104] In this embodiment, the water-cooling head 310a is used for thermal coupling to heat sources such as overclocked or unoverclocked CPUs and GPUs to transfer the heat generated by the heat sources to the coolant. The coolant, having absorbed heat, then flows to the water-cooling radiator 320a and then to the heat exchanger 100a for heat dissipation. Thus, the coolant, after absorbing heat, undergoes a first heat dissipation through the water-cooling radiator 320a, and a second heat dissipation through the low-temperature refrigerant in the refrigeration system 200a (described later). The cooled coolant then flows back to the water-cooling head 310a to dissipate heat from the CPU, GPU, and other heat sources.

[0105] The reason for the secondary heat dissipation of the coolant after absorbing heat is, for example, to dissipate heat from overclocked or other high-heat sources. For example, the heat generated by an overclocked CPU or GPU is much higher than that of a non-overclocked CPU. If the heat generated by the overclocked CPU is only dissipated through the radiator 320a, the temperature of the coolant returning to the water block 310a may not meet the system's low-temperature requirements. Therefore, in this embodiment, the coolant, after absorbing heat, first undergoes a first heat dissipation through the radiator 320a, and then a second heat dissipation through the low-temperature refrigerant in the refrigeration system 200a, so that the coolant temperature can meet the system's low-temperature requirements.

[0106] In this embodiment, a controller (not shown), such as a programmable logic controller (PLC), controls the on / off state and airflow direction of the water-cooled fan 330a, such as drawing air out of the electronic device or blowing air from outside the electronic device into the device. Specifically, when the temperature of the coolant in the water-cooling system 300a is high, the controller can control the water-cooled fan 330a to draw air out of the electronic device to lower the temperature of the coolant. Conversely, when the temperature of the coolant in the water-cooling system 300a is low, the controller can control the water-cooled fan 330a to blow air from outside the electronic device into the device to lower the internal temperature.

[0107] Please see Figures 7 to 8 . Figure 7 This is a perspective view of the composite cooling system according to the second embodiment of the present invention. Figure 8 for Figure 7 A block diagram of a composite cooling system.

[0108] The composite cooling system 10b of this embodiment includes a heat exchanger 100b and a refrigeration system 200b. Furthermore, the composite cooling system 10b may also include a water-cooling system 300b.

[0109] The heat exchanger 100b is, for example, a plate heat exchanger 100b, and has a cold end inlet 110b, a cold end outlet 120b, a hot end inlet 130b, and a hot end outlet 140b. The cold end inlet 110b is connected to the cold end outlet 120b. The hot end inlet 130b is connected to the hot end outlet 140b, but is not connected to the cold end inlet 110b and the cold end outlet 120b.

[0110] The refrigeration system 200b includes a first expansion valve 210b, a first branch pipe 220b, a second expansion valve 230b, an air-cooling unit 240b, a second branch pipe 250b, a compressor 270b, and a heat dissipation unit 280b. Additionally, the refrigeration system 200b may also include a liquid storage unit 260b.

[0111] The first expansion valve 210b is connected to the cold end inlet 110b of the heat exchanger 100b. The first branch pipe 220b has a first pipe section 221b, a second pipe section 222b, and a third pipe section 223b. Both the second pipe section 222b and the third pipe section 223b are connected to the first pipe section 221b. The first pipe section 221b is connected to the first expansion valve 210b. The second expansion valve 230b is connected to the second pipe section 222b. The air-cooling unit 240b includes, for example, an evaporator 241b and an air-cooling fan 242b. The evaporator 241b is, for example, a finned evaporator and is connected to the second expansion valve 230b. The air-cooling fan 242b is mounted on the evaporator 241b, and the airflow generated by the air-cooling fan 242b is used, for example, to blow air onto the casing to dissipate heat from the casing.

[0112] The second branch pipe 250b has a fourth pipe section 251b, a fifth pipe section 252b, and a sixth pipe section 253b. The fourth pipe section 251b and the fifth pipe section 252b are both connected to the sixth pipe section 253b. The fifth pipe section 252b is connected to the cold end outlet 120b of the heat exchanger 100b.

[0113] The liquid storage assembly 260b is, for example, a liquid storage tank and is connected to the sixth pipe section 253b of the second branch pipe 250b. The compressor 270b is connected to the liquid storage assembly 260b.

[0114] The heat dissipation unit 280b includes, for example, a condenser 281b and a cooling fan 282b. The condenser 281b is connected to the compressor 270b and the third pipe section 223 of the first branch pipe 220b. The cooling fan 282b is mounted on the condenser 281b.

[0115] In this embodiment, an additional liquid storage component 260b is provided to prevent liquid from flowing into the compressor 270b, but the provision of the liquid storage component 260b is not intended to limit the invention. In other embodiments, the liquid storage component 260b may not be required.

[0116] In this embodiment, the liquid storage assembly 260b is connected to the sixth pipe portion 253b of the second branch pipe 250b, and the condenser 281 is connected to the third pipe portion 223b of the first branch pipe 220b, but this is not a limitation. In other embodiments, the liquid storage assembly may also be connected to the fourth pipe portion 251b of the second branch pipe 250b, and the condenser may also be connected to the second pipe portion 222b of the first branch pipe 220b.

[0117] The water cooling system 300b includes a water block 310b and a water radiator 320b. In addition, the water cooling system 300b may also include a water cooling fan 330b.

[0118] The water-cooling head 310b and the water-cooling radiator 320b are configured in parallel, with their opposite ends connected to the hot-end outlet 140b and the hot-end inlet 130b, respectively. In other words, the water-cooling head 310b, the water-cooling radiator 320b, and the heat exchanger 100b are connected by pipes to form a cooling channel. In this embodiment, the water-cooling head 310b is equipped with a pump to drive the coolant to circulate in the cooling channel. A water-cooled fan 330b is installed on the water-cooling radiator 320b to dissipate heat from the radiator 320b.

[0119] In this embodiment, the water cooling system 300b uses a water radiator 320b and a water-cooled fan 330b to dissipate heat from the coolant, but this is not intended to limit the invention. In other embodiments, the water cooling system may not have a water-cooled fan, i.e., it may rely solely on the water radiator to dissipate heat from the coolant.

[0120] In this embodiment, the water cooling head 310b has a built-in pump, but this is not a limitation. In other embodiments, the water cooling head may not have a built-in pump, but may instead use an external pump to drive the coolant for cooling circulation.

[0121] In this embodiment, the water block 310b is used for thermal coupling to heat sources such as overclocked or unoverclocked CPUs and GPUs to transfer the heat generated by the heat sources to the coolant. The coolant, having absorbed heat, then flows to the radiator 320b and then to the heat exchanger 100b for heat dissipation. Thus, the coolant, after absorbing heat, undergoes a first cooling process through the radiator 320b, and a second cooling process through the low-temperature refrigerant in the refrigeration system 200b (described later). The cooled coolant then flows back to the water block 310b to dissipate heat from the CPU, GPU, and other heat sources.

[0122] The reason for the secondary heat dissipation of the coolant after absorbing heat is, for example, to dissipate heat from overclocked or other high-heat sources. For example, the heat generated by an overclocked CPU or GPU is much higher than that of a non-overclocked CPU. If the heat generated by the overclocked CPU is only dissipated through the radiator 320b, the temperature of the coolant returning to the water block 310b may not meet the system's low-temperature requirements. Therefore, in this embodiment, the coolant, after absorbing heat, first undergoes a first heat dissipation through the radiator 320b, and then a second heat dissipation through the low-temperature refrigerant in the refrigeration system 200b, so that the coolant temperature can meet the system's low-temperature requirements.

[0123] Furthermore, the refrigeration system 200b in this embodiment is divided into a main refrigeration cycle and a secondary refrigeration cycle. The main refrigeration cycle uses compressor 270b to drive the refrigerant through a refrigeration cycle, compressing the gaseous low-pressure, low-temperature refrigerant into a high-pressure, high-temperature gaseous refrigerant. The high-pressure, high-temperature gaseous refrigerant dissipates heat through condenser 281b, condensing into a high-pressure, room-temperature liquid refrigerant. The high-pressure, room-temperature liquid refrigerant is depressurized through first expansion valve 210b into a low-pressure, low-temperature liquid-gas mixture refrigerant. The low-pressure, low-temperature liquid-gas mixture refrigerant absorbs heat through heat exchanger 100b, transforming into a low-pressure, low-temperature gaseous refrigerant to dissipate heat from the coolant in the water-cooling system. The secondary refrigeration cycle uses compressor 270b to drive the refrigerant through a refrigeration cycle, compressing the gaseous low-pressure, low-temperature refrigerant into a high-pressure, high-temperature gaseous refrigerant. The high-pressure, high-temperature gaseous refrigerant dissipates heat through condenser 281b, condensing into a high-pressure, room-temperature liquid refrigerant. The high-pressure, room-temperature liquid refrigerant is depressurized through second expansion valve 230b into a low-pressure, low-temperature liquid-gas mixture refrigerant. The low-pressure, low-temperature liquid-gas mixture refrigerant absorbs heat in the evaporator 241b and is converted into a low-pressure, low-temperature gaseous refrigerant to dissipate heat to another component that needs heat dissipation, such as the casing or other heat sources.

[0124] In this way, by controlling the two expansion valves 210b and 230b, the cold energy generated by the refrigeration system 200b can not only dissipate heat to the water cooling system 300b through the heat exchanger 100b, but can also selectively dissipate heat to another component that needs heat dissipation, such as the casing or other heat sources, through the evaporator 241b.

[0125] According to the composite cooling system of the above embodiment, the water cooling system is cooled a second time by the refrigeration system, thereby further reducing the return water temperature of the water cooling system, so that the water cooling system can be used for heat sources with high heat generation, such as overclocked central processing units.

[0126] In addition, in some embodiments, the refrigeration system is divided into a main refrigeration cycle and a secondary refrigeration cycle. By controlling the two expansion valves, the cold energy generated by the refrigeration system can not only dissipate heat to the water cooling system through the heat exchanger, but can also selectively dissipate heat to another component that needs heat dissipation, such as the casing or other heat sources, through the evaporator.

[0127] Furthermore, in some embodiments, the water cooling block and the water cooling radiator are configured in series, so that the controller can determine the direction of the water cooling fan or switch it on or off based on the temperature of the coolant in the water cooling system, so as to optimize the heat dissipation performance of the water cooling system 300.

[0128] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. A composite cooling system, characterized in that, Include: A heat exchanger used for the exchange of hot and cold energy; and A refrigeration system, connected to the heat exchanger, for forming a main refrigeration cycle and a secondary refrigeration cycle, includes: At least one expansion valve is provided, and by controlling the expansion valve, the cold energy generated by the main refrigeration cycle can be used to perform secondary water cooling heat dissipation on the electronic components of the high heat source through the heat exchanger, and the secondary refrigeration cycle can perform air cooling heat dissipation on other heat sources. A water-cooling system is used to dissipate heat from the high-heat-generating heat source in the first stage. The water-cooling system includes a water-cooling head, a water-cooling radiator, and a water-cooling fan. The water-cooling head is used to thermally couple to the electronic components of the high-heat-generating heat source to transfer the heat generated by the high-heat-generating heat source to the coolant. The coolant, after absorbing heat, will first dissipate heat through the water-cooling radiator for the first stage, and then dissipate heat a second time through the low-temperature refrigerant of the refrigeration system. The dissipated low-temperature coolant will then flow back to the water-cooling head to dissipate heat from the electronic components of the high-heat-generating heat source a second time. It also includes a controller and a temperature sensor. The controller uses the temperature value of the coolant sensed by the temperature sensor to control the opening and closing of the water-cooling fan and the airflow direction. When the temperature of the coolant in the water-cooling system is high, the controller controls the water-cooling fan to draw air out of the electronic device to lower the temperature of the coolant. When the temperature of the coolant in the water-cooling system is low, the controller controls the water-cooling fan to blow air inward from the electronic device to lower the internal temperature. When the temperature value of the coolant sensed by the temperature sensor reaches the default upper limit, the controller stops the refrigerant system from running.

2. The composite cooling system according to claim 1, characterized in that, The heat exchanger includes: a cold end inlet, a cold end outlet, a hot end inlet, and a hot end outlet, wherein the cold end inlet is connected to the cold end outlet, the hot end inlet is connected to the hot end outlet, and is not connected to either the cold end inlet or the cold end outlet; and Refrigeration system, including: A compressor is connected to the cold end outlet and is used to compress and drive the refrigerant to form a high-pressure, high-temperature gaseous refrigerant. A heat dissipation unit is connected to the compressor outlet and is used to condense the high-pressure, high-temperature gaseous refrigerant into a high-pressure, room-temperature liquid refrigerant. A first expansion valve is connected to the outlet of the heat dissipation unit and the inlet of the cold end. It is used to depressurize the high-pressure room temperature liquid refrigerant into a low-pressure low temperature liquid-gas mixture refrigerant, which enters the heat exchanger through the cold end inlet to absorb heat and transform into a low-pressure low temperature gaseous refrigerant, so as to perform a second heat dissipation on the high heat source. A second expansion valve is connected to the outlet of the heat dissipation unit and is used to depressurize the high-pressure room-temperature liquid refrigerant into a low-pressure low-temperature liquid-gas mixture refrigerant. A gas-cooled unit, connected to the second expansion valve, is used to absorb heat from the low-pressure, low-temperature liquid-gas mixture refrigerant and convert it into a low-pressure, low-temperature gaseous refrigerant to dissipate heat from other heat sources.

3. The composite cooling system according to claim 2, characterized in that, The refrigeration system further includes: A first branch pipe has a first pipe section, a second pipe section and a third pipe section, wherein the first pipe section is connected to the first expansion valve, and the second pipe section and the third pipe section are both connected to the first pipe section. A second branch pipe has a fourth pipe section, a fifth pipe section and a sixth pipe section, wherein the fourth pipe section and the fifth pipe section are both connected to the sixth pipe section, the fourth pipe section is connected to the air-cooling unit, and the fifth pipe section is connected to the cold end outlet.

4. The composite cooling system according to claim 3, characterized in that, The refrigeration system further includes a liquid storage assembly that connects the compressor to the sixth pipe section of the second branch pipe.

5. The composite cooling system according to claim 2, characterized in that, The air-cooling unit includes an evaporator and an air-cooling fan. The evaporator is connected to the second expansion valve, and the air-cooling fan is installed on the evaporator.

6. The composite cooling system according to claim 3, characterized in that, The heat dissipation unit includes a condenser and a cooling fan. The condenser is connected to the compressor and the third pipe of the first branch pipe, and the cooling fan is installed in the condenser.

7. The composite cooling system according to claim 2, characterized in that, The water cooling head and the water cooling radiator are connected in series, with the water cooling head connected to the hot end outlet and the water cooling radiator connected to the hot end inlet.

8. The composite cooling system according to claim 7, characterized in that, The water-cooled fan is installed on the water-cooling radiator.

9. The composite cooling system according to claim 2, characterized in that, The water cooling head and the water cooling radiator are configured in parallel, and the two ends of the water cooling head and the water cooling radiator are respectively connected to the hot end outlet and the hot end inlet.

10. The composite cooling system according to claim 9, characterized in that, The water-cooled fan is installed on the water-cooling radiator.

11. A composite cooling system, characterized in that, Include: A heat exchanger used for the exchange of hot and cold energy; and A refrigeration system, connected to the heat exchanger, for forming a main refrigeration cycle and a secondary refrigeration cycle, includes: At least one expansion valve is provided, and by controlling the expansion valve, the cold energy generated by the main refrigeration cycle can be used to dissipate heat from the high-heat source through a heat exchanger. A water-cooling system is used to dissipate heat from the high-heat-generating heat source in the first stage. The water-cooling system includes a water-cooling head, a water-cooling radiator, and a water-cooling fan. The water-cooling head is used to thermally couple to the electronic components of the high-heat-generating heat source to transfer the heat generated by the high-heat-generating heat source to the coolant. The coolant, after absorbing heat, will first dissipate heat through the water-cooling radiator for the first stage, and then dissipate heat a second time through the low-temperature refrigerant of the refrigeration system. The dissipated low-temperature coolant will then flow back to the water-cooling head to dissipate heat from the electronic components of the high-heat-generating heat source a second time. It also includes a controller and a temperature sensor. The controller uses the temperature value of the coolant sensed by the temperature sensor to control the opening and closing of the water-cooling fan and the airflow direction. When the temperature of the coolant in the water-cooling system is high, the controller controls the water-cooling fan to draw air out of the electronic device to lower the temperature of the coolant. When the temperature of the coolant in the water-cooling system is low, the controller controls the water-cooling fan to blow air inward from the electronic device to lower the internal temperature. When the temperature value of the coolant sensed by the temperature sensor reaches the default upper limit, the controller stops the refrigerant system from running.

12. The composite cooling system according to claim 11, characterized in that, Include: The heat exchanger includes: a cold end inlet, a cold end outlet, a hot end inlet, and a hot end outlet, wherein the cold end inlet is connected to the cold end outlet, the hot end inlet is connected to the hot end outlet, and is not connected to either the cold end inlet or the cold end outlet; and Refrigeration system, including: A compressor is connected to the cold end outlet and is used to compress and drive the refrigerant to form a high-pressure, high-temperature gaseous refrigerant. A heat dissipation unit is connected to the compressor outlet and is used to condense the high-pressure, high-temperature gaseous refrigerant into a high-pressure, room-temperature liquid refrigerant. An expansion valve is connected to the outlet of the heat dissipation unit and the inlet of the cold end. It is used to depressurize the high-pressure room-temperature liquid refrigerant into a low-pressure low-temperature liquid-gas mixture refrigerant, which enters the heat exchanger through the cold end inlet to absorb heat and transform into a low-pressure low-temperature gaseous refrigerant, so as to perform a second heat dissipation on the high-heat-generating heat source.

13. The composite cooling system according to claim 12, characterized in that, The refrigeration system further includes a first branch pipe and a second branch pipe. The first branch pipe has a first pipe section, a second pipe section, and a third pipe section. The first pipe section is connected to the expansion valve. The second pipe section and the third pipe section are both connected to the first pipe section. The heat dissipation unit is connected to the second pipe section or the third pipe section. The second branch pipe has a fourth pipe section, a fifth pipe section, and a sixth pipe section. The fourth pipe section and the fifth pipe section are both connected to the sixth pipe section. The fourth pipe section or the fifth pipe section is connected to the cold end outlet, and the sixth pipe section is connected to the compressor.

14. The composite cooling system according to claim 13, characterized in that, The refrigeration system further includes a liquid storage assembly that connects the compressor to the sixth pipe section of the second branch pipe.

15. The composite cooling system according to claim 12, characterized in that, The heat dissipation unit includes a condenser and a cooling fan. The condenser is connected to the compressor and the expansion valve, and the cooling fan is installed in the condenser.

16. The composite cooling system according to claim 12, characterized in that, The water cooling head and the water cooling radiator are connected in series, with the water cooling head connected to the hot end outlet and the water cooling radiator connected to the hot end inlet.

17. The composite cooling system according to claim 16, characterized in that... The water-cooled fan is installed on the water-cooling radiator.

18. The composite cooling system according to claim 12, characterized in that, The water cooling head and the water cooling radiator are configured in parallel, and the two ends of the water cooling head and the water cooling radiator are respectively connected to the hot end outlet and the hot end inlet.

19. The composite cooling system according to claim 18, characterized in that, The water-cooled fan is installed on the water-cooling radiator.

Images