Display module, display device, mold and glue filling machine

Abstract

The present disclosure provides a display module, a display device, a mold and a glue filling machine. A plurality of display modules are used for splicing for display, and the display module comprises: a light source and an encapsulation layer covering the light emitting side of the light source, the encapsulation layer comprising an edge region located at a splicing position of at least two display modules, the edge region of the encapsulation layer comprising a side region of the encapsulation layer; and an optical brightness adjustment structure, the optical brightness adjustment structure being arranged in the edge region of the encapsulation layer, wherein the optical brightness adjustment structure is configured to: control the optical path of the emitted light at least from the light source at the splicing position to equalize the brightness of the splicing position.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module, a display device, a mold and a glue filling machine. Background Art

[0002] With the development of light emitting diode (LED) splicing display technology, the application scenarios of this technology are becoming more and more diverse, such as city lighting, outdoor advertising display, stage lighting effect display, commercial display, etc.

[0003] However, the LED splicing display technology has uneven brightness at at least some splicing locations, which affects the display effect. Summary of the invention

[0004] In view of this, the embodiments of the present disclosure provide a display module, a display device, a mold and a glue filling machine, which are used to improve the problem of uneven brightness at at least part of the splicing point of LED splicing display technology.

[0005] An embodiment of the present disclosure provides a display module, wherein a plurality of the display modules are used for splicing for display, and the display module comprises: a light source and an encapsulation layer covering the light emitting side of the light source, the encapsulation layer comprising an edge area located at a splicing position of at least two display modules, the edge area of ​​the encapsulation layer comprising a side area of ​​the encapsulation layer; and an optical brightness adjustment structure, the optical brightness adjustment structure being arranged in the edge area of ​​the encapsulation layer, wherein the optical brightness adjustment structure is configured to: control the optical path of at least the outgoing light originating from the light source at the splicing position to equalize the brightness of the splicing position.

[0006] In some embodiments, the optical brightness adjustment structure includes at least one of a scattering microstructure, a transmittance adjustment structure, and a refractive index adjustment structure.

[0007] In some embodiments, the scattering microstructure includes a regular micro-prism structure located on at least one side of the encapsulation layer, and the vertex angle of the regular micro-prism structure ranges from 60° to 135°.

[0008] In some embodiments, a ratio of a maximum dimension of the regular micro-prism structure to a thickness of the encapsulation layer is in a range of 2% to 20%.

[0009] In some embodiments, the optical brightness adjustment structure further includes a flat structure, which is disposed on a side of the encapsulation layer and is located between the regular micro-prism structure and a side of the encapsulation layer away from the light source.

[0010] In some embodiments, the transmittance adjustment structure includes at least one of a haze structure or a low transmittance structure located on a side of the encapsulation layer, and a first transmittance of the low transmittance structure is lower than a second transmittance of a non-edge region of the encapsulation layer.

[0011] In some embodiments, the material of the refractive index adjustment structure includes an edge region encapsulation material and microcrystalline structures dispersed in the edge region encapsulation material.

[0012] In some embodiments, the edge region encapsulation material is the same as the non-edge region encapsulation material of the encapsulation layer.

[0013] In some embodiments, the display module also includes: a driving circuit board reused as a substrate; the light source includes a light-emitting diode, and the light-emitting diode is arranged on a side of the driving circuit board away from the supporting surface; wherein the packaging layer is arranged on a side of the driving circuit board away from the supporting surface and wraps multiple light-emitting diodes.

[0014] An embodiment of the present disclosure provides a display device, which includes: a display module and a housing as shown above; wherein at least one display module is detachably fixed to the housing.

[0015] In some embodiments, the display device further includes: a gap layer, the gap layer is located between adjacent display modules, the thickness of the gap layer is determined by the distance between two adjacent encapsulation layers, and the refractive index of the gap layer is less than the refractive index of the encapsulation layer.

[0016] An embodiment of the present disclosure provides a mold, comprising: a main body; and a complementary optical brightness adjustment structure arranged on the main body, wherein the complementary optical brightness adjustment structure is used to form an optical brightness adjustment structure in an edge area of ​​a packaging layer of a display module, the optical brightness adjustment structure is complementary in shape to the complementary optical brightness adjustment structure, and the optical brightness adjustment structure is configured to: control the optical path of at least the outgoing light originating from the light source of the packaging layer at a splicing position of the packaging layer to equalize the brightness of the splicing position.

[0017] An embodiment of the present disclosure provides a glue potting machine, comprising: a first glue potting passage corresponding to an edge area of ​​a display module, the first glue potting passage being used to form a first sub-packaging layer having a first refractive index in the edge area of ​​the display module; and a second glue potting passage corresponding to a non-edge area of ​​the display module, the second glue potting passage being used to form a second sub-packaging layer having a second refractive index in the non-edge area of ​​the display module, wherein the first glue potting passage and the second glue potting passage are isolated from each other, the first sub-packaging layer and the second sub-packaging layer together constitute a packaging layer of the display module, and the first sub-packaging layer is configured to: control an optical path of at least an outgoing light from a light source at a splicing position of the packaging layer to equalize the brightness of the splicing position.

[0018] In some embodiments, the ratio of the first glue pouring amount to the second glue pouring amount ranges from 70 to 90%, wherein the first glue pouring amount is the glue pouring amount of a single glue pouring nozzle corresponding to the edge area of ​​the display module, and the second glue pouring amount is the glue pouring amount of a single glue pouring nozzle corresponding to the non-edge area of ​​the display module.

[0019] Advantages of additional aspects of the present disclosure will be given in part in the following description, and in part will be obvious from the following description, or will be learned through practice of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly described below. It should be noted that the drawings described below only relate to some embodiments of the present disclosure, but are not intended to limit the present disclosure, wherein:

[0021] Figure 1 is a plan view of a display device;

[0022] Figure 2 for Figure 1 A schematic diagram of a cross-sectional structure of the display device taken along line AA;

[0023] Figure 3 A schematic diagram of uniform light mixing;

[0024] Figure 4 A schematic diagram of splicing and mixing light;

[0025] Figure 5 A plan view of a display device provided in an embodiment of the present disclosure;

[0026] Figure 6 for Figure 5 A schematic diagram of a cross-sectional structure of the display device taken along line BB;

[0027] Figure 7 A schematic diagram of a light path after atomization, taken along line BB in a cross section provided in an embodiment of the present disclosure;

[0028] Figure 8 A schematic diagram of a light path after refractive index differentiation of a cross section taken along line BB provided in an embodiment of the present disclosure;

[0029] Fig. 9 A schematic diagram of a refractive index adjustment structure provided in an embodiment of the present disclosure;

[0030] Fig.10 A schematic diagram of a microcrystalline structure and packaging material provided in an embodiment of the present disclosure;

[0031] Fig.11 A schematic diagram of a light path after light diffusion in a cross section taken along line BB provided in an embodiment of the present disclosure;

[0032] Fig.12 A cross-sectional schematic diagram of a display module after light diffusion provided by an embodiment of the present disclosure;

[0033] Fig.13 (a)~ Fig.13 (h) is a schematic diagram of a regular micro-prism structure provided in an embodiment of the present disclosure;

[0034] Fig.14 A cross-sectional schematic diagram of a display module after light diffusion provided by another embodiment of the present disclosure;

[0035] Fig.15 A schematic diagram of a cross-sectional structure of a display module provided by another embodiment of the present disclosure;

[0036] Fig.16 A schematic cross-sectional structural diagram of a display device provided in another embodiment of the present disclosure;

[0037] Fig.17 A flow chart of a method for manufacturing a display module provided in an embodiment of the present disclosure;

[0038] Fig.18 A schematic diagram of a cross-sectional structure of a mold;

[0039] Fig.19 A schematic diagram of the cross-sectional structure of a mold provided in an embodiment of the present disclosure;

[0040] Fig. 20 A schematic diagram of a cross-sectional structure of a mold provided in another embodiment of the present disclosure;

[0041] Fig.21 A schematic diagram of a cross-sectional structure of a mold provided in another embodiment of the present disclosure;

[0042] Fig. 22 It is a schematic diagram of the cross-sectional structure of a glue filling machine;

[0043] Fig.23 A schematic cross-sectional structure diagram of a glue filling machine provided in an embodiment of the present disclosure;

[0044] Fig.24 A schematic cross-sectional structure diagram of a glue filling machine provided by another embodiment of the present disclosure; and

[0045] Fig.25 A block diagram of a display device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0046] In order to more clearly explain the purpose, technical solutions and advantages of the present disclosure, the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the following description of the embodiments is intended to explain and illustrate the overall concept of the present disclosure and should not be understood as a limitation of the present disclosure. In the specification and the drawings, the same or similar reference numerals refer to the same or similar parts or components. For the sake of clarity, the drawings are not necessarily drawn to scale, and some well-known parts and structures may be omitted in the drawings.

[0047] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be the common meanings understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not represent any order, quantity or importance, but are only used to distinguish different components. "Including" or "comprising" and similar words mean that the elements or objects appearing in front of the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connecting" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right", "top" or "bottom" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly. When an element such as a layer, a film, a region or a substrate is referred to as being "on" or "under" another element, the element may be "directly" located "on" or "under" another element, or there may be an intermediate element.

[0048] In order to facilitate understanding of the technical solution of the present disclosure, a display device and problems existing in the display device and causes thereof are first described.

[0049] Figure 1 A plan view of a display device.

[0050] like Figure 1 As shown, the display device 10 is exemplarily described by taking an assembled LED display screen as an example. The assembled LED display screen is composed of a plurality of display modules 11 assembled together.

[0051] On the one hand, the structure at the edge of the display module 11 is different from that at the non-edge of the display module 11. For example, the edge region has a side surface, and the light propagation path at the side surface is different from that at the non-edge of the display module 11, resulting in the brightness at the joint between two adjacent display modules being different from that at the non-edge region of the display module.

[0052] On the one hand, due to limitations of machining accuracy, assembly accuracy and other process reasons during the splicing process, inconsistent spacing may occur between LED pixel points at the edges of adjacent display modules 11 where the display modules 11 are spliced ​​together. This affects the display quality by showing bright or dark lines when displaying low-frequency images.

[0053] The embodiment of the present disclosure aims to improve the phenomenon of uneven display effect at the joints of the display device 10 caused by the above reasons and the like.

[0054] Figure 2 for Figure 1 A schematic diagram of the cross-sectional structure of the display device taken along line AA.

[0055] like Figure 2 As shown, the display module 11 of the display device 10 may include a packaging layer 111, and the packaging layer 111 wraps a plurality of LED chips 112 located on a circuit board 113. The LED chips 112 may be fixed on the circuit board 113 by flip-chip welding, silver paste bonding, or the like. Figure 2 There is a gap between two adjacent display modules 11 after being assembled, and the gap cannot be completely eliminated. In addition, in order to reserve a certain redundant window for the spliced ​​display modules 11, a gap of a certain size also needs to be preset.

[0056] The display product composed of multiple display modules 11 is spliced ​​by array splicing. In theory, it can achieve infinite size splicing and achieve super large display effect, which is also its biggest advantage over LCD liquid crystal display. For the above display module 11, if there is no encapsulation layer 111, the LED chip 112 can mix light evenly in the air, and there is no defect in the display. In fact, due to the splicing, slight bright bands may appear at all splicing points 20 (dotted line position). When watching a pure color picture at a close distance, this uneven brightness phenomenon is particularly obvious.

[0057] Figure 3 A schematic diagram of uniform light mixing.

[0058] like Figure 3 As shown, for the non-edge area of ​​the display module 11, there is no gap caused by splicing, and the upper surface of the entire non-edge area can be flat. For light with the same incident angle, the refraction angle can be the same. Figure 3The light path principle of the non-jointed part in the display module 11 is shown in FIG. It can be seen that when all the light passes through the flat encapsulation layer 111, the light enters the air directly after refraction, and the refracted light changes a certain direction. Since the light is refracted only once, although the angle of the refracted light changes from a2 to a1, the size of the mixed light area S1 does not change, and each LED chip 112 has the same mixed light area S1, and the overall display effect looks uniform.

[0059] Figure 4 A schematic diagram of splicing and mixing light.

[0060] like Figure 4 As shown, after the edge area (edge ​​area includes side walls) of the display module 11 is spliced, there is a gap caused by the splicing. The first optical path of the light with a specified exit angle passing through the upper surface of the encapsulation layer 111, and the second optical path of the light with the same specified exit angle passing through the side of the encapsulation layer 111-the side of the encapsulation layer of the adjacent display module-the upper surface of the encapsulation layer of the adjacent display module are different. Specifically, when an air gap appears after the display modules 11 are spliced, the light is emitted along BF, reaches the gap, passes through FG, enters the adjacent display module 11, passes through GH, and finally exits along HI. AC and DE are the normal directions of the side of the encapsulation layer. Figure 4The dotted line in the middle shows the optical path of the light when there is no gap. The refractive index of the light from the air to the encapsulation layer changes from small to large. The refractive index ratio of air to other substances is less than 1, and is equal to the sine ratio of the incident angle to the refractive angle (that is, the first ratio between the refractive index of air and the encapsulation layer is proportional to the second ratio between the incident angle and the refractive angle, so the incident angle in the air is greater than the refractive angle of the transparent substance, and the light path is reversible. For example, the material of the encapsulation layer includes but is not limited to at least one of the following: polymethyl methacrylate (such as acrylic, plexiglass, PMMA plastic) (Nd / 25℃1.49), polycarbonate (PC plastic) (Nd / 25℃1.584~1.586), polyethylene glycol (PET) (Nd / 25℃1.65), transparent nylon (Nd / 25℃1.592), acrylic Acrylonitrile-styrene copolymer (AS, Nd / 25℃1.561), etc. If the incident angle of the light from the transparent material is AFB, the refraction angle is CFG, and the refraction angle CFG is greater than the incident angle AFB, and then after returning from point G to the adjacent display module 11, GH is parallel to BF, that is, after the light is emitted from the adjacent display module 11, the emission angle of the light remains unchanged, but the light emitted from the joint 20 is offset inward relative to the light emitted from the unjoined part, although the direction has not changed. This results in that although the total luminous flux of the LED chip at the joint 20 has not changed, after the joint gap appears, the light is offset to the inside of the gap. The macroscopic performance is that the light at the joint 20 is more convergent than the light without the joint, so it is easy to form a bright band at the joint 20.

[0061] The embodiment of the present disclosure provides a display module, and a plurality of the display modules are used for splicing for display.

[0062] The display module may include: a light source and an encapsulation layer covering the light emitting side of the light source, the encapsulation layer including an edge area located at the splicing position of at least two display modules, the edge area of ​​the encapsulation layer including the side area of ​​the encapsulation layer; and an optical brightness adjustment structure, the optical brightness adjustment structure is arranged in the edge area of ​​the encapsulation layer, wherein the optical brightness adjustment structure is configured to: control the optical path of the emergent light at the splicing position to equalize the brightness of the splicing position. The light source includes an active light source and a passive light source, and the active light source may be an electrically excited light source or a light excited light source, etc. The passive light source may be a light source provided by the outside, such as light emitted from the outside to the encapsulation layer, etc., which is not limited here.

[0063] Figure 5 A plan view of a display device provided in an embodiment of the present disclosure. Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure of the display device taken along line BB.

[0064] like Figure 5 and Figure 6 As shown, the refractive index of the edge area of ​​the packaging layer is adjusted as an example for schematic description.

[0065] The display device 5 may include: a plurality of display modules 50 capable of splicing display, and the splicing portion 60 is shown by the dotted line in the figure. At least some of the display modules 50 include an encapsulation layer 51. The edge area of ​​the encapsulation layer 51 includes an optical brightness adjustment structure 511, which is used to reduce the refractive index difference between the side material of the encapsulation layer and the material in the gap at the splicing portion (such as air, etc.). The optical brightness adjustment structure 511 reduces the effect of the side of the encapsulation layer 51 on the optical path from the inside of the encapsulation layer 51 to the outside of the encapsulation layer 51, so as to equalize the brightness of the splicing portion 60 between the plurality of display modules 50.

[0066] In addition, the display device 5 may further include a light source and a circuit board for controlling the light source, and a housing for fixing the circuit board. The light source may be fixed on the circuit board, and the encapsulation layer 51 may cover the upper surface of the circuit board and wrap the light source. Among them, the light source includes but is not limited to: an incandescent light source, a fluorescent light source, an LED light source, an organic light emitting diode (OLED), a laser light source, etc. Among them, the fluorescent light source and the laser light source may be an optically pumped or electrically pumped light source, which is not limited here.

[0067] The encapsulation layer 51 can provide physical protection for the LED chip 52 wrapped therein, and the thickness of the encapsulation layer 51 can be determined according to the application scenario. For example, for a display device that needs to be mounted on a wall, the encapsulation layer 51 does not need to bear too much load, so the thickness of the encapsulation layer 51 can be made thinner, such as being able to cover the LED chip 52. For example, for a display device that needs to bear more loads, such as a display device laid on the ground or on a stage, the encapsulation layer 51 needs to bear such as the weight of the human body and the weight of the equipment. By manufacturing a thicker encapsulation layer 51, the load-bearing capacity of the display device can be effectively improved, so the thickness of the encapsulation layer 51 can be made thicker. Such as determined by calculation based on material parameters such as the maximum load required to be carried in a preset application scenario and the strength of the encapsulation layer material. Of course, the thickness of the encapsulation layer 51 can also be made larger than the above calculation result to improve the safety of users using the display device.

[0068] It should be noted that the encapsulation layer 51 may be located only on the upper surface of the circuit board, or may be located on the upper surface and at least part of the side surface of the circuit board at the same time, so that the circuit board can be protected at the same time. In addition, the encapsulation layer 51 may also cover the back of the circuit board to isolate the circuit board from the external environment, which is not limited here.

[0069] The optical brightness adjustment structure 511 can reduce the influence of the edge area of ​​the encapsulation layer 51 on the optical path from the inside of the encapsulation layer 51 to the outside of the encapsulation layer 51. For example, this can be achieved by adjusting light scattering, light refraction, and light incident angle. The light source can be a light emitting diode, which is arranged on the side of the driving circuit board away from the supporting surface.

[0070] like Figure 6 As shown, the display module 50 may further include: a driving circuit board 53 which is reused as a substrate. The LED chip 52 may be arranged on a side of the driving circuit board 53 away from the supporting surface.

[0071] The supporting surface of the driving circuit board 53 may be a surface without LED chips 52, that is, the surface opposite to the surface of the driving circuit board 53 on which the LED chips 52 are provided. The packaging layer 51 is provided on the side of the driving circuit board 53 away from the supporting surface and wraps the plurality of LED chips 52.

[0072] Specifically, the LED chip 52 can be fixed on the driving circuit board 53 by face-up and / or flip-up. The LED chip 52 in the display module 50 can be a monochrome LED chip, such as the display device 50 can be a red monochrome display screen, a yellow monochrome display screen, an orange monochrome display screen, a green monochrome display screen, a blue monochrome display screen or a purple monochrome display screen.

[0073] The display module 50 may include LED chips 52 of various colors. The various colors of light include, but are not limited to, red light, blue light, yellow light, green light, purple light, and white light, etc. Among them, white light may be a mixture of red light, blue light, and green light, and white light may be a mixture of blue light that excites phosphor.

[0074] The display module 50 may include a plurality of pixels, each of which may be composed of one or more LED chips 52. For example, a pixel includes a red LED chip, a blue LED chip, and a green LED chip, and the driving circuit may control the luminous brightness of the red LED chip, the blue LED chip, and the green LED chip, so that the display color of a pixel may be adjusted. For example, if only the red LED chip is controlled to light up, the pixel displays red; if only the blue LED chip is controlled to light up, the pixel displays blue; if only the red LED chip and the green LED chip are controlled to emit light, the pixel displays yellow; if the red LED chip, the blue LED chip, and the green LED chip are controlled to emit light, the pixel displays white. In addition, the driving circuit may also control the luminous intensity of each color LED chip at the same time, so that the pixel may display more kinds of colors.

[0075] In some embodiments, the optical brightness adjustment structure 511 includes: at least one of a scattering microstructure, a transmittance adjustment structure, and a refractive index adjustment structure. This facilitates adjusting the effect of the edge area of ​​the encapsulation layer on the optical path by setting at least one of the above optical brightness adjustment structures 511 on the side of the encapsulation layer 51. Among them, the optical brightness adjustment structure 511 can be set in the edge area of ​​the encapsulation layer 51, such as at least part of the side of the encapsulation layer 51, or a part of the upper surface of the encapsulation layer 51 adjacent to the side, which is not limited here.

[0076] Reference About Figure 4 According to the principle of the invention, the uneven brightness can be changed by introducing the optical brightness adjustment structure 511 to optimize the corresponding influencing factors. In the actual manufacturing process, this undesirable phenomenon can be reduced by improving the process. Specifically, the optimization direction is to reduce the internal offset of the H point, that is, to reduce the convergence of the light path, or to reduce the luminous flux. The spacing between the display modules can be greater than 0mm and less than 0.3mm.

[0077] In a specific embodiment, the mold used to form the encapsulation layer 51 can be improved to change Figure 4 The light transmittance or incident angle of the edge area of ​​the middle encapsulation layer 111 is adjusted to improve the uneven brightness of the joint 60. When the light enters the encapsulation layer or exits from the encapsulation layer in a direction perpendicular to the encapsulation layer 111, the incident angle and the refraction angle are equal. When the angle between the incident light and the normal line of the surface of the encapsulation layer 111 is reduced, the angle between the outgoing light and the normal line of the surface of the encapsulation layer 111 will also be reduced, which effectively improves Figure 4 The light at point H in the middle is deflected inward, which reduces the convergence of the light path.

[0078] The display device 5 provided in the embodiment of the present disclosure optimizes the structure of the edge area of ​​the encapsulation layer 511 of the display module 50 to change the influence of the edge area of ​​the encapsulation layer 51 on the optical path, improve the problem of uneven brightness at the splicing point 60, and optimize the display effect of the entire splicing display device 5.

[0079] The following combination Figures 7 to 14 An optical brightness adjustment structure is exemplified.

[0080] The transmittance adjustment structure is mainly used to adjust the transmittance of the edge area of ​​the encapsulation layer 51 , and to reduce the brightness of the splicing part 60 by reducing the transmittance of the edge area of ​​the encapsulation layer 51 , thereby optimizing the display effect of the entire splicing display device 5 .

[0081] In some embodiments, the transmittance adjustment structure includes a low transmittance structure located on the side of the encapsulation layer, and the first transmittance of the low transmittance structure is lower than the second transmittance of the non-edge area of ​​the encapsulation layer. It should be noted that the light transmittance can also be indirectly reduced by light scattering, thereby reducing the light intensity of the edge area of ​​the encapsulation layer and avoiding the light collection phenomenon on the side of the encapsulation layer.

[0082] Specifically, the transmittance adjustment structure may be made of a low-transmittance material with a lower transmittance than the encapsulation layer 51 to reduce the transmittance of the edge region of the encapsulation layer. In addition, the transmittance may also be reduced by using methods such as frosted glass.

[0083] Figure 7 A schematic diagram of the light path after atomization, with the cross section taken along line BB provided in an embodiment of the present disclosure.

[0084] like Figure 7 As shown, the light path is atomized in a scheme in which the light-emitting surface (non-edge area) of the display module 50 is also the appearance surface, and uneven atomization cannot be performed. In particular, the area of ​​the S1 region of the display module 50 is relatively small, and it is difficult to atomize the S1 region in large-scale process operations. As for the side M, it does not affect the appearance of the product, and it is also easy to implement in terms of process. It only requires a new polishing process for the formed display module 50, and a slight polishing of the side M of the display module 50. The polishing effect can be selected according to the fine specifications of the corresponding polishing tool. When the side M is atomized, it is affected by the increased light scattering, resulting in a decrease in the luminous flux, which reduces the brightness of the joint 60 and achieves uniform display brightness.

[0085] In addition, a new grinding process can be added to the existing mold (used to form the display module 50), and the surface of the mold corresponding to at least part of the side M is lightly ground, and the grinding effect can be selected according to the fine specifications of the corresponding grinding tool. When the display module 50 is processed using the ground mold, the side M of the formed display module 50 is atomized, and its light transmittance is also reduced, and the luminous flux is reduced, so that the brightness of the joint 60 is reduced, and the display brightness is uniform.

[0086] It should be noted that, in addition to using atomization to scatter the outgoing light to reduce the luminous flux, it can also be adjusted by semi-blocking. For example, applying colloids of different transparencies on the side M can also reduce the luminous flux and also play a role in weakening the bright band.

[0087] like Figure 7As shown, after the transmittance adjustment structure is set on the side M, although the light path is not changed or slightly changed, and the internal offset of the light path is not reduced, that is, the convergence of the light path is reduced, the luminous flux of the joint 60 is reduced. Therefore, the brightness of the joint 60 is effectively reduced, and the display brightness is uniform.

[0088] It should be noted that the adjustment of the transmittance can be determined according to the actual product model, such as first detecting the ratio of the light intensity at the splicing portion 60 to the light intensity at the non-splicing portion, and then determining the adjustment of the transmittance based on the ratio. Therefore, the transmittance adjustment structure can be designed based on the adjustment of the transmittance, such as the size, material type, film thickness and other parameters of the transmittance adjustment structure.

[0089] The refractive index adjustment structure is described below as an example. The refractive index adjustment structure is mainly used to reduce the convergence of the light path by adjusting the refractive index of the edge region of the encapsulation layer.

[0090] Figure 8 A schematic diagram of the light path after refractive index differentiation of a cross section taken along line BB provided in an embodiment of the present disclosure.

[0091] like Figure 8 As shown, the internal deviation of the light can be reduced by changing the refractive index of the edge area of ​​the encapsulation layer 51, such as reducing the refractive index of the edge area of ​​the encapsulation layer 51, so as to reduce the convergence of the light path. Specifically, according to the refractive index formula, when the incident angle α remains unchanged, the exit angle β varies with the refractive index η of the encapsulation layer. When the refractive index η of the encapsulation layer is closer to the refractive index of air (the refractive index of air is 1), the value of the exit angle is closer to the incident angle. The refractive index formula is shown in (1).

[0092] η=sinα / sinβ Formula (1)

[0093] Wherein, η is the refractive index of the encapsulation layer, α is the incident angle, and β is the exit angle.

[0094] Formula (1) shows that reducing the refractive index of the edge area of ​​the packaging layer helps to improve the internal deviation of the light and reduce the convergence of the light path. Figure 8 As shown, when the relative refractive index from air to other media is greater, the offset angle is also greater. Therefore, two transparent materials with different refractive indices are used, and the splicing edge uses a material with a smaller offset angle. The range of the side H point converging outward is also reduced, which can also reduce the bright band.

[0095] In some embodiments, the refractive index of the edge region of the encapsulation layer may be changed by changing the material of the edge region of the encapsulation layer.

[0096] Fig. 9 A schematic diagram of a refractive index adjustment structure provided in an embodiment of the present disclosure.

[0097] like Fig. 9 As shown, the material of the edge region of the encapsulation layer 51 is different from the material of the non-edge region of the encapsulation layer 51 , and the refractive index of the non-edge region of the encapsulation layer 51 is reduced by using a low refractive index material 5111 .

[0098] Fig. 9 A low refractive index material 5111 is used to replace the original material used in the edge area of ​​the encapsulation layer. For example, the transparent encapsulation material includes but is not limited to at least one of the following: polymethyl methacrylate (such as acrylic, organic glass, PMMA plastic), polycarbonate (PC plastic), polyethylene terephthalate (PET), transparent nylon, acrylonitrile-styrene copolymer (AS), etc. If the original encapsulation layer material is acrylic, the material of the edge area of ​​the encapsulation layer can be replaced by a material with a lower refractive index, which can effectively reduce the convergence of the light path.

[0099] Specifically, the material of the edge area of ​​the encapsulation layer 51 can be easily realized to be different from the material of the non-edge area by improving the glue dispensing machine. For example, the glue dispensing machine includes a plurality of glue dispensing nozzles, each of which is used to implement glue dispensing operations for a specified area of ​​the encapsulation layer 51. By changing the material flowing out of the glue dispensing nozzle corresponding to the edge area of ​​the encapsulation layer, the refractive index of the edge area of ​​the encapsulation layer 51 can be changed.

[0100] In some embodiments, the edge region encapsulation material may be the same as the non-edge region encapsulation material of the encapsulation layer 51. For example, the refractive index of the edge region of the encapsulation layer may be changed by improving the material of the edge region of the encapsulation layer. Since there is no need to replace the substrate of the encapsulation layer 51, it helps to reduce the types of raw materials and reduce the production and manufacturing costs such as warehousing and material collection. In addition, it also helps to reduce the color difference between the encapsulation layer in the edge region and the non-edge region.

[0101] Fig.10 Schematic diagram of the microcrystalline structure and packaging material provided in the embodiment of the present disclosure.

[0102] like Fig.10As shown, the edge area material of the encapsulation layer 51 can be improved by doping or mixing, so that it is also convenient to finely adjust the refractive index of the edge area of ​​the encapsulation layer by adjusting the doping amount or the mixing amount. For example, the spacing between adjacent display modules 50 is less than 0.2mm, and the refractive index of the material in the non-edge area of ​​the encapsulation layer is a, then the refractive index of the material in the edge area η can be: 0.85a≤η<a. For example, the refractive index of the acrylic material is 1.49, and the refractive index of the material in the edge area of ​​the encapsulation layer is adjusted to any one of 1.1, 1.14, 1.18, 1.2, 1.23, 1.35, 1.38, 1.42, 1.45 or 1.48 by the above-mentioned doping, additives, mixing, etc.

[0103] For example, the material of the refractive index adjustment structure includes an edge region packaging material and a microcrystalline structure 5112 dispersed in the edge region packaging material. The microcrystalline structure 5112 includes but is not limited to at least one of microcrystals such as PC polycarbonate and transparent silicone grease particles that can reduce the refractive index of the packaging layer material. The microcrystalline structure 5112 can be dispersed in the packaging material by stirring and other operations to facilitate molding of the packaging layer. The overall material is mainly one material, but the microcrystalline structure is used as an additive to modify the edge of the packaging layer.

[0104] The following is an exemplary description of the scattering microstructure. The scattering microstructure is mainly used to reduce the angle between the normal line of the edge area of ​​the encapsulation layer and the incident light to reduce the convergence of the light path. In some embodiments, the light scattering characteristics can be adjusted by setting a regular micro-prism structure and / or atomization structure in the edge area of ​​the encapsulation layer.

[0105] Fig.11 A schematic diagram of a light path after light diffusion in a cross section taken along line BB provided in an embodiment of the present disclosure.

[0106] Referring to the refractive index formula shown in formula (1), when the refractive index of the encapsulation layer material remains unchanged, the exit angle can be adjusted by changing the incident angle. Therefore, it can be determined by formula (1) that when the refractive index of the encapsulation layer material remains unchanged, the exit angle can be reduced by reducing the incident angle to improve the internal deviation of the light and reduce the convergence of the light path. For example, if the incident light is perpendicular to the surface of the encapsulation layer 51, the exit light is also perpendicular to the medium surface. Although it is difficult to make all the exit light perpendicular to the side of the encapsulation layer 51, the average value of the exit angles of all the exit light rays and the side of the encapsulation layer 51 can be reduced by preparing a scattering microstructure of a specific shape on the side of the encapsulation layer 51.

[0107] like Fig.11As shown, the side M is the side of the encapsulation layer, and assuming that M1 and M2 are the side angles of two adjacent splicing modules, which are just perpendicular to the emitted light BF, it will be the same as the original mixed light area S1, that is, no bright band will appear. As the directions of M1 and M2 change, the H1I1 emitted light will shift left and right, that is, bright areas and dark areas will be realized. This will cause bright areas or dark areas to appear near the splicing, and the side M is not easy to make into such an inclined surface. In order to solve the above problems, micro-mirrorization of the side M can be adopted.

[0108] In some embodiments, the scattering microstructure includes a regular microprism structure located on at least one side of the encapsulation layer 51, and the vertex angle of the regular microprism structure ranges from 60° to 135°. In this way, when different light rays hit the same microprism surface, the positions of the emitted light H1 and I1 are different, and the same luminous flux will achieve a generalized uniform distribution, making the bright band disappear. Among them, the regular microprism structure effectively increases the area of ​​the optical path, making it easier for light to interfere. At the same time, the vertex angle should not be too large to avoid excessive light loss at the corners.

[0109] Specifically, the regular micro-prism structure can be manufactured by using an improved mold. For example, if the inner surface of the mold is provided with a microstructure complementary to the regular micro-prism structure, after glue pouring, a packaging layer 51 having a regular micro-prism structure can be formed.

[0110] Fig.12 A cross-sectional schematic diagram of a display module after light diffusion provided by an embodiment of the present disclosure.

[0111] like Fig.12 As shown, a plurality of scattering microstructures 5113 are provided on the side of the encapsulation layer 51, and the scattering microstructures 5113 can cover the entire side of the encapsulation layer 51. It should be noted that the scattering microstructures 5113 can be microstructures protruding from the surface of the encapsulation layer 51, or can be concave microstructures, which are not limited here. The scattering microstructures 5113 may not cover the driving circuit board 53 located at the bottom of the encapsulation layer 51, and the scattering microstructures 5113 may cover the driving circuit board 53 located at the bottom of the encapsulation layer 51.

[0112] In some embodiments, the ratio of the maximum size of the regular micro-prismatic structure to the thickness of the encapsulation layer 51 is in the range of 2% to 20%. On the one hand, such a size setting can meet the light diffusion requirements. On the other hand, such a size setting helps to improve the safety of the device and the safety of use, and reduce the risk of damage to the regular micro-prismatic structure and scratches to the user during transportation. Among them, the above-mentioned thickness ratio determines how many regular micro-prismatic structures can be placed at the edge. Too few will cause insufficient light interference, and too many will increase the difficulty of the process. The brightness equalization effect in the above ratio range is better.

[0113] Fig.13 (a)~ Fig.13 (h) is a schematic diagram of a regular micro-prism structure provided in an embodiment of the present disclosure.

[0114] like Fig.13 (a)~ Fig.13 (h) is a schematic cross-sectional view of a regular micro-prism structure. The regular micro-prism structure may include one or more vertex angles, and the vertex angle may range from 60° to 135°. For example, Fig.13 (a) may be a cross-sectional view of a triangular pyramid or a triangular prism, Fig.13 (c) shows a cross-sectional view of a semi-cylindrical or rectangular parallelepiped. It should be noted that: Fig.13 (a)~ Fig.13 The microstructure shown in (h) is only shown as an example. The scattering microstructure obtained by simply deforming the above microstructure is applicable to a variety of microstructures that can be used to achieve a generalized and uniform distribution of light flux.

[0115] In some embodiments, in order to improve the surface flatness and aesthetic appearance of the display device, the optical brightness adjustment structure may further include a flat structure 5114, which is arranged on the side of the encapsulation layer 51 and located between the regular microprism structure and the upper surface of the encapsulation layer 51.

[0116] For example, if the thickness of the encapsulation layer 51 is X, the maximum size of the microprism is 2%X to 20%X. The size of the flat structure 5114 can be greater than 0.5 mm, which takes into account the tooling error of 0.3 mm. The thickness of the encapsulation layer is determined based on the application scenario's requirements for the mechanical strength of the display device 5. The maximum size may refer to any one of the maximum width, maximum length, and / or maximum height, or the maximum value of the maximum width, maximum length, and maximum height.

[0117] In some embodiments, the scattering microstructure may include an irregular scattering microstructure located on a side of the encapsulation layer. For example, the irregular scattering microstructure may be an atomized structure.

[0118] Fig.14 A cross-sectional schematic diagram of a display module after light diffusion provided by another embodiment of the present disclosure.

[0119] like Fig.14As shown, in the side of the encapsulation layer 51, the area adjacent to the upper surface of the encapsulation layer 51 is a relatively flat area. Specifically, the optical brightness adjustment structure also includes a flat structure 5114, which is arranged on the upper side of the scattering microstructure 5113. For example, a sawtooth mirror structure with a flat upper side and a convex lower side can be used in the mold for molding the encapsulation layer 51, so that a scattering microstructure complementary to the inner surface of the mold can be easily formed, and the appearance is not affected during splicing, and the concave mirror surface below also does not affect the appearance.

[0120] Fig.15 A schematic diagram of the cross-sectional structure of a display module provided in another embodiment of the present disclosure.

[0121] like Fig.15 As shown, the display module 50 may further include a system module 54 and a fixing structure 55 located on the lower surface of the driving circuit board 53 .

[0122] The system module 54 may include one or more processors and memories, etc., for implementing functions such as power adjustment, display image data processing, etc. The memory may store firmware information and programs of the display module 50, such as row and column information, etc. The programs may be drivers, etc.

[0123] The fixing structure 55 may be a structure that is easy to disassemble and assemble, including but not limited to snap fixing, magnetic fixing, interference fit fixing, bolt fixing, etc., which is not limited here.

[0124] Fig.16 A schematic cross-sectional structure diagram of a display device provided in another embodiment of the present disclosure.

[0125] like Fig.16 As shown, the display device 5 may further include: a housing, wherein at least one display module 50 is detachably fixed to the housing.

[0126] For example, the housing may include a substrate 163, a support structure 162, and a mounting structure 161 that matches the fixed structure 55. For example, the support structure 162 is fixed on the substrate 163, and the mounting structure 161 is provided on the side of the support structure 162 away from the substrate 163. When the fixed structure 55 is a magnetic component, the mounting structure 161 may include a magnetic component, so that the display module 50 can be fixed and positioned by the attraction of the fixed structure 55 and the mounting structure 161. For example, a display device 5 includes four display modules 50 arranged in a 2*2 array. Fig.16 Two display modules 50 are shown in FIG.

[0127] In addition, the display device may further include: a gap layer, the gap layer is located between adjacent display modules, the thickness of the gap layer is determined by the distance between two adjacent encapsulation layers, and the refractive index of the gap layer is less than the refractive index of the encapsulation layer. For example, the gap layer may be air. For example, the gap layer may be made of a material having a refractive index less than that of an acrylic material. For example, after the display device is assembled, a low refractive index material, such as a fluid material, a low refractive index solid material, etc., may be injected into the gap between the display modules. The injected material may change its properties through processes such as heating and illumination, such as changing from a fluid material to a solid material, or from a solid material to a fluid material, etc.

[0128] In a specific embodiment, an LED display screen is used as an example for illustrative description. The LED display screen includes a plurality of display modules 50 of the same size, which are spliced ​​in an array. In theory, infinite-size splicing can be achieved to achieve a super-large display effect, which is also the biggest advantage of LED display over LCD liquid crystal display. As a universal display module 50, it needs to be suitable for different usage scenarios, such as outdoor, stage floor, etc. Therefore, it is also necessary to protect the LED chip 52. A one-time packaging protection for the entire display module 50 can be adopted so that its optics and hardness can meet various requirements. Among them, the driving circuit board 53 can be a PCB board, a closed carrier of LED lamp beads, the substrate 163 can include a structural frame and a rear shell, the fixing structure 55 includes a magnetic bead enclosed on the back of the PCB board, and the mounting structure 161 includes a magnetic bead fixed on the support structure 162. The two magnetic beads attract each other to fix the display module 50. It should be noted that a display module 50 can be composed of one or more light board arrays.

[0129] The display device provided by the embodiment of the present disclosure optimizes the edge area of ​​the encapsulation layer so that when displaying a monochrome image, there is no obvious uneven brightness in the overall display effect, which effectively improves the display effect. In addition, the display device is easy to disassemble and install, and can be applied to a variety of scenarios, effectively improving the user experience.

[0130] Another aspect of the present disclosure provides a method for manufacturing a display module.

[0131] Fig.17 A flow chart of a display module manufacturing method provided in an embodiment of the present disclosure.

[0132] like Fig.17 As shown, the display module manufacturing method 170 may include operations S171 to S172.

[0133] In operation S171, a display assembly is provided, where the display assembly includes: a driving circuit board reused as a base substrate, and a plurality of light sources arranged on a side of the driving circuit board away from a supporting surface.

[0134] In this embodiment, the display component, the driving circuit board, the light emitting diode, etc. can refer to the description of the relevant parts in the above embodiments, and will not be described in detail here.

[0135] In operation S172, an encapsulation layer is formed on a side of the driving circuit board away from the supporting surface, the encapsulation layer includes an edge area located at a splicing position of at least two display modules, the edge area of ​​the encapsulation layer includes a side area of ​​the encapsulation layer, and an optical brightness adjustment structure arranged in the edge area of ​​the encapsulation layer, the optical brightness adjustment structure is configured to: control the optical path of at least the outgoing light from the light source at the splicing position to equalize the brightness of the splicing position.

[0136] In this embodiment, the encapsulation layer, the edge area, the optical brightness adjustment structure, the optical path and the display effect equalization etc. can refer to the description of the relevant parts in the above embodiments, which will not be described in detail here.

[0137] The molding operation of forming the encapsulation layer on the side of the driver circuit board away from the support surface can be achieved by using an improved mold and an existing glue potting machine. For example, the display component is fixed in a mold with a specified structure on the inner surface, and then a glue potting machine is used to perform glue potting in the mold, so that the encapsulation layer with the optical brightness adjustment structure can be directly formed. The specified structure and the optical brightness adjustment structure are complementary.

[0138] In addition, the above molding operation can also be achieved by using an existing mold and an improved glue potting machine. For example, the material supplied by the nozzle corresponding to the edge area of ​​the packaging layer among the multiple nozzles of the glue potting machine can have a lower refractive index than the material supplied by other nozzles.

[0139] In addition, the above molding operation can also be implemented by using an existing mold and an existing glue filling machine. For example, the side of the molded packaging layer is polished.

[0140] Another aspect of the present disclosure provides a mold.

[0141] Fig.18 A schematic diagram of the cross-sectional structure of a mold. Fig.19 A schematic diagram of the cross-sectional structure of a mold provided in an embodiment of the present disclosure.

[0142] like Fig.18 and Fig.19 As shown, the mold 180 includes a main body 181 and a complementary optical brightness adjustment structure 1811 disposed on the main body 181 .

[0143] In this embodiment, the complementary optical brightness adjustment structure 1811 is used to form an optical brightness adjustment structure 511 in the edge area of ​​the packaging layer 51 of the display module 50. The shape of the optical brightness adjustment structure 511 is complementary to that of the complementary optical brightness adjustment structure 1811. The optical brightness adjustment structure 51 reduces the influence of the edge area of ​​the packaging layer on the optical path from the inside of the packaging layer 51 to the outside of the packaging layer 51, so as to equalize the brightness of the joint 60 between multiple display modules 50.

[0144] In some embodiments, the complementary optical brightness adjustment structure 1811 may be an atomization structure, a scattering microstructure, or the like.

[0145] Fig. 20 A schematic diagram of the cross-sectional structure of a mold provided in another embodiment of the present disclosure.

[0146] like Fig. 20 As shown, the scattering microstructure is used as an example for explanation. A protruding scattering microstructure 18113 may be provided on the inner surface of the main body 181. The protruding scattering microstructure 18113 may cover the entire inner surface or part of the inner surface of the main body 181. The protruding scattering microstructure 18113 may be provided on the inner surface of the main body 181. Fig.13 It should be noted that a concave scattering microstructure may also be provided on the inner surface of the main body 181, or both a protruding scattering microstructure 18113 and a concave scattering microstructure may be provided.

[0147] Fig.21 A schematic diagram of the cross-sectional structure of a mold provided in another embodiment of the present disclosure.

[0148] like Fig.21 As shown, the complementary optical brightness adjustment structure 1811 may include a protruding scattering microstructure 18113 and a flat microstructure 18114. When using the mold 180 to make a display module, the mold 180 can be fixed to the side of the display component. Among them, the mold 180 can be composed of multiple detachable parts, and the multiple detached parts need to be assembled and fixed during molding, which helps to improve the convenience of use. For example, the spring provides a clamping force so that the two opposite sides of the mold 180 clamp the display component. In addition, the mold 180 can also be a whole, and the display component is directly placed in the mold 180.

[0149] Fig.21The molding process of the encapsulation layer for the LED display module is shown. The driver circuit board 53 with the die bonded is placed in the main body 181 of the mold 180. After the colloid is evenly poured into the mold 180 by a glue filling machine, the mold 180 is removed after leveling and curing to achieve the encapsulation of the driver circuit board 53. Among them, the mold 180 can implement at least one of the following strategies: On the one hand, the brightness is reduced by reducing the light energy through atomizing the light path. On the other hand, the splicing bright band is reduced by generalizing the light source to differentiate the mixed area of ​​the light.

[0150] Another aspect of the present disclosure further provides a glue filling machine.

[0151] Fig. 22 The figure is a schematic diagram of the cross-sectional structure of a glue filling machine.

[0152] like Fig. 22 As shown, the glue dispensing machine may include a glue dispensing passage 221 and a plurality of glue dispensing nozzles 222. Among them, the plurality of glue dispensing nozzles 222 may be evenly arranged. After the glue dispensing nozzles 222 are aligned with the mold 180 (including the main body 181 and the complementary optical brightness adjustment structure 1811), glue is dispensed through each glue dispensing nozzle 222 to achieve the preparation of the encapsulation layer 51. The thickness of the encapsulation layer 51 can be calculated based on the opening size, pressure, viscosity of the glue dispensing material, and duration of the glue dispensing nozzle 222. In addition, the glue dispensing process parameters corresponding to the specified encapsulation layer thickness can also be determined by calibration.

[0153] In addition, in order to meet special needs, such as equalizing the brightness of the joints between multiple display modules, the glue filling machine can be improved.

[0154] Fig.23 A schematic cross-sectional structure diagram of a glue filling machine provided in an embodiment of the present disclosure.

[0155] like Fig.23 As shown, the glue potting machine may include a first glue potting passage 224 and a second glue potting passage 223 .

[0156] Fig.23 The first glue pouring passage 224 corresponds to the edge region of the display module, and the first glue pouring passage 224 is used to form a first sub-encapsulation layer with a first refractive index in the edge region of the display module.

[0157] The second glue pouring passage 223 corresponds to the non-edge region of the display module and is used to form a second sub-encapsulation layer with a second refractive index in the non-edge region of the display module.

[0158] Specifically, the first glue pouring passage 224 and the second glue pouring passage 223 are isolated from each other, and the first sub-packaging layer and the second sub-packaging layer together constitute the packaging layer 51 of the display module 50. The first sub-packaging layer is used to reduce the influence of the edge area of ​​the packaging layer on the optical path from the inside of the packaging layer 51 to the outside of the packaging layer 51, so as to equalize the brightness of the joints between multiple display modules.

[0159] The first glue pouring passage 224 and the second glue pouring passage 223 can be implemented by mutually isolated pipes, and the fluid pressures in the two pipes can be the same or different. The glue pouring amount of a single glue pouring nozzle 222 of the first glue pouring passage 224 and a single glue pouring nozzle 222 of the second glue pouring passage 223 can be the same or different. The first glue pouring passage 224 and the second glue pouring passage 223 can have a single row or multiple rows of glue pouring nozzles 222, respectively. For example, the number of glue pouring nozzles 222 of the second glue pouring passage 223 can be more than the number of glue pouring nozzles 222 of the first glue pouring passage 224.

[0160] In some embodiments, the glue dispensing amount of a single glue dispensing nozzle corresponding to the edge area is different from the glue dispensing amount of a single glue dispensing nozzle corresponding to the non-edge area.

[0161] Fig.24 A schematic cross-sectional structure diagram of a glue filling machine provided in another embodiment of the present disclosure.

[0162] like Fig.24 As shown, the opening size of the single glue pouring nozzle 222 ′ corresponding to the edge area is smaller than the opening size of the single glue pouring nozzle 222 in the non-edge area.

[0163] For example, the ratio of the first glue injection amount to the second glue injection amount ranges from 70% to 90%, wherein the first glue injection amount is the glue injection amount of a single glue injection nozzle 222' corresponding to the edge area of ​​the display module, and the second glue injection amount is the glue injection amount of a single glue injection nozzle 222 corresponding to the non-edge area of ​​the display module. In the above manner, the glue injection amount of one path in the edge area can be between 70% and 90% of the glue injection amount of one path in other areas, thereby avoiding glue overflow.

[0164] It should be noted that in order to achieve a ratio range of 70% to 90% of the first glue pouring amount to the second glue pouring amount, in addition to changing the opening size of the nozzle of the first glue pouring passage 224, it can also be achieved by changing the process parameters of the first glue pouring passage 224, such as changing the fluid pressure, glue pouring time, etc., which are not limited here.

[0165] The glue potting machine provided in the embodiment of the present disclosure can conveniently form different refractive indices in the edge area and non-edge area of ​​the packaging layer to weaken the convergence of the light path.

[0166] The glue dispensing machine provided in the embodiment of the present disclosure transforms the original glue dispensing machine into two glue dispensing passages, respectively dispensing materials with different refractive indices, thereby improving the problem of uneven brightness at the joints of the packaging layers. In addition, the materials with different refractive indices can be made of conventional transparent materials, and low-refractive-index microcrystalline particles can be mixed in the conventional transparent materials, so that the two will not cause color difference when the glue is dispensed and integrated.

[0167] Another aspect of the present disclosure provides a display device.

[0168] Fig.25 A schematic diagram of the structure of a display device provided in an embodiment of the present disclosure.

[0169] like Fig.25 As shown, the display device 2500 includes one or more display modules as shown above.

[0170] In addition, the display device 2500 may include one or more processors 2510 and a computer-readable storage medium 2520 .

[0171] Specifically, the processor 2510 may include, for example, a general-purpose microprocessor, an instruction set processor and / or a related chipset and / or a special-purpose microprocessor (eg, an application-specific integrated circuit (ASIC)), etc. The processor 2510 may also include an onboard memory for cache purposes.

[0172] Computer-readable storage medium 2520, for example, can be a non-volatile computer-readable storage medium, and specific examples include but are not limited to: magnetic storage devices, such as magnetic tapes or hard disks (HDDs); optical storage devices, such as compact disks (CD-ROMs); memories, such as random access memory (RAM) or flash memory, etc.

[0173] The computer-readable storage medium 2520 may include a program 2521, which may include code / computer-executable instructions that, when executed by the processor 2510, cause the processor 2510 to perform image display data processing. For example, in an example embodiment, the code in the program 2521 may include one or more program modules, such as program module 2521A, program module 2521B, ...

[0174] In some embodiments, the display device 2500 may be: a television, a monitor, a digital photo frame, a mobile phone, a smart watch, a tablet computer, or any other product or component with display and camera functions.

[0175] Although the present disclosure is described in conjunction with the accompanying drawings, the embodiments disclosed in the drawings are intended to exemplify the embodiments of the present disclosure and should not be construed as limiting the present disclosure. The dimensional ratios in the drawings are merely illustrative and should not be construed as limiting the present disclosure.

[0176] The above embodiments are merely illustrative of the principles and structures of the present disclosure, and are not intended to limit the present disclosure. It should be understood by those skilled in the art that any changes and improvements made to the present disclosure without departing from the overall concept of the present disclosure are within the scope of the present disclosure. The scope of protection of the present disclosure shall be subject to the scope defined by the claims of the present disclosure.

Claims

1. A display module, wherein a plurality of the display modules are used for splicing for display, and the display module comprises: A light source and an encapsulation layer covering a light-emitting side of the light source, wherein the encapsulation layer includes an edge region located at a joint position of at least two display modules, and the edge region of the encapsulation layer includes a side region of the encapsulation layer; as well as an optical brightness adjustment structure, wherein the optical brightness adjustment structure is arranged in an edge region of the encapsulation layer, Wherein, the optical brightness adjustment structure is configured to: control the optical path of at least the outgoing light from the light source at the splicing position to equalize the brightness of the splicing position; The optical brightness adjustment structure includes: a refractive index adjustment structure, the refractive index adjustment structure is used to reduce the refractive index of the edge area of ​​the encapsulation layer to reduce the internal deviation of the output light of the light source and achieve the reduction of the convergence of the light path; The refractive index of the material in the edge region of the encapsulation layer is lower than the refractive index of the material in the non-edge region of the encapsulation layer; or The material of the edge region of the encapsulation layer includes doped material or mixed material.

2. The display module according to claim 1, wherein: The material of the refractive index adjustment structure includes an edge region encapsulation material and a microcrystalline structure dispersed in the edge region encapsulation material.

3. The display module according to claim 2, wherein: The edge region encapsulation material is the same as the non-edge region encapsulation material of the encapsulation layer.

4. The display module according to any one of claims 1 to 3, further comprising: A driving circuit board multiplexed as a substrate base plate; The light source comprises a light emitting diode, and the light emitting diode is arranged on a side of the driving circuit board away from the supporting surface; The packaging layer is arranged on a side of the driving circuit board away from the supporting surface and wraps a plurality of light emitting diodes.

5. A display device, comprising: The display module according to any one of claims 1 to 4; case; Gap layer; The display module is detachably fixed on the shell, the gap layer is located between adjacent display modules, the thickness of the gap layer is determined by the distance between two adjacent packaging layers, and the refractive index of the gap layer is smaller than the refractive index of the packaging layer.

6. A mold, comprising: main body; as well as A complementary optical brightness adjustment structure is provided on the body, The complementary optical brightness adjustment structure is used to form an optical brightness adjustment structure in an edge region of an encapsulation layer of a display module, the optical brightness adjustment structure is complementary in shape to the complementary optical brightness adjustment structure, and the optical brightness adjustment structure is configured to: control the optical path of at least the outgoing light from the light source in the encapsulation layer at the splicing position of the encapsulation layer to homogenize the optical display effect of the splicing position; The optical brightness adjustment structure includes: a refractive index adjustment structure, the refractive index adjustment structure is used to reduce the refractive index of the edge area of ​​the encapsulation layer to reduce the internal deviation of the output light of the light source and achieve the reduction of the convergence of the light path; The refractive index of the material in the edge region of the encapsulation layer is lower than the refractive index of the material in the non-edge region of the encapsulation layer; or The material of the edge region of the encapsulation layer includes doped material or mixed material.

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