A three-dimensional simulation method for micro-milling of anisotropic KDP functional crystal materials based on ABAQUS

Abstract

The present invention provides a three-dimensional simulation method of the micro-milling process of anisotropic KDP functional crystal materials based on ABAQUS, which belongs to the field of computer-aided design and processing technology of optical components. To solve the problem that the existing simulation method cannot accurately predict the micro-milling process of anisotropic KDP materials from three dimensions. It includes: step one, constructing a three-dimensional assembly model of the processing process; step two, setting the total length of the analysis step time and semi-automatic mass scaling and setting the output variables; step three, constructing an anisotropic constitutive model of the workpiece; step four, meshing the milling cutter and the KDP crystal element respectively; step five, simulating the contact state between the milling cutter and the element; step six, constraining the model's degrees of freedom and setting the processing parameters; step seven, solving the model, repeating the operations of steps two to seven until the simulation results converge; step eight, outputting the simulation results. The method of the present invention can accurately describe the micro-milling process of anisotropic KDP crystal materials in all directions.

Description

Technical Field

[0001] The present invention relates to the technical field of computer-aided design and processing of optical elements, and in particular to a three-dimensional simulation method of a micro-milling process of anisotropic KDP functional crystal materials based on ABAQUS. Background Art

[0002] In order to solve the increasingly prominent energy and environmental problems, China, the United States, Britain, France and other countries have built laser-driven inertial confinement nuclear fusion systems to develop new energy sources with sufficient reserves and clean and environmentally friendly. As the only large-size optical component that can be applied to this system at this stage, KDP crystals are widely used in the form of photoelectric switches and frequency doubling conversion components. However, when serving in laser nuclear fusion systems, the incident high-energy laser beam can easily cause different forms of laser damage points on the surface of KDP functional crystal components. Once these damage points are generated, they will expand rapidly during the subsequent laser targeting process, which will seriously affect the optical performance and service life of KDP functional crystal components. Domestic and foreign studies have shown that using ball-end milling cutters for high-speed micro-milling to repair and remove the initial damage points on the crystal surface is the most effective method to inhibit the growth of laser damage points on the surface of KDP functional crystal components and prolong their service life.

[0003] Since the micro-milling process of KDP crystal material is a complex process, it not only involves elastic mechanics, plastic mechanics and fracture mechanics, but also the cutting quality will be affected by factors such as tool shape and chip flow. At the same time, the residual stress and residual strain on the cutting surface will seriously affect the service life of the crystal. Therefore, compared with cutting simulation software such as Deform, ABAQUS software with powerful nonlinear processing capabilities is often used to simulate the micro-milling process to conduct quantitative analysis and research on the cutting mechanism, thereby reducing the experimental workload, providing a simple way to optimize the micro-milling process parameters, and accelerating the optimization process of the entire processing process. However, the current simulation method of KDP crystal micro-milling process based on ABAQUS has the following shortcomings: (1) In the simulation method of KDP functional crystal material micro-milling process based on ABAQUS, the cutting process is usually simplified to an orthogonal cutting process, and the influence of the actual shape of the ball-end milling cutter is not considered, which seriously reduces the authenticity of the micro-milling simulation results and makes it difficult to accurately predict the chip formation process during micro-milling; (2) At present, the micro-milling simulation model based on ABAQUS is usually simplified to a two-dimensional simulation model, which cannot fully reflect the milling process from three dimensions. The magnitude and distribution of physical quantities such as process stress, strain and cutting force; at the same time, there are also great limitations in reproducing the surface morphology of KDP crystal after micro-milling. (3) KDP crystal is a soft, brittle and difficult-to-process material with extremely strong anisotropy of mechanical properties. At present, when simulating based on ABAQUS, a constitutive model suitable for describing the anisotropic material properties of its own mechanical properties has not been established. It is impossible to reproduce the anisotropy of cutting force during micro-milling through simulation methods, which makes it impossible for existing simulation methods to accurately predict the micro-milling process and surface morphology of KDP crystal materials. Summary of the invention

[0004] The present invention adopts the following technical solutions to solve the above technical problems:

[0005] The present invention provides a three-dimensional simulation method for the micro-milling process of anisotropic KDP functional crystal materials based on ABAQUS, comprising the following steps:

[0006] Step 1: Build a 3D model of the KDP crystal element through the Part function module of ABAQUS software, build a 3D model of the milling cutter through 3D design software, and then assemble and position the milling cutter and the KDP crystal element in the Assembly function module according to their relative positional relationship to obtain a 3D assembly model of the KDP crystal material micro-milling process;

[0007] Step 2: In the Step analysis function module, set the total length of the analysis step time and semi-automatic quality scaling, and set the output variables;

[0008] Step 3: In the Property function module, set the density of the KDP crystal element, set the elastic stage parameters, the elastic stage parameters are the elastic matrix obtained according to the stress-strain matrix, set the plastic stage parameters, the plastic stage parameters include stress value and strain value, and anisotropic yield stress ratio, set the shear damage stage parameters, the shear damage stage parameters include fracture strain value and failure displacement value, and obtain the anisotropic constitutive model of the KDP crystal workpiece;

[0009] Step 4: In the Mesh function module, determine the mesh size according to the set failure displacement value, and mesh the milling cutter and KDP crystal element respectively;

[0010] Step 5. In the Interaction function module, set the contact properties, the interaction area between the milling cutter and the component, and the constraint of the milling cutter as a rigid body, simulate the contact state between the milling cutter and the KDP crystal component, and reproduce the surface morphology of the KDP crystal component after micro-milling.

[0011] Step 6: In the Load function module, the degrees of freedom of the milling cutter and the KDP crystal element are constrained and the processing parameters are set to obtain a three-dimensional simulation model of the micro-milling process of the anisotropic KDP crystal element;

[0012] The constrained milling cutter degree of freedom is the rotational degree of freedom in the axial direction, and the freedom of the KDP crystal element is the translational degree of freedom in the feed direction; the process parameters include the spindle speed and the feed speed of the workpiece;

[0013] Step 7: Submit the three-dimensional simulation model of the micro-milling process of the anisotropic KDP crystal element to the solver in the Job analysis function module for calculation, and repeat the operations of steps 2 to 7 for the obtained results until the simulation results converge;

[0014] Step 8. View the simulation data results in the Visualization post-processing module and conduct theoretical analysis on the simulation results to provide a reference for the optimization of micro-milling process parameters for anisotropic KDP crystal components.

[0015] Optionally, the three-dimensional design software in step one is SolidWorks.

[0016] Optionally, the specific method for obtaining the elasticity matrix in step 3 is:

[0017] Since KDP crystal belongs to the tetragonal system, according to the basic theory of crystallography, the stress-strain relationship matrix of KDP crystal material is first constructed:

[0018]

[0019] where σ x , σ y , σ z is the normal stress; τ xy , τ yz , τ zx is the shear stress; x , ε y , ε z is the positive strain; x , γ y , γ z is the shear strain; C m is the elasticity matrix; C 11 , C 12 , C 13 , C 33 , C 44 , C 66 is the elastic constant of KDP crystal;

[0020] Then the elastic matrix C of KDP crystal material is obtained by photoelastic experiment. m , and C m Converted into elastic matrix for input into ABAQUS software:

[0021]

[0022] Optionally, the specific method for obtaining the yield stress ratio in step 3 is:

[0023] Using the Hill yield criterion, the formula for calculating the equivalent stress σ0 is expressed as:

[0024]

[0025] Among them, F, G, H, L, M, and N are constants obtained by testing the mechanical properties of KDP crystal materials in different directions, which can be determined by three uniaxial tensile tests along the anisotropic principal axes of the material in the directions of x, y, and z, and shear tests in the yoz, zox, and xoy planes;

[0026] The solution equation for the yield stress ratio is constructed based on constants F, G, H, L, M, and N:

[0027]

[0028]

[0029]

[0030]

[0031]

[0032]

[0033] Among them, R11, R22, R33, R 12 , R 13 , R 23 is the yield stress ratio;

[0034] The anisotropic yield stress ratio can be obtained by formulas (1) to (6).

[0035] Optionally, in the step 4, for a milling cutter with a complex and irregular contour, its grid unit is set to a tetrahedral grid and the grid division is performed using an autonomous grid division method; for a KDP crystal element with a simple and regular shape, its grid unit is set to a hexahedral grid and the grid division is performed using an autonomous division and local subdivision method; the failure displacement is set to 0.5 to 0.8 times the minimum grid size of the KDP crystal material to accurately simulate material separation during the cutting process.

[0036] Optionally, in step five, the contact attribute is set to penalty function friction, and the friction factor is set.

[0037] Compared with the prior art, the present invention has the following beneficial effects:

[0038] The present invention discloses a three-dimensional simulation method for the micro-milling process of anisotropic KDP functional crystal materials based on ABAQUS. First, in the simulation method of the present invention, a double-edged ball-end milling cutter is used as the tool component, and the important influence of the tool shape on the cutting process is considered, which not only improves the authenticity of the micro-milling simulation results, but also can reproduce the formation of chips in the micro-milling process, and provides an important basis and model means for the exploration of the crystal micro-milling repair mechanism.

[0039] 2. In the simulation method of the present invention, a three-dimensional simulation model of the micro-milling process of KDP crystal materials is constructed, which can not only fully reflect the size and distribution law of the physical quantities of stress, strain and cutting force in the micro-milling process, but also intuitively reproduce the surface morphology of the KDP crystal material after micro-milling, providing methods and means for predicting the surface quality of such crystal micro-milling.

[0040] 3. In the ABAQUS simulation of this method, a mechanical constitutive model considering the anisotropy of KDP crystal materials was constructed. This model can simulate the phenomenon of anisotropy of cutting force in the micro-milling process of this type of material, and can accurately simulate the micro-milling process of anisotropic KDP crystal materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 The present invention provides a flow chart of a three-dimensional simulation method for micro-milling of anisotropic KDP functional crystal materials in an embodiment of the present invention;

[0042] Figure 2 A three-dimensional assembly model of the micro-milling process of anisotropic KDP functional crystal material in an embodiment of the present invention;

[0043] Figure 3 A schematic diagram of mesh division of a micro-milling process model of anisotropic KDP functional crystal material in an embodiment of the present invention;

[0044] Figure 4 : is the relative position of the ball end mill and the KDP crystal in the embodiment of the present invention;

[0045] Figure 5 The simulation results of cutting forces in different cutting directions during micro-milling of KDP crystals in an embodiment of the present invention;

[0046] Figure 6 A three-dimensional simulation model of the micro-milling process of KDP functional crystal materials in an embodiment of the present invention;

[0047] Figure 7 The simulation results of the surface morphology and stress cloud map at different milling depths during the micro-milling process of the KDP crystal in the embodiment of the present invention;

[0048] Figure 8 This is the simulation result of the chip state during the micro-milling process of the KDP crystal in the embodiment of the present invention. DETAILED DESCRIPTION

[0049] In the description of the present invention, it should be noted that the terms "first", "second", and "third" mentioned in the embodiments of the present invention are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include one or more of the features.

[0050] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0051] like Figure 1 As shown, the present invention provides a three-dimensional simulation method for the micro-milling process of anisotropic KDP functional crystal materials based on ABAQUS, comprising the following steps:

[0052] Step 1: Figure 2As shown, the 3D model of the KDP crystal element is constructed by the Part function module of the ABAQUS software, and the 3D model of the milling cutter is constructed by the 3D design software. Then, according to the relative position relationship between the milling cutter and the KDP crystal element, the two are assembled and positioned in the Assembly function module to obtain the 3D assembly model of the micro-milling process of the KDP crystal material.

[0053] The three-dimensional design software is SolidWorks;

[0054] In the three-dimensional assembly model, the milling cutter is a ball-end milling cutter with a diameter of 500 μm; the KDP crystal element is a rectangular element with a size of 100 μm, a width of 100 μm, and a height of 10 μm; and the inclination angle of the ball-end milling cutter is 30° to the vertical direction, and the relative position with the KDP crystal is adjusted at the same time, and the relative position can simulate the milling depth.

[0055] Step 2: In the Step analysis function module, set the total length of the analysis step time and semi-automatic quality scaling, and set the output variables;

[0056] According to the ball end milling cutter speed of 50000r / min and its rotation angle of 60° in the actual processing process, the total length of the analysis step is 0.0002s; in order to improve the calculation efficiency without losing too much model accuracy, the semi-automatic quality scaling sets the magnification factor to 100, and the output variable is the cutting force.

[0057] Step 3, in the Property function module, set the density of the KDP crystal element, set the elastic stage parameters, the elastic stage parameters are the elastic matrix obtained according to the stress-strain matrix, set the plastic stage parameters, the plastic stage parameters include stress value and strain value, and anisotropic yield stress ratio, shear damage parameters, the shear damage parameters include fracture strain value and failure displacement value, and obtain the anisotropic constitutive model of the KDP crystal workpiece;

[0058] The density of the component is set to 2344kg / m 3 ;

[0059] Since KDP crystal belongs to the tetragonal system, according to the basic theory of crystallography, the stress-strain relationship of KDP crystal material is first constructed as follows:

[0060]

[0061] where σ x , σ y , σ z is the normal stress; τ xy , τ yz , τ zx is the shear stress; x, ε y , ε z is the positive strain; x , γ y , γ z is the shear strain; C m is the elasticity matrix; C 11 , C 12 , C 13 , C 33 , C 44 , C 66 is the elastic constant of KDP crystal;

[0062] Then the elastic matrix C of KDP crystal material is obtained by photoelastic experiment. m , and C m Converted into elastic matrix for input into ABAQUS software:

[0063]

[0064] The elastic matrix parameters that need to be input into ABAQUS are obtained as shown in Table 1;

[0065] Table 1

[0066] <![CDATA[D 1111 ]]> <![CDATA[D 1122 ]]> <![CDATA[D 2222 ]]> <![CDATA[D 1133 ]]> <![CDATA[D 2233 ]]> <![CDATA[D 3333 ]]> <![CDATA[D 1212 ]]> <![CDATA[D 1313 ]]> <![CDATA[D 2323 ]]> 71650 -6270 71650 14940 14940 56400 12480 6210 6210

[0067] Using the Hill yield criterion, the formula for calculating the equivalent stress σ0 is expressed as:

[0068]

[0069] Among them, F, G, H, L, M, and N are constants obtained by testing the mechanical properties of KDP crystal elements in different directions, which can be determined by three uniaxial tensile tests along the main axes of material anisotropy x, y, and z, and shear tests in the yoz, zox, and xoy planes;

[0070] The solution equation for the yield stress ratio is constructed based on constants F, G, H, L, M, and N:

[0071]

[0072]

[0073]

[0074]

[0075]

[0076]

[0077] Among them, R11, R22, R33, R 12 , R 13 , R 23 is the yield stress ratio;

[0078] The anisotropic yield stress ratio shown in Table 2 is obtained by using formulas (1) to (6).

[0079] Table 2

[0080] <![CDATA[R 11 ]]> <![CDATA[R 22 ]]> <![CDATA[R 33 ]]> <![CDATA[R 12 ]]> <![CDATA[R 13 ]]> <![CDATA[R 23 ]]> 1 1.2 1.2 0.63 0.63 0.63

[0081] Step 4: In the Mesh function module, determine the mesh size according to the set failure displacement value, and mesh the milling cutter and KDP crystal element respectively;

[0082] Among them, Figure 3 As shown, for a milling cutter with a complex and irregular contour, its grid unit is set to a tetrahedral grid and the grid division is performed using an autonomous grid division method. For a KDP crystal element with a simple and regular shape, its grid unit is set to a hexahedral grid and the grid division is performed using an autonomous division and local subdivision method. The failure displacement is set to 0.5 to 0.8 times the minimum grid size of the KDP crystal material to accurately simulate material separation during the cutting process.

[0083] Step 5. In the Interaction function module, set the contact properties, the interaction area between the milling cutter and the component, and the constraint of the milling cutter as a rigid body, simulate the contact state between the milling cutter and the KDP crystal component, and reproduce the surface morphology of the KDP crystal component after micro-milling.

[0084] Among them, the contact property is set to penalty function friction, and the friction factor is set to 0.3.

[0085] Step 6: In the Load function module, constrain the degrees of freedom of the milling cutter and the KDP crystal element and set the processing parameters to obtain a three-dimensional simulation model of the micro-milling process of the anisotropic KDP crystal element;

[0086] The constrained milling cutter degree of freedom is the rotational degree of freedom in the axial direction, and the freedom of the KDP crystal element is the translational degree of freedom in the feed direction; the process parameters include the spindle speed and the feed speed of the workpiece;

[0087] Step 7: Submit the three-dimensional simulation model of the micro-milling process of the anisotropic KDP crystal element to the solver in the Job analysis function module for calculation, and repeat the operations of steps 2 to 7 for the obtained results until the simulation results converge.

[0088] Step 8. View the simulation data results in the Visualization post-processing module.

[0089] Theoretical Analysis of Simulation Results

[0090] As shown in Table 3, the simulation results under two sets of process parameters are analyzed;

[0091] Table 3

[0092] Serial number Spindle speed Feed speed Milling depth 1 50000r / min 1mm / s 2μm 2 50000r / min 1mm / s 5μm

[0093] 1. Cutting force simulation results:

[0094] Under the process parameters of No. 1 in Table 1, the ball end mill and KDP crystal are as follows Figure 4 (a) shows the first relative position. In the global coordinate system, the longitudinal section of the ball end mill is parallel to the YOZ plane, the rotation direction is clockwise, the KDP crystal is translated in the negative direction along the Y axis, and the milling method is positive milling. Figure 4 (b) The second relative position shows that in the global coordinate system, the longitudinal section of the ball-end milling cutter is parallel to the XOZ plane, the rotation direction is clockwise, the KDP crystal is translated in the negative direction along the X-axis, and the milling method is positive milling.

[0095] Depend on Figure 4 , Figure 5 It can be seen that the ball end mill processes the KDP crystal along the Y-axis direction and the X-axis direction respectively. As the milling direction changes, the cutting forces in the three directions, namely the lateral feed force, the feed force and the axial force, also change. The simulation data results are shown in Table 4. This shows that due to the strong anisotropic mechanical properties of the KDP crystal, the cutting force in the micro-milling process will change significantly with the change of the milling direction, which further illustrates the accuracy of the cutting force simulation of the model constructed by the method of the present invention.

[0096] Table 4

[0097] Transverse feed force Feed force Axial force First relative position 156.72mN 4.135mN 13.31mN Second relative position 167.90mN 2.18mN 13.35mN The difference between the two 11.18mN 1.955mN 0.04mN

[0098] 2. Surface morphology simulation results:

[0099] like Figure 6 and Figure 7 As shown, Figure 7 (a) is the surface morphology and stress cloud diagram of the cutting area obtained under the process parameters of No. 1 in Table 3. Figure 7 (b) is the surface morphology and stress cloud diagram of the cutting area obtained under the process parameters of No. 2 in Table 3. Figure 7 (a) It can be seen that the KDP crystal element has undergone plastic cutting, the simulated surface is flat, and no brittle fracture point appears; Figure 7(b) It can be seen that brittle cutting occurred in the KDP crystal element, and cracking points appeared on the simulated surface. The surface residual stress was greater than the surface residual stress value of the process parameter No. 1. This shows that with the increase of milling depth, when the undeformed chip thickness exceeds the critical cutting depth of brittle-ductile transition, the KDP crystal will not only undergo brittle-ductile transition during the micro-milling process, but also its repaired surface quality will be seriously reduced, thereby affecting the service life of the optical element.

[0100] 3. Chip formation simulation results:

[0101] like Figure 8 As shown in Table 3, under the process parameters of No. 2, segmented chips were produced due to brittle cutting of the KDP crystal, which further illustrates that the three-dimensional simulation method can reproduce the formation of chips in the micro-milling process, and provides an important basis and model means for the exploration of the crystal micro-milling repair mechanism.

[0102] Through the three-dimensional simulation method of the present invention, the phenomenon of cutting force anisotropy, surface morphology reproduction and chip formation reproduction during the micro-milling of KDP crystal components were obtained, which confirmed that the method of the present invention can provide an important basis and model means for the exploration of surface quality prediction and repair mechanism of micro-milling of KDP crystal components.

[0103] Although the present invention is disclosed as above, the protection scope of the present invention is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications will fall within the protection scope of the present invention.

Claims

1. A three-dimensional simulation method for micro-milling of anisotropic KDP functional crystal materials based on ABAQUS, characterized in that The steps include: Step 1: Build a 3D model of the KDP crystal element through the Part function module of ABAQUS software, build a 3D model of the milling cutter through 3D design software, and then assemble and position the milling cutter and the KDP crystal element in the Assembly function module according to their relative positional relationship to obtain a 3D assembly model of the KDP crystal material micro-milling process; Step 2: In the Step analysis function module, set the total length of the analysis step time and semi-automatic quality scaling, and set the output variables; Step 3: In the Property function module, set the density of the KDP crystal element, set the elastic stage parameters, the elastic stage parameters are the elastic matrix obtained according to the stress-strain matrix, set the plastic stage parameters, the plastic stage parameters include stress value and strain value, and anisotropic yield stress ratio, set the shear damage stage parameters, the shear damage stage parameters include fracture strain value and failure displacement value, and obtain the anisotropic constitutive model of the KDP crystal workpiece; Step 4: In the Mesh function module, determine the mesh size according to the set failure displacement value, and mesh the milling cutter and KDP crystal element respectively; Step 5. In the Interaction function module, set the contact properties, the interaction area between the milling cutter and the component, and the constraint of the milling cutter as a rigid body, simulate the contact state between the milling cutter and the KDP crystal component, and reproduce the surface morphology of the KDP crystal component after micro-milling. Step 6: In the Load function module, the degrees of freedom of the milling cutter and the KDP crystal element are constrained and the processing parameters are set to obtain a three-dimensional simulation model of the micro-milling process of the anisotropic KDP crystal element; The constrained milling cutter degree of freedom is the rotational degree of freedom in the axial direction, and the freedom of the KDP crystal element is the translational degree of freedom in the feed direction; the process parameters include the spindle speed and the feed speed of the workpiece; Step 7: Submit the three-dimensional simulation model of the micro-milling process of the anisotropic KDP crystal element to the solver in the Job analysis function module for calculation, and repeat the operations of steps 2 to 7 for the obtained results until the simulation results converge; Step 8. View the simulation data results in the Visualization post-processing module and conduct theoretical analysis on the simulation results to provide a reference for the optimization of micro-milling process parameters for anisotropic KDP crystal components.

2. The three-dimensional simulation method of the micro-milling process of anisotropic KDP functional crystal materials based on ABAQUS according to claim 1 is characterized in that The 3D design software described in step 1 is SolidWorks.

3. The three-dimensional simulation method of the micro-milling process of anisotropic KDP functional crystal materials based on ABAQUS according to claim 2 is characterized in that The specific method for obtaining the elasticity matrix in step 3 is: Since KDP crystal belongs to the tetragonal system, according to the basic theory of crystallography, the stress-strain relationship matrix of KDP crystal material is first constructed: where σ x , σ y , σ z is the normal stress; τ xy , τ yz , τ zx is the shear stress; x , ε y , ε z is the positive strain; xy , γ yz , γ zx is the shear strain; C m is the elasticity matrix; C 11 , C 12 , C 13 , C 33 , C 44 , C 55 and C 66 is the elastic constant of KDP crystal; Then the elastic matrix C of KDP crystal material is obtained by photoelastic experiment. m , and C m Converted into elastic matrix for input into ABAQUS software:

4. The three-dimensional simulation method of the micro-milling process of anisotropic KDP functional crystal materials based on ABAQUS according to claim 3 is characterized in that The specific method for obtaining the yield stress ratio in step 3 is: Using the Hill yield criterion, the formula for calculating the equivalent stress σ0 is expressed as: Among them, F, G, H, L, M, and N are constants obtained by testing the mechanical properties of KDP crystal materials in different directions, which can be determined by three uniaxial tensile tests along the anisotropic principal axes of the material in the directions of x, y, and z, and shear tests in the yoz, zox, and xoy planes; The solution equation for the yield stress ratio is constructed based on constants F, G, H, L, M, and N: Among them, R 11 , R 22 , R 33 , R 12 , R 13 , R 23 is the yield stress ratio; The anisotropic yield stress ratio can be obtained by formulas (1) to (6).

5. The three-dimensional simulation method of micro-milling process of anisotropic KDP functional crystal material based on ABAQUS according to claim 4 is characterized in that In the step 4, for the milling cutter with complex and irregular contour shape, its grid unit is set to a tetrahedral grid and the grid division is performed by the autonomous grid division method. For the KDP crystal element with a simple and regular shape, its grid unit is set to a hexahedral grid and the grid division is performed by the autonomous division and local subdivision method. The failure displacement is set to 0.5 to 0.8 times the minimum grid size of the KDP crystal material to accurately simulate the material separation during the cutting process.

6. The three-dimensional simulation method of micro-milling process of anisotropic KDP functional crystal material based on ABAQUS according to claim 5 is characterized in that In the step 5, the contact attribute is set to penalty function friction, and the friction factor is set.

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