Low-profile dual-band UWB antenna and electronic device
By designing a multi-layered low-profile dual-frequency UWB antenna, the problems of severe polarization loss and impure polarization were solved, achieving controllable antenna thickness, low profile, and high polarization purity, thus improving the reception efficiency of UWB signals and making it suitable for mobile communication devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU SOBEIDE COMM TECH CO LTD
- Filing Date
- 2022-06-13
- Publication Date
- 2026-06-02
AI Technical Summary
Existing UWB antennas suffer from severe polarization loss and impure polarization in consumer terminal devices, resulting in reduced working efficiency. Furthermore, traditional implementation methods have high requirements for clearance height and area, making them difficult to deploy in limited spaces.
Design a low-profile dual-frequency UWB antenna with a multi-layer structure, including a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer and a third metal layer stacked in sequence. The radiating element is divided into low-frequency and high-frequency parts by short-circuited metal pillars, and fed by a feed microstrip line and a signal transmission line to realize signal transmission and radiation.
It achieves controllable antenna thickness, low profile, single current flow direction, and high polarization purity, improving the reception efficiency and bidirectional working efficiency of UWB signals, and is suitable for mobile communication devices with compact internal space.
Smart Images
Figure CN115173024B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of antenna technology, and in particular to a low-profile dual-frequency UWB antenna and electronic device. Background Technology
[0002] Spatial positioning technology is divided into outdoor and indoor positioning technologies. Outdoor positioning is mainly based on satellite positioning technology, including the four major satellite positioning systems: GPS, BeiDou, Galileo, and GLONASS. With the increasing scale of modern buildings, the increasing frequency of underground construction, and the demand for IoT and big data analytics, the demand for indoor positioning technology is growing. Traditional satellite positioning signals are susceptible to interference from buildings, thus creating a significant opportunity for indoor positioning technology. UWB (Ultra-Wideband) technology is a wireless communication technology that uses nanosecond-level narrow pulses for data transmission. With a spectrum range of 3.1GHz-10.6GHz and a bandwidth of over 500MHz, it not only provides more accurate positioning capabilities than other indoor positioning technologies such as WiFi and Bluetooth, but also boasts numerous advantages such as high reliability, strong resistance to multipath interference, low latency, and low power consumption, making it a technology with very broad application prospects.
[0003] With the advancement of science and technology, the antennas in mobile phones and other terminal devices have become increasingly diverse, such as 4G LTE main antennas and diversity antennas, Bluetooth antennas, WiFi antennas, and 5G antennas (divided into Sub 6GHz antennas and millimeter-wave antennas). Most of these antennas have high requirements for clearance height and clearance area, thus occupying advantageous positions on the top, bottom, left, and right bezels inside the phone. This makes it difficult to implement the newly added UWB antenna using the traditional form of RF coaxial cable + metal spring feet + plastic bracket LDS or metal frame.
[0004] UWB antennas in consumer terminal devices typically operate on two channels: channel 5 and channel 9. Channel 5 operates at a center frequency of approximately 6.5 GHz, while channel 9 operates at approximately 8 GHz. Common methods for achieving dual-band radiation in microstrip antennas include dividing the antenna radiator into upper and lower layers, or creating slots on the antenna surface. The former requires a higher overall thickness of the dielectric layer, while the latter, creating slots on the antenna surface, alters the current flow, leading to impure antenna polarization. Impure polarization increases polarization loss during communication with surrounding UWB devices, thus reducing operating efficiency. Summary of the Invention
[0005] This application aims to provide a low-profile dual-band UWB antenna and electronic device, wherein the low-profile dual-band UWB antenna includes: multiple radiating elements, each radiating element comprising a low-frequency radiating element and a high-frequency radiating element, the low-frequency radiating element and the high-frequency radiating element being separated by a row of short-circuited metal pillars and fed separately by feed microstrip lines. This solves the problems of severe antenna polarization loss and impure polarization in existing technologies.
[0006] This application provides a low-profile dual-band UWB antenna, comprising: a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer and a third metal layer stacked sequentially.
[0007] The first metal layer includes: a first metal ground, multiple radiator units and multiple feed microstrip lines. The multiple radiator units are disposed with clearance on the first metal ground. The feed microstrip lines are connected to the radiator units. Each radiator unit is divided into two parts with different areas by a row of short-circuited metal pillars. The larger part is a low-frequency radiator unit, and the smaller part is a high-frequency radiator unit.
[0008] A signal transmission line is disposed on the second metal layer, and the signal transmission line is connected to the feed microstrip line by a first blind hole metal pillar passing through the first dielectric layer.
[0009] The third metal layer includes a third metal ground and a plurality of metal signal pads. The metal signal pads are disposed on the third metal ground and are connected to the signal transmission line through a second blind via metal post. The second blind via metal post passes through the second dielectric layer. The metal signal pads can be soldered to board-to-board connectors, which are used to transmit UWB signals.
[0010] A second metal ground is also provided on the second metal layer. The first metal ground, the first dielectric layer, the second metal ground, the second dielectric layer and the third metal ground are electrically connected in sequence through grounding metal posts so that the three metal layers share the same metal ground.
[0011] Optionally, multiple pores are provided on the first metal ground, the second metal ground, and the third metal ground.
[0012] Optionally, the feeding microstrip line includes a high-frequency feeding microstrip line and a low-frequency feeding microstrip line. One end of the high-frequency feeding microstrip line is connected to the high-frequency radiator unit, and the other end is connected to the first blind hole metal post. One end of the low-frequency feeding microstrip line is connected to the low-frequency radiator unit, and the other end is connected to the first blind hole metal post.
[0013] Optionally, one end of the signal transmission line is connected to the first blind hole metal post, and the other end is connected to the second blind hole metal post.
[0014] Optionally, the grounding metal post is located on both sides of the signal transmission line and is in close contact with the signal transmission line.
[0015] Optionally, the second metal layer further includes: a metal pad disposed on the second metal ground, and the short-circuit metal post passing through the metal pad.
[0016] Optionally, the first metal layer further includes a connector reinforcing plate welding area, wherein the reinforcing plate welding area is provided with longitudinal and transverse grooves for welding the reinforcing plate.
[0017] Optionally, the materials of the first dielectric layer and the second dielectric layer are liquid crystal polymers, polytetrafluoroethylene, or modified polyimide.
[0018] Optionally, the high-frequency radiator unit radiates signals in the 8GHz frequency band, and the low-frequency radiator unit radiates signals in the 6.5GHz frequency band.
[0019] This application also provides an electronic device that includes the aforementioned low-profile dual-frequency UWB antenna.
[0020] As can be seen from the above technical solutions, this application provides a low-profile dual-frequency UWB antenna, comprising: a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer, and a third metal layer stacked sequentially; the first metal layer includes: a first metal ground, multiple radiator elements, and multiple feed microstrip lines, wherein the multiple radiator elements are disposed with clearance on the first metal ground, the feed microstrip lines are connected to the radiator elements, and the radiator elements are divided into two parts with different areas by a row of short-circuited metal pillars, the larger part being the low-frequency radiator element and the smaller part being the high-frequency radiator element; a signal transmission line is disposed on the second metal layer, the signal transmission line passing through the first metal ground. A first blind via metal post of a dielectric layer is connected to the feed microstrip line; the third metal layer includes a third metal ground and a plurality of metal signal pads, the metal signal pads are disposed on the third metal ground, the metal signal pads are connected to the signal transmission line through a second blind via metal post, the second blind via metal post passes through the second dielectric layer, the metal signal pads can be soldered to board-to-board connectors, the board-to-board connectors are used to transmit UWB signals; a second metal ground is also disposed on the second metal layer, the first metal ground, the first dielectric layer, the second metal ground, the second dielectric layer and the third metal ground are electrically connected sequentially through a grounding metal post, so that the three metal layers share the same metal ground.
[0021] In practical applications, the low-profile dual-frequency UWB antenna provided in this application transmits the UWB signal from the motherboard of the electronic device through a board-to-board connector to a metal signal pad. The metal signal pad then transmits the UWB signal through a second blind-hole metal post to a signal transmission line, which in turn transmits it to a first blind-hole metal post. From there, the signal is transmitted to a feed microstrip line, which powers both the high-frequency and low-frequency radiating elements. The radiating elements convert the current signal into an electromagnetic wave signal, which propagates into free space. The low-profile dual-frequency UWB antenna provided in this application features controllable thickness, a low profile, and a unidirectional current flow, resulting in high horizontal polarization purity. This is beneficial for receiving UWB signals with the same polarization from surrounding areas, thus improving bidirectional operating efficiency. Attached Figure Description
[0022] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 An exploded view of the low-profile dual-frequency UWB antenna provided in the embodiments of this application;
[0024] Figure 2 This is a planar schematic diagram of the first metal layer covering the first dielectric layer;
[0025] Figure 3 This is a planar schematic diagram of the second metal layer covering the second dielectric layer;
[0026] Figure 4 This is a planar schematic diagram of the third metal layer;
[0027] Figure 5 A schematic diagram of the return loss of the low-profile dual-band UWB antenna in the operating frequency band provided in the embodiments of this application;
[0028] Figure 6 This is a schematic diagram of the current flow direction of a radiating element.
[0029] In the picture:
[0030] 1-First metal layer, 101-First metal ground, 102-Radiator element, 10201-High-frequency radiator element, 10202-Low-frequency radiator element, 103-Feed microstrip line, 10301-High-frequency feed microstrip line, 10302-Low-frequency feed microstrip line, 104-Reinforcing plate area, 2-First dielectric layer, 3-Second metal layer, 301-Second metal ground, 302-Signal transmission line, 303-Metal pad, 4-Second dielectric layer, 5-Third metal layer, 501-Third metal ground, 502-Metal signal pad, 6-Ground metal post, 7-Vacuum, 8-Short-circuit metal post, 9-First blind via metal post, 10-Second blind via metal post. Detailed Implementation
[0031] The technical solutions of the embodiments of this application will be described completely and clearly below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0032] See Figure 1 This is an exploded view of the low-profile dual-frequency UWB antenna provided in an embodiment of this application; see also Figure 2 This is a planar schematic diagram showing the first metal layer covering the first dielectric layer; see also Figure 3 This is a planar schematic diagram showing the second metal layer covering the second dielectric layer; see also Figure 4 This is a planar schematic diagram of the third metal layer.
[0033] One embodiment of this application provides a low-profile dual-frequency UWB antenna, comprising: a first metal layer 1, a first dielectric layer 2, a second metal layer 3, a second dielectric layer 4, and a third metal layer 5 stacked sequentially.
[0034] The first metal layer 1 includes: a first metal ground 101, a plurality of radiator units 102 and a plurality of feed microstrip lines 103. The plurality of radiator units 102 are disposed on the first metal ground 101 with clearance. The feed microstrip lines 103 are connected to the radiator units 102. The radiator unit 102 is divided into two parts with different areas by a row of short-circuited metal pillars 8. The larger part is the low-frequency radiator unit 10202 and the smaller part is the high-frequency radiator unit 10201.
[0035] A signal transmission line 302 is provided on the second metal layer 3. The signal transmission line 302 is connected to the feed microstrip line 103 by a first blind hole metal post 9 passing through the first dielectric layer 2.
[0036] The third metal layer 5 includes a third metal ground 501 and a plurality of metal signal pads 502. The metal signal pads 502 are disposed on the third metal ground 501. The metal signal pads 502 are connected to the signal transmission line 302 through a second blind via metal post 10. The second blind via metal post 10 passes through the second dielectric layer 4. The metal signal pads 502 can be soldered to board-to-board connectors, which are used to transmit UWB signals.
[0037] A second metal ground 301 is also provided on the second metal layer 3. The first metal ground 101, the first dielectric layer 2, the second metal ground 301, the second dielectric layer 4 and the third metal ground 501 are electrically connected in sequence through the grounding metal post 6 so that the three metal layers share the same metal ground.
[0038] The integrated transmission line antenna design provided in this application avoids unnecessary soldering processes and also avoids the problem of poor contact of the metal spring feet in existing UWB antennas.
[0039] It should be noted that the second metal ground 301 and the signal transmission line 302 both belong to the second metal layer. The second metal ground 301 and the signal transmission line 302 are on the same plane. The signal transmission line 302 is located in the middle of the second metal ground 301 and does not contact the second metal ground 301.
[0040] The superior metal signal pads 502 allow for SMT (reflow soldering) of BTB connectors (board-to-board connectors).
[0041] In this embodiment, the thicknesses of the first metal layer 1, the second metal layer 3, and the third metal layer 5 can be selected as 12 μm or 18 μm, and the thicknesses of the first dielectric layer 2 and the second dielectric layer 4 can be selected as 50 μm or 100 μm. The dielectric layer thickness can be selected as needed; generally, the thicker the dielectric layer, the lower the transmission line loss and the wider the antenna bandwidth. More preferably, this embodiment selects a metal layer thickness of 12 μm and a dielectric layer thickness of 100 μm. Therefore, the overall thickness of the low-profile dual-band UWB antenna is less than 300 μm, resulting in a very low profile, making it very suitable for mobile communication electronic devices with compact internal space.
[0042] It should also be noted that the terms "multiple" and "multiple lines" mentioned in the embodiments of this application, such as multiple radiator units 102, multiple feed microstrip lines 103, multiple signal transmission lines 302, and multiple metal signal pads 502, can be simply selected according to actual production needs. The number of multiple radiator units 102, multiple feed microstrip lines 103, multiple signal transmission lines 302, multiple metal signal pads 502, the number of first blind via metal pillars 9, the number of second blind via metal pillars 10, and the number of rows of short-circuit metal pillars 8 are corresponding in quantity. More preferably, in this embodiment, the number is 3. In addition, the number of multiple radiator units 102, multiple feed microstrip lines 103, multiple signal transmission lines 302, multiple metal signal pads 502, the number of first blind via metal pillars 9, the number of second blind via metal pillars 10, and the number of rows of short-circuit metal pillars 8 are not necessarily required to be exactly the same. There can be slight differences, such as thickness, length, and area, while the performance remains basically unchanged.
[0043] Since the low-profile dual-band UWB antenna provided in this application embodiment is made of multiple layers (metal plate and dielectric layer), regardless of whether low-temperature or high-temperature lamination is used, lamination defects such as glue overflow, bubbles, and delamination may occur during the lamination process. These defects are more severe when there are large areas of metal layer coverage in each layer. To reduce these defects, the requirements for the lamination process environment and process parameters are very high, such as baking and dehumidification before lamination, strengthening cleaning management during the lamination process, continuously adjusting the appropriate pressure intensity, and appropriately slowing down the heating rate. Strict control of each process will increase time and price costs.
[0044] To reduce the complexity of the lamination process and improve yield, multiple pores 7 are further provided on the first metal ground 101, the second metal ground 301, and the third metal ground 501. This facilitates the removal of air bubbles generated during lamination, prevents adhesive overflow, and promotes the fusion of different molten media to prevent delamination. This reduces process complexity, improves product yield, and saves costs. Furthermore, air bubbles generated during lamination can be discharged through the pores 7. At high temperatures, media such as LCP and adhesive sheets become molten. If the copper plating area is too large during lamination, improper pressure and temperature control can cause the molten media to overflow. If multiple small pores 7 are provided in the metal layers, the molten media of different layers will fuse together through the pores 7, not only preventing overflow but also increasing the bonding strength between the two layers, thus increasing peel strength and resolving delamination and other defects.
[0045] It should be noted that the third metal ground 501 of the third metal layer 5 does not have vents 7 in the vertical projection area of the multiple radiator units 102 and the signal transmission line 302, ensuring the integrity of the RF reference ground. Furthermore, the area without grounding metal pillars 6 and vents 7 is the bending area of the transmission line; if the grounding metal pillars 6 were placed in the bending area, there would be a significant risk of breakage. Additionally, the signal transmission line 302 can be designed with reduced copper or a microstrip line as needed.
[0046] Furthermore, the feeding microstrip line 103 includes a high-frequency feeding microstrip line 10301 and a low-frequency feeding microstrip line 10302. One end of the high-frequency feeding microstrip line 10301 is connected to the high-frequency radiator unit 10201, and the other end is connected to the first blind-hole metal post 9. One end of the low-frequency feeding microstrip line 10302 is connected to the low-frequency radiator unit 10202, and the other end is connected to the first blind-hole metal post 9. The feeding microstrip line 103 can be used to feed the radiator unit 102. The feeding microstrip line 103 is divided into two parts by the first blind-hole metal post 9, wherein the high-frequency feeding microstrip line 10301 feeds the high-frequency radiator unit 10201, and the low-frequency feeding microstrip line 10302 feeds the low-frequency radiator unit 10202.
[0047] Furthermore, one end of the signal transmission line 302 is connected to the first blind hole metal post 9, and the other end is connected to the second blind hole metal post 10. The UWB signal can be transmitted from the second blind hole metal post 10 to the first blind hole metal post 9 via the signal transmission line 302.
[0048] Furthermore, the grounding metal posts 6 are located on both sides of the signal transmission line 302 and are in close contact with the signal transmission line 302. The grounding metal posts 6 are mainly arranged on both sides of the signal transmission line 302. In addition to electrically connecting the three metal grounds (first metal ground 101, second metal ground 301 and third metal ground 501), they can also reduce electromagnetic radiation between signals, improve the transmission efficiency of the signal transmission line 302 and increase the isolation between signals.
[0049] Furthermore, the second metal layer 3 also includes a metal pad 303, which is disposed on the second metal ground 301, and the short-circuit metal post 8 passes through the metal pad 303. The short-circuit metal post 8 is equivalent to the short-circuit metal sheet of a conventional PIFA antenna. The inductive component of the short-circuit metal post 8 structure can compensate for the capacitive component formed between the radiator element 102 and the third metal ground 501 of the third metal layer 5, thereby achieving impedance matching without changing the resonant frequency. In addition, the impedance matching can be further optimized by changing the positions of the high-frequency feed microstrip line 10301 and the low-frequency feed microstrip line 10302 connected to the radiator element 102, so as to maximize the radiation efficiency of high and low frequency signals. The third metal ground 501 in the third metal layer 5 is the reference ground of the radiator element 102. The greater the distance between the radiator element 102 and the reference ground, the wider the bandwidth. Therefore, except for the metal pad 303 where the short-circuit metal pillar 8 is located, all other metal grounds in the projection area of the second metal layer 3 below the radiator unit 102 need to be removed, otherwise it will affect the bandwidth of the antenna.
[0050] Furthermore, the first metal layer 1 also includes a connector reinforcing plate welding area 104, which has longitudinal and transverse grooves for welding the reinforcing plate. The reinforcing plate is used to increase the structural strength of the connector during SMT, and the longitudinal and transverse grooves in this area ensure uniform solder application during welding.
[0051] Furthermore, the materials of the first dielectric layer 2 and the second dielectric layer 4 are liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE), or modified polyimide (MPI). Compared to ordinary plastic support materials, they have lower dielectric constants (DK) and lower dielectric losses, resulting in stable performance at high frequencies. Antenna radiators based on these materials have relatively high gain and strong signal radiation capabilities. In addition, these materials are relatively flexible and easy to bend and conformally conform, especially the signal transmission line section with connectors, which can be pre-bent according to the internal environment requirements of the device, facilitating assembly and fastening onto the motherboard.
[0052] More preferably, the materials of the first dielectric layer 2 and the second dielectric layer 4 are liquid crystal polymers (LCP). LCP is in a molten state at high temperatures, and the layers can bond together. For other dielectrics, an adhesive sheet needs to be added between the dielectric and the metal layer. The adhesive sheet is in a molten state at high temperatures, which can achieve bonding between the layers.
[0053] Furthermore, the high-frequency radiator unit 10201 radiates signals in the 8GHz frequency band, and the low-frequency radiator unit 10202 radiates signals in the 6.5GHz frequency band.
[0054] See Figure 5This is a schematic diagram of the return loss of the low-profile dual-frequency UWB antenna provided in the embodiments of this application. The low-frequency resonance is around 6.5 GHz, and the high-frequency resonance is around 8 GHz.
[0055] See Figure 6 This diagram illustrates the current flow direction of the radiator element 102. The current flow is primarily perpendicular to the short-circuited metal post 8 and parallel to the long side of the radiator element 102. The polarization of the radiator element 102 is mainly horizontal. Because the radiator element 102 has a simple shape and structure—a rectangular patch—without any unnecessary slots or cuts, the unidirectional current flow results in a relatively pure horizontal polarization of the antenna. This is beneficial for receiving UWB signals with the same polarization from the surrounding area, thus improving bidirectional operating efficiency.
[0056] Furthermore, the low-profile dual-frequency UWB antenna provided in this application embodiment adopts a stacked structure of three or more layers. Compared with the radio frequency coaxial cable, which can only transmit one signal at a time, this application embodiment can simultaneously realize the transmission of multiple radio frequency signals and the radiation of multiple antenna radiators.
[0057] As can be seen from the above technical solutions, this application provides a low-profile dual-frequency UWB antenna, including: a first metal layer 1, a first dielectric layer 2, a second metal layer 3, a second dielectric layer 4, and a third metal layer 5 stacked sequentially; the first metal layer 1 includes: a first metal ground 101, a plurality of radiator elements 102, and a plurality of feed microstrip lines 103, the plurality of radiator elements 102 being disposed on the first metal ground 101 with clearance, the feed microstrip lines 103 being connected to the radiator elements 102, the radiator elements 102 being divided into two parts with different areas by a row of short-circuited metal pillars 8, the larger part being the low-frequency radiator element 10202, and the smaller part being the high-frequency radiator element 10201; a signal transmission line 302 is disposed on the second metal layer 3, the signal transmission line 302 being formed by passing through the first metal ground 101, the second dielectric layer 4 being the first metal ground 101, the third dielectric layer 5 being the first metal ground 101, the fourth dielectric layer 5 being the first metal ground 101, the fifth dielectric layer 5 being the first metal ground 101, the sixth dielectric layer 5 being the first metal ground 101, the seventh dielectric layer 5 being the first metal ground 101, the elliptic microstrip lines 102 ... The first blind via metal post 9 of the first dielectric layer 2 is connected to the feed microstrip line 103; the third metal layer 5 includes: a third metal ground 501 and a plurality of metal signal pads 502, the metal signal pads 502 are disposed on the third metal ground 501, the metal signal pads 502 are connected to the signal transmission line 302 through the second blind via metal post 10, the second blind via metal post 10 passes through the second dielectric layer 4, the metal signal pads 502 can be soldered to board-to-board connectors, the board-to-board connectors are used to transmit UWB signals; the second metal layer 3 is also provided with a second metal ground 301, the first metal ground 101, the first dielectric layer 2, the second metal ground 301, the second dielectric layer 4 and the third metal ground 501 are electrically connected sequentially through grounding metal post 6 so that the three metal layers share the same metal ground.
[0058] In practical applications, the low-profile dual-frequency UWB antenna provided in this application transmits the UWB signal from the motherboard of the electronic device through a board-to-board connector to a metal signal pad 502. The metal signal pad 502 transmits the UWB signal through a second blind hole metal post 10 to a signal transmission line 302, and then through the signal transmission line 302 to a first blind hole metal post 9. From the first blind hole metal post 9, the signal is transmitted to a feed microstrip line 103. The feed microstrip line 103 feeds the high-frequency radiator element 10201 and the low-frequency radiator element 10202, respectively. The radiator element 102 converts the current signal into an electromagnetic wave signal that propagates into free space. The low-profile dual-frequency UWB antenna provided in this application has controllable thickness, low profile, and unidirectional current flow, resulting in high horizontal polarization purity, which is beneficial for receiving UWB signals with the same polarization from the surrounding area and improving bidirectional working efficiency.
[0059] A second aspect of this application provides an electronic device that includes the low-profile dual-frequency UWB antenna described in the embodiments of this application.
[0060] As used in embodiments of this application, "electronic device" includes, but is not limited to, means configured to receive / transmit communication signals via a wired connection (such as via a Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), digital cable, direct cable connection, and / or another data connection / network) and / or via a wireless interface (e.g., for cellular networks, wireless local area networks (WLANs), digital television networks such as DVB-H networks, satellite networks, AM-FM broadcast transmitters, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal," "wireless terminal," "electronic device," and / or "electronic device." Examples of electronic devices include, but are not limited to, satellite or cellular phones; personal communication system (PCS) terminals that can combine cellular radiotelephones with data processing, fax, and data communication capabilities; PDAs that may include radiotelephones, pagers, Internet / intranet access, web browsers, notebooks, calendars, and / or Global Positioning System (GPS) receivers; and conventional laptop and / or handheld receivers, game consoles, or other electronic devices that include radiotelephone transceivers.
[0061] The present application has been described in detail above with reference to specific embodiments and exemplary examples; however, these descriptions should not be construed as limiting the present application. Those skilled in the art will understand that various equivalent substitutions, modifications, or improvements can be made to the technical solutions and implementation methods of the present application without departing from the spirit and scope of the present application, and all such modifications and improvements fall within the scope of the present application. The scope of protection of the present application is determined by the appended claims.
Claims
1. A low-profile dual-frequency UWB antenna, characterized in that, include: A first metal layer (1), a first dielectric layer (2), a second metal layer (3), a second dielectric layer (4), and a third metal layer (5) are stacked sequentially. The first metal layer (1) includes: a first metal ground (101), a plurality of radiator units (102) and a plurality of feed microstrip lines (103). The plurality of radiator units (102) are disposed on the first metal ground (101) with clearance. The feed microstrip lines (103) are connected to the radiator units (102). The radiator unit (102) is divided into two parts with a large area and a small area by a row of short-circuited metal pillars (8). The large area part is the low-frequency radiator unit (10202) and the small area part is the high-frequency radiator unit (10201). A signal transmission line (302) is provided on the second metal layer (3), and the signal transmission line (302) is connected to the feed microstrip line (103) by a first blind hole metal post (9) passing through the first dielectric layer (2); The third metal layer (5) includes a third metal ground (501) and a plurality of metal signal pads (502). The metal signal pads (502) are disposed on the third metal ground (501). The metal signal pads (502) are connected to the signal transmission line (302) through a second blind hole metal post (10). The second blind hole metal post (10) passes through the second dielectric layer (4). The metal signal pads (502) can be soldered to board-to-board connectors, which are used to transmit UWB signals. A second metal ground (301) is also provided on the second metal layer (3). The first metal ground (101), the first dielectric layer (2), the second metal ground (301), the second dielectric layer (4) and the third metal ground (501) are electrically connected through grounding metal posts (6) in sequence so that the three metal layers share the same metal ground. Among them, the third metal ground (501) in the third metal layer (5) is the reference ground of the radiator unit (102). Except for the metal pad (303) where the short-circuit metal pillar (8) is located, all other metal grounds in the projection area of the second metal layer (3) below the radiator unit (102) are removed.
2. The low-profile dual-frequency UWB antenna according to claim 1, characterized in that, Multiple pores (7) are provided on the first metal ground (101), the second metal ground (301) and the third metal ground (501).
3. The low-profile dual-frequency UWB antenna according to claim 1, characterized in that, The feeding microstrip line (103) includes a high-frequency feeding microstrip line (10301) and a low-frequency feeding microstrip line (10302). One end of the high-frequency feeding microstrip line (10301) is connected to the high-frequency radiator unit (10201), and the other end is connected to the first blind hole metal post (9). One end of the low-frequency feeding microstrip line (10302) is connected to the low-frequency radiator unit (10202), and the other end is connected to the first blind hole metal post (9).
4. A low-profile dual-frequency UWB antenna according to claim 1, characterized in that, One end of the signal transmission line (302) is connected to the first blind hole metal post (9), and the other end is connected to the second blind hole metal post (10).
5. A low-profile dual-frequency UWB antenna according to claim 1, characterized in that, The grounding metal post (6) is located on both sides of the signal transmission line (302) and is in close contact with the signal transmission line (302).
6. A low-profile dual-frequency UWB antenna according to claim 1, characterized in that, The second metal layer (3) further includes a metal pad (303) disposed on the second metal ground (301), and the short-circuit metal post (8) passes through the metal pad (303).
7. A low-profile dual-frequency UWB antenna according to claim 1, characterized in that, The first metal layer (1) also includes a connector reinforcing plate welding area (104), which has longitudinal and transverse grooves that can be used to weld the reinforcing plate.
8. A low-profile dual-frequency UWB antenna according to claim 1, characterized in that, The materials of the first dielectric layer (2) and the second dielectric layer (4) are liquid crystal polymer, polytetrafluoroethylene or modified polyimide.
9. A low-profile dual-frequency UWB antenna according to claim 1, characterized in that, The high-frequency radiator unit (10201) radiates signals in the 8GHz band, and the low-frequency radiator unit (10202) radiates signals in the 6.5GHz band.
10. An electronic device, characterized in that, It includes a low-profile dual-frequency UWB antenna as described in any one of claims 1-9.