Display panel and manufacturing method thereof

Abstract

The present invention provides a display panel and a manufacturing method thereof. The display panel includes: a glass substrate having a first surface; a device to be stripped, the device to be stripped including a film layer to be stripped and a display device, the film layer to be stripped being located on a side of the glass substrate close to the first surface, and the display device being located on a side of the film layer to be stripped away from the glass substrate; a reflective film layer, the reflective film layer being located on a side of the glass substrate close to the first surface and used to reflect a portion of the laser light used to separate the glass substrate from the device to be stripped; wherein the glass substrate has a laser irradiation overlapping region, and the reflective film layer corresponds to the laser irradiation overlapping region. By providing the reflective film layer in the laser irradiation overlapping region, a portion of the energy during the laser irradiation process is reflected, thereby avoiding the problem of carbonization of the film layer to be stripped due to repeated scanning of the laser irradiation overlapping region, thereby improving the yield and reliability of the panel.

Description

Technical field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof. [Background Technology]

[0002] Light Emitting Diodes (LEDs) are semiconductor electronic components that can convert electrical energy into light energy. Due to their small size, long service life, rich colors, and low energy consumption, they are widely used in lighting, display screens, signal lights, backlight sources, toys and other fields. Mini LED, also known as sub-millimeter light-emitting diodes, is a new generation of LED technology. It inherits the characteristics of high efficiency, high reliability, high brightness and fast response time of small-pitch LEDs, and the smaller-pitch LEDs have lower power consumption and cost. In recent years, flexible electronic products have attracted widespread attention from all over the world and have developed rapidly. During the manufacturing process of at least some flexible devices in flexible electronic products, a PI film (polyimide film) is often first formed on a hard glass substrate, and related electronic devices are manufactured on the PI film. After the relevant electronic devices are manufactured, the glass substrate and the PI film are separated to form a flexible device with the PI film as the substrate.

[0003] Flexible Mini LED screens, like rigid Mini LED screens, can be infinitely spliced. Rigid substrates that haven't undergone LLO (Low Loop Laser) are easier to splice and can also reduce the seam. However, due to the larger size of the spliced ​​substrates, the LLO laser head scanning area needs to be designed to be larger, which increases costs. If the scanning is done in two steps, there will be an overlap area where the LLO laser scans are repeated. This causes the PI film in the overlapped area to be severely carbonized after repeated LLO scanning, damaging the TFT devices inside the array substrate and causing poor dot and line quality. Therefore, how to prevent the PI film from being repeatedly scanned by the LLO laser head has become a technical problem that needs to be solved in this field. [Summary of the invention]

[0004] The present invention provides a display panel and a manufacturing method thereof, which optimizes the process of a laser lift-off process and improves the yield and stability of the panel.

[0005] In order to solve the above problems, the present invention provides a display panel, comprising: a glass substrate, the glass substrate having a first surface; a device to be peeled off, the device to be peeled off comprising a film layer to be peeled off and a display device, the film layer to be peeled off is located on a side of the glass substrate close to the first surface, and the display device is located on a side of the film layer to be peeled off away from the glass substrate; a reflective film layer, the reflective film layer is located on a side of the glass substrate away from the first surface, or on a side of the glass substrate close to the first surface, and is used to reflect part of the laser that separates the glass substrate from the device to be peeled off; wherein the glass substrate has a laser irradiation overlapping area, and the reflective film layer corresponds to the laser irradiation overlapping area.

[0006] The reflective film layer is located on a side of the glass substrate away from the first surface.

[0007] The reflective film layer is located on a side of the glass substrate close to the first surface.

[0008] The device to be stripped includes a first sub-device and a second sub-device, and the device to be stripped is formed by splicing at least one first sub-device and at least one second sub-device.

[0009] The device to be peeled off is a single large-sized flexible device.

[0010] The material of the reflective film layer includes any one or more of Ti, Ta, TiO2 and TaO2, and / or the thickness of the reflective film layer is in the range of

[0011] The reflectivity of the reflective film layer to laser light is 20-60%.

[0012] The width of the laser irradiated overlapping area ranges from 200um to 2000um.

[0013] Among them, the devices to be stripped include Mini LED, Micro LED or OLED.

[0014] In order to solve the above problems, the present invention also provides a method for manufacturing a display panel, comprising: providing a glass substrate, the glass substrate having a first surface; forming a film layer to be stripped on a side of the glass substrate close to the first surface; forming a display device on a side of the film layer to be stripped away from the glass substrate, the device to be stripped including the film layer to be stripped and the display device; irradiating the glass substrate with laser to separate the glass substrate from the device to be stripped; wherein, before irradiating the glass substrate with laser, the method further comprises: forming a reflective material layer on a side of the glass substrate away from the first surface, or on a side of the glass substrate close to the first surface, and patterning the reflective material layer to form a reflective film layer; the glass substrate has a laser irradiation overlapping area, the reflective film layer corresponds to the laser irradiation overlapping area, and is used to reflect part of the laser that separates the glass substrate from the device to be stripped.

[0015] The beneficial effects of the present invention are as follows: Different from the prior art, the present invention provides a display panel and a manufacturing method thereof, wherein the display panel comprises: a glass substrate having a first surface; a device to be peeled off, the device to be peeled off comprising a film layer to be peeled off and a display device, the film layer to be peeled off being located on the side of the glass substrate close to the first surface, and the display device being located on the side of the film layer to be peeled off away from the glass substrate; a reflective film layer, the reflective film layer being located on the side of the glass substrate away from the first surface, or on the side of the glass substrate close to the first surface, and being used to reflect a portion of the laser light used to separate the glass substrate from the device to be peeled off; wherein the glass substrate has a laser irradiation overlapping region, and the reflective film layer corresponds to the laser irradiation overlapping region. By providing a reflective film layer in the laser irradiation overlapping region to reflect part of the energy during the laser irradiation process, the problem of carbonization of the film layer to be peeled off due to repeated scanning of the laser irradiation overlapping region is avoided, thereby improving the yield rate of the laser peeling process and thereby improving the yield rate and reliability of the panel.

Brief Description of the Drawings

[0016] Figure 1 A schematic diagram of a process flow of a display panel provided by an embodiment of the present invention;

[0017] Figure 2a A schematic diagram of the structure of a device to be stripped provided in an embodiment of the present invention;

[0018] Figure 2b for Figure 2a Schematic diagram of the top view structure;

[0019] Figure 3a A schematic diagram of a structure for forming a reflective film layer according to an embodiment of the present invention;

[0020] Figure 3b for Figure 3a Schematic diagram of the top view structure;

[0021] Figure 4a This is a schematic structural diagram of the first laser irradiation performed in an embodiment of the present invention;

[0022] Figure 4b This is a structural schematic diagram of the second laser irradiation according to an embodiment of the present invention. [Specific implementation method]

[0023] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It is particularly noted that the following examples are intended only to illustrate the present invention and are not intended to limit the scope of the present invention. Similarly, the following examples are only some embodiments of the present invention and are not intended to be exhaustive. All other embodiments obtained by those of ordinary skill in the art without creative effort are intended to fall within the scope of protection of the present invention.

[0024] In addition, the terms first, second, third, etc. mentioned in the present invention can be used to describe various elements here, but these elements should not be limited to these terms. These terms are only used to distinguish these elements from each other. For example, without departing from the scope of the present invention, the first can be referred to as the second, and similarly, the second can be referred to as the first. Therefore, the terms used are used to illustrate and understand the present invention, rather than to limit the present invention. In the various drawings, units with similar structures are represented by the same reference numerals. For clarity, the various parts in the drawings are not drawn to scale. In addition, certain well-known parts may not be shown in the drawings.

[0025] In addition, in each drawing, similar units are denoted by the same reference numerals. When a component is described as being “connected to” another component, the two components can be understood to be directly “connected” or one component can be indirectly “connected to” the other component through an intermediate component.

[0026] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings.

[0027] like Figure 1 FIG. 1 is a flow chart of a method for manufacturing a display panel according to an embodiment of the present invention, which is applied in the field of display technology. The specific method for manufacturing the display panel is described in detail in FIG. Figures 2a to 4b The structure diagram may include the following:

[0028] Step S101: providing a glass substrate 110, wherein the glass substrate 110 has a first surface B1;

[0029] Step S102: forming a film layer 121 to be peeled off on a side of the glass substrate 110 close to the first surface B1;

[0030] Step S103: forming a display device 122 on the side of the film layer 121 to be peeled away from the glass substrate 110, wherein the device 120 to be peeled includes the film layer 121 to be peeled and the display device 122;

[0031] Step S104: performing laser irradiation on the glass substrate 110 to separate the glass substrate 110 from the device to be peeled 120; wherein, before performing laser irradiation on the glass substrate 110, the step further includes: forming a reflective material layer on a side of the glass substrate 110 away from the first surface B1, or on a side of the glass substrate 110 close to the first surface B1, and patterning the reflective material layer to form a reflective film layer 130; the glass substrate 110 has a laser irradiation overlapping area A1, and the reflective film layer 130 corresponds to the laser irradiation overlapping area A1, and is used to reflect part of the laser that separates the glass substrate 110 from the device to be peeled 120.

[0032] In addition, it should be noted that Figures 2a to 4b Only structures related to the embodiments of the present invention are shown. The display panel of the present invention may further include other components and / or structures for realizing the complete functions of the display panel.

[0033] Figure 2a and Figure 2b The structure formed by steps S101 to S103 is shown, including: a glass substrate 110, a film layer 121 to be peeled off located on the glass substrate 110, and a display device 122. The glass substrate 110 has a laser irradiation overlapping area A1, and the laser irradiation overlapping area A1 is an overlapping area where the laser head performs multiple laser irradiations during the laser lift-off process (LLO). The glass substrate 110 also has a first surface B1, and the glass substrate 110 can be a rigid transparent glass (glass). After providing the glass substrate 110, the film layer 121 to be peeled off can be formed on the side of the glass substrate 110 close to the first surface B1. The film layer 121 to be peeled off can be a flexible substrate. For example, the material of the film layer 121 to be peeled off can be PI (polyimide). After the film layer 121 to be peeled off is formed on the glass substrate 110, the display device 122 can be formed on the film layer 121 to be peeled off. Specifically, the device 120 to be stripped is used for displaying images on a panel. There is no particular limitation on the device 120 to be stripped, and the device 120 to be stripped can be a Mini LED display device, a Micro LED display device, or an OLED display device. When the device 120 to be stripped is a Mini LED display device, the steps for forming the device 120 to be stripped can include forming a drive circuit on the film layer to be etched and completing the transfer of the Mini LED lamp beads.

[0034] Figure 3a and Figure 3b The structure for forming the reflective film layer 130 is shown, including: a glass substrate 110, a film layer 121 to be peeled off, a display device 122, and the reflective film layer 130 located on the side of the glass substrate 110 away from the display device 122. After forming the display device 122, the glass substrate 110 can be placed with the side away from the first surface B1 facing upward, and a reflective material layer can be formed on the side of the glass substrate 110 away from the first surface B1 by physical vapor deposition (PVD). The reflective material layer is then patterned to form the reflective film layer 130. The reflective film layer 130 corresponds to the laser irradiation overlap area A1 (for example, the width W2 of the reflective film layer 130 is consistent with the width W1 of the laser irradiation overlap area A1) and is used to reflect a portion of the laser light used to separate the glass substrate 110 from the device 120 to be peeled off.

[0035] The material of the reflective film layer 130 includes any one or more of Ti, Ta, TiO2 and TaO2, and / or the thickness of the reflective film layer 130 is in the range of

[0036] The reflectivity of the reflective film layer 130 to the laser light is 20-60%.

[0037] The width W1 of the laser irradiated overlapping area A1 ranges from 200um to 2000um.

[0038] Specifically, the reflective film layer 130 needs to have a certain transmittance, so the reflective film layer 130 generally adopts a thinner metal film or metal oxide film. For example, the material of the reflective film layer 130 can be any one or more of Ti, Ta, TiO2 and TaO2. Among them, the thickness range of the reflective film layer 130 is Furthermore, to ensure that the reflective film layer 130 reflects a portion of the laser energy, the reflectivity of the reflective film layer 130 is 20-60%. Furthermore, the laser irradiation overlap region A1 is related to the width of the laser head used for laser lift-off and the laser lift-off process. Generally, the width W1 of the laser irradiation overlap region A1 ranges from 200 μm to 2000 μm. Correspondingly, the width W2 of the reflective film layer 130 ranges from 200 μm to 2000 μm.

[0039] Specifically, the structure formed in step S104 includes: a film layer 121 to be peeled and a display device 122 located on the film layer 121 to be peeled. After forming the reflective film layer 130, the glass substrate 110 can be irradiated with a laser. The laser irradiation direction is from the glass substrate 110 to the film layer 121 to be peeled. The laser irradiation weakens the adhesion of the film layer 121 to be peeled, thereby separating the film layer 121 from the glass substrate 110.

[0040] Specifically, as can be seen above, the material of the film layer 121 to be peeled can be PI (polyimide). When the laser is irradiated on the film layer 121 to be peeled, the film layer 121 to be peeled will carbonize and decompose due to absorption of the laser, resulting in a decrease in the adhesion between the glass substrate 110 and the film layer 121 to be peeled, thereby achieving separation of the glass substrate 110 and the film layer 121 to be peeled. In addition, polyimide is an excellent flexible material, which enables the flexible display device 122 to be bent freely at a certain angle, improving the flexibility of the flexible display device 122, while also avoiding stress concentration during bending and the problem of localized fracture.

[0041] The device to be stripped 120 includes a first sub-device and a second sub-device (not shown in the figure), and the device to be stripped 120 is formed by splicing at least one first sub-device and at least one second sub-device.

[0042] The device 120 to be peeled off is a single large-sized flexible device.

[0043] Specifically, the device 120 to be stripped may be formed by splicing screen technology. For example, the device 120 to be stripped may include a first sub-device and a second sub-device, and the device 120 to be stripped is formed by splicing at least one first sub-device and at least one second sub-device. In addition, the device 120 to be stripped may also be a single large-sized flexible device. With the emergence of splicing screen technology and single large-sized panels, the size of the display panels formed is getting larger and larger, resulting in the width of the display panel being larger than the width of the laser head for the laser stripping process. At this time, the laser stripping process needs to be optimized. In response to the problem of the larger size of the display panel, the width of the laser head for the laser stripping process can be increased, which will increase the cost. In addition, in response to the problem of the larger size of the display panel, the display panel can be divided into multiple areas and multiple laser irradiations can be performed to achieve overall laser stripping of the display panel. As Figure 4a As shown in FIG, it is a schematic diagram of the structure for the first laser irradiation. Figure 4a It can be seen that the laser head 200 can only irradiate a part of the glass substrate 110. Figure 4b As shown in FIG, it is a schematic diagram of the structure for the second laser irradiation. Figure 4b As can be seen, laser head 200 can only illuminate another portion of glass substrate 110, resulting in an overlapping laser irradiation area A1. Typically, film layer 121 to be stripped is PI. Repeated laser scanning can lead to severe carbonization of PI, potentially damaging the TFTs within the panel and causing defective dots and lines, impacting the panel's yield and reliability.

[0044] Based on this, through the method of an embodiment of the present invention, a reflective film layer 130 is set in the laser irradiation overlapping area A1 to reflect part of the energy during the laser irradiation process, thereby avoiding the carbonization problem of the film layer 121 to be stripped due to repeated scanning of the laser irradiation overlapping area A1, thereby improving the yield and reliability of the laser stripping process.

[0045] The reflective film layer 130 is located on a side of the glass substrate 110 away from the first surface B1 .

[0046] Specifically, a reflective film layer 130 is provided in the laser irradiation overlap region A1. The reflective film layer 130 is located on the side of the glass substrate 110 away from the first surface B1. The reflective film layer 130 reflects the laser irradiation energy away, reducing the laser irradiation energy of the film layer 121 to be peeled off in the laser irradiation overlap region A1. This prevents carbonization of the film layer 121 to be peeled off due to repeated scanning of the laser irradiation overlap region A1, thereby improving the yield of the laser lift-off process. Furthermore, the display panel of the present invention can be processed in a large-scale laser lift-off (LLO) process using a small-scale laser lift-off (LLO) machine, reducing equipment costs.

[0047] Furthermore, it should be noted that a reflective material layer can be formed on the side of the glass substrate 110 near the first surface B1 and patterned to form a reflective film layer 130. The glass substrate 110 has a laser irradiation overlap region A1. The reflective film layer 130 corresponds to the laser irradiation overlap region A1 and is used to reflect a portion of the laser light used to separate the glass substrate 110 from the device to be peeled 120. In other words, the reflective film layer 130 can also be located between the glass substrate 110 and the film layer to be peeled 121. During the laser lift-off process, the reflective film layer 130 located on the side of the glass substrate 110 near the first surface B1 can play a certain role in reflecting the laser light, preventing the carbonization of the film layer to be peeled 121 caused by repeated scanning of the laser irradiation overlap region A1. This improves the yield of the laser lift-off process, thereby improving the yield and reliability of the panel.

[0048] Based on the method for manufacturing a display panel described in the above embodiment of the present invention, the present invention further provides a display panel, such as Figure 3a and 3b As shown, it includes: a glass substrate 110, the glass substrate 110 has a first surface B1; a device to be stripped 120, the device to be stripped 120 includes a film layer to be stripped 121 and a display device 122, the film layer to be stripped 121 is located on the side of the glass substrate 110 close to the first surface B1, and the display device 122 is located on the side of the film layer to be stripped 121 away from the glass substrate 110; a reflective film layer 130, the reflective film layer 130 is located on the side of the glass substrate 110 away from the first surface B1, or on the side of the glass substrate 110 close to the first surface B1, and is used to reflect part of the laser that separates the glass substrate 110 from the device to be stripped 120; wherein the glass substrate 110 has a laser irradiation overlapping area A1, and the reflective film layer 130 corresponds to the laser irradiation overlapping area A1 (for example, the width W2 of the reflective film layer 130 is consistent with the width W1 of the laser irradiation overlapping area A1).

[0049] The glass substrate 110 has a laser irradiation overlap area A1, which is an overlapping area where the laser head performs multiple laser irradiations during the laser lift-off process. The glass substrate 110 also has a first surface B1, and the glass substrate 110 can be a rigid transparent glass. After providing the glass substrate 110, a film layer 121 to be peeled can be formed on the side of the glass substrate 110 close to the first surface B1. The film layer 121 to be peeled can be a flexible substrate. For example, the material of the film layer 121 to be peeled can be PI (polyimide). After the film layer 121 to be peeled is formed on the glass substrate 110, a display device 122 can be formed on the film layer 121 to be peeled.

[0050] The reflective film layer 130 is located on a side of the glass substrate 110 away from the first surface B1 .

[0051] The device to be stripped 120 includes a first sub-device and a second sub-device, and the device to be stripped 120 is formed by splicing at least one first sub-device and at least one second sub-device.

[0052] The device 120 to be peeled off is a single large-sized flexible device.

[0053] Specifically, the device 120 to be stripped may be formed by splicing screen technology. For example, the device 120 to be stripped may include a first sub-device and a second sub-device, and the device 120 to be stripped is formed by splicing at least one first sub-device and at least one second sub-device. In addition, the device 120 to be stripped may also be a single large-sized flexible device. With the emergence of splicing screen technology and single large-sized panels, the size of the display panels formed is getting larger and larger, resulting in the width of the display panel being larger than the width of the laser head for the laser stripping process. At this time, the laser stripping process needs to be optimized. In response to the problem of the larger size of the display panel, the width of the laser head for the laser stripping process can be increased, which will increase the cost. In addition, in response to the problem of the larger size of the display panel, the display panel can be divided into multiple areas and multiple laser irradiations can be performed to achieve overall laser stripping of the display panel. As Figure 4a As shown in FIG, it is a schematic diagram of the structure for the first laser irradiation. Figure 4a It can be seen that the laser head 200 can only irradiate a part of the glass substrate 110. Figure 4b As shown in FIG, it is a schematic diagram of the structure for the second laser irradiation. Figure 4b As can be seen, laser head 200 can only illuminate another portion of glass substrate 110, resulting in an overlapping laser irradiation area A1. Typically, film layer 121 to be stripped is PI. Repeated laser scanning can lead to severe carbonization of PI, potentially damaging the TFTs within the panel and causing defective dots and lines, impacting the panel's yield and reliability.

[0054] Based on this, in the display panel of the embodiment of the present invention, a reflective film layer 130 is provided in the laser irradiation overlap region A1. The reflective film layer 130 is located on the side of the glass substrate 110 away from the first surface B1. The reflective film layer 130 reflects the energy of the laser irradiation, thereby reducing the laser irradiation energy of the film layer 121 to be peeled off in the laser irradiation overlap region A1. This prevents the problem of carbonization of the film layer 121 to be peeled off due to repeated scanning of the laser irradiation overlap region A1, thereby improving the yield of the laser lift-off process. At the same time, the display panel of the embodiment of the present invention can complete the laser lift-off process of a larger size using a small-sized laser lift-off (LLO) machine, reducing equipment costs.

[0055] The material of the reflective film layer 130 includes any one or more of Ti, Ta, TiO2 and TaO2, and / or the thickness of the reflective film layer 130 is in the range of

[0056] The reflectivity of the reflective film layer 130 to the laser light is 20-60%.

[0057] The width W1 of the laser irradiated overlapping area A1 ranges from 200um to 2000um.

[0058] Specifically, the reflective film layer 130 needs to have a certain transmittance, so the reflective film layer 130 generally adopts a thinner metal film or metal oxide film. For example, the material of the reflective film layer 130 can be any one or more of Ti, Ta, TiO2 and TaO2. Among them, the thickness range of the reflective film layer 130 is Furthermore, to ensure that the reflective film layer 130 reflects a portion of the laser energy, the reflectivity of the reflective film layer 130 is 20-60%. Furthermore, the laser irradiation overlap region A1 is related to the width of the laser head 200 performing the laser lift-off process and the process itself. Generally, the width W1 of the laser irradiation overlap region A1 ranges from 200 μm to 2000 μm. Correspondingly, the width W2 of the reflective film layer 130 ranges from 200 μm to 2000 μm.

[0059] The device 120 to be stripped includes Mini LED, Micro LED or OLED.

[0060] Specifically, the device 120 to be stripped is used for displaying images on a panel. There is no particular limitation on the device 120 to be stripped, and the device 120 to be stripped can be a Mini LED display device, a Micro LED display device, or an OLED display device. When the device 120 to be stripped is a Mini LED display device, the steps for forming the device 120 to be stripped can include forming a drive circuit on the film layer to be etched and completing the transfer of the Mini LED lamp beads.

[0061] The reflective film layer 130 is located on a side of the glass substrate 110 close to the first surface B1 .

[0062] Furthermore, it should be noted that a reflective material layer can be formed on the side of the glass substrate 110 near the first surface B1 and patterned to form a reflective film layer 130. The glass substrate 110 has a laser irradiation overlap region A1. The reflective film layer 130 corresponds to the laser irradiation overlap region A1 and is used to reflect a portion of the laser light used to separate the glass substrate 110 from the device to be peeled 120. In other words, the reflective film layer 130 can also be located between the glass substrate 110 and the film layer to be peeled 121. During the laser lift-off process, the reflective film layer 130 located on the side of the glass substrate 110 near the first surface B1 can play a certain role in reflecting the laser light, preventing the carbonization of the film layer to be peeled 121 caused by repeated scanning of the laser irradiation overlap region A1. This improves the yield of the laser lift-off process, thereby improving the yield and reliability of the panel.

[0063] It should be understood that the specific structure and manufacturing process of the display panel of the embodiment of the present invention can refer to the embodiment of the manufacturing method of the display panel above, and will not be repeated here. In addition, it should be noted that the limiting conditions of the manufacturing method of the embodiment of the present invention can also be applied to the structure of the embodiment of the present invention.

[0064] According to the above, the present invention provides a display panel and a method for manufacturing the same, wherein the display panel comprises: a glass substrate having a first surface; a device to be peeled off, the device to be peeled off comprising a film layer to be peeled off and a display device, the film layer to be peeled off being located on the side of the glass substrate close to the first surface, and the display device being located on the side of the film layer to be peeled off away from the glass substrate; a reflective film layer, the reflective film layer being located on the side of the glass substrate away from the first surface, or on the side of the glass substrate close to the first surface, and being used to reflect a portion of the laser light used to separate the glass substrate from the device to be peeled off; wherein the glass substrate has a laser irradiation overlapping region, and the reflective film layer corresponds to the laser irradiation overlapping region. By providing a reflective film layer in the laser irradiation overlapping region, part of the energy during the laser irradiation process is reflected, thereby avoiding the problem of carbonization of the film layer to be peeled off due to repeated scanning of the laser irradiation overlapping region, thereby improving the yield rate of the laser peeling process, thereby improving the yield rate and reliability of the panel.

[0065] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A display panel, characterized in that: include: a glass substrate having a first surface; a device to be peeled, the device to be peeled comprising a film layer to be peeled and a display device, the film layer to be peeled is located on a side of the glass substrate close to the first surface, and the display device is located on a side of the film layer to be peeled away from the glass substrate; a reflective film layer, the reflective film layer being located on a side of the glass substrate away from the first surface, or on a side of the glass substrate close to the first surface, and being used to reflect a portion of the laser light used to separate the glass substrate from the device to be peeled off; The glass substrate has a laser irradiation overlapping area, the reflective film layer corresponds to the laser irradiation overlapping area, and the laser irradiation overlapping area is an overlapping area where the laser head performs multiple laser irradiations during the laser lift-off process.

2. The display panel according to claim 1, wherein The reflective film layer is located on a side of the glass substrate away from the first surface.

3. The display panel according to claim 1, wherein The reflective film layer is located on a side of the glass substrate close to the first surface.

4. The display panel according to claim 1, wherein: The device to be stripped includes a first sub-device and a second sub-device, and the device to be stripped is formed by splicing at least one of the first sub-device and at least one of the second sub-device.

5. The display panel according to claim 1, wherein The device to be peeled off is a single large-sized flexible device.

6. The display panel according to claim 1, wherein: The material of the reflective film layer includes any one or more of Ti, Ta, TiO2 and TaO2, and / or the thickness of the reflective film layer is in the range of 7. The display panel according to claim 1, wherein: The reflectivity of the reflective film layer to laser light is 20-60%.

8. The display panel according to claim 1, wherein: The width of the laser irradiation overlapping area ranges from 200um to 2000um.

9. The display panel according to claim 1, wherein: The device to be stripped includes MiniLED, MicroLED or OLED.

10. A method for manufacturing a display panel, characterized in that: include: providing a glass substrate having a first surface; forming a film layer to be peeled off on a side of the glass substrate close to the first surface; forming a display device on a side of the film layer to be peeled away from the glass substrate, wherein the device to be peeled includes the film layer to be peeled and the display device; irradiating the glass substrate with laser light to separate the glass substrate from the device to be peeled off; Wherein, before the laser irradiation is performed on the glass substrate, the method further comprises: A reflective material layer is formed on a side of the glass substrate away from the first surface, or on a side of the glass substrate close to the first surface, and the reflective material layer is patterned to form a reflective film layer; the glass substrate has a laser irradiation overlapping area, and the reflective film layer corresponds to the laser irradiation overlapping area and is used to reflect part of the laser for separating the glass substrate from the device to be peeled off.

Images