Apparatus for processing a substrate

Abstract

A substrate processing apparatus is provided. The substrate processing apparatus includes a processing chamber configured to process a substrate, a transfer assembly configured to transfer the substrate to the processing chamber, and a diagnostic assembly configured to detect an abnormal state of the transfer assembly, and wherein the transfer assembly includes a housing having a transfer space, and a transfer robot configured to transfer the substrate to the processing chamber, and wherein the diagnostic assembly includes a detection member to detect air vibration generated within the housing, and a diagnostic member to diagnose a driving unit of the transfer assembly based on the air vibration detected by the detection member.

Description

Technical Field

[0001] The embodiments of the inventive concept described herein relate to an apparatus for processing a substrate, and more specifically, to an apparatus for processing a substrate for diagnosing abnormal states of the drive unit of a transmission component. Background Technology

[0002] To manufacture semiconductor devices, various processes such as deposition, photolithography, etching, and cleaning are performed. Deposition is the process of forming a thin film on a substrate (such as a wafer). Photolithography includes coating, exposure, and development. Coating is the process of applying a photosensitive solution, such as a photoresist solution, onto a substrate. Exposure is the process of transferring a circuit pattern onto a substrate by exposing a photomask on the applied photoresist film to light from a light source. Development is the process of selectively developing the exposed areas of the substrate. Etching is the process of removing the thin film formed on the substrate. Cleaning is the process of removing byproducts generated during substrate processing by supplying cleaning and rinsing solutions to the substrate.

[0003] The aforementioned substrate processing processes are performed in a processing chamber having a processing space for processing the substrates. Therefore, a typical substrate processing apparatus includes a transfer assembly for conveying the substrates into the processing chamber. A transfer robot for conveying the substrates into the processing chamber while supporting them, and a transfer track (e.g., an LM guide rail) for guiding the linear movement of the transfer robot are mounted in the transfer assembly. A drive unit is provided inside the transfer assembly. For example, the drive unit includes: a horizontal drive unit for realizing the horizontal movement of the transfer robot; a vertical drive unit for realizing the vertical movement of the transfer robot; and a rotary drive unit for realizing the rotary movement of the transfer robot. Each drive unit may be equipped with various motors, timing belts, bearings, etc.

[0004] The interior of substrate processing equipment is exposed to various environmental factors, such as noise and airflow generated by various devices. Due to these internal environmental factors, it is difficult to determine whether the drive units supplied to the conveying components are defective. If defects in the drive units are ignored and not addressed, the substrate cannot return to the correct position, resulting in defects in the substrate processing process. Summary of the Invention

[0005] An embodiment of the present invention provides a substrate processing apparatus for diagnosing abnormal states of a transmission component drive unit for transmitting substrates.

[0006] An embodiment of the present invention provides a substrate processing apparatus for diagnosing abnormal states of the drive unit of a transmission component without being affected by the internal environment of the substrate processing apparatus.

[0007] An embodiment of the present invention provides a substrate processing apparatus for improving the diagnostic reliability of abnormal states relative to a drive unit by detecting air vibrations while minimizing the influence of airflow.

[0008] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0009] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a processing chamber configured to process a substrate; a transfer assembly configured to transfer the substrate into the processing chamber; and a diagnostic assembly configured to detect abnormal states of the transfer assembly. The transfer assembly includes: a housing having a transfer space; and a transfer robot configured to transfer the substrate into the processing chamber. The diagnostic assembly includes: a detection member for detecting air vibrations generated within the housing; and a diagnostic member for diagnosing a drive unit of the transfer assembly based on the air vibrations detected by the detection member.

[0010] In one embodiment, the detection component includes: an inlet portion for introducing the air vibration generated within the housing; and a body portion having a valve configured to provide vibration in response to the air vibration introduced from the inlet portion.

[0011] In one embodiment, the inlet portion includes a mesh structure.

[0012] In one embodiment, the inlet portion includes a porous component.

[0013] In one embodiment, the diagnostic component includes: a conversion unit for converting the vibration of the valve into a waveform; a diagnostic unit for diagnosing the waveform converted by the conversion unit; and a display unit for displaying the results of analyzing the waveform.

[0014] In one embodiment, when the peak value of the waveform converted by the conversion unit is outside a preset normal range waveform, the diagnostic unit determines that the drive unit of the transmission component is in an abnormal state.

[0015] In one embodiment, the diagnostic component is mounted inside the housing.

[0016] In one embodiment, the diagnostic component is mounted on any fixed component within the housing.

[0017] In one embodiment, the conveying assembly further includes a conveying track mounted along the longitudinal direction of the housing and configured to guide the movement direction of the conveying robot, wherein the detection unit is mounted on the conveying track.

[0018] In one embodiment, the detection unit is installed at the midpoint of the conveyor track.

[0019] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes a first unit; a second unit, different from the first unit; a transfer assembly configured to transfer a substrate between the first unit and the second unit; and a diagnostic assembly configured to detect abnormal states of the transfer assembly. The transfer assembly includes a housing having a transfer space; and a transfer robot configured to transfer the substrate. The diagnostic assembly includes a detection member for detecting air vibrations generated within the housing; and a diagnostic member for diagnosing a drive unit of the transfer assembly based on the air vibrations detected by the detection member.

[0020] In one embodiment, the detection component includes: an inlet portion for introducing the air vibration generated within the housing; and a body portion having a valve configured to provide vibration in response to the air vibration introduced from the inlet portion.

[0021] In one embodiment, the inlet portion includes a mesh structure.

[0022] In one embodiment, the diagnostic component includes: a conversion unit for converting the vibration of the valve into a waveform; a diagnostic unit for diagnosing the waveform converted by the conversion unit; and a display unit for displaying the results of analyzing the waveform.

[0023] In one embodiment, when the peak value of the waveform converted by the conversion unit is outside a preset normal range waveform, the diagnostic unit determines that the drive unit of the transmission component is in an abnormal state.

[0024] In one embodiment, the diagnostic component is mounted on any fixed component within the housing.

[0025] In one embodiment, the conveying assembly further includes a conveying track mounted along the longitudinal direction of the housing and configured to guide the movement direction of the conveying robot, wherein the detection unit is mounted on the conveying track.

[0026] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a transposition module having a loading port for placing a container storing a substrate therein; a processing module having a processing chamber for performing a process of processing the substrate; a transfer assembly disposed to at least one of the transposition module and the processing module and configured to transfer the substrate; and a diagnostic assembly for detecting abnormal states of the transfer assembly, wherein the transfer assembly includes: a housing having a transfer space; and a transfer robot configured to transfer the substrate, wherein the diagnostic assembly includes: an inlet portion for introducing air vibrations generated within the housing; and a body portion having a valve configured to provide vibration in response to the air vibrations introduced from the inlet portion, wherein the inlet portion includes a mesh structure.

[0027] In one embodiment, the diagnostic component further includes: a conversion unit for converting the vibration of the valve into a waveform; a diagnostic unit for diagnosing the waveform converted by the conversion unit; and a display unit for displaying the results of analyzing the waveform, wherein when the peak value of the waveform converted by the conversion unit is outside a preset normal range waveform, the drive unit of the transmission component is determined to be in an abnormal state.

[0028] In one embodiment, the conveying assembly further includes a conveying track mounted along the longitudinal direction of the housing and configured to guide the movement direction of the conveying robot, wherein the detection unit is mounted on the conveying track.

[0029] According to the embodiments of the present invention, abnormal states of the moving body of the transmission component can be detected more accurately.

[0030] According to an embodiment of the present invention, abnormal states of the moving body can be diagnosed by introducing the sound of the moving body of the transmission component.

[0031] According to an embodiment of the present invention, the reliability of the moving body of the transmission component can be determined by detecting the sound of the moving body while minimizing the influence of wind.

[0032] The effects of this invention are not limited to those described above, and other effects not mentioned will become apparent to those skilled in the art from the following description. Attached Figure Description

[0033] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals in the various drawings refer to the same parts, and wherein:

[0034] Figure 1 This is a schematic view of a substrate processing apparatus according to an embodiment of the present invention.

[0035] Figure 2 It shows the setting Figure 1 A view of the substrate processing equipment in the processing chamber.

[0036] Figure 3 It shows the setting Figure 1 A view of the substrate processing equipment in the transfer chamber.

[0037] Figure 4 It shows the setting Figure 3 A view of an embodiment of a diagnostic component in a substrate processing apparatus.

[0038] Figure 5 It shows the setting Figure 3 An evaluation view of the waveform stiffness of a diagnostic component in a substrate processing device.

[0039] Figure 6 and Figure 7 It shows Figure 4 A view of another implementation of the diagnostic component.

[0040] Figure 8 and Figure 9 This is a view schematically illustrating an embodiment in which the diagnostic components are positioned within the substrate processing apparatus. Detailed Implementation

[0041] The inventive concept can be modified and taken in various forms, and specific embodiments of the inventive concept will be shown and described in detail in the accompanying drawings. However, the embodiments of the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions included within the spirit and scope of the inventive concept. In the description of the inventive concept, detailed descriptions of relevant prior art may be omitted where it may obscure the essence of the inventive concept.

[0042] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a,” “one,” and “described” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that, when used in this specification, the terms “comprise” and / or “comprising” specify the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. As used herein, the term “and / or” includes any and all combinations of one or more associated listed items. Furthermore, the term “exemplary” is intended to refer to an example or illustration.

[0043] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another region, layer, or section. Therefore, without departing from the inventive concept, the first element, first component, first region, first layer, or first section discussed below may be referred to as a second element, second component, second region, second layer, or second section.

[0044] In the following text, reference will be made to Figures 1 to 9 Description of embodiments of the present invention.

[0045] Figure 1 This is a schematic view of a substrate processing apparatus according to an embodiment of the present invention. (Reference) Figure 1 The substrate processing apparatus 10 includes a transposition module and a processing module. The transposition module has a loading port 120 and a transfer frame 140. The loading port 120, the transfer frame 140, and the processing module are arranged sequentially in one direction. Hereinafter, the direction in which the loading port 120, the transfer frame 140, and the processing module are arranged is referred to as a first direction 12, the direction perpendicular to the first direction 12 is referred to as a second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as a third direction 16.

[0046] A carrier 130 for accommodating the substrate W is positioned within a loading port 120. Multiple loading ports 120 are provided and arranged along a second direction 14. The number of loading ports 120 can be increased or decreased depending on the process efficiency and area occupied by the processing module. Multiple slots (not shown) are formed in the carrier 130 for accommodating the substrate W, which is positioned horizontally relative to the ground. A front-opening combined wafer cassette (FOUP) can be used as the carrier 130.

[0047] The processing module includes a buffer unit 220, a transfer chamber 240, and a processing chamber 260. The transfer chamber 240 is arranged along a longitudinal direction parallel to a first direction 12. The processing chambers 260 are respectively arranged on both sides of the transfer chamber 240. The processing chambers 260 can be arranged symmetrically on both sides of the transfer chamber 240. On each side of the transfer chamber 240, the processing chambers 260 are arranged along the longitudinal direction of the transfer chamber 240 (e.g., the first direction 12) and stacked on top of each other along a third direction 16. That is, the processing chambers 260 can be arranged in an A×B arrangement on each side of the transfer chamber 240. Here, A is the number of processing chambers 260 arranged along the first direction 12, and B is the number of processing chambers 260 arranged along the third direction 16. When four or six processing chambers 260 are provided on each side of the transfer chamber 240, the processing chambers 260 can be arranged in a 2×2 or 3×2 arrangement on each side. The number of processing chambers 260 can be increased or decreased. Unlike the above, the processing chamber 260 may be located on only one side of the transfer chamber 240. Furthermore, the processing chamber 260 may be arranged as a single layer (not stacked) on one and / or both sides of the transfer chamber 240.

[0048] A buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240. The buffer unit 220 provides space for the substrate W to remain before it is transferred between the transfer chamber 240 and the transfer frame 140. A slot (not shown) for placing the substrate W is provided inside the buffer unit 220. Multiple slots (not shown) are spaced apart from each other in a third direction 16. The buffer unit 220 has an opening side facing the transfer frame 140 and an opening side facing the transfer chamber 240.

[0049] The transfer frame 140 provides a transfer space for transferring the substrate W between the carrier 130, which is seated on the loading port 120, and the buffer unit 220. A transposition track 142 and a transposition robot 144 are disposed inside the transfer frame 140. The transposition track 142 is arranged parallel to a second direction 14, wherein the longitudinal direction of the transposition track is the longitudinal direction of the transposition frame. The transposition robot 144 is mounted on the transposition track 142 and moves linearly along the transposition track 142 in the second direction 14. The transposition robot 144 has a base 144a, a body 144b, and a transposition arm 144c. The base 144a is mounted to be movable along the transposition track 142. The body 144b is coupled to the base 144a. The body 144b is configured to be movable on the base 144a in a third direction 16. Furthermore, the body 144b is configured to be rotatable on the base 144a. The indexing arm 144c is coupled to the body 144b and configured to move forward and backward relative to the body 144b. Multiple indexing arms 144c are configured to be individually driven. The indexing arms 144c are stacked while being spaced apart from each other on the third direction 16. Some of the indexing arms 144c are used to transfer the substrate W from the processing module to the carrier 130, and some of the other indexing arms are used to transfer the substrate W from the carrier 130 to the processing module. This prevents particles generated from the substrate W before process processing from adhering to the substrate W after process processing during the process of the indexing robot 144 placing and removing the substrate W.

[0050] The transfer chamber 240 provides a transfer space for transferring substrate W between the buffer unit 220 and the processing chamber 260, and between the processing chambers 260. A transfer robot 520 and a transfer track 540 are disposed inside the transfer chamber 240. The transfer track 540 is arranged parallel to a first direction 12, wherein the longitudinal direction of the transfer track is the longitudinal direction of the transfer chamber. The transfer robot 520 is mounted on the transfer track 540 and moves linearly along the transfer track 540 in the first direction 12. The transfer robot 520 can transfer substrate W to a desired processing chamber 260 within the processing chambers 260 while moving linearly along the transfer track 540 in the first direction 12, or it can remove substrate W from a processing chamber 260 selected from a plurality of processing chambers 260. The transfer robot 520 will be described in more detail later.

[0051] Processing chamber 260 is equipped with substrate processing equipment for liquid processing of substrate W. For example, processing chamber 260 may be a chamber that performs a cleaning process by supplying a cleaning solution to substrate W. Alternatively, processing chamber 260 may be a chamber that performs a wet etching process by supplying liquid plasma to remove a thin film from the substrate. Depending on the type of process used to process substrate W, the substrate processing equipment in processing chamber 260 may have different structures. Alternatively, the substrate processing equipment in each processing chamber 260 may have the same structure. Alternatively, processing chambers 260 may be divided into multiple groups, and processing chambers 260 belonging to any one group may be processing chambers 260 performing either the cleaning process or the wet etching process, while processing chambers 260 belonging to another group may be processing chambers 260 performing the other of the cleaning process and the wet etching process.

[0052] Figure 2 It shows the setting Figure 1 A view of a substrate processing apparatus in a processing chamber. The substrate processing apparatus 300 may include a housing 310, a processing container 320, a support unit 340, a lifting / lowering unit 360, and a liquid supply unit 380.

[0053] The housing 310 has a processing space 312. The processing container 320, support unit 340, lifting / lowering unit 360, and liquid supply unit 380 can be disposed within the internal space 312 of the housing 310. The housing 310 can have a generally rectangular parallelepiped shape. However, the inventive concept is not limited thereto, and the housing 310 can be modified into various shapes.

[0054] The processing container 320 may have a cylindrical shape with an open top. The processing container 320 has an internal recollection container 322 and an external recollection container 326. Each of the internal recollection container 322 and the external recollection container 326 is used to recover different processing liquids from the processing liquid used in the process. The internal recollection container 322 is arranged in an annular shape around the substrate support unit 340, and the external recollection container 326 is arranged in an annular shape around the internal recollection container 326. The internal space of the internal recollection container 322 serves as a first inlet 322a through which the processing liquid is introduced into the internal recollection container 322. The space between the internal recollection container 322 and the external recollection container 326 serves as a second inlet 326a through which the processing liquid flows into the external recollection container 326. According to one embodiment, each of the first inlet 322a and the second inlet 326a may be located at different heights. Recollection lines 322b and 326b are connected to the bottom of each of the inner recollection container 322 and the outer recollection container 326. Processing fluid introduced into each of the inner recollection container 322 and the outer recollection container 326 can be reused in the external processing fluid regeneration system (not shown) via recollection lines 322b and 326b.

[0055] The support unit 340 supports the substrate W in the processing space 312. The support unit 340 supports and rotates the substrate W during the process. The support unit 340 has a support plate 342, a support pin 344, a chuck pin 346, and a rotation drive member.

[0056] The support plate 342 is configured to be substantially circular and has a top surface and a bottom surface. The diameter of the bottom surface is smaller than the diameter of the top surface. The support plate 342 may have a horizontal cross-sectional area that gradually decreases from top to bottom. The top surface and the bottom surface are configured such that their central axes coincide with each other. Furthermore, a heating device (not shown) is provided in the support plate 342 to heat the substrate according to the type of liquid being processed during liquid processing.

[0057] Multiple support pins 344 are provided. The support pins 344 are disposed along the edge of the top surface of the support plate 342 and spaced apart from each other by a predetermined distance, thereby defining the shape of the annular hole as a whole and protruding upward from the support plate 342. The support pins 344 can support the edge portion of the bottom surface of the substrate W, such that the substrate W is spaced apart from the top surface of the support plate 342 by a predetermined distance.

[0058] Multiple chuck pins 346 are provided. The chuck pins 346 are positioned further away from the center of the support plate 342 than the support pins 344. The chuck pins 346 are configured to project upwards from the top surface of the support plate 342. The chuck pins 346 support the side portions of the substrate W such that the substrate W does not laterally separate from a predetermined position when the support plate 342 rotates. The chuck pins 346 are configured to be linearly movable along the radial direction of the support plate 324 between an outer position and an inner position. The outer position is the position further away from the center of the support plate 342 compared to the inner position. When the substrate W is loaded or unloaded on the support plate 342, the chuck pins 346 are positioned in the outer position, and when a process is performed on the substrate W, the chuck pins 346 are positioned in the inner position. The inner position is the position where the chuck pins 346 and the side portions of the substrate W contact each other, and the outer position is the position where the chuck pins 346 and the substrate W are spaced apart from each other.

[0059] A rotational drive member causes the support plate 342 to rotate. The support plate 342 can rotate about its central axis via the rotational drive member. The rotational drive member includes a support shaft 348 and a drive unit 349. The support shaft 348 extends along a third direction 16. The top end of the support shaft 348 is fixedly coupled to the bottom surface of the support plate 342. According to one embodiment, the support shaft 348 can be fixedly coupled to the center of the bottom surface of the support plate 342. The drive unit 349 provides a driving force to rotate the support shaft 348. The support shaft 348 is rotated by the drive unit 349, and the support plate 342 can rotate together with the support shaft 348.

[0060] The lifting / lowering unit 360 linearly moves the processing container 320 in the up / down direction. As the processing container 320 moves up and down, its relative height to the support plate 342 changes. When the substrate W is loaded or unloaded from the support plate 342, the processing container 320 of the lifting / lowering unit 360 is lowered, causing the support plate 342 to protrude upwards from the processing container 320. Furthermore, during the process, the height of the processing container 320 is adjusted so that the processing liquid flows into a preset internal collection container 322 and an external collection container 326, depending on the type of processing liquid supplied to the substrate W. The lifting / lowering unit 360 includes a bracket 362, a moving shaft 364, and a driver 366. The bracket 362 is fixedly mounted on the outer wall of the processing container 320 and is fixedly connected to the bracket 362 via the moving shaft 364, which moves in the up / down direction via the driver 366. Optionally, the lifting / lowering unit 360 can move the support plate 342 in the up / down direction.

[0061] Liquid supply unit 380 supplies processing liquid to substrate W. The processing liquid can be a chemical, rinsing fluid, wetting fluid, cleaning fluid, or organic solvent. Chemicals can be acidic or alkaline liquids. Chemicals may include sulfuric acid (H₂SO₄), phosphoric acid (P₂O₅), hydrofluoric acid (HF), and ammonium hydroxide (NH₄OH). Chemicals may be a diluted mixture of sulfuric acid peroxide (DSP). Cleaning fluid, rinsing fluid, and wetting fluid may be deionized water (H₂O). Organic solvents may be isopropanol (IPA) solution.

[0062] The liquid supply unit 380 may include a moving member 381 and a nozzle 389. The moving member 381 moves the nozzle 389 to a process position and a standby position. The process position is the position where the nozzle 389 faces the top surface of the substrate W supported by the support unit 340. According to one embodiment, the process position is the position where the processing liquid is discharged onto the top surface of the substrate W. Furthermore, the process position includes a first supply position and a second supply position. The first supply position may be a position closer to the center of the substrate W than the second supply position, and the second supply position may be a position relatively closer to the edge region of the substrate than the center of the substrate. Optionally, the second supply position may be a region adjacent to an end of the substrate. The standby position is defined as the position where the nozzle 389 deviates from the process position. According to one embodiment, the standby position may be a position where the nozzle 389 is prepared before or after completing the process processing on the substrate W.

[0063] The moving member 381 includes an arm 382, ​​a support shaft 383, and a driver 384. The support shaft 383 is located near the side wall of the processing container 320. The support shaft 383 has a rod shape extending in a third direction. The support shaft 383 is configured to be rotatable by the driver 384. The support shaft 383 is configured to move upward and downward. The arm 382 is coupled to the top end of the support shaft 383. The arm 382 extends horizontally (i.e., perpendicular to the support shaft 383). A nozzle 389 is coupled to the end of the arm 382. As the support shaft 383 rotates, the nozzle 389 can swing along with the arm 382. The nozzle 389 can swing and move to a process position and a standby position. Optionally, the arm 382 is configured to move forward and backward in its longitudinal direction. When viewed from above, the central axis of the substrate W can be positioned on the path through which the nozzle 389 moves.

[0064] Figure 3 It shows the setting Figure 1 A view of an embodiment of the transfer chamber 240 in the substrate processing apparatus 10. (See reference...) Figure 1 and Figure 3 The transfer chamber 240 can transfer the substrate W between the processing chamber 260 and the buffer unit 220, and within the processing chamber 260. The transfer chamber 240 can provide transfer space for transferring the substrate W.

[0065] A flow supply unit (not shown) can be provided on the top surface of the transfer chamber 240, which forms a downward flow entering the interior space of the transfer chamber 240. The flow supply unit includes a fan and a filter. The flow supply unit supplies outside air to the housing. The filter removes impurities contained in the air. The fan forms a downward flow in the interior space of the transfer chamber 240. In the flow supply unit, various particles generated in the interior space of the transfer chamber 240 are discharged to the outside along with the downward flow through an exhaust member. The exhaust member 560 can be mounted on the bottom surface of the transfer chamber 240. The flow formed inside the transfer chamber 240 is discharged to the outside of the substrate processing apparatus 10 through the exhaust member 560.

[0066] The transfer robot 520 and the transfer track 540 are disposed inside the transfer chamber 240. The transfer robot 520 may include a hand 521, a hand drive unit 522, a rotation drive unit 523, a vertical drive unit 524, and a horizontal drive unit 525.

[0067] Specifically, the hand 521 can support the substrate W. The hand 521 is mounted on the top portion of the hand drive unit 522. The hand drive unit 522 can move the hand 521 horizontally. The number of hands 521 can be increased according to the efficiency of the substrate processing process. In one embodiment, when multiple hands 521 are provided, some hands can be used to convey the substrate W into the processing chamber 260, and other hands can be used to convey the substrate W out of the processing chamber 260. A rotary drive unit 523 is mounted below the hand drive unit 522. The rotary drive unit 523 is coupled to the hand drive unit 522 and rotates itself to rotate the hand drive unit 522. Therefore, the hands 521 coupled to the hand drive unit 522 can rotate together, and the hands 521 can be configured to move along a first direction 12 and / or a second direction 14. A vertical drive unit 524 is mounted below the rotary drive unit 523, and a horizontal drive unit 525 is mounted below the vertical drive unit 524. A vertical drive unit 524 is coupled to a rotary drive unit 523 to raise and lower the rotary drive unit 523, thereby adjusting the vertical position of the hand 521 and the hand drive unit 522. Thus, the hand 521 can be configured to move along a third direction 16. A horizontal drive unit 525 is coupled to a transfer track 540 and moves linearly along a first direction 12 on the transfer track. In one embodiment, the hand drive unit 522, rotary drive unit 523, vertical drive unit 524, and horizontal drive unit 525 can be configured as motors. As the transfer robot 520 moves along the first direction 12, the transfer robot 520 can selectively transfer the substrate W to / from the processing chamber 260.

[0068] The drive unit disposed inside the transfer chamber 240 can move in its position within the transfer chamber 240. In one embodiment, the drive unit disposed inside the transfer chamber 240 may be a hand drive unit 522, a rotation drive unit 523, a vertical drive unit 524, and a horizontal drive unit 525.

[0069] The transfer robot 520 described in the above example corresponds to the implementation method, and the configuration of the transfer robot 520 can be modified differently to a known robot unit capable of transferring the substrate W.

[0070] Figure 4 This is a view illustrating an embodiment of a diagnostic component disposed on a substrate processing apparatus. (Reference) Figure 4 The diagnostic component 700 may include a detection component 720 and a diagnostic component 740. The diagnostic component 700 is installed in the transfer chamber 240.

[0071] The detection component 720 diagnoses air vibrations generated in the transport space inside the transport chamber 240. The detection component 720 may include an inlet portion 722 and a main body portion 724.

[0072] The entrance portion 722 introduces air vibrations into the conveying space within the conveying chamber 240. The entrance portion 722 can extend from the end of the main body portion 724 and can have a generally circular shape. The entrance portion 722 can be arranged in a grid structure on its outer circumferential surface. The entrance portion 722 can be formed of a plastic material.

[0073] The main body 724 may be a hollow cylindrical shape, with one end connected to the inlet portion 722 and the other end closed. The main body 724 is provided with a valve that vibrates in response to vibrations of air received from the inlet portion 722. The valve may be configured as a diaphragm so that it vibrates even with minute vibrations of the air. The shapes of the inlet portion 722 and the main body 724 are not limited to these and can be modified into various shapes and configurations.

[0074] Airflow can be formed in the conveying space by a flow supply unit (not shown) mounted on the top surface of the conveying chamber 240 and an exhaust member 621 mounted on the bottom surface. Alternatively, airflow can be formed in the conveying space by a drive unit disposed inside the conveying chamber 240. However, this is not a limitation, and airflow can be formed inside the conveying space for various reasons. The inlet portion 722 may have a grid structure defining a fine space that can block airflow formed inside the conveying space and can only introduce (e.g., deliver) vibrations of air generated by the drive unit. Therefore, vibrations of pure air generated only by the drive unit can be provided to the valve. Thus, the reliability of detecting vibrations of air generated by the drive unit disposed inside the conveying chamber 240 can be improved.

[0075] The diagnostic component 740 diagnoses abnormal conditions of the drive unit located inside the transfer chamber 240 based on vibrations of the air introduced from the detection component 720. The diagnostic component 740 may include a conversion unit 742, a diagnostic unit 744, and a display unit 746.

[0076] The conversion unit 742 converts the vibration of the air introduced into the transmission chamber 240 into a waveform through the vibration of the valve. The conversion unit 742 sends the converted waveform signal to the diagnostic unit 744 and the display unit 746 respectively.

[0077] The diagnostic unit 744 uses the converted waveform generated by the conversion unit 742 to diagnose the drive unit located inside the transmission chamber 240. When the drive unit located inside the transmission chamber 240 is in a normal state, the waveform of the air vibration inside the transmission space is defined as the reference range waveform.

[0078] Figure 5 This is an evaluation view showing the waveform stiffness of the diagnostic component 700. (Reference) Figure 5 When the peak value of the converted waveform exceeds the peak value range of the normal waveform, the diagnostic unit 744 can determine that the drive unit installed inside the transfer chamber 240 is malfunctioning. Furthermore, if the curve of the converted waveform does not match the curve of the reference range waveform, the diagnostic unit 744 can determine that the drive unit installed inside the transfer chamber 240 is in an abnormal state. Additionally, the diagnostic unit 744 can determine whether the drive unit installed inside the transfer chamber 240 is defective by comparing the value of the converted waveform when the drive unit installed inside the transfer chamber 240 passes through a specific position with the value of the reference range waveform. An abnormal state of the drive unit installed inside the transfer chamber 240 refers to an abnormality occurring in at least one motor, such as the hand drive unit 522, the rotary drive unit 523, the vertical drive unit 524, the horizontal drive unit 525, or the timing belt.

[0079] Return to reference Figure 4 The display unit 746 is connected to the conversion unit 742 and the diagnostic unit 744. The display unit 746 can convert the waveform converted by the converter 742 into an electrical signal and display the waveform of the transmission space inside the transmission chamber 240. Therefore, the operator can monitor in real time whether the drive unit installed inside the transmission chamber 240 is defective. The display unit 746 can display the diagnostic results of the diagnostic unit 744. The display unit 746 can be configured as an oscilloscope for converting waveforms into electrical signals. The conversion unit 742, the diagnostic unit 744, and the display unit 746 can be connected via wired or wireless means to enable communication between them.

[0080] Therefore, according to the embodiments of the present invention, abnormal states of drive units can be efficiently determined by analyzing the waveform of air vibrations in the transport space without the need for the operator to directly inspect the drive units (e.g., hand drive unit 522, rotary drive unit 523, vertical drive unit 524, horizontal drive unit 525). Since the airflow formed in the transport space can be blocked by the mesh structure of the inlet portion 722 and only air vibrations can be introduced, the diagnostic reliability of the drive components provided in the transport chamber 240 can be improved.

[0081] Figure 6 and Figure 7 It shows Figure 4 A view of another embodiment of the diagnostic component 700. The differences from the above embodiment of the diagnostic component 700 will be described below.

[0082] refer to Figure 6 The inlet portion 722a of the diagnostic component 700a introduces air vibrations into the internal transport space of the transport chamber 240. The inlet portion 722a can extend from one end of the main body portion 724 and can have a substantially circular shape at its end. The inlet portion 722a can be formed of a plastic material. The inlet portion 722a can be configured as a porous member. The inlet portion 722a may include multiple through holes penetrating its outer circumferential surface. The inlet portion 722a introduces air vibrations into the transport space through these through holes. The through holes can be configured with very small micropores. Therefore, airflow formed within the transport space can be blocked, and only air vibrations generated by the drive unit can be introduced.

[0083] refer to Figure 7 The inlet portion 722b of the diagnostic component 700b receives vibrations from the air within the internal transport space of the transport chamber 240. The inlet portion 722b can extend longitudinally from one end of the main body portion 724 and terminate in a circular shape, and can also protrude in a direction orthogonal to the longitudinal direction of the main body portion 724. The inlet portion 722b can be provided with a mesh structure or porous components. The inlet portion 722b can be made of plastic material. However, the shape of the inlet portion 722b is not limited to this and can be modified into various shapes and configurations.

[0084] Figures 8 to 9 This is a view schematically illustrating an embodiment in which the diagnostic component 700 is mounted in the substrate processing apparatus 10. (Refer to...) Figures 8 to 9The diagnostic component 700 can be mounted on a fixed member whose position does not move within the transfer chamber 240. In one embodiment, the diagnostic component 700 can be mounted at the midpoint of the transfer track 540. The direction from the inlet portion 722 of the diagnostic component 700 to the main body portion 724 can be parallel to the longitudinal direction of the transfer track 540. For example, the diagnostic component 700 can be mounted on the top or bottom surface of the transfer chamber 240. The diagnostic component 700 can be mounted such that the longitudinal direction from the main body portion 724 of the diagnostic component 700 to the inlet portion 722 can be parallel to the direction from the bottom surface of the transfer chamber 240 toward the top surface. The diagnostic component 700 can be disposed inside the transfer chamber 240 and mounted on the fixed member. The diagnostic component 700 can be mounted in a position where the amount of movement of the fixed member within the transfer chamber 240 is the greatest among the fixed members disposed within the transfer chamber 240. For example, the diagnostic component 700 can be mounted in a fixed position on the transfer track 540, and can be mounted at the midpoint of the transfer track 540, thereby maximizing the movement of the transfer robot 520 between them. The diagnostic component 700 can be mounted such that vibrations of the air generated by the drive unit disposed inside the transfer chamber 240 are introduced in a direction orthogonal to the inlet 722. By mounting the diagnostic component 700 in a suitable position in the transfer space with maximum movement, the vibration frequency of the air flowing into the drive section disposed inside the transfer chamber 240 can be increased. For this reason, the amount of data that can be accumulated to diagnose whether the drive is malfunctioning in real time can be improved, thereby increasing the reliability of diagnosing abnormal drive conditions.

[0085] The following description describes an embodiment in which the diagnostic component 700 is disposed in the processing module. The inventive concept is not limited thereto, and the diagnostic component 700 may also be disposed in a transport component. The transport component may include a housing, a transport robot, and a transport track.

[0086] The housing provides a transport space for transporting the substrate W. In one embodiment, the housing may be a transport frame 140 disposed to a transposition module or a transport chamber 240 disposed to a processing module. However, the inventive concept is not limited thereto, and the housing refers to any substrate processing apparatus having a transport space for transporting the substrate W. A transport robot is disposed in the transport space inside the housing and transports the substrate W. For example, the transport robot may be a transposition robot 144 disposed in the transport space of the transport frame 140 or a transport robot 520 disposed in the transport space of the transport chamber 240. However, the inventive concept is not limited thereto, and the transport robot includes various robot units in a transport device for transporting the substrate W. A transport track is mounted along the longitudinal direction of the housing. The transport robot is mounted on the transport track and moves linearly along the transport track. For example, the transport track may be a transposition track 142 disposed in the transport space of the transport frame 140 or a transport track 540 disposed in the transport space of the transport chamber 240. However, the inventive concept is not limited thereto, and includes tracks mounted to allow the robot transporting the substrate W to move linearly.

[0087] When the transfer component 600 is configured to the transpose module, in one embodiment, the first unit may be the loading port 120, and the second unit may be the buffer unit 220. When the transfer component 600 is configured to the processing module, in one embodiment, the first unit may be the processing chamber 260, and the second unit may be a different processing chamber 260 from the first unit. Furthermore, the first unit may be the processing chamber 260, and the second unit may be the buffer unit 220.

[0088] In the above example, the case where the conveying component 600 is set to the processing module is described as an example, but the inventive concept is not limited thereto. For example, even when set to the indexing module, the conveying component 600 and the diagnostic component 700 mounted in the housing can be applied in the same / similar manner. Furthermore, the conveying component 600 and the diagnostic component 700 mounted in the housing can be applied in the same / similar manner to a substrate processing apparatus having a conveying space for a conveying substrate W. For example, the conveying track 540 can be applied in the same / similar manner to a conveying apparatus for conveying substrate W (e.g., a top-mounted conveying apparatus). Furthermore, the conveying track 540 can be applied in the same / similar manner to a tower lift that moves a container in which articles are contained in the up / down direction.

[0089] In the above example, the processing chamber 260 of the substrate processing apparatus 10 supplies processing liquid to perform a liquid processing process for processing the substrate W, but the inventive concept is not limited thereto. For example, the processing chamber 260 of the substrate processing apparatus 10 can perform a coating process to form a liquid film on the substrate W by supplying a photoresist solution, or it can use plasma to perform a plasma process for processing the substrate W. Furthermore, the processing chamber 260 can use supercritical fluid to perform a supercritical drying process for processing. That is, the transfer assembly 600 and the diagnostic assembly 700 mounted in the housing according to embodiments of the inventive concept can be applied differently to known substrate processing apparatuses provided with position-moving components.

[0090] The effects of this invention are not limited to those described above, and those skilled in the art to which this invention pertains can clearly understand any effects not mentioned from the specification and drawings.

[0091] Although preferred embodiments of the inventive concept have been shown and described up to now, the inventive concept is not limited to the specific embodiments described above, and it should be noted that those skilled in the art to which the inventive concept relates can implement the inventive concept differently without departing from the essence of the inventive concept as claimed in the claims, and should not be interpreted or modified separately from the technical spirit or prospect of the inventive concept.

Claims

1. A substrate processing apparatus, comprising: Processing chamber, the processing chamber being configured as a processing substrate; A transfer assembly configured to transfer the substrate to the processing chamber; as well as A diagnostic component, configured to detect abnormal states of the transmission component, and The transmission component includes: A housing having a conveying space and including a conveying chamber and two conveying tracks on the bottom surface of the conveying chamber; and A transfer robot, configured to transfer the substrate to the processing chamber, and The diagnostic component includes: A detection component, the detection component being used to detect air vibrations generated within the housing; and A diagnostic component for diagnosing the drive unit of the transmission assembly based on the air vibrations detected by the detection component. The diagnostic component is fixed to the bottom surface of the transfer chamber and located at the midpoint between the two transfer tracks. The detection component includes: An inlet portion, the inlet portion being used to introduce the air vibrations generated within the housing; and The main body portion has a valve configured to provide vibration in response to air vibration introduced from the inlet portion, and The inlet portion includes a porous component.

2. The substrate processing apparatus according to claim 1, wherein the diagnostic component comprises: A conversion unit, the conversion unit being used to convert the vibration of the valve into a waveform; A diagnostic unit, the diagnostic unit being used to diagnose the waveform converted by the conversion unit; as well as The display unit is used to display the results of the waveform analysis.

3. The substrate processing apparatus according to claim 2, wherein when the peak value of the waveform converted by the conversion unit is outside a preset normal range waveform, the diagnostic unit determines that the drive unit of the transmission component is in an abnormal state.

4. A substrate processing apparatus, comprising: Unit 1; The second unit is different from the first unit; A transmission component configured to transmit a substrate between the first unit and the second unit; as well as A diagnostic component, configured to detect abnormal states of the transmission component, and The transmission component includes: A housing having a conveying space and including a conveying chamber and two conveying tracks on the bottom surface of the conveying chamber; and A transfer robot, configured to transfer the substrate, and The diagnostic component includes: A detection component, the detection component being used to detect air vibrations generated within the housing; and A diagnostic component for diagnosing the drive unit of the transmission assembly based on the air vibrations detected by the detection component. The diagnostic component is fixed to the bottom surface of the transfer chamber and located at the midpoint between the two transfer tracks. The detection component includes: An inlet portion, the inlet portion being used to introduce the air vibrations generated within the housing; and The main body portion has a valve configured to provide vibration in response to air vibration introduced from the inlet portion, and The inlet portion includes a porous component.

5. The substrate processing apparatus according to claim 4, wherein the diagnostic component comprises: A conversion unit, the conversion unit being used to convert the vibration of the valve into a waveform; A diagnostic unit, the diagnostic unit being used to diagnose the waveform converted by the conversion unit; as well as The display unit is used to display the results of the waveform analysis.

6. The substrate processing apparatus according to claim 5, wherein when the peak value of the waveform converted by the conversion unit is outside a preset normal range waveform, the diagnostic unit determines that the drive unit of the transmission component is in an abnormal state.

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