Substrate peeling apparatus, film forming apparatus, substrate stage, substrate peeling method, and film forming method

Abstract

The present application provides a substrate peeling apparatus, a film forming apparatus, a substrate stage, a substrate peeling method, and a film forming method, which do not adversely affect a display element region on a substrate and can peel the substrate from a substrate stage in a short time. The substrate peeling apparatus peels a substrate from a substrate stage (100) that holds the substrate using a plurality of adsorption pads, characterized in that the substrate stage (100) is provided with the plurality of adsorption pads and a plurality of peeling portions that peel the substrate in a manner that the adsorption pads are respectively along an outer peripheral portion of the held substrate and a boundary portion of the held substrate corresponding to a display element region.

Description

Technical Field

[0001] The present invention relates to a substrate peeling apparatus, a film forming apparatus, a substrate stage, a substrate peeling method, and a film forming method for peeling a substrate held on a substrate stage. Background Technology

[0002] In recent years, the FPD (Flat Panel Display) industry has seen a trend towards utilizing large glass substrates, known as mother glass, to improve production efficiency. Large glass substrates are used to divide multiple image display sections for each display from a single mother glass. For example, mother glass exceeding two meters in length on one side undergoes manufacturing processes such as film deposition, and is then divided along the substrate cutting lines separating the image display sections to create final products of various desired sizes. Generally, the thickness of the mother glass is less than a few millimeters. Minimizing the effects of flexing and breakage is a crucial issue; during the manufacturing process, the mother glass is transported integrally with the substrate stage while undergoing vacuum film deposition.

[0003] To integrate the mother glass with the substrate stage, adhesive members are preferably used. In the adhesive member, it is required to maintain the adhesive strength of the mother glass and the peelability to separate the glass in a short time, and preferably, it should be reusable multiple times. For example, Patent Document 1 discloses a technique that includes multiple adhesive members for holding the substrate and peeling pins protruding from the sides of each adhesive member toward the substrate.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2015-046517 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] In the technology disclosed in Patent Document 1, adhesive members and release pins are arranged throughout the entire area of ​​the substrate. Therefore, in functional areas requiring subsequent processing such as film deposition—in other words, in the image display area (display element area) of the final product—the adhesive members and release pins will also come into contact with the substrate. For example, during vacuum film deposition, localized differences in thermal conductivity may occur due to the contact of the adhesive members, impairing the uniformity of the film deposition. Alternatively, traces may remain in the image display area due to contact with the release pins. This could potentially affect the display of high-resolution images.

[0009] In view of the above issues, some embodiments aim to peel the substrate from the substrate stage while suppressing the impact on the display element area on the substrate.

[0010] Methods for solving problems

[0011] The substrate peeling device of one side of the present invention peels the substrate from a substrate stage that holds the substrate using a plurality of adsorption pads. The substrate stage is characterized in that the plurality of adsorption pads and the plurality of peeling portions for peeling the substrate are provided respectively along the outer periphery of the held substrate and the boundary between the held substrate and the display element area.

[0012] The effects of the invention

[0013] According to at least some of the embodiments, the substrate can be peeled off from the substrate stage while suppressing the impact on the display element area on the substrate. Attached Figure Description

[0014] Figure 1 This is an explanatory diagram (top view) showing an example of a substrate according to an embodiment of the present invention.

[0015] Figure 2 This is an explanatory diagram (top view) showing an example of a substrate stage according to an embodiment of the present invention.

[0016] Figure 3 This is an explanatory diagram (top view) showing an example of a substrate stage according to an embodiment of the present invention.

[0017] Figure 4 This is a schematic cross-sectional view of the substrate stage according to an embodiment of the present invention.

[0018] Figure 5 This is a schematic cross-sectional view of the substrate stage according to an embodiment of the present invention.

[0019] Figure 6 This is a flowchart illustrating the processing steps of a substrate according to an embodiment of the present invention.

[0020] Figure 7 This is an operational illustration of the substrate holding device according to an embodiment of the present invention.

[0021] Figure 8 This is an operational illustration of the substrate holding device according to an embodiment of the present invention.

[0022] Figure 9 This is an operational illustration of the substrate holding device according to an embodiment of the present invention.

[0023] Figure 10 This is an operational illustration of the substrate holding device according to an embodiment of the present invention.

[0024] Figure 11 This is an explanatory diagram of the operation of the reversing device according to an embodiment of the present invention.

[0025] Figure 12 This is an illustration of the film-forming process according to an embodiment of the present invention.

[0026] Figure 13 This is a schematic diagram illustrating the substrate peeling operation according to an embodiment of the present invention.

[0027] Figure 14 This is a schematic diagram illustrating the substrate peeling operation according to an embodiment of the present invention.

[0028] Figure 15 This is an operational illustration of the substrate peeling device according to Embodiment 1 of the present invention.

[0029] Figure 16 This is an explanatory diagram (top view) showing an example of the peeling pin unit of Embodiment 2 of the present invention.

[0030] Figure 17 This is an operational illustration of the substrate peeling device according to Embodiment 2 of the present invention.

[0031] Figure 18 This is an explanatory diagram (schematic cross-sectional view) showing an example of the peeling pin unit of Embodiment 3 of the present invention.

[0032] Figure 19 This is an operational illustration of the substrate peeling device according to Embodiment 3 of the present invention.

[0033] Figure 20 This is an explanatory diagram of an organic EL display device according to an embodiment of the present invention.

[0034] Explanation of reference numerals in the attached figures

[0035] 10…Main glass (substrate) 10x…Main glass mounting area 11, 12, 13…Image display unit 14…Inner region 15…Outer region 100, 100X…Substrate stage 110…Plate member 110x…Substrate holding surface 111, 112…Through hole 120…Adsorption pad 123…Adhesive member 341…Release pin. Detailed Implementation

[0036] Hereinafter, embodiments and examples of the present invention will be described based on the accompanying drawings. Unless otherwise specified, the dimensions, materials, shapes, and relative arrangements of the structural components described in this specification are not intended to limit the scope of the invention. In this specification, "adhesion" refers to the property arising from intermolecular forces between an adhesive material and the surface of an adherend, such as a glass substrate, when the adhesive material is in contact with the surface of the adherend. Furthermore, "peeling" refers to the separation of the adhesive material from the adherend.

[0037] The following describes a substrate peeling apparatus, a film forming apparatus, a substrate stage, a substrate peeling method, and a film forming method according to embodiments of the present invention. Furthermore, the above-described apparatus and method can preferably be applied to manufacturing apparatuses and methods for manufacturing electronic devices. Additionally, the film forming method can employ various methods such as vapor deposition and sputtering, and the film forming material can be various materials. Furthermore, the substrate peeling method and film forming method of this embodiment can also be understood as a program that enables a computer to execute it, and a storage medium storing that program. The storage medium can also be a non-temporary storage medium that can be read by a computer.

[0038] In the embodiments and examples described below, the traveling direction of the substrate stage and the substrate is set as the X-axis direction, the direction orthogonal to the traveling direction in the substrate surface is set as the Y-axis direction, and the direction perpendicular to the substrate surface (the vertical direction in this embodiment and example) is set as the Z-axis direction.

[0039] (Implementation Method)

[0040] In this embodiment, the case where the substrate is made of glass is used as an example. However, the substrate material that can be used in this embodiment is not limited to glass.

[0041] <Mother Glass>

[0042] Figure 1 This is a top view showing an example of the mother glass 10, which serves as the substrate in this embodiment. As shown, the vertices of the mother glass 10 are represented by O, P, Q, and R. This mother glass 10 is subsequently formed into image display sections 11, 12, and 13 using a three-panel construction. These image display sections 11, 12, and 13 correspond to display element areas. The line JK connecting point J on edge OR to point K on edge PQ and the line GH connecting point G on edge OP to point H on edge JK are cutting lines that are cut in subsequent processes. Figure 1 In this design, the area corresponding to the cut line is referred to as the inner region 14, which serves as the boundary, and the periphery of the mother glass 10 is referred to as the outer region 15, which serves as the outer periphery. After being cut, the portion other than the inner region 14 and the outer region 15 corresponds to the display element area.

[0043] In addition, Figure 1 The illustration shows an example of three-panel molding of the image display section from the mother glass 10, but the implementation is not limited to this. Multi-panel molding of the image display size is possible, and the panel molding pattern is not limited to the example shown. The substrate size can also be appropriately selected.

[0044] <Substrate stage>

[0045] use Figures 2-5The substrate stage 100 of this embodiment will be described. To emphasize the characteristic structure, the scale may sometimes differ from the actual scale.

[0046] The substrate stage 100 avoids the image display section and discretely arranges the adhesive members and release pins on the outer periphery 15 of the mother glass 10 and the boundary 14 corresponding to the display element area. The boundary 14 is the part corresponding to the substrate cutting line where the mother glass is cut in a subsequent process.

[0047] Figure 2 This is a top view schematic diagram showing an example of the substrate stage 100 of this embodiment. By placing the mother glass 10 on the substrate holding surface 110x of the substrate stage 100 and adsorbing the mother glass 10 onto the adsorption pad 120, the mother glass 10 is held on the substrate stage 100. In other words, the substrate stage 100 and the mother glass 10 are configured to be integrated. Figure 2 In the diagram, the portion 10x where the mother glass is mounted is indicated by a dashed line. The substrate stage 100 includes a flat plate member 110. This flat plate member 110 has a plurality of through holes 111 and 112 arranged along the inner region 14 and outer region 15 of the mother glass 10, respectively. The through holes 111 allow the substrate mounting pin 240 for mounting the mother glass 10 and the peeling pin 341 used during substrate peeling to pass through, while the through holes 112 are used to mount adhesive pads 120.

[0048] Furthermore, the substrate stage 100 includes multiple support members 130 for supporting the periphery of the mother glass 10 relative to the flat member 110. Various known technologies, such as conventional clamping devices, can be used as the support members 130. The mother glass 10, placed on the substrate stage 100, is fixed to the substrate holding surface 110x by means of multiple adsorption pads 120 and support members 130, thereby becoming integrated with the substrate stage 100.

[0049] Next, the process of peeling the mother glass 10 from the substrate stage 100 after the prescribed treatments, such as film formation, will be described. Here, refer to... Figures 3-5 The process of peeling off the mother glass 10 using a peeling pin is explained. Figure 3 (A) also shows the adhesive member 123 and the release pin 341 mounted in the adsorption pad 120 of the substrate stage 100. In addition, for ease of understanding of the configuration, only the outer edge of the mother glass 10 is shown with dashed lines. Figure 4 and Figure 5 These are partial cross-sectional views of the substrate stage 100, respectively. Figure 3 (A) E-E' section view and F-F' section view.

[0050] The adsorption pad 120 is mounted on the flat member 110 with the through hole 112 for passing through the adsorption pad. The fixed part 127 of the shaft 126 in the adsorption pad 120 is integrated with the fixing member 150 by a known method and fixed to the flat member 110. The fixing member 150 and the fixing part of the flat member 110 can be any known technology not shown, such as bolts.

[0051] The release pin 341 can move out of and out of the substrate holding surface 110x through the through hole 111, thereby allowing the mother glass 10 to approach or move away from the substrate holding surface 110x. The release pins 341 can be moved individually by a drive mechanism (not shown), or multiple release pins can be moved together by a release pin holder.

[0052] Alternatively, an absorbent pad that also functions as a peeling pin can be used instead of a peeling pin. Figure 3 (B) illustrates an example of an adhesive pad with a peeling function being mounted on a substrate stage 100. This adhesive pad includes an adhesive member 123, a lifting platform 125, and a plurality of metal balls 124 disposed between them. Furthermore, when the lifting platform 125 is lowered, the adhesive member 123 maintains its flat shape and is able to adsorb the substrate (mother glass 10). When the lifting platform 125 is raised, the adhesive member 123 deforms due to the metal balls 124, reducing the adhesive force with the substrate. Therefore, the substrate can be peeled off from the substrate stage 100.

[0053] Furthermore, the shape and size of the flat member 110 can be appropriately set according to the size of the mother glass 10 and the size of the image display section for panel molding. In addition, the size, number and arrangement of the through holes 111, 112, the adsorption pad 120 and the support member 130 can also be appropriately set according to the size of the mother glass 10 and the panel molding size.

[0054] <Absorbent Pad>

[0055] Reference Figure 4The adsorption pad 120 will be described in more detail below. The adsorption pad 120 has an adhesive member 123 provided on a metal shaft 126 via an adhesive layer (not shown). As the material of the adhesive member 123, to suppress the generation of venting that adversely affects the vacuum manufacturing process, fluororubber without siloxane bonds is preferably used. Similarly, the material constituting the adhesive layer is preferably a known adhesive or double-sided tape that does not release venting components. In this embodiment, a φ10mm stainless steel shaft 126 is used, and the adhesive member 123 is made of φ10mm, 0.5mm thick fluororubber. The adhesive member 123 is configured to be adjustable within a certain range along the vertical direction shown in the figure using spacers (not shown) to manage the amount of protrusion from the substrate holding surface 110x. While the amount of protrusion also depends on the size of the components constituting the adsorption pad 120 and the compression characteristics of the adhesive member 123, it is less than the thickness of the mother glass 10. The diameter of the through hole 112 used in the adsorption pad is larger than the outer diameter of the shaft 126. In addition to allowing vertical movement, the adsorption pad 120 also allows a certain degree of oscillation.

[0056] <Film-forming apparatus and film-forming method>

[0057] The film-forming apparatus of this embodiment includes various substrate processing apparatuses such as a device for holding a substrate on a substrate stage 100, a device for forming a thin film on the substrate using a film-forming source, and a substrate peeling device for peeling the substrate with the formed film from the substrate stage 100. Furthermore, the substrate is transported while undergoing various processing procedures. Hereinafter, reference will be made to... Figure 6 The flowchart shown illustrates the substrate processing steps.

[0058] The substrate processing steps are roughly divided into: 1. substrate holding step, 2. inversion step, 3. mask holding step, 4. film deposition step, and 5. substrate peeling step. All of these steps are performed under a vacuum atmosphere. The substrate holding step further includes: (a) preparation step, (b) substrate placement step, and (c) substrate bonding step. These steps will be described below in order.

[0059] <<1. Substrate Holding Process>>

[0060] This process involves holding the mother glass 10, which serves as the substrate, on the substrate stage 100, utilizing... Figure 7The substrate holding device shown is used for this purpose. This substrate holding device includes: a substrate holding chamber R1; a substrate mounting pin unit 200 (substrate moving mechanism) for moving the mother glass 10 up and down along the Z-axis; a pressing unit 400 for pressing the mother glass 10; and a support platform 500 for supporting the substrate stage 100. The substrate stage 100 includes a flat plate member 110. This flat plate member 110 is supported by the support platform 500 and is configured such that the substrate holding surface 110x is parallel to the horizontal plane. Furthermore, in... Figure 7 The diagram shows a case where a ball screw mechanism is used to move the substrate mounting pin 240, which is mounted on the shaft 440 of the pressing unit 400, up and down. However, other known technologies such as a rack and pinion mechanism can also be used. The above mechanism is controlled by a power supply 710 and a control unit 720.

[0061] The substrate mounting pin unit 200 includes: a motor 210, a lead screw 220 that rotates via the motor 210, a nut portion 230 that moves up and down along the lead screw 220 as the lead screw 220 rotates, and a substrate mounting pin 240 fixed to the nut portion 230 and moving up and down together with the nut portion 230. It is configured such that a plurality of balls circulate infinitely between the inner circumferential surface of the nut portion 230 and the outer circumferential surface of the lead screw 220.

[0062] The pressing unit 400 includes: a motor 410; a lead screw 420 that rotates via the motor 410; a nut portion 430 that moves up and down along the lead screw 420 as the lead screw 420 rotates; a shaft portion 440 that is fixed to the nut portion 430 and moves up and down together with the nut portion 430; and a pressing portion 450 provided at the front end of the shaft portion 440. Furthermore, a plurality of balls are configured to circulate infinitely between the inner circumferential surface of the nut portion 430 and the outer circumferential surface of the lead screw 420. Multiple pressing portions 450 are provided, each corresponding to one of the plurality of suction pads 120.

[0063] The substrate holding chamber R1 is divided into a substrate processing area A1, a first drive source arrangement area A2, and a second drive source arrangement area A3. The first drive source arrangement area A2 is located vertically below the substrate processing area A1, and the second drive source arrangement area A3 is located vertically above the substrate processing area A1. A substrate stage 100, etc., is disposed in the substrate processing area A1. Furthermore, a motor 210, etc., from the substrate mounting pin unit 200 is disposed in the first drive source arrangement area A2, and a motor 410, etc., from the pressing unit 400 is disposed in the second drive source arrangement area A3.

[0064] With the above structure, it is possible to suppress foreign objects generated by the rotation of motors 210 and 410, and foreign objects generated in the sliding part of the ball screw, from intruding into the substrate processing area A1. Furthermore, it is also possible not to place all areas A1, A2, and A3 within the vacuum atmosphere of the substrate holding chamber R1, but instead, for example, place the substrate processing area A1 within the vacuum atmosphere of the substrate holding chamber R1, and place the first drive source placement area A2 and the second drive source placement area A3 in an atmospheric atmosphere.

[0065] <<<1(a). Preparation process>>>

[0066] In the preparatory state before holding the mother glass 10, the substrate mounting pin 240 and the pressing part 450 are both positioned at the uppermost position in the vertical direction. The substrate mounting pin 240 protrudes from the pin-through hole 111 of the flat member 110 in the substrate stage 100 to a position above the substrate holding surface 110x in the vertical direction. The adhesive member 123 in the adsorption pad 120 protrudes slightly from the substrate holding surface 110x and is fixed to the flat member 110 (see reference). Figure 4 Additionally, the pressing part 450 separates from the substrate stage 100. In this state, the mother glass 10 is moved into the substrate processing area A1 of the substrate holding chamber R1, and as follows... Figure 7 The mother glass 10 is placed on a plurality of substrate mounting pins 240 as shown. Furthermore, the transfer of the mother glass 10 into the substrate holding chamber R1 is performed using a transfer robot (not shown). Since the transfer robot is known technology, its description is omitted.

[0067] <<<1(b) Substrate Placement Process>>>

[0068] When the substrate mounting pin 240 is moved vertically downward using the motor 210, the front end of the substrate mounting pin 240 passes through the pin-type through hole 111 of the flat member 110 and moves to a position lower than the side opposite to the substrate holding surface 110x. As a result, the mother glass 10 comes into contact with the adhesive member 123 of the adsorption pad 120.

[0069] Figure 8 This illustration shows a state where the substrate mounting pin 240 moves downwards and the mother glass 10 contacts the adhesive member 123 of the adsorption pad 120. In the case of multi-panel molding of multiple image display sections from the mother glass 10, the adhesive member 123 is absent on the glass surface corresponding to the image display section (see reference). Figure 1 As the substrate mounting pin 240 moves downward, undulations may sometimes remain on the mother glass 10, but these undulations can be reduced by adjusting the downward movement of the substrate mounting pin 240.

[0070] <<<1(c) Substrate bonding process>>>

[0071] Next, the pressing mechanism is used to press the base glass 10. By using the motor 410 to move the pressing part 450 downward in the vertical direction, sufficient contact between the adhesive member 123 of the adsorption pad 120 and the base glass 10 can be ensured. At this time, instead of pressing multiple pressing parts 450 onto the base glass simultaneously, the pressing area can be controlled in a way that gradually changes from a specific starting point to a specific ending point. For example, it can be controlled in a way that the pressing starts from the center of the base glass 10 along its long side and is pressed sequentially towards both ends. Figure 9 The image shows the state in which the pressing part 450 moves downward and the mother glass 10 comes into contact with and adheres (adsorbs) to the adhesive member 123 that protrudes slightly from the flat member 110.

[0072] After that, as Figure 10 As shown, the pressing part 450 is moved vertically upward by the motor 410, and the support member 130 fixes the periphery of the mother glass 10 to the substrate stage 100, thus integrating the mother glass 10 with the substrate stage 100. As described above, the substrate holding process performed by the substrate holding chamber R1 is completed.

[0073] <<2. Reversal Process>>

[0074] Figure 11 (A) and (B) are schematic cross-sectional views of the reversing device. The reversing device includes a reversing chamber R2. Inside the reversing chamber R2 are a holding member 610 for holding the substrate stage 100, a rotating shaft 620 fixed to the holding member 610, a motor 630 for rotating the rotating shaft 620, and a support member 640 for supporting the rotating shaft 620.

[0075] The substrate stage 100, integrated with the mother glass 10, is transported from the substrate holding chamber R1 to the reversing chamber R2 by a known transfer robot (not shown), and held in the holding member 610 (see reference). Figure 11 (A)). Then, the substrate stage 100 rotates 180 degrees, and the mother glass 10 is positioned so that it is suspended (hanging) from the substrate stage 100 in the vertical direction (see reference). Figure 11 (B)).

[0076] <<3. Mask Holding Process>>

[0077] The substrate stage 100, holding the mother glass 10, is transferred from the reversing chamber R2 to the alignment chamber. The mask 20, waiting in the alignment chamber, is aligned with the mother glass 10, and the substrate stage 100 is placed with its upper surface aligned with the mask 20. Any suitable known technology can be used to fix the substrate stage 100 to the mask 20. For example, a magnetic component such as an electromagnet, or a mechanical mechanism such as a clamping device, can be used. Alternatively, the substrate stage 100 may not be fixed to the mask 20; instead, it may be placed on the mask 20 located on a conveying member such as a roller, and moved integrally on the conveying member.

[0078] <<4. Film Formation Process>>

[0079] In this embodiment, as an example of a film formation method, a case using vacuum evaporation is shown. Figure 12 This is a schematic cross-sectional view of a vapor deposition apparatus. The vapor deposition apparatus includes a film deposition chamber R3, inside which an evaporation source 30, serving as a film deposition source, is disposed. A substrate stage 100, which integrally holds a base glass 10 and a mask 20, is transported from an alignment chamber to the film deposition chamber R3. By allowing the substrate stage 100 to pass through the space where the film-forming material evaporates or sublimates from the evaporation source 30, a thin film is formed on the base glass 10. Alternatively, a structure can be adopted in which multiple film deposition chambers are provided, each equipped with a different film deposition source, and the substrate stage 100 is transported sequentially to sequentially deposit various thin films on the base glass 10. At the end of film deposition, the mask 20 combined with the base glass 10 is removed. Alternatively, it is also possible to repeatedly perform the film deposition process by recombining other masks.

[0080] <<5. Substrate peeling process>>

[0081] After the film-forming process described above, the mother glass 10, which serves as the substrate, is peeled off from the substrate stage 100. Furthermore, the peeled mother glass 10 is then cut along the cutting line to obtain multiple image display sections as the final product. In this embodiment, the design is configured to avoid adverse effects on the image display sections (display element areas) within the mother glass 10, and to allow for the rapid peeling of the mother glass 10 from the substrate stage 100. Before describing the specific substrate peeling apparatus, substrate peeling method, and substrate peeling process, an overview of the substrate peeling in this embodiment will be provided below.

[0082] <<<Overview of Substrate Peeling>>>

[0083] During substrate peeling, cracks sometimes occur at the bend in the substrate (especially the mother glass) at the boundary between the peeled and unpeeled areas. This is presumably due to the overlap of stress caused by substrate deflection and stress caused by substrate deformation due to the peeling action, resulting in localized stress concentration. Furthermore, when a structure is used where the adhesive member 123 and peeling pin 341 in the adsorption pad 120 abut against the image display section, it may adversely affect the display of high-resolution images. Additionally, it is known that if the substrate is peeled from the adhesive member 123 while maintaining its parallel position to the substrate surface, a large force is required, making peeling difficult and increasing the load on the substrate. Moreover, experiments have confirmed that the substrate is more difficult to peel from the adhesive member 123 near its center of gravity compared to areas further away.

[0084] Based on the above, this embodiment investigates a method for substrate peeling. Hereinafter, refer to... Figure 13 and Figure 14 The outline of the substrate peeling in this embodiment will be described. Figure 13 This is a top view of the substrate stage 100X, showing the substrate stage 100X used for forming the mother glass of the image display section. Figure 14 (A) is a graph showing the relationship between the position of the stripping pin and the amount (height) of the stripping pin tip protruding from the substrate holding surface, and (B) is a graph showing the relationship between the elapsed time of the stripping action and the moving speed of the stripping pin.

[0085] In this embodiment, a structure is adopted in which the adhesive member 123 and the release pin 341 do not contact the display element area (image display section) of the substrate. Specifically, the structure is as follows: a plurality of adsorption pads 120 and a plurality of release portions for peeling the substrate are provided on the substrate stage 100X, respectively along the outer periphery of the held substrate and the boundary portion of the held substrate corresponding to the display element area. Furthermore, when the adsorption pads 120 are used, which also have a peeling function, the release portions are equivalent to the adsorption pads 120. In addition, when the release pins 341 are used, the release portions are equivalent to the through holes 111 through which the release pins 341 enter and exit. Figure 13 An example of the latter is shown. In this embodiment, the aforementioned boundary portion corresponds to the cutting line when the substrate is cut. That is, the boundary portion is a region that includes the cutting line and has a predetermined width relative to the cutting line. However, it also includes the case where the boundary portion in the embodiment is the portion that becomes the boundary between display element regions in the final product that has two or more display element regions (image display units).

[0086] With this structure, the substrate can be peeled off from the substrate stage while suppressing the impact on the display element area on the substrate.

[0087] Next, additional structures in the embodiments will be described. Preferably, in addition to the structure (method) in which the adhesive member 123 and the peeling pin 341 do not contact the display element area of ​​the substrate, one or more of the following structures are appropriately combined and employed. Furthermore, the following structures are not essential; even without the following structures, it is possible to peel the substrate from the substrate stage while suppressing the impact on the display element area on the substrate. In addition, when the following structures are combined, multiple structures can be combined as appropriately as possible. Appropriate combinations can be adopted according to the size, weight, etc. of the substrate.

[0088] (1) Preferably, the peeling operation is performed in the order of the adsorption pad 120 disposed on the outside to the adsorption pad 120 disposed on the inside, so that the substrate is peeled from the outside to the inside of the substrate. When an adsorption pad 120 with peeling function is used, the peeling operation from the adsorption pad 120 disposed on the outside can be performed before the peeling operation from the adsorption pad 120 disposed on the inside.

[0089] When using peeling pins 341, during the peeling operation, when all peeling pins 341 protrude from the substrate holding surface 110x, the protrusion amount of the outer peeling pins 341 from the substrate holding surface 110x should be greater than that of the inner peeling pins 341. For example, by making the moving speed of the peeling pins 341 different, the protrusion amount of the outer peeling pins 341 from the substrate holding surface 110x can be made greater than that of the inner peeling pins 341. That is, it is sufficient to make the moving speed of the outer peeling pins 341 faster than that of the inner peeling pins 341. In addition, by making the starting time of the movement of the peeling pins 341 different, the protrusion amount of the outer peeling pins 341 from the substrate holding surface 110x can be made greater than that of the inner peeling pins 341. That is, it is sufficient that the movement of the outer peeling pin 341 begins earlier than that of the inner peeling pin 341. Furthermore, by making the lengths of the peeling pins 341 different, the protrusion of the outer peeling pin 341 from the substrate holding surface 110x can be greater than that of the inner peeling pin 341. In other words, it is sufficient that the length of the outer peeling pin 341 is longer than that of the inner peeling pin 341. Additionally, they can be appropriately combined.

[0090] Furthermore, by employing a structure where the adsorption force of the adsorption pad 120 disposed on the outer side is smaller than that of the adsorption pad 120 disposed on the inner side, the substrate can be peeled off from the outer side to the inner side. In this case, either an adsorption pad 120 that also has a peeling function can be used, or a structure with a peeling pin 341 can be used. In the latter case, structures that change the moving speed of the peeling pin 341 on the inner and outer sides, structures that change the starting time of the movement of the peeling pin 341, and structures that change the length of the peeling pin 341 can be appropriately combined.

[0091] (2) During the peeling operation, when all the peeling pins 341 protrude from the substrate holding surface 110x, the peeling pin 341 with the smallest protrusion from the substrate holding surface 110x can be configured to pass through the through hole 111 provided at the boundary and emerge from the substrate holding surface 110x. Furthermore, this peeling pin 341 with the smallest protrusion is more preferably configured to pass through the through hole located at a position that does not overlap with the center of gravity G0 of the substrate (e.g., in…). Figure 13 The through-hole (located at position O) emerges from the substrate holding surface 110x. Position O corresponds to the boundary and is closest to the center of gravity G0. During substrate peeling, peeling can proceed approximately concentrically inwards from the outer side of the substrate, and finally, peeling is performed using the peeling pin 341 emerging from the through-hole 111 at position O. As described above, peeling is difficult near the center of gravity G0 compared to areas far from it, and the load on the substrate increases when peeling it last near G0. In contrast, by using the peeling pin 341 emerging from the through-hole 111 at position O, which does not overlap with the center of gravity G0, the load on the substrate can be suppressed.

[0092] Here, in order to peel the substrate in a roughly concentric circle from the outside towards the inside, the protrusion amount (height) of the peeling pins 341 protruding from the through holes 111 located at a distance equidistant from position O needs to be the same. Furthermore, in Figure 13 In the diagram, multiple concentric circles are shown using dashed lines. For example, during the peeling operation, when all the peeling pins 341 protrude from the substrate holding surface 110x, it is sufficient to position the front ends of all the peeling pins 341 on an imaginary curved surface (spherical surface, ellipsoidal surface), conical surface, etc. Figure 14 (A) shows the stripping pins 341 respectively from... Figure 13The graph shows the relationship between the position of the peeling pins 341 protruding from the multiple through holes 111 at the boundary L and their protrusion (height) from the substrate holding surface 110x. Graph L1 shows the case where the tips of all the peeling pins 341 are located on an imaginary conical surface. The black circles in Graph L1 show the position of the tips of a portion of the peeling pins 341. Graph L2 shows the case where the tips of all the peeling pins 341 are located on an imaginary curved surface. The white circles in Graph L2 show the position of the tips of a portion of the peeling pins 341. By adopting this structure, peeling is performed from the outside of the substrate in a generally concentric circle towards the inside, and finally, peeling is performed using the peeling pins 341 that protrude from the through holes 111 located at position O.

[0093] Furthermore, during peeling, the greater the inclination between the surface of the adhesive member 123 and the substrate surface, the easier it is to peel the substrate, thus reducing the load on the substrate. Specifically, it is preferable to increase the height difference between the peeling pins 341 on both sides of the adsorption pad 120. As shown in Figure L1 above, the height difference between the peeling pins 341 on both sides of the adsorption pad 120 can be increased regardless of the position of the adsorption pad 120. In contrast, as shown in Figure L2, the height difference between the peeling pins 341 on both sides of the adsorption pad 120 decreases near position O. Therefore, during the peeling operation, it is more preferable that when all the peeling pins 341 protrude from the substrate holding surface 110x, the tips of all the peeling pins 341 are located on an imaginary conical surface.

[0094] (3) It is possible that, with the first and second peeling pins 341 protruding from the through holes 111 on both sides of the adsorption pad 120 and protruding from the substrate holding surface 110x respectively, the amount of protrusion of the first peeling pin 341 from the substrate holding surface 110x is different from the amount of protrusion of the second peeling pin 341 from the substrate holding surface 110x. Therefore, during peeling, since the surface of the adhesive member 123 is not parallel to the substrate surface and is inclined, the substrate is easily peeled off, reducing the load on the substrate. Therefore, it is preferable to configure all the adsorption pads (adhesive members 123) provided on the substrate stage 100X and the peeling pins 341 protruding from the through holes 111 on both sides thereon as described above. That is, considering any adsorption pad 120 provided on the substrate stage 100X, the first and second peeling pins 341 protruding from the through holes 111 on both sides thereon can be configured as described above. For example, in Figure 13 In the structure shown, during the peeling action, when all the peeling pins 341 protrude from the substrate holding surface 110x, it is sufficient to ensure that the front ends of all the peeling pins 341 are located on the imaginary curved surface or conical surface.

[0095] (4) Alternatively, during the peeling action, the moving speed of the plurality of peeling pins 341 may vary in a slower manner. In this case, when peeling the substrate from the outside to the inside, the peeling speed slows down near the center of gravity G0 of the substrate. As described above, since it is difficult to peel the substrate from the adhesive member 123 near the center of gravity G0 of the substrate, slowing down the peeling speed can suppress the load on the substrate. Furthermore, Figure 14 (B) is a graph showing the relationship between elapsed time and the moving speed of the stripping pin 341. In this embodiment, the moving speed of all stripping pins 341 is slowed down midway. In addition, in this embodiment, the speed is slowed down by one stage midway, but it can also be slowed down in multiple stages, or the speed can be slowed down continuously.

[0096] (5) It is possible that the adsorption force of the adsorption pad 120 disposed on the outer side is greater than that of the adsorption pad 120 disposed on the inner side. For example, in the substrate stage 100X, the adsorption force of a plurality of adsorption pads 120 disposed along the outer periphery of the held substrate can be greater than that of adsorption pads 120 disposed along the boundary portion of the held substrate corresponding to the display element region. In addition, in Figure 13 In this configuration, the adsorption force of the adsorption pad 120 disposed near position O can be reduced, while the adsorption force increases the further away the adsorption pad 120 is disposed from position O. With the configuration described above, the substrate can be easily peeled off even near the center of gravity G0, which is difficult to peel off, and the load on the substrate can be suppressed.

[0097] Based on the above overview, the following describes the substrate stripping apparatus, substrate stripping method, and substrate stripping process in more detail.

[0098] <<<Example 1 regarding substrate peeling>>>

[0099] After the film is formed and the mask is removed, the substrate stage 100 is transported to the substrate stripping chamber R4 of the substrate stripping device. Figure 15 This is a schematic cross-sectional view showing a simplified structure of the substrate peeling apparatus of Embodiment 1, illustrating that it has... Figure 3 (B) shows the state in which the substrate stage 100 of the adsorption pad 120 with peeling function is transported to the substrate peeling chamber R4.

[0100] After the film-forming process is performed and the mask is removed, the integrated mother glass 10 and substrate stage 100 are reversed again by the reversing device and then transported to the substrate stripping chamber R4. After the substrate stage 100, transported to the substrate stripping chamber R4, is placed on the support stage 500, the support member 130 is released (see reference). Figure 15(A)). Then, by the rise of the lifting platform 125 provided on the adsorption pad 120, the metal ball 124 rises, and the mother glass 10 is peeled off from the substrate stage 100. At this time, the peeling of the adhesive member 123 provided on the outer region 15 of the mother glass 10 is performed before the peeling of the adhesive member 123 provided on the inner region 14 (see reference). Figure 15 (B) This reduces the bending of the mother glass 10 at the boundary between the peeled outer region 15 and the unpeeled inner region 14, and shortens the peeling cycle time without damaging the mother glass 10.

[0101] <<<Example 2 regarding substrate peeling>>>

[0102] Figure 16 This is a top view of the peeling pin unit 350 constituting the substrate peeling apparatus of Embodiment 2. In this embodiment, the following structure is adopted: after the support member 130 is released, the mother glass 10, which is supported and fixed to the substrate holding surface 110x by the adsorption pad 120 and the support member 130, is peeled off from the adsorption pad 120 by the peeling pin.

[0103] In the peeling pin unit 350, 26 peeling pins 341 are provided on the peeling pin bracket 360. The number, outer diameter, length, and other specifications of the peeling pins 341 can be appropriately changed according to the dimensions of the bonding member 123, the mother glass 10, and the panel molding pattern of the image display section. The peeling pins 341 are made of materials that can be used under vacuum and have low exhaust content. For example, the front end that contacts the metal body such as stainless steel and the mother glass 10 is formed of fluororesin, fluororubber, etc.

[0104] For ease of explanation, Figure 16 In the diagram, each peeling pin 341 is distinguished using coordinates. Specifically, the peeling pin on the lower left of the peeling pin stand 360 is designated as (x1, y1), and the peeling pin on the upper right of the stand is designated as (x7, y5). This substrate peeling apparatus is configured to peel the inner region 14 and outer region 15 of the mother glass 10 using the peeling pins 341; in other words, it peels the area around each display element region (image display section). Figure 1 The coordinates corresponding to the image display units 11, 12, and 13 shown, such as (x3, y4), (x3, y2), and (x6, y3), do not have the stripping pin 341.

[0105] Figure 17 (A) is a schematic cross-sectional view of the substrate stage 100 being transported to the substrate stripping chamber R4 and the substrate stripping chamber R4 equipped with stripping pin units 350, showing the state where the support member 130 is released. Each stripping pin 341 is configured to move independently up and down in the figure using a drive mechanism such as a motor or ball screw. Furthermore, as shown... Figure 17 As shown in (B), in this embodiment, the moving speed of the peeling pin 341 in the outer region 15 is faster than the moving speed of the peeling pin 341 in the inner region 14. Therefore, by peeling the mother glass 10 first in the outer region 15, the bending of the mother glass 10 at the boundary region between the outer region 15 and the inner region 14 can be reduced, and the peeling cycle time can be shortened without damaging the mother glass 10.

[0106] Alternatively, the moving speed of the stripping pin 341 can be set to a constant, and the movement of the stripping pin 341 in the outer region 15 can begin earlier than that of the stripping pin 341 in the inner region 14. In this case, the mother glass 10 can also be stripped first in the outer region 15, achieving the same effect.

[0107] <<<Example 3 regarding substrate peeling>>>

[0108] In this embodiment, a structure is shown where the length of the release pin 341 varies depending on its position. In this embodiment, it is configured such that when all the release pins 341 protrude from the substrate holding surface 110x, the intersection of the two boundary portions (at...) Figure 16 With the coordinates (x5, y3) as the center point, the protrusion (height) of the stripping pin 341 gradually increases in a roughly concentric circle towards the outer area.

[0109] Figure 18 (A) is equivalent to in Figure 16 A schematic cross-sectional view showing the cut-off points at A1-A2 where pins (x1, y1) connect to pins (x7, y1) and A3-A4 where pins (x1, y5) connect to pins (x7, y5). Figure 18 (B) is equivalent to in Figure 16 A schematic cross-sectional view showing the cut-off point at C1-C2 where pins (x1, y1) and (x1, y5) are connected. Figure 18 (C) is equivalent to in Figure 16 A schematic cross-sectional view showing the cut-off point at B1-B2 where pins (x1, y3) and (x7, y3) are connected. Figure 18 (D) is equivalent to in Figure 16 A schematic cross-sectional view showing the cut-off point at D1-D2 where pins (x5, y1) and (x5, y5) are connected. Figure 18 (E) is equivalent to in Figure 16 A schematic cross-sectional view showing the cut-off point at C3-C4 where pins (x7, y1) and (x7, y5) are connected.

[0110] Regarding the height of the stripping pins 341, pin (x5, y3) has the lowest height, and the pins on the concentric circles centered on pin (x5, y3) have equal heights. The height of the stripping pins 341 gradually increases as they move away from (x5, y3). The front ends of all the stripping pins 341 are configured to lie on an imaginary conical surface with (x5, y3) as the vertex. Furthermore, the height difference between adjacent stripping pins 341 is approximately 1 mm to 2 mm, and the maximum height difference between the stripping pins 341 is approximately 20 mm.

[0111] Figure 19 (A) is a schematic cross-sectional view of the substrate stage 100 being transported to the substrate stripping chamber R4 and the substrate stripping chamber R4 equipped with the stripping pin unit 350, showing the state in which the support member 130 is released.

[0112] As described above, if the substrate is to be peeled off from the adhesive member 123 while maintaining the parallelism between the surface of the adhesive member 123 and the substrate surface, a large force is required, making it difficult to peel the substrate and increasing the load on the substrate. This could potentially cause the mother glass 10, which serves as the substrate, to crack. This is because, when the substrate is adhered to the adhesive member 123, if the substrate is simultaneously pushed upwards using a set of peeling pins 341 on both sides of the adhesive member 123, the force on both sides of the adhesive member 123 becomes balanced, resulting in increased peeling resistance.

[0113] By employing the structure shown in the various embodiments and making the heights of the peeling pins 341 on both sides of the adhesive member 123 (adsorption pad 120) different, the line of action of the adhesive force can be offset from the direction of action of the peeling pins 341, thereby reducing the peeling resistance by allowing the torque to take effect.

[0114] In Embodiment 3, by moving the peeling pin stand 360, all peeling pins 341 of different heights can be moved as a single unit, and the timing of peeling off the mother glass 10 can be varied depending on their position. In Embodiment 3, as... Figure 19 As shown in (B), the peeling of the mother glass 10 begins from the outer region 15 and proceeds towards the inner region 14, and is completed by pins (x5, y3). In this embodiment, the bending of the mother glass 10 at the boundary region between the outer region 15 and the inner region 14 can also be reduced, and the peeling cycle time can be shortened without damaging the mother glass 10.

[0115] <<<Other embodiments regarding substrate peeling>>>

[0116] As described above, a structure can also be adopted in which an adsorption pad 120 (adhesive member 123) with a greater adhesive force than the outer region 15 is disposed in the inner region 14, thereby peeling off first from the adhesive member 123 of the outer region 15. In this case, the bending of the mother glass 10 at the boundary region between the outer region 15 and the inner region 14 can also be reduced, and the peeling cycle time can be shortened without damaging the mother glass 10.

[0117] Conversely, the adsorption force of the adsorption pad 120 disposed in the outer region 15 can also be configured to be greater than that of the adsorption pad 120 disposed in the inner region. In this case, there is an advantage that the substrate can be easily peeled off from the adhesive member 123 near the center of gravity of the substrate, which is difficult to peel off.

[0118] When employing a structure that alters the adhesive force of the adsorption pad 120 on both the inner and outer sides, the adhesive force can be increased by simply selecting which side (inner or outer) to increase based on the size and weight of the combined substrate and the structure shown in the various embodiments described above. Furthermore, altering the adhesive force includes not only changing the adhesive force using the adsorption pad 120 disposed in the inner region 14 and the adsorption pad 120 disposed in the outer region 15, but also, for example, by configuring... Figure 13 With position O as the center, the adhesive force gradually decreases or increases as it moves outward in a roughly concentric circle.

[0119] The adhesive force of the adsorption pad 120 can be appropriately set by changing the type, thickness, and contact area of ​​the material constituting the adhesive member 123.

[0120] <Methods for Manufacturing Electronic Devices>

[0121] Next, an example of a method for manufacturing an electronic device using the film-forming apparatus of this embodiment will be described. Hereinafter, as an example of an electronic device, the structure of an organic EL display device will be shown, and a method for manufacturing an organic EL display device will be illustrated.

[0122] First, the organic EL display device to be manufactured will be explained. Figure 20 (A) is an overall view of the organic EL display device 800. Figure 20 (B) shows the cross-sectional structure of a pixel.

[0123] like Figure 20As shown in (A), a plurality of pixels 802, each equipped with a plurality of light-emitting elements, are arranged in a matrix in the display area 801 of the organic EL display device 800. Details will be described later, but each light-emitting element has a structure having an organic layer sandwiched between a pair of electrodes. Furthermore, a pixel, as used herein, refers to the smallest unit in the display area 801 capable of displaying a desired color. In the case of the organic EL display device of this embodiment, the pixel 802 is constructed by showing a combination of a first light-emitting element 802R, a second light-emitting element 802G, and a third light-emitting element 802B, each emitting a different color. The pixel 802 is typically composed of a combination of red, green, and blue light-emitting elements, but it can also be a combination of yellow, cyan, and white light-emitting elements, as long as at least one color is used; it is not particularly limited.

[0124] Figure 20 (B) is Figure 20 (A) is a partial cross-sectional view at the SS line. Pixel 802 is composed of multiple light-emitting elements, each of which has a first electrode (anode) 804, a hole transport layer 805, one of light-emitting layers 806R, 806G, and 806B, an electron transport layer 807, and a second electrode (cathode) 808 on substrate 803. The hole transport layer 805, light-emitting layers 806R, 806G, 806B, and electron transport layer 807 are equivalent to organic layers. In this embodiment, light-emitting layer 806R is an organic EL layer that emits red light, light-emitting layer 806G is an organic EL layer that emits green light, and light-emitting layer 806B is an organic EL layer that emits blue light. Light-emitting layers 806R, 806G, and 806B are respectively formed in patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light.

[0125] Furthermore, the first electrode 804 is formed separately for each light-emitting element. The hole transport layer 805, electron transport layer 807, and second electrode 808 can be formed together in multiple light-emitting elements 802R, 802G, and 802B, or they can be formed separately for each light-emitting element. In addition, to prevent short circuits between the first electrode 804 and the second electrode 808 due to foreign matter, an insulating layer 809 is provided between the first electrode 804. Moreover, since the organic EL layer is susceptible to deterioration due to moisture and oxygen, a protective layer 810 is provided to protect the organic EL element from the effects of moisture and oxygen.

[0126] exist Figure 20In (B), the hole transport layer 805 and the electron transport layer 807 are represented by a single layer, but depending on the structure of the organic EL display element, they may be formed by multiple layers having a hole blocking layer and an electron blocking layer. Alternatively, a hole injection layer with a band structure that allows for smooth injection of holes from the first electrode 804 to the hole transport layer 805 may be formed between the first electrode 804 and the hole transport layer 805. Similarly, an electron injection layer may also be formed between the second electrode 808 and the electron transport layer 807.

[0127] Next, an example of a method for manufacturing an organic EL display device will be given.

[0128] First, a circuit (not shown) for driving an organic EL display device and a substrate (mother glass) 803 on which a first electrode 804 is formed are prepared.

[0129] Acrylic resin is spin-coated onto a substrate 803 on which the first electrode 804 is formed. The acrylic resin is then patterned using photolithography to form an opening in the area where the first electrode 804 is formed, and an insulating layer 809 is formed. This opening corresponds to the light-emitting area where the light-emitting element actually emits light.

[0130] A substrate 803, on which the insulating layer 809 is patterned, is placed on a substrate stage provided with an adhesive member. The substrate 803 is held in place by the adhesive member. After being transferred into the first organic material film-forming apparatus and reversed, a hole transport layer 805 is formed on the first electrode 804 of the display area as a common layer. The hole transport layer 805 is formed by vacuum evaporation. Since the hole transport layer 805 is actually formed to a size larger than the display area 801, a high-precision mask is not required.

[0131] Next, the substrate 803 to which the hole transport layer 805 is formed is moved into the second organic material film forming apparatus. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light emitting layer 806R is formed on the portion of the substrate 803 where the red light emitting element is disposed.

[0132] Similar to the deposition of the light-emitting layer 806R, a green light-emitting layer 806G is deposited using a third organic material deposition apparatus, and a blue light-emitting layer 806B is deposited using a fourth organic material deposition apparatus. After the deposition of the light-emitting layers 806R, 806G, and 806B is completed, an electron transport layer 807 is deposited over the entire display area 801 using a fifth deposition apparatus. The electron transport layer 807 is formed as a common layer on the three color light-emitting layers 806R, 806G, and 806B.

[0133] A substrate that has been moved to the electron transport layer 807 in a metallic vapor deposition material film forming apparatus is used to form a film on the second electrode 808.

[0134] Next, the substrate is moved to a plasma CVD apparatus to form a protective layer 810, completing the film formation process for the substrate 803. After inversion, as described in the above embodiments or examples, the substrate 803 is separated from the substrate stage by peeling off the adhesive members. Then, the organic EL display device 800 is completed by cutting.

[0135] From the moment the substrate 803, to which the insulating layer 809 has been patterned, is placed into the film-forming apparatus until the protective layer 810 is formed, the light-emitting layer made of organic EL material may deteriorate due to exposure to an atmosphere containing moisture and oxygen. Therefore, in this embodiment, the substrate is moved in and out of the film-forming apparatus under a vacuum atmosphere or an inert gas atmosphere.

Claims

1. A substrate peeling apparatus, wherein the substrate peels off a substrate from a substrate stage that holds the substrate using a plurality of adhesive suction pads, characterized in that, On the substrate stage, a plurality of adhesive suction pads are provided respectively along the outer periphery of the held substrate and the boundary portion of the held substrate corresponding to the display element region. The adhesive absorbent pad has an adhesive component and also functions to peel off the substrate. With the adhesive member maintaining the flat plate shape, the adhesive adsorption pad acts as an adsorption part to adsorb the substrate. When the adhesive member deforms toward the substrate, the adhesive suction pad acts as a peeling part to peel the substrate from the substrate carrier. The adhesive pad includes an adhesive member and a metal ball. When the lifting platform is lowered, the adhesive member maintains a flat shape. When the lifting platform is raised, the metal ball deforms the adhesive member. Multiple metal balls are arranged in the lifting direction of the lifting platform.

2. The substrate peeling device according to claim 1, characterized in that, The boundary portion is the part corresponding to the cutting line where the substrate is cut in a subsequent process.

3. The substrate peeling device according to claim 1, characterized in that, The peeling action from the adhesive absorbent pad disposed on the outside is performed before the peeling action from the adhesive absorbent pad disposed on the inside.

4. The substrate peeling apparatus according to claim 1 or 2, characterized in that, On the substrate stage, a plurality of through holes are provided respectively along the outer periphery of the held substrate and the boundary portion of the held substrate corresponding to the display element region, and... The substrate peeling device has a plurality of peeling pins, which are configured to pass through the plurality of through holes and emerge from the substrate holding surface of the substrate stage.

5. The substrate peeling apparatus according to claim 4, characterized in that, During the peeling action, when all the peeling pins protrude from the substrate holding surface, the peeling pins disposed on the outer side protrude a greater amount from the substrate holding surface than the peeling pins disposed on the inner side.

6. The substrate peeling apparatus according to claim 5, characterized in that, By making the moving speed of the peeling pins different, the amount of protrusion of the peeling pins disposed on the outer side from the substrate holding surface is greater than that of the peeling pins disposed on the inner side.

7. The substrate peeling apparatus according to claim 5, characterized in that, By differentiating the timing of the movement of the peeling pins, the peeling pins disposed on the outer side protrude more from the substrate holding surface than the peeling pins disposed on the inner side.

8. The substrate peeling apparatus according to claim 5, characterized in that, By making the lengths of the peeling pins different, the amount of protrusion of the peeling pins disposed on the outer side from the substrate holding surface is greater than that of the peeling pins disposed on the inner side.

9. The substrate peeling apparatus according to any one of claims 5 to 8, characterized in that, During the peeling operation, when all the peeling pins protrude from the substrate holding surface, the peeling pin with the smallest protrusion from the substrate holding surface is configured to pass through the through hole provided in the boundary portion and emerge from the substrate holding surface.

10. The substrate peeling apparatus according to claim 9, characterized in that, The peeling pin, with minimal protrusion from the substrate holding surface, is configured to pass through the through hole located at a position not overlapping with the center of gravity of the substrate and emerge from the substrate holding surface.

11. The substrate peeling apparatus according to claim 4, characterized in that, During the peeling action, when all the peeling pins protrude from the substrate holding surface, the front ends of all the peeling pins are located on an imaginary conical surface.

12. The substrate peeling apparatus according to claim 4, characterized in that, With the first and second peeling pins protruding from the through holes on both sides of any of the adhesive absorbent pads and protruding from the substrate holding surface, the amount of protrusion of the first peeling pin from the substrate holding surface is different from the amount of protrusion of the second peeling pin from the substrate holding surface.

13. The substrate peeling apparatus according to claim 4, characterized in that, The movement speed of the multiple stripping pins varies in a slowing manner.

14. The substrate peeling apparatus according to claim 1 or 2, characterized in that, The adhesive adsorption pad disposed on the outer side has a smaller adsorption force than the adhesive adsorption pad disposed on the inner side.

15. The substrate peeling apparatus according to claim 1 or 2, characterized in that, The adhesive adsorption pad disposed on the outer side has a greater adsorption force than the adhesive adsorption pad disposed on the inner side.

16. A film-forming apparatus, characterized in that, The film-forming apparatus includes: A film-forming source, wherein the film-forming source forms a thin film on a substrate held on the substrate stage; and The substrate peeling apparatus according to any one of claims 1 to 15.

17. A substrate stage, the substrate stage comprising a plurality of adhesive suction pads for holding a substrate, characterized in that, A plurality of adhesive pads are provided such that they are arranged along the outer periphery of the held substrate and the boundary between the held substrate and the display element region, respectively. The adhesive absorbent pad has an adhesive component and also functions to peel off the substrate. With the adhesive member maintaining the flat plate shape, the adhesive adsorption pad acts as an adsorption part to adsorb the substrate. When the adhesive member deforms toward the substrate, the adhesive suction pad acts as a peeling part to peel the substrate from the substrate carrier. The adhesive pad includes an adhesive member and a metal ball. When the lifting platform is lowered, the adhesive member maintains a flat shape. When the lifting platform is raised, the metal ball deforms the adhesive member. Multiple metal balls are arranged in the lifting direction of the lifting platform.

18. A substrate peeling method, comprising peeling the substrate from a substrate stage that holds the substrate using a plurality of adhesive adsorption pads, characterized in that, The adhesive absorbent pad has an adhesive component and also functions to peel off the substrate. The substrate peeling method includes: A process in which a plurality of adhesive suction pads disposed on a substrate stage, respectively along the outer periphery of the substrate and the boundary portion of the substrate corresponding to the display element region, hold the substrate in a flat-plate shape by means of an adhesive member; and The process of peeling off the substrate by deforming the adhesive member toward the substrate using the adhesive adsorption pad. The adhesive pad includes an adhesive member and a metal ball. When the lifting platform is lowered, the adhesive member maintains a flat shape. When the lifting platform is raised, the metal ball deforms the adhesive member. Multiple metal balls are arranged in the lifting direction of the lifting platform.

19. A method for forming a film, wherein a thin film is formed on a substrate held on a substrate stage, characterized in that, The film-forming method includes: A process in which a substrate is held in a flat plate shape by means of an adhesive member having an adhesive pad provided on a substrate stage, wherein a plurality of adhesive pads are respectively provided along the outer periphery of the substrate and the boundary portion of the substrate corresponding to the display element area. The process of forming a thin film on a substrate held on a substrate stage using a film-forming source; and The process of peeling off the substrate by deforming the adhesive member toward the substrate using the adhesive adsorption pad. The adhesive pad includes an adhesive member and a metal ball. When the lifting platform is lowered, the adhesive member maintains a flat shape. When the lifting platform is raised, the metal ball deforms the adhesive member. Multiple metal balls are arranged in the lifting direction of the lifting platform.

Images