Display panel and manufacturing method, electronic device

Abstract

The application provides a display panel and a manufacturing method and an electronic device. The display panel comprises a substrate, a first dam and an encapsulation layer; the substrate comprises a display area and a non-display area; the first dam is located in the non-display area of the substrate and is arranged around the display area of the substrate; the first dam comprises a first dam organic layer and a first dam inorganic layer located on the side surface of the first dam organic layer away from the substrate; the encapsulation layer covers the substrate and the first dam; the encapsulation layer comprises a plurality of inorganic encapsulation film layers and an organic encapsulation film layer located between the plurality of inorganic encapsulation film layers; the inorganic encapsulation film layer at the bottom of the encapsulation layer is in contact with the first dam inorganic layer. The display panel reduces the probability of peeling between the encapsulation layer and the first dam, thereby effectively improving the reliability of the encapsulation layer, so that the encapsulation layer can withstand greater stress and has a longer service life.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel and its manufacturing method, and an electronic device. Background Technology

[0002] With the development of the display industry, the application of display panels is becoming more and more diversified. The display requirements such as bending, stretching and rolling of flexible display panels have become the mainstream of current display requirements. However, under the action of external force, the thin film encapsulation (TFE) layer of such display panels is easy to peel off from the encapsulation layer, resulting in poor reliability of the encapsulation layer, reduced display reliability and service life, and affected screen quality. Summary of the Invention

[0003] The display panel, manufacturing method, and electronic device provided in this application aim to solve the problem that the screen body of existing display panels is easily peeled off from the encapsulation layer, resulting in poor reliability of the encapsulation layer.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is to provide a display panel. The display panel includes a substrate, a first dam, and an encapsulation layer; wherein the substrate includes a display area and a non-display area; the first dam is located in the non-display area of ​​the substrate and is disposed around the display area of ​​the substrate; wherein the first dam includes a first dam organic layer and a first dam inorganic layer located on the surface of the first dam organic layer away from the substrate; the encapsulation layer covers the substrate and the first dam; the encapsulation layer includes a plurality of inorganic encapsulation film layers and an organic encapsulation film layer located between the plurality of inorganic encapsulation film layers; wherein the bottommost inorganic encapsulation film layer of the encapsulation layer is in contact with the inorganic layer of the first dam.

[0005] In one possible implementation, the display panel further includes a plurality of protrusions located in the non-display area of ​​the substrate and disposed on the side of the first dam away from the display area.

[0006] Preferably, the encapsulation layer covers the plurality of protrusions, each of the protrusions comprising an organic layer and an inorganic layer located on the side of the organic layer away from the substrate; the bottommost inorganic encapsulation film layer of the encapsulation layer is in contact with the inorganic layer.

[0007] In one possible implementation, the plurality of protrusions are spaced apart from the first dam.

[0008] Preferably, the plurality of protrusions are arranged around the first dam.

[0009] Preferably, the organic layer is an array of organic layers, and the inorganic layer is an array of inorganic layers.

[0010] In one possible implementation, the display panel further includes a second dam, which is disposed on the side of the first dam away from the display area and surrounds the first dam; the plurality of protrusions are disposed on the side of the second dam away from the first dam, and / or the plurality of protrusions are disposed between the second dam and the first dam.

[0011] Preferably, the second dam includes a second dam organic layer and a second dam inorganic layer located on the side surface of the second dam organic layer away from the substrate.

[0012] More preferably, the organic layer, the first dam organic layer, the second dam organic layer, the inorganic layer, the first dam inorganic layer, and the second dam inorganic layer are prepared by chemical vapor deposition at a first temperature; the inorganic encapsulation film layer is prepared by the chemical vapor deposition process at a second temperature; wherein, the first temperature is greater than 200°C; and the second temperature is less than 100°C.

[0013] In one possible implementation, at least some of the protrusions are arranged in an array, and the spacing between two adjacent protrusions in the array is the same as or a multiple of the spacing between two adjacent pixels in the display area.

[0014] In one possible implementation, the spacing between two adjacent protrusions is greater than the spacing between two adjacent pixels in the display area.

[0015] Preferably, the spacing between two adjacent protrusions is 50 micrometers to 200 micrometers.

[0016] In one possible implementation, the length and width of the protrusion are 30 to 60 micrometers, and the height of the protrusion is 3 to 5 micrometers.

[0017] In one possible implementation, the plurality of protrusions are misaligned.

[0018] Preferably, the plurality of protrusions are arranged in parallel rows to form at least two rows and / or at least two columns, with the protrusions staggered between adjacent rows and / or adjacent columns.

[0019] Preferably, the cross-sectional shapes of the protrusions in each adjacent row are the same or different.

[0020] Preferably, in every two adjacent rows of protrusions, the cross-sectional area of ​​the protrusions in one row gradually decreases along the first direction A, while the cross-sectional area of ​​the protrusions in the other row gradually increases along the first direction A.

[0021] Preferably, the cross-sectional shape of the protrusion is circular, elliptical, cross-shaped, hexagonal, or arrow-shaped.

[0022] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide a method for manufacturing a display panel. In one possible embodiment, the display panel includes the aforementioned organic layer, first dam organic layer, second dam organic layer, inorganic layer, first dam inorganic layer, and second dam inorganic layer. The organic layer, first dam organic layer, second dam organic layer, inorganic layer, first dam inorganic layer, and second dam inorganic layer are prepared by chemical vapor deposition at a first temperature; the inorganic encapsulation film layer is prepared by the same chemical vapor deposition process at a second temperature; wherein the first temperature is greater than 200°C; and the second temperature is less than 100°C.

[0023] To solve the aforementioned technical problems, another technical solution adopted in this application is to provide an electronic device. This electronic device includes the display panel described above.

[0024] The display panel, manufacturing method, and electronic device provided in this application involve setting a substrate, forming a first dam in a non-display area of ​​the substrate, and surrounding the display area of ​​the substrate with the first dam to prevent organic materials from intruding into the non-display area and causing defects. Simultaneously, an encapsulation layer is provided to cover the substrate and the first dam, preventing the light-emitting unit from being affected by the external environment and reducing the degradation of the display panel device caused by moisture and oxygen. Furthermore, by including an organic layer and an inorganic layer on the side of the organic layer away from the substrate, and by contacting the bottom inorganic encapsulation film layer of the encapsulation layer with the inorganic layer of the first dam, the encapsulation layer and the first dam are bonded together through the bonding of the inorganic layer of the first dam and the inorganic encapsulation film layer of the encapsulation layer. This effectively enhances the bonding force between the encapsulation layer and the first dam, reduces the probability of peeling problems between the encapsulation layer and the first dam, and thus effectively improves the reliability of the encapsulation layer, enabling it to withstand greater stress and have a longer lifespan. Attached Figure Description

[0025] Figure 1 A partial structural schematic diagram of a display panel provided in an embodiment of this application;

[0026] Figure 2 for Figure 1 A simplified top view of the structure shown;

[0027] Figure 3 A partial structural schematic diagram of a display panel provided in another embodiment of this application;

[0028] Figure 4 for Figure 3 A simplified top view of the structure shown;

[0029] Figure 5 A partial structural schematic diagram of a display panel provided in another embodiment of this application;

[0030] Figure 6 for Figure 5 A simplified top view of the structure shown;

[0031] Figure 7 This is a schematic diagram showing the positions of several protrusions provided in an embodiment of this application;

[0032] Figure 8 A schematic diagram showing the positions of several protrusions provided in another embodiment of this application;

[0033] Figure 9 This is a diagram illustrating the spacing between two adjacent protrusions and the spacing between two adjacent pixels.

[0034] Figures 10-19 A schematic diagram of the misaligned distribution of several protrusions in the first to tenth embodiments provided in this application.

[0035] Figures 20-26 Schematic diagram of the matrix distribution of several protrusions provided in the embodiments of this application from the first to the seventh embodiments;

[0036] Figure 27 A simplified structural diagram of an electronic device provided in an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] Display panel 10, substrate 1, display area 11, non-display area 12, first dam 2, first dam organic layer 21, first dam inorganic layer 22, encapsulation layer 3, inorganic encapsulation film layer 31, organic encapsulation film layer 32, anode 4, protrusion 5, organic layer 51, inorganic layer 52, second dam 6, second dam organic layer 61, second dam inorganic layer 62, pixel 7. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0040] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0041] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0042] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0043] Please see Figure 1 and Figure 2 , Figure 1 A partial structural schematic diagram of a display panel provided in an embodiment of this application; Figure 2 for Figure 1 The diagram shows a simplified top view of the structure. In this embodiment, a display panel 10 is provided, which can be a rigid screen or a flexible screen, for displaying images during operation. Figure 1 As shown, the display panel 10 includes a substrate 1, a first dam 2, and an encapsulation layer 3. For ease of description, the embodiments of this application use... Figure 1 Taking the directions shown as an example, we define the upward direction B as the top layer and the downward direction as the bottom layer.

[0044] The substrate 1 includes a display area 11 and a non-display area 12 disposed on at least one side of the display area 11. The display area 11 includes a plurality of pixels 7 (see below). Figure 9It is used to display images. The images may include predetermined visual information, such as text, video, pictures, and / or images. In a specific embodiment, the display area 11 of the substrate 1 further includes an organic light-emitting layer, a planarization layer, an anode layer, etc. The non-display area 12 is the area in which no pixels 7 are arranged and no images are displayed. The driving units for driving pixels may be arranged in the non-display area 12.

[0045] like Figure 2 As shown, the cross-sectional shape of substrate 1 can be approximately rectangular, but the shape of substrate 1 is not limited to this, and substrate 1 can have various shapes. For example, substrate 1 can be a polygon with a closed shape including straight sides, a circle or ellipse including curved sides, or a semicircle or semi-ellipse including one side formed by a straight line and the other side formed by a curve.

[0046] Substrate 1 can be formed of a flexible insulating material. Substrate 1 can be formed of various materials, such as glass or polymer materials. Substrate 1 can be an insulating substrate, for example, formed of a polymeric organic material. For example, the insulating substrate may include polymethyl methacrylate, polyetherimide, polyethylene terephthalate, polyphenylene sulfide, polyarylate, cellulose triacetate, etc. However, the material of substrate 1 is not limited to these, and substrate 1 can be formed of, for example, glass fiber reinforced plastic.

[0047] The first dam 2 is located in the non-display area 12 of the substrate 1 and is disposed around the display area 11 of the substrate 1 to prevent organic materials from flowing into the non-display area 12 and causing defects. Specifically, as shown in the figure... Figure 1 As shown, the first dam 2 includes a first dam organic layer 21 and a first dam inorganic layer 22 located on the side surface of the first dam organic layer 21 away from the substrate 1.

[0048] The material of the first dam organic layer 21 can be acrylic resin, epoxy resin, phenolic resin, polyamide resin, etc. The material of the first dam inorganic layer 22 can be silicon oxide and / or silicon nitride (SiOx & SiNx).

[0049] In a specific embodiment, such as Figure 1 As shown, the first dam organic layer 21 includes a planarization layer disposed on the substrate 1 and a pixel defining layer stacked on the side of the planarization layer facing away from the substrate 1. Optionally, an anode 4 is also disposed between the planarization layer and the pixel defining layer. Of course, in other embodiments, the first dam organic layer 21 may also include a support pillar disposed on the surface of the pixel defining layer facing away from the substrate 1.

[0050] The encapsulation layer 3 covers the display area 11 of the substrate 1 to cover the light-emitting unit and other devices in the display area 11, thereby preventing the light-emitting unit from being affected by the external environment and reducing the degradation of the display panel 10 devices caused by moisture and oxygen. At the same time, the encapsulation layer 3 covers at least a portion of the non-display area 12 of the substrate 1 to cover the driving circuit layer, the first dam 2, etc. in the non-display area 12.

[0051] like Figure 1 As shown, the encapsulation layer 3 includes multiple inorganic encapsulation film layers 31 and organic encapsulation film layers 32 located between the multiple inorganic encapsulation film layers 31; that is, the top and bottom layers of the encapsulation layer 3 are set as inorganic encapsulation film layers 31, and the inorganic encapsulation film layers 31 cover the organic encapsulation film layers 32. In this way, not only can the inorganic encapsulation film layers 31 prevent the penetration of moisture or oxygen, but the organic encapsulation film layers 32 can also improve the elasticity or flexibility of the encapsulation layer 3 to prevent the propagation of cracks.

[0052] In one specific embodiment, such as Figure 1 As shown, the encapsulation layer 3 includes two inorganic encapsulation film layers 31, namely a first inorganic encapsulation film layer and a second inorganic encapsulation film layer. An organic encapsulation film layer 32 is disposed between the first and second inorganic encapsulation film layers and is in direct contact with both the first and second inorganic encapsulation film layers. The material of the inorganic encapsulation film layer 31 can be polysiloxane, silicon nitride, silicon oxide, and / or silicon nitride. The material of the organic encapsulation film layer 32 can be a polyacrylic acid compound, a polyimide compound, a fluorocarbon compound (e.g., Teflon), and / or an organic insulating material such as a benzocyclobutene compound.

[0053] like Figure 1 As shown, in a specific embodiment, the bottommost inorganic encapsulation film layer 31 of the encapsulation layer 3, i.e., the first inorganic encapsulation film layer of the encapsulation layer 3, is in direct contact with the first dam inorganic layer 22. Specifically, the bonding between the first dam inorganic layer 22 and the inorganic encapsulation film layer 31 of the encapsulation layer 3 achieves the bonding between the encapsulation layer 3 and the first dam 2. Compared to the direct bonding between the inorganic encapsulation film layer 31 and the organic layer 21 of the first dam, this method effectively enhances the bonding force between the encapsulation layer 3 and the first dam 2, reduces the probability of peeling problems between them, and thus effectively improves the reliability of the encapsulation layer 3. This allows the encapsulation layer 3 to withstand greater stress and has a longer lifespan.

[0054] In a specific embodiment, in the manufacturing method of the display panel 10, both the first dam organic layer 21 and the inorganic encapsulation film layer 31 are formed using a chemical vapor deposition (CVD) process. Specifically, the first dam organic layer 21 undergoes a gas-phase reaction at a first temperature greater than 200°C. Specifically, the first temperature can be 300°C-450°C, or 500°C-600°C. The inorganic encapsulation film layer 31 undergoes a gas-phase reaction at a second temperature less than 100°C. Specifically, the second temperature can be 40°C-80°C. This allows for a tighter bond between the first dam organic layer 21 and the first dam inorganic layer 22, as well as between the inorganic encapsulation film layer 31 and the first dam inorganic layer 22, resulting in a more compact overall encapsulation structure.

[0055] The inventors of this application have discovered that conventional dam designs only block forces from the left and right sides (first direction A) of the display panel 10, but cannot block forces from other directions, such as forces from the vertical direction of the display panel 10 (i.e., direction B perpendicular to the display panel 10). This makes it very easy for the encapsulation layer 3 to peel off from the display panel 10 due to forces from other directions.

[0056] For this purpose, please refer to Figure 3 and Figure 4 , Figure 3 A partial structural schematic diagram of a display panel provided in another embodiment of this application; Figure 4 for Figure 3 The diagram shows a simplified top view of the structure. In one embodiment, the display panel 10 further includes a plurality of protrusions 5 spaced apart. The protrusions 5 are located in the non-display area 12 of the substrate 1 and are spaced apart from the first dam 2, and are located on the side of the first dam 2 opposite to the display area 11. By providing a plurality of protrusions 5 on the side of the first dam 2 opposite to the display area 11, forces from the left-right direction of the display panel 10 can be blocked, as well as forces from other directions, such as from the up-down direction or the diagonal direction, thereby effectively reducing the problem of the encapsulation layer 3 peeling off from the display panel 10.

[0057] In this embodiment, such as Figure 3 As shown, the encapsulation layer 3 also covers several protrusions 5, and each protrusion 5 includes an organic layer 51 and an inorganic layer 52 located on the side surface of the organic layer 51 away from the substrate 1. The specific structure, function, and formation process of the organic layer 51 and the inorganic layer 52 are similar to those of the first dam organic layer 21 and the first dam inorganic layer 22 described above; and the material of the organic layer 51 can be the same as the material of the first dam organic layer 21, and the material of the inorganic layer 52 can be the same as the material of the first dam inorganic layer 22, as detailed above.

[0058] In a specific embodiment, the array organic layer is an organic material layer in the array film layer of the display panel 10, and the array inorganic layer is an inorganic material layer in the array film layer of the display panel 10. The organic layer 51 is an array organic layer, and the inorganic layer 52 is an array inorganic layer; the array organic layer and the array inorganic layer are stacked sequentially.

[0059] In a specific embodiment, the organic layer 51, the first dam organic layer 21, and the array organic layer can be formed simultaneously, and the inorganic layer 52, the first dam inorganic layer 22, and the array inorganic layer can be formed simultaneously to simplify the process.

[0060] The bottom inorganic encapsulation film layer 31, i.e. the first inorganic encapsulation film layer, of the encapsulation layer 3 is in direct contact with the inorganic layer 52 to enhance the bonding force between the inorganic encapsulation film layer 31 and the protrusion 5, reduce the probability of peeling problems between the encapsulation layer 3 and the protrusion 5, and thus effectively improve the reliability of the encapsulation layer 3.

[0061] In a specific embodiment, the length and width of the protrusion 5 are 30-60 micrometers; the height of the protrusion 5 is 3-5 micrometers. This allows the encapsulation layer 3 to bond with the protrusion 5, thereby enhancing the bonding force between the encapsulation layer 3 and the substrate 1, resulting in a more compact overall encapsulation structure.

[0062] In one specific embodiment, such as Figure 3 or Figure 4 As shown, several protrusions 5 are arranged around the first dam 2. In this specific embodiment, the several protrusions 5 can also serve as an outer dam surrounding the first dam 2.

[0063] In another specific embodiment, see Figure 5 and Figure 6 , Figure 5 A partial structural schematic diagram of a display panel provided in another embodiment of this application; Figure 6 for Figure 5 A simplified top view of the structure shown;

[0064] Figure 7 This is a schematic diagram showing the positions of several protrusions provided in an embodiment of this application; Figure 8 This is a schematic diagram showing the positions of several protrusions provided in another embodiment of this application. The display panel 10 also includes a second dam 6, which is spaced apart from the first dam 2 on the side opposite to the display area 11 and surrounds the first dam 2. In this embodiment, as... Figure 6 As shown, several protrusions 5 are disposed between the first dam 2 and the second dam 6. Or as... Figure 7 As shown, several protrusions 5 are provided on the side of the second embankment 6 facing away from the first embankment 2. Or, as... Figure 8As shown, several protrusions 5 are provided on the side of the second dam 6 away from the first dam 2 and between the second dam 6 and the first dam 2. In this way, the protrusions 5 can effectively block forces from other directions such as vertical or diagonal directions, thereby further reducing the probability of the encapsulation layer 3 detaching from the display panel 10 due to forces from other directions such as vertical or diagonal directions.

[0065] Among them, such as Figure 5 As shown, the second dam 6 includes a second dam organic layer 61 and a second dam inorganic layer 62 located on the side surface of the second dam organic layer 61 away from the substrate 1. The specific structure, function, materials, and formation process of the second dam organic layer 61 and the second dam inorganic layer 62 are similar to those of the first dam organic layer 21 and the first dam inorganic layer 22 described above, and can be found in the relevant descriptions above.

[0066] In a specific embodiment, see Figure 9 , Figure 9 This diagram illustrates the relationship between the spacing between two adjacent protrusions and the spacing between two adjacent pixels. At least some of the protrusions 5 are arranged in an array, and the spacing L1 between two adjacent protrusions 5 in this array is the same as or a multiple of the spacing L2 between two adjacent pixels 7 in the display area 11. Specifically, the spacing L1 between two adjacent protrusions 5 is greater than the spacing L2 between two adjacent pixels 7 in the display area 11. This allows the protrusions 5 to be used to locate pixels 7, enabling rapid pixel location during later problem analysis by determining the position of the protrusions 5, thereby improving work efficiency. The spacing L1 between two adjacent protrusions 5 can be 1.5 times, 2 times, 3 times, 3.5 times, or 4 times the spacing L2 between two adjacent pixels 7 in the display area 11. Specifically, the spacing between two adjacent protrusions 5 is 50 micrometers to 200 micrometers.

[0067] In order to enhance the bonding force between the encapsulation layer 3, the protrusion 5, and the substrate 1, and to prevent cracks in the non-display area 12 of the display panel 10 from extending to the display area 11 and affecting the light-emitting unit; such as Figure 4 , Figure 6 or Figure 10 As shown, Figure 10 This is a schematic diagram of the staggered distribution of a plurality of protrusions according to a first embodiment of this application. The plurality of protrusions 5 can be staggered. Specifically, the staggered distribution of the plurality of protrusions 5 means that at least some of the protrusions 5 have at least one protrusion 5 between adjacent protrusions 5 along a direction perpendicular to the direction connecting their center points. Specifically, the plurality of protrusions 5 can be discrete, arrayed, or dispersed.

[0068] In specific implementation, such as Figure 10As shown, a plurality of protrusions 5 are arranged in parallel rows to form at least one column, with the protrusions 5 in each adjacent column being staggered. Of course, in other embodiments, such as... Figure 11 As shown, Figure 11 A schematic diagram of the misaligned distribution of several protrusions 5 provided in the second embodiment of this application.

[0069] Figures 12-19 The diagram illustrates the staggered distribution of several protrusions in the third to tenth embodiments of this application. Several protrusions 5 are arranged in parallel rows to form at least one column, with the protrusions 5 in each adjacent two rows being staggered, and the protrusions 5 in each adjacent two columns also being staggered.

[0070] Specifically, such as Figure 18 As shown, in two adjacent rows of protrusions 5, the cross-sectional area of ​​the protrusions 5 in one row gradually decreases along the first direction A, while the cross-sectional area of ​​the protrusions 5 in the other row gradually increases along the first direction A. This is to strengthen the bonding force between the encapsulation layer 3 and the protrusions 5 and the substrate 1 while blocking forces in the vertical or oblique directions through these protrusions 5, resulting in a tighter encapsulation effect for the entire encapsulation structure. Or as... Figure 19 As shown, the protrusions 5 are arrow-shaped, and the arrows of adjacent columns of protrusions 5 point in opposite directions.

[0071] Specifically, the cross-sectional shapes of any two adjacent rows of protrusions 5 may be the same or different. The cross-sectional shape of protrusion 5 can be circular (e.g., ...). Figure 12 ), oval (such as) Figure 10 ), cross-shaped (such as Figure 13 , Figure 16 ), hexagon (such as Figure 14 or Figure 18 ) or arrow-shaped (such as Figure 15 , Figure 17 , Figure 19 ).

[0072] Of course, in other embodiments, see Figures 20 to 26 , Figures 20-26 These are schematic diagrams illustrating the matrix distribution of several protrusions in the first to seventh embodiments of this application. The several protrusions 5 can also be arranged in a matrix. Specifically, as shown... Figures 20 to 24 As shown, the shape and / or area of ​​the cross-section of each of the plurality of protrusions 5 may also be the same. Specifically, as... Figure 25 As shown, the cross-sectional areas of the protrusions 5 in each row are different, and the cross-sectional areas of the protrusions 5 in each row gradually decrease along the first direction A. Alternatively, as... Figure 26 As shown, the protrusion 5 is arrow-shaped, and the arrows of adjacent rows of protrusion 5 point in opposite directions.

[0073] It should be noted that the distribution of the protrusions 5 provided in this application includes, but is not limited to, the patterns and arrangements mentioned above. The specific distribution of the protrusions 5 can be varied according to different needs and limitations of the screen circuitry, as long as it can achieve the purpose of increasing the bonding force of the encapsulation layer 3 and meet different design needs and limitations. The pattern and arrangement of the protrusions 5 are highly flexible.

[0074] The display panel 10 provided in this embodiment includes a substrate 1, a first dam 2 in the non-display area 12 of the substrate 1, and the first dam 2 surrounding the display area 11 of the substrate 1. This prevents organic materials from intruding into the non-display area 12 and causing defects. Simultaneously, an encapsulation layer 3 is provided to cover the substrate 1 and the first dam 2, thereby preventing the light-emitting unit from being affected by the external environment and reducing device degradation of the display panel 10 caused by moisture and oxygen. Furthermore, by including a first dam organic layer 21 and a first dam inorganic layer 22 on the side surface of the first dam organic layer 21 away from the substrate 1, and by contacting the bottom inorganic encapsulation film layer 31 of the encapsulation layer 3 with the first dam inorganic layer 22, the encapsulation layer 3 and the first dam 2 are bonded together through the bonding of the first dam inorganic layer 22 and the inorganic encapsulation film layer 31 of the encapsulation layer 3. This effectively enhances the bonding force between the encapsulation layer 3 and the first dam 2, reduces the probability of peeling problems between the encapsulation layer 3 and the first dam 2, and thus effectively improves the reliability of the encapsulation layer 3, enabling the encapsulation layer 3 to withstand greater stress and have a longer lifespan.

[0075] See Figure 27 , Figure 27 This is a simplified structural diagram of an electronic device provided in one embodiment of this application. In this embodiment, an electronic device is also provided, which may be a desktop computer, laptop computer, personal digital assistant (PDA), mobile phone, television, etc. The electronic device includes a display panel 10 for displaying images during operation. The display panel 10 is the same as the display panel 10 involved in any of the above embodiments. The specific structure and function of the display panel 10 can be found in the relevant descriptions of the display panel 10 provided in the above embodiments, and will not be repeated here.

[0076] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A display panel, characterized in that, include: The substrate includes a display area and a non-display area; A first dam is located in the non-display area of ​​the substrate and is disposed around the display area of ​​the substrate; wherein the first dam includes a first dam organic layer and a first dam inorganic layer located on the side surface of the first dam organic layer away from the substrate. An encapsulation layer covers the substrate and the first dam; the encapsulation layer includes a plurality of inorganic encapsulation film layers and an organic encapsulation film layer located between the plurality of inorganic encapsulation film layers; wherein the bottommost inorganic encapsulation film layer of the encapsulation layer is in contact with the inorganic layer of the first dam; A plurality of protrusions are located in the non-display area of ​​the substrate and disposed on the side of the first dam away from the display area; at least some of the protrusions are arranged in an array, and the spacing between two adjacent protrusions in the array is the same as or a multiple of the spacing between two adjacent pixels in the display area; the plurality of protrusions are staggered; the plurality of protrusions are arranged in parallel rows to form at least two rows and / or at least two columns, and the protrusions in each adjacent two rows and / or each adjacent two columns are staggered; in each adjacent two rows of protrusions, the cross-sectional area of ​​the protrusions in one row gradually decreases along a first direction, and the cross-sectional area of ​​the protrusions in the other row gradually increases along the first direction; The second dam is located on the side of the first dam away from the display area and surrounds the first dam; the plurality of protrusions are spaced apart on the side of the second dam away from the first dam, and / or the plurality of protrusions are spaced apart between the second dam and the first dam.

2. The display panel according to claim 1, characterized in that, The encapsulation layer covers the plurality of protrusions, each of the protrusions including an organic layer and an inorganic layer located on the side of the organic layer away from the substrate; the bottommost inorganic encapsulation film layer of the encapsulation layer is in contact with the inorganic layer.

3. The display panel according to claim 1, characterized in that, The protrusions are spaced apart from the first dam.

4. The display panel according to claim 1, characterized in that, The plurality of protrusions are arranged around the first dam.

5. The display panel according to claim 1, characterized in that, The organic layer is an array of organic layers, and the inorganic layer is an array of inorganic layers.

6. The display panel according to claim 1, characterized in that, The second dam includes a second dam organic layer and a second dam inorganic layer located on the side surface of the second dam organic layer away from the substrate.

7. The display panel according to claim 6, characterized in that, The organic layer, the first dam organic layer, the second dam organic layer, the inorganic layer, the first dam inorganic layer, and the second dam inorganic layer are prepared by chemical vapor deposition at a first temperature; the inorganic encapsulation film layer is prepared by chemical vapor deposition at a second temperature; wherein, the first temperature is greater than 200°C; and the second temperature is less than 100°C.

8. The display panel according to claim 1, characterized in that, The spacing between two adjacent protrusions is greater than the spacing between two adjacent pixels in the display area.

9. The display panel according to claim 8, characterized in that, The spacing between two adjacent protrusions is 50 micrometers to 200 micrometers.

10. The display panel according to claim 1, characterized in that, The length and width of the protrusion are 30-60 micrometers; the height of the protrusion is 3-5 micrometers.

11. The display panel according to claim 1, characterized in that, The cross-sectional shape of each pair of adjacent rows of protrusions may be the same or different.

12. The display panel according to claim 1, characterized in that, The cross-sectional shape of the protrusion is circular, elliptical, cross-shaped, hexagonal, or arrow-shaped.

13. A method for manufacturing a display panel, the display panel comprising the display panel of claim 1, characterized in that, The organic layer, the first dam organic layer, the second dam organic layer, the inorganic layer, the first dam inorganic layer, and the second dam inorganic layer are prepared by chemical vapor deposition at a first temperature; the inorganic encapsulation film layer is prepared by chemical vapor deposition at a second temperature; wherein, the first temperature is greater than 200°C; and the second temperature is less than 100°C.

14. An electronic device, characterized in that, Includes the display panel as described in any one of claims 1-12.

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