High-altitude multi-purpose high-power vehicle-mounted system heat dissipation module

Abstract

The application relates to a heat dissipation module suitable for a high-altitude multipurpose high-power vehicle-mounted system, which comprises a PCB board, four groups of control chips are arranged on one side of the PCB board, the four groups of heat sources are arrayed, two control chips at the front end are both connected with first heat dissipation assemblies for dissipating heat of the chips, two control chips at the rear end are both connected with second heat dissipation assemblies for dissipating heat of the chips, the first heat dissipation assemblies and the second heat dissipation assemblies are of the same structure, and the height of the first heat dissipation assemblies is lower than that of the second heat dissipation assemblies. The application can improve the heat dissipation efficiency.

Description

Technical Field

[0001] This invention relates to a heat dissipation module for a high-power vehicle-mounted system suitable for high altitudes and multiple applications. Background Technology

[0002] With the rapid pace of national construction and the continuous improvement of standards, there are increasingly higher requirements for vehicles used in production operations, such as dump trucks, road rollers, sedans, and commercial vehicles. Although their functions differ, they share the same control system principles. The increasing functionality and stringent requirements of these products necessitate higher efficiency and processing speeds for the central control system chips in automobiles. Consequently, the number of chips in the central control system must be increased to meet these demands without expanding the available space. This places greater challenges on the design of the control system's heat sink.

[0003] Currently, existing products are used at an altitude of 2000m and an ambient temperature of 35℃, where four GPU chips are working simultaneously and the surface temperature of their junctions cannot exceed 72℃. At the same time, when the wind (ambient temperature = 35℃) blows over the first heat dissipation module, the heatsink is heated by the bottom chip. When the air blown out of the first heat dissipation module by the fan reaches the air inlet of the second heat dissipation module, the temperature reaches 60℃. Traditional heat dissipation methods can no longer meet the requirements of this product, and heat dissipation cannot be performed at this time, resulting in reduced heat dissipation efficiency.

[0004] Since traditional production heat dissipation engineering processes can no longer meet the thermal performance requirements of this product, the designers have actively researched and innovated to create a new type of heat dissipation module suitable for high-altitude, multi-purpose, high-power vehicle systems, making it more valuable for industrial applications. Summary of the Invention

[0005] To address the aforementioned technical problems, the purpose of this invention is to provide a heat dissipation module for a high-power vehicle-mounted system suitable for high-altitude and multi-purpose applications.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A heat dissipation module for a high-power vehicle system suitable for high-altitude and multi-purpose applications includes a PCB board. Four control chips are arranged in an array on one side of the PCB board. These four control chips are four 436.4W high-power GPU chips. Next to each GPU chip are three small heat-generating components with power ratings of 10.5W*2, 9.1W*1, and 19.8W*1, respectively. The two control chips at the front end are each connected to a first heat dissipation component for chip cooling, and the two control chips at the rear end are each connected to a second heat dissipation component for chip cooling. The first and second heat dissipation components have the same structure, with the height of the first heat dissipation component being lower than the height of the second heat dissipation component.

[0008] The first heat dissipation component includes a heat dissipation connecting block and a heat spreader plate. The heat spreader plate is connected to the PCB board through a thermal pad, and the bottom of the heat spreader plate is in contact with the control chip. The heat dissipation connecting block is connected to the left and right sides of the heat spreader plate through a thermal pad. The heat dissipation connecting block has several holes for heat pipe insertion. Several heat pipes are inserted into the holes of the heat dissipation connecting block. The heat pipes have a D-shaped structure with one end open. The lower end of the D-shaped heat pipe is in contact with the heat spreader plate. Several heat dissipation fins are connected to the top of the heat spreader plate. Several heat dissipation fins are inserted through the upper end of the heat pipes. A heat dissipation shroud is connected to the heat dissipation fins (24).

[0009] Preferably, in the heat dissipation module of the high-power vehicle-mounted system suitable for high altitude and multiple uses, the PCB board is connected to a cooling fan for blowing air onto the first heat dissipation component and the second heat dissipation component.

[0010] Preferably, in the heat dissipation module of the high-power vehicle-mounted system suitable for high altitude and multiple uses, the bottom of the heat dissipation shroud is connected to the heat dissipation connecting block by bolts.

[0011] Preferably, in the heat dissipation module of the high-power vehicle-mounted system suitable for high altitude and multiple uses, the bends of the heat pipes in the D-shaped structure are all at 60 degrees.

[0012] Preferably, in the heat dissipation module of the high-power vehicle-mounted system applicable to high altitude and multiple uses, the heat spreader is provided with an evaporation cavity, wherein the thickness of the copper powder sintered in the evaporation cavity is 0.8mm, and the heat spreader is provided with an upper cover plate, wherein the thickness of the copper powder sintered on the upper cover plate is 0.4mm.

[0013] Preferably, in the heat dissipation module of the high-power vehicle-mounted system suitable for high altitude and multiple uses, a rivet is connected to the top of the heat dissipation shroud.

[0014] Preferably, in the heat dissipation module of the high-power vehicle-mounted system suitable for high altitude and multiple uses, the number of heat dissipation fins of the first heat dissipation component is less than the number of heat dissipation fins of the second heat dissipation component.

[0015] Preferably, in the heat dissipation module of the high-power vehicle system applicable to high altitude and multiple uses, the thickness of the heat dissipation fins of the first heat dissipation component is 1.82mm.

[0016] Preferably, in the heat dissipation module of the high-power vehicle system applicable to high altitude and multiple uses, the thickness of the heat dissipation fins of the second heat dissipation component is 1.40mm.

[0017] Preferably, in the heat dissipation module of the high-power vehicle system applicable to high altitudes and multiple uses, the thickness of the copper powder sintered on the surface of the D-shaped heat pipe is 0.8 mm.

[0018] By means of the above-described solution, the present invention has at least the following advantages:

[0019] 1. Compared with traditional heat dissipation modules, this invention can meet the requirement of four high-power chips being connected in series and dissipating heat simultaneously.

[0020] 2. The present invention uses a welded heat sink with a heat spreader plate and sintered heat pipes, which has high overall temperature uniformity of the heat dissipation module, effectively improving heat dissipation performance and increasing efficiency.

[0021] 3. The present invention adopts a modular installation method, which is compact in structure. The present invention only requires two 80*80mm fans, which greatly reduces the size.

[0022] 4. This invention uses rivets to reduce the resonance frequency, thus fixing the heat sink and the product together, reducing the resonance amplitude, and ensuring stable operation during vibration.

[0023] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the internal structure of the present invention;

[0027] Figure 3 This is a schematic diagram of the internal structure of the present invention;

[0028] Figure 4 This is a schematic diagram of the temperature sensing point of the heating block of the heat spreader in this invention;

[0029] Figure 5 This is a schematic diagram of the temperature sensing zone at the condenser end of the heat spreader plate of the present invention;

[0030] Figure 6 This is a heat dissipation flow rate diagram of the first heat dissipation component and the second heat dissipation component of the present invention under a laminar flow state;

[0031] Figure 7 This is a heat dissipation diagram of the first and second heat dissipation components of the present invention under advection conditions;

[0032] Figure 8 This is a heat dissipation velocity diagram of the first and second heat dissipation components of the present invention under turbulent conditions;

[0033] Figure 9 This is a heat dissipation diagram of the first and second heat dissipation components of the present invention under turbulent conditions. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0036] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0037] In the description of this application, it should be noted that the terms "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0038] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or vertical, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0039] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0040] Example

[0041] like Figure 1 , Figure 2 and Figure 3 As shown, a heat dissipation module for a high-power vehicle-mounted system suitable for high-altitude and multi-purpose applications includes a PCB board 1. Four sets of control chips are arranged in an array on one side of the PCB board. Each set of control chips is a 436.4W high-power GPU chip. Next to each GPU chip are three small heat-generating components with power ratings of 10.5W*2, 9.1W*1, and 19.8W*1, respectively. The two front-end control chips are each connected to a first heat dissipation component 2 for chip cooling, and the two rear-end control chips are each connected to a second heat dissipation component 3 for chip cooling. The first heat dissipation component 2 and the second heat dissipation component 3 have the same structure, with the height of the first heat dissipation component 2 being lower than the height of the second heat dissipation component 3. While the overall structure of the first heat dissipation component 2 and the second heat dissipation component 3 is roughly the same, there are differences in the tooth spacing and fin height of their fins. This is to address the phenomenon of heat concentration caused by heat convection during the array-type operation of the fins.

[0042] The first heat dissipation component 2 includes a heat dissipation connecting block 21 and a heat spreader plate 22. The heat spreader plate 22 is connected to the PCB board 1 via a thermal pad, and the bottom of the heat spreader plate 22 is in contact with the control chip. The heat dissipation connecting block 21 is connected to the left and right sides of the heat spreader plate 22 via a thermal pad. The heat dissipation connecting block 21 has several holes for heat pipe insertion. Several heat pipes 23 are inserted into the holes of the heat dissipation connecting block 21. The heat pipes 23 have a D-shaped structure with one open end. The lower end of the D-shaped heat pipes 23 is in contact with the heat spreader plate 22. Several heat dissipation fins 24 are connected to the top of the heat spreader plate 22. Several heat dissipation fins 24 are inserted through the upper end of the heat pipes 23. Heat dissipation shrouds 25 are connected to the heat dissipation fins 24.

[0043] The PCB board 1 described in this invention is connected to cooling fans (not shown) for blowing air onto the first heat dissipation component 2 and the second heat dissipation component 3. The heat sink dimensions of the first heat dissipation component are 140.5*81.5*51.42mm, and the heat sink dimensions of the second heat dissipation component are 140.5*80.5*63.7mm. Two 80*80mm fans are used for cooling, significantly reducing the overall size.

[0044] In this invention, the bottom of the heat dissipation shroud 25 is connected to the heat dissipation connecting block 21 by bolts.

[0045] In this invention, the bends of the D-type heat pipes 23 are all 60 degrees. Due to the special installation method, there are significant challenges in the arrangement of the heat pipes. To minimize the heat exchange area of ​​the fins, and within a limited space, multiple simulations showed that only four heat pipes could be arranged, positioned on both sides of the radiator. Two holes were pre-drilled on each side of the fins. To maximize heat transfer efficiency, the distance between the two sides of the fins was limited to 23mm and 26mm respectively. This maximizes heat transfer. Furthermore, the heat pipes all employ a grooved wall structure before powder sintering, involving multiple bends and 60° rotations. Conventional heat pipes cannot meet the 125W heat dissipation requirement; therefore, a D-type composite tube design is adopted. The internal heat pipe sintering powder thickness is 0.8mm, filled with ultrapure water at a 95% water ratio. This not only solves the risk of copper powder shedding at multiple bends but also meets the 125W heat dissipation requirement.

[0046] like Figure 4 and Figure 5 As shown, the temperature distribution plate 22 of the present invention is provided with an evaporation chamber, wherein the thickness of the copper powder sintered in the evaporation chamber is 0.8 mm, and the temperature distribution plate 22 is provided with an upper cover plate, wherein the thickness of the copper powder sintered on the upper cover plate is 0.4 mm.

[0047] Table 1

[0048] Filling volume Power TC T20 T21 T23 T25 T26 R 6.2g 500 85.8 63.6 62.8 62.7 62.1 62.5 0.0461 5.6g 500 84.2 62.4 63.6 62.8 62.8 62.4 0.0428 5.8g 500 82.6 63.3 62.5 62.6 62.9 62.7 0.0396

[0049] According to the formula R = (TC - (T20 + T21 + T23 + T25 + T26) / 5) / POWER, the smaller the value of R, the better the heat dissipation of the vapor chamber.

[0050] Based on the verification data in Table 1 above, and after verification with different water injection volumes and powder thicknesses, the following conclusions were drawn. Finally, a powder thickness of 0.8 mm for the evaporation chamber and 0.4 mm for the top cover was used, and a water injection volume of 5.8 g was used for filling.

[0051] The top of the heat dissipation shroud 25 in this invention is connected to a rivet post 26, and six M4 tapered holes are reserved on each side to lock with six M4 threaded holes on both sides of the aluminum block (heat dissipation connecting block 21). This structure is beneficial to enhance the stability of the base.

[0052] First, the bottom support is secured with six M4 screws, effectively fixing the base in place and allowing it to function normally under a force of 109 pounds.

[0053] Secondly, it facilitates the integration of sheet metal parts and the product, reducing the increase in resonance amplitude between the two products. The addition of the two top rivets allows for direct locking of the top rivets to the chassis. During bumps and vibrations, the actual product and the vibrating body vibrate together, reducing amplitude and increasing product stability.

[0054] Thirdly, the sheet metal parts and the bottom support base are secured with screws and brackets. Then, the bottom support base is soldered to the heat spreader using solder paste. The heat spreader, fins, and heat pipes are all soldered with solder paste. Once soldering is complete, the entire heatsink becomes a single unit. Next, it is connected to the control system via 26 press-fit studs on the upper part of the sheet metal parts.

[0055] Operating vibration: 5~17Hz, 0.5" double amplitude;

[0056] Storage / transport vibration: 2g@5~500Hz;

[0057] Work impact: 20g@11ms;

[0058] Storage / transport shock: In 30g@11ms shock and vibration environments, there will be no resonance with the control system, reducing the amplitude and ensuring its stability.

[0059] In this invention, the number of heat dissipation fins of the first heat dissipation component 2 is less than the number of heat dissipation fins of the second heat dissipation component 3. The thickness of the heat dissipation fins of the first heat dissipation component 2 is 1.82 mm, and the thickness of the heat dissipation fins of the second heat dissipation component 3 is 1.40 mm.

[0060] It should be noted that the heat dissipation fins of the first heat dissipation component 2 and the heat dissipation fins of the second heat dissipation component 3 have the same structure.

[0061] like Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, since four GPU main chip heat sources are working simultaneously, the first heatsink assembly 2, which is close to the cooling fans, needs to reduce the number and spacing of the fins to increase the heat exchange area of ​​the second heatsink and allow more airflow into the second heatsink fins. This can significantly reduce the heat exchange area of ​​the first heatsink. Secondly, the height of the heatsink can be reduced to allow more airflow into the first heatsink. Furthermore, because the GPU temperature of the first heatsink is indirectly increased due to the reduced heat dissipation area, the temperature of the airflow into the fins will also be reduced accordingly. This indirectly increases the airflow into the second heatsink and also significantly reduces the temperature of the incoming air, thus improving the heat exchange efficiency.

[0062] Among them, in such Figure 6 The heat dissipation fins of the first heat dissipation component 2 and the second heat dissipation component 3 are at the same height, and their airflow velocities are almost the same, but... Figure 7 In this process, because the height of the second heat dissipation component 3 is greater than that of the first heat dissipation component 2, the airflow from the cooling fan is formed in a turbulent state under the structure of the heat dissipation fins of the first heat dissipation component 2 and the second heat dissipation component 3, which increases the airflow speed and thus achieves efficient heat dissipation.

[0063] By adjusting the installation method of the first and second heat dissipation components, the first heat dissipation component 2, located closer to the cooling fan, has a reduced heat dissipation area and a lower fin height. This allows air to enter the second heat dissipation component from the top of the first component without being heated. Then, as the air heated by the first component flows into the second component, the staggered fin spacing transforms the originally horizontal airflow into turbulent flow, further increasing the airflow velocity of the cooling fan. This effectively increases the heat exchange rate of the second heat dissipation component's fins, thereby meeting the heat dissipation requirements.

[0064] In this invention, the thickness of the copper powder sintered on the surface of the D-shaped heat pipe 23 is 0.8 mm, which can increase the heat dissipation area with the heat dissipation fins. The D-shaped tube increases the heat flux density of the heat pipe and fins during welding and is beneficial to the heat pipe conduction.

[0065] Table 2

[0066]

[0067] In Table 2 above, GPUs (2-3) in Scheme 1 are made of aluminum, while GPUs (1-4) are made of copper. In Scheme 2, the GPU uses 3VDC (pure aluminum fins). Scheme 3 is simulated data, and Scheme 4 is the actual sampled data in this invention. The data in Scheme 4 is lower than the GPU temperature in Schemes 1 and 2, and also lower than the simulated data. That is, this invention can improve heat dissipation efficiency.

[0068] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A heat dissipation module for a high-power vehicle-mounted system suitable for high altitude and multiple applications, comprising a PCB board (1), wherein four sets of control chips are disposed on one side of the PCB board (1), and the four sets of control chips are arranged in an array, characterized in that: The two control chips located at the front end are each connected to a first heat dissipation component (2) for chip heat dissipation, and the two control chips located at the rear end are each connected to a second heat dissipation component (3) for chip heat dissipation. The first heat dissipation component (2) and the second heat dissipation component (3) have the same structure, wherein the height of the first heat dissipation component (2) is lower than the height of the second heat dissipation component (3). The first heat dissipation component (2) includes a heat dissipation connecting block (21) and a heat spreader plate (22). The heat spreader plate (22) is connected to the PCB board (1) via a thermal pad, and the bottom of the heat spreader plate (22) is in contact with the control chip. The heat dissipation connecting block (21) is connected to the left and right sides of the heat spreader plate (22) via a thermal pad. The heat dissipation connecting block (21) has several holes for heat pipe insertion, and several heat pipes (22) are inserted into the holes of the heat dissipation connecting block (21). 3) The heat pipe (23) has a D-shaped structure with one end open. The lower end of the heat pipe (23) with the D-shaped structure is in contact with the heat spreader (22). Several heat dissipation fins (24) are connected to the top of the heat spreader (22). Several heat dissipation fins (24) are connected to the upper end of the heat pipe (23). Heat dissipation shrouds (25) are connected to the heat dissipation fins (24). The number and spacing of the fins of the first heat dissipation component are less than the number and spacing of the fins of the second heat dissipation component.

2. The heat dissipation module for a high-power vehicle-mounted system suitable for high altitude and multiple applications as described in claim 1, characterized in that: The PCB board (1) is connected to a cooling fan for blowing air onto the first heat dissipation component (2) and the second heat dissipation component (3).

3. The heat dissipation module for a high-power vehicle-mounted system suitable for high altitude and multiple applications as described in claim 1, characterized in that: The bottom of the heat dissipation shroud (25) is connected to the heat dissipation connecting block (21) by bolts.

4. The heat dissipation module for a high-power vehicle-mounted system suitable for high altitude and multiple applications as described in claim 1, characterized in that: The bends of the heat pipes (23) in the D-type structure are all 60 degrees.

5. A heat dissipation module for a high-power vehicle-mounted system suitable for high altitude and multiple applications as described in claim 1, characterized in that: The temperature distribution plate (22) is provided with an evaporation chamber, wherein the thickness of the copper powder sintered in the evaporation chamber is 0.8 mm, and the temperature distribution plate (22) is provided with an upper cover plate, wherein the thickness of the copper powder sintered on the upper cover plate is 0.4 mm.

6. A heat dissipation module for a high-power vehicle-mounted system suitable for high altitude and multiple applications as described in claim 3, characterized in that: A rivet (26) is connected to the top of the heat dissipation shroud (25).

7. A heat dissipation module for a high-power vehicle-mounted system suitable for high altitude and multiple applications as described in claim 1, characterized in that: The number of heat dissipation fins in the first heat dissipation component (2) is less than the number of heat dissipation fins in the second heat dissipation component (3).

8. A heat dissipation module for a high-power vehicle-mounted system suitable for high altitude and multiple applications, as described in claim 1 or 7, characterized in that: The thickness of the heat dissipation fins of the first heat dissipation component (2) is 1.82 mm.

9. A heat dissipation module for a high-power vehicle-mounted system suitable for high altitude and multiple applications, as described in claim 1 or 7, characterized in that: The thickness of the heat dissipation fins of the second heat dissipation component (3) is 1.40 mm.

10. A heat dissipation module for a high-power vehicle-mounted system suitable for high-altitude multi-purpose applications as described in claim 1 or 4, characterized in that: The thickness of the copper powder sintered on the surface of the heat pipe (23) of the D-type structure is 0.8 mm.

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