A focal plane assembly device and method for large target surface splicing of detectors

Abstract

This invention discloses a focal plane assembly device for large target surface stitching of detectors, relating to the field of area array detector technology. The invention includes a substrate with several sets of mounting holes, allowing scientific imaging CCDs to be stitched together to form a scientific imaging area. A wavefront sensing CCD is mounted on the substrate via a wavefront sensor mounting bracket, and a guide star detector CCD is mounted via a guide star detector mounting bracket, thus stitching the wavefront sensing CCD and the guide star detector CCD with the scientific imaging area to form a complete imaging surface. A base ring is connected to a circumferentially distributed bracket, the upper end of which is connected to the substrate. This invention uses the wavefront sensor mounting bracket and the guide star detector mounting bracket to mount the wavefront sensing CCD and the guide star detector CCD respectively, and uses a reference block on the substrate as a reference, enabling the scientific imaging area composed of the wavefront sensing CCD, the guide star detector CCD, and the scientific imaging CCD to be stitched together into a complete imaging surface, solving the problem that the flatness of the imaging surface after stitching multiple CCDs cannot be guaranteed in existing methods.

Description

Technical Field

[0001] This invention belongs to the field of area array detector technology, and in particular relates to a focal plane assembly device and method for assembling large target surfaces of detectors. Background Technology

[0002] With the development of space science and astronomy, the demand for precision in their detection projects is increasing. To develop more precise photoelectric detection instruments, scientific-grade detectors such as CCD photoelectric sensors, CMOS sensors, infrared InGaAs sensors, InSb sensors, and MCT sensors are required. Taking scientific-grade CCDs (charge-coupled devices) as an example, because the target surface of scientific cameras is becoming increasingly larger, a single CCD cannot meet the requirements. Multiple CCDs need to be stitched together, either linearly or interlaced mechanically, on a substrate to form an image plane.

[0003] Considering that the height variation range of a CCD is approximately 10-15 μm, the flatness requirement for the substrate supporting multiple CCDs needs to be 3-5 μm. Furthermore, in telescope systems, when the substrate supports multiple CCDs to perform specific observation tasks, the elevation angle needs to be constantly changed to observe different areas of the sky. This necessitates minimizing the potential impact of changes in the direction of gravity when designing the substrate and its supporting components for multiple CCDs.

[0004] Furthermore, in order to reduce its dark current noise and improve the signal-to-noise ratio for weak signal detection, the substrate and the support components need to meet the requirement of low heat leakage.

[0005] For telescope imaging systems, to maximize the number of pixels on the imaging surface within the field of view, the seam between stitched CCDs should be as small as possible. In existing multi-detector substrate designs, most can only accommodate two or four small-sized detectors in the same package. In this design, the substrate size is relatively small, and positioning is not an issue. However, when extending to the stitching of multiple large-sized CCDs, the substrate's thermal expansion and contraction, as well as deformation due to gravity, cause the flatness of the resulting imaging surface to be compromised, rendering existing substrate designs unsuitable. Summary of the Invention

[0006] The purpose of this invention is to provide a focal plane assembly device for large target surface splicing of detectors. The wavefront sensing CCD and the guide detector CCD are installed by a wavefront sensor mounting base and a guide detector mounting base, respectively. The reference block on the substrate is used as a reference, so that the scientific imaging area composed of the wavefront sensing CCD, the guide detector CCD and the scientific imaging CCD is spliced ​​into a complete imaging surface. This solves the problem that the flatness accuracy of the imaging surface after splicing multiple CCDs cannot be guaranteed.

[0007] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution:

[0008] This invention relates to a focal plane assembly device for large target surface splicing of detectors, comprising a substrate and a base ring. The substrate has several sets of mounting holes for mounting scientific imaging CCDs, which are then spliced ​​together to form a scientific imaging area. The substrate is fixedly connected to several wavefront sensor mounting seats, guide star detector mounting seats, and a reference block. The wavefront sensor mounting seats and guide star detector mounting seats are arranged around the scientific imaging area, used to mount wavefront sensing CCDs via the wavefront sensor mounting seats and guide star detector CCDs via the guide star detector mounting seats, thus splicing the wavefront sensing CCDs and guide star detector CCDs with the scientific imaging area to form a complete imaging surface. The base ring has a circular structure and is fixedly connected to brackets evenly distributed around its circumference, the upper end of which is fixedly connected to the substrate.

[0009] As a preferred embodiment of the present invention, the substrate has a plurality of reinforcing ribs on its side, and the reinforcing ribs are arranged in a crisscross pattern.

[0010] As a preferred embodiment of the present invention, the mounting hole group includes a plurality of positioning holes, connecting holes and cable routing holes.

[0011] As a preferred embodiment of the present invention, the wavefront sensor mounting base has a front-focus detector mounting surface and a back-focus detector mounting surface, and the front-focus detector mounting surface and the back-focus detector mounting surface form a stepped surface structure to ensure that the front-focus detector and the back-focus detector meet the parallelism requirements after installation; wherein, both the front-focus detector mounting surface and the back-focus detector mounting surface are provided with wire-passing holes and several mounting holes, and the substrate is provided with through slots corresponding to the positions of the wire-passing holes.

[0012] As a preferred embodiment of the present invention, the surface of the guide detector mounting base is provided with a cuboid cooling block and a plurality of cylindrical bosses; the upper surface of the cylindrical bosses is provided with threaded holes.

[0013] As a preferred embodiment of the present invention, a blind hole is provided on the connection surface between the reference block and the substrate, and an Invar column is fixedly connected inside the blind hole; the Invar column is provided with a threaded connection hole; and an exhaust hole communicating with the upper end of the blind hole is provided on the side of the reference block.

[0014] As a preferred embodiment of the present invention, the bracket has an inverted V-shaped structure; wherein, it includes a substrate connecting block for connecting to the substrate;

[0015] The substrate connecting block is fixedly connected to two support rods, and the lower ends of the two support rods are fixedly connected to base ring connecting blocks for connecting to the base ring through the base ring connecting blocks.

[0016] As a preferred embodiment of the present invention, a bracket adapter block is fixedly connected to the upper surface of the substrate connecting block, and the lower surface of the bracket adapter block is fixedly connected to the upper surface of the substrate.

[0017] As a preferred embodiment of the present invention, a pad is connected between the base ring connecting block and the base ring, and the pad is made of G10 material.

[0018] A method for assembling a focal plane assembly for large target surface stitching of a detector includes the following steps:

[0019] Step 1: Connect the substrate to the base ring using several supports and pads;

[0020] Step 2: Install several wavefront sensor mounting bases, guide star detector mounting bases, and reference blocks on the substrate surface, and determine the parallelism between the reference block surface and the base ring surface.

[0021] Step 3: Connect the scientific imaging CCDs to the substrate surface one by one with the corresponding mounting hole positions, and then stitch the scientific imaging CCDs together to form a scientific imaging area. Then calibrate the parallelism between the reference block surface and the scientific imaging area.

[0022] Step 4: Mount the wavefront sensing CCD onto the surface of the wavefront sensor mount, and then mount the guide star detector CCD onto the surface of the guide star detector mount.

[0023] Step 4: The parallelism between the wavefront sensing CCD imaging surface and the guide star detection CCD imaging surface and the surface of the reference block is calibrated by the reference block, so that the scientific imaging area composed of the wavefront sensing CCD, the guide star detection CCD and the scientific imaging CCD is stitched into a complete imaging surface.

[0024] The present invention has the following beneficial effects:

[0025] This invention mounts the wavefront sensing CCD and the guide detector CCD using a wavefront sensor mounting base and a guide detector mounting base, respectively. Using a reference block on the substrate as a reference, the scientific imaging area composed of the wavefront sensing CCD, the guide detector CCD, and the scientific imaging CCD is stitched together to form a complete imaging surface. This ensures the overall flatness accuracy of the imaging surface after stitching together multiple CCDs, effectively meeting the design requirements of a large target surface stitching detector substrate.

[0026] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0027] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of a focal plane assembly device for splicing large target surfaces of a detector according to the present invention.

[0029] Figure 2 This is a schematic diagram of the substrate structure;

[0030] Figure 3 for Figure 2 A structural diagram viewed from below;

[0031] Figure 4 A schematic diagram of the wavefront sensor mounting base;

[0032] Figure 5 A schematic diagram of the structure installed for a guide satellite detector;

[0033] Figure 6 This is a partial sectional view of the reference block;

[0034] Figure 7 This is a schematic diagram of the base ring structure;

[0035] Figure 8 This is a schematic diagram of the support structure;

[0036] Figure 9 This is a schematic diagram of the bracket adapter block;

[0037] Figure 10 This is a schematic diagram of the mounting hole assembly;

[0038] Figure 11 A schematic diagram of the structure of a scientific imaging CCD;

[0039] Figure 12 This is a schematic diagram of the structure of a wavefront sensing CCD;

[0040] Figure 13 A schematic diagram of the structure of the guide star detection CCD and the guide star detector mounting base;

[0041] The attached diagram lists the components represented by each number as follows:

[0042] 1-Substrate, 2-Wavefront sensor mounting base, 3-Guide detector mounting base, 4-Reference block, 5-Base ring, 6-Bracket, 101-Reinforcing rib, 102-Positioning hole, 103-Connecting hole, 104-Cable hole, 105-Through slot, 201-Focus front detector mounting surface, 202-Post-Focus detector mounting surface, 203-Wire through hole, 204-Mounting hole, 301-Cooling block, 302-Cylindrical boss, 401-Blind hole, 402-Invar column, 403-Exhaust hole, 601-Substrate connecting block, 602-Support rod, 603-Base ring connecting block, 604-Bracket adapter block, 605-Padded block. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] In the description of this invention, it should be understood that the terms "opening", "upper", "lower", "thickness", "top", "middle", "length", "inner", "around", etc., which indicate orientation or positional relationship, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this invention.

[0045] Example 1

[0046] Please see Figure 1-3 As shown, the present invention is a focal plane assembly device for splicing large target surfaces of detectors, including a substrate 1 and a base ring 5. The substrate 1 has nine sets of mounting holes for mounting scientific imaging CCDs, which are used to splice the scientific imaging CCDs together to form a scientific imaging area after installation.

[0047] like Figure 10 and 11As shown, the mounting hole assembly includes two positioning holes 102, three connecting holes 103, and two ribbon cable holes 104. The two positioning holes 102 can be configured as a circular hole and an oblong hole, respectively, with the center of the circular hole and the two centers of the oblong hole collinear. The waist width of the oblong hole and the circular hole are calibrated with the same geometric tolerance. During installation, the scientific imaging CCD is positioned through the positioning holes 102 and fixed through the connecting holes 103. The two ribbon cables of the scientific imaging CCD pass through the ribbon cable holes 104.

[0048] The substrate 1 is made of silicon carbide, which is sintered and then finely processed. The thickness of the substrate 1 is 12mm-20mm. At the same time, a number of reinforcing ribs 101 are provided on the back side of the substrate 1, and the reinforcing ribs 101 are arranged in a crisscross pattern to improve the rigidity of the substrate 1.

[0049] Multiple temperature sensors need to be distributed and fixed on substrate 1. Considering that the silicon carbide substrate 1 cannot be threaded, threaded Invar posts and holes opened on the silicon carbide substrate 1 can be used to plug the holes. The temperature sensors are then installed through the threaded Invar posts.

[0050] The base plate 1 is fixedly connected to four wavefront sensor mounting bases 2, four guide detector mounting bases 3, and four reference blocks 4; the wavefront sensor mounting bases 2, four guide detector mounting bases 3, and four reference blocks 4 are fixed to the base plate 1 by screws.

[0051] Four wavefront sensor mounts 2 and four guide star detector mounts 3 are arranged around the scientific imaging area. They are used to install wavefront sensing CCDs through the wavefront sensor mounts 2 and guide star detector CCDs through the guide star detector mounts 3, and to stitch the wavefront sensing CCDs and guide star detector CCDs with the scientific imaging area to form a complete imaging surface.

[0052] Among them, the wavefront sensor mount 2 is made of 4j36 with a thermal expansion coefficient of 1.8ppm / K. The four wavefront sensor mounts 2 are arranged in a rectangle on the outside of the scientific imaging area. The four guide detector mounts 3 are arranged in pairs on both sides of the scientific imaging area. The four reference blocks 4 are arranged in pairs on the other two sides of the scientific imaging area. In addition, the two guide detector mounts 3 in a pair are located at the two ends of the wavefront sensor mount 2 on the same side, and the two reference blocks 4 in a pair are located at the two ends of the wavefront sensor mount 2 on the same side.

[0053] Specifically, such as Figure 4 and 12As shown, each wavefront sensor mounting base 2 includes a pair of front-focus detectors and back-focus detectors. The wavefront sensor mounting base 2 has a front-focus detector mounting surface 201 and a back-focus detector mounting surface 202, and the front-focus detector mounting surface 201 and the back-focus detector mounting surface 202 have a stepped surface structure to ensure that the front-focus detectors and back-focus detectors meet the parallelism requirements after installation.

[0054] Both the front-focus detector mounting surface 201 and the back-focus detector mounting surface 202 are provided with wire-passing holes 203 and several mounting holes 204. The substrate 1 is provided with a through slot 105 corresponding to the position of the wire-passing hole 203, so that after the wavefront sensing CCD and the wavefront sensor mounting base 2 are installed through the mounting holes 204, the ribbon cable can pass through the wire-passing hole 203 and the through slot 105.

[0055] like Figure 5 and 13 As shown, the surface of the guide detector mounting base 3 is provided with a cuboid cooling block 301 and three cylindrical bosses 302; the upper end face of the cylindrical bosses 302 is provided with threaded holes, and the guide detector CCD is connected to the guide detector mounting base 3 through the threaded holes.

[0056] Meanwhile, a spring washer with a large elastic range can be added between the contact surface of the guide CCD and the cylindrical boss 302. By adjusting the tightness of the fixing screw and inserting precision shims of different thicknesses between the guide CCD and the cooling block 301, the height of the guide CCD can be adjusted.

[0057] like Figure 6 As shown, a blind hole 401 is provided on the connection surface between the reference block 4 and the substrate 1, and an Invar column 402 is fixedly connected inside the blind hole 401; the Invar column 402 is provided with a threaded connection hole, and the reference block 4 is connected and fixed to the substrate 1 by screws. A vent hole 403 is provided on the side of the reference block 4, which communicates with the upper end of the blind hole 401, so that internal air can be discharged when the screw is screwed in.

[0058] Meanwhile, the parallelism of the plane formed by the four reference blocks 4 with respect to the surface of the base ring 5 is less than 3 μm. Considering temperature adaptability, the reference blocks 4 and the substrate 1 are made of the same material.

[0059] like Figure 1 and 7 As shown, the base ring 5 has a circular structure, and mounting holes are arranged in a circular array on the upper surface of the base ring 5. Supports 6, evenly distributed in a circular pattern, are fixedly connected to the base ring 5. The upper end of each support 6 is fixedly connected to the substrate 1. Specifically, there are four supports 6, which makes the temperature distribution between the supports 6 and the substrate 1 more uniform at low temperatures, avoiding significant warping and tilting caused by non-uniform temperature distribution on the substrate 1.

[0060] Meanwhile, the support 6 is made of titanium alloy TC4. Utilizing the low thermal conductivity and high strength of titanium alloy TC4, heat leakage on the support 6 can be greatly reduced while ensuring support strength.

[0061] Example 2

[0062] Based on Example 1, such as Figure 1 and 8 As shown, the bracket 6 has an inverted V-shaped structure; it includes a substrate connecting block 601 for connecting to the substrate 1. Specifically, a bracket adapter block 604 is attached to the upper surface of the substrate connecting block 601 via screws, and the lower surface of the bracket adapter block 604 is fixedly connected to the upper surface of the substrate 1. The bracket 6 and the substrate 1 are connected by a single substrate connecting block 601. Considering the high flatness of the front surface of the substrate 1, the fixing contact surface between the substrate connecting block 601 and the substrate is designed to be the upper surface of the substrate 1, which is more conducive to precision transfer and ensures the overall assembly accuracy.

[0063] The substrate connecting block 601 is fixedly connected to two support rods 602. The lower ends of the two support rods 602 are fixedly connected to base ring connecting blocks 603, which are used to connect to the base ring 5 through the base ring connecting blocks 603. In addition, a spacer block 605 is connected between the base ring connecting block 603 and the base ring 5. The spacer block 605 is made of G10 material.

[0064] Adding a shim 605 between the base ring connecting block 603 and the base ring 5 not only allows the shim 605 to act as a fitting ring during the assembly of the coke surface assembly, but also enables the leveling of the substrate 1 by machining shims 605 with different height precision or adding precision shims to the contact surface between the shim 605 and the base ring connecting block 603. Simultaneously, adding a G10 material shim 605 helps to further reduce heat leakage and shorten the cooling time of the coke surface.

[0065] Example 3

[0066] Based on Embodiment 2, a method for splicing a focal plane assembly device for splicing large target surfaces of a detector includes the following steps:

[0067] Step 1: Connect the substrate 1 and the base ring 2 using four supports 6. Specifically, connect the substrate connecting block 601 to the substrate 1 via the support adapter block 604, connect the base ring connecting block 603 to the base ring 5, and add a spacer block 605 between the base ring connecting block 603 and the base ring 5.

[0068] Step 2: Install four wavefront sensor mounting bases 2, four guide detector mounting bases 3 and reference block 4 on the surface of substrate 1, and determine the parallelism between the surface of reference block 4 and the surface of base ring 5. The overall flatness is usually less than 3 μm.

[0069] Specifically, after installation, the parallelism between the four reference blocks 4 and the base ring 5 is measured. Depending on the measurement structure, the pad 605 is replaced or the required high-precision pad is added until the parallelism between the reference blocks 4 and the base ring 5 meets the requirements.

[0070] Step 3: Connect the nine scientific imaging CCDs to the surface of substrate 1 one-to-one with the nine mounting hole groups, and then stitch the scientific imaging CCDs together to form a scientific imaging area. Finally, calibrate the parallelism between the surface of reference block 4 and the scientific imaging area. The nine scientific imaging CCD detectors are stitched together in a 3x3 pattern to form the scientific imaging area, with a seam width of less than or equal to 0.5 mm between them.

[0071] Step 4: Mount the wavefront sensing CCD onto the surface of wavefront sensor mount 2, and then mount the guide detector CCD onto the surface of guide detector mount 3. Specifically, the wavefront sensing CCDs are arranged in a rectangular pattern and are closely attached to the outer side of the scientific imaging area.

[0072] Each wavefront sensor mounting base 2 includes two pairs of front-focus detectors and back-focus detectors. The height difference between the front-focus detectors and back-focus detectors is ±1mm, the height tolerance is less than 50um, and the parallelism is less than 30um.

[0073] The high-precision positioning and installation of the wavefront sensing CCD, which consists of a front-focus detector and a back-focus detector, is achieved through the stepped surface structure of the front-focus detector mounting surface 201 and the back-focus detector mounting surface 202, ensuring the parallelism between the front-focus detector and the back-focus detector.

[0074] The four guide star detector CCDs are paired up. In each pair, the two guide star detector CCDs are located on either side of the wavefront sensing CCD on the same side, and they are close to each other and also close to the outside of the scientific imaging area.

[0075] Step 4: Through calibration using reference block 4, ensure that the parallelism between the wavefront sensing CCD imaging surface and the guide star detection CCD imaging surface and the surface of reference block 4 meets the requirements, thereby stitching together the scientific imaging area composed of the wavefront sensing CCD, the guide star detection CCD and the scientific imaging CCD into a complete imaging surface.

[0076] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0077] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A focal plane assembly device for splicing large target surfaces of a detector, characterized in that, It includes: The substrate (1) is provided with a plurality of groups of mounting hole groups for installing scientific imaging CCDs, which are used to splice the scientific imaging CCDs after installation to form a scientific imaging area; The substrate (1) is fixedly connected with a plurality of wavefront sensor mounting seats (2), star guide detector mounting seats (3) and reference blocks (4); wherein a plurality of wavefront sensor mounting seats (2) and star guide detector mounting seats (3) are arranged around the scientific imaging area, and are used to install wavefront sensing CCDs through the wavefront sensor mounting seats (2), install star guide detection CCDs through the star guide detector mounting seats (3), and splice the wavefront sensing CCDs and the star guide detection CCDs with the scientific imaging area to form a complete imaging surface; The base ring (5) is in a circular ring structure and is fixedly connected with supports (6) arranged in a circle, and the upper end of the support (6) is fixedly connected with the substrate (1); The substrate (1) is provided with a plurality of reinforcing ribs (101) arranged in a longitudinal and transverse interlaced manner; The wavefront sensor mounting seat (2) has a pre-focus detector mounting surface (201) and a post-focus detector mounting surface (202), and the pre-focus detector mounting surface (201) and the post-focus detector mounting surface (202) are in a stepped surface structure, which is used to ensure that the pre-focus detector and the post-focus detector meet the parallelism requirement after installation; Wherein, the pre-focus detector mounting surface (201) and the post-focus detector mounting surface (202) are both provided with a wire passing hole (203) and a plurality of mounting holes (204), and the substrate (1) is provided with a through slot (105) corresponding to the position of the wire passing hole (203); The support (6) is in an inverted V-shaped structure; wherein, it includes a substrate connecting block (601) for connecting with the substrate (1) through the substrate connecting block (601); The substrate connecting block (601) is fixedly connected with two support rods (602), and the lower end of each support rod (602) is fixedly connected with a base ring connecting block (603) for connecting with the base ring (5) through the base ring connecting block (603); The upper surface of the substrate connecting block (601) is fixedly connected with a support adapter block (604), and the lower surface of the support adapter block (604) is fixedly connected with the upper surface of the substrate (1).

2. The focal plane assembly of claim 1, wherein, The mounting hole group includes a plurality of positioning holes (102), connecting holes (103) and wire arranging holes (104).

3. The focal plane assembly of claim 1, wherein, The surface of the star guide detector mounting seat (3) is provided with a cuboid cooling block (301) and a plurality of cylindrical bosses (302); the upper end surface of the cylindrical boss (302) is provided with a threaded hole.

4. The focal plane assembly of claim 1, wherein, The connecting surface of the reference block (4) and the substrate (1) is provided with a blind hole (401), and an invar column (402) is fixedly connected in the blind hole (401); the invar column (402) is provided with a threaded connection hole; the side surface of the reference block (4) is provided with an exhaust hole (403) in communication with the upper end of the blind hole (401).

5. The focal plane assembly of claim 1, wherein, The base ring connecting block (603) and the base ring (5) are connected by a spacer (605), and the spacer (605) is made of G10 material.

6. The method according to any one of claims 1-5, wherein, The steps include: Step one: connect the base plate (1) with the base ring (2) through several supports (6); Step two: install several wavefront sensor mounting seats (2), star guide detector mounting seats (3) and reference blocks (4) on the surface of the base plate (1), and determine the parallelism between the surface of the reference block (4) and the surface of the base ring (5); Step three: connect the scientific imaging CCDs with the mounting hole groups one by one on the surface of the base plate (1), and make the scientific imaging CCDs splice into a scientific imaging area after installation, and calibrate the parallelism between the surface of the reference block (4) and the scientific imaging area; Step four: install the wavefront sensing CCD on the surface of the wavefront sensor mounting seat (2), and install the star guide detection CCD on the surface of the star guide detector mounting seat (3); Step four: calibrate the parallelism between the imaging surface of the wavefront sensing CCD and the imaging surface of the star guide detection CCD and the surface of the reference block (4) through the reference block (4), so that the scientific imaging area composed of the wavefront sensing CCD, the star guide detection CCD and the scientific imaging CCD splices into a complete imaging surface.

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