Display panel and display device

Abstract

The present application provides a display panel and a display device. The display panel has a light-emitting region and a peripheral region. The display panel includes a substrate, an inorganic insulating layer, a driving circuit layer, a light-emitting layer, and a packaging layer that are sequentially stacked. The substrate includes a first flexible substrate. The light-emitting layer includes a common layer. The packaging layer includes at least one inorganic layer. Among them, a groove is formed in the peripheral region, the groove penetrates through the inorganic insulating layer and the first flexible substrate, a first undercut structure is formed on the side wall of the groove, the common layer includes a first portion located in the light-emitting region and a second portion located in the groove, and the first portion and the second portion are disconnected by the first undercut structure. At least one inorganic layer covers the end of the first portion away from the light-emitting region, and the end of at least one inorganic layer away from the light-emitting region does not exceed the end of the common layer away from the light-emitting region. The present application can reduce the packaging width of the packaging layer and narrow the border.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display panel and a display device. Background Art

[0002] After experiencing explosive growth in 2018, the concept of a full-screen display has occupied more than half of the smartphone market. Among them, the penetration rate of the organic light-emitting diode (OLED) full-screen display is as high as about 80%. However, in existing OLED full-screen concept products, due to limitations in packaging technology, the narrow bezel technology has reached a bottleneck. Therefore, there is an urgent need to provide an OLED display product that can further narrow the bezel. Summary of the Invention

[0003] The present application provides a display panel and a display device that can further narrow the bezel.

[0004] The present application provides a display panel. The display panel has a light-emitting area and a peripheral area located on at least one side of the light-emitting area. The display panel includes:

[0005] a substrate including a first flexible substrate;

[0006] an inorganic insulating layer disposed on one side of the substrate;

[0007] a driving circuit layer disposed on a side of the inorganic insulating layer away from the substrate;

[0008] a light-emitting layer disposed on a side of the driving circuit layer away from the inorganic insulating layer. The light-emitting layer includes a common layer; and

[0009] a packaging layer disposed on a side of the light-emitting layer away from the driving circuit layer. The packaging layer includes at least one inorganic layer;

[0010] wherein, a groove is formed in the peripheral area, the groove penetrates through the inorganic insulating layer and the first flexible substrate, a first undercut structure is formed on a sidewall of the groove, the common layer includes a first part and a second part, the first part is located in the light-emitting area and the peripheral area, the second part is at least partially located in the groove, and the first part and the second part are disconnected by the first undercut structure. The at least one inorganic layer covers an end of the first part away from the light-emitting area, and an end of the at least one inorganic layer away from the light-emitting area does not exceed an end of the common layer away from the light-emitting area.

[0011] Optionally, in some embodiments, an opening is further formed in the display panel, the opening exposes the substrate, the substrate exposed by the opening is bent to the back surface of the display panel to form a bent portion, the groove communicates with the opening, and the groove is formed on a side wall of the opening close to the light-emitting region.

[0012] Optionally, in some embodiments, the substrate further includes:

[0013] A second flexible substrate disposed on a side of the first flexible substrate away from the driving circuit layer; and

[0014] A barrier layer and a wire-changing layer, which are disposed on the same layer between the first flexible substrate and the second flexible substrate, and the wire-changing layer is disposed corresponding to the opening;

[0015] The driving circuit layer includes a first signal line and a first fan-out line, the first signal line is located in the light-emitting region, the first fan-out line is located on the back surface of the display panel, and the first signal line and the first fan-out line are respectively connected to the wire-changing layer via vias.

[0016] Optionally, in some embodiments, the driving circuit layer further includes a second signal line and a second fan-out line, the second signal line is disposed on a different layer from the first signal line, the second signal line is located in the light-emitting region, the second fan-out line is located on the back surface of the display panel, the wire-changing layer is located between the second signal line and the second fan-out line, and the second signal line and the second fan-out line are respectively connected to the wire-changing layer via vias.

[0017] Optionally, in some embodiments, the first signal line and the first fan-out line are disposed on the same layer, the second signal line and the second fan-out line are disposed on the same layer, the wire-changing layer includes a first wire-changing portion and a second wire-changing portion, the first wire-changing portion and the second wire-changing portion are disposed at an insulating interval, the first signal line is connected to the first fan-out line via the first wire-changing portion, and the second signal line is connected to the second fan-out line via the second wire-changing portion.

[0018] Optionally, in some embodiments, the driving circuit layer includes a gate and a source, the gate and the source are disposed on different layers, the first signal line is disposed on the same layer as the gate, and the second signal line is disposed on the same layer as the source.

[0019] Optionally, in some embodiments, a surface of the first flexible substrate of the bent portion away from the wire-changing layer is a gas dielectric layer or a vacuum layer.

[0020] Optionally, in some embodiments, the common layer includes at least one of an electron injection layer, an electron transport layer, and an electrode layer.

[0021] Optionally, in some embodiments, the peripheral region is disposed around the light-emitting region, the first undercut structure forms a closed loop around the light-emitting region, and the first undercut structure is located on the sidewall of the groove close to the light-emitting region.

[0022] Optionally, in some embodiments, a second undercut structure is further formed on the sidewall of the groove, the second undercut structure is located on the sidewall of the groove away from the light-emitting region, the common layer further includes a third portion, the third portion is located on a side of the second portion away from the first portion, and the second portion and the third portion are disconnected by the second undercut structure.

[0023] Optionally, in some embodiments, the display panel further includes a dielectric layer, the dielectric layer is disposed between the inorganic insulating layer and the light-emitting layer, the groove further penetrates through the dielectric layer, and the at least one inorganic layer covers the groove and is in direct contact with the inorganic insulating layer and the dielectric layer on the sidewall of the groove to form a closed inorganic encapsulation structure.

[0024] The present application further provides a display device, which includes a display panel and a driving component connected to the display panel, and the display panel is the display panel as described above.

[0025] In existing display panels and display devices, since the common layer in the light-emitting layer is easily invaded by water and oxygen and fails. In order to protect the common layer, the inorganic layer in the encapsulation layer needs to cover the end of the common layer away from the light-emitting region covering end, resulting in a relatively large encapsulation width of the encapsulation layer. In the display panel and display device of the present application, the common layer is disconnected by the first undercut structure, and the propagation path of water and oxygen between the first portion and the second portion of the common layer is cut off, which can play a role in blocking water and oxygen and prevent crack propagation. And the inorganic layer in the encapsulation layer only needs to cover the end of the first portion located in the light-emitting region, and does not need to cover the end of the common layer away from the light-emitting region. By making the end of the inorganic layer away from the light-emitting region not exceed the end of the common layer away from the light-emitting region, compared with the prior art where the inorganic layer needs to cover the end of the common layer away from the light-emitting region, the encapsulation width of the encapsulation layer is significantly reduced, thereby achieving the effect of a narrow border. Description of the Drawings

[0026] Figure 1 It is a plan view of the display device of the present application.

[0027] Figure 2 It is Figure 1 The structural schematic diagram of the display device in the unfolded state.

[0028] Figure 3 It is Figure 1 The cross-sectional view of a structure of the display device.

[0029] Figure 4 A Figure 2 partial cross-sectional view of a structure of the display device along line B-B.

[0030] Figure 5 A Figure 1 top view schematic diagram of the first signal line, the second signal line, the first fan-out line, and the second fan-out line of the display panel of

[0031] Figure 6 A Figure 1 cross-sectional view of another structure of the display device of Specific Embodiments

[0032] The technical solutions in the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

[0033] In the present application, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely means that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely means that the first feature has a lower horizontal height than the second feature. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the number of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more features.

[0034] Aspects and features of various embodiments of the present disclosure may be combined with each other partially or completely. Each embodiment may be implemented independently of each other, or may be related to each other partially or completely and implemented together.

[0035] The present application provides a display panel and a display device including the display panel. The display panel has a light-emitting region and a peripheral region located on at least one side of the light-emitting region. The display panel includes a substrate, an inorganic insulating layer, a driving circuit layer, a light-emitting layer, and a packaging layer. The substrate includes a first flexible substrate. The inorganic insulating layer is disposed on one side of the substrate. The driving circuit layer is disposed on the side of the inorganic insulating layer away from the substrate. The light-emitting layer is disposed on the side of the driving circuit layer away from the inorganic insulating layer, and the light-emitting layer includes a common layer. The packaging layer is disposed on the side of the light-emitting layer away from the driving circuit layer, and the packaging layer includes at least one inorganic layer. Wherein, a groove is formed in the peripheral region, the groove penetrates through the inorganic insulating layer and the first flexible substrate, a first undercut structure is formed on the sidewall of the groove, the common layer includes a first portion and a second portion, the first portion is located in the light-emitting region, the second portion is at least partially located in the groove, and the first portion and the second portion are disconnected by the first undercut structure. At least one inorganic layer covers the end of the first portion away from the light-emitting region, and the end of the at least one inorganic layer away from the light-emitting region does not exceed the end of the common layer away from the light-emitting region.

[0036] In existing display panels and display devices, since the common layer in the light-emitting layer is vulnerable to water and oxygen intrusion and fails. In order to protect the common layer, the inorganic layer in the packaging layer needs to cover the end of the common layer away from the light-emitting region, resulting in a relatively large packaging width of the packaging layer. In the display panel and display device of the present application, the common layer is disconnected by the first undercut structure, and the propagation path of water and oxygen between the first portion and the second portion of the common layer is cut off, which can play a role in blocking water and oxygen and prevent crack propagation. The inorganic layer in the packaging layer only needs to cover the end of the first portion located in the light-emitting region, and does not need to cover the end of the common layer away from the light-emitting region. By making the end of the inorganic layer away from the light-emitting region not exceed the end of the common layer away from the light-emitting region, compared with the prior art where the inorganic layer needs to cover the end of the common layer away from the light-emitting region, the packaging width of the packaging layer is significantly reduced, thus achieving the effect of a narrow border.

[0037] Hereinafter, the display panel and the display device of the present application will be described in detail in conjunction with specific embodiments.

[0038] Please refer to Figure 1 and Figure 2 , the display device 1 includes a display panel 100 and a driving component 200 connected to the display panel 100. The display panel 100 is used for displaying images, and the driving component 200 is used for driving the display panel 100 to display.

[0039] The display panel 100 includes a light-emitting region 100a and a peripheral region 100b located on at least one side of the light-emitting region 100a. As Figure 1As shown, the display panel 100 can be rectangular, and the peripheral area 100b can be located on at least one of the upper side, lower side, left side, and right side of the light-emitting area 100a. That is, the peripheral area 100b can include at least one of the upper border area 101b, lower border area 102b, left border area 103b, and right border area 104b. Optionally, in this embodiment, the peripheral area 100b is arranged in a circle around the light-emitting area 100a. Further, the display panel 100 further includes a bending area 100c and a fan-out area 100d. The bending area 100c can also be referred to as a Pad Bending area. The bending area 100c is located on the side of the lower border area 102b in the peripheral area 100b away from the light-emitting area 100a. The fan-out area 100d is located on the side of the bending area 100c away from the lower border area 102b. Moreover, the light-emitting area 100a, the peripheral area 100b, the bending area 100c, and the fan-out area 100d are connected in sequence.

[0040] The driving component 200 is connected to the side of the fan-out area 100d of the display panel 100 away from the light-emitting area 100a. The driving component 200 can include a Chip on Film (COF) and / or a Flexible Printed Circuit (FPC).

[0041] Please refer to Figure 3 and Figure 4 , for the convenience of description, Figure 4 In, the light-emitting layer 40 and the encapsulation layer 50 are omitted. The display panel 100 includes a substrate 10, an inorganic insulating layer 20, a driving circuit layer 30, a light-emitting layer 40, and an encapsulation layer 50. The inorganic insulating layer 20 is disposed on one side of the substrate 10. The driving circuit layer 30 is disposed on the side of the inorganic insulating layer 20 away from the substrate 10. The light-emitting layer 40 is disposed on the side of the driving circuit layer 30 away from the inorganic insulating layer 20. The encapsulation layer 50 is disposed on the side of the light-emitting layer 40 away from the driving circuit layer 30.

[0042] The substrate 10 is located in the light-emitting area 100a, the peripheral area 100b, the bending area 100c, and the fan-out area 100d. The substrate 10 includes a first flexible substrate 11, a second flexible substrate 12, and a barrier layer 13 and a wire-changing layer 14 disposed between the first flexible substrate 11 and the second flexible substrate 12. The barrier layer 13 and the wire-changing layer 14 are disposed in the same layer. The barrier layer 13 is at least located in the light-emitting area 100a. The wire-changing layer 14 is at least located in the peripheral area 100b and the bending area 100c. Optionally, the wire-changing layer 14 can also be located in the light-emitting area 100a and the fan-out area 100d. Optionally, the barrier layer 13 and the wire-changing layer 14 can be directly connected. Specifically, a part of the barrier layer 13 located on the first flexible substrate 11 can be etched away, and then the wire-changing layer 14 is formed at the position where the barrier layer 13 has been etched away.

[0043] The materials of the first flexible substrate 11 and the second flexible substrate 12 are independently selected from one of polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyarylate (PAR), polycarbonate (PC), polyetherimide (PEI), and polyethersulfone (PES). The material of the barrier layer 13 can be selected from inorganic materials such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride (SiON), etc. and their laminates to prevent water vapor from diffusing from the second flexible substrate 12 to the driving circuit layer 30. The rewiring layer 14 can be a single-layer metal trace such as Cu (copper), Mo (molybdenum), Al (aluminum), Ag (silver), etc., or a laminated metal trace thereof. For the convenience of bending, the material of the rewiring layer 14 is a material with certain bending properties. Optionally, the rewiring layer 14 is the neutral layer of the substrate 10. Specifically, the rewiring layer 14 can be precisely adjusted to be the neutral layer of the substrate 10 by controlling the thickness of the two flexible substrates. The so-called neutral layer refers to the layer with the least stress in the film layer structure of the substrate 10.

[0044] An opening 101 is provided in the display panel 100. The opening 101 is located in the peripheral area 100b and the bending area 100c. The opening 101 sequentially penetrates through the driving circuit layer 30 and the inorganic insulating layer 20, exposing the substrate 10. The substrate 10 exposed by the opening 101 is bent to the back surface of the display panel 100 to form a bent portion 1001. The rewiring layer 14 is disposed corresponding to the opening 101. Specifically, the positive projection of the side wall 101W of the opening 101 on the plane where the rewiring layer 14 is located overlaps with the rewiring layer 14. However, in the length direction of the display panel 100, the length of the rewiring layer 14 far exceeds the length of the opening 101. The so-called "the substrate 10 is bent to the back surface of the display panel 100 to form a bent portion 1001" means that the first flexible substrate 11, the second flexible substrate 12, and the rewiring layer 14 are bent to the back surface of the display panel 100 to form a bent portion 1001. The surface of the first flexible substrate 11 of the bent portion 1001 away from the rewiring layer 14 is a gas medium layer 110. In other words, the opening 101 is not filled with a flexible organic material but is filled with a gas, and the gas can be air or an inert gas such as nitrogen. In other embodiments, the surface of the first flexible substrate 11 of the bent portion 1001 away from the rewiring layer 14 can also be a vacuum layer, that is, it is not filled with gas but is evacuated.

[0045] A groove 11a is formed in the peripheral region 100b, and the groove 11a penetrates through the inorganic insulating layer 20 and the first flexible substrate 11. A first undercut structure UD1 is formed on the side wall 101W of the groove 11a. The first undercut structure UD1 is formed by etching. Since the etching rate of the etching solution or etching gas on the first flexible substrate 11 is greater than that on the inorganic insulating layer 20 during the etching process, the amount of the inorganic insulating layer 20 etched away after the etching is less than the amount of the first flexible substrate 11 etched away, thereby forming a first undercut structure UD1 between the inorganic insulating layer 20 and the first flexible substrate 11.

[0046] In the present embodiment, the peripheral region 100b is disposed around the light-emitting region 100a, and the first undercut structure UD1 forms a closed loop around the light-emitting region 100a. The first undercut structure UD1 is located on the side wall 101W of the groove 11a close to the light-emitting region 100a. Further, in the lower border 102b region, that is, the border region connecting the bending region 100c and the fan-out region 100d, the groove 11a communicates with the opening 101. And the groove 11a is formed on the side wall 101W of the opening 101 close to the light-emitting region 100a. At other positions, such as the upper border 101b, the left border 103b, and the right border 104b, no opening 101 for bending is provided, and the groove 11a is directly formed.

[0047] The inorganic insulating layer 20 is at least located in the light-emitting region 100a, the peripheral region 100b, and the fan-out region 100d. The inorganic insulating layer 20 in the bending region 100c is removed for bending. The inorganic insulating layer 20 is disposed between the substrate 10 and the driving circuit layer 30, and is used to block water and oxygen from entering the driving circuit layer 30 from the substrate 10, and / or enhance the bonding force between the substrate 10 and the driving circuit layer 30. The inorganic insulating layer 20 includes at least one layer of silicon nitride, silicon oxide, and a-Si. Optionally, in the present embodiment, the inorganic insulating layer 20 includes a barrier layer 21 (also referred to as a 3L layer) and a buffer layer 22. The barrier layer 21 is located on the side closer to the substrate 10 of the buffer layer 22. The buffer layer 22 includes silicon nitride, silicon oxide, or a stack of silicon nitride and silicon oxide. The barrier layer 21 includes a stack of silicon nitride, silicon oxide, and a-Si. Optionally, in other embodiments of the present application, the inorganic insulating layer 20 may only include one of the buffer layer 22 and the barrier layer 21. Optionally, in some embodiments, the inorganic insulating layer 20 may also be a dielectric layer formed in the peripheral region 100b during the formation of the driving circuit layer 30, such as a gate insulating layer, an interlayer insulating layer, etc.

[0048] The driving circuit layer 30 is located in the light-emitting region 100a and the fan-out region 100d. The driving circuit layer 30 in the light-emitting region 100a includes driving circuits for OLED displays such as 2T1C, 3T1C, 5T1C, or 7T1C.

[0049] Optionally, the display panel further includes a dielectric layer 31 located in the peripheral region 100b. The dielectric layer 31 is an insulating material layer formed in the peripheral region 100b during the formation process of the driving circuit layer 30, such as by evaporation coating. The dielectric layer 31 includes inorganic dielectric layers such as a gate insulating layer GI and an interlayer insulating layer IL. The material of the dielectric layer 31 includes silicon oxide, silicon nitride, and their laminates. Since the dielectric layer 31 is located in the peripheral region 100b and covers the inorganic insulating layer 20 and the first flexible substrate 11 in the peripheral region 100b, before the groove 11a penetrates through the inorganic insulating layer 20 and the first flexible substrate 11, it first penetrates through the dielectric layer 31.

[0050] The driving circuit layer 30 includes a first signal line 32 and a first fan-out line 33. The first signal line 32 is located in the light-emitting region 100a, and the first fan-out line 33 is located in the fan-out region 100d and on the back surface of the display panel 100. The wire-changing layer 14 is located between the first signal line 32 and the first fan-out line 33. The first signal line 32 and the first fan-out line 33 are respectively connected to the wire-changing layer 14 via vias VA. The first signal line 32 is connected to one end of the wire-changing layer 14 close to the light-emitting region 100a, and the first fan-out line 33 layer is connected to the other end of the wire-changing layer 14 far from the light-emitting region 100a.

[0051] The driving circuit layer 30 further includes a second signal line 34 and a second fan-out line 35. The second signal line 34 is arranged on a different layer from the first signal line 32. The second signal line 34 is located in the light-emitting region 100a, and the second fan-out line 35 is located in the fan-out region 100d and on the back surface of the display panel 100. The wire-changing layer 14 is located between the second signal line 34 and the second fan-out line 35. The second signal line 34 and the second fan-out line 35 are respectively connected to the wire-changing layer 14 via vias VA. The second signal line 34 is connected to one end of the wire-changing layer 14 close to the light-emitting region 100a, and the second fan-out line 35 layer is connected to the other end of the wire-changing layer 14 far from the light-emitting region 100a. The first signal line 32 and the second signal line 34 can be gate lines, data lines, VDD signal lines, or VSS signal lines, etc.

[0052] Optionally, the first signal line 32 and the first fan-out line 33 are arranged on the same layer, and the second signal line 34 and the second fan-out line 35 are arranged on the same layer. Please refer to Figure 5 , when viewed from above, the wire-changing layer 14 includes a first wire-changing part 141 and a second wire-changing part 142. The first wire-changing part 141 and the second wire-changing part 142 are arranged with an insulating gap therebetween. The first signal line 32 and the second signal line 34 are arranged with an insulating gap therebetween. The first signal line 32 is connected to the first fan-out line 33 via the first wire-changing part 141, and the second signal line 34 is connected to the second fan-out line 35 via the second wire-changing part 142.

[0053] The driving circuit layer 30 includes a gate electrode GE, a source electrode SE, a drain electrode DE, and a semiconductor layer CL. The gate electrode GE is disposed on a different layer from the source electrode SE and the drain electrode DE. In this embodiment, the thin-film transistor in the driving circuit layer 30 is a top-gate thin-film transistor. The semiconductor layer CL is disposed on the substrate 10. The gate electrode GE is disposed on a side of the semiconductor layer CL away from the substrate 10. The source electrode SE and the drain electrode DE are disposed on a side of the gate electrode GE away from the substrate 10. The first signal line 32 is located on a side of the second signal line 34 closer to the substrate 10. Optionally, the first signal line 32 is on the same layer as the gate electrode GE, and the second signal line 34 is on the same layer as the source electrode SE and the drain electrode DE. It can be understood that in other embodiments of the present application, the first signal line 32 and the second signal line 34 may also be disposed on the same layer as other metal film layers in the driving circuit layer 30, such as a light-shielding layer. In other embodiments of the present application, the second fan-out line 35 may also be disposed on the same layer as the first fan-out line 33, that is, the first signal line 32 and the second signal line 34 are switched to the same layer after passing through the wiring layer.

[0054] The light-emitting layer 40 includes a first electrode layer 41, a pixel definition layer 42, a light-emitting material layer 43, and a common layer 44. A planarization layer 60 is further disposed between the driving circuit layer 30 and the light-emitting layer 40 to planarize the topography formed above the driving circuit layer 30, which helps to form the light-emitting layer 40. The first electrode layer 41 is disposed on the planarization layer 60 and is connected to the driving circuit layer 30 through a connection hole formed in the planarization layer 60. Optionally, the first electrode layer 41 may be an anode. The pixel definition layer 42 covers the planarization layer 60, and a plurality of pixel definition openings 421 for exposing the first electrode layer 41 are further formed in the pixel definition layer 42. The light-emitting material layer 43 is disposed in the pixel definition openings 421. The light-emitting material layer 43 may include hole-functional layers such as an organic light-emitting layer, a hole injection layer, and a hole transport layer. The light-emitting material layer 43 may be formed by an inkjet printing method. The common layer 44 refers to a film layer formed by evaporation using a common mask during the manufacturing process of the light-emitting layer 40. The common layer 44 may specifically include at least one of an electron injection layer, an electron transport layer, and a second electrode layer, but is not limited thereto. Among them, the second electrode layer is a cathode. It can be understood that in other embodiments of the present application, the OLED device is an inverted device, the first electrode layer may also be a cathode, and the second electrode layer may also be an anode.

[0055] The encapsulation layer 50 is located in the light-emitting region 100a and the peripheral region 100b. The encapsulation layer 50 covers the light-emitting layer 40 to protect the light-emitting layer 40 from failure caused by the intrusion of water and oxygen. Optionally, the encapsulation layer 50 may adopt a thin film encapsulation (TFE) structure. The encapsulation layer 50 includes at least one inorganic layer and at least one organic layer. The inorganic layer and the organic layer are alternately stacked. In this embodiment, the encapsulation layer 50 is formed by sequentially stacking a first inorganic layer 51, an organic encapsulation layer 52, and a second inorganic layer 53. In addition, the display panel 100 further includes a dam, and the dam is disposed on the driving circuit layer 30 and is located between the light-emitting layer 40 and the first undercut UD1. Or, the dam is located in the peripheral region 100b and is used to block the organic encapsulation layer 52 in the encapsulation layer 50.

[0056] In the present application, the common layer 44 includes a first portion 441 and a second portion 442. The first portion 441 is located in the light-emitting region 100a and the peripheral region 100b. The second portion 442 is at least partially located in the groove 11a, and the first portion 441 and the second portion 442 are disconnected by the first undercut structure UD1. Optionally, the second portion 442 covers the bottom wall of the groove 11a and extends outside the groove 11a. At least one inorganic layer, that is, the first inorganic layer 51 and the second inorganic layer 53, covers the end of the first portion 441 away from the light-emitting region 100a, and the end of the at least one inorganic layer away from the light-emitting region 100a does not exceed the end of the common layer 44 away from the light-emitting region 100a. Specifically, the end of the at least one inorganic layer away from the light-emitting region 100a is flush with the end of the common layer 44 away from the light-emitting region 100a, or is located on the side of the end of the common layer 44 away from the light-emitting region 100a (that is, the end of the second portion 442) close to the light-emitting region 100a. In other words, the at least one inorganic layer away from the light-emitting region 100a does not cover the end of the common layer 44 away from the light-emitting region 100a. Further, the at least one inorganic layer covers and fills the groove 11a and is in direct contact with the inorganic insulating layer 20 and the dielectric layer 31 on the side wall 101W of the groove 11a.

[0057] In some embodiments, by disconnecting the common layer 44 through the first undercut structure UD1, the propagation path of water and oxygen between the first portion 441 and the second portion 442 of the common layer 44 is cut off, which can play a role in blocking water and oxygen and prevent crack propagation. And the inorganic layer in the encapsulation layer 50 only needs to cover the end of the first portion 441 located in the light-emitting region 100a and does not need to cover the end of the common layer 44 away from the light-emitting region 100a. By making the end of the inorganic layer away from the light-emitting region 100a not exceed the end of the common layer 44 away from the light-emitting region 100a, compared with the prior art where the inorganic layer needs to cover the end of the common layer 44 away from the light-emitting region 100a, the encapsulation width of the encapsulation layer 50 is significantly reduced, thus achieving the effect of a narrow border.

[0058] In some embodiments, when forming an undercut structure on the first flexible substrate 11, if there is a signal line disposed above the first flexible substrate 11, it will affect the formation of the undercut structure. By routing the signal line in the bending region 100c between the two flexible substrates, there is no signal line above the first flexible substrate 11, facilitating the formation of the undercut structure on the first flexible substrate 11 and successfully integrating the narrow bezel packaging technology.

[0059] In some embodiments, the first undercut structure UD1 forms a complete closed loop around the light-emitting region, which can further enhance the packaging effect.

[0060] In some embodiments, the opening 101 is not filled with a flexible organic material, but is filled with gas or is a vacuum layer. Compared with the structure in the prior art where the opening 101 in the bending region 100c is filled with a flexible organic material, it can prevent outgasing. The so-called "outgasing" is caused by the characteristics of the organic material, that is, in subsequent high-temperature processes, gas will be released from the organic layer, damaging the upper structure.

[0061] In some embodiments, since it is necessary to form the opening 101 for bending in the bending region 100c, and further form a groove 11a on the basis of the opening 101, the existing opening 101 can be used to form the first undercut structure UD1, saving the etching steps and simplifying the process. By forming the groove 11a on the sidewall 101W of the opening 101 close to the light-emitting region 100a, an undercut structure is formed on the sidewall 101W of the bending portion 1001 close to the light-emitting region 100a, which can achieve the effect of narrowing the bezel.

[0062] Please refer to Figure 6, in a display panel 100 of another structure, the inorganic insulating layer 20 within the opening 101 is not entirely etched, and a portion of the inorganic insulating layer 20 within the opening 101 near the light-emitting region 100a is retained. Meanwhile, a groove 11a is formed within this portion of the inorganic insulating layer 20. In addition to the first undercut structure UD1, a second undercut structure UD2 is also formed on the sidewall 101W of the groove 11a, and the second undercut structure UD2 is located on the sidewall 101W of the groove 11a away from the light-emitting region 100a. The common layer 44 further includes a third portion 443, and the third portion 443 is located on the side of the second portion 442 away from the first portion 441. The second portion 442 and the third portion 443 are disconnected by the second undercut structure UD2. The third portion 443 of the common layer 44 is located on the inorganic insulating layer 20 and the dielectric layer 31. At least one inorganic layer, that is, the first inorganic layer 51 and the second inorganic layer 53, covers the end of the first portion 441 away from the light-emitting region 100a, and the end of at least one inorganic layer away from the light-emitting region 100a does not exceed the end of the third portion 443 away from the light-emitting region 100a. The end of at least one inorganic layer away from the light-emitting region 100a may be flush with the end of the third portion 443 away from the light-emitting region 100a as shown in the figure, may be located on the side of the end of the third portion 443 away from the light-emitting region 100a closer to the light-emitting region 100a, or may only cover up to the end of the first portion 441, only cover up to the end of the second portion 442, or cover a portion of the second portion 442. Optionally, at least one inorganic layer covers the groove 11a and is in direct contact with both the inorganic insulating layer 20 and the dielectric layer 31 on the sidewalls 101W of the groove 11a away from and close to the light-emitting region 100a, forming a closed inorganic encapsulation structure to enclose the second portion 442.

[0063] In this embodiment, the common layer 44 is disconnected into three parts by the first undercut structure UD1 and the second undercut structure UD2, and the anti-crack effect of the encapsulation is better.

[0064] It can be understood that in other embodiments of the present application, only the second undercut structure UD2 may be provided, and the effect of a narrow border can also be obtained.

[0065] The above provides a detailed introduction to the embodiments of the present application. Specific examples are used in this article to elaborate on the principles and embodiments of the present application. The description of the above embodiments is only used to help understand the present application. At the same time, for those skilled in the art, based on the idea of the present application, there will be changes in the specific embodiments and application scopes. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A display panel, the display panel having a light-emitting region and a peripheral region located at least on one side of the light-emitting region, characterized in that, The display panel includes: a substrate including a first flexible substrate; an inorganic insulating layer disposed on one side of the substrate; a driving circuit layer disposed on a side of the inorganic insulating layer away from the substrate; a light-emitting layer disposed on a side of the driving circuit layer away from the inorganic insulating layer, the light-emitting layer including a common layer; and a packaging layer disposed on a side of the light-emitting layer away from the driving circuit layer, the packaging layer including at least one inorganic layer; wherein a groove is formed in the peripheral region, the groove penetrates through the inorganic insulating layer and the first flexible substrate, a first undercut structure is formed on a sidewall of the groove, the common layer includes a first portion and a second portion, the first portion is located in the light-emitting region and the peripheral region, the second portion is at least partially located in the groove, and the first portion and the second portion are disconnected by the first undercut structure, the at least one inorganic layer covers an end of the first portion away from the light-emitting region, and an end of the at least one inorganic layer away from the light-emitting region does not exceed an end of the common layer away from the light-emitting region; an opening is further formed in the display panel, the opening exposes the substrate, the substrate exposed by the opening is bent to the back surface of the display panel to form a bent portion, the groove communicates with the opening, and the groove is formed on a sidewall of the opening close to the light-emitting region; wherein the substrate further includes a second flexible substrate disposed on a side of the first flexible substrate away from the driving circuit layer, and a surface of the first flexible substrate of the bent portion away from the second flexible substrate is a gas medium layer or a vacuum layer.

2. The display panel according to claim 1, wherein The substrate further includes: a barrier layer and a wire-changing layer which are disposed in the same layer between the first flexible substrate and the second flexible substrate, and the wire-changing layer is disposed corresponding to the opening; the driving circuit layer includes a first signal line and a first fan-out line, the first signal line is located in the light-emitting region, the first fan-out line is located on the back surface of the display panel, and the first signal line and the first fan-out line are respectively connected to the wire-changing layer via vias.

3. The display panel according to claim 2, wherein The driving circuit layer further includes a second signal line and a second fan-out line, the second signal line is disposed in a different layer from the first signal line, the second signal line is located in the light-emitting region, the second fan-out line is located on the back surface of the display panel, the wire-changing layer is located between the second signal line and the second fan-out line, and the second signal line and the second fan-out line are respectively connected to the wire-changing layer via vias.

4. The display panel according to claim 3, wherein, The first signal line and the first fan-out line are disposed in the same layer, the second signal line and the second fan-out line are disposed in the same layer, the wire-changing layer includes a first wire-changing portion and a second wire-changing portion, the first wire-changing portion and the second wire-changing portion are disposed at an insulating interval, the first signal line is connected to the first fan-out line via the first wire-changing portion, and the second signal line is connected to the second fan-out line via the second wire-changing portion.

5. The display panel according to claim 4, wherein The driving circuit layer includes a gate and a source, the gate and the source are disposed in different layers, the first signal line and the gate are disposed in the same layer, and the second signal line and the source are disposed in the same layer.

6. The display panel according to any one of claims 1 to 5, characterized in that, The common layer includes at least one of an electron injection layer, an electron transport layer, and an electrode layer.

7. The display panel according to any one of claims 1 to 5, characterized in that The peripheral region is disposed around the light-emitting region, and the first undercut structure forms a closed loop around the light-emitting region. The first undercut structure is located on the side wall of the groove close to the light-emitting region.

8. The display panel according to claim 7, wherein A second undercut structure is further formed on the side wall of the groove. The second undercut structure is located on the side wall of the groove far from the light-emitting region. The common layer further includes a third portion. The third portion is located on a side of the second portion far from the first portion. The second portion and the third portion are disconnected by the second undercut structure.

9. The display panel according to claim 8, wherein, The display panel further includes a dielectric layer. The dielectric layer is disposed between the inorganic insulating layer and the light-emitting layer and is located in the peripheral region. The groove further penetrates through the dielectric layer. The at least one inorganic layer covers the groove and is in direct contact with the inorganic insulating layer and the dielectric layer on the side wall of the groove to form a closed inorganic encapsulation structure.

10. A display device, characterized in that, It includes a display panel and a driving component connected to the display panel. The display panel is the display panel according to any one of claims 1 to 9.

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