Display device and method for manufacturing the same

Abstract

A display device and a manufacturing method thereof. The display device includes a driving substrate, an electronic ink layer, and a conductive water-blocking layer. The electronic ink layer is located on the driving substrate. The conductive water-blocking layer is located on the electronic ink layer. The conductive water-blocking layer includes a conductive layer, a water-blocking layer, and a base layer. The conductive layer is located between the water-blocking layer and the electronic ink layer, and the conductive layer is separated from the electronic ink layer. By providing a conductive water-blocking layer with the effects of anti-UV, water-blocking, and driving the electronic ink layer, the display device can be made without a protective film covering the surface of the conductive water-blocking layer facing away from the electronic ink layer and the side walls of the conductive water-blocking layer. Therefore, the thickness of the display device can be reduced. The display device can have better bendability and reduce fatigue damage caused by repeated bending of the display device. The above structure can be applied to non-planar or full-planar display devices to avoid stress generation on each stacked layer when the display device is bent, resulting in the failure of the display device.

Description

Technical Field

[0001] The present disclosure relates to a display device and a manufacturing method thereof. Background Art

[0002] In the current display device, the electronic ink layer and the driving electrode layer are of an integrated structure. Therefore, an additional water-resistant and ultraviolet-resistant protective film is required to cover the electronic ink layer and the driving electrode layer.

[0003] However, the protective film needs to cover the upper surface and the side walls of the electronic ink layer and the driving electrode layer, resulting in difficulty in thinning the overall thickness of the display device and causing the protective film to form a wedge-shaped structure. In this way, when the display device is bent, the protective film will have an adhesive failure due to stress and a problem of peeling of the protective layer will occur.

[0004] Therefore, in view of this, how to provide a display device with a reduced thickness while avoiding adhesive failure or display device failure due to stress is still one of the urgent research goals in the current industry. Summary of the Invention

[0005] One technical aspect of the present disclosure is a display device.

[0006] In an embodiment of the present disclosure, the display device includes a driving substrate, an electronic ink layer, and a conductive and water-resistant layer. The electronic ink layer is located on the driving substrate. The conductive and water-resistant layer is located on the electronic ink layer. The conductive and water-resistant layer includes a conductive layer and a base layer. The conductive layer is located between the base layer and the electronic ink layer, and the conductive layer is separated from the electronic ink layer.

[0007] In an embodiment of the present disclosure, the conductive and water-resistant layer further includes a water-resistant layer located between the conductive layer and the base layer.

[0008] In an embodiment of the present disclosure, the vertical projection area of the conductive and water-resistant layer on the driving substrate is larger than the vertical projection area of the electronic ink layer on the driving substrate.

[0009] In an embodiment of the present disclosure, the base layer is a Colorless Polyimide (CPI) layer.

[0010] In an embodiment of the present disclosure, the display device further includes an adhesive layer located between the electronic ink layer and the conductive and water-resistant layer.

[0011] In an embodiment of the present disclosure, the display device further includes a sealant located between the driving substrate and the conductive and water-resistant layer, and the sealant surrounds the electronic ink layer.

[0012] In an embodiment of the present disclosure, the hardness of the sealant is less than 500 MPa.

[0013] In an embodiment of the present disclosure, the moisture vapor transmission rate (MVTR) of the sealant is less than 12 g / m 2 / day.

[0014] In an embodiment of the present disclosure, the viscosity of the sealant is less than 2000 Pa·s.

[0015] In an embodiment of the present disclosure, the display device further includes a functional film and a housing. The functional film is disposed on the water-resistant conductive layer, and the width of the functional film is less than or equal to a width of the water-resistant conductive layer. The housing surrounds the driving substrate, the electronic ink layer, the water-resistant conductive layer, and the functional film, wherein the housing extends onto the surface of the functional film facing away from the water-resistant conductive layer.

[0016] In an embodiment of the present disclosure, the functional film includes a first cover structure and a second cover structure. The first cover structure is located between the second cover structure and the water-resistant conductive layer, and the width of the second cover structure is less than the width of the first cover structure.

[0017] In an embodiment of the present disclosure, the display device further includes a functional film. The functional film is disposed on the water-resistant conductive layer, and the width of the functional film is greater than the width of the water-resistant conductive layer, and the difference between the width of the functional film and the width of the water-resistant conductive layer is greater than 3 mm.

[0018] In an embodiment of the present disclosure, the functional film includes a first cover structure and a second cover structure. The first cover structure is located between the second cover structure and the water-resistant conductive layer, and the width of the second cover structure is greater than the width of the first cover structure. The display device further includes a housing. The housing surrounds the driving substrate, the electronic ink layer, the water-resistant conductive layer, and the first cover structure, wherein the housing is located below the second cover structure.

[0019] In an embodiment of the present disclosure, the functional film includes a first cover structure and a second cover structure. The first cover structure is located between the second cover structure and the water-resistant conductive layer, and the display device further includes a housing. The housing surrounds the driving substrate, the electronic ink layer, and the water-resistant conductive layer, wherein the housing is located below the first cover structure.

[0020] Another aspect of the present disclosure is a method for manufacturing a display device.

[0021] In an embodiment of the present disclosure, the method for manufacturing a display device includes forming an electronic ink layer on a driving substrate; providing a water-resistant conductive layer, wherein the water-resistant conductive layer includes a conductive layer on a base layer; and bonding the electronic ink layer and the conductive layer through an adhesive layer.

[0022] In an embodiment of the present disclosure, providing the water-resistant conductive layer further includes disposing a water-resistant layer between the base layer and the conductive layer.

[0023] In an embodiment of the present disclosure, the method for manufacturing a display device further includes disposing a sealant between the driving substrate and the water-resistant conductive layer, and the sealant surrounds the electronic ink layer.

[0024] In an embodiment of the present disclosure, the method for manufacturing a display device further includes disposing a functional film on the driving substrate or on the water-resistant conductive layer.

[0025] In an embodiment of the present disclosure, the width of the functional film is less than or equal to the width of the water-resistant conductive layer. The method for manufacturing a display device further includes disposing a housing. The housing surrounds the driving substrate, the electronic ink layer, the water-resistant conductive layer, and the functional film, such that the housing extends to the surface of the functional film facing away from the water-resistant conductive layer.

[0026] In an embodiment of the present disclosure, the width of the functional film is greater than the width of the water-resistant conductive layer, and the difference between the width of the functional film and the width of the water-resistant conductive layer is greater than 3 mm. The method for manufacturing a display device further includes disposing a housing. The housing surrounds the driving substrate, the electronic ink layer, and the water-resistant conductive layer, wherein the housing is located below the functional film.

[0027] In the above embodiments, by disposing a water-resistant conductive layer having the effects of anti-UV, water resistance, and driving the electronic ink layer, the display device can be made without disposing a protective film covering the surface of the water-resistant conductive layer facing away from the electronic ink layer and the side walls of the water-resistant conductive layer. Therefore, the thickness of the display device can be reduced. In this way, the display device can have better bendability and reduce the fatigue damage of the display device 100 caused by repeated bending. In addition, the above structure can be applied to non-planar or full-planar display devices to avoid generating stress on each stacked layer when bending the display device, resulting in the failure of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A cross-sectional view of a display device according to an embodiment of the present disclosure;

[0029] Figure 2 For Figure 1 A partial cross-sectional view of the display device;

[0030] Figure 3 A cross-sectional view of a display device according to another embodiment of the present disclosure;

[0031] Figure 4 A cross-sectional view of a display device according to another embodiment of the present disclosure;

[0032] Figure 5 A cross-sectional view of a display device according to another embodiment of the present disclosure;

[0033] Figure 6 A flowchart of a method for manufacturing a display device according to an embodiment of the present disclosure;

[0034] Figures 7 to 9 Cross-sectional view of an intermediate step in a method for manufacturing a display device Figure 6 of

[0035]

Reference Signs

[0036] 100, 100a, 100b, 100c: Display device

[0037] 110: Driving substrate

[0038] 110T: Surface

[0039] 120: Electronic ink layer

[0040] 130: Water-repellent conductive layer

[0041] 130T, 130B: Surface

[0042] 130S: Side wall

[0043] 132: Base layer

[0044] 134: Water-repellent layer

[0045] 136: Conductive layer

[0046] 140: Adhesive layer

[0047] 150: Frame adhesive

[0048] 160, 160a, 160b, 160c, 170: Functional film

[0049] 160S: Surface

[0050] 162, 162b, 162c: First cover structure

[0051] 164, 164a, 164b, 164c: Second cover structure

[0052] 166: Optical adhesive layer

[0053] 172: Protective layer

[0054] 174: Optical adhesive layer

[0055] 180, 180a, 180b: Housing

[0056] G: Gap

[0057] W1, W2, W3, W4, W5: Width

[0058] D: Difference

[0059] S1 to S6: Steps Detailed implementation mode

[0060] The following will disclose multiple embodiments of the present invention with the accompanying drawings. For the sake of clear illustration, many practical details will be described together in the following narrative. However, it should be understood that these practical details are not used to limit the present invention. That is to say, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the accompanying drawings, some well-known and conventional structures and elements will be shown in a simple schematic manner in the drawings. And for clarity, the thicknesses of layers and regions in the drawings may be exaggerated, and the same reference numerals in the description of the drawings denote the same elements.

[0061] Figure 1 It is a cross-sectional view of a display device 100 according to an embodiment of the present disclosure. The display device 100 includes a driving substrate 110, an electronic ink layer 120, and a water-resistant conductive layer 130. The electronic ink layer 120 is located on the driving substrate 110. The water-resistant conductive layer 130 is located on the electronic ink layer 120. The display device 100 of the present disclosure is a bendable display device.

[0062] Figure 2 is Figure 1 A partial cross-sectional view of the display device 100. The display device 100 further includes an adhesive layer 140 and a sealant 150. The adhesive layer 140 is located between the electronic ink layer 120 and the water-resistant conductive layer 130. The water-resistant conductive layer 130 includes a base layer 132, a water-resistant layer 134, and a conductive layer 136. The conductive layer 136 is located between the water-resistant layer 134 and the electronic ink layer 120. The water-resistant layer 134 is located between the base layer 132 and the conductive layer 136. In other words, the conductive layer 136 is separated from the electronic ink layer 120.

[0063] The base layer 132 is a Colorless Polyimide (CPI) layer. Since the ultraviolet light transmittance of the colorless polyimide is low, the effect of ultraviolet light resistance can be achieved through the base layer 132, and there is no need to further provide an anti-UV film layer on the water-resistant conductive layer 130. The conductive layer 136 is an electrode layer configured to control the electronic ink layer 120. Since the conductive layer 136 is formed on the water-resistant layer 134 and the base layer 132, the size of the conductive layer 136 is substantially the same as the sizes of the water-resistant layer 134 and the base layer 132.

[0064] In other words, since the display device 100 of the present disclosure integrates the base layer 132, the water-resistant layer 134, and the conductive layer 136 into an integrated film having the effects of anti-UV, water resistance, and driving the electronic ink layer 120, the conductive layer 136 in the water-resistant conductive layer 130 is not directly formed on the electronic ink layer 120. In this way, the size of the water-resistant conductive layer 130 can be larger than the size of the electronic ink layer 120. As Figure 2As shown, the vertical projection area of the conductive water-blocking layer 130 on the driving substrate 110 is larger than that of the electronic ink layer 120 on the driving substrate 110. In addition, the width W1 of the conductive water-blocking layer 130 is larger than the width W2 of the electronic ink layer 120. With such a design, the display device 100 does not need to be provided with a protective film covering the surface 130T of the conductive water-blocking layer 130 facing away from the electronic ink layer 120 and the side walls 130S of the conductive water-blocking layer 130, so the thickness of the display device 100 can be reduced. For example, in one embodiment, the thickness of the display device 100 can be reduced from about 163 micrometers to about 107 micrometers. In this way, the display device 100 can have better bendability. For example, the bending radius of the display device 100 can be reduced from greater than 10 micrometers to less than or equal to about 4 micrometers, which can reduce the fatigue damage of the display device 100 caused by repeated bending.

[0065] As Figure 2 shown, the sealant 150 is located between the driving substrate 110 and the conductive water-blocking layer 130, and the sealant 150 surrounds the electronic ink layer 120. Specifically, the sealant 150 is located between the surface 130B of the conductive water-blocking layer 130 facing the electronic ink layer 120 and the surface 110T of the driving substrate 110 facing the electronic ink layer 120, and the sealant 150 does not extend to the side walls 130S of the conductive water-blocking layer 130 or the surface 130T of the conductive water-blocking layer 130 facing away from the electronic ink layer 120. In this way, the display device 100 does not have a protective film that wedge-covers the electronic ink layer 120 (and the aforementioned protective film covering the surface 130T of the conductive water-blocking layer 130 facing away from the electronic ink layer 120 and the side walls 130S of the conductive water-blocking layer 130), and it can be avoided that when the display device 100 is bent, the protective layer peels off due to adhesive failure caused by stress.

[0066] In this embodiment, the hardness of the sealant 150 is less than 500 MPa, so that the sealant 150 can withstand the stress during bending. The viscosity of the sealant 150 is less than 2000 Pa·s, and it can effectively penetrate into the gap G between the conductive water-blocking layer 130 and the driving substrate 110 to seal the electronic ink layer 120 in an edge sealing manner. In some embodiments, the gap G between the conductive water-blocking layer 130 and the driving substrate 110 is about 55 micrometers. The moisture vapor transmission rate (MVTR) of the sealant 150 is less than 12 g / m 2 / day, so the effective water-blocking distance is less than 1.2 millimeters, which can prevent moisture from entering the electronic ink layer 120. With such a design, the moisture protection characteristics of the display device 100 can be maintained.

[0067] Back to Figure 1, the display device 100 further includes a functional film 160 disposed on the conductive water-blocking layer 130, another functional film 170 disposed on the driving substrate 110, and a housing 180. The functional film 160 is a cover plate structure, and the functional film 160 includes a first cover plate structure 162 and a second cover plate structure 164. The first cover plate structure 162 is located between the second cover plate structure 164 and the conductive water-blocking layer 130. The first cover plate structure 162 and the second cover plate structure 164 are adhered through an optical adhesive layer 166, and the first cover plate structure 162 and the conductive water-blocking layer 130 are also adhered through the optical adhesive layer 166. The functional film 170 includes a protective layer 172 and an optical adhesive layer 174 that adheres the protective layer 172 to the driving substrate 110. The states of the above functional films 160 and 170 are only examples, and the present disclosure is not limited thereto.

[0068] In this embodiment, the width W3 of the functional film 160 is less than or equal to the width W1 of the conductive water-blocking layer 130 (see Figure 2 ). The housing 180 surrounds the driving substrate 110, the electronic ink layer 120, the conductive water-blocking layer 130, and the functional films 160 and 170. The housing 180 extends to the surface 160S of the functional film 160 facing away from the conductive water-blocking layer 130. In other words, the display device 100 in this embodiment has a non-full-plane design. By making the width W3 of the functional film 160 less than the widths of the conductive water-blocking layer 130 and the driving substrate 110, it is possible to prevent the bearing mechanism of the display device 100 and the housing 180 from generating stress on each stacked layer during bending, resulting in the failure of the display device 100.

[0069] Figure 3 is a cross-sectional view of a display device 100a according to another embodiment of the present disclosure. The display device 100a is substantially the same as the display device 100 Figure 1 shown, and the difference is that the width W4 of the second cover plate structure 164a of the functional film 160a of the display device 100a is less than the width W3 of the first cover plate structure 162. By further reducing the width W4 of the second cover plate structure 164a, it is possible to prevent the bearing mechanism of the display device 100a and the housing 180 from generating stress on each stacked layer during bending, resulting in the failure of the display device 100a. The display device 100a also has the same technical effects as the display device 100, which will not be elaborated here.

[0070] Figure 4 is a cross-sectional view of a display device 100b according to another embodiment of the present disclosure. The display device 100b is substantially the same as the display device 100, and the difference is that the width W5 of the second cover plate structure 164b of the functional film 160b of the display device 100b is greater than the width W1 of the conductive water-blocking layer 130 (see Figure 2) and the width of the first cover structure 162b is approximately equal to the width W1 of the water-resistant conductive layer 130. The difference D between the width W5 of the second cover structure 164b and the width W1 of the water-resistant conductive layer 130 is greater than 3 mm. The housing 180a surrounds the driving substrate 110, the electronic ink layer 120, the water-resistant conductive layer 130, and the first cover structure 162b, and the housing 180a is located below the second cover structure 164b. In other words, the display device 100b in this embodiment has a flat design. Through such a design, it is possible to avoid the wavy deformation of the interfaces attached to each stack due to the bending stress when the display device 100b is bent, thereby avoiding the situation of interface peeling and preventing the display device 100b from failing.

[0071] Figure 5 FIG. is a cross-sectional view of a display device 100c according to another embodiment of the present disclosure. The display device 100c is substantially the same as the display device 100b, except that the widths of the first cover structure 162c and the second cover structure 164c of the functional film 160c of the display device 100c are approximately equal. The housing 180b surrounds the driving substrate 110, the electronic ink layer 120, and the water-resistant conductive layer 130, and the housing 180b is located below the first cover structure 162c. The display device 100c has the same technical effects as the display device 100b, and will not be described in detail here.

[0072] Figure 6 FIG. is a flowchart of a manufacturing method of a display device according to an embodiment of the present disclosure. Figures 7 to 9 is Figure 6 a cross-sectional view of an intermediate step of the manufacturing method of the display device. Referring to Figure 6 and Figure 7 simultaneously. The manufacturing method starts from step S1, forming an electronic ink layer 120 on the driving substrate 110. In step S2, a water-resistant conductive layer 130 is provided, where the water-resistant conductive layer 130 includes a conductive layer 136 located on a base layer 132. Step S2 also includes disposing a water-resistant layer 134 on the base layer 132. In other words, the water-resistant layer 134 is first formed on the base layer 132, and then the conductive layer 136 is formed on the water-resistant layer 134. The order of the above steps S1 and S2 can be swapped, which does not affect the technical effects of this manufacturing method. As described above, since the conductive layer 136 is integrated in the water-resistant conductive layer 130, the size of the water-resistant conductive layer 130 can be larger than the size of the electronic ink layer 120.

[0073] Referring to Figure 6 and Figure 8。In step S3, the electro-ink layer 120 is joined to the conductive layer 136 through the adhesive layer 140. Since the size of the conductive water-blocking layer 130 is larger than that of the electro-ink layer 120, a gap G may be formed between the surface 130B of the conductive water-blocking layer 130 facing the electro-ink layer 120 and the surface 110T of the driving substrate 110 facing the electro-ink layer 120.

[0074] Refer also to Figure 6 and Figure 2 。In step S4, the frame sealant 150 is disposed between the driving substrate 110 and the conductive water-blocking layer 130, and the frame sealant 150 surrounds the electro-ink layer 120. As described above, the frame sealant 150 can be used in a side encapsulation manner to seal the electro-ink layer 120.

[0075] Refer also to Figure 6 and Figure 9 。In step S5, the functional films 160 and 170 are disposed under the driving substrate 110 or on the conductive water-blocking layer 130. In this embodiment, the cover structure of the display device 100 as Figure 1 is taken as an example. In other embodiments, the functional film 160 can also be the Figures 3 to 5 shown cover structure.

[0076] Refer also to Figure 6 and Figure 1 。In step S6, the housing 180 is disposed to surround the driving substrate 110, the electro-ink layer 120, the conductive water-blocking layer 130, and the functional films 160 and 170. In this embodiment, the housing 180 of the display device 100 as Figure 1 is taken as an example. In other embodiments, the housing can also be the housing 180a as shown in Figure 4 or the housing 180b as shown in Figure 5 。

[0077] In summary, by providing the conductive water-blocking layer with the effects of anti-UV, water-blocking, and driving the electro-ink layer, the display device of the present disclosure can eliminate the need for a protective film covering the surface of the conductive water-blocking layer facing away from the electro-ink layer and the sidewalls of the conductive water-blocking layer, thus reducing the thickness of the display device. In this way, the display device can have better bendability and reduce the fatigue damage of the display device 100 caused by repeated bending. In addition, the above structure can be applied to non-planar or full-planar display devices to avoid generating stress on each stacked layer when bending the display device, resulting in the failure of the display device.

[0078] Although the present invention has been disclosed as above in embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the appended claims.

Claims

1. A display device, characterized in that, Comprising: A driving substrate; An electronic ink layer located on the driving substrate; and A conductive water-blocking layer located on the electronic ink layer, wherein the conductive water-blocking layer comprises a conductive layer and a base layer, the conductive layer is located between the base layer and the electronic ink layer, and the conductive layer is separated from the electronic ink layer; A functional film disposed on the conductive water-blocking layer, and a difference between a width of the functional film and a width of the conductive water-blocking layer is greater than 3 mm; and A housing surrounding the driving substrate, the electronic ink layer, and the conductive water-blocking layer.

2. The display device according to claim 1, wherein Wherein the conductive water-blocking layer further comprises a water-blocking layer located between the conductive layer and the base layer.

3. The display device according to claim 1, characterized in that, Wherein a vertically projected area of the conductive water-blocking layer on the driving substrate is greater than a vertically projected area of the electronic ink layer on the driving substrate.

4. The display device according to claim 1, wherein Wherein the base layer is a colorless polyimide layer.

5. The display device according to claim 1, characterized in that, Further comprising: An adhesive layer located between the electronic ink layer and the conductive water-blocking layer.

6. The display device according to claim 1, wherein Further comprising: A sealant located between the driving substrate and the conductive water-blocking layer, and the sealant surrounds the electronic ink layer.

7. The display device according to claim 6, wherein, Wherein a hardness of the sealant is less than 500 MPa.

8. The display device according to claim 6, wherein Among them, the water vapor transmission rate of the frame adhesive is less than 12 g / m 2 / day.

9. The display device according to claim 6, wherein Wherein a viscosity of the sealant is less than 2000 Pa·s.

10. The display device according to claim 1, wherein, Wherein the width of the functional film is less than the width of the conductive water-blocking layer, and wherein the housing further surrounds the functional film and extends to a surface of the functional film facing away from the conductive water-blocking layer.

11. The display device according to claim 10, wherein Wherein the functional film comprises a first cover structure and a second cover structure, the first cover structure is located between the second cover structure and the conductive water-blocking layer, and a width of the second cover structure is less than a width of the first cover structure.

12. The display device according to claim 1, characterized in that, Wherein the width of the functional film is greater than the width of the conductive water-blocking layer.

13. The display device according to claim 12, wherein Wherein the functional film comprises a first cover structure and a second cover structure, the first cover structure is located between the second cover structure and the conductive water-blocking layer, a width of the second cover structure is greater than a width of the first cover structure, and wherein the housing further surrounds the first cover structure and is located below the second cover structure.

14. The display device according to claim 12, wherein Wherein the functional film comprises a first cover structure and a second cover structure, the first cover structure is located between the second cover structure and the conductive water-blocking layer, and the housing is located below the first cover structure.

15. A manufacturing method of a display device, characterized in that, Comprising: Forming an electronic ink layer on a driving substrate; Providing a conductive water-blocking layer, wherein the conductive water-blocking layer comprises a conductive layer located on a base layer; Bonding the electronic ink layer and the conductive layer through an adhesive layer; Disposing a functional film on the driving substrate or the conductive water-blocking layer, and a difference between a width of the functional film and a width of the conductive water-blocking layer is greater than 3 mm; and Disposing a housing surrounding the driving substrate, the electronic ink layer, and the conductive water-blocking layer.

16. The manufacturing method of the display device according to claim 15, characterized in that, Wherein providing the conductive water-blocking layer further comprises disposing a water-blocking layer located between the base layer and the conductive layer.

17. The manufacturing method of the display device according to claim 15, characterized in that, Further comprising: Disposing a sealant between the driving substrate and the conductive water-blocking layer, and the sealant surrounds the electronic ink layer.

18. The manufacturing method of the display device according to claim 15, characterized in that, wherein the width of the functional film is less than or equal to the width of the conductive water-blocking layer, and wherein the housing further surrounds the functional film and extends onto a surface of the functional film facing away from the conductive water-blocking layer.

19. The manufacturing method of the display device according to claim 15, characterized in that, wherein the width of the functional film is greater than the width of the conductive water-blocking layer, and wherein the housing is located below the functional film.

Images