Method of manufacturing an optical substrate and optical substrate

Abstract

The application provides a method for manufacturing an optical substrate, comprising: providing a mother substrate; coating a partial area of the mother substrate to manufacture an optical glass substrate, wherein the coated mother substrate forms an optical window part of the optical glass substrate, and the uncoated mother substrate forms a substrate main part of the optical glass substrate, the substrate main part having a first surface and a second surface opposite to each other; forming a metal layer on the first surface of the substrate main part; mechanically cutting the metal layer to remove part of the metal layer; and laser cutting from the second surface to form a plurality of optical substrates. The method for manufacturing the optical substrate provided by the application removes part of the metal layer on the first surface by mechanical cutting, and laser cuts the second surface corresponding to the first surface, thereby improving the yield and production efficiency of the optical substrate. The application also provides an optical substrate.

Description

Technical Field

[0001] This invention relates to the field of optical component manufacturing technology, and more specifically, to a method for manufacturing an optical substrate and an optical substrate. Background Technology

[0002] With the development of optical technology, optical components such as light windows and diffusers are increasingly used in projection and lighting. Therefore, the manufacturing process of optical components is particularly important. However, existing optical component manufacturing processes suffer from low yield rates or low production efficiency. Summary of the Invention

[0003] The purpose of this invention is to provide a method for fabricating an optical substrate and an optical substrate itself, in order to solve the aforementioned problems. This invention achieves the above objective through the following technical solutions.

[0004] In a first aspect, the present invention provides a method for manufacturing an optical substrate, comprising: providing a master substrate; depositing a portion of the master substrate with a film to manufacture an optical glass substrate, wherein the deposited master substrate forms an optical window portion, and the undeposited master substrate forms a substrate body portion, the substrate body portion having a first surface and a second surface facing away from each other; forming a metal layer on the first surface of the substrate body portion; mechanically cutting the metal layer to remove a portion of the metal layer; and laser cutting from the second surface to form a plurality of optical substrates.

[0005] In one embodiment, coating the mother substrate includes: placing the mother substrate in a coating fixture, the mother substrate having a first surface and a second surface facing away from each other. The coating fixture includes a plurality of openings, through which the first surface and the second surface of the mother substrate placed in the coating fixture are exposed. Coating is performed on the exposed first surface and the second surface to form a plurality of optical windows, and the uncoated mother substrate forms the substrate body.

[0006] In one embodiment, before mechanically cutting the metal layer to remove a portion of the metal layer, the method further includes: forming a patterned mask on the metal layer using a dry film etching process to cover the optical window and a portion of the metal layer; and forming a metal sealing layer using an electroplating process, the metal sealing layer surrounding the optical window.

[0007] In one embodiment, there is a gap between the metal sealing layer and the corresponding optical window.

[0008] In one embodiment, a metal layer is continuously formed on a first surface and extends to and connects with an optical window.

[0009] In one embodiment, the thickness of the metal sealing layer is greater than 10 μm.

[0010] In one embodiment, a rotating blade method is used to mechanically cut the metal layer to remove part of the metal layer.

[0011] In one embodiment, the process further includes attaching a fixing film to the second surface before mechanically cutting the metal layer to remove a portion of it.

[0012] In one embodiment, the process further includes removing a fixing film from the second surface before laser cutting from the second surface to form a plurality of optical substrates. A fixing film is then attached to the first surface.

[0013] Secondly, the present invention also provides an optical substrate, which is manufactured using any of the above-described methods for manufacturing optical substrates.

[0014] Compared to existing technologies, the optical substrate fabrication method and optical substrate provided in this invention include the following steps: first, providing a mother substrate; then, coating a portion of the mother substrate with a film to fabricate an optical glass substrate including a substrate body and an optical window; forming a metal layer on a first surface of the substrate body; then, mechanically cutting the metal layer to remove a portion of the metal layer, thereby achieving a first pre-cutting of the optical glass substrate; and finally, laser cutting from a second surface to achieve a second pre-cutting of the optical glass substrate, thereby forming multiple optical substrates. In this method, the metal layer is partially removed by mechanical cutting, and laser cutting acts on the metal-free surface of the optical glass substrate. Mechanical cutting does not damage the metal layer due to the high temperature of the cutting process. Furthermore, this method improves the yield and production efficiency of the optical substrate, making it suitable for mass production of optical substrates.

[0015] These or other aspects of the invention will become more apparent from the following description of the embodiments. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a flowchart of a method for fabricating an optical substrate according to an embodiment of the present invention.

[0018] Figure 2 This is a schematic diagram of the motherboard substrate provided in an embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram of the optical glass substrate provided in an embodiment of the present invention.

[0020] Figure 4This is a flowchart of the fabrication of an optical glass substrate provided in an embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram of the coating fixture provided in an embodiment of the present invention.

[0022] Figure 6 This is a schematic diagram of an optical glass substrate after the metal layer coating is completed, as provided in an embodiment of the present invention.

[0023] Figure 7 This is a reflection performance curve of the first optical film layer (second optical film layer) provided in the embodiment of the present invention.

[0024] Figure 8 This is a transmission performance curve of the first optical film layer (second optical film layer) provided in the embodiments of the present invention.

[0025] Figure 9 This is a flowchart of another method for fabricating an optical substrate provided in an embodiment of the present invention.

[0026] Figure 10 This is a schematic diagram of an optical glass substrate after the metal sealing layer has been coated, as provided in an embodiment of the present invention.

[0027] Figure 11 This is a schematic diagram of the optical glass substrate after mechanical cutting and laser cutting, as provided in the embodiments of the present invention.

[0028] Figure 12 This is a schematic diagram of the optical substrate provided in an embodiment of the present invention.

[0029] Figure 13 yes Figure 12 Cross-sectional view along the AA direction. Detailed Implementation

[0030] To facilitate understanding of the embodiments of the present invention, a more complete description of the embodiments will be given below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the present invention.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the embodiments of the invention is for the purpose of describing particular implementations only and is not intended to limit the invention.

[0032] Cutting is a crucial step in the manufacturing process of optical components. The inventors discovered that current methods primarily involve laser cutting of glass substrates with pre-coated metal films. However, because laser cutting is an invisible process, the cutting temperature is very high. After cutting, the metal films on the glass substrate tend to stick together, damaging the metal film and resulting in low product yield. Currently, there are methods that involve laser pre-cutting the glass substrate, followed by cleaning, re-coating, and finally mechanical cutting and cleaving. However, this approach has several drawbacks: 1. Pre-cutting generates residue, increasing cleaning complexity and production costs; 2. The laser cutting temperature causes the coated films to stick together after cutting. If only the connecting points are cut, the metal film will be damaged during cleaving; 3. The time required for laser cutting followed by mechanical cutting is essentially the same as using mechanical cutting alone, offering no improvement in cutting efficiency. Additionally, there are methods that first cut the glass substrate into smaller pieces before coating with metal films. However, this method has very low production efficiency and is unsuitable for mass production. Therefore, based on the aforementioned problems existing in the current optical element manufacturing process, the inventors developed a new type of optical element manufacturing process.

[0033] Please see Figure 1 The present invention provides a method for manufacturing an optical substrate 100, comprising:

[0034] S10: Provide mother substrate 1;

[0035] S20: A portion of the mother substrate 1 is coated, wherein the coated mother substrate 1 forms the optical window portion 15 of the optical glass substrate 10, and the uncoated mother substrate 1 forms the substrate body portion 17 of the optical glass substrate 10, the substrate body portion 17 having a first surface 11 and a second surface 13 facing away from each other.

[0036] S30: A metal layer 112 is formed on the first surface 11 of the substrate body portion 17;

[0037] S40: Mechanically cut the metal layer 112 to remove a portion of the metal layer 112; and

[0038] S50: Laser cutting from the second surface 13 to form multiple optical substrates 100.

[0039] For step S10, please refer to Figure 2 and Figure 3The mother substrate 1 has a first surface 11 and a second surface 13, which are opposite to each other. The mother substrate 1 is generally a circular sheet structure. In other embodiments, the shape of the mother substrate 1 can also be a rectangular sheet, an elliptical sheet, or other shapes, as long as it can be processed to form an optical substrate 100. In this embodiment, the mother substrate 1 is, for example, made of sapphire, with a diameter of 6.66 cm and a thickness of 0.5 mm. In other embodiments, the mother substrate 1 can also be made of quartz or other glass. In other embodiments, the mother substrate 1 can also be of other sizes.

[0040] For step S20, in this embodiment, the optical glass substrate 10 is formed by depositing an optical film on a portion of a mother substrate 1. The optical glass substrate 10 includes an optical window portion 15 and a substrate body portion 17, wherein the optical window portion 15 is formed from the coated mother substrate 1, and the remaining uncoated mother substrate 1 forms the substrate body portion 17, that is, the substrate body portion 17 has a first surface 11 and a second surface 13.

[0041] The optical glass substrate 10 is composed of a substrate body portion 17 and an optical window portion 15. The substrate body portion 17 surrounds and connects multiple optical window portions 15. In other words, the substrate body portion 17 is a structure other than the optical window portions 15.

[0042] In this embodiment, the optical window 15 is generally rectangular. There are multiple optical windows 15, arranged at intervals and in an array, conforming to the boundary of the circular optical glass substrate 10. In some embodiments, the optical window 15 can also be circular, elliptical, or other shapes, as long as the actual optical requirements are met.

[0043] Please see Figure 4 , Figure 5 and Figure 6 In this embodiment, fabricating the optical glass substrate 20 includes:

[0044] S21: Place the mother substrate 1 in the coating fixture 20. The mother substrate 1 has a first surface 11 and a second surface 13 facing away from each other.

[0045] S22: The coating fixture 20 includes a plurality of openings 26, through which the first surface 11 and the second surface 13 of the mother substrate 1 placed within the coating fixture 20 are exposed; and

[0046] S23: A film is deposited on the exposed first surface 11 and second surface 13 to form a plurality of optical window portions 15, and the uncoated mother substrate 1 forms a substrate body portion 17.

[0047] For step S21, before placing the mother substrate 1 into the coating fixture 20, the mother substrate 1 needs to be inspected upon arrival to ensure that the cleanliness of the mother substrate 1 meets the coating standards. If the cleanliness of the mother substrate 1 does not meet the requirements, it needs to be cleaned according to the standard cleaning procedure for the mother substrate 1 to ensure that the cleanliness of the mother substrate 1 meets the coating requirements.

[0048] For step S22, please refer to Figure 2 , Figure 3 and Figure 5 It should be noted that in order to manufacture the optical glass substrate 10, a film layer needs to be deposited on the surface of the mother substrate 1. Since the shape of the film layer needs to be controlled and the deposition process is at high temperature, a deposition fixture 20 is required. Specifically, the deposition fixture 20 includes a first fixture 22 and a second fixture 24. In addition, the deposition fixture 20 is also provided with multiple openings 26. The first surface 11 and the second surface 13 of the mother substrate 1 placed in the deposition fixture 20 are exposed through the multiple openings 26. The openings 26 include a first opening 261 and a second opening 262. That is, the first surface 11 is exposed through the first opening 261 and the second surface 13 is exposed through the second opening 262.

[0049] The first clamp 22 is provided with a groove 221 and a plurality of first openings 261. The groove 221 is suitable for mounting the mother plate substrate 1, and the plurality of first openings 261 communicate with the groove 221 so that the first surface 11 can be exposed from the plurality of first openings 261.

[0050] The second clamp 24 is provided with multiple second openings 262, allowing the second surface 13 to be exposed through the multiple second openings 262. In this embodiment, before coating, the second clamp 24 needs to be fixedly connected to the first clamp 22, wherein the fixing method can be screw locking or adhesive fixing. It should be noted that after the screws are locked, the projections of the first opening 261 and the second opening 262 on the mother substrate 1 overlap, that is, the screw locking positioning method ensures that the multiple optical window areas 15 on the first surface 11 and the second surface 13 of the mother substrate 1 correspond one-to-one.

[0051] In this embodiment, the first clamp 22 can be a lower clamp and the second clamp 24 can be an upper clamp; that is, the first clamp 22 is disposed below the coating cavity, and the second clamp 24 is disposed above the coating cavity. In other embodiments, the first clamp 22 can be an upper clamp and the second clamp 24 can be a lower clamp.

[0052] For step S23, please refer to Figure 3 , Figure 5 and Figure 6The coating on the exposed first surface 11 and the second surface 13 includes: coating a first optical film layer 114 on the first surface 11 exposed from the plurality of first openings 261, and simultaneously coating a second optical film layer 132 on the second surface 13 exposed from the plurality of second openings 262. Figure 13 Multiple optical windows 15 are formed, and an uncoated mother substrate 1 forms a substrate body 13.

[0053] In this embodiment, the steps of depositing the first optical film layer 114 and the second optical film layer 132 are as follows: after the mother plate substrate 1 is installed in the groove 221, the first clamp 22 and the second clamp 24 can be fixedly connected, and then the fixed coating clamp 20 is placed in the coating machine for coating. The coating material can be Ta2O5 and SiO2, and the coating requires a transmittance greater than 99%.

[0054] In this embodiment, the first optical film layer 114 is formed on the first surface 11 of the mother substrate 1 exposed from the first opening 261. In this embodiment, the first optical film layer 114 is a visible light anti-reflection film layer with a light transmittance greater than 99%. Figure 7 As shown, in one embodiment, the first optical film layer 114 has the highest transmittance for light with wavelengths between 600nm and 700nm, and the reflectivity is reduced by about 14% for light with wavelengths between 600nm and 700nm, that is, light transmittance is increased by about 14%. Figure 8 As shown, in another embodiment, the first optical film layer 114 has the highest transmittance for light with wavelengths between 400nm and 500nm, approaching 100%, indicating good transmission performance of the first optical film layer 114 (second optical film layer 132). In other embodiments, the coating can be applied according to actual application requirements; for example, the first optical film layer 114 may need to have the highest transmittance for light with wavelengths between 300nm and 400nm. In other embodiments, the first optical film layer 114 can also be other functional films, such as high-reflectivity films or selective filtering films.

[0055] The second optical film layer 132 is formed on the second surface 13 of the mother substrate 1 exposed from the second opening 262. In this embodiment, the second optical film layer 132 is also a visible light anti-reflection film layer, and the light transmittance is greater than 99%. In other embodiments, the second optical film layer 132 may also be other functional film layers. The optical properties of the second optical film layer 132 are as follows: Figure 7 and Figure 8 As shown.

[0056] When the first optical film layer 114 and the second optical film layer 132 are the same type of film layer, such as antireflection film, there is no need to distinguish between the front and back sides when using the optical glass substrate 10, and the consistency of the sample is good.

[0057] In this embodiment, the deposition of the first optical film layer 114 and the second optical film layer 132 is completed simultaneously. In other embodiments, the deposition of the first optical film layer 114 and the second optical film layer 132 may be completed sequentially. In other embodiments, when the deposition of the first optical film layer 114 and the second optical film layer 132 is completed sequentially, the first optical film layer 114 and the second optical film layer 132 may also be different films.

[0058] In some embodiments, the first surface 11 may not be coated with the first optical film layer 114, and the second surface 13 may not be coated with the second optical film layer 132. In other embodiments, when the first clamp 22 has multiple first openings 261 and the second clamp 24 does not have second openings 262, the first surface 11 may be coated with the first optical film layer 114, and the second surface 13 may not be coated with the second optical film layer 132; or when the first clamp 22 does not have first openings 261 and the second clamp 24 has multiple second openings 262, the first surface 11 may not be coated with the first optical film layer 114, and the second surface 13 may be coated with the second optical film layer 132.

[0059] For step S30, please refer to Figure 2 , Figure 3 and Figure 6 In this embodiment, the metal layer 112 is formed on the first surface 11 of the substrate body 17 by a plating process. It should be noted that before plating, the metal layer 112 needs to be coated with photoresist, exposed, and developed so that the photoresist covers the optical window 15 exposed on the first surface 11. Specifically, photoresist is first uniformly coated on the first surface 11 of the optical glass substrate 10, covering the substrate body 17 and the optical window 15. After baking and fixing, the photoresist is transferred to a lithography machine, where ultraviolet light is used to transfer the pattern onto the photoresist. Then, under the action of the developing solution, the photoresist located on the substrate body 17 dissolves, while the photoresist located on the optical window 15 is retained and covers the optical window 15. Therefore, the metal layer 112 can be plated on the substrate body 17, while the optical window 15 will not be plated with the metal layer 112 due to the presence of the photoresist. After treatment with the developing solution, the substrate is cleaned and transferred to a vacuum coating machine for metal layer 112 coating. After metal layer 112 is coated, the photoresist is removed to remove the photoresist located in the optical window portion 15. This completes the continuous coating of metal layer 112 onto the substrate body portion 17 of the first surface 11 and extends to the optical window portion 15, connecting with the optical window portion 15.

[0060] It should be noted that photoresist, also known as photoresist, is a photosensitive liquid mixture composed of three main components: photosensitive resin, sensitizer, and solvent. Under the influence of ultraviolet light, electron beams, ion beams, X-rays, etc., the solubility and affinity of the photosensitive resin in the photoresist change due to the photocuring reaction. After treatment with a suitable solvent, the soluble portion can be dissolved to obtain the desired pattern. The development principle in the metal layer 112 plating process is as follows: the photoresist in the exposed portion (substrate body 17) does not undergo a polymerization reaction and dissolves upon contact with the developer. In this embodiment, the developer is a weak alkali, Na2CO3 (0.5%-1.5%) or K2CO3. The photoresist in the non-exposed portion (optical window 15) undergoes a polymerization reaction. The resulting polymer material does not react with the developer and is retained and covers the optical window 15, protecting it from being plated with the metal layer 112.

[0061] In this embodiment, a positive photoresist is used. During development, the exposed portion dissolves in the developing solution. The mask used is a bright field mask, that is, the area on the mask corresponding to the optical window 15 is opaque, while the remaining areas are transparent, so that the same pattern as on the mask can be formed on the photoresist.

[0062] In other embodiments, the photoresist can also be a negative photoresist, that is, the non-exposed parts dissolve in the developer during development, and the mask used is a dark field mask, that is, the area on the mask corresponding to the optical window 15 is transparent, while the other areas are opaque, so that the same pattern as on the mask can be formed on the photoresist.

[0063] In this embodiment, the metal layer 112 is continuously distributed on the substrate body 17 and surrounds the optical window portion 15 coated with the first optical film layer 114. That is, the metal layer 112 is continuously formed on the first surface 11 and extends to the optical window portion 15, connecting with it. In other words, the metal layer 112 is continuous without gaps, facilitating the conductivity of the optical glass substrate 10 and thus enabling the subsequent formation of a metal sealing layer by electroplating. The coating of the metal layer 112 can be performed using a vacuum coating machine.

[0064] In this embodiment, the metal layer 112 is made of titanium / platinum / gold, that is, the metal layer 112 includes a titanium layer, a platinum layer and a gold layer, or germanium / nickel / gold, wherein the gold layer is the topmost layer. The thickness of the metal layer 112 is less than 10 μm.

[0065] Please see Figure 9In other embodiments, before mechanically cutting the metal layer 112 to remove a portion of the metal layer 112, and after the metal layer 112 is formed on the first surface 11, the method further includes step S30A: forming a patterned mask on the metal layer 112 using a dry film etching process to cover the optical window portion 15 and a portion of the metal layer 112; and forming a metal sealing layer 113 using an electroplating process, the metal sealing layer 113 surrounding the optical window portion 15.

[0066] Please see Figures 10 to 13 The metal sealing layer 113 covers a portion of the metal layer 112 and surrounds the optical window portion 15, and there is a gap 115 between the metal sealing layer 113 and the corresponding optical window portion 15.

[0067] The metal sealing layer 113 can be used for hermetic encapsulation, that is, the optical substrate 100 can be sealed and welded to the housing through the metal sealing layer 113. In this embodiment, the metal sealing layer 113 is made of a gold-tin alloy, for example, a gold-tin ratio of Au80Sn20. The metal sealing layer 113 in this embodiment is relatively thick, with a thickness greater than 10μm. The metal sealing layer 113 can be formed on the surface of the metal layer 112 by a dry film etching process combined with an electroplating process. The specific thickness needs to be set according to the flatness of the actual sealing surface. The electroplating process can specifically be chemical electroplating. It should be noted that dry film is relative to wet film in coating. Dry film is a high-molecular-weight compound that can undergo a polymerization reaction after being irradiated by ultraviolet light to form a stable substance that adheres to the board surface, thereby achieving the function of blocking electroplating and etching. The dry film consists of three layers: a PE (Polyethylene) protective film; a middle dry film layer with good adhesion and photosensitivity to absorb ultraviolet light from the photolithography machine; and a PET (polyethylene glycol terephthalate) protective layer. The PE and PET layers protect the middle dry film layer and need to be removed before lamination and development. Specific removal methods can be found in existing technologies. Dry films are low-cost and easy to use; therefore, using dry films for pre-plating treatment simplifies the process of preparing the metal sealing layer 113.

[0068] As an example, the fabrication process of the metal sealing layer 113 includes forming a patterned mask on the metal layer 112 using a dry film etching process, the patterned mask covering the optical window 15 and part of the metal layer 112; and forming the metal sealing layer 113 using a dry film etching process combined with an electroplating process, specifically including the following steps:

[0069] Pretreatment (cleaning of optical glass substrate 10): The optical glass substrate 10 coated with metal layer 112 is ultrasonically cleaned with IPA (Isopropenyl acetate) for ten minutes, then rinsed with ultrapure water, and then the optical glass substrate 10 is placed in a spin dryer to dry.

[0070] Lamination: Remove the PET layer from the dry film and use a laminator to apply a 1.5-millimeter dry film to the first surface 11 of the optical glass substrate 10 via a hot press roller, while simultaneously peeling off the PE layer;

[0071] Exposure: The optical glass substrate 10 with dry film is transferred to the photolithography machine. In the photolithography machine, the mask and the optical glass substrate 10 are aligned using marking points, and the pattern is transferred onto the dry film by ultraviolet light irradiation.

[0072] Development: The dry film of the non-exposed part (most of the substrate body 17) is removed, leaving the dry film of the photosensitive part (optical window 15 and part of the metal layer 112), thereby forming a patterned mask on the metal layer 112, and the patterned mask covers the optical window 15 and the part of the metal layer 112 connected to the optical window 15.

[0073] Electroplating: A metal sealing layer 113 of appropriate proportion is electroplated on the first surface 11. Since the optical window portion 15 and part of the metal layer are covered by dry film, the metal sealing layer 113 is only plated on the substrate body portion 17 that is not covered by dry film.

[0074] Film removal: The dry film covering the optical window 15 and part of the metal layer 112 is removed by using a stripping solution.

[0075] In this embodiment, when the dry film is attached to the surface of the metal layer 112, it is sufficient to cover multiple optical windows 15 and part of the metal layer 112, without covering the entire first surface 11, so as to save dry film.

[0076] The principle of development in the manufacturing process of the metal sealing layer 113 is as follows: the photosensitive material in the unexposed part (corresponding to the substrate body 17 of the metal sealing layer 113) does not undergo a polymerization reaction and dissolves when it comes into contact with a weak alkali Na2CO3 (0.5%-1.5%) or K2CO3, while the photosensitive material in the exposed part (optical window 15 and most of the substrate body 17) undergoes a polymerization reaction. The resulting polymer material does not react with the developer and is retained and covers the optical window 15 and most of the substrate body 17, protecting the optical window 15 and most of the substrate body 17 from being electroplated with the metal sealing layer 113.

[0077] Since the substrate body portion 17 corresponding to the metal sealing layer 113 is the unexposed portion, while the optical window portion 15 and most other parts of the substrate body portion 17 are the exposed portions, the mask in this embodiment is a dark field mask. Because the patterned mask covers the optical window portion 15 and a portion of the metal layer 112 connected to the optical window portion 15, the metal sealing layer 113 will not be formed on the metal layer 112 in this area. The metal sealing layer 113 formed after electroplating has a gap 115 between it and the corresponding optical window portion 15, allowing molten solder to flow into the gap 115 when the optical substrate 100 is soldered to the casing, preventing solder from overflowing into the optical window portion 15 and avoiding affecting the light transmittance of the optical window portion 15.

[0078] For step S40: In this embodiment, a rotary blade method is used to mechanically cut the metal layer 112 to remove part of the metal layer 112. Because the gold layer is very thin, on the micrometer scale, the rotary blade method for cutting the metal layer 112 is faster than cutting the optical glass substrate 10 with a rotary blade, saving cutting time and improving cutting efficiency. The mechanical cutting forms a first cutting kerf. It should be noted that the width of the first cutting kerf can be approximately 200 μm. Therefore, after mechanical cutting, a certain metal layer missing area will be left, that is, the optical substrate 100 will have a certain metal layer missing area around its perimeter. This allows the molten solder to flow into the metal layer missing area when the optical substrate 100 is welded to the tube shell, preventing solder overflow. By mechanically cutting the metal layer 112 of the first surface 11, the first pre-cutting of the optical glass substrate 10 can be achieved, facilitating subsequent dicing operations.

[0079] Before mechanically cutting the metal layer 112 to remove a portion of it, the process further includes attaching a fixing film to the second surface 13. In this embodiment, the fixing film is a blue film, which can be used to fix the optical glass substrate 10, preventing the optical glass substrate 10 from moving freely during and after the mechanical cutting process. In addition, the fixing film can also protect the second surface 13 of the optical glass substrate 10, preventing scratches on the second surface 13.

[0080] For step S50: Since laser cutting is performed from the second surface 13, and the second surface 13 is not coated with a metal layer 112, i.e., the second surface 13 is a smooth surface, this facilitates laser transmission, thereby improving laser cutting efficiency. Laser cutting can achieve a second pre-cutting of the optical glass substrate 10, forming multiple optical substrates 100. In one embodiment, when laser cutting is insufficient to separate multiple optical substrates 100 from the optical glass substrate 10, it is necessary to cleave along the first and second cutting paths to form multiple optical substrates 100. After the first two pre-cuttings, the difficulty of cleaving is reduced, and the production efficiency of the optical substrates 100 is improved. Cleaving can be completed by a cleaving machine. For the method of manufacturing the optical substrate 100 provided by the present invention, since the cutting process is placed in the last step of the entire process, i.e., coating first and then cutting, it is convenient for mass production of the optical substrates 100. The laser cutting forms a second cutting path, and the width of the second cutting path is less than 20 μm. Furthermore, laser cutting operates on the surface (second surface 13) of the metal-free layer 112 of the optical glass substrate 10, and mechanical cutting avoids damage to the metal layer 112 due to high cutting temperatures, thus improving the yield of the optical substrate 100 and saving raw materials. In this embodiment, the laser used for laser cutting can be a picosecond laser. In other embodiments, it can also be a femtosecond laser or a nanosecond laser.

[0081] If a fixing film has been attached to the second surface 13 before mechanically cutting the metal layer 112, the process of laser cutting from the second surface 13 to form a plurality of optical substrates 100 includes removing the fixing film from the second surface 13. Furthermore, a fixing film may also be attached to the first surface 11 before laser cutting from the second surface 13 to form a plurality of optical substrates 100. This fixing film can also be a blue film, used to fix the optical glass substrate 10 and prevent it from moving freely during and after laser cutting. Additionally, the fixing film can protect the first surface 11 of the optical glass substrate 10, preventing scratches on the first surface 11.

[0082] Please see Figure 11 , Figure 11 The diagram shows an optical glass substrate 10 after mechanical and laser cutting. The first and second cutting paths are both located at the outer edge of the metal sealing layer 113. Therefore, subsequent dicing will be carried out along the outer edge of the metal sealing layer 113, resulting in the substrate body 17 located outside the metal sealing layer 113 being removed. This does not damage the metal layer 112 and the metal sealing layer 113 on the optical substrate 100, thus improving the yield of the optical substrate 100.

[0083] Please see Figure 2 , Figure 12 and Figure 13The present invention also provides an optical substrate 100. The optical substrate 100 may be an optical window for emitting light from a light source device and for protecting the optical components inside the light source device.

[0084] The optical substrate 100 includes a mother substrate 1. In this embodiment, the mother substrate 1 is generally a rectangular sheet structure, and the mother substrate 1 is made of, for example, sapphire. The size of the mother substrate 1 can be set according to actual needs.

[0085] The motherboard substrate 1 includes a first surface 11 and a second surface 13 facing away from each other. The first surface 11 is provided with a metal layer 112, a metal sealing layer 113, and a first optical film layer 114. The metal layer 112 connects the first surface 11 and the metal sealing layer 113, and connects to and surrounds the first optical film layer 114. The metal layer 112 is made of titanium / platinum / gold, that is, the metal layer 112 includes a titanium layer, a platinum layer, and a gold layer, or germanium / nickel / gold. The metal sealing layer 113 covers the surface of the metal layer 112, surrounds the first optical film layer 114, and has a gap 115 between it and the first optical film layer 114. The metal sealing layer 113 can be made of a gold-tin alloy. The first optical film layer 114 can be an antireflective coating. The gap 115 is designed so that the molten solder when the optical substrate 100 is welded to the tube shell will flow into the gap 115, preventing the solder from overflowing into the optical window 15 and avoiding affecting the light transmittance of the optical window 15.

[0086] The second surface 13 is provided with a second optical film layer 132, which is located at the corresponding position of the first optical film layer 114 on the mother substrate 1. That is, the projection of the second optical film layer 132 on the first surface 11 is located on the first optical film layer 114. The second optical film layer 132 can also be an antireflective coating.

[0087] In summary, the method for manufacturing the optical substrate 100 and the optical substrate 100 provided in this embodiment of the invention include the following steps: First, an optical glass substrate 10 comprising a substrate body portion 17 and an optical window portion 15 is manufactured; a metal layer 112 is formed on the first surface 11 of the substrate body portion 17; then, the metal layer 112 is mechanically cut to remove a portion of the metal layer 112, thereby achieving a first pre-cutting of the optical glass substrate 10; next, laser cutting is performed from the second surface 13 to achieve a second pre-cutting of the optical glass substrate 10, thereby forming multiple optical substrates 100. In this method, the metal layer 112 is partially removed by mechanical cutting, and the laser cutting acts on the surface of the optical glass substrate 10 without the metal layer 112. Mechanical cutting does not cause damage to the metal layer 112 due to the high temperature of the cutting. In addition, this method improves the yield and production efficiency of the optical substrate 100, and is suitable for mass production of the optical substrate 100.

[0088] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A method for fabricating an optical substrate, characterized in that, include: Provide motherboard substrate; A portion of the mother substrate is coated to produce an optical glass substrate, wherein the coated mother substrate forms an optical window portion of the optical glass substrate, and the uncoated mother substrate forms a substrate body portion of the optical glass substrate, the substrate body portion having a first surface and a second surface facing away from each other; A metal layer is formed on the first surface of the substrate body; Mechanically cutting the metal layer to remove a portion of the metal layer; and Laser cutting is performed from the second surface to form multiple optical substrates.

2. The method for fabricating an optical substrate according to claim 1, characterized in that, The fabrication of the optical glass substrate includes: A mother substrate is placed in a coating fixture. The mother substrate has a first surface and a second surface that are opposite to each other. The coating fixture includes a plurality of openings through which the first surface and the second surface of the mother substrate placed in the coating fixture are exposed. A film is deposited on the exposed first and second surfaces to form a plurality of optical windows, and the uncoated mother substrate forms the substrate body.

3. The method for fabricating an optical substrate according to claim 1, characterized in that, Before mechanically cutting the metal layer to remove a portion of the metal layer, the method further includes: A patterned mask is formed on the metal layer using a dry film etching process, covering the optical window and a portion of the metal layer; and A metal sealing layer is formed using an electroplating process, the metal sealing layer surrounding the optical window portion.

4. The method for fabricating an optical substrate according to claim 3, characterized in that, There is a gap between the metal sealing layer and the optical window.

5. The method for fabricating an optical substrate according to claim 1, characterized in that, The metal layer is continuously formed on the first surface and extends to the optical window portion, connecting with the optical window portion.

6. The method for fabricating an optical substrate according to claim 3, characterized in that, The thickness of the metal sealing layer is greater than 10 μm.

7. The method for fabricating an optical substrate according to any one of claims 1-6, characterized in that, The metal layer is mechanically cut using a rotary blade method to remove a portion of the metal layer.

8. The method for fabricating an optical substrate according to any one of claims 1-6, characterized in that, The procedure further includes attaching a fixing film to the second surface before mechanically cutting the metal layer to remove a portion of the metal layer.

9. The method for fabricating an optical substrate according to claim 8, characterized in that, The method further includes, prior to laser cutting from the second surface to form a plurality of optical substrates: Remove the fixed film from the second surface; and A fixing film is attached to the first surface.

10. An optical substrate, characterized in that, The optical substrate is manufactured using the method described in any one of claims 1-9.

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