Brittle plate processing apparatus and brittle plate processing method

Abstract

A brittle board processing device and a brittle board processing method are provided, in which a position deviation amount of a processing wheel is automatically measured before processing a brittle board without performing a plurality of trials for position alignment of the brittle board and a processing wheel groove by manual work, the position deviation of the processing wheel is automatically corrected based on the position deviation amount, and the processing wheel whose position deviation is corrected processes an outer periphery of the brittle board, so that time and effort for position alignment of the processing wheel with respect to the brittle board after replacing the processing wheel by manual work can be reduced, and the processing efficiency of the brittle board as a whole is high. A brittle board processing device (1) includes: a table (4) that holds a brittle board (2); a processing head (7) that has a processing wheel (6) that processes an outer periphery (5) of the brittle board (2) held by the table (4); a measurement unit (8) that measures a position deviation amount (Δ) of the processing wheel (6) in an axial direction with respect to the brittle board (2); and a control unit (9) that corrects a position deviation of the processing wheel (6) in a Z-axis direction based on the position deviation amount (Δ) of the processing wheel (6) in the axial direction measured by the measurement unit (8), and causes the processing wheel (6) whose position deviation is corrected to process the outer periphery (5) of the brittle board (2).

Description

Technical Field

[0001] This invention relates to a brittle plate processing apparatus and a brittle plate processing method, targeting brittle plates used in automobiles, LCD TVs, solar cells, furniture, and buildings, for example, grinding or polishing the outer periphery of a rectangular brittle plate, or performing grinding and polishing (hereinafter referred to as processing). Background Technology

[0002] Currently, for example, glass grinding devices use an electric motor to rotate a grinding wheel and bring it into contact with the periphery of the glass plate, thereby grinding the glass plate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2010-58265 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] In the glass grinding apparatus disclosed in Patent Document 1, as a method for aligning the glass grinding position with the grinding wheel position when changing the grinding wheel, a method is adopted in which the dimension from the grinding wheel mounting surface to the grinding wheel groove reference position is manually calibrated when the grinding wheel is manufactured. However, in this method, the processed shape may sometimes deviate slightly when processing the glass plate. Therefore, the processed shape of the glass plate is observed for the first time and the grinding wheel position is readjusted. However, the time spent aligning the grinding wheel position with the glass plate results in a decrease in the overall processing efficiency of the glass plate.

[0008] In view of the above points, the purpose of this invention is to provide a brittle plate processing apparatus and a brittle plate processing method. In cases where the alignment of the brittle plate with the processing wheel groove is performed manually without requiring multiple trials, the positional deviation of the processing wheel is automatically measured before processing the brittle plate. Based on this deviation, the positional deviation of the processing wheel is automatically corrected, allowing the corrected processing wheel to process the outer periphery of the brittle plate. Therefore, the effort and time spent on manually aligning the processing wheel with the brittle plate after changing the processing wheel can be reduced, resulting in higher overall processing efficiency for brittle plates.

[0009] Another objective of this invention is to provide a brittle plate processing apparatus and a brittle plate processing method. Before processing the brittle plate, the positional deviation of the processing wheel is automatically measured, and the positional deviation of the processing wheel is automatically corrected based on the positional deviation. These measurements and corrections are performed alternately and repeatedly, thereby automatically and with higher precision correcting the positional deviation of the processing wheel. The processing wheel with the corrected positional deviation is then used to process the outer periphery of the brittle plate. Therefore, the effort and time spent on manually aligning the processing wheel with the brittle plate after changing the processing wheel can be reduced, resulting in higher overall processing efficiency for brittle plates.

[0010] Technical solutions adopted to solve technical problems

[0011] As a first feature of the present invention for solving the above-mentioned technical problems, a brittle plate processing apparatus is provided, the brittle plate processing apparatus comprising: a worktable holding a brittle plate; a processing head having a processing wheel for processing the outer periphery of the brittle plate held on the worktable; a measuring step for measuring the positional deviation of the processing wheel relative to the brittle plate in the axial direction; and a control unit for correcting the positional deviation of the processing wheel in the axial direction based on the positional deviation measured by the measuring unit, and causing the processing wheel with the corrected positional deviation to process the outer periphery of the brittle plate.

[0012] As an example of the processing apparatus for the brittle plate of the present invention having the first feature, the measuring unit includes: a mounting plate; a movable seat arranged to move freely relative to the mounting plate in a first direction orthogonal to the axis of the processing wheel; a moving mechanism that moves the movable seat in the first direction; and a rotating mechanism disposed on the movable seat and having a shaft member including a top end portion.

[0013] The measuring unit rotates the shaft member in a first surrounding direction about its axis so that the top end contacts the machining surface of the machining wheel. It measures a first position where the top end contacts the machining surface of the machining wheel after rotating in the first surrounding direction. Then, it rotates the shaft member in a second surrounding direction, opposite to the first surrounding direction, so that the top end contacts the machining surface of the machining wheel. It measures a second position where the top end contacts the machining surface of the machining wheel after rotating in the second surrounding direction.

[0014] The control unit calculates a first distance in the axial direction from a predetermined machining reference position to the machining wheel at the first position, calculates a second distance in the axial direction from the predetermined machining reference position to the machining wheel at the second position, calculates a positional deviation in the axial direction of the machining wheel based on the first distance and the second distance, and corrects the positional deviation in the axial direction of the machining wheel based on the positional deviation in the axial direction of the machining wheel, so that the machining wheel with the corrected positional deviation performs machining on the outer periphery of the brittle plate.

[0015] As another example of the brittle plate processing apparatus of the present invention having the first feature, the brittle plate processing apparatus alternately and repeatedly performs the measurement of the first position and the second position by the measuring unit and the correction of the position deviation in the axial direction of the processing wheel by the control unit, so that the processing wheel whose position deviation has been corrected multiple times processes the outer periphery of the brittle plate.

[0016] As another example of the brittle plate processing apparatus of the present invention having the first feature, the rotating mechanism is a servo motor for controlling torque.

[0017] As another example of the brittle plate processing apparatus of the present invention having the first feature, the measuring unit includes: a mounting plate; a movable seat arranged to move freely relative to the mounting plate in a first direction orthogonal to the axis of the processing wheel; a moving mechanism that moves the movable seat in the first direction; and a laser measuring mechanism disposed on the movable seat and irradiating the processing surface of the processing wheel with a laser to measure the processing surface.

[0018] The control unit calculates the positional deviation of the machining wheel in the axial direction relative to the specified machining reference position based on the measured value measured by the laser measuring mechanism, and corrects the positional deviation of the machining wheel in the axial direction relative to the specified machining reference position, so that the machining wheel with the corrected positional deviation can perform machining on the outer periphery of the brittle plate.

[0019] As another example of the brittle plate processing apparatus of the present invention having the first feature, in the state where the laser measuring mechanism irradiates the processing surface of the processing wheel with a laser, the laser measuring mechanism measures the processing surface of the processing wheel by moving at least one of the processing wheel from one side to the other in the axial direction of the processing wheel.

[0020] The control unit calculates the position deviation in the axial direction of the processing wheel based on the maximum distance from the laser measuring mechanism to the processing surface of the processing wheel in the first direction as measured by the laser measuring mechanism and a predetermined processing reference position. The control unit then corrects the position deviation in the axial direction of the processing wheel based on the position deviation, so that the processing wheel with the corrected position deviation can process the outer periphery of the brittle plate.

[0021] As another example of the brittle plate processing apparatus of the present invention having the first feature, the laser measuring mechanism irradiates a predetermined area or the entire area of ​​the processing surface in the axial direction of the processing wheel with a laser to measure the processing surface of the processing wheel.

[0022] The control unit calculates the position deviation in the axial direction of the processing wheel based on the maximum distance from the laser measuring mechanism to the processing surface of the processing wheel in the first direction as measured by the laser measuring mechanism and a predetermined processing reference position. The control unit then corrects the position deviation in the axial direction of the processing wheel based on the position deviation, so that the processing wheel with the corrected position deviation can process the outer periphery of the brittle plate.

[0023] As a second feature of the present invention for solving the above-mentioned technical problems, a method for processing brittle plates is provided. This method utilizes a brittle plate processing apparatus, which includes: a worktable holding a brittle plate; a processing head having a processing wheel that processes the outer periphery of the brittle plate held on the worktable; a measuring unit that measures the positional deviation of the processing wheel relative to the brittle plate in the axial direction; and a control unit that corrects the positional deviation of the processing wheel in the axial direction based on the positional deviation measured by the measuring unit, and causes the corrected processing wheel to process the outer periphery of the brittle plate.

[0024] Methods for processing brittle plates include:

[0025] The measurement process involves measuring the positional deviation of the processing wheel relative to the brittle plate in the axial direction.

[0026] The correction process corrects the positional deviation in the axial direction of the machining wheel based on the positional deviation measured in the measurement process; and

[0027] The processing step involves using a processing wheel whose positional deviation has been corrected after the correction step to process the outer periphery of the brittle plate.

[0028] As a third feature of the present invention for solving the above-mentioned technical problems, a method for processing brittle plates is provided. This method utilizes a brittle plate processing apparatus, which includes: a worktable holding a brittle plate; a processing head having a processing wheel that processes the outer periphery of the brittle plate held on the worktable; a measuring unit measuring the positional deviation of the processing wheel relative to the brittle plate in the axial direction; and a control unit correcting the positional deviation of the processing wheel in the axial direction based on the positional deviation measured by the measuring unit, and causing the corrected processing wheel to process the outer periphery of the brittle plate. The measuring unit includes: a mounting plate; a movable seat arranged to move freely relative to the mounting plate in a first direction orthogonal to the axis of the processing wheel; a moving mechanism that moves the movable seat in the first direction; and a rotating mechanism disposed on the movable seat and having a shaft member including a top end portion.

[0029] Methods for processing brittle plates include:

[0030] The alignment process involves calibrating the shaft component to a specified position.

[0031] In the first measurement step, the shaft member is rotated in a first surrounding direction about its axis so that the top end contacts the machining surface of the machining wheel, and the first position of the top end contacting the machining surface of the machining wheel is measured.

[0032] In the second measurement step, the shaft member is rotated in a direction opposite to the first surrounding direction, i.e., a second surrounding direction, so that the top end contacts the machining surface of the machining wheel, and a second position on the machining surface of the machining wheel where the top end contacts is measured.

[0033] The process is calculated, the first distance in the axial direction of the machining wheel from the specified machining reference position to the first position is calculated, the second distance in the axial direction of the machining wheel from the specified machining reference position to the second position is calculated, and the position deviation in the axial direction of the machining wheel is calculated based on the first distance and the second distance.

[0034] The correction process involves correcting the positional deviation in the axial direction of the machining wheel based on the amount of positional deviation in the axial direction; and

[0035] The processing step involves the processing wheel, whose positional deviation has been corrected after the correction step, processing the outer periphery of the brittle plate.

[0036] As an example of the brittle plate processing apparatus of the present invention having a third feature, in the brittle plate processing method, the first measurement step, the second measurement step, the calculation step, and the correction step are repeatedly performed, so that the processing wheel whose positional deviation is corrected multiple times processes the outer periphery of the brittle plate.

[0037] As a fourth feature of the present invention for solving the above-mentioned technical problems, a method for processing brittle plates is provided. This method utilizes a brittle plate processing apparatus, which includes: a worktable holding a brittle plate; a processing head having a processing wheel that processes the outer periphery of the brittle plate held on the worktable; a measuring unit measuring the positional deviation of the processing wheel relative to the brittle plate in the axial direction; and a control unit correcting the positional deviation of the processing wheel in the axial direction based on the positional deviation measured by the measuring unit, and causing the corrected processing wheel to process the outer periphery of the brittle plate. The measuring unit includes: a mounting plate; a movable seat arranged to move freely relative to the mounting plate in a first direction orthogonal to the axis of the processing wheel; a moving mechanism that moves the movable seat in the first direction; and a laser measuring mechanism disposed on the movable seat and irradiating a laser onto the processing surface of the processing wheel to measure the processing surface.

[0038] Methods for processing brittle plates include:

[0039] The position alignment process involves calibrating the laser measuring mechanism to a specified position.

[0040] The measurement process involves irradiating the processing surface of the processing wheel with a laser from a laser measurement mechanism, and measuring the processing surface of the processing wheel.

[0041] The process is calculated, and the positional deviation in the axial direction of the processing wheel is calculated based on the measured values ​​obtained by the laser measuring mechanism.

[0042] The correction process involves correcting the positional deviation in the axial direction of the machining wheel based on the amount of positional deviation in the axial direction; and

[0043] The processing step involves the processing wheel, whose positional deviation has been corrected after the correction step, processing the outer periphery of the brittle plate.

[0044] As an example of the brittle plate processing apparatus of the present invention having a fourth feature, in the measurement step, while the laser measuring mechanism irradiates the processing surface of the processing wheel with a laser, the processing surface of the processing wheel is measured by moving at least one of the processing wheel and the laser measuring mechanism from one side to the other in the axial direction of the processing wheel.

[0045] In the calculation process, the positional deviation in the axial direction of the processing wheel is calculated based on the position where the distance from the laser measuring mechanism to the processing surface of the processing wheel reaches its maximum in the first direction as measured by the laser measuring mechanism, and the specified processing reference position.

[0046] As another example of the brittle plate processing apparatus of the present invention having the fourth feature, in the measurement step, the laser measuring mechanism irradiates a predetermined area or the entire area of ​​the processing surface in the axial direction of the processing wheel with a laser to measure the processing surface of the processing wheel.

[0047] In the calculation process, the positional deviation in the axial direction of the processing wheel is calculated based on the position where the distance from the laser measuring mechanism to the processing surface of the processing wheel reaches its maximum in the first direction as measured by the laser measuring mechanism, and the specified processing reference position.

[0048] Invention Effects

[0049] According to the brittle plate processing apparatus having the first feature, a brittle plate processing apparatus can be provided, wherein the measuring unit measures the positional deviation of the processing wheel relative to the brittle plate in the axial direction, and the control unit corrects the positional deviation of the processing wheel in the axial direction based on the positional deviation of the processing wheel measured by the measuring unit, so that the processing wheel with the corrected positional deviation performs processing on the outer periphery of the brittle plate. Therefore, when the positional alignment of the brittle plate and the processing wheel groove is performed manually without the need for multiple trials, the effort and time spent on manually aligning the processing wheel relative to the brittle plate after changing the processing wheel can be reduced, and the overall processing efficiency of brittle plates is high.

[0050] According to a brittle plate processing apparatus having a first feature, a brittle plate processing apparatus can be provided in which the control unit calculates a first distance in the axial direction of the processing wheel from a predetermined processing reference position to the first position, calculates a second distance in the axial direction of the processing wheel from the predetermined processing reference position to the second position, calculates a positional deviation in the axial direction of the processing wheel based on the first distance and the second distance, corrects the positional deviation in the axial direction of the processing wheel based on the positional deviation in the axial direction of the processing wheel, and the processing wheel with the corrected positional deviation performs processing on the outer periphery of the brittle plate. Therefore, when the position alignment of the brittle plate and the processing wheel groove is performed manually without the need for multiple trials, the effort and time spent on manually aligning the processing wheel relative to the brittle plate after changing the processing wheel can be reduced, resulting in higher overall processing efficiency for brittle plates.

[0051] According to another brittle plate processing apparatus having the first feature, a brittle plate processing apparatus can be provided that automatically and with higher precision corrects the position deviation of the processing wheel by alternately and repeatedly measuring the first position and the second position by the measuring unit and correcting the position deviation of the processing wheel in the axial direction by the control unit. The processing wheel with the corrected position deviation is then used to process the outer periphery of the brittle plate. Therefore, the effort and time spent on manually aligning the processing wheel with the brittle plate after changing the processing wheel can be reduced, and the overall processing efficiency of the brittle plate is higher.

[0052] According to another brittle plate processing apparatus having the first feature, since the rotating mechanism is a servo motor that controls the torque, the rotation (angle) of the rotating mechanism can be controlled and reliably stopped at the position where the top end of the shaft member contacts the processing surface. In addition, the position deviation of the processing wheel can be measured more accurately, and the position deviation of the processing wheel can be corrected with high precision.

[0053] According to another brittle plate processing apparatus having the first feature, a brittle plate processing apparatus can be provided in which the control unit calculates the positional deviation of the processing wheel in the axial direction relative to a predetermined processing reference position based on the measurement value measured by the laser measuring mechanism, corrects the positional deviation of the processing wheel in the axial direction relative to the predetermined processing reference position based on the positional deviation of the processing wheel in the axial direction, and enables the processing wheel with the corrected positional deviation to process the outer periphery of the brittle plate. Therefore, when the positional alignment of the brittle plate and the processing wheel groove is performed manually without the need for multiple trials, the effort and time spent on manually aligning the processing wheel relative to the brittle plate after changing the processing wheel can be reduced, resulting in higher overall processing efficiency for brittle plates.

[0054] According to another brittle plate processing apparatus having the first feature, when the laser measuring mechanism irradiates the processing surface of the processing wheel with a laser, at least one of the processing wheel and the laser measuring mechanism moves from one side to the other in the axial direction of the processing wheel. The laser measuring mechanism measures the processing surface of the processing wheel. The control unit calculates the positional deviation in the axial direction of the processing wheel based on the position where the distance from the laser measuring mechanism to the processing surface of the processing wheel in the first direction reaches its maximum, as determined by the laser measuring mechanism, and a predetermined processing reference position. The control unit corrects the positional deviation in the axial direction of the processing wheel based on the positional deviation in the axial direction of the processing wheel, so that the processing wheel with the corrected positional deviation performs the processing of the outer periphery of the brittle plate. Therefore, when the positional alignment of the brittle plate and the processing wheel groove is performed manually without the need for multiple trials, the effort and time spent on manually aligning the processing wheel relative to the brittle plate after changing the processing wheel can be reduced, resulting in higher overall processing efficiency for brittle plates.

[0055] According to another brittle plate processing apparatus with the first feature, a brittle plate processing apparatus can be provided, wherein the laser measuring mechanism irradiates a predetermined area or the entire area of ​​the processing surface in the axial direction of the processing wheel with a laser to measure the processing surface of the processing wheel; the control unit calculates the positional deviation in the axial direction of the processing wheel based on the position where the distance from the laser measuring mechanism to the processing surface of the processing wheel in the first direction reaches its maximum as measured by the laser measuring mechanism and a predetermined processing reference position; and corrects the positional deviation in the axial direction of the processing wheel based on the positional deviation in the axial direction of the processing wheel, so that the processing wheel with the corrected positional deviation performs the processing of the outer periphery of the brittle plate. Therefore, when the positional alignment of the brittle plate and the processing wheel groove is performed manually without the need for multiple trials, the effort and time spent on manually aligning the processing wheel relative to the brittle plate after changing the processing wheel can be reduced, resulting in higher overall processing efficiency for brittle plates.

[0056] According to the brittle plate processing method with the second feature, a brittle plate processing method can be provided, comprising: a measurement step, measuring the positional deviation of the processing wheel relative to the brittle plate in the axial direction; a correction step, correcting the positional deviation of the processing wheel in the axial direction based on the positional deviation measured in the measurement step; and a processing step, causing the processing wheel with the positional deviation corrected after the correction step to process the outer periphery of the brittle plate. Therefore, when the positional alignment of the brittle plate and the processing wheel groove is performed manually without requiring multiple trials, the effort and time spent on manually aligning the processing wheel relative to the brittle plate after changing the processing wheel can be reduced, resulting in higher overall processing efficiency for brittle plates.

[0057] According to the brittle plate processing method with a third feature, a brittle plate processing method can be provided, comprising: a position alignment step, calibrating the shaft member to a predetermined position; a first measurement step, rotating the shaft member in a first surrounding direction about its axis so that the top end contacts the processing surface of the processing wheel, and measuring a first position on the processing surface of the processing wheel where the top end contacts; a second measurement step, rotating the shaft member in a second surrounding direction opposite to the first surrounding direction so that the top end contacts the processing surface of the processing wheel, and measuring a second position on the processing surface of the processing wheel where the top end contacts; and a calculation step, calculating the axial direction of the processing wheel from the predetermined processing reference position to the first position. The first distance involves calculating a second distance along the axis of the machining wheel from the specified machining reference position to the second position, and calculating the positional deviation along the axis of the machining wheel based on the first and second distances. A correction process involves correcting the positional deviation along the axis of the machining wheel based on the positional deviation. A machining process then involves machining the outer periphery of the brittle plate using the machining wheel whose positional deviation has been corrected after the correction process. Therefore, since aligning the brittle plate with the machining wheel groove manually does not require multiple trials, the effort and time spent on manually aligning the machining wheel relative to the brittle plate after changing the machining wheel can be reduced, resulting in higher overall machining efficiency for the brittle plate.

[0058] According to a brittle plate processing method with a third feature, a brittle plate processing method can be provided in which the first measurement step, the second measurement step, the calculation step, and the correction step are repeatedly performed to automatically and with higher precision correct the positional deviation of the processing wheel. The processing wheel with the positional deviation corrected multiple times is then used to process the outer periphery of the brittle plate. Therefore, the effort and time spent on manually aligning the processing wheel with the brittle plate after changing the processing wheel can be reduced, and the overall processing efficiency of the brittle plate is higher.

[0059] According to the brittle plate processing method with the fourth feature, a brittle plate processing method can be provided, including: a position alignment step, in which the laser measuring mechanism is calibrated to a specified position; a measuring step, in which the laser of the laser measuring mechanism is irradiated onto the processing surface of the processing wheel, and the processing surface of the processing wheel is measured; a calculation step, in which the position deviation in the axial direction of the processing wheel is calculated based on the measured value measured by the laser measuring mechanism; a correction step, in which the position deviation in the axial direction of the processing wheel is corrected based on the position deviation in the axial direction of the processing wheel; and a processing step, in which the processing wheel with the position deviation corrected after the correction step processes the outer periphery of the brittle plate. Therefore, when the position alignment of the brittle plate and the processing wheel groove is performed manually without the need for multiple trials, the effort and time spent on the position alignment of the processing wheel relative to the brittle plate by manual means after changing the processing wheel can be reduced, and the overall processing efficiency of the brittle plate is high.

[0060] According to a brittle plate processing method with a fourth feature, a brittle plate processing method can be provided. In the measurement step, while the laser measuring mechanism irradiates the processing surface of the processing wheel with a laser, the processing surface of the processing wheel is measured by moving at least one of the processing wheel and the laser measuring mechanism from one side to the other in the axial direction of the processing wheel. In the calculation step, the positional deviation in the axial direction of the processing wheel is calculated based on the position where the distance from the laser measuring mechanism to the processing surface of the processing wheel in the first direction reaches its maximum as measured by the laser measuring mechanism and a predetermined processing reference position. Therefore, when the positional alignment of the brittle plate and the processing wheel groove is performed manually without the need for multiple trials, the effort and time spent on manually aligning the processing wheel relative to the brittle plate after changing the processing wheel can be reduced, resulting in higher overall processing efficiency for brittle plates.

[0061] According to another brittle plate processing method with a fourth feature, a brittle plate processing method can be provided. In the measurement step, the laser measuring mechanism irradiates a specified area or the entire area of ​​the processing surface in the axial direction of the processing wheel to measure the processing surface of the processing wheel. In the calculation step, based on the position where the distance from the laser measuring mechanism to the processing surface of the processing wheel in the first direction reaches its maximum as measured by the laser measuring mechanism, and the specified processing reference position, the position deviation in the axial direction of the processing wheel is calculated. Therefore, when the position alignment of the brittle plate and the processing wheel groove is performed manually without multiple tests, the effort and time spent on manually aligning the processing wheel relative to the brittle plate after changing the processing wheel can be reduced, resulting in higher overall processing efficiency for brittle plates. Attached Figure Description

[0062] Figure 1 This is a front view of a brittle plate processing apparatus as an example.

[0063] Figure 2 yes Figure 1 A partial, omitted top view illustration of the brittle plate processing apparatus shown.

[0064] Figure 3 yes Figure 1 The left side of the brittle plate processing apparatus shown is partially omitted.

[0065] Figure 4 yes Figure 1 An explanatory diagram of the processing head of the brittle plate processing apparatus shown.

[0066] Figure 5 It means that it was used. Figure 1 A flowchart of the brittle plate processing method shown in the diagram.

[0067] Figure 6 yes Figure 1 The diagram illustrates the operation of the measuring section of the brittle plate processing device.

[0068] Figure 7 yes Figure 1 The diagram illustrates the operation of the shaft components in the brittle plate processing device.

[0069] Figure 8 yes Figure 1 The diagram illustrates the measurement operation of the shaft component in the brittle plate processing device.

[0070] Figure 9 This is a front view of a brittle plate processing apparatus, as another example.

[0071] Figure 10 It means that it was used. Figure 9 A flowchart of the brittle plate processing method shown in the diagram. Detailed Implementation

[0072] Hereinafter, embodiments for carrying out the present invention will be described with reference to the accompanying drawings. In the drawings, the same or corresponding symbols are used to label the same or corresponding structures, and descriptions are omitted. Furthermore, the present invention is not limited to these embodiments.

[0073] Referring to the front view of the brittle plate processing apparatus 1 shown as an example, i.e. Figure 1 The details of the brittle plate processing apparatus of the present invention will be described below with reference to the accompanying drawings. Furthermore, Figure 2 This is a partially omitted top view illustration of the brittle plate processing device 1. Figure 3 This is a partial, omitted left-side illustration of the brittle plate processing device 1. Figure 4 This is an explanatory diagram of the processing head 7 of the brittle plate processing device 1. Figure 5 This is a flowchart illustrating a brittle plate processing method using the brittle plate processing apparatus 1. Figure 6 This is an instruction diagram illustrating the operation of the measuring unit 8 in the brittle plate processing apparatus 1. Figure 7 This is an operational diagram illustrating the shaft component 97 of the brittle plate processing device 1. Figure 8 This is a diagram illustrating the measuring operation of the shaft component 97 in the brittle plate processing device 1. Figure 1 The diagram omits the upstream side of the brittle plate processing apparatus 1, including components such as the brittle plate loading section, scribing section, and breaking section. Figure 2 The diagrams of the transverse support frame 13 of the base 3 and the processing head 7 are omitted. Figure 3 The diagrams of the worktable 4 and processing head 7, etc., are omitted. Figure 1 In the diagram, the X-axis represents the transport direction of the brittle plate 2, the Z-axis represents the up-down direction, and the Y-axis represents the direction orthogonal to both the X-axis and Z-axis.

[0074] Figures 1 to 3The brittle plate processing apparatus 1, as an example, includes a base 3, a worktable 4, a processing head 7, a measuring unit 8, and a control unit 9. The worktable 4 is disposed on the base 3 and holds the brittle plate 2 from its lower surface. The brittle plate 2 is a rectangular flat plate with a predetermined area defined in the XY plane. The processing head 7 has a processing wheel 6 for processing the outer periphery 5 of the brittle plate 2 held on the worktable 4. The measuring unit 8 measures the positional deviation Δ of the processing wheel 6 relative to the brittle plate 2 in the axial direction of the processing wheel 6, i.e., the Z-axis direction orthogonal to the XY plane. The control unit 9 corrects the positional deviation Δ of the processing wheel 6 in the Z-axis direction based on the positional deviation Δ measured by the measuring unit 8, so that the processing wheel 6 with the corrected positional deviation processes the outer periphery 5 of the brittle plate 2.

[0075] In this example, the brittle plate 2 can be any brittle plate used in automobiles, LCD TVs, solar cells, furniture, and buildings. There are many types of brittle plates 2, such as glass plates, silicon carbide plates, and silicon substrates.

[0076] In this example, the brittle plate 2 is a rectangular flat plate. However, as an alternative, the brittle plate 2 can also be any shape such as ellipse, circle, polygon, square, or rectangle. In addition, the brittle plate 2 only needs to have a specified area and a specified thickness.

[0077] The base 3 includes a main body 11, a pair of portal frames 12 and a transverse support frame 13. The main body 11 is placed on the ground 10. The pair of portal frames 12 are erected on the upper surface of the main body 11 and at both ends in the transport direction of the brittle plate 2, i.e., the X-axis direction. The transverse support frame 13 is mounted on the pair of portal frames 12 and extends in the X-axis direction.

[0078] A worktable 4 is provided on the upper surface of the main body 11, a measuring part 8 is provided in one of the pair of portal frames 12A, and a processing head 7 is provided in the transverse support frame 13.

[0079] The worktable 4 includes multiple suction cups 21, suction cup bases 22, a Y-axis moving mechanism 23, and a cable drag chain (registered trademark) 24. The multiple suction cups 21 adsorb and hold the brittle plate 2 from the lower surface of the brittle plate 2. The suction cup bases 22 are used to hold the multiple suction cups 21. The Y-axis moving mechanism 23 guides and moves the suction cup bases 22 in the Y-axis direction, which is orthogonal to the X-axis direction. The cable drag chain 24 is electrically connected to the Y-axis moving mechanism 23.

[0080] In this example, the brittle plate 2 is supported by multiple suction cups 21; however, alternatively, the brittle plate 2 can also be supported by a single suction cup 21.

[0081] The Y-axis moving mechanism 23 includes two guide rails 25, a slider 26, a feed screw 27, and a Y-axis control motor (not shown). Among them, the two guide rails 25 extend in the Y-axis direction and are laid parallel to each other in the Y-axis direction. The slider 26 is installed on each guide rail 25 so as to be freely movable in the Y-axis direction and is installed on the lower surface of the suction cup seat 22. The feed screw 27 is screwed to a nut (not shown) fixed to the lower surface of the suction cup seat 22 and is disposed between the pair of guide rails 25. The Y-axis control motor rotates the feed screw 27.

[0082] By the operation of the Y-axis control motor, the feed screw 27 rotates, so that the suction cup seat 22 moves in the Y-axis direction.

[0083] Refer to Figure 4 of (a) to Figure 4 of (c) to describe the details of the processing head 7. In addition, Figure 4 of (a) is a partial omitted front view of the processing head 7, Figure 4 of (b) is a partial omitted side view of the processing head 7, Figure 4 of (c) is a partial omitted top view of the processing head 7.

[0084] The processing head 7 includes a processing wheel 6 of a round-edge type (Japanese: ペンシルエッジ型), a rotating mechanism 31, a cutting amount adjusting mechanism 32, an X-axis moving mechanism 33, a Z-axis moving mechanism 34, a swiveling mechanism 36, and a base 39. Among them, the processing wheel 6 processes the outer peripheral edge 5 of the brittle plate 2. The rotating mechanism 31 has an output rotating shaft, and the processing wheel 6 is installed at the lower end in the Z-axis direction of the output rotating shaft. The output rotating shaft rotates the processing wheel 6 around the axis C1. The cutting amount adjusting mechanism 32 adjusts the cutting amount of the processing wheel 6 with respect to the brittle plate 2. The X-axis moving mechanism 33 moves the processing wheel 6 in the X-axis direction. The Z-axis moving mechanism 34 moves the processing wheel 6 in the Z-axis direction. The swiveling mechanism 36 has a swivel shaft 35 that swivels the processing wheel 6 around the axis C2. The base 39 is installed on a swivel shaft holder 38 at the lower end portion 37 of the swivel shaft 35 of the swiveling mechanism 36.

[0085] The processing wheel 6 includes a disk-shaped main body 41 and a processing surface 42 containing diamond abrasive grains and the like. In addition, the processing wheel 6 grinds or polishes the brittle plate 2 or grinds and polishes the brittle plate 2 (hereinafter referred to as processing) through the processing surface 42.

[0086] The processing head 7 and the brittle plate 2 are numerically controlled by the control unit 9 and move in the XY plane coordinate system. Angle control is performed so that the processing wheel 6 always faces the normal direction with respect to the outer peripheral edge 5 of the brittle plate 2, and the outer peripheral edge 5 of the brittle plate 2 is processed around the outer periphery of the brittle plate 2.

[0087] The rotating mechanism 31 is a spindle motor with an output shaft 46. A machining wheel 6 is mounted on the lower end 45 of the output shaft 46 in the Z-axis direction. Driven by the spindle motor, the machining wheel 6 rotates in the R1 direction around the axis of the output shaft 46 with the rotation axis C1 as the center.

[0088] The cut-in amount adjustment mechanism 32 includes two cut-in sliding members 51, an X-axis sliding seat 52, a feed screw 54, a cut-in gear 55, and a cut-in servo motor 58. The two cut-in sliding members 51 are mounted on the base 39 and extend in the X-axis direction and are laid parallel to each other. The X-axis sliding seat 52 is mounted on each cut-in sliding member 51 in a manner that allows it to move freely relative to each other in the X-axis direction. The feed screw 54 is screwed into a nut 53 fixed to the X-axis sliding seat 52. The cut-in gear 55 is mounted on the feed screw 54. The cut-in servo motor 58 has a cut-in gear 56 that meshes with the cut-in gear 55 and is mounted on the base 39 via a bracket 57, and adjusts the cut-in amount.

[0089] The control unit 9 operates the infeed servo motor 58, which rotates the feed screw 54 via the infeed gear 55 and the infeed gear 56, causing the X-axis sliding block 52 to move in the X-axis direction, thereby adjusting the infeed amount of the processing wheel 6 against the brittle plate 2.

[0090] By adjusting the depth of cut mechanism 32, the peripheral end face (machining surface 42) of machining wheel 6 is aligned with the rotation axis C2 of rotary shaft 35.

[0091] The X-axis moving mechanism 33 includes an X-axis moving base 61, a pair of guide rails 63, a slider (not shown), a nut (not shown), a feed screw 64, and an X-axis servo motor 67. The X-axis moving base 61 is equipped with a machining head 7. The pair of guide rails 63 are mounted on the side 62 of the transverse support frame 13 and extend parallel to each other in the X-axis direction. The slider is freely slidably fitted into the pair of guide rails 63 and fixed to the back of the X-axis moving base 61. The nut is mounted on the X-axis moving base 61. The feed screw 64 is disposed between the pair of guide rails 63 and screwed with a nut. The X-axis servo motor 67 has an output shaft 66. The feed screw 64 is connected to the output shaft 66 through a bearing 65.

[0092] The machining head 7 is integrated with the X-axis moving seat 61 in the X-axis direction through the X-axis moving mechanism 33 and moves linearly. The linear movement of the X-axis moving seat 61 in the X-axis direction is driven by the X-axis servo motor 67, which rotates the feed screw 64 through the bearing 65, so that the X-axis moving seat 61 moves in the X-axis direction.

[0093] The Z-axis moving mechanism 34 includes two guide rails 71, a Z-axis sliding seat 72, a feed screw 74, a gearbox 75, and a Z-axis servo motor 77. The two guide rails 71 are mounted on the X-axis sliding seat 52 and extend in the Z-axis direction and are laid parallel to each other. The Z-axis sliding seat 72 is mounted on each guide rail 71 in a freely movable manner and is mounted in a manner that allows free relative movement with respect to the X-axis sliding seat 52 in the Z-axis direction. The feed screw 74 is screwed into a nut 73 fixed to the X-axis sliding seat 52. The gearbox 75 is connected to the feed screw 74. The Z-axis servo motor 77 has an output shaft 76 connected to the gearbox 75 and adjusts the position of the machining wheel 6 in the Z-axis direction.

[0094] The control unit 9 activates the Z-axis servo motor 77, rotates the feed screw 74, moves the Z-axis slide block 72 in the Z-axis direction, and moves the machining wheel 6 in the Z-axis direction.

[0095] The positional deviation of the machining wheel 6 in the axial direction is corrected by adjusting the Z-axis moving mechanism 34.

[0096] The rotary mechanism 36 includes a rotary servo motor 81, a gearbox 82, a rotary shaft 35, and a bearing housing 85. The rotary servo motor 81 causes the processing head 7 to rotate around the axis C2. The gearbox 82 is connected to the output shaft of the rotary servo motor 81. The rotary shaft 35 has a rotary gear 84 that meshes with the rotary gear 83 of the gearbox 82. The bearing housing 85 keeps the rotary shaft 35 in a free-rotating position.

[0097] The rotary mechanism 36 is mounted on the X-axis moving seat 61 that moves along the X-axis, and the rotary shaft 35 is assembled such that its axis C2 is orthogonal to the XY plane coordinate system, i.e., the upper surface of the brittle plate 2.

[0098] The processing head 7 is mounted on the rotary shaft 35 of the rotary mechanism 36 via the base 39, forming an integral part with the rotary shaft 35, and rotates horizontally with the axis C2 of the rotary shaft 35 as the center, and the angle is controlled in the R2 direction around the axis C2.

[0099] The measuring unit 8 includes a mounting plate 91, a Z-axis moving seat 92, a Z-axis moving mechanism 93, an X-axis moving seat 94, an X-axis moving mechanism 95, a rotation mechanism 98, and a position measuring sensor 99. The mounting plate 91 is mounted on the side of one of the pairs of frames 12, frame 12A. The Z-axis moving seat 92 is mounted on the mounting plate 91 so as to move freely in the Z-axis direction. The Z-axis moving mechanism 93 moves the Z-axis moving seat 92 in the Z-direction. The X-axis moving seat 94 is mounted on the mounting plate 91 so as to move freely in the X-direction direction. The X-axis moving mechanism 95 moves the X-axis moving seat 94 in the X-axis direction, which is a first direction orthogonal to the axis C1 of the machining wheel 6. The rotation mechanism 98 is provided on the X-axis moving seat 94 and has a shaft member 97 with a top end portion 96. The position measuring sensor 99 measures the position of the machining surface 44 of the machining wheel 6.

[0100] Z-axis moving base 92 includes base 101, plate member 104 and plate portion 107, wherein plate member 104 is mounted on base 101 and has flange portion 103 extending from one end 102 in the Z-axis direction in the Y-axis direction, and plate portion 107 has groove 106 for fitting the top end portion 105 of flange portion 103 in the Y-axis direction.

[0101] In this example, in the plate member 104, the flange portion 103 is integrally formed with one end 102 of the plate member 104 in the Z-axis direction.

[0102] The Z-axis moving mechanism 93 includes a guide rail (not shown), a sliding block (not shown), a feed screw (not shown), and a Z-axis control motor 108. The guide rail extends in the Z-axis direction and is laid parallel to each other. The sliding block is mounted on each guide rail (not shown) in a manner that allows it to move freely in the Z-axis direction and is mounted on the Z-axis moving seat 92. The feed screw is screwed into a nut (not shown) fixed to the lower surface of the Z-axis moving seat 92. The Z-axis control motor 108 causes the feed screw to rotate.

[0103] The X-axis moving base 94 is formed by a plate portion 111 extending in the X-axis direction and having a specified area, and a cable drag chain mounting plate 113 for mounting the cable drag chain 112 is mounted on the plate portion 111.

[0104] The X-axis moving mechanism 95 includes a rodless cylinder 123, a rodless cylinder connecting plate 124, a guide rail 125, and a guide block 126. The rodless cylinder 123 is mounted on a surface 109 of the plate portion 107 in the Y-axis direction and has a sliding member 121 that can move freely in the X-axis direction. The rodless cylinder connecting plate 124 is connected to the sliding member 121 and to the plate portion 111. The guide rail 125 is laid on the other surface 110 of the plate portion 107 in the Y-axis direction and extends in the X-axis direction. The guide block 126 is mounted on the guide rail 125 in a manner that allows free movement in the X-axis direction and is mounted on a surface 115 of the plate portion 111 in the Y-axis direction.

[0105] Driven by the rodless cylinder 123, the X-axis moving mechanism 95 causes the plate portion 111 to move in the X-axis direction via the rodless cylinder connecting plate 124 connected to the sliding member 121.

[0106] The rotating mechanism 98 includes a servo motor 133, a shaft member 97, a coupling 134, and a bearing housing 135. The servo motor 133 is mounted on the other side 116 of the plate portion 111 in the Y-axis direction via a bracket 131 and has an output shaft 132, and controls the torque. The shaft member 97 has a top end portion 96. The coupling 134 connects the output shaft 132 to the shaft member 97. The bearing housing 135 is mounted on the other side 116 of the plate portion 111 in the Y-axis direction and supports the shaft member 97 for free rotation.

[0107] In this example, the axis of shaft member 97 and the axis of output shaft 132 of servo motor 133 are arranged on axis C3 (coaxial).

[0108] Driven by the servo motor 133, the rotating mechanism 98 causes the shaft component 97 to rotate along the R3 direction around the axis of the shaft center C3 via the coupling 134.

[0109] The shaft component 97 includes a shaft body 141, a cutout portion 143, a top end portion 96, and a fixing mechanism 144. The shaft body 141 extends in the X-axis direction. The cutout portion 143 is disposed at one end 142 of the shaft body 141 in the X-axis direction. The top end portion 96 is inserted into and clamped in the cutout portion 143. The fixing mechanism 144 fixes the top end portion 96 to the shaft body 141.

[0110] The top portion 96 includes a rectangular top portion body 152 and a top portion cutout 154, wherein the top portion body 152 is formed of a hard material and has a through hole 151, and the top portion cutout 154 is formed at the end 153 in the axial direction C3 of the top portion body 152.

[0111] The top portion 96 can be formed of any hard material; in this example, the top portion 96 is formed of stainless steel.

[0112] The fixing mechanism 144 is formed by a screw body 161 with a male threaded portion (not shown) formed on the outer peripheral surface and a head 162 provided at one end of the screw body 161. A female threaded portion (not shown) is formed on the inner peripheral surface defining the through hole 151 of the shaft member 97. In the fixing mechanism 144, the screw body 161 passes through the through hole 151, and the male threaded portion engages with the female threaded portion of the through hole, thereby fixing the top end 96 to the shaft member 97.

[0113] The position measurement sensor 99 includes a contact sensor 172 and a limiting member 174. The contact sensor 172 is mounted on the other side 116 of the plate portion 111 in the Y-axis direction via a bracket 171. The limiting member 174 is mounted on the other side 116 of the plate portion 111 in the Y-axis direction via a bracket 171 and contacts one side 173 of the flange portion 103 in the Y-axis direction.

[0114] Under the action of the rodless cylinder 123, the X-axis moving seat 94 moves in one direction of the X-axis, namely the X1 direction. First, the contact sensor 172 contacts the side 173 of the flange portion 103 in the X1 direction. Then, the X-axis moving seat 94 moves further in the X1 direction, so that the limiting member 174 contacts the side 173 of the flange portion 103. Then, the movement of the X-axis moving seat 94 in the X1 direction stops.

[0115] With the contact sensor 172 and the limiting member 174 in contact with the side 173 of the flange portion 103, the X-axis moving seat 94 is subjected to force in the X1 direction under the elastic force formed by the air pressure generated by the rodless cylinder 123.

[0116] The contact sensor 172 is connected to the control unit 9. When the processing head 7 moves in the X2 direction, the control unit 9 causes the X-axis moving seat 94 to move in the X2 direction. During the movement of the X-axis moving seat 94 in the X2 direction, when the movement amount preset in the contact sensor 172 is reached, the control unit 9 stops the movement of the processing head 7 in the X1 direction.

[0117] In this example, the contact sensor 172 is a contact sensor; however, alternatively, it could be a digital dial indicator or a laser displacement sensor that detects displacement by means of electricity or optics, or it could be a non-contact sensor.

[0118] By adjusting the amount of protrusion of the limiting member 174 in the X1 direction from the bracket 171, the distance between the limiting member 174 and the side 173 of the flange portion 103 before contact can be adjusted.

[0119] The control unit 9 includes an arithmetic processing unit 181 such as a CPU (Central Processing Unit) and a storage unit 182 such as flash memory. For example, the control unit 9 can be a computer (PC) such as a microprocessor, or it can be a virtual server built in the cloud or a physical computer set up in a machine room, etc. Furthermore, the control unit 9 can be composed of a single computer, multiple computers working together, or a collection of computer resources, i.e., the cloud.

[0120] The control unit 9 is connected to the worktable 4, processing head 7, measuring unit 8, and motors, rodless cylinders, cable carriers, etc., required to drive the brittle plate processing device 1, and controls them through pre-programmed numerical control commands. Since such a control unit 9 is known, its detailed description is omitted.

[0121] Storage unit 182 is a storage medium including ROM (Read-Only Memory), RAM (Random Access Memory), and hard disk drive, etc. Storage unit 182 pre-stores the program executed by control unit 9. Storage unit 182 may also be provided outside of brittle plate processing apparatus 1, in which case data can be transmitted between it and control unit 9 via network.

[0122] In this example, the worktable 4, the processing head 7, and the measuring unit 8 are controlled numerically independently of each other. In addition, the worktable 4, the processing head 7, and the measuring unit 8 can also be controlled numerically synchronously.

[0123] Next, refer to Figures 5 to 8 The following describes a method for processing brittle sheet 2 using a brittle sheet processing apparatus 1. The following operations of the brittle sheet processing apparatus 1 are controlled by a control unit 9. Furthermore, Figure 5 This is a flowchart illustrating a brittle plate processing method using the brittle plate processing apparatus 1 in this example to process the brittle plate 2.

[0124] like Figure 5As shown, the brittle plate processing method includes: a position alignment step S101, calibrating the shaft member 97 to a specified position; a first measurement step S102, rotating the shaft member 97 in a first surrounding direction (R4) around the axis of the shaft center C3 so that the top end 96 contacts the processing surface 42 of the processing wheel 6, and measuring the first position A on the processing surface 42 of the processing wheel 6 where the top end 96 contacts; and a second measurement step S103, rotating the shaft member 97 in a second surrounding direction (R5) opposite to the first surrounding direction (R4) around the axis of the shaft center C3 so that the top end 96 contacts the processing surface 42 of the processing wheel 6, and measuring the first position A on the processing surface 42 of the processing wheel 6 where the top end 96 contacts. The second position B on the processing surface 42 is measured; in step S104, the first distance D3 in the Z-axis direction of the processing wheel 6 from the specified processing reference position B1 to the first position A is calculated, and the second distance D4 in the Z-axis direction of the processing wheel 6 from the specified processing reference position B1 to the second position B is calculated, and the position deviation Δ of the processing wheel 6 relative to the brittle plate 2 in the Z-axis direction is calculated based on the first distance D3 and the second distance D4; in step S105, the position deviation of the processing wheel 6 in the Z-axis direction is corrected based on the position deviation Δ of the processing wheel 6 in the Z-axis direction; and in step S106, the processing wheel 6 after the correction step is used to process the outer periphery 5 of the brittle plate 2.

[0125] First, as part of the positioning alignment process S101, the brittle plate 2 to be processed is placed on top of the worktable 4. The brittle plate 2 is vacuum-adsorbed and supported by the suction cup 21 of the worktable 4, thereby positioning the brittle plate 2.

[0126] The Z-axis moving mechanism 93 moves the Z-axis moving seat 92 in the Z-axis direction, aligning the position of the axis C3 of the shaft member 97 with the specified machining reference position B1. In this example, the specified machining reference position B1 is the position that divides the brittle plate 2 in two along the Z-axis direction (the thickness direction of the brittle plate 2).

[0127] like Figure 6 (a) and Figure 6 As shown in (b), the X-axis moving mechanism 95 is driven to move the X-axis moving seat 94 in the X1 direction, causing the shaft member 97, which is aligned with the machining reference position B1, to move in the X1 direction, causing the contact sensor 172 to contact the side surface 173 of the flange portion 103, causing the X-axis moving seat 94 to move further in the X1 direction, causing the limiting member 174 to contact the side surface 173 of the flange portion 103, and stopping (restricting) the movement of the X-axis moving seat 94 in the X1 direction.

[0128] like Figure 6 (b) and Figure 6As shown in (c), when the contact sensor 172 is in contact with the side surface 173 of the flange portion 103 and the limiting member 174 is in contact with the side surface 173 of the flange portion 103 and the movement of the X-axis moving seat 94 in the X1 direction is stopped (restricted), the machining wheel 6 is moved in the X2 direction by the X-axis moving mechanism 33, so that the machining surface 42 of the machining wheel 6 gradually approaches the shaft member 97.

[0129] The control unit 9 gradually moves the machining wheel 6 in the X2 direction, so that the machining surface 42 of the machining wheel 6 contacts the end 153 of the top body 152. Under the action of the opposing force of the air pressure in the X1 direction of the rodless cylinder 123, i.e. in the X2 direction, the machining wheel 6 moves further in the X2 direction.

[0130] The machining wheel 6 moves in the X2 direction while the end 153 of the top body 152 is in contact with the machining surface 42.

[0131] When the horizontal distance D1 that the contact sensor 172 moves from the side 173 of the flange portion 103 in the X2 direction under the action of the processing wheel 6 reaches the movement amount preset in the contact sensor 172, the control unit 9 stops the movement of the processing wheel 6 in the X2 direction.

[0132] At this time, the machining surface 42 of the machining wheel 6 is kept in contact with the end 153 of the top body 152. The horizontal distance D1 that the contact sensor 172 moves in the X2 direction is equal to the horizontal distance D2 that the machining wheel 6 moves in the X2 direction.

[0133] After the movement of the machining wheel 6 in the X2 direction stops, while maintaining the machining surface 42 of the machining wheel 6 in contact with the end 153 of the top body 152, the machining wheel 6 is moved in the X1 direction according to the movement amount preset in the contact sensor 172.

[0134] Therefore, the control unit 9 measures the position where the machining surface 42 contacts the end 153 of the top body 152 and obtains position information.

[0135] In order to make the machining surface 42 of the machining wheel 6 face each other with the end 153 of the top body 152 across a specified gap S1, the machining wheel 6 is moved further in the X1 direction.

[0136] like Figure 7 As shown, in this example, the specified gap S1 is simply the degree to which the end 153 of the top body 152 does not contact the machining surface 42 of the machining wheel 6. The gap S1 is preferably about 0.1 mm to 0.5 mm, and more preferably 0.3 mm. The gap S1 can be changed according to the shape of the machining surface 42.

[0137] The end 153 of the top body 152 is located within the annular space S2 defined by the radial outer contour of the machining wheel 6 and the machining surface 42.

[0138] Next, refer to Figure 8 (a1) to (a3) ​​and Figure 8 Sections (b1) to (b3) provide details of the measurement operation of shaft member 97. Additionally, Figure 8 (a1) to (a3) ​​are partially omitted sectional views of shaft member 97. Figure 8 (b1) to (b3) are partial omitted side views of the top part 96.

[0139] As the first measuring step S102, such as Figure 8 (a1) and (a2) and Figure 8 As shown in (b1) and (b2), the measuring unit 8 rotates the shaft member 97 in the R4 direction so that the end 153 of the top body 152 contacts the machining surface 42 of the machining wheel 6, and measures the position coordinates of the first position A where the end 153 of the top body 152 rotates in the R4 direction and contacts the machining surface 42 of the machining wheel 6.

[0140] Next, as Figure 8 (a3) and Figure 8 As shown in (b3), as the second measurement step S103, the measuring unit 8 rotates the shaft member 97 in the R5 direction so that the end 153 of the top body 152 contacts the machining surface 42 of the machining wheel 6, and measures the position coordinates of the second position B where the end 153 of the top body 152 rotates in the R5 direction and contacts the machining surface 42 of the machining wheel 6.

[0141] Next, as a calculation process S104, the control unit 9 calculates a first distance D3 in the Z-axis direction from the predetermined machining reference position B1 to the machining wheel 6 at the first position A, and calculates a second distance D4 in the Z-axis direction from the predetermined machining reference position B1 to the machining wheel 6 at the second position B. For example, the first distance D3 is calculated based on the angle θ1 formed by the top body 152 and the machining reference position B1 and the length h1 in the Y-axis direction of the top body 152, and the second distance D4 is calculated based on the angle θ2 formed by the top body 152 and the machining reference position B1 and the length h1 in the Y-axis direction of the top body 152. Furthermore, the angles θ1 and θ2 can also be calculated by the servo motor 133.

[0142] The positional deviation Δ of the processing wheel 6 relative to the brittle plate 2 in the Z-axis direction is calculated based on the first distance D3 and the second distance D4.

[0143] The position deviation amount Δ is calculated in the arithmetic processing unit 181. In the calculation of the arithmetic processing unit 181, for example, when D3 < D4, the position deviation amount Δ is obtained according to the position deviation amount Δ (correction amount) = ((D3+D4) / 2-D3).

[0144] Next, as a correction process S105, the control unit 9 drives the Z-axis moving mechanism 34 according to the position deviation amount Δ calculated by the calculation processing unit 181, so that the machining wheel 6 moves in the other direction of the Z-axis, namely the Z2 direction (upward), thereby correcting the position deviation of the machining wheel 6 in the Z-axis direction (from the specified machining reference position B1 of the brittle plate 2 to the position B2 that divides the machining surface 42 of the machining wheel 6 in two in the Z-axis direction).

[0145] Next, as a processing step S106, the processing wheel 6, after the positional deviation has been corrected, processes the outer periphery 5 of the brittle plate 2.

[0146] According to the brittle plate processing method in this example, at the processing surface 42 of the processing wheel 6, the shaft member 97 of the rotating mechanism 31 with a top end 96 is inserted into the annular space S2, and the shaft member 97 is rotated in the R4 and R5 directions. The position coordinates (first position A and second position B) of the top end 96 contacting the processing surface 42 of the processing wheel 6 are measured respectively. Based on these position coordinates, the position deviation Δ of the processing wheel 6 in the Z-axis direction, calculated from the processing reference position B1, is automatically calculated by the control unit 9. Thus, the position deviation in the Z-axis direction of the processing wheel 6 can be automatically corrected. Therefore, for example, the position alignment of the processing wheel 6, which is manually performed each time the processing wheel 6 is changed, can be automated. This reduces the effort and time spent on the position alignment of the processing wheel 6 relative to the brittle plate 2, which is performed manually after the processing wheel 6 is changed, and improves the overall processing efficiency of the brittle plate.

[0147] According to another example of this embodiment, in the brittle plate processing method, by repeatedly performing the first measurement step S102, the second measurement step S103, the calculation step S104, and the correction step S105, the positional deviation Δ of the processing wheel 6 relative to the brittle plate 2 in the Z-axis direction can be made infinitely close to 0. This eliminates the positional deviation of the processing wheel 6 in the Z-axis direction and allows the processing surface 42 of the repeatedly corrected processing wheel 6 to make high-precision contact with the brittle plate 2, enabling high-precision processing of the brittle plate 2. In another example of this embodiment, in the brittle plate processing method, it is preferable to repeat the process two to five times in the order of each step from the first measurement step S102 to the correction step S105. More preferably, it is preferable to repeat the process three times in the order of each step from the first measurement step S102 to the correction step S105, thereby making the positional deviation Δ of the processing wheel 6 relative to the brittle plate 2 in the Z-axis direction infinitely close to 0. In addition, in order to reduce the positional deviation of the processing wheel 6 relative to the brittle plate 2 in the Z-axis direction, the process can be repeated in the following order: first measurement step S102, second measurement step S103, calculation step S104, and correction step S105.

[0148] According to another example of this case, in the brittle plate processing method, for the processing wheel 6 whose positional deviation in the Z-axis direction is corrected after the correction process S105, or for the processing wheel 6 whose positional deviation is corrected multiple times by repeating the process from the first measurement process S102 to the correction process S105, the control unit 9 drives the X-axis moving mechanism 95 to move the X-axis moving seat 94 in the X1 direction, so that the shaft member 97, which is aligned with the processing reference position B1, moves in the X1 direction, so that the contact sensor 172 and the limiting member 174 come into contact with the side surface 173 of the flange portion 103. The movement of the X-axis moving seat 94 in the X1 direction is stopped (restricted). While the movement of the X-axis moving seat 94 in the X1 direction is stopped (restricted), the machining wheel 6 is moved in the X2 direction via the X-axis moving mechanism 33. The machining surface 42 of the machining wheel 6 gradually approaches (moves) the shaft member 97, bringing it into contact with the end 153 of the top body 152. Under the action of a counterforce against the air pressure in the X1 direction from the rodless cylinder 123, i.e., in the X2 direction, the machining wheel 6 moves further in the X2 direction. When the sensor 172 moves from the side 175 of the flange 103... When the horizontal distance D1 moved in the X2 direction reaches the preset movement amount in the contact sensor 172, the movement of the machining wheel 6 in the X2 direction stops. After the movement of the machining wheel 6 in the X2 direction stops, while maintaining the contact between the machining surface 42 of the machining wheel 6 and the end 153 of the top body 152, the machining wheel 6 is moved in the X1 direction according to the preset movement amount in the contact sensor 172. The control unit 9 then measures the contact position between the machining surface 42 of the machining wheel 6 and the end 153 of the top body 152, where the positional deviation in the Z-axis direction has been corrected, and obtains the position... The position information, along with preset values ​​in the control unit 9 such as the dimensions of the machining wheel 6, shaft member 97, and top end 96, enables the machining surface 42 of the machining wheel 6 to make precise contact with the outer periphery 5 of the brittle plate 2. Therefore, in the brittle plate machining method, the machining wheel 6, whose position deviation in the Z-axis direction has been corrected after the correction process S105, or the machining wheel 6, whose position deviation has been corrected multiple times by repeating the process from the first measurement process S102 to the correction process S105, can precisely cut into the brittle plate 2.

[0149] Referring to the front view of the brittle plate processing apparatus 200, which is shown as another example, Figure 9 The details of the brittle plate processing apparatus 200 of the present invention will be described below with reference to the accompanying drawings. Figure 10 This is a flowchart illustrating the brittle plate processing method of the brittle plate processing apparatus 200. Furthermore, Figure 9 The brittle plate processing device 200 shown is Figure 1The difference in the brittle plate processing apparatus is that a laser measuring mechanism 201 is used instead of a rotating mechanism 98 and a position measuring sensor 99. This is because the other structures of the brittle plate processing apparatus 200 are different from those in the previous one. Figure 1 The brittle plate processing device 1 is the same as that used in the previous one, therefore, the markings are the same. Figure 1 Same symbols and reference Figure 1 The description is omitted here, thus deleting detailed descriptions of other structures of the brittle plate processing device 1.

[0150] The laser measuring mechanism 201 is set on the X-axis moving seat 94 and irradiates the machining surface 42 of the machining wheel 6 with a laser to measure the machining surface 42.

[0151] The measuring range of the laser measuring mechanism 201 varies depending on its type. For example, the mid-range model (CL-L070 / CL-P070) of the Keyence CL-3000 series has a measuring range of 70mm ± 10mm; the mid-range model (LJ-G080) of the LJ-G5000 series has a measuring range of 80mm ± 23mm; and the high-precision model (LJ-G030) of the LJ-G5000 series also has a measuring range of 80mm ± 23mm. However, the type of laser measuring mechanism 201 is not particularly limited to these specifications, and can be appropriately selected and used according to the application.

[0152] In addition, the laser measuring mechanism 201 can perform various measurements such as height (peak height, bottom height, average height), width, position, layer difference, angle, intersection, shape, cross-sectional area, and shape comparison. Furthermore, it can perform instantaneous measurements on a specified area or the entire area. In this example, it can measure the position where the distance in the X-axis direction between the laser measuring mechanism 201 and the processing surface 42 of the processing wheel 6 reaches its maximum.

[0153] The control unit 9 calculates the position where the distance between the laser measuring mechanism 201 and the processing surface 42 of the processing wheel 6 reaches its maximum based on the measured value measured by the laser measuring mechanism 201. Based on the position where the distance between the laser measuring mechanism 201 and the processing surface 42 of the processing wheel 6 reaches its maximum (center B2 in the Z-axis direction of the processing wheel 6) and the processing reference position B1, the control unit 9 calculates the position deviation Δ in the Z-axis direction of the processing wheel 6. Based on the position deviation Δ in the Z-axis direction of the processing wheel 6, the control unit 9 corrects the position deviation in the Z-axis direction of the processing wheel 6, so that the processing wheel 6 with the corrected position deviation can process the outer periphery 5 of the brittle plate 2.

[0154] Next, refer to Figure 10The brittle plate processing method for processing the brittle plate 2 using the brittle plate processing apparatus 200 of this example will be described. The following operations of the brittle plate processing apparatus 200 are controlled by the control unit 9. Furthermore, Figure 10 This is a flowchart illustrating a brittle plate processing method using the brittle plate processing apparatus 200 in this example to process the brittle plate 2.

[0155] like Figure 10 As shown, the brittle plate processing method includes: a position alignment step S201, in which the laser measuring mechanism 201 is calibrated to a specified position; a measuring step S202, in which the laser of the laser measuring mechanism 201 is irradiated onto the processing surface 42 of the processing wheel 6 to measure the processing surface 42 of the processing wheel 6; a calculation step S203, in which the position deviation Δ of the processing wheel 6 in the Z-axis direction is calculated based on the measured value of the laser measuring mechanism 201; a correction step S204, in which the position deviation Δ of the processing wheel 6 in the Z-axis direction is corrected based on the position deviation Δ of the processing wheel 6 in the Z-axis direction; and a processing step S205, in which the processing wheel 6 after the correction step processes the outer periphery 5 of the brittle plate 2.

[0156] First, as part of the positioning alignment process S201, the brittle plate 2 to be processed is placed on top of the worktable 4. The brittle plate 2 is vacuum-adsorbed and supported by the suction cup 21 of the worktable 4, thereby positioning the brittle plate 2.

[0157] In order to position the laser measuring mechanism 201 within a range that allows for the measurement of the machining surface 42 of the machining wheel 6, the Z-axis moving mechanism 93 is driven to adjust the Z-axis position of the Z-axis moving seat 92, and the X-axis moving mechanism 95 is driven to move the X-axis moving seat 94 in the X1 direction, so that the laser measuring mechanism 201 is close to the machining wheel 6 within the measuring range of the laser measuring mechanism 201.

[0158] Next, as a measurement step S202, the laser measurement mechanism 201 irradiates the machining surface 42 of the machining wheel 6 with a laser to measure the machining surface 42 of the machining wheel 6.

[0159] Next, as a calculation process S203, the control unit 9 calculates the position deviation Δ of the machining wheel 6 in the Z-axis direction based on the measured value measured by the laser measuring mechanism 201.

[0160] The position deviation Δ is calculated in the arithmetic processing unit 181.

[0161] Next, as a correction process S204, the control unit 9 drives the Z-axis moving mechanism 34 to correct the position deviation of the machining wheel 6 in the Z-axis direction based on the position deviation amount Δ calculated in the calculation processing mechanism 181.

[0162] Next, as a processing step S205, the processing wheel 6, after the Z position deviation has been corrected, processes the outer periphery 5 of the brittle plate 2.

[0163] According to the brittle plate processing method of this other example, the position deviation Δ of the processing wheel 6 in the Z-axis direction can be easily and automatically calculated using the laser measuring mechanism 201, and the position deviation of the processing wheel 6 in the Z-axis direction can be automatically corrected. Therefore, for example, the position alignment of the processing wheel 6, which was performed manually each time the processing wheel 6 is changed, can be automated, and the effort and time spent on the position alignment of the processing wheel 6 relative to the brittle plate 2 performed manually after the processing wheel 6 is changed can be reduced, thereby improving the overall processing efficiency of the brittle plate.

[0164] According to another example, in the measurement process S202, when the laser measuring mechanism 201 irradiates the processing surface 42 of the processing wheel 6 with a laser, the measurement time of the processing surface 42 of the processing wheel 6 can be shortened by moving at least one of the processing wheel 6 and the laser measuring mechanism 201 relative to each other in the Z-axis direction. For example, the position alignment of the processing wheel 6 relative to the brittle plate 2, which is usually done manually each time the processing wheel 6 is changed, can be automated, and the time for aligning the processing wheel 6 relative to the brittle plate 2 can be significantly shortened.

[0165] According to another example of this embodiment, in the measurement step S202, the laser measurement mechanism 201 can irradiate at least one, multiple, or the entire area of ​​the machining surface 42 of the machining wheel 6 in the Z-axis direction with a laser to measure the machining surface 42 of the machining wheel 6. This can shorten the measurement time of the machining surface 42 of the machining wheel 6. Therefore, for example, it can automate the position alignment of the machining wheel 6, which is usually done manually each time the machining wheel 6 is changed, and can significantly shorten the position alignment time of the machining wheel 6. The specified area is simply the width of the laser irradiation of the machining surface 42 of the machining wheel 6 in the Z-axis direction, or it can be an area with one width or multiple widths.

[0166] According to another example of this example, in the measurement step S202, the laser is simultaneously irradiated onto a predetermined area of ​​the machining surface 42 of the machining wheel 6 in the Z-axis direction, such as any eight parts on the machining surface 42 of the machining wheel 6 in the Z-axis direction, so that the machining surface 42 of the machining wheel 6 can be measured simultaneously. In addition, in the measurement step S202, the laser is simultaneously irradiated onto the entire area of ​​the machining surface 42 of the machining wheel 6 in the Z-axis direction, so that the machining surface 42 of the machining wheel 6 can be measured simultaneously.

[0167] In the examples of the brittle plate processing apparatus 1 and the brittle plate processing apparatus 200, the measuring unit 8 includes a Z-axis moving seat 92 mounted on the mounting plate 91 in a manner that allows free movement in the Z-axis direction, and a Z-axis moving mechanism 93 that moves the Z-axis moving seat 92 in the Z-axis direction. However, as an alternative, the measuring unit 8 may not include the Z-axis moving seat 92 and the Z-axis moving mechanism 93, but may be mounted on the frame 12A in a state of position alignment in the Z-axis direction and in a manner that does not move in the Z-axis direction.

[0168] Symbol Explanation

[0169] 1. Brittle plate processing device

[0170] 2. Brittle Plate

[0171] 3 bases

[0172] 4 workbenches

[0173] 5. Peripheral edge

[0174] 6 machining wheels

[0175] 7 processing heads

[0176] 8 Measurement Department

[0177] 9 Control Department

[0178] 10 ground

[0179] 11 main bodies

[0180] 12 frames

[0181] 12A frame

[0182] 13 Horizontal support frame

[0183] 21 suction cups

[0184] 22 suction cup base

[0185] 23Y-axis moving mechanism

[0186] 24 cable drag chain

[0187] 25 guide rail

[0188] 26 sliding blocks

[0189] 27 feed screw

[0190] 31 Rotating Mechanism

[0191] 32 Cut-in Adjustment Mechanism

[0192] 33X-axis moving mechanism

[0193] 34Z-axis moving mechanism

[0194] 35 swivel shaft

[0195] 36 rotary mechanism

[0196] 37 Lower end

[0197] 38 Swing Retainer

[0198] 39 bases

[0199] 41 main body

[0200] 42 machined surfaces

[0201] 45 lower end

[0202] 46 Output Shaft

[0203] 51 Cut-in Slider

[0204] 52X-axis sliding seat

[0205] 53 nuts

[0206] 54 feed screw

[0207] 55-inch infeed gear

[0208] 56-pitch gear

[0209] 57 supports

[0210] 58-speed infeed servo motor

[0211] 61X-axis moving base

[0212] 62 side view

[0213] 63 guide rail

[0214] 64 feed screw

[0215] 65 bearing

[0216] 66 Output Shaft

[0217] 67 X-axis servo motor

[0218] 71 guide rail

[0219] 72Z-axis sliding seat

[0220] 73 nuts

[0221] 74 feed screw

[0222] 75 Gearbox

[0223] 76 Output Shaft

[0224] 77Z-axis servo motor

[0225] 81 rotary servo motor

[0226] 82 Gearbox

[0227] 83 Rotary Gear

[0228] 84 rotating gears

[0229] 85 bearing housing

[0230] 91 mounting base

[0231] 92Z-axis moving base

[0232] 93Z-axis moving mechanism

[0233] 94X-axis moving base

[0234] 95X-axis moving mechanism

[0235] 96 top

[0236] 97-axis components

[0237] 98 Rotary Mechanism

[0238] 99 position measurement sensor

[0239] 101 base

[0240] 102 end

[0241] 103 Flange

[0242] 104 plate components

[0243] 105 top part

[0244] 106 slots

[0245] 107 Plate Section

[0246] 108Z-axis control motor

[0247] 109 pages

[0248] 110 sides

[0249] 111 board section

[0250] 112 cable drag chain

[0251] 113 Cable Carrier Mounting Plate 113

[0252] 115 sides

[0253] 116 sides

[0254] 121 Slider

[0255] 123 rodless cylinder

[0256] 124 rodless cylinder connecting plate

[0257] 125 guide rail

[0258] 126 guide blocks

[0259] 131 stent

[0260] 132 output shaft

[0261] 133 servo motor

[0262] 134 coupling

[0263] 135 bearing housing

[0264] 141-axis main body

[0265] 142 end

[0266] 143 Incision Site

[0267] 144 Fixed Mechanism

[0268] 151 through hole

[0269] 152 Top Main Body

[0270] 153 end

[0271] 154 Top cut

[0272] 161 screw body

[0273] 162 heads

[0274] 171 stent

[0275] 172 Contact Sensor

[0276] 173 side view

[0277] 174 limit components

[0278] 181 processing units

[0279] 182 memory cells

[0280] 200 Brittle Plate Processing Equipment

[0281] 201 Laser Measurement Agency

Claims

1. A brittle plate processing apparatus, characterized in that, include: A workbench, wherein the workbench is a brittle plate; A processing head having processing wheels that process the outer periphery of the brittle plate held on the worktable; The measuring unit measures the positional deviation of the processing wheel relative to the brittle plate in the axial direction; and The control unit corrects the positional deviation of the machining wheel in the axial direction based on the positional deviation measured by the measuring unit, and causes the machining wheel with the corrected positional deviation to perform machining on the outer periphery of the brittle plate. The measuring unit includes: a mounting plate; and a movable seat, the movable seat being disposed such that it can move freely relative to the mounting plate in a first direction orthogonal to the axis of the processing wheel; A moving mechanism that moves the movable seat in the first direction; and a rotating mechanism disposed on the movable seat and having a shaft member including a top end portion. The measuring unit rotates the shaft member in a first surrounding direction around its axis so that the top end contacts the machining surface of the machining wheel. It measures a first position where the top end contacts the machining surface of the machining wheel after rotating in the first surrounding direction. Then, it rotates the shaft member in a second surrounding direction, opposite to the first surrounding direction, so that the top end contacts the machining surface of the machining wheel. It measures a second position where the top end contacts the machining surface of the machining wheel after rotating in the second surrounding direction. The control unit calculates a first distance in the axial direction from a predetermined machining reference position to the machining wheel at the first position, calculates a second distance in the axial direction from the predetermined machining reference position to the machining wheel at the second position, calculates a positional deviation in the axial direction of the machining wheel based on the first distance and the second distance, and corrects the positional deviation in the axial direction of the machining wheel based on the positional deviation in the axial direction of the machining wheel, so that the machining wheel with the corrected positional deviation performs machining on the outer periphery of the brittle plate.

2. The brittle plate processing apparatus as described in claim 1, characterized in that, The brittle plate processing device alternately and repeatedly measures the first and second positions by the measuring unit and corrects the positional deviation of the processing wheel in the axial direction by the control unit, so that the processing wheel with the positional deviation corrected multiple times processes the outer periphery of the brittle plate.

3. The brittle plate processing apparatus as described in claim 1 or 2, characterized in that, The rotating mechanism is a servo motor that controls the torque.

4. A method for processing brittle sheet metal, the method using a brittle sheet metal processing apparatus, the apparatus comprising: The system comprises: a worktable holding a brittle plate; a machining head having machining wheels that machine the outer periphery of the brittle plate held on the worktable; a measuring unit measuring the positional deviation of the machining wheels relative to the brittle plate in the axial direction; and a control unit correcting the positional deviation of the machining wheels in the axial direction based on the positional deviation measured by the measuring unit, and causing the machined wheel with the corrected positional deviation to machine the outer periphery of the brittle plate. The measuring unit includes: a mounting plate; a movable seat arranged to move freely relative to the mounting plate in a first direction orthogonal to the axis of the processing wheel; a moving mechanism that moves the movable seat in the first direction; and a rotating mechanism disposed on the movable seat and having a shaft member including a top end portion. Its features include: The alignment process involves calibrating the shaft component to a specified position. In the first measurement step, the shaft member is rotated in a first surrounding direction about its axis so that the top end contacts the machining surface of the machining wheel, and the first position of the top end contacting the machining surface of the machining wheel is measured. In the second measurement step, the shaft member is rotated in a direction opposite to the first surrounding direction, i.e., a second surrounding direction, so that the top end contacts the machining surface of the machining wheel, and a second position on the machining surface of the machining wheel where the top end contacts is measured. The process is calculated, the first distance in the axial direction of the machining wheel from the specified machining reference position to the first position is calculated, the second distance in the axial direction of the machining wheel from the specified machining reference position to the second position is calculated, and the position deviation in the axial direction of the machining wheel is calculated based on the first distance and the second distance. The correction process involves correcting the positional deviation in the axial direction of the machining wheel based on the amount of positional deviation in the axial direction; and The processing step involves the processing wheel, whose positional deviation has been corrected after the correction step, processing the outer periphery of the brittle plate.

5. The method for processing brittle plates as described in claim 4, characterized in that, The first measurement step, the second measurement step, the calculation step, and the correction step are repeated multiple times, so that the positional deviation is corrected multiple times by the processing wheel to process the outer periphery of the brittle plate.

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