Adsorption refrigeration device

Abstract

The present application relates to the technical field of solid adsorption refrigeration, and specifically to an adsorption refrigeration device. The first adsorption bed in the adsorption refrigeration device has an adsorption medium, the evaporator has a second pipeline and a heat medium, and the first pipeline has a medium; the inlet of the first adsorption bed is connected to the outlet of the first condenser, the first pipeline has a first part and a second part, the first part is located in the first condenser, the outlet of the first part is connected to the inlet of the second pipeline, and the second part is used to connect the outlet of the second pipeline and the inlet of the first part; when the inlet of the first condenser is connected to the refrigerant, the medium in the first part is cooled by the refrigerant in the first condenser to cool the medium in the second pipeline; the cooled medium in the second pipeline exchanges heat with the heat medium in the evaporator to cool the heat medium in the evaporator. The adsorption cooling device in the present application can provide continuous refrigeration when the heat source temperature is low or there is no heat source.

Description

Technical Field

[0001] The present application relates to the technical field of solid adsorption refrigeration, and in particular to an adsorption refrigeration device. Background Art

[0002] Adsorption refrigeration technology uses the adsorption effect to reduce the pressure of liquid and evaporate it to achieve the refrigeration effect. At different temperatures, the adsorbent has different adsorption rates on the adsorbate. By periodically heating and cooling the adsorbent, the adsorbate gas is alternately desorbed and adsorbed, and the refrigeration effect is achieved by using the adsorption effect.

[0003] However, in the existing adsorption refrigeration device, when the heat source temperature is low or there is no heat source, the adsorption refrigeration device cannot continuously cool. Therefore, a new adsorption refrigeration device is urgently needed to achieve continuous cooling when there is no heat source or the heat source temperature is low. Summary of the invention

[0004] The present application provides an adsorption cooling device that can continue to cool when the heat source temperature is low or there is no heat source.

[0005] The present application provides an adsorption refrigeration device, which includes a first adsorption bed, a first pipeline, an evaporator and a first condenser; the first adsorption bed contains an adsorption medium, the evaporator contains a second pipeline and a heat medium, and the first pipeline contains a medium; the inlet of the first adsorption bed is connected to the outlet of the first condenser, and the first pipeline has a first part and a second part, the first part of the first pipeline is located in the first condenser, and the outlet of the first part of the first pipeline is connected to the inlet of the second pipeline, and the second part of the first pipeline is used to connect the outlet of the second pipeline and the inlet of the first part; when the inlet of the first condenser is used to connect the refrigerant, the refrigerant passes through the first adsorption bed and flows out through the outlet of the first adsorption bed; the medium in the first part of the first pipeline is cooled by the refrigerant in the first condenser, so as to realize cooling of the medium in the second pipeline by the medium flowing in the first pipeline; the cooled medium in the second pipeline exchanges heat with the heat medium in the evaporator to cool the heat medium in the evaporator.

[0006] When the temperature of the heat source in the adsorption refrigeration device in the present application decreases or there is no heat source, the inlet of the first condenser can be connected to the refrigerant, and the outlet of the first condenser is connected to the inlet of the first adsorption bed, wherein the medium flowing through the second pipeline exchanges heat with the heat medium in the evaporator, and the medium heated up after the heat exchange can flow through the second part and the first part of the first pipeline, and the temperature of the heated medium in the first part of the first pipeline and the refrigerant in the first condenser is reduced, and the medium with reduced temperature flows through the second pipeline and continues to exchange heat with the heat medium in the evaporator, thereby cooling the heat medium in the evaporator, so that the adsorption refrigeration device can continue to cool.

[0007] In a possible implementation of the present application, the adsorption refrigeration device also includes a second adsorption bed, a second condenser and a third pipeline; the second adsorption bed contains an adsorption medium, and the second pipeline contains a medium; the inlet of the second adsorption bed is connected to the outlet of the second condenser, and the first part and the second part of the third pipeline, the first part of the third pipeline is located in the second condenser, and the second part of the third pipeline is used to connect the inlet of the second pipeline and the outlet of the first part of the third pipeline; when the inlet of the second condenser is used to connect the refrigerant, the refrigerant flows out through the outlet of the second adsorption bed after the adsorption medium in the second adsorption bed absorbs the specified components; the medium in the first part of the third pipeline is cooled by the refrigerant in the second condenser, so as to realize the cooling of the medium in the second pipeline by the medium circulating in the third pipeline; the cooled medium in the second pipeline exchanges heat with the heat medium in the evaporator to cool the heat medium in the evaporator;

[0008] When the temperature of the heat source in the adsorption refrigeration device decreases or there is no heat source, and the inlet of the second condenser is connected to the refrigerant, the medium flowing through the second pipeline exchanges heat with the heat medium in the evaporator, and the medium heated up after the heat exchange can flow through the second part and the first part of the third pipeline. The temperature of the heated medium in the first part of the third pipeline and the refrigerant in the second condenser is reduced, and the medium with reduced temperature flows through the second pipeline to continue to exchange heat with the heat medium in the evaporator, thereby cooling the heat medium in the evaporator, so that the adsorption refrigeration device can continue to cool.

[0009] It should be noted that when the inlet of the first condenser is used to connect to the refrigerant, the inlet of the second condenser can stop connecting to the refrigerant; when the inlet of the second condenser is used to connect to the refrigerant, the inlet of the first condenser can stop connecting to the refrigerant; the inlets of the first condenser and the second condenser can also be connected to the refrigerant at the same time.

[0010] In a possible implementation of the present application, the evaporator includes a first evaporator and a second evaporator, and the second pipeline includes a first sub-pipeline and a second sub-pipeline; the first sub-pipeline is located in the first evaporator, the inlet of the first sub-pipeline is used to communicate with the outlet of the first part of the first pipeline, and the outlet of the first sub-pipeline is connected to the inlet of the second part of the first pipeline; the second sub-pipeline is located in the second evaporator, the inlet of the second sub-pipeline is used to communicate with the outlet of the first part of the third pipeline, and the outlet of the second sub-pipeline is connected to the inlet of the second part of the third pipeline. The first evaporator is used to correspond to the first condenser and the first adsorption bed, and the second evaporator is used to correspond to the second condenser and the second adsorption bed.

[0011] In a possible implementation of the present application, the adsorption refrigeration device may further include a four-way valve, which is connected to the inlet of the first sub-pipeline and the outlet of the first part of the first pipeline, and is also connected to the inlet of the second sub-pipeline and the outlet of the first part of the third pipeline. When the first condenser is connected to the refrigerant, the four-way valve controls the inlet of the first sub-pipeline and the outlet of the first part of the first pipeline to be in a conducting state, and controls the inlet of the second sub-pipeline and the outlet of the first part of the third pipeline to be in a disconnected state; when the second condenser is connected to the refrigerant, the four-way valve controls the inlet of the second sub-pipeline and the outlet of the first part of the third pipeline to be in a conducting state, and controls the inlet of the first sub-pipeline and the outlet of the first part of the first pipeline to be in a disconnected state.

[0012] It should be noted that the adsorption refrigeration device may also include two two-way throttle valves, one of which is connected to the outlet of the first part of the first pipeline and the inlet of the first sub-pipeline, and the other of which is connected to the outlet of the first part of the third pipeline and the inlet of the second sub-pipeline. When the first condenser is connected to the refrigerant, one two-way throttle valve controls the inlet of the first sub-pipeline and the outlet of the first part of the first pipeline to be in a conducting state, and the other two-way throttle valve controls the inlet of the second sub-pipeline and the outlet of the first part of the third pipeline to be in a disconnected state; when the second condenser is connected to the refrigerant, the other two-way throttle valve controls the inlet of the second sub-pipeline and the outlet of the first part of the third pipeline to be in a conducting state, and the other two-way throttle valve controls the inlet of the first sub-pipeline and the outlet of the first part of the first pipeline to be in a disconnected state.

[0013] In a possible implementation of the present application, in the vertical direction, the first evaporator is located below the first adsorption bed and the first condenser, and the second evaporator is located below the second adsorption bed and the second condenser. In this way, when the medium in the first sub-pipeline is heated and vaporized, the vaporized medium enters the first part of the first pipeline, and the vaporized medium in the first part of the first pipeline condenses and releases heat in the first condenser to form a liquid medium, which can flow back to the first sub-pipeline under the action of gravity and exchange heat with the heat medium in the first evaporator again; the vaporized medium in the second sub-pipeline can also be condensed and released heat in the second condenser through the first part of the third pipeline to form a liquid medium, which can flow back to the second sub-pipeline under the action of gravity and exchange heat with the heat medium in the second evaporator again.

[0014] In a possible implementation of the present application, a compressor is provided on the first pipeline and / or the third pipeline, and the compressor can make the first pipeline and / or the third pipeline circulate internally in the absence of gravity, so that the adsorption refrigeration device can continue to cool.

[0015] In a possible implementation of the present application, in order to provide refrigerant to the first condenser and the second condenser, the adsorption refrigeration device may further include a fourth pipeline, a fifth pipeline, a sixth pipeline, a seventh pipeline, a first valve body and a second valve body; the two ends of the fourth pipeline are respectively connected to the first valve body and the inlet of the first condenser, the two ends of the fifth pipeline are respectively connected to the inlet of the first valve body and the second condenser, the two ends of the sixth pipeline are respectively connected to the outlet of the second valve body and the first adsorption bed, and the two ends of the seventh pipeline are respectively connected to the outlet of the second valve body and the second adsorption bed; when the first condenser is used to connect the refrigerant, the refrigerant passes through the fourth pipeline and the first condenser in sequence, enters the first adsorption bed, and flows out through the sixth pipeline; when the second condenser is used to connect the refrigerant, the refrigerant passes through the fifth pipeline and the second condenser in sequence, enters the second adsorption bed, and flows out through the seventh pipeline. Among them, the fourth pipeline and the fifth pipeline can be connected to the same cold source, and the first valve body controls the cold source to flow into the fourth pipeline and / or the fifth pipeline.

[0016] In a possible implementation of the present application, in order to provide heat medium to the first evaporator and the second evaporator, the adsorption refrigeration device further includes an eighth pipeline, a ninth pipeline, a tenth pipeline, an eleventh pipeline, a third valve body and a fourth valve body; the two ends of the eighth pipeline are respectively connected to the third valve body and the inlet of the first evaporator, and the two ends of the ninth pipeline are respectively connected to the fourth valve body and the outlet of the first evaporator; the two ends of the tenth pipeline are respectively connected to the inlet of the third valve body and the second evaporator, and the two ends of the eleventh pipeline are respectively connected to the outlet of the fourth valve body and the second evaporator. Among them, the eighth pipeline and the tenth pipeline can be connected to a heat source (a medium to be cooled), and the third valve body can allow the medium to be cooled flowing out of the heat source to flow into the eighth pipeline or the tenth pipeline.

[0017] In a possible implementation of the present application, in order to protect the first adsorption bed, the second adsorption bed, the first evaporator, the second evaporator, the first condenser and the second condenser, the adsorption refrigeration device may include a shell, and the first adsorption bed, the second adsorption bed, the first evaporator, the second evaporator, the first condenser and the second condenser may all be arranged in the shell.

[0018] In a possible implementation of the present application, in order to facilitate the layout of the first adsorption bed, the second adsorption bed, the first evaporator, the second evaporator, the first condenser and the second condenser, and to make the first evaporator located below the first condenser and the second evaporator located below the second condenser, a first partition component is arranged in the shell, and the first partition component divides the shell into a first chamber and a second chamber, the first evaporator, the first adsorption bed and the second condenser are arranged in the first chamber, the first evaporator is arranged at the bottom of the first chamber, and the first adsorption bed and the second condenser are located on the side of the first evaporator away from the bottom of the first chamber; the second evaporator, the second adsorption bed and the first condenser are arranged in the second chamber, the second evaporator is arranged at the bottom of the second chamber, and the second adsorption bed and the first condenser are located on the side of the second evaporator away from the bottom of the second chamber.

[0019] In a possible implementation of the present application, in order to enable the adsorption refrigeration device to be separated from the first condenser, the second condenser and the first adsorption bed and the second adsorption bed when there is a heat source, the surfaces of the first condenser and the second condenser condense into a low-temperature medium that can be wrapped around the first evaporator and the second evaporator, a second partition component is arranged in the first chamber, the second partition component is connected to the first partition component, the second partition component and the first partition component form a first accommodation space with an opening facing away from the bottom of the first chamber, the second condenser is arranged in the first accommodation space, the bottom of the first accommodation space is provided with a first opening, and the first opening corresponds to the bottom of the first chamber; a third partition component is arranged in the second chamber, the third partition component is connected to the first partition component, the third partition component and the first partition component form a second accommodation space with an opening facing away from the bottom of the second chamber, the first condenser is arranged in the second accommodation space, the bottom of the second accommodation space is provided with a second opening, and the second opening corresponds to the bottom of the second chamber.

[0020] In the above-mentioned embodiment, the adsorption refrigeration device may also include a third adsorption bed, a fourth adsorption bed and a fifth adsorption bed, etc., as well as pipelines and condensers matched with each adsorption bed; in addition, in order to ensure the heat exchange rate between the medium in the loop formed by the first sub-pipeline and the first pipeline and the first evaporator and the first condenser, and the heat exchange rate between the medium in the loop formed by the second sub-pipeline and the third pipeline and the second evaporator and the second condenser, the flow direction of the internal medium in the loop formed by the first sub-pipeline and the first pipeline is opposite to the flow direction of the medium in the first evaporator and the first condenser; the flow direction of the internal medium in the loop formed by the second sub-pipeline and the third pipeline is opposite to the flow direction of the medium in the second evaporator and the second condenser. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of an adsorption refrigeration device provided in an embodiment of the present application;

[0022] Figure 2 A schematic diagram of another structure of the adsorption refrigeration device provided in an embodiment of the present application;

[0023] Figure 3 A schematic diagram of another structure of the adsorption refrigeration device provided in an embodiment of the present application;

[0024] Figure 4 A schematic diagram of an equivalent structure of a first condenser, a first evaporator and a first pipeline in an adsorption refrigeration device provided in an embodiment of the present application;

[0025] Figure 5 A schematic diagram of another structure of the adsorption refrigeration device provided in an embodiment of the present application;

[0026] Figure 6 The structural schematic diagram of each pipeline is not shown in the adsorption refrigeration device provided in the embodiment of the present application.

[0027] Figure numerals: 1-first adsorption bed; 2-second adsorption bed; 3-evaporator; 301-first evaporator; 302-second evaporator; 4-second pipeline; 41-first sub-pipeline; 42-second sub-pipeline; 5-first condenser; 6-second condenser; 7-first pipeline; 8-third pipeline; 9-four-way valve; 10-fourth pipeline; 11-fifth pipeline; 12-sixth pipeline; 13-seventh pipeline; 14-first valve body; 15-second valve body; 16 -eighth pipeline; 17-ninth pipeline; 18-tenth pipeline; 19-eleventh pipeline; 20-third valve body; 21-fourth valve body; 22-twelfth pipeline; 23-thirteenth pipeline; 24-fourteenth pipeline; 25-fifteenth pipeline; 26-fifth valve body; 27-sixth valve body; 28-compressor; 29-housing; 30-first partition assembly; 31-second partition assembly; 32-third partition assembly; 33-two-way throttle valve; 34-refrigerator. DETAILED DESCRIPTION

[0028] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings.

[0029] With the intensification of energy crisis and environmental pollution, energy-saving and environmentally friendly products have received attention and favor from the society. The adsorption refrigeration device is a thermodynamic cycle constructed based on the adsorption process and phase change process. It uses heat drive to achieve the refrigeration effect through the conversion of thermal energy, adsorption potential energy and phase change potential energy. The working fluid used in the adsorption refrigeration device is natural material, and can be well combined with occasions such as waste heat recovery. Therefore, it is a green, environmentally friendly and energy-saving product.

[0030] However, the existing adsorption refrigeration system has high requirements on the heat source temperature. When the heat source temperature is low or there is no heat source, the adsorption refrigeration device cannot continuously cool. For this reason, an embodiment of the present application provides an adsorption refrigeration device to achieve continuous cooling when there is no heat source or the heat source temperature is low.

[0031] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to be limiting of the present application. As used in the specification and appended claims of the present application, the singular expressions "a", "an", "above", "the" and "this" are intended to also include expressions such as "one or more", unless there is a clear contrary indication in the context.

[0032] References to "one embodiment" or "some embodiments" etc. described in this specification mean that a particular feature, structure or characteristic described in conjunction with the embodiment is included in one or more embodiments of the present application. Thus, the phrases "in one embodiment", "in some embodiments", "in some other embodiments", "in some other embodiments", etc. that appear at different places in this specification do not necessarily refer to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in other ways. The terms "including", "comprising", "having" and their variations all mean "including but not limited to", unless otherwise specifically emphasized in other ways.

[0033] Figure 1 The adsorption refrigeration device provided in the embodiment of the present application only includes a first adsorption bed. That is, the adsorption refrigeration device only includes one adsorption bed. Figure 1 The adsorption refrigeration device comprises a first adsorption bed 1, a first pipeline 7, an evaporator 3 and a first condenser 5; the first adsorption bed 1 has an adsorption medium, the evaporator 3 has a third pipeline 8 and a heat medium, and the first pipeline 7 has a medium; the inlet of the first adsorption bed 1 is connected to the outlet of the first condenser 5, and the first pipeline 7 has a first part and a second part, the first part of the first pipeline 7 is located in the first condenser 5, and the outlet of the first part of the first pipeline 7 is connected to the inlet of the third pipeline 8, and the second part of the first pipeline 7 is used to connect the outlet of the third pipeline 8 and the inlet of the first part of the first pipeline 7; when the inlet of the first condenser 5 is used to connect the refrigerant, the refrigerant passes through the first adsorption bed 1 and flows out through the outlet of the first adsorption bed 1; the medium in the first part of the first pipeline 7 is cooled by the refrigerant in the first condenser 5, so as to realize the cooling of the medium in the third pipeline 8 by the medium circulating in the first pipeline 7; the cooled medium in the third pipeline 8 exchanges heat with the heat medium in the evaporator 3 to cool the heat medium in the evaporator.

[0034] When the temperature of the heat source in the adsorption refrigeration device decreases or there is no heat source, the inlet of the first condenser 5 can be connected to the refrigerant, and the outlet of the first condenser 5 is connected to the inlet of the first adsorption bed 1. The medium in the first pipeline 7 can flow. Specifically, the medium flowing through the third pipeline 8 can exchange heat with the heat medium in the evaporator 3. The medium that has been heated after the heat exchange can flow through the second part of the first pipeline 7 and return to the first part of the first pipeline 7 and reduce the heat exchange temperature with the refrigerant in the first condenser 3. The medium after the temperature is reduced flows through the third pipeline 8 and continues to exchange heat with the heat medium in the evaporator 3, thereby cooling the heat medium in the evaporator 3, so that the adsorption refrigeration device can continue to cool.

[0035] It should be noted that the adsorption refrigeration device provided in the present application may include two or more adsorption beds. The following description will be given using an adsorption refrigeration device including two adsorption beds as an example. Figure 2 This is a schematic diagram of the structure of the first condenser connected to the refrigerant in the adsorption refrigeration device provided in the embodiment of the present application. Figure 3 This is a schematic diagram of the structure of the second condenser connected to the refrigerant in the adsorption refrigeration device provided in the embodiment of the present application. Figure 2 and Figure 3 In one embodiment of the present application, the adsorption refrigeration device includes a first adsorption bed 1, a second adsorption bed 2, a first pipeline 7, a third pipeline 8, an evaporator 3, a second pipeline 4, a first condenser 5 and a second condenser 6; wherein the first pipeline 7 may include a first part and a second part, and the first end of the first part of the first pipeline 7 may be connected to the first end of the second part of the first pipeline 7, the third pipeline 8 may also include a first part and a second part, and the first end of the first part of the third pipeline 8 may be connected to the first end of the second part of the third pipeline 8, the first part of the first pipeline 7 is located in the first condenser 5, the second part of the first pipeline 7 is used to connect the outlet of the second pipeline 4 and the inlet of the first part, the first part of the third pipeline 8 is located in the second condenser 6, and the second part of the third pipeline 8 is used to connect the inlet of the second pipeline 4 and the outlet of the first part of the third pipeline; wherein the second adsorption bed 2 and the first adsorption bed 1 have the same structure.

[0036] When the temperature of the heat source in the adsorption refrigeration device decreases or there is no heat source, and the inlet of the first condenser 5 is connected to the refrigerant, the medium flowing through the second pipeline 4 can exchange heat with the heat medium in the evaporator 3, and the medium heated after the heat exchange can flow through the second part and the first part of the first pipeline 7. The heat exchange temperature of the heated medium in the first part of the first pipeline 7 and the refrigerant in the first condenser 5 is reduced, and the medium with reduced temperature flows through the second pipeline 4 to continue to exchange heat with the heat medium in the evaporator 3, thereby cooling the heat medium in the evaporator 3, so that the adsorption refrigeration device can continue to cool. Similarly, when the temperature of the heat source in the adsorption refrigeration device decreases or there is no heat source, and the inlet of the first condenser 5 is not connected to the refrigerant, and the inlet of the second condenser 6 is connected to the refrigerant, the medium flowing through the second pipeline 4 exchanges heat with the heat medium in the evaporator 3, and the medium heated after the heat exchange can flow through the second part and the first part of the third pipeline 8. The temperature of the heated medium in the first part of the third pipeline 6 and the refrigerant in the second condenser 6 is reduced, and the medium with reduced temperature flows through the second pipeline 4 to continue to exchange heat with the heat medium in the evaporator 3, thereby cooling the heat medium in the second evaporator 3, so that the adsorption refrigeration device can continue to cool.

[0037] It should be noted that the second pipeline 4 can be vaporized when exchanging heat with the evaporator 3, and the medium in the second pipeline 4 in the following process is described as being vaporized by heat. Figure 2 and Figure 3 The evaporator 3 may include a first evaporator 301 and a second evaporator 302, and the second pipeline 4 includes a first sub-pipeline 41 and a second sub-pipeline 42; the first sub-pipeline 41 is located in the first evaporator 301, the inlet of the first sub-pipeline 41 is used to communicate with the outlet of the first part of the first pipeline 7, and the outlet of the first sub-pipeline 41 is communicated with the inlet of the second part of the first pipeline 7; the second sub-pipeline 42 is located in the second evaporator, the inlet of the second sub-pipeline 42 is used to communicate with the outlet of the first part of the third pipeline 8, and the outlet of the second sub-pipeline 42 is communicated with the inlet of the second part of the third pipeline 8. The adsorption refrigeration device may also include a four-way valve 9, the four-way valve 9 is communicated with the inlet of the first sub-pipeline 41 and the outlet of the first part of the first pipeline 7, and the four-way valve 9 is also communicated with the inlet of the second sub-pipeline 42 and the outlet of the first part of the third pipeline 8. When the first condenser 5 is connected to the refrigerant, the four-way valve 9 controls the inlet of the first sub-pipeline 41 and the outlet of the first part of the first pipeline 7 to be in a conducting state, and controls the inlet of the second sub-pipeline 42 and the outlet of the first part of the third pipeline 8 to be in a disconnected state; when the second condenser 6 is connected to the refrigerant, the four-way valve 9 controls the inlet of the second sub-pipeline 42 and the outlet of the first part of the third pipeline 8 to be in a conducting state, and controls the inlet of the first sub-pipeline 41 and the outlet of the first part of the first pipeline 7 to be in a disconnected state.

[0038] It should be noted that the adsorption refrigeration device may further include two two-way throttle valves 33, one of the two two-way throttle valves 33 is connected to the outlet of the first part of the first pipeline 7 and the inlet of the first sub-pipeline 41, and the other of the two two-way throttle valves 33 is connected to the outlet of the first part of the third pipeline 8 and the inlet of the second sub-pipeline 42. When the first condenser 5 is connected to the refrigerant, one two-way throttle valve 33 controls the inlet of the first sub-pipeline 41 and the outlet of the first part of the first pipeline 7 to be in a conducting state, and the other two-way throttle valve 33 controls the inlet of the second sub-pipeline 42 and the outlet of the first part of the third pipeline 8 to be in a disconnected state; when the second condenser 6 is connected to the refrigerant, the other two-way throttle valve 33 controls the inlet of the second sub-pipeline 42 and the outlet of the first part of the third pipeline 8 to be in a conducting state, and the other two-way throttle valve 33 controls the inlet of the first sub-pipeline 41 and the outlet of the first part of the first pipeline 7 to be in a disconnected state.

[0039] Continue to refer to Figure 2 and Figure 3The adsorption refrigeration device may further include a fourth pipeline 10, a fifth pipeline 11, a sixth pipeline 12, a seventh pipeline 13, a first valve body 14 and a second valve body 15, wherein one end of the fourth pipeline 10 is connected to the first valve body 14, the other end of the fourth pipeline 10 is connected to the inlet of the first condenser 5, one end of the fifth pipeline 11 is connected to the first valve body 14, the other end of the fifth pipeline 11 is connected to the inlet of the second condenser 6, both ends of the sixth pipeline 12 are respectively connected to the second valve body 15 and the outlet of the first adsorption bed 1, and both ends of the seventh pipeline 13 are respectively connected to the second valve body 15 and the outlet of the second adsorption bed 2; the adsorption refrigeration device also It includes an eighth pipeline 16, a ninth pipeline 17, a tenth pipeline 18, an eleventh pipeline 19, a third valve body 20 and a fourth valve body 21; one end of the eighth pipeline 16 is connected to the third valve body 20, and the other end of the eighth pipeline 16 is connected to the first evaporator 301, one end of the ninth pipeline 17 is connected to the fourth valve body 21, and the other end of the ninth pipeline 17 is connected to the first evaporator 301, one end of the tenth pipeline 18 is connected to the third valve body 20, and the other end of the tenth pipeline 18 is connected to the second evaporator 302, one end of the eleventh pipeline 19 is connected to the fourth valve body 21, and the other end of the eleventh pipeline 19 is connected to the second evaporator 302. When the temperature of the heat source in the adsorption refrigeration device decreases or there is no heat source, the refrigerant can pass through the fourth pipeline 10 and the first condenser 5 in sequence, enter the first adsorption bed 1 and flow out through the sixth pipeline 12, and the eighth pipeline 16 can continue to provide heat medium for the first evaporator 301. After the heat exchange in the first evaporator 301, the heat medium becomes a low-temperature medium and flows out through the ninth pipeline 17. Specifically, when the refrigerant passes through the first condenser 5, the refrigerant can exchange heat with the vaporized medium in the first part of the first pipeline 7, so that the vaporized medium in the first part of the first pipeline 7 is liquefied, and the low-temperature liquefied medium is liquefied. The medium flows back to the first sub-pipeline 41 through the four-way valve 9 or a two-way throttle valve. The liquefied medium in the first sub-pipeline 41 can continuously exchange heat with the heat medium entering the first evaporator 301 through the eighth pipeline 16, so that the liquefied medium in the first sub-pipeline 41 can be re-vaporized, and the re-vaporization process can cool the heat medium in the first evaporator 301, so that the heat medium entering the first evaporator 301 through the eighth pipeline 16 and then flowing out through the ninth pipeline 17 changes the high-temperature medium into a low-temperature medium, so that the adsorption refrigeration device can continue to cool.

[0040] In addition, when the temperature of the heat source in the adsorption refrigeration device decreases or there is no heat source, the refrigerant can also pass through the fifth pipeline 11 and the second condenser 6 in sequence, enter the second adsorption bed 2, and flow out through the seventh pipeline 13. The tenth pipeline 18 can provide heat medium for the second evaporator 302. After the heat exchange in the second evaporator 302, the heat medium becomes a low-temperature medium and flows out through the eleventh pipeline 19. Specifically, when the refrigerant passes through the second condenser 6, the refrigerant can exchange heat with the vaporized medium in the first part of the third pipeline 8, so that the vaporized medium in the first part of the third pipeline 8 is liquefied, and the low-temperature liquefied medium is converted into a low-temperature medium. The mass flows back to the second sub-pipeline 42 through the four-way valve 9 or a two-way throttle valve. The liquefied medium in the second sub-pipeline 42 can continuously exchange heat with the heat medium that enters the second evaporator 302 through the tenth pipeline 18, so that the liquefied medium in the second sub-pipeline 42 can be re-vaporized, and the re-vaporization process can also cool the heat medium in the second evaporator 302, so that the heat medium that enters the second evaporator 302 through the tenth pipeline 18 and then flows out through the eleventh pipeline 19, the high-temperature medium is changed into a low-temperature medium, so that the adsorption refrigeration device can continue to cool.

[0041] It should be noted that when providing heat medium to the first evaporator 301, the heat medium can also enter the first evaporator 301 through the ninth pipeline 17, and after the high-temperature medium exchanges heat in the first evaporator 301, the low-temperature medium in the first evaporator 301 flows out through the eighth pipeline 16. Similarly, when providing heat medium to the second evaporator 302, the heat medium can also enter the second evaporator 302 through the eleventh pipeline 19, and after the high-temperature medium exchanges heat in the second evaporator 302, the low-temperature medium in the second evaporator 302 flows out through the tenth pipeline 18.

[0042] In order to ensure the heat exchange rate between the medium in the loop formed by the first sub-pipeline 41 and the first pipeline 7 and the first evaporator 301 and the first condenser 5, and the heat exchange rate between the medium in the loop formed by the second sub-pipeline 42 and the third pipeline 8 and the second evaporator 302 and the second condenser 6, the flow direction of the inner medium in the loop formed by the first sub-pipeline 41 and the first pipeline 7 is opposite to the flow direction of the medium in the first evaporator 301 and the first condenser 5; the flow direction of the inner medium in the loop formed by the second sub-pipeline 42 and the third pipeline 8 is opposite to the flow direction of the medium in the second evaporator 302 and the second condenser 6.

[0043] In order to improve the heat exchange rate between the first part of the third pipeline 8 and the second evaporator 302, and the heat exchange rate between the second part of the third pipeline 8 and the second condenser 6, the flow direction of the medium in the third pipeline 8 can be opposite to the flow direction of the medium in the second evaporator 302 and the flow direction of the refrigerant in the second condenser 6. Specifically, the flow direction of the medium in the second evaporator 302 can be controlled by controlling the inlet of the heat medium in the second evaporator 302, and the flow direction of the refrigerant in the second condenser 6 can be controlled by controlling the inlet of the refrigerant in the second condenser 6, so that the flow direction of the medium in the third pipeline 8 is opposite to the flow direction of the medium in the second evaporator 302 and the flow direction of the refrigerant in the second condenser 6.

[0044] Figure 4 This is a schematic diagram of the structure of the heat exchange system formed between the first evaporator, the first condenser and the first pipeline. Please refer to Figure 4 The adsorption cooling device may further include a refrigerator 34, which may be, but is not limited to, a cooling tower or a dry cooler. The outlet of the refrigerator may be connected to the fourth pipeline 10, and the inlet of the refrigerator 24 may be connected to the sixth pipeline 12. When the first condenser 5 is arranged above the first evaporator 301, the medium in the first sub-pipeline 41 is heated and vaporized after heat exchange with the first evaporator 301, and the vaporized medium enters the first part of the first pipeline 7, exchanges heat with the refrigerant in the first condenser and is liquefied. The liquefied medium can flow back to the first sub-pipeline 41 from the first part of the first pipeline 7 through the two-way throttle valve 33 under the action of gravity to form a circulating loop, so that the heat medium entering the first evaporator 301 from the eighth pipeline 16 changes from the high-temperature medium to the low-temperature medium when it flows out through the ninth pipeline 17.

[0045] It should be noted that when there is no height difference between the first evaporator 301 and the first condenser 5, the adsorption cooling device also includes a compressor 28, which is arranged in the first pipeline 7 and is located on the path where the vaporized medium in the first sub-pipeline 41 flows to the first part of the first pipeline 7. The compressor 28 can convert the vaporized low-pressure medium in the first sub-pipeline 41 into a high-temperature and high-pressure gas. The high-temperature and high-pressure gas enters the first part of the first pipeline 7 and is condensed and released in the first condenser 5 to form a liquid medium. The liquid medium can flow back to the first sub-pipeline 41 through the two-way throttle valve 33 to form a medium circulation.

[0046] In addition, the heat exchange system formed between the second evaporator and the second condenser and the second sub-pipeline and the third pipeline is the same as the heat exchange system formed between the first evaporator 301 and the first condenser 5 and the second sub-pipeline and the first pipeline 7, and the effects produced are also the same, which will not be repeated here.

[0047] Please refer to Figure 5 and Figure 6 In the above embodiment, in order to protect the first evaporator 301, the second evaporator 302, the first adsorption bed 1, the second adsorption bed 2, the first condenser 5 and the second condenser 6, the adsorption cooling device may also include a shell 29, the first evaporator 301, the second evaporator 302, the first adsorption bed 1, the second adsorption bed 5, the first condenser 5 and the second condenser 6 may all be arranged inside the shell 29, and the shell 29 may be provided with a plurality of through holes for various pipelines to pass through, so as to ensure that media and refrigerants of various temperatures can enter the evaporator, condenser and adsorption bed through the pipelines.

[0048] The compressor 28 may be disposed inside the housing, or outside the housing, and the specific arrangement may be adjusted according to actual needs.

[0049] A first partition component 30 may also be provided in the shell 29, and the first partition component 30 may divide the shell 29 into a first chamber and a second chamber, wherein the first evaporator 301, the first adsorption bed 1 and the second condenser 6 may be arranged in the first chamber, the first evaporator 301 may be arranged at the bottom of the first chamber, the second condenser 6 and the first adsorption bed 1 may be arranged above the first evaporator 301, and the second evaporator 302, the second adsorption bed 2 and the first condenser 5 may be arranged in the second chamber, wherein the second evaporator 302 may be arranged at the bottom of the second chamber, the second adsorption bed 2 and the first condenser 5 may be arranged above the second evaporator 302, specifically, the second condenser 6 and the first end condenser 5 may be arranged above the first evaporator 301 and the second evaporator 302. In this way, after the medium in the first sub-pipeline 41 exchanges heat with the first evaporator 301, the medium in the first sub-pipeline 41 is heated and vaporized, and the vaporized medium enters the first part of the first pipeline 7, and heat exchanges with the refrigerant in the first condenser 3 and liquefies. Under the action of gravity, the liquefied medium can flow back to the first sub-pipeline 41 from the first part of the first pipeline 7 through the two-way throttle valve or the four-way valve 9 to form a circulating loop. After the medium in the second sub-pipeline 42 exchanges heat with the second evaporator 302, the medium in the second sub-pipeline 42 is heated and vaporized, and the vaporized medium enters the first part of the third pipeline 8, and heat exchanges with the refrigerant in the second condenser 6 and liquefies. Under the action of gravity, the liquefied medium can flow back to the second sub-pipeline 42 from the first part of the third pipeline 8 through the two-way throttle valve or the four-way valve 9 to form a circulating loop.

[0050] The adsorption refrigeration device may also include a second partition component 31 and a third partition component 32, wherein the second partition component 31 is arranged in the first chamber, and the third partition component 32 is arranged in the second chamber, and the second partition component 31 and the third partition component 32 are both connected to the first partition component 30, and the second partition component 31 and the first partition component 30 form a first accommodating space, and the opening of the first accommodating space faces away from the bottom of the first chamber, and the second condenser 6 can be arranged in the first accommodating space, and the bottom of the first accommodating space can be provided with an opening corresponding to the bottom of the first chamber, so that the liquid formed in the first accommodating space can flow into the bottom of the first chamber; the third partition component 32 and the first partition component 30 can form a second accommodating space, and the opening of the second accommodating space faces away from the bottom of the second chamber, and the first condenser 5 can be arranged in the second accommodating space, and the bottom of the second accommodating space can be provided with an opening corresponding to the bottom of the second chamber, so that the liquid formed in the second accommodating space can flow into the bottom of the second accommodating chamber.

[0051] Please note that, please refer to Figure 2 , Figure 3 and Figure 5The adsorption refrigeration device may also include a twelfth pipeline 22, a thirteenth pipeline 23, a fourteenth pipeline 24, a fifteenth pipeline 25, a fifth valve body 26 and a sixth valve body 27; one end of the twelfth pipeline 22 can be connected to the fifth valve body 26, and the other end of the twelfth pipeline 22 can be connected to the second valve body 15, one end of the thirteenth pipeline 23 can be connected to the fifth valve body 26, and the other end of the thirteenth pipeline 23 can be connected to the sixth valve body 27, one end of the fourteenth pipeline 24 can be connected to the sixth valve 27, and the other end of the fourteenth pipeline 24 can be connected to the first adsorption bed 1, one end of the fifteenth pipeline 25 can be connected to the sixth valve body 27, and the other end of the fifteenth pipeline 25 can be connected to the second adsorption bed 2. Specifically, when the adsorption refrigeration device has sufficient heat source and the refrigerant can enter the fourth pipeline 10 through the first valve body 14, the refrigerant enters the first condenser 5 through the fourth pipeline 10 and then enters the first adsorption bed 1, and flows out from the second valve body 15 through the sixth pipeline 12, the heat source can enter through the fifth valve body 26, enter the second adsorption bed 2 through the twelfth pipeline 22, the second valve body 15, and the seventh pipeline 13, and flow out from the fifth valve body 26 after the fourteenth pipeline 24, the sixth valve body 27, and the thirteenth pipeline 23. At this time, the seventh pipeline 13 is reused as the water inlet pipe of the heat source. In addition, when the refrigerant enters the fifth pipeline 11 through the first valve body 14, enters the second condenser 6 through the fifth pipeline 11, and then enters the second adsorption bed 2, and flows out from the second valve body 15 through the seventh pipeline 13, the heat source can enter through the fifth valve body 26, enter the first adsorption bed 1 through the twelfth pipeline 22, the second valve body 15, and the sixth pipeline 12, and flow out from the fifth valve body 26 after the fifteenth pipeline 25, the sixth valve body 27, and the thirteenth pipeline 23. At this time, the sixth pipeline 12 is reused as a water inlet pipe of the heat source. Since the heat source can be repeatedly introduced into the first adsorption bed 1 and the second adsorption bed 2, the refrigerant in the adsorbent in the first adsorption bed 1 and the second adsorption bed 2 is desorbed, and the desorbed vapor releases heat in the first condenser 5 and the second condenser 6 to condense into a low-temperature medium, and the low-temperature medium can wrap the surface of the first evaporator 301 and the second evaporator 7 to cool the heat medium in the first evaporator 301 and the second evaporator 302.

[0052] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An adsorption refrigeration device, characterized in that: include: a first adsorption bed, a first pipeline, an evaporator, and a first condenser; The first adsorption bed has an adsorption medium, the evaporator has a second pipeline and a heat medium, and the first pipeline has a medium; The inlet of the first adsorption bed is connected to the outlet of the first condenser, and the first pipeline has a first part and a second part, the first part of the first pipeline is located in the first condenser, and the outlet of the first part of the first pipeline is connected to the inlet of the second pipeline, and the second part of the first pipeline is used to connect the outlet of the second pipeline and the inlet of the first part; The inlet of the first condenser is used to receive a refrigerant, and the refrigerant passes through the first adsorption bed and flows out through the outlet of the first adsorption bed; The medium in the first part of the first pipeline is cooled by the refrigerant in the first condenser, so that the medium in the second pipeline is cooled by the medium flowing in the first pipeline; the cooled medium in the second pipeline exchanges heat with the heat medium in the evaporator, so as to cool the heat medium in the evaporator; The adsorption refrigeration device further comprises: a second adsorption bed, a third pipeline and a second condenser; The second adsorption bed has an adsorption medium in it, and the third pipeline has a medium in it; The inlet of the second adsorption bed is connected to the outlet of the second condenser, and the third pipeline has a first part and a second part, the first part of the third pipeline is located in the second condenser, and the second part of the third pipeline is used to connect the outlet of the second pipeline and the inlet of the first part of the third pipeline; The inlet of the second condenser is used to receive a refrigerant, and the refrigerant passes through the second adsorption bed and flows out through the outlet of the second adsorption bed; The medium in the first part of the third pipeline is cooled by the refrigerant in the second condenser, so that the medium in the second pipeline is cooled by the medium flowing in the third pipeline; the cooled medium in the second pipeline exchanges heat with the heat medium in the evaporator, so as to cool the heat medium in the evaporator; The first pipeline does not pass through the first adsorption bed, and the third pipeline does not pass through the second adsorption bed.

2. The adsorption refrigeration device according to claim 1, characterized in that: The evaporator includes a first evaporator and a second evaporator, and the second pipeline includes a first sub-pipeline and a second sub-pipeline; The first sub-pipeline is located in the first evaporator, the inlet of the first sub-pipeline is used to communicate with the outlet of the first part of the first pipeline, and the outlet of the first sub-pipeline is communicated with the inlet of the second part of the first pipeline; The second sub-pipeline is located in the second evaporator, the inlet of the second sub-pipeline is used to communicate with the outlet of the first part of the third pipeline, and the outlet of the second sub-pipeline is communicated with the inlet of the second part of the third pipeline.

3. The adsorption refrigeration device according to claim 2, characterized in that: The adsorption refrigeration device further comprises a four-way valve, which is connected to the inlet of the first sub-pipeline and the outlet of the first part of the first pipeline, and is also connected to the inlet of the second sub-pipeline and the outlet of the first part of the third pipeline.

4. The adsorption refrigeration device according to claim 2, characterized in that: The adsorption refrigeration device also includes two two-way throttle valves, one of the two two-way throttle valves is connected to the outlet of the first part of the first pipeline and the inlet of the first sub-pipeline, and the other of the two two-way throttle valves is connected to the outlet of the first part of the third pipeline and the inlet of the second sub-pipeline.

5. The adsorption refrigeration device according to any one of claims 2 to 4, characterized in that: In the vertical direction, the first evaporator is located below the first adsorption bed and the first condenser, and the second evaporator is located below the second adsorption bed and the second condenser.

6. The adsorption refrigeration device according to any one of claims 2 to 4, characterized in that: A compressor is arranged on the first pipeline and / or the third pipeline.

7. The adsorption refrigeration device according to any one of claims 2 to 4, characterized in that: The adsorption refrigeration device further includes a fourth pipeline, a fifth pipeline, a sixth pipeline, a seventh pipeline, a first valve body and a second valve body; The two ends of the fourth pipeline are respectively communicated with the first valve body and the inlet of the first condenser, the two ends of the fifth pipeline are respectively communicated with the first valve body and the inlet of the second condenser, the two ends of the sixth pipeline are respectively communicated with the second valve body and the outlet of the first adsorption bed, and the two ends of the seventh pipeline are respectively communicated with the second valve body and the outlet of the second adsorption bed; The first condenser is used to connect the refrigerant, and the refrigerant passes through the fourth pipeline and the first condenser in sequence, enters the first adsorption bed, and flows out through the sixth pipeline; The second condenser is used to connect the refrigerant, and the refrigerant passes through the fifth pipeline and the second condenser in sequence, enters the second adsorption bed, and flows out through the seventh pipeline.

8. The adsorption refrigeration device according to any one of claims 2 to 4, characterized in that: The adsorption refrigeration device further includes an eighth pipeline, a ninth pipeline, a tenth pipeline, an eleventh pipeline, a third valve body and a fourth valve body; The two ends of the eighth pipeline are respectively connected to the third valve body and the inlet of the first evaporator, and the two ends of the ninth pipeline are respectively connected to the fourth valve body and the outlet of the first evaporator; the two ends of the tenth pipeline are respectively connected to the third valve body and the inlet of the second evaporator, and the two ends of the eleventh pipeline are respectively connected to the fourth valve body and the outlet of the second evaporator.

9. The adsorption refrigeration device according to any one of claims 2 to 4, characterized in that: The adsorption refrigeration device further includes a shell, and the first adsorption bed, the second adsorption bed, the first evaporator, the second evaporator, the first condenser and the second condenser are all arranged in the shell.

10. The adsorption refrigeration device according to claim 9, characterized in that: A first partition component is disposed in the shell, and the first partition component divides the shell into a first chamber and a second chamber, the first evaporator, the first adsorption bed and the second condenser are disposed in the first chamber, the first evaporator is disposed at the bottom of the first chamber, and the first adsorption bed and the second condenser are located on a side of the first evaporator away from the bottom of the first chamber; The second evaporator, the second adsorption bed and the first condenser are arranged in the second chamber, the second evaporator is arranged at the bottom of the second chamber, and the second adsorption bed and the first condenser are located on the side of the second evaporator away from the bottom of the second chamber.

11. The adsorption refrigeration device according to claim 10, characterized in that: A second partition assembly is disposed in the first chamber, the second partition assembly is connected to the first partition assembly, the second partition assembly and the first partition assembly form a first accommodation space with an opening facing away from the bottom of the first chamber, the second condenser is disposed in the first accommodation space, a first opening is disposed at the bottom of the first accommodation space, and the first opening corresponds to the bottom of the first chamber; A third partition component is disposed in the second chamber, and the third partition component is connected to the first partition component. The third partition component and the first partition component form a second storage space with an opening facing away from the bottom of the second chamber. The first condenser is disposed in the second storage space, and a second opening is provided at the bottom of the second storage space, and the second opening corresponds to the bottom of the second chamber.

12. The adsorption refrigeration device according to any one of claims 2 to 4, characterized in that: The flow direction of the inner medium in the loop formed by the first sub-pipeline and the first pipeline is opposite to the flow direction of the inner medium in the first evaporator and the first condenser; The flow direction of the inner medium in the loop formed by the second sub-pipeline and the third pipeline is opposite to the flow direction of the inner medium in the second evaporator and the second condenser.

Images