Display panel, display device and method for manufacturing display panel

Abstract

The present application provides a display panel, a display device, and a method for manufacturing a display panel. The display panel includes a substrate, a first conductive portion, a second conductive portion, and a bonding block. The first conductive portion is disposed on one side of the substrate. The first conductive portion includes a first sub-portion and a second sub-portion stacked, the first sub-portion is located on the side of the second sub-portion away from the substrate, and the first sub-portion includes a main body portion located on the side of the second sub-portion away from the substrate and a protruding portion that extends beyond the second sub-portion in a first direction, and the first direction is parallel to the plane of the substrate. A part of the second conductive portion is located on the side of the protruding portion away from the main body portion in the first direction and is electrically connected to the first conductive portion, a part of the second conductive portion is located on the side of the first sub-portion away from the substrate, and at least partially overlaps with the first sub-portion in the orthographic projection on the substrate. The bonding block is at least partially located on the side of the first conductive portion close to the second conductive portion along the first direction and is disposed in contact with the second conductive portion. The embodiments of the present application can reduce the risk of breakage of the second conductive portion and ensure reliable connection between the first conductive portion and the second conductive portion.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] In the existing display device technology, display panels are mainly divided into two mainstream technologies: liquid crystal display panels and organic self-luminous display panels. As people's requirements for display panels gradually increase, the frame size of display panels is gradually reduced. However, during the production process, due to the limitation of the frame size of the display panel, it is easy to have poor preparation of the metal layer, which affects the product yield. Summary of the invention

[0003] The embodiments of the present application provide a display panel, a display device and a method for manufacturing a display panel, which can improve and reduce the risk of fracture of a conductive structure.

[0004] In a first aspect, an embodiment of the present application provides a display panel, which includes a substrate, a first conductive portion, a second conductive portion, and a jumper. The first conductive portion is arranged on one side of the substrate, and the first conductive portion includes a first sub-portion and a second sub-portion arranged in a stacked manner, the first sub-portion is located on the side of the second sub-portion away from the substrate, and the first sub-portion includes a main body portion located on the side of the second sub-portion away from the substrate and a protrusion extending beyond the second sub-portion in a first direction, and the first direction is parallel to the plane where the substrate is located. The second conductive portion is partially located on the side of the protrusion away from the main body portion in the first direction and is electrically connected to the first conductive portion, and the second conductive portion is partially located on the side of the first sub-portion away from the substrate, and at least partially overlaps with the orthographic projection of the first sub-portion on the substrate. The jumper is at least partially located on the side of the first conductive portion close to the second conductive portion along the first direction, and is arranged in contact with the second conductive portion.

[0005] In some embodiments, the bridge block includes a first portion and a second portion connected to each other, the orthographic projection of the first portion on the substrate is located outside the orthographic projection of the first conductive portion on the substrate, the second portion is located on a side of the first conductive portion away from the substrate, and the orthographic projection of the second portion on the substrate is located inside the orthographic projection of the first conductive portion on the substrate

[0006] In some embodiments, the protruding portion and the second sub-portion together form a recessed space, and the overlapping block further includes a third portion located in the recessed space, and the third portion is connected to the first portion.

[0007] In some embodiments, the first subsection and the second subsection are made of different materials.

[0008] In some embodiments, the second portion includes a first through hole penetrating along a thickness direction of the substrate, and the second conductive portion is at least partially located in the first through hole and connected to the first conductive portion.

[0009] In some embodiments, the first portion includes a second through hole penetrating along a thickness direction, and the first through hole is connected to the second through hole in the first direction.

[0010] In some embodiments, there are multiple first through holes, and the multiple first through holes are spaced apart along a second direction. The second direction is parallel to the plane where the substrate is located and intersects with the first direction.

[0011] In some embodiments, the thickness of the first portion tends to gradually increase in a direction approaching the first conductive portion.

[0012] In some embodiments, in a direction approaching the first conductive portion, the thickness of the first portion increases gradually or linearly.

[0013] In some embodiments, the second conductive portion includes a third sub-portion located on a side of the first conductive portion away from the substrate, and an orthographic projection of the third sub-portion on the substrate is at least partially located outside an orthographic projection of the connecting block on the substrate to connect with the first conductive portion.

[0014] In some embodiments, the straps include a conductive material.

[0015] In some embodiments, the bridge blocks are transparent structures.

[0016] In some embodiments, the maximum thickness H1 of the connecting block is greater than the maximum thickness H2 of the first conductive portion.

[0017] In some embodiments, H1 ≥ 2H2.

[0018] In some embodiments, 3H2≥H1.

[0019] In some embodiments, the display panel has a display area and a non-display area located outside the display area, and the display panel further includes a driving chip located in the non-display area;

[0020] The first conductive part includes a touch line, the second conductive part includes a touch electrode, the second conductive part is at least partially located in the display area, the first conductive part is located in the non-display area, and the second conductive part is electrically connected to the driver chip through the first conductive part. In a second aspect, an embodiment of the present application provides a display device, including a display panel in any of the aforementioned embodiments.

[0021] In a third aspect, an embodiment of the present application provides a method for preparing a display panel, comprising:

[0022] forming a second sub-portion on one side of the substrate;

[0023] A first sub-section is formed on a side of the second sub-section away from the substrate, wherein the first sub-section includes a main body located on a side of the second sub-section away from the substrate and a protruding portion extending beyond the second sub-section in a first direction, wherein the first direction is parallel to a plane where the substrate is located;

[0024] Form a lapping block on one side of the substrate, and at least part of the lapping block is located on the side of the protruding portion away from the main body portion along the first direction;

[0025] Form a second conductive portion on one side of the substrate, and a part of the second conductive portion is attached to the lapping block and extends to the side of the first sub-portion away from the substrate, and is electrically connected to the first sub-portion.

[0026] The embodiments of the present application provide a display panel, a display device and a preparation method of the display panel. By arranging at least part of the lapping block on the side of the first conductive portion close to the second conductive portion along the first direction, the concave space formed by the protruding portion can be blocked by the lapping block. Thus, when the second conductive portion climbs, the second conductive portion can be supported by the lapping block, thereby reducing the risk of breakage of the second conductive portion and improving the connection reliability between the first conductive portion and the second conductive portion. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0028] Figure 1 is a schematic structural diagram of a display panel provided by an embodiment of the present application;

[0029] Figure 2 is Figure 1 an enlarged structural diagram of region Q in

[0030] Figure 3 is Figure 2 a cross-sectional structural diagram taken along A-A in

[0031] Figure 4 is an enlarged structural diagram of region Q of another display panel provided by an embodiment of the present application;

[0032] Figure 5 is Figure 4 a cross-sectional structural diagram taken along B-B in

[0033] Figure 6 is a cross-sectional structural diagram of another display panel provided by an embodiment of the present application;

[0034] Figure 7 is a schematic structural diagram of the lapping block in another display panel provided by an embodiment of the present application;

[0035] Figure 8 is Figure 7 a cross-sectional structural diagram taken at C-C in

[0036] Figure 9 It is a schematic structural diagram of a lapping block in another display panel provided by an embodiment of the present application;

[0037] Figure 10 It is a schematic structural diagram of a lapping block in another display panel provided by an embodiment of the present application;

[0038] Figure 11 It is a schematic cross-sectional structural diagram of another display panel provided by an embodiment of the present application;

[0039] Figure 12 It is a schematic structural diagram of a display device provided by an embodiment of the present application;

[0040] Figure 13 It is a flowchart of a method for manufacturing a display panel provided by an embodiment of the present application;

[0041] Figure 14a - 14d It is a schematic structural diagram of the process of a method for manufacturing a display panel provided by an embodiment of the present application.

[0042] Marking description:

[0043] 1. Substrate;

[0044] 2. First conductive part; 21. First sub-part; 22. Second sub-part;

[0045] 3. Second conductive part; 31. Third sub-part; 32. Fourth sub-part; 33. Fifth sub-part;

[0046] 4. Lapping block; 41. First part; 411. Second through-hole; 42. Second part; 421. First through-hole; 43. Third part;

[0047] 5. Planarization layer;

[0048] AA. Display area; NA. Non-display area;

[0049] A1. Recessed space;

[0050] B. Body part; T. Protruding part;

[0051] X. First direction; Y. Second direction; Z. Thickness direction. Detailed implementation manners

[0052] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0053] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0054] Display panels are usually arranged with a conductive layer for signal transmission. Due to impedance limitations, different conductive materials are often used to form the conductive layer. During the preparation of the conductive layer, due to the different etching rates of the etching solution on different conductive materials, it is easy to cause the conductive material in the middle or at the bottom to be etched too much, resulting in a concave structure at the edge of the conductive layer. When the conductive layer is overlapped with other structures, it is easy to cause the other structures to have a climbing fracture problem on the edge of the conductive layer, affecting the connection effect between the two.

[0055] To solve the above problems, see Figures 1 to 3 The embodiment of the present application provides a display panel, including a substrate 1, a first conductive part 2, a second conductive part 3 and a bridge block 4. The first conductive part 2 is arranged on one side of the substrate 1, and the first conductive part 2 includes a first sub-part 21 and a second sub-part 22 that are stacked, the first sub-part 21 is located on the side of the second sub-part 22 away from the substrate 1, and the first sub-part 21 includes a main body part B located on the side of the second sub-part 22 away from the substrate 1 and a protrusion T that exceeds the second sub-part 22 in a first direction X, and the first direction X is parallel to the plane where the substrate 1 is located.

[0056] The second conductive part 3 is located on the side of the protruding part T away from the main body part B in the first direction X and is electrically connected to the first conductive part 2. The second conductive part 3 is located on the side of the first sub-part 21 away from the substrate 1, and at least partially overlaps with the first sub-part 21 in the orthographic projection on the substrate 1.

[0057] The overlapping block 4 is at least partially located on the side of the first conductive part 2 close to the second conductive part 3 in the first direction X, and is arranged in contact with the second conductive part 3.

[0058] The substrate 1 can be rigid, such as a glass substrate, or flexible, such as a polyimide (PI) substrate. The first conductive part 2 and the second conductive part 3 are located on the same side of the substrate 1 and are electrically connected to each other, that is, the driving signal on the first conductive part 2 can be transmitted to the second conductive part 3, and at the same time, the driving signal on the second conductive part 3 can also be transmitted to the first conductive part 2. Among them, there may be multiple functional film layers between the first conductive part 2 and the substrate 1, and the functional film layers include but are not limited to the planarization layer 5 and the light-emitting device layer, etc.

[0059] Regarding the specific positions and specific functions of the first conductive part 2 and the second conductive part 3, the embodiments of the present application do not make limitations. Exemplarily, the display panel includes a display area AA and a non-display area NA surrounding the outer peripheral side of the display area AA. The first conductive part 2 is located in the non-display area NA and is electrically connected to the driving chip, and the second conductive part 3 is located in the display area AA and is electrically connected to the pixel circuit. The first conductive part 2 and the second conductive part 3 are used to transmit the driving signal sent by the driving chip to the pixel circuit to control the display panel to emit light or go out.

[0060] The first conductive part 2 includes a first sub-part 21 and a second sub-part 22 arranged in a stacked manner, and the materials of the first sub-part 21 and the second sub-part 22 are different. When preparing the first conductive part 2, first, the second sub-part 22 is patterned by etching technology, and then the first sub-part 21 is patterned by etching technology on the side of the second sub-part 22 away from the substrate 1. Ideally, the orthographic projection contours of the patterned second sub-part 22 and the first sub-part 21 on the substrate 1 overlap. However, in the actual preparation process, due to the different etching rates of the etching solution for different materials, the first sub-part 21 after etching at least partially extends beyond the second sub-part 22 in the first direction X, that is, a protruding part T that extends beyond the second sub-part 22 appears in the first sub-part 21. Among them, the orthographic projection of the main body part B on the substrate 1 at least partially overlaps with the orthographic projection of the second sub-part 22 on the substrate 1, and the orthographic projection of the protruding part T on the substrate 1 is located outside the orthographic projection of the second sub-part 22 on the substrate 1.

[0061] The second conductive part 3 at least includes a fourth sub-part 32, a third sub-part 31 and a fifth sub-part 33, wherein the fourth sub-part 32 is arranged in the same layer as the first conductive part 2 and is located on one side of the first conductive part 2 in the first direction X. The third sub-part 31 is located on the side of the first conductive part 2 away from the substrate 1, and the third sub-part 31 is electrically connected to the first conductive part 2 to achieve electrical connection between the first conductive part 2 and the second conductive part 3. The fifth sub-part 33 and the fourth sub-part 32 are located on the same side of the first conductive part 2 in the first direction X, and the two ends of the fifth sub-part 33 are respectively connected to the fourth sub-part 32 and the third sub-part 31.

[0062] The protrusion T and the second sub-portion 22 together form a recessed space A1. Figure 3 In the figure, the recessed space A1 is indicated by a dotted box. Due to the existence of the recessed space A1, when the second conductive part 3 overlaps with the first conductive part 2, the fifth sub-part 33 located at the recessed space A1 cannot be supported, so that the risk of breaking is prone to occur, affecting the reliability of the electrical connection between the first conductive part 2 and the second conductive part 3.

[0063] To this end, the embodiment of the present application adds a bridge block 4, and the bridge block 4 is at least partially located on the side of the first conductive part 2 close to the second conductive part 3 along the first direction X. Specifically, the bridge block 4 is at least partially located between the first conductive part 2 and the fourth sub-part 32. The bridge block 4 can play a role in shielding the recessed space A1. Furthermore, since the second conductive part 3 is fitted with the bridge block 4, the fifth sub-part 33 in the second part 42 can extend along the bridge block 4 to the side of the first conductive part 2 away from the substrate 1, and connect with the third sub-part 31. The presence of the bridge block 4 can reduce the risk of the second conductive part 3 breaking. The embodiment of the present application does not limit the specific material of the bridge block 4.

[0064] In summary, the embodiment of the present application positions the jump block 4 at least partially along the first direction X on the side of the first conductive part 2 close to the second conductive part 3, so that the recessed space A1 formed by the protrusion T can be blocked by the jump block 4. Therefore, when the second conductive part 3 climbs the slope, the second conductive part 3 can be supported by the jump block 4, thereby reducing the risk of the second conductive part 3 breaking and improving the connection reliability between the first conductive part 2 and the second conductive part 3.

[0065] It should be noted that the first conductive part 2 includes but is not limited to the first sub-part 21 and the second sub-part 22, that is, the first conductive part 2 can be formed by stacking three or more conductive structures. In addition, in addition to the first sub-part 21 and the second sub-part 22 having different materials, which causes the first sub-part 21 to at least partially exceed the second sub-part 22 in the first direction X, the first sub-part 21 and the second sub-part 22 may also have different sizes in the first direction X due to other reasons. Therefore, the materials of the first sub-part 21 and the second sub-part 22 are not limited in the embodiment of the present application. The first sub-part 21 can be made of the same material as the second sub-part 22, or different materials, as long as the first sub-part 21 at least partially exceeds the second sub-part 22 in the first direction X.

[0066] In some embodiments, see Figure 4 and Figure 5 The jumper block 4 includes a first part 41 and a second part 42 which are connected to each other, the orthographic projection of the first part 41 on the substrate 1 is located outside the orthographic projection of the first conductive part 2 on the substrate 1, the second part 42 is located on the side of the first conductive part 2 away from the substrate 1, and the orthographic projection of the second part 42 on the substrate 1 is located within the orthographic projection of the first conductive part 2 on the substrate 1.

[0067] The first portion 41 covers one side of the edge of the first conductive portion 2 in the first direction X and can shield the recessed space A1. The existence of the first portion 41 enables the second conductive portion 3 to be supported by the first portion 41 during the climbing process, thereby reducing the risk of the second conductive portion 3 breaking.

[0068] The second portion 42 covers one side of the edge of the first conductive portion 2 in the thickness direction Z of the substrate 1, the first portion 41 and the second portion 42 can completely cover the edge of the first conductive portion 2 in the first direction X, the fifth sub-portion 33 in the second conductive portion 3 is attached to the first portion 41, and at least part of the third sub-portion 31 in the second conductive portion 3 is attached to the second portion 42, and can achieve electrical connection with the first conductive portion 2. Among them, the third sub-portion 31 can directly contact the first conductive portion 2 to achieve electrical connection with the first conductive portion 2, or the third sub-portion 31 can also achieve electrical connection with the first conductive portion 2 through the second portion 42, and the embodiment of the present application is not limited to this.

[0069] In some embodiments, see Figure 6 The overlapping block 4 further includes a third portion 43 located in the recessed space A1 , and the third portion 43 is connected to the first portion 41 .

[0070] The third portion 43 of the overlapping block 4 is filled in the recessed space A1. Exemplarily, the overlapping block 4 may include some material with strong fluidity so that at least part of the material can enter and fill in the recessed space A1, thereby forming the third portion 43 of the overlapping block 4.

[0071] The presence of the third part 43 can help the overlapping block 4 better cover the concave space A1, thereby further reducing the risk of breakage of the second conductive part 3 and improving the connection reliability between the first conductive part 2 and the second conductive part 3.

[0072] In some embodiments, the materials of the first sub - part 21 and the second sub - part 22 are different. Due to the different materials of the two, during the preparation process of the display panel, the etching rates of the first sub - part 21 and the second sub - part 22 by the etching solution are different, resulting in at least a part of the first sub - part 21 exceeding the second sub - part 22 in the first direction X after etching, that is, a protruding part T exceeding the second sub - part 22 appears in the first sub - part 21.

[0073] In some embodiments, please refer to Figure 7 and Figure 8 , the second part 42 includes a first through - hole 421 penetrating along the thickness direction Z of the substrate 1, and at least a part of the second conductive part 3 is located in the first through - hole 421 and is connected to the first conductive part 2. In Figure 7 , the first through - hole 421 is schematically shown in the form of a square.

[0074] As can be seen from the foregoing, in the second conductive part 3, the third sub - part 31 needs to be electrically connected to the first conductive part 2, and at least a part of the third sub - part 31 is located on the side of the second part 42 away from the substrate 1. In order to realize the electrical connection between the first conductive part 2 and the second conductive part 3, in the embodiment of the present application, a first through - hole 421 is provided on the second part 42, and the first through - hole 421 penetrates the second part 42 along the thickness direction Z. When preparing the second conductive part 3, at least the material in the second conductive part 3 will fill into the first through - hole 421, thereby realizing the electrical connection between the first conductive part 2 and the second conductive part 3.

[0075] It should be noted that, in the embodiment of the present application, the overlapping block 4 can be a conductive material or an insulating material. When the overlapping block 4 is an insulating material, the first conductive part 2 and the second conductive part 3 are connected to each other through the first through - hole 421; when the overlapping block 4 is a conductive material, the first conductive part 2 and the second conductive part 3 can be connected to each other through the first through - hole 421, or the electrical signal can be transmitted through the overlapping block 4.

[0076] In some embodiments, please refer to Figure 9 , the first part 41 includes a second through - hole 411 penetrating along the thickness direction, and the first through - hole 421 is communicated with the second through - hole 411 in the first direction X.

[0077] The second through hole 411 penetrates through the first part 41 in the thickness direction. At least part of the material in the second conductive part 3 can also be filled into the first part 41 and electrically connected to the second conductive part 3. Among them, the first through hole 421 on the second part 42 and the second through hole 411 on the first part 41 communicate with each other in the first direction X. Therefore, the first through hole 421 and the second through hole 411 can be formed simultaneously in the same process. Further, optionally, the second through hole 411 penetrates through the first part 41 in the first direction X, and this design makes at least part of the structure in the overlapping block 4 a zigzag structure.

[0078] In some embodiments, the number of the first through holes 421 is multiple, and the multiple first through holes 421 are arranged at intervals in the second direction Y. The second direction Y is parallel to the plane where the substrate 1 is located and intersects with the first direction X. Exemplarily, the first direction X is perpendicular to the second direction Y.

[0079] The number of the first through holes 421 is multiple, and the multiple first through holes 421 can improve the connection effect between the first conductive part 2 and the second conductive part 3 and improve the reliability of signal transmission between the first conductive part 2 and the second conductive part 3. The cross-sectional shape of the first through holes 421 includes but is not limited to circular, square, polygonal, etc. For the dimensions of each first through hole 421 and the distance between adjacent first through holes 421, the embodiments of the present application do not make limitations. Optionally, the multiple first through holes 421 are equidistantly arranged in the second direction Y.

[0080] In some alternative embodiments, please refer to Figure 10 , the number of the second through holes 411 is also multiple, and the multiple first through holes 421 and the multiple second through holes 411 are correspondingly arranged and communicate with each other. Further, optionally, the second through hole 411 penetrates through the first part 41 in the first direction X, and the first through hole 421 penetrates through the second part 42 in the first direction X. Under this design, the overlapping block 4 has a plurality of strip-shaped structures arranged separately, and the plurality of strip-shaped structures are arranged side by side in the second direction Y. This design can increase the contact area between the first conductive part and the second conductive part, thereby reducing the overlapping impedance.

[0081] In some embodiments, as Figure 3 shown, in the direction close to the first conductive part 2, the thickness of the first part 41 shows a gradually increasing trend.

[0082] The statement in the embodiments of the present application that "in the direction close to the first conductive part 2, the thickness of the first part 41 shows a gradually increasing trend" means that in the direction parallel to the first direction X and pointing to the first conductive part 2, the dimension of the first part 41 in the thickness direction Z shows a gradually increasing trend.

[0083] The fifth sub - part 33 in the second conductive part 3 needs to extend along the surface of the first part 41 and away from the substrate 1 to contact and connect with the third sub - part 31. On this basis, in the embodiments of the present application, the size of the first part 41 is restricted such that the thickness dimension of the first part 41 shows a gradually changing trend. Compared with the scheme of sudden thickness change, the embodiments of the present application can further reduce the risk of the fifth sub - part 33 breaking and improve the connection reliability between the first conductive part 2 and the second conductive part 3. Optionally, in the direction close to the first conductive part 2, the thickness of the first part 41 increases in a gradient or linearly.

[0084] In some embodiments, referring to Figure 11 , the orthographic projection of the third sub - part 31 on the substrate 1 is at least partially located outside the orthographic projection of the overlapping block 4 on the substrate 1 to connect with the first conductive part 2. In other words, the third sub - part 31 at least partially extends beyond the second part 42 in the first direction X, and the part of the third sub - part 31 that extends beyond the second part 42 can be in direct contact with the first conductive part 2, thereby realizing the electrical connection between the first conductive part 2 and the second conductive part 3.

[0085] In the embodiments of the present application, the orthographic projection of the overlapping block 4 on the substrate 1 is completely located within the orthographic projection of the second conductive part 3 on the substrate 1. During the manufacturing process, the size of the overlapping block 4 in the first direction X can be appropriately reduced so that the second conductive part 3 can exceed the overlapping block 4 in the first direction X, thereby realizing the contact connection between the first conductive part 2 and the second conductive part 3. This design can further reduce the influence of the overlapping block 4 on the impedance, thereby improving the signal transmission effect between the first conductive part 2 and the second conductive part 3.

[0086] In some embodiments, the overlapping block 4 includes a conductive material.

[0087] Since the overlapping block 4 itself has a conductive effect, the first conductive part 2 and the second conductive part 3 can realize the signal transmission function through the overlapping block 4 without the need to contact - connect the first conductive part 2 and the second conductive part 3. On this basis, in the embodiments of the present application, the orthographic projection of the third sub - part 31 on the substrate 1 can be arranged within the orthographic projection of the second part 42 on the substrate 1, that is, the entire third sub - part 31 is attached to the overlapping block 4.

[0088] In some embodiments, the overlapping block 4 is a transparent structure.

[0089] For a display panel, the overlapping position of the first conductive part 2 and the second conductive part 3 can be located within the display area AA. In order to reduce the influence of the overlapping block 4 on the display effect in the display panel, in the embodiments of the present application, the overlapping block 4 is set as a transparent structure to increase the transmittance of the display panel at the position of the overlapping block 4.

[0090] It should be noted that in the embodiments of the present application, at least one of the first conductive part 2 and the second conductive part 3 can be a transparent conductive structure. Exemplarily, the first conductive part 2 is located in the non-display area NA, the first conductive part 2 is a conductive metal structure, the second conductive part 3 is located in the display area AA, and the second conductive part 3 is a transparent conductive structure.

[0091] In some embodiments, the maximum thickness H1 of the overlapping block 4 is greater than the maximum thickness H2 of the first conductive part 2.

[0092] In the prior art, the second conductive part 3 is prone to break at the position of the concave space A1, mainly because the relative thickness of the second conductive part 3 is relatively thin. Therefore, the self-strength of the second conductive part 3 is insufficient, and without support, the second conductive part 3 is prone to the risk of breakage. Similarly, if the thickness of the overlapping block 4 itself is too small, the overlapping block 4 is also prone to break at the position of the concave space A1 and cannot support the second conductive part 3 effectively.

[0093] On this basis, in the embodiments of the present application, the maximum thickness H1 of the overlapping block 4 is set to be greater than the maximum thickness H2 of the first conductive part 2, thereby reducing the risk of the overlapping block 4 breaking and improving the supporting effect of the overlapping block 4 on the second conductive part 3. Optionally, H1≥2H2.

[0094] In some embodiments, 3H2≥H1. The thickness of the overlapping block 4 affects the thickness of the display panel. Therefore, if the thickness of the overlapping block 4 is too large, it is likely to cause the overall thickness of the display panel to be too large, which is not conducive to the user experience. Therefore, in the embodiments of the present application, H1 is set to be less than or equal to 3H2, so as to reduce the overall thickness of the display panel and improve the user experience of the display panel while meeting the requirement of being able to support the second conductive part 3.

[0095] In some embodiments, the display panel further includes a driving chip located in the non-display area NA. The first conductive part 2 includes touch traces, the second conductive part 3 includes touch electrodes, at least a part of the second conductive part 3 is located in the display area AA, the first conductive part 2 is located in the non-display area NA, and the second conductive part 3 is electrically connected to the driving chip through the first conductive part 2.

[0096] Both the touch traces and the touch electrodes are located in the touch metal layer and are used to achieve the touch effect of the display panel. Among them, the touch electrodes in the second conductive part 3 can sense the touch information of the user. The touch traces in the first conductive part 2 are used to electrically connect the second conductive part 3 and the driving chip, and are used to transmit the touch information obtained by the touch electrodes to the driving chip, and obtain the specific touch coordinates through the processing of the driving chip, so as to make the display panel give corresponding feedback.

[0097] The second conductive part 3 is located within the display area AA. The second conductive part 3 can be made of indium tin oxide (ITO) material. The first conductive part 2 is located within the non-display area NA and can be made of a multi-layer metal structure. Exemplarily, the first conductive part 2 includes a three-layer metal structure arranged in layers, namely molybdenum metal, aluminum metal, and molybdenum metal. Among them, the materials of the first sub-part 21 and the second sub-part 22 are different. The first sub-part 21 includes molybdenum metal, and the second sub-part 22 includes aluminum metal.

[0098] In the embodiment of the present application, by adding a lap joint block 4 within the touch metal layer, the risk of breakage of the second conductive part 3 is reduced, thereby enhancing the connection reliability between the first conductive part 2 and the second conductive part 3, and ensuring that the display panel has a stable touch sensing effect.

[0099] In a second aspect, please refer to Figure 12 , the embodiment of the present application provides a display device, including the display panel in any of the foregoing embodiments.

[0100] The display device provided by the embodiment of the present application has the beneficial effects of the display panel in any of the foregoing embodiments. For specific content, please refer to the description of the beneficial effects of the display panel above. The embodiment of the present application will not be elaborated here.

[0101] In a third aspect, please refer to Figure 13 and FIG. 14, the embodiment of the present application provides a method for manufacturing a display panel, including:

[0102] S100: Form a second sub-part on one side of the substrate;

[0103] Please refer to Figure 14a , in step S100, the second sub-part 22 can be patterned by an etching technique and formed on one side of the substrate 1. Optionally, the display panel includes a display area and a non-display area located on the periphery of the display area, and the second sub-part 22 is located within the non-display area.

[0104] S110: Form a first sub-part on the side of the second sub-part facing away from the substrate. The first sub-part includes a main body part located on the side of the second sub-part away from the substrate and a protruding part that extends beyond the second sub-part in a first direction. The first direction is parallel to the plane where the substrate is located.

[0105] Please refer to Figure 14bIn step S110, the first sub-portion 21 can also be patterned by etching technology. Due to the difference in materials or other factors between the first sub-portion 21 and the second sub-portion 22, during the preparation of the first sub-portion 21, the etching rate of the etching liquid on the first sub-portion 21 and the second sub-portion 22 is different, resulting in the first sub-portion 21 after etching at least partially exceeding the second sub-portion 22 in the first direction X, thereby forming a protrusion T, and the protrusion T will form a recessed space A1 together with the second sub-portion 22.

[0106] It should be noted that the first sub-portion 21 and the second sub-portion 22 can be etched simultaneously, that is, the second sub-portion 22 with a whole-surface structure and the first sub-portion 21 with a whole-surface structure are first formed in sequence on one side of the substrate 1, and then the first sub-portion 21 and the second sub-portion 22 are etched simultaneously. Since the etching rates of the etching solution on the first sub-portion 21 and the second sub-portion 22 are different, the first sub-portion 21 at least partially exceeds the second sub-portion 22 in the first direction X after the etching is completed.

[0107] S120: forming a bridge block on one side of the substrate, wherein at least a portion of the bridge block is located along the first direction on a side of the protrusion away from the main body.

[0108] See also Figure 14c In step S120, the overlap block 4 is located on one side of the first sub-section 21 and the second sub-section 22 along the first direction X, and the existence of the overlap block 4 can play a role in shielding the recessed space A1. Optionally, the overlap block 4 includes a first portion 41 and a second portion 42 connected to each other, the orthographic projection of the first portion 41 on the substrate 1 is located outside the orthographic projection of the first sub-section 21 on the substrate 1, the second portion 42 is located on the side of the first sub-section 21 away from the substrate 1, and the orthographic projection of the second portion 42 on the substrate 1 is located within the orthographic projection of the first sub-section 21 on the substrate 1.

[0109] S130: forming a second conductive portion on one side of the substrate, wherein a portion of the second conductive portion is disposed in contact with the connecting block and extends to a side of the first sub-portion away from the substrate, and is electrically connected to the first sub-portion.

[0110] See also Figure 14d In step S130, the recessed space A1 formed by the second sub-portion 22 and the portion of the first sub-portion 21 extending beyond the second sub-portion 22 can be blocked by the overlapping block 4, so that during the preparation of the second conductive portion 3, part of the structure in the second conductive portion 3 can be supported by the overlapping block 4, thereby reducing the risk of breakage of the second conductive portion 3.

[0111] Although the embodiments disclosed in this application are as above, the content described above is only an embodiment adopted for the convenience of understanding this application and is not intended to limit the present invention. Any person skilled in the art within the technical field to which this application pertains, without departing from the spirit and scope disclosed in this application, may make any modifications and changes in the form of implementation and details, but the protection scope of this application shall still be subject to the scope defined by the appended claims.

[0112] As described above, the above is only the specific implementation manner of this application. Those skilled in the art can clearly understand that for the convenience and brevity of description, the replacement of other connection manners described above and the like can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art within the technical scope disclosed in this application can easily think of various equivalent modifications or replacements, and these modifications or replacements should all be covered within the protection scope of this application.

Claims

1. A display panel, characterized in that, comprising: a substrate; a first conductive part disposed on one side of the substrate, the first conductive part includes a first sub - part and a second sub - part stacked, the first sub - part is located on the side of the second sub - part away from the substrate, and the first sub - part includes a body part on the side of the second sub - part away from the substrate and a protruding part that extends beyond the second sub - part in a first direction, the first direction being parallel to the plane of the substrate; a second conductive part, a part of the second conductive part is located on the side of the protruding part away from the body part in the first direction and is electrically connected to the first conductive part, and a part of the second conductive part is located on the side of the first sub - part away from the substrate and at least partially overlaps with the first sub - part in the orthographic projection on the substrate; a lap joint block, at least partially located on the side of the first conductive part close to the second conductive part along the first direction, and is disposed in contact with the second conductive part; the lap joint block includes a first part and a second part connected to each other, the orthographic projection of the first part on the substrate is located outside the orthographic projection of the first conductive part on the substrate, the second part is located on the side of the first conductive part away from the substrate, and the orthographic projection of the second part on the substrate is located inside the orthographic projection of the first conductive part on the substrate; the lap joint block includes a conductive material, the second conductive part includes a third sub - part on the side of the first conductive part away from the substrate, and the third sub - part is electrically connected to the first conductive part through the second part.

2. The display panel according to claim 1, characterized in that, the protruding part and the second sub - part together form a recessed space, and the lap joint block further includes a third part located in the recessed space, and the third part is connected to the first part.

3. The display panel according to claim 2, characterized in that, the materials of the first sub - part and the second sub - part are different.

4. The display panel according to claim 1, characterized in that, in the direction close to the first conductive part, the thickness of the first part shows a gradually increasing trend.

5. The display panel according to claim 4, characterized in that, in the direction close to the first conductive part, the thickness of the first part increases in a gradient or linearly.

6. The display panel according to claim 1, characterized in that, the lap joint block is a transparent structure.

7. The display panel according to claim 1, characterized in that, the maximum thickness H1 of the lap joint block is greater than the maximum thickness H2 of the first conductive part.

8. The display panel according to claim 7, characterized in that, H1 ≥ 2H2.

9. The display panel according to claim 7, characterized in that, 3H2 ≥ H1.

10. The display panel according to claim 1, characterized in that, the display panel has a display area and a non - display area located on the outer peripheral side of the display area, and the display panel further includes a driving chip located in the non - display area; The first conductive portion includes touch traces, the second conductive portion includes touch electrodes, at least a part of the second conductive portion is located in the display area, the first conductive portion is located in the non-display area, and the second conductive portion is electrically connected to the driving chip through the first conductive portion.

11. A display device, characterized in that, it includes the display panel according to any one of claims 1 to 10.

12. A method for manufacturing a display panel, characterized in that, it includes: forming a second sub-portion on one side of the substrate; forming a first sub-portion on the side of the second sub-portion away from the substrate, the first sub-portion includes a main body portion located on the side of the second sub-portion away from the substrate and a protruding portion extending beyond the second sub-portion in a first direction, the first direction is parallel to the plane of the substrate, and the stacked second sub-portion and the first sub-portion form a first conductive portion; forming a lap joint on one side of the substrate, at least a part of the lap joint is located on the side of the protruding portion away from the main body portion along the first direction, the lap joint includes a first part and a second part connected to each other, the orthographic projection of the first part on the substrate is located outside the orthographic projection of the first sub-portion on the substrate, the second part is located on the side of the first sub-portion away from the substrate, and the orthographic projection of the second part on the substrate is located inside the orthographic projection of the first sub-portion on the substrate, and the lap joint includes a conductive material; forming a second conductive portion on one side of the substrate, a part of the second conductive portion is disposed in contact with the lap joint, the second conductive portion includes a third sub-portion located on the side of the first conductive portion away from the substrate, and at least a part of the third sub-portion is in contact with the second part and is electrically connected to the first conductive portion through the second part.

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