Heat dissipation method and device, electronic device, and storage medium

Abstract

The present disclosure relates to a heat dissipation method and device, electronic equipment and storage medium. The heat dissipation method comprises: determining the heat generation position of a first electronic device, determining the first heat dissipation mode for the first electronic device based on the heat generation position; and starting heat dissipation for the first electronic device based on the first heat dissipation mode. In the present disclosure, a second electronic device can determine a heat dissipation mode with better heat dissipation effect for the first electronic device according to the heat generation position of the first electronic device, so that the heat dissipation efficiency of the first electronic device is higher.

Description

Technical Field

[0001] This disclosure relates to heat dissipation technology for electronic devices, and more particularly to a heat dissipation method and apparatus, electronic devices, and storage media. Background Technology

[0002] With the continuous improvement and development of wireless charging technology, the application of wireless charging pads for charging electronic devices is becoming increasingly widespread. Since electronic devices generate heat during charging, heat dissipation is necessary. Currently, heat dissipation methods are limited and ineffective. Summary of the Invention

[0003] This disclosure provides a heat dissipation method and apparatus, an electronic device, and a storage medium.

[0004] According to a first aspect of the present disclosure, a heat dissipation method is provided, applied in a second electronic device, the method comprising:

[0005] Determine the heat-generating location of the first electronic device, and determine a first heat dissipation method for the first electronic device based on the heat-generating location;

[0006] The first electronic device is cooled based on the first heat dissipation method.

[0007] Optionally, determining the location of the heat source in the first electronic device includes:

[0008] The location of heat generation in the first electronic device is detected by a sensor;

[0009] Alternatively, it can receive the location information of the heat source sent by the first device.

[0010] Optionally, determining the first heat dissipation method for the first electronic device based on the heat-generating location includes:

[0011] When the air outlet is in a unique location, heat is dissipated from the heat-generating location through the air outlet;

[0012] When there are two or more air outlets, the air outlet corresponding to the heat-generating position is selected for heat dissipation, or all air outlets are used for heat dissipation, or the air outlet corresponding to the heat-generating position where the heat generation exceeds a set threshold is selected for heat dissipation, or a fixed air outlet is used for heat dissipation.

[0013] Optionally, the method further includes:

[0014] Receive information about the heat dissipation status sent by the first electronic device; and / or receive a second heat dissipation method sent by the first electronic device; the second heat dissipation method may be the same as or different from the first heat dissipation method;

[0015] Based on the information about the heat dissipation status and / or the second heat dissipation method, the first heat dissipation method is combined with the first heat dissipation method to activate the heat dissipation of the first electronic device.

[0016] According to a second aspect of the present disclosure, a heat dissipation method is provided, applied in a first electronic device, the method comprising:

[0017] Upon detecting a first event, determine the location of heat generation in the first electronic device, or determine a heat dissipation method for the first electronic device based on the heat generation location; and send information about the heat generation location or the heat dissipation method to the second electronic device.

[0018] The second electronic device is triggered to activate heat dissipation for the first electronic device based on the heat-generating location or the heat dissipation method.

[0019] Optionally, the detection of the first event includes:

[0020] The first electronic device was detected to be placed at a predetermined position of the second electronic device.

[0021] Optionally, determining the heat dissipation method for the first electronic device based on the heat-generating location includes:

[0022] Detect the pose information of the first electronic device;

[0023] Based on the pose information, the relative positional relationship between the first electronic device and the second electronic device is determined, and a heat dissipation method suitable for dissipating heat from the heat-generating location is determined.

[0024] According to a third aspect of the present disclosure, a heat dissipation device is provided, applied in a second electronic device, the device comprising:

[0025] A determining unit is used to determine the heat-generating location of the first electronic device and, based on the heat-generating location, determine a first heat dissipation method for the first electronic device.

[0026] The activation unit is used to activate the heat dissipation of the first electronic device based on the first heat dissipation method.

[0027] Optionally, the determining unit is further configured to: detect the heat-generating location of the first electronic device using a sensor; or receive heat-generating location information sent by the first device.

[0028] Optionally, the opening unit is further configured to:

[0029] When the air outlet is in a unique location, heat is dissipated from the heat-generating location through the air outlet;

[0030] When there are two or more air outlets, the air outlet corresponding to the heat-generating position is selected for heat dissipation, or all air outlets are used for heat dissipation, or the air outlet corresponding to the heat-generating position where the heat generation exceeds a set threshold is selected for heat dissipation, or a fixed air outlet is used for heat dissipation.

[0031] Optionally, the device further includes:

[0032] A receiving unit is configured to receive information about the heat dissipation status sent by the first electronic device; and / or receive a second heat dissipation method sent by the first electronic device;

[0033] The determining unit is further configured to activate heat dissipation for the first electronic device based on the information of the heating state and / or the second heat dissipation method, in conjunction with the first heat dissipation method.

[0034] According to a fourth aspect of the present disclosure, a heat dissipation device is provided, applied in a first electronic device, the device comprising:

[0035] The detection unit is used to detect the first event;

[0036] A determining unit is used to determine the heat-generating location of the first electronic device, or to determine a heat dissipation method for the first electronic device based on the heat-generating location;

[0037] The sending unit is used to send information about the heat-generating location or the heat dissipation method to the second electronic device, so as to trigger the second electronic device to start heat dissipation for the first electronic device based on the heat-generating location or heat dissipation method.

[0038] Optionally, the detection unit is further configured to:

[0039] The system detects that the first electronic device is placed at a predetermined location on the second electronic device, thus confirming the detection of the first event.

[0040] Optionally, the detection unit is further configured to detect the pose information of the first electronic device;

[0041] The determining unit is further configured to:

[0042] Based on the pose information, the relative positional relationship between the first electronic device and the second electronic device is determined, and a heat dissipation method suitable for dissipating heat from the heat-generating location is determined.

[0043] According to a fifth aspect of the present disclosure, a second electronic device is provided, including a processor, a transceiver, a memory, and an executable program stored in the memory and executable by the processor, wherein the processor executes the steps of the heat dissipation method when running the executable program.

[0044] According to a sixth aspect of the present disclosure, a first electronic device is provided, including a processor, a transceiver, a memory, and an executable program stored in the memory and executable by the processor, wherein the processor executes the steps of the heat dissipation method when running the executable program.

[0045] According to a seventh aspect of the present disclosure, a storage medium is provided that stores an executable program thereon, which, when executed by a processor, implements the steps of the heat dissipation method.

[0046] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0047] In the embodiments of this disclosure, the second electronic device may determine a better heat dissipation method for the first electronic device based on the heat dissipation location of the first electronic device, so as to make the heat dissipation efficiency of the first electronic device higher, or the second electronic device may receive the heat dissipation method determined by the first electronic device itself, and determine a suitable heat dissipation method for the first electronic device based on the heat dissipation method determined by the first electronic device itself.

[0048] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0049] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0050] Figure 1 This is a schematic flowchart illustrating a heat dissipation method according to an embodiment of the present disclosure;

[0051] Figure 2 This is a schematic flowchart illustrating a heat dissipation method according to an embodiment of the present disclosure;

[0052] Figure 3 This is a schematic diagram illustrating the structure of the first electronic device and the second electronic device in an embodiment of this disclosure;

[0053] Figure 4 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of this disclosure;

[0054] Figure 5 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of the present disclosure;

[0055] Figure 6 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of the present disclosure;

[0056] Figure 7 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of this disclosure;

[0057] Figure 8 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of the present disclosure;

[0058] Figure 9 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of the present disclosure.

[0059] Figure 10 This is a schematic diagram of the structure of a heat dissipation device according to an embodiment of the present disclosure;

[0060] Figure 11 This is a schematic diagram of the structure of a heat dissipation device according to an embodiment of the present disclosure;

[0061] Figure 12 This is a block diagram illustrating an electronic device according to an exemplary embodiment. Detailed Implementation

[0062] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0063] Figure 1 This is a schematic flowchart illustrating a heat dissipation method according to an embodiment of the present disclosure, as shown below. Figure 1 As shown, the heat dissipation method of this disclosure embodiment is applied to a second electronic device, and specifically includes the following processing steps:

[0064] Step 101: Determine the heat-generating location of the first electronic device, and determine a first heat dissipation method for the first electronic device based on the heat-generating location.

[0065] Here, the first electronic device includes mobile phones, laptops, and other electronic devices, while the second electronic device includes electronic device stands, chargers, and other devices. Regarding heat dissipation methods for the first electronic device, a fixed heat dissipation channel is typically created on the second electronic device to dissipate heat from the heat-generating areas placed on it. However, current heat dissipation methods are fixed and non-adjustable. For example, the air vent on the second device is fixed. Even when the first electronic device is placed horizontally or vertically, the position of the air vent cannot be adjusted because the position of heat-generating components such as chips or batteries changes. Therefore, the heat dissipation efficiency for the heat-generating areas cannot be improved accordingly with the adjustment of the first electronic device's position. Therefore, this disclosure addresses this heat dissipation deficiency by determining the corresponding heat-generating locations based on the position of the first electronic device and adjusting the corresponding heat dissipation method accordingly. This is described in detail below.

[0066] Determining the heat-generating location of the first electronic device includes: detecting the heat-generating location of the first electronic device using a sensor (e.g., a temperature sensor) installed on the second electronic device; or receiving heat-generating location information sent by the first device. In this embodiment, the first electronic device can detect its own posture using a gravity sensor, gyroscope, etc. After determining the posture of the first electronic device, the second electronic device can determine the approximate positional relationship between the heat-generating location of the first electronic device and the air outlet based on the posture information of the first electronic device and the specific relationship of the first electronic device being placed at a set position on the second electronic device, thereby determining the method for heat dissipation for the first electronic device.

[0067] In this embodiment, the first electronic device is a mobile phone, game console, wearable device, virtual reality device, personal digital assistant, laptop computer, tablet computer, or television terminal, etc. The second electronic device can be a wireless charging device, wired charging dock, etc.

[0068] Step 102: Start the heat dissipation of the first electronic device based on the first heat dissipation method.

[0069] In this embodiment of the disclosure, information on the heat dissipation status sent by the first electronic device is received; and / or a second heat dissipation method is received from the first electronic device;

[0070] Based on the information about the heat dissipation status and / or the second heat dissipation method, the first heat dissipation method is combined with the first heat dissipation method to activate the heat dissipation of the first electronic device.

[0071] When determining the heat dissipation method for the first electronic device, the second electronic device needs to comprehensively consider the heat-generating location of the first electronic device, the relative positional relationship between the heat-generating location and the air outlet of the second electronic device, and the airflow situation of the air outlet of the second electronic device.

[0072] In this embodiment of the disclosure, determining a first heat dissipation method for the first electronic device based on the heat-generating location includes: when the air outlet location is unique, dissipating heat from the heat-generating location through the air outlet;

[0073] When there are two or more air outlets, the air outlet corresponding to the heat-generating position is selected for heat dissipation, or all air outlets are used for heat dissipation, or the air outlet corresponding to the heat-generating position where the heat generation exceeds a set threshold is selected for heat dissipation, or a fixed air outlet is used for heat dissipation.

[0074] The second electronic device can flexibly select a heat dissipation method for the first electronic device based on the heat-generating location of the first electronic device, the location and number of its own heat dissipation vents, and the adjustable heat dissipation method, to determine a heat dissipation method with better heat dissipation effect for the first electronic device, thereby making the heat dissipation efficiency of the first electronic device higher. Alternatively, the second electronic device can receive the heat dissipation method determined by the first electronic device itself, and based on the heat dissipation method determined by itself, comprehensively determine a suitable heat dissipation method for the first electronic device.

[0075] Figure 2 This is a schematic flowchart illustrating a heat dissipation method according to an embodiment of the present disclosure, as shown below. Figure 2 As shown, the heat dissipation method of this disclosure embodiment is applied to a first electronic device, and specifically includes the following processing steps:

[0076] Step 201: Detect the first event, determine the heat-generating location of the first electronic device, or determine a heat dissipation method for the first electronic device based on the heat-generating location; send the information of the heat-generating location or the heat dissipation method to the second electronic device.

[0077] Here, the first electronic device includes mobile phones, laptops, and other electronic devices, while the second electronic device includes electronic device stands, chargers, and other devices. Regarding heat dissipation methods for the first electronic device, a fixed heat dissipation channel is typically created on the second electronic device to dissipate heat from the heat-generating areas placed on it. However, current heat dissipation methods are fixed and non-adjustable. For example, the air vent on the second device is fixed. Even when the first electronic device is placed horizontally or vertically, the position of the air vent cannot be adjusted because the position of heat-generating components such as chips or batteries changes. Therefore, the heat dissipation efficiency for the heat-generating areas cannot be improved accordingly with the adjustment of the first electronic device's position. Therefore, this disclosure addresses this heat dissipation deficiency by determining the corresponding heat-generating locations based on the position of the first electronic device and adjusting the corresponding heat dissipation method accordingly. This is described in detail below.

[0078] In this embodiment of the disclosure, detecting the first event includes detecting that the first electronic device is placed at a predetermined position on the second electronic device. Here, the first event is a trigger event that initiates heat dissipation for the first electronic device. When the first electronic device is placed on the second electronic device, a heat dissipation method for the first electronic device can be determined and activated to achieve better heat dissipation for the first electronic device.

[0079] Determining a heat dissipation method for the first electronic device based on the heat source location includes:

[0080] The pose information of the first electronic device is detected; based on the pose information, the relative positional relationship between the first electronic device and the second electronic device is determined, and a heat dissipation method suitable for dissipating heat from the heat-generating location is determined.

[0081] In this embodiment, the heat-generating locations include easily heated components such as chips and batteries in the first electronic device. The orientation of the first electronic device includes how it is placed on the second electronic device, such as horizontally or vertically. Different placement methods of the first electronic device require corresponding adjustments to the heat dissipation method of the second electronic device to achieve better heat dissipation for the first electronic device.

[0082] Step 202: Trigger the second electronic device to start cooling the first electronic device based on the heat source location or the heat dissipation method.

[0083] In this embodiment, the relative positional relationship between the first electronic device and the second electronic device is determined based on the pose information of the first electronic device, and a suitable heat dissipation method for cooling the heat-generating location is determined. In this embodiment, the heat dissipation airflow conversion mode supported by the second electronic device itself is used, combined with the air outlets on the second electronic device. Based on the heat-generating location and pose of the first electronic device, an air outlet closer to the heat-generating location is selected for heat dissipation, thereby achieving a better heat dissipation effect on the first electronic device.

[0084] The heat dissipation method of this disclosure will be described in detail below with reference to specific examples.

[0085] Figure 3 This is a schematic diagram illustrating the structure of the first and second electronic devices used in embodiments of this disclosure, such as... Figure 3 As shown in this embodiment, when the first electronic device needs to be charged, it can be placed on the charging area of ​​the second electronic device. At this time, the second electronic device can dissipate heat for the first electronic device using a default heat dissipation method, such as defaulting to the first electronic device using... Figure 3 The first electronic device is placed vertically on the charging dock of the second electronic device, as shown in the left diagram. In this case, the heat-generating position of the first electronic device is relatively high. The second electronic device, as shown in the left diagram, dissipates heat from the upper airflow direction to the first electronic device. However, when the first electronic device is placed horizontally on the charging dock of the second electronic device, as shown in the left diagram... Figure 3 As shown in the middle right figure, the heat-generating part of the first electronic device is located relatively low. In this case, the second electronic device can open its lower air duct to dissipate air and cool the first electronic device. Since both methods ensure that the air outlet is directly facing the heat-generating part of the first electronic device, heat dissipation is highly efficient.

[0086] In this embodiment, the selection of a heat dissipation method for the first electronic device can be determined by the first electronic device based on its relative position to the second electronic device and its own heat-generating location, and the second electronic device can then activate the corresponding heat dissipation method. Alternatively, the first electronic device can send its own heat-generating location to the second electronic device, which will then determine the appropriate heat dissipation method. Alternatively, the second electronic device can detect the heat status of the first electronic device and automatically determine the appropriate heat dissipation method based on the heat status of the first electronic device, thereby dissipating heat from the first electronic device.

[0087] In this embodiment of the disclosure, determining the first heat dissipation method for the first electronic device based on the heat-generating location includes: when the air outlet location is unique, dissipating heat from the heat-generating location through the air outlet;

[0088] When there are two or more air outlets, the air outlet corresponding to the heat-generating position is selected for heat dissipation, or all air outlets are used for heat dissipation, or the air outlet corresponding to the heat-generating position where the heat generation exceeds a set threshold is selected for heat dissipation, or a fixed air outlet is used for heat dissipation.

[0089] Specifically, the second electronic device can support multiple heat dissipation methods and can have multiple air outlets on its surface. Depending on the position and orientation of the first electronic device placed on top of the second, the fan or blower in the second electronic device can be activated to direct the airflow to the heat-generating areas of the first electronic device, thus achieving heat dissipation even when the first electronic device is charging. The second electronic device is equipped with a fan or blower, and by controlling the airflow duct of the fan or blower, different air outlets can be used to direct airflow to different parts of the first electronic device, achieving the purpose of cooling different heat-generating areas.

[0090] Figure 4 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of this disclosure. Figure 5 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of the present disclosure. Figure 6 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of the present disclosure, such as... Figure 4 , Figure 5 and Figure 6The diagram illustrates a scenario where the second electronic device supports different heat dissipation methods. In this embodiment, an internal air duct is provided in the second electronic device, with a fan facing the duct to blow or draw air into it. An external upper air vent and an external lower air vent are provided on the outer surface of the second electronic device, corresponding to the upper and lower ports of the internal channel, respectively. An air duct switching valve is also provided at the fan's blowing or drawing air vent into the internal air duct, allowing control and selection of the heat dissipation method.

[0091] like Figure 4 As shown, when the air duct switching valve is in the state of blocking the external downdraft, the fan's exhaust air directly enters the internal air duct, and the air exits through the external updraft. When the first electronic device is placed vertically on the second electronic device, the external updraft is directly facing the heat-generating position of the first electronic device, thereby enabling direct heat dissipation of the heat-generating position of the first electronic device.

[0092] like Figure 5 As shown, when the air duct switching valve is in the state of blocking the air outlet of the inner air duct, the fan exhausts air through the external lower air outlet. When the first electronic device is placed horizontally on the second electronic device, the external lower air outlet is directly facing the heat-generating position of the first electronic device, thereby enabling direct heat dissipation of the heat-generating position of the first electronic device.

[0093] like Figure 6 As shown, when the air duct switching valve is positioned between the inner air duct and the outer downdraft vent, it neither obstructs the airflow from the inner air duct nor the outer downdraft vent. In this case, the fan outputs air both through the outer downdraft vent and through the inner air duct to the outer updraft vent. When the first electronic device is placed horizontally on top of the second electronic device, or when the first electronic device is placed at an angle on top of the second electronic device, both the outer downdraft vent and the outer updraft vent blow air onto the heat-generating areas of the first electronic device, thereby achieving heat dissipation.

[0094] Figure 7 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of this disclosure. Figure 8 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of the present disclosure. Figure 9 This is a schematic diagram illustrating a heat dissipation method according to an embodiment of the present disclosure, such as... Figure 7 , Figure 8 and Figure 9The diagram illustrates a scenario where the second electronic device supports different heat dissipation methods. In this embodiment, an internal air duct is provided in the second electronic device, with a fan facing the duct to blow or draw air into it. An external upper air vent and an external lower air vent are provided on the outer surface of the second electronic device, corresponding to the upper and lower ports of the internal channel, respectively. An air duct switching baffle is also provided at the fan's blowing or drawing air vent into the internal air duct, allowing control of the heat dissipation method and selection.

[0095] Figure 10 This is a schematic diagram of a heat dissipation device according to an embodiment of the present disclosure, such as... Figure 10 As shown, the heat dissipation device of this disclosure embodiment is applied in a second electronic device, the device comprising:

[0096] The determining unit 100 is used to determine the heat-generating location of the first electronic device and determine a first heat dissipation method for the first electronic device based on the heat-generating location;

[0097] The activation unit 101 is used to activate the heat dissipation of the first electronic device based on the first heat dissipation method.

[0098] Optionally, the determining unit 100 is further configured to: detect the heat-generating location of the first electronic device using a sensor; or receive heat-generating location information sent by the first device.

[0099] Optionally, the determining unit 100 is further configured to:

[0100] When the air outlet is in a unique location, heat is dissipated from the heat-generating location through the air outlet;

[0101] When there are two or more air outlets, the air outlet corresponding to the heat-generating position is selected for heat dissipation, or all air outlets are used for heat dissipation, or the air outlet corresponding to the heat-generating position where the heat generation exceeds a set threshold is selected for heat dissipation, or a fixed air outlet is used for heat dissipation.

[0102] Optionally, the device further includes:

[0103] A receiving unit (not shown in the figure) is used to receive information on the heat dissipation status sent by the first electronic device; and / or to receive a second heat dissipation method sent by the first electronic device;

[0104] The determining unit 100 is further configured to activate heat dissipation for the first electronic device based on the information of the heating state and / or the second heat dissipation method, in conjunction with the first heat dissipation method.

[0105] In an exemplary embodiment, the determining unit 100, the enabling unit 101, and the receiving unit may be implemented by one or more central processing units (CPUs), graphics processing units (GPUs), baseband processors (BPs), application-specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), complex programmable logic devices (CPLDs), field-programmable gate arrays (FPGAs), general-purpose processors, controllers, microcontrollers (MCUs), microprocessors, or other electronic components. They may also be implemented in conjunction with one or more radio frequency (RF) antennas to perform the aforementioned heat dissipation method.

[0106] In this embodiment of the disclosure, Figure 10 The specific ways in which each module and unit in the heat dissipation device performs its operation have been described in detail in the embodiments of the relevant method, and will not be elaborated here.

[0107] Figure 11 This is a schematic diagram of a heat dissipation device according to an embodiment of the present disclosure, such as... Figure 12 As shown, the heat dissipation device of this disclosure embodiment is applied in a first electronic device, the device comprising:

[0108] Detection unit 110 is used to detect the first event;

[0109] The determining unit 111 is used to determine the heat-generating location of the first electronic device, or to determine a heat dissipation method for the first electronic device based on the heat-generating location;

[0110] The sending unit 112 is used to send information about the heat-generating location or the heat dissipation method to the second electronic device, so as to trigger the second electronic device to start heat dissipation for the first electronic device based on the information about the heat-generating location or the heat dissipation method.

[0111] Optionally, the detection unit 110 is further configured to:

[0112] The system detects that the first electronic device is placed at a predetermined location on the second electronic device, thus confirming the detection of the first event.

[0113] Optionally, the detection unit 110 is further configured to detect the pose information of the first electronic device;

[0114] The determining unit 111 is further configured to:

[0115] Based on the pose information, the relative positional relationship between the first electronic device and the second electronic device is determined, and a heat dissipation method suitable for dissipating heat from the heat-generating location is determined.

[0116] In an exemplary embodiment, the detection unit 110, the determination unit 111, the transmission unit 112, etc., may be implemented by one or more central processing units (CPUs), graphics processing units (GPUs), baseband processors (BPs), application-specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), complex programmable logic devices (CPLDs), field-programmable gate arrays (FPGAs), general-purpose processors, controllers, microcontrollers (MCUs), microprocessors, or other electronic components, or may be implemented in conjunction with one or more radio frequency (RF) antennas, for performing the aforementioned heat dissipation method.

[0117] In this embodiment of the disclosure, Figure 11 The specific ways in which each module and unit in the heat dissipation device performs its operation have been described in detail in the embodiments of the relevant method, and will not be elaborated here.

[0118] This disclosure also provides a second electronic device, including a processor, a transceiver, a memory, and an executable program stored in the memory and executable by the processor. When the processor runs the executable program, it performs the steps of a heat dissipation method as described in the first embodiment above.

[0119] This disclosure also provides a first electronic device, including a processor, a transceiver, a memory, and an executable program stored in the memory and executable by the processor. When the processor runs the executable program, it performs the steps of a heat dissipation method as described in the second embodiment above.

[0120] Figure 12 This is a block diagram illustrating an electronic device 800 (a first electronic device or a second electronic device) according to an exemplary embodiment, such as Figure 12 As shown, the electronic device 800 supports multi-screen output and may include one or more of the following components: processing component 802, memory 804, power supply component 806, multimedia component 808, audio component 810, input / output (I / O) interface 812, sensor component 814, and communication component 816.

[0121] Processing component 802 typically controls the overall operation of electronic device 800, such as operations associated with display, telephone calls, data communication, camera operation, and recording operations. Processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the methods described in the embodiments above. Furthermore, processing component 802 may include one or more modules to facilitate interaction between processing component 802 and other components. For example, processing component 802 may include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802.

[0122] Memory 804 is configured to store various types of data to support the operation of device 800. Examples of this data include instructions for any application or method operating on electronic device 800, contact data, phonebook data, messages, pictures, videos, etc. Memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0123] Power supply component 806 provides power to various components of electronic device 800. Power supply component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 800.

[0124] Multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 808 includes a front-facing camera and / or a rear-facing camera. When the device 800 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0125] Audio component 810 is configured to output and / or input audio signals. For example, audio component 810 includes a microphone (MIC) configured to receive external audio signals when electronic device 800 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 804 or transmitted via communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

[0126] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0127] Sensor assembly 814 includes one or more sensors for providing state assessments of various aspects of electronic device 800. For example, sensor assembly 814 may detect the on / off state of device 800, the relative positioning of components such as the display and keypad of electronic device 800, changes in position of electronic device 800 or a component of electronic device 800, the presence or absence of user contact with electronic device 800, orientation or acceleration / deceleration of electronic device 800, and temperature changes of electronic device 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 814 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor.

[0128] Communication component 816 is configured to facilitate wired or wireless communication between electronic device 800 and other devices. Electronic device 800 can access wireless networks based on communication standards, such as Wi-Fi, 2G, or 3G, or combinations thereof. In one exemplary embodiment, communication component 816 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 816 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0129] In an exemplary embodiment, the electronic device 800 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0130] This disclosure also describes a non-transitory computer-readable storage medium that, when the instructions in the storage medium are executed by the processor of a terminal, enables the terminal to perform the heat dissipation method of the foregoing embodiments.

[0131] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0132] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A heat dissipation method, applied in a second electronic device, characterized in that, The method includes: The device receives heat source location information sent by a first electronic device; the heat source location information is obtained by the first electronic device based on the orientation of the device placed on the second electronic device; the orientation includes horizontal placement, vertical placement, or tilted placement. Based on the heat source location information, the relative positional relationship between the heat source location of the first electronic device and multiple air outlets of the second electronic device is determined to determine a first heat dissipation method for the first electronic device; wherein, the second electronic device is a charging device for charging the first electronic device; the first heat dissipation method includes the determined air outlet and heat dissipation duct conversion mode. The first electronic device is cooled based on the first heat dissipation method. Wherein, activating heat dissipation for the first electronic device based on the first heat dissipation method includes: By determining the heat dissipation duct conversion mode, the air outlet or air intake direction of the internal air duct of the second electronic device is adjusted to face the determined air outlet, and heat dissipation is achieved through the determined air outlet. The step of determining the relative positional relationship between the heat-generating location of the first electronic device and multiple air outlets of the second electronic device based on the heat-generating location information, in order to determine a first heat dissipation method for the first electronic device, includes: selecting an air outlet whose position corresponds to the heat-generating location for heat dissipation, or using all the air outlets for heat dissipation, or selecting an air outlet corresponding to the heat-generating location whose heat generation exceeds a set threshold for heat dissipation, or using a fixed air outlet for heat dissipation.

2. The method according to claim 1, characterized in that, The method further includes: Receive information on the heat dissipation status sent by the first electronic device, and / or receive a second heat dissipation method sent by the first electronic device; Based on the information about the heat dissipation status and / or the second heat dissipation method, the first heat dissipation method is combined with the first heat dissipation method to activate the heat dissipation of the first electronic device.

3. A heat dissipation method, applied in a first electronic device, characterized in that, The method includes: A first event is detected, and the location of the heat source in the first electronic device is determined; the heat source location information is sent to a second electronic device; wherein, the first event is a trigger event that initiates heat dissipation for the first electronic device; and the second electronic device is a charging device that charges the first electronic device; The second electronic device is triggered to activate heat dissipation for the first electronic device based on the heat-generating location; wherein, the heat-generating location is used to enable the second electronic device to determine a heat dissipation method for the first electronic device based on the relative positional relationship between the heat-generating location and multiple air outlets of the second electronic device, so as to activate heat dissipation for the first electronic device; the heat dissipation method for the first electronic device includes: selecting an air outlet whose position corresponds to the heat-generating location among the air outlets of the second electronic device for heat dissipation, or using all air outlets for heat dissipation, or selecting an air outlet corresponding to the heat-generating location whose heat generation exceeds a set threshold among the air outlets for heat dissipation, or using a fixed air outlet for heat dissipation; or, Upon detecting a first event, a heat dissipation method is determined for the first electronic device based on the location of heat generation; the heat dissipation method is then sent to a second electronic device; wherein, the first event is a trigger event that initiates heat dissipation for the first electronic device; and the second electronic device is a charging device that charges the first electronic device. The second electronic device is triggered to start cooling the first electronic device based on the aforementioned cooling method; Determining the heat dissipation method for the first electronic device based on the heat-generating location of the first electronic device includes: Detect the pose information of the first electronic device; Based on the pose information, the relative positional relationship between the first electronic device and the second electronic device is determined, and a heat dissipation method suitable for dissipating heat from the heat-generating location is determined; wherein, determining a heat dissipation method suitable for dissipating heat from the heat-generating location includes: the second electronic device includes multiple air outlets; selecting an air outlet whose position corresponds to the heat-generating location from the air outlets of the second electronic device for heat dissipation, or using all air outlets for heat dissipation, or selecting an air outlet corresponding to the heat-generating location whose heat generation exceeds a set threshold from the air outlets for heat dissipation, or using a fixed air outlet for heat dissipation.

4. The method according to claim 3, characterized in that, The detection of the first event includes: The first electronic device was detected to be placed at a predetermined position of the second electronic device.

5. A heat dissipation device, used in a second electronic device, characterized in that, The device includes: A determining unit is configured to receive heat source location information sent by a first electronic device; the heat source location information is obtained by the first electronic device based on its orientation when placed on a second electronic device; the orientation includes horizontal placement, vertical placement, or tilted placement; based on the heat source location information, the unit determines the relative positional relationship between the heat source location of the first electronic device and multiple air outlets of the second electronic device, thereby determining a first heat dissipation method for the first electronic device; wherein the second electronic device is a charging device for charging the first electronic device; the first heat dissipation method includes the determined air outlet and heat dissipation duct switching mode; An activation unit is used to activate the heat dissipation of the first electronic device based on the first heat dissipation method; The opening unit is further configured to adjust the air outlet direction or air intake direction of the internal air duct of the second electronic device toward the determined air outlet by determining the heat dissipation air duct conversion mode, and to perform air outlet heat dissipation or air intake heat dissipation through the determined air outlet; and to select the air outlet whose position corresponds to the heat generation position for heat dissipation, or to use all the air outlets for heat dissipation, or to select the air outlet corresponding to the heat generation position where the heat generation exceeds a set threshold for heat dissipation, or to use a fixed air outlet for heat dissipation.

6. The apparatus according to claim 5, characterized in that, The device further includes: The receiving unit is configured to receive information on the heat dissipation status sent by the first electronic device, and / or receive a second heat dissipation method sent by the first electronic device; The determining unit is further configured to activate heat dissipation for the first electronic device based on the information of the heating state and / or the second heat dissipation method, in conjunction with the first heat dissipation method.

7. A heat dissipation device, applied in a first electronic device, characterized in that, The device includes: A detection unit is used to detect a first event; the first event is a trigger event that enables heat dissipation for the first electronic device. A determining unit is used to determine the location of heat generation in the first electronic device; A sending unit is configured to send the heat-generating location information to a second electronic device to trigger the second electronic device to activate heat dissipation for the first electronic device based on the heat-generating location; Wherein, the second electronic device is a charging device for charging the first electronic device; the heat-generating location is used to enable the second electronic device to determine a heat dissipation method for the first electronic device based on the relative positional relationship between the heat-generating location and multiple air outlets of the second electronic device, so as to activate the heat dissipation for the first electronic device; the heat dissipation method for the first electronic device includes: selecting an air outlet whose position corresponds to the heat-generating location among the air outlets of the second electronic device for heat dissipation, or using all air outlets for heat dissipation, or selecting an air outlet corresponding to the heat-generating location whose heat generation exceeds a set threshold among the air outlets for heat dissipation, or using a fixed air outlet for heat dissipation; or, A detection unit is used to detect a first event; the first event is a trigger event that enables heat dissipation for the first electronic device. The determining unit is configured to determine a heat dissipation method for the first electronic device based on the heat-generating location of the first electronic device; A sending unit is configured to send the heat dissipation method to the second electronic device, thereby triggering the second electronic device to activate heat dissipation for the first electronic device based on the heat dissipation method; The detection unit is also used to detect the pose information of the first electronic device; The determining unit is further configured to determine the relative positional relationship between the first electronic device and the second electronic device based on the pose information, and determine a heat dissipation method suitable for dissipating heat from the heat-generating location; wherein determining a heat dissipation method suitable for dissipating heat from the heat-generating location includes: the second electronic device includes multiple air outlets; selecting an air outlet whose position corresponds to the heat-generating location from the air outlets of the second electronic device for heat dissipation, or using all air outlets for heat dissipation, or selecting an air outlet corresponding to the heat-generating location whose heat generation exceeds a set threshold from the air outlets for heat dissipation, or using a fixed air outlet for heat dissipation.

8. The apparatus according to claim 7, characterized in that, The detection unit is also used for: The system detects that the first electronic device is placed at a predetermined location on the second electronic device, thus confirming the detection of the first event.

9. A second electronic device, comprising a processor, a transceiver, a memory, and an executable program stored in the memory and executable by the processor, wherein the processor, when executing the executable program, performs the steps of the heat dissipation method as described in any one of claims 1 or 2.

10. A first electronic device, comprising a processor, a transceiver, a memory, and an executable program stored in the memory and executable by the processor, wherein the processor, when executing the executable program, performs the steps of the heat dissipation method as described in any one of claims 3 or 4.

11. A storage medium having an executable program stored thereon, wherein the executable program, when executed by a processor, implements the steps of the heat dissipation method as claimed in claim 1 or 2, or implements the steps of the heat dissipation method as claimed in claim 3 or 4.

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