Method for producing a coolable electronic device module

Abstract

A method for manufacturing a coolable electronic equipment module comprises the following steps: a) providing a sandwich module constructed from a plurality of layer elements, the sandwich module having an upper plate, a lower plate provided with through holes, and a fluid chamber between the upper plate and the lower plate; b) placing the lower plate on a workpiece support pierced by an access portion of a fluid supply channel, thereby connecting the through holes of the lower plate and the access portion of the fluid supply channel to each other in a fluid-tight manner; c) placing an electronic component on the upper plate; d) applying a pressing force to the electronic component; and e) filling the fluid chamber with a hydraulic fluid through a fluid supply channel and applying the hydraulic fluid with a counterpressure that compensates for the force on the upper plate, characterized in that the lower plate is constructed to be flat and is placed on the workpiece support with a major portion of its surface during the force and pressure application in steps d and e, wherein at least one spacer frame, which is also constructed to be flat and surrounds the through holes of the lower plate, is fixed in a fluid-tight manner between it and the upper plate.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a coolable electronic device module, comprising the following steps:

[0002] a) providing a sandwich module constructed from a plurality of layer elements, the sandwich module having a flat, closed upper plate and a lower plate provided with through-holes, wherein a fluid chamber connected to the through-holes of the lower plate is formed between the upper plate and the lower plate,

[0003] b) placing the lower plate of the sandwich module on a workpiece support penetrated by the access of the fluid supply channel, so that the through hole of the lower plate and the access of the fluid supply channel are connected to each other in a fluid-tight manner,

[0004] c) Place the electronic components on the upper plate,

[0005] d) loading the electronic component with a force directed toward the upper plate along a surface normal of the upper plate, and

[0006] e) Filling the fluid chamber with hydraulic fluid via the fluid supply channel and loading the hydraulic fluid with a counterpressure that compensates for the force on the upper plate. Background Art

[0007] A production method of this type is known from DE 10 2019 204 683 A1.

[0008] High power is implemented in power electronics of motor vehicles, in particular pure electric or hybrid electric motor vehicles. The electronic components used for this purpose, such as so-called power modules (such as IGBTs), require coolers to dissipate the heat accumulated therein. Such electronic components are usually equipped with cooling structures, such as labyrinth cooling ribs, around which a coolant, which is usually in a liquid state, flows. These cooling structures can be directly installed at the electronic components and extend into coolant channels (for short: cooling channels). However, it is also known to connect the electronic components to a plate, here called an upper plate (which covers the opening of the cooling channel), in a planar manner, and to install the cooling structures on the opposite side of the upper plate that faces the cooling channel.

[0009] From the documents mentioned at the beginning, a cooling assembly for cooling electronic components of motor vehicles is known, which has a plate-shaped cooling channel cover in which the electronic components to be cooled are fixed, in particular sintered, in thermal contact on the upper side of an upper plate at a plurality of locations, each referred to here as cooling locations. On the lower side of the upper plate, in the region of each cooling location, a turbulence mat is welded, which is designed as a structure extending in a plane and through which a coolant can flow parallel to the plane of extension and thereby stimulates the coolant flow into turbulence. In such documents, such a turbulence mat, which is also a preferred embodiment in the context of the present application, is described as an assembly of corrugated sheet metal strips connected to each other in a phase-shifted manner relative to the wave period.

[0010] The lower edge of the upper plate is welded to the upper side of the pot-shaped lower plate in a fluid-tight manner, enclosing the turbulence pad, in the lower plate into which the turbulence pad is sunk. The lower plate is provided with a central through-hole in its base and lateral through-holes in its side walls, which serve as inflow and outflow openings for the coolant in the assembled state. In a common embodiment with a plurality of such cooling locations, when a plurality of turbulence pads are sunk into each of a plurality of lower plate pots, these turbulence pads are subsequently cooled with two bowls nested in one another. A span which, on the one hand, connects the inlet openings of the different cooling points to one another and, on the other hand, connects their outlet openings to one another in a housing-like manner.

[0011] In order to fix (multiple) electronic components at one or more cooling positions, it is known that these electronic components are sintered on the upper side of the upper plate. When the pressing force is applied over a large area, the process temperature required for the connection of the structural material can be reduced to such an extent that the thermal damage to the electronic components can be reliably prevented. This is an obvious advantage relative to the welding method. However, the pressing force required for sintering can cause the deformation of the sandwich module (Sandwich-Module, sometimes also referred to as a sandwich module) consisting of a flat upper plate and a basin-shaped lower plate, especially in the case of a filamentary structure. Therefore, the aforementioned document suggests that the sandwich module is placed on the edge of the basin (Wanne, sometimes also referred to as a tray) of the workpiece support with its edge fluid-tightly sealed, and the workpiece support basin is flooded with hydraulic fluid, especially with gas (such as nitrogen) in parallel with the force loading of the electronic components, and the workpiece support basin is loaded with hydrostatic pressure. The hydraulic fluid penetrates into the fluid chamber of the sandwich module via the supporting fluid chamber formed between the lower side of the module and the upper side of the workpiece support, and a compensating counterpressure to the applied force is constructed. Here, the hydraulic fluid in the oversized workpiece receiving basin also flushes around the basin of the lower plate, so that the internal pressure in the basin of the lower plate, i.e. the compensating counterpressure, is generated from the outside, i.e. in the supporting fluid chamber. This is also necessary, since otherwise the basin-shaped curved lower plate would be in danger of deforming.

[0012] A disadvantage of this known method is the relatively large volume of hydraulic fluid required in order to be able to load the lower plate basin with the necessary compensating pressure internally and externally. The volume flow required for each working cycle is time-consuming and energy-intensive. In addition, in particular in the case of small through-holes in the lower plate, pressure differences between the fluid chamber and the supporting fluid chamber can at least temporarily result, which poses the risk of deformation of the lower plate. Summary of the invention

[0013] The object of the present invention is to provide a more reliable and more efficient method for producing a coolable electronic device module.

[0014] This object is achieved in conjunction with a method for producing a coolable electronic device module in that during the application of force and pressure in steps d and e, the lower plate rests with a major portion of its surface on a workpiece support. The method comprises the following steps: a) providing a sandwich module constructed from a plurality of layer elements, the sandwich module having a flat, closed upper plate and a lower plate provided with through-holes, wherein a fluid chamber connected to the through-holes of the lower plate is formed between the upper plate and the lower plate,

[0015] b) placing the lower plate of the sandwich module on a workpiece support penetrated by the access of the fluid supply channel, so that the through hole of the lower plate and the access of the fluid supply channel are connected to each other in a fluid-tight manner,

[0016] c) Place the electronic components on the upper plate,

[0017] d) loading the electronic component with a force directed toward the upper plate along the surface normal of the upper plate, and

[0018] e) Filling the fluid chamber with hydraulic fluid via the fluid supply channel and loading the hydraulic fluid with a counterpressure that compensates for the force on the upper plate.

[0019] The core idea of ​​the present invention is to support the lower side of the sandwich module on the workpiece support over a large area and to introduce the hydraulic fluid of the fluid supply channel directly (i.e. without intermediate access to a supporting fluid chamber extending between the lower plate and the workpiece support) into the fluid chamber. This can reduce the required fluid volume on the one hand. On the other hand, a pressure difference between the upper side and the lower side of the fluid chamber and thus a deformation of the lower plate are eliminated.

[0020] In a first embodiment of the invention, the lower plate is designed in a pot-shaped manner, as is basically known from the prior art. For example, the lower plate can be designed as a formed sheet metal part, in particular a deep-drawn part. This is particularly cost-effective, material-saving and advantageous in terms of construction space and weight. In such a design, it is provided that the sandwich module (10) has two layer elements, namely an upper plate and

[0021] - A bottom basin acting as a lower plate, the bottom basin having a central basin depression forming a fluid chamber and a basin edge completely surrounding the basin depression, the basin depression including a bottom basin through hole acting as a lower plate through hole, the basin edge being connected to the lower side of the upper plate by material fit.

[0022] An alternative embodiment of the present invention provides that the lower plate is flat and at least one spacer frame, which is also flat and surrounds the through-holes of the lower plate, is fixed in a fluid-tight manner between the lower plate and the upper plate. This approach is based on the concept that the sandwich module is constructed from a purely flat element, on which the electronic components are sintered and which surrounds the cooling channels in the finished electronic device module. In this context, flat means that the main surfaces (if any) that are opposite to each other extend essentially parallel to each other. This does not mean that such a flat element can be easily provided with through-holes, but rather such through-holes, especially through-holes in the lower plate and the spacer frame arranged between the lower plate and the upper plate, are an important element of the present invention. In this way, the fluid chamber (which is used to build up a compensating hydrostatic counterpressure during the manufacturing method and is used as a cooling channel in the finished electronic device module) can be designed without deforming the sheet metal structure simply by building up different through-holes layer by layer. This results in a flat underside of the sandwich module, i.e. the underside of the flat lower plate, which can be placed on a substantially flat part of the workpiece support in order to support the forces acting thereon by the hydrostatic internal pressure, which act toward the outside. The same hydraulic support of the internal pressure in the fluid chamber can be dispensed with by means of a compensating external pressure in a separate supporting fluid chamber, as is known in the prior art. As already explained above, this leads to a reduction in the overall required volume of hydraulic fluid and thus to a more time-efficient and energy-efficient design of the entire method.

[0023] When the lower plate is mechanically supported by the workpiece support, it is preferably provided with full-surface contact. This also ensures that deformation does not occur even when the hydrostatic pressure in the fluid chamber is high when the wall thickness of the lower plate is very thin. However, it can also be arranged in a corresponding dimensioning that certain areas of the lower plate remain unsupported, for example, if the workpiece support is constructed by closely arranged ribs side by side, the spacing of the ribs is small enough, so that deformation can also be avoided under the preset hydrostatic pressure and the preset thickness of the lower plate. The rib-shaped design of the workpiece support has the following advantages: the hydraulic fluid that may still seep out can leak out without forming an undesirable padding portion (Polster) between the workpiece support and the lower side of the lower plate.

[0024] For the specific design of the sandwich module, different embodiments are conceivable. In a first variant, it is provided that the sandwich module has three layer elements, namely

[0025] -On the board,

[0026] - a bottom plate acting as a lower plate, which has bottom plate through-holes acting as lower plate through-holes, and - a spacer plate acting as a spacer frame, which is materially connected to the upper plate on the one hand and to the bottom plate on the other hand, and which is penetrated by spacer plate through-holes forming a fluid chamber and surrounding the bottom plate through-holes.

[0027] In this design, the sandwich module is therefore essentially composed of a cooling channel formed by a fluid cavity or a wall surrounding a cooling channel. The import and export structures required in the finished electronic device module must be installed later (i.e. after the electronic device components are sintered). In particular, two bowls that can be constructed as sheet metal parts, especially deep-drawn parts, can be applied, especially welded, preferably by means of laser welding. In order to ensure low pressure loss inflow and outflow for each cooling position, it is preferably provided in this embodiment that the bottom plate has a plurality of through holes, which are surrounded by the through holes of the spacer plate together. The bowl to be applied later only spans one or a group of these through holes, so that one or more through holes of the bottom plate are associated with the first bowl as a supply channel, and one or more other through holes of these bottom plate through holes are associated with another bowl as a derivation channel. However, for the manufacturing method at the core of the present invention, the specific number of bottom plate through holes or lower plate through holes is not important, as long as these through holes are fully sealed to the workpiece support surface.

[0028] In a second variant, it is provided that the sandwich module has five layer elements, namely

[0029] -On the board,

[0030] - a bottom plate which is also designed as a flat plate and is provided with a plurality of bottom plate through-holes,

[0031] a spacer plate which acts as a first spacer frame and is connected in a materially bonding manner to the upper plate on the one hand and to the bottom plate on the other hand, and which is penetrated by a spacer plate through-hole which forms the upper region of the fluid chamber and surrounds the through-hole in the bottom plate,

[0032] - a lower plate provided with a plurality of lower plate through holes, and

[0033] a housing plate which acts as a second spacer frame and is connected in a materially bonding manner to the base plate on the one hand and to the lower plate on the other hand, and which is penetrated by at least two housing plate through-holes which together form a separate lower region of the fluid chamber,

[0034] The housing plate through-holes surround different bottom plate through-holes or groups of bottom plate through-holes and are respectively connected to one of the lower plate through-holes.

[0035] In this embodiment, the introduction and discharge of the actual cooling channel are also components of the sandwich module. The upper part of the sandwich module, which is composed of an upper plate, a spacer plate and a bottom plate, corresponds precisely to the structure of the sandwich module in the three-layer variant described above. However, the bottom plate of the five-layer variant does not act as a lower plate to be placed on the workpiece support in the three-layer variant. Instead, in this variant, a second spacer frame, which is referred to as a shell plate, is connected to the bottom plate, which has a plurality of separated longitudinal slit-shaped through holes, which correspond to different bottom plate through holes or different bottom plate through hole groups. Here, the bottom plate through hole is also used as an inflow portion to the cooling position or an outflow portion from the cooling position; and the through holes in the second spacer frame form the introduction portion or the discharge portion to these inflow portions or outflow portions. The second spacer frame is closed by the actual lower plate, which is placed on the workpiece support in the scope of the method according to the invention, and can be connected in a one-piece manner with the shell plate or the second spacer frame material in a special embodiment.

[0036] A person skilled in the art will understand that the layer elements forming one or more spacer frames must have a relatively large material thickness in order to be able to ensure a low-pressure flow of a coolant or, within the scope of the manufacturing method according to the invention, a low-pressure flow of a hydraulic fluid within their interior. However, the layer elements that are bounded externally or are located between two spacer frames, i.e. the upper plate, the lower plate and, if necessary, the bottom plate that does not function as a lower plate, can be designed to be very thin-walled, since they are neither within the scope of the manufacturing method according to the invention nor are they subject to high one-sided pressures after operation without compensating counterpressure or mechanical support.

[0037] In the case of the five-layer variant described above, it can be provided that the through-holes of the lower plate are each surrounded by a pipe nipple fixed to the lower plate in a material-fitting manner, a so-called boss, which is inserted into the inlet of the fluid supply channel in a form-fitting manner when the sandwich module is placed on the workpiece support in step b. In this case, a hydraulic fluid seal can be achieved at the same time.

[0038] Advantageously, the housing plate can have a circumferential collar on its upper side, into which the submodule comprising the bottom plate, the spacer plate and the upper plate is fixed in a form-fitting and flush manner. Such a submodule, which forms the actual cooling channel, can be manufactured separately and then inserted into a submodule comprising the housing plate and the lower plate, which is also manufactured separately. For example, both submodules can be manufactured as brazed assemblies and can also be brazed to each other or fixed to each other in another way. In general, regardless of the specific embodiment, it is preferred to connect the individual layer elements to form a sandwich module by brazing. This is a reliable, well-controlled and cost-effective method, the only disadvantage of which, namely the relatively high temperature loading, is harmless, because particularly temperature-sensitive electronic components are only applied in the scope of the method according to the invention in a subsequent process step and are therefore not subjected to excessive temperature loads.

[0039] For weight saving and structural space saving, it is desirable to select the wall thickness of the spacer frame to be very thin. However, this is inevitably related to the corresponding structural sensitivity. In any case, the wall thickness must be designed so thick that it withstands the internal pressure of the coolant that occurs during operation. However, the internal pressure that occurs in the scope of the manufacturing method and is loaded with compensating forces in sintering in the fluid chamber may be significantly higher. In order to still be able to create a very thin-walled structure, it is arranged in a modified version of the present invention that the workpiece support is constructed as a basin, and the sandwich module is inserted into the basin of the workpiece support in a form-fitting manner when its lower plate is placed on the workpiece support. Thus, the mechanical support of the internal pressure generated by the workpiece support in the fluid chamber is obtained laterally, especially completely circumferentially. The workpiece support is preferably formed of steel, especially thick-walled steel, correspondingly and stably. And the sandwich module is preferably made of light metal, especially aluminum.

[0040] The term "inserting the sandwich module into the basin of the workpiece support with a form fit" should be understood in a broad sense here and in particular also includes a form fit with a gap. As a result, the different thermal expansion coefficients of the materials of the sandwich module on the one hand and the workpiece support on the other hand can be taken into account for the heating that occurs during the sintering process. Therefore, it is particularly preferably arranged that before and / or during the force loading of step d, the sandwich module is heated, wherein a gapless form fit is established between the sandwich module and the basin of the workpiece support by heating. In other words, the sandwich module is therefore first slightly undersized and inserted into the basin of the workpiece support with a gapless form fit. The subsequent heating causes the gap to be reduced, preferably to zero. In the subsequent force and pressure loading in the scope of the sintering process, the hydrostatic pressure in the fluid chamber can then be supported by the workpiece support downwardly and laterally without gaps, thereby eliminating deformation of the sandwich module. Deformation upward is also eliminated, because the force required for sintering is introduced from here via the electronic equipment module.

[0041] It is known that the sintering process can be made significantly simpler and more efficient if a sintering layer, in particular a sintering paste, is applied between the components to be sintered to one another. Therefore, it is also preferably provided within the scope of the present invention that the upper side of the upper plate and / or the lower side of the electronic component are coated with a sintering layer before the electronic component is placed on the upper plate in step c.

[0042] In terms of the sealing of the hydraulic fluid transfer from the workpiece support to the fluid chamber, it can be arranged that, regardless of the specific design of the lower plate as a flat element or as a basin, when the lower plate is placed on the workpiece support in step b, the access portion of the fluid supply channel and the through hole of the lower plate are directly connected to each other in a fluid-tight manner. Thus, it is ensured that the hydraulic fluid flows directly from the fluid supply channel through the through hole of the lower plate into the fluid chamber, so that the workpiece support is kept dry in addition. But this may be structurally consuming. Therefore, in an alternative design scheme, it is arranged that, when the lower plate is placed on the workpiece support in step b, the access portion of the fluid supply channel and the through hole of the lower plate are connected to each other in a fluid-tight manner by means of a sealing device that preferably directly surrounds them adjacently. For example, a sealing cutting edge similar to ISO 1179 can be used for this. Alternatively, a sealing groove surrounding the access portion of the fluid supply channel can also be provided, and an O-ring is inserted into the sealing groove so that the hydraulic fluid flowing into the fluid chamber through the fluid supply channel only wets the upper side of the workpiece support or the lower side of the lower plate in the sealing ring. The workpiece support or the underside of the lower plate, however, remains dry in its main region, so that during the pressure loading according to step e, the former can directly mechanically support the latter. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Further details and advantages of the invention result from the following detailed description and the accompanying drawings.

[0044] in:

[0045] Figure 1 Different schematic views of a first embodiment of a method product according to the method of the invention are shown,

[0046] Figure 2 The method for manufacturing the Figure 1 The first method step of the method of the product,

[0047] Figure 3 The method for manufacturing the Figure 1 The product of the second method step of the method,

[0048] Figure 4 A second embodiment of the method product according to the method of the invention is shown,

[0049] Figure 5 The method for manufacturing the Figure 4 The core method steps of the product method are

[0050] Figure 6 A third embodiment of a method product according to the method of the invention is shown, and

[0051] Figure 7 The method for manufacturing the Figure 6 The core method steps of the product method.

[0052] Figure 8 Another embodiment of a sandwich module 10 ″′ according to the invention is shown.

[0053] Fig. 9 A further embodiment of a sandwich module 10 ′″ according to the invention is shown.

[0054] The same reference numbers in the drawings identify the same or similar elements. DETAILED DESCRIPTION

[0055] Figure 1The direct method product of the first embodiment of the method according to the invention, i.e. the upper part of an electronic device module which can be cooled in particular, is shown in a highly schematic, not to scale illustration and in different views. The unit is shown in a top view, in a bottom view and in two sectional views according to the section lines AA and BB in the top view or bottom view. The unit consists of a sandwich module 10 and an electronic component 20 sintered thereon. The sandwich module 10 consists of three layers, i.e. a relatively thin upper plate 110, a similarly thin lower plate 130 (which in the embodiment shown also serves as the required lower plate 120) and a significantly thicker spacer plate 140 fixed in a fluid-tight manner between the upper plate 110 and the lower plate 120 or the lower plate 130, which in the embodiment shown simultaneously serves as the required spacer frame 150. The three plates 110, 120 / 130 and 140 / 150 are preferably made of light metal, in particular aluminum, and brazed to each other. In the spacer frame 150 or the intermediate plate 140, relatively large through-holes 141 are arranged, which are arranged below the electronic components 20 and define a fluid chamber 170, which acts as a cooling chamber during the operation of the finished electronic device module, but acts as a pressure chamber within the scope of the production method according to the invention. Into this, a heat exchanger element (not shown) can be inserted, for example a turbulence pad welded to the upper plate 110. The inflow to the fluid chamber 170 is ensured by corresponding, significantly smaller through-holes 131, which are centrally arranged in the bottom plate 130 for each cooling position. In the embodiment shown, the through-holes can simultaneously be the required through-holes 121 of the bottom plate 120. The outflow from the fluid chamber 170 is ensured by further, lateral through-holes 132 in the bottom plate 130. Such an outflow is used for the cooling operation of the finished electronic device module; however, it is not absolutely necessary within the scope of the production method according to the invention, so that the mentioned bottom plate through-holes 132 are not assigned a separate reference numeral as bottom plate through-holes.

[0056] exist Figure 1 , the inlet and outlet structure 40 is indicated by dashed lines, which connects the bottom plate through-holes 131, 132 to each other in groups, so as to ensure that the fluid chambers 170 of different cooling positions are supplied with coolant in parallel during operation. In the embodiment shown, the inlet and outlet structure 40 is constructed by two bowls 41, 42 that span each other. The inner bowl 41 connects the central bottom plate through-holes 131 to each other at each cooling position. Conversely, the outer bowl 42 connects the lateral bottom plate through-holes 132 to each other, so that a parallel coolant flow through all fluid chambers 170 can be established, such as by Figure 1 As shown by the flow arrows in .

[0057] Figure 2 Shown in the use of Figure 1The first method step of the method according to the invention is carried out in the case of a sandwich module 10 of the type described herein. Such a sandwich module 10 is placed with its lower side of the lower plate 120 on a substantially flat workpiece support 50. Furthermore, an electronic component 20, preferably an electronic component with an intermediate layer of a sintered layer 30 (e.g. sintered paste), is placed on the upper side of the upper plate 110. The specific order of these sub-steps is not relevant to the invention.

[0058] However, it is important that the workpiece support 50 is penetrated by a fluid supply channel 51, the entry of which spatially coincides with the through hole 121 (central through hole in the illustrated embodiment) of the lower plate 120. The sealing of this connection between the fluid supply channel 51 and the fluid chamber 170 is achieved in the illustrated embodiment via a seal 52, which in the illustrated embodiment consists of a sealing groove and an O-ring. Alternatively, a cutting edge seal similar to ISO 1179 can also be implemented in the workpiece support 50.

[0059] In the next Figure 3 In the method steps shown in , the forces required for sintering the electronic component 20 onto the sandwich module 10 are applied from above, while at the same time the fluid chamber 170 is flooded with a hydraulic fluid, in particular nitrogen, via the fluid supply channel 51 and loaded with a pressure P. This hydrostatic internal pressure is set so that it precisely compensates for the pressing force acting from the outside. The lower plate or base plate 120 / 130 rests on the workpiece support 50 over its entire surface, so that deformations due to the internal pressure P are not to be feared here either.

[0060] Figure 4 An alternative embodiment of a sandwich module 10 ′ is shown. The upper part of the sandwich module 10 ′ with the upper plate 110 , the bottom plate 130 and the intermediate plate 140 corresponds exactly to Figure 1 However, in Figure 1 In the embodiment of the present invention, the introduction and discharge parts are also integrated into the sandwich module 10' via the bowls 41, 42 to be fixed later. Therefore, in particular, two spacer frames 150a, 150b are provided, wherein the first spacer frame (150a) is as shown in FIG. Figure 1 However, the second spacer frame 150b is connected to the bottom plate 130 at the bottom, so that the bottom plate is not connected to the bottom plate 130. Figure 1 Instead, a separate lower plate 120 is provided, which is connected to the second spacer frame 150b at the bottom. Figure 4As can be seen in the sectional view along the section line CC, the second spacer frame 150b, also referred to here as the housing plate 160, has channel-shaped or longitudinally cut-shaped through-holes 161, 162. The central housing plate through-hole 161 is connected to the central bottom plate through-hole 131 and to the bottom plate through-hole. The lateral housing plate through-holes 162 are connected to the lateral bottom plate through-holes 132 and to the other bottom plate through-holes 122.

[0061] Figure 5 The electronic component 20 is sintered to Figure 4 The core method step on the sandwich module 10'. Again, one of the lower plate through-holes is connected to the fluid supply channel 51 of the workpiece support 50' in a fluid-tight manner, so that a hydrostatic internal pressure P that compensates for the contact pressure can be generated in the separate fluid chambers 170a, b formed by the intermediate plate through-hole 141 and the housing plate through-holes 161, 162. In the illustrated embodiment, the second lower plate through-hole 122, which is essentially not required for the method according to the invention, is sealed with a seal corresponding to the seal 52 in order to prevent hydraulic fluid from squeezing in between the sandwich module 10' and the workpiece support 50'. Here, a cutting edge seal can also be used as an alternative to the illustrated embodiment.

[0062] Figure 6 Another embodiment of a sandwich module 10" is shown. Here, the housing plate 160 has a collar 163 at its upper edge, into which the submodule consisting of the upper plate 110, the intermediate plate 140 and the bottom plate 130 is inserted and fixed in a materially bonded manner, in particular by brazing. Figure 7 As shown in FIG, the entire sandwich module 10 ″ is inserted into the caisson workpiece support 50 ″ in a form-fitting manner, so that lateral support is also provided when subjected to the hydrostatic internal pressure P, which enables a thinner wall thickness of the housing plate 160 . In this embodiment, the sintering is additionally supported by a hold-down device 60 .

[0063] Figure 8 and Fig. 9 Another embodiment of a sandwich module 10'' according to the invention is shown, which is isolated ( Figure 8 ) or inserted into the pot-shaped workpiece receiving portion 50"' ( Fig. 9 ). In this embodiment, the sandwich module 50"' is essentially constructed in two parts and, in addition to its upper plate 110, also includes a lower plate 120 designed as a bottom basin 130"'. The lower plate can be constructed, for example, as a sheet metal formed part, in particular a deep-drawn part. The inner contour of the basin of the workpiece support 50"' and the outer contour of the bottom basin 130"' are coordinated with each other in such a way that the side walls of the latter rest against the side walls of the former during the sintering process and are supported laterally on the outside in the fluid chamber 170 when internal pressure is applied.

[0064] Of course, the embodiments discussed in the detailed description and shown in the drawings are merely illustrative embodiments of the present invention. According to the present disclosure, a wide range of possible variations is given to those skilled in the art.

[0065] Reference numerals list

[0066] 10 Mezzanine Modules

[0067] 10' Mezzanine Module

[0068] 10” Mezzanine Module

[0069] 10”' Mezzanine Module

[0070] 110 board

[0071] 120 Lower plate

[0072] 121 Lower plate through hole

[0073] 122 Lower plate through hole

[0074] 130 Bottom plate

[0075] 130"' bottom basin

[0076] 131 Central bottom plate through hole

[0077] 131”’ Bottom Basin Through Hole

[0078] 132 Lateral bottom plate through hole

[0079] 140 Spacer

[0080] 141 Spacer plate through hole

[0081] 150 Spacer frame

[0082] 150a First spacer frame

[0083] 150b Second spacer frame

[0084] 160 Shell plate

[0085] 161 Central housing plate through hole

[0086] 162 Lateral housing plate through hole

[0087] 163 Collar

[0088] 170 Fluid chamber

[0089] 170a The upper area of ​​170

[0090] 170b The lower area of ​​170

[0091] 20 Electronic components

[0092] 30 Sintering layer

[0093] 40 Importing and exporting structures

[0094] 41 Inner bowl

[0095] 42 External bowl

[0096] 50 Workpiece support

[0097] 50' Workpiece Support

[0098] 50” Workpiece Support

[0099] 50”' Workpiece Support

[0100] 51 Fluid supply channel

[0101] 52 Seals

[0102] 60 Compactor.

Claims

1. A method for manufacturing a coolable electronic device module, comprising the following steps: a) providing a sandwich module constructed from a plurality of layer elements, the sandwich module having a flat, closed upper plate and a lower plate provided with through-holes, wherein: A fluid cavity connected to the through hole of the lower plate is constructed between the upper plate and the lower plate. b) placing the lower plate of the sandwich module on a workpiece support penetrated by the access portion of the fluid supply channel, so that the through hole of the lower plate and the access portion of the fluid supply channel are connected to each other in a fluid-tight manner, c) placing electronic components on the upper plate, d) loading the electronic component with a force directed toward the upper plate along a surface normal of the upper plate, the force being required for sintering the electronic component to the sandwich module; as well as e) filling the fluid chamber with hydraulic fluid through the fluid supply channel and applying a counterpressure to the hydraulic fluid to compensate for the force on the upper plate while applying the force to the electronic component, It is characterized in that the lower plate rests with a major portion of its surface on the workpiece support during the force application and counterpressure application in steps d and e, in order to exclude deformation of the lower plate when filling with the hydraulic fluid.

2. The method according to claim 1, It is characterized in that The sandwich module has two layer elements, namely the upper plate, and The bottom basin acts as the lower plate, and the bottom basin has a central basin depression forming the fluid chamber and a basin edge completely surrounding the basin depression, the basin depression includes a bottom basin through hole acting as a lower plate through hole, and the basin edge is connected to the lower side of the upper plate by material fit.

3. The method according to claim 1, It is characterized in that The lower plate is of planar design, and at least one spacer frame, which is also of planar design and surrounds the through-opening of the lower plate, is fastened between the lower plate and the upper plate in a fluid-tight manner.

4. The method according to claim 3, It is characterized in that The sandwich module has three layer elements, namely Said upper plate, A bottom plate that functions as the lower plate, the bottom plate having a bottom plate through-hole that functions as the lower plate through-hole, and a spacer plate that functions as the spacer frame and is materially connected to the upper plate on the one hand and to the bottom plate on the other hand, the spacer plate being penetrated by the spacer plate through-hole that forms the fluid chamber and surrounds the bottom plate through-hole.

5. The method according to claim 4, It is characterized in that The bottom plate has a plurality of bottom plate through holes, which are collectively surrounded by the spacer plate through holes.

6. The method according to claim 1, It is characterized in that The sandwich module has five layer elements, namely Said upper plate, A flat bottom plate provided with a plurality of bottom plate through-holes, a spacer plate which acts as a first spacer frame and is connected in a materially bonding manner to the upper plate on the one hand and to the bottom plate on the other hand, the spacer plate being penetrated by a spacer plate through-hole which forms the upper region of the fluid chamber and surrounds the through-hole in the bottom plate, The lower plate is provided with a plurality of lower plate through holes, the lower plate is configured to be flat, and a housing plate which acts as a second spacer frame and is connected in a materially bonded manner to the base plate on the one hand and to the lower plate on the other hand, the housing plate being penetrated by at least two housing plate through-holes which together form a separate lower region of the fluid chamber, The housing plate through holes surround different bottom plate through holes or bottom plate through hole groups and are respectively connected to one of the lower plate through holes.

7. The method according to claim 6, It is characterized in that The lower plate through-openings are each surrounded by a socket which is fixed to the lower plate in a materially bonded manner and which is inserted into the opening of the fluid supply channel in a form-fitting manner when the sandwich module is placed on a workpiece support in step b.

8. The method according to claim 6, It is characterized in that The housing plate has a circumferential collar on its top side, in which the submodule comprising the base plate, the intermediate plate and the top plate is fixed in a form-fitting and flush manner.

9. The method according to any one of the preceding claims, It is characterized in that The workpiece support is designed as a cup and the sandwich module is inserted into the cup of the workpiece support in a form-fitting manner when its lower plate is placed on the workpiece support.

10. The method according to claim 9, It is characterized in that Before and / or during the application of force in step d., the sandwich module is heated, wherein the heating produces a play-free positive fit between the sandwich module and the pot of the workpiece support.

11. The method according to any one of claims 1 to 8, It is characterized in that Before placing the electronic component on the upper plate in step c, the upper side of the upper plate and / or the lower side of the electronic component are coated with a sintered layer.

12. The method according to any one of claims 1 to 8, It is characterized in that When the lower plate is placed on the workpiece support in step b, the inlet of the fluid supply channel and the through-opening of the lower plate are connected to one another directly or in a fluid-tight manner by means of sealing means surrounding them.

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