Bifacial loudspeaker device

Abstract

The application discloses a double-sided loudspeaker device, comprising a combination of a magnetic conductive carrier plate and a side magnetic conductive element (or a magnetic conductive carrier plate assembly), a first magnetic circuit module, a second magnetic circuit module, a first voice coil, a second voice coil, a first vibration assembly and a second vibration assembly. The magnetic conductive carrier plate has two side walls and a bottom plate, and the two side walls are arranged on the two side edges of one side surface of the bottom plate. The side magnetic conductive element is arranged on the two side edges of the other side surface of the bottom plate. The first magnetic circuit module is arranged on one side of the magnetic conductive carrier plate. The second magnetic circuit module is arranged on the other side of the magnetic conductive carrier plate. The first voice coil is located between the first magnetic circuit module and the side wall. The second voice coil is located between the second magnetic circuit module and the side magnetic conductive element. The first vibration assembly is arranged on one side of the magnetic conductive carrier plate, and the first vibration assembly has a first accommodating space. The second vibration assembly is arranged on the other side of the magnetic conductive carrier plate, and the second vibration assembly has a second accommodating space, and the second accommodating space is communicated with the first accommodating space.

Description

Technical Field

[0001] This application relates to the technical field of loudspeaker devices, and more particularly to a double-sided loudspeaker device. Background Technology

[0002] In the prior art, dual-sided speaker devices are usually formed by two voice coils with a common magnetic circuit module. The interior of the dual-sided speaker device is divided into two resonant spaces by the magnetic circuit module. The two voice coils are located in the two resonant spaces respectively. The two resonant spaces are not connected, resulting in poor sound quality of the dual-sided speaker device. If the resonant space is increased to improve the sound quality of the dual-sided speaker device, the size of the dual-sided speaker device will increase, which is not suitable for thin electronic devices. Summary of the Invention

[0003] This application provides a dual-sided speaker device that solves the problem of poor sound quality in current dual-sided speaker devices.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] A first aspect provides a double-sided speaker device, comprising: a magnetic carrier plate, side magnetic guides, a first magnetic circuit module, a second magnetic circuit module, a first voice coil, a second voice coil, a first vibration assembly, and a second vibration assembly. The magnetic carrier plate has two side walls and a base plate, the two side walls being disposed on opposite sides of one surface of the base plate. The side magnetic guides are disposed on opposite sides of the other surface of the base plate. The first magnetic circuit module is disposed on one side of the magnetic carrier plate. The second magnetic circuit module is disposed on the other side of the magnetic carrier plate. The first voice coil is located between the first magnetic circuit module and the side wall. The second voice coil is located between the second magnetic circuit module and the side magnetic guides. The first vibration assembly is disposed on one side of the magnetic carrier plate and has a first accommodating space, within which the first magnetic circuit module and the first voice coil are located. The second vibration component is disposed on the other side of the magnetic carrier plate. The second vibration component has a second accommodating space. The second magnetic circuit module and the second voice coil are located in the second accommodating space. The second accommodating space is connected to the first accommodating space. The overall height of the sidewall is greater than or equal to the overall height of the first magnetic circuit module and / or the second magnetic circuit module.

[0006] In one embodiment, the first vibration assembly includes a first support and a first diaphragm. The first support is disposed on two sidewalls of the magnetic carrier plate, and the first diaphragm is disposed on the side of the first support away from the sidewall and connected to the first voice coil. The second vibration assembly includes a second support and a second diaphragm. The second support is disposed on a side magnetic conductor, and the second diaphragm is disposed on the side of the second support away from the side magnetic conductor and connected to the second voice coil.

[0007] In one embodiment, two auxiliary magnetic conductors are further included, which are respectively disposed on the two side walls.

[0008] In one embodiment, each auxiliary magnetic conductor has protrusions at both ends and each sidewall has a recess relative to the protrusion, with the protrusions being secured to the recesses.

[0009] In one embodiment, the first vibration assembly includes a first support and a first diaphragm. The first support is disposed on two side walls of a magnetic carrier plate and two auxiliary magnetic conductors. The first diaphragm is disposed on the side of the first support away from the side walls and connected to a first voice coil. The second vibration assembly includes a second support and a second diaphragm. The second support is disposed on the side magnetic conductors and the second diaphragm is disposed on the side of the second support away from the side magnetic conductors and connected to a second voice coil.

[0010] In one embodiment, the first magnetic circuit module further includes a first magnetic body and a first magnetic plate. The first magnetic body is disposed on one side surface of the base plate, and the first magnetic plate is disposed on the side of the first magnetic body away from the base plate. The second magnetic circuit module further includes a second magnetic body and a second magnetic plate. The second magnetic body is disposed on the other side surface of the base plate, and the second magnetic plate is disposed on the side of the second magnetic body away from the base plate.

[0011] In one embodiment, the height of each sidewall is higher than the height of the first magnetic body and / or the height of the second magnetic body.

[0012] In one embodiment, the height of each side-guided magnet is higher than the height of the first magnetic body and / or the height of the second magnetic body.

[0013] In one embodiment, the side magnetic guide has a through hole, and the second bracket has a fixing protrusion that passes through the through hole.

[0014] In one embodiment, one end of the fixed protrusion has a fixed end head, and the other end of the through hole has a fixed hole portion that matches the fixed end head. When the fixed protrusion is inserted into the through hole, the fixed end head is fitted into the fixed hole portion.

[0015] In one embodiment, the first bracket has a first docking structure, the second bracket has a second docking structure, the first docking structure and the second docking structure are opposite to each other, and the first docking structure and the second docking structure are connected and fixed to each other.

[0016] In one embodiment, there are two side magnetic guides, each with a notch, and the two sides of the other side surface of the base plate are respectively secured to the notches of the two side magnetic guides.

[0017] In one embodiment, the magnetic carrier plate further includes a plurality of connecting holes located on the base plate and connecting the first accommodating space and the second accommodating space.

[0018] In one embodiment, a plurality of connecting holes are arranged along the orientation of the sidewall.

[0019] In one embodiment, multiple connecting holes are located near the sidewall.

[0020] In one embodiment, the device further includes a first electrical connector and a second electrical connector. The first electrical connector is disposed on the first bracket and exposed on the outer surface of the first bracket. A first voice coil is electrically connected to the first electrical connector. The second electrical connector is disposed on the second bracket and exposed on the outer surface of the second bracket. A second voice coil is electrically connected to the second electrical connector.

[0021] In one embodiment, the position of the first electrical connector on the first bracket corresponds to the position of the second electrical connector on the second bracket.

[0022] In one embodiment, a first voice coil surrounds a first magnetic circuit module at intervals, and a second voice coil surrounds a second magnetic circuit module at intervals.

[0023] In one embodiment, the sidewall and the bottom plate are integrally formed.

[0024] In one embodiment, the first accommodating space and the second accommodating space are interconnected through the front and rear ends of the magnetic carrier plate.

[0025] A second aspect provides a dual-sided speaker device, comprising: a magnetic carrier plate assembly, a first magnetic circuit module, a second magnetic circuit module, a first voice coil, a second voice coil, a first vibration assembly, and a second vibration assembly. The magnetic carrier plate assembly includes a first magnetic carrier plate and a second magnetic carrier plate. The first magnetic carrier plate has two first sidewalls and a first base plate, with the two first sidewalls disposed on both sides of the first base plate. The second magnetic carrier plate has two second sidewalls and a second base plate, with the two second sidewalls disposed on both sides of the second base plate. The first base plate and the second base plate form a coplanar plane. The two first sidewalls extend from the upper sides of the second base plate, and the two second sidewalls extend from the lower sides of the first base plate. The first magnetic circuit module is disposed on one side of the magnetic carrier plate assembly; the second magnetic circuit module is disposed on the other side of the magnetic carrier plate assembly; and the first voice coil is located on the first magnetic circuit module. Between the two first sidewalls; the second voice coil is located between the second magnetic circuit module and the two second sidewalls; the first vibration component is disposed on one side of the magnetic carrier plate assembly, the first vibration component has a first accommodating space, the first magnetic circuit module and the first voice coil are located in the first accommodating space; and the second vibration component is disposed on the other side of the magnetic carrier plate assembly, the second vibration component has a second accommodating space, the second magnetic circuit module and the second voice coil are located in the second accommodating space, the second accommodating space is connected to the first accommodating space, wherein the overall height of the two first sidewalls and the two second sidewalls is greater than or equal to the overall height of the first magnetic circuit module and / or the second magnetic circuit module.

[0026] In one embodiment, there is a first base plate and a second base plate. Two first sidewalls extend toward the upper sides of the second base plate, forming a U-shape with the first base plate. Two second sidewalls extend toward the lower sides of the first base plate, forming a U-shape with the second base plate.

[0027] In one embodiment, there are multiple first base plates and multiple second base plates. Two adjacent first base plates are spaced apart by a second base plate, and two first sidewalls are disposed on both sides of the multiple first base plates. Two adjacent second base plates are spaced apart by a first base plate, and two second sidewalls are disposed on both sides of the multiple second base plates. The multiple first base plates and the multiple second base plates form the same plane.

[0028] In one embodiment, the first vibration assembly includes a first support and a first diaphragm. The first support is disposed on two first sidewalls of the first magnetic carrier plate, and the first diaphragm is disposed on the side of the first support away from the two first sidewalls and connected to the first voice coil. The second vibration assembly includes a second support and a second diaphragm. The second support is disposed on two second sidewalls of the second magnetic carrier plate, and the second diaphragm is disposed on the side of the second support away from the two second sidewalls and connected to the second voice coil.

[0029] In one embodiment, the first magnetic circuit module further includes a first magnetic body and a first magnetic plate. The first magnetic body is disposed on one side surface of the first base plate and the second base plate, and the first magnetic plate is disposed on the side of the first magnetic body away from the first base plate and the second base plate. The second magnetic circuit module further includes a second magnetic body and a second magnetic plate. The second magnetic body is disposed on the other side surface of the first base plate and the second base plate, and the second magnetic plate is disposed on the side of the second magnetic body away from the first base plate and the second base plate.

[0030] In one embodiment, the height of each first sidewall and each second sidewall is higher than the height of the first magnetic body and / or the height of the second magnetic body.

[0031] In one embodiment, the first bracket has a first docking structure, the second bracket has a second docking structure, the first docking structure and the second docking structure are opposite to each other, and the first docking structure and the second docking structure are connected and fixed to each other.

[0032] In one embodiment, the device further includes a first electrical connector and a second electrical connector. The first electrical connector is disposed on the first bracket and exposed on the outer surface of the first bracket. A first voice coil is electrically connected to the first electrical connector. The second electrical connector is disposed on the second bracket and exposed on the outer surface of the second bracket. A second voice coil is electrically connected to the second electrical connector.

[0033] In one embodiment, the system further includes a plurality of elastic components, the plurality of elastic components including two first elastic elements and two second elastic elements. One side of each of the two first elastic elements is connected to both sides of the first voice coil, and the other side of each of the two first elastic elements is connected to the first bracket. One side of each of the two second elastic elements is connected to both sides of the second voice coil, and the other side of each of the two second elastic elements is connected to the second bracket.

[0034] In one embodiment, the magnetic carrier plate assembly further includes a plurality of connecting holes located between the first base plate and the second base plate, the plurality of connecting holes connecting between the first accommodating space and the second accommodating space, and the plurality of connecting holes being arranged along the setting direction of the sidewall.

[0035] In one embodiment, the position of the first electrical connector on the first bracket corresponds to the position of the second electrical connector on the second bracket.

[0036] In one embodiment, a first voice coil surrounds a first magnetic circuit module at intervals, and a second voice coil surrounds a second magnetic circuit module at intervals.

[0037] In one embodiment, the first accommodating space and the second accommodating space are interconnected through the front and rear ends of the magnetic carrier plate assembly.

[0038] In one embodiment, the first base plate has a first convex surface, and the second base plate has a second convex surface, the first convex surface and the second convex surface forming a boss.

[0039] In one embodiment, the first base plate has a first protrusion and / or a first recess, and the second base plate has a second recess and / or a second protrusion corresponding to the first protrusion and / or the first recess of the first base plate, wherein the first protrusion of the first base plate is combined with the second recess of the second base plate and / or the first recess of the first base plate is combined with the second protrusion of the second base plate.

[0040] In one embodiment, the magnetic carrier plate assembly includes a plurality of vent holes, which are formed by the first sidewall, the first bottom plate and the second sidewall, the second sidewall, the second bottom plate and the first sidewall, or / and the first sidewall, the first bottom plate, the second sidewall and the second bottom plate.

[0041] In one embodiment, the plurality of vent holes are located at the connection between the two first sidewalls and the first base plate, and the plurality of vent holes are located at the connection between the two second sidewalls and the second base plate.

[0042] In one embodiment, the first support of the first vibration component has a first notch and the second support of the second vibration component has a second notch, the first notch and the second notch correspond to each other, the first notch corresponds to the upper edge of the plurality of vent holes of the magnetic carrier plate assembly, and the second notch corresponds to the lower edge of the plurality of vent holes of the magnetic carrier plate assembly.

[0043] This application provides a dual-sided speaker device, which forms a first speaker section through a magnetic carrier plate (or magnetic carrier plate assembly), a first voice coil, a first magnetic circuit module, and a first vibration component. A second speaker section is formed by the magnetic carrier plate, a side magnetic conductor (or magnetic carrier plate assembly), a second voice coil, a second magnetic circuit module, and a second vibration component. The first and second voice coils independently utilize the first and second magnetic circuit modules respectively to achieve dual-sided sound emission. The first and second accommodating spaces are two resonant cavities of the dual-sided speaker device, and the two resonant cavities are interconnected. Thus, without increasing the overall volume of the dual-sided speaker device, the volume of the resonant cavities is increased, effectively improving the sound quality of the dual-sided speaker device. Attached Figure Description

[0044] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0045] Figure 1 This is a perspective view of the double-sided speaker device according to the first embodiment of this application;

[0046] Figure 2 yes Figure 1 A sectional perspective view of line A-A';

[0047] Figure 3 yes Figure 1 A sectional view of line A-A';

[0048] Figure 4 This is an exploded view of the double-sided speaker device according to the first embodiment of this application;

[0049] Figure 5 This is another exploded view of the double-sided speaker device according to the first embodiment of this application;

[0050] Figure 6 This is a perspective view of the double-sided speaker device according to the second embodiment of this application;

[0051] Figure 7 yes Figure 6 A sectional perspective view of line B-B';

[0052] Figure 8 yes Figure 6A cross-sectional view of line B-B';

[0053] Figure 9 This is an exploded view of the internal structure of the double-sided speaker device according to the second embodiment of this application;

[0054] Figure 10 This is a perspective view of the double-sided speaker device according to the third embodiment of this application;

[0055] Figure 11 yes Figure 10 A sectional perspective view of the C-C' line;

[0056] Figure 12 yes Figure 10 A cross-sectional view of the C-C' line;

[0057] Figure 13 This is an exploded view of the double-sided speaker device according to the third embodiment of this application;

[0058] Figure 14 This is another exploded view of the double-sided speaker device according to the third embodiment of this application;

[0059] Figure 15 This is a perspective view of the magnetic carrier plate of this application having multiple through holes;

[0060] Figure 16 This is a perspective view of the magnetic carrier plate assembly of this application having multiple through holes;

[0061] Figure 17 This is an exploded perspective view of the magnetic carrier plate assembly of this application;

[0062] Figure 18 This is an assembly diagram of the magnetic carrier plate assembly of this application;

[0063] Figure 19 This is another exploded perspective view of the magnetic carrier plate assembly of this application;

[0064] Figure 20 This is another assembly diagram of the magnetic carrier plate assembly of this application;

[0065] Figure 21 This is an exploded view of the spring assembly of the double-sided speaker device of this application;

[0066] Figure 22 This is an assembly diagram of the spring-loaded component of the double-sided speaker device of this application; and

[0067] Figure 23 This is a perspective view of the spring assembly of the double-sided speaker device of this application.

[0068] The following explanation is based on the accompanying diagram:

[0069] 1: Double-sided speaker device; 11: Magnetic carrier plate; 11A: Magnetic carrier plate assembly; 111: Side wall; 110A: Vent hole; 111A: First magnetic carrier plate; 1111A: First side wall; 1112A: First base plate; 1113A: First convex surface; 1114A: First protrusion; 1115A: First recess; 112A: Second magnetic carrier plate; 1121A: Second side wall; 1122A: Second base plate; 1123A: Second... 1124A: Second convex part; 1125A: Second concave part; 1111: Concave part; 112: Base plate; 1121: First side edge; 1122: Second side edge; 113: Connecting hole; 12: Side magnetic guide; 121: Notch; 122: Through hole; 1221: Fixing hole; 13: First magnetic circuit module; 131: First magnetic body; 132: First magnetic plate; 14: Second magnetic circuit module; 141: Second magnetic body; 14 2: Second magnetic plate; 15: First voice coil; 16: Second voice coil; 17: First vibration assembly; 170: First accommodating space; 171: First support; 1711: First docking structure; 1712: First notch; 172: First diaphragm; 18: Second vibration assembly; 180: Second accommodating space; 181: Second support; 1811: Second docking structure; 1812: Fixed protrusion; 18121: Fixed end; 1813: Second notch; 182: Second diaphragm; 191: First electrical connector; 192: Second electrical connector; 21: Auxiliary magnetic conductor; 211: Protrusion; 22: Elastic component; 221: First elastic component; 222: Second elastic component; H11: Height of sidewall; H13: Height of side magnetic conductor; H15: Height of first sidewall; H17: Height of second sidewall; H21: Height of first magnetic body; H22: Height of second magnetic body. Detailed Implementation

[0070] The following drawings disclose several embodiments of this application. For clarity, many implementation details will be described in the following description. However, it should be understood that these implementation details are not intended to limit the application. That is, in some embodiments of this application, these implementation details are not essential. Furthermore, for the sake of simplicity, some conventional structures and components will be shown in a simple schematic manner in the drawings. In the following embodiments, the same or similar components will be represented by the same reference numerals.

[0071] Please see Figures 1 to 4 , Figure 1 This is a perspective view of the double-sided speaker device according to the first embodiment of this application. Figure 2 yes Figure 1 sectional perspective view of line A-A' Figure 3 yes Figure 1 The cross-sectional view of line A-A' and Figure 4This is an exploded view of the double-sided speaker device according to the first embodiment. As shown in the figure, this application provides a double-sided speaker device 1, including a magnetic carrier plate 11, side magnetic guides 12, a first magnetic circuit module 13, a second magnetic circuit module 14, a first voice coil 15, a second voice coil 16, a first vibration assembly 17, and a second vibration assembly 18. The magnetic carrier plate 11 has two side walls 111 and a base plate 112. The two side walls 111 are disposed on both sides of one side surface of the base plate 112. The side magnetic guides 12 are disposed on both sides of the other side surface of the base plate 112. The first magnetic circuit module 13 is disposed on one side of the magnetic carrier plate 11. The second magnetic circuit module 14 is disposed on the other side of the magnetic carrier plate 11. The first voice coil 15 surrounds the first magnetic circuit module 13 at intervals, and the first voice coil 15 is located between the first magnetic circuit module 13 and the side walls 111. The second voice coil 16 surrounds the second magnetic circuit module 14 at intervals, and is located between the second magnetic circuit module 14 and the side magnetic guide 12. The first vibration assembly 17 is disposed on one side of the magnetic carrier plate 11, and has a first accommodating space 170, within which the first magnetic circuit module 13 and the first voice coil 15 are located. The second vibration assembly 18 is disposed on the other side of the magnetic carrier plate 11, and has a second accommodating space 180, within which the second magnetic circuit module 14 and the second voice coil 16 are located. The second accommodating space 180 connects to the first accommodating space 170. The first accommodating space 170 and the second accommodating space 180 are interconnected through the front and rear ends of the magnetic carrier plate 11 (where there are no side walls 111), allowing air to circulate between the first vibration assembly 17 and the second vibration assembly 18 during operation, thereby improving the effect of generating a three-dimensional resonant sound.

[0072] In this embodiment, the overall height of the sidewall 111 of the magnetic carrier plate 11 is greater than or equal to the overall height of the first magnetic circuit module 13 and / or the second magnetic circuit module 14. This embodiment may, but is not limited to, having the overall height of the sidewall 111 greater than that of the first magnetic circuit module 13 and / or the second magnetic circuit module 14 as an example. Specifically, the magnetic carrier plate 11 has two sidewalls 111. One side surface of the base plate 112 has a first side edge 1121 and a second side edge 1122 opposite to the first side edge 1121. The two sidewalls 111 are respectively disposed on the first side edge 1121 and the second side edge 1122 of the base plate 112. The sidewalls 111 and the base plate 112 can be integrally formed. Similarly, there are two side magnetic guides 12, each with a recess 121. The two sides of the other side surface of the base plate 112 are respectively secured to the recesses 121 of the two side magnetic guides 12. The side wall 111 and the side magnetic guide 12 are positioned relative to the two sides of the base plate 112.

[0073] Furthermore, the first magnetic circuit module 13 further includes a first magnetic body 131 and a first magnetic conductive plate 132. The first magnetic body 131 is disposed on one side surface of the base plate 112, and the first magnetic conductive plate 132 is disposed on the side of the first magnetic body 131 away from the base plate 112. The second magnetic circuit module 14 further includes a second magnetic body 141 and a second magnetic conductive plate 142. The second magnetic body 141 is disposed on the other side surface of the base plate 112, and the second magnetic conductive plate 142 is disposed on the side of the second magnetic body 141 away from the base plate 112. Wherein, in terms of the height of the base plate 112 perpendicular to the magnetic conductive carrier plate 11, the height H11 of the sidewall 111 is higher than the height H21 of the first magnetic body 131 and / or the height H22 of the second magnetic body 141. When the height H11 of the sidewall 111 of the magnetic carrier plate 11 is higher than the height H21 of the first magnetic body 131, it indicates that the sidewall 111 of the magnetic carrier plate 11 can cover most of the magnetic field lines of the first magnetic body 131. The sidewall 111 of the magnetic carrier plate 11 helps to concentrate the magnetic field lines of the first magnetic body 131, resulting in a better magnetic field effect generated by the first magnetic body 131. Furthermore, the height H13 of the side magnetic guide 12 is higher than the height H21 of the first magnetic body 131 and / or the height H22 of the second magnetic body 141. When the height H13 of the side magnetic guide 12 is higher than the height H22 of the second magnetic body 141, it indicates that the magnetic carrier plate 11 and the side magnetic guide 12 can cover most of the magnetic field lines of the second magnetic body 141, also producing a better magnetic field effect.

[0074] Please refer to the following: Figure 5 This is another exploded view of the double-sided speaker device according to the first embodiment of this application. As shown in the figure, in this embodiment, the first vibration assembly 17 includes a first support 171 and a first diaphragm 172. The first support 171 is disposed on one side of the magnetic carrier plate 11, and the first diaphragm 172 is disposed on the side of the first support 171 away from the two side walls 111, and the first diaphragm 172 is connected to the first voice coil 15. The second vibration assembly 18 includes a second support 181 and a second diaphragm 182. The second support 181 is disposed on the other side of the magnetic carrier plate 11, and the second diaphragm 182 is disposed on the side of the second support 181 away from the side magnetic conductors 12, and the second diaphragm 182 is connected to the second voice coil 16. The first support 171 is fixed to the two side walls 111, and the second support 181 is fixed to the two side magnetic conductors 12.

[0075] Furthermore, the first bracket 171 is disposed on the two side walls 111 of the magnetic carrier plate 11, and the second bracket 181 is disposed on the two side magnetic conductors 12. Each side magnetic conductor 12 has a through hole 122, and the second bracket 181 has a fixing protrusion 1812, which passes through the through hole 122. One end of the fixing protrusion 1812 has a fixing end 18121, and one end of the through hole 122 has a fixing hole 1221 that matches the fixing end 18121. When the fixing protrusion 1812 passes through the through hole 122, the fixing end 18121 engages with the fixing hole 1221, and the fixing end 18121 serves to prevent the side magnetic conductor 12 from disengaging from the fixing protrusion 1812.

[0076] Furthermore, the first bracket 171 has a first docking structure 1711, and the second bracket 181 has a second docking structure 1811. The first docking structure 1711 and the second docking structure 1811 are opposite to each other. The first bracket 171 is disposed on the second bracket 181, and the first docking structure 1711 and the second docking structure 1811 are connected and fixed to each other. The first docking structure 1711 and the second docking structure 1811 can be protrusions or slots. The first docking structure 1711 and the second docking structure 1811 are arranged opposite to each other, so that the protrusions are fitted into the slots, thereby strengthening the fixing strength between the first bracket 171 and the second bracket 181.

[0077] In this embodiment, the dual-sided speaker device 1 further includes a first electrical connector 191 and a second electrical connector 192. The first electrical connector 191 is disposed on the first bracket 171 and exposed on the outer surface of the first bracket 171. A first voice coil 15 is electrically connected to the first electrical connector 191. The second electrical connector 192 is disposed on the second bracket 181 and exposed on the outer surface of the second bracket 181. A second voice coil 16 is electrically connected to the second electrical connector 192. The positions of the first electrical connector 191 on the first bracket 171 and the second electrical connector 192 on the second bracket 181 correspond to each other.

[0078] In this embodiment, an external power source supplies current to the first voice coil 15 through the first electrical connector 191, and simultaneously supplies current to the second voice coil 16 through the second electrical connector 192. The first voice coil 15 and the second voice coil 16 generate magnetic fields under the influence of the current. Thus, by changing the magnitude of the current supplied to the first voice coil 15 and the second voice coil 16, the magnitude and direction of the magnetic fields generated by the first voice coil 15 and the second voice coil 16 can be changed. The magnetic field of the first voice coil 15 interacts with the magnetic field of the first magnetic circuit module 13, causing the first voice coil 15 to vibrate orthogonally to the direction of the current. The first voice coil 15 drives the first diaphragm 172 to vibrate, producing sound. Similarly, the magnetic field of the second voice coil 16 interacts with the magnetic field of the second magnetic circuit module 14, causing the second voice coil 16 to vibrate orthogonally to the direction of the current. The second voice coil 16 drives the second diaphragm 182 to vibrate, producing sound. In this embodiment, the dual-sided speaker device 1 forms a first speaker section through a magnetic carrier plate 11, a first magnetic circuit module 13, a first voice coil 15, and a first vibration component 17. The magnetic carrier plate 11, a second magnetic circuit module 14, a second voice coil 16, and a second vibration component 18 form a second speaker section, thus achieving dual-sided speaker operation.

[0079] Furthermore, since the identical vibrating masses of the first voice coil 15 and the second voice coil 16 cancel each other out, the vibration of the dual-sided speaker 1 is reduced, the vibration area of ​​the first diaphragm 172 and the second diaphragm 182 is increased, and the efficiency of the dual-sided speaker 1 is improved. In addition, the first accommodating space 170 and the second accommodating space 180 in this embodiment are two resonant cavities of the dual-sided speaker 1, and the two resonant cavities are interconnected. In this way, without increasing the volume of the dual-sided speaker 1, the volume of the resonant cavities of the dual-sided speaker 1 is increased, which can effectively improve the stereo sound quality of the dual-sided speaker 1.

[0080] Please see Figures 6 to 9 , Figure 6 This is a perspective view of the double-sided speaker device according to the second embodiment of this application. Figure 7 yes Figure 6 sectional perspective view of line B-B' Figure 8 yes Figure 6 The cross-sectional view of line B-B' and Figure 9This is an exploded view of the internal structure of the double-sided speaker device according to the second embodiment. As shown, the difference between this embodiment and the first embodiment is that it includes two auxiliary magnetic guides 21. The two auxiliary magnetic guides 21 are respectively disposed on the two side walls 111. Each auxiliary magnetic guide 21 has a protrusion 211 at both ends, and each side wall 111 has a concave portion 1111 relative to the protrusion 211. The protrusion 211 of the auxiliary magnetic guide 21 is fixed to the concave portion 1111 of the side wall 111. In this embodiment, by disposing of the auxiliary magnetic guides 21 on both sides of the magnetic carrier plate 11, the auxiliary magnetic guides 21 help to concentrate the magnetic lines of force of the magnetic carrier plate 11, thereby enhancing the magnetic field generated by the first magnetic circuit module 13. Furthermore, the first bracket 171 is disposed on the two side walls 111 and the two auxiliary magnetic guides 21 of the magnetic carrier plate 11, and the second bracket 181 is disposed on the side magnetic guide 12.

[0081] Please see Figures 10 to 14 , Figure 10 This is a perspective view of the double-sided speaker device according to the third embodiment of this application. Figure 11 yes Figure 10 sectional perspective view of the C-C' line, Figure 12 yes Figure 10 A cross-sectional view of the C-C' line. Figure 13 This is an exploded view of the double-sided speaker device according to the third embodiment. Figure 14This is another exploded view of the double-sided speaker device according to the third embodiment. As shown in the figure, the difference between this embodiment and the first embodiment is that the magnetic carrier plate assembly 11A replaces the combination of the magnetic carrier plate 11 and the side magnetic component 12. In this embodiment, the double-sided speaker device 1 includes the magnetic carrier plate assembly 11A, the first magnetic circuit module 13, the second magnetic circuit module 14, the first voice coil 15, the second voice coil 16, the first vibration component 17, and the second vibration component 18. The magnetic carrier plate assembly 11A includes a first magnetic carrier plate 111A and a second magnetic carrier plate 112A. The first magnetic carrier plate 111A has two first sidewalls 1111A and a first base plate 1112A, with the two first sidewalls 1111A disposed on both sides of the first base plate 1112A. The second magnetic carrier plate 112A has two second sidewalls 1121A and a second base plate 1122A, with the two second sidewalls 1121A disposed on both sides of the second base plate 1122A. The first base plate 1112A and the second base plate 1122A form a coplanar plane. The two first sidewalls 1111A are located on the upper sides of the second base plate 1122A, and the two second sidewalls 1121A are located on the lower sides of the first base plate 1112A. A first magnetic circuit module 13 is disposed on one side of the magnetic carrier plate assembly 11A. A second magnetic circuit module 14 is disposed on the other side of the magnetic carrier plate assembly 11A. A first voice coil 15 surrounds a first magnetic circuit module 13 at intervals, and the first voice coil 15 is located between the first magnetic circuit module 13 and the two first sidewalls 1111A. A second voice coil 16 surrounds a second magnetic circuit module 14 at intervals, and the second voice coil 16 is located between the second magnetic circuit module 14 and the two second sidewalls 1121A.

[0082] Furthermore, the first vibration component 17 is disposed on one side of the magnetic carrier plate assembly 11A. The first vibration component 17 has a first accommodating space 170, within which the first magnetic circuit module 13 and the first voice coil 15 are located. The second vibration component 18 is disposed on the other side of the magnetic carrier plate assembly 11A. The second vibration component 18 has a second accommodating space 180, within which the second magnetic circuit module 14 and the second voice coil 16 are located. The second accommodating space 180 is connected to the first accommodating space 170. The first accommodating space 170 and the second accommodating space 180 are interconnected through the front and rear ends of the magnetic carrier plate assembly 11A, where the two first sidewalls 1111A and the two second sidewalls 1121A are not present.

[0083] In this embodiment, as Figure 14As shown, the first magnetic carrier plate 111A and the second magnetic carrier plate 112A have the same structure. There is one first base plate 1112A. Two first sidewalls 1111A are disposed on both sides of the first base plate 1112A. The two first sidewalls 1111A extend towards the upper sides of the second base plate 1122A and extend horizontally out of the surface of the first base plate 1112A. The length of the two first sidewalls 1111A extending out of the first base plate 1112A is equal to the length of the second base plate 1122A, and a U-shaped structure is formed between the two first sidewalls 1111A and the first base plate 1112A. Furthermore, there is one second base plate 1122A, and two second sidewalls 1121A are disposed on both sides of the second base plate 1122A. The two second sidewalls 1121A extend downwards towards the sides of the first base plate 1112A, and extend horizontally beyond the surface of the second base plate 1122A. The length of the two second sidewalls 1121A extending beyond the second base plate 1122A is equal to the length of the first base plate 1112A, and the two second sidewalls 1121A form a U-shape with the second base plate 1122A. The two first sidewalls 1111A and the first base plate 1112A are integrally formed, and the two second sidewalls 1121A and the second base plate 1122A are integrally formed. The first magnetically conductive carrier plate 111A and the second magnetically conductive carrier plate 112A are assembled opposite each other by inverting their positions. The first base plate 1112A and the second base plate 1122A form a common plane to support the first magnetic circuit module 13 and the second magnetic circuit module 14. In addition, the two first sidewalls 1111A are the common upper sidewalls of the first base plate 1112A and the second base plate 1122A, and the two second sidewalls 1121A are the common lower sidewalls of the first base plate 1112A and the second base plate 1122A. Thus, the magnetically conductive carrier plate assembly 11A has high structural strength. Furthermore, the identical structure of the first magnetically conductive carrier plate 111A and the second magnetically conductive carrier plate 112A facilitates manufacturing, eliminates the need for additional mold design, and saves manufacturing costs.

[0084] Furthermore, in this embodiment, as Figure 12As shown, the overall height of the two first sidewalls 1111A and the two second sidewalls 1121A is greater than or equal to the overall height of the first magnetic circuit module 13 and / or the second magnetic circuit module 14. This embodiment may, but is not limited to, exemplify a height greater than that of the first magnetic circuit module 13 and / or the second magnetic circuit module 14. Specifically, the first support 171 of the first vibration assembly 17 is fixed to the two first sidewalls 1111A, and the second support 181 is fixed to the two side magnetic guides 12. The second support 181 of the second vibration assembly 18 is fixed to the two second sidewalls 1121A. Furthermore, the first magnetic body 131 of the first magnetic circuit module 13 is disposed on one side surface of the first base plate 1112A and the second base plate 1122A. The second magnetic body 141 of the second magnetic circuit module 14 is disposed on the other side surface of the first base plate 1112A and the second base plate 1122A. The height H15 of each first sidewall 1111A and the height H17 of each second sidewall 1121A are higher than the height H21 of the first magnetic body 131 and / or the height H22 of the second magnetic body 141. With the above structural configuration, the first magnetic circuit module 13, the second magnetic circuit module 14, the first voice coil 15 and the second voice coil 16 can operate in a stable electromagnetic field.

[0085] Furthermore, in this embodiment, the structures of the first magnetic circuit module 13, the second magnetic circuit module 14, the first voice coil 15, the second voice coil 16, the first vibration component 17, the second vibration component 18, the first electrical connector 191, and the second electrical connector 192 are the same as those in the first and second embodiments described above, and therefore will not be repeated here.

[0086] Please see Figure 15 This is a perspective view of the magnetic carrier plate of this application having multiple connecting holes. As shown in the figure, the difference between the base plate 112 structure of the magnetic carrier plate 11 in this embodiment and the first and second embodiments is that it includes multiple connecting holes 113. The multiple connecting holes 113 are located on the base plate 112 and connect the first accommodating space 170 and the second accommodating space 180. The multiple connecting holes 113 facilitate the resonance effect between the first accommodating space 170 and the second accommodating space 180, that is, the airflow of vibration during operation flows between the first accommodating space 170 and the second accommodating space 180. The multiple connecting holes 113 are arranged at intervals along the setting direction of the sidewall 111 and are located close to the sidewall 111. This embodiment does not limit the setting and arrangement of the connecting holes 113 on the base plate 112 and can be adjusted according to the user's needs.

[0087] Please see Figure 16This is a perspective view of the magnetic carrier plate assembly of this application having multiple connecting holes. As shown in the figure, the difference between this embodiment and the structure of the first base plate 1112A of the first magnetic carrier plate 111A and the second base plate 1122A of the second magnetic carrier plate 112A in the third embodiment is that it includes multiple connecting holes 113. The multiple connecting holes 113 are located on the first base plate 1112A and the second base plate 1122A, and the multiple connecting holes 113 connect the first accommodating space 170 and the second accommodating space 180. The multiple connecting holes 113 facilitate the resonance effect of the first accommodating space 170 and the second accommodating space 180, that is, the airflow of vibration during operation flows between the first accommodating space 170 and the second accommodating space 180. The multiple connecting holes 113 are arranged at intervals along the setting direction of the first sidewall 1111A and the second sidewall 1121A, and the multiple connecting holes 113 are located near the first sidewall 1111A and / or the second sidewall 1121A. This embodiment does not limit the setting and arrangement of the connecting holes 113 on the first base plate 1112A and the second base plate 1122A, and can be adjusted according to the user's needs.

[0088] Please refer to the following: Figure 17 and Figure 18 , Figure 17 This is an exploded perspective view of the magnetic carrier plate assembly of this application. Figure 18 This is a composite diagram. As shown in the figure, in another embodiment, there are multiple first base plates 1112A and multiple second base plates 1122A. The width of a second base plate 1122A separates two adjacent first base plates 1112A, and two first sidewalls 1111A are disposed on both sides of the multiple first base plates 1112A. The width of a first base plate 1112A separates two adjacent second base plates 1122A, and two second sidewalls 1121A are disposed on both sides of the multiple second base plates 1122A. The multiple first base plates 1112A and the multiple second base plates 1122A form a coplanar plane to support the first magnetic circuit module 13 and the second magnetic circuit module 14.

[0089] As described above, the first base plate 1112A has a first convex surface 1113A, and the second base plate 1122A has a second convex surface 1123A. The first convex surface 1113A and the second convex surface 1123A form a boss. The first convex surface 1113A is located on the upper surface and / or lower surface of the first base plate 1112A, and the second convex surface 1123A is located opposite to the first convex surface on the upper surface and / or lower surface of the second base plate 1122A. The boss structure can be configured on one side or both sides according to the user's needs. In this embodiment, the boss can connect multiple first base plates 1112A and multiple second base plates 1122A. The boss increases the structural thickness of the combined structure of multiple first base plates 1112A and multiple second base plates 1122A, thereby strengthening the structural strength between the multiple first base plates 1112A of the first magnetic carrier plate 111A and the multiple second base plates 1122A of the second magnetic carrier plate 112A. The boss structure of this embodiment can also be applied to a structure consisting of a single first base plate 1112A and a single second base plate 1122A, and has the same effect of strengthening the structural strength.

[0090] Please refer to the following: Figure 19 and Figure 20 , Figure 19 This is another exploded perspective view of the magnetic carrier plate assembly of this application. Figure 20 This is another combined diagram. As shown, this embodiment further adds a connecting structure to the first base plate 1112A and the second base plate 1122A. The first base plate 1112A has a first protrusion 1114A and / or a first recess 1115A, and the second base plate 1122A has a second recess 1125A and / or a second protrusion 1124A corresponding to the first protrusion 1114A and / or the first recess 1115A of the first base plate 1112A. The first protrusion 1114A of the first base plate 1112A is combined with the second recess 1125A of the second base plate 1122A, and / or the first recess 1115A of the first base plate 1112A is combined with the second protrusion 1124A of the second base plate 1122A. The structural connection strength between the plurality of first base plates 1112A of the first magnetically conductive carrier plate 111A and the plurality of second base plates 1122A of the second magnetically conductive carrier plate 112A is strengthened in the above manner. This embodiment does not limit the shape of the matching connection structure between the first base plate 1112A and the second base plate 1122A. For example, a serrated side with a serrated notch or a wavy side with a wavy notch, etc., can be matched and connected or assembled with each other to achieve a plane between the first base plate 1112A and the second base plate 1122A. This can improve the structural connection strength between the multiple first base plates 1112A of the first magnetic carrier plate 111A and the multiple second base plates 1122A of the second magnetic carrier plate 112A. The above can be adjusted according to the user's needs.

[0091] Furthermore, the magnetic carrier plate assembly 11A includes a plurality of vent holes 110A, which are composed of a first sidewall 1111A, a first base plate 1112A and a second sidewall 1121A, a second sidewall 1121A, a second base plate 1122A and a first sidewall 1111A, or / and a first sidewall 1111A, a first base plate 1112A, a second sidewall 1121A and a second base plate 1122A. In this embodiment, the vent holes 110A are assembled using the aforementioned structures, and each vent hole 110A connects the first accommodating space 170, the second accommodating space 180 and the outer space of the magnetic carrier plate assembly 11A. Each vent 110A contributes to the resonance effect of the first accommodating space 170, the second accommodating space 180, and the outer space of the magnetic carrier plate assembly 11A, that is, the airflow of vibrating air during operation flows between the first accommodating space 170, the second accommodating space 180, and the outer space of the magnetic carrier plate assembly 11A. This embodiment does not limit the arrangement of the vents 110A and can be adjusted according to the user's needs. Furthermore, the vents 110A of this embodiment can also be applied to the double-sided speaker device 1 of the aforementioned embodiments to facilitate the airflow of vibrating air between the first accommodating space 170, the second accommodating space 180, and the outer space of the magnetic carrier plate assembly 11A.

[0092] It should be further explained that, such as Figure 17 and Figure 18 As shown, multiple vent holes 110A are located at the connection point between the two first side walls 1111A and the first base plate 1112A, i.e., at the corner connection point; multiple vent holes 110A are located at the connection point between the two second side walls 1121A and the second base plate 1122A, i.e., at the corner connection point; however, the vent holes 110A located between the two first side walls 1111A and the first base plate 1112A can match the vent holes 110A located between the two second side walls 1121A and the second base plate 1122A to form a larger ventilation area.

[0093] Please refer to the following: Figure 22 and Figure 23 The first support 171 of the first vibration component 17 has a first recess 1712 (the same structure as the second recess 1813 shown in the figure) and the second support 181 of the second vibration component 18 has a second recess 1813. The first recess 1712 and the second recess 1813 have the same structure and are positioned corresponding to each other. The first recess 1712 corresponds to the upper edge of the plurality of vent holes 110A of the magnetic carrier plate assembly 11A, and the second recess 1813 corresponds to the lower edge of the plurality of vent holes 110A of the magnetic carrier plate assembly 11A. Thus, the first recess 1712 and the second recess 1813 facilitate the airflow of the plurality of vent holes 110A.

[0094] Please see Figures 21 to 23 , Figure 21 This is an exploded view of the spring assembly of the double-sided speaker device of this application. Figure 22 It is a combination diagram and Figure 23 This is a perspective view. As shown in the figure, in this embodiment, the dual-sided speaker device 1 further includes multiple elastic components 22. Each elastic component 22 includes two first elastic elements 221 and two second elastic elements 222. One side of each of the two first elastic elements 221 is connected to both sides of the first voice coil 15, and the other side of each of the two first elastic elements 221 is connected to the first bracket 171. One side of each of the two second elastic elements 222 is connected to both sides of the second voice coil 16, and the other side of each of the two second elastic elements 222 is connected to the second bracket 181. As described above, the first elastic element 221 of the multiple elastic components 22 mainly prevents the first voice coil 15 from contacting the first sidewall 1111A of the first magnetic carrier plate 111A and the first magnetic circuit module 13 when the first voice coil 15 vibrates and displaces vertically in the gap between the first sidewall 1111A of the first magnetic carrier plate 111A and the first magnetic circuit module 13. Similarly, the second elastic element 222 of the multiple elastic components 22 mainly prevents the second voice coil 16 from contacting the second sidewall 1121A of the second magnetic carrier plate 112A and the second magnetic circuit module 14 when the second voice coil 15 vibrates and displaces vertically in the gap between the second sidewall 1121A of the second magnetic carrier plate 112A and the second magnetic circuit module 14. Simultaneously, when the first voice coil 15 and the second voice coil 16 stop vibrating, they return to their original positions. The multiple elastic components 22 provide support for the balance of the first vibration component 17 and the second vibration component 18 and control the smoothness of the vibration amplitude. The flexible component of this embodiment is also applicable to the first and second embodiments, and can be correspondingly set between the bracket and the voice coil according to the user's needs to achieve the same effect.

[0095] In summary, this application provides a dual-sided speaker device, which forms a first speaker section through a magnetic carrier plate (or magnetic carrier plate assembly), a first voice coil, a first magnetic circuit module, and a first vibration component. A second speaker section is formed by the magnetic carrier plate, a side magnetic conductor (or magnetic carrier plate assembly), a second voice coil, a second magnetic circuit module, and a second vibration component. The first and second voice coils independently utilize the first and second magnetic circuit modules respectively to achieve dual-sided sound emission. The first and second accommodating spaces are two resonant cavities of the dual-sided speaker device, and the two resonant cavities are interconnected. Thus, without increasing the overall volume of the dual-sided speaker device, the volume of the resonant cavities is increased, effectively improving the sound quality of the dual-sided speaker device.

[0096] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0097] The foregoing description illustrates and describes several preferred embodiments of this application. However, as previously stated, it should be understood that this application is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of this application should be protected within the scope of the appended claims.

Claims

1. A double-sided speaker device, characterized in that, It includes: A magnetic carrier plate has two side walls and a bottom plate, wherein the two side walls are disposed on both sides of one side surface of the bottom plate; Side magnetic guides are disposed on both sides of the other side surface of the base plate, and the side magnetic guides have through holes; The first magnetic circuit module is disposed on one side of the magnetically conductive carrier plate; The second magnetic circuit module is disposed on the other side of the magnetically conductive carrier plate; The first voice coil is located between the first magnetic circuit module and the side wall; The second voice coil is located between the second magnetic circuit module and the side magnetic component; A first vibration component is disposed on one side of the magnetic carrier plate. The first vibration component has a first accommodating space, and the first magnetic circuit module and the first voice coil are located within the first accommodating space. as well as The second vibration component is disposed on the other side of the magnetic carrier plate. The second vibration component has a second accommodating space. The second magnetic circuit module and the second voice coil are located in the second accommodating space. The second accommodating space is connected to the first accommodating space. The second vibration component includes a second bracket. The second bracket has a fixed protrusion. The fixed protrusion of the second bracket passes through the through hole of the side magnetic conductor. Wherein, the overall height of the sidewall is greater than or equal to the overall height of the first magnetic circuit module and / or the second magnetic circuit module.

2. The double-sided speaker device as described in claim 1, characterized in that, The first vibration assembly includes a first support and a first diaphragm. The first support is disposed on the two sidewalls of the magnetic carrier plate, and the first diaphragm is disposed on the side of the first support away from the sidewall and connected to the first voice coil. The second vibration assembly includes a second diaphragm, which is disposed on the side of the second support away from the side magnetic conductor and connected to the second voice coil.

3. The double-sided speaker device as described in claim 1, characterized in that, It also includes two auxiliary magnetic conductive elements, which are respectively disposed on the two side walls.

4. The double-sided speaker device as described in claim 3, characterized in that, Each of the auxiliary magnetic conductors has a protrusion at both ends, and each of the sidewalls has a recess relative to the protrusion, the protrusion being secured to the recess.

5. The double-sided speaker device as described in claim 3, characterized in that, The first vibration assembly includes a first support and a first diaphragm. The first support is disposed on the two side walls and the two auxiliary magnetic conductors of the magnetic carrier plate. The first diaphragm is disposed on the side of the first support away from the side wall and connected to the first voice coil. The second vibration assembly includes a second diaphragm. The second diaphragm is disposed on the side of the second support away from the side magnetic conductors and connected to the second voice coil.

6. The double-sided loudspeaker device as described in any one of claims 1 to 5, characterized in that, The first magnetic circuit module further includes a first magnetic body and a first magnetic plate. The first magnetic body is disposed on one side surface of the base plate, and the first magnetic plate is disposed on the side of the first magnetic body away from the base plate. The second magnetic circuit module further includes a second magnetic body and a second magnetic plate. The second magnetic body is disposed on the other side surface of the base plate, and the second magnetic plate is disposed on the side of the second magnetic body away from the base plate.

7. The double-sided speaker device as described in claim 6, characterized in that, The height of each of the sidewalls is higher than the height of the first magnet and / or the height of the second magnet.

8. The double-sided speaker device as described in claim 6, characterized in that, The height of each of the side magnetic elements is higher than the height of the first magnetic body and / or the height of the second magnetic body.

9. The double-sided speaker device as described in claim 1, characterized in that, One end of the fixed protrusion has a fixed end head, and one end of the through hole has a fixed hole portion that matches the fixed end head. When the fixed protrusion is inserted into the through hole, the fixed end head is fitted into the fixed hole portion.

10. The double-sided speaker device as described in claim 2 or 5, characterized in that, The first bracket has a first docking structure, and the second bracket has a second docking structure. The first docking structure and the second docking structure are opposite to each other and are connected and fixed to each other.

11. The double-sided speaker device as described in claim 1, characterized in that, The side magnetic guide has two parts, each of which has a notch. The two sides of the other side surface of the base plate are respectively secured to the notches of the two side magnetic guides.

12. The double-sided speaker device as described in claim 1, characterized in that, The magnetic carrier plate further includes a plurality of connecting holes, which are located on the base plate and connect the first accommodating space and the second accommodating space.

13. The double-sided speaker device as described in claim 12, characterized in that, The plurality of connecting holes are arranged along the setting direction of the sidewall.

14. The double-sided speaker device as described in claim 12, characterized in that, The plurality of connecting holes are located near the sidewall.

15. The double-sided speaker device as described in claim 2 or 5, characterized in that, It further includes a first electrical connector and a second electrical connector. The first electrical connector is disposed on the first bracket and exposed on the outer surface of the first bracket. The first voice coil is electrically connected to the first electrical connector. The second electrical connector is disposed on the second bracket and exposed on the outer surface of the second bracket. The second voice coil is electrically connected to the second electrical connector.

16. The double-sided speaker device as described in claim 15, characterized in that, The position of the first electrical connector on the first bracket corresponds to the position of the second electrical connector on the second bracket.

17. The double-sided speaker device as described in claim 1, characterized in that, The first voice coil surrounds the first magnetic circuit module at intervals, and the second voice coil surrounds the second magnetic circuit module at intervals.

18. The double-sided speaker device as described in claim 1, characterized in that, The sidewall and the bottom plate are integrally formed.

19. The double-sided speaker device as described in claim 1, characterized in that, The first accommodating space and the second accommodating space are interconnected through the front and rear ends of the magnetic carrier plate.

20. A double-sided speaker device, characterized in that, It includes: A magnetically conductive carrier plate assembly includes a first magnetically conductive carrier plate and a second magnetically conductive carrier plate. The first magnetically conductive carrier plate has two first sidewalls and a first base plate, with the two first sidewalls disposed on both sides of the first base plate. The second magnetically conductive carrier plate has two second sidewalls and a second base plate, with the two second sidewalls disposed on both sides of the second base plate. There is one first base plate and one second base plate. The two first sidewalls extend towards the upper sides of the second base plate, forming a U-shape with the first base plate. The two second sidewalls extend towards the lower sides of the first base plate, also forming a U-shape with the second base plate. The first base plate and the second base plate form a coplanar plane. The two first sidewalls are located on the upper sides of the second base plate, and the two second sidewalls are located on the lower sides of the first base plate. The first magnetic circuit module is disposed on one side of the magnetically conductive carrier plate assembly; The second magnetic circuit module is disposed on the other side of the magnetically conductive carrier plate assembly; The first voice coil is located between the first magnetic circuit module and the two first sidewalls; The second voice coil is located between the second magnetic circuit module and the two second sidewalls; A first vibration component is disposed on one side of the magnetic carrier plate assembly. The first vibration component has a first accommodating space, and the first magnetic circuit module and the first voice coil are located within the first accommodating space. The second vibration component is disposed on the other side of the magnetic carrier plate assembly. The second vibration component has a second accommodating space. The second magnetic circuit module and the second voice coil are located in the second accommodating space. The second accommodating space is connected to the first accommodating space. The overall height of the two first sidewalls and the two second sidewalls is greater than or equal to the overall height of the first magnetic circuit module and / or the second magnetic circuit module.

21. A double-sided speaker device, characterized in that, It includes: A magnetically conductive carrier plate assembly includes a first magnetically conductive carrier plate and a second magnetically conductive carrier plate. The first magnetically conductive carrier plate has two first sidewalls and a first base plate, with the two first sidewalls disposed on both sides of the first base plate. The second magnetically conductive carrier plate has two second sidewalls and a second base plate, with the two second sidewalls disposed on both sides of the second base plate. There are multiple first base plates and multiple second base plates, with a second base plate spaced between adjacent first base plates. The two first sidewalls are disposed on both sides of the multiple first base plates, and a first base plate spaced between adjacent second base plates. The two second sidewalls are disposed on both sides of the multiple second base plates. The multiple first base plates and the multiple second base plates form a coplanar plane. The two first sidewalls are located on the upper sides of the multiple second base plates, and the two second sidewalls are located on the lower sides of the multiple first base plates. A first magnetic circuit module is provided. A magnetic circuit module is disposed on one side of the magnetic carrier plate assembly; a second magnetic circuit module is disposed on the other side of the magnetic carrier plate assembly; a first voice coil is located between the first magnetic circuit module and the two first sidewalls; a second voice coil is located between the second magnetic circuit module and the two second sidewalls; a first vibration component is disposed on one side of the magnetic carrier plate assembly, the first vibration component having a first accommodating space, the first magnetic circuit module and the first voice coil being located within the first accommodating space; and a second vibration component is disposed on the other side of the magnetic carrier plate assembly, the second vibration component having a second accommodating space, the second magnetic circuit module and the second voice coil being located within the second accommodating space, the second accommodating space being connected to the first accommodating space; wherein, the overall height of the two first sidewalls and the two second sidewalls is greater than or equal to the overall height of the first magnetic circuit module and / or the second magnetic circuit module.

22. The double-sided speaker device as described in claim 20 or 21, characterized in that, The first vibration assembly includes a first support and a first diaphragm. The first support is disposed on the two first sidewalls of the first magnetic carrier plate, and the first diaphragm is disposed on the side of the first support away from the two first sidewalls and connected to the first voice coil. The second vibration assembly includes a second support and a second diaphragm. The second support is disposed on the two second sidewalls of the second magnetic carrier plate, and the second diaphragm is disposed on the side of the second support away from the two second sidewalls and connected to the second voice coil.

23. The double-sided speaker device as described in claim 22, characterized in that, The first magnetic circuit module further includes a first magnetic body and a first magnetic conductive plate. The first magnetic body is disposed on one side surface of the first base plate and the second base plate, and the first magnetic conductive plate is disposed on the side of the first magnetic body away from the first base plate and the second base plate. The second magnetic circuit module further includes a second magnetic body and a second magnetic conductive plate. The second magnetic body is disposed on the other side surface of the first base plate and the second base plate, and the second magnetic conductive plate is disposed on the side of the second magnetic body away from the first base plate and the second base plate.

24. The double-sided speaker device as described in claim 23, characterized in that, The height of each of the first sidewalls and each of the second sidewalls is higher than the height of the first magnet and / or the height of the second magnet.

25. The double-sided speaker device as described in claim 24, characterized in that, The first bracket has a first docking structure, and the second bracket has a second docking structure. The first docking structure and the second docking structure are opposite to each other and are connected and fixed to each other.

26. The double-sided speaker device as described in claim 22, characterized in that, It further includes a first electrical connector and a second electrical connector. The first electrical connector is disposed on the first bracket and exposed on the outer surface of the first bracket. The first voice coil is electrically connected to the first electrical connector. The second electrical connector is disposed on the second bracket and exposed on the outer surface of the second bracket. The second voice coil is electrically connected to the second electrical connector.

27. The double-sided speaker device as described in claim 22, characterized in that, It further includes multiple elastic components, including two first elastic elements and two second elastic elements. One side of each of the two first elastic elements is connected to both sides of the first voice coil, and the other side of each of the two first elastic elements is connected to the first bracket. One side of each of the two second elastic elements is connected to both sides of the second voice coil, and the other side of each of the two second elastic elements is connected to the second bracket.

28. The double-sided speaker device as described in claim 20 or 21, characterized in that, The magnetic carrier plate assembly further includes a plurality of connecting holes located between the first base plate and the second base plate, connecting the first accommodating space and the second accommodating space, and the plurality of connecting holes are arranged along the setting direction of the first sidewall and the second sidewall.

29. The double-sided speaker device as described in claim 26, characterized in that, The position of the first electrical connector on the first bracket corresponds to the position of the second electrical connector on the second bracket.

30. The double-sided speaker device as described in claim 20 or 21, characterized in that, The first voice coil surrounds the first magnetic circuit module at intervals, and the second voice coil surrounds the second magnetic circuit module at intervals.

31. The double-sided speaker device as described in claim 20 or 21, characterized in that, The first accommodating space and the second accommodating space are interconnected through the front and rear ends of the magnetic carrier plate assembly.

32. The double-sided speaker device as described in claim 20 or 21, characterized in that, The first base plate has a first convex surface, and the second base plate has a second convex surface, the first convex surface and the second convex surface together form a boss.

33. The double-sided speaker device as described in claim 20 or 21, characterized in that, The first base plate has a first protrusion and / or a first recess, and the second base plate has a second recess and / or a second protrusion corresponding to the first protrusion and / or the first recess of the first base plate. The first protrusion of the first base plate is combined with the second recess of the second base plate, and / or the first recess of the first base plate is combined with the second protrusion of the second base plate.

34. The double-sided speaker device as described in claim 20 or 21, characterized in that, The magnetic carrier plate assembly includes multiple ventilation holes, which are formed by the first sidewall, the first bottom plate and the second sidewall, the second sidewall, the second bottom plate and the first sidewall, or / and the first sidewall, the first bottom plate, the second sidewall and the second bottom plate.

35. The double-sided speaker device as described in claim 34, characterized in that, The plurality of vent holes are located at the connection between the two first sidewalls and the first base plate, and the plurality of vent holes are located at the connection between the two second sidewalls and the second base plate.

36. The double-sided speaker device as described in claim 34, characterized in that, The first support of the first vibration component has a first notch and the second support of the second vibration component has a second notch. The first notch and the second notch correspond to each other. The first notch corresponds to the upper edge of the plurality of vent holes of the magnetic carrier plate assembly, and the second notch corresponds to the lower edge of the plurality of vent holes of the magnetic carrier plate assembly.

Images