A lubricating resin for semiconductor packaging molds and its application

Abstract

This invention relates to the field of electronic device packaging technology, specifically to a lubricating resin for semiconductor packaging molds and its application. The raw materials for its preparation include epoxy resin, a curing agent, an accelerator, and a release agent; the curing agent is phenolic resin; and the accelerator content is 0.5 to 5 parts per 100 parts of the total epoxy resin and curing agent. The lubricating resin for semiconductor packaging molds provided in this invention, after molding and high-temperature curing, exhibits excellent lubrication effects, effectively lubricating the mold surface and restoring the continuous operation of the mold. Furthermore, this resin has excellent fluidity at high temperatures, enabling it to fully fill some ultra-small injection nozzles, effectively avoiding problems such as difficulty in restoring continuous operation in unfilled areas due to poor local filling, thus improving operational efficiency.

Description

Technical Field

[0001] This invention relates to the field of electronic device packaging technology, and more specifically to a lubricating resin for semiconductor packaging molds and its application. Background Technology

[0002] Semiconductor packaging molds undergo continuous packaging. After cyclical use, some components of the packaging material remain on the mold surface. Continuing packaging will allow these residues to enter the packaged product, leading to poor appearance. To achieve a clean mold and ensure a qualified product appearance, mold cleaning materials with a rubber base are typically used. After cleaning, the mold surface is clean again. However, production cannot continue at this point because the cleaned mold lacks the capability for continuous injection molding. Directly using it for production will cause mold sticking, resulting in product scrap. The high-strength molding compound adheres to the mold, making it difficult to clean, wasting time and reducing efficiency. While existing technologies use rubber-based lubricating materials to treat molds, and through repeated molding, high-temperature curing, and other processes, the continuous operation of the mold can be restored. However, due to the limited fluidity of rubber lubricating materials at high temperatures and the surface tension of the melt, they cannot fully fill ultra-small products such as fully encapsulated injection gate devices, often causing localized poor filling. This makes it difficult to restore continuous operation in unfilled areas, affecting product yield.

[0003] Although Chinese patent CN201210346966.1 proposes solutions to the encapsulation problems of small surface mount devices, it mainly applies to the encapsulation protection of small surface mount devices, addressing issues such as the cyclic reliability at high temperatures and the service life under high voltage operating environments. Furthermore, the epoxy resin composition disclosed in that patent contains a large amount of coupling agents, flame retardants, ion traps, and metal passivators, which severely affect the resin's melt flowability and the surface tension of the melt. This fails to ensure sufficient spreading and filling within the mold of small surface mount devices, while also providing good release ability to avoid problems such as sticking due to insufficient release. Summary of the Invention

[0004] To address the aforementioned technical problems, a first aspect of the present invention provides a lubricating resin for semiconductor packaging molds, the raw materials of which include epoxy resin, curing agent, accelerator and release agent; the curing agent is phenolic resin; and the accelerator content is 0.5 to 5 parts per 100 parts of total epoxy resin and curing agent.

[0005] As a preferred embodiment of the present invention, the molar ratio of epoxy groups in the epoxy resin structure to phenolic hydroxyl groups in the phenolic resin is (0.8-1.2):1.

[0006] As a preferred embodiment of the present invention, the accelerator is selected from one or more of alkylphosphine derivatives, diamine derivatives, and imidazole compounds.

[0007] As a preferred embodiment of the present invention, the diamine derivative is selected from one or more of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentethylenehexamine, piperazine, N-aminoethylpiperazine, N-hydroxyethylpiperazine, m-phenylenediamine, o-phenylenediamine, diaminodiphenylmethane, isoflurone diamine, 1,3-bis(aminomethyl)cyclohexane, 4,4-diaminodicyclohexylmethane, ethylenediamine bismaleimide, hexamethylenediamine bismaleimide, m-phenylenediamine bismaleimide, p-aminophenol maleimide, diaminodiphenyl sulfone, and diazonaphthone; the alkylphosphine derivative is selected from one or more of triphenylphosphine, methyltrioctylphosphonium dimethyl phosphate, tetrabutylphosphonium acetate, and methyltributylphosphonium dimethyl phosphate. The imidazole compound is selected from one or more of the following: benzyltriphenylphosphonium chloride, tetrabutylphosphonium chloride, methyltriphenylphosphonium dimethyl phosphate, triphenylethylphosphonium iodide, benzyltriphenylphosphonium bromide, tetrabutylphosphonium bromide, triphenylphosphine triphenylboronic acid ester, triphenylphosphine triphenylboronic complex, and tetraphenylphosphine tetraphenylboronic acid; the imidazole compound is selected from one or more of the following: 2-methylimidazolium, 2-ethyl-4-methylimidazolium, 2-undecylimidazolium, 2-phenylimidazolium, 1-benzyl-2-methylimidazolium, 1-cyanoethyl-2-ethyl-4-methylimidazolium, 2-phenyl-4,5-dihydroxymethylimidazolium, 2-phenyl-4-methyl-5-hydroxymethylimidazolium, and 1-cyanoethyl-2-phenyl-4,5-di(cyanethoxymethylene)imidazolium.

[0008] As a preferred embodiment of the present invention, the phenolic resin is selected from one or more of linear phenol-formaldehyde resin, linear o-cresol-formaldehyde resin, biphenyl-type phenolic resin, p-tert-octylphenol-formaldehyde resin, p-tert-butylphenol-formaldehyde resin, epoxy-modified alkylphenol-formaldehyde resin, cashew nut shell oil-modified alkylphenol-formaldehyde resin, p-octylphenol-formaldehyde resin, brominated hydroxymethyl p-octylphenol-formaldehyde resin, and hydroxymethyl p-tert-butylphenol-formaldehyde resin.

[0009] As a preferred embodiment of the present invention, the release agent is selected from one or more of oxidized polyethylene wax, erucamide, oleamide, stearic acid wax, palm wax, paraffin wax, and lignite wax; the content of the release agent is 4 to 15 parts based on 100 parts of the total amount of epoxy resin and curing agent.

[0010] As a preferred embodiment of the present invention, the epoxy resin is selected from one or more of o-cresol epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, alicyclic epoxy resin, triglycidyl isocyanate, and biphenyl type epoxy resin.

[0011] As a preferred embodiment of the present invention, the raw materials for preparing the molding resin further include inorganic fillers; the fillers are selected from at least one of titanium dioxide, sericite, aluminum oxide, zinc oxide, silicon dioxide, clay, boron nitride, calcium carbonate, montmorillonite, graphite, and graphene oxide; the content of the fillers is 150 to 900 parts based on 100 parts of the total amount of epoxy resin and curing agent.

[0012] As a preferred embodiment of the present invention, the silica is selected from one or more of molten spherical silica, molten broken angular silica, and crystalline angular silica; the maximum particle size of the silica is not higher than 75 μm.

[0013] As a preferred technical solution of the present invention, after the mold is cleaned, the mold is moistened once with the mold-lubricating resin and then tested by injection molding with molding compound. The injection molding steps are repeated. After 5 consecutive tests, the force of the molding compound being pushed off horizontally by the thrust gauge in the 5th test is no more than 2Kg.

[0014] As a preferred embodiment of the present invention, the molding resin, after being cured for 300 seconds, has a hot bending strength of not less than 60 MPa at 175°C.

[0015] A second aspect of the invention provides the application of the lubricating resin for semiconductor packaging molds as described above, in the field of packaging small surface mount devices.

[0016] Beneficial effects: The lubricating resin for semiconductor packaging molds provided in this invention can be cured by molding and high temperature, restoring the continuous operation of the mold. Furthermore, this resin exhibits excellent fluidity at high temperatures, enabling it to fully fill some ultra-small injection molded parts, effectively avoiding problems such as difficulty in restoring continuous operation in unfilled areas due to poor local filling. At the same time, the lubricating resin provided in this invention has excellent lubrication effect, effectively solving problems such as mold sticking and low continuous molding efficiency, thus improving operational efficiency. Detailed Implementation

[0017] The technical features of the present invention will be further clearly and completely described below with reference to specific embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] The terms "preferred," "more preferably," and "more suitable" used in this invention refer to embodiments of the invention that provide certain beneficial effects under certain circumstances. However, other embodiments may also be preferred under the same or other circumstances. Furthermore, the description of one or more preferred embodiments does not imply that other embodiments are unavailable, nor is it intended to exclude other embodiments from the scope of this invention.

[0019] It should be understood that, except in any operational instance or otherwise indicated, all figures representing the amount of an ingredient as used, for example, in the specification and claims, should be understood to be modified in all cases by the term “about”.

[0020] A first aspect of the present invention provides a lubricating resin for semiconductor packaging molds, the raw materials for which include epoxy resin, curing agent, accelerator and release agent; the curing agent is phenolic resin; the accelerator content is 0.5-3 wt%.

[0021] The main component of the molding resin in this invention is epoxy resin. The specific type of epoxy resin is not specifically limited in this invention, and various epoxy resins known to those skilled in the art can be selected.

[0022] In some embodiments, the epoxy resin is selected from one or more of o-cresol epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, alicyclic epoxy resin, triglycidyl isocyanate, and biphenyl type epoxy resin.

[0023] As o-cresyl formaldehyde epoxy resins, including but not limited to SQCN700-3, SQCN704 (Shengquan Chemical), YDCN-500-1P, YDCN-500-2P, YDCN-500-4P, YDCN-500-5P, YDCN-500-7P, YDCN-500-8P, YDCN-500-10P, YDCN-500-80P, YDCN-500-80PCA60 (Kukdo Chemical Co., Ltd.); EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025 and EOCN-1027 (Nippon Kayaku Co., Ltd.); YDCN-701, YDCN-702, YDCN-703 and YDCN-704 (Tohto Kasei Co., Ltd.); EPICLON The following are o-cresol epoxy resins: N-665-EXP (Dainippon Ink & Chemicals); PGCN-700-2, PGCN-700-3, PGCN-701, PGCN-702, PGCN-703, PGCN-704L, PGCN-704ML, PGCN-704, PGCN-700-2S, PGCN-700-3S, PGCN-701S, PGCN-702S, PGCN-703S, PGCN-704S (Dalian Qihua Chemical Co., Ltd.); JF-43, JF-45, JF-46 (Lanxing Chemical New Materials Co., Ltd.); CNE-195XL (Changchun Chemical); KI-3000, KI-5000 (Nippon Steel Chemicals), etc.

[0024] Bisphenol A type epoxy resins include, but are not limited to, bisphenol A type epoxy resins with grades such as NPES-301, NPES-302, NPES-303, and NPES-304.

[0025] Bisphenol F type epoxy resins include, but are not limited to, bisphenol F epoxy resins with grades YDF-161, YDF-161H, YDF-162, YDF-165, YDF-170, YDF-175, YDF-175S, YDF-2001, YDF-2004, DER354, NPON862, NPON863, EPICLON830, EPICLON830S, EPICLON830LVP, EPICLON835 or EPICLON835LV.

[0026] As alicyclic epoxy resins, they include, but are not limited to, Dow ERL-4211; Huntsman CY179 and CY184; Daicel Celloxide 2021p and Celloxide EHPE-3150; and domestic manufacturers' UVR6105, UVR6103, and UVR6110, etc.

[0027] As triglycidyl isocyanurate, including but not limited to TGIC-A and TGIC-D.

[0028] Biphenyl-type epoxy resins include, but are not limited to, the biphenyl-type epoxy resins shown in YX-4000H, YX-4000K, YX4000H / K, YL6121H, YL6677, YX7399, and YL6640 (Mitsubishi Chemical, Japan).

[0029] In addition, it can also be hydrogenated bisphenol A type epoxy resin with the following grades: ST-1000, ST-3000, ST-4000D, ST-40100D, ST-5080, ST-5100 or EPONEX1510; or phenol-formaldehyde epoxy resin with the grades F-44, F-52 or F-48; or cresol-formaldehyde epoxy resin with the grades FJ-47 or FJ-43; or bis(2,3-epoxycyclopentyl) ether, 3,4-epoxy-6-methylcyclohexylcarboxylic acid-3',4'-epoxy-6'-methylcyclohexylmethyl ester, vinylcyclohexene dieoxy compound, 3,4-epoxycyclohexylcarboxylic acid-3',4'-epoxycyclohexylmethyl ester, diisoprene dieoxy compound, adipic acid dieoxy compound, etc. (3,4-epoxy-6-methylcyclohexyl methyl ester), dicyclopentadiene diepoxide, tetrahydrophthalic acid diglycidyl ester, cyclohexane-1,2-dicarboxylic acid diglycidyl ester, 4,5-epoxytetrahydrophthalic acid diglycidyl ester, bis((3,4-epoxycyclohexyl)methyl)adipate, 1,2-epoxy-4-vinylcyclohexane, 3,4-epoxycyclohexylmethyl methacrylate, 1,4-cyclohexanedimethyl bis(3,4-epoxycyclohexanecarboxylic acid) ester and 3-epoxyethylene 7-oxabicyclo[4.1.0]heptane; bromobisphenol A type epoxy resins, such as products of model SR-BBS and SR-TBA-400 produced by Sakamoto Yakuhin Kogyo Co., Ltd., Asahi DenkaKogyoCo., Ltd. produces products with model numbers EP-62 and -66; Asahi Chemical Industry Co., Ltd. produces products with registered trademarks "AER" -755 and 0765; TohtoKaseiCo., Ltd. produces products with registered trademarks "EpoTohto" YBO-600 and -715, etc.

[0030] In some preferred embodiments, the phenolic resin is an epoxy-modified alkylphenolic resin and / or a cashew nut shell oil-modified alkylphenolic resin.

[0031] As epoxy-modified alkylphenol resins, including but not limited to epoxy-modified phenol resins PF-231, TKM-O, SP1077, T6000, T3100, etc.

[0032] Cashew oil modified alkylphenol resins include, but are not limited to, the cashew oil modified alkylphenol resins shown in grades such as SP6600 (SP6700+HMT), SP6700, SL2201, SL2202, Durez12686, PFM-C, HRJ11995, PF221, PF222, and PF223.

[0033] The curing agent described in this invention is a phenolic resin. The type of phenolic resin is not specifically limited, and includes, but is not limited to, common linear phenolic resins with grades HF-1, HF-4, HF-1M, PF-8606, PF-8010, GS-180, GS-200, P-180, and P-200; or o-cresol formaldehyde resins with grades SH-3080 and SH-3110; and grades MEH-7851S, MEH-7851-3H, and MEH-785... Biphenyl phenolic resins as shown in 2M or MEH-7853-SS; or DCPDN phenolic resins such as SH-7090; or XYLOK phenolic resins such as SH-4064, SH-4100, or MEH-7800-3L; or p-tert-octylphenol formaldehyde resins as shown in TXN-203; or p-tert-butylphenol formaldehyde resins as shown in 2402; or epoxy-modified alkyl phenolic resins as shown in TKM-O, SP1077, T6000, or T3100. Phenolic resin; or cashew oil-modified alkylphenolic resin with the following grades: SP6600 (SP6700+HMT), SP6700, SL2201, SL2202, urez12686, PFM-C, HRJ11995, PF221, PF222, PF223; or cashew oil-modified alkylphenolic resin with the following grades: SP6601 (SP6701+HMT), SP6701, SL2101, SL2102, Durez13355, PFM-T, HRJ12 The tall oil-modified alkylphenol resin shown in 532; or the hydroxymethyl p-octylphenol formaldehyde resin shown in grades 202, R17152, SP-1044 or SP-10458; or the brominated hydroxymethyl p-octylphenol formaldehyde resin shown in grades 201, SP-1055, SP-1056, Tackind250 or P-124; or the hydroxymethyl p-tert-butylphenol formaldehyde resin shown in grade 101; or at least one of the epoxy-modified phenolic resins shown in grade PF-231.

[0034] In some embodiments, the molar ratio of epoxy groups in the epoxy resin structure to phenolic hydroxyl groups in the phenolic resin is (0.8-1.2):1.

[0035] In some embodiments, the promoter is selected from one or more of alkylphosphine derivatives, diamine derivatives, and imidazole compounds.

[0036] In some embodiments, the diamine derivative is selected from one or more of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, piperazine, N-aminoethylpiperazine, N-hydroxyethylpiperazine, m-phenylenediamine, o-phenylenediamine, diaminodiphenylmethane, isoflurone diamine, 1,3-bis(aminomethyl)cyclohexane, 4,4-diaminodicyclohexylmethane, ethylenediamine bismaleimide, hexamethylenediamine bismaleimide, m-phenylenediamine bismaleimide, p-aminophenol maleimide, diaminodiphenyl sulfone, and diazanaphthone.

[0037] Furthermore, the accelerators described in this invention may also be selected from phthalic anhydride, trimellitic anhydride, pyromellitic dianhydride, hydrogenated pyromellitic dianhydride, maleic anhydride, tung oil anhydride, dodecenylsuccinic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, nadic anhydride, methylnadic anhydride, glutaric anhydride, hydrogenated methylnadic anhydride, methylcyclohexenetetracarboxylic anhydride, polyazelite anhydride, polydecanite anhydride, 1,4,5,6-tetrabromophthalic anhydride, 1,8-diaza-bicyclo[5,4,0]-7-undecene, diaza-bicyclo-nonene, benzoyl peroxide, di-tert-butyl peroxide, tert-butyl peroxide Benzoate esters, 2-phenylimidazoline, 2-methylimidazolium, 2-ethyl-4-methylimidazolium, 2-undecylimidazolium, 2-heptadecanylimidazolium, 2-phenylimidazolium, 1-benzyl-2-methylimidazolium, 1-cyanoethyl-2-ethyl-4-methylimidazolium, 1-cyanoethyl-2-undecylimidazolium, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2-methylimidazolium triisocyanate, 2,4-diamino-6-(2-methylimidazol-1-ethyl)-S-triazine, 2,4-diamino-6-(2-ethyl-4-methylimidazol-1-ethyl)-S-triazine, 2,4-diamino-6-( 2-Undecylimidazol-1-ethyl)-S-triazine, 2-phenyl-4,5-dihydroxymethylimidazol, 2-phenyl-4-methyl-5-hydroxymethylimidazol, 1-cyanoethyl-2-phenyl-4,5-di(cyanoethoxymethylene)imidazol, 1-dodecyl-2-methyl-3-benzylimidazol chloride, 1,3-dibenzyl-2-methylimidazol chloride, polyamide resins with a relative molecular mass of 200-1000, aniline-formaldehyde resins with a molecular weight of 200-600, dicyandiamide, toluene-bisguanidine, 2,5-dimethylphenylbisguanidine, diphenylbisguanidine, phenylbisguanidine, benzylbisguanidine, dimethylbisguanidine, boron trifluoride-methylaniline complex, boron trifluoride-monoethylamine complex The following are included in the list of: boron trifluoride-benzylamine complex, boron trifluoride-2,4-dimethylaniline, boron trifluoride-triphenylphosphine complex, diaminomaleonitrile, 2,4,6-tris(dimethylaminomethyl)phenol, tri(2-ethylhexanoic acid) salt of 2,4,6-tris(dimethylaminomethyl)phenol, triphenylphosphine, methyltrioctylphosphonium dimethyl phosphate, tetrabutylphosphonium acetate, methyltributylphosphonium dimethyl phosphate, benzyltriphenylphosphonium chloride, tetrabutylphosphonium chloride, methyltriphenylphosphonium dimethyl phosphate, triphenylethylphosphonium iodide, benzyltriphenylphosphonium bromide, tetrabutylphosphonium bromide, triphenylphosphine triphenylboronic acid ester, triphenylphosphine triphenylboronic complex, and tetraphenylphosphine tetraphenylboronic acid.

[0038] In some embodiments, the release agent is selected from one or more of organosiloxanes, waxes, metallic soap surfactants, and amide surfactants; preferably, the amide surfactant is selected from one or more of erucamide, isobutyramide palmitate, oleamide, stearyl erucamide, ethylene bisoleamide, and N,N'-[ethylenedi(iminoethyleneethylene)]distearate. The waxes include, but are not limited to, polyethylene wax, oxidized polyethylene wax, polypropylene wax, polytetrafluoroethylene, polytetrafluoroethylene-modified polyethylene wax, stearic acid wax, palm wax, paraffin wax, and lignite wax.

[0039] In some embodiments, the raw materials for preparing the molding resin also include inorganic fillers. The specific composition of the inorganic fillers is not specifically limited in this invention; fillers well-known to those skilled in the art can be selected, including but not limited to fused silica, crystalline silica, silicon carbide, silicon nitride, boron nitride, calcium carbonate, magnesium carbonate, barium sulfate, calcium sulfate, mica, talc, bentonite, alumina, magnesium oxide, germanium oxide, aluminum hydroxide, magnesium hydroxide, calcium silicate, aluminum silicate, lithium aluminum silicate, germanium silicate, barium titanate, glass fiber, carbon fiber, molybdenum disulfide, asbestos, montmorillonite, graphite, titanium dioxide, sericite, aluminum oxide, zinc oxide, silicon dioxide, clay, zirconium oxide, etc. The above components can be used alone or in combination.

[0040] In some embodiments, the silica is selected from one or more of molten spherical silica, molten broken corner silica, and crystalline corner silica; the maximum particle size of the silica is not higher than 75 μm; preferably not higher than 60 μm; and not higher than 50 μm.

[0041] In some embodiments, based on a total content of 100 parts of epoxy resin and curing agent, the content of the accelerator is 0.5 to 5.0 parts; preferably 0.5 to 3 parts.

[0042] In some embodiments, the total content of epoxy resin and curing agent is 100 parts, and the content of release agent is 4 to 15 parts.

[0043] In some embodiments, the total content of epoxy resin and curing agent is 100 parts, and the filler content is 150 to 900 parts.

[0044] The lubricating resin for semiconductor packaging molds described in this invention can be prepared according to conventional methods known to those skilled in the art, and no special limitations are made on its specific operation and method.

[0045] A second aspect of the invention provides the application of the lubricating resin for semiconductor packaging molds as described above, which is used in the packaging of small surface-mount devices.

[0046] The small surface-mount devices mentioned in this invention refer to devices such as SOD523, SOD923, SOT23, SOT89, SOT143, SOT-553, SOT563, SOD123, SMA, SMB, and SNC, which are well known to those skilled in the art.

[0047] The present invention will now be described in detail through embodiments. It should be noted that the following embodiments are only for further illustration of the present invention and should not be construed as limiting the scope of protection of the present invention. Non-essential improvements and adjustments made by those skilled in the art based on the above description of the present invention still fall within the scope of protection of the present invention.

[0048] Example

[0049] Example 1 This embodiment provides a lubricating resin for semiconductor packaging molds. The raw materials for its preparation, by weight, include 100 parts epoxy resin and curing agent, 2 parts accelerator, 6 parts release agent, and 220 parts inorganic filler. The molar ratio of epoxy equivalent to phenol equivalent in the epoxy resin and curing agent is 1:1.

[0050] The epoxy resin is YDCN-500-7P; the curing agent is HRJ11995 cashew oil modified alkylphenol resin; the accelerator is a mixture of equal weights of isoflurane diamine and 2-heptadecyl imidazole; the release agent is a mixture of equal weights of stearic acid wax and erucamide; and the inorganic filler is molten spherical silica with a maximum particle size of less than 75 μm.

[0051] Example 2 This embodiment provides a lubricating resin for semiconductor packaging molds. The raw materials for its preparation, by weight, include 100 parts epoxy resin and curing agent, 2 parts accelerator, 6 parts release agent, and 50 parts inorganic filler. The molar ratio of epoxy equivalent to phenol equivalent in the epoxy resin and curing agent is 1:1.

[0052] The epoxy resin is YDCN-500-7P; the curing agent is HRJ11995 cashew oil modified alkylphenol resin; the accelerator is a mixture of equal weights of isoflurane diamine and 2-heptadecyl imidazole; the release agent is a mixture of equal weights of stearic acid wax and erucamide; and the inorganic filler is molten spherical silica with a maximum particle size of less than 75 μm.

[0053] Example 3 This embodiment provides a lubricating resin for semiconductor packaging molds. The raw materials for its preparation, by weight, include 100 parts epoxy resin and curing agent, 6 parts release agent, 220 parts inorganic filler, and 0.2 parts accelerator. The molar ratio of epoxy equivalent to phenol equivalent in the epoxy resin and curing agent is 1:1.

[0054] The epoxy resin is YDCN-500-7P; the curing agent is HRJ11995 cashew oil modified alkylphenol resin; the release agent is a mixture of stearic acid wax and erucamide in equal weight; the inorganic filler is molten spherical silica with a maximum particle size of less than 75 μm; and the accelerator is 2-heptadecylimidazole.

[0055] Example 4 This embodiment provides a lubricating resin for semiconductor packaging molds. The raw materials for its preparation, by weight, include 100 parts epoxy resin and curing agent, 2 parts accelerator, 6 parts release agent, and 220 parts inorganic filler. The molar ratio of epoxy equivalent to phenol equivalent in the epoxy resin and curing agent is 1:1.

[0056] The epoxy resin is YDCN-500-7P; the curing agent is HRJ11995 cashew oil modified alkylphenol resin; the accelerator is a mixture of equal weights of isoflurane diamine and 2-heptadecyl imidazole; the release agent is a mixture of equal weights of stearic acid wax and erucamide; and the inorganic filler is fumed silica with a maximum particle size of 150 μm.

[0057] Example 5 This embodiment provides a molding compound for semiconductor packaging molds. The raw materials for its preparation, by weight, include 100 parts epoxy resin and curing agent, 2 parts accelerator, 220 parts inorganic filler, and 2 parts release agent. The molar ratio of epoxy equivalent to phenol equivalent in the epoxy resin and curing agent is 1:1.

[0058] The epoxy resin is YDCN-500-7P; the curing agent is HRJ11995 cashew oil modified alkylphenol resin; the accelerator is a mixture of equal weights of isoflurane diamine and 2-heptadecyl imidazole; the inorganic filler is molten spherical silica with a maximum particle size of less than 75 μm; and the release agent is a mixture of equal weights of stearic acid wax and erucamide.

[0059] Example 6 This embodiment provides a lubricating resin for semiconductor packaging molds. The raw materials for its preparation, by weight, include 100 parts epoxy resin and curing agent, 2 parts accelerator, 6 parts release agent, and 220 parts inorganic filler. The molar ratio of epoxy equivalent to phenol equivalent in the epoxy resin and curing agent is 1:1.

[0060] The epoxy resin is YDCN-500-7P; the curing agent is HRJ11995 cashew oil modified alkylphenol resin; the accelerator is isoflurane diamine; the release agent is a mixture of stearic acid wax and erucamide in equal weight; and the inorganic filler is molten spherical silica with a maximum particle size of less than 75 μm.

[0061] Example 7 This embodiment provides a lubricating resin for semiconductor packaging molds. The raw materials for its preparation, by weight, include 100 parts epoxy resin and curing agent, 2 parts accelerator, 6 parts release agent, and 220 parts inorganic filler. The molar ratio of epoxy equivalent to phenol equivalent in the epoxy resin and curing agent is 1:1.

[0062] The epoxy resin is YDCN-500-7P; the curing agent is HRJ11995 cashew oil modified alkylphenol resin; the accelerator is a mixture of equal weights of isoflurane diamine and 2-heptadecyl imidazole; the release agent is erucamide; and the inorganic filler is molten spherical silica with a maximum particle size of less than 75 μm.

[0063] Performance testing

[0064] The applicant conducted corresponding experimental tests on the lubrication effect, curing performance, and hot flexural strength of the lubricating resin in the above embodiments, as detailed below:

[0065] 1. Lubrication Effect: For continuously used molds, after cleaning with traditional rubber cleaning materials, the mold is lubricated once with the lubricating resin of this application, and then injection molded with conventional epoxy encapsulant. The epoxy encapsulant is horizontally pushed off using a thrust gauge, and the thrust force is read. The injection area is a circle with a diameter of 25mm. Five groups were tested continuously using this method. The thrust force of the fifth group was not greater than 2Kg, which was considered excellent for the lubrication effect of the lubricating resin; the thrust force of the fourth group was not greater than 2Kg, but the thrust force of the fifth group was greater than 2Kg, which was considered good; the thrust force of the third group was not greater than 2Kg, but the thrust force of the fourth group was greater than 2Kg, which was considered poor. The results are shown in Table 1.

[0066] 2. Curing Ability: The curing ability of the lubricating resin in the above embodiments was tested according to the test method for mold opening heat hardness. A mold opening heat hardness of 75-80 after 120 seconds of curing indicates excellent curing performance; a mold opening heat hardness of 70-75 after 120 seconds of curing indicates good curing performance; and a mold opening heat hardness below 70 after 120 seconds of curing indicates poor curing performance. The results are shown in Table 1.

[0067] 3. Hot Bending Strength: Standard-sized test strips were prepared according to GB / T 9341-2008. The hot bending strength of the test strip at 175℃ was tested using the three-point bending method specified in this standard. The test procedure was as follows: the test material was injection molded at 175℃ using a specific mold (the dimensions specified in GB / T 9341-2008). The total injection and curing time was 300 seconds. After curing, the strip was immediately removed, and the hot bending strength at 175℃ was tested. A hot bending strength higher than 60 MPa was considered excellent; a bending strength between 40 and 60 MPa was considered good; and a bending strength lower than 40 MPa was considered poor. The results are shown in Table 1.

[0068] Table 1

[0069]

[0070]

[0071] Comparative Example 1 in the table above is GE-100LFC resin. According to the SDS composition information, GE-100LFC consists of: 2-20 wt% solid epoxy resin, 2-20 wt% phenolic resin, 60-95 wt% fused silica, less than 5 wt% crystalline silica, less than 1 wt% carbon black, and less than 30 wt% metal hydroxide. Comparative Example 2 is EME-G770 resin. According to the SDS composition information, EME-G770 consists of: 1-5 wt% epoxy resin A and 1-5 wt% epoxy resin B. The content of phenolic resin A is 1-5 wt%, the content of phenolic resin B is 1-5 wt%, the content of metal hydroxide is 0.5-2.5 wt%, the content of carbon black is 0.1-0.5 wt%, and the content of fused silica is 75-95 wt%. Comparative Example 3 is MP8000AN resin. According to the composition information of MP8000AN, the composition of MP8000AN is: solid epoxy resin 2-20 wt%, phenolic resin 2-20 wt%, fused silica 60-95 wt%, crystalline silica less than 5 wt%, carbon black less than 1 wt%, and antimony trioxide 2 wt%.

[0072] Although GE-100LFC, EME-G770, and MP8000AN all contain epoxy resin and phenolic resin, their release effect is significantly worse than that of Examples 1, 6, and 7 when used for lubrication, and they do not possess the characteristics of lubrication resin.

[0073] The experimental results above show that the lubricating resin provided in this invention has excellent lubrication effect on semiconductor packaging molds, and the curing time is significantly shortened compared to the curing time of traditional lubricating rubber materials (300s), thus improving efficiency. Meanwhile, the lubricating resin in this application possesses excellent hot bending strength. Due to its high cured hot bending strength, when filling small gaps, the lubricating material of this patent is less prone to breakage due to its low strength, preventing corner chipping or sticking. In contrast, while the lubricating resin in Example 4 achieves excellent lubrication ability, curing ability, and hot bending strength, the filler particles used are relatively large, reducing its ability to fill small gaps and failing to achieve complete filling of small gaps in actual molding.

[0074] Furthermore, the applicant conducted a slit-filling experiment on the lubricating resin in the above embodiments. This involved molding the lubricating resin particles using a transfer injection molding method. During the molding process, to achieve good venting, the molds were equipped with dedicated venting holes, typically 10–40 μm deep. The experiment revealed that the lubricating resin particles in Example 1 have good filling capabilities without causing blockage of slits like the venting holes, thus preventing venting hole failure. The applicant speculates that its technical effectiveness is mainly due to: 1) High thermal strength during curing within the mold cavity: The thermal strength reaches over 60 MPa, resulting in high strength of the resin overflowing from the venting holes. 2) Good release effect: The lubricating resin particles themselves act as a lubricant for the mold, enabling smooth demolding during continuous molding of ordinary molding compounds. Their own demolding effect is even better, therefore, the overflow from the venting holes is very easy to demold without causing blockage. 3) Good performance in filling slit overflow: Tests were conducted on the filling effect of 5μm, 10μm, 20μm, and 50μm slits. The results showed that in Example 1, the overflow length of the lubricating resin particles did not exceed 5mm in 5-20μm slits; and in 50μm slits, the overflow length did not exceed 10mm. The overflow lengths of the samples in Examples 2 and 3 exceeded those of Example 1. Specifically, the overflow length test results for different slit sizes are shown in Table 2 below.

[0075] Table 2

[0076]

[0077] Actual test results show that for micro-gaps with slit thicknesses ranging from 5µm to 50µm, the maximum overflow length of the lubricating resin did not exceed 10mm. Therefore, it did not cause large-scale overflow, making it difficult to clean and clogging the vent holes. Furthermore, because the release agent is uniformly mixed in the lubricating resin, the continuous and stable filling speed after transfer molding ensures that the mold surface treated with the lubricating resin not only provides continuous molding but also results in a uniform gloss, leading to consistent surface finishes on the injection-molded products, free from localized marks and stains.

[0078] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention in any other way. Any person skilled in the art may make changes or equivalent variations based on the above-disclosed technical content. Any simple modifications, equivalent variations, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the protection scope of the present invention.

Claims

1. A mold release resin for a semiconductor package mold, characterized by, The preparation raw materials include epoxy resin, curing agent, accelerator, release agent and inorganic filler; the curing agent is phenolic resin; the content of the accelerator is 0.5-5 parts, the content of the filler is 150-900 parts, and the content of the release agent is 4-15 parts, based on 100 parts of the total amount of the epoxy resin and the curing agent; The accelerator is selected from one or more of alkyl phosphine derivatives, diamine derivatives and imidazole compounds; The release agent is selected from one or more of oxidized polyethylene wax, erucic acid amide, oleic acid amide, stearic acid wax, palm wax, paraffin wax and lignite wax; The filler is selected from at least one of titanium dioxide, sericite, aluminum oxide, zinc oxide, silicon dioxide, clay, boron nitride, calcium carbonate, montmorillonite, graphite and graphene oxide; The silicon dioxide is selected from one or more of fused spherical silicon dioxide, fused broken angular silicon dioxide and crystalline angular silicon dioxide; the maximum particle size of the silicon dioxide is not higher than 75 μm.

2. The mold releasing resin for a semiconductor package mold according to claim 1, wherein The molar ratio of the epoxy groups in the structure of the epoxy resin to the phenolic hydroxyl groups in the phenolic resin is (0.8-1.2):

1.

3. The mold releasing resin for a semiconductor package mold according to claim 1, wherein The diamine derivative is selected from one or more of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, piperazine, N-aminoethylpiperazine, N-hydroxyethylpiperazine, m-phenylenediamine, o-phenylenediamine, diaminodiphenylmethane, isophorone diamine, 1,3-bis(aminomethyl)cyclohexane, 4,4-diaminodicyclohexylmethane, ethylenediamine bismaleimide, hexamethylenediamine bismaleimide, m-phenylenediamine bismaleimide, p-aminophenol maleimide, diaminodiphenyl sulfone and naphthyridone; the alkyl phosphine derivative is selected from one or more of triphenylphosphine, methyltrioctylphosphonium dimethyl phosphate, tetrabutylphosphonium acetate, methyltributylphosphonium dimethyl phosphate, benzyltriphenylphosphonium chloride, tetrabutylphosphonium chloride, methyltriphenylphosphonium dimethyl phosphate, triphenyl ethyl phosphonium iodide, benzyltriphenylphosphonium bromide, tetrabutylphosphonium bromide, triphenylphosphine triphenyl borate, triphenylphosphine triphenyl boron complex and tetraphenylphosphonium tetraphenyl boron; and the imidazole compound is selected from one or more of 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole and 1-cyanoethyl-2-phenyl-4,5-di(cyanoethoxymethyl)imidazole.

4. The mold releasing resin for a semiconductor package mold according to claim 1, wherein The phenolic resin is selected from one or more of linear phenol formaldehyde resin, linear o-cresol formaldehyde resin, biphenyl type phenolic resin, p-tert-octyl phenol formaldehyde resin, p-tert-butyl phenol formaldehyde resin, epoxy modified alkyl phenolic resin, cashew nut shell oil modified alkyl phenolic resin, p-octyl phenol formaldehyde resin, brominated hydroxymethyl p-octyl phenol formaldehyde resin and hydroxymethyl p-tert-butyl phenol formaldehyde resin.

5. The mold release resin for a semiconductor package mold according to any one of claims 1 to 4, characterized by, The epoxy resin is selected from one or more of o-cresol novolac epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, alicyclic epoxy resin, isocyanuric acid triglycidyl ester, and biphenyl type epoxy resin.

6. The mold releasing resin for a semiconductor package mold according to claim 1, wherein In use, after mold cleaning, the mold is lubricated once with the mold lubricating resin, and then tested by injection molding with plastic sealing material; the injection molding step is repeated, and after 5 times of continuous testing, the force with which the plastic sealing material is pushed horizontally by the thrust meter is not more than 2 Kg.

7. The mold releasing resin for a semiconductor package mold according to claim 1, wherein The mold lubricating resin has a hot bending strength at 175 DEG C of not less than 60 MPa after 300 s of curing.

8. Use of the mold release resin for a semiconductor package mold according to any one of claims 1 to 7, characterized by, Applied to the packaging field of small surface mount devices.

Images