Laser processing head and laser processing device

Abstract

A laser processing head has: a frame having a first wall portion and a second wall portion opposing each other in a first direction, a third wall portion and a fourth wall portion opposing each other in a second direction perpendicular to the first direction, and a fifth wall portion and a sixth wall portion opposing each other in a third direction perpendicular to the first and second directions; an incidence portion configured to the first wall portion or the fifth wall portion to cause laser light to be incident into the frame; a laser light adjustment portion configured to the frame to adjust the laser light incident from the incidence portion; and a condensing portion configured to the sixth wall portion to condense and emit the laser light adjusted by the laser light adjustment portion outside the frame, the laser light adjustment portion having an optical axis adjustment portion for adjusting an optical axis of the laser light incident from the incidence portion, the incidence portion being biased to the first wall portion side in the first direction, and the condensing portion being biased to the second wall portion side in the first direction.

Description

TECHNICAL FIELD

[0001] The present application relates to a laser processing head and a laser processing apparatus. BACKGROUND

[0002] In Patent Literature 1, a laser processing apparatus is described, which includes a holding mechanism that holds a workpiece, and a laser irradiation mechanism that irradiates laser light to the workpiece held by the holding mechanism. In the laser processing apparatus described in Patent Literature 1, the laser irradiation mechanism having a condenser lens is fixed with respect to a base, and the movement of the workpiece in a direction perpendicular to the optical axis of the condenser lens is performed by the holding mechanism.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent No. 5456510 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] In the laser processing apparatus described in Patent Literature 1, since each structure on the optical path of the laser light from the laser oscillator to the condenser lens is disposed in the frame, it is not easy to move the condenser lens in a direction perpendicular to the optical axis of the condenser lens. In order to achieve such movement of the condenser lens, it is considered to miniaturize the frame by disposing the laser oscillator outside the frame, and to mount the frame provided with the condenser lens to a moving mechanism. However, in this case, it is not easy to maintain the state in which the optical axis of the laser light incident to the condenser lens coincides with the optical axis of the condenser lens.

[0008] An object of the present application is to provide a laser processing head that can condense laser light with high precision, and a laser processing apparatus provided with such a laser processing head.

[0009] TECHNICAL MEANS FOR SOLVING THE PROBLEMS

[0010] The laser processing head of one aspect of the present application includes a frame having a first wall portion and a second wall portion opposing each other in a first direction, a third wall portion and a fourth wall portion opposing each other in a second direction perpendicular to the first direction, and a fifth wall portion and a sixth wall portion opposing each other in a third direction perpendicular to the first direction and the second direction; an incidence portion disposed in the first wall portion or the fifth wall portion to cause laser light to be incident into the frame; a laser adjustment portion disposed in the frame to adjust the laser light incident from the incidence portion; and a condensing portion disposed in the sixth wall portion to condense and emit the laser light adjusted by the laser adjustment portion outside the frame, the laser adjustment portion having an optical axis adjustment portion for adjusting the optical axis of the laser light incident from the incidence portion, the incidence portion being biased to the first wall portion side in the first direction, and the condensing portion being biased to the second wall portion side in the first direction.

[0011] In the laser processing head, an optical axis adjusting section for adjusting the optical axis of the laser light incident from the incident section is disposed on the optical path of the laser light from the incident section to the condensing section. Thus, for example, when the exit end section of an optical fiber for guiding the laser light from a light source that outputs the laser light is connected to the incident section, the optical axis of the laser light incident to the condensing section can be made to coincide with the optical axis of the condensing section. In addition, the incident section is biased toward the first wall section of the frame in the first direction, and the condensing section is biased toward the second wall section of the frame in the first direction. Thus, the optical path of the laser light from the incident section to the optical axis adjusting section can be prevented from becoming long, and as a result, the optical axis of the laser light incident to the condensing section can be prevented from deviating from the optical axis of the condensing section. Therefore, according to the laser processing head, the laser light can be condensed with good precision.

[0012] In the laser processing head of one aspect of the present application, the incident section can be disposed on the fifth wall section, and the laser adjusting section can further include a first reflecting section, an attenuator, a beam expander, a second reflecting section, a reflective spatial light modulator, and an imaging optical system, the first reflecting section can reflect the laser light incident from the incident section toward the second wall section side, the attenuator can adjust the output of the laser light reflected by the first reflecting section, the optical axis adjusting section can reflect the laser light whose output has been adjusted by the attenuator toward the sixth wall section side, the beam expander can expand the diameter of the laser light reflected by the optical axis adjusting section, the second reflecting section can reflect the laser light whose diameter has been expanded by the beam expander toward the first wall section side and the fifth wall section side, the reflective spatial light modulator can modulate the laser light reflected by the second reflecting section and reflect the modulated laser light toward the sixth wall section side, and the imaging optical system can constitute a telecentric optical system on both sides of the reflective surface of the reflective spatial light modulator and the entrance pupil surface of the condensing section in an imaging relationship. Thus, since the optical axis of the laser light incident to the structure related to the shaping of the laser light, i.e., the "beam expander, second reflecting section, reflective spatial light modulator, imaging optical system, and condensing section", can be adjusted, the laser light can be condensed with even better precision. In addition, since the attenuator is disposed between the first reflecting section and the optical axis adjusting section, the frame can be prevented from becoming large due to the application of the attenuator.

[0013] In the laser processing head of one aspect of the present application, the incident portion can also be disposed at the 5th wall portion, and the laser adjusting portion further includes an attenuator, a 1st reflecting portion, a beam expander, a 2nd reflecting portion, a reflective spatial light modulator, and an imaging optical system. The optical axis adjusting portion reflects laser light incident from the incident portion toward the 2nd wall portion side. The attenuator adjusts the output of the laser light reflected by the optical axis adjusting portion. The 1st reflecting portion reflects the laser light whose output has been adjusted by the attenuator toward the 6th wall portion side. The beam expander expands the diameter of the laser light reflected by the 1st reflecting portion. The 2nd reflecting portion reflects the laser light whose diameter has been expanded by the beam expander toward the 1st wall portion side and the 5th wall portion side. The reflective spatial light modulator modulates the laser light reflected by the 2nd reflecting portion and reflects it toward the 6th wall portion side. The imaging optical system constitutes a telecentric optical system on both sides of the imaging relationship between the reflecting surface of the reflective spatial light modulator and the entrance pupil surface of the condensing portion. Thus, since the optical axis of the laser light incident to the structure related to the shaping of the laser light, i.e., the "beam expander, 2nd reflecting portion, reflective spatial light modulator, imaging optical system, and condensing portion" can be adjusted, the laser light can be condensed with higher precision. In addition, since the attenuator is disposed between the optical axis adjusting portion and the 1st reflecting portion, the large size of the frame caused by the application of the attenuator can be suppressed.

[0014] In the laser processing head of one aspect of the present application, the incident portion can also be disposed at the 1st wall portion, and the laser adjusting portion further includes an attenuator, a beam expander, a reflecting portion, a reflective spatial light modulator, and an imaging optical system. The attenuator adjusts the output of the laser light incident from the incident portion. The optical axis adjusting portion reflects the laser light whose output has been adjusted by the attenuator toward the 6th wall portion side. The beam expander expands the diameter of the laser light reflected by the optical axis adjusting portion. The reflecting portion reflects the laser light whose diameter has been expanded by the beam expander toward the 1st wall portion side and the 5th wall portion side. The reflective spatial light modulator modulates the laser light reflected by the reflecting portion and reflects it toward the 6th wall portion side. The imaging optical system constitutes a telecentric optical system on both sides of the imaging relationship between the reflecting surface of the reflective spatial light modulator and the entrance pupil surface of the condensing portion. Thus, since the optical axis of the laser light incident to the structure related to the shaping of the laser light, i.e., the "beam expander, reflecting portion, reflective spatial light modulator, imaging optical system, and condensing portion" can be adjusted, the laser light can be condensed with higher precision. In addition, since the attenuator is disposed between the incident portion and the optical axis adjusting portion, the large size of the frame caused by the application of the attenuator can be suppressed.

[0015] In the laser processing head of one aspect of the present application, the distance between the third wall portion and the fourth wall portion can be smaller than the distance between the first wall portion and the second wall portion, the frame body can be configured in a manner that the frame body is mounted to the mounting portion in a state where at least one of the first wall portion, the second wall portion, the third wall portion, and the fifth wall portion is disposed on the mounting portion side of the laser processing apparatus, and the incidence portion and the condensing portion are biased toward the fourth wall portion side in the second direction. Thus, in a case where the frame body is moved in the second direction in which the third wall portion and the fourth wall portion face each other, even if, for example, another structure exists on the fourth wall portion side, the condensing portion can be brought close to the other structure. In addition, since the distance between the third wall portion and the fourth wall portion is smaller than the distance between the first wall portion and the second wall portion, in a case where the frame body is moved in the second direction in which the third wall portion and the fourth wall portion face each other, the space occupied by the frame body can be reduced. Further, since the incidence portion and the condensing portion are biased toward the fourth wall portion side in the second direction, the region on the third wall portion side in the region in the frame body can be effectively used with respect to the laser adjustment portion.

[0016] The laser processing head of one aspect of the present application can further include a circuit portion disposed on the third wall portion side with respect to the laser adjustment portion in the frame body. Thus, the region on the third wall portion side in the region in the frame body with respect to the laser adjustment portion can be effectively used.

[0017] In the laser processing head of one aspect of the present application, a partition wall portion that divides a region on the third wall portion side and a region on the fourth wall portion side in the frame body can be provided, the laser adjustment portion can be disposed on the fourth wall portion side with respect to the partition wall portion in the frame body, and the circuit portion can be disposed on the third wall portion side with respect to the partition wall portion in the frame body. Thus, since heat generated in the circuit portion is less likely to propagate to the laser adjustment portion, generation of strain in the laser adjustment portion due to heat generated in the circuit portion can be suppressed, and the laser can be properly adjusted. Further, the circuit portion can be effectively cooled in the region on the third wall portion side in the region in the frame body by, for example, air cooling or water cooling.

[0018] In the laser processing head of one aspect of the present application, the laser adjustment portion can be mounted to the partition wall portion. Thus, the laser adjustment portion can be reliably and stably supported in the frame body.

[0019] In the laser processing head of one aspect of the present application, the circuit portion can be separated from the partition wall portion. Thus, heat generated in the circuit portion can be more reliably suppressed from propagating to the laser adjustment portion via the partition wall portion.

[0020] The laser processing head of one aspect of the present application can also include a measurement unit that outputs measurement light for measuring the distance between the surface of the object and the condensing unit, and detects the measurement light reflected by the surface of the object via the condensing unit; and a dichroic mirror that reflects the measurement light and transmits the laser light, the circuit unit processing the signal output from the measurement unit, the dichroic mirror being disposed between the laser adjustment unit and the condensing unit in the frame. Thus, the area inside the frame can be effectively used, and the processing can be performed in the laser processing device based on the measurement result of the distance between the surface of the object and the condensing unit.

[0021] In the laser processing head of one aspect of the present application, the measurement unit can be disposed on the first wall side with respect to the condensing unit in the frame. Thus, the area inside the frame can be more effectively used, and the processing can be performed in the laser processing device based on the measurement result of the distance between the surface of the object and the condensing unit.

[0022] The laser processing head of one aspect of the present application can also include an observation unit that outputs observation light for observing the surface of the object, and detects the observation light reflected by the surface of the object via the condensing unit, the observation unit being disposed on the first wall side with respect to the condensing unit in the frame. Thus, the area inside the frame can be effectively used, and the processing can be performed in the laser processing device based on the observation result of the surface of the object.

[0023] The laser processing head of one aspect of the present application can also include a driving unit that moves the condensing unit in the third direction, and the circuit unit controls the driving unit based on the signal output from the measurement unit. Thus, the position of the condensing point of the laser light can be adjusted based on the measurement result of the distance between the surface of the object and the condensing unit.

[0024] The laser processing device of one aspect of the present application includes a first laser processing head and a second laser processing head as the laser processing head described above; a first mounting unit that mounts the frame of the first laser processing head; a second mounting unit that mounts the frame of the second laser processing head; a light source unit that outputs laser light that is incident to the incidence unit of the first laser processing head and the incidence unit of the second laser processing head, respectively; and a support unit that supports an object; the first mounting unit and the second mounting unit are moved in the second direction, respectively, the first frame of the first laser processing head is mounted to the first mounting unit in such a manner that the fourth wall of the first frame is positioned on the second laser processing head side with respect to the third wall of the first frame and the sixth wall of the first frame is positioned on the support unit side with respect to the fifth wall of the first frame, and the second frame of the second laser processing head is mounted to the second mounting unit in such a manner that the fourth wall of the second frame is positioned on the first laser processing head side with respect to the third wall of the second frame and the sixth wall of the second frame is positioned on the support unit side with respect to the fifth wall of the second frame.

[0025] In the laser processing apparatus, since laser light is condensed with high precision by the first and second laser processing heads, the object can be processed with high efficiency and high precision.

[0026] In the laser processing apparatus of one aspect of the present application, the first and second mounting portions can also move in the third direction. Thus, the object can be processed with even higher efficiency.

[0027] In the laser processing apparatus of one aspect of the present application, the support portion can also move in the first direction and rotate about an axis parallel to the third direction. Thus, the object can be processed with even higher efficiency.

[0028] The laser processing apparatus of one aspect of the present application includes: the laser processing head; a mounting portion that mounts a frame of the laser processing head; a light source unit that outputs laser light that is incident on an incident portion of the laser processing head; and a support portion that supports an object, the mounting portion moving in the second direction.

[0029] In the laser processing apparatus, since laser light is condensed with high precision by the laser processing head, the object can be processed with high precision.

[0030] In the laser processing apparatus of one aspect of the present application, the mounting portion can also move in the third direction. Thus, the object can be processed with high efficiency.

[0031] In the laser processing apparatus of one aspect of the present application, the support portion can also move in the first direction and rotate about an axis parallel to the third direction. Thus, the object can be processed with high efficiency.

[0032] Effects of the Invention

[0033] According to the present application, a laser processing head that can condense laser light with high precision and a laser processing apparatus including such a laser processing head can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 A perspective view of a laser processing apparatus according to one embodiment.

[0035] Figure 2 A front view of a portion of the laser processing apparatus shown in FIG. 1. Figure 1

[0036] A front view of the laser processing head of the laser processing apparatus shown in FIG. 1. Figure 3 Figure 1 A side view of the laser processing head shown in FIG. 1.

[0037] Figure 4 A side view of the laser processing head shown in FIG. 1. Figure 3 A side view of the laser processing head shown in FIG. 1.​

[0038] Figure 5 The optical system of the laser processing head is shown in FIG. 1. Figure 3

[0039] The optical system of the laser processing head is shown in FIG. 1. Figure 6

[0040] The optical system of the laser processing head is shown in FIG. 1. Figure 7

[0041] The optical system of the laser processing head is shown in FIG. 1. Figure 8 DETAILED DESCRIPTION

[0042] Hereinafter, an embodiment of the present application will be described in detail with reference to the drawings. In the drawings, like or equivalent components are designated by like reference numerals, and repeated description is omitted.

[0043] [Structure of laser processing device]

[0044] As shown in FIG. 1, the laser processing device 1 includes a plurality of moving mechanisms 5, 6, a support portion 7, a pair of laser processing heads (first laser processing head, second laser processing head) 10A, 10B, a light source unit 8, and a control portion 9. Hereinafter, a first direction is referred to as an X direction, a second direction perpendicular to the first direction is referred to as a Y direction, and a third direction perpendicular to the first direction and the second direction is referred to as a Z direction. In the present embodiment, the X direction and the Y direction are horizontal directions, and the Z direction is a vertical direction. Figure 1 The moving mechanism 5 includes a fixed portion 51, a moving portion 53, and a mounting portion 55. The fixed portion 51 is mounted to a device frame la. The moving portion 53 is mounted to a rail provided to the fixed portion 51 and is movable in the Y direction. The mounting portion 55 is mounted to a rail provided to the moving portion 53 and is movable in the X direction.

[0045] The moving mechanism 6 includes a fixed portion 61, a pair of moving portions (first moving portion, second moving portion) 63, 64, and a pair of mounting portions (first mounting portion, second mounting portion) 65, 66. The fixed portion 61 is mounted to the device frame la. The pair of moving portions 63, 64 are respectively mounted to rails provided to the fixed portion 61 and are independently movable in the Y direction. The mounting portion 65 is mounted to a rail provided to the moving portion 63 and is movable in the Z direction. The mounting portion 66 is mounted to a rail provided to the moving portion 64 and is movable in the Z direction. That is, the pair of mounting portions 65, 66 are respectively movable in the Y direction and the Z direction with respect to the device frame la.

[0046]

[0047] ​​The support section 7 is mounted to a rotation shaft provided to the mounting section 55 of the moving mechanism 5, and is rotatable about an axis parallel to the Z direction as a center line. That is, the support section 7 is movable along the X and Y directions, respectively, and is rotatable about an axis parallel to the Z direction as a center line. The support section 7 supports the object 100. The object 100 is, for example, a wafer.

[0048] As shown in FIG. 1, the laser processing device 1 includes a device frame la, a moving mechanism 5, a moving mechanism 6, a support section 7, a laser processing head 10A, a laser processing head 10B, a light source unit 8, and a control section 9. Figure 1 and Figure 2 The laser processing head 10A is mounted to the mounting section 65 of the moving mechanism 6. The laser processing head 10A irradiates laser (first laser) LI to the object 100 supported by the support section 7 in a state where the support section 7 opposes the laser processing head 10A in the Z direction. The laser processing head 10B is mounted to the mounting section 66 of the moving mechanism 6. The laser processing head 10B irradiates laser (second laser) L2 to the object 100 supported by the support section 7 in a state where the support section 7 opposes the laser processing head 10B in the Z direction.

[0049] The light source unit 8 has a pair of light sources 81, 82. The pair of light sources 81, 82 is mounted to the device frame la. The light source 81 outputs laser LI. The laser LI is emitted from an emission section 81a of the light source 81, and is guided to the laser processing head 10A by an optical fiber 2. The light source 82 outputs laser L2. The laser L2 is emitted from an emission section 82a of the light source 82, and is guided to the laser processing head 10B by another optical fiber 2.

[0050] The control section 9 controls each section (the moving mechanisms 5, 6, the pair of laser processing heads 10A, 10B, the light source unit 8, and the like) of the laser processing device 1. The control section 9 is configured as a computer device including a processor, a memory, a storage, a communication device, and the like. In the control section 9, software (programs) read into the memory and the like are executed by the processor, reading and writing of data in the memory and the storage, and communication of the communication device are controlled by the processor. Thus, the control section 9 realizes various functions.

[0051] An example of processing performed by the laser processing device 1 configured as described above will be described. One example of the processing is an example in which a plurality of lines set in a lattice shape are formed in the inside of the object 100 in order to cut the object 100 as a wafer into a plurality of chips.

[0052] First, the moving mechanism 5 moves the support section 7 along the X and Y directions, respectively, so that the support section 7 supporting the object 100 opposes the pair of laser processing heads 10A, 10B in the Z direction. Next, the moving mechanism 5 rotates the support section 7 about an axis parallel to the Z direction as a center line, so that the plurality of lines extending in one direction on the object 100 are aligned along the X direction.

[0053] Then, the moving mechanism 6 moves the laser machining head 10A in the Y direction to position the focal point of the laser Ll on a line extending in one direction. On the other hand, the moving mechanism 6 moves the laser machining head 10B in the Y direction to position the focal point of the laser L2 on another line extending in one direction. Then, the moving mechanism 6 moves the laser machining head 10A in the Z direction to position the focal point of the laser Ll inside the object 100. On the other hand, the moving mechanism 6 moves the laser machining head 10B in the Z direction to position the focal point of the laser L2 inside the object 100.

[0054] Next, the light source 81 outputs the laser Ll and the laser machining head 10A irradiates the object 100 with the laser Ll, and the light source 82 outputs the laser L2 and the laser machining head 10B irradiates the object 100 with the laser L2. At the same time, the moving mechanism 5 moves the support 7 in the X direction to relatively move the focal point of the laser Ll along a line extending in one direction and relatively move the focal point of the laser L2 along another line extending in one direction. In this way, the laser machining device 1 forms modified regions inside the object 100 along a plurality of lines extending in one direction on the object 100, respectively.

[0055] Next, the moving mechanism 5 rotates the support 7 with an axis parallel to the Z direction as a center line to move a plurality of lines extending in another direction orthogonal to one direction on the object 100 in the X direction.

[0056] Then, the moving mechanism 6 moves the laser machining head 10A in the Y direction to position the focal point of the laser Ll on a line extending in another direction. On the other hand, the moving mechanism 6 moves the laser machining head 10B in the Y direction to position the focal point of the laser L2 on another line extending in another direction. Then, the moving mechanism 6 moves the laser machining head 10A in the Z direction to position the focal point of the laser Ll inside the object 100. On the other hand, the moving mechanism 6 moves the laser machining head 10B in the Z direction to position the focal point of the laser L2 inside the object 100.

[0057] Next, the light source 81 outputs the laser Ll and the laser machining head 10A irradiates the object 100 with the laser Ll, and the light source 82 outputs the laser L2 and the laser machining head 10B irradiates the object 100 with the laser L2. At the same time, the moving mechanism 5 moves the support 7 in the X direction to relatively move the focal point of the laser Ll along a line extending in another direction and relatively move the focal point of the laser L2 along another line extending in another direction. In this way, the laser machining device 1 forms modified regions inside the object 100 along a plurality of lines extending in another direction orthogonal to one direction on the object 100, respectively.

[0058] Furthermore, in one example of the above processing, light source 81 outputs a transmissive laser L1 to the object 100 via, for example, pulse oscillation, and light source 82 outputs a transmissive laser L2 to the object 100 via, for example, pulse oscillation. If such laser light is focused inside the object 100, the laser is specifically absorbed at the point corresponding to the focal point, forming a modified region inside the object 100. The modified region is a region whose density, refractive index, mechanical strength, and other physical properties differ from the surrounding unmodified region. Examples of modified regions include, for example, melt-processed regions, cracked regions, insulation failure regions, and regions with refractive index changes.

[0059] If a laser output via pulse oscillation is applied to the object 100, and the laser's focal point moves relative to a line set on the object 100, multiple modified particles are formed and arranged in a row along the line. One modified particle is formed by the irradiation of one laser pulse. A row of modified regions is a collection of multiple modified particles arranged in that row. Adjacent modified particles may be connected or separated depending on the relative movement speed of the laser's focal point relative to the object 100 and the laser's repetition frequency.

[0060] [Structure of the laser processing head]

[0061] like Figure 3 and Figure 4 As shown, the laser processing head 10A includes a frame 11, an incident part 12, a laser adjustment part 13, and a focusing part 14.

[0062] The frame 11 has a first wall portion 21 and a second wall portion 22, a third wall portion 23 and a fourth wall portion 24, and a fifth wall portion 25 and a sixth wall portion 26. The first wall portion 21 and the second wall portion 22 are opposite to each other in the X direction. The third wall portion 23 and the fourth wall portion 24 are opposite to each other in the Y direction. The fifth wall portion 25 and the sixth wall portion 26 are opposite to each other in the Z direction.

[0063] The distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22. The distance between the first wall portion 21 and the second wall portion 22 is smaller than the distance between the fifth wall portion 25 and the sixth wall portion 26. Furthermore, the distance between the first wall portion 21 and the second wall portion 22 may be equal to or greater than the distance between the fifth wall portion 25 and the sixth wall portion 26.

[0064] In the laser processing head 10A, the first wall portion 21 is located on the opposite side of the fixed portion 61 of the moving mechanism 6, and the second wall portion 22 is located on the side of the fixed portion 61. The third wall portion 23 is located on the side of the mounting portion 65 of the moving mechanism 6, and the fourth wall portion 24 is located on the opposite side of the mounting portion 65, that is, on the side of the laser processing head 10B (see reference). Figure 2). The 5th wall portion 25 is located on the opposite side of the support portion 7, and the 6th wall portion 26 is located on the side of the support portion 7.

[0065] The frame 11 is configured in such a manner that the frame 11 is attached to the mounting portion 65 in a state where the 3rd wall portion 23 is disposed on the side of the mounting portion 65 of the moving mechanism 6. Specifically, as described below. The mounting portion 65 has a bottom plate 65a and a mounting plate 65b. The bottom plate 65a is attached to the rail (refer to Fig. 2) provided to the moving portion 63. The mounting plate 65b is erected on the end portion of the bottom plate 65a on the laser processing head 10B side (refer to Fig. 2). The frame 11 is attached to the mounting portion 65 in a state where the 3rd wall portion 23 contacts the mounting plate 65b, via the pedestals 27, and the bolts 28 are screwed to the mounting plate 65b. The pedestals 27 are provided to the 1st wall portion 21 and the 2nd wall portion 22, respectively. The frame 11 is detachable with respect to the mounting portion 65. Figure 2 ). The mounting plate 65b is erected on the end portion of the bottom plate 65a on the laser processing head 10B side (refer to Fig. 2). The frame 11 is attached to the mounting portion 65 in a state where the 3rd wall portion 23 contacts the mounting plate 65b, via the pedestals 27, and the bolts 28 are screwed to the mounting plate 65b. The pedestals 27 are provided to the 1st wall portion 21 and the 2nd wall portion 22, respectively. The frame 11 is detachable with respect to the mounting portion 65. Figure 2 ). The mounting plate 65b is erected on the end portion of the bottom plate 65a on the laser processing head 10B side (refer to Fig. 2). The frame 11 is attached to the mounting portion 65 in a state where the 3rd wall portion 23 contacts the mounting plate 65b, via the pedestals 27, and the bolts 28 are screwed to the mounting plate 65b. The pedestals 27 are provided to the 1st wall portion 21 and the 2nd wall portion 22, respectively. The frame 11 is detachable with respect to the mounting portion 65.

[0066] The incident portion 12 is disposed to the 5th wall portion 25. The incident portion 12 causes the laser light LI to be incident into the frame 11. The incident portion 12 is deviated to the 1st wall portion 21 side in the X direction, and is deviated to the 4th wall portion 24 side in the Y direction. That is, the distance between the incident portion 12 in the X direction and the 1st wall portion 21 is smaller than the distance between the incident portion 12 in the X direction and the 2nd wall portion 22, and the distance between the incident portion 12 in the Y direction and the 4th wall portion 24 is smaller than the distance between the incident portion 12 in the Y direction and the 3rd wall portion 23.

[0067] The emission end portion 2a of the optical fiber 2 is connected to the incident portion 12. Specifically, the incident portion 12 is a portion including the hole 25a formed to the 5th wall portion 25. In the 5th wall portion 25, the mounting portion 25b is provided. In the mounting portion 25b, the main body portion 2b of the emission end portion 2a is attached by a bolt or the like. In this state, the front end portion 2c of the emission end portion 2a is inserted into the hole 25a. Thus, the emission end portion 2a of the optical fiber 2 is detachable with respect to the incident portion 12. Between the 5th wall portion 25 and the main body portion 2b, the cover 25c is disposed. The cover 25c covers the gap formed between the hole 25a and the front end portion 2c. As one example, in the emission end portion 2a, an isolator that suppresses return light is disposed in the main body portion 2b, and a collimator lens that collimates the laser light LI is disposed in the front end portion 2c. Further, the incident portion 12 can be a connector or the like configured in such a manner that the emission end portion 2a of the optical fiber 2 can be connected.

[0068] A laser adjustment unit 13 is disposed within a frame 11. The laser adjustment unit 13 adjusts the laser L1 incident from the incident part 12. The laser adjustment unit 13 is disposed within the frame 11 on the side of the fourth wall portion 24, opposite to the partition wall portion 29. The laser adjustment unit 13 is mounted on the partition wall portion 29. The partition wall portion 29 is disposed within the frame 11, dividing the area within the frame 11 into an area on the side of the third wall portion 23 and an area on the side of the fourth wall portion 24. The partition wall portion 29 is formed as part of the frame 11. The various structures of the laser adjustment unit 13 are mounted on the partition wall portion 29 on the side of the fourth wall portion 24. The partition wall portion 29 functions as an optical base supporting the various structures of the laser adjustment unit 13.

[0069] A focusing section 14 is disposed on the sixth wall portion 26. Specifically, the focusing section 14 is disposed on the sixth wall portion 26 with its insertion through the hole 26a formed in the sixth wall portion 26. The focusing section 14 focuses the laser L1, which is adjusted by the laser adjustment section 13, and emits it outward from the frame 11. The focusing section 14 is biased towards the second wall portion 22 in the X direction and towards the fourth wall portion 24 in the Y direction. That is, the distance between the focusing section 14 and the second wall portion 22 in the X direction is smaller than the distance between the focusing section 14 and the first wall portion 21 in the X direction, and the distance between the focusing section 14 and the fourth wall portion 24 in the Y direction is smaller than the distance between the focusing section 14 and the third wall portion 23 in the X direction.

[0070] like Figure 5 As shown, the laser adjustment unit 13 includes a reflecting part (first reflecting part) 31, an attenuator 32, and an optical axis adjustment unit 33. The reflecting part 31, the attenuator 32, and the optical axis adjustment unit 33 are arranged on a first straight line A1 extending along the X direction. The reflecting part 31 is opposite to the incident part 12 in the Z direction. That is, the reflecting part 31 is opposite to the emitting end 2a of the optical fiber 2 in the Z direction. The reflecting part 31 reflects the laser L1 incident from the incident part 12 toward the second wall 22 side. The reflecting part 31 is, for example, a mirror or a prism. The attenuator 32 adjusts the output of the laser L1 reflected by the reflecting part 31. The optical axis adjustment unit 33 reflects the laser L1 after its output is adjusted by the attenuator 32 toward the sixth wall 26 side.

[0071] The optical axis adjustment unit 33 is used to adjust the optical axis of the laser L1 incident from the incident unit 12. In this embodiment, the optical axis adjustment unit 33 includes a first steering mirror 331, a reflecting member 332, and a second steering mirror 333.

[0072] The first turning mirror 331 is disposed on the first straight line Al. The first turning mirror 331 is constituted by a mirror 331a and a holder 331b. The mirror 331a is attached to the holder 331b. The holder 331b is attached to the partition wall portion 29. The holder 331b holds the mirror 331a in such a manner that the orientation of the mirror 331a can be adjusted. The first turning mirror 331 reflects the laser light Ll, whose output has been adjusted by the attenuator 32, toward the sixth wall portion 26.

[0073] The reflecting member 332 reflects the laser light Ll, which has been reflected by the first turning mirror 331, toward the second wall portion 22. The reflecting member 332 is, for example, a mirror or a prism.

[0074] The second turning mirror 333 is disposed on the second straight line A2. The second turning mirror 333 is constituted by a mirror 333a and a holder 333b. The mirror 333a is attached to the holder 333b. The holder 333b is attached to the partition wall portion 29. The holder 333b holds the mirror 333a in such a manner that the orientation of the mirror 333a can be adjusted. The second turning mirror 333 reflects the laser light Ll, which has been reflected by the reflecting member 332, toward the sixth wall portion 26.

[0075] As one example, with respect to each of the holders 331b and 333b, access can be made via a tool that passes through a covered opening (not shown) formed in the second wall portion 22. Thereby, by observing an image or the like taken by the observation portion 17 described below and operating the tool, the orientation of each of the mirrors 331a and 333a can be adjusted so that the optical axis of the laser light Ll incident on the condensing portion 14 coincides with the optical axis of the condensing portion 14.

[0076] The laser light adjusting portion 13 further has a beam expander 34 and a reflecting portion (second reflecting portion) 35. The optical axis adjusting portion 33, the beam expander 34, and the reflecting portion 35 are disposed on the second straight line A2 extending in the Z direction. The beam expander 34 expands the diameter of the laser light Ll, which has been reflected by the optical axis adjusting portion 33. The reflecting portion 35 reflects the laser light Ll, whose diameter has been expanded by the beam expander 34, toward the first wall portion 21 and the fifth wall portion 25. The reflecting portion 35 is, for example, a mirror or a prism.

[0077] The laser adjustment section 13 further has a reflection-type spatial light modulator 36 and an imaging optical system 37. The reflection-type spatial light modulator 36, the imaging optical system 37, and the condensing section 14 are arranged on a third straight line A3 extending in the Z direction. The reflection-type spatial light modulator 36 modulates and reflects the laser light L1 reflected by the reflecting section 35 toward the sixth wall section 26 side. The reflection-type spatial light modulator 36 is a spatial light modulator (SLM) such as a reflection-type liquid crystal on silicon (LCOS). The imaging optical system 37 constitutes a two-side telecentric optical system in which a reflecting surface 36a of the reflection-type spatial light modulator 36 and the entrance pupil surface 14a of the condensing section 14 are in an imaging relationship. The imaging optical system 37 is constituted by three or more lenses.

[0078] The first straight line A1, the second straight line A2, and the third straight line A3 are located on a plane perpendicular to the Y direction. The second straight line A2 is located on the second wall section 22 side with respect to the third straight line A3. In the laser processing head 10A, the laser light L1 incident into the frame 11 from the entrance section 12 along the Z direction is reflected by the reflecting section 31 and travels on the first straight line A1. The laser light L1 traveling on the first straight line A1 is reflected by the optical axis adjustment section 33 and travels on the second straight line A2. The laser light L1 traveling on the second straight line A2 is sequentially reflected by the reflecting section 35 and the reflection-type spatial light modulator 36 and travels on the third straight line A3. The laser light L1 traveling on the third straight line A3 is emitted from the condensing section 14 toward the outside of the frame 11 along the Z direction.

[0079] The laser processing head 10A further has a dichroic mirror 15, a measurement section 16, an observation section 17, a driving section 18, and a circuit section 19.

[0080] The dichroic mirror 15 is arranged between the imaging optical system 37 and the condensing section 14 on the third straight line A3. That is, the dichroic mirror 15 is arranged between the laser adjustment section 13 and the condensing section 14 in the frame 11. The dichroic mirror 15 is attached to the spacer wall section 29 on the fourth wall section 24 side. The dichroic mirror 15 transmits the laser light L1. The dichroic mirror 15 is preferably, for example, a cubic shape or a two-plate shape arranged in a twisted relationship from the viewpoint of suppressing astigmatism.

[0081] The measurement section 16 is disposed on the first wall portion 21 side with respect to the third straight line A3 in the frame body 11. That is, the measurement section 16 is disposed on the first wall portion 21 side with respect to the condensing section 14 in the X direction. The measurement section 16 is attached to the partition wall portion 29 on the fourth wall portion 24 side. The measurement section 16 outputs the measurement light L10 for measuring the distance from the surface of the object 100 (for example, the surface on the side on which the laser light L1 is incident) to the condensing section 14, and detects the measurement light L10 reflected by the surface of the object 100 via the condensing section 14. That is, the measurement light L10 output from the measurement section 16 is irradiated to the surface of the object 100 via the condensing section 14, and the measurement light L10 reflected by the surface of the object 100 is detected by the measurement section 16 via the condensing section 14.

[0082] More specifically, the measurement light L10 output from the measurement section 16 is reflected by the beam splitter 20 and the dichroic mirror 15 attached to the partition wall portion 29 on the fourth wall portion 24 side in this order, and exits from the condensing section 14 to the outside of the frame body 11. The measurement light L10 reflected by the surface of the object 100 is incident into the frame body 11 from the condensing section 14, and is reflected by the dichroic mirror 15 and the beam splitter 20 in this order, and is incident into the measurement section 16, which detects it.

[0083] The observation section 17 is disposed on the first wall portion 21 side with respect to the third straight line A3 in the frame body 11. That is, the observation section 17 is disposed on the first wall portion 21 side with respect to the condensing section 14 in the X direction. The observation section 17 is attached to the partition wall portion 29 on the fourth wall portion 24 side. The observation section 17 outputs the observation light L20 for observing the surface of the object 100 (for example, the surface on the side on which the laser light L1 is incident), and detects the observation light L20 reflected by the surface of the object 100 via the condensing section 14. That is, the observation light L20 output from the observation section 17 is irradiated to the surface of the object 100 via the condensing section 14, and the observation light L20 reflected by the surface of the object 100 is detected by the observation section 17 via the condensing section 14.

[0084] More specifically, the observation light L20 output from the observation section 17 is reflected by the dichroic mirror 15 after passing through the beam splitter 20, and exits from the condensing section 14 to the outside of the frame body 11. The observation light L20 reflected by the surface of the object 100 is incident into the frame body 11 from the condensing section 14, is reflected by the dichroic mirror 15, and passes through the beam splitter 20 to be incident into the observation section 17, which detects it. Furthermore, the respective wavelengths of the laser light L1, the measurement light L10, and the observation light L20 are different from each other (at least the respective central wavelengths are shifted from each other).

[0085] The driving section 18 is attached to the partition wall portion 29 on the fourth wall portion 24 side. The driving section 18 moves the condensing section 14 disposed on the sixth wall portion 26 in the Z direction by a driving force of, for example, a piezoelectric element.

[0086] The circuit portion 19 is disposed on the third wall portion 23 side with respect to the partition wall portion 29 in the frame 11. That is, the circuit portion 19 is disposed on the third wall portion 23 side with respect to the laser adjustment portion 13, the measurement portion 16, and the observation portion 17 in the frame 11. The circuit portion 19 is separated from the partition wall portion 29. The circuit portion 19 is, for example, a plurality of circuit boards. The circuit portion 19 processes a signal output from the measurement portion 16 and a signal input to the reflective spatial light modulator 36. The circuit portion 19 controls the driving portion 18 on the basis of the signal output from the measurement portion 16. As one example, the circuit portion 19 controls the driving portion 18 on the basis of the signal output from the measurement portion 16 so that the distance between the surface of the object 100 and the condensing portion 14 is maintained constant (that is, the distance between the surface of the object 100 and the condensing point of the laser light L1 is maintained constant).

[0087] Further, in the partition wall portion 29, a notch, a hole, or the like (omitted from illustration) through which a wiring for electrically connecting each of the measurement portion 16, the observation portion 17, the driving portion 18, and the reflective spatial light modulator 36 to the circuit portion 19 passes is formed. In addition, in the frame 11, a connector (omitted from illustration) to which a wiring or the like for electrically connecting the circuit portion 19 to the control portion 9 (refer to FIG. 1) is attached is provided. Figure 1 ) is electrically connected.

[0088] The laser processing head 10B, like the laser processing head 10A, has the frame 11, the incident portion 12, the laser adjustment portion 13, the condensing portion 14, the dichroic mirror 15, the measurement portion 16, the observation portion 17, the driving portion 18, and the circuit portion 19. However, each structure of the laser processing head 10B is disposed in a manner that has a relationship symmetrical to each structure of the laser processing head 10A with respect to an imaginary plane passing through the midpoint between the pair of mounting portions 65, 66 and perpendicular to the Y direction, as shown in FIG. 6. Figure 2

[0089] For example, the frame (first frame) 11 of the laser processing head 10A is mounted to the mounting portion 65 in a manner that the fourth wall portion 24 is located on the laser processing head 10B side with respect to the third wall portion 23 and the sixth wall portion 26 is located on the support portion 7 side with respect to the fifth wall portion 25. In contrast, the frame (second frame) 11 of the laser processing head 10B is mounted to the mounting portion 66 in a manner that the fourth wall portion 24 is located on the laser processing head 10A side with respect to the third wall portion 23 and the sixth wall portion 26 is located on the support portion 7 side with respect to the fifth wall portion 25.

[0090] ​The frame 11 of the laser processing head 10B is configured to be attached to the attachment portion 66 in a state where the third wall portion 23 is disposed on the attachment portion 66 side. Specifically, as described below. The attachment portion 66 has a base plate 66a and an attachment plate 66b. The base plate 66a is attached to the rail provided to the moving portion 63. The attachment plate 66b is erected on the end portion of the base plate 66a on the laser processing head 10A side. The frame 11 of the laser processing head 10B is attached to the attachment portion 66 in a state where the third wall portion 23 contacts the attachment plate 66b. The frame 11 of the laser processing head 10B is detachable with respect to the attachment portion 66.

[0091] [Effects]

[0092] In the laser processing head 10A, the optical axis adjustment portion 33 for adjusting the optical axis of the laser L1 incident from the incidence portion 12 is disposed on the optical path of the laser L1 from the incidence portion 12 to the condensing portion 14. Thereby, for example, when the emission end portion 2a of the optical fiber 2 is detached from the frame 11 for maintenance or the like, and the emission end portion 2a of the optical fiber 2 is connected to the incidence portion 12 again, the optical axis of the laser L1 incident to the condensing portion 14 can be made to coincide with the optical axis of the condensing portion 14. In addition, the incidence portion 12 is biased to the first wall portion 21 side of the frame 11 in the X direction, and the condensing portion 14 is biased to the second wall portion 22 side of the frame 11 in the X direction. Thereby, the optical path of the laser L1 from the incidence portion 12 to the optical axis adjustment portion 33 can be suppressed from becoming long, and as a result, the optical axis of the laser L1 incident to the condensing portion 14 can be suppressed from deviating from the optical axis of the condensing portion 14. Therefore, according to the laser processing head 10A, the laser L1 can be condensed with good precision.

[0093] In addition, in the laser processing head 10A, the incidence portion 12 is disposed to the fifth wall portion 25 of the frame 11, and in the laser adjustment portion 13, the optical axis adjustment portion 33 is disposed to the rear stage (downstream side in the traveling direction of the laser L1) of the reflecting portion 31 and the attenuator 32 and to the front stage (upstream side in the traveling direction of the laser L1) of the expander 34, the reflecting portion 35, the reflective spatial light modulator 36, and the imaging optical system 37. The optical axis adjustment portion 33 is disposed to the front stage (upstream side in the traveling direction of the laser L1) of the expander 34, the reflecting portion 35, the reflective spatial light modulator 36, and the imaging optical system 37. Thereby, since the optical axis of the laser L1 incident to the structure with respect to the shaping of the laser L1, that is, the "expander 34, reflecting portion 35, reflective spatial light modulator 36, imaging optical system 37, and condensing portion 14" can be adjusted, the laser L1 can be condensed with even better precision. In addition, the incidence portion 12 is disposed to the fifth wall portion 25, and in the laser adjustment portion 13, the attenuator 32 is disposed between the reflecting portion 31 and the optical axis adjustment portion 33. Thereby, the increase in the size of the frame 11 due to the application of the attenuator 32 can be suppressed.

[0094] Further, in the laser processing head 10A, since the light source that outputs the laser light L1 is not provided in the frame 11, it is possible to reduce the size of the frame 11. Further, in the frame 11, the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, and the light collecting portion 14 provided to the sixth wall portion 26 is biased to the fourth wall portion 24 side in the Y direction. Thus, in a case where the frame 11 is moved in the Y direction along which the third wall portion 23 and the fourth wall portion 24 face each other, even if there is another structure (for example, the laser processing head 10B) on the fourth wall portion 24 side, for example, it is possible to bring the light collecting portion 14 close to the other structure. Further, since the distance between the third wall portion 23 and the fourth wall portion 24 is smaller than the distance between the first wall portion 21 and the second wall portion 22, in a case where the frame 11 is moved in the Y direction along which the third wall portion 23 and the fourth wall portion 24 face each other, it is possible to reduce the space occupied by the frame 11. Further, since the incident portion 12 and the light collecting portion 14 are biased to the fourth wall portion 24 side in the Y direction, it is possible to effectively use the region in the frame 11, which is the region on the third wall portion 23 side with respect to the laser adjusting portion 13, by providing another structure (for example, the circuit portion 19) or the like.

[0095] Further, in the laser processing head 10A, the circuit portion 19 is provided to the third wall portion 23 side with respect to the laser adjusting portion 13 in the frame 11. Thus, it is possible to effectively use the region in the frame 11, which is the region on the third wall portion 23 side with respect to the laser adjusting portion 13.

[0096] Further, in the laser processing head 10A, the laser adjusting portion 13 is provided to the fourth wall portion 24 side with respect to the partition wall portion 29 in the frame 11, and the circuit portion 19 is provided to the third wall portion 23 side with respect to the partition wall portion 29 in the frame 11. Thus, since the heat generated in the circuit portion 19 is less likely to propagate to the laser adjusting portion 13, it is possible to suppress the generation of strain in the laser adjusting portion 13 due to the heat generated in the circuit portion 19, and it is possible to appropriately adjust the laser light L1. Further, by air cooling or water cooling or the like, for example, it is possible to effectively cool the circuit portion 19 in the region on the third wall portion 23 side in the frame 11.

[0097] Further, in the laser processing head 10A, the laser adjusting portion 13 is attached to the partition wall portion 29. Thus, it is possible to reliably and stably support the laser adjusting portion 13 in the frame 11.

[0098] Further, in the laser processing head 10A, the circuit portion 19 is separated from the partition wall portion 29. Thus, it is possible to more reliably suppress the propagation of the heat generated in the circuit portion 19 to the laser adjusting portion 13 via the partition wall portion 29.

[0099] Furthermore, in the laser processing head 10A, the measuring unit 16 and the observing unit 17 are disposed in the area within the frame 11 on the side of the first wall portion 21 relative to the focusing unit 14. The circuit unit 19 is disposed in the area within the frame 11 on the side of the third wall portion 23 relative to the laser adjustment unit 13. The dichroic mirror 15 is disposed within the frame 11 between the laser adjustment unit 13 and the focusing unit 14. This allows for efficient utilization of the area within the frame 11. Moreover, in the laser processing apparatus 1, processing can be performed based on the measurement results of the distance between the surface of the object 100 and the focusing unit 14. Additionally, in the laser processing apparatus 1, processing can be performed based on the observation results of the surface of the object 100.

[0100] Furthermore, in the laser processing head 10A, the circuit section 19 controls the drive section 18 based on the signal output from the self-measurement section 16. As a result, the position of the focusing point of the laser L1 can be adjusted based on the measurement results of the distance between the surface of the object 100 and the focusing section 14.

[0101] The same functions and effects can be achieved with the laser processing head 10B.

[0102] Furthermore, in the laser processing apparatus 1, since the laser L1 is focused with good precision by each laser processing head 10A, 10B, the object 100 can be processed with good efficiency and good precision.

[0103] Furthermore, in the laser processing apparatus 1, a pair of mounting parts 65 and 66 move along the Y and Z directions respectively. This allows for more efficient processing of the object 100.

[0104] Furthermore, in the laser processing apparatus 1, the support 7 moves along the X and Y directions respectively, and rotates about an axis parallel to the Z direction as its center line. This allows for more efficient processing of the object 100.

[0105] [Variation Example]

[0106] The present invention is not limited to the embodiments described above. For example, in the laser processing head 10A, it may also be as described above. Figure 6 As shown, the incident part 12 is disposed on the first wall part 21 of the frame 11. In the laser adjustment part 13, the optical axis adjustment part 33 is disposed at the rear section of the attenuator 32 and at the front section of the beam expander 34, the reflector 35, the reflective spatial light modulator 36, and the imaging optical system 37. Figure 6 In the laser processing head 10A shown, the incident part 12, the attenuator 32, and the optical axis adjustment part 33 (specifically, the first steering mirror 331 of the optical axis adjustment part 33) are arranged on the first straight line A1 (other components are arranged on the same line as the laser processing head 10A). Figure 5 (The laser processing head 10A shown is the same). Figure 6In the laser processing head 10A shown, the attenuator 32 adjusts the output of the laser light Ll incident from the incidence section 12. Thus, since the optical axis of the laser light Ll incident to the structure shaped with respect to the laser light Ll, i.e., "the expander 34, the reflection section 35, the reflection-type spatial light modulator 36, the imaging optical system 37, and the condensing section 14" can be adjusted, the laser light Ll can be condensed with higher precision. In addition, since the attenuator 32 is disposed between the incidence section 12 and the optical axis adjustment section 33, the increase in the size of the frame 11 due to the application of the attenuator 32 can be suppressed. Further, the thinness of the laser processing device 1 can be pursued. The above structure can also be applied to the laser processing head 10B.

[0107] In addition, in the laser processing head 10A, as shown in Figure 7 In the laser processing head 10A shown, the incidence section 12 is disposed at the fifth wall section 25 of the frame 11, and in the laser adjustment section 13, the optical axis adjustment section 33 is disposed at the front stage of the attenuator 32, the reflection section 31, the expander 34, the reflection section 35, the reflection-type spatial light modulator 36, and the imaging optical system 37. In the laser processing head 10A shown, Figure 7 In the laser processing head 10A shown, the optical axis adjustment section 33 (specifically, the second turning mirror 333 of the optical axis adjustment section 33), the attenuator 32, and the reflection section 31 are disposed on the first straight line Al, the optical axis adjustment section 33 (specifically, the first turning mirror 331 of the optical axis adjustment section 33) is opposed to the incidence section 12 in the Z direction, and the reflection section 31 is opposed to the expander 34 in the Z direction (the same as in the laser processing head 10A shown in Figure 5 In the laser processing head 10A shown, the optical axis adjustment section 33 (specifically, the second turning mirror 333 of the optical axis adjustment section 33), the attenuator 32, and the reflection section 31 are disposed on the first straight line Al, the optical axis adjustment section 33 (specifically, the first turning mirror 331 of the optical axis adjustment section 33) is opposed to the incidence section 12 in the Z direction, and the reflection section 31 is opposed to the expander 34 in the Z direction (the same as in the laser processing head 10A shown in Figure 7 In the laser processing head 10A shown, the optical axis adjustment section 33 (specifically, the second turning mirror 333 of the optical axis adjustment section 33), the attenuator 32, and the reflection section 31 are disposed on the first straight line Al, the optical axis adjustment section 33 (specifically, the first turning mirror 331 of the optical axis adjustment section 33) is opposed to the incidence section 12 in the Z direction, and the reflection section 31 is opposed to the expander 34 in the Z direction (the same as in the laser processing head 10A shown in

[0108] In addition, in the laser processing head 10A shown in Figure 5 and Figure 6 In each of the laser processing heads 10A shown, the attenuator 32 can also be disposed between the optical axis adjustment section 33 and the expander 34. In addition, in the laser processing head 10A shown in Figure 7In the illustrated laser processing head 10A, the attenuator 32 can also be disposed between the reflecting section 31 and the beam expander 34. In addition, in each of the illustrated laser processing heads 10A, the attenuator 32 can also be disposed in a rear section of the beam expander 34 (e.g., between the reflecting section 35 and the reflective spatial light modulator 36). Each of the above-described structures can also be applied to the laser processing head 10B. Figure 5 Figure 6 Figure 7 In each of the illustrated laser processing heads 10A, the attenuator 32 can also be disposed in a rear section of the beam expander 34 (e.g., between the reflecting section 35 and the reflective spatial light modulator 36). Each of the above-described structures can also be applied to the laser processing head 10B.

[0109] In addition, the optical axis adjustment section 33 is not limited to having the first turning mirror 331, the reflecting member 332, and the second turning mirror 333. The optical axis adjustment section 33 can have a structure for adjusting the optical axis of the laser light L1 incident from the entrance section 12. As one example, the optical axis adjustment section 33 can have the first turning mirror 331 that reflects the laser light L1 incident from the first wall section 21 side along the X direction toward the first wall section 21 side and toward the fifth wall section 25 side, and the second turning mirror 333 that reflects the laser light L1 reflected by the first turning mirror 331 along the Z direction toward the sixth wall section 26 side. In addition, the first turning mirror 331 and the second turning mirror 333 can each be an electric mirror that operates electrically. In this case, the first turning mirror 331 and the second turning mirror 333 can be configured to automatically adjust the orientations of the respective mirrors 331a, 333a based on the image acquired by the observation section 17.

[0110] In addition, the frame 11 can be configured to be attached to the attachment section 65 (or the attachment section 66) of the laser processing apparatus 1 in a state in which at least one of the first wall section 21, the second wall section 22, the third wall section 23, and the fifth wall section 25 is disposed on the attachment section 65 (or the attachment section 66) side.

[0111] In addition, the circuit section 19 is not limited to processing the signal output from the measurement section 16 and / or the signal input to the reflective spatial light modulator 36, but can process any signal in the laser processing head.

[0112] In addition, the light source unit 8 can have one light source. In this case, the light source unit 8 can be configured to emit a portion of the laser light output from the one light source from the exit section 81a and emit the remaining portion of the laser light from the exit section 82a.

[0113] ​​In addition, the laser processing apparatus 1 can also be provided with a single laser processing head 10A, and the mounting portion 65 of the frame 11 in which the single laser processing head 10A is mounted is moved at least in the Y direction. In this case, since the laser L1 is condensed with high precision by the laser processing head 10A, the object 100 can be processed with high precision. In the laser processing apparatus 1 provided with the single laser processing head 10A, if the mounting portion 65 is moved in the Z direction, the object 100 can also be processed with high efficiency. In the laser processing apparatus 1 provided with the single laser processing head 10A, if the support portion 7 is moved in the X direction and rotated around an axis parallel to the Z direction as a center line, the object 100 can be processed with high efficiency.

[0114] In addition, the laser processing apparatus 1 can be provided with three or more laser processing heads. Figure 8 FIG. 1 is a perspective view of a laser processing apparatus 1 provided with two pairs of laser processing heads. Figure 8 The laser processing apparatus 1 shown in FIG. 1 is provided with a plurality of moving mechanisms 200, 300, 400; a support portion 7; a pair of laser processing heads 10A, 10B; a pair of laser processing heads 10C, 10D; and a light source unit (not shown).

[0115] The moving mechanism 200 moves the support portion 7 in each of the X, Y, and Z directions, and rotates the support portion 7 around an axis parallel to the Z direction as a center line.

[0116] The moving mechanism 300 has a fixed portion 301, and a pair of mounting portions (first mounting portion, second mounting portion) 305, 306. The fixed portion 301 is mounted to an apparatus frame (not shown). The pair of mounting portions 305, 306 are respectively mounted to rails provided to the fixed portion 301, are independent of each other, and are movable in the Y direction.

[0117] The moving mechanism 400 has a fixed portion 401, and a pair of mounting portions (first mounting portion, second mounting portion) 405, 406. The fixed portion 401 is mounted to an apparatus frame (not shown). The pair of mounting portions 405, 406 are respectively mounted to rails provided to the fixed portion 401, are independent of each other, and are movable in the X direction. Further, the rails of the fixed portion 401 are arranged so as to three-dimensionally cross the rails of the fixed portion 301.

[0118] The laser processing head 10A is attached to the attachment portion 305 of the moving mechanism 300. The laser processing head 10A irradiates laser light to the object 100 supported by the support portion 7 in a state of facing the support portion 7 in the Z direction. The laser light emitted from the laser processing head 10A is guided from a light source unit (not shown) by the optical fiber 2. The laser processing head 10B is attached to the attachment portion 306 of the moving mechanism 300. The laser processing head 10B irradiates laser light to the object 100 supported by the support portion 7 in a state of facing the support portion 7 in the Z direction. The laser light emitted from the laser processing head 10B is guided from the light source unit (not shown) by the optical fiber 2.

[0119] The laser processing head 10C is attached to the attachment portion 405 of the moving mechanism 400. The laser processing head 10C irradiates laser light to the object 100 supported by the support portion 7 in a state of facing the support portion 7 in the Z direction. The laser light emitted from the laser processing head 10C is guided from a light source unit (not shown) by the optical fiber 2. The laser processing head 10D is attached to the attachment portion 406 of the moving mechanism 400. The laser processing head 10D irradiates laser light to the object 100 supported by the support portion 7 in a state of facing the support portion 7 in the Z direction. The laser light emitted from the laser processing head 10D is guided from the light source unit (not shown) by the optical fiber 2.

[0120] Figure 8 The structure of the pair of laser processing heads 10A, 10B in the laser processing apparatus 1 shown is the same as that of the pair of laser processing heads 10A, 10B in the laser processing apparatus 1 shown in FIG. 1. Figure 1 The structure of the pair of laser processing heads 10A, 10B in the laser processing apparatus 1 shown is the same as that of the pair of laser processing heads 10A, 10B in the laser processing apparatus 1 shown in FIG. 1. Figure 8 The structure of the pair of laser processing heads 10C, 10D in the laser processing apparatus 1 shown is the same as that of the pair of laser processing heads 10C, 10D in the laser processing apparatus 1 shown in FIG. 1. Figure 1 The structure of the pair of laser processing heads 10A, 10B in the laser processing apparatus 1 shown is the same as that of the pair of laser processing heads 10A, 10B in the laser processing apparatus 1 shown in FIG. 1.

[0121] For example, the frame (first frame) 11 of the laser processing head 10C is attached to the attachment portion 65 in a manner that the fourth wall portion 24 is positioned on the laser processing head 10D side with respect to the third wall portion 23, and the sixth wall portion 26 is positioned on the support portion 7 side with respect to the fifth wall portion 25. In addition, the frame (second frame) 11 of the laser processing head 10D is attached to the attachment portion 66 in a manner that the fourth wall portion 24 is positioned on the laser processing head 10C side with respect to the third wall portion 23, and the sixth wall portion 26 is positioned on the support portion 7 side with respect to the fifth wall portion 25.

[0122] In addition, the laser processing head and the laser processing apparatus of the present application are not limited to be used for forming a modified region in the inside of the object 100, and can be used for performing other laser processing.

[0123] Finally, an example of the operation of the laser processing apparatus 1 will be described. One example of the operation of the laser processing apparatus 1 is as follows. In the object 100, a plurality of lines extending in the X direction and arranged in the Y direction are set. In this state, the control section 9 performs the first scan processing of scanning the laser L1 in the X direction with respect to one line and the second scan processing of scanning the laser L2 in the X direction with respect to another line in a manner repeated at least in part of the time. In particular, the control section 9 can sequentially perform the first scan processing from the line at the end portion of the object 100 in the Y direction toward the line inside in the Y direction and sequentially perform the second scan processing from the line at the end portion of the object 100 in the Y direction toward the line inside in the Y direction. Thereby, it is possible to seek the improvement of the throughput.

[0124] One example of the operation of the laser processing apparatus 1 is as follows. In the laser processing apparatus 1, the control section 9 performs the first scan processing of causing the focal point of the laser L1 to be located at the first position in the Z direction and scanning the laser L1 in the X direction with respect to one line on which the laser processing heads 10A, 10B are arranged in the first state and the second scan processing of causing the focal point of the laser L2 to be located at the second position in the Z direction (a position closer to the incident surface side than the first position) and scanning the laser L2 in the X direction with respect to the one line in the first state. At this time, the control section 9 sets the focal point of the laser L2 at a position separated from the focal point of the laser L1 in the opposite direction of the X direction by a prescribed distance or more and performs the first scan processing and the second scan processing. The prescribed distance is, for example, 300 μm. Thereby, it is possible to improve the throughput and to sufficiently progress the cracking from the modified region.

[0125] One example of the operation of the laser processing apparatus 1 is as follows. The control section 9 performs the first scan processing of scanning the laser L1 in the X direction with respect to one line and the second scan processing of scanning the laser L2 in the X direction with respect to another line in a manner repeated at least in part of the time and, when only the second scan processing is performed, performs the imaging processing of imaging the region of the object 100 including the line on which the processing is completed by the imaging unit set to be movable together with the laser processing head 10A. In the imaging processing, light (for example, light in the near infrared region) transmitted through the object 100 is used. Thereby, it is possible to confirm the success or failure of the laser processing in a non-destructive manner using the time in which the first scan processing is not performed.

[0126] One example of the operation of the laser processing apparatus 1 is described below. The laser processing apparatus 1 performs a peeling process of peeling a portion in the object 100. For example, in the peeling process, by rotating the support portion 7 while irradiating the laser Ll, L2 from the laser processing heads 10A, 10B, respectively, and controlling the movement of the condensing points of the laser Ll, L2 in the horizontal direction, respectively, a modified region is formed in the inside of the object 100 along an imaginary plane. As a result, a portion of the object 100 can be peeled with the modified region along the imaginary plane as a boundary.

[0127] One example of the operation of the laser processing apparatus 1 is described below. The laser processing apparatus 1 performs a peeling process of peeling a portion in the object 100. For example, in the peeling process, by rotating the support portion 7 while irradiating the laser Ll, L2 from the laser processing heads 10A, 10B, respectively, and controlling the movement of the condensing points of the laser Ll, L2 in the horizontal direction, respectively, a modified region is formed in the inside of the object 100 along an imaginary plane. As a result, a portion of the object 100 can be peeled with the modified region along the imaginary plane as a boundary.

[0128] One example of the operation of the laser processing apparatus 1 is described below. The laser processing apparatus 1 performs a peeling process of peeling a portion in the object 100. For example, in the peeling process, by rotating the support portion 7 while irradiating the laser Ll, L2 from the laser processing heads 10A, 10B, respectively, and controlling the movement of the condensing points of the laser Ll, L2 in the horizontal direction, respectively, a modified region is formed in the inside of the object 100 along an imaginary plane. As a result, a portion of the object 100 can be peeled with the modified region along the imaginary plane as a boundary.

[0129] The structures in the above-described embodiments are not limited to the above-described materials and shapes, and various materials and shapes can be applied. In addition, the structures in one embodiment or modified example described above can be arbitrarily applied to the structures in other embodiments or modified examples.

[0130] Explanation of Symbols

[0131] 1 … laser processing apparatus, 7 … support portion, 8 … light source unit, 10A, 10B, 10C, 10D … laser processing head (1st laser processing head, 2nd laser processing head), 11 … frame (1st frame, 2nd frame), 12 … incidence portion, 13 … laser adjustment portion, 14 … condensing portion, 14a … incidence pupil plane, 15 … dichroic mirror, 16 … measurement portion, 17 … observation portion, 18 … drive portion, 19 … circuit portion, 21 … 1st wall portion, 22 … 2nd wall portion, 23 … 3rd wall portion, 24 … 4th wall portion, 25 … 5th wall portion, 26 … 6th wall portion, 29 … partition wall portion, 31 … reflection portion (1st reflection portion), 32 … attenuator, 33 … optical axis adjustment portion, 34 … beam expander, 35 … reflection portion (2nd reflection portion), 36 … reflection-type spatial light modulator, 36a … reflection surface, 37 … imaging optical system, 65, 66, 305, 306, 405, 406 … mounting portion (1st mounting portion, 2nd mounting portion).

Claims

1. A laser processing head, wherein, have: The frame has a first wall portion and a second wall portion that are opposite to each other in a first direction, a third wall portion and a fourth wall portion that are opposite to each other in a second direction that is perpendicular to the first direction, and a fifth wall portion and a sixth wall portion that are opposite to each other in a third direction that is perpendicular to the first direction and the second direction. An incident portion, which is disposed in the fifth wall portion, allows the laser to be incident into the frame; A laser adjustment unit, disposed within the frame, adjusts the laser light incident from the incident part; and A focusing section, disposed on the sixth wall portion, focuses the laser beam adjusted by the laser adjustment section and emits it outwards from the frame. The laser adjustment unit has an optical axis adjustment unit for adjusting the optical axis of the laser incident from the incident unit. The incident portion is biased toward the first wall portion side in the first direction. The light-concentrating part is biased towards the second wall part in the first direction. The laser adjustment unit also includes a first reflector, an attenuator, a beam expander, a second reflector, a reflective spatial light modulator, and an imaging optical system. The first reflector reflects the laser light incident from the incident portion toward the second wall portion. The attenuator adjusts the output of the laser light reflected by the first reflector. The optical axis adjustment unit adjusts the reflection of the output laser toward the sixth wall side via the attenuator. The beam expander enlarges the diameter of the laser light reflected by the optical axis adjustment unit. The second reflector reflects the laser beam, whose diameter has been expanded by the beam expander, toward the first wall side and the fifth wall side. The reflective spatial light modulator modulates the laser light reflected by the second reflector and reflects it toward the sixth wall side. The imaging optical system constitutes a telecentric optical system on both sides of the reflecting surface of the reflective spatial light modulator and the entrance pupil surface of the focusing part in an imaging relationship.

2. The laser processing head as described in claim 1, wherein, The distance between the third wall portion and the fourth wall portion is smaller than the distance between the first wall portion and the second wall portion. The frame is configured such that at least one of the first wall portion, the second wall portion, the third wall portion, and the fifth wall portion is disposed on the mounting portion side of the laser processing apparatus, and the frame is mounted to the mounting portion. The incident portion and the focusing portion are biased toward the fourth wall portion in the second direction.

3. The laser processing head as described in claim 2, wherein, It also includes: a circuit section, which is disposed on the side of the third wall section relative to the laser adjustment section within the frame.

4. The laser processing head as described in claim 3, wherein, Within the frame, a partition wall is provided that divides the area within the frame into a region on the third wall side and a region on the fourth wall side. The laser adjustment unit is located within the frame and is positioned on the side of the fourth wall relative to the spacer wall. The circuit section is located within the frame and is positioned on the side of the third wall relative to the spacer wall section.

5. The laser processing head as described in claim 4, wherein, The laser adjustment unit is installed on the spacer wall.

6. The laser processing head as described in claim 4, wherein, The circuit section is separated from the spacer wall section.

7. The laser processing head as described in claim 5, wherein, The circuit section is separated from the spacer wall section.

8. The laser processing head according to any one of claims 3 to 7, wherein, It also has: A measuring unit outputs measuring light for measuring the distance between the surface of an object and the focusing unit, and detects the measuring light reflected by the surface of the object via the focusing unit; and A dichroic mirror reflects the measuring light, allowing the laser beam to pass through. The circuit section processes the signal output from the measurement section. The dichroic mirror is located within the frame and is positioned between the laser adjustment section and the focusing section.

9. The laser processing head as described in claim 8, wherein, The measuring part is located within the frame and is positioned on the side of the first wall portion relative to the light-concentrating part.

10. The laser processing head as claimed in claim 8, wherein, It also includes: an observation unit that outputs observation light for observing the surface of an object, and detects the observation light reflected by the surface of the object via the focusing unit. The observation section is located within the frame and is positioned on the side of the first wall relative to the light-focusing section.

11. The laser processing head as claimed in claim 8, wherein, It also includes: a driving unit that moves the focusing unit along the third direction. The circuit section controls the drive section based on the signal output from the measurement section.

12. A laser processing apparatus, wherein, have: The first laser processing head and the second laser processing head are respectively the laser processing head according to any one of claims 1 to 7; The first mounting portion of the frame on which the first laser processing head is mounted; The second mounting portion of the frame on which the second laser processing head is mounted; A light source unit that outputs laser light incident on the incident portion of the first laser processing head and the incident portion of the second laser processing head, respectively; and The support component, which supports the object. The first mounting part and the second mounting part move along the second direction respectively. The first frame, which serves as the housing of the first laser processing head, is mounted on the first mounting portion such that the fourth wall portion of the first frame is located on the side of the second laser processing head relative to the third wall portion of the first frame, and the sixth wall portion of the first frame is located on the side of the support portion relative to the fifth wall portion of the first frame. The second frame, which is the frame of the second laser processing head, is mounted on the second mounting part in such a manner that the fourth wall portion of the second frame is located on the side of the first laser processing head relative to the third wall portion of the second frame, and the sixth wall portion of the second frame is located on the side of the support portion relative to the fifth wall portion of the second frame.

13. The laser processing apparatus as described in claim 12, wherein, The first mounting part and the second mounting part move along the third direction respectively.

14. The laser processing apparatus as described in claim 12, wherein, The support moves along the first direction and rotates about an axis parallel to the third direction as its center line.

15. A laser processing apparatus, wherein, have: The laser processing head according to any one of claims 1 to 7; The mounting portion of the frame on which the laser processing head is mounted; A light source unit that outputs laser light incident on the incident portion of the laser processing head; and The support component, which supports the object. The mounting part moves along the second direction.

16. The laser processing apparatus as described in claim 15, wherein, The mounting part moves along the third direction.

17. The laser processing apparatus as described in claim 15, wherein, The support moves along the first direction and rotates about an axis parallel to the third direction as its center line.

18. The laser processing apparatus as claimed in claim 16, wherein, The support moves along the first direction and rotates about an axis parallel to the third direction as its center line.

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