Display device

Abstract

Some embodiments of the present disclosure provide a display device, which includes a plurality of pixels, and one of the plurality of pixels includes a color conversion layer. The plurality of pixels also includes a dielectric layer disposed on the color conversion layer. Among them, the refractive index of the dielectric layer is less than the refractive index of the color conversion layer.

Description

[0001] This application is a divisional application of the Chinese patent application with the application number of "201810146834.1", the filing date of February 12, 2018, and the invention title of "Display Device" Technical Field

[0002] The present disclosure relates to a display device, and more particularly to a display device with high transmittance or wide color gamut. Background Art

[0003] With the development of digital technology, display devices have been widely used in various aspects of daily life. For example, they have been widely used in modern information devices such as televisions, notebooks, computers, mobile phones, or smart phones, and display devices are constantly evolving towards being thinner, lighter, shorter, higher in brightness, higher in chromaticity, or more fashionable. Such display devices include, for example, light-emitting diode display devices.

[0004] Currently, the display device industry is moving towards mass production, and any reduction in the production cost or manufacturing process steps of a display device can bring huge economic benefits. However, current display devices are not satisfactory in all aspects.

[0005] Therefore, there is still a need in the industry for a display device that can further improve display quality (including brightness or color gamut) or reduce manufacturing costs or process complexity. Summary of the Invention

[0006] Some embodiments of the present disclosure provide a display device, which includes a plurality of light-emitting diodes, a plurality of pixels, a first light-shielding layer, and a second light-shielding layer. The plurality of pixels correspond to the plurality of light-emitting diodes, and one of the plurality of pixels includes a color filter layer. The first light-shielding layer defines a plurality of first openings, and the color filter layer of one of the plurality of pixels is disposed within one of the plurality of first openings. The second light-shielding layer defines a plurality of second openings, and one of the plurality of light-emitting diodes is disposed within one of the plurality of second openings, and the first light-shielding layer and the second light-shielding layer at least partially overlap.

[0007] Some embodiments of the present disclosure provide a display device, which includes a plurality of light-emitting diodes, a color conversion layer, a color filter layer, a first light-shielding layer, a second light-shielding layer, and a material layer. The color conversion layer is located above one of the plurality of light-emitting diodes. The color filter layer is located above the color conversion layer. The first light-shielding layer defines a plurality of first openings, and the color conversion layer is disposed within one of the plurality of first openings. The first light-shielding layer and the second light-shielding layer at least partially overlap. The material layer is disposed between the first light-shielding layer and the second light-shielding layer, and the material layer overlaps at least two of the plurality of light-emitting diodes. Brief Description of the Drawings

[0008] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the specific embodiments of the present invention is provided in conjunction with the accompanying drawings, wherein:

[0009] Figure 1 Schematic cross-sectional view of a display device according to some embodiments of the present disclosure;

[0010] Figure 2 Schematic cross-sectional view of a light-emitting diode according to some embodiments of the present disclosure;

[0011] Figure 3 Drawing showing the transmittance corresponding to wavelengths of light after passing through red, green, and yellow filter layers according to some embodiments;

[0012] Figure 4 Schematic cross-sectional view of a display device according to some embodiments of the present disclosure;

[0013] Figure 5 Schematic cross-sectional view of a display device according to some embodiments of the present disclosure;

[0014] Figure 6 According to some embodiments of the present disclosure, such as Figure 5 Schematic cross-sectional view of the liquid crystal substrate shown;

[0015] Figures 7 - 17 Schematic cross-sectional view of a display device according to some embodiments of the present disclosure;

[0016] Figures 18A - 18B Schematic cross-sectional view of the process of forming a layer film between spacer layers according to some embodiments of the present disclosure;

[0017] Figures 19A - 19C Schematic cross-sectional view of the process of forming a material layer between spacer layers according to some embodiments of the present disclosure;

[0018] Figures 20A - 20B Schematic cross-sectional view of the process of forming a material layer between spacer layers according to some embodiments of the present disclosure.

[0019] Symbol Explanation:

[0020] 100A - 100N ~ Display device

[0021] 102 ~ Substrate

[0022] 104 ~ Light-shielding layer

[0023] 106 ~ Blue filter layer

[0024] 108 ~ Blue color conversion layer

[0025] 110 ~ Yellow filter layer

[0026] 112 ~ Green color conversion layer

[0027] 114 ~ Yellow filter layer

[0028] 116 - Red color conversion layer

[0029] 118 - Adhesive layer

[0030] 120 - Light - shielding layer

[0031] 122 - Light - emitting diode

[0032] 123 - Filler

[0033] 124 - Semiconductor layer

[0034] 126 - Light - emitting layer

[0035] 128 - Semiconductor layer

[0036] 130 - Conductive pad

[0037] 132 - Conductive pad

[0038] 134 - Protective layer

[0039] 136 - Conductive layer

[0040] 137 - Substrate

[0041] 138 - Filling layer

[0042] 140 - Liquid crystal display element

[0043] 142 - First element layer

[0044] 144 - Display layer

[0045] 146 - Second element layer

[0046] 148 - Dielectric layer

[0047] 150 - Green filter layer

[0048] 152 - Red filter layer

[0049] 154 - Sealant layer

[0050] 156 - Spacer element

[0051] 158 - Air

[0052] 160 - Short - wavelength filter layer

[0053] 200 - Substrate

[0054] 202 - Spacer layer

[0055] 204 - Material layer

[0056] 206 - Bottom layer

[0057] 208 - Plasma process

[0058] 210 - Spacing structure

[0059] 400 - Nozzle

[0060] 402 - Spraying material Specific embodiments

[0061] The following provides a detailed description of the element substrate, display device, and manufacturing method of the display device for some embodiments of the present disclosure. It should be understood that the following description provides many different embodiments for implementing different aspects of the display device of the present disclosure. The elements or element arrangements described below are only used to simply and clearly describe some embodiments of the present disclosure, and are only used for illustration rather than limitation of the present disclosure. In different embodiments, repeated reference numerals or signs may be used, only for simply describing some embodiments of the present disclosure, and do not represent any correlation between the different embodiments and / or structures discussed. When a first material layer is located on or above a second material layer, it may include the case where the first material layer is in direct contact with the second material layer. Alternatively, one or more other material layers may be interposed between the first material layer and the second material layer, and in this case, the first material layer and the second material layer may not be in direct contact.

[0062] In addition, relative terms such as "lower" or "bottom" and "higher" or "top" may be used in the embodiments to describe the relative relationship of one element of the drawing to another element. It can be understood that if the device of the drawing is flipped so that it is upside down, the element described on the "lower" side will become the element on the "higher" side.

[0063] Here, the terms "about", "approximately", "substantially" generally mean within 20% of a given value or range, preferably within 10%, and more preferably within 5%, or 3%, or 2%, or 1%, or 0.5%. The quantity given here is an approximate quantity, that is, the meaning of "about", "approximately", "substantially" may still be implied even without specifically stating "about", "approximately", "substantially".

[0064] It can be understood that although the terms "first", "second", "third", etc. may be used here to describe various elements, components, regions, layers, and / or parts, these terms are only used to distinguish different elements, components, regions, layers, and / or parts. Therefore, a first element, component, region, layer, and / or part discussed below may be referred to as a second element, component, region, layer, and / or part without departing from the teachings of some embodiments of the present disclosure.

[0065] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be understood that such terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the context of the relevant art and this disclosure, and should not be interpreted in an idealized or overly formal manner unless specifically defined in an embodiment of this disclosure.

[0066] Some embodiments of the present disclosure may be accompanied by attached Figure One It is understood that the accompanying drawings of the embodiments of the present disclosure are also regarded as part of the description of the embodiments of the present disclosure. It should be noted that the accompanying drawings of the embodiments of the present disclosure are not drawn to the scale of actual devices or elements. The shapes and thicknesses of the embodiments may be exaggerated in the drawings to clearly show the features of the embodiments of the present disclosure. In addition, the structures and devices in the drawings are shown in a schematic manner to clearly show the features of the embodiments of the present disclosure.

[0067] In some embodiments of the present disclosure, relative terms such as "lower", "upper", "horizontal", "vertical", "below", "above", "top", "bottom", etc. should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. Such relative terms are only for convenience of description and do not mean that the devices described need to be manufactured or operated in a specific orientation. Regarding terms related to joining and connecting, such as "connected" and "interconnected", unless specifically defined, may mean that two structures are in direct contact, or may also mean that two structures are not in direct contact and there are other structures disposed between the two structures. And such terms related to joining and connecting may also include the cases where both structures are movable or both structures are fixed.

[0068] It is worth noting that, hereinafter, the term "substrate" may include elements formed on the substrate or various film layers covering the substrate. For example, any desired number of active elements (transistor elements) may have been formed thereon. However, for the sake of simplicity of the drawings, only a flat substrate is shown herein.

[0069] The thickness of a structure described in these embodiments of the present disclosure represents the average thickness of the structure after removing outliers. An outlier may be the thickness of an edge, an obvious micro-groove, or an obvious micro-protrusion region. After removing these outliers, most of the thickness values of the structure are within the range of plus or minus three standard deviations of the average thickness.

[0070] Refer to Figure 1Schematic cross-sectional view of a display device 100A according to some embodiments of the present disclosure. The display device 100A includes blue pixels B, green pixels G, and red pixels R, which can emit light of different wavelengths respectively. In some embodiments, the display device 100A may include other pixels, such as infrared pixels or white pixels, which are not limited herein.

[0071] In some embodiments, the display device 100A includes a substrate 102, which can be used as a protective element or a packaging element of the display device 100A, for example, to prevent material layers or components such as a light filter layer, a dielectric layer, a color conversion layer, or a display layer from being physically or chemically damaged. The substrate 102 can be, for example, a transparent substrate, such as glass, ceramic, plastic, or any other suitable substrate, but not limited thereto. The substrate 102 may, for example, include phosphosilicate glass (PSG), borophosphosilicate glass (BPSG), silicon oxide, silicon nitride, silicon oxynitride, or a dielectric material with a high dielectric constant, or a combination of the above, but not limited thereto. This dielectric material with a high dielectric constant can be a metal oxide, a metal nitride, a metal silicide, a transition metal oxide, a transition metal nitride, or a combination of the above, but not limited thereto.

[0072] In some embodiments, the display device 100A includes a light-shielding layer 104, which is disposed on the substrate 102 and correspondingly disposed between two adjacent pixels. As Figure 1 shown, the patterned light-shielding layer 104 defines a plurality of openings, and these openings can distinguish or define different pixels, such as blue pixels B, green pixels G, or red pixels R. In addition, the light-shielding layer 104 can be used to shield, for example, areas or components in the display device 100A that are not used for color display, such as to shield scan lines, data lines, or thin-film transistors, etc. The material of this light-shielding layer 104 can be, for example, a black photoresist, black printing ink, black resin, or other suitable light-shielding materials. The light-shielding material can, for example, prevent light from penetrating, but is not limited to light absorption, and can also be a light-shielding material with high reflection characteristics, such as a white and reflective material, or is not limited to a single material. In some embodiments, the light-shielding layer 104 can be, for example, a multi-layer material structure with a high-reflection characteristic material (such as a metal or white ink) or a high-light-absorption characteristic material (such as black ink or black photoresist) on the periphery, but the intermediate layer is transparent or other materials, etc., but not limited thereto.

[0073] In some embodiments, as Figure 1As shown, a color conversion layer or a color filter layer may be included in each pixel (e.g., blue pixel B, green pixel G, red pixel R). For example, the blue color filter layer 106 and the blue color conversion layer 108 provided on the blue color filter layer 106 are correspondingly formed in the blue pixel B, the yellow color filter layer 110 and the green color conversion layer 112 provided on the yellow color filter layer 110 are correspondingly formed in the green pixel G, and the yellow color filter layer 114 and the red color conversion layer 116 provided on the yellow color filter layer 114 are correspondingly formed in the red pixel R.

[0074] The color filter layer can allow light of a specific wavelength to pass through. For example, the blue color filter layer can allow light with a wavelength between about 400 nm - 500 nm to pass through, the green color filter layer can allow light with a wavelength between about 500 nm - 570 nm to pass through, and the red color filter layer can allow light with a wavelength between about 620 nm - 750 nm to pass through. However, the above color filter layers and their corresponding light wavelength ranges that can pass through are only examples and are not limitations of this case.

[0075] In some embodiments, as Figure 1 shown, the yellow color filter layer 110 and the yellow color filter layer 114 may be respectively provided in the corresponding green pixel G or red pixel R. The yellow color filter layer 110 and the yellow color filter layer 114 may be manufactured by the same or different processes. That is to say, when the yellow color filter layer 110 and the yellow color filter layer 114 are manufactured by different processes, the thicknesses of the yellow color filter layer 110 and the yellow color filter 114 may be different. Refer to Figure 3 , Figure 3 is a drawing showing the light transmittance of light passing through red, green, and yellow color filter layers respectively against wavelength according to some embodiments. Band 302 represents the light passing through the yellow color filter layer, and its transmittance spectrum corresponding to different wavelengths; band 304 represents the light passing through the green color filter layer, and its transmittance spectrum corresponding to different wavelengths; band 306 represents the light passing through the red color filter layer, and its transmittance spectrum corresponding to different wavelengths. As Figure 3 shown, the yellow color filter layer has a light transmittance greater than 95% for light with a wavelength in the range of about 500 - 780 nm. The light transmittance of the green color filter layer for light with a wavelength in the range of about 500 - 570 nm is less than that of the yellow color filter layer. Therefore, using the yellow color filter layer instead of the green color filter layer helps to improve the light extraction efficiency of the green pixel G.

[0076] And, as Figure 3As shown, the light passing through the yellow filter layer has a light transmittance in the wavelength range of approximately 620 - 750 nm that is substantially equal to the light transmittance of the light passing through the red filter layer, and the light transmittance in the wavelength range of 620 - 750 nm mostly remains at 95%. Therefore, the yellow filter layer can replace the red filter layer. By providing the yellow filter layer in the green pixels G and the red pixels R, the light extraction efficiency can be improved, and the manufacturing process steps of forming the display device 100A can also be simplified (for example, replacing the red filter layer and the green filter layer with a single yellow filter layer process), reducing the manufacturing cost or production time.

[0077] In some embodiments, such as Figure 1 As shown, the blue color conversion layer 108 is correspondingly formed in the blue pixels B, the green color conversion layer 112 is correspondingly formed in the green pixels G, and the red color conversion layer 116 is correspondingly formed in the red pixels R. The blue color conversion layer 108, the green color conversion layer 112, and the red color conversion layer 116 may include, for example, quantum dot films, fluorescent materials, or other light conversion materials. For example, the materials of the blue color conversion layer 108, the green color conversion layer 112, or the red color conversion layer 116 may include an organic layer or an inorganic layer mixed or doped with quantum dots. The quantum dots may include zinc, cadmium, selenium, sulfur, indium phosphide (InP), gallium antimonide (GaSb), gallium arsenide (GaAs), or a combination thereof, without limitation herein. The particle size of the quantum dots is, for example, in the range of about 1 nm to 30 nm. When quantum dots of different particle sizes are excited by light, light of different wavelengths can be converted and generated. For example, quantum dots with a small particle size can excite light with a relatively short wavelength (e.g., blue light), and quantum dots with a large particle size can excite light with a relatively long wavelength (e.g., red light). Therefore, by adjusting the particle size of the quantum dots, light of different wavelengths can be generated to achieve a wide color gamut effect. For example, the blue color conversion layer 108 mixed or doped with quantum dots of a first particle size will generate blue light when excited, the green color conversion layer 112 mixed or doped with quantum dots of a second particle size will generate green light when excited, and the red color conversion layer 116 mixed or doped with quantum dots of a third particle size will generate red light when excited. In other embodiments, the color conversion layer material may also be an organic layer or an inorganic layer mixed or doped with perovskite, without limitation herein. In other embodiments, the color conversion layer material may be a fluorescent material, for example, which can absorb part of the light in the short wavelength range and excite light with a longer wavelength, without limitation herein.

[0078] In addition, in some embodiments, the display device 100A further includes a color conversion enhancement layer (not shown). The color conversion enhancement layer may be disposed, for example, between the filter layer and the color conversion layer. The color conversion enhancement layer may be a material that reflects blue light, which can reflect the unexcited blue light back to the blue color conversion layer 108, the green color conversion layer 112, or the red color conversion layer 116 respectively. In this way, the blue light that has not been completely converted can be excited again by the blue color conversion layer 108, the green color conversion layer 112, or the red color conversion layer 116, improving the light conversion efficiency.

[0079] As Figure 1 shown, the display device 100A includes an adhesive layer 118. The adhesive layer 118 may be used, for example, to adhere the light-emitting units or a substrate having a light-emitting display layer. The material of the adhesive layer 118 may include an optical clear adhesive (OCA), an optical clear resin (OCR), or other suitable transparent adhesive materials, or a combination of the above materials, but is not limited thereto.

[0080] As Figure 1 shown, the display device 100A includes a light-shielding layer 120. The light-shielding layer 120 and the light-shielding layer 104 may substantially overlap each other. For example, the light-shielding layer 120 and the light-shielding layer 104 may completely overlap or partially overlap. The light-shielding layer 120 may define a plurality of openings, and at least one light-emitting diode 122 is correspondingly disposed in the openings, for example. In some embodiments, the material of the light-shielding layer 120 and the material of the light-shielding layer 104 may be the same or similar. In some embodiments, the material of the light-shielding layer 120 and the material of the light-shielding layer 104 may be different, which is not limited herein. In some embodiments, from a cross-sectional view, the shape of the light-shielding layer 120 may be trapezoidal, rectangular, arc-shaped, other suitable shapes, or a combination of the above, but is not limited thereto.

[0081] In some embodiments, as Figure 1As shown, the display device 100A includes a light-emitting diode 122 and a substrate 137. In some embodiments, the light-emitting diode 122 may include a quantum dot (QD), a fluorescence material, a phosphor material, a light-emitting diode (LED), a micro light-emitting diode or a mini light-emitting diode, or other display media, but the present disclosure is not limited thereto. In some embodiments, the chip size of the light-emitting diode is about 300 micrometers (μm) to 10 millimeters (mm), the chip size of the mini light-emitting diode (mini LED) is about 100 micrometers (μm) to 300 micrometers (μm), and the chip size of the micro light-emitting diode (microLED) is about 1 micrometer (μm) to 100 micrometers (μm), but the present disclosure is not limited thereto. In other embodiments, the light-emitting diode 122 may include an organic light-emitting diode (OLED), and the structure of the display device 100A may be appropriately adjusted, but the present disclosure is not limited thereto.

[0082] As Figure 1 shown, the light-emitting diode 122 may be respectively disposed in the blue pixel B, the green pixel G or the red pixel R. As Figure 1 shown, the light-emitting diode 122 is disposed in the opening defined or demarcated by the light-shielding layer 120. The light-emitting diode 122 may be electrically connected to the substrate 137 via the conductive layer 136. In some embodiments, the conductive layer 136 may be a welding material. In addition, the filler 123 may be disposed between the substrate 137 and the adhesive layer 118. In some embodiments, the filler 123 may be, for example, a transparent material, but is not limited thereto. The substrate 137 may contain many circuits (not shown), and the above circuits include, for example, thin-film transistors or other components.

[0083] Referring to Figure 2 , Figure 2 is a cross-sectional schematic diagram of the light-emitting diode 122 according to some embodiments of the present disclosure. As Figure 2As shown, in some embodiments, the light-emitting diode 122 may include a semiconductor layer 124, a light-emitting layer 126, and a semiconductor layer 128. The semiconductor layer 124 and the semiconductor layer 128 may be connected to a conductive pad 130 and a conductive pad 132, respectively. The semiconductor layer 124 and the semiconductor layer 128 may be, for example, elemental semiconductors, including amorphous silicon (amorphous-Si), polycrystalline silicon (poly-Si), germanium; compound semiconductors, including gallium nitride (GaN), silicon carbide, gallium arsenide, gallium phosphide, indium phosphide, indium arsenide, or indium antimonide; alloy semiconductors, including silicon-germanium alloy (SiGe), gallium arsenide phosphide alloy (GaAsP), aluminum gallium arsenide alloy (AlGaAs), gallium indium arsenide alloy (GaInAs), or gallium indium phosphide alloy (GaInP); or metal oxides, including indium gallium zinc oxide (IGZO), indium zinc oxide (IZO); organic semiconductors, including polycyclic aromatic compounds, or a combination of the above materials, and is not limited thereto.

[0084] As Figure 2 shown, the light-emitting layer 126 is disposed between the semiconductor layer 124 and the semiconductor layer 128. The light-emitting layer 126 may, for example, include a homojunction, a heterojunction, a single quantum well (SQW), a multiple quantum well (MQW), or other similar structures. In some embodiments, the light-emitting layer 126 includes undoped n-type In x Ga (1-x) N. In other embodiments, the light-emitting layer 126 may include, for example, other commonly used materials such as Al x In y Ga (1-x-y) N. Additionally, the light-emitting layer 126 may, for example, include a multiple quantum well structure in which multiple well layers (such as InGaN) and barrier layers (such as GaN) are arranged alternately. Furthermore, the light-emitting layer 126 may be formed by methods including metal organic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE), hydride vapor phase epitaxy (HVPE), liquid phase epitaxy (LPE), or other suitable chemical vapor deposition methods, which are not limited herein.

[0085] As Figure 2As shown, the protective layer 134 may be disposed, for example, on the sides of the semiconductor layer 124, the light-emitting layer 126, the semiconductor layer 128, or a part of the conductive pads 130 and 132. In some embodiments, the protective layer 134 may be, for example, a material having reflective characteristics or light-absorbing characteristics, but is not limited thereto. When the protective layer 134 is a material having reflective characteristics, it may include a multi-layer dielectric thin film that is a distributed Bragg reflector (DBR), a hybrid layer material (such as a three-layer material structure of a dielectric layer-metal layer-dielectric layer stack), or an Omni-Directional reflector (ODR), but is not limited thereto. When the protective layer 134 is a material having light-absorbing characteristics, the protective layer 134 may be, for example, a photoresist material (such as a white photoresist or a black photoresist). It should be noted that since it is necessary to avoid a short-circuit phenomenon between the protective layer 134 and other metal layers, at least one layer of the protective layer 134 is a non-conductive material. For example, the surface layer in contact with the conductive pads 130 and 132 is a non-conductive layer material. In some embodiments, the outer surface layer of the protective layer 134 is, for example, a non-conductive material.

[0086] As Figure 2 shown, the conductive pad 130 is disposed adjacent to the semiconductor layer 128, and the conductive pad 132 is disposed adjacent to the semiconductor layer 124. The materials of the conductive pads 130 and 132 may include copper, aluminum, molybdenum, tungsten, gold, chromium, nickel, platinum, titanium, iridium, rhodium, alloys thereof, combinations thereof, or other metal materials with good electrical conductivity.

[0087] In addition, as Figure 2 shown, the light-emitting diode 122 includes a conductive layer 136. The conductive layer 136 may be used, for example, to electrically connect the light-emitting diode 122 or other substrates (not shown) having electronic components or circuits. The conductive layer 136 may be, for example, a low-melting-point alloy material. In some embodiments, the conductive layer 136 may be a eutectic material having a melting point less than 300°C, such as a tin-indium alloy, a tin-zinc alloy, a tin-silver alloy, a gold-indium alloy, a gold-tin alloy, or other suitable materials. In some embodiments, the conductive layer 136 may be a multi-layer stacked structure, such as: a copper / nickel / gold or copper / nickel / palladium / gold structure, etc., which is not limited herein.

[0088] In some embodiments, the light-emitting diode 122 may be formed using flip-chip technology. In addition, the light-emitting diode 122 may be a lateral structure or a vertical structure, which is not limited herein. When the light-emitting diode is a lateral structure, the two electrodes of the light-emitting diode are, for example, disposed on the same side of the light-emitting diode. When the light-emitting diode is a vertical structure, the two electrodes of the light-emitting diode are, for example, disposed on two sides of the light-emitting diode, respectively.

[0089] The above substrate with electronic components is an integrated circuit substrate electrically connected to a light-emitting unit. This integrated circuit is, for example, a microprocessor, a memory element, and / or other elements. The integrated circuit may also include different passive and active components, such as resistors, or other types of capacitors, which are not limited herein.

[0090] Various changes and adjustments can be made in the embodiments of the present disclosure. Refer to Figure 4 FIG. 6 is a cross-sectional schematic view of a display device 100B according to some embodiments. The display device 100B may be similar to the display device 100A described above, except that a filling layer 138 is used to replace the blue color conversion layer 108 in the corresponding blue pixel B of the display device 100B. In some embodiments, the light-emitting diode 122 can emit blue light, so the blue color conversion layer 108 can be replaced, for example, by the filling layer 138. The material of the filling layer 138 may be, for example, a material with a high refractive index or high diffusivity. The material of the filling layer 138 may, for example, include silicone, epoxy resin, polymethyl methacrylate, polycarbonate, or other suitable composite materials, and is not limited thereto.

[0091] Various changes and adjustments can be made in the embodiments of the present disclosure. Refer to Figure 5 FIG. 7 is a cross-sectional schematic view of a display device 100C according to some embodiments. The display device 100C may be similar to the display device 100A described above, except that a liquid crystal display element 140 is disposed under the adhesive layer 118. And in some embodiments, the adhesive layer 118 may even not be required, which is not limited herein.

[0092] In some embodiments, the liquid crystal display element 140 is an element including an LCD (liquid crystal display). Refer to Figure 6Schematic cross-sectional view of a liquid crystal display element 140 according to some embodiments. The liquid crystal display element 140 at least includes a first element layer 142, a display layer 144, and a second element layer 146. In other embodiments, the liquid crystal display element 140 may include other elements. In some embodiments, the first element layer 142 may include an upper polarizer layer (not shown), and the upper polarizer layer may be, for example, a metal periodic nanostructure formed by nano imprinting, but not limited thereto. This upper polarizer layer is an in-cell polarizer. Among them, nano imprinting may be, for example, through thermoplastic nanoimprint lithography, resist-free direct thermal nanoimprint lithography, or photo nanoimprint lithography, etc., but not limited thereto.

[0093] In some embodiments, the display layer 144 is disposed between the first element layer 142 and the second element layer 146. The first element layer 142 and the second element layer 146 include some circuits or alignment layers (polyimide layer, etc.) (not shown). By controlling the arrangement state of the liquid crystal molecules in the display layer 144 to be different, the light has different polarization or refraction characteristics to control the penetration amount of light, achieving different gray levels. The display layer 144 can be combined with the structural design of the electrodes or the alignment method of the alignment layer, so that the display layer 144 can be applied to different liquid crystal modes, such as twisted nematic (TN) liquid crystal, super twisted nematic (STN) liquid crystal, vertical alignment (VA) liquid crystal, in-plane switching (IPS) liquid crystal, cholesteric liquid crystal, blue phase liquid crystal, fringe field switching (FFS) liquid crystal, or any other suitable liquid crystal.

[0094] In some embodiments, the second element layer 146 includes a lower polarizing layer (not shown), and the display layer 144 can be disposed, for example, between the upper polarizing layer and the lower polarizing layer. The lower polarizing layer can include, for example, a protective film, tri-acetate cellulose (TAC), polyvinyl alcohol (PVA), tri-acetate cellulose (TAC), pressure-sensitive adhesive (PSA), release film, and other structures. The polyvinyl alcohol (PVA) of the polarizing substrate is pasted with tri-acetate cellulose (TAC) on both sides to form a transparent substrate, which is used to support or protect the polarizing substrate or prevent the polarizing substrate from retracting, but is not limited thereto. The lower polarizing layer can be directly pasted to the substrate (not shown) of the second element layer 146. By arranging the liquid crystal molecules passing through the display layer 144 and matching the arrangement of the transmission axes of the upper polarizing layer and the lower polarizing layer, the amount of light transmission is controlled. A backlight module (not shown) can be further disposed under the second element layer 146.

[0095] In some embodiments, the second element layer 146 can include, for example, thin film transistors (TFTs). The material of the electrodes can be copper, aluminum, tungsten, gold, chromium, nickel, platinum, titanium, alloys of the above, or indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), antimony zinc oxide (AZO), combinations of the above, or any other suitable transparent conductive oxide material, and is not limited thereto.

[0096] The second element layer 146 can include, for example, a substrate, and the substrate can be, for example, a glass substrate, a plastic substrate, or other suitable substrates. The material of the substrate can include, for example, glass, quartz, organic polymers, inorganic polymers, or metals, etc. The material of the substrate includes silicon dioxide, phosphosilicate glass (PSG), low dielectric constant dielectric materials, or other suitable dielectric materials. The low dielectric constant dielectric materials include fluorinated silica glass (FSG), carbon doped silicon oxide, parylene, polyimide, combinations of the above, or other suitable materials, and are not limited thereto. In some embodiments, the second element layer can include, for example, a gate driving circuit, a data driving circuit, a demultiplexer, or other elements, and is not limited thereto.

[0097] Various changes and adjustments can be made in the embodiments of the present disclosure. Refer to Figure 7FIG. 0 is a cross-sectional schematic diagram of a display device 100D according to some embodiments. The display device 100D may be similar to the display device 100A described above, with the difference that the display device 100D further includes a dielectric layer 148. In some embodiments, the dielectric layer 148 may be correspondingly disposed between the color conversion layer and the filter layer. For example, in the corresponding blue pixel B, the dielectric layer 148 is disposed between the blue filter layer 106 and the blue color conversion layer 108. Similarly, the dielectric layer 148 may also be correspondingly disposed in the color pixel G or the color pixel B. In some embodiments, the refractive index of the dielectric layer 148 is less than the refractive index of the color conversion layer. In some embodiments, the refractive index of the dielectric layer 148 is less than the refractive index of the filter layer. In some embodiments, the difference between the refractive index (n1) of the dielectric layer 148 and the refractive index (n2) of the color conversion layer or the refractive index (n3) of the color conversion layer is approximately greater than or equal to 0.05 and less than or equal to 1 (0.05 ≦ n2 - n1 ≦ 1; 0.05 ≦ n3 - n1 ≦ 1). For example, the difference between the refractive index of the blue color conversion layer 108, the green color conversion layer 112, or the red color conversion layer 116 and the refractive index of the dielectric layer 148 is respectively approximately greater than or equal to 0.05 and less than or equal to 1.

[0098] Providing a dielectric material with a refractive index less than that of the filter layer and / or the color conversion layer between the filter layer and the color conversion layer can increase the chance of light being redirected back to the color conversion layer and being excited and converted again, thereby improving the color conversion efficiency of the light. In some embodiments, the dielectric layer 148 may include aluminum gallium nitride (AlGaN), gallium nitride (GaN), silicon dioxide (SiO2), optical resin, epoxy resin, silicone resin, and is not limited thereto.

[0099] Various changes and adjustments can be made in the embodiments of the present disclosure. In some embodiments, as Figure 7 shown, the blue color conversion layer 108 can be replaced by a filling layer 138 as Figure 4 shown. In some embodiments, as Figure 7 shown, the light-shielding layer 120 and the light-emitting diode 122 (including the components contained in the light-emitting diode 122 as Figure 2 shown) can be replaced by a liquid crystal display element 140 as Figure 6 shown. When it is an embodiment of the liquid crystal display element 140, the adhesive layer 118 can be omitted, but it is not limited.

[0100] Various changes and adjustments can be made in the embodiments of the present disclosure. Refer to Figure 8Schematic cross-sectional view of a display device 100E according to some embodiments. The display device 100E may be similar to the display device 100D described above, with the difference that the yellow filter layer 110 corresponding to the green pixel G is replaced by a green filter layer 150, and the yellow filter layer 114 corresponding to the red pixel R is replaced by a red filter layer 152. As described above, by disposing a dielectric layer between the filter layer and the color conversion layer, the color conversion efficiency of light can be improved. At this time, the color purity of the color can be improved by disposing a green filter layer in the corresponding green pixel G and a red filter layer in the corresponding red pixel R.

[0101] Various changes and adjustments can be made in the embodiments of the present disclosure. In some embodiments, such as Figure 8 the blue color conversion layer 108 shown can be replaced by a filling layer 138 such as Figure 4 shown. In some embodiments, Figure 8 the light-shielding layer 120, the light-emitting diode 122 (including components contained in the light-emitting diode 122 such as Figure 2 shown) can be replaced by a liquid crystal display element 140 such as Figure 6 shown.

[0102] Various changes and adjustments can be made in the embodiments of the present disclosure. Referring to Figure 9 , Figure 9 Schematic cross-sectional view of a display device 100F according to some embodiments. The display device 100F may be similar to the display device 100D described above, with the difference that a dielectric layer 148 can be further disposed between the light-shielding layer 104 and the light-shielding layer 120. As Figure 9As shown, in some embodiments, the color conversion layers (such as the blue color conversion layer 108, the green color conversion layer 112, and the red color conversion layer 116) may be disposed, for example, on the light-emitting diode 122. The color conversion layers (such as the blue color conversion layer 108, the green color conversion layer 112, and the red color conversion layer 116) may be in contact with the light-emitting diode 122, and the blue color conversion layer 108 is separated from the blue filter layer 106, or the yellow filter layer 110 is separated from the green color conversion layer 112, or the yellow filter layer 114 is separated from the red color conversion layer 116 through the dielectric layer 148 respectively. In this embodiment, the dielectric layer 148 may be formed, for example, as a continuous layer structure. The dielectric layer 148 is disposed on the surfaces of the light-shielding layer 120, the blue color conversion layer 108, the green color conversion layer 112, and the red color conversion layer 116, and does not need to be separately separated by the light-shielding layer 120 or the light-shielding layer 104. In this way, the dielectric layer 148 does not require a patterning process, or the adhesive layer 118 may be omitted, making the manufacturing simpler or reducing the cost. And for this manufacturing method of this embodiment, for example, the dielectric layer 148 may be disposed on the substrate 102 on which the blue filter layer 106, the yellow filter layer 110, the yellow filter layer 114, and the light-shielding layer 104 have been formed, and then assembled with the substrate 137 provided with the light-emitting diode 122 (the blue color conversion layer 108, the green color conversion layer 112, and the red color conversion layer 116 have been respectively disposed on the light-emitting diode 122). Here, the manufacturing process sequence of the display device is not limited.

[0103] Various changes and adjustments can be made in the embodiments of the present disclosure. In some embodiments, as Figure 9 shown, the blue color conversion layer 108 can be replaced by a filling layer 138 as Figure 4 shown. In some embodiments, as Figure 9 shown, the light-shielding layer 120, the light-emitting diode 122 (including the components contained in the light-emitting diode 122 as Figure 2 shown) can be replaced by a liquid crystal display element 140 as Figure 6 shown.

[0104] Various changes and adjustments can be made in the embodiments of the present disclosure. Referring to Figure 10 FIG. 18 is a cross-sectional schematic view of a display device 100G according to some embodiments. The display device 100G may be similar to the display device 100F described above, and the difference is that the yellow filter layer 110 correspondingly disposed in the green pixel G is replaced by a green filter layer 150, and the yellow filter layer 114 correspondingly disposed in the red pixel R is replaced by a red filter layer 152.

[0105] Various changes and adjustments can be made in the embodiments of the present disclosure. In some embodiments, as Figure 10 shown, the blue color conversion layer 108 can be replaced by a filling layer 138 as Figure 4replaced by the filling layer 138 shown. At this time, the dielectric layer 148 in the blue pixel B may not need to be provided. That is to say, the dielectric layer 148 is only correspondingly provided in the green pixel G and the red pixel R, for example. In other embodiments, the material of the filling layer 138 may be selected from the same or similar materials as the dielectric layer 148. The material of the filling layer 138 may be selected from materials with different refractive indices from the dielectric layer 148. In some embodiments, such as Figure 10 the light-shielding layer 120 and the light-emitting diode 122 (including components contained in the light-emitting diode 122 as shown in Figure 2 the light-emitting diode 122) may be replaced by Figure 6 the liquid crystal display element 140 shown.

[0106] Various changes and adjustments can be made in the embodiments of the present disclosure. Refer to Figure 11 FIG. 11 is a cross-sectional schematic diagram of a display device 100H according to some embodiments. The display device 100H may be similar to the display device 100G described above, and the difference is that the dielectric layer 148 may be replaced by a spacer element 156 and air (or vacuum layer) 158. In other embodiments, the dielectric layer 148 may be replaced by a spacer element 156, a spacer layer 154, and air (or vacuum layer) 158. As shown in Figure 11 the figure, the spacer element 156 may be disposed between the light-shielding layer 104 and the light-shielding layer 120. The spacer element 156 is, for example, a PhotoSpacer, and the spacer element 156 may include glass, ceramic, plastic, or any other suitable transparent or opaque material, which is not limited herein. In some embodiments, the material of the spacer element 156 may also be similar to or the same as the light-shielding layer 104. In some embodiments, the spacer element 156 may be substantially overlapped with the light-shielding layer 104 or the light-shielding layer 120 in the normal direction of the substrate 102. In some embodiments, the cross-section of the spacer element 156 may, for example, be a trapezoidal, circular, arc-shaped, or rectangular (square or rectangular) contour structure, which is not limited herein. The sealant layer 154 may be disposed around the spacer element 156 to separate or encapsulate multiple groups of green pixels G, red pixels R, and blue pixels B, which is not limited herein. The light-shielding layer 104 and the light-shielding layer 120 may, for example, be used to shield areas or components in the display device 100H that are not used for displaying colors, such as scanning lines (not shown), data lines (not shown), or thin film transistors (not shown), etc.

[0107] In addition, in some embodiments, there may be more air 158 between the color conversion layer (such as the blue color conversion layer 108, the green color conversion layer 112, and the red color conversion layer 116) and the light filtering layer (such as the blue light filtering layer 106, the yellow light filtering layer 110, and the yellow light filtering layer 114). By providing a layer of air 158 with a lower refractive index (the refractive index of air 158 is approximately equal to 1) between the light filtering layer and the color conversion layer, the chance of light being redirected back to the light conversion layer and then being re-excited and converted after passing through the light conversion layer can be increased. In addition, the process or cost of setting a low refractive index material can be omitted, achieving higher economic or man-hour benefits.

[0108] Various changes and adjustments can be made in the embodiments of the present disclosure. In some embodiments, such as Figure 11 the blue color conversion layer 108 shown can be replaced by a filling layer 138 such as Figure 4 shown. In some embodiments, such as Figure 11 the light-shielding layer 120, the light-emitting diode 122 (including components such as Figure 2 those contained in the light-emitting diode 122) shown can be replaced by Figure 6 the liquid crystal display element 140 shown.

[0109] Various changes and adjustments can be made in the embodiments of the present disclosure. Referring to Figure 12 , Figure 12 is a cross-sectional schematic view of a display device 100I according to some embodiments. The display device 100I may be similar to the display device 100H described above, wherein the difference is that the yellow light filtering layer 110 corresponding to the green pixel G is replaced by a green light filtering layer 150, and the yellow light filtering layer 114 corresponding to the red pixel R is replaced by a red light filtering layer 152.

[0110] Various changes and adjustments can be made in the embodiments of the present disclosure. In some embodiments, such as Figure 12 the blue color conversion layer 108 shown can be replaced by a filling layer 138 such as Figure 4 shown. In some embodiments, such as Figure 12 the light-shielding layer 120, the light-emitting diode 122 (including components such as Figure 2 those contained in the light-emitting diode 122) shown can be replaced by Figure 6 the liquid crystal display element 140 shown.

[0111] Various changes and adjustments can be made in the embodiments of the present disclosure. Referring to Figure 13 is a cross-sectional schematic view of a display device 100J according to some embodiments. The display device 100J may be similar to the display device 100D described above, wherein the difference is that the light filtering layer is not correspondingly disposed in the blue pixel B, the green pixel G, or the red pixel R. In this embodiment, the dielectric layer 148 can be in direct contact with the substrate 102.

[0112] Various changes and adjustments can be made in the embodiments of the present disclosure. In some embodiments, such as Figure 13 the blue color conversion layer 108 shown can be replaced by a filling layer 138 such as Figure 4 shown. In some embodiments, such as Figure 13 the light-shielding layer 120, light-emitting diode 122 (including components contained in the light-emitting diode 122) shown can be replaced by Figure 2 the liquid crystal display element 140 shown. Figure 6 shown.

[0113] Various changes and adjustments can be made in the embodiments of the present disclosure. Refer to Figure 14 FIG. 15 is a cross-sectional schematic view of a display device 100K according to some embodiments. The display device 100K may be similar to the display device 100D described above, with the difference that the blue filter layer 106, yellow filter layer 110, and yellow filter layer 114 are replaced by a short-wavelength filter layer 160. The short-wavelength filter layer 160 can, for example, block light with a wavelength below 430 nm, so that the light transmittance of light with a wavelength below 430 nm is, for example, less than 5%. That is to say, when light passes through the blue color conversion layer 108, green color conversion layer 112, or red color conversion layer 116, it can be excited and converted into blue light, green light, and red light respectively. These lights of different colors then further pass through a short-wavelength filter layer 160 to filter out light with a wavelength below 430 nm (such as purple light or near-ultraviolet light).

[0114] In some embodiments, the above-mentioned short-wavelength filter layer 160 can be replaced by a distributed Bragg reflector (DBR). The material of the Bragg reflector can be a non-metallic material, dielectric layer material, optical fiber, or other materials. The Bragg reflector can be composed of multiple layers of films with different refractive indexes and has the function of being a waveguide.

[0115] Various changes and adjustments can be made in the embodiments of the present disclosure. In some embodiments, such as Figure 14 the blue color conversion layer 108 shown can be replaced by a filling layer 138 such as Figure 4 shown. In some embodiments, such as Figure 14 the light-shielding layer 120, light-emitting diode 122 (including components contained in the light-emitting diode 122) shown can be replaced by Figure 2 the liquid crystal display element 140 shown. Figure 6 shown.

[0116] Various changes and adjustments can be made in the embodiments of the present disclosure. Refer to Figure 15FIG. 0 is a cross-sectional schematic view of a display device 100L according to some embodiments. The display device 100L may be similar to the display device 100K described above, with the difference that the short-wavelength filter layer 160 is disposed on the light-shielding layer 104 and between the light-shielding layer 104 and the substrate 102. In this embodiment, the short-wavelength filter layer 160 is disposed on the light-shielding layer 104 and the dielectric layer 148. Various changes and adjustments can be made in the embodiments of the present disclosure. In some embodiments, such as Figure 15 the blue color conversion layer 108 shown in FIG. may be replaced by a filling layer 138 as shown in Figure 4 FIG. In some embodiments, such as Figure 15 the light-shielding layer 120, the light-emitting diode 122 (including components contained in the light-emitting diode 122 as shown in Figure 2 FIG.) shown in FIG. may be replaced by a liquid crystal display element 140 as shown in Figure 6 FIG.

[0117] Various changes and adjustments can be made in the embodiments of the present disclosure. Referring to Figure 16 FIG. 14 is a cross-sectional schematic view of a display device 100M according to some embodiments. The display device 100M may be similar to the display device 100E described above, with the difference that the color conversion layer (e.g., the blue color conversion layer 108, the green color conversion layer 112, and the red color conversion layer 116) is covered by the dielectric layer 148. As shown in Figure 16 FIG., the dielectric layer 148 is further disposed on the sidewalls of the blue color conversion layer 108, the green color conversion layer 112, or the red color conversion layer 116. That is, on the normal line of the substrate 102, the area of the dielectric layer 148 projected on the substrate 102 may be larger than the area of the blue color conversion layer 108, the green color conversion layer 112, or the red color conversion layer 116 projected on the substrate 102. By increasing the contact surface or the contact area between the dielectric layer 148 and the blue color conversion layer 108, the green color conversion layer 112, or the red color conversion layer 116, the opportunity for light to be reverted to the color conversion layer and re-excited and converted can be increased.

[0118] Various changes and adjustments can be made in the embodiments of the present disclosure. In some embodiments, such as Figure 16 the blue color conversion layer 108 shown in FIG. may be replaced by a filling layer 138 as shown in Figure 4 FIG.

[0119] Various changes and adjustments can be made in the embodiments of the present disclosure. Referring to Figure 17 FIG. 29 is a cross-sectional schematic view of a display device 100N according to some embodiments. The display device 100N may be similar to the display device 100E described above, with the difference that the display device 100N includes a reflective layer 162, which is correspondingly disposed between the light-shielding layer 104 and the adhesive layer 118. As shown in Figure 17As shown, the reflective layer 162 may overlap with the light-shielding layer 104 and the light-shielding layer 120 in the normal direction of the substrate 102 (it may be completely overlapped or partially overlapped, and this is not limited herein). The material of the reflective layer 162 may include a metallic material (such as aluminum, gold, silver, copper, titanium, or other metallic materials, or metal alloys, and is not limited thereto), a non-metallic material, a dielectric layer, or a white photoresist. In some embodiments, the material of the reflective layer 162 may be a dielectric layer material such as silicon dioxide (SiO2) or titanium dioxide (TiO2), and its refractive index may be adjusted according to the process conditions or the composition ratio, and is not limited thereto.

[0120] Various changes and adjustments can be made in the embodiments of the present disclosure. In some embodiments, such as Figure 17 shown, the blue color conversion layer 108 can be replaced by a filling layer 138 as Figure 4 shown.

[0121] Referring to Figures 18A - 18B , Figures 18A - 18B is a cross-sectional schematic view of a process of forming a material layer 204 between spacer layers 202 according to some embodiments. When using an inkjet printing process, due to the different surface tension characteristics of the sprayed material between the surfaces of the two materials, the material layer formed by the sprayed material has a problem of uneven thickness. In some cases, for example, the material layer has a protrusion in the middle and depressions on both sides. In other cases, for example, the material layer has depressions and protrusions on both sides. To solve the above problem of uneven thickness of the material layer, the overall or surface of the material in contact with the sprayed material can be modified to control the contact angle between the sprayed material and the surface of the contacted material within an appropriate range, which can improve the thickness uniformity of the sprayed material. In some embodiments, the material of the spacer layer 202 can be, for example, a material with a contact angle with water in the range of about 90° to 150°. In some embodiments, the overall or surface of the material of the spacer layer 202 can, for example, contain fluorine (F) elements or functional groups containing fluorine. In some embodiments, the spacer layer 202 can be, for example, a polymer material, and a fluorine-containing additive is added to make the spacer layer 202 form a fluorine-containing polymer material. In other embodiments, the overall or surface of the material of the spacer layer 202 can, for example, contain other suitable elements to make the contact angle between the spacer layer 202 and water in the range of about 90° to 150°. The so-called "contact angle with water" can be measured by dropping a water droplet on the surface of the spacer layer 202 with a contact anglemeter to measure the contact angle between the water droplet and the spacer layer 202.

[0122] In some embodiments, such as Figure 18AAs shown, a substrate 200 is first provided. The substrate 200 can be, for example, a substrate, a component, or a structural layer. When the substrate 200 is a substrate, it can include a transparent substrate, such as a glass substrate, a ceramic substrate, a plastic substrate, or any other suitable transparent substrate.

[0123] As Figure 18A shown, a spacer layer 202 is formed on the substrate 200. Since the whole or the surface of the spacer layer 202 contains fluorine elements or fluorine-containing functional groups, the surface of the spacer layer 202 can, for example, have hydrophobicity, which changes the surface tension between the surface of the spacer layer 202 and the spraying material, and further changes the contact angle between the surface of the spacer layer 202 and the spraying material. The contact angle at this time is the angle between the spraying material and the spacer layer 202 before the spraying material is baked, dried, or otherwise post-processed. In some embodiments, when the spraying material is baked, dried, or otherwise post-processed, the contact angle between the spraying material and the spacer layer 202 may change, but this is not limited thereto.

[0124] By modifying the whole or the surface of the spacer layer 202, the contact angle between the spacer layer 202 and a solvent (such as water) can be adjusted. For example, if the whole or the surface of the spacer layer 202 does not contain fluorine elements or fluorine-containing functional groups, the contact angle between the surface of the spacer layer 202 and water is approximately in the range of 0° to 80°. In some embodiments, when the whole or the surface of the spacer layer 202 contains fluorine, the contact angle between the surface of the spacer layer 202 and water is approximately in the range of 90° to 150°.

[0125] When the contact angle between the surface of the spacer layer 202 and water is in the range of 90° to 150° after the whole or the surface of the spacer layer 202 is modified, the thickness uniformity of the material layer formed on the substrate 200 and between two adjacent spacer layers 202 can be improved by using an inkjet process.

[0126] In some embodiments, referring to Figure 18B , when performing the inkjet process, the spraying material 402 can be sprayed onto the substrate 200 through a nozzle 400, so that the material layer 204 is formed on the substrate 200 and between two adjacent spacer layers 202. As Figure 18B shown, when the whole or the surface of the spacer layer 202 is modified, the contact angle θ between the material layer 204 and the spacer layer 202 can be adjusted so that the material layer 204 can have a flatter surface.

[0127] In some embodiments, the spacer layer 202 can be, for example, the light-shielding layer 104 or the reflective layer 162 as shown in Figures 1 - 17 the embodiment, but not limited thereto. The material layer 204 can be, for example, as shown in Figures 1 - 17The blue light - filtering layer 106, blue color - conversion layer 108, yellow light - filtering layer 110, green color - conversion layer 112, yellow light - filtering layer 114, red color - conversion layer 116, dielectric layer 148, green light - filtering layer 150, or red light - filtering layer 152 shown in the embodiments, but not limited thereto. In some embodiments, when the dielectric layer is set and formed and then the color - conversion layer is to be set, at this time, the dielectric layer can be used as another material other than the light - shielding layer in contact with the spraying material (color - conversion layer).

[0128] Referring to Figures 19A - 19C , Figures 19A - 19C is a cross - sectional schematic view of a process of forming a material layer 204 between spacer layers 202 according to some embodiments. As Figure 19A shown, first, spacer layers 202 without fluorine on the surface are formed above a substrate 200. Then, a bottom layer 206 with fluorine on the surface is formed on the substrate 200, and the bottom layer 206 with fluorine is formed between two adjacent spacer layers 202. The bottom layer 206 can be, for example, a substrate material of a fluorine - containing display device or a dielectric material with fluorine on the surface, but not limited thereto.

[0129] Next, in some embodiments, as Figure 19B shown, a plasma process 208 can be performed, for example, on the entire structure of the spacer layers 202 and the bottom layer 206. In some embodiments, performing the plasma process 208 includes injecting carbon tetrafluoride (CF4), fluoromethane (CH3F), difluoromethane (CH2F2), other fluorine - containing gases, or other suitable elemental materials, but not limited thereto. As Figure 19B shown, after performing the plasma process 208, the fluorine on the surface of the bottom layer 206 can be transferred to the surface (side surface or upper surface) of the spacer layer 202.

[0130] In some embodiments, referring to Figure 19C , an ink - jet process is performed, and a spraying material 402 is sprayed or coated onto the substrate 200 through a nozzle 400, so that the material layer 204 is formed on the bottom layer 206 and between two adjacent spacer layers 202.

[0131] In some embodiments, the spacer layer 202 can be, for example, the light - shielding layer 104 or the reflective layer 162 shown in the Figures 1 - 17 embodiments, and the bottom layer 206 can be, for example, the blue light - filtering layer 106, yellow light - filtering layer 110, yellow light - filtering layer 114, dielectric layer 148, green light - filtering layer 150, or red light - filtering layer 152 shown in the Figures 1 - 17 embodiments. The material layer 204 can be, for example, the blue color - conversion layer 108, green color - conversion layer 112, or red color - conversion layer 116 shown in the Figures 1 - 17 embodiments, but not limited thereto, and mainly varies according to the process sequence of different material layers.

[0132] In this embodiment, a color conversion layer, a light filtering layer, or a dielectric layer having fluorine on its surface can be used, for example. By performing a plasma process, the fluorine on the color conversion layer, the light filtering layer, or the dielectric layer is transferred to the surface of the light shielding layer 104 or the reflective layer 162.

[0133] Refer to Figures 20A - 20B , Figures 20A - 20B FIG. is a cross-sectional schematic view of a process of forming a material layer 204 between spacer layers 202 according to some embodiments. In some embodiments, as Figure 20A shown, a spacer layer 202 having no fluorine on its surface is formed above a substrate 200. Then, a coating layer 208 is formed on the upper surface and the sidewalls of the spacer layer 202. In some embodiments, the coating layer 208 can be, for example, a polymer material containing fluorine on its surface, and the spacer layer 202 can be, for example, a monomer or polymer material without fluorine. That is, the spacer layer 202 can use a material that does not carry fluorine itself, but through the formation of the coating layer 208, for example, through the bonding between the coating layer 208 and the spacer layer 202, the outer surface of the spacer layer 202 contains fluorine, but it is not limited thereto.

[0134] As described above, the spacer layer 202 and the coating layer 208 interact or bond to form a spacer structure 210. By forming a fluorine-containing coating layer 208 on the surface of the spacer layer 202 to form the spacer structure 210, the contact angle between the spacer structure 210 and a solvent can be adjusted. For example, in some embodiments, the spacer structure 210 has a contact angle with water, and the contact angle is, for example, in the range of about 90° to 150°.

[0135] In some embodiments, refer to Figure 20B , when an inkjet process is performed, a spraying material 402 is sprayed onto the substrate 200 through a nozzle 400, so that the material layer 204 is formed on the substrate 200 and between two adjacent spacer structures 210.

[0136] In some embodiments, a coating layer containing fluorine on its surface can be formed on the light shielding layer 104 or the reflective layer 162, or a combination thereof as shown in Figures 1 - 17 the embodiment to form a spacer structure. The material layer 204 can be, for example, the blue light filtering layer 106, the blue color conversion layer 108, the yellow light filtering layer 110, the green color conversion layer 112, the yellow light filtering layer 114, the red color conversion layer 116, the dielectric layer 148, the green light filtering layer 150, or the red light filtering layer 152 as shown in Figures 1 - 17 the embodiment, but it is not limited thereto.

[0137] In the embodiments disclosed in FIGS. 18 to 20, the surface of the spacer layer 202 or the spacer structure 210 contains fluorine (F) to change its contact angle characteristics with water. However, the present case is not limited to fluorine (F), and the contact angle between the surface of the spacer layer 202 or the spacer structure 210 and water can also be made to be in the range of about 90° to 150° by containing other chemical elements on the surface of the spacer layer 202 or the spacer structure 210.

[0138] In addition, due to the differences in the respective nozzles, the volume of the material sprayed or coated by each nozzle may be different. Therefore, when the same nozzle is used to spray or coat the material on the pixels in the same column or the same row, problems such as linear color non-uniformity (mura) may occur in the formed color conversion layer, dielectric layer, or light filtering layer. In some embodiments, a mosaic printing method or a mixing nozzle printing method can be combined to alleviate the above-mentioned color non-uniformity (mura) problem.

[0139] More specifically, the mosaic printing method refers to using multiple nozzles to randomly spray or coat the material in the pixels corresponding to different columns or rows, rather than using the same nozzle fixedly in the pixels of the same column or the same row, so as to avoid the formation of linear (in the column or row direction) color non-uniformity due to the spraying differences between different nozzles.

[0140] The mixing nozzle printing method refers to, when forming a color conversion layer, a dielectric layer, or a light filtering layer in the same pixel, for example, two or more nozzles can be used to spray or coat the material. First, the volume of the material sprayed by each nozzle is calculated separately, and then the combination of nozzles is allocated according to the calculated volume. For example, two or more nozzles can be combined to spray the material in the same pixel. Similarly, different nozzles are also combined to spray the material in other pixels, so as to achieve a material layer with approximately equal film thickness between different pixels. In other embodiments, by combining the mosaic printing method and the mixing nozzle printing method, a color conversion layer, a dielectric layer, or a light filtering layer with approximately equal film thickness can be achieved between different pixels.

[0141] Although the embodiments of the present disclosure and their advantages have been disclosed above, it should be understood that those of ordinary skill in any art may make changes, substitutions, and modifications without departing from the spirit and scope of the present disclosure. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufactures, compositions of matter, devices, methods, and steps in the specific embodiments described in the specification. Those of ordinary skill in any art may understand from the disclosure of some embodiments of the present disclosure the processes, machines, manufactures, compositions of matter, devices, methods, and steps developed currently or in the future, as long as they can perform substantially the same functions or achieve substantially the same results in the embodiments described herein and can be used according to some embodiments of the present disclosure. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufactures, compositions of matter, devices, methods, and steps. Additionally, each claim for patent forms a separate embodiment, and the scope of protection of the present disclosure also includes combinations of each claim for patent and embodiments.

Claims

1. A display device, comprising: a substrate; a plurality of light-emitting diodes; a color conversion layer located above one of the plurality of light-emitting diodes; a filter layer located above the color conversion layer; a first light-shielding layer disposed on the substrate and defining a plurality of first openings, wherein the color conversion layer is disposed within one of the plurality of first openings; a second light-shielding layer disposed on the first light-shielding layer, wherein the first light-shielding layer and the second light-shielding layer at least partially overlap; and a material layer disposed between the first light-shielding layer and the second light-shielding layer, the material layer overlapping at least two of the plurality of light-emitting diodes, wherein the material layer contacts the second light-shielding layer, and a maximum distance between an upper surface of the material layer and an upper surface of the substrate is less than a maximum distance between an upper surface of the second light-shielding layer and the upper surface of the substrate.

2. The display device according to claim 1, wherein The material layer includes silicon oxide or a silicon-containing material.

3. The display device according to claim 1, further comprising an adhesive layer disposed between the first light-shielding layer and the second light-shielding layer.

4. The display device according to claim 3, characterized in that, The adhesive layer is disposed between the filter layer and one of the plurality of light-emitting diodes.

Images