A method of cementing

Abstract

The application discloses a gluing method, and belongs to the technical field of metal gluing. The gluing method is characterized in that a protection piece is arranged at the joint between a metal piece and a honeycomb piece, then the metal piece and the honeycomb piece are connected through a colloid, after the metal piece and the honeycomb piece are pressed together, the colloid is solidified and expanded to form a glue layer, thereby realizing the gluing of the metal piece and the honeycomb piece, and the arrangement of the protection piece avoids the direct contact between the overflowed colloid and the metal piece, so that the upper surface of the metal piece is prevented from being damaged when the overflowed colloid is removed. Then, the overflowed colloid on the upper surface of the protection piece is removed, and the thickness of the protection piece is adjusted according to the expected range of the thickness of the required glue layer. Finally, the upper surface of the glue layer is polished with the upper surface of the protection piece as a reference, so that the thickness of the glue layer after polishing is controlled, and the gluing performance is improved.

Description

Technical Field

[0001] This invention relates to the field of metal bonding technology, and more particularly to a bonding method. Background Technology

[0002] Metal bonding is widely used in manufacturing due to its simple process and uniform stress distribution at the bonded joint. Depending on the bonding object, metal bonding structures can be divided into sheet-to-sheet bonding structures and metal honeycomb sandwich bonding structures. In metal honeycomb sandwich bonding structures, expanding foam is used to fill the core cells of the honeycomb components. As the expanding foam cures and expands, it forms a raised adhesive layer on the surface of the honeycomb components. To reduce stress concentration, improve fatigue life, and ensure bonding performance, the adhesive layer needs to be sanded. However, common bonding methods do not control the thickness of the adhesive layer after sanding, which can easily result in an excessively thin adhesive layer, leading to weak bonding and reducing the bonding performance of the metal honeycomb sandwich bonding structure.

[0003] Therefore, there is an urgent need to provide an adhesive bonding method to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide an adhesive bonding method that can control the thickness difference between the adhesive layer and the honeycomb component, thereby improving the adhesive bonding performance of the bonded structure.

[0005] To achieve the above objectives, the following technical solution is provided:

[0006] An adhesive bonding method includes the following steps:

[0007] S1: A protective element is provided at the joint between the metal parts and the honeycomb parts;

[0008] S2: The metal part is provided with adhesive on the bonding surface, the honeycomb part is disposed on the bonding surface of the metal part, the honeycomb part and the metal part are pressed together, and the adhesive is cured and expanded to form an adhesive layer.

[0009] S3: Remove excess adhesive from the upper surface of the protective component, and adjust the thickness of the protective component according to the expected range of the required adhesive layer thickness;

[0010] S4: Using the upper surface of the protective component as a reference, polish the upper surface of the adhesive layer.

[0011] As an alternative to the above-mentioned bonding method, the protective component in step S1 includes a plurality of pressure-sensitive adhesive tapes, which are stacked sequentially along the thickness direction of the honeycomb component.

[0012] As an alternative to the above adhesive bonding method, step S3 specifically includes:

[0013] S31: Remove the pressure-sensitive adhesive tape from the top layer of the protective component;

[0014] S32: Select an appropriate quantity of the pressure-sensitive tape based on the expected range of the thickness of the adhesive layer.

[0015] As an alternative to the above adhesive bonding method, step S4 specifically includes:

[0016] S41: The grinding surface of the grinding part is simultaneously brought into contact with the upper surface of the protective part and the upper surface of the adhesive layer to achieve grinding of the adhesive layer.

[0017] As an alternative to the above adhesive bonding method, step S4 further includes:

[0018] S42: Measure the thickness of the adhesive layer after polishing using a test piece.

[0019] As an alternative to the above-mentioned bonding method, the testing component includes:

[0020] slide rail;

[0021] A support base is slidably disposed on the slide rail along a first direction;

[0022] A measuring element is disposed on the support base. The measuring element includes a detection head. When the detection head contacts the upper surface of the metal part, it is used to measure the thickness of the metal part. When the detection head contacts the upper surface of the adhesive layer, it is used to measure the sum of the thicknesses of the adhesive layer and the metal part.

[0023] As an alternative to the above-mentioned bonding method, the detection component further includes a positioning component, which is disposed on the support base. The positioning component has a positioning hole in the horizontal direction, and the detection head passes through the positioning hole to achieve positioning of the detection head.

[0024] As an alternative to the above adhesive bonding method, step S42 specifically includes:

[0025] S421: The positioning element is placed at the joint between the metal part and the honeycomb part, and the detection head passes through the positioning hole;

[0026] S422: Fix the slide rail and reset the measurement value of the measuring element to zero;

[0027] S423: The detection head is brought into contact with the upper surface of the metal part to obtain the thickness of the metal part; then the support is slid along the first direction until the detection head is brought into contact with the upper surface of the adhesive layer to obtain the sum of the thicknesses of the metal part and the adhesive layer.

[0028] S424: The thickness of the adhesive layer is obtained by subtracting the thickness of the metal part from the sum of the thicknesses of the metal part and the adhesive layer.

[0029] As an alternative to the above adhesive bonding method, step S4 further includes:

[0030] S43: If the measured value of the adhesive layer thickness is within the expected range, the polishing process of the adhesive layer ends; if the measured value of the adhesive layer thickness is not within the expected range, a suitable protective component is selected, and the adhesive layer is polished again.

[0031] As an alternative to the above adhesive bonding method, step S4 further includes:

[0032] S44: Dust generated during the polishing process of the adhesive layer is adsorbed by a vacuum device.

[0033] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0034] The bonding method provided by this invention involves providing a protective element at the joint between a metal component and a honeycomb component. The metal component and the honeycomb component are then connected by an adhesive. After pressing the metal component and the honeycomb component together, the adhesive cures and expands to form an adhesive layer, thereby achieving bonding between the metal component and the honeycomb component. The protective element prevents direct contact between the overflowing adhesive and the metal component, thus avoiding damage to the upper surface of the metal component when removing the overflowing adhesive. Then, the overflowing adhesive on the upper surface of the protective element is removed, and the thickness of the protective element is adjusted according to the expected range of the required adhesive layer thickness. Finally, the upper surface of the adhesive layer is polished with the upper surface of the protective element as a reference, thereby controlling the thickness of the adhesive layer after polishing and improving the bonding performance. Attached Figure Description

[0035] Figure 1 This is a flowchart of the bonding method in an embodiment of the present invention;

[0036] Figure 2 This is a flowchart of step S3 in the adhesive bonding method of this invention embodiment;

[0037] Figure 3 This is a flowchart of step S4 in the adhesive bonding method of this invention embodiment;

[0038] Figure 4 This is a flowchart of step S42 in the adhesive bonding method of this invention embodiment;

[0039] Figure 5 This is a schematic diagram of the curing of the metal parts and the honeycomb parts in an embodiment of the present invention.

[0040] Figure label:

[0041] 1. Metal parts; 2. Honeycomb parts; 3. Protective parts. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0043] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0044] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0045] In the description of this invention, it should be noted that the terms "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0046] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0047] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the horizontal thickness of the first feature is greater than that of the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the horizontal thickness of the first feature is less than that of the second feature.

[0048] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0049] like Figure 1-5 As shown, this embodiment provides an adhesive bonding method, referencing... Figure 1 The bonding method includes the following steps:

[0050] S1: A protective element 3 is provided at the joint between the metal part 1 and the honeycomb part 2;

[0051] S2: Adhesive is provided on the bonding surface of metal part 1, honeycomb part 2 is provided on the bonding surface of metal part 1, honeycomb part 2 and metal part 1 are pressed together, and the adhesive is cured and expanded to form an adhesive layer.

[0052] S3: Remove excess adhesive from the upper surface of the protective component 3, and adjust the thickness of the protective component 3 according to the expected range of the required adhesive layer thickness.

[0053] S4: Using the upper surface of the protective component 3 as a reference, polish the upper surface of the adhesive layer.

[0054] In this embodiment, a protective element 3 is provided at the joint between the metal part 1 and the honeycomb part 2. The metal part 1 and the honeycomb part 2 are then connected by an adhesive. After the metal part 1 and the honeycomb part 2 are pressed together, the adhesive cures and expands to form an adhesive layer, thereby achieving the bonding of the metal part 1 and the honeycomb part 2. The protective element 3 prevents the overflowing adhesive from directly contacting the metal part 1, thus avoiding damage to the upper surface of the metal part 1 when the overflowing adhesive is removed. Then, the overflowing adhesive on the upper surface of the protective element 3 is removed, and the thickness of the protective element 3 is adjusted according to the expected range of the required adhesive layer thickness. Finally, the upper surface of the adhesive layer is polished with the upper surface of the protective element 3 as a reference, thereby controlling the thickness of the adhesive layer after polishing to improve the bonding performance.

[0055] Optionally, the protective element 3 in step S1 includes multiple pressure-sensitive adhesive tapes, which are stacked sequentially along the thickness direction of the honeycomb element 2. For example... Figure 2 As shown, specifically, step S3 includes:

[0056] S31: Remove the top layer of pressure-sensitive tape from protective component 3;

[0057] S32: Select the appropriate amount of pressure-sensitive tape based on the expected range of adhesive layer thickness.

[0058] The overlapping arrangement of multiple pressure-sensitive adhesive tapes transforms the removal of excess adhesive from the upper surface of the protective component 3 into the removal of the outermost layer of pressure-sensitive adhesive tape, and converts the adjustment of the thickness of the protective component 3 into the adjustment of the number of pressure-sensitive adhesive tapes, thereby simplifying step S3 and making the thickness adjustment of the protective component 3 more efficient. Optionally, several protective components 3 are provided, and adjacent protective components 3 are bonded together, avoiding overlapping between adjacent protective components 3 to ensure that the thickness of the multiple protective components 3 is the same. Optionally, the number of protective components 3 is related to the dimensions of the metal component 1 and the honeycomb component 2 in actual working conditions. The protective components 3 need to cover the upper surface of the metal component 1 around the honeycomb component 2 to prevent excess adhesive from adhering to the upper surface of the metal component 1.

[0059] like Figure 3 As shown, optionally, step S4 specifically includes step S41: simultaneously contacting the grinding surface of the grinding component with the upper surface of the protective component 3 and the upper surface of the adhesive layer to achieve grinding of the adhesive layer. The simultaneous contact of the grinding surface with the protective component 3 and the adhesive layer facilitates grinding of the adhesive layer using the upper surface of the protective component 3 as a reference, ensuring that the thickness of the ground adhesive layer is consistent with the thickness of the protective component 3, thereby controlling the thickness of the adhesive layer by controlling the thickness of the protective component 3.

[0060] Optionally, step S41 includes step S411: if the upper surface of the protective element 3 is worn, replace the protective element 3 and re-polish it. The above steps ensure that the thickness of the protective element 3 remains consistent during polishing, avoiding over-polishing of the adhesive layer and preventing the thickness of the adhesive layer after polishing from exceeding the expected range. In this embodiment, the protective element 3 is composed of multiple pressure-sensitive adhesive tapes stacked together. Therefore, the wear of the upper surface of the protective element 3 can be determined by observing whether the surface of the pressure-sensitive adhesive tapes has changed color or even broken, allowing workers to replace the protective element 3 in a timely manner and adjust the pressure applied to the polishing element. Optionally, the polishing surface of the polishing element is provided with multiple protrusions to improve polishing efficiency.

[0061] Optionally, step S4 further includes step S42: measuring the thickness of the adhesive layer after sanding using a testing component. Step S42 ensures that the thickness of the adhesive layer after sanding is within the expected range, thereby guaranteeing bonding performance.

[0062] Optionally, the testing component includes a slide rail, a support base, and a measuring component. The support base is slidably mounted on the slide rail along a first direction (i.e., the X direction in the attached figure). The measuring component is mounted on the support base and includes a testing head. When the support base slides along the first direction, the testing head of the measuring component can sequentially contact the upper surfaces of the metal part 1 and the adhesive layer. When the testing head contacts the upper surface of the metal part 1, it is used to measure the thickness of the metal part 1. When the testing head contacts the upper surface of the adhesive layer, it is used to measure the sum of the thicknesses of the adhesive layer and the metal part 1. The thickness of the adhesive layer after polishing can be obtained by subtracting the thickness of the metal part 1 from the sum of the thicknesses of the adhesive layer and the metal part 1, thereby completing the measurement of the thickness of the adhesive layer after polishing.

[0063] Optionally, the detection component further includes a positioning component, which is mounted on the support base. The positioning component has a positioning hole in the horizontal direction, through which the detection head passes to achieve positioning of the detection head. This positioning component prevents the detection head from shifting during measurement, thus improving measurement accuracy.

[0064] refer to Figure 4 Specifically, step S42 includes:

[0065] S421: Place the positioning element at the joint between the metal part 1 and the honeycomb part 2, and pass the detection head through the positioning hole;

[0066] S422: Fix the slide rail and zero the measurement value of the measuring piece;

[0067] S423: The detection head is brought into contact with the upper surface of the metal part 1 to obtain the thickness of the metal part 1; then the support seat is slid along the first direction until the detection head is brought into contact with the upper surface of the adhesive layer to obtain the sum of the thicknesses of the metal part 1 and the adhesive layer.

[0068] S424: The thickness of the adhesive layer is obtained by subtracting the thickness of the metal part 1 from the sum of the thicknesses of the metal part 1 and the adhesive layer.

[0069] The above measurement process involves zeroing the measuring piece, which not only improves the accuracy of the measurement results but also facilitates the subsequent calculation of the adhesive layer thickness, thus improving measurement efficiency.

[0070] Refer again Figure 3 Optionally, step S4 further includes step S43: if the measured value of the adhesive layer thickness is within the expected range, the sanding process of the adhesive layer ends; if the measured value of the adhesive layer thickness is not within the expected range, a suitable protective component 3 is selected, and the adhesive layer is sanded again. The above steps provide the conditions for ending the sanding process. When the adhesive layer thickness does not meet the expected range, the sanding process is repeated until the adhesive layer thickness is within the expected range.

[0071] Optionally, step S4 further includes step S44: using a vacuum device to adsorb the dust generated during the polishing process on the adhesive layer. These steps prevent powder from adhering to the metal part 1 and the honeycomb part 2, eliminating the need to clean the metal honeycomb sandwich adhesive structure obtained after polishing, simplifying the adhesive bonding process, and improving adhesive bonding efficiency.

[0072] Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A cementing method, characterized by, The method comprises the following steps: S1: A protection piece (3) is arranged at the joint of a metal piece (1) and a honeycomb piece (2), the protection piece (3) comprises a plurality of pressure-sensitive adhesive tapes, and the plurality of pressure-sensitive adhesive tapes are sequentially laminated along the thickness direction of the honeycomb piece (2); S2: An adhesive is arranged on the surface to be glued of the metal piece (1), the honeycomb piece (2) is arranged on the surface to be glued of the metal piece (1), the honeycomb piece (2) and the metal piece (1) are pressed, and the adhesive is solidified and expanded to form an adhesive layer; S3: The excess adhesive on the upper surface of the protection piece (3) is removed, and the thickness of the protection piece (3) is adjusted according to the expected range of the thickness of the adhesive layer; S3 specifically comprises: S31: The uppermost pressure-sensitive adhesive tape of the protection piece (3) is torn off; S32: The number of the pressure-sensitive adhesive tapes is selected according to the expected range of the thickness of the adhesive layer; S4: The upper surface of the adhesive layer is polished based on the upper surface of the protection piece (3); S4 specifically comprises: S41: The polishing surface of a polishing piece is simultaneously in contact with the upper surface of the protection piece (3) and the upper surface of the adhesive layer, so that the adhesive layer is polished; S41 comprises S411: If the upper surface of the protection piece (3) is worn, the protection piece (3) is replaced and the polishing is re-performed; S42: The thickness of the adhesive layer after polishing is measured by a detection piece; The detection piece comprises a slide rail, a support seat, a measuring piece, and a positioning piece; the support seat is arranged on the slide rail and slides in a first direction; the measuring piece is arranged on the support seat and comprises a detection head; when the detection head is in contact with the upper surface of the metal piece (1), the detection head is used for measuring the thickness of the metal piece (1); when the detection head is in contact with the upper surface of the adhesive layer, the detection head is used for measuring the sum of the thicknesses of the adhesive layer and the metal piece (1); the positioning piece is arranged on the support seat and comprises a positioning hole in a horizontal direction; the detection head passes through the positioning hole to realize the positioning of the detection head; S42 specifically comprises: S421: The positioning piece is placed at the joint of the metal piece (1) and the honeycomb piece (2), and the detection head passes through the positioning hole; S422: The slide rail is fixed, and the measurement value of the measuring piece is zeroed; S423: The detection head is in abutment with the upper surface of the metal piece (1) to obtain the thickness of the metal piece (1); then the support seat is slid in the first direction until the detection head is in abutment with the upper surface of the adhesive layer to obtain the sum of the thicknesses of the adhesive layer and the metal piece (1); S424: The sum of the thicknesses of the adhesive layer and the metal piece (1) is subtracted by the thickness of the metal piece (1) to obtain the thickness of the adhesive layer. S43: If the measured value of the thickness of the adhesive layer is in the expected range, the polishing process of the adhesive layer is ended; if the measured value of the thickness of the adhesive layer is not in the expected range, a suitable protection piece (3) is selected, and the adhesive layer is polished again.

2. The cementing method of claim 1, wherein, S4 further comprises: ​ 3. The cementing method of claim 1, wherein, ​ S44: Dust generated in the polishing process of the adhesive layer is adsorbed by the vacuum suction member.

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