Display module, mother board of display panel, and display device

Abstract

An embodiment of the present application provides a display module, a mother board of a display panel, and a display device. The display module includes a display panel, and the display panel includes a color filter substrate and an array substrate which are oppositely arranged. The color filter substrate includes a color filter base and a first wire; the first wire is disposed on a side of the color filter base away from the array substrate and is located in a first sub-region. The non-display region includes the first sub-region and a second sub-region. The first sub-region surrounds the display region, and the second sub-region is located on a side of the first sub-region away from the display region; the array substrate includes a gate driving circuit located in the first sub-region and a ground pad located in the second sub-region; a positive projection of the gate driving circuit on the color filter substrate at least partially coincides with the first wire; the first wire is electrically connected to the ground pad through a conductive adhesive. In the embodiment of the present application, the first wire can conduct static electricity to the ground pad, avoiding static electricity from breaking through the wires of the gate driving circuit, and capable of improving the product yield of the display module.

Description

Technical Field

[0001] This application relates to the field of display technologies. Specifically, this application relates to a display module, a mother board of a display panel, and a display device. Background Art

[0002] With the development of thin-film transistor liquid crystal display manufacturing technologies, the GOA (Gate Driver on Array) design emerged. The GOA design integrates the gate driver circuit on the array substrate of the display panel, thereby eliminating the gate driver integrated circuit part, and reducing the product cost in terms of both material cost and manufacturing process.

[0003] However, currently, the modules manufactured using the GOA design are prone to functional defects due to static electricity, resulting in a decrease in product yield. Summary of the Invention

[0004] Aiming at the disadvantages of the existing methods, this application provides a display module, a mother board of a display panel, and a display device to solve the technical problem that the existing display module integrated with GOA is prone to static electricity leading to functional defects.

[0005] In a first aspect, an embodiment of this application provides a display module. The display panel includes a display area and a non-display area. The display panel includes a color filter substrate and an array substrate disposed opposite to each other;

[0006] The color filter substrate includes a color filter base and a first wire; the first wire is disposed on a side of the color filter base away from the array substrate and is located in a first sub-region. The non-display area includes the first sub-region and a second sub-region. The first sub-region surrounds the display area, and the second sub-region is located on a side of the first sub-region away from the display area;

[0007] The array substrate includes a gate driver circuit located in the first sub-region and a ground pad located in the second sub-region; a positive projection of the gate driver circuit on the color filter substrate at least partially coincides with the first wire; the first wire is electrically connected to the ground pad through a conductive adhesive.

[0008] Optionally, a positive projection of the gate driver circuit on the color filter base is covered by a positive projection of the first wire on the color filter base.

[0009] Optionally, the first sub-region is annular;

[0010] The first wire is annular; a line width of the first wire is less than or equal to a distance between an inner edge and an outer edge of the first sub-region.

[0011] Optionally, the display module includes at least one of the following:

[0012] The first wire includes a plurality of first sub-wires arranged in parallel, and each of the first sub-wires is electrically connected to the ground pad of the array substrate through the conductive adhesive;

[0013] The conductive adhesive is located at the junction of the first sub-region and the second sub-region;

[0014] The display module further includes a flexible circuit board, which is electrically connected to the bonding region of the second sub-region, and the bonding region is located on the side of the second sub-region away from the first sub-region; the array substrate further includes a ground trace located in the second sub-region, the ground pad is electrically connected to one end of the ground trace, and the other end of the ground trace is electrically connected to the flexible circuit board;

[0015] The display module further includes a liquid crystal layer located in the display area and a sealant located in the first sub-region, and both the liquid crystal layer and the sealant are disposed between the array substrate and the color filter substrate;

[0016] The color filter substrate further includes a color resist layer, and the color resist layer is disposed on the side of the color filter substrate close to the array substrate.

[0017] In a second aspect, an embodiment of the present application provides a mother board of a display panel, including an array of display panel areas and a cutting area located outside the display panel areas, and the display panel of the first aspect is located in the display panel areas;

[0018] The mother board includes a second wire, and the second wire is located in the cutting area and is used to electrically connect to the first wire of each display panel.

[0019] Optionally, the gate driving circuit of the display panel includes a metal structure, and a storage capacitor is formed between the first wire and the second wire and the metal structure.

[0020] Optionally, the gate driving circuit includes a plurality of thin film transistors and connection traces disposed between adjacent thin film transistors;

[0021] The thin film transistor includes a gate line and a source-drain line, and the metal structure includes at least one of the gate line, the source-drain line, and the connection trace.

[0022] Optionally, the cutting area includes a first cutting area located between any two display panel areas and a second cutting area located outside the periphery of all display panel areas; the second wire includes a first connection wire located in the first cutting area and a second connection wire located in the second cutting area;

[0023] The arrangement of each of the first wire arrays includes at least two first wire rows. The first connection wire includes multiple first connection sub-wires, and any two adjacent first wires in each first wire row are electrically connected through the first connection sub-wires;

[0024] The second connection wire includes at least two second connection sub-wires, and the first wire located at one end in each first wire row is electrically connected through the second connection sub-wires.

[0025] Optionally, the mother board includes at least one of the following:

[0026] The first wire and the second wire are arranged on the same layer;

[0027] The materials of the first wire and the second wire are both indium tin oxide.

[0028] In a third aspect, an embodiment of the present application provides a display device, including the display module described in the first aspect.

[0029] The beneficial technical effects brought by the technical solution provided by the embodiment of the present application include:

[0030] By providing a first wire on the side of the color filter substrate away from the array substrate, and electrically connecting the first wire to the ground pad of the array substrate through a conductive adhesive, when static electricity is generated on the surface of the side of the color filter substrate away from the array substrate, the first wire can conduct the static electricity to the ground pad, avoiding electrostatic breakdown at the crossover positions in the dense gate driving circuit. Thus, it is beneficial to protect the integrity of the gate driving circuit of the array substrate, and further ensure the use performance of the display module, and can significantly improve the product yield of the display module.

[0031] Moreover, the positive projection of the gate driving circuit on the color filter substrate at least partially coincides with the first wire, that is to say, the first wire can protect the covered gate driving circuit, thereby ensuring the function of the display module.

[0032] In addition, since the first wire is arranged in the non-display area of the display module, the light transmittance of the display module can be ensured, thereby ensuring the display performance and touch performance of the display module.

[0033] Additional aspects and advantages of the present application will be given in part in the following description, and these will become obvious from the following description, or can be understood through the practice of the present application. Description of the Drawings

[0034] The above and / or additional aspects and advantages of the present application will become obvious and easy to understand from the following description of the embodiments in conjunction with the drawings, in which:

[0035] Figure 1A top view structural schematic diagram of a display module provided by an embodiment of the present application;

[0036] Figure 2 For Figure 1 A cross-sectional film layer structural schematic diagram at CC in

[0037] Figure 3 A top view structural schematic diagram of a mother board of a display panel provided by an embodiment of the present application.

[0038] Explanation of reference numerals:

[0039] 1 - Display module;

[0040] 11 - Display panel; A - Display area; B - Non-display area; B1 - First sub-area; B2 - Second sub-area; CC - Cutting line; 111 - Color filter substrate; 1111 - Color filter base; 1112 - First wire; 1113 - Color resist layer; 112 - Array substrate; 1121 - Gate driving circuit; 1121a - Metal structure; 1122 - Ground pad; 1123 - Ground trace; 113 - Liquid crystal layer; 114 - Sealing glue;

[0041] 12 - Flexible circuit board;

[0042] 2 - Mother board of display panel; D - Display panel area; E - Cutting area; E1 - First cutting area; E2 - Second cutting area;

[0043] 21 - Second wire; 211 - First connection wire; 2111 - First connection sub-wire; 212 - Second connection wire; 2121 - Second connection sub-wire. Detailed implementation manners

[0044] The embodiments of the present application will be described below with reference to the accompanying drawings in the present application. It should be understood that the embodiments described below in conjunction with the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application, and do not constitute limitations on the technical solutions of the embodiments of the present application.

[0045] Those skilled in the art of the present technology can understand that unless specifically stated otherwise, the singular forms "a", "an", "the" and "said" used herein may also include the plural forms. It should be further understood that the term "including" used in the specification of the present application means the presence of the described features, integers, steps, operations, elements and / or components, but does not exclude the presence of other features, information, data, steps, operations, elements, components and / or combinations thereof supported by the art of the present technology. The term "and / or" used herein means at least one of the items defined by the term, for example, "A and / or B" can be implemented as "A", or implemented as "B", or implemented as "A and B".

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the following will further describe the embodiments of this application in detail with reference to the accompanying drawings.

[0047] In the GOA design, the gate driving circuit is integrated on the array substrate of the display panel. There are multiple thin-film transistors in the gate driving circuit. When the signal line is electrically connected to each thin-film transistor, it will cause the problem of crosstalk between the gate trace and the source-drain trace.

[0048] When cutting or inspecting the mother board of the display panel, the static electricity generated on one side of the color filter substrate of the display panel is likely to break down the position of the single-point trace, resulting in defects in the mother board of the display panel; and after the display panel is fabricated into a display module, during use, static electricity is also likely to form on the surface of the display module, which is likely to break down the crosstalk position between the gate trace and the source-drain trace, resulting in functional defects in the display module, thereby reducing the production yield of the display module and decreasing the revenue.

[0049] The following will specifically describe the technical solutions of this application and how the technical solutions of this application solve the above technical problems with specific embodiments. It should be noted that the following embodiments can refer to, draw on, or combine with each other. For the same terms, similar features, and similar implementation steps in different embodiments, they will not be described repeatedly.

[0050] An embodiment of this application provides a display module 1. The schematic structural diagram of the display module 1 is as shown in Figure 1 and Figure 2 and includes a display panel 11. The display panel 11 includes a display area A and a non-display area B. The non-display area B includes a first sub-area B1 and a second sub-area B2. The first sub-area B1 surrounds the display area A, and the second sub-area B2 is located on the side of the first sub-area B1 away from the display area A.

[0051] The display panel 11 includes a color filter substrate 111 and an array substrate 112 that are oppositely arranged.

[0052] The color filter substrate 111 includes a color filter base 1111 and a first wire 1112; the first wire 1112 is disposed on the side of the color filter base 1111 away from the array substrate 112 and is located in the first sub-area B1.

[0053] The array substrate 112 includes a gate driving circuit 1121 located in the first sub-area B1 and a ground pad 1122 located in the second sub-area B2; the orthographic projection of the gate driving circuit 1121 on the color filter substrate 111 at least partially coincides with the first wire 1112; the first wire 1112 is electrically connected to the ground pad 1122 through a conductive adhesive.

[0054] In this embodiment, when the operator touches the display module 1 by hand or the robotic arm grasps the display module 1, static electricity is likely to be generated on the surface of the color filter substrate 111. By providing a first wire 1112 on the side of the color filter substrate 1111 away from the array substrate 112, and electrically connecting the first wire 1112 to the ground pad 1122 of the array substrate 112 through a conductive adhesive, when static electricity is generated on the surface of the side of the color filter substrate 1111 away from the array substrate 112, the first wire 1112 can conduct the static electricity to the ground pad 1122, avoiding static electricity from breaking down the cross-wire position in the dense gate driving circuit 1121. Thus, it is beneficial to protect the integrity of the gate driving circuit 1121 of the array substrate 112, and further ensure the performance of the display module 1, and can significantly improve the product yield of the display module 1.

[0055] Moreover, the orthographic projection of the gate driving circuit 1121 on the color filter substrate 111 at least partially coincides with the first wire 1112. That is to say, the first wire 1112 can protect the covered gate driving circuit 1121, thereby ensuring the function of the display module 1.

[0056] In addition, the first wire 1112 is arranged in the non-display area B of the display module 1, so as to ensure the light transmittance of the display module 1, and thus ensure the display performance and touch performance of the display module 1.

[0057] Optionally, the orthographic projection of the gate driving circuit 1121 on the color filter substrate 1111 is covered by the orthographic projection of the first wire 1112 on the color filter substrate 1111.

[0058] In this embodiment, the orthographic projection of the first wire 1112 on the color filter substrate 1111 covers the orthographic projection of the gate driving circuit 1121 on the color filter substrate 1111, thereby ensuring that all the gate driving circuits 1121 are not broken down by static electricity, further ensuring the performance of the display module 1, and thus being beneficial to improving the production yield and customer reliability of the display module 1.

[0059] Optionally, the first sub-region B1 is annular. The first wire 1112 is annular. The line width of the first wire 1112 is less than or equal to the distance between the inner edge and the outer edge of the first sub-region B1.

[0060] In this embodiment, since the line width of the first wire 1112 is less than or equal to the distance between the inner edge and the outer edge of the first sub-region B1, it is ensured that the first wire 1112 is not located in the display area A, ensuring the normal display function and touch function of the display module 1.

[0061] It should be noted that the shape of the first sub-region B1 of the display panel 11 can be regular or irregular, as long as it is ensured that the first wire 1112 is located within the first sub-region B1. For example Figure 1As shown, the display panel 11 of the present application is a regular rectangle, and the position where the first wire 1112 is located is the area between the inner edge and the outer edge of the first sub-region B1.

[0062] Optionally, the first wire 1112 includes a plurality of first sub-wires arranged in parallel, and each first sub-wire is electrically connected to the ground pad 1122 of the array substrate 112 through a conductive adhesive.

[0063] In this embodiment, the first wire 1112 may include a plurality of first sub-wires arranged in parallel, and the number of first sub-wires can be set according to the needs of the actual product.

[0064] Optionally, the conductive adhesive is located at the junction of the first sub-region B1 and the second sub-region B2.

[0065] In this embodiment, since the conductive adhesive is located at the junction of the first sub-region B1 and the second sub-region B2, the glue dots formed by the conductive adhesive are also located at the junction of the first sub-region B1 and the second sub-region B2, thereby avoiding the glue dots formed by the conductive adhesive from affecting the function of the display module 1.

[0066] It should be noted that the conductive adhesive can be silver glue.

[0067] Optionally, the display module 1 further includes a flexible circuit board 12, the flexible circuit board 12 is electrically connected to the bonding area of the second sub-region B2, and the bonding area is located on the side of the second sub-region B2 far from the first sub-region B1; the array substrate 112 further includes a ground trace 1123 located in the second sub-region B2, one end of the ground pad 1122 is electrically connected to the ground trace 1123, and the other end of the ground trace 1123 is electrically connected to the flexible circuit board 12.

[0068] In this embodiment, the first wire 1112 of the color filter substrate 111 is electrically connected to the ground pad 1122 through a conductive adhesive, and the ground pad 1122 is electrically connected to the flexible circuit board 12 through the ground trace 1123, which is beneficial to conduct the static electricity generated on the surface of the color filter substrate 111 to the ground pad 1122, through the ground pad 1122 to the flexible circuit board 12, and the static electricity conducted to the flexible circuit board 12 is released through the grounding of the whole machine device, which is beneficial to protecting the display module 1.

[0069] Optionally, the display module 1 further includes a liquid crystal layer 113 located in the display area A and a sealant 114 located in the first sub-region B1, and both the liquid crystal layer 113 and the sealant 114 are disposed between the array substrate 112 and the color filter substrate 111.

[0070] In this embodiment, the display panel 11 can be a liquid crystal display panel 11. The sealant 114 is located in the first sub-region B1 and is disposed on the outer edge of the first sub-region B1, and the sealant 114 can be used to prevent the liquid crystal of the liquid crystal layer 113 from flowing out.

[0071] Optionally, the color filter substrate 111 further includes a color resist layer 1113, and the color resist layer 1113 is disposed on a side of the color filter substrate 1111 close to the array substrate 112.

[0072] Optionally, the color resist layer 1113 includes a first-color color resist, a second-color color resist, and a third-color color resist, and a black matrix located between the first-color color resist and the second-color color resist, and between the second-color color resist and the third-color color resist.

[0073] Based on the same inventive concept, an embodiment of the present application provides a mother board 2 of a display panel 11. A schematic structural diagram of the mother board 2 is as shown in Figure 3 and includes a display panel area D arranged in an array and a cutting area E located outside the display panel area D. The display panel 11 provided in the above embodiment is located in the display panel area D.

[0074] The mother board 2 includes a second wire 21, and the second wire 21 is located in the cutting area E. The second wire 21 is used for electrically connecting to the first wire 1112 of each display panel 11.

[0075] In this embodiment, when the mother board is cut or detected, static electricity is likely to occur at the position where it touches the mother board, and the generated static electricity is likely to break down the single-point wiring covered at the touched position. In this case, the present application provides a second wire 21 on one side of the mother board 2, and the second wire 21 is electrically connected to the first wire 1112 of each display panel 11, so that the electric potential at each part of the second wire 21 and the first wire 1112 is the same. Thus, when static electricity is generated at a certain position of the mother board 2, the static electricity is conducted to the second wire 21, and the second wire 21 is conducted to the first wire 1112, that is, the static electricity is dispersed to the first wire 1112 and the second wire 21 in the mother board 2, which is beneficial to preventing the breakdown of the single-point wiring by static electricity and can ensure the function of the mother board 2.

[0076] Optionally, the gate driving circuit 1121 of the display panel 11 includes a metal structure 1121a, and a storage capacitor is formed between the first wire 1112 and the second wire 21 and the metal structure 1121a.

[0077] In this embodiment, a storage capacitor is formed between the first wire 1112 and the second wire 21 and the metal structure 1121a. The first wire 1112 and the second wire 21 are equipotential bodies, which can ensure that the static electricity generated on the mother board 2 can be dispersed to the first wire 1112 through the second wire 21, thereby protecting the integrity of the mother board 2.

[0078] Moreover, the second wire 21 is located in the cutting area E, which can avoid the second wire 21 being located in the display panel area D, thereby avoiding the problem of short circuit of the first wire 1112, and is beneficial to increasing the value of the storage capacitor formed between the first wire 1112 and the second wire 21 and the metal structure 1121a.

[0079] It should be noted that, as Figure 2 shown, the dashed arrow from the first wire 1112 to the metal structure 1121a only represents the storage capacitance from the first wire 1112 to the metal structure 1121a and has no practical significance.

[0080] Optionally, the gate driving circuit 1121 includes a plurality of thin film transistors and connection traces disposed between adjacent thin film transistors.

[0081] The thin film transistors include gate lines and source-drain lines, and the metal structure 1121a includes at least one of a gate line, a source-drain line, and a connection trace.

[0082] Optionally, the cutting area E includes a first cutting area E1 located between any two display panel areas D and a second cutting area E2 located outside the display panel area D. The second wire 21 includes a first connection wire 211 located in the first cutting area E1 and a second connection wire 212 located in the second cutting area E2.

[0083] The first wires 1112 are arranged in an array, the first wires 1112 include at least two rows of first wires 1112, the first connection wire 211 includes a plurality of first connection sub-wires 2111, and any two adjacent first wires 1112 in each row of first wires 1112 are electrically connected by the first connection sub-wires 2111.

[0084] The second connection wire 212 includes at least two second connection sub-wires 2121, and the first wire 1112 at one end in each row of first wires 1112 is electrically connected by the second connection sub-wires 2121.

[0085] In this embodiment, the first wires 1112 at one end in each row of first wires 1112 are electrically connected by the second connection sub-wires 2121, that is, the first wires 1112 at one end in adjacent rows of first wires 1112 are electrically connected by the second connection sub-wires 2121, so that the first wires 1112 in each row of first wires 1112 are electrically connected by the second connection sub-wires 2121, making the first wires 1112 and the second wire 21 equipotential bodies.

[0086] Optionally, the first wire 1112 and the second wire 21 are disposed on the same layer.

[0087] In this embodiment, the first wire 1112 and the second wire 21 are disposed on the same layer, which is beneficial to reducing the complexity of the manufacturing process and improving the manufacturing efficiency.

[0088] Optionally, the materials of the first wire 1112 and the second wire 21 are both indium tin oxide.

[0089] In this embodiment, the first wire 1112 and the second wire 21 are transparent wires, which can ensure that other display functions of the motherboard 2 are not affected.

[0090] Based on the same inventive concept, a display device provided by an embodiment of the present application includes the display module 1 provided by the above embodiment.

[0091] In this embodiment, since the display device includes the display module 1 provided by the above embodiment, the beneficial effects of the display device also include the beneficial effects of the display module 1 provided by the above embodiment, which will not be elaborated here.

[0092] Applying the embodiments of the present application can at least achieve the following beneficial effects:

[0093] 1. In the embodiment of the present application, by providing a first wire on the side of the color filter substrate away from the array substrate, and electrically connecting the first wire to the ground pad of the array substrate through a conductive adhesive, when static electricity is generated on the surface of the side of the color filter substrate away from the array substrate, the first wire can conduct the static electricity to the ground pad, avoiding electrostatic breakdown of the crossover position in the dense gate driving circuit. Thus, it is beneficial to protect the integrity of the gate driving circuit of the array substrate, and further ensure the use performance of the display module, and can significantly improve the product yield of the display module.

[0094] 2. The positive projection of the gate driving circuit provided by the embodiment of the present application on the color filter substrate at least partially coincides with the first wire. That is to say, the first wire can protect the covered gate driving circuit, thereby ensuring the function of the display module.

[0095] 3. In the embodiment of the present application, a second wire is provided on one side of the motherboard, and the second wire is electrically connected to the first wire of each display panel. Then, the electric potentials of each part of the second wire and the first wire are the same. Thus, when static electricity is generated at a certain position on the motherboard, the static electricity is conducted to the second wire, and the second wire is conducted to the first wire, that is, the static electricity is dispersed to the first wire and the second wire in the motherboard, which is beneficial to preventing electrostatic breakdown of single-point wiring and can ensure the function of the motherboard.

[0096] Those skilled in the art of the present technology can understand that the various operations, methods, steps, measures, and solutions in the processes discussed in the present application can be alternated, changed, combined, or deleted. Further, other steps, measures, and solutions in the various operations, methods, and processes discussed in the present application can also be alternated, changed, rearranged, decomposed, combined, or deleted. Further, those in the prior art having the steps, measures, and solutions in the various operations, methods, and processes disclosed in the present application can also be alternated, changed, rearranged, decomposed, combined, or deleted.

[0097] In the description of the present application, the directions or positional relationships indicated by terms such as "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the exemplary directions or positional relationships shown in the drawings, and are for the convenience of describing or simplifying the embodiments of the present application, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation on the present application.

[0098] The terms "first" and "second" are used only for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0099] In the description of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0100] In the description of this specification, specific features, structures, materials, or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0101] It should be understood that although the steps in the flowchart of the drawings are shown sequentially as indicated by the arrows, the implementation order of these steps is not limited to the order indicated by the arrows. Unless otherwise clearly stated in this document, in some implementation scenarios of the embodiments of the present application, the steps in each process can be executed in other orders according to requirements. Moreover, some or all of the steps in each flowchart may include multiple sub-steps or multiple stages based on the actual implementation scenario. Some or all of these sub-steps or stages can be executed at the same time or at different times. In the scenario where the execution times are different, the execution order of these sub-steps or stages can be flexibly configured according to requirements, and the embodiments of the present application do not limit this.

[0102] The above are only some implementation manners of the present application. It should be noted that for those of ordinary skill in the art, without departing from the technical concept of the solution of the present application, other similar implementation means based on the technical idea of the present application also belong to the protection scope of the embodiments of the present application.

Claims

1. A display module, comprising a display panel, the display panel including a display area and a non-display area, characterized in that, The display panel includes a color filter substrate and an array substrate which are oppositely arranged; The color filter substrate includes a color filter base and a first wire; the first wire is disposed on a side of the color filter base away from the array substrate and is located in a first sub-region. The non-display region includes the first sub-region and a second sub-region. The first sub-region surrounds the display region, and the second sub-region is located on a side of the first sub-region away from the display region; The array substrate includes a gate driving circuit located in the first sub-region and a ground pad located in the second sub-region; a positive projection of the gate driving circuit on the color filter substrate at least partially coincides with the first wire; The first wire is electrically connected to the ground pad through a conductive adhesive; The gate driving circuit of the display panel includes a metal structure, and a storage capacitor is formed between the first wire and the metal structure.

2. The display module according to claim 1, wherein A positive projection of the gate driving circuit on the color filter base is covered by a positive projection of the first wire on the color filter base.

3. The display module according to claim 1, wherein The first sub-region is annular; The first wire is annular; a line width of the first wire is less than or equal to a distance between an inner edge and an outer edge of the first sub-region.

4. The display module according to claim 1, wherein It includes at least one of the following: The first wire includes a plurality of first sub-wires arranged in parallel, and each of the first sub-wires is electrically connected to the ground pad of the array substrate through the conductive adhesive; The conductive adhesive is located at a junction of the first sub-region and the second sub-region; The display module further includes a flexible circuit board, the flexible circuit board is electrically connected to a bonding region of the second sub-region, and the bonding region is located on a side of the second sub-region away from the first sub-region; the array substrate further includes a ground trace located in the second sub-region, the ground pad is electrically connected to one end of the ground trace, and the other end of the ground trace is electrically connected to the flexible circuit board; The display module further includes a liquid crystal layer located in the display region and a sealant located in the first sub-region, and both the liquid crystal layer and the sealant are disposed between the array substrate and the color filter substrate; The color filter substrate further includes a color resist layer, and the color resist layer is disposed on a side of the color filter base close to the array substrate.

5. A mother board of a display panel, characterized in that, It includes a display panel region arranged in an array and a cutting region located outside the display panel region, and the display panel according to any one of claims 1-4 is located in the display panel region; The mother board includes a second wire, the second wire is located in the cutting region, and the second wire is used for electrically connecting to the first wire of each display panel.

6. The mother board of the display panel according to claim 5, characterized in that, The gate driving circuit of the display panel includes a metal structure, and a storage capacitor is formed between the first wire and the second wire and the metal structure.

7. The mother board of the display panel according to claim 6, characterized in that, The gate driving circuit includes a plurality of thin film transistors and connection traces disposed between adjacent thin film transistors; The thin film transistor includes a gate line and a source-drain line, and the metal structure includes at least one of the gate line, the source-drain line, and the connection trace.

8. The mother board of the display panel according to claim 5, characterized in that, The cutting area includes a first cutting area located between any two of the display panel areas and a second cutting area located at the periphery of all the display panel areas; the second wire includes a first connection wire located in the first cutting area and a second connection wire located in the second cutting area; Each of the first wires is arranged in an array, including at least two first wire rows. The first connection wire includes a plurality of first connection sub-wires, and any two adjacent first wires in each first wire row are electrically connected through the first connection sub-wires; The second connection wire includes at least two second connection sub-wires, and the first wire located at one end in each first wire row is electrically connected through the second connection sub-wires.

9. The mother board of the display panel according to claim 5, characterized in that, It includes at least one of the following: The first wire and the second wire are arranged on the same layer; The materials of the first wire and the second wire are both indium tin oxide.

10. A display device, characterized in that, It includes the display module according to any one of claims 1-4.

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