Display panel, preparation method thereof and spliced screen

Abstract

The application provides a display panel, a preparation method thereof and a spliced screen. A first signal wire is arranged on a driving substrate. A plurality of light emitting devices are arranged in an array on the driving substrate and are electrically connected to corresponding first signal wires on the driving substrate. A protective layer is arranged on the light emitting devices and the driving substrate. An exposed end of the first signal wire is exposed from the protective layer. A cladding layer covers the exposed end of the first signal wire to avoid corrosion of the first signal wire, thereby alleviating the problem of corrosion of the metal wire caused by exposure of the metal wire in the existing display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and its manufacturing method, and a splicing screen. Background Technology

[0002] Existing Micro LED and Mini LED display panels require a cell test before entering the module manufacturing process to detect defects. This necessitates the use of test pads on the display panel, which are electrically connected to the metal traces within the panel. After the cell test, the test pads need to be cut. However, cutting exposes the cut surfaces of the metal traces that are electrically connected to the test pads. These exposed traces are directly exposed to moisture and oxygen, which can easily lead to corrosion and consequently, abnormal display panel performance. Summary of the Invention

[0003] This application provides a display panel and its manufacturing method, as well as a splicing screen, to alleviate the technical problem of exposed metal traces leading to circuit corrosion in existing display panels.

[0004] To solve the above problems, the technical solution provided in this application is as follows:

[0005] This application provides a display panel, which includes:

[0006] A driving substrate, on which a first signal trace is provided, the first signal trace being used to transmit test signals when the display panel is performing a lamp-on test;

[0007] Multiple light-emitting devices are arranged in an array on the driving substrate, and each light-emitting device is electrically connected to the corresponding first signal trace on the driving substrate.

[0008] A protective layer is applied to the light-emitting device and the driving substrate, with one end of the first signal trace exposed from the protective layer to form an exposed end; and

[0009] A covering layer that covers the exposed end of the first signal trace.

[0010] In the display panel provided in the embodiments of this application, the covering layer also surrounds and covers the driving substrate and the protective layer on the driving substrate.

[0011] In the display panel provided in this application embodiment, the water vapor transmission rate of the coating layer is less than that of the protective layer.

[0012] In the display panel provided in the embodiments of this application, the display panel further includes a second signal trace and a flip-chip film disposed on the driving substrate. The flip-chip film is electrically connected to the light-emitting device through the second signal trace. There is a gap between the flip-chip film and the protective layer. The covering layer surrounds and covers the flip-chip film and covers the second signal trace within the gap.

[0013] In the display panel provided in the embodiments of this application, the coating layer includes at least one first coating layer, which is a pyrene coating or an inorganic coating.

[0014] In the display panel provided in the embodiments of this application, the coating layer further includes at least one second coating layer, the second coating layer surrounds and covers the first coating layer, wherein one of the first coating layer and the second coating layer is the phenelzine coating and the other is the inorganic coating.

[0015] In the display panel provided in the embodiments of this application, the covering layer further includes at least one third covering layer, which surrounds and covers the second covering layer, wherein the material of the third covering layer is the same as the material of the first covering layer.

[0016] In the display panel provided in the embodiments of this application, the thickness of the Pyrelin coating ranges from 10 micrometers to 30 micrometers, and the thickness of the inorganic coating ranges from 20 angstroms to 60 angstroms.

[0017] This application also provides a method for manufacturing a display panel, which includes:

[0018] A driving substrate is provided, on which a first signal trace is provided. The first signal trace is used to transmit test signals when the display panel is performing a lamp test.

[0019] An array of light-emitting devices is fabricated on the driving substrate, and the light-emitting devices are electrically connected to the corresponding first signal traces;

[0020] A protective layer is formed on the light-emitting device and the driving substrate, wherein one end of the first signal trace is exposed from the protective layer to form an exposed end; and

[0021] An overlay layer is prepared on the driving substrate to cover the exposed end of the first signal trace.

[0022] In the display panel fabrication method provided in this application embodiment, the step of fabricating a cladding layer on the driving substrate includes:

[0023] An inorganic coating is formed by depositing an inorganic material on the driving substrate and the protective layer on the driving substrate using atomic layer deposition to form a first coating layer.

[0024] A paraffin material is deposited on the first coating layer using paraffin vacuum deposition to form a paraffin coating, thereby forming the second coating layer;

[0025] An inorganic coating is formed by depositing an inorganic material on the second coating layer using atomic layer deposition to form the third coating layer.

[0026] This application also provides a video wall, which includes a plurality of display panels spliced ​​together, wherein the display panels include one of the display panels in the foregoing embodiments.

[0027] The beneficial effects of this application are as follows: In the display panel, its manufacturing method, and splicing screen provided by this application, a first signal trace is provided on the driving substrate, and multiple light-emitting devices are arranged in an array on the driving substrate. Each light-emitting device is electrically connected to the corresponding first signal trace on the driving substrate. A protective layer is covered on the light-emitting device and the driving substrate. One end of the first signal trace is exposed from the protective layer to form an exposed end. A covering layer covers the exposed end of the first signal trace to avoid circuit corrosion caused by the exposure of the first signal trace, thus solving the problem of circuit corrosion caused by the exposure of metal traces in existing display panels. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments or prior art, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a top view of a display panel provided in an embodiment of this application.

[0030] Figure 2 This is a cross-sectional structural diagram of a display panel provided in an embodiment of this application.

[0031] Figure 3 This is a schematic diagram showing some details of the structure of the display panel provided in an embodiment of this application.

[0032] Figure 4 This is a top view of another display panel structure provided in an embodiment of this application.

[0033] Figure 5 This is a schematic flowchart of a display panel fabrication method provided in an embodiment of this application.

[0034] Figure 6 This is a cross-sectional structural diagram of the driving substrate provided in an embodiment of this application.

[0035] Figure 7 In order to be in Figure 6 A cross-sectional schematic diagram of the light-emitting device mounted on the driving backplate.

[0036] Figure 8 In order to be in Figure 7 A cross-sectional schematic diagram of the structure covered with a protective layer.

[0037] Figure 9 In order to be in Figure 7 A cross-sectional structural diagram of a flip-chip thin film bonded to the structure.

[0038] Figure 10 In order to be in Figure 9 A cross-sectional structural diagram of the first coating layer prepared on the structure.

[0039] Figure 11 In order to be in Figure 10 A cross-sectional structural diagram of the second coating layer prepared on the structure.

[0040] Figure 12 In order to be in Figure 11 A cross-sectional structural diagram of the preparation of the third coating layer on the structure.

[0041] Figure 13 This is a top view of a splicing screen provided in an embodiment of this application. Detailed Implementation

[0042] The following descriptions of the embodiments are based on the accompanying illustrations, illustrating specific embodiments in which this application can be implemented. Directional terms used in this application, such as [up], [down], [front], [back], [left], [right], [inner], [outer], [side], etc., are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustration and understanding of this application, and not for limiting this application. In the figures, structurally similar units are denoted by the same reference numerals. In the figures, the thickness of some layers and regions is exaggerated for clarity and ease of description. That is, the dimensions and thicknesses of each component shown in the figures are arbitrarily shown, but this application is not limited thereto.

[0043] Please refer to Figures 1 to 3 , Figure 1 This is a top view of a display panel provided in an embodiment of this application. Figure 2 This is a cross-sectional structural diagram of a display panel provided in an embodiment of this application. Figure 3This is a schematic diagram showing some details of the structure of a display panel provided in an embodiment of this application. The display panel 100 includes a driving substrate 10 and a plurality of light-emitting devices 20 arranged in an array on the driving substrate 10. Each light-emitting device 20 is bonded to the driving substrate 10, and there is a gap between adjacent light-emitting devices 20.

[0044] The display panel 100 includes a plurality of pixels P arranged in an array, and each pixel P includes three light-emitting devices 20. The spacing between any two adjacent pixels P is greater than the spacing between any two adjacent light-emitting devices 20 within the same pixel P. The three light-emitting devices 20 of each pixel P emit light of different colors, and each light-emitting device 20 is a sub-pixel. For example, if the three light-emitting devices 20 emit red light, green light, and blue light respectively, then the light-emitting device 20 emitting red light is the red sub-pixel, the light-emitting device 20 emitting green light is the green sub-pixel, and the light-emitting device 20 emitting blue light is the blue sub-pixel. Of course, this application is not limited to this; the three light-emitting devices 20 of each pixel P can also emit light of the same color. In this case, a quantum dot film or similar material needs to be provided in the light-emitting direction of the light-emitting device 20.

[0045] Optionally, the light-emitting device 20 includes a Micro LED chip or a Mini LED chip, etc. A first signal trace 11 and a second signal trace 12 are provided on the driving substrate 10. Each light-emitting device 20 is electrically connected to a corresponding first signal trace 11 on the driving substrate 10. The first signal trace 11 is used to transmit test signals when the display panel 100 performs a lighting test. The second signal trace 12 provides a driving signal for the light emission of the light-emitting device 20. It should be noted that... Figure 2 This illustration is merely to show the connection relationship between the light-emitting device 20 and the first signal trace 11 and the second signal trace 12, and does not distinguish between the first signal trace 11 and the second signal trace 12 corresponding to each light-emitting device 20. Of course, in some embodiments, the first signal trace 11 and the second signal trace 12 can be the same signal trace.

[0046] In one embodiment, the light-emitting device 20 is driven by an active method. A transistor (not shown) is further disposed on the driving substrate 10. The light-emitting device 20 is electrically connected to the corresponding transistor, and the transistor is also electrically connected to the corresponding second signal line 12. The second signal line 12 provides a driving signal to the transistor to control the light-emitting device 20 to emit light. The second signal line 12 includes a source driving signal line, etc. Of course, in other embodiments, the light-emitting device 20 can also be driven by a passive method.

[0047] To protect the light-emitting devices 20 and flatten the step differences between them, the display panel 100 further includes a protective layer 30. The protective layer 30 covers the light-emitting devices 20 and the driving substrate 10, with one end of the first signal trace 11 on the driving substrate 10 exposed through the protective layer 30 to form an exposed end 111. The surface of the protective layer 30 away from the driving substrate 10 is a flat surface, and the surface of the protective layer 30 away from the driving substrate 10 extends beyond the surface of the light-emitting devices 20 away from the driving substrate 10.

[0048] Specifically, continue to refer to Figure 1 and Figure 2 The protective layer 30 fills the spaces between the pixels P and the spaces between the light-emitting devices 20 within the same pixel P. Optionally, the material of the protective layer 30 includes at least one of transparent adhesives such as epoxy resin and silicone.

[0049] To provide a driving signal to the second signal trace 12, a chip-on-film (COF) 50 is bonded to one side of the driving substrate 10. The COF 50 is electrically connected to the second signal trace 12, thereby connecting the COF 50 to the light-emitting device 20 via the second signal trace 12. A gap exists between the COF 50 and the protective layer 30 to prevent interference between them.

[0050] Understandably, in order to reduce the bezel of the display panel 100, the flip-chip film 50 can also be bent to the back surface 14 of the driving substrate 10. The back surface 14 of the driving substrate 10 is the side of the driving substrate 10 away from the light-emitting device 20. For ease of description, as... Figure 3 As shown, in this application, the side of the driving substrate 10 on which the light-emitting device 20 is bonded is defined as the front side 13 of the driving substrate 10, the side of the driving substrate 10 away from the light-emitting device 20 is defined as the back side 14 of the driving substrate 10, and the surface on the driving substrate 10 that connects the front side 13 and the back side 14 of the driving substrate 10 is defined as the side side 15 of the driving substrate 10.

[0051] Correspondingly, the surface of the protective layer 30 furthest from the driving substrate 10 is the upper surface 31 of the protective layer 30, the surface of the protective layer 30 closest to the driving substrate 10 is the lower surface of the protective layer 30, and the surface of the protective layer 30 connecting the upper surface 31 and the lower surface is the side surface 32 of the protective layer 30. The definitions of each surface of the light-emitting device 20 are the same as the definitions of each surface of the protective layer 30, and will not be repeated here.

[0052] Because the display panel 100 needs to undergo a lamp-on test, after the lamp-on test is completed, one end of the first signal trace 11 will be exposed from the protective layer 30, forming an exposed end 111. Figure 3 As shown, the exposed end 111 of the first signal trace 11 is flush with the side surface 32 of the protective layer 30. Thus, the protective layer 30 cannot effectively protect the exposed end 111 of the first signal trace 11, allowing it to directly contact moisture or oxygen, leading to corrosion of the metal circuitry.

[0053] To prevent corrosion of the metal circuit caused by the exposed end 111 of the first signal trace 11, the display panel 100 of this application further includes a covering layer 40, which at least covers the exposed end 111 of the first signal trace 11 to prevent the exposed end 111 of the first signal trace 11 from contacting external moisture or oxygen.

[0054] Optionally, the cladding layer 40 also surrounds and covers the driving substrate 10 and the protective layer 30 on the driving substrate 10. That is, the cladding layer 40 completely wraps the driving substrate 10 and the first signal trace 11, the light-emitting device 20, the protective layer 30, and the flip-chip film 50 on the driving substrate 10, so as to isolate them from the outside world.

[0055] The encapsulation layer 40 surrounds and covers the protective layer 30, which can enhance the water and oxygen barrier performance of the protective layer 30 and improve the encapsulation effect of the display panel 100. In particular, when the light-emitting device 20 adopts active driving and the transistor driving the light-emitting device 20 uses oxide semiconductor material as the semiconductor layer, by having the encapsulation layer 40 surround and cover the protective layer 30, water and oxygen can be further prevented from passing through the protective layer 30 and entering the semiconductor layer of the light-emitting device 20 and the transistor, thereby preventing the light-emitting device 20 and the semiconductor layer of the transistor from failing due to water and oxygen intrusion.

[0056] Optionally, the water vapor transmission rate (WVTR) of the covering layer 40 is lower than that of the protective layer 30, making the covering layer 40 more effective at blocking water and oxygen, thereby further enhancing the water and oxygen barrier performance of the protective layer 30 and further improving the encapsulation effect of the display panel 100.

[0057] Specifically, the coating layer 40 includes at least one first coating layer 41, which is formed by depositing an inorganic film on the driving substrate 10 and the devices on the driving substrate 10 using atomic layer deposition (ALD). The inorganic film material includes inorganic materials such as Al2O3, silicon nitride, silicon oxide, and zirconium oxide. The first coating layer 41 formed by atomic layer deposition is a full-area film layer. Specifically, the first coating layer 41 covers the back side 14 of the driving substrate 10, the side side 15 of the driving substrate 10, the exposed end 111 of the first signal line 11, the side side 32 of the protective layer 30, the upper surface 31 of the protective layer 30, the surfaces of the flip-chip film 50 that are not in contact with the driving substrate 10, and the second signal line 12 in the gap between the flip-chip film 50 and the protective layer 30, so that the first coating layer 41 encapsulates the driving substrate 10 and the devices and films on the driving substrate 10.

[0058] Understandably, the protective layer 30 is made of materials such as epoxy resin and silicone. Epoxy resin has good adhesion, high cross-linking density, and good water vapor transmission rate, effectively preventing moisture from entering the device and ensuring good reliability during high-temperature and high-humidity testing. However, epoxy resin can yellow under high temperatures or short-wavelength light exposure, affecting the optical quality of the product. Silicone, on the other hand, can withstand high temperatures and short-wavelength light exposure, but its adhesion is relatively poor, making it prone to peeling from the interface. Furthermore, silicone has a much lower cross-linking density than epoxy, resulting in poor water vapor transmission rate and an inability to effectively prevent moisture from entering the device, leading to poor performance during high-temperature and high-humidity testing.

[0059] Based on this, the coating layer 40 of this application can effectively compensate for the defects of the protective layer 30. For example, when the first coating layer 41 is formed using atomic layer deposition, the film-forming temperature is less than 80°C, which will not affect the protective layer 30 formed using epoxy resin, thus preventing the protective layer 30 from yellowing. Simultaneously, the water vapor transmission rate of the first coating layer 41 is lower than that of the protective layer 30; for example, the water vapor transmission rate of the first coating layer 41 formed by an inorganic coating is less than 1*10⁻⁶. -4 g / m2 *24h. This strengthens the water and oxygen barrier properties of the protective layer 30 formed using silicone.

[0060] Furthermore, the first cladding layer 41 formed by atomic layer deposition is relatively thin. When it covers the side 15 of the driving substrate 10, the exposed end 111 of the first signal trace 11, and the side 32 of the protective layer 30, it does not excessively increase the width of the bezel of the display panel 100, which is more conducive to achieving a narrow bezel of the display panel 100. Optionally, the thickness of the first cladding layer 41 formed by the inorganic coating ranges from 20 angstroms to 60 angstroms.

[0061] In one embodiment, the first coating layer 41 may also be formed by depositing a parylene (parylene) film on the driving substrate 10 and the devices on the driving substrate 10 using parylene vacuum deposition. The materials for the parylene film include parylene C powder (parylene dichloro-p-xylene dimer), parylene D powder (parylene tetrachloro-p-xylene dimer), etc. The water vapor transmission rate of the first coating layer 41 formed by the parylene film is less than 1*10⁻⁶. -2 g / m 2 *24h, its film thickness ranges from 10 micrometers to 30 micrometers, which is thicker than the thickness of the first coating layer 41 formed by inorganic coating. It can better prevent the display panel 100 from being damaged by impact. Moreover, the surface flatness of the Perylene coating formed by Perylene vacuum coating is very good, and it can be used as a planarization layer to form a smooth surface.

[0062] In one embodiment, please refer to the reference. Figures 1 to 4 , Figure 4 This is another cross-sectional structural diagram of the display panel provided in this application embodiment. Unlike the above embodiment, the covering layer 40 of the display panel 101 includes multiple film layers. Specifically, the covering layer 40 further includes at least one second covering layer 42, which surrounds and covers the first covering layer 41. One of the first covering layer 41 and the second covering layer 42 is a pyrene coating, and the other is an inorganic coating. This embodiment uses the example of the first covering layer 41 being an inorganic coating and the second covering layer 42 being a pyrene coating. Therefore, the thickness of the first covering layer 41 ranges from 20 angstroms to 60 angstroms, and the thickness of the second covering layer 42 ranges from 10 micrometers to 30 micrometers.

[0063] In one embodiment, the coating layer 40 further includes at least one third coating layer 43, which surrounds and covers the second coating layer 42, wherein the material of the third coating layer 43 is the same as that of the first coating layer 41. For example, if the first coating layer 41 is an inorganic coating, then the third coating layer 43 is also an inorganic coating, and the thickness of the third coating layer 43 ranges from 20 angstroms to 60 angstroms.

[0064] Thus, the coating layer 40 employs alternating layers of multilayer inorganic coatings and pyrene coatings, enhancing its water and oxygen barrier capabilities. This provides better protection for the first signal trace 11 and strengthens the water and oxygen barrier performance of the protective layer 30. Simultaneously, the second coating layer 42, formed by the pyrene coating, is located between the first coating layer 41 and the third coating layer 43 formed by the inorganic coatings. This increases the length of the water and oxygen permeation channels, releases stress between the inorganic coatings, and covers unavoidable impurity particles.

[0065] In one embodiment, a method for manufacturing a display panel is also provided, please refer to... Figures 1 to 12 , Figure 5 This is a schematic flowchart of the display panel fabrication method provided in the embodiments of this application. Figure 6 This is a schematic cross-sectional view of the driving substrate provided in an embodiment of this application. Figure 7 In order to be in Figure 6 A cross-sectional diagram of the light-emitting device mounted on the driver backplane. Figure 8 In order to be in Figure 7 A cross-sectional diagram of the structure covered with a protective layer. Figure 9 In order to be in Figure 7 A cross-sectional diagram of the structure in which flip-chip thin films are bonded. Figure 10 In order to be in Figure 9 A schematic diagram of the cross-sectional structure of the first coating layer prepared on the structure. Figure 11 In order to be in Figure 10 A schematic diagram of the cross-sectional structure for fabricating the second coating layer on the structure. Figure 12 In order to be in Figure 11 A cross-sectional structural diagram of the third coating layer fabricated on the structure. The display panel fabrication method includes the following steps:

[0066] S301: A driving substrate 10 is provided, and a first signal trace 11 is provided on the driving substrate 10. The first signal trace 11 is used to transmit test signals when the display panel is performing a lamp test.

[0067] Specifically, such as Figure 6As shown, the driving substrate 10 is provided with a first signal trace 11 and a second signal trace 12. The first signal trace 11 is used to transmit test signals when the display panel is performing a lamp-lighting test, and the second signal trace 12 is used to provide driving signals for the light emission of the display panel. Of course, in some embodiments, the first signal trace 11 and the second signal trace 12 can be the same signal trace.

[0068] S302: An array of light-emitting devices 20 is fabricated on the driving substrate 10, and the light-emitting devices 20 are electrically connected to the corresponding first signal line 11.

[0069] Specifically, a plurality of light-emitting devices 20 arranged in an array are fabricated on a transfer substrate. The light-emitting devices 20 include Micro LED chips or Mini LED chips, etc. Then, the plurality of light-emitting devices 20 are transferred to the driving substrate 10, such that each light-emitting device 20 is bonded to the driving substrate 10, with a gap between adjacent light-emitting devices 20, such as... Figure 7 As shown. Furthermore, each of the light-emitting devices 20 is electrically connected to a corresponding first signal line 11, which is used to transmit test signals when the display panel performs a lighting test. Simultaneously, each of the light-emitting devices 20 is also electrically connected to a corresponding second signal line 12, which provides a driving signal for the light emission of the light-emitting device 20.

[0070] S303: A protective layer 30 is formed on the light-emitting device 20 and the driving substrate 10, and one end of the first signal line 11 is exposed from the protective layer 30 to form an exposed end 111;

[0071] Specifically, the protective layer 30 is formed by applying an encapsulating adhesive to the driving substrate 10 and the light-emitting device 20 using molding or spraying processes. Figure 8 As shown. Specifically, a transparent encapsulating material such as epoxy resin or silicone is filled into the gaps of the light-emitting device 20 using a molding or spraying process, and the light-emitting device 20 is wrapped to form the protective layer 30. The protective layer 30 covers the upper surface and side surface of the light-emitting device 20, a portion of the surface of the first signal trace 11, and a portion of the surface of the driving substrate 10, and the upper surface 31 of the protective layer 30 extends beyond the upper surface of the light-emitting device 20.

[0072] Furthermore, in order to provide a driving signal to the second signal trace 12, a flip-chip film 50 is also bonded to one side of the driving substrate 10. The flip-chip film 50 is electrically connected to the second signal trace 12, such as... Figure 9As shown. A gap exists between the flip-chip film 50 and the protective layer 30 to avoid interference between them. It is understood that, in order to reduce the bezel of the display panel 100, the flip-chip film 50 may also be bent to the back surface 14 of the driving substrate 10.

[0073] S304: A cladding layer 40 is prepared on the driving substrate 10, such that the cladding layer 40 covers the exposed end 111 of the first signal trace 11;

[0074] Specifically, an inorganic coating is formed by depositing inorganic material on the driving substrate 10, the first signal trace 11 on the driving substrate 10, and the protective layer 30 using atomic layer deposition to form the first coating layer 41. Figure 10 As shown. The first coating layer 41, formed by atomic layer deposition, is a single-layer film. Specifically, the first coating layer 41 sequentially covers the back surface 14 of the driving substrate 10, the side surface 15 of the driving substrate 10, the exposed end 111 of the first signal trace 11, the side surface 32 of the protective layer 30, the upper surface 31 of the protective layer 30, the surfaces of the flip-chip film 50 that are not in contact with the driving substrate 10, and the first signal trace 11 within the gap between the flip-chip film 50 and the protective layer 30. This allows the first coating layer 41 to encapsulate the driving substrate 10 and all the devices and films on the driving substrate 10, thus preventing the exposed end 111 of the first signal trace 11 from being exposed and causing corrosion of the metal lines.

[0075] Optionally, the inorganic coating material includes inorganic materials such as Al2O3, silicon nitride, silicon oxide, and zirconium oxide. Inorganic materials have good water and oxygen barrier properties, so the water vapor transmission rate of the first coating layer 41 formed by the inorganic coating is less than that of the protective layer 30. For example, the water vapor transmission rate of the first coating layer 41 formed by the inorganic coating is less than 1*10. -4 g / m 2 *24h, thus enhancing the water and oxygen barrier properties of the protective layer 30 formed with silicone. Simultaneously, when forming the first coating layer 41 using atomic layer deposition, the film-forming temperature is less than 80℃, which will not affect the protective layer 30 formed with epoxy resin, preventing yellowing of the protective layer 30.

[0076] Optionally, the thickness of the first cladding layer 41 formed by the inorganic coating ranges from 20 angstroms to 60 angstroms. Thus, when the first cladding layer 41 covers the side 15 of the driving substrate 10, the exposed end 111 of the first signal trace 11, and the side 32 of the protective layer 30, it does not excessively increase the width of the display panel bezel, which is more conducive to achieving a narrow bezel for the display panel, thereby facilitating the splicing of multiple display panels.

[0077] Furthermore, a phenelin coating is formed by depositing phenelin material on the first coating layer 41 using phenelin vacuum deposition, thereby forming a second coating layer 42. The second coating layer 42 surrounds and covers the first coating layer 41, as shown below. Figure 11 As shown. The materials used in the pyrene coating include pyrene C powder, pyrene D powder, etc. The water vapor transmission rate of the second coating layer 42 formed by the pyrene coating is less than 1*10. -2 g / m 2 *24h, its film thickness ranges from 10 micrometers to 30 micrometers, which is thicker than the thickness of the first coating layer 41 formed by inorganic coating. It can better prevent the display panel from being damaged by impact. Moreover, the surface flatness of the Perelin coating formed by vacuum coating is very good, and it can be used as a planarization layer to form a smooth surface.

[0078] Furthermore, an inorganic coating is formed by depositing an inorganic material on the second coating layer 42 using atomic layer deposition (ALD) to form a third coating layer 43. The third coating layer 43 surrounds and covers the second coating layer 42, such as... Figure 12 As shown. The material of the third coating layer 43 is the same as that of the first coating layer 41. The thickness of the third coating layer 43 ranges from 20 angstroms to 60 angstroms, and the water vapor transmission rate of the third coating layer 43 is less than 1*10. -4 g / m 2 *24h.

[0079] Thus, the coating layer 40 employs alternating layers of multilayer inorganic coatings and pyrene coatings, enhancing its water and oxygen barrier capabilities. This provides better protection for the first signal trace 11 and further strengthens the water and oxygen barrier performance of the protective layer 30. Simultaneously, the second coating layer 42, formed by the pyrene coating, is located between the first coating layer 41 and the third coating layer 43 formed by the inorganic coatings. This increases the length of the water and oxygen permeation channels, releases stress between the inorganic coatings, and covers unavoidable impurity particles.

[0080] Based on the same inventive concept, this application also provides a video wall, see reference. Figures 1 to 13 , Figure 13This is a top view structural diagram of a splicing screen provided in an embodiment of this application. The splicing screen 1000 includes multiple display panels 101, which include one of the display panels 101 in the aforementioned embodiments. This embodiment uses the display panel 101 as an example for illustration. When multiple display panels 101 are spliced ​​together to form the splicing screen, since the cladding layer 40 of the display panels 101 is formed by atomic layer deposition and / or Pyrelin vacuum coating, the film thickness of the cladding layer 40 is relatively thin. Thus, while protecting the first signal trace 11, the bezel of the display panels 101 is not excessively increased, resulting in a smaller splicing seam in the splicing screen 1000 formed by splicing multiple display panels 101.

[0081] It should be noted that, in order to prevent the covering layer 40 from affecting the connection between the flip-chip film 50 on the display panel 101 and the external circuit during the splicing process, the covering layer 40 is provided with an opening (not shown in the figure) at the position where the flip-chip film 50 needs to be connected to the external circuit. For example, when preparing the covering layer 40, a jig or other shielding device can be used to shield the position where the flip-chip film 50 needs to be connected to the external circuit to form the opening, so as to prevent the covering layer 40 from affecting the splicing of the display panel 101.

[0082] As can be seen from the above embodiments:

[0083] This application provides a display panel and its manufacturing method, as well as a splicing screen. In this method, a first signal trace is provided on a driving substrate, and multiple light-emitting devices are arranged in an array on the driving substrate. Each light-emitting device is electrically connected to the corresponding first signal trace on the driving substrate. A protective layer covers the light-emitting devices and the driving substrate. One end of the first signal trace is exposed from the protective layer to form an exposed end. A covering layer surrounds and covers the driving substrate, the exposed end of the first signal trace on the driving substrate, and the protective layer to avoid circuit corrosion caused by the exposed first signal trace. This solves the problem of circuit corrosion caused by exposed metal traces in existing display panels.

[0084] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0085] The embodiments of this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display panel, characterized in that, include: A driving substrate, on which a first signal trace is provided, the first signal trace being used to transmit test signals when the display panel is performing a lamp-on test; Multiple light-emitting devices are arranged in an array on the driving substrate, and each light-emitting device is electrically connected to the corresponding first signal line on the driving substrate. The light-emitting devices include Micro LED chips or Mini LED chips. A protective layer is applied to the light-emitting device and the driving substrate. One end of the first signal trace is exposed from the protective layer to form an exposed end, and the exposed end of the first signal trace is flush with the side of the protective layer. as well as The coating layer includes at least one first coating layer, wherein the first coating layer is an inorganic film, and the film-forming temperature of the first coating layer is lower than the yellowing temperature of the protective layer; The first covering layer covers the back side of the driving substrate, the side side of the driving substrate, the exposed end of the first signal trace, the side side of the protective layer, and the upper surface of the protective layer.

2. The display panel according to claim 1, characterized in that, The covering layer also surrounds and covers the driving substrate and the protective layer on the driving substrate.

3. The display panel according to claim 2, characterized in that, The water vapor transmission rate of the coating layer is less than that of the protective layer.

4. The display panel according to claim 1, characterized in that, The display panel further includes a second signal trace and a flip-chip film disposed on the driving substrate. The flip-chip film is electrically connected to the light-emitting device through the second signal trace. There is a gap between the flip-chip film and the protective layer. The covering layer surrounds and covers the flip-chip film and covers the second signal trace within the gap.

5. The display panel according to claim 1, characterized in that, The coating layer further includes at least one second coating layer, which surrounds and covers the first coating layer, and the second coating layer is a Piriton coating.

6. The display panel according to claim 5, characterized in that, The covering layer further includes at least one third covering layer that surrounds and covers the second covering layer, wherein the material of the third covering layer is the same as the material of the first covering layer.

7. The display panel according to claim 5, characterized in that, The thickness of the phenelzine coating ranges from 10 micrometers to 30 micrometers, and the thickness of the inorganic coating ranges from 20 angstroms to 60 angstroms.

8. A method for manufacturing a display panel, characterized in that, include: A driving substrate is provided, on which a first signal trace is provided. The first signal trace is used to transmit test signals when the display panel is performing a lamp test. An array of light-emitting devices is fabricated on the driving substrate. The light-emitting devices are electrically connected to the corresponding first signal lines. The light-emitting devices include Micro LED chips or Mini LED chips. A protective layer is prepared on the light-emitting device and the driving substrate, and one end of the first signal trace is exposed from the protective layer to form an exposed end, and the exposed end of the first signal trace is flush with the side of the protective layer. as well as A coating layer is prepared on the driving substrate. The coating layer includes at least one first coating layer, which is an inorganic film, and the film formation temperature of the first coating layer is lower than the yellowing temperature of the protective layer. The first covering layer covers the back side of the driving substrate, the side side of the driving substrate, the exposed end of the first signal trace, the side side of the protective layer, and the upper surface of the protective layer.

9. The method for manufacturing a display panel according to claim 8, characterized in that, The step of preparing a coating layer on the driving substrate includes: An inorganic coating is formed by depositing an inorganic material on the driving substrate and the protective layer on the driving substrate using atomic layer deposition to form a first coating layer. A paraffin material is deposited on the first coating layer using paraffin vacuum deposition to form a paraffin coating, thereby forming the second coating layer; An inorganic coating is formed by depositing an inorganic material on the second coating layer using atomic layer deposition to form the third coating layer.

10. A video wall, characterized in that, It includes multiple display panels that are spliced ​​together, and the display panels include the display panels as described in any one of claims 1 to 7.

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