A leveling mechanism and a diaphragm bonding device
By adjusting the parallelism of the diaphragm using a leveling mechanism, the problem of air bubbles during diaphragm bonding was solved, resulting in a better bonding effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- KUNSHAN SAMON AUTOMATION TECH
- Filing Date
- 2022-09-20
- Publication Date
- 2026-05-26
Smart Images

Figure CN115503228B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of diaphragm bonding technology, and more particularly to a leveling mechanism and a diaphragm bonding device. Background Technology
[0002] In the prior art, due to production needs, a bonding device is required to bond two films together. For example, in the prior art, a bonding device is usually used to bond a protective film to a glass lens to prevent the glass lens from being scratched. However, current bonding devices do not adjust the parallelism of the two films during the bonding process, which makes it easy for defects such as air bubbles to form between the two films after bonding, resulting in poor bonding effect between the two films.
[0003] Therefore, the above problems urgently need to be solved. Summary of the Invention
[0004] The purpose of this invention is to provide a leveling mechanism and a diaphragm bonding device to solve the problem that defects such as air bubbles are easily generated between two diaphragms after they are bonded together, resulting in poor bonding effect between the two diaphragms.
[0005] To achieve this objective, the present invention adopts the following technical solution:
[0006] The present invention provides a leveling mechanism for adjusting the parallelism of a first membrane and a second membrane respectively adsorbed on opposite sides of a first adsorption plate and a second adsorption plate, the leveling mechanism comprising:
[0007] The first adjustment unit includes a first rod, one end of which is connected to the side of the first adsorption plate away from the second adsorption plate via a first ball bearing;
[0008] The second adjustment unit includes a first movable member and a second rod. The first movable member is mounted on the side of the first adsorption plate opposite to the second adsorption plate. One end of the second rod is connected to the first movable member via a second ball bearing. The second rod is capable of moving along the arrangement direction of the first and second adsorption plates.
[0009] The third adjustment unit includes a second movable component and a third rod. The second movable component is installed on the side of the first adsorption plate away from the second adsorption plate. One end of the third rod is connected to the second movable component through a third ball bearing. The third rod can move along the arrangement direction of the first adsorption plate and the second adsorption plate.
[0010] The first rod, the second rod, and the third rod are arranged in a triangle. The first moving member enables the second rod and the first adsorption plate to move relative to each other along a first direction, which is parallel to the arrangement direction of the first rod and the second rod. The second moving member enables the third rod and the first adsorption plate to move relative to each other along the first direction and / or a second direction perpendicular to the first direction.
[0011] Preferably, the first moving member includes a first slider and a first mounting block, the first mounting block is fixedly connected to the first adsorption plate, the first slider is slidably connected to the first mounting block along the first direction, and the second rod is connected to the first slider through the second ball bearing.
[0012] Preferably, the second moving member includes a second slider, a third slider, and a second mounting block. The second mounting block is fixedly connected to the first adsorption plate. The second slider is slidably connected to the second mounting block along the first direction. The third slider is slidably connected to the second slider along the second direction. The third rod is connected to the third slider through the third ball bearing.
[0013] Preferably, the leveling mechanism further includes a height sensor configured to acquire at least three positions on the first diaphragm and the spacing between the second diaphragm.
[0014] Preferably, the height sensor includes a laser head, the first adsorption plate has a through hole and a plurality of adsorption holes, the plurality of adsorption holes being arranged at intervals around the outer periphery of the through hole, the laser head being located on the side of the first adsorption plate opposite to the second adsorption plate and capable of emitting laser light into the through hole, and the leveling mechanism further includes a driving unit configured to drive the height sensor to move in a direction perpendicular to the arrangement direction of the first adsorption plate and the second adsorption plate.
[0015] Preferably, a pad is fixedly connected to the side of the first adsorption plate away from the second adsorption plate, and the first rod is connected to the pad through the first ball bearing. The pad, the first moving member, and the second moving member are of equal height.
[0016] Preferably, the second adjustment unit and the third adjustment unit further include a first driving member and a second driving member, respectively. The first driving member is configured to drive the second rod to move along the arrangement direction of the first adsorption plate and the second adsorption plate, and the second driving member is configured to drive the third rod to move along the arrangement direction of the first adsorption plate and the second adsorption plate.
[0017] In another aspect, the present invention provides a film bonding device, including a first adsorption plate and a second adsorption plate disposed opposite to each other, and a leveling mechanism as described above, wherein the first adsorption plate and the second adsorption plate are movable relative to each other.
[0018] Preferably, the film bonding device further includes a third driving member, which is configured to drive the first rod to move along the arrangement direction of the first adsorption plate and the second adsorption plate.
[0019] Preferably, the diaphragm bonding device further includes a displacement sensor configured to detect the movement distance of the first rod.
[0020] The beneficial effects of this invention are as follows: Using the first rod as a reference, the parallelism of the first membrane adsorbed on the first adsorption plate and the second membrane adsorbed on the second adsorption plate is adjusted by moving the second and third rods. This avoids defects such as air bubbles between the two membranes after they are bonded together, thereby improving the bonding effect between the first and second membranes. When the second and third rods move along the arrangement direction of the first and second adsorption plates, the first ball bearing, the second ball bearing, the third ball bearing, the first moving part, and the second moving part work together to ensure that the first rod, the second rod, the third rod, and the first adsorption plate are not damaged. Furthermore, the membrane bonding device of this invention also includes the leveling mechanism described above, which allows for adjustment of the parallelism between the first and second membranes before bonding, thus avoiding defects such as air bubbles between the two membranes after bonding, and further improving the bonding effect between the first and second membranes. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the diaphragm bonding device in an embodiment of the present invention. Figure 1 ;
[0022] Figure 2 This is a schematic diagram of the diaphragm bonding device in an embodiment of the present invention. Figure 2 ;
[0023] Figure 3 This is a schematic diagram of the diaphragm bonding device in an embodiment of the present invention. Figure 3 ;
[0024] Figure 4 This is a schematic diagram of the structure of the first adsorption plate in an embodiment of the present invention;
[0025] Figure 5 yes Figure 4 A magnified view of a portion of point A in the middle.
[0026] In the picture:
[0027] 100. First adsorption plate; 110. Through hole; 120. Adsorption hole;
[0028] 210. First adjustment unit; 211. First rod; 212. First ball bearing; 220. Second adjustment unit; 221. First moving part; 2211. First slider; 2212. First mounting block; 222. Second rod; 223. Second ball bearing; 224. First drive component; 225. First screw; 230. Third adjustment unit; 231. Second moving part; 2311. Second slider; 2312. Third slider; 2313. Second mounting block; 232. Third rod; 233. Third ball bearing; 234. Second drive component; 235. Second screw; 240. Height sensor; 241. Laser head; 250. Drive unit; 251. Fourth drive component; 252. Fifth drive component; 253. Sixth drive component; 260. Pad; 270. Mounting bracket; 280. First connecting plate; 290. Second connecting plate;
[0029] 300. Third drive component;
[0030] 400. Displacement sensor;
[0031] 500, Third connecting plate;
[0032] 600, Third screw. Detailed Implementation
[0033] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.
[0034] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0035] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0036] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.
[0037] Please see Figures 1 to 3 This embodiment provides a membrane bonding device, which includes a first adsorption plate 100 and a second adsorption plate (not shown in the figure) arranged opposite to each other. A first membrane and a second membrane are respectively adsorbed on opposite sides of the first adsorption plate 100 and the second adsorption plate. The first adsorption plate 100 and the second adsorption plate can move relative to each other to bond the first membrane and the second membrane together. Based on the above, if the parallelism of the first membrane and the second membrane is not corrected before bonding them together, defects such as air bubbles will easily be generated between the bonded first membrane and the second membrane, resulting in a poor bonding effect between the first membrane and the second membrane.
[0038] To avoid defects such as air bubbles that can easily form between the first and second films after lamination, please refer to [further details]. Figures 1 to 3This embodiment also provides a leveling mechanism for adjusting the parallelism of a first diaphragm and a second diaphragm respectively adsorbed on opposite sides of a first adsorption plate 100 and a second adsorption plate. The leveling mechanism includes a first adjustment unit 210, a second adjustment unit 220, and a third adjustment unit 230. The first adjustment unit 210 includes a first rod 211, one end of which is connected to the side of the first adsorption plate 100 away from the second adsorption plate via a first ball bearing 212. The second adjustment unit 220 includes a first moving member 221 and a second rod 222. The first moving member 221 is mounted on the side of the first adsorption plate 100 away from the second adsorption plate, and one end of the second rod 222 is connected to the first moving member 221 via a second ball bearing 223. The second rod 222 is oriented along the first adsorption plate 100 and the second adsorption plate... The third adjustment unit 230, which moves in the arrangement direction, includes a second moving member 231 and a third rod 232. The second moving member 231 is mounted on the side of the first adsorption plate 100 away from the second adsorption plate. One end of the third rod 232 is connected to the second moving member 231 through a third ball bearing 233. The third rod 232 can move along the arrangement direction of the first adsorption plate 100 and the second adsorption plate. The first rod 211, the second rod 222 and the third rod 232 are arranged in a triangle. The first moving member 221 can make the second rod 222 and the first adsorption plate 100 move relative to each other in a first direction, which is parallel to the arrangement direction of the first rod 211 and the second rod 222. The second moving member 231 can make the third rod 232 and the first adsorption plate 100 move relative to each other in the first direction and / or in a second direction perpendicular to the first direction.
[0039] In this embodiment, the first rod 211 is used as a reference. The parallelism between the first membrane adsorbed on the first adsorption plate 100 and the second membrane adsorbed on the second adsorption plate is adjusted by moving the second rod 222 and the third rod 232. This avoids defects such as air bubbles between the two membranes after they are bonded together, thereby improving the bonding effect between the first membrane and the second membrane. When the second rod 222 and the third rod 232 move along the arrangement direction of the first adsorption plate 100 and the second adsorption plate, the first ball bearing 212, the second ball bearing 223, the third ball bearing 233, the first moving part 221 and the second moving part 231 work together to ensure that the first rod 211, the second rod 222, the third rod 232 and the first adsorption plate 100 are not damaged.
[0040] In this embodiment, the first adsorption plate 100 and the second adsorption plate are arranged vertically at intervals. The second adsorption plate is located below the first adsorption plate 100, and the adsorption surfaces of the first adsorption plate 100 and the second adsorption plate are opposite to each other. The first adsorption plate 100 and the second adsorption plate can move relative to each other to make the first membrane adhere to the second membrane. The first rod 211, the second rod 222 and the third rod 232 all extend vertically. Before the first adsorption plate 100 and the second adsorption plate move relative to each other and make the first membrane adhere to the second membrane, the second rod 222 and the third rod 232 are moved vertically with the first rod 211 as a reference to adjust the parallelism between the adsorption surfaces of the first adsorption plate 100 and the second adsorption plate, thereby adjusting the parallelism between the first membrane and the second membrane. When the second rod 222 and the third rod 232 move vertically, the first adsorption plate 100 can rotate relative to the first rod 211 via the first ball bearing 212, and can rotate relative to the second rod 222 via the second ball bearing 223, and / or rotate relative to the third rod 232 via the third ball bearing 233. At the same time, the first adsorption plate 100 moves relative to the second rod 222 in a first direction via the first moving member 221, and moves relative to the third rod 232 in a second direction via the second moving member 231. This adjusts the parallelism between the adsorption surface of the first adsorption plate 100 and the adsorption surface of the second adsorption plate, while preventing damage to the first rod 211, the second rod 222, the third rod 232, and the first adsorption plate 100.
[0041] Preferably, in this embodiment, a pad 260 is fixedly connected to the side of the first adsorption plate 100 away from the second adsorption plate. The first rod 211 is connected to the pad 260 through the first ball bearing 212. The pad 260, the first moving member 221 and the second moving member 231 are at the same height. That is, in this embodiment, the distance between the first ball bearing 212, the second ball bearing 223 and the third ball bearing 233 and the first adsorption plate 100 is equal, thereby further preventing damage to the first rod 211, the second rod 222, the third rod 232 and the first adsorption plate 100.
[0042] It should be noted that the membrane bonding device in this embodiment also includes the leveling mechanism described above, which can adjust the parallelism between the first membrane and the second membrane before bonding the first membrane and the second membrane, so as to avoid defects such as air bubbles between the two membranes after bonding, thereby improving the bonding effect between the first membrane and the second membrane.
[0043] It is understood that the first and second films mentioned above can be thin films, glass lenses, etc. That is, the film bonding device in this embodiment can either bond two thin films together or bond a thin film to a glass lens. This embodiment does not impose any specific restrictions on this.
[0044] Preferably, in this embodiment, the second adjustment unit 220 and the third adjustment unit 230 further include a first driving member 224 and a second driving member 234, respectively. The first driving member 224 is configured to drive the second rod 222 to move along the arrangement direction of the first adsorption plate 100 and the second adsorption plate, and the second driving member 234 is configured to drive the third rod 232 to move along the arrangement direction of the first adsorption plate 100 and the second adsorption plate. Specifically, the leveling mechanism in this embodiment further includes a mounting frame 270, a first connecting plate 280, and a second connecting plate 290. The first connecting plate 280 and the second connecting plate 290 are slidably connected to the mounting frame 270 along the arrangement direction of the first adsorption plate 100 and the second adsorption plate. The first connecting plate 280 and the second connecting plate 290 are respectively connected to the other ends of the second rod 222 and the third rod 232. The movable ends of the first driving member 224 and the second driving member 234 are respectively connected to the first screw 225 and the second screw 235. The first connecting plate 280 and the second connecting plate 290 are respectively screwed to the first screw 225 and the second screw 235. The first driving member 224 and the second driving member 234 can drive the first screw 225 and the second screw 235 to rotate, thereby causing the first connecting plate 280 and the second connecting plate 290 to move along the arrangement direction of the first adsorption plate 100 and the second adsorption plate.
[0045] Furthermore, the film bonding device in this embodiment also includes a third driving member 300, which is configured to drive the first rod 211 to move along the arrangement direction of the first adsorption plate 100 and the second adsorption plate. Specifically, the membrane bonding device further includes a third connecting plate 500, which is slidably connected to the mounting frame 270 along the arrangement direction of the first adsorption plate 100 and the second adsorption plate. The third connecting plate 500 is connected to the other end of the first rod 211. The movable end of the third driving member 300 is connected to the third screw 600. The third connecting plate 500 is screwed to the third screw 600. The third driving member 300 can drive the third screw 600 to rotate, thereby moving the third connecting plate 500 along the arrangement direction of the first adsorption plate 100 and the second adsorption plate. In this embodiment, the first driving member 224, the second driving member 234 and the third driving member 300 can work simultaneously, so that the first rod 211, the second rod 222 and the third rod 232 move synchronously, thereby moving the first adsorption plate 100 toward the second adsorption plate, and thus bonding the first membrane and the second membrane.
[0046] It is understood that the first driving component 224, the second driving component 234 and the third driving component 300 in this embodiment can all be selected from any one of the driving structures such as stepper motor and servo motor, and no specific limitation is made in this embodiment.
[0047] Furthermore, the diaphragm bonding device also includes a displacement sensor 400, which is configured to detect the moving distance of the first rod 211. In this embodiment, the displacement sensor 400 is a grating sensor, which is fixedly connected to the third connecting plate 500 to detect the moving distance of the third connecting plate 500, thereby ensuring that the first diaphragm can be accurately bonded to the second diaphragm.
[0048] Based on the above, the first moving member 221 in this embodiment includes a first slider 2211 and a first mounting block 2212. The first mounting block 2212 is fixedly connected to the first adsorption plate 100. The first slider 2211 is slidably connected to the first mounting block 2212 along a first direction. The second rod 222 is connected to the first slider 2211 through a second ball bearing 223. When the second rod 222 moves along the arrangement direction of the first adsorption plate 100 and the second adsorption plate, the first mounting block 2212 can move relative to the first slider 2211 along the first direction. At the same time, the first slider 2211 and the first mounting block 2212 can rotate relative to the second rod 222.
[0049] Furthermore, the second moving member 231 includes a second slider 2311, a third slider 2312, and a second mounting block 2313. The second mounting block 2313 is fixedly connected to the first adsorption plate 100. The second slider 2311 is slidably connected to the second mounting block 2313 along a first direction. The third slider 2312 is slidably connected to the second slider 2311 along a second direction. The third rod 232 is connected to the third slider 2312 via a third ball bearing 233. When the third rod 232 moves along the arrangement direction of the first adsorption plate 100 and the second adsorption plate, the second mounting block 2313 can move relative to the second slider 2311 along the first direction, and the second mounting block 2313 and the second slider 2311 can move relative to the third slider 2312 along the second direction. At the same time, the second slider 2311, the third slider 2312, and the second mounting block 2313 can rotate relative to the third rod 232.
[0050] Preferably, the leveling mechanism in this embodiment further includes a height sensor 240, which is configured to acquire at least three positions on the first diaphragm and the distance between the second diaphragm. That is, this embodiment can detect the parallelism between the first diaphragm and the second diaphragm by comparing at least three positions on the first diaphragm and the distance between the second diaphragm.
[0051] It is understood that the leveling mechanism in this embodiment also includes a controller (not shown in the figure). The height sensor 240 in this embodiment is communicatively connected to the controller. The controller is electrically connected to the first drive member 224, the second drive member 234, and the third drive member 300. When the parallelism between the first diaphragm and the second diaphragm meets the requirements, the controller controls the first drive member 224, the second drive member 234, and the third drive member 300 to start working simultaneously, so that the first rod 211, the second rod 222, and the third rod 232 move synchronously. When the parallelism between the first diaphragm and the second diaphragm does not meet the requirements, ... The height sensor 240 converts the detected at least three positions on the first diaphragm and the distance between the second diaphragm into electrical signals and transmits them to the controller. The controller controls the first drive member 224 to stop working, and simultaneously controls the second drive member 234 and the third drive member 300 to start working, and causes the second rod 222 and the third rod 232 to move along the arrangement direction of the first adsorption plate 100 and the second adsorption plate, respectively. The moving distance of the second rod 222 and the third rod 232 is calculated by the controller based on the at least three positions on the first diaphragm and the distance between the second diaphragm detected by the height sensor 240.
[0052] like Figure 1 and Figure 2 As shown, the height sensor 240 preferably includes a laser head 241, combined with... Figure 4 and Figure 5The first adsorption plate 100 is provided with a through hole 110 and a plurality of adsorption holes 120. The plurality of adsorption holes 120 are arranged at intervals around the outline of the through hole 110. That is, when the first membrane is adsorbed onto the first adsorption plate 100, the middle part of the first membrane can be exposed through the through hole 110. The laser head 241 is located on the side of the first adsorption plate 100 away from the second adsorption plate and can emit a laser towards the through hole 110 to detect the distance between the laser head 241 and any position on the first membrane exposed in the through hole 110. The leveling mechanism in this embodiment also includes a driving unit 250, which is configured to drive the height sensor 240 to move in a direction perpendicular to the arrangement direction of the first adsorption plate 100 and the second adsorption plate. Based on the above, the first adsorption plate 100 and the second adsorption plate in this embodiment are arranged at intervals in the vertical direction. Therefore, the driving unit 250 in this embodiment can drive the height sensor 240 to move in the horizontal direction to sequentially detect the distance between the laser head 241 and at least three positions exposed on the first diaphragm in the through hole 110. Since the laser head 241 in this embodiment is fixed along the arrangement direction of the first adsorption plate 100 and the second adsorption plate, that is, the distance between the laser head 241 and the second adsorption plate is fixed, in this embodiment, by detecting the distance between the laser head 241 and any position on the first membrane exposed in the through hole 110, the distance between that position on the first membrane and the second membrane adsorbed on the second adsorption plate can be obtained. Specifically, for any position on the first membrane exposed in the through hole 110, the distance between that position on the first membrane and the second membrane adsorbed on the second adsorption plate is equal to the distance between the laser head 241 and the second membrane adsorbed on the second adsorption plate minus the distance between the laser head 241 and that position on the first membrane.
[0053] It is understood that the displacement sensor 400 mentioned above is also fixedly connected to the first connecting plate 280 and the second connecting plate 290 in this embodiment, so as to detect the movement distance of the first connecting plate 280 and the second connecting plate respectively when adjusting the parallelism of the first diaphragm and the second diaphragm.
[0054] For example, the driving unit 250 in this embodiment includes a fourth driving member 251, a fifth driving member 252, and a sixth driving member 253. The fourth driving member 251 is used to drive the fifth driving member 252 and the sixth driving member 253 to move along a second direction. The fifth driving member 252 is used to drive the sixth driving member 253 to move along a first direction. The height sensor 240 is connected to the movable end of the sixth driving member 253. The sixth driving member 253 is used to drive the height sensor 240 to move along the first direction. The stroke of the height sensor 240 along the first direction is formed by the joint drive of the fifth driving member 252 and the sixth driving member 253 to increase the stroke of the height sensor 240 along the first direction.
[0055] It is understood that the fourth driving component 251, the fifth driving component 252 and the sixth driving component 253 in this embodiment can all be selected as any one of the driving structures such as stepper motor and servo motor, and no specific limitation is made in this embodiment.
[0056] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.
Claims
1. A leveling mechanism for adjusting the parallelism of a first membrane and a second membrane respectively adsorbed on opposite sides of a first adsorption plate (100) and a second adsorption plate, characterized in that, The leveling mechanism includes: The first adjustment unit (210) includes a first rod (211), one end of which is connected to the side of the first adsorption plate (100) away from the second adsorption plate via a first ball bearing (212); The second adjustment unit (220) includes a first movable member (221) and a second rod member (222). The first movable member (221) is mounted on the side of the first adsorption plate (100) facing away from the second adsorption plate. One end of the second rod member (222) is connected to the first movable member (221) via a second ball bearing (223). The second rod member (222) is movable along the arrangement direction of the first adsorption plate (100) and the second adsorption plate. The third adjustment unit (230) includes a second moving part (231) and a third rod (232). The second moving part (231) is installed on the side of the first adsorption plate (100) away from the second adsorption plate. One end of the third rod (232) is connected to the second moving part (231) through a third ball bearing (233). The third rod (232) can move along the arrangement direction of the first adsorption plate (100) and the second adsorption plate. The first rod (211), the second rod (222), and the third rod (232) are arranged in a triangle. The first moving member (221) enables the second rod (222) and the first adsorption plate (100) to move relative to each other along a first direction, which is parallel to the arrangement direction of the first rod (211) and the second rod (222). The second moving member (231) enables the third rod (232) and the first adsorption plate (100) to move relative to each other along the first direction and / or in a second direction perpendicular to the first direction. The first moving member (221) includes a first slider (2211) and a first mounting block (2212). The first mounting block (2212) is fixedly connected to the first adsorption plate (100). The first slider (2211) is slidably connected to the first mounting block (2212) along the first direction. The second rod (222) is connected to the first slider (2211) through the second ball bearing (223). The second moving part (231) includes a second slider (2311), a third slider (2312), and a second mounting block (2313). The second mounting block (2313) is fixedly connected to the first adsorption plate (100). The second slider (2311) is slidably connected to the second mounting block (2313) along the first direction. The third slider (2312) is slidably connected to the second slider (2311) along the second direction. The third rod (232) is connected to the third slider (2312) through the third ball bearing (233). A pad (260) is fixedly connected to the side of the first adsorption plate (100) away from the second adsorption plate. The first rod (211) is connected to the pad (260) through the first ball bearing (212). The pad (260), the first moving part (221) and the second moving part (231) are of equal height.
2. The leveling mechanism according to claim 1, characterized in that, The leveling mechanism further includes a height sensor (240) configured to acquire at least three positions on the first diaphragm and the distance between the second diaphragm.
3. The leveling mechanism according to claim 2, characterized in that, The height sensor (240) includes a laser head (241). The first adsorption plate (100) is provided with a through hole (110) and a plurality of adsorption holes (120) are provided on the first adsorption plate (100). The plurality of adsorption holes (120) are arranged at intervals around the outer periphery of the through hole (110). The laser head (241) is located on the side of the first adsorption plate (100) away from the second adsorption plate and can emit laser light into the through hole (110). The leveling mechanism also includes a driving unit (250). The driving unit (250) is configured to drive the height sensor (240) to move in a direction perpendicular to the arrangement direction of the first adsorption plate (100) and the second adsorption plate.
4. The leveling mechanism according to claim 1, characterized in that, The second adjustment unit (220) and the third adjustment unit (230) further include a first driving member (224) and a second driving member (234), respectively. The first driving member (224) is configured to drive the second rod (222) to move along the arrangement direction of the first adsorption plate (100) and the second adsorption plate, and the second driving member (234) is configured to drive the third rod (232) to move along the arrangement direction of the first adsorption plate (100) and the second adsorption plate.
5. A diaphragm bonding device, characterized in that, Includes a first adsorption plate (100) and a second adsorption plate arranged opposite to each other, and a leveling mechanism as described in any one of claims 1-4, wherein the first adsorption plate (100) and the second adsorption plate are capable of moving relative to each other.
6. The diaphragm bonding device according to claim 5, characterized in that, The film bonding device further includes a third driving member (300), which is configured to drive the first rod (211) to move along the arrangement direction of the first adsorption plate (100) and the second adsorption plate.
7. The diaphragm bonding device according to claim 6, characterized in that, The diaphragm bonding device further includes a displacement sensor (400) configured to detect the movement distance of the first rod (211).