Method for manufacturing light emitting diode display panel

Abstract

A manufacturing method of a light emitting diode display panel includes the following steps. An initial driving substrate and an initial protection substrate are combined together by using a frame adhesive in a vacuum environment. Then, the initial driving substrate and the initial protection substrate are cut to remove a first peripheral portion of the initial driving substrate and a second peripheral portion of the initial protection substrate, and to form a driving substrate and a protection substrate, respectively, wherein inner edges of the first peripheral portion and the second peripheral portion are not cut to each other. Then, an external gas is filled into a negative pressure space between the driving substrate and the protection substrate, and the driving substrate and the protection substrate are separated. Then, a plurality of connection traces are formed on the driving substrate. Then, a plurality of light emitting diodes are mounted on an upper surface of the driving substrate.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a display, and more particularly to a method for manufacturing a light-emitting diode (LED) display panel. Background Technology

[0002] Existing LED display panels typically include a glass substrate, two circuit layers disposed on opposite sides of the glass substrate, and multiple LEDs mounted on one of the circuit layers. Generally, during the manufacturing process of an LED display panel, the fabrication of these two circuit layers is carried out sequentially, not simultaneously. In other words, the fabrication of one circuit layer will not begin until the other circuit layer is completed.

[0003] In current common manufacturing processes, after one circuit layer is completed and before fabricating another, a peelable adhesive is applied to the completed circuit layer to protect it from damage in subsequent processes. Once all circuit layers are complete, the adhesive is removed. Then, multiple light-emitting diodes (LEDs) are mounted onto one of the circuit layers. However, because the protective effect of the peelable adhesive on the circuit layers is quite limited, the yield rate of existing LED display panels is difficult to further improve. Summary of the Invention

[0004] At least one embodiment of the present invention provides a method for manufacturing a light-emitting diode display panel, which utilizes a negative pressure space to combine an initial driving substrate and an initial protective substrate together, so that the initial protective substrate can protect the initial driving substrate, thereby helping to improve the yield.

[0005] The method for manufacturing a light-emitting diode display panel according to at least one embodiment of the present invention includes bonding an initial driving substrate and an initial protective substrate together in a vacuum environment using a frame adhesive, wherein the frame adhesive is located between the initial driving substrate and the initial protective substrate after the initial driving substrate and the initial protective substrate are bonded together. A negative pressure space is formed between the initial driving substrate and the initial protective substrate, and the frame adhesive surrounds the negative pressure space. Then, the initial driving substrate and the initial protective substrate are cut to remove the frame adhesive, a first peripheral portion of the initial driving substrate, and a second peripheral portion of the initial protective substrate, and a driving substrate and a protective substrate are formed respectively, wherein the inner edges of the first peripheral portion and the second peripheral portion are not flush with each other. After cutting the initial driving substrate and the initial protective substrate, the negative pressure space is filled with external gas. After the negative pressure space is filled with external gas, the driving substrate and the protective substrate are separated. After separating the driving substrate and the protective substrate, a plurality of connection traces are formed on the driving substrate, wherein the driving substrate has an upper surface, a lower surface, and a first side surface located between the upper surface and the lower surface. These connection traces are formed on the upper surface, the first side surface, and the lower surface. Then, multiple light-emitting diodes are mounted on the upper surface of the driving substrate, wherein these light-emitting diodes are electrically connected to these connection traces.

[0006] In at least one embodiment of the present invention, the step of filling the negative pressure space with external gas includes having an electrostatic eliminator fan provide a deionized airflow into the negative pressure space.

[0007] In at least one embodiment of the present invention, the manufacturing method further includes forming a frame adhesive and a plurality of spacers on at least one of the initial driving substrate and the initial protective substrate before bonding the initial driving substrate and the initial protective substrate in a vacuum environment, wherein the frame adhesive surrounds the spacers.

[0008] In at least one embodiment of the present invention, the manufacturing method further includes, after forming these connection traces on the drive substrate, mounting an electrical connector on the lower surface of the drive substrate.

[0009] In at least one embodiment of the present invention, the above manufacturing method further includes forming a cover layer on the driving substrate, wherein the cover layer is formed on the upper surface, the first side surface and the lower surface, and covers these connection traces.

[0010] In at least one embodiment of the present invention, the manufacturing method further includes forming a circuit layer on the initial driving substrate before cutting the initial driving substrate and the initial protective substrate, wherein the circuit layer is located outside the negative pressure space.

[0011] In at least one embodiment of the present invention, the manufacturing method further includes flipping the initial driving substrate and the initial protective substrate that are bonded together before forming a circuit layer on the initial driving substrate.

[0012] In at least one embodiment of the present invention, after cutting the initial driving substrate and the initial protective substrate, the protective substrate protrudes from the first side of the driving substrate.

[0013] In at least one embodiment of the present invention, after cutting the initial driving substrate and the initial protective substrate, the driving substrate protrudes from the second side of the protective substrate.

[0014] In at least one embodiment of the present invention, the protective substrate has a second side surface, and the adjacent distance between the first side surface and the second side surface is greater than or equal to 1 mm.

[0015] In at least one embodiment of the present invention, the initial driving substrate includes a support substrate and a pixel circuit layer. The pixel circuit layer is disposed on the support substrate, wherein after the negative pressure space is formed, the negative pressure space is located between the pixel circuit layer and the initial protective substrate.

[0016] In summary, by utilizing the aforementioned negative pressure space, the initial protective substrate can be firmly attached to the initial driving substrate to protect the pixel circuit layer from scratches and damage in subsequent processes, thereby improving the yield of the LED display panel. Attached Figure Description

[0017] Figures 1A to 1M This is a schematic diagram of a method for manufacturing a light-emitting diode display panel according to at least one embodiment of the present invention.

[0018] Figure 2A and Figure 2B This is a schematic diagram of a method for manufacturing a light-emitting diode display panel according to another embodiment of the present invention.

[0019] The reference numerals in the attached figures are explained as follows:

[0020] 10, 20: Driving substrate

[0021] 10d: Lower surface

[0022] 10s, 20s: First side view

[0023] 10u: Upper surface

[0024] 11, 21: First Peripheral Section

[0025] 11e, 21e, 122e, 124e: Inner edge

[0026] 100: Initial driving substrate

[0027] 101: Pixel Circuit Layer

[0028] 102, 112: Insulation protective layer

[0029] 102a, 102b, 112a, 112b: Openings

[0030] 103, 113: Conductive layer

[0031] 109: Support substrate

[0032] 109a: First surface

[0033] 109b: Second surface

[0034] 111: Circuit Layer

[0035] 120: Initial protective substrate

[0036] 121, 123: Protective substrate

[0037] 121s, 123s: Second side view

[0038] 122, 124: Second Peripheral Section

[0039] 131: Connecting the wiring

[0040] 132: Overlay

[0041] 140: Light Emitting Diode

[0042] 141: Connector

[0043] 150: Electrical connector

[0044] 151: Conductive materials

[0045] 170: Static Electricity Eliminating Fan

[0046] 171: Deionized gas flow

[0047] 180: Cavity

[0048] 181: Vacuum environment

[0049] 191: Frame adhesive

[0050] 192: Spacer

[0051] 193: Knives

[0052] 300: Light Emitting Diode Display Panel

[0053] G12, G22: Adjacent distance

[0054] V1: Negative Pressure Space Detailed Implementation

[0055] In the following text, to clearly present the technical features of this application, the dimensions (e.g., length, width, thickness, and depth) of the elements (e.g., layers, films, substrates, and regions) in the drawings will be enlarged proportionally. Therefore, the description and explanation of the embodiments below are not limited to the dimensions and shapes presented by the elements in the drawings, but should cover dimensions, shapes, and deviations from both due to actual manufacturing processes and / or tolerances. For example, a flat surface shown in the drawings may have rough and / or non-linear characteristics, and an acute angle shown in the drawings may be rounded. Therefore, the elements presented in the drawings of this application are primarily for illustrative purposes and are not intended to precisely depict the actual shape of the elements, nor are they intended to limit the claims of this application.

[0056] Secondly, the terms "approximately," "approximately," or "substantially" used in this case not only cover explicitly stated numerical values ​​and ranges, but also the permissible deviation range understood by someone skilled in the art to which this invention pertains. This deviation range can be determined by errors generated during measurement, which may arise from limitations of the measurement system or process conditions. For example, two objects (e.g., planes or traces of a substrate) are "substantially parallel" or "substantially perpendicular." "Substantially parallel" and "substantially perpendicular" respectively indicate that the parallelism and perpendicularity between the two objects can include non-parallelism and non-perpendicularity caused by permissible deviation ranges.

[0057] Furthermore, "approximately" can indicate a deviation from one or more standard deviations of the aforementioned values, such as ±30%, ±20%, ±10%, or ±5%. The use of terms such as "approximately," "approximately," or "substantially" in this text allows for the selection of an acceptable range of deviations or standard deviations based on optical, etched, mechanical, or other properties, and does not apply to all of the aforementioned optical, etched, mechanical, and other properties using a single standard deviation.

[0058] Figures 1A to 1M This is a schematic diagram illustrating a method for manufacturing a light-emitting diode display panel according to at least one embodiment of the present invention. Please refer to [link / reference]. Figure 1A and Figure 1B First, an initial driving substrate 100 is provided, wherein... Figure 1A A top view of the initial driving substrate 100 is shown, while Figure 1B Draw Figure 1A A schematic diagram of the cross section 1B-1B along the central line.

[0059] The initial driving substrate 100 includes a support substrate 109 and a pixel circuit layer 101, with the pixel circuit layer 101 disposed on the support substrate 109. The support substrate 109 has a first surface 109a and a second surface 109b, wherein the first surface 109a is opposite to the second surface 109b, and the pixel circuit layer 101 is disposed on the first surface 109a. Furthermore, the support substrate 109 can be a rigid substrate, such as a glass substrate or a ceramic substrate.

[0060] The pixel circuit layer 101 may include multiple layers (not shown), such as multiple conductive pattern layers, multiple insulating layers, and semiconductor pattern layers. The semiconductor pattern layers may be made of silicon, while the conductive pattern layers may be made of metal or a transparent conductive material, wherein the transparent conductive material may be a metal oxide, such as indium tin oxide (ITO). The formation methods of these layers may include deposition and photolithography, wherein the aforementioned deposition may be physical vapor deposition (PVD).

[0061] These conductive patterned layers, insulating layers, and semiconductor patterned layers are stacked on top of each other on the first surface 109a, and can form multiple control elements, which can be transistors, such as thin-film transistors (TFTs). The initial driving substrate 100 may also include multiple conductive layers 103 and insulating protective layers 102, wherein the conductive layers 103 and insulating protective layers 102 are disposed on the pixel circuit layer 101, and the conductive layers 103 are electrically connected to the control elements in the pixel circuit layer 101.

[0062] An insulating protective layer 102 covers the conductive layers 103 and has multiple openings 102a and 102b, which expose the conductive layers 103. In other words, the insulating protective layer 102 partially covers the conductive layers 103, but does not cover the conductive layers 103 located within the openings 102a and 102b. Because the insulating protective layer 102 covers the conductive layers 103, the conductive layers 103 can be sandwiched between the pixel circuit layer 101 and a portion of the insulating protective layer 102.

[0063] Subsequently, a frame adhesive 191 and a plurality of spacers 192 are formed on the initial driving substrate 100, wherein the frame adhesive 191 surrounds the spacers 192. The spacers 192 may be photoresist after development, so the method for forming the spacers 192 may include photoresist coating, exposure, and development. Furthermore, the frame adhesive 191 may be formed after the spacers 192 are formed.

[0064] It should be noted that, Figure 1A The frame adhesive 191 and the spacers 192 are depicted, but the pixel circuit layer 101, the insulating protective layer 102, and the conductive layers 103 are omitted to clearly show the frame adhesive 191 and the spacers 192. Additionally, Figure 1B Only a partial cross-sectional structure of the initial drive substrate 100 is shown, in which... Figure 1B In the diagram, the pair of curves within the dashed frame represent omission lines to indicate other parts of the initial drive substrate 100 that are omitted from the drawing. Therefore, these curves do not represent holes.

[0065] Please see Figure 1C and Figure 1D Then, using frame adhesive 191, the initial driving substrate 100 and the initial protective substrate 120 are bonded together in a vacuum environment 181. After the initial driving substrate 100 and the initial protective substrate 120 are bonded together, the frame adhesive 191 is located between the initial driving substrate 100 and the initial protective substrate 120, and adheres the initial driving substrate 100 and the initial protective substrate 120 together.

[0066] exist Figure 1C and Figure 1D In the illustrated embodiment, a vacuum environment 181 can be formed within a chamber 180, and the process of combining the initial driving substrate 100 and the initial protective substrate 120 can be performed in the vacuum environment 181 within the chamber 180, wherein the chamber 180 can be a vacuum chamber suitable for One Drop Filling (ODF) liquid crystal injection.

[0067] Since the initial driving substrate 100 and the initial protective substrate 120 are bonded in a vacuum environment 181, a negative pressure space V1 is formed between the initial driving substrate 100 and the initial protective substrate 120. The frame adhesive 191 surrounds the negative pressure space V1, and the negative pressure space V1 is located between the pixel circuit layer 101 and the initial protective substrate 120.

[0068] It is worth noting that in this embodiment, both the adhesive 191 and the spacers 192 are formed on the initial driving substrate 100. However, in other embodiments, the adhesive 191 and the spacers 192 may also be formed on the initial protective substrate 120. Alternatively, the adhesive 191 and the spacers 192 may be formed on the initial driving substrate 100 and the initial protective substrate 120, respectively. For example, the adhesive 191 may be formed on the initial protective substrate 120, while the spacers 192 may be formed on the initial driving substrate 100. Therefore, before bonding the initial driving substrate 100 and the initial protective substrate 120 under vacuum environment 181, the adhesive 191 and the spacers 192 may be formed on at least one of the initial driving substrate 100 and the initial protective substrate 120.

[0069] Please see Figures 1E to 1G After the initial driving substrate 100 and the initial protective substrate 120 are combined, a circuit layer 111 and an insulating protective layer 112 can be formed on the initial driving substrate 100, such as... Figure 1G As shown. Furthermore, before forming the circuit layer 111 and the insulating protective layer 112 on the initial driving substrate 100, the initially driving substrate 100 and the initially protective substrate 120, which are bonded together, can be flipped so that the second surface 109b of the support substrate 109 faces upwards, as shown. Figure 1E and Figure 1F As shown.

[0070] Please see Figure 1G Both the circuit layer 111 and the insulating protective layer 112 are formed on the second surface 109b. The insulating protective layer 112 covers the circuit layer 111 and has a plurality of openings 112a and 112b. In the openings 112a and 112b, the insulating protective layer 112 does not cover the circuit layer 111, so that the insulating protective layer 112 partially covers the circuit layer 111, and the circuit layer 111 can be sandwiched between the support substrate 109 and part of the insulating protective layer 112.

[0071] After forming the insulating protective layer 112 and the circuit layer 111, a conductive layer 113 can be formed within the opening 112a. The conductive layer 113 can cover a portion of the circuit layer 111 located within the opening 112a and can directly contact the circuit layer 111, so that the conductive layer 113 can be electrically connected to the circuit layer 111. Furthermore, both the circuit layer 111 and the insulating protective layer 112 are located outside the negative pressure space V1, with the circuit layer 111 and the pixel circuit layer 101 located on opposite sides of the support substrate 109.

[0072] The negative pressure space V1 creates a pressure difference, which, together with the frame adhesive 191, allows the initial protective substrate 120 to be firmly attached to the initial driving substrate 100. Therefore, when the initial driving substrate 100 and the initial protective substrate 120 are flipped together, the negative pressure space V1 makes it difficult for the initial protective substrate 120 to separate from the initial driving substrate 100. This allows the rigid initial protective substrate 120 to protect the pixel circuit layer 101 adjacent to the negative pressure space V1, thus avoiding the risk of the pixel circuit layer 101 being exposed and easily scratched.

[0073] Because the negative pressure space V1 makes it difficult to separate the initial protective substrate 120 from the initial driving substrate 100, the initial protective substrate 120 can protect the pixel circuit layer 101 from damage during the formation of the insulating protective layer 112 and the circuit layer 111. For example, the method of forming the circuit layer 111 includes etching, and the initial protective substrate 120 can protect the pixel circuit layer 101 from corrosion by the etching solution.

[0074] Therefore, the initial protective substrate 120, which is firmly attached to the initial driving substrate 100 through the negative pressure space V1 and the frame adhesive 191, can protect the pixel circuit layer 101 from scratches and damage in subsequent processes. Compared with commonly used peelable adhesives, the initial protective substrate 120 can more effectively protect the initial driving substrate 100, thereby improving the yield of the light-emitting diode display panel.

[0075] Please see Figure 1H and Figure 1I Then, the initial driving substrate 100 and the initial protective substrate 120 are cut to remove the frame adhesive 191, a portion of the initial driving substrate 100, and a portion of the initial protective substrate 120, thereby forming the driving substrate 10 and the protective substrate 121, respectively. Specifically, the initial driving substrate 100 has a driving substrate 10 and a first peripheral portion 11, wherein the first peripheral portion 11 surrounds the driving substrate 10. The initial protective substrate 120 has a protective substrate 121, wherein a second peripheral portion 122 surrounds the protective substrate 121.

[0076] The first peripheral portion 11 does not contain any circuitry. The pixel circuit layer 101 within the first peripheral portion 11 may consist only of an insulating layer, excluding conductive and semiconductor pattern layers. After cutting the initial driving substrate 100 and the initial protective substrate 120, not only is the frame adhesive 191 removed, but the first peripheral portion 11 and the second peripheral portion 122 are also removed. Since the first peripheral portion 11 does not contain any circuitry, the function of the remaining driving substrate 10 is not affected under normal circumstances, even if the first peripheral portion 11 is removed.

[0077] It should be noted that, since the driving substrate 10 is formed by removing the first peripheral portion 11, the driving substrate 10 substantially includes a pixel circuit layer 101, an insulating protective layer 102, conductive layers 103, and a support substrate 109. Furthermore, the driving substrate 10 may also include a circuit layer 111, an insulating protective layer 112, conductive layers 113, and at least one spacer 192, such as... Figure 1I As shown.

[0078] After cutting the initial driving substrate 100 and the initial protective substrate 120, the inner edges 11e of the first peripheral portion 11 and the inner edges 122e of the second peripheral portion 122 are not aligned. In other words, during the cutting of the initial driving substrate 100 and the initial protective substrate 120, a single cutting tool 193 does not cut both the initial driving substrate 100 and the initial protective substrate 120 at the same time. For example, the cutting tool 193 may cut the initial driving substrate 100 first, and then cut the initial protective substrate 120.

[0079] The driving substrate 10 has a first side surface 10s, while the protective substrate 121 has a second side surface 121s, as shown below. Figure 1I As shown. The first side 10s and the second side 121s are formed after cutting the initial driving substrate 100 and the initial protective substrate 120, wherein the first side 10s corresponds to the inner edge 11e of the first peripheral portion 11, and the second side 121s corresponds to the inner edge 122e of the second peripheral portion 122.

[0080] The inner edges 11e of the first peripheral portion 11 and 122e of the second peripheral portion 122 are not aligned, therefore the first side surface 10s and the second side surface 121s are also not aligned. Figure 1I For example, the driving substrate 10 may protrude beyond the second side surface 121s of the protective substrate 121. Furthermore, the adjacent distance G12 between the first side surface 10s and the second side surface 121s may be greater than or equal to 1 mm, and the adjacent distance G12 is equal to the length of the driving substrate 10 protruding beyond the second side surface 121s. Figure 1I As shown.

[0081] It should be noted that after removing the first peripheral portion 11 and the second peripheral portion 122, the negative pressure space V1 still essentially exists between the driving substrate 10 and the protective substrate 121. Therefore, even without the sealant 191, the negative pressure space V1 can still create a pressure difference, and this pressure difference can still allow the protective substrate 121 to adhere to the driving substrate 10. Therefore, although Figure 1I The protective substrate 121 and the driving substrate 10 are depicted as separate from each other. However, in reality, due to the influence of the negative pressure space V1, the protective substrate 121 and the driving substrate 10 are still combined and not separated.

[0082] Please see Figure 1J After cutting the initial drive substrate 100 and the initial protective substrate 120, the negative pressure space V1 is filled with external gas, which may include a deionized gas flow 171. The static eliminator fan 170 provides the deionized gas flow 171 into the negative pressure space V1. When the static eliminator fan 170 generates the deionized gas flow 171, the drive substrate 10 protrudes from the second side 121s of the protective substrate 121, which facilitates the separation of the sides (i.e., the first side 10s and the second side 121s) of the drive substrate 10 and the protective substrate 121. For example, an operator can use the portion of the drive substrate 10 protruding from the second side 121s to manually pry open or press against the pins to separate the drive substrate 10 and the protective substrate 121, allowing the static eliminator fan 170 to provide the deionized gas flow 171 into the negative pressure space V1.

[0083] When the deionized gas flow 171 enters the negative pressure space V1, it neutralizes the static electricity within the drive substrate 10. In practice, after the deionized gas flow 171 enters the negative pressure space V1, the static electricity value of the drive substrate 10, measured by an electrostatic meter, can be below 100 volts. Thus, the deionized gas flow 171 helps reduce or prevent the risk of electrostatic damage to the pixel circuit layer 101.

[0084] Since the external gas (including the deionization gas flow 171) fills the negative pressure space V1, the external gas can eliminate the pressure difference caused by the negative pressure space V1, that is, the external gas can effectively eliminate the negative pressure space V1. Therefore, under the influence of the loss of the negative pressure space V1, the protective substrate 121 cannot be attached to the driving substrate 10, so as to separate the protective substrate 121 and the driving substrate 10, thereby removing the protective substrate 121.

[0085] Please see Figure 1K and Figure 1L ,in Figure 1K Figure 1L shows a top view of the driving substrate 10. Figure 1K A cross-sectional schematic diagram drawn along line 1L-1L. After separating the driving substrate 10 and the protective substrate 121, that is, after removing the protective substrate 121, a plurality of connection traces 131 are formed on the driving substrate 10. The method for forming these connection traces 131 may include deposition and photolithography, wherein the aforementioned deposition may be physical vapor deposition.

[0086] The driving substrate 10 also has an upper surface 10u and a lower surface 10d, wherein a first side surface 10s is located between the upper surface 10u and the lower surface 10d. Connection traces 131 are formed on the upper surface 10u, the first side surface 10s, and the lower surface 10d, wherein these connection traces 131 extend from the upper surface 10u along the first side surface 10s to the lower surface 10d. These connection traces 131 may cover insulating protective layers 102 and 112 and extend into openings 102b and 112b, so that the connection traces 131 can connect the conductive layer 103 and the circuit layer 111 via the openings 102b and 112b. Thus, the connection traces 131 electrically connect the conductive layer 103 and the circuit layer 111.

[0087] Subsequently, a cover layer 132 can be formed on the driving substrate 10, wherein the cover layer 132 is formed on the upper surface 10u, the first side surface 10s, and the lower surface 10d, and covers the connection traces 131 to protect them. The cover layer 132 can be an insulating layer, so the cover layer 132 does not electrically connect the connection traces 131 to avoid short circuits in the connection traces 131.

[0088] It should be noted that, Figure 1K The spacers 192, the connecting traces 131, and the cover layer 132 are depicted, but the pixel circuit layer 101, the insulating protective layer 102, and the conductive layers 103 are omitted to clearly show the cover layer 132, the spacers 192, and the connecting traces 131. Furthermore, from... Figure 1K It can be seen that these connecting lines 131 are arranged in an alternating pattern with some spacers 192, and a connecting line 131 can be set between two adjacent spacers 192, such as... Figure 1K As shown.

[0089] Please see Figure 1M Then, multiple light-emitting diodes 140 ( Figure 1M (Only one is shown) on the upper surface 10u of the driving substrate 10, so that the light-emitting diodes 140 are electrically connected to the conductive layers 103 and the pixel circuit layer 101, wherein the conductive layers 103 can be electrically connected to the anode and cathode of the light-emitting diodes 140 respectively. Since the conductive layers 103 are electrically connected to the control elements, such as thin-film transistors (TFTs) in the pixel circuit layer 101, the control elements in the pixel circuit layer 101 can be electrically connected to the light-emitting diodes 140 through the conductive layers 103, so that the control elements can control the light-emitting diodes 140 to emit light.

[0090] At least one of these light-emitting diodes 140 can be electrically connected to the conductive layer 103 using multiple connectors 141, wherein the connectors 141 can be solder or indium blocks. In terms of size, the light-emitting diodes 140 can be microLEDs or sub-millimeter light-emitting diodes. Since the connection traces 131 can electrically connect the conductive layer 103 to the circuit layer 111, these light-emitting diodes 140 can be electrically connected to the pixel circuit layer 101 via the conductive layer 103 through these connection traces 131, and electrically connected to the circuit layer 111 and the conductive layer 113 via the connection traces 131.

[0091] After forming these connection traces 131 on the driving substrate 10, an electrical connector 150 can be mounted on the lower surface 10d of the driving substrate 10 so that the electrical connector 150 is electrically connected to the circuit layer 111. The electrical connector 150 is electrically connected to the conductive layer 113 through the conductive material 151, and is electrically connected to the circuit layer 111 through the conductive layer 113. At this point, the light-emitting diode display panel 300 is basically completed.

[0092] The conductive material 151 may be anisotropic conductive film (ACF). The electrical connector 150 may be a circuit board assembly. For example, the electrical connector 150 may include a flexible printed circuit (FPC) and a driver chip (not shown) mounted on the flexible printed circuit.

[0093] Since these light-emitting diodes 140 can be electrically connected to the circuit layer 111 and the conductive layer 113 via the connecting trace 131, the electrical connector 150 can be electrically connected to these light-emitting diodes 140 via the conductive layer 113, the circuit layer 111, the connecting trace 131, and the pixel circuit layer 101. Thus, the driver chip of the electrical connector 150 can input electrical signals to the pixel circuit layer 101, so that the control elements within the pixel circuit layer 101 can control the light-emitting diodes 140 to emit light, thereby enabling the light-emitting diode display panel 300 to display images.

[0094] Figure 2A and Figure 2B This is a schematic diagram illustrating a method for manufacturing a light-emitting diode display panel according to another embodiment of the present invention. Please refer to [link / reference]. Figure 2A and Figure 2B The manufacturing method in this embodiment is similar to that in the previous embodiments; therefore, the same features and effects will not be repeated in principle. The following mainly describes the differences between the two, wherein... Figure 2A and Figure 2BThis illustration only shows the differences between this embodiment and the previous embodiments.

[0095] After the initial driving substrate 100 and the initial protective substrate 120 are bonded together and a circuit layer 111, an insulating protective layer 112 and a conductive layer 113 are formed, the initial driving substrate 100 and the initial protective substrate 120 are cut to remove the frame adhesive 191, the first peripheral portion 21 of the initial driving substrate 100 and the second peripheral portion 124 of the initial protective substrate 120, thereby forming the driving substrate 20 and the protective substrate 123 respectively.

[0096] The first peripheral portion 21 does not contain any circuitry, and the pixel circuit layer 101 in the first peripheral portion 21 may only include an insulating layer, excluding the conductive pattern layer and the semiconductor pattern layer. The inner edge 21e of the first peripheral portion 21 and the inner edge 124e of the second peripheral portion 124 are not aligned with each other. Therefore, after removing the first peripheral portion 21 and the second peripheral portion 124, the driving substrate 10 has a first side surface 20s, and the protective substrate 123 has a second side surface 123s, wherein the first side surface 20s and the second side surface 123s are also not aligned with each other.

[0097] Unlike the first peripheral portion 11 and the second peripheral portion 124 in the previous embodiments, in this embodiment, the protective substrate 123 protrudes from the first side surface 20s of the driving substrate 20, wherein the adjacent distance G22 between the first side surface 20s and the second side surface 123s can be greater than or equal to 1 mm, and the adjacent distance G22 is equal to the length of the protective substrate 123 protruding from the first side surface 20s, such as... Figure 2B As shown. Afterwards, the following can be performed: Figures 1I to 1M The disclosed steps complete the light-emitting diode display panel.

[0098] In summary, by utilizing the aforementioned negative pressure space and frame adhesive, the initial protective substrate can be securely attached to the initial driving substrate, protecting the pixel circuit layer from scratches and damage during subsequent processes. Compared to commonly used peelable adhesives, the manufacturing method disclosed in at least one embodiment of this invention more effectively protects the initial driving substrate, thereby improving the yield of LED display panels.

[0099] Although the present invention has been disclosed above with reference to embodiments, it is not intended to limit the present invention. Those skilled in the art to which this invention pertains may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A method for manufacturing a light-emitting diode (LED) display panel, comprising: Using a frame adhesive, an initial driving substrate and an initial protective substrate are bonded together in a vacuum environment. After the initial driving substrate and the initial protective substrate are bonded together, the frame adhesive is located between the initial driving substrate and the initial protective substrate, forming a negative pressure space between the initial driving substrate and the initial protective substrate. The frame adhesive surrounds the negative pressure space. The initial driving substrate includes: A support substrate, wherein the support substrate has a first surface and a second surface, wherein the first surface is opposite to the second surface; A pixel circuit layer is disposed on the first surface of the supporting substrate, wherein after the negative pressure space is formed, the negative pressure space is located between the pixel circuit layer and the initial protective substrate, and the pixel circuit layer is located between the negative pressure space and the second surface; and Multiple conductive layers are disposed on the pixel circuit layer, and these conductive layers are electrically connected to multiple control elements in the pixel circuit layer; The initial drive substrate and the initial protective substrate are flipped together and combined. After the initial driving substrate and the initial protective substrate are flipped together, a circuit layer is formed on the second surface of the initial driving substrate, wherein the circuit layer is located outside the negative pressure space. After the circuit layer is formed on the second surface of the initial driving substrate, the initial driving substrate and the initial protective substrate are cut to remove the frame adhesive, a first peripheral portion of the initial driving substrate and a second peripheral portion of the initial protective substrate, and a driving substrate and a protective substrate are formed respectively. The first peripheral portion does not contain any circuit, and the inner edges of the first peripheral portion and the second peripheral portion are not flush with each other. After cutting the initial driving substrate and the initial protective substrate, an external gas is filled into the negative pressure space; After the external gas fills the negative pressure space, the driving substrate and the protective substrate are separated. After separating the driving substrate and the protective substrate, multiple connection traces are formed on the driving substrate. The driving substrate has an upper surface, a lower surface and a first side surface located between the upper surface and the lower surface. The connection traces are formed on the upper surface, the first side surface and the lower surface. The conductive layer is electrically connected to the circuit layer. A cover layer is formed on the driving substrate, wherein the cover layer is formed on the upper surface, the first side surface, and the lower surface, and covers the connection traces; and After the cover layer is formed on the driving substrate, a plurality of light-emitting diodes are mounted on the upper surface of the driving substrate, wherein the light-emitting diodes are electrically connected to the connection traces.

2. The method for manufacturing a light-emitting diode display panel as claimed in claim 1, wherein after removing the first peripheral portion and the second peripheral portion, the negative pressure space still exists between the driving substrate and the protective substrate, and under the influence of the negative pressure space, the protective substrate and the driving substrate are still bonded together and not separated, wherein the step of filling the negative pressure space with the external gas includes: An electrostatic eliminator fan provides a deionized airflow into the negative pressure space.

3. The method for manufacturing a light-emitting diode display panel as described in claim 1, further comprising: Before bonding the initial driving substrate and the initial protective substrate together in the vacuum environment, the frame adhesive and a plurality of spacers are formed on at least one of the initial driving substrate and the initial protective substrate, wherein the frame adhesive surrounds the spacers, and wherein the connection traces are arranged interleaved with the spacers.

4. The method for manufacturing a light-emitting diode display panel as described in claim 1, further comprising: After the connection traces are formed on the drive substrate, an electrical connector is installed on the lower surface of the drive substrate.

5. The method for manufacturing a light-emitting diode display panel as claimed in claim 1, wherein after cutting the initial driving substrate and the initial protective substrate, the protective substrate protrudes from the first side surface of the driving substrate.

6. The method for manufacturing a light-emitting diode display panel as claimed in claim 1, wherein after cutting the initial driving substrate and the initial protective substrate, the driving substrate protrudes from a second side of the protective substrate, wherein the step of filling the negative pressure space with the external gas includes having an electrostatic eliminator fan provide a deionized airflow into the negative pressure space, and the manufacturing method further includes using the portion of the driving substrate protruding from the second side of the protective substrate to manually pry open or press the pins to open the driving substrate and the protective substrate that are joined together, so that the electrostatic eliminator fan can provide the deionized airflow into the negative pressure space.

7. The method for manufacturing a light-emitting diode display panel as claimed in claim 1, wherein the protective substrate has a second side surface, and the adjacent distance between the first side surface and the second side surface is greater than or equal to 1 mm.

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