A printed circuit board testing system, method, apparatus, device and storage medium

Abstract

The application provides a printed circuit board test system, method, device, equipment and storage medium, and relates to the technical field of printed circuit boards. The printed circuit board test system can include a to-be-tested circuit board, a resistance test line, a collection device and a processing device. The resistance test line includes a plurality of sub test lines, and a resistance line fixing hole is arranged at a first preset position of the to-be-tested circuit board. One end of each sub test line is connected to the collection device, and the other end of each sub test line is connected to a resistance test point arranged on the to-be-tested circuit board through the resistance line fixing hole. The collection device is used to collect resistance test data through each sub test line in the resistance test line in real time from the moment when the to-be-tested circuit board is sent into a test body provided with a temperature parameter. The processing device is used to obtain a test result of the to-be-tested circuit board according to the resistance test data collected by the collection device after the to-be-tested circuit board leaves the test body. In this way, the normal execution of the test can be avoided, and the test efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of printed circuit board technology, and more specifically, to a printed circuit board testing system, method, apparatus, equipment, and storage medium. Background Technology

[0002] The reflow soldering process involves heating air or nitrogen to a sufficiently high temperature and then blowing it onto a printed circuit board (PCB) with solder paste applied and components mounted. The solder paste melts and then solidifies, forming a stable connection between the components and the PCB.

[0003] Understandably, for components to form a stable connection with the PCB, the PCB usually needs to undergo multiple soldering heating processes. Since PCBs may experience delamination, open circuits, or other problems under repeated high temperatures, it is necessary to test the high-temperature resistance of the PCB.

[0004] Currently, reflow ovens can be used to test the high-temperature resistance of PCBs. When testing the high-temperature resistance of PCBs using a reflow oven, test leads need to be led out from the test points on the PCB and connected to the processing equipment. However, the chain in the reflow oven often gets tangled with the test leads during rotation, affecting the normal execution of the test. Summary of the Invention

[0005] The purpose of this application is to address the shortcomings of the prior art by providing a printed circuit board testing system, method, apparatus, and storage medium to avoid affecting the normal execution of testing and thereby improve testing efficiency.

[0006] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows:

[0007] In a first aspect, embodiments of this application provide a printed circuit board testing system, including: a circuit board under test, resistance test lines, acquisition equipment, and processing equipment. The resistance test lines include multiple sub-test lines, and a resistance line fixing hole is provided at a first preset position of the circuit board under test.

[0008] One end of each of the sub-test lines is connected to the acquisition device, and the other end of each of the sub-test lines passes through the resistance wire fixing hole and is connected to the resistance test point set on the circuit board under test.

[0009] The acquisition device is used to acquire resistance test data in real time through each sub-test line in the resistance test line, starting from the moment the test body with temperature parameters is sent into the circuit board under test.

[0010] The processing device is used to obtain the test result of the circuit board under test based on the resistance test data collected by the acquisition device after the circuit board under test leaves the test body.

[0011] Optionally, a protective cover is provided outside the resistance test leads, and the protective cover includes each sub-test lead;

[0012] The protective cover passes through the resistance wire fixing hole and connects to the resistance test point set on the circuit board under test.

[0013] Optionally, the resistance test point is a resistance test hole;

[0014] The resistance test hole is connected to the other end of each of the sub-test lines via an electrical connector.

[0015] Optionally, the system further includes: a temperature test line and a temperature sensor, and a temperature line fixing hole is provided at the second preset position of the circuit board under test;

[0016] One end of the temperature test line is connected to the acquisition device, and the other end of the temperature test line passes through the temperature line fixing hole and is connected to the temperature sensor on the temperature test point set on the circuit board under test.

[0017] Optionally, the acquisition device is further configured to: acquire temperature test data in real time through the temperature test line starting from the moment the circuit board under test is sent into the test body;

[0018] The processing device is specifically used to obtain the test results of the circuit board under test based on the resistance test data and the temperature test data after the circuit board under test leaves the test body.

[0019] Optionally, the acquisition device and the processing device are the same device.

[0020] Optionally, the data acquisition device includes: a resistance data acquisition device and a temperature data acquisition device;

[0021] One end of each of the sub-test leads is connected to the resistance acquisition device, and one end of the temperature test lead is connected to the temperature acquisition device.

[0022] Optionally, the system further includes: a screen recording device;

[0023] When the resistance test data and the temperature test data are displayed on the display interface of the acquisition device at a preset acquisition frequency, the screen recording device is aligned with the display interface of the acquisition device to obtain a recorded video.

[0024] The processing device is connected to the screen recording device to acquire the recorded video and obtain the test results of the circuit board under test based on the resistance test data and temperature test data recorded in the recorded video.

[0025] Optionally, the system further includes: a test wire transmission device, wherein the test wire transmission device is provided with a resistance wire transmission wheel and a temperature wire transmission wheel, the resistance wire transmission wheel being used to wind the resistance test wire, and the temperature wire transmission wheel being used to wind the temperature test wire;

[0026] When the circuit board under test is tested, the resistance wire drive wheel and the temperature wire drive wheel rotate according to the transmission rate set by the test body, so that the resistance test wire and the temperature test wire travel at the same transmission rate as the chain in the test body, so as to send the circuit board under test into the test body for heating.

[0027] Secondly, embodiments of this application also provide a printed circuit board testing method, the method being applied to the processing equipment in the printed circuit board testing system described in the first aspect above, the method comprising:

[0028] According to the preset acquisition frequency, extract multiple resistance test data and temperature test data corresponding to the same time from the acquired recorded video;

[0029] The test results of the circuit board under test are obtained based on multiple resistance test data and temperature test data corresponding to the same time.

[0030] Thirdly, embodiments of this application also provide a printed circuit board testing apparatus, which is applied to the processing equipment in the printed circuit board testing system described in the first aspect above, the apparatus comprising:

[0031] The extraction module is used to extract multiple resistance test data and temperature test data corresponding to the same time from the acquired recorded video according to a preset acquisition frequency.

[0032] The determination module is used to obtain the test results of the circuit board under test based on multiple resistance test data and temperature test data corresponding to the same time.

[0033] Thirdly, embodiments of this application provide an electronic device, including: a processor, a storage medium, and a bus. The storage medium stores machine-readable instructions executable by the processor. When the electronic device is running, the processor communicates with the storage medium via the bus, and the processor executes the machine-readable instructions to perform the steps of the printed circuit board testing method described in the second aspect above.

[0034] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program, which, when executed by a processor, performs the steps of the printed circuit board testing method described in the second aspect above.

[0035] The beneficial effects of this application are:

[0036] This application provides a printed circuit board (PCB) testing system, method, apparatus, device, and storage medium. The PCB testing system may include: a PCB under test, resistance test leads, a data acquisition device, and a processing device. The resistance test leads include multiple sub-test leads. A resistance wire fixing hole is provided at a first preset position on the PCB under test. One end of each sub-test lead is connected to the data acquisition device, and the other end of each sub-test lead passes through the resistance wire fixing hole and connects to a resistance test point provided on the PCB under test. The data acquisition device is used to collect resistance test data in real time through each sub-test lead of the resistance test leads, starting from the moment the PCB under test is inserted into a test body with a set temperature parameter. The processing device is used to obtain the test result of the PCB under test based on the resistance test data collected by the data acquisition device after the PCB under test leaves the test body.

[0037] The printed circuit board testing system provided in this application uses a resistance wire fixing hole set at a first preset position on the circuit board under test. Each sub-test wire can pass through this fixing hole to connect the acquisition device and the resistance test point on the circuit board under test. Based on the connection method described above, the acquisition device 102, each sub-test wire 101A, the resistance wire fixing hole 104, and the resistance test point 105 are connected. In this way, the test body (such as a reflow oven) can use its chain to transport the circuit board under test from the test inlet to the test outlet for simulated reflow soldering. Since each sub-test wire connects the acquisition device and the resistance test point by passing through the resistance wire fixing hole on the test circuit board, the phenomenon of the chain in the reflow oven becoming entangled with the sub-test wires during rotation, or the sub-test wires falling off, can be avoided, thus preventing interference with the normal execution of the test and improving test efficiency. Attached Figure Description

[0038] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 A schematic flowchart of a printed circuit board testing system provided in this application embodiment;

[0040] Figure 2 This is a schematic diagram of another printed circuit board testing system provided in an embodiment of this application;

[0041] Figure 3 A schematic diagram of the structure of another printed circuit board testing system provided in this application embodiment;

[0042] Figure 4 A schematic diagram of another printed circuit board testing system provided in an embodiment of this application;

[0043] Figure 5 A schematic diagram of the structure of another printed circuit board testing system provided in this application embodiment;

[0044] Figure 6 A schematic flowchart illustrating a printed circuit board testing method provided in an embodiment of this application;

[0045] Figure 7 This is a schematic diagram of the structure of a printed circuit board testing device provided in an embodiment of this application;

[0046] Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0048] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0049] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0050] The printed circuit board testing system mentioned in this application is illustrated below with reference to the accompanying drawings. Figure 1 This is a flowchart illustrating a printed circuit board testing system provided in an embodiment of this application. Figure 1As shown, the system may include: a circuit board under test 100, a resistance test line 101, a data acquisition device 102, and a processing device 103. The resistance test line 101 includes multiple sub-test lines 101A. A resistance line fixing hole 104 is provided at a first preset position on the circuit board under test 100.

[0051] One end of each sub-test line 101A is connected to the data acquisition device 102, and the other end of each sub-test line 101A passes through the resistance wire fixing hole 104 and is connected to the resistance test point 105 set on the circuit board under test 100. The data acquisition device 102 is used to acquire resistance test data in real time through each sub-test line 101A in the resistance test line 101, starting from the moment the circuit board under test 100 is sent into the test body with set temperature parameters; the processing device 103 is used to obtain the test result of the circuit board under test 100 based on the resistance test data acquired by the data acquisition device 102 after the circuit board under test 100 leaves the test body.

[0052] The printed circuit board to be tested can be selected as the circuit board under test 100 according to actual needs. The circuit board under test 100 can be a circuit board without solder paste. The circuit board under test 100 is generally a composite structure of copper layers and epoxy resin. It should be noted that this application does not limit the number of layers of the circuit board under test 100. For example, the circuit board under test 100 can be a single-sided board, a double-sided board, or a multilayer board.

[0053] After the circuit board 100 under test is determined, a resistance wire fixing hole 104 can be drilled at a first preset position on the circuit board 100. This first preset position is generally located at the edge of the circuit board 100 so as not to affect the wiring layout on the circuit board 100. One example is that the first preset position is independent of the position of the resistance test point; another example is that the first preset position is related to the position of the resistance test point, i.e., the resistance wire fixing hole 104 is drilled at a first preset position related to the position of the resistance test point.

[0054] One example is that the resistance of the circuit board 100 under test can be tested using a four-wire resistance test method, where the resistance test line 101 includes four sub-test lines 101A. In other words, four sub-test lines 101A need to be led out from the resistance test points set on the circuit board under test and connected to the acquisition device 102.

[0055] It should be noted that the circuit board under test 100 can have one or more resistance test points 105. This application does not limit the number of resistance test points 105. This application uses one resistance test point 105 as an example for explanation. Figure 1 The situation shown is as follows. As an example, the resistance test point 105 is set in an area with a dense wire layout, or it can be set in an area with a dense via, which is not limited in this application.

[0056] For example, after the resistance wire fixing hole 104 mentioned above is set, but before it is inserted into the test body, one end of each sub-test wire 101A can first be connected to the resistance test terminal of the acquisition device 102, and then each sub-test wire 101A, i.e. Figure 1 The four sub-test lines 101A shown in the figure pass through the resistance wire fixing hole 104 respectively, and finally one end of each sub-test line 101A that passes through the resistance wire fixing hole 104 is connected to the resistance test point 105.

[0057] After connecting the acquisition device 102, each sub-test line 101A, the resistance wire fixing hole 104, and the resistance test point 105 according to the above connection method, the circuit board under test 100 can be sent into the test chamber with set temperature parameters. Specifically, the test chamber can be a reflow oven. During the high-temperature resistance test of the circuit board under test 100 using the reflow oven, the reflow oven needs to use its chain to transport the circuit board under test 100 from the test inlet to the test outlet. During the test, the reflow oven can heat the circuit board under test 100 according to the preset temperature parameters. It should be understood that these temperature parameters can be continuously changed.

[0058] At the start of the test, a chain in the test body feeds the circuit board 100 under test into the test body, while the acquisition device 102 acquires resistance test data based on each sub-test line 101A in the resistance test line 101. In one exemplary case, the acquisition device 102 and the processing device 103 are the same device, in which case the processing device 103 can acquire the resistance test data in real time. In another exemplary case, the acquisition device 102 and the processing device 103 are different devices, in which case the acquisition device 102 can send the acquired resistance test data to the processing device 103 after the test is completed, or it can send the acquired resistance test data to the processing device 103 in real time; this application does not limit this.

[0059] It should be noted that the aforementioned processing device 103 obtains the test results of the circuit board under test 100 based on the resistance test data only after the circuit board under test leaves the test body. This can be understood as the processing device obtaining the test results of the circuit board under test 100 based on the resistance test data only after the test is completed. This application does not limit the conditions for test completion. Test completion can be considered after one simulated reflow soldering or after multiple simulated reflow solderings.

[0060] It is understandable that the high-temperature resistance of the circuit board under test 100 can be reflected by its resistance. The relationship between temperature and resistance is as follows: the higher the temperature, the greater the resistance. When the resistance value represented by the resistance test data exceeds a preset multiple (such as 5% or 10%) of the reference resistance value, or in other words, when the resistance value represented by the resistance test data increases to exceed a preset multiple of the reference resistance value, the current temperature parameter of the test object is the critical value for high-temperature resistance of the circuit board under test 100. The reference resistance value can be understood as the resistance value of the circuit board under test 100 when it is not heated.

[0061] In one feasible embodiment, after the test is completed, the processing device 103 can determine the correspondence between the temperature parameter of the test body and the resistance test data, that is, what is the temperature of the test body at the same time and what is the corresponding resistance test data. If the resistance value represented by the resistance test data corresponding to a certain temperature test data exceeds 5% of the reference resistance value, the temperature parameter can be used as the high temperature resistance critical value of the circuit board 100 under test.

[0062] In summary, in the printed circuit board testing system provided in this application, by setting resistance wire fixing holes at the first preset position of the circuit board under test, each sub-test wire can pass through the resistance wire fixing holes to connect the acquisition device and the resistance test points set on the circuit board under test. Based on the connection method described above, the acquisition device 102, each sub-test wire 101A, the resistance wire fixing hole 104, and the resistance test point 105 are connected. In this way, the test body (such as a reflow oven) can use its chain to transport the circuit board under test from the test inlet to the test outlet to simulate reflow soldering of the circuit board under test. Since each sub-test wire connects the acquisition device and the resistance test point by passing through the resistance wire fixing holes on the test circuit board, the phenomenon of the chain in the reflow oven getting tangled with the sub-test wires during rotation and the phenomenon of the sub-test wires falling off can be avoided, thus avoiding affecting the normal execution of the test and improving the test efficiency.

[0063] Optionally, the length of each sub-test lead 101A should be at least longer than the length of the reflow oven body. The resistance test leads can be made of Teflon wire, which avoids the resistance test leads being affected by the heating temperature of the test object.

[0064] Figure 2 This is a schematic diagram of another printed circuit board testing system provided in an embodiment of this application. Optionally, as... Figure 2 As shown, a protective cover 200 is provided outside the resistance test leads, and the protective cover 200 includes each sub-test lead. The protective cover 200 passes through the resistance wire fixing hole 104 and is connected to the resistance test point 105 provided on the circuit board 100 under test.

[0065] The protective cover 200 can be made of a material with heat insulation properties. Each sub-test line 101A is wrapped with the protective cover 200 and then passed through the resistance wire fixing hole 104. This can avoid the difficulty of connecting the acquisition device to the resistance test point when there are many sub-test lines, and also avoid the risk of entanglement with the chain in the test body.

[0066] The following example illustrates the specific structure of the resistance test point on the circuit board under test.

[0067] Combination Figure 1 To illustrate, in one scenario, the resistance test point 105 is a preset area on the upper surface of the circuit board 100 under test, and each sub-test line 101A can be soldered onto this preset area.

[0068] Optionally, the resistance test point is a resistance test hole; the resistance test hole is connected to the other end of each sub-test lead via an electrical connector.

[0069] The electrical connector can be pressed into the resistance test hole, and each sub-test lead can use the electrical connector to collect resistance test data from the circuit board 100 under test. It should be noted that the material of the electrical connector is designed to withstand the temperature of the test object during heating.

[0070] Optionally, if the resistance test point is a pad, then each sub-test line can be soldered onto the pad using high-temperature solder to collect resistance test data of the circuit board 100 under test.

[0071] Figure 3 This is a schematic diagram of another printed circuit board testing system provided in an embodiment of this application. Figure 3 As shown, optionally, the system also includes: a temperature test line 300 and a temperature sensor 301. A temperature line fixing hole 302 is provided at the second preset position of the circuit board 100 under test. One end of the temperature test line 300 is connected to the acquisition device 102, and the other end of the temperature test line 300 passes through the temperature line fixing hole 302 and is connected to the temperature sensor 301 on the temperature test point 303 provided on the circuit board 100 under test.

[0072] After the circuit board 100 under test is determined, a temperature wire fixing hole 302 can be drilled at a second preset position on the circuit board 100 under test. The second preset position is generally located at the edge of the circuit board 100 under test, so as not to affect the wiring layout on the circuit board 100 under test. In one example, the second preset position is independent of the position of the temperature test point; in another example, the second preset position is related to the position of the temperature test point, that is, the temperature wire fixing hole 302 is drilled at the second preset position related to the position of the temperature test point.

[0073] It should be noted that the second preset position may be different from or the same as the first preset position mentioned above. Figure 3 The diagram shows the case where the second preset position is the same as the first preset position mentioned above, that is, the resistance wire fixing hole 104 and the temperature wire fixing hole 302 are the same hole. It should be understood that... Figure 3 This is merely an example and is not intended to limit this application.

[0074] After the temperature test point 303 is determined, the temperature sensor 301 can be placed on the temperature test point 303. One method is to use thermally conductive silicone to adhere the temperature sensor 301 to the temperature test point 303. Another method is to use high-temperature adhesive to attach the temperature sensor 301 to the temperature test point 303.

[0075] For example, after the temperature wire fixing hole 302 mentioned above is set, but before the circuit board is inserted into the test body, one end of the temperature test wire 300 can first be connected to the temperature test end of the acquisition device 102, then the temperature test wire 300 is passed through the temperature wire fixing hole 302, and finally the other end of the temperature test wire 300 passing through the temperature fixing hole 302 is connected to the temperature sensor 301 that has been set at the temperature test point 303. After connecting the acquisition device 102, temperature test wire 300, temperature wire fixing hole 302, and temperature test point 303 according to the above connection method, the circuit board 100 under test can be sent into the test body with the temperature parameters set. This can avoid the phenomenon of the chain in the reflow oven getting tangled with the temperature test wire during rotation, and the phenomenon of the temperature test wire falling off, thereby improving the efficiency of testing the circuit board under test.

[0076] In one example, the temperature test point 303 and the resistance test point 105 on the circuit board under test have a corresponding relationship. Assuming that the tester selects a preset area on the circuit board under test according to actual needs, and then sets the temperature test point 303 and the resistance test point 105 in the preset area respectively, the temperature test data collected from the temperature test point 303 and the resistance test data collected from the resistance test point 105 have a one-to-one correspondence, which can improve the accuracy of the test results obtained later.

[0077] Another example is that a protective cover can be provided on the outside of the resistance test line 101 and the temperature test line 300, so that the resistance test line 101 and the temperature test line 300 can be twisted into one strand.

[0078] like Figure 3 As shown, optionally, the acquisition device 102 is also used to: acquire temperature test data in real time through the temperature test line 300 starting from the moment the circuit board under test 100 is sent into the test body; the processing device 103 is specifically used to obtain the test result of the circuit board under test 100 based on the resistance test data and the temperature test data after the circuit board under test 100 leaves the test body.

[0079] The test begins the moment the circuit board under test (PCB) 100 is fed into the test chamber. A chain within the test chamber feeds PCB 100 into the chamber, while the data acquisition device 102 simultaneously acquires resistance test data based on each sub-test line 101A of the resistance test line 101 and temperature test data based on the temperature test line 300. After the test, the processing device 103 establishes a time-based correspondence between the acquired resistance and temperature test data. Specifically, it determines the resistance data at the same time point 105 and the temperature data at the same temperature test point 303 within the same region. The processing device 103 then uses this established correspondence to obtain the test results of PCB 100, such as its connection temperature.

[0080] The following example illustrates the relationship between the data acquisition device 102 and the processing device 103. In one scenario, the data acquisition device 102 and the processing device 103 are the same device; that is, the processing device 103 not only has resistance and temperature acquisition functions but also data processing and analysis functions. When the processing device 103 does not have a data acquisition function, it is... Figure 4 The example shown.

[0081] Figure 4 This is a schematic diagram of another printed circuit board testing system provided in an embodiment of this application. Figure 4 As shown, optionally, the acquisition device 102 includes: a resistance acquisition device 401 and a temperature acquisition device 402; one end of each sub-test line 101A is connected to the resistance acquisition device 401, and one end of the temperature test line 300 is connected to the temperature acquisition device 402.

[0082] from Figure 4 It can be seen that the acquisition device 102 and the processing device 103 are different devices. The acquisition device 102 has an acquisition function, while the processing device 103 has a data processing and analysis function. As an example, the resistance acquisition device 401 may be a micro-ohmmeter, and the temperature acquisition device 402 may be a temperature recorder. It should be noted that this application does not limit the specific form of the resistance acquisition device 401 and the temperature acquisition device 402.

[0083] It is understandable that the acquisition device 102 may be capable of acquiring resistance and temperature test data at a preset sampling frequency (e.g., per second), but its data recording function cannot record resistance and temperature test data at the preset sampling frequency. Consequently, the processing device 103 cannot acquire resistance and temperature test data that vary at the preset sampling frequency. Based on this, this application can be modified as follows: Figure 5 The corresponding example enables the processing device 103 to acquire resistance test data and temperature test data that vary at a preset sampling frequency.

[0084] Figure 5 This is a schematic diagram of another printed circuit board testing system provided in an embodiment of this application. Figure 5 As shown, the system may optionally include a screen recording device 500.

[0085] When the resistance test data and temperature test data are displayed on the display interface of the acquisition device 102 at a preset acquisition frequency, the screen recording device 500 is aligned with the display interface of the acquisition device 102 to obtain the recorded video; the processing device 103 is connected to the screen recording device 500 to acquire the recorded video and obtain the test results of the circuit board under test based on the resistance test data and temperature test data recorded in the recorded video.

[0086] It should be noted that the acquisition device 102 and the screen recording device 500 can be two independent devices or integrated into the same device as a functional module. This application does not limit them.

[0087] In one exemplary scenario, when the acquisition device 102 and the processing device 103 are the same device—that is, when the processing device 103 has acquisition capabilities but cannot record resistance test data and temperature test data at a preset sampling frequency—a screen recording device connected to it can be used to record the display interface of the processing device 103. It is understood that during data acquisition, the processing device 103 displays resistance test data and temperature test data at a preset sampling frequency on its display interface, and both resistance test data and temperature test data correspond to time information. Therefore, when the screen recording device 500 records the data at the display interface of the processing device 103, the resulting recorded video includes resistance test data, temperature test data, and time information displayed at the preset sampling frequency. After the processing device 103 receives the recorded video sent by the screen recording device 500, it can extract multiple resistance test data and temperature test data corresponding to the same time from the acquired recorded video according to the preset sampling frequency. Then, based on these multiple resistance test data and temperature test data corresponding to the same time, the test results of the circuit board under test can be obtained.

[0088] In another exemplary case, the acquisition device 102 and the processing device 103 are different devices. Assuming that the resistance acquisition device 401 and the temperature acquisition device 402 in the acquisition device 102 cannot record resistance test data and temperature test data at a preset sampling frequency, respectively, a screen recording device 1 can be assigned to the resistance acquisition device 401 and a screen recording device 2 can be assigned to the temperature acquisition device 402. The screen recording device 1 and the screen recording device 2 are respectively connected to the processing device 103. The acquired recorded resistance video and recorded temperature video can be sent to the processing device 103. The processing device 103 establishes a correspondence between the resistance test data and the temperature test data based on the preset sampling frequency, and then obtains the test results of the circuit board under test based on the relationship.

[0089] As can be seen, by using the above method, the processing device 103 can acquire resistance test data and temperature test data that vary at a preset sampling frequency, which can improve the accuracy of the test results.

[0090] Optionally, the system further includes: a test lead transmission device, which is equipped with a resistance wire drive wheel and a temperature wire drive wheel. The resistance wire drive wheel is used to wind the resistance test lead 101, and the temperature wire drive wheel is used to wind the temperature test lead 300. When the circuit board 100 to be tested is tested, the resistance wire drive wheel and the temperature wire drive wheel rotate according to the transmission rate set by the test body, so that the resistance test lead 101 and the temperature test lead 300 travel at the same transmission rate as the chain in the test body, so as to send the circuit board 100 to be tested into the test body for heating.

[0091] In one example, when testing the circuit board 100 under test, the transmission speed of the resistance wire drive wheel and the temperature wire drive wheel on the test line transmission device can be set to the transmission speed of the chain in the test body, and the circuit board 100 under test is sent into the test entrance of the test body in a clockwise transmission manner. After the circuit board 100 under test comes out of the test exit of the test body, the connection between the resistance test line 101 and the temperature test line 300 and the circuit board under test is disconnected, the chain transmission is stopped, and then the resistance wire drive wheel and the temperature wire drive wheel on the test line transmission device are set to retrieve the resistance test line 101 and the temperature test line 300 in a counterclockwise transmission manner.

[0092] In another exemplary manner, after the circuit board under test 100 exits from the test outlet of the test body, the connection between the resistance test line 101 and the temperature test line 300 and the acquisition device 102 is disconnected, so that the resistance test line 101 and the temperature test line 300 continue to travel with the transmission of the resistance line drive wheel, the transmission of the temperature line drive wheel, and the chain until the test lines are completely exited from the test outlet of the test body.

[0093] In another exemplary embodiment, after the resistance test lead 101 and the temperature test lead 300 are connected to the circuit board under test 100, they are then fixed at intervals (e.g., 1m) to a board surface of the same width as the circuit board under test 100 using high-temperature adhesive or cable ties. Subsequently, these board surfaces and the circuit board under test 100 are fed into the test body together. When the circuit board under test 100 comes out of the test outlet of the test body, the connection between the resistance test lead 101 and the temperature test lead 300 and the acquisition device 102 is disconnected, so that these board surfaces and the circuit board under test continue to move with the transmission of the resistance wire drive wheel, the transmission of the temperature wire drive wheel, and the chain until the resistance test lead and the temperature test lead completely exit from the test outlet of the test body.

[0094] It can be seen that the test transmission equipment feeds the test wires into the test body according to the transmission speed of the chain in the test body, which can further avoid the phenomenon of the test wires getting tangled with the chain.

[0095] Figure 6 This is a flowchart illustrating a printed circuit board testing method provided in an embodiment of this application. Figure 6 As shown, this method is applied to the processing device 103 in the aforementioned printed circuit board testing system, and the method may include:

[0096] S601. According to the preset acquisition frequency, extract multiple resistance test data and temperature test data corresponding to the same time from the acquired recorded video.

[0097] S602. Based on multiple resistance test data and temperature test data corresponding to the same time, the test results of the circuit board under test are obtained.

[0098] After acquiring the recorded video, the processing device can segment the recorded video based on a preset sampling frequency to obtain multiple sub-videos. Resistance test data and temperature test data are extracted from each sub-video. The resistance test data and temperature test data in each sub-video have corresponding time information, so multiple resistance test data and temperature test data corresponding to the same time can be obtained, such as the resistance test data and temperature test data corresponding to t1 second, t2 second, and t3 second.

[0099] Based on this, the correspondence between the resistance test data and the temperature test data per second can be obtained. The processing device analyzes the change of the resistance test data when the temperature test data continuously increases according to the correspondence. If the resistance test data corresponding to a certain temperature test data indicates that its resistance value exceeds a preset multiple (such as 5% or 10%) of the reference resistance value, the temperature test data can be used as the critical temperature of the circuit board under test.

[0100] Figure 7 This is a schematic diagram of a printed circuit board testing device provided in an embodiment of this application. Figure 7 As shown, this device is used in the processing equipment of the aforementioned printed circuit board testing system, and the device may include:

[0101] The extraction module 701 is used to extract multiple resistance test data and temperature test data corresponding to the same time from the acquired recorded video according to a preset acquisition frequency.

[0102] The determination module 702 is used to obtain the test results of the circuit board under test based on multiple resistance test data and temperature test data corresponding to the same time.

[0103] The above-described apparatus is used to execute the method provided in the foregoing embodiments, and its implementation principle and technical effects are similar, so they will not be described again here.

[0104] These modules can be one or more integrated circuits configured to implement the above methods, such as one or more Application Specific Integrated Circuits (ASICs), one or more Digital Signal Processors (DSPs), or one or more Field Programmable Gate Arrays (FPGAs). Alternatively, when a module is implemented using processing element scheduler code, the processing element can be a general-purpose processor, such as a Central Processing Unit (CPU) or other processor capable of calling program code. Furthermore, these modules can be integrated together as a system-on-a-chip (SoC).

[0105] Figure 8 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application, such as... Figure 8 As shown, the electronic device may include a processor 801, a storage medium 802, and a bus 803. The storage medium 802 stores machine-readable instructions executable by the processor 801. When the electronic device is running, the processor 801 communicates with the storage medium 802 via the bus 803, and the processor 801 executes the machine-readable instructions to perform the steps of the above method embodiment. The specific implementation and technical effects are similar and will not be described in detail here.

[0106] Optionally, this application also provides a computer-readable storage medium storing a computer program, which, when run by a processor, executes the steps of the above-described method embodiments.

[0107] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0108] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0109] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or in a combination of hardware and software functional units.

[0110] The integrated units implemented as software functional units described above can be stored in a computer-readable storage medium. These software functional units, stored in a storage medium, include several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute some steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0111] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0112] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application. It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need further definition and explanation in subsequent figures. The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations are possible for those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A printed circuit board testing system, characterized in that, include: The system includes a circuit board under test (PCB), resistance test leads, a data acquisition device, a processing device, temperature test leads, a temperature sensor, and a test lead transmission device. The resistance test leads comprise multiple sub-test leads. A resistance wire fixing hole is provided at a first preset position on the PCB; a temperature wire fixing hole is provided at a second preset position on the PCB; one end of each temperature test lead is connected to the data acquisition device, and the other end passes through the temperature wire fixing hole and connects to the temperature sensor at a temperature test point on the PCB; the test lead transmission device includes a resistance wire drive wheel and a temperature wire drive wheel, the resistance wire drive wheel being used to wind the resistance test lead, and the temperature wire drive wheel being used to wind the temperature test lead. One end of each of the sub-test lines is connected to the acquisition device, and the other end of each of the sub-test lines passes through the resistance wire fixing hole and is connected to the resistance test point set on the circuit board under test. The acquisition device is used to acquire resistance test data in real time through each sub-test line in the resistance test line, starting from the moment the test body with temperature parameters is sent into the circuit board under test. The processing device is used to obtain the test result of the circuit board under test based on the resistance test data collected by the acquisition device after the circuit board under test leaves the test body; When the circuit board under test is tested, the resistance wire drive wheel and the temperature wire drive wheel rotate according to the transmission rate set by the test body, so that the resistance test wire and the temperature test wire travel at the same transmission rate as the chain in the test body, so as to send the circuit board under test into the test body for heating.

2. The system according to claim 1, characterized in that, A protective cover is provided outside the resistance test leads, and the protective cover includes each sub-test lead; The protective cover passes through the resistance wire fixing hole and connects to the resistance test point set on the circuit board under test.

3. The system according to claim 1, characterized in that, The resistance test point is a resistance test hole; The resistance test hole is connected to the other end of each of the sub-test lines via an electrical connector.

4. The system according to claim 1, characterized in that, The acquisition device is also used to: acquire temperature test data in real time through the temperature test line, starting from the moment the circuit board under test is sent into the test body; The processing device is specifically used to obtain the test results of the circuit board under test based on the resistance test data and the temperature test data after the circuit board under test leaves the test body.

5. The system according to claim 4, characterized in that, The acquisition device and the processing device are the same device.

6. The system according to claim 4, characterized in that, The data acquisition equipment includes: a resistance data acquisition device and a temperature data acquisition device; One end of each of the sub-test leads is connected to the resistance acquisition device, and one end of the temperature test lead is connected to the temperature acquisition device.

7. The system according to claim 5 or 6, characterized in that, The system also includes: a screen recording device; When the resistance test data and the temperature test data are displayed on the display interface of the acquisition device at a preset acquisition frequency, the screen recording device is aligned with the display interface of the acquisition device to obtain a recorded video. The processing device is connected to the screen recording device to acquire the recorded video and obtain the test results of the circuit board under test based on the resistance test data and temperature test data recorded in the recorded video.

8. A method for testing printed circuit boards, characterized in that, The method is applied to the processing equipment in the printed circuit board testing system of claim 7, and the method includes: According to the preset acquisition frequency, extract multiple resistance test data and temperature test data corresponding to the same time from the acquired recorded video; The test results of the circuit board under test are obtained based on multiple resistance test data and temperature test data corresponding to the same time.

9. A printed circuit board testing device, characterized in that, The device is applied to the processing equipment in the printed circuit board testing system of claim 7, and the device comprises: The extraction module is used to extract multiple resistance test data and temperature test data corresponding to the same time from the acquired recorded video according to a preset acquisition frequency. The determination module is used to obtain the test results of the circuit board under test based on multiple resistance test data and temperature test data corresponding to the same time.

10. An electronic device, characterized in that, include: The device includes a processor, a storage medium, and a bus. The storage medium stores machine-readable instructions executable by the processor. When the electronic device is running, the processor communicates with the storage medium via the bus, and the processor executes the machine-readable instructions to perform the steps of the printed circuit board testing method as described in claim 8.

11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, performs the steps of the printed circuit board testing method as described in claim 8.

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