Camera module and electronic device thereof

Abstract

The present invention discloses an imaging module and an electronic device thereof, including a photosensitive component, a lens component, and a driving component. The photosensitive component includes a circuit board and a base disposed on the circuit board. The lens component is disposed on the photosensitive path of the photosensitive component. The driving component includes at least one set of coils and at least one set of magnets. The at least one set of coils is disposed at the base. The at least one set of coils and the at least one set of magnets are disposed opposite to each other along the optical axis direction. The at least one set of coils is electrically connected to the circuit board. When the at least one set of coils is electrically conductive, the lens component can be driven to relatively displace along the orthogonal plane of the optical axis. Thereby, while ensuring the imaging quality of the imaging module, it is beneficial to make the imaging module thinner and lighter and have a smaller manufacturing volume.

Description

Technical Field

[0001] The present invention relates to the field of optical technologies, and in particular, to an imaging module and an electronic device thereof. Background Art

[0002] With the progress and development of technology, electronic devices and intelligent devices are increasingly developing towards high performance and thinness. As one of the core configurations of electronic products and intelligent devices, the imaging module necessarily needs to make corresponding adjustments in terms of performance and size. Correspondingly, during this round of technological innovation, each component of the imaging module needs to make corresponding changes in terms of performance and size.

[0003] The motor is an indispensable component of a high-pixel imaging module. During the operation of the imaging module, the motor can drive the lens to move in multiple directions to achieve the optical autofocus function (hereinafter referred to as the AF function, AutoFocus, automatic focusing) and the optical image stabilization function (hereinafter referred to as the OIS function: Optical Image Stabilization) during the shooting process. The AF function refers to the function of linearly moving a carriage with a lens in the optical axis direction through the motor to focus on the subject and generate a clear image at an image sensor (CMOS, CCD, etc.) located behind the lens. The OIS function refers to the function of improving the image clarity by adaptively moving the carriage with the lens along the direction compensating for the jitter when the lens shakes due to tremors through the motor.

[0004] As the imaging quality requirements of mobile phone imaging modules are getting higher and higher, the volume and weight of the lens are getting larger and larger, and the driving force requirements for the motor are also getting higher and higher. However, current electronic devices (such as mobile phones) have relatively large restrictions on the volume of the imaging module, and the occupied volume of the motor increases correspondingly as the lens increases, and the imaging module cannot meet the requirements of miniaturization. In existing imaging modules, the motor is usually an independent supporting structure, usually including a motor and a motor support seat. The motor is assembled to the photosensitive component through the motor support seat. During the assembly process, due to the insufficient surface flatness of the motor support seat, assembly tolerances may be generated between the motor support seat and the photosensitive component. If the flatness is increased to reduce the assembly tolerance, the cost of the motor will increase, which is not conducive to market competition.

[0005] In the traditional packaging process of camera modules, components such as motors, lenses, and image sensors are provided by different suppliers respectively. The production environments of each component are different, and the requirements for products are also inconsistent. Among them, the motor is a component with a relatively complex structure but relatively low requirements for the manufacturing environment. The dust-free level requirement in the motor manufacturing workshop is relatively low, and the dust in its production environment is much more than that in the manufacturing workshops of lenses or image sensors. When the module factory packages independent motors, lenses, and image sensors, the dust carried on the motor will cause serious dust pollution to the camera module. Even if the motor is cleaned in time, due to the complexity of the internal structure of the motor, dust may still be hidden inside the motor and escape during the subsequent assembly process or the use of the camera module, falling on the lens or the photosensitive surface of the image sensor, resulting in black spots in the imaging of the camera module and affecting the imaging quality of the camera module. Summary of the Invention

[0006] An object of the present invention is to provide a camera module and its electronic device, which can ensure the imaging quality of the camera module while facilitating the camera module to be more lightweight and have a smaller manufacturing volume.

[0007] Another object of the present invention is to provide a camera module and its electronic device, which can improve the flatness of the installation of the driving component by directly placing the first coil in the driving component at the base, without the need for an additional first coil support, realize the OIS function of the camera module, reduce the assembly tolerance of the camera module, and facilitate further reducing the height of the camera module.

[0008] Another object of the present invention is to provide a camera module and its electronic device, which can facilitate ensuring the stability of the position of the first coil by holding the first coil in the base of the photosensitive component, not only preventing it from falling off, but also facilitating always maintaining a safe gap between the first coil and the magnet, enabling good electromagnetic induction between the magnet and the first coil.

[0009] Another object of the present invention is to provide a camera module and its electronic device, which integrates the assembly of the motor into the packaging of the camera module, making the motor a part of the module packaging rather than a separate component, changing the assembly process, improving the integration degree of the camera module, thereby not only reducing the influence of dirt caused by dust, improving the yield rate, shortening the overall process, but also further eliminating the use of some parts and reducing the size of the camera module.

[0010] To achieve the above object, the technical solution adopted by the present invention is as follows: An imaging module includes a photosensitive component, a lens component, and a driving component. The photosensitive component includes a circuit board and a base disposed on the circuit board. The lens component is disposed on the photosensitive path of the photosensitive component. The driving component includes at least one set of coils and at least one set of magnets. The coils are disposed at the upper end of the base, at least a part of the coils is exposed on the upper surface of the base, the coils and the magnets are disposed opposite to each other along the optical axis direction, and the coils are electrically connected to the circuit board. When the coils are electrically conducted, the lens component can be driven to displace relatively along the orthogonal plane of the optical axis.

[0011] As a preference, the at least one set of coils includes at least one first coil. The base is provided with a positioning area, which is located on the upper surface of the base or is internally provided in the base. The first coil is disposed in the positioning area of the base, so that at least a part of the first coil is exposed on the upper surface of the base.

[0012] As a preference, the positioning area is a positioning groove. The first coil includes a coil body and a coil end. The coil end electrically connects the coil body and the circuit board. The positioning groove is recessed from the upper surface of the base. The coil body is internally disposed in the base, and the coil end is exposed on the upper surface of the base.

[0013] As a preference, the depth of the positioning groove is greater than the thickness of the first coil. The coil body of the first coil is internally disposed in the positioning groove, and the coil end is exposed on the upper surface of the base; or the depth of the positioning groove is equal to the thickness of the first coil, and at least a part of the coil end and the coil body of the first coil are exposed on the upper surface of the base; or when the depth of the positioning groove is less than the thickness of the first coil, both the coil end and the coil body of the first coil are exposed on the upper surface of the base.

[0014] As a preference, an axial spacing is formed between the first coil and the magnet. The axial spacing is 0.05 - 0.5 mm. Preferably, the axial spacing is 0.1 - 0.3 mm. Preferably, the axial spacing is 0.1 mm.

[0015] As a preference, the positioning area is located in the upper part of the base, and the distance between the first coil and the upper surface of the base is not greater than 0.1 mm.

[0016] As a preference, the photosensitive component includes a circuit board assembly, a photosensitive chip, and a filter. The photosensitive chip is placed on the circuit board. The circuit board assembly includes the circuit board and the base. The base is fixed on the upper surface of the circuit board, and the filter is disposed on the base.

[0017] As a preference, the base further includes a conductive bracket which is built in the base and electrically connects the first coil and the circuit board.

[0018] As a preference, the conductive bracket is an iron bracket, and the conductive bracket and the magnet are axially arranged opposite to each other, so as to generate a magnetic suction force in the optical axis direction between the conductive bracket and the magnet.

[0019] As a preference, a motor pin slot is provided inside the base, and the first coil is electrically connected to the circuit board through the motor pin slot; or the first coil conducts the circuit board from the side of the base.

[0020] As a preference, the base is a conductive base, and the base electrically conducts the first coil and the circuit board.

[0021] As a preference, a conductive adhesive layer is coated on the positioning area of the base and the side wall of the base where the positioning area is located; or a circuit layer is laid on the surface of the base; or the base is a split conductive structure.

[0022] As a preference, the base is a conductive base, and the base electrically conducts the first coil and the circuit board.

[0023] As a preference, the first coil is a wound coil or a circuit board type coil.

[0024] As a preference, the camera module further includes a housing, the photosensitive component and the driving component are accommodated in the housing, and the housing is joined to the circuit board.

[0025] As a preference, the driving component further includes a first carrier, a second carrier and a second coil. The lens component is accommodated in the second carrier, the second coil is arranged on the outer periphery of the second carrier, the magnet is fixed on the first carrier, the magnet and the first coil are axially arranged opposite to each other to form a first magnetic field circuit, so as to drive the lens component to displace relative to the base along the orthogonal plane of the optical axis and perform jitter correction on the lens component. The magnet and the second coil are radially arranged opposite to each other to form a second magnetic field circuit, so as to drive the second carrier to move along the optical axis direction and drive the lens component to perform autofocus.

[0026] As a preference, the driving component further includes a pair of first elastic sheets and a pair of second elastic sheets. The first carrier is suspended in the housing through the first elastic sheets connected up and down, and the second carrier is suspended in the first carrier through the second elastic sheets connected up and down.

[0027] As a preference, the camera module further includes a sensing element, which is disposed in the first coil and is arranged opposite to the magnet to detect the position of the magnet.

[0028] An electronic device includes the above-mentioned camera module and an electronic device body, wherein the camera module is assembled to the electronic device body. Description of the Drawings

[0029] Figure 1 is a schematic structural diagram of a first camera module according to an embodiment of the present application;

[0030] Figure 2 is a schematic structural diagram of a second camera module according to an embodiment of the present application;

[0031] Figure 3 is a schematic structural diagram of a third camera module according to an embodiment of the present application;

[0032] Figure 4 is a schematic structural diagram of a fourth camera module according to an embodiment of the present application;

[0033] Figure 5 is a schematic structural diagram of a fifth camera module according to an embodiment of the present application;

[0034] Figure 6 is a schematic structural diagram of a sixth camera module according to an embodiment of the present application.

[0035] In the figures: 10, lens assembly; 11, lens; 12, lens barrel; 20, photosensitive assembly; 21, base; 211, upper surface; 212, conductive bracket; 214, filter groove; 215, positioning area; 217, motor pin groove; 22, filter; 231, circuit board; 232, photosensitive chip; 233, electronic component; 30, driving assembly; 31, first carrier; 32, second carrier; 331, first elastic sheet; 332, second elastic sheet; 34, first coil; 341, coil body; 342, coil end; 35, second coil; 36, magnet; 40, housing. Detailed Embodiments

[0036] Next, in combination with the specific embodiments, the present invention will be further described. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be combined arbitrarily to form new embodiments.

[0037] In the description of the present invention, it should be noted that for orientation terms, such as the terms "center", "horizontal", "vertical", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation and positional relationship are based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present invention.

[0038] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence.

[0039] The terms "comprising" and "having" in the description and claims of the present application, and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that comprises a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0040] It should be noted that, as used in the present application, terms such as "substantially", "about", and similar terms are used as approximate terms and not as terms of degree, and are intended to account for the inherent deviations in measured or calculated values that would be recognized by a person of ordinary skill in the art.

[0041] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, the terms "arranged", "installed", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected, or connected by contact or indirectly through an intermediate medium, and may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] According to the first aspect of the present application, there is provided an imaging module, such as Figures 1 to 6As shown, the camera module includes a lens assembly 10, an image sensor assembly 20, and a driving assembly 30. The image sensor assembly 20 includes a circuit board 231 and a base 21 disposed on the circuit board 231. The lens assembly 10 is disposed on the light sensing path of the image sensor assembly 20. The driving assembly 30 includes at least one set of coils and at least one set of magnets 36. The at least one set of coils is disposed at the base 21. The at least one set of coils and the at least one set of magnets 36 are disposed opposite to each other along the optical axis direction. The at least one set of coils is electrically connected to the upper surface of the circuit board 231. When the at least one set of coils is electrically conducted, the lens assembly 10 can be driven to displace relative to the orthogonal plane of the optical axis. By directly disposing the coils at the base 21, the base 21 of the image sensor assembly 20 can be directly used as the motor base, eliminating the motor support base of the traditional motor. This not only simplifies the structure of the camera module, but also enables the installation of the motor to be directly assembled based on the base 21, eliminating the glue bonding method between the traditional motor support base and the base 21 of the image sensor assembly 20. Furthermore, it improves the flatness of the motor relative to the image sensor assembly 20, reduces the assembly tolerance of the camera module, and is beneficial to further reducing the height of the camera module.

[0043] In some embodiments, the camera module may be an optical image stabilization camera module, that is, the lens assembly 10 displaces relative to the image sensor assembly 20 along the orthogonal plane of the optical axis. The lens assembly 10 is a mover, and the image sensor assembly 20 is a stator. The camera module may also be an image sensor chip stabilization camera module, that is, the image sensor assembly 20 displaces relative to the lens assembly 10 along the orthogonal plane of the optical axis. The image sensor assembly 20 is a mover, and the lens assembly 10 is a stator. In the description of this application, the camera module is taken as an optical image stabilization camera module as an example for illustration.

[0044] In some embodiments, the number of optical lenses of the lens assembly 10 may be one or more than one. Each optical lens is respectively assembled to the driving assembly 30. That is to say, the camera module can be implemented as an array camera module. In this embodiment, only one optical lens is taken as an example for illustration.

[0045] In some embodiments, the at least one set of coils includes at least one first coil 34. The base 21 is provided with a positioning area 215. The positioning area 215 is located on the upper surface 211 of the base 21 or is internally provided in the base 21. The first coil 34 is disposed in the positioning area 215 of the base 21. In other words, the positioning area 215 can be provided on the upper surface 211 of the base, so that the first coil 34 is superposed and disposed on the upper surface 211 of the base 21, as Figure 1As shown, the position of the positioning area 215 can also be lower than the upper surface 211 of the base 21, such that part or all of the first coil 34 is built into the base 21 and adjacent to the upper surface 211 of the base 21.

[0046] In this embodiment, an orthogonal coordinate system (X, Y, Z) is used for description. The Z direction is the optical axis direction and is the up-and-down direction. The X direction and the Y direction orthogonal to the Z axis are used as the optical axis orthogonal directions. The X direction is the front-back direction (or left-right direction), and the Y direction is the left-right direction (or front-back direction). The plane formed by the X direction and the Y direction along the optical axis is the plane formed by the X direction and the Y direction. The "radial direction" is the direction orthogonal to the Z axis, and the "axial direction" refers to the opposite setting between two planes orthogonal to the Z axis, including not only the direction parallel to the Z axis but also the direction close to the Z axis parallel.

[0047] In some embodiments, the positioning area 215 is a positioning groove. The first coil 34 includes a coil body 341 and a coil end 342. The coil end 342 electrically connects the coil body 341 and the circuit board 231. The positioning groove is formed by recessing from the upper surface 211 of the base 21. The first coil 34 is built into the base 21. At least a part of the first coil 34 is exposed on the upper surface 211 of the base 21 and electrically connected to the circuit board 231. The depth of the positioning groove is less than, equal to, or greater than the height of the first coil 34, such that the coil body 341 is built into the base 21 and the coil end 342 is exposed on the upper surface 211 of the base 21, where Figure 2 the depth of the positioning groove shown is greater than the thickness of the first coil 34; Figure 3 the depth of the positioning groove shown is less than the thickness of the first coil 34; Figure 5 the depth of the positioning groove shown is equal to the thickness of the first coil 34. Herein, the thickness of the first coil 34 is the height of the first coil 34 along the optical axis direction.

[0048] In other words, the first coil 34 can be built into the base 21. When the depth of the positioning groove is greater than the thickness of the first coil 34, the coil body 341 of the first coil 34 is built into the positioning groove and the coil end 342 is exposed on the upper surface of the base 21, as Figure 2 shown; when the depth of the positioning groove is equal to the thickness of the first coil 34, at least a part of the coil end 342 and the coil body 341 of the first coil 34 are exposed on the upper surface of the base 21, as Figure 5 shown; when the depth of the positioning groove is less than the thickness of the first coil 34, both the coil end 342 and the coil body 341 of the first coil 34 are exposed on the upper surface of the base 21, as Figure 3As shown. That is to say, at least part of the first coil 34 is exposed as much as possible upward from the upper surface 211 of the base 21. The coil end 342 is electrically connected to the circuit board 231 through the side of the conduction structure outside the base 21, so that the first coil 34 is electrically conducted. The coil end 342 can also be electrically connected to the circuit board 231 through the conduction structure inside the base 21.

[0049] In some embodiments, an axial spacing is formed between the first coil 34 and the magnet 36. The axial spacing is 0.05 - 0.5 mm. Preferably, the axial spacing is 0.1 - 0.3 mm. Preferably, the axial spacing is 0.1 mm. Thus, the magnet 36 will not contact the first coil 34 to cause interference, and can generate good electromagnetic induction, facilitating maintaining a certain safety distance between the first coil 34 and the magnet 36, ensuring that the first coil 34 and the magnet 36 will neither contact and rub due to being too close nor result in too weak a generated magnetic field due to being too far apart.

[0050] In some embodiments, the positioning area 215 is located in the upper part of the base 21, and the distance between the first coil 34 and the upper surface 211 of the base 21 is not greater than 0.1 mm, so that the first coil 34 built in the base 21 maintains a preset distance from the upper surface 211 of the base 21, which helps to maintain a certain safety distance between the first coil 34 and the magnet 36.

[0051] In some embodiments, the photosensitive component 20 includes a circuit board assembly, a photosensitive chip 232, and a filter 22. The photosensitive chip 232 is placed on the circuit board 231. The circuit board assembly includes the circuit board 231 and the base 21. The base 21 is fixed on the upper surface of the circuit board 231, such as the base 21 being directly pasted on the upper surface of the circuit board 231. The base 21 can also be integrally formed with the circuit board 231. The filter 22 is arranged on the base 21.

[0052] Among them, the photosensitive component 20 further includes electronic components 233. The electronic components 233 are located on the outer periphery of the photosensitive chip 232. The electronic components 233 include but are not limited to resistors, capacitors, driving devices, etc. The substrate of the circuit board 231 can be a rigid PCB, a flexible PCB, a rigid-flex PCB, or a ceramic substrate. The base 21 covers the electronic components 233 to form protection for the electronic components 233. It is worth mentioning that in other embodiments of the present application, the base 21 may not completely cover the electronic components 233, and the present application does not make any restrictions.

[0053] In some embodiments, the photosensitive chip 232 includes a photosensitive area and a non-photosensitive area. The photosensitive area is aligned with the lens assembly 10, and the base 21 surrounds the non-photosensitive area of the photosensitive chip.

[0054] In some embodiments, the filter 22 is attached to the base 21. The lower surface of the filter 22 faces the photosensitive chip 232, and the upper surface of the filter 22 faces the lens assembly 10. A closed space of the photosensitive assembly 20 is formed among the filter 22, the base 21, and the circuit board 231 to accommodate the photosensitive chip 232 therein and prevent dust from contaminating the photosensitive chip 232. Herein, the filter 22 can be attached to the upper surface 211 of the base 21 or can be attached inside the base 21.

[0055] In some embodiments, the base 21 is provided with a base body and an extension arm. The extension arm extends inward from the base body. The filter 22 is attached to the extension arm of the base 21, so that the filter 22 is accommodated inside the base 21, further reducing the height of the photosensitive assembly 20. In other words, a filter groove 214 is provided on the base 21, and the extension arm extends inward to form the filter groove 214, and the filter 22 is placed in the filter groove 214. Herein, the extension arm can be in a stepped structure. The filter 22 is attached to the upper step of the extension arm, and the non-optical area of the photosensitive chip 232 is attached to the lower step of the extension arm.

[0056] In some embodiments, the photosensitive assembly 20 can further include a lens holder. The lens holder is placed on the upper surface 211 of the base 21, and the filter 22 is attached to the lens holder. A closed space is formed among the base 21, the lens holder, and the circuit board 231, and the photosensitive chip 232 is sealed therein to prevent the photosensitive chip 232 from being contaminated by other impurities such as dust, thereby affecting the imaging effect.

[0057] Herein, the base 21 can be integrally formed on the outer periphery of the photosensitive chip 232, that is, the base 21 does not contact the photosensitive chip 232, that is, the base 21 is integrally formed on the circuit board 231 through the MOB packaging process; of course, the base 21 can also be integrally formed on the non-photosensitive area of the photosensitive chip 232. The base 21 extends toward the photosensitive chip 232 and covers the non-photosensitive area of the photosensitive chip 232, that is, the base 21 is integrally formed on the circuit board 231 through the MOC packaging process. Thus, by integrally forming the base 21, the flatness of the surface of the base 21 can be maintained, which is beneficial to reducing the assembly tolerance of the camera module and can also reduce the height of the camera module.

[0058] In some embodiments, the base 21 can be integrally formed on the circuit board 231 through a molding process. By directly placing the first coil 34 at the base 21, the motor support base in the traditional motor is removed, avoiding the assembly tolerance caused by the flatness problem of the motor support base, so that the base 21 has a high flatness, which helps to improve the overall imaging quality of the camera module. In addition, the installation of the motor can be directly assembled based on the base 21 of the photosensitive component 20. The height of the motor can be set according to the back focus of the lens, and other parts can be assembled, canceling the height setting process in the traditional process, and helping to reduce the shoulder height of the motor, thereby reducing the overall height of the camera module.

[0059] In some embodiments, the coil end 342 of the first coil 34 is exposed on the base 21, so that the coil end 342 can be electrically connected to the circuit board 231 through the side wall of the base 21, realizing the electrical connection of the first coil 34 to the circuit board 231; when the coil end 342 is accommodated in the base 21, the base 21 can further include a conductive bracket 212, and the conductive bracket 212 is built in the base 21 as a conduction structure. The conductive bracket 212 electrically connects the first coil 34 and the circuit board 231. At the same time, the conductive bracket 212 can support the first coil 34, such as directly attaching the first coil 34 to the conductive bracket 212, as Figure 4 shown. When both the coil body 341 and the coil end 342 of the first coil 34 are accommodated in the base 21, a motor pin slot 217 can also be provided in the base 21 as a conduction structure, and the first coil 34 and the circuit board 231 are electrically connected through the motor pin slot 217 to realize circuit conduction, as Figure 6 shown. Of course, in other embodiments of the present application, when the coil end 342 of the first coil 34 is exposed on the base 21, the first coil 34 and the circuit board 231 can also be electrically connected through the conductive bracket 212 or the built-in motor pin slot 217, and the present application does not make any restrictions.

[0060] In some embodiments, the circuit board 231 and the base 21 can be integrally formed through a molding process first, and then the first coil 34 is directly attached to the upper surface 211 of the base 21, that is, the first coil 34 is placed on the top of the base 21, and both the coil body 341 and the coil end 342 of the first coil 34 are completely exposed from the upper surface 211 of the base 21, as Figure 1 shown. It is also possible to first attach the base 21 directly to the upper surface of the circuit board 231, and then attach the first coil 34 to the upper surface of the base 21.

[0061] Among them, the conductive bracket 212 can be a metal conductive bracket or a non-metal conductive bracket. Preferably, the conductive bracket 212 is an iron bracket. The conductive bracket 212 is axially arranged opposite to the magnet 36, so as to generate a magnetic suction force along the optical axis direction between the conductive bracket 212 and the magnet 36, that is, the magnetic suction force generated between the plane where the conductive bracket 212 is located and the plane where the magnet 36 is located, including but not limited to the magnetic suction force in the vertical direction and the inclined magnetic suction force deviating from the vertical direction, to ensure the stability of the lens assembly 10 in the imaging module, so that the lens assembly 10 maintains a centered effect. When the lens assembly 10 is optically stabilized, it can quickly return to the initial position through the magnetic suction force between the conductive bracket 212 and the magnet 36. The initial position is the position of the lens assembly 10 before optical stabilization. A conductive bracket 212 can be arranged inside the base 21. One end of the conductive bracket 212 is connected to the first coil 34, and the other end of the conductive bracket 212 is connected to the circuit board 231. The circuit of the first coil 34 and the circuit board 231 is conducted through the conductive bracket 212, as Figure 4 shown.

[0062] In some embodiments, the base 21 is a conductive base, and the base 21 electrically conducts the first coil 34 and the circuit board 231. When the base 21 is a conductive base, the first coil 34 is electrically connected to the surface of the circuit board 231 through the base 21, so that the circuit connection is simpler and more convenient. The base 21 can be coated with a layer of conductive material on its surface, such as conductive glue, etc., which can be coated on the positioning area 215 and the side wall of the base 21 on the side where the positioning area 215 is located; a circuit layer can also be laid on the surface of the base 21, such as engraving a circuit or setting an FPC, etc., and the circuit is arranged on the positioning area and the side wall of the base 21 on the side where the positioning area is located, so that the required laid circuit is shorter; the base 21 can also be made of a conductive material, such as a metal material, etc. When the base is a conductive material, in order to prevent the circuit from short-circuiting, the base 21 is a split conductive structure, that is, the base is set as a split structure, the first coil 34 is arranged on the upper part of each split base 21, the number of the split bases 21 is the same as the number of the first coils 34, the split bases 21 are not connected to each other, and each split base 21 is arranged on the circuit board and is located on the four sides of the imaging module.

[0063] In some embodiments, the first coil 34 is a wound coil or a circuit board type coil. The circuit board type coil includes a substrate and a coil body. The coil body is integrally formed on the substrate and is arranged in a spiral shape on the substrate. Those skilled in the art should understand that based on electromagnetic induction, a magnetic field can be generated by a current-carrying solenoid. Correspondingly, when the circuit board type coil is conducted, a stable magnetic field is generated by means of the coil body. In particular, the substrate is planar, and the coil body is formed in a spiral shape on the surface of the substrate. Since the coil body is integrally formed on the substrate without being tightened, the diameter of the wire of the coil body can be significantly reduced. Correspondingly, under the same volume, the number of turns of the circuit board type coil can be relatively increased compared with the existing wound coil. On the other hand, since the circuit board type coil can be configured to have relatively more turns, correspondingly, the size of the magnetic element opposite to the circuit board type coil can be reduced, which is beneficial to further reducing the overall size of the driving assembly 30.

[0064] In some embodiments, the circuit board type coil can be prepared by circuit board etching process, circuit board electroplating process, circuit board electroless plating process, circuit board lithography process. The substrate can be a rigid board, a flexible board, a PCB board, a rigid-flex board, etc. The coil body is formed at a corresponding position on the substrate through relevant processes and is arranged in a spiral shape.

[0065] In some embodiments, the photosensitive chip 232 can be directly attached to the upper surface of the circuit board 231. In other embodiments, the circuit board 231 has a groove, and the photosensitive chip 232 is placed in the groove. Of course, the groove can also be directly formed into a through groove, and the photosensitive chip 232 is placed in the through groove. The camera module can further include a reinforcing part, which is placed on the bottom surface of the circuit board 231 to support and reinforce the camera module. The reinforcing part can also have a heat dissipation function to dissipate the heat generated by the circuit board 231 and prevent the circuit board 231 from being deformed by heat.

[0066] In some embodiments, the lens assembly 10 is correspondingly arranged on the light-sensing path of the photosensitive chip 232 to assemble into the camera module. The driving assembly 30 is arranged to drive the lens assembly 10 to move to achieve functions such as optical image stabilization and / or autofocus of the camera module.

[0067] In some embodiments, the camera module further includes a housing 40. The photosensitive component 20 and the driving component 30 are accommodated within the housing 40. The housing 40 can be engaged with the circuit board 231 to protect each element of the camera module and to block the electromagnetic waves generated during the operation of the camera module, achieving an electromagnetic shielding effect. If the electromagnetic waves generated when driving the camera module are emitted to the outside, they may affect other electronic components and may cause communication errors or malfunctions. The material of the housing 40 can be a metallic material, and the housing 40 can be grounded through a ground plane so that the housing 40 can be used as an electromagnetic shielding cover; the material of the housing 40 can also be a plastic material, with a conductive material coated on the plastic surface to block electromagnetic waves. The application does not limit the material of the housing 40. Since the motor support surface is eliminated, the housing 40 can be directly engaged with the circuit board 231, further reducing the assembly tolerance of the camera module.

[0068] In some embodiments, the driving component 30 further includes a first carrier 31, a second carrier 32, and a second coil 35. The lens assembly 10 is accommodated within the second carrier 32. The second coil 35 is disposed on the outer periphery of the second carrier 32. The magnet 36 is fixed to the first carrier 31. The magnet 36 and the first coil 34 are axially opposed to form a first magnetic field circuit, enabling the lens assembly 10 to be driven to displace relative to the base 21 along the orthogonal plane of the optical axis to perform jitter correction on the lens assembly 10. The magnet 36 and the second coil 35 are radially opposed to form a second magnetic field circuit, enabling the second carrier 32 to be driven to move along the optical axis direction, driving the lens assembly 10 to perform autofocus.

[0069] Wherein, the magnet 36 and the second coil 35 being radially opposed means that the magnet 36 and the second coil 35 are opposed in the X direction or the Y direction, and the magnet 36 and the first coil 34 being axially opposed means that the magnet 36 and the first coil 34 are opposed in the Z direction.

[0070] If the first coil 34 is energized, based on the interaction between the magnetic field of the magnet 36 and the current flowing through the first coil 34, a Lorentz force is generated to drive the first carrier 31 with the magnet 36 to move in the X direction or the Y direction, thereby driving the second carrier 32 and the lens assembly 10 to move in the X direction or the Y direction to achieve OIS anti-shake correction. The direction of the Lorentz force in the first magnetic field circuit is a direction (Y direction or X direction) orthogonal to the direction of the magnetic field (Z direction) and the direction of the current (X direction or Y direction).

[0071] If the second coil 35 is energized, based on the interaction between the magnetic field generated by the magnet 36 and the current flowing through the second coil 35, namely, the second magnetic field circuit is formed to generate a Lorentz force, driving the second carrier 32 with the second coil 35 to move in the Z direction, thereby driving the lens assembly 10 to move in the Z direction to achieve autofocus. The direction of the Lorentz force is the direction (Z direction) orthogonal to the direction of the magnetic field (X direction or Y direction) and the direction of the current in the second coil 35 (Y direction or X direction).

[0072] In some embodiments, the driving assembly 30 further includes a pair of first elastic sheets 331 and a pair of second elastic sheets 332. The first carrier 31 is suspended in the housing 40 by the first elastic sheets 331 connected up and down. Two ends of the two first elastic sheets 331 are connected to the first carrier 31 and the housing 40. The second carrier 32 is suspended in the first carrier 31 by the second elastic sheets 332 connected up and down. Two ends of the two second elastic sheets 332 are connected to the first carrier 31 and the second carrier 32, and the second carrier 32 is restored to the initial position by the elastic force of the second elastic sheets 332. Herein, the initial position of the second carrier 32 refers to the position before the second carrier 32 is displaced along the optical axis direction AF, so as to enable the second carrier 32 to achieve a centered effect. The first elastic sheets 331 can keep the first carrier 31 in the imaging module by their elastic force and make the first carrier 31 restored to the initial position by the elastic force of the first elastic sheets 331. Herein, the initial position of the first carrier 31 refers to the position before the first carrier 31 is displaced along the plane orthogonal to the optical axis direction OIS, so as to enable the first carrier 31 to achieve a centered effect.

[0073] In some embodiments, the second coil 35 can be disposed on the side wall of the first carrier 31 or integrally formed with the first carrier 31. The lens assembly 10 includes a plurality of lenses 11 and a lens barrel 12 disposed along the optical axis direction. The lens barrel 12 can be fixed to the second carrier 32 by means of adhesion or buckling, or the lens assembly 10 and the second carrier 32 can be set as an integral structure, namely, the second carrier 32 replaces the lens barrel 12 to accommodate the lenses 11. By the integral structure, the size of the lens barrel 12 can be reduced, and the gap between the conventional lens barrel 12 and the second carrier 32 can be reduced. And by forming the second coil 35 as a part of the second carrier 32, the thickness dimension of the second carrier 32 can be further reduced, and the second carrier 32 can be strengthened by the second coil 35, which helps to further reduce the size of the imaging module.

[0074] In some embodiments, the second coil 35 may be electrically connected to the circuit board 231 through the second elastic piece 332, or an FPC (Flexible Printed Circuit) may be disposed on the second carrier 32 to conduct the circuit between the first coil 34 and the circuit board 231 through the second carrier 32.

[0075] In some embodiments, the camera module further includes a sensing element disposed within the first coil 34. The sensing element is disposed opposite to the magnet 36 to detect the position of the magnet 36. The sensing element may be a position sensing element such as an IC or a Hall element. When the first carrier 31 moves in the direction of the optical axis orthogonal plane, the sensing element within the first coil 34 can measure the offset position of the magnet 36 relative to the base 21 in the X direction and / or the Y direction.

[0076] According to another aspect of the present application, an electronic device includes the above-described camera module and an electronic device body. The camera module is assembled to the electronic device body, and the camera module acquires and provides image information for the electronic device body.

[0077] The basic principles, main features, and advantages of the present invention have been described above. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present invention. Without departing from the spirit and scope of the present invention, various changes and improvements will occur to the present invention, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. An imaging module, characterized in that, Comprising: A photosensitive component, the photosensitive component including a circuit board and a base disposed on the circuit board; A lens component, disposed on the photosensitive path of the photosensitive component; A driving component, the driving component including at least one set of coils and at least one set of magnets, the coils being disposed at the upper end of the base, at least a part of the coils being exposed on the upper surface of the base, the coils and the magnets being oppositely disposed along the optical axis direction, the coils being electrically connected to the circuit board, when the coils are electrically conducted, being able to drive the lens component to relatively displace along the orthogonal plane of the optical axis. Wherein, the at least one set of coils includes at least one first coil, the base is provided with a positioning area, the positioning area is located on the upper surface of the base or is internally disposed in the base, the first coil is disposed in the positioning area of the base, such that the distance between the first coil and the upper surface of the base is not greater than 0.1 mm, the base further includes a conductive bracket, the conductive bracket is internally disposed in the base, the conductive bracket electrically connects the first coil and the circuit board. Wherein, the conductive bracket is an iron bracket, the conductive bracket and the magnet are axially oppositely disposed, being able to generate a magnetic suction force along the optical axis direction between the conductive bracket and the magnet.

2. The camera module according to claim 1, wherein, The positioning area is a positioning groove, the first coil includes a coil body and a coil end, the coil end electrically conducts the coil body and the circuit board, the positioning groove is formed by concave from the upper surface of the base, the coil body is internally disposed in the base, and the coil end is exposed on the upper surface of the base.

3. The camera module according to claim 2, wherein The depth of the positioning groove is greater than the thickness of the first coil, the coil body of the first coil is internally disposed in the positioning groove, and the coil end is exposed on the upper surface of the base; or the depth of the positioning groove is equal to the thickness of the first coil, at least a part of the coil end and the coil body of the first coil are exposed on the upper surface of the base; or when the depth of the positioning groove is less than the thickness of the first coil, both the coil end and the coil body of the first coil are exposed on the upper surface of the base.

4. The camera module according to claim 1, wherein An axial spacing is formed between the first coil and the magnet, the axial spacing is 0.05 - 0.5 mm, preferably, the axial spacing is 0.1 - 0.3 mm, preferably, the axial spacing is 0.1 mm.

5. The camera module according to claim 1, wherein The positioning area is located in the upper part of the base.

6. The imaging module according to claim 1, wherein The photosensitive component includes a circuit board assembly, a photosensitive chip, and a filter, the photosensitive chip is placed on the circuit board, the circuit board assembly includes the circuit board and the base, the base is fixed on the upper surface of the circuit board, and the filter is disposed on the base.

7. The camera module according to claim 1, wherein, The base is internally provided with a motor pin slot, the first coil is electrically connected to the circuit board through the motor pin slot; or the first coil conducts the circuit board from the side of the base.

8. The imaging module according to claim 1, characterized in that, The base is a conductive base, and the base electrically conducts the first coil and the circuit board.

9. The camera module according to claim 8, wherein A conductive adhesive layer is coated on the positioning area of the base and the side wall of the base where the positioning area is located; or a circuit layer is laid on the surface of the base; or the base is a split conductive structure.

10. The camera module according to claim 1, wherein The first coil is a wound coil or a circuit board type coil.

11. The camera module according to any one of claims 1 to 10, characterized in that, It further includes a housing, the photosensitive component and the driving component are accommodated in the housing, and the housing is joined to the circuit board.

12. The camera module according to claim 11, wherein The driving component further includes a first carrier, a second carrier and a second coil. The lens assembly is accommodated in the second carrier. The second coil is disposed on the outer periphery of the second carrier. The magnet is fixed to the first carrier. The magnet and the first coil are axially opposed to form a first magnetic field circuit, so as to drive the lens assembly to displace relative to the base along the orthogonal plane of the optical axis and perform shake correction on the lens assembly. The magnet and the second coil are radially opposed to form a second magnetic field circuit, so as to drive the second carrier to move along the optical axis direction and drive the lens assembly to perform autofocus.

13. The camera module according to claim 12, wherein, The driving component further includes a pair of first elastic pieces and a pair of second elastic pieces. The first carrier is suspended in the housing by the first elastic pieces connected up and down. The second carrier is suspended in the first carrier by the second elastic pieces connected up and down.

14. The imaging module according to claim 11, wherein It further includes a sensing element. The sensing element is disposed in the first coil. The sensing element is opposed to the magnet to detect the position of the magnet.

15. An electronic device, characterized in that, Comprising: The imaging module according to any one of claims 1 to 14; And An electronic device body, wherein the imaging module is assembled to the electronic device body.

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