An impedance testing device, method and electronic device

Abstract

The present application discloses an impedance testing device, method and electronic device, belonging to the technical field of integrated circuits. The device includes: a transmitting source module for transmitting a target signal with a preset frequency value; a transmission module for dividing the target signal into a reference signal and a transmitted signal, generating a reflected signal corresponding to the transmitted signal, transmitting the transmitted signal, and also receiving a feedback signal corresponding to the transmitted signal; a power amplifier PA module for amplifying the target signal and then transmitting it to the circuit under test. The PA module includes a first switching switch. When the first switching switch conducts the connection between the transmission module and the circuit under test, the transmission module transmits the transmitted signal to the circuit under test; a second switching switch. When the second switching switch conducts the connection between the circuit under test and the transmission module, the circuit under test transmits the feedback signal to the transmission module.

Description

Technical Field

[0001] This application belongs to the field of integrated circuit technology, and particularly relates to an impedance testing device, method, and electronic device. Background Art

[0002] As the functions required by electronic products are increasing, the printed circuit board (PCB), as the carrier for the electrical interconnection of electronic components, has become increasingly complex. Under the current PCB industrial technology limitations, there is a certain probability of impedance deviation in the circuit boards used for radio frequency development, resulting in unexpected reflections and additional power consumption, which requires the adjustment of the originally tuned matching.

[0003] The related method is to use a network analyzer to re-match and debug the impedance, but it has the following defects:

[0004] 1. Removing the power amplifier (PA) for passive testing will cause the motherboard to be scrapped, increase costs, and the soldering grounding state also affects the test results;

[0005] 2. It has a high dependence on external equipment (network analyzer);

[0006] 3. The impedance differences of different motherboards at different stages cannot be effectively identified, there is a certain degree of randomness, batch data cannot be extracted, and for abnormal impedance, only passive testing or cutting and calculating the impedance can be performed, resulting in a long analysis cycle. Summary of the Invention

[0007] The purpose of the embodiments of this application is to provide an impedance testing device, method, and electronic device, which can directly read the impedance of the motherboard in the Smith chart analysis interface of the electronic device without using a network analyzer, improve the debugging efficiency of engineers, and save development costs.

[0008] To solve the above technical problems, this application is implemented as follows:

[0009] In a first aspect, the embodiments of this application provide an impedance testing device, which includes:

[0010] A transmitting source module, which is used to transmit a target signal with a preset frequency value;

[0011] A transmission module, the input end of which is connected to the output end of the transmitting source module through a first switch. The transmission module is used to divide the target signal into a reference signal and a transmitted signal when the first switch is closed, generate a reflected signal corresponding to the transmitted signal, transmit the transmitted signal, and also receive a feedback signal corresponding to the transmitted signal;

[0012] Power amplifier PA module. The input end of the PA module is connected to the output end of the emission source module through a second switch. The output end of the PA module is connected to the input end of the circuit under test, and is used to amplify the target signal and then transmit it to the circuit under test. The PA module includes a first switching switch. The first end of the first switching switch is connected to the first end of the transmission module, and the second end of the first switching switch is connected to the input end of the circuit under test. When the first switching switch conducts the connection between the transmission module and the circuit under test, the transmission module transmits the emission signal to the circuit under test;

[0013] A second switching switch. The first end of the second switching switch is connected to the output end of the circuit under test, and the second end of the second switching switch is connected to the second end of the transmission module. When the second switching switch conducts the connection between the circuit under test and the transmission module, the circuit under test transmits the feedback signal corresponding to the emission signal to the transmission module;

[0014] The transmission module is further configured to determine the target impedance of the circuit under test according to the reference signal, the reflection signal, and the feedback signal.

[0015] In a second aspect, an embodiment of the present application provides an impedance testing method. The method is applied to the impedance testing device as described in the first aspect, and the method includes:

[0016] The transmission module acquires a target signal with a preset frequency value emitted by the emission source module;

[0017] The transmission module divides the target signal into a reference signal and an emission signal, and generates a reflection signal corresponding to the emission signal;

[0018] The transmission module transmits the emission signal to the circuit under test;

[0019] The transmission module receives the feedback signal corresponding to the emission signal output by the circuit under test;

[0020] The transmission module determines the target impedance of the circuit under test according to the reference signal, the reflection signal, and the feedback signal.

[0021] In a third aspect, an embodiment of the present application provides an electronic device, and the electronic device includes the impedance testing device as described in the first aspect.

[0022] In the embodiments of the present application, there is a transmitting source module for transmitting a target signal with a preset frequency value; a transmission module, the input end of which is connected to the output end of the transmitting source module through a first switch, and the transmission module is configured to divide the target signal into a reference signal and a transmitted signal when the first switch is closed, generate a reflected signal corresponding to the transmitted signal, transmit the transmitted signal, and also receive a feedback signal corresponding to the transmitted signal; a power amplifier PA module, the input end of which is connected to the transmitting source module through a second switch, and the output end of which is connected to the input end of a circuit under test, and is used to amplify the target signal and then transmit it to the circuit under test. The PA module includes a first switching switch, the first end of which is connected to the first end of the transmission module, and the second end of which is connected to the input end of the circuit under test. When the first switching switch conducts the connection between the transmission module and the circuit under test, the transmission module transmits the transmitted signal to the circuit under test; a second switching switch, the first end of which is connected to the output end of the circuit under test, and the second end of which is connected to the second end of the transmission module. When the second switching switch conducts the connection between the circuit under test and the transmission module, the circuit under test transmits the feedback signal corresponding to the transmitted signal to the transmission module; the transmission module is further configured to determine the target impedance of the circuit under test according to the reference signal, the reflected signal, and the feedback signal, which can realize directly reading the impedance of the main board of the Smith chart analysis interface of the electronic device without using a network analyzer, improve the debugging efficiency of engineers, and save the development cost. Description of the Drawings

[0023] Figure 1 is a schematic structural diagram of an impedance testing device provided by an embodiment of the present application;

[0024] Figure 2 is a schematic structural diagram of another impedance testing device provided by an embodiment of the present application;

[0025] Figure 3 is a schematic flowchart of an impedance testing method provided by an embodiment of the present application;

[0026] Figure 4 is a Smith chart corresponding to an impedance testing device provided by an embodiment of the present application after self-calibration;

[0027] Figure 5 is a Smith chart corresponding to an impedance testing device provided by an embodiment of the present application when performing impedance testing;

[0028] Figure 6It is a Smith chart corresponding to an impedance test device provided by an embodiment of the present application during impedance debugging;

[0029] Figure 7 It is a schematic diagram of the hardware structure of an electronic device according to an embodiment of the present application. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present application will be clearly described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0031] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such used data may be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order different from those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same category, and the number of objects is not limited. For example, the first object may be one or multiple. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0032] Next, with reference to the accompanying drawings, a kind of impedance test device, method and electronic device provided by the embodiments of the present application will be described in detail through specific embodiments and their application scenarios.

[0033] Figure 1 It shows a kind of impedance test device provided by the embodiments of the present application, as Figure 1As shown in the figure, the impedance testing device 100 includes: a transmitting source module 110, which is used to transmit a target signal with a preset frequency value; a transmission module 120, the input end of the transmission module 120 is connected to the output end of the transmitting source module 110 through a first switch S1, and the transmission module 120 is used to divide the target signal into a reference signal a1 and a transmitted signal when the first switch S1 is closed, generate a reflected signal b1 corresponding to the transmitted signal, transmit the transmitted signal, and also receive a feedback signal b2 corresponding to the transmitted signal; a power amplifier PA module 130, the input end of the PA module 130 is connected to the output end of the transmitting source module 110 through a second switch S2, and the output end of the PA module 130 is connected to the input end of the circuit under test, and is used to amplify the target signal and then transmit it to the circuit under test. The PA module 130 includes a first switching switch SW1, the first end of the first switching switch SW1 is connected to the first end of the transmission module 120, and the second end of the first switching switch SW1 is connected to the input end of the circuit under test. When the first switching switch SW1 conducts the connection between the transmission module 120 and the circuit under test, the transmission module 120 transmits the transmitted signal to the circuit under test; a second switching switch SW2, the first end of the second switching switch SW2 is connected to the output end of the circuit under test, and the second end of the second switching switch SW2 is connected to the second end of the transmission module 120. When the second switching switch conducts the connection between the circuit under test and the transmission module, the circuit under test transmits the feedback signal corresponding to the transmitted signal to the transmission module 120; the transmission module 120 is further used to determine the target impedance of the circuit under test according to the reference signal, the reflected signal, and the feedback signal.

[0034] As the core component of the front end of the radio frequency circuit, the power amplifier (PA) is used to amplify the radio frequency power signal. In actual operation, the amplifier needs to drive the load impedance. As the core of the PA, the input and output impedance of the transistor is only a few ohms, but the standard impedance of a typical radio frequency system is 50Ω. To obtain better power transmission performance, the impedance values of the transistor input and output need to be matched to the standard impedance of 50Ω, which requires impedance matching debugging of the motherboard circuit.

[0035] The impedance matching of traditional motherboard circuits generally relies on a network analyzer to repeatedly debug and match each device (capacitor, inductor) in the motherboard circuit until the device that meets the best match is found. During the process, only passive testing or cutting and calculating the impedance can be performed on abnormal impedance. The analysis period is long, and repeatedly replacing devices will cause damage to the motherboard and increase the testing cost. In addition, for each device in the motherboard that has been debugged and matched, certain random errors will also occur during batch assembly or production, and batch data cannot be extracted.

[0036] In one implementation, the emission source module 110 includes: an emission source of a wireless transmit / receive transceiver chip, and the emission source can generate the target signals of multiple preset frequency values corresponding to three frequency bands of high, medium, and low.

[0037] An impedance testing device provided by an embodiment of the present application, by sharing the emission source of the transceiver chip on the motherboard, the target signal is sent out from the emission source module 110 (the port of the transceiver). By integrating the transmission module 120 on the chip, and when the first switch is closed, the transmission module 120 divides the target signal into a reference signal a1 and an emission signal, and transmits the emission signal. The PA module 130 includes a first switching switch SW1. When the connection between the transmission module 120 and the circuit under test is conducted through the first switching switch SW1, the transmission module 120 transmits the emission signal to the circuit under test. When the connection between the circuit under test and the transmission module is conducted through the second switching switch, the circuit under test transmits the feedback signal b2 corresponding to the emission signal to the transmission module 120. At the same time, the transmission module 120 is also used to receive the reflection signal b1 corresponding to the emission signal. Then, at the chip end, it can be measured Figure 1 the reflection loss b1 / a1 and the transmission loss b2 / a1 corresponding to the two ports port1 and port2 of the transmission module 120 described above. Based on these two losses, by looking up the Smith chart in the device, the target impedance can be obtained. It should be noted that the device can be an electronic device with a display function including the motherboard or including the impedance detection device 100, and the Smith algorithm has been pre-loaded in the electronic device. Therefore, the impedance of the motherboard can be directly read from the Smith chart analysis interface on the electronic device without relying on a network analyzer, improving the debugging efficiency of engineers and saving development costs.

[0038] An impedance testing device provided by an embodiment of the present application includes a transmitting source module for transmitting a target signal with a preset frequency value; a transmission module, the input end of the transmission module is connected to the output end of the transmitting source module through a first switch, and the transmission module is used for splitting the target signal into a reference signal and a transmitting signal when the first switch is closed, generating a reflection signal corresponding to the transmitting signal, transmitting the transmitting signal, and also receiving a feedback signal corresponding to the transmitting signal; a power amplifier PA module, the input end of the PA module is connected to the transmitting source module through a second switch, the output end of the PA module is connected to the input end of the circuit under test, and is used for amplifying the target signal and transmitting it to the circuit under test. The PA module includes a first switching switch, the first end of the first switching switch is connected to the first end of the transmission module, the second end of the first switching switch is connected to the input end of the circuit under test, and the third end of the first switching switch is connected to the output end of the transistor in the PA module. When the first switching switch conducts the connection between the transmission module and the circuit under test, the transmission module transmits the transmitting signal to the circuit under test; a second switching switch, the first end of the second switching switch is connected to the output end of the circuit under test, and the second end of the second switching switch is connected to the second end of the transmission module. When the second switching switch conducts the connection between the circuit under test and the transmission module, the circuit under test transmits the feedback signal corresponding to the transmitting signal to the transmission module; the transmission module is further used for determining the target impedance of the circuit under test according to the reference signal, the reflection signal and the feedback signal, and can directly read the impedance of the main board of the Smith chart analysis interface of the electronic device without using a network analyzer, improving the debugging efficiency of engineers and saving the development cost.

[0039] In one implementation, the transmission module 120 includes a power divider, a coupler, a first attenuator, a second attenuator, a first mixer, a second mixer, a third mixer and an oscillator. Among them, the input end of the power divider is connected to the output end of the transmitting source module 110 through the first switch S1, the first output end of the power divider is connected to the input end of the first attenuator, the output end of the first attenuator is connected to the first input end R of the first mixer, the output end of the oscillator is connected to the second input end L of the first mixer, and the second output end of the power divider is connected to the input end of the coupler;

[0040] The first mixer is used for outputting the reference signal;

[0041] The first output terminal of the coupler is connected to the first terminal of the first switch, the second output terminal of the coupler is connected to the first input terminal R of the second mixer, and the output terminal of the oscillator is connected to the second input terminal L of the second mixer;

[0042] The second mixer is used to output the reflected signal;

[0043] The input terminal of the second attenuator is connected to the second terminal of the second switch, the output terminal of the second attenuator is connected to the first input terminal R of the third mixer, and the output terminal of the oscillator is connected to the second input terminal L of the third mixer;

[0044] The third mixer is used to output the return signal.

[0045] Specifically, the target signal is split into two signal sources a and b by the power splitter in the transmission module 120. The signal source a and the local oscillator signal generated by the oscillator pass through the first mixer to obtain the reference signal a1; the signal source b passes through the coupler and is mixed with the local oscillator signal to obtain the reflected signal b1. The signal source b passes through the port port1 of the transmission module 120, passes through the circuit under test, and then returns to the port port2, and then is mixed with the local oscillator signal to obtain the return signal b2.

[0046] In a microwave system, it is often necessary to divide a microwave power into several paths in proportion. The components that achieve this function are called power distribution components, including: couplers, power splitters, etc. The difference is that the coupler distributes the power unevenly, and the power splitter distributes the power evenly; in the embodiment of the present application, the power splitter evenly divides the target signal into two paths of signals, one path is used as a reference signal, and the other path is used for transmission; the coupler is used to couple the corresponding reflected signal from the transmitted signal. In the embodiment of the present application, the coupler is generally a directional coupler, and different couplers are selected for the signal source b corresponding to different frequency bands.

[0047] Mixers are generally used to generate intermediate frequency signals. When the mixing frequency is equal to the intermediate frequency, this signal can pass through the intermediate frequency amplifier, be amplified, and then peak detected. The detected signal is amplified by the amplifier and then displayed. Since the oscillation frequency of the oscillator local oscillator circuit changes with time, the frequencies received by the spectrum analyzer at different times are different. When the frequency of the oscillator scans with time, the amplitudes of the measured signals at different frequencies are displayed on the screen, so that the amplitudes of the signals at different frequencies can be recorded, and the spectrum of the measured signal is obtained.

[0048] Based on the reference signal a1, the reflected signal b1, and the feedback signal b2, the reflection loss b1 / a1 and the transmission loss b2 / a1 can be obtained. These two losses respectively correspond to the values of two S-parameters (S(1,1), S(1,2)) on the Smith chart. By looking up the positions of the two S-parameters on the Smith chart, the target impedance can be obtained. The specific implementation steps are not elaborated here.

[0049] In one implementation, the PA module 130 further includes a calibration circuit, which is connected to the transmission module 120 and is used to calibrate the errors of the transmission module.

[0050] In one implementation, the PA module 130 further includes a third switching switch. There are multiple calibration circuits. The third switching switch is arranged between the multiple calibration circuits and the transmission module and is used to switch the connection between the transmission module 120 and different calibration circuits. Among them, the calibration circuit includes at least one of an open-circuit calibration circuit, a short-circuit calibration circuit, and a load calibration circuit.

[0051] The purpose of self-calibration in the embodiments of the present application is the same as that of network analyzer calibration, which is to eliminate errors. The errors include at least one of random error, systematic error, and drift error. Through the third switching switch, the three states of load / open circuit / short circuit of the calibration port port1 are calibrated to obtain the corresponding compensation parameters. The compensation parameters act on the transmission module 120. Among them, through open-circuit calibration, the line loss compensation parameters between the port1 port of the transmission module and the PA module and the original values of S(1,1) / S(1,2) of the circuit under test are obtained. As Figure 4 shown, S(1,1) is at the open-circuit point and S(1,2) has infinite loss.

[0052] Figure 2 Another impedance testing device provided by the embodiments of the present application is shown in Figure 2As shown, the impedance testing device 200 includes: a transmitting source module 110 for transmitting a target signal with a preset frequency value; a transmission module 120 connected to the transmitting source module 110 through a first switch S1. The transmission module 120 is configured to divide the target signal into a reference signal and a transmitted signal when the first switch S1 is closed, generate a reflected signal corresponding to the transmitted signal, transmit the transmitted signal, and also receive a feedback signal corresponding to the transmitted signal; a power amplifier PA module 130. The input end of the PA module 130 is connected to the transmitting source module 110 through a second switch S2, and the output end of the PA module 130 is connected to the input end of the circuit under test. It is used to amplify the target signal and transmit it to the circuit under test. The PA module 130 includes three first switching switches 2T_L, 2T_M, and 2T_H. Among them, the three first switching switches 2T_L, 2T_M, and 2T_H are respectively used to control the circuit switching when the target signal of the corresponding low, medium, and high frequency bands is input. For example, when the preset frequency value of the target signal belongs to the low frequency band, the first end of the first switching switch 2T_L is connected to the transmission module 120, and the second end of the first switching switch 2T_L is connected to the input end of the circuit under test. When the first switching switch 2T_L conducts the connection between the transmission module 120 and the circuit under test, the transmission module 120 transmits the transmitted signal to the circuit under test; a second switching switch 2T_ANT. The first end of the second switching switch 2T_ANT is connected to the output end of the circuit under test, and the second end of the second switching switch 2T_ANT is connected to the transmission module 120. When the second switching switch 2T_ANT conducts the connection between the circuit under test and the transmission module 120, the circuit under test transmits the feedback signal corresponding to the transmitted signal to the transmission module 120; the transmission module 120 is further configured to determine the target impedance of the circuit under test according to the reference signal, the reflected signal, and the feedback signal.

[0053] In one implementation, the PA module 130 includes a transistor. The input end of the transistor is connected to the output end of the emission source module 110 through a second switch S2. In the first state of the device 200, the second switch S2 is closed, and one of the first switching switches 2T_L, 2T_M, and 2T_H conducts the connection between the transistor and the circuit under test. The transistor amplifies the target signal and then transmits it to the circuit under test. In the second state of the device 200, the first switch S1 is closed, and one of the first switching switches 2T_L, 2T_M, and 2T_H conducts the connection between the transmission module 120 and the circuit under test. The transmission module 120 transmits the emission signal to the circuit under test.

[0054] In one implementation, the third end of the second switching switch is connected to the transmitting antenna. In the first state, the second switching switch 2T_ANT conducts the connection between the circuit under test and the transmitting antenna, and the transmitting antenna emits the amplified target signal; in the second state, the second switching switch 2T_ANT conducts the connection between the circuit under test and the transmission module, and the circuit under test returns the feedback signal corresponding to the emission signal to the transmission module.

[0055] Specifically, the target signal is emitted from the emission source module 110. In the second state of the device 200, the first switch S1 is closed, the transmission module 120 divides the target signal into a reference signal and an emission signal, and transmits the emission signal. Then, according to the frequency value of the target signal, one of the first switching switches 2T_L, 2T_M, and 2T_H conducts the connection between the transmission module 120 and the circuit under test, and the transmission module 120 transmits the emission signal to the circuit under test. The circuit under test includes a B1 / 3 / 7 multiplexer, a transmission line, a TXM device, and a coupler. The second switching switch 2T_ANT conducts the connection between the circuit under test and the transmission module 120, and the circuit under test returns the feedback signal corresponding to the emission signal to the transmission module 120. The transmission module 120 determines the target impedance of the circuit under test according to the reference signal, the reflection signal, and the feedback signal, thereby realizing passive impedance testing.

[0056] In the first state of the device 200, one channel corresponding to the second switch S2 of one of the signal sources corresponding to the high, medium, and low three preset frequency values according to the frequency value of the target signal is closed. One of the first switching switches 2T_L, 2T_M, 2T_H conducts the connection between the transistor and the circuit under test. The transistor amplifies the target signal and then transmits it to the circuit under test. The second switching switch 2T_ANT conducts the connection between the circuit under test and the transmitting antenna. The transmitting antenna transmits the amplified target signal, thereby ensuring the smoothness of the PA transmitting circuit.

[0057] In one implementation, the PA module 130 further includes a calibration circuit, which is connected to the transmission module 120 and is used to calibrate the error of the transmission / reflection module.

[0058] In one implementation, the PA module 130 further includes a third switching switch SPDT. There are multiple calibration circuits. The third switching switch is arranged between the multiple calibration circuits and the transmission module and is used to switch the connection between the transmission module 120 and different calibration circuits. Among them, the calibration circuit includes at least one of an open-circuit calibration circuit, a short-circuit calibration circuit, and a load calibration circuit.

[0059] In the embodiment of the present application, through open-circuit calibration, short-circuit calibration, or load calibration, the line loss compensation parameters between the port1 port of the corresponding transmission module and the PA module and the circuit under test are obtained. According to the compensation parameters, the initial positions of two points S(1,1) and S(1,2) in the corresponding Smith chart are calibrated, thereby improving the accuracy and reliability of subsequent impedance testing.

[0060] An impedance testing device provided by the present application can realize passive debugging while realizing passive impedance detection. Specifically, the Smith algorithm can be imported into the electronic device, and after obtaining the initial S11 / S12 parameters through self-calibration, control the device to work in the second state, that is, perform passive testing, and obtain a passive diagram as shown in Figure 4 Then, track the load pull of the PA module to debug the radio frequency matching. After the matching debugging is successful, switch the device to work in the first state, that is, open the amplification path of the PA module to test the active data, thereby realizing the integration of passive and active. Figure 5 Shown, and then track the load pull of the PA module to debug the radio frequency matching. After the matching debugging is successful, switch the device to work in the first state, that is, open the amplification path of the PA module to test the active data, thereby realizing the integration of passive and active.

[0061] In addition, an impedance testing device provided by the present application can also input the S11 / S12 data of the debugging optimal position according to the passive debugging to obtain the position of Z = R + jX, as shown in Figure 6As shown. Since the relevant impedance is generally controlled within plus or minus 5 ohms in the current technical capabilities, for example, the real and imaginary parts of the fixed S(1,1) parameter can fluctuate plus or minus 2 ohms. If the fluctuation ranges from plus or minus 2 ohms to plus or minus 5 ohms, only the corresponding power supply voltage VCC or bias BIAS parameter of the power amplifier PA needs to be adjusted, rather than repeatedly replacing the PA on the main board to recalculate the passive impedance by cutting. Thus, the debugging efficiency of engineers can be improved, and the development cost can be saved. It should be noted that if the fluctuation exceeds plus or minus 5 ohms, an impedance anomaly needs to be reported and relevant devices such as the PA need to be replaced.

[0062] An impedance testing device provided by the present application includes a transmitting source module for transmitting a target signal with a preset frequency value; a transmission module, the input end of which is connected to the output end of the transmitting source module through a first switch. The transmission module is configured to divide the target signal into a reference signal and a transmitted signal when the first switch is closed, generate a reflected signal corresponding to the transmitted signal, transmit the transmitted signal, and also receive a feedback signal corresponding to the transmitted signal; a power amplifier PA module, the input end of which is connected to the transmitting source module through a second switch, and the output end of which is connected to the input end of the circuit under test. The PA module is used to amplify the target signal and transmit it to the circuit under test. The PA module includes a first switching switch, the first end of which is connected to the first end of the transmission module, and the second end of which is connected to the input end of the circuit under test. When the first switching switch conducts the connection between the transmission module and the circuit under test, the transmission module transmits the transmitted signal to the circuit under test; a second switching switch, the first end of which is connected to the output end of the circuit under test, and the second end of which is connected to the second end of the transmission module. When the second switching switch conducts the connection between the circuit under test and the transmission module, the circuit under test transmits the feedback signal corresponding to the transmitted signal to the transmission module; the transmission module is further configured to determine the target impedance of the circuit under test according to the reference signal, the reflected signal, and the feedback signal, capable of directly reading the impedance of the main board of the Smith chart analysis interface of the electronic device without using a network analyzer, improving the debugging efficiency of engineers, saving the development cost, and simultaneously testing the impedance position map of each main board, and automatically adjusting the corresponding power supply voltage VCC and bias BIAS of the power amplifier according to the impedance deviation magnitude, so as to ensure that each main board reaches the optimal performance.

[0063] The present application further provides an impedance testing method. The following will describe an impedance testing method provided by the embodiments of the present application in conjunction with the accompanying drawings through specific embodiments and their application scenarios.

[0064] Figure 3 shows an impedance testing method provided by an embodiment of the present application, which is applied to the above-mentioned Figure 1 or Figure 2 the impedance testing device described. As Figure 3 shown, the method includes the following steps:

[0065] S301: The transmission module acquires a target signal with a preset frequency value transmitted by the emission source module.

[0066] Wherein, the transmission module is connected to the emission source module through a first switch, and the first switch is closed.

[0067] S302: The transmission module divides the target signal into a reference signal and an emission signal, and generates a reflection signal corresponding to the emission signal.

[0068] S303: The transmission module transmits the emission signal to the circuit under test.

[0069] Wherein, the first end of the first switching switch in the device is connected to the first end of the transmission module, the second end of the first switching switch is connected to the input end of the circuit under test, and when the first switching switch conducts the connection between the transmission module and the circuit under test, the transmission module transmits the emission signal to the circuit under test.

[0070] S304: The transmission module receives a feedback signal corresponding to the emission signal output by the circuit under test.

[0071] Wherein, the first end of the second switching switch in the device is connected to the output end of the circuit under test, the second end of the second switching switch is connected to the second end of the transmission module, and when the second switching switch conducts the connection between the circuit under test and the transmission module, the circuit under test transmits the feedback signal corresponding to the emission signal to the transmission module.

[0072] S305: The transmission module determines the target impedance of the circuit under test according to the reference signal, the reflection signal, and the feedback signal.

[0073] An impedance testing method provided by an embodiment of the present application obtains a target signal with a preset frequency value transmitted by a transmitting source module through a transmission module; the transmission module divides the target signal into a reference signal and a transmitted signal, and generates a reflected signal corresponding to the transmitted signal; the transmission module transmits the transmitted signal to a circuit under test; the transmission module receives a feedback signal corresponding to the transmitted signal output by the circuit under test; the transmission module determines the target impedance of the circuit under test according to the reference signal, the reflected signal, and the feedback signal, and can directly read the impedance of the main board of the Smith chart analysis interface of an electronic device without using a network analyzer, improving the debugging efficiency of engineers, saving development costs, and at the same time, it can test the impedance position map of each main board, and automatically adjust the power supply voltage VCC and bias BIAS corresponding to the power amplifier according to the impedance deviation size, so as to ensure that each main board reaches the best performance.

[0074] In one implementation, before the above step S303, the method further includes:

[0075] Performing error calibration on the transmission module through a calibration circuit, where the calibration circuit includes at least one of an open-circuit calibration circuit, a short-circuit calibration circuit, and a load calibration circuit.

[0076] In one implementation, the above step S305 includes:

[0077] Determining the target impedance based on the Smith chart according to the reference signal, the reflected signal, and the feedback signal.

[0078] In one implementation, after the above step S305, the method further includes:

[0079] Performing passive debugging on the PA module and the circuit under test based on the target impedance to obtain a target debugging result.

[0080] In one implementation, after performing passive debugging on the PA module and the circuit under test based on the target impedance to obtain a target debugging result, the method further includes:

[0081] Adjusting the power supply voltage VCC or bias BIAS corresponding to the power amplifier based on the target debugging result.

[0082] It should be noted that an impedance testing method provided by an embodiment of the present application has the same inventive concept as the above impedance testing device and can achieve the same technical effects. The specific execution steps of the above impedance testing method can refer to the function descriptions of each module of the impedance testing device and will not be elaborated here.

[0083] It should also be noted that for the impedance testing method provided in the embodiments of the present application, the execution subject can be the above-mentioned impedance testing device, or the control module in the impedance testing device for executing the impedance testing method.

[0084] The impedance testing device in the embodiments of the present application can be a device, or a component, integrated circuit, or chip in a terminal. The device can be a mobile electronic device or a non-mobile electronic device. Exemplarily, the mobile electronic device can be a mobile phone, a tablet computer, a laptop computer, a handheld computer, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc., and the non-mobile electronic device can be a server, a Network Attached Storage (NAS), a personal computer (PC), a television (TV), a teller machine, or a self-service machine, etc. The embodiments of the present application do not make specific limitations.

[0085] The impedance testing device in the embodiments of the present application can be a device with an operating system. The operating system can be the Android operating system, the iOS operating system, or other possible operating systems. The embodiments of the present application do not make specific limitations.

[0086] Optionally, the embodiments of the present application further provide an electronic device, including the Figure 1 impedance testing device as described in Figure 3 or 2, or implementing each process of the impedance testing method embodiment as described in

[0087] More specifically, Figure 7 is a schematic diagram of the hardware structure of an electronic device for implementing the embodiments of the present application.

[0088] The electronic device 700 includes but is not limited to: a radio frequency unit 701, a network module 702, an audio output unit 703, an input unit 704, a sensor 705, a display unit 706, a user input unit 707, an interface unit 708, a memory 709, and a processor 710, etc.

[0089] Among them, the radio frequency unit 701 includes Figure 1 or Figure 2The impedance testing device described above is used to: obtain a target signal with a preset frequency value transmitted by a transmitting source module; divide the target signal into a reference signal and a transmitting signal, and generate a reflection signal corresponding to the transmitting signal; transmit the transmitting signal to a circuit under test; receive a feedback signal corresponding to the transmitting signal output by the circuit under test; determine the target impedance of the circuit under test according to the reference signal, the reflection signal, and the feedback signal. Without using a network analyzer, it can directly read the impedance of the main board on the Smith analysis interface of the display unit of the electronic device 700, improve the debugging efficiency of engineers, save development costs, and at the same time can test the impedance position map of the main board of the electronic device. Automatically adjust the power supply voltage VCC and bias BIAS corresponding to the power amplifier according to the impedance deviation, so as to ensure that the main board of the electronic device reaches the best performance.

[0090] The radio frequency unit 701 is further used to: perform error calibration on the transmission module through a calibration circuit, where the calibration circuit includes at least one of an open-circuit calibration circuit, a short-circuit calibration circuit, and a load calibration circuit.

[0091] The radio frequency unit 701 is further used to: determine the target impedance based on the Smith chart according to the reference signal, the reflection signal, and the feedback signal.

[0092] Those skilled in the art can understand that the electronic device 700 may further include a power supply (such as a battery) for supplying power to each component. The power supply can be logically connected to the processor 710 through a power management system, so as to realize functions such as management of charging, discharging, and power consumption management through the power management system. Figure 7 The structure of the electronic device shown does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements, which will not be elaborated here.

[0093] It should be understood that in the embodiments of the present application, the input unit 704 may include a Graphics Processing Unit (GPU) 7041 and a microphone 7042. The GPU 7041 processes the image data of still pictures or videos obtained by an image capture device (such as a camera) in the video capture mode or the image capture mode. The display unit 706 may include a display panel 7061, and the display panel 7061 may be configured in the form of a liquid crystal display, an organic light-emitting diode, etc. The user input unit 707 includes a touch panel 7071 and other input devices 7072. The touch panel 7071 is also referred to as a touch screen. The touch panel 7071 may include two parts: a touch detection device and a touch controller. The other input devices 7072 may include, but are not limited to, a physical keyboard, function keys (such as volume control keys, power on / off keys, etc.), a trackball, a mouse, and a joystick, which will not be elaborated here. The memory 709 may be used to store software programs and various data, including but not limited to application programs and operating systems. The processor 710 may integrate an application processor and a modem processor. Among them, the application processor mainly processes the operating system, user interface, application programs, etc., and the modem processor mainly processes wireless communications. It can be understood that the above-mentioned modem processor may not be integrated into the processor 710.

[0094] It should be noted that the electronic device in the embodiments of the present application is pre-loaded with the Smith algorithm, and the Smith chart can be displayed through the display unit on the electronic device.

[0095] It should also be noted that in this article, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including that element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the reverse order according to the functions involved. For example, the described methods may be performed in an order different from that described, and various steps may be added, omitted, or combined. Additionally, the features described with reference to certain examples may be combined in other examples.

[0096] Through the description of the above embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus a necessary general hardware platform. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, can be embodied in the form of a computer software product. The computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions for causing a terminal (which can be a mobile phone, computer, server, or network device, etc.) to execute the methods described in various embodiments of the present application.

[0097] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific implementation manners. The above specific implementation manners are merely illustrative rather than restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them belong to the protection scope of the present application.

Claims

1. An impedance testing device, characterized in that, The device includes: A transmission source module for transmitting a target signal with a preset frequency value; A transmission module, the input end of which is connected to the output end of the transmission source module through a first switch. The transmission module is used to divide the target signal into a reference signal and a transmission signal when the first switch is closed, generate a reflection signal corresponding to the transmission signal, transmit the transmission signal, and also receive a feedback signal corresponding to the transmission signal; A power amplifier PA module, the input end of which is connected to the output end of the transmission source module through a second switch, and the output end of which is connected to the input end of the circuit under test. It is used to amplify the target signal and transmit it to the circuit under test. The PA module includes a first switching switch, the first end of which is connected to the first end of the transmission module, and the second end of which is connected to the input end of the circuit under test. When the first switching switch conducts the connection between the transmission module and the circuit under test, the transmission module transmits the transmission signal to the circuit under test; A second switching switch, the first end of which is connected to the output end of the circuit under test, and the second end of which is connected to the second end of the transmission module. When the second switching switch conducts the connection between the circuit under test and the transmission module, the circuit under test transmits the feedback signal corresponding to the transmission signal to the transmission module; The transmission module is also used to determine the target impedance of the circuit under test according to the reference signal, the reflection signal and the feedback signal.

2. The device according to claim 1, characterized in that, The transmission module includes a power divider, a coupler, a first attenuator, a second attenuator, a third mixer, a first mixer, a second mixer and an oscillator, where The input end of the power divider is connected to the transmission source module through the first switch, the first output end of the power divider is connected to the input end of the first attenuator, the output end of the first attenuator is connected to the first input end of the first mixer, the output end of the oscillator is connected to the second input end of the first mixer, and the second output end of the power divider is connected to the input end of the coupler; The first mixer is used to output the reference signal; The first output end of the coupler is connected to the first end of the first switching switch, the second output end of the coupler is connected to the first input end of the second mixer, and the output end of the oscillator is connected to the second input end of the second mixer; The second mixer is used to output the reflection signal; The input end of the second attenuator is connected to the second end of the second switching switch, the output end of the second attenuator is connected to the first input end of the third mixer, and the output end of the oscillator is connected to the second input end of the third mixer; The third mixer is used to output the feedback signal.

3. The device according to claim 1, characterized in that, The PA module also includes a calibration circuit connected to the transmission module for calibrating the error of the transmission module.

4. The device according to claim 3, characterized in that, The PA module further includes a third switching switch. There are multiple calibration circuits, and the third switching switch is arranged between the multiple calibration circuits and the transmission module for switching the connection between the transmission module and different calibration circuits. Among them, the calibration circuit includes at least one of an open-circuit calibration circuit, a short-circuit calibration circuit, and a load calibration circuit.

5. The device according to claim 1, characterized in that, The PA module includes a transistor. The input end of the transistor is connected to the output end of the emission source module through a second switch. The output end of the transistor is connected to the third end of the first switching switch. In the first state of the device, the second switch is closed, and the first switching switch conducts the connection between the transistor and the circuit under test. The transistor amplifies the target signal and then transmits it to the circuit under test. In the second state of the device, the first switch is closed, and the first switching switch conducts the connection between the transmission module and the circuit under test. The transmission module transmits the emission signal to the circuit under test.

6. The device according to claim 5, characterized in that, The third end of the second switching switch is connected to the transmitting antenna. In the first state, the second switching switch conducts the connection between the circuit under test and the transmitting antenna, and the transmitting antenna transmits the amplified target signal. In the second state, the second switching switch conducts the connection between the circuit under test and the transmission module, and the circuit under test returns the return signal corresponding to the emission signal to the transmission module.

7. An impedance testing method, characterized in that, The method is applied to the impedance testing device according to any one of claims 1 to 6, and the method includes: The transmission module obtains the target signal with a preset frequency value emitted by the emission source module. The transmission module divides the target signal into a reference signal and an emission signal, and generates a reflection signal corresponding to the emission signal. The transmission module transmits the emission signal to the circuit under test. The transmission module receives the return signal corresponding to the emission signal output by the circuit under test. The transmission module determines the target impedance of the circuit under test according to the reference signal, the reflection signal, and the return signal.

8. The method according to claim 7, characterized in that, Before the transmission module transmits the emission signal to the circuit under test, the method further includes: Performing error calibration on the transmission module through a calibration circuit, where the calibration circuit includes at least one of an open-circuit calibration circuit, a short-circuit calibration circuit, and a load calibration circuit.

9. The method according to claim 7, characterized in that, The transmission module determines the target impedance of the circuit under test according to the reference signal, the reflection signal, and the return signal, including: Determining the target impedance based on the Smith chart according to the reference signal, the reflection signal, and the return signal.

10. An electronic device, characterized in that, Including the impedance testing device according to any one of claims 1-6.

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