Method and device for determining crack parameters, and computer storage medium

Abstract

The embodiment of the application discloses a kind of crack parameter determination method, device and computer storage medium, belong to the technical field of seismic exploration.The method comprises: when receiving the multi-wave seismic data including pure shear wave seismic data, PSV converted wave seismic data and SVP converted wave seismic data by geophone, due to the reverse direction of shear wave source excitation direction caused by the back and forth of seismic source vehicle, therefore, the polarity adjustment processing can be carried out to the shear wave source seismic data therein;Then, according to the seismic data imaging profile corresponding to the multi-wave seismic data, the shear wave splitting analysis time window corresponding to the multi-wave seismic data in each target layer is determined, and the crack parameter of each target layer is determined by the shear wave splitting analysis time window corresponding to the multi-wave seismic data in each target layer.The embodiment of the application carries out shear wave splitting analysis by converted wave and pure shear wave, which guarantees the uniqueness and reliability of crack parameter.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of seismic exploration, and particularly relate to a method and device for determining fracture parameters and a computer storage medium. BACKGROUND

[0002] With the development of multi-wave and multi-quantity seismic exploration technology, people have a deeper understanding of anisotropy. In seismic exploration, a shear wave can be excited by a shear wave source for exploration. When the shear wave obliquely passes through a directional anisotropic medium, shear wave splitting occurs, and the fast and slow shear waves carry information about the fracture direction and fracture strength. Therefore, through shear wave splitting analysis, the development direction and density of the fractures can be obtained.

[0003] Currently, when analyzing the shear wave splitting phenomenon, PSV converted shear wave seismic data can be used for converted shear wave splitting analysis, or pure shear wave data can be used for pure shear wave splitting analysis. For the same directional anisotropic medium, the corresponding fracture parameters should be unique. However, when the same directional anisotropic medium is analyzed by the above two methods, the fracture parameters obtained by the above two analyses may not be the same due to differences in signal-to-noise ratio and other reasons, which leads to non-unique underground fracture information and reduces the reliability of determining the fracture parameters. SUMMARY

[0004] Embodiments of the present application provide a method and device for determining fracture parameters and a computer storage medium, which can be used to solve the problem of low reliability of fracture parameters in related technologies. The technical solution is as follows:

[0005] In one aspect, a method for determining fracture parameters is provided, which includes:

[0006] When multi-wave seismic data is received by a geophone, the multi-wave seismic data is adjusted and processed, and the multi-wave seismic data includes pure shear wave seismic data, PSV converted wave seismic data, and SVP converted wave seismic data.

[0007] According to the processed multi-wave seismic data, a shear wave splitting analysis time window corresponding to each target layer of the multi-wave seismic data is determined.

[0008] According to the processed multi-wave seismic data and the shear wave splitting analysis time window corresponding to each target layer of the multi-wave seismic data, the fracture parameters of each target layer are determined.

[0009] In some embodiments, the adjusting and processing of the multi-wave seismic data when the multi-wave seismic data is received by the geophone includes:

[0010] When receiving shear wave source seismic data through the detector, the seismic data whose source direction is opposite to the target direction is determined. The target direction is the excitation direction specified when the source device performs source excitation. The shear wave source seismic data includes the pure shear wave seismic data and the SVP converted wave seismic data.

[0011] The amplitude values ​​of shear wave source seismic data with the opposite source direction to the target direction are reversed to obtain shear wave source seismic data with the same excitation direction.

[0012] Obtain the azimuth angle of the multi-wave seismic data;

[0013] Based on the azimuth angle, Alford rotation is performed on the four-component seismic data of the pure shear wave seismic data received by the horizontal component of the detector, horizontal rotation is performed on the two-component seismic data of the PSV converted wave seismic data received by the horizontal component of the detector, and horizontal source rotation is performed on the two-component seismic data of the SVP converted wave seismic data received by the vertical component of the detector.

[0014] In some embodiments, determining the shear wave splitting analysis time window corresponding to each target layer of the processed multi-wave seismic data includes:

[0015] The processed multi-wave seismic data is stacked or migrated for imaging to obtain seismic data imaging results corresponding to the pure shear wave seismic data, the PSV converted wave seismic data, and the SVP converted wave seismic data, respectively.

[0016] Layer calibration is performed on the seismic data imaging results to determine the shear wave splitting analysis time window for the pure shear wave seismic data, the PSV converted wave seismic data, and the SVP converted wave seismic data at each target layer.

[0017] In some embodiments, determining the fracture parameters of each target layer based on the processed multiwave seismic data and the shear wave splitting analysis time window corresponding to each target layer includes:

[0018] The processed multiwave seismic data is acquired, including each effective component signal, including a specific component signal, in each target layer. The specific component signal includes the SrRt component signal and StRr component signal of the pure shear wave seismic data, the PSRt component signal of the PSV converted wave seismic data, and the StP component signal of the SVP converted wave seismic data. The amplitude of the specific component signal in the target layer is not 0.

[0019] Based on the effective component signals of the processed multi-wave seismic data in each target layer and the corresponding shear wave splitting analysis time window for each target layer, the fracture parameters of each target layer are determined.

[0020] In some embodiments, determining the fracture parameters of each target layer based on the effective component signals of the processed multiwave seismic data in each target layer and the corresponding shear wave splitting analysis time window for each target layer includes:

[0021] Based on the effective component signals of the processed multi-wave seismic data in each target layer, and the shear wave splitting analysis time window corresponding to each target layer, the amplitude energy of the specific component signal after shear wave splitting correction in each target layer is determined.

[0022] The target fracture parameter is defined as the fracture parameter of the target stratum, which is any stratum in the strata transmitted by the multi-wave seismic data. The target fracture parameter is the fracture parameter corresponding to the minimum amplitude energy of the specific component signal in the target stratum.

[0023] On the other hand, an apparatus for determining crack parameters is provided, the apparatus comprising:

[0024] An adjustment module is used to adjust the multi-wave seismic data received through the detector, the multi-wave seismic data including pure shear wave seismic data, PSV converted wave seismic data and SVP converted wave seismic data;

[0025] The first determining module is used to determine the shear wave splitting analysis time window corresponding to each target layer of the processed multi-wave seismic data.

[0026] The second determining module is used to determine the fracture parameters of each target layer based on the processed multi-wave seismic data and the shear wave splitting analysis time window corresponding to each target layer.

[0027] In some embodiments, the adjustment module includes:

[0028] The first determining submodule is used to determine seismic data whose source direction is opposite to the target direction when the shear wave source seismic data is received through the detector. The target direction is the excitation direction specified by the source device when the source device performs source excitation. The shear wave source seismic data includes the pure shear wave seismic data and the SVP converted wave seismic data.

[0029] The processing submodule is used to reverse the polarity of the amplitude values ​​of the shear wave source seismic data whose source direction is opposite to the target direction, so as to obtain shear wave source seismic data with the same excitation direction.

[0030] The first acquisition submodule is used to acquire the azimuth angle of the multi-wave seismic data;

[0031] The rotation submodule is used to perform Alford rotation on the four-component seismic data of the pure shear wave seismic data received by the detector in the horizontal component, perform horizontal component rotation on the two-component seismic data of the PSV converted wave seismic data received by the detector in the horizontal component, and perform horizontal source rotation on the two-component seismic data of the SVP converted wave seismic data received by the detector in the vertical component, according to the azimuth angle.

[0032] In some embodiments, the first determining module includes:

[0033] The imaging submodule is used to perform superposition or migration imaging processing on the processed multi-wave seismic data to obtain seismic data imaging profiles corresponding to the pure shear wave seismic data, the PSV converted wave seismic data and the SVP converted wave seismic data, respectively.

[0034] The calibration submodule is used to perform layer calibration in the seismic data imaging profile to determine the shear wave splitting analysis time window of the pure shear wave seismic data, the PSV converted wave seismic data and the SVP converted wave seismic data in each target layer.

[0035] In some embodiments, the second determining module includes:

[0036] The second acquisition submodule is used to acquire the effective component signals of the processed multi-wave seismic data in each target layer, including specific component signals. The specific component signals include the SrRt component signal and StRr component signal of the pure shear wave seismic data, the PSRt component signal of the PSV converted wave seismic data, and the StP component signal of the SVP converted wave seismic data. The amplitude of the specific component signal in the target layer is not 0.

[0037] The second determination submodule is used to determine the fracture parameters of each stratum based on the effective component signals of the processed multi-wave seismic data in each target layer and the shear wave splitting analysis time window corresponding to each target layer.

[0038] In some embodiments, the second determining submodule is used to:

[0039] Based on the effective component signals of the processed multi-wave seismic data in each target layer and the corresponding shear wave splitting analysis time window in each target layer, the amplitude energy of the specific component signal after shear wave splitting correction in each target layer is determined.

[0040] The target fracture parameter is defined as the fracture parameter of the target stratum, which is any stratum in the strata transmitted by the multi-wave seismic data. The target fracture parameter is the fracture parameter corresponding to the minimum amplitude energy of the specific component signal in the target stratum.

[0041] On the other hand, a computer-readable storage medium is provided, on which instructions are stored, which, when executed by a processor, implement any step in the method for determining the crack parameters described above.

[0042] The beneficial effects of the technical solutions provided in this application include at least the following:

[0043] In the embodiments of this application, since the fracture parameters of each target layer can be determined by pure shear wave seismic data, PSV converted wave seismic data and SVP converted wave seismic data, the different fracture parameters obtained by analyzing by converting waves or pure shear waves alone are avoided. That is, by performing shear wave splitting analysis by combining converted waves and pure shear waves, the uniqueness of fracture parameters is guaranteed and the reliability of determining fracture parameters is improved. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a flowchart of a method for determining crack parameters provided in an embodiment of this application;

[0046] Figure 2 This is a flowchart of another method for determining crack parameters provided in an embodiment of this application;

[0047] Figure 3 This is a schematic diagram of a seismic data imaging result provided in an embodiment of this application;

[0048] Figure 4 This is a schematic diagram of the structure of a crack parameter determination device provided in an embodiment of this application;

[0049] Figure 5 This is a schematic diagram of the structure of an adjustment module provided in an embodiment of this application;

[0050] Figure 6 This is a schematic diagram of the structure of a first determining module provided in an embodiment of this application;

[0051] Figure 7This is a schematic diagram of the structure of a second determining module provided in an embodiment of this application;

[0052] Figure 8 This is a schematic diagram of the structure of a terminal provided in an embodiment of this application. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0054] Before providing a detailed explanation of the method for determining crack parameters provided in the embodiments of this application, let's first discuss an application scenario provided in the embodiments of this application.

[0055] In seismic exploration, in addition to using P-wave sources, shear waves can also be generated by shear wave sources. When a shear wave obliquely crosses an azimuthally anisotropic medium, shear wave splitting occurs and can be recorded by a geophone. The energy of the shear wave is mainly recorded in two horizontal components of a three-component geophone. If the two horizontal components are parallel and perpendicular to the fracture direction, respectively, one horizontal component records a fast shear wave and the other records a slow shear wave; otherwise, both horizontal components record a wavefield where fast and slow shear waves overlap, causing shear wave reflections from the same reflection interface to occur repeatedly at different times on each horizontal component. This leads to poor shear wave imaging results or even erroneous imaging results. Therefore, to avoid erroneous imaging results, shear wave splitting analysis is usually performed by converting PSV-based shear wave seismic data to shear wave splitting analysis, or pure shear wave splitting analysis is performed using pure shear wave data, thereby separating the fast and slow shear waves or performing shear wave splitting correction based on the time difference between the fast and slow shear waves. However, when analyzing anisotropic media in the same direction using the two methods described above, the difference in signal-to-noise ratio may lead to different fracture parameters obtained from the two analyses, resulting in non-unique underground fracture information and reducing the reliability of determining fracture parameters.

[0056] Based on this application scenario, this application provides a method for determining crack parameters that can improve the reliability and accuracy of crack parameter determination.

[0057] Figure 1 This is a flowchart illustrating a method for determining crack parameters according to an embodiment of this application. The method for determining crack parameters may include the following steps:

[0058] Step 101: When receiving multi-wave seismic data through the detector, adjust and process the multi-wave seismic data, which includes pure shear wave seismic data, PSV converted wave seismic data, and SVP converted wave seismic data.

[0059] Step 102: Based on the processed multi-wave seismic data, determine the shear wave splitting analysis time window corresponding to each target layer of the multi-wave seismic data.

[0060] Step 103: Based on the processed multi-wave seismic data and the shear wave splitting analysis time window corresponding to each target layer, determine the fracture parameters of each target layer.

[0061] In the embodiments of this application, since the fracture parameters of each target layer can be determined by pure shear wave seismic data, PSV converted wave seismic data and SVP converted wave seismic data, the different fracture parameters obtained by analyzing by converting waves or pure shear waves alone are avoided. That is, by performing shear wave splitting analysis by combining converted waves and pure shear waves, the uniqueness of fracture parameters is guaranteed and the reliability of determining fracture parameters is improved.

[0062] In some embodiments, when multi-wave seismic data is received by a detector, the multi-wave seismic data is adjusted, including:

[0063] When receiving seismic data from a shear wave source through this detector, the seismic data whose source direction is opposite to the target direction is determined. The target direction is the excitation direction specified by the source equipment when it performs source excitation.

[0064] By reversing the polarity of the amplitude values ​​of shear wave source seismic data whose source direction is opposite to that of the target, shear wave source seismic data with the same excitation direction are obtained.

[0065] Obtain the azimuth angle of this multi-wave seismic data;

[0066] Based on this azimuth angle, Alford rotation is performed on the four-component seismic data of pure shear wave seismic data received by the horizontal component of the geophone, horizontal rotation is performed on the two-component seismic data of PSV converted wave seismic data received by the horizontal component of the geophone, and horizontal source rotation is performed on the two-component seismic data of SVP converted wave seismic data received by the vertical component of the geophone.

[0067] In some embodiments, determining the shear wave splitting analysis time window corresponding to each target layer of the processed multi-wave seismic data includes:

[0068] The processed multi-wave seismic data is stacked or migrated for imaging to obtain seismic data imaging profiles corresponding to the pure shear wave seismic data, the PSV converted wave seismic data, and the SVP converted wave seismic data, respectively.

[0069] Layer calibration is performed on the seismic data imaging profile to determine the shear wave splitting analysis time windows for the pure shear wave seismic data, PSV converted wave seismic data, and SVP converted wave seismic data in each target layer.

[0070] In some embodiments, based on the processed multiwave seismic data and the shear wave splitting analysis time window corresponding to each target layer, the fracture parameters of each target layer are determined, including:

[0071] The processed multiwave seismic data is acquired, including the specific component signal in each target layer. The specific component signal includes the SrRt component signal and StRr component signal of pure shear wave seismic data, the PSRt component signal of PSV converted wave seismic data, and the StP component signal of SVP converted wave seismic data. The amplitude of the specific component signal in the target layer is not 0.

[0072] Based on the effective component signals of the processed multi-wave seismic data in each target layer, and the corresponding shear wave splitting analysis time window for each target layer, the fracture parameters of each target layer are determined.

[0073] In some embodiments, the fracture parameters of each target layer are determined based on the effective component signals of the processed multiwave seismic data in each target layer and the corresponding shear wave splitting analysis time window for each target layer, including:

[0074] Based on the effective component signals of the processed multi-wave seismic data in each target layer, and the corresponding shear wave splitting analysis time window for each target layer, the amplitude energy of the specific component signal after shear wave splitting correction in each target layer is determined.

[0075] The target fracture parameter is defined as the fracture parameter of the target stratum, which is any stratum in the strata transmitted by the multi-wave seismic data. The target fracture parameter is the fracture parameter corresponding to the minimum amplitude energy of the specific component signal in the target stratum.

[0076] All of the above-mentioned optional technical solutions can be combined in any way to form optional embodiments of this application, and the embodiments of this application will not be described in detail one by one.

[0077] Figure 2 This is a flowchart illustrating a method for determining crack parameters according to an embodiment of this application. This embodiment uses the application of this method to a terminal as an example for illustration. The method for determining crack parameters may include the following steps:

[0078] Step 201: The terminal acquires multi-wave seismic data through the detector.

[0079] It should be noted that 3D9C multiwave seismic data is a complete type of multiwave seismic data. 3D9C multiwave seismic data is generated by two horizontal sources (sometimes called shear wave sources) and one vertical source (sometimes called p-wave source), with each excitation received and recorded by a three-component geophone. The multiwave seismic data involved in this invention includes p-wave source seismic data and shear wave source seismic data. The shear wave source seismic data includes four components of pure shear wave seismic data and two components of SVP converted wave seismic data. The p-wave source seismic data includes two horizontal components of PSV converted wave seismic data.

[0080] Because shear waves split during propagation in azimuthally anisotropic media, the pure shear wave field and converted wave field become extremely complex, affecting the imaging quality of subsequent seismic data. Therefore, shear wave splitting analysis is needed to obtain fracture parameters characterizing the subsurface anisotropy, so that fast and slow wave separation or shear wave splitting correction can be performed on the pure shear wave and converted wave seismic data based on the fracture parameters. For detailed procedures, please refer to steps 202-204 below.

[0081] As an example, the terminal can actively receive multi-wave seismic data sent by the geophone; that is, when the geophone detects multi-wave seismic data, it can actively send the detected multi-wave seismic data to the terminal so that the terminal can acquire the multi-wave seismic data. The terminal can also passively acquire multi-wave seismic data; that is, the terminal can receive an acquisition command and, upon receiving the command, acquire the multi-wave seismic data through the geophone.

[0082] It should be noted that this acquisition command can be triggered when staff perform a specified operation on the terminal, such as a click, swipe, or voice operation.

[0083] Step 202: When the terminal receives multi-wave seismic data through the detector, it adjusts and processes the multi-wave seismic data.

[0084] It should be noted that the adjustment processing of multi-wave seismic data includes polarity adjustment processing of shear wave source seismic data and rotation processing of multi-wave seismic data.

[0085] Since the excitation direction of vertical seismic sources remains consistent regardless of whether the seismic source vehicle (a type of seismic source equipment) is turned around, no adjustment is needed. However, for shear wave sources, the seismic source vehicle needs to turn around repeatedly during construction, resulting in the excitation direction of the shear wave sources being reversed. In this case, the excitation direction of the shear wave sources needs to be adjusted. That is, due to the inconsistent excitation directions of the shear wave sources, there is a polarity problem in the shear wave source seismic data. Therefore, in order to improve the accuracy of subsequent fracture parameter determination, it is necessary to eliminate the polarity inconsistency problem of the shear wave source seismic data.

[0086] As an example, when a terminal receives multi-wave seismic data through a geophone, the operation of adjusting the multi-wave seismic data includes at least the following: when receiving shear wave source seismic data through the geophone, determining the seismic data whose source direction is opposite to the target direction, where the target direction is the excitation direction specified by the source equipment during source excitation; performing reverse polarity processing on the amplitude values ​​of the shear wave source seismic data whose source direction is opposite to the target direction to obtain shear wave source seismic data with the same excitation direction; acquiring the azimuth angle of the multi-wave seismic data; performing Alford rotation on the four-component seismic data of the pure shear wave seismic data received by the geophone's horizontal component based on the azimuth angle, performing horizontal component rotation on the two-component seismic data of the PSV converted wave seismic data received by the geophone's horizontal component, and performing horizontal source rotation on the two-component seismic data of the SVP converted wave seismic data received by the geophone's vertical component.

[0087] In some embodiments, the terminal can directly obtain the receiving line direction from the stored field construction records and determine the azimuth of multi-wave seismic data through the coordinates of the shot (a type of seismic source device) and the detector.

[0088] In one implementation environment, the source device can generate shear waves through a controllable source with horizontal vibration, and the terminal can reverse the sign of the amplitude values ​​of the shot record (seismic data, which includes x, y, and z components) generated in the opposite direction (opposite to the target direction). For example, the process of reversing the polarity of seismic data can be represented by the following first formula.

[0089]

[0090] It should be noted that in the first formula (1) above, Sx represents that the excitation direction of the shear wave source corresponding to the shear wave source seismic data is parallel to the x-direction, i.e., the inline direction; Sy represents that the excitation direction of the shear wave source corresponding to the shear wave source seismic data is parallel to the y-axis direction, i.e., the crossline direction; Rx, Ry, and Rz represent the three components of the detector, including two horizontal components, the x-component and the y-component. During construction, the x-component is parallel to the inline direction, the y-component is parallel to the crossline direction, and a vertical component, the z-component, is also included. That is, the three component directions of the detector are parallel to the x-axis, y-axis, and z-axis, respectively. SxRx, SxRy, SxRz, SyRx, SyRy, and SyRz are the amplitude values ​​of each component of the shear wave source seismic data detected under the above conditions.

[0091] In one embodiment, the terminal can subtract the angle corresponding to the survey line direction from the azimuth angle to obtain the adjustment angle, and perform Alford rotation on pure SVR seismic data, horizontal component rotation on PSV converted wave seismic data, and horizontal source rotation on SVP converted wave seismic data by adjusting the angle.

[0092] It should be noted that the terminal performs Alford rotation on pure SVR seismic data to rotate both the source excitation direction and the receiver direction of the horizontal component of the geophone to the direction of the source-sensor connection and its perpendicular direction. The terminal performs horizontal component rotation on PSV converted wave seismic data to rotate the receiver direction of the horizontal component of the geophone to the direction of the source-sensor connection and its perpendicular direction. The terminal performs horizontal source rotation on SVP converted wave seismic data to rotate the excitation direction of the SVR source to the direction of the source-sensor connection and its perpendicular direction.

[0093] In one implementation environment, the process of performing Alford rotation on pure SVR seismic data by the terminal is represented by the second formula below, the process of rotating the horizontal component of PSV converted wave seismic data is represented by the third formula below, and the operation of rotating the horizontal source of SVP converted wave seismic data is represented by the fourth formula below.

[0094]

[0095]

[0096]

[0097] It should be noted that in the second formula (2) above, SxRx, SxRy, SyRx and SyRy are the four seismic data components of pure shear wave seismic data (also known as four-component seismic data), SrRr, SrRt, StRr and StRt are the amplitude values ​​of the four seismic data components obtained after Alford rotation of the four seismic data components of pure shear wave seismic data, and β is the adjustment angle. In the third formula (3) above, PSRx and PSRy are the two seismic data components of PSV converted wave seismic data (also known as two-component seismic data), PSRr and PSRt are the amplitude values ​​of the two seismic data components obtained after horizontal component rotation of the two seismic data components of PSV converted wave seismic data (also known as two-component seismic data), and β is the adjustment angle. In the fourth formula (4) above, SxP and SyP ​​are the two components of the shear wave source-converted seismic data of the SVP converted wave seismic data, SrP and StP are the amplitude values ​​of the two seismic data components (also known as two-component seismic data) obtained after horizontal source rotation of the two shear wave source seismic data components of the SVP converted wave seismic data, and β is the adjustment angle.

[0098] Step 203: The terminal determines the shear wave splitting analysis time window corresponding to each target layer based on the processed multi-wave seismic data.

[0099] Since the arrival time of multi-wave seismic data varies in each target layer, the terminal needs to determine the corresponding shear wave splitting analysis time window for each target layer based on the processed multi-wave seismic data.

[0100] As an example, the operation of the terminal to determine the shear wave splitting analysis time window corresponding to each target layer of the processed multi-wave seismic data includes at least the following: performing stacking or migration imaging processing on the processed multi-wave seismic data to obtain seismic data imaging profiles corresponding to pure shear wave seismic data, PSV converted wave seismic data, and SVP converted wave seismic data, respectively; and performing layer calibration on the seismic data imaging profiles to help determine the shear wave splitting analysis time window of the pure shear wave seismic data, PSV converted wave seismic data, and SVP converted wave seismic data, respectively, at each target layer.

[0101] It should be noted that, since multi-wave seismic data involves shear waves including pure shear wave seismic data, PSV converted wave seismic data, and SVP converted wave seismic data, the terminal can perform stacking or migration imaging processing on pure shear wave seismic data, PSV converted wave seismic data, and SVP converted wave seismic data to obtain seismic data imaging profiles. The terminal's operation of stacking or migration imaging processing on multi-wave seismic data can be referenced from relevant technologies, and will not be described in detail in this embodiment.

[0102] In one embodiment, for the same target layer, the terminal can determine the time when pure shear wave seismic data, PSV converted wave seismic data, and SVP converted wave seismic data reach the layer of that layer, and determine the shear wave splitting analysis time window corresponding to the pure shear wave seismic data based on the time corresponding to the pure shear wave seismic data and the thickness of the target layer, and determine the shear wave splitting analysis time window corresponding to the PSV converted wave seismic data and the SVP converted wave seismic data based on the time corresponding to the PSV converted wave seismic data and the thickness of the target layer.

[0103] In one embodiment, for the same target layer, the terminal operates according to a sequence from shallow to deep, starting with the first azimuth anisotropic layer. The terminal operation criteria include: the time when the pure shear wave reflection time, specifically the time when the pure shear wave SrRt and StRr components begin to show significant effective signals, is the layer position time for the pure shear wave; and the time when the converted wave reflection time, specifically the time when the PSV converted wave PSRt component begins to show significant effective signals, is the layer position time for the PSV converted wave, and the time when the SVP converted wave StP component begins to show significant effective signals, is the layer position time for the SVP converted wave. The layer position times for the PSV and SVP converted waves are denoted as wnct, for example, wnct if it is in the first layer; and the layer position time for the pure shear wave (SS) is denoted as wnst, for example, wnst if it is in the first layer. Furthermore, based on the shear wave splitting characteristics and the stratigraphic correspondence between pure shear waves and converted waves, the target layer thickness of the pure shear wave is simultaneously determined, namely, the time window height hsn and the time window height hcn, with the corresponding half-heights of the time windows being hsn / 2 and hcn / 2, respectively. This allows for the determination of the start time wnst-hsn / 2 and the end time wnst+hsn / 2 of the pure shear wave splitting analysis time window centered on the pure shear wave stratigraphic time, and simultaneously, the start time wnct-hcn / 2 and the end time wnct+hcn / 2 of the converted shear wave splitting analysis time window centered on the converted wave stratigraphic time.

[0104] In one implementation environment, the terminal performs polarity adjustment and rotation processing on the multi-wave seismic data, then sorts it according to azimuth, resulting in the following: Figure 3 The earthquake data shown in the figure has boxes ranging from light to dark representing the time windows for shear wave splitting analysis. In this context, the layer time for PSV converted wave seismic data and SVP converted wave seismic data is wnct, and the layer time for pure SW seismic data is wnst. n represents the number of fracture layers, hsn is the time window height of the current pure SW target layer, and hcn is the time window height of the converted wave target layer. For example, n=1 indicates the first fracture layer. For the first fracture layer, the layer time for PSV converted wave seismic data and SVP converted wave seismic data is w1ct, and the layer time for pure SW seismic data is w1st. hs1 is the time window height of the first pure SW target layer, and hc1 is the time window height of the first converted wave target layer. Therefore, the start time of the SW splitting analysis time window for pure SW seismic data is w1st-hs1 / 2, and the end time is w1st+hs1 / 2. The start time of the SW splitting analysis time window for PSV converted wave seismic data and SVP converted wave seismic data is w1ct-hc1 / 2, and the end time is w1ct+hc1 / 2.

[0105] Step 204: The terminal determines the fracture parameters of each target layer based on the processed multi-wave seismic data and the shear wave splitting analysis time window corresponding to each target layer.

[0106] As an example, the operation of determining the fracture parameters of each target layer based on the processed multi-wave seismic data and the shear wave splitting analysis time window corresponding to each target layer includes at least the following: acquiring each effective component signal of the processed multi-wave seismic data in each target layer, including a specific component signal, wherein the specific component signal includes the SrRt component signal and StRr component signal of pure shear wave seismic data, the PSRt component signal of PSV converted wave seismic data, and the StP component signal of SVP converted wave seismic data, and the amplitude of the specific component signal in the target layer is not 0; determining the fracture parameters of each target layer based on each effective component signal of the processed multi-wave seismic data in each target layer and the shear wave splitting analysis time window corresponding to each target layer.

[0107] In some embodiments, the operation of determining the fracture parameters of each target layer based on the effective component signals of the processed multi-wave seismic data in each target layer and the corresponding shear wave splitting analysis time window in each target layer includes: determining the amplitude energy of a specific component signal after shear wave splitting correction in each target layer based on the effective component signals of the processed multi-wave seismic data in each target layer and the corresponding shear wave splitting analysis time window in each target layer; determining the target fracture parameters as the fracture parameters of the target stratum, wherein the target stratum is an anisotropic stratum in any azimuth of the stratum transmitted by the multi-wave seismic data, and the target fracture parameters are the fracture parameters corresponding to the minimum amplitude energy of the specific component signal in the target stratum.

[0108] It should be noted that when the amplitude of a specific component signal is 0 in the target layer, there is no need to perform transverse wave splitting correction.

[0109] In some embodiments, the terminal can acquire reference fracture parameters for each target layer, which are assumed fracture parameters for each target layer. Then, for the target formation, based on the effective component signals of the processed multiwave seismic data in the target formation and the corresponding shear wave splitting analysis time window in the target formation, the terminal determines the amplitude energy of the specific component signal after shear wave splitting correction when the fracture parameters of the multiwave seismic data in the target formation are the reference fracture parameters. The reference fracture parameter corresponding to the minimum amplitude energy of the specific component signal is determined as the fracture parameter of the target formation.

[0110] It should be noted that when shear wave splitting occurs in a target layer with azimuth anisotropy, the amplitude of a specific component signal will not be zero. However, after shear wave splitting correction, the amplitude of the specific component signal will be zero, meaning that the amplitude energy of the specific component signal after shear wave splitting correction will be at its minimum. When this amplitude energy is at its minimum, the amplitude energy is 0.

[0111] In some embodiments, the terminal determines the fracture information of each target layer using the following fifth formula based on the effective component signals of the processed multi-wave seismic data in each target layer and the corresponding shear wave splitting analysis time window in each stratum.

[0112]

[0113] It should be noted that in the fifth formula (5) above, the relevant parameters are as shown in the sixth and seventh formulas below:

[0114]

[0115]

[0116] It should be noted that in the fifth formula (5), the sixth formula (6), and the seventh formula (7) above, U represents the amplitude of different seismic data, and different seismic data components correspond to different subscripts. For example, U 0SrRt U 0StRr U 0PSRt U 0StP Etc. and so on represent the amplitudes corresponding to specific component signals of different seismic data, U 0Sr Including U 0SrRr and U 0SrRt Two components, U 0St Including U 0StRr and U 0StRt Two components, U 0PS Including U 0PSRr and U 0PSRt Two components, U 0SP Including U 0SrP and U 0StP Two components; U Sr Including U SrRr and U SrRt Two components; U St Including U StRr and U StRt Two components, U PS Including U PSRr and U PSRt Two components, U SP Including U SrP and U StPTwo components; the operational matrices R and D are shown in formulas (6) and (7); t is used to represent different time points in the transverse wave splitting analysis time window; θ represents the crack direction and θ n The direction of the fracture in the nth stratum is used to represent the time difference between fast and slow waves, and Δt is used to represent the time difference between fast and slow waves. n The time difference between fast and slow shear waves in the nth formation is used to represent the time difference between them. α represents the azimuth of the seismic trace. wnct-hcn / 2 is the start time of the shear wave splitting analysis window corresponding to PSV converted wave seismic data and SVP converted wave seismic data. wnct+hcn / 2 is the end time of the shear wave splitting analysis window corresponding to PSV converted wave seismic data and SVP converted wave seismic data. wnst-hsn / 2 is the start time of the shear wave splitting analysis window corresponding to pure shear wave seismic data. wnst+hsn / 2 is the end time of the shear wave splitting analysis window corresponding to pure shear wave seismic data. A(θ) n , Δt n ) represents the sum of amplitude energy of a specific component signal in the multi-wave seismic data of the nth stratum, where i is an imaginary number and ω is the frequency.

[0117] In some embodiments, in A(θ) n , Δt n When the value reaches its minimum, the terminal can determine the fracture parameters of the nth formation, which include the fracture direction and the time difference between fast and slow shear waves.

[0118] In some embodiments, after determining the crack parameters, the terminal can display the crack parameters through prompt information.

[0119] It should be noted that the prompt message can be in the form of voice, text, video, etc.

[0120] In this embodiment of the application, since the terminal can determine the fracture parameters of each target layer through pure shear wave seismic data, PSV converted wave seismic data and SVP converted wave seismic data, it avoids obtaining different fracture parameters after analyzing by converting waves and pure shear waves alone. That is, by performing shear wave splitting analysis by combining converted waves and pure shear waves, the uniqueness of fracture parameters is guaranteed and the reliability of determining fracture parameters is improved.

[0121] Figure 4 This is a schematic diagram of a crack parameter determination device provided in an embodiment of this application. The crack parameter determination device can be implemented by software, hardware, or a combination of both. The crack parameter determination device may include: an adjustment module 401, a first determination module 402, and a second determination module 403.

[0122] The adjustment module 401 is used to adjust the multi-wave seismic data when it is received by the detector. The multi-wave seismic data includes pure shear wave seismic data, PSV converted wave seismic data and SVP converted wave seismic data.

[0123] The first determining module 402 is used to determine the shear wave splitting analysis time window corresponding to each target layer of the processed multi-wave seismic data.

[0124] The second determining module 403 is used to determine the fracture parameters of each target layer based on the processed multi-wave seismic data and the shear wave splitting analysis time window corresponding to each target layer.

[0125] In some embodiments, see Figure 5 The adjustment module 401 includes:

[0126] The first determining submodule 4011 is used to determine seismic data whose source direction is opposite to the target direction when the shear wave source seismic data is received through the detector. The target direction is the excitation direction specified by the source device when the source device performs source excitation. The shear wave source seismic data includes the pure shear wave seismic data and the SVP converted wave seismic data.

[0127] The processing submodule 4012 is used to reverse the polarity of the amplitude values ​​of the shear wave source seismic data whose source direction is opposite to the target direction, so as to obtain shear wave source seismic data with the same excitation direction.

[0128] The first acquisition submodule 4013 is used to acquire the azimuth angle of the multi-wave seismic data;

[0129] The rotation submodule 4014 is used to perform Alford rotation on the four-component seismic data of the pure shear wave seismic data received by the horizontal component of the detector according to the azimuth angle, perform horizontal component rotation on the two-component seismic data of the PSV converted wave seismic data received by the horizontal component of the detector, and perform horizontal source rotation on the two-component seismic data of the SVP converted wave seismic data received by the vertical component of the detector.

[0130] In some embodiments, see Figure 6 The first determining module 402 includes:

[0131] The imaging submodule 4021 is used to perform superposition or migration imaging processing on the processed multi-wave seismic data to obtain seismic data imaging profiles corresponding to the pure shear wave seismic data, the PSV converted wave seismic data and the SVP converted wave seismic data, respectively.

[0132] The calibration submodule 4022 is used to perform layer calibration in the seismic data imaging profile to determine the shear wave splitting analysis time window of the pure shear wave seismic data, the PSV converted wave seismic data and the SVP converted wave seismic data in each target layer.

[0133] In some embodiments, see Figure 7 The second determining module 403 includes:

[0134] The second acquisition submodule 4031 is used to acquire the effective component signals of the processed multi-wave seismic data in each target layer, including specific component signals. The specific component signals include the SrRt component signal and StRr component signal of the pure shear wave seismic data, the PSRt component signal of the PSV converted wave seismic data, and the StP component signal of the SVP converted wave seismic data. The amplitude of the specific component signal in the target layer is not 0.

[0135] The second determining submodule 4032 is used to determine the fracture parameters of each target layer based on the effective component signals of the processed multi-wave seismic data in each target layer and the corresponding shear wave splitting analysis time window in each target layer.

[0136] In some embodiments, the second determining submodule 4032 is used for:

[0137] Based on the effective component signals of the processed multi-wave seismic data in each target layer and the corresponding shear wave splitting analysis time window in each target layer, the amplitude energy of the specific component signal after shear wave splitting correction in each target layer is determined.

[0138] The target fracture parameter is defined as the fracture parameter of the target stratum, which is any stratum in the strata transmitted by the multi-wave seismic data. The target fracture parameter is the fracture parameter corresponding to the minimum amplitude energy of the specific component signal in the target stratum.

[0139] In this embodiment, since the terminal can determine the fracture parameters of each target layer through pure shear wave seismic data, PSV converted wave seismic data and SVP converted wave seismic data, it avoids obtaining different fracture parameters after analyzing by converting waves or pure shear waves alone. That is, by performing shear wave splitting analysis by combining converted waves and pure shear waves, the uniqueness of fracture parameters is guaranteed and the reliability of determining fracture parameters is improved.

[0140] It should be noted that the crack parameter determination device provided in the above embodiments is only illustrated by the division of the above functional modules. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. In addition, the crack parameter determination device and the crack parameter determination method embodiments provided in the above embodiments belong to the same concept, and the specific implementation process can be found in the method embodiments, which will not be repeated here.

[0141] Figure 8 This illustration shows a structural block diagram of a terminal 800 provided in an exemplary embodiment of this application. The terminal 800 may be a smartphone, tablet computer, MP3 player (Moving Picture Experts Group Audio Layer III), MP4 player (Moving Picture Experts Group Audio Layer IV), laptop computer, or desktop computer. The terminal 800 may also be referred to as a user device, portable terminal, laptop terminal, desktop terminal, or other names.

[0142] Typically, terminal 800 includes a processor 801 and a memory 802.

[0143] Processor 801 may include one or more processing cores, such as a quad-core processor or an octa-core processor. Processor 801 may be implemented using at least one hardware form selected from DSP (Digital Signal Processing), FPGA (Field-Programmable Gate Array), and PLA (Programmable Logic Array). Processor 801 may also include a main processor and a coprocessor. The main processor, also known as a CPU (Central Processing Unit), is used to process data in the wake-up state; the coprocessor is a low-power processor used to process data in the standby state. In some embodiments, processor 801 may integrate a GPU (Graphics Processing Unit), which is responsible for rendering and drawing the content to be displayed on the screen. In some embodiments, processor 801 may also include an AI (Artificial Intelligence) processor, which is used to handle computational operations related to machine learning.

[0144] The memory 802 may include one or more computer-readable storage media, which may be non-transitory. The memory 802 may also include high-speed random access memory and non-volatile memory, such as one or more disk storage devices or flash memory devices. In some embodiments, the non-transitory computer-readable storage media in the memory 802 is used to store at least one instruction, which is executed by the processor 801 to implement the crack parameter determination method provided in the method embodiments of this application.

[0145] In some embodiments, the terminal 800 may also optionally include a peripheral device interface 803 and at least one peripheral device. The processor 801, memory 802, and peripheral device interface 803 can be connected via a bus or signal line. Each peripheral device can be connected to the peripheral device interface 803 via a bus, signal line, or circuit board. Specifically, the peripheral device includes at least one of the following: a radio frequency circuit 804, a display screen 805, a camera assembly 806, an audio circuit 807, a positioning assembly 808, and a power supply 809.

[0146] Peripheral device interface 803 can be used to connect at least one I / O (Input / Output) related peripheral device to processor 801 and memory 802. In some embodiments, processor 801, memory 802 and peripheral device interface 803 are integrated on the same chip or circuit board; in some other embodiments, any one or two of processor 801, memory 802 and peripheral device interface 803 can be implemented on separate chips or circuit boards, which is not limited in this embodiment.

[0147] The radio frequency (RF) circuit 804 is used to receive and transmit RF (Radio Frequency) signals, also known as electromagnetic signals. The RF circuit 804 communicates with communication networks and other communication devices via electromagnetic signals. The RF circuit 804 converts electrical signals into electromagnetic signals for transmission, or converts received electromagnetic signals back into electrical signals. Optionally, the RF circuit 804 includes: an antenna system, an RF transceiver, one or more amplifiers, a tuner, an oscillator, a digital signal processor, a codec chipset, a user identity module card, etc. The RF circuit 804 can communicate with other terminals through at least one wireless communication protocol. This wireless communication protocol includes, but is not limited to: metropolitan area networks (MANs), various generations of mobile communication networks (2G, 3G, 4G, and 5G), wireless local area networks (WLANs), and / or WiFi (Wireless Fidelity) networks. In some embodiments, the RF circuit 804 may also include circuitry related to NFC (Near Field Communication), which is not limited in this application.

[0148] Display screen 805 is used to display a UI (User Interface). This UI may include graphics, text, icons, videos, and any combination thereof. When display screen 805 is a touch display screen, it also has the ability to collect touch signals on or above its surface. These touch signals can be input as control signals to processor 801 for processing. In this case, display screen 805 can also be used to provide virtual buttons and / or a virtual keyboard, also known as soft buttons and / or a soft keyboard. In some embodiments, there may be one display screen 805, which serves as the front panel of terminal 800; in other embodiments, there may be at least two display screens, respectively disposed on different surfaces of terminal 800 or in a folded design; in still other embodiments, display screen 805 may be a flexible display screen, disposed on a curved or folded surface of terminal 800. Furthermore, display screen 805 may be configured as a non-rectangular, irregular shape, i.e., a non-rectangular screen. Display screen 805 may be made of materials such as LCD (Liquid Crystal Display) or OLED (Organic Light-Emitting Diode).

[0149] The camera assembly 806 is used to acquire images or videos. Optionally, the camera assembly 806 includes a front-facing camera and a rear-facing camera. Typically, the front-facing camera is located on the front panel of the terminal, and the rear-facing camera is located on the back of the terminal. In some embodiments, there are at least two rear-facing cameras, which are any one of a main camera, a depth-sensing camera, a wide-angle camera, and a telephoto camera, to achieve background blurring by fusion of the main camera and the depth-sensing camera, panoramic shooting by fusion of the main camera and the wide-angle camera, VR (Virtual Reality) shooting, or other fusion shooting functions. In some embodiments, the camera assembly 806 may also include a flash. The flash can be a single-color temperature flash or a dual-color temperature flash. A dual-color temperature flash refers to a combination of a warm-light flash and a cool-light flash, which can be used for light compensation at different color temperatures.

[0150] The audio circuit 807 may include a microphone and a speaker. The microphone is used to collect sound waves from the user and the environment, converting the sound waves into electrical signals that are input to the processor 801 for processing, or input to the radio frequency circuit 804 to achieve voice communication. For stereo sound acquisition or noise reduction purposes, multiple microphones may be used, each located at a different part of the terminal 800. The microphone may also be an array microphone or an omnidirectional microphone. The speaker is used to convert the electrical signals from the processor 801 or the radio frequency circuit 804 into sound waves. The speaker may be a conventional diaphragm speaker or a piezoelectric ceramic speaker. When the speaker is a piezoelectric ceramic speaker, it can convert electrical signals not only into audible sound waves but also into inaudible sound waves for purposes such as distance measurement. In some embodiments, the audio circuit 807 may also include a headphone jack.

[0151] The positioning component 808 is used to determine the current geographic location of the terminal 800 in order to enable navigation or LBS (Location Based Service). The positioning component 808 can be a positioning component based on the US GPS (Global Positioning System), China's BeiDou system, Russia's Granas system, or the European Union's Galileo system.

[0152] Power supply 809 is used to supply power to the various components in terminal 800. Power supply 809 can be AC ​​power, DC power, a disposable battery, or a rechargeable battery. When power supply 809 includes a rechargeable battery, the rechargeable battery can support wired or wireless charging. The rechargeable battery can also be used to support fast charging technology.

[0153] In some embodiments, the terminal 800 further includes one or more sensors 810. The one or more sensors 810 include, but are not limited to: an accelerometer 811, a gyroscope 812, a pressure sensor 813, a fingerprint sensor 814, an optical sensor 815, and a proximity sensor 816.

[0154] Accelerometer 811 can detect the magnitude of acceleration on the three coordinate axes of a coordinate system established by terminal 800. For example, accelerometer 811 can be used to detect the components of gravitational acceleration on the three coordinate axes. Processor 801 can control display screen 805 to display the user interface in either a landscape or portrait view based on the gravitational acceleration signal acquired by accelerometer 811. Accelerometer 811 can also be used for games or for acquiring user motion data.

[0155] The gyroscope sensor 812 can detect the orientation and rotation angle of the terminal 800. The gyroscope sensor 812, in conjunction with the accelerometer sensor 811, can collect 3D motion data from the user on the terminal 800. Based on the data collected by the gyroscope sensor 812, the processor 801 can perform the following functions: motion sensing (e.g., changing the UI based on the user's tilt), image stabilization during shooting, game control, and inertial navigation.

[0156] The pressure sensor 813 can be disposed on the side bezel of the terminal 800 and / or on the lower layer of the display screen 805. When the pressure sensor 813 is disposed on the side bezel of the terminal 800, it can detect the user's grip signal on the terminal 800, and the processor 801 can perform left / right hand recognition or quick operation based on the grip signal collected by the pressure sensor 813. When the pressure sensor 813 is disposed on the lower layer of the display screen 805, the processor 801 can control the operable controls on the UI interface based on the user's pressure operation on the display screen 805. The operable controls include at least one of button controls, scroll bar controls, icon controls, and menu controls.

[0157] The fingerprint sensor 814 is used to collect the user's fingerprint. The processor 801 identifies the user's identity based on the fingerprint collected by the fingerprint sensor 814, or the fingerprint sensor 814 identifies the user's identity based on the collected fingerprint. When the user's identity is identified as trusted, the processor 801 authorizes the user to perform relevant sensitive operations, including unlocking the screen, viewing encrypted information, downloading software, making payments, and changing settings. The fingerprint sensor 814 can be located on the front, back, or side of the terminal 800. When the terminal 800 has physical buttons or a manufacturer's logo, the fingerprint sensor 814 can be integrated with the physical buttons or manufacturer's logo.

[0158] An optical sensor 815 is used to collect ambient light intensity. In one embodiment, the processor 801 can control the display brightness of the display screen 805 based on the ambient light intensity collected by the optical sensor 815. Specifically, when the ambient light intensity is high, the display brightness of the display screen 805 is increased; when the ambient light intensity is low, the display brightness of the display screen 805 is decreased. In another embodiment, the processor 801 can also dynamically adjust the shooting parameters of the camera assembly 806 based on the ambient light intensity collected by the optical sensor 815.

[0159] The proximity sensor 816, also known as a distance sensor, is typically located on the front panel of the terminal 800. The proximity sensor 816 is used to detect the distance between the user and the front of the terminal 800. In one embodiment, when the proximity sensor 816 detects that the distance between the user and the front of the terminal 800 is gradually decreasing, the processor 801 controls the display screen 805 to switch from a screen-on state to a screen-off state; when the proximity sensor 816 detects that the distance between the user and the front of the terminal 800 is gradually increasing, the processor 801 controls the display screen 805 to switch from a screen-off state to a screen-on state.

[0160] Those skilled in the art will understand that Figure 8 The structure shown does not constitute a limitation on terminal 800 and may include more or fewer components than shown, or combine certain components, or use different component arrangements.

[0161] This application also provides a non-transitory computer-readable storage medium, which, when the instructions in the storage medium are executed by the processor of a terminal, enables the terminal to execute the crack parameter determination method provided in the above embodiment.

[0162] This application also provides a computer program product containing instructions that, when run on a terminal, causes the terminal to execute the crack parameter determination method provided in the above embodiments.

[0163] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0164] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present application should be included within the protection scope of the present application.

Claims

1. A method for determining crack parameters, characterized in that, The method includes: When multi-wave seismic data is received through the detector, the multi-wave seismic data is adjusted and processed. The multi-wave seismic data includes pure shear wave seismic data, PSV converted wave seismic data, and SVP converted wave seismic data. Based on the processed multi-wave seismic data, determine the shear wave splitting analysis time window corresponding to each target layer of the multi-wave seismic data; Based on the processed multi-wave seismic data and the shear wave splitting analysis time window corresponding to each target layer, the fracture parameters of each target layer are determined. The step of determining the fracture parameters of each target layer based on the processed multi-wave seismic data and the shear wave splitting analysis time window corresponding to each target layer includes: The processed multiwave seismic data is acquired, including each effective component signal, including a specific component signal, in each target layer. The specific component signal includes the SrRt component signal and StRr component signal of the pure shear wave seismic data, the PSRt component signal of the PSV converted wave seismic data, and the StP component signal of the SVP converted wave seismic data. The amplitude of the specific component signal in the target layer is not 0. Based on the effective component signals of the processed multi-wave seismic data in each target layer, and the shear wave splitting analysis time window corresponding to each target layer, the fracture parameters of each target layer are determined. The step of determining the fracture parameters of each target layer based on the effective component signals of the processed multi-wave seismic data in each target layer and the corresponding shear wave splitting analysis time window for each target layer includes: Based on the effective component signals of the processed multi-wave seismic data in each target layer, and the shear wave splitting analysis time window corresponding to each target layer, the amplitude energy of the specific component signal after shear wave splitting correction in each target layer is determined. The target fracture parameter is defined as the fracture parameter of the target stratum, which is any stratum in the strata transmitted by the multi-wave seismic data. The target fracture parameter is the fracture parameter corresponding to the minimum amplitude energy of the specific component signal in the target stratum.

2. The method as described in claim 1, characterized in that, The step of adjusting the multi-wave seismic data received by the detector includes: When receiving shear wave source seismic data through the detector, the seismic data whose source direction is opposite to the target direction is determined. The target direction is the excitation direction specified when the source device performs source excitation. The shear wave source seismic data includes the pure shear wave seismic data and the SVP converted wave seismic data. The amplitude values ​​of shear wave source seismic data with the opposite source direction to the target direction are reversed to obtain shear wave source seismic data with the same excitation direction. Obtain the azimuth angle of the multi-wave seismic data; Based on the azimuth angle, Alford rotation is performed on the four-component seismic data of the pure shear wave seismic data received by the horizontal component of the detector, horizontal rotation is performed on the two-component seismic data of the PSV converted wave seismic data received by the horizontal component of the detector, and horizontal source rotation is performed on the two-component seismic data of the SVP converted wave seismic data received by the vertical component of the detector.

3. The method as described in claim 1, characterized in that, The step of determining the shear wave splitting analysis time window corresponding to each target layer of the processed multi-wave seismic data includes: The processed multi-wave seismic data are stacked or migrated for imaging to obtain seismic data imaging profiles corresponding to the pure shear wave seismic data, the PSV converted wave seismic data, and the SVP converted wave seismic data, respectively. Layer calibration is performed on the seismic data imaging profile to determine the shear wave splitting analysis time windows of the pure shear wave seismic data, the PSV converted wave seismic data, and the SVP converted wave seismic data in each target layer.

4. A device for determining crack parameters, characterized in that, The device includes: An adjustment module is used to adjust the multi-wave seismic data received through the detector, the multi-wave seismic data including pure shear wave seismic data, PSV converted wave seismic data and SVP converted wave seismic data; The first determining module is used to determine the shear wave splitting analysis time window corresponding to each target layer of the processed multi-wave seismic data. The second determining module is used to determine the fracture parameters of each target layer based on the processed multi-wave seismic data and the shear wave splitting analysis time window corresponding to each target layer. The second determining module includes: The second acquisition submodule is used to acquire the effective component signals of the processed multi-wave seismic data in each target layer, including specific component signals. The specific component signals include the SrRt component signal and StRr component signal of the pure shear wave seismic data, the PSRt component signal of the PSV converted wave seismic data, and the StP component signal of the SVP converted wave seismic data. The amplitude of the specific component signal in the target layer is not 0. The second determination submodule is used to determine the fracture parameters of each target layer based on the effective component signals of the processed multi-wave seismic data in each target layer and the shear wave splitting analysis time window corresponding to each target layer. The second determining submodule is used for: Based on the effective component signals of the processed multi-wave seismic data in each target layer, and the shear wave splitting analysis time window corresponding to each target layer, the amplitude energy of the specific component signal after shear wave splitting correction in each target layer is determined. The target fracture parameter is defined as the fracture parameter of the target stratum, which is any stratum in the strata transmitted by the multi-wave seismic data. The target fracture parameter is the fracture parameter corresponding to the minimum amplitude energy of the specific component signal in the target stratum.

5. The apparatus as described in claim 4, characterized in that, The adjustment module includes: The first determining submodule is used to determine seismic data whose source direction is opposite to the target direction when the shear wave source seismic data is received through the detector. The target direction is the excitation direction specified by the source device when the source device performs source excitation. The shear wave source seismic data includes the pure shear wave seismic data and the SVP converted wave seismic data. The processing submodule is used to reverse the polarity of the amplitude values ​​of the shear wave source seismic data whose source direction is opposite to the target direction, so as to obtain shear wave source seismic data with the same excitation direction. The first acquisition submodule is used to acquire the azimuth angle of the multi-wave seismic data; The rotation submodule is used to perform Alford rotation on the four-component seismic data of the pure shear wave seismic data received by the detector in the horizontal component, perform horizontal component rotation on the two-component seismic data of the PSV converted wave seismic data received by the detector in the horizontal component, and perform horizontal source rotation on the two-component seismic data of the SVP converted wave seismic data received by the detector in the vertical component, according to the azimuth angle.

6. The apparatus as claimed in claim 4, characterized in that, The first determining module includes: The imaging submodule is used to perform superposition or migration imaging processing on the processed multi-wave seismic data to obtain seismic data imaging profiles corresponding to the pure shear wave seismic data, the PSV converted wave seismic data and the SVP converted wave seismic data, respectively. The calibration submodule is used to perform layer calibration in the seismic data imaging profile to determine the shear wave splitting analysis time window of the pure shear wave seismic data, the PSV converted wave seismic data and the SVP converted wave seismic data in each target layer.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores instructions that, when executed by a processor, implement the steps of the method described in any one of claims 1 to 3.

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