Electronic device and heat sink thereof

Abstract

The application discloses an electronic device and a radiator thereof. The radiator comprises an adjusting module and a heat dissipation module. The adjusting module comprises a first air exchange cavity and a second air exchange cavity. The heat dissipation module comprises a liquid cooling circulation pipe. Two ends of the liquid cooling circulation pipe are communicated with the first air exchange cavity and the second air exchange cavity respectively. The first air exchange cavity is provided with a first sealing plate and a first driving element. The first driving element provides power, so that the first sealing plate moves to the first side, and the cooling medium in the liquid cooling circulation pipe is driven to flow. The second air exchange cavity is provided with a second sealing plate and a second driving element. The second driving element provides power, so that the second sealing plate moves to the second side, and the cooling medium in the liquid cooling circulation pipe is driven to flow. The radiator can solve the problem that the temperature of a computer with high load operation appears a sharp peak, the cooling medium in the air-cooled heat pipe cannot be condensed and returned in time, the heat pipe is dried, the rotating speed of the heat dissipation fan is high, the noise is too large, and even the computer is shut down, and rapid cooling is realized.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and in particular to a heat sink. This application also relates to an electronic device having the heat sink. Background Technology

[0002] In recent years, with the rapid development of computer technology, electronic devices such as computers, servers, and storage have been widely used, and computer computing power has been continuously improved. Computers are important computing service devices, generally composed of various hardware modules, such as motherboards, storage units, computing units, cooling modules, and power supply modules. When a computer is running, each module generates a large amount of heat, with the computing unit being the main heat-generating component. Generally, thermal engineers design and install cooling modules (heat sinks, equipped with fan modules, etc.) above the computing unit to help cool it down and ensure the computer's normal operation.

[0003] Common heat sinks include air-cooled and liquid-cooled types. Air-cooled heat sinks work by generating heat in the computing unit, which is then conducted to the evaporation end at the bottom of the heat pipe. The cooling medium in the heat pipe vaporizes due to the heat and evaporates to the condensation end at the top of the heat pipe. Under the heat convection exchange between the heat sink fins and the fan module, the cooling medium wets and condenses on the sintered wall inside the heat pipe and slowly flows back to the evaporation end at the bottom of the heat pipe. This cycle repeats to dissipate heat from the computing unit. However, when running large programs or software, the computing unit may experience temperature spikes due to short-term performance overload. The cooling medium in the heat pipe cannot condense and flow back in time, causing the heat pipe to dry out or even fail. Simultaneously, due to high-temperature alarms, the fan module operates at full load, generating significant noise and severely impacting the user experience. In existing technologies, to address issues such as CPU temperature spikes due to computer overload, heat pipe cooling fluid failing to condense and reflux in time leading to heat pipe drying out, or excessive fan noise, the common approach is to replace the liquid cooling radiator. Because the liquid water circulating in the liquid cooling radiator has a high specific heat capacity, it can absorb a large amount of heat in a short time, thus rapidly cooling the computing unit. However, liquid cooling radiators require pumps to drive a large flow of liquid water, posing a risk of leakage and potentially damaging the computing unit.

[0004] Therefore, how to solve the problem of rapidly cooling down computers under high load and reducing the risk of liquid heat sink leakage is a technical challenge faced by those skilled in the art. Summary of the Invention

[0005] The purpose of this application is to provide a heat sink that solves the problem of heat spikes occurring during high-load computer operation, which prevent the cooling medium in the air-cooled heat pipes from condensing and flowing back in time, causing the heat pipes to dry out, the cooling fan to run at high speed, excessive noise, and even system crashes. This heat sink achieves rapid cooling, improves the user experience, and reduces the risk of liquid heat sink leakage. Another purpose of this application is to provide an electronic device including the aforementioned heat sink.

[0006] To achieve the above objectives, this application provides a radiator, including an adjustment module and a heat dissipation module. The adjustment module includes a first ventilation chamber and a second ventilation chamber that are interconnected. The heat dissipation module includes a liquid cooling circulation pipe, and the two ends of the liquid cooling circulation pipe are respectively connected to the first ventilation chamber and the second ventilation chamber.

[0007] The first ventilation chamber is provided with a first sealing plate and a first driving member. The first sealing plate is movably disposed in the first ventilation chamber. The first driving member is connected to the first sealing plate and provides power to make the first sealing plate move to the first side to drive the cooling medium in the liquid cooling circulation pipe to flow to the end of the liquid cooling circulation pipe connected to the first ventilation chamber.

[0008] The second ventilation chamber is provided with a second sealing plate and a second driving member. The second sealing plate is movably disposed in the second ventilation chamber, and the second driving member provides power to move the second sealing plate to the second side, so as to drive the cooling medium in the liquid cooling circulation pipe to flow to the end of the liquid cooling circulation pipe connected to the second ventilation chamber.

[0009] In some embodiments, the first driving member is an elastic member that can be deformed by heat. The two ends of the elastic member are respectively connected to the first sealing plate and the adjustment module. The elastic member deforms when heated, so that the first sealing plate moves to the first side.

[0010] In some embodiments, the second driving member is a magnetic suction plate, which is fixed to the second side of the second sealing plate. When the magnetic suction plate is energized, it generates magnetism, causing the second sealing plate to move toward the magnetic suction plate.

[0011] In some embodiments, a pressure sensor is also provided in the second ventilation chamber. The pressure sensor is located at a limiting point in the second ventilation chamber. When the second sealing plate moves to the limiting point, the pressure sensor detects a pressure change signal, and the magnetic suction plate is energized to generate magnetism.

[0012] In some embodiments, the first ventilation chamber is further provided with a first guide rail groove, and the first sealing plate is slidably connected to the first guide rail groove;

[0013] The second ventilation chamber is also provided with a second guide rail groove, and the second sealing plate is slidably connected to the second guide rail groove.

[0014] In some embodiments, the adjustment module further includes a third ventilation chamber, which is disposed between the first ventilation chamber and the second ventilation chamber and connects the first ventilation chamber and the second ventilation chamber.

[0015] In some embodiments, the heat dissipation module further includes heat dissipation fins and air-cooled heat pipes, wherein both the air-cooled heat pipes and the liquid-cooled circulation pipes are coiled within the heat dissipation fins.

[0016] In some embodiments, the system further includes a thermally conductive base and a thermally conductive grease layer. The thermally conductive base is connected to the heat dissipation module and contacts and abuts against the air-cooled heat pipe and the liquid-cooled circulation pipe. The thermally conductive grease layer is disposed between the thermally conductive base and the motherboard.

[0017] In some embodiments, liquid check valves are provided at both ends of the liquid cooling circulation pipe to prevent the cooling medium in the liquid cooling circulation pipe from overflowing.

[0018] This application also provides an electronic device including any of the heat sinks described above.

[0019] Compared to the aforementioned background technology, the heat sink provided in this application includes an adjustment module and a heat dissipation module. The adjustment module includes a first ventilation chamber and a second ventilation chamber, which are interconnected. The heat dissipation module includes a liquid-cooled circulation pipe, with both ends of the liquid-cooled circulation pipe connected to the first and second ventilation chambers, respectively. In this way, once the air pressure in the first or second ventilation chamber changes, the cooling medium in the liquid-cooled circulation pipe can flow along one side, thereby changing the position of the cooling medium in the liquid-cooled circulation pipe that absorbs or does not absorb heat.

[0020] Furthermore, the first ventilation chamber is provided with a first sealing plate and a first driving member. The first sealing plate is movably disposed in the first ventilation chamber, and the first driving member is connected to the first sealing plate. The first driving member is used to provide power to move the first sealing plate to the first side (right side) to drive the cooling medium in the liquid cooling circulation pipe to flow to the end of the liquid cooling circulation pipe connected to the first ventilation chamber. The second ventilation chamber is provided with a second sealing plate and a second driving member. The second sealing plate is movably disposed in the second ventilation chamber, and the second driving member provides power to move the second sealing plate to the second side (left side) to drive the cooling medium in the liquid cooling circulation pipe to flow to the end of the liquid cooling circulation pipe connected to the second ventilation chamber.

[0021] When the radiator is running, the heat generated by the computing unit inside the electronic device is conducted to the adjustment module through the liquid cooling circulation pipe on the heat dissipation module. The first driving component is activated, and the first sealing plate moves to the first side (right side). The air pressure in the first ventilation chamber decreases, and the cooling medium in the liquid cooling circulation pipe flows towards the end of the liquid cooling circulation pipe connected to the first ventilation chamber. That is, the cooling medium on one side (left side) of the liquid cooling circulation pipe rises under the action of air pressure. In this way, the cooling medium that has absorbed heat at the bottom of the liquid cooling circulation pipe is driven to the upper part of the heat dissipation module for heat dissipation, while the liquid level on the opposite side (right side) of the liquid cooling circulation pipe drops, and the cooling medium that has not absorbed heat flows to the bottom of the liquid cooling circulation pipe and absorbs heat. As the liquid level on the opposite side of the cooling circulation pipe decreases, the air pressure in the second ventilation chamber drops, causing the second sealing plate to move towards the first side (right side). When the second sealing plate reaches a preset position, the second driving component activates, generating a reverse traction force on the second sealing plate and causing it to move in the opposite direction. This further adjusts the air pressure in the second ventilation chamber, driving the cooling medium in the liquid cooling circulation pipe to flow towards the end of the liquid cooling circulation pipe connected to the second ventilation chamber. This also readjusts the water level in the liquid cooling circulation pipe. At this point, the cooling medium that has absorbed heat at the bottom is driven to the upper part of the heat dissipation module. The cooled medium then flows back to the bottom of the liquid cooling circulation pipe to absorb heat again. This reciprocating motion achieves rapid cooling of the computing unit. The beneficial effects of this heat sink configuration mainly include:

[0022] Firstly, compared to traditional air-cooled radiators, the radiator provided in this application embodiment adopts a linkage design of a first air exchange chamber, a second air exchange chamber, and a liquid cooling circulation pipe. Utilizing the principle of air pressure, the cooling medium in the liquid cooling circulation pipe circulates, thereby solving the problem of temperature spikes occurring when the computer is running under high load, which prevents the cooling medium in the air-cooled heat pipe from condensing and flowing back in time, causing the heat pipe to dry out, resulting in high cooling fan speed, excessive noise, or even system crash. This achieves rapid cooling and improves the user experience.

[0023] Secondly, compared to traditional liquid-cooled radiators, the radiator provided in this application adopts a pump-free design. It does not require a power pump to drive the liquid cooling medium. Instead, the pressure in the air exchange chamber is changed by the movement of the sealing plate in the air exchange chamber, thereby changing the position of the cooling medium in the liquid cooling circulation pipe and achieving circulating heat dissipation. This can solve the leakage problem caused by using a power pump to drive the flow of liquid cooling medium, avoid damage to the computing unit, and greatly improve the stability and safety of equipment operation. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0025] Figure 1 This is an exploded view of the heat sink in the embodiment of this application;

[0026] Figure 2 for Figure 1 A schematic diagram of the overall structure of the heat sink shown.

[0027] Figure 3 for Figure 2 The diagram shows the linkage between the adjustment module and the liquid cooling circulation pipe in the heat sink.

[0028] Figure 4 This is a schematic diagram of the heat sink application in the embodiments of this application.

[0029] in:

[0030] 1-Adjustment module, 2-Heat dissipation module, 3-Heat conductive base, 4-Heat conductive grease layer, 5-Fasting screw;

[0031] 11-Conduit, 12-Sealing screw, 13-First ventilation chamber, 14-Third ventilation chamber, 15-Second ventilation chamber;

[0032] 21-Heat dissipation fins, 22-Air-cooled heat pipes, 23-Liquid-cooled circulation pipes;

[0033] 131-First sealing plate, 132-First driving component, 133-First guide rail groove;

[0034] 151-Second driving component, 152-Sealant, 153-Sealing ring, 154-Second sealing plate, 155-Limiting point;

[0035] 231 - Cooling medium, 232 - Liquid check valve. Detailed Implementation

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] The core of this application is to provide a heat sink that solves the problem of heat spikes occurring during high-load computer operation, which prevent the cooling medium in the air-cooled heat pipes from condensing and flowing back in time, causing the heat pipes to dry out, the cooling fan to run at high speed, excessive noise, and even system crashes. This heat sink achieves rapid cooling, improves the user experience, and reduces the risk of liquid heat sink leakage. Another core aspect of this application is to provide an electronic device that includes the aforementioned heat sink.

[0038] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] It should be noted that the directional terms such as "upper end," "lower end," "left side," and "right side" mentioned below are defined based on the accompanying drawings in the instruction manual.

[0040] Please refer to Figures 1 to 4 , Figure 1 This is an exploded view of the heat sink in the embodiment of this application; Figure 2 for Figure 1 A schematic diagram of the overall structure of the heat sink shown. Figure 3 for Figure 2 The diagram shows the linkage between the adjustment module and the liquid cooling circulation pipe in the heat sink. Figure 4 This is a schematic diagram of the heat sink application in the embodiments of this application.

[0041] The radiator provided in this application embodiment includes an adjustment module 1 and a heat dissipation module 2. The adjustment module 1 includes a first ventilation chamber 13 and a second ventilation chamber 15, which are interconnected. The heat dissipation module 2 includes a liquid cooling circulation pipe 23, which is connected to the first ventilation chamber 13 and the second ventilation chamber 15 at both ends. Specifically, the first ventilation chamber 13 and the second ventilation chamber 15 are connected to the two ends of the liquid cooling circulation pipe 23 through diagonally designed conduits 11 and sealing screws 12.

[0042] In this way, rapid cooling can be achieved by adjusting the air exchange and pressurization of module 1 to drive the flow of the cooling medium 231 in the liquid cooling circulation pipe 23. In other words, once the air pressure in the first air exchange chamber 13 or the second air exchange chamber 15 changes, the cooling medium 231 in the liquid cooling circulation pipe 23 can flow to one side, thereby changing the position of the cooling medium 231 in the liquid cooling circulation pipe 23 that absorbs or does not absorb heat.

[0043] Of course, depending on actual needs, the cooling medium 231 can be water coolant or other commonly used coolant.

[0044] Furthermore, the first ventilation chamber 13 is provided with a first sealing plate 131 and a first driving member 132. The first sealing plate 131 is movably disposed within the first ventilation chamber 13, and the first sealing plate 131 can move along the first ventilation chamber 13 as follows: Figure 3 The horizontal movement shown is achieved by connecting the first drive member 132 to the first sealing plate 131. The first drive member 132 provides power to move the first sealing plate 131 towards the first side (e.g., ...). Figure 3 The movement (as shown on the right) drives the cooling medium 231 in the liquid cooling circulation pipe 23 to flow to one end of the liquid cooling circulation pipe 23 connected to the first ventilation chamber 13; the second ventilation chamber 15 is provided with a second sealing plate 154 and a second driving member 151. The second sealing plate 154 is movably disposed in the second ventilation chamber 15, and the second sealing plate 154 can move along the right side of the second ventilation chamber 15. Figure 3 The horizontal movement shown is powered by the second drive member 151, causing the second sealing plate 154 to move towards the second side (e.g., Figure 3 The movement (as shown on the left) drives the cooling medium 231 in the liquid cooling circulation pipe 23 to flow to one end of the liquid cooling circulation pipe 23 connected to the second ventilation chamber 15.

[0045] This allows the cooling medium 231 within the liquid cooling circulation pipe 23 to circulate and dissipate heat.

[0046] Understandably, when the heat sink is running, the heat generated by the computing unit inside the electronic device is conducted to the adjustment module 1 via the liquid cooling circulation pipe 23 on the heat dissipation module 2. The first driving component 132 is activated, and the first sealing plate 131 moves towards the first side (e.g., Figure 3 As shown on the right side, the air pressure in the first ventilation chamber 13 decreases, and the cooling medium 231 in the liquid cooling circulation pipe 23 flows to one end of the liquid cooling circulation pipe 23 connected to the first ventilation chamber 13, that is, one side of the liquid cooling circulation pipe 23 (as shown on the right side). Figure 3 The cooling medium 231 (shown on the left) rises under air pressure. This causes the cooling medium 231, which has absorbed heat at the bottom of the liquid cooling circulation pipe 23, to be driven to the upper part of the heat dissipation module 2 for heat dissipation. The opposite side of the liquid cooling circulation pipe 23 (as shown on the left)... Figure 3 The liquid level on the right side (as shown) drops, and the unabsorbed cooling medium 231 flows to the bottom of the liquid cooling circulation pipe 23 and absorbs heat; in addition, because the liquid level on the opposite side of the liquid cooling circulation pipe 23 drops, the air pressure in the second ventilation chamber 15 decreases, and the second sealing plate 154 moves towards the first side (as shown on the right side). Figure 3As shown on the right side, when the second sealing plate 154 moves to the preset position, the second driving component 151 is activated, generating a reverse traction force on the second sealing plate 154 and causing the second sealing plate 154 to move in the opposite direction. This further adjusts the air pressure in the second ventilation chamber 15, driving the cooling medium 231 in the liquid cooling circulation pipe 23 to flow to the end of the liquid cooling circulation pipe 23 connected to the second ventilation chamber 15. This also achieves a readjustment of the water level in the liquid cooling circulation pipe 23. At this time, the cooling medium 231 that has absorbed heat at the bottom of the liquid cooling circulation pipe 23 is driven to the upper part of the heat dissipation module 2. After heat dissipation, the cooling medium 231 flows back to the bottom of the liquid cooling circulation pipe 23 and absorbs heat. This reciprocating motion achieves rapid cooling of the computing unit.

[0047] On the one hand, compared with traditional air-cooled radiators, the radiator provided in this application embodiment adopts a linkage design of the first air exchange chamber 13, the second air exchange chamber 15 and the liquid cooling circulation pipe 23. Utilizing the principle of air pressure, the cooling medium 231 in the liquid cooling circulation pipe 23 circulates, thereby solving the problem of temperature spikes occurring when the computer is running under high load, which prevents the cooling medium in the air-cooled heat pipe 22 from condensing and flowing back in time, causing the heat pipe to dry out, the cooling fan speed to be high, the noise to be too loud, or even the computer to crash. This achieves rapid cooling and improves the user experience.

[0048] On the other hand, compared with traditional liquid-cooled radiators, the radiator provided in this application embodiment adopts a pump-free design. It does not require a power pump to drive the liquid cooling medium 231. Instead, the pressure in the air exchange chamber is changed by the movement of the sealing plate in the air exchange chamber, thereby changing the position of the cooling medium 231 in the liquid cooling circulation pipe 23 and realizing circulation heat dissipation. This can solve the leakage problem caused by using a power pump to drive the flow of liquid cooling medium 231, avoid damage to the computing unit, and greatly improve the stability and safety of equipment operation.

[0049] In some embodiments, the first driving member 132 is an elastic member capable of thermal deformation. Preferably, the first driving member 132 is a shape memory alloy spring. Shape memory alloys (SMAs) are materials composed of two or more metallic elements that exhibit shape memory effect (SME) through thermoelastic and martensitic phase transformation and its inverse transformation. The two ends of the shape memory alloy spring are respectively connected to the first sealing plate 131 and the adjustment module 1. Based on the shape memory effect of the shape memory alloy spring, it absorbs the conductive heat in the heat dissipation module 2 and adaptively adjusts the air pressure in the first ventilation chamber 13 through high and low temperature deformation, thereby realizing the liquid level adjustment of the cooling medium 231 in the liquid cooling circulation pipe 23.

[0050] In this way, when heat is conducted to adjustment module 1 through heat dissipation module 2, the shape memory alloy spring in adjustment module 1 contracts and deforms after being heated, causing the first sealing plate 131 to move to the right, which will reduce the air pressure in the first ventilation chamber 13.

[0051] Of course, depending on actual needs, the first driving component 132 can also be configured as a telescopic driving component (such as a cylinder or electric push rod) or a magnetic driving component (such as an electromagnetic plate, which generates magnetic attraction force after being energized). Correspondingly, a temperature sensor can be installed in the first ventilation chamber 13. When the temperature sensor detects that the temperature of the adjustment module 1 has reached the preset temperature, the telescopic driving component or the magnetic driving component can be activated, thereby driving the first sealing plate 131 to move along the right side.

[0052] In some embodiments, preferably, the second driving member 151 is a magnetic suction plate (plate electromagnet). The magnetic suction plate is fixed and sealed in the second ventilation chamber 15 by sealant 152, and the magnetic suction plate is located on the second side (left side) of the second sealing plate 154. In conjunction with the air pressure adjustment in the first ventilation chamber 13, the magnetic suction plate becomes magnetic after being energized, and repulses and attracts the second sealing plate 154 (magnetic pole), so that the second sealing plate 154 moves towards the magnetic suction plate, thereby adjusting the air pressure in the second ventilation chamber 15.

[0053] Correspondingly, a pressure sensor is also provided in the second ventilation chamber 15. The pressure sensor is located at the limit point 155 in the second ventilation chamber 15. When the second sealing plate 154 moves to the limit point 155, and the pressure sensor detects that the pressure in the second ventilation chamber 15 reaches the preset value or a pressure change signal, the magnetic suction plate can be energized. The magnetic suction plate generates magnetism after being energized.

[0054] Of course, depending on actual needs, the second drive component 151 can also be set as a telescopic drive component (such as a cylinder or electric push rod). When the pressure sensor detects that the pressure in the second air exchange chamber 15 reaches a preset value or a pressure change signal, the telescopic drive component provides power to drive the second sealing plate 154 to move in the opposite direction.

[0055] It should be noted that the electrical signal feedback, information processing, and magnetic cladding plate control signals of pressure sensors, etc., can all be precisely controlled by the computer BMC (Baseboard Management Controller) module.

[0056] In some embodiments, the first ventilation chamber 13 is further provided with a first guide rail groove 133, and the first sealing plate 131 is slidably connected to the first guide rail groove 133; the second ventilation chamber 15 is further provided with a second guide rail groove, and the second sealing plate 154 is slidably connected to the second guide rail groove.

[0057] In this way, the first sealing plate 131 can slide left and right in the first ventilation chamber 13, and the second sealing plate 154 can slide left and right in the second ventilation chamber 15.

[0058] It should be noted that both the first sealing plate 131 and the second sealing plate 154 are equipped with sealing rings 153 to ensure an airtight seal with the ventilation chamber during movement.

[0059] In some embodiments, the adjustment module 1 further includes a third ventilation chamber 14, which is located between the first ventilation chamber 13 and the second ventilation chamber 15, and connects the first ventilation chamber 13 and the second ventilation chamber 15. The function of the third ventilation chamber 14 is to realize the connection and gas exchange between the first ventilation chamber 13 and the second ventilation chamber 15.

[0060] In some embodiments, the heat dissipation module 2 further includes heat dissipation fins 21 and air-cooled heat pipes 22, with both air-cooled heat pipes 22 and liquid-cooled circulation pipes 23 coiled within the heat dissipation fins 21.

[0061] By coiling the air-cooled heat pipe 22 and the liquid-cooled circulation pipe 23 within the heat dissipation fins 21, the contact area between the heat dissipation fins 21 and the air-cooled heat pipe 22 and the liquid-cooled circulation pipe 23 can be increased, thereby improving the heat dissipation efficiency.

[0062] In some embodiments, the heat sink further includes a thermally conductive base 3 and a thermally conductive grease layer 4. The thermally conductive base 3 is connected to the heat dissipation module 2 and contacts and abuts against the air-cooled heat pipe 22 and the liquid-cooled circulation pipe 23. The thermally conductive grease layer 4 is disposed between the thermally conductive base 3 and the motherboard. The thermally conductive base 3 is tightened and fixed inside the electronic device (such as a computer or server) by fastening screws 5.

[0063] Thus, the heat sink provided in this application is an adaptive heat sink combining air cooling and liquid cooling. During computer operation, the heat generated by the computing unit is conducted upwards to the heat dissipation fins 21 via the air-cooled heat pipe 22 and the liquid-cooled circulation pipe 23, with some heat continuing to be conducted upwards to the adjustment module 1, serving as the driving force for adaptive adjustment. The heat from the heat dissipation module 2 is directly blown by the fan module arranged perpendicular to the heat dissipation fins 21, resulting in rapid airflow and exchange within the heat dissipation module 2, achieving cooling and heat dissipation. When the computer is under high load or overload, the heat generated by the computing unit increases sharply. The heat is conducted through the heat-conducting base 3 to the liquid cooling circulation pipe 23, where it is absorbed by the internal coolant. Because of its much larger specific heat capacity, it absorbs more heat than the air-cooled heat pipe 22. At the same time, the heat is conducted through the heat dissipation module 2 to the adjustment module 1. The shape memory alloy spring reaches its phase transition temperature due to the high temperature and begins to contract and deform. The air pressure in the first ventilation chamber 13 decreases, and the coolant on the corresponding side of the liquid cooling circulation pipe 23 is attracted, causing the water level to rise. The coolant at the bottom of the liquid cooling circulation pipe 23 that has absorbed heat is driven to the upper part of the heat dissipation module 2, where it is rapidly cooled by the heat dissipation fins 21 and the fan module. The water level on the opposite side of the liquid cooling circulation pipe 23 then drops, and the coolant that has not absorbed heat flows to the bottom and absorbs heat. Furthermore, due to the drop in water level on the opposite side of the liquid cooling circulation pipe 23, the air pressure in the third ventilation chamber 14 decreases, causing the second sealing plate 154 to slide to the right. When it reaches the limit point 155, the pressure sensor detects the pressure change signal. At this time, the magnetic suction plate is energized to generate magnetism, which in turn generates a reverse traction force on the second sealing plate 154 (magnetic pole) and causes it to slide in the opposite direction. The air pressure in the second ventilation chamber 15 is adjusted, thus readjusting the water level in the liquid cooling circulation pipe 23. This reciprocating motion achieves rapid cooling of the computing unit. When the computer is running at low speed, the heat conducted to the adjustment module 1 through the heat dissipation module 2 decreases and does not reach the phase transition temperature of the shape memory alloy spring. At this time, ordinary air cooling is used. The heat from the computing unit is conducted upward through the air cooling heat pipe 22 to the upper part of the heat dissipation module 2 and cooled by the heat dissipation fins 21 and the fan module.

[0064] In addition, to prevent leakage in the liquid cooling heat dissipation section, liquid check valves 232 are provided at both ends of the liquid cooling circulation pipe 23 to prevent the coolant in the liquid cooling circulation pipe 23 from overflowing and to avoid leakage in the liquid cooling heat dissipation section. The check valves cannot isolate gas, so they will not affect the ventilation of the adaptive adjustment pump chamber.

[0065] In summary, the heat sink provided in this embodiment adopts a linked design of the first air exchange chamber 13, the second air exchange chamber 15, and the liquid cooling circulation pipe 23. Utilizing the principle of air pressure, the cooling medium 231 in the liquid cooling circulation pipe 23 circulates, thereby solving the problem of temperature spikes occurring during high-load computer operation. This prevents the cooling medium 231 in the air-cooled heat pipe 22 from condensing and flowing back in time, causing the heat pipe to dry out, resulting in high cooling fan speed, excessive noise, and even system crashes. This achieves rapid cooling and improves the user experience. Furthermore, the heat sink provided in this embodiment employs a pump-less design, eliminating the need for a power pump to drive the liquid cooling medium 231. Instead, the movement of the sealing plate within the air exchange chamber changes the pressure, causing the cooling medium 231 in the liquid cooling circulation pipe 23 to change position and achieve circulating heat dissipation. This solves the leakage problem caused by using a power pump to drive the liquid cooling medium 231, preventing damage to the computing unit and greatly improving the stability and safety of equipment operation.

[0066] The electronic device provided in this application includes the heat sink described in the above specific embodiments; other parts of the electronic device can be referred to the prior art, and will not be elaborated here.

[0067] It should be noted that in this specification, relational terms such as first and second are used only to distinguish one entity from several other entities, and do not necessarily require or imply any such actual relationship or order between these entities.

[0068] The electronic device and its heat sink provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the solution and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A radiator, characterized in that, It includes an adjustment module (1) and a heat dissipation module (2). The adjustment module (1) includes a first air exchange chamber (13) and a second air exchange chamber (15) that are interconnected. The heat dissipation module (2) includes a liquid cooling circulation pipe (23). The two ends of the liquid cooling circulation pipe (23) are respectively connected to the first air exchange chamber (13) and the second air exchange chamber (15). The first ventilation chamber (13) is provided with a first sealing plate (131) and a first driving member (132). The first sealing plate (131) is movably disposed in the first ventilation chamber (13). The first driving member (132) is connected to the first sealing plate (131). The first driving member (132) provides power to make the first sealing plate (131) move to the first side to drive the cooling medium (231) in the liquid cooling circulation pipe (23) to flow to one end of the liquid cooling circulation pipe (23) connected to the first ventilation chamber (13). The second ventilation chamber (15) is provided with a second sealing plate (154) and a second driving member (151). The second sealing plate (154) is movably disposed in the second ventilation chamber (15). The second driving member (151) provides power to make the second sealing plate (154) move to the second side to drive the cooling medium (231) in the liquid cooling circulation pipe (23) to flow to one end of the liquid cooling circulation pipe (23) connected to the second ventilation chamber (15). The adjustment module (1) further includes a third ventilation chamber (14), which is located between the first ventilation chamber (13) and the second ventilation chamber (15) and connects the first ventilation chamber (13) and the second ventilation chamber (15).

2. The radiator as described in claim 1, characterized in that, The first driving member (132) is an elastic member that can be deformed by heat. The two ends of the elastic member are respectively connected to the first sealing plate (131) and the adjustment module (1). The elastic member deforms after being heated, so that the first sealing plate (131) moves to the first side.

3. The radiator as described in claim 1, characterized in that, The second driving component (151) is a magnetic suction plate, which is fixed to the second side of the second sealing plate (154). When the magnetic suction plate is energized, it generates magnetism, so that the second sealing plate (154) moves toward the magnetic suction plate.

4. The radiator as described in claim 3, characterized in that, The second ventilation chamber (15) is also equipped with a pressure sensor. The pressure sensor is located at the limiting point (155) in the second ventilation chamber (15). When the second sealing plate (154) moves to the limiting point (155), the pressure sensor detects the pressure change signal, and the magnetic suction plate is energized to generate magnetism.

5. The radiator as described in claim 1, characterized in that, The first ventilation chamber (13) is also provided with a first guide rail groove (133), and the first sealing plate (131) is slidably connected to the first guide rail groove (133). The second ventilation chamber (15) is also provided with a second guide rail groove, and the second sealing plate (154) is slidably connected to the second guide rail groove.

6. The radiator as described in claim 1, characterized in that, The heat dissipation module (2) also includes heat dissipation fins (21) and air-cooled heat pipes (22), with the air-cooled heat pipes (22) and the liquid-cooled circulation pipes (23) both coiled within the heat dissipation fins (21).

7. The radiator as described in claim 6, characterized in that, It also includes a thermally conductive base (3) and a thermally conductive silicone grease layer (4). The thermally conductive base (3) is connected to the heat dissipation module (2), and the thermally conductive base (3) is in contact with the air-cooled heat pipe (22) and the liquid-cooled circulation pipe (23). The thermally conductive silicone grease layer (4) is located between the thermally conductive base (3) and the motherboard.

8. The radiator according to any one of claims 1-7, characterized in that, Both ends of the liquid cooling circulation pipe (23) are equipped with liquid check valves (232) to prevent the cooling medium (231) in the liquid cooling circulation pipe (23) from overflowing.

9. An electronic device, characterized in that, Includes the heat sink as described in any one of claims 1-8.

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