A radio frequency test fixture for tile-type microwave components

Abstract

The present invention provides a radio frequency test fixture for a tile-type microwave component, comprising a base, a coaxial connector, an adapter board module and a DC socket, wherein the adapter board module comprises an input adapter board, the input adapter board comprises an input adapter board body and at least two contacts arranged on the input adapter board body, the contacts are cylindrical grooves, the depth of the cylindrical grooves is less than the diameter of the BGA solder balls of the component to be tested, the upper base is used to apply pressure to the component to be tested during radio frequency testing, and the contacts are used to place the BGA solder balls of the component to be tested during radio frequency testing and cause the BGA solder balls to produce micro-deformations to achieve solder-free transmission of radio frequency signals. The present invention can achieve the radio frequency test function of a DC-40GHz frequency band tile-type single / double-sided BGA packaged microwave component through a sandwich-type crimping test scheme, and the frequency test range is greater than that of existing BGA test fixtures in the form of elastic probe connection, wool button connection, diaphragm connection, etc. The test fixture is small in size and simple in structure.

Description

Technical Field

[0001] The invention relates to the technical field of measurement and testing, and in particular to a radio frequency test fixture of a tile-type microwave component. Background Art

[0002] Ball gland array (BGA) packaging can reduce the size, weight and RF interconnection distance of RF products with the motherboard while allowing the design of more I / O interfaces. Therefore, it has been widely used in electronic products in recent years. Since the BGA package port is not a connector structure, it cannot be directly connected to a vector network analyzer for S parameter measurement, so an additional test fixture is required. In order to achieve the reusability of the fixture and test package, the test fixture and BGA package currently used are generally crimped. Common interconnection methods are: (1) elastic probe connection: suitable for RF testing of low-frequency BGA packages below 10 GHz. Due to the long size of the probe, the insertion loss is large and the installation is difficult; (2) diaphragm connection: suitable for digital signal and RF signal transmission testing within 10 GHz, but the performance test effect of higher frequency RF signals is poor; (3) button connection: can complete the test of RF signals below 25 GHz, but the assembly and repair and replacement are very complicated, and the insertion loss is large. Summary of the invention

[0003] The invention aims to solve the radio frequency test problem of BGA packaged products and provides a radio frequency test fixture for tile-type microwave components. The fixture can be used for radio frequency testing of tile-type single-sided / double-sided BGA packaged microwave components. The fixture is easy to process, easy to operate, has good electrical contact, has a wide application frequency band, is low in cost and can be reused.

[0004] The present invention provides a radio frequency test fixture for a tile-type microwave component, comprising a base, a coaxial connector detachably connected to a side of the base, an adapter board module arranged in the base, and a DC socket connected to the side of the base, wherein the component to be tested is arranged above the adapter board module;

[0005] The base includes an upper base detachably connected to the coaxial connector and a lower base arranged below the upper base and connected to the DC socket and the coaxial connector. The adapter board module is arranged below the upper base and above the lower base. The upper base and the lower base are fixed by bolts.

[0006] The coaxial connector is used to connect the vector network analyzer cable to transmit the radio frequency signal to the adapter board module and then transmit the radio frequency signal output by the adapter board module to the vector network analyzer. The number of the coaxial connectors is at least 2;

[0007] The adapter board module includes an input adapter board, which includes an input adapter board body and at least two contacts arranged on the input adapter board body. The contacts are cylindrical grooves, and the depth of the cylindrical grooves is less than the diameter of the BGA solder balls of the component to be tested. The input adapter board body is arranged above the lower base, and the upper base is used to apply pressure to the component to be tested during the RF test. The contacts are used to place the BGA solder balls of the component to be tested during the RF test and cause the BGA solder balls to produce micro-deformations to achieve solder-free transmission of RF signals.

[0008] The radio frequency test fixture of a tile-type microwave component described in the present invention, as a preferred embodiment, the upper base includes an upper base body, an upper base through hole arranged in the middle of the upper base body, light holes arranged at the four corners of the upper base body and an alignment platform arranged at the bottom of the upper base body and extending downwardly, the upper base body is a plate-like structure, the upper base through hole is a rectangular through hole, the rectangular through hole is an operating hole for welding the microstrip line of the adapter board module to the coaxial connector, the light hole is used to fix and lock the component to be tested with the lower base, and the alignment platform is used to position with the lower base.

[0009] The radio frequency test fixture of a tile-type microwave component described in the present invention, as a preferred embodiment, the lower base includes a lower base body, a lower base through hole arranged in the middle of the lower base body, threaded holes arranged at the four corners of the lower base body and an alignment groove arranged on the upper part of the lower base body, the lower base body is a plate-like structure, the lower base through hole is a rectangular through hole, the rectangular through hole is an operating hole for welding the microstrip line of the adapter board module to the coaxial connector, the threaded hole is used to fix and lock the component to be tested with the upper base through bolts, and the alignment groove is used to accommodate the alignment table for positioning.

[0010] The radio frequency test fixture of a tile-type microwave component described in the present invention is preferably such that the radio frequency input interface of the component to be tested is a BGA solder ball, and the radio frequency output interface is a circular solder pad;

[0011] The adapter board module also includes an output adapter board arranged on the upper part of the RF output surface of the component to be tested. The output adapter board is fixedly connected to the bottom of the upper base. The surface of the output adapter board is connected to the microstrip line, the microstrip line is connected to the coaxial connector, and the output adapter board is used to connect to the RF output interface of the component to be tested.

[0012] In the radio frequency test fixture of a tile-type microwave component described in the present invention, as a preferred embodiment, the output adapter board is a multi-layer laminate of Rogers RO4350B and Rogers RO4450F materials.

[0013] The radio frequency test fixture of a tile-type microwave component described in the present invention is preferably configured such that the output adapter plate is subjected to BGA ball planting before the radio frequency test.

[0014] In the radio frequency test fixture of a tile-type microwave assembly described in the present invention, as a preferred embodiment, the input adapter plate is a multi-layer laminate of Rogers RO4350B and Rogers RO4450F materials, and the input adapter plate is bonded above the lower base;

[0015] A positioning frame for limiting and fixing the component to be tested is arranged on the upper part of the input adapter plate body, and the contact is obtained by opening a stepped hole in the input adapter plate body and depositing metal.

[0016] In the radio frequency test fixture of a tile-type microwave component described in the present invention, as a preferred embodiment, the coaxial connector is an SMA coaxial connector, and the DC socket is connected to the pad of the input adapter board by gold wire bonding.

[0017] The radio frequency test fixture of a tile-type microwave assembly described in the present invention, as a preferred embodiment, the assembly and connection of the radio frequency test fixture includes the following steps:

[0018] S1. Test fixture assembly: glue and fix the input adapter board to the upper part of the lower base, then use screws to fix the coaxial connectors to the sides of the upper base and the lower base respectively, and weld the coaxial connectors to the microstrip line on the surface of the input adapter board, then weld and fix the DC socket to the side of the lower base, and use gold wire bonding to connect the DC socket to the input adapter board;

[0019] S2. Connect the test fixture to the component under test: The component under test is a tile-type single-sided BGA packaged microwave component whose RF input and output interfaces are both BGA solder balls. Place the BGA ball planting surface of the component under test toward the input adapter board and place it in the positioning frame of the input adapter board so that the BGA solder balls enter the contacts. Align the alignment table of the upper base with the alignment groove of the lower base and press down to engage them. Use screws with external threads to tighten the upper base and the lower base to lock and fix the component under test and apply appropriate and uniform pressure to the BGA solder balls. Finally, connect the DC cable and insert the test cable of the vector network analyzer into the SMA connector to perform S parameter test on the component under test.

[0020] The radio frequency test fixture of a tile-type microwave assembly described in the present invention, as a preferred embodiment, the assembly and connection of the radio frequency test fixture includes the following steps:

[0021] S1. Test fixture assembly: perform BGA ball planting on the output adapter board, glue and fix the input adapter board to the upper part of the lower base, and glue and fix the output adapter board to the upper part of the upper base, then use screws to fix the coaxial connectors to the sides of the upper base and the lower base respectively, and weld the coaxial connectors to the microstrip lines on the surfaces of the input adapter board and the output adapter board, then weld and fix the DC socket to the side of the lower base, and use gold wire bonding to connect the DC socket to the input adapter board;

[0022] S2. Connect the test fixture to the component under test: the component under test is a tile-type double-sided BGA packaged microwave component with a RF input interface of BGA solder balls and a RF output interface of circular solder pads. The signal input surface of the component under test faces the input adapter board and is placed in the positioning frame of the input adapter board so that the BGA solder balls enter the contacts. The output adapter board is then placed above the component under test. The alignment table of the upper base is then aligned with the alignment groove of the lower base and pressed down to engage. The upper base and the lower base are tightened with screws with external threads to lock and fix the component under test and apply appropriate and uniform pressure to the BGA solder balls. Finally, the DC cable is connected, and the test cable of the vector network analyzer is inserted into the SMA connector to perform S parameter test on the component under test.

[0023] The invention relates to a radio frequency test fixture for a tile-type single-sided / double-sided BGA packaged microwave component. The test fixture is suitable for X-band tile-type double-sided BGA packaged T / R components, and can also be used for radio frequency testing of other DC40GHz frequency band single-sided / double-sided BGA package component products.

[0024] The technical solution of the present invention is: a sandwich-type crimping radio frequency test fixture, comprising an SMA coaxial connector, a DC socket, an input adapter board, an output adapter board, and corresponding base structural parts. The DC socket is used to connect and transmit external power and control signals to the input adapter board, and the coaxial connector is used to connect the vector network analyzer cable, so as to transmit the RF signal to the input adapter board and transmit the RF signal output by the output adapter board to the vector network analyzer; the bottom sides of the upper base carrying the output adapter board are provided with raised alignment platforms, which can be accurately aligned with the alignment grooves on the upper surface of the base carrying the input adapter board and the BGA package component to be tested; positioning frames are provided around the placement position of the component to be tested, which are used to limit and fix the component to be tested to ensure the precise alignment of the solder balls; in order to ensure the balance and stability of the solder ball pressure contact, the upper base is provided with light holes at the four corners, and the lower base is provided with threaded holes at the corresponding positions. In the working state, the upper and lower bases and are fixedly tightened with screws with external threads to lock and fix the component to be tested, and apply appropriate and uniform pressure to the solder balls; rectangular through grooves and are provided in the center of the base to facilitate the welding of the microstrip lines and SMA connectors on the input adapter board and the output adapter board. Through the above design, the test fixture has the advantages of low cost, convenient material placement, reusability, easy processing, and low installation difficulty.

[0025] Furthermore, the key to the RF test fixture for BGA packaged products lies in the RF interconnection design between the BGA solder balls and the fixture adapter board. The solder ball pressure contacts of the input adapter board are designed as recessed cylindrical contacts, and the depth of the contacts is slightly smaller than the diameter of the solder balls. This is achieved by opening a stepped hole of the required size on the upper layer of the input adapter board substrate and depositing a metal layer. When the test fixture is in working condition, the bottom surface of the substrate of the component to be tested is in close contact with the top surface of the input adapter board. At this time, the solder balls at the bottom of the component to be tested are just embedded in the contacts at the corresponding positions on the upper surface of the input adapter board, and the solder balls are slightly deformed, realizing the solder-free transmission of RF signals, while causing less damage to the solder balls.

[0026] The present invention has the following advantages:

[0027] (1) The present invention can realize the radio frequency test function of DC-40GHz frequency band tile-type single / double-sided BGA package microwave components through a sandwich-type crimping test scheme, and the frequency test range is greater than that of existing BGA test fixtures in the form of elastic probe connection, wool button connection, diaphragm connection, etc.;

[0028] (2) The present invention can realize the RF test function for single-sided or double-sided BGA package components, solving the difficulty of RF test of T / R components of tile-type BGA package;

[0029] (3) The BGA contacts of the input adapter board of the present invention adopt a cylindrical recessed design, which has a simple processing technology and can realize reliable solder-free radio frequency interconnection between the component to be tested and the input adapter board, with less damage to the solder balls;

[0030] (4) The test fixture of the present invention can be applied to general BGA packaging components of standard size. The adapter plate is detachable and can be replaced according to the different pad distributions of the components to be tested.

[0031] (5) The test fixture base of the present invention is provided with a positioning structure, without redundant accessories, and can be pressed and locked only by screws with external threads, which is convenient for taking and placing materials, simple to operate, and low in cost;

[0032] (6) The test fixture of the present invention has a small size, a simple structure, and is easy to assemble and disassemble, and is easy to carry. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 A three-dimensional schematic diagram of a radio frequency test fixture for a tile-type microwave component;

[0034] Figure 2 A schematic diagram of the shape of the BGA solder ball contacts of an input adapter board of a radio frequency test fixture for a tile-type microwave component;

[0035] Figure 3It is a schematic diagram of the radio frequency signal path of a double-sided BGA package component radio frequency test fixture of a tile-type microwave component in the working state;

[0036] Figure 4 The electromagnetic simulation results of the board-level interconnection structure between the input / output adapter board of the RF test fixture of a tile-type microwave component and the BGA package component to be tested;

[0037] Figure 5 The figure is a three-dimensional schematic diagram of a radio frequency test fixture for a tile-type microwave component and a single-sided BGA packaged component radio frequency test fixture.

[0038] Reference numerals:

[0039] 1. Base; 11. Upper base; 111. Upper base body; 112. Upper base through hole; 113. Light hole; 114. Alignment table; 12. Lower base; 121. Lower base body; 122. Lower base through hole; 123. Threaded hole; 124. Alignment groove; 2. Coaxial connector; 3. Adapter board module; 31. Input adapter board; 311. Input adapter board body; 312. Contact; 32. Output adapter board; 4. DC socket. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0041] Example 1

[0042] like Figures 1 to 3 , 5, a radio frequency test fixture for a tile-type microwave component, comprising a base 1, a coaxial connector 2 detachably connected to a side of the base 1, an adapter board module 3 disposed in the base 1, and a DC socket 4 connected to a side of the base 1, wherein the component to be tested is disposed above the adapter board module 3;

[0043] The base 1 includes an upper base 11 detachably connected to the coaxial connector 2 and a lower base 12 disposed below the upper base 11 and connected to the DC socket 4 and the coaxial connector 2. The adapter board module 3 is disposed below the upper base 11 and above the lower base 12. The upper base 11 and the lower base 12 are fixed by bolts.

[0044] The coaxial connector 2 is used to connect the vector network analyzer cable to transmit the radio frequency signal to the adapter module 3 and then transmit the radio frequency signal output by the adapter module 3 to the vector network analyzer. The number of the coaxial connectors 2 is at least 2;

[0045] The adapter board module 3 includes an input adapter board 31, which includes an input adapter board body 311 and at least two contacts 312 arranged on the input adapter board body 311, wherein the contacts are cylindrical grooves, and the depth of the cylindrical grooves is less than the diameter of the BGA solder balls of the component to be tested. The input adapter board body 311 is arranged above the lower base 12, and the upper base 11 is used to apply pressure to the component to be tested during the RF test. The contacts 312 are used to place the BGA solder balls of the component to be tested during the RF test and cause the BGA solder balls to produce micro-deformation to achieve solder-free transmission of RF signals;

[0046] The upper base 11 includes an upper base body 111, an upper base through hole 112 arranged in the middle of the upper base body 111, light holes 113 arranged at the four corners of the upper base body 111, and an alignment platform 114 arranged at the bottom of the upper base body 111 and extending downward. The upper base body 111 is a plate-like structure, the upper base through hole 112 is a rectangular through hole, and the rectangular through hole is an operation hole for welding the microstrip line of the adapter board module 3 and the coaxial connector 2. The light hole 113 is used to fix and lock the component to be tested with the lower base 12, and the alignment platform 114 is used to position with the lower base 12;

[0047] The lower base 12 includes a lower base body 121, a lower base through hole 122 arranged in the middle of the lower base body 121, threaded holes 123 arranged at the four corners of the lower base body 121, and an alignment groove 124 arranged at the upper part of the lower base body 121. The lower base body 121 is a plate-like structure, and the lower base through hole 122 is a rectangular through hole. The rectangular through hole is an operation hole for welding the microstrip line of the adapter board module 3 and the coaxial connector 2. The threaded hole 123 is used to fix and lock the component to be tested with the upper base 11 through bolts, and the alignment groove 124 is used to accommodate the alignment stage 114 for positioning;

[0048] The RF input interface of the component under test is a BGA solder ball, and the RF output interface is a circular solder pad;

[0049] The adapter board module 3 also includes an output adapter board 32 arranged on the upper part of the RF output surface of the component under test, the output adapter board 32 is fixedly connected to the bottom of the upper base 11, the surface of the output adapter board 32 is connected to the microstrip line, the microstrip line is connected to the coaxial connector 2, and the output adapter board 32 is used to connect to the RF output interface of the component under test;

[0050] The output adapter board 32 is a multi-layer laminate of Rogers RO4350B and Rogers RO4450F materials;

[0051] The output adapter board 32 is BGA-balled before the RF test;

[0052] The input adapter plate 31 is a multi-layer laminate of Rogers RO4350B and Rogers RO4450F materials, and the input adapter plate 31 is bonded above the lower base 12;

[0053] The upper part of the input adapter board body 311 is provided with a positioning frame for limiting and fixing the BGA package component 5 to be tested, and the contact 312 is obtained by opening a stepped hole in the input adapter board body 311 and depositing metal;

[0054] The coaxial connector 2 is an SMA coaxial connector, and the DC socket 4 is connected to the pad of the input adapter board 31 by gold wire bonding;

[0055] The assembly and connection of the RF test fixture includes the following steps:

[0056] S1. Test fixture assembly: The input adapter plate 31 is glued and fixed to the upper part of the lower base 12, and then the coaxial connector 2 is fixed to the sides of the upper base 11 and the lower base 12 respectively with screws, and the coaxial connector 2 is welded to the microstrip line on the surface of the input adapter plate 31, and then the DC socket 4 is welded and fixed to the side of the lower base 12, and the DC socket 4 is connected to the input adapter plate 31 by gold wire bonding;

[0057] S2. Connect the test fixture to the component to be tested: The component to be tested is a tile-type single-sided BGA packaged microwave component whose RF input and output interfaces are both BGA solder balls. Place the BGA ball planting surface of the component to be tested toward the input adapter board 31 and place it in the positioning frame of the input adapter board 31, so that the BGA solder ball enters the contact 312, align the alignment platform 114 of the upper base 11 with the alignment groove 124 of the lower base 12 and press down to fit them together, use screws with external threads to tighten the upper base 11 and the lower base 12 to lock and fix the component to be tested and apply appropriate and uniform pressure to the BGA solder ball, finally connect the DC cable, insert the test cable of the vector network analyzer into the SMA connector, and perform S parameter test on the component to be tested;

[0058] The assembly and connection of the RF test fixture includes the following steps:

[0059] S1. Test fixture assembly: perform BGA ball planting on the output adapter board 32, glue and fix the input adapter board 31 to the upper part of the lower base 12, and glue and fix the output adapter board 32 to the upper part of the upper base 11, then use screws to fix the coaxial connector 2 to the sides of the upper base 11 and the lower base 12 respectively, and weld the coaxial connector 2 to the microstrip lines on the surfaces of the input adapter board 31 and the output adapter board 32, then weld and fix the DC socket 4 to the side of the lower base 12, and use gold wire bonding to connect the DC socket 4 to the input adapter board 31;

[0060] S2. Connect the test fixture to the component to be tested: the component to be tested is a tile-type double-sided BGA packaged microwave component whose RF input interface is a BGA solder ball and whose RF output interface is a circular solder pad. The signal input surface of the component to be tested faces the input adapter board 31 and is placed in the positioning frame of the input adapter board 31, so that the BGA solder ball enters the contact 312. Then, place the output adapter board 32 above the component to be tested, and then align the alignment table 114 of the upper base 11 with the alignment groove 124 of the lower base 12 and press down to engage. Use screws with external threads to tighten the upper base 11 and the lower base 12 to lock and fix the component to be tested and apply appropriate and uniform pressure to the BGA solder ball. Finally, connect the DC cable, insert the test cable of the vector network analyzer into the SMA connector, and perform S parameter test on the component to be tested.

[0061] Example 2

[0062] like Figures 1 to 3 As shown in Figure 5, a radio frequency test fixture for a tile-type microwave component. The present invention provides a radio frequency test fixture for a tile-type double-sided BGA packaged microwave component whose radio frequency input interface is a BGA solder ball and whose radio frequency output interface is a circular solder pad. The test fixture includes an SMA coaxial connector 2, a DC socket 4, an input adapter board 31, an output adapter board 32, and corresponding base structural parts 11 and 12. The SMA coaxial connector 2 installed on the lower base 12 is used to connect the vector network analyzer cable and receive radio frequency signals; the DC socket 4 is used to connect and receive external power and control signals; the SMA coaxial connector 2 installed on the upper base 11 is used to transmit the radio frequency signal output by the output adapter board 32 to the vector network analyzer; the input adapter board 31 is installed on the lower base 12, and the adapter board material is a multi-layer laminate of Rogers RO4350B and Rogers RO4450F materials, and the upper surface of the adapter board 31 facing the BGA package component 5 to be tested is provided with the following Figure 2 The cylindrical recessed contact shown is realized by opening a stepped hole of the required size on the upper layer of the input adapter plate 31 and depositing a metal layer. The contact position and size correspond to the distribution and size of the package solder balls to be tested, and the depth of the recessed contact is slightly smaller than the diameter of the solder balls.

[0063] The test fixture assembly process of the tile-type double-sided BGA packaging component is as follows: ① BGA ball planting is performed on the output adapter board; ② the input adapter board 31 and the output adapter board 32 are respectively bonded and fixed to the lower base 12 and the upper base 11; ③ multiple SMA coaxial connectors 2 are respectively fixed to the lower base 12 and the upper base 11 using screws; ④ the DC socket 4 is fixed to the lower base 12 by welding, and the SMA coaxial connector 2 is connected to the microstrip lines on the surfaces of the input adapter board 31 and the output adapter board 32 by welding; ⑤ The DC socket is connected to the corresponding pads of the input adapter board 31 by gold wire bonding.

[0064] The working process of the test fixture of the tile-type double-sided BGA packaged microwave component is as follows: ① After the test fixture is assembled, the signal input surface of the BGA package component 5 to be tested is placed in the positioning frame of the lower base 12 facing the input adapter board 31 to ensure the precise alignment of the solder balls; ② Align the alignment boss 114 of the upper base 11 with the alignment groove of the lower base 12 and press down to make it fit together; ③ Use 4 screws with external threads to fix and tighten the four corners of the upper and lower bases to complete the locking and fixing of the BGA package component 5 to be tested and apply appropriate and uniform pressure to the solder balls; ④ Connect the DC cable, insert the test cable of the vector network analyzer into the SMA connector, and perform S parameter test on the component to be tested.

[0065] like Figure 3 As shown in the figure, when the tile-type double-sided BGA packaged microwave component RF test fixture is in normal working condition, the RF signal is transmitted from the vector network analyzer through the SMA connector to the microstrip line on the transition board, and then transmitted to the pressure contact through the vertical transition structure of the "microstrip stripline quasi-coaxial", and the signal is transmitted to the DUT through the BGA solder ball tightly crimped with the pressure contact, and then finally output to the SMA connector on the other side of the transition board in the same way to pass it to the vector network analyzer.

[0066] For example Figure 3 The board-level interconnect structure shown in the figure is subjected to electromagnetic simulation. The simulation results are shown in Figure 4 As shown, when the test fixture is working, the board-level interconnection structure of the "SMA adapter board to be tested package adapter board SMA" has a return loss S11<15dB within DC40GHz, and has good RF transmission performance in the low-frequency to high-frequency bands.

[0067] Example 3

[0068] like Figure 5 As shown, a radio frequency test fixture for a tile-type microwave component, the present invention provides a radio frequency test fixture for a tile-type single-sided BGA packaged microwave component whose radio frequency input and output interfaces are all BGA solder balls, the test fixture includes an SMA coaxial connector 2, a DC socket 4, an adapter board module 3, and corresponding base structural parts 11 and 12. The lower base 12 plays the role of carrying the BGA package component 5 to be tested and the adapter board module 3; the functions of the SMA coaxial connector 2 and the DC socket 4 are the same as those of the first embodiment; the upper base 11 only plays the role of uniform pressurization; the material of the adapter board module 3 is a multi-layer laminate of Rogers RO4350B and RogersRO4450F materials, and the upper surface of the adapter board module 3 facing the BGA package component 5 to be tested is provided with a cylindrical recessed contact of the same form as that of the first embodiment, the contact position and size correspond to the distribution and size of the package solder balls to be tested, and the depth of the recessed contact is slightly smaller than the diameter of the solder balls.

[0069] The test fixture assembly process of the tile-type single-sided BGA packaged microwave component is as follows: ① glue and fix the adapter board module 3 on the lower base 12; ② use screws to fix multiple SMA coaxial connectors 2 in the lower base 12; ③ fix the DC socket 4 in the lower base 12 by welding, and connect the SMA coaxial connector 2 and the microstrip line on the surface of the adapter board module 3 by welding; ④ use gold wire bonding to connect the DC socket and the corresponding pads of the adapter board module 3.

[0070] The working process of the test fixture of the tile-type single-sided BGA packaged microwave component is as follows: ① After the test fixture is assembled, the BGA package component 5 to be tested is placed in the positioning frame of the lower base 12 with the BGA ball planting surface facing the adapter board module 3 to ensure the precise alignment of the solder balls; ② After the upper base 11 and the lower base 12 are aligned, they are pressed down to make them fit together; ③ Four screws with external threads are used to fix and tighten the four corners of the upper and lower bases to complete the locking and fixing of the BGA package component 5 to be tested and to apply appropriate and uniform pressure to the solder balls; ④ Connect the DC cable, insert the test cable of the vector network analyzer into the SMA connector, and perform S parameter test on the component to be tested.

[0071] After the test is completed, adjust the four corner screws of the base in the direction of decompression to separate the upper and lower bases, and then take out the product.

[0072] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A radio frequency test fixture for a tile-type microwave assembly, characterized in that: It comprises a base (1), a coaxial connector (2) detachably connected to a side of the base (1), an adapter board module (3) arranged in the base (1), and a DC socket (4) connected to the side of the base (1), wherein the component to be tested is arranged above the adapter board module (3); The base (1) comprises an upper base (11) detachably connected to the coaxial connector (2) and a lower base (12) arranged below the upper base (11) and connected to the DC socket (4) and the coaxial connector (2); the adapter board module (3) is arranged below the upper base (11) and above the lower base (12); the upper base (11) and the lower base (12) are fixed by bolt connection; The coaxial connector (2) is used to connect the vector network analyzer cable to transmit the radio frequency signal to the adapter board module (3), and then transmit the radio frequency signal output by the adapter board module (3) to the vector network analyzer, and the number of the coaxial connectors (2) is at least 2; The adapter board module (3) comprises an input adapter board (31), the input adapter board (31) comprising an input adapter board body (311) and at least two contacts (312) arranged on the input adapter board body (311), the contacts being cylindrical grooves, the depth of the cylindrical grooves being less than the diameter of the BGA solder balls of the component to be tested, the input adapter board body (311) being arranged above the lower base (12), the upper base (11) being used to apply pressure to the component to be tested during radio frequency testing, and the contacts (312) being used to place the BGA solder balls of the component to be tested during radio frequency testing and to cause the BGA solder balls to produce micro-deformations to achieve solder-free transmission of radio frequency signals; The RF input interface of the component to be tested is a BGA solder ball, and the RF output interface is a circular solder pad; The adapter board module (3) further comprises an output adapter board (32) arranged on the upper part of the radio frequency output surface of the component under test, the output adapter board (32) being fixedly connected to the bottom of the upper base (11), the surface of the output adapter board (32) being connected to a microstrip line, the microstrip line being connected to the coaxial connector (2), and the output adapter board (32) being used to be connected to the radio frequency output interface of the component under test.

2. The radio frequency test fixture of a tile-type microwave component according to claim 1, characterized in that: The upper base (11) comprises an upper base body (111), an upper base through hole (112) arranged in the middle of the upper base body (111), light holes (113) arranged at the four corners of the upper base body (111), and an alignment platform (114) arranged at the bottom of the upper base body (111) and extending downward, wherein the upper base body (111) is a plate-like structure, the upper base through hole (112) is a rectangular through hole, and the rectangular through hole is an operation hole for welding the microstrip line of the adapter board module (3) to the coaxial connector (2), the light hole (113) is used to fix and lock the component to be tested with the lower base (12), and the alignment platform (114) is used to position with the lower base (12).

3. The radio frequency test fixture of a tile-type microwave component according to claim 2, characterized in that: The lower base (12) comprises a lower base body (121), a lower base through hole (122) arranged in the middle of the lower base body (121), threaded holes (123) arranged at the four corners of the lower base body (121), and an alignment groove (124) arranged at the upper part of the lower base body (121); the lower base body (121) is a plate-like structure; the lower base through hole (122) is a rectangular through hole; the rectangular through hole is an operation hole for welding the microstrip line of the adapter board module (3) and the coaxial connector (2); the threaded hole (123) is used to fix and lock the component to be tested with the upper base (11) by bolts; and the alignment groove (124) is used to accommodate the alignment platform (114) for positioning.

4. The radio frequency test fixture of a tile-type microwave component according to claim 1, characterized in that: The output adapter plate (32) is a multi-layer laminate made of Rogers RO4350B and Rogers RO4450F materials.

5. The radio frequency test fixture of a tile-type microwave component according to claim 1, characterized in that: The output adapter board (32) is subjected to BGA ball planting before radio frequency testing.

6. The radio frequency test fixture of a tile-type microwave component according to claim 1, characterized in that: The input adapter plate (31) is a multi-layer laminate of Rogers RO4350B and Rogers RO4450F materials, and the input adapter plate (31) is bonded to the top of the lower base (12); A positioning frame for limiting and fixing the component to be tested is arranged on the upper part of the input adapter plate body (311), and the contact point (312) is obtained by opening a stepped hole in the input adapter plate body (311) and depositing metal.

7. The radio frequency test fixture of a tile-type microwave component according to claim 1, characterized in that: The coaxial connector (2) is an SMA coaxial connector, and the DC socket (4) is connected to the pad of the input adapter plate (31) by means of gold wire bonding.

8. The radio frequency test fixture of a tile-type microwave component according to claim 1, characterized in that: The assembly and connection of the RF test fixture includes the following steps: S1. Assembling the test fixture: the input adapter plate (31) is glued and fixed to the upper part of the lower base (12), and then the coaxial connector (2) is respectively fixed to the side surfaces of the upper base (11) and the lower base (12) using screws, and the coaxial connector (2) is welded to the microstrip line on the surface of the input adapter plate (31), and then the DC socket (4) is welded and fixed to the side surface of the lower base (12), and the DC socket (4) is connected to the input adapter plate (31) using gold wire bonding; S2. Connecting the test fixture to the component to be tested: the component to be tested is a tile-type single-sided BGA packaged microwave component whose radio frequency input and output interfaces are both BGA solder balls. The BGA ball planting surface of the component to be tested is oriented toward the input adapter board (31) and is placed in the positioning frame of the input adapter board (31), so that the BGA solder ball enters the contact (312). The alignment platform (114) of the upper base (11) is aligned with the alignment groove (124) of the lower base (12) and then pressed down to engage. The upper base (11) and the lower base (12) are fastened using screws with external threads to lock and fix the component to be tested and apply appropriate and uniform pressure to the BGA solder ball. Finally, a DC cable is connected, and the test cable of the vector network analyzer is inserted into the SMA connector to perform an S parameter test on the component to be tested.

9. The radio frequency test fixture of a tile-type microwave component according to claim 1, characterized in that: The assembly and connection of the RF test fixture includes the following steps: S1, test fixture assembly: perform BGA ball planting on the output adapter board (32), glue and fix the input adapter board (31) to the upper part of the lower base (12), and glue and fix the output adapter board (32) to the upper part of the upper base (11), then use screws to fix the coaxial connector (2) to the side surfaces of the upper base (11) and the lower base (12), respectively, and weld the coaxial connector (2) to the microstrip lines on the surfaces of the input adapter board (31) and the output adapter board (32), then weld and fix the DC socket (4) to the side surface of the lower base (12), and use gold wire bonding to connect the DC socket (4) to the input adapter board (31); S2. The test fixture is connected to the component to be tested: the component to be tested is a tile-type double-sided BGA packaged microwave component whose RF input interface is a BGA solder ball and whose RF output interface is a circular solder pad. The signal input surface of the component to be tested faces the input adapter board (31) and is placed in the positioning frame of the input adapter board (31) so that the BGA solder ball enters the contact (312). The output adapter board (32) is then placed above the component to be tested. The alignment platform (114) of the upper base (11) is then aligned with the alignment groove (124) of the lower base (12) and then pressed down to engage. The upper base (11) and the lower base (12) are fastened using screws with external threads to lock and fix the component to be tested and apply appropriate and uniform pressure to the BGA solder ball. Finally, a DC cable is connected, and the test cable of the vector network analyzer is inserted into the SMA connector to perform an S parameter test on the component to be tested.

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