Curved surface panel and its manufacturing method

Abstract

The present invention discloses a curved panel and a manufacturing method thereof. The curved panel includes a first curved substrate, a second curved substrate, a curved cover plate, and an adhesion structure. The first curved substrate and the second curved substrate overlap each other. The first sidewall to the fourth sidewall of the first curved substrate respectively correspond to the fifth sidewall to the eighth sidewall of the second curved substrate. The first sidewall to the third sidewall of the first curved substrate respectively extend beyond the fifth sidewall to the seventh sidewall of the second curved substrate. The second curved substrate is located between the curved cover plate and the first curved substrate. The second curved substrate is joined to the curved cover plate through an adhesive layer. The adhesion structure is located between the first curved substrate and the curved cover plate, and is horizontally located between the first sidewall and the fifth sidewall, between the second sidewall and the sixth sidewall, and between the third sidewall and the seventh sidewall.

Description

Technical Field

[0001] The present invention relates to a panel, and particularly to a curved panel and a manufacturing method thereof. Background Art

[0002] With the progress of technology, the application of curved displays has become more and more widespread. For example, curved display devices have been widely used in mobile phones, televisions, automotive panels, wearable display devices, etc. Display devices commonly used in daily life can be set to be curved to enhance the user experience, which also represents great market potential for curved display devices.

[0003] In the prior art, a curved display panel is formed by bending a display panel. However, residual stress is likely to occur after the display panel is bent, and the residual stress at the edge or corner of the display panel is the most obvious, resulting in uneven distribution of residual stress on the display panel. When the residual stress on the display panel is unevenly distributed, light leakage is likely to occur after the display panel is assembled. Therefore, there is an urgent need for a method to solve the foregoing problems. Summary of the Invention

[0004] The present invention provides a curved panel, which can improve the problem of uneven distribution of residual stress after the panel is bent.

[0005] The present invention provides a manufacturing method of a curved panel, which can improve the problem of uneven distribution of residual stress after the panel is bent.

[0006] At least one embodiment of the present invention provides a curved panel. The curved panel includes a first curved substrate, a second curved substrate, a curved cover plate, and an adhesive structure. The first curved substrate and the second curved substrate overlap each other. The first sidewall to the fourth sidewall of the first curved substrate respectively correspond to the fifth sidewall to the eighth sidewall of the second curved substrate. The first sidewall to the third sidewall of the first curved substrate respectively extend beyond the fifth sidewall to the seventh sidewall of the second curved substrate. The second curved substrate is located between the curved cover plate and the first curved substrate. The second curved substrate is joined to the curved cover plate through an adhesive layer. The adhesive structure is located between the first curved substrate and the curved cover plate, and is horizontally located between the first sidewall and the fifth sidewall, between the second sidewall and the sixth sidewall, and between the third sidewall and the seventh sidewall.

[0007] At least one embodiment of the present invention provides a curved panel. The curved panel includes a first curved substrate, a second curved substrate, a curved cover plate, and an adhesion structure. The first curved substrate and the second curved substrate overlap each other. The first to fourth side walls of the first curved substrate respectively correspond to the fifth to eighth side walls of the second curved substrate. The second curved substrate is located between the curved cover plate and the first curved substrate. The second curved substrate is joined to the curved cover plate through an adhesive layer. The adhesion structure is located on the surface of the curved cover plate facing the second curved substrate and covers the first side wall of the first curved substrate and the fifth side wall of the second curved substrate. The adhesion structure includes cured aqueous glue, and the elastic modulus of the cured aqueous glue is 0.265 MPa to 20 MPa.

[0008] At least one embodiment of the present invention provides a method for manufacturing a curved panel, including the following steps: providing a first substrate and a second substrate that overlap each other, wherein the first to fourth side walls of the first substrate respectively correspond to the fifth side wall to the eighth side wall of the second substrate; joining the second substrate to a cover plate through an adhesive layer; bonding the first substrate and the cover plate through an adhesion structure; and bending the first substrate, the second substrate, and the cover plate to form a first curved substrate, a second curved substrate, and a curved cover plate. Description of the Drawings

[0009] Figure 1A 、 Figure 2A 、 Figure 3A is a top view schematic diagram of a method for manufacturing a curved panel according to an embodiment of the present invention;

[0010] Figure 1B 、 Figure 2B 、 Figure 3B are respectively Figure 1A 、 Figure 2A 、 Figure 3A sectional schematic diagrams taken along line A-A' of

[0011] Figure 1C 、 Figure 2C 、 Figure 3C are respectively Figure 1A 、 Figure 2A 、 Figure 3A sectional schematic diagrams taken along line B-B' of

[0012] Figure 4A is a sectional schematic diagram of a curved panel according to an embodiment of the present invention;

[0013] Figure 4B is a top view schematic diagram of a curved panel according to an embodiment of the present invention;

[0014] Figure 5 is a top view schematic diagram of a first substrate and a second substrate according to an embodiment of the present invention;

[0015] Figure 6A, Figure 7A , Figure 8A is a top view schematic diagram of a manufacturing method of a curved panel according to an embodiment of the present invention;

[0016] Figure 6B , Figure 7B , Figure 8B are respectively Figure 6A , Figure 7A , Figure 8A cross-sectional schematic diagrams of line A-A' of

[0017] Figure 6C , Figure 7C , Figure 8C are respectively Figure 6A , Figure 7A , Figure 8A cross-sectional schematic diagrams of line B-B' of

[0018] Figure 9A is a cross-sectional schematic diagram of a curved panel according to an embodiment of the present invention;

[0019] Figure 9B is a top view schematic diagram of a curved panel according to an embodiment of the present invention.

[0020] Symbol Explanation

[0021] 1, 2: Curved panel

[0022] 100: First substrate

[0023] 100’: First curved substrate

[0024] 110: Base

[0025] 120: First element layer

[0026] 122: Bonding pad

[0027] 130: First polarizer

[0028] 200: Second substrate

[0029] 200’: Second curved substrate

[0030] 210: Base

[0031] 220: Second element layer

[0032] 230: Second polarizer

[0033] 300: Frame adhesive

[0034] 400: Flexible circuit board

[0035] 500: Cover plate

[0036] 500’: Curved surface cover plate

[0037] 600, 600A: Adhesive structure

[0038] 600a: First side

[0039] 600b: Second side

[0040] 602: Release layer

[0041] 700: Adhesive layer

[0042] 800: Backlight module

[0043] 900: Fixing part

[0044] A - A’, B - B’: Lines

[0045] D1: Stacking direction

[0046] F: Pressure

[0047] S1: First side wall

[0048] S2: Second side wall

[0049] S3: Third side wall

[0050] S4: Fourth side wall

[0051] S5: Fifth side wall

[0052] S6: Sixth side wall

[0053] S7: Seventh side wall

[0054] S8: Eighth side wall

[0055] S9: Ninth side wall

[0056] S10: Tenth side wall

[0057] S11: Eleventh side wall

[0058] S12: Twelfth side wall

[0059] VD1, VD2, VD3, VD4: Horizontal distance Detailed implementation manner

[0060] Figure 1A 、 Figure 2A 、 Figure 3A is a top - view schematic diagram of a manufacturing method of a curved surface panel according to an embodiment of the present invention. Figure 1B 、 Figure 2B 、 Figure 3B Are respectively Figure 1A 、 Figure 2A 、 Figure 3ASchematic cross-sectional view of line A-A'. Figure 1C and Figure 2C and Figure 3C are respectively Figure 1A and Figure 2A and Figure 3A Schematic cross-sectional view of line B-B'.

[0061] Please refer to Figures 1A to 1C , and provide a first substrate 100 and a second substrate 200 that overlap each other. The first sidewall S1, the second sidewall S2, the third sidewall S3, and the fourth sidewall S4 of the first substrate 100 respectively correspond to the fifth sidewall S5, the sixth sidewall S6, the seventh sidewall S7, and the eighth sidewall S8 of the second substrate 200. In this embodiment, the first sidewall S1 of the first substrate 100 and the fifth sidewall S5 of the second substrate 200 face the same direction, the second sidewall S2 of the first substrate 100 and the sixth sidewall S6 of the second substrate 200 face the same direction, the third sidewall S3 of the first substrate 100 and the seventh sidewall S7 of the second substrate 200 face the same direction, and the fourth sidewall S4 of the first substrate 100 and the eighth sidewall S8 of the second substrate 200 face the same direction.

[0062] The area of the first substrate 100 is larger than the area of the second substrate 200. From the stacking direction D1 of the first substrate 100 and the second substrate 200, the first sidewall S1 to the fourth sidewall S4 of the first substrate 100 respectively exceed the fifth sidewall S5 to the eighth sidewall S8 of the second substrate 200. In other words, in this embodiment, the first sidewall S1 to the fourth sidewall S4 of the first substrate 100 do not align with the fifth sidewall S5 to the eighth sidewall S8 of the second substrate 200. In this embodiment, the horizontal distance VD1 between the first sidewall S1 and the fifth sidewall S5 is 0.5 mm to 1.0 mm, the horizontal distance VD2 between the second sidewall S2 and the sixth sidewall S6 is 0.5 mm to 1.0 mm, the horizontal distance VD3 between the third sidewall S3 and the seventh sidewall S7 is 0.5 mm to 1.0 mm, and the horizontal distance VD4 between the fourth sidewall S4 and the eighth sidewall S8 is 2.0 mm to 8.0 mm. In some embodiments, the horizontal distance VD4 is greater than the horizontal distance VD1, the horizontal distance VD2, and the horizontal distance VD3, but the present invention is not limited thereto. The horizontal distances VD1, VD2, VD3, and VD4 can be adjusted according to actual requirements.

[0063] In some embodiments, the first substrate 100 includes a substrate 110, a first element layer 120, and a first polarizer 130.

[0064] The material of the substrate 110 is, for example, glass, quartz, an organic polymer, or other applicable materials. In some embodiments, the thickness of the substrate 110 is 0.1 mm to 0.5 mm.

[0065] The first element layer 120 is located on the substrate 110. In some embodiments, the first element layer 120 includes multiple conductive layers and multiple insulating layers. For example, the first element layer 120 includes bonding pads 122, a thin-film transistor array, scan lines, data lines, and other elements, where Figure 1A The bonding pad 122 of the first element layer 120 is illustrated, and other parts of the first element layer 120 are omitted from illustration. In some embodiments, the first element layer 120 may further include a black matrix or color filter elements to form a structure of a black matrix on the pixel array (Black matrix on array, BOA) or a color filter layer on the pixel array (Colorfilter on array, COA).

[0066] The first polarizer 130 is located on the substrate 110. In some embodiments, the first element layer 120 and the first polarizer 130 are respectively located on opposite sides of the substrate 110, but the present invention is not limited thereto. In other embodiments, the first element layer 120 and the first polarizer 130 are located on the same side of the substrate 110. The first polarizer 130 can be a polarizing film of organic material, a metal wire grid polarizer, or other suitable polarizers.

[0067] In some embodiments, the second substrate 200 includes a substrate 210, a second element layer 220, and a second polarizer 230 ( Figure 1A omitted from illustration).

[0068] The material of the substrate 210 is, for example, glass, quartz, organic polymer, or other applicable materials. In some embodiments, the thickness of the substrate 210 is from 0.1 mm to 0.5 mm.

[0069] The second element layer 220 is located on the substrate 210. In some embodiments, the second element layer 220 includes a common electrode, a black matrix, color filter elements, and other elements.

[0070] The second polarizer 230 is located on the substrate 210. In some embodiments, the second element layer 220 and the second polarizer 230 are respectively located on opposite sides of the substrate 210, but the present invention is not limited thereto. In other embodiments, the second element layer 220 and the second polarizer 230 are located on the same side of the substrate 210. The second polarizer 230 can be a polarizing film of organic material, a metal wire grid polarizer, or other suitable polarizers.

[0071] The first substrate 100 and the second substrate 200 are bonded to each other by a sealant 300. The sealant 300 surrounds the display area of the panel. In some embodiments, there is also a liquid crystal layer between the first substrate 100 and the second substrate 200, where the liquid crystal layer is surrounded by the sealant 300.

[0072] The flexible printed circuit board 400 is bonded to the bonding pad 122 of the first substrate 100, where the bonding pad 122 is laterally located between the fourth sidewall S4 of the first substrate 100 and the eighth sidewall S8 of the second substrate 200. In some embodiments, the flexible printed circuit board 400 includes a Chip on Film (COF), but the present invention is not limited thereto. In other embodiments, the bonding pad 122 is not connected to the flexible printed circuit board 400, and the bonding pad 122 is electrically connected to other components on the back surface of the first substrate 100 through side electrodes (not shown), where the aforementioned side electrodes are directly deposited on the fourth sidewall S4 of the first substrate 100.

[0073] Please refer to Figures 2A to 2C , a cover plate 500 is provided. The cover plate 500 includes a ninth sidewall S9, a tenth sidewall S10, an eleventh sidewall S11, and a twelfth sidewall S12.

[0074] An adhesive layer 700 is formed on the cover plate 500. In some embodiments, the adhesive layer 700 is a solid sheet of optically clear adhesive (OCA), but the present invention is not limited thereto. In other embodiments, the adhesive layer 700 is a liquid adhesive, such as a liquid optically clear adhesive (LOCA) or an optically clear resin (OCR). In some embodiments, the thickness of the adhesive layer 700 is from 100 microns to 1000 microns.

[0075] An adhesive structure 600 is formed on the cover plate 500. In the present embodiment, the adhesive structure 600 includes a double-sided adhesive, and its material is, for example, a foam material of an acrylic-based adhesive. A release layer 602 is provided on the surface of the adhesive structure 600. The adhesive structure 600 and the release layer 602 are adhered to the cover plate 500, where the release layer 602 is located on the first side 600a of the adhesive structure 600, and the second side 600b of the adhesive structure 600 adheres to the cover plate 500.

[0076] In other embodiments, the adhesive structure 600 includes a liquid adhesive, and its material is, for example, a liquid adhesive of an acrylic-based or silicone-based type. The method of forming the liquid adhesive includes coating or other suitable manufacturing processes. When the adhesive structure 600 is a liquid adhesive, the surface of the adhesive structure 600 does not have a release layer 602.

[0077] The thickness of the adhesive structure 600 is greater than the thickness of the adhesive layer 700. In some embodiments, the thickness of the adhesive structure 600 is from 300 microns to 1700 microns. In some embodiments, the adhesive structure 600 and the adhesive layer 700 are separated from each other, but the present invention is not limited thereto. In other embodiments, the adhesive structure 600 and the adhesive layer 700 are in contact with each other.

[0078] Please refer to Figures 3A to 3C , remove the release layer 602, then bond the second substrate 200 to the cover plate 500 through the adhesive layer 700, and bond the first substrate 100 and the cover plate 500 through the adhesive structure 600. The first substrate 100 is adhered to the first side 600a of the adhesive structure 600. In this embodiment, the adhesive structure 600 and the release layer 602 are first formed on the cover plate 500, so the manufacturing process of removing the release layer 602 will not damage the components in the first substrate 100.

[0079] In this embodiment, the ninth sidewall S9 to the twelfth sidewall S12 of the cover plate 500 respectively correspond to the first sidewall S1 to the fourth sidewall S4 of the first substrate 100, and the ninth sidewall S9 to the twelfth sidewall S12 of the cover plate 500 respectively correspond to the fifth sidewall S5 to the eighth sidewall S8 of the second substrate 200.

[0080] In some embodiments, the adhesive structure 600 is separated from the first sidewall S1, the second sidewall S2, the third sidewall S3, and the fourth sidewall S4 of the first substrate 100 and the fifth sidewall S5, the sixth sidewall S6, the seventh sidewall S7, and the eighth sidewall S8 of the second substrate 200. In some embodiments, the adhesive structure 600 is laterally located between the first sidewall S1 and the fifth sidewall S5, between the second sidewall S2 and the sixth sidewall S6, between the third sidewall S3 and the seventh sidewall S7, and between the fourth sidewall S4 and the eighth sidewall S8.

[0081] The adhesive structure 600 avoids the position of the bonding pad 122 of the first substrate 100. For example, the adhesive structure 600 has an opening (an opening facing downward in Figure 3A ), and the bonding pad 122 is disposed in the aforementioned opening.

[0082] In this embodiment, after bonding the first substrate 100 and the cover plate 500, a pressure F is applied to the first substrate 100 and the cover plate 500 and maintained for dozens of seconds to remove the bubbles in the adhesive structure 600.

[0083] In other embodiments, when the adhesive structure 600 is a liquid glue, after bonding the first substrate 100 and the cover plate 500, the first substrate 100, the second substrate 200, and the cover plate 500 are left standing, so that the silane in the resin in the adhesive structure 600 acts as a cross-linking agent and reacts with moisture, and then a series of chain reactions occur after alcohol is removed, and it turns into a cured liquid glue. In some embodiments, the first substrate 100, the second substrate 200, and the cover plate 500 are left standing at room temperature to cure the liquid glue.

[0084] Figure 4A It is a cross-sectional schematic diagram of a curved panel according to an embodiment of the present invention. Figure 4BIt is a top view schematic diagram of a curved panel according to an embodiment of the present invention. For convenience of description, Figure 4B the backlight module 800 and the fixing member 900 shown in Figure 4A are omitted.

[0085] Please refer to Figure 4A and Figure 4B to bend the first substrate 100, the second substrate 200 and the cover plate 500 to form the first curved substrate 100', the second curved substrate 200' and the curved cover plate 500'. So far, the curved panel 1 is roughly completed.

[0086] The curved panel 1 includes the first curved substrate 100', the second curved substrate 200' and the curved cover plate 500'. The frame adhesive 300 is located between the first curved substrate 100' and the second curved substrate 200'. The second curved substrate 200' is located between the curved cover plate 500' and the first curved substrate 100'. The second curved substrate 200' is joined to the curved cover plate 500' through the adhesive layer 700. The first curved substrate 100' is joined to the curved cover plate 500' through the adhesion structure 600. In some embodiments, the radius of curvature of the first curved substrate 100', the second curved substrate 200' and the curved cover plate 500' is 750 mm to 5500 mm.

[0087] In this embodiment, the first sidewall S1 to the fourth sidewall S4 of the first curved substrate 100' respectively correspond to the fifth sidewall S5 to the eighth sidewall S8 of the second curved substrate 200'. From the stacking direction of the first curved substrate 100' and the second curved substrate 200', the first sidewall S1 to the fourth sidewall S4 of the first curved substrate 100' respectively exceed the fifth sidewall S5 to the eighth sidewall S8 of the second curved substrate 200'.

[0088] The adhesion structure 600 is located between the first curved substrate 100' and the curved cover plate 500', and is horizontally located between the first sidewall S1 and the fifth sidewall S5, between the second sidewall S2 and the sixth sidewall S6, between the third sidewall S3 and the seventh sidewall S7, and between the fourth sidewall S4 and the eighth sidewall S8. The adhesion structure 600 is separated from the first sidewall S1 to the fourth sidewall S4 of the first curved substrate 100' and the fifth sidewall S5 to the eighth sidewall S8 of the second curved substrate 200'. In this embodiment, the adhesion structure 600 is separated from the frame adhesive 300.

[0089] In this embodiment, the adhesion structure 600 includes double-sided tape, and the peel strength of the adhesion structure 600 is 5.0 kgf / cm 2 to 6.0 kgf / cm 2 , and the elastic modulus of its material is 0.3 MPa to 0.8 MPa.

[0090] In other embodiments, the adhesive structure 600 includes a liquid adhesive, and the peeling strength of the liquid adhesive after curing is 20 kgf / cm 2 to 26 kgf / cm 2 , and the elastic modulus of the cured liquid adhesive is 0.265 MPa to 20 MPa.

[0091] Since the adhesive structure 600 has a sufficient elastic modulus, it is not easy to have a cracking problem even after the bending manufacturing process.

[0092] In some embodiments, the curved panel 1 further includes a curved backlight module 800 and a fixing member 900. The fixing member 900 is adapted to fix the curved cover plate 500'. The first curved substrate 100', the second curved substrate 200', and the curved cover plate 500' overlap the curved backlight module 800.

[0093] Based on the above, the adhesive structure 600 can reduce the stress on the first curved substrate 100', thereby improving the problem of uneven residual stress distribution in the curved panel 1, and further avoiding the problem of light leakage at the corners or edges of the curved panel 1. In this embodiment, the black picture brightness uniformity rate of the curved panel 1 is greater than or equal to 50%.

[0094] Figure 5 is a top view schematic diagram of a first substrate and a second substrate according to an embodiment of the present invention. It must be noted here that Figure 5 The embodiment of Figure 1A follows the component numbers and partial contents of the embodiments in

[0095] Figure 5 to FIG. 4, where the same or approximate reference numerals are used to represent the same or approximate components, and the description of the same technical content is omitted. For the description of the omitted part, reference can be made to the foregoing embodiments, which will not be elaborated here. Figure 1A The main difference between the embodiment of Figure 5 and the embodiments in

[0096] Please refer to Figure 5 to stick the adhesive structure and the release layer 602 on the first substrate 100, where the adhesive structure is located between the release layer 602 and the first substrate 100.

[0097] Remove the release layer 602, and stick the cover plate 500 on the second side 600b of the adhesive structure 600 (as Figure 3B and Figure 3CAfter bonding the cover plate 500 to the first substrate 100 and the second substrate 200, the first substrate 100, the second substrate 200, and the cover plate 500 are bent to form a first curved substrate 100', a second curved substrate 200', and a curved cover plate 500' (as Figure 4A and Figure 4B shown).

[0098] Figure 6A , Figure 7A , Figure 8A are top view schematic diagrams of a method for manufacturing a curved panel according to an embodiment of the present invention. Figure 6B , Figure 7B , Figure 8B are respectively Figure 6A , Figure 7A , Figure 8A cross-sectional schematic diagrams of the line A-A'. Figure 6C , Figure 7C , Figure 8C are respectively Figure 6A , Figure 7A , Figure 8A cross-sectional schematic diagrams of the line B-B'. It must be noted here that Figures 6A to 8C the embodiment of Figures 1A to 3C adopts the component numbers and some contents of the embodiment of

[0099] Please refer to Figures 6A to 6C , and provide the first substrate 100 and the second substrate 200 that overlap each other. The first side wall S1, the second side wall S2, the third side wall S3, and the fourth side wall S4 of the first substrate 100 respectively correspond to the fifth side wall S5, the sixth side wall S6, the seventh side wall S7, and the eighth side wall S8 of the second substrate 200. In this embodiment, the first side wall S1 of the first substrate 100 and the fifth side wall S5 of the second substrate 200 face the same direction, the second side wall S2 of the first substrate 100 and the sixth side wall S6 of the second substrate 200 face the same direction, the third side wall S3 of the first substrate 100 and the seventh side wall S7 of the second substrate 200 face the same direction, and the fourth side wall S4 of the first substrate 100 and the eighth side wall S8 of the second substrate 200 face the same direction.

[0100] The area of the first substrate 100 is larger than the area of the second substrate 200. From the stacking direction D1 of the first substrate 100 and the second substrate 200, the first sidewall S1 to the third sidewall S3 of the first substrate 100 do not extend beyond the fifth sidewall S5 to the seventh sidewall S7 of the second substrate 200, and the fourth sidewall S4 of the first substrate 100 extends beyond the eighth sidewall S8 of the second substrate 200. In other words, in the present embodiment, the first sidewall S1 to the third sidewall S3 of the first substrate 100 are respectively aligned with the fifth sidewall S5 to the seventh sidewall S7 of the second substrate 200, and the fourth sidewall S4 of the first substrate 100 is not aligned with the eighth sidewall S8 of the second substrate 200. In some embodiments, the horizontal distance VD4 between the fourth sidewall S4 and the eighth sidewall S8 is from 2.0 mm to 8.0 mm.

[0101] Please refer to Figures 7A to 7C , a cover plate 500 is provided. The cover plate 500 includes a ninth sidewall S9, a tenth sidewall S10, an eleventh sidewall S11, and a twelfth sidewall S12.

[0102] A glue layer 700 is formed on the cover plate 500. In some embodiments, the glue layer 700 is a solid sheet-like transparent optical adhesive (OCA), but the present invention is not limited thereto. In other embodiments, the glue layer 700 is a liquid glue, such as a liquid transparent optical adhesive (LOCA) or a transparent optical resin (OCR). In some embodiments, the thickness of the glue layer 700 is from 100 microns to 1000 microns.

[0103] Please refer to Figures 8A to 8C , the second substrate 200 is bonded to the cover plate 500 through the glue layer 700, and the first substrate 100 and the cover plate 500 are adhered through the adhesion structure 600A. In the present embodiment, after the second substrate 200 is bonded to the cover plate 500 through the glue layer 700, the adhesion structure 600A is formed between the first substrate 100 and the cover plate 500, and the method of forming the adhesion structure 600A includes coating, scraping, or other suitable manufacturing processes.

[0104] In some embodiments, the adhesion structure 600A covers the first sidewall S1, the second sidewall S2, and the third sidewall S3 of the first substrate 100 and the fifth sidewall S5, the sixth sidewall S6, and the seventh sidewall S7 of the second substrate 200. In some embodiments, the adhesion structure 600A is laterally located between the fourth sidewall S4 of the first substrate 100 and the eighth sidewall S8 of the second substrate 200, but the present invention is not limited thereto. In other embodiments, the adhesion structure 600A covers the eighth sidewall S8 of the second substrate 200. The adhesion structure 600A avoids the position of the bonding pad 122 of the first substrate 100. For example, the adhesion structure 600A has an opening (an opening facing downward in Figure 8A ), and the bonding pad 122 is disposed in the aforementioned opening.

[0105] In this embodiment, part of the adhesive structure 600A fills the gap between the first substrate 100 and the second substrate 200 and contacts the frame adhesive 300, but the present invention is not limited thereto. In other embodiments, the adhesive structure 600A does not contact the frame adhesive 300. In this embodiment, part of the adhesive structure 600A fills the gap between the second substrate 200 and the cover plate 500, but the present invention is not limited thereto. In other embodiments, the adhesive structure 600A does not fill the gap between the second substrate 200 and the cover plate 500.

[0106] In this embodiment, the adhesive structure 600A is a liquid adhesive. After bonding the first substrate 100 and the cover plate 500, the first substrate 100, the second substrate 200, and the cover plate 500 are left standing, so that silane in the resin in the adhesive structure 600A acts as a crosslinking agent and reacts with moisture, and then a series of chain reactions occur by alcohol removal, and it is transformed into a cured liquid adhesive. In some embodiments, the first substrate 100, the second substrate 200, and the cover plate 500 are left standing at room temperature to cure the liquid adhesive.

[0107] Figure 9A It is a schematic cross-sectional view of a curved panel according to an embodiment of the present invention. Figure 9B It is a schematic top view of a curved panel according to an embodiment of the present invention. For the convenience of description, Figure 9B the backlight module 800 and the fixing member 900 in Figure 9A are omitted from the drawing.

[0108] Please refer to Figure 9A and Figure 9B . Bend the first substrate 100, the second substrate 200, and the cover plate 500 to form a first curved substrate 100', a second curved substrate 200', and a curved cover plate 500'. Thus, the curved panel 2 is substantially completed.

[0109] The curved panel 2 includes a first curved substrate 100', a second curved substrate 200', and a curved cover plate 500'. The frame adhesive 300 is located between the first curved substrate 100' and the second curved substrate 200'. The second curved substrate 200' is located between the curved cover plate 500' and the first curved substrate 100'. The second curved substrate 200' is joined to the curved cover plate 500' through an adhesive layer 700. The first curved substrate 100' is joined to the curved cover plate 500' through an adhesive structure 600A. In some embodiments, the radius of curvature of the first curved substrate 100', the second curved substrate 200', and the curved cover plate 500' is 750 millimeters to 5500 millimeters.

[0110] In this embodiment, the first sidewall S1 to the fourth sidewall S4 of the first curved substrate 100' respectively correspond to the fifth sidewall S5 to the eighth sidewall S8 of the second curved substrate 200'. From the stacking direction of the first curved substrate 100' and the second curved substrate 200', the first sidewall S1 to the third sidewall S3 of the first curved substrate 100' do not extend beyond the fifth sidewall S5 to the seventh sidewall S7 of the second curved substrate 200', and the fourth sidewall S4 of the first curved substrate 100' extends beyond the eighth sidewall S8 of the second curved substrate 200'.

[0111] The adhesive structure 600A is located between the first curved substrate 100' and the curved cover plate 500', and covers the first sidewall S1, the second sidewall S2, and the third sidewall S3 of the first curved substrate 100' and the fifth sidewall S5, the sixth sidewall S6, and the seventh sidewall S7 of the second curved substrate 200'. In this embodiment, the adhesive structure 600A is horizontally located between the fourth sidewall S1 of the first curved substrate 100' and the eighth sidewall S8 of the second curved substrate 200', but the present invention is not limited thereto. In other embodiments, the adhesive structure 600A covers the eighth sidewall S8 of the second curved substrate 200'.

[0112] In this embodiment, a part of the adhesive structure 600A fills the gap between the first curved substrate 100' and the second curved substrate 200' and contacts the frame adhesive 300, but the present invention is not limited thereto. In other embodiments, the adhesive structure 600A does not contact the frame adhesive 300. In this embodiment, a part of the adhesive structure 600A fills the gap between the second curved substrate 200' and the curved cover plate 500', but the present invention is not limited thereto. In other embodiments, the adhesive structure 600A does not fill the gap between the second curved substrate 200' and the curved cover plate 500'.

[0113] In this embodiment, the adhesive structure 600A includes a liquid adhesive, and the peeling strength of the liquid adhesive after curing is 20 kgf / cm 2 to 26 kgf / cm 2 , and the elastic modulus of the cured liquid adhesive is 0.265 MPa to 20 MPa.

[0114] Since the adhesive structure 600A has a sufficient elastic modulus, it is not easy to have a cracking problem even after the bending manufacturing process.

[0115] In some embodiments, the curved panel 2 further includes a curved backlight module 800 and a fixing member 900. The fixing member 900 is suitable for fixing the curved cover plate 500'. The first curved substrate 100', the second curved substrate 200', and the curved cover plate 500' overlap the curved backlight module 800.

[0116] Based on the above, the adhesive structure 600A can reduce the stress on the first curved substrate 100', thereby improving the problem of uneven residual stress distribution in the curved panel 2, and further avoiding the problem of light leakage at the corners or edges of the curved panel 2. In this embodiment, the brightness uniformity rate of the black picture of the curved panel 2 is greater than or equal to 50%.

Claims

1. A curved surface panel, comprising: A first curved substrate and a second curved substrate that overlap each other, wherein a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall of the first curved substrate respectively correspond to a fifth sidewall, a sixth sidewall, a seventh sidewall, and an eighth sidewall of the second curved substrate, and wherein the first sidewall, the second sidewall, and the third sidewall of the first curved substrate respectively extend beyond the fifth sidewall, the sixth sidewall, and the seventh sidewall of the second curved substrate; A curved cover plate, wherein the second curved substrate is located between the curved cover plate and the first curved substrate, and the second curved substrate is joined to the curved cover plate through an adhesive layer; And An adhesive structure is located between the first curved substrate and the curved cover plate, and is horizontally located between the first side wall and the fifth side wall, between the second side wall and the sixth side wall, and between the third side wall and the seventh side wall. When the adhesive structure includes double-sided tape, the peel strength of the adhesive structure is 5.0 kgf / cm 2 to 6.0 kgf / cm 2 , and the elastic modulus of its material is 0.3 MPa to 0.8 MPa; when the adhesive structure includes a cured liquid adhesive, the peel strength of the cured liquid adhesive is 20 kgf / cm 2 to 26 kgf / cm 2 , and the elastic modulus of the cured liquid adhesive is 0.265 MPa to 20 MPa.

2. The curved surface panel according to claim 1, wherein the fourth side wall of the first curved surface substrate extends beyond the eighth side wall of the second curved surface substrate, and the adhesive structure is laterally located between the fourth side wall and the eighth side wall, wherein the first curved surface substrate includes a plurality of bonding pads, and the bonding pads are laterally located between the fourth side wall and the eighth side wall.

3. The curved surface panel according to claim 1, wherein the adhesive structure is separated from the first side wall, the second side wall, the third side wall and the fourth side wall of the first curved surface substrate.

4. The curved surface panel according to claim 1, wherein the adhesive structure is separated from the fifth side wall, the sixth side wall, the seventh side wall and the eighth side wall of the second curved surface substrate.

5. The curved surface panel according to claim 4, further comprising: A frame adhesive, located between the first curved substrate and the second curved substrate, wherein the frame adhesive is separated from the adhesive structure.

6. The curved surface panel according to claim 1, wherein the radius of curvature of the curved surface cover plate is 750 mm to 5500 mm.

7. A curved surface panel, comprising: A first curved substrate and a second curved substrate that overlap each other, wherein a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall of the first curved substrate respectively correspond to a fifth sidewall, a sixth sidewall, a seventh sidewall, and an eighth sidewall of the second curved substrate; A curved cover plate, wherein the second curved substrate is located between the curved cover plate and the first curved substrate, and the second curved substrate is joined to the curved cover plate through an adhesive layer; And An adhesive structure is located on the surface of the curved cover plate facing the second curved substrate and covers the first side wall of the first curved substrate and the fifth side wall of the second curved substrate. The adhesive structure includes a cured liquid adhesive, where the elastic modulus of the cured liquid adhesive is from 0.265 MPa to 20 MPa, and the peel strength of the cured liquid adhesive is from 20 kgf / cm 2 to 26 kgf / cm 2 .

8. The curved surface panel according to claim 7, wherein the first side wall, the second side wall and the third side wall of the first curved surface substrate do not extend beyond the fifth side wall, the sixth side wall and the seventh side wall of the second curved surface substrate, and the fourth side wall of the first curved surface substrate extends beyond the eighth side wall of the second curved surface substrate.

9. The curved surface panel according to claim 8, wherein the adhesive structure covers the second side wall and the third side wall of the first curved surface substrate and the sixth side wall and the seventh side wall of the second curved surface substrate.

10. The curved surface panel according to claim 7, wherein a part of the adhesive structure fills the gap between the first curved surface substrate and the second curved surface substrate.

11. A manufacturing method of a curved surface panel, comprising: Providing a first substrate and a second substrate that overlap each other, wherein a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall of the first substrate respectively correspond to a fifth sidewall, a sixth sidewall, a seventh sidewall, and an eighth sidewall of the second substrate; Forming an adhesive layer on the cover plate and then joining the second substrate to the cover plate through the adhesive layer; Bonding the first substrate and the cover plate through an adhesive structure, with the first substrate adhered to a first side of the adhesive structure and the cover plate adhered to a second side of the adhesive structure, and the adhesive structure being located outside the adhesive layer; And Bending the first substrate, the second substrate, and the cover plate to form a first curved substrate, a second curved substrate, and a curved cover plate.

12. The manufacturing method of the curved panel as claimed in claim 11, wherein the first sidewall, the second sidewall, and the third sidewall of the first substrate respectively extend beyond the fifth sidewall, the sixth sidewall, and the seventh sidewall of the second substrate, and the adhesive structure is laterally located between the first sidewall and the fifth sidewall, between the second sidewall and the sixth sidewall, and between the third sidewall and the seventh sidewall.

13. The manufacturing method of the curved panel as claimed in claim 12, wherein the adhesive structure comprises double-sided tape or liquid glue, and the peel strength of the liquid glue after curing is 20 kgf / cm 2 to 26 kgf / cm 2 , and the elastic modulus of the liquid glue after curing is 0.265 MPa to 20 MPa.

14. The manufacturing method of the curved panel as claimed in claim 12, wherein the adhesive structure is separated from the first sidewall, the second sidewall, the third sidewall, and the fourth sidewall of the first substrate and the fifth sidewall, the sixth sidewall, the seventh sidewall, and the eighth sidewall of the second substrate.

15. The manufacturing method of the curved panel as claimed in claim 11, wherein the method of bonding the first substrate and the cover plate by the adhesive structure comprises: Adhering the adhesive structure and a release layer to one of the first substrate and the cover plate, wherein the release layer is located on the first side of the adhesive structure; Removing the release layer; and Adhering the other of the first substrate and the cover plate to the first side of the adhesive structure.

16. The manufacturing method of the curved panel as claimed in claim 11, wherein the adhesive structure covers the first sidewall of the first substrate and the fifth sidewall of the second substrate, the adhesive structure comprises liquid glue, and the elastic modulus of the liquid glue after curing is 0.265 MPa to 20 MPa.

17. The manufacturing method of the curved panel as claimed in claim 16, wherein the first sidewall, the second sidewall, and the third sidewall of the first substrate do not extend beyond the fifth sidewall, the sixth sidewall, and the seventh sidewall of the second substrate, and the fourth sidewall of the first substrate extends beyond the eighth sidewall of the second substrate.

18. The manufacturing method of the curved panel as claimed in claim 17, wherein the adhesive structure covers the second sidewall and the third sidewall of the first substrate and the sixth sidewall and the seventh sidewall of the second substrate.

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